SLP (Substance Like PCB) circuit boards
As we mentioned, a report from ETNews on Tuesday cites industry insiders to claim Samsung has already begun procuring components for the upcoming Galaxy S9 duo. Samsung will reportedly adopt the new SLP (Substance Like PCB) circuit boards to make room for bigger batteries and other parts.
SLP is a next-generation motherboard technology that allows for chips to be stacked together resulting in more space for other components. Apple recently employed a similar technology in its iPhone X, freeing up space for the new L-shaped battery that offers a bigger capacity. The SLP circuit boards will connect major smartphone parts like flash memory, application processor, and DRAM.
The report mentions that Samsung has also begun mass production for camera modules. According to ETNews' sources, Partron is working on the front camera of the Galaxy S9, while Power Logics is developing the front camera on the Galaxy S9+. It also confirms that the dual camera setup will be exclusive to the bigger model of the duo, the Galaxy S9+.