123

Page 1


Embedded Processing Selection Guide

ii

Table of Contents

Introduction to TI Embedded Processing Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Processor Find and Fit Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Introduction to TI ARM®-Based Embedded Processors . . . . . . . . . . . . . . . . . . . . . . . . . .4

TMS320C5000™ DSP Platform TMS320C55x™ DSP Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 TMS320C54x™ DSP Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Power Management Products for the C5000™ DSP Platform . . . . . . . . . . . . . . . . . . .10

TMS320C6000™ DSP Platform TMS320C64x™ DSP Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 TMS320C645x DSP Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 TMS320C647x DSP Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 TMS320C67x™ DSP Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Power Management Products for the C6000™ DSP Platform . . . . . . . . . . . . . . . . . . .23

Digital Media Processors with DaVinci™ Technology Digital Media Processors with DaVinci Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 TMS320DM646x Digital Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 TMS320DM644x Digital Media Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 TMS320DM643x Digital Media Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 TMS320DM64x™ Digital Media Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 TMS320DM3x Digital Media Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 Compatible Analog Products for DaVinci-Based Digital Video Applications . . . . . . . . . .37

OMAP™ Applications Processors OMAP35x Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 OMAP-L1x Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 Power Management Products for OMAP35x and OMAP-L1x Applications Processors . . .45

Software and Development Tools eXpressDSP™ Software and Development Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Code Composer Studio™ IDE and TI Developer Network Development Tools . . . . . . . .47 JTAG Debug and eXpressDSP Data Visualization . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 Operating Systems Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 Algorithm Standards and Frameworks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52 Digital Media Software Portfolio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 Getting Started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 DaVinci Development Tools and Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56 OMAP Development Tools and Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 TI DSP Developer Network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 Embedded Processing Development Tools Feature Matrix . . . . . . . . . . . . . . . . . . . . . .59

Embedded Processing Support Resources Embedded Processing Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60 Training Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62 TI Embedded Processor Device Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64

ARM® References Introduction to TI ARM-Based Embedded Processors . . . . . . . . . . . . . . . . . . . . . . . . . . .4

ARM + DSP: TMS320DM6467 Digital Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 TMS320DM6446 Digital Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 TMS320DM6443 Digital Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 TMS320DM6441 Digital Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 OMAP3530 Applications Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 OMAP3525 Applications Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

ARM Only: TMS320DM365 Digital Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 TMS320DM357 Digital Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 TMS320DM355 Digital Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 TMS320DM335 Digital Media Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 OMAP3515 Applications Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 OMAP3503 Applications Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

ARM + MCU: Stellaris 32-Bit ARM® Cortex™-M3 MCUs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99

TI Worldwide Technical Support Internet TI Semiconductor Product Information Center Home Page support.ti.com TI Semiconductor KnowledgeBase Home Page support.ti.com/sc/knowledgebase

Product Information Centers Americas

Phone

+1(972) 644-5580

Brazil

Phone

0800-891-2616

Mexico

Phone

0800-670-7544

Fax Internet/Email

+1(972) 927-6377 support.ti.com/sc/pic/americas.htm

Europe, Middle East, and Africa Phone European Free Call

00800-ASK-TEXAS (00800 275 83927)

Complementary Products for the TMS320™ DSP Family

International

+49 (0) 8161 80 2121

Linear and Logic Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 Data Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69 Audio Converters and Controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72 Interface Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75

Russian Support

+7 (4) 95 98 10 701

TMS320C2000™ Microcontrollers for Real-Time Control TMS320C2000 Microcontrollers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .79 TMS320C2000 New Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81 TMS320C2000 New Technology Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .83 Power Management Products for the C2000™ Microcontroller Platform . . . . . . . . . . .85

MSP430 Ultra-Low Power Microcontrollers MSP430 Microcontrollers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86 Flash-Based F2xx MCU Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88 Flash/ROM-Based x1xx MCU Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .90 Flash/ROM-Based x4xx MCU Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91 Flash-Based F5xx MCU Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .92 Complementary Analog Products for the MSP430 Family . . . . . . . . . . . . . . . . . . . . . . .95 ®

Stellaris Family of Microcontrollers Stellaris 32-Bit ARM® Cortex™-M3 MCUs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99

System Solutions Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .101 HiRel DSPs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103 Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .104 Medical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .110 Medical Imaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111 Portable Medical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112 Smart Metering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113 Telecom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .114 Video and Imaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115

Texas Instruments 3Q 2009

Note: The European Free Call (Toll Free) number is not active in all countries. If you have technical difficulty calling the free call number, please use the international number above. Fax Internet Japan Fax International Internet/Email International Domestic Asia Phone International Domestic Australia China Hong Kong India Indonesia Korea Fax Internet

+(49) (0) 8161 80 2045 support.ti.com/sc/pic/euro.htm

+81-3-3344-5317

Domestic

0120-81-0036

support.ti.com/sc/pic/japan.htm www.tij.co.jp/pic

+91-80-41381665 Toll-Free Number 1-800-999-084 800-820-8682 800-96-5941 1-800-425-7888 001-803-8861-1006 080-551-2804 +886-2-2378-6808 support.ti.com/sc/pic/asia.htm

Malaysia New Zealand Philippines Singapore Taiwan Thailand Email

Toll-Free Number 1-800-80-3973 0800-446-934 1-800-765-7404 800-886-1028 0800-006800 001-800-886-0010 tiasia@ti.com ti-china@ti.com

C093008 © 2009 Texas Instruments Incorporated Printed in U.S.A. by Southwest Precision Printers, Houston, TX

Embedded Processing Guide


Overview Embedded Processing Overview Texas Instruments has the broadest portfolio of scaleable DSP, MCU, differentiated ARM and complementary analog products offering complete system solutions for electronics manufacturers. This portfolio offers the full range of power/performance requirements ensuring the right combination of attributes serving the smallest portable devices to the largest multi-channel systems and everything in between. In addition, TI offers design resources including extensive software (including open source), tools, technical training, in-person and online tech support and engineer-to-engineer forums at e2e.ti.com. Visit www.ti.com for technical literature, systems block diagrams and more.

DaVinci™ Digital Media Processors: Optimized for Digital Video DaVinci technology consists of scalable, programmable signal processing system on chips (SoCs), accelerators and peripherals, optimized to match the price, performance and feature requirements for a broad spectrum of video end equipments.

OMAP™ Applications Processors: Best General-Purpose, Multimedia and Graphics TI’s OMAP platform delivers high-performance applications processors and a robust support network allowing for rapid development of multimedia-enhanced devices to general-purpose computer applications that require Linux OS or Windows® CE OS. OMAP35x devices target portable navigation devices and media players, Internet appliances and personal medical equipment. OMAP-L1x devices include ARM9 and ARM9 + DSP architectures and offer a variety of peripherals for networking, targeting consumer and industrial applications.

Highest Performance: TMS320C6000™ DSP Platform The C6000™ DSP platform offers the industry’s highest-performance single-core and multi-core DSPs ideal for networking,

telecommunication, video, imaging, infrastructure, test and equipment, military and industrial applications. The platform includes the C64x™ high-performance DSPs, C67x™ floating-point DSPs and the C674x fixed-/floating-point DSPs.

Power-Efficient Performance: TMS320C5000™ DSP Platform The C5000™ DSP platform offers the industry’s lowest standby power and advanced automatic power management for portable products like digital music players, VoIP, hands-free accessories, GPS receivers and portable medical equipment.

TMS320C2000™ 32-Bit Microcontroller for Real-Time Control

TI provides the ultimate solution for batterypowered measurement applications. Using leadership in both mixed-signal and digital technologies, TI has created the MSP430, enabling system designers to simultaneously interface to analog signals, sensors and digital components while maintaining unmatched low power.

Stellaris® 32-Bit ARM® Cortex™-M3 MCUs Stellaris 32-bit MCUs combine advanced connectivity options with the generalpurpose processing performance of the industry-standard ARM Cortex-M3 core for cost-conscious applications.

Software and Development Tools

The C2000™ Microcontroller family combines advanced control peripherals with the processing power of a 32-bit core. From the low-cost, high-integration Piccolo™ to the powerful Delfino™ floating-point MCU, C2000 MCUs offer a broad range of options, and are ideal for embedded industrial control applications such as digital motor control, digital power supplies, intelligent sensors.

MSP430 Ultra-Low Power Microcontroller Platform The MSP430 family of ultra-low power 16-bit RISC mixed-signal processors from

TMS320™ DSPs are supported by eXpressDSP™ Software and Development Tools including Code Composer Studio™ IDE, DSP/BIOS™ kernel, TMS320 DSP Algorithm Standard and numerous reusable, modular software from the largest Developer Network in the industry.

Complementary Analog Products TI offers a range of complementary data converter, power management, amplifiers, interface and logic products to complete your design.

Applications Matrix Guideline Digital Media Processors

OMAP Applications Processors

C6000 Digital Signal Processors

C5000 Digital Signal Processors

Complete tailored video solution

Low power and high performance

High performance

Power-efficient performance

C2000 Microcontrollers

MSP430 Microcontrollers

Performance, integration for greener industrial applications

Ultra-low power

Stellaris 32-Bit ARM Cortex-M3 MCUs

Audio Automotive Communications Industrial Medical Security Video Wireless Key Feature

Texas Instruments 3Q 2009

Open architecture software, rich communications options

Embedded Processing Guide

1

Introduction to TI Embedded Processing


2

Introduction to TI Embedded Processing Processor Find and Fit Guide Step 1: Do you Need a Processor for Your Application? Count up Yes answers and see the score at the bottom for whether a processor is right for your application. 1. Does your applciation need to run algorithms to interpret, filter, and/or adjust data of real-world signals?  Yes  No 2. Does your application need to make multiple control decisions based on feedback from sensors?  Yes  No 3. Does your application need to play or record music and/or video in multiple formats?  Yes  No 4. Does your application need to process any networking, wireless or WiMAX communications protocols?  Yes  No 5. Does your application have a GUI (Graphical User Interface)?  Yes  No 6. Does your application need to access the Internet?  Yes  No 7. Does your application need to run Linux, Windows® CE, other operating system or real-time kernel?  Yes  No Simple Scoring:  0 Yes = You most likely do not need a processor  1 or 2 Yes = You may need a processor  3 or 4 Yes = You most likely need a processor  5+ Yes = You definitely need a processor

Step 2: Finding the Right TI Processor for Your Application. Seven simple but important questions with “checkbox” answer simplicity that will help identify the most appropriate TI processor family or product to meet your requirements. 1. What is the primary function of your product using this processor?  a. Control  b. Sensing and measurement  c. Audio  d. General processing  e. Video/image processing  f. Communications processing  g. 3-D graphics  h. Real-time signal processing 2. What is your ranked priority order of your first, second and third most important processor requirement to address? (Write 1, 2 or 3 in three boxes)  a. Lowest processor cost  b. Fast time to market  c. Performance  d. Software reuse  e. Low power dissipation  f. Run Linux or Windows OS  g. Low system BOM cost 3. What processor types have you used prior to or are you considering to use for this project?  a. General-purpose 32-bit  b. DSP 16 or 32 (ADI, C5000™, C6000™)  c. MCU 8/16 (e.g., MSP430, PIC)  d. Video processors (DM64x, IMX)  e. MCU 16/32 (e.g., ARM7, C2000™)  f. FPGA soft cores  g. Floating point 4. What classification would most closely fit your processor application?  a. Battery powered  b. Plug-in (line) powered  c. Infrastructure or backbone  d. Stand alone  e. Gateway or in between  f. Other 5. What example I/O would be important for your processor to support?  a. Audio input/output  b. Control I/O and PWMs  c. Video input/output  d. Ethernet  e. USB  f. SATA or SDIO  g. PCI, PCI Express®, sRIO  h. Wi-Fi or WiMAX  i. On-chip ADC or analog I/O  j. RF (e.g., ZigBee®) 6. In what language/level do you expect/desire to do most of your programming?  a. C or C++  b. Graphical programming (e.g., Simulink™)  c. Assembly  d. Not me – Will buy software  e. Java or open source  f. Other 7. What price range do you expect to pay for your processor?  a. Up to U.S. $2  b. U.S. $2 to $5  c. > U.S. $5 to $10  d. > U.S. $10 to $25  e. > U.S. $25 to $50  f. > U.S. $50 Continued on the following page.

Want to find the right processor even faster? Check out the new interactive selection tools MCU Selection online with all the features and functions that Tool you need. Select ✓ www.ti.com/mcutool

Texas Instruments 3Q 2009

DSP Selection Tool Select ✓

www.ti.com/dsptool

Embedded Processing Guide


Processor Find and Fit Guide Step 3: Processor Platform Fit: The More Blue = Better Fit MSP430 MCU

TMS320C2000™ Stellaris 32-Bit ARM® TMS320C5000™ TMS320C6000™ OMAP™ Applications TMS320DM64x, DM3x Processor Cortex™-M3 MCU MCU DSP DSP Digital Media Processor

1. Primary function? a. Control b. Sensing/Measurement c. Audio d. General processing e. Video/Image processing f. Communications processing g. 3-D graphics h. Real-time signal processing 2. Priority requirement? a. Lowest processor cost b. Fast time to market c. Performance d. Software reuse e. Low power dissipation f. Run Linux or Windows g. Low system BOM cost 3. Processor types? a. General-purpose, 32-bit b. DSP 16-/32-bit c. MCU 8-/16-bit d. Video processor e. MCU 16-/32-bit f. FPGA soft cores g. Floating point 4. Application classification? a. Battery powered b. Plug-in (line) powered c. Infrastructure of backbone d. Stand alone e. Gateway or in between f. Other 5. What I/O is important? a. Audio input/output b. Control I/O and PWMs c. Video input/output d. Ethernet e. USB f. SATA or SDIO g. PCI, PCI Express® or sRIO h. Wi-Fi™ or WiMAX i. On-chip ADC or analog I/O j. RF (e.g., ZigBee®) 6. Programming language? a. C or C++ b. Graphical programming c. Assembly d. Not me – Will buy software e. Java or open source f. Other 7. Price expectation? a. Up to U.S. $2 b. U.S. $2 to $5 c. > U.S. $5 to $10 d. > U.S. $10 to $25 e. > U.S. $25 to $50 f. > U.S. $50

Texas Instruments 3Q 2009

Embedded Processing Guide

3

Introduction to TI Embedded Processing


Introduction to TI ARM®-Based Embedded Processors ARM®-Based TI Offerings Overview

Target Applications for TI’s ARM-Based Devices ARM processors cover a wide range of performance and features enabling system designers to create solutions that meet their precise requirements.

ARM9 32-bit µP Up o 500 MHz

ARM® Cortex™-A8/9 32-bit µP Up to 1 GHz

OMAP35x

Microcontrollers ARM Cortex™-M3 32-bit MCU Up to 100 MHz

Stellaris® LM3Sxx

ARM to TI device capability overlay

TI’s ARM-Based Devices TI Processor OMAP3503

CPU ARM Cortex™-A8

OMAP3515

ARM Cortex-A8

OMAP3525

OMAP-L137

ARM Cortex-A8 + C64x™ DSP ARM Cortex-A8 + C64x DSP ARM926 + C674x DSP

OMAP-L138

ARM926 + C674x DSP

OMAP3530

TMS320DM355 TMS320DM335 TMS320DM357 TMS320DM365

ARM926 ARM926 ARM926 ARM926

TMS320DM6467

ARM926 + C64x+™ DSP TMS320DM6446 ARM926 + C64x+ DSP TMS320DM6443 ARM926 + C64x+ DSP TMS320DM6441 ARM926 + C64x+ DSP Stellaris® LM3S: 1/3/6/800, 1000 Stellaris LM3S: 6/8/9000 Stellaris LM3S: 3/5/9000 Stellaris LM3S: 2/5/8/9000

Texas Instruments 3Q 2009

DM3x DM644x DM646x OMAP-L1x

O/S Complexity

Computing Capability

Applications Processors

Connectivity Complexity

Target applications include: • Data processing • POS • Handheld computing • Wired communications • Networking • Broadcast equipment • Wireless communications • Handsets • LAN/WAN routers • Consumer electronics • Portable A/V players • Digital set-top • Digital cameras • Network appliances • HVAC • Gaming equipment • Automotive • Infotainment • Safety and control • Body electronics • Industrial • Medical • Automation and drives • Metering • Power supplies • Remote monitoring • Building controls • Factory automation • Test and measurement equipment

User Interface

TI offers a broad range of ARM-based products that address a wide variety of applications while delivering optimum performance, power consumption and system cost. These ARM-based products span a variety of TI’s product lines. See the chart below for how these products map to the ARM offerings.

Capability

Introduction to TI Embedded Processing

Control Capability

4

ARM Cortex-M3 ARM Cortex-M3 ARM Cortex-M3 ARM Cortex-M3

MHz 600

Operating System Key Peripherals Linux, Windows CE MMC/SD, McBSP, UART, USB 2.2 HS 3-Port, USB 2.0 HS OTG 600 Linux, Windows CE MMC/SD, McBSP, UART, USB 2.2 HS 3-Port, USB 2.0 HS OTG 600 Linux, Windows CE MMC/SD, McBSP, UART, USB 2.2 HS 3-Port, USB 2.0 HS OTG 600 Linux, Windows CE MMC/SD, McBSP, UART, USB 2.2 HS 3-Port, USB 2.0 HS OTG 300/300 Linux, Windows CE, MMC/SD, SDRAM/NAND, EMAC, UART, VxWorks USB 2.0 HS OTG, USB 1.1 300/300 Linux, Windows CE, mDDR/DDR2, SDRAM/NAND, SATA, uPP, VxWorks EMAC, USB 2.0 HS OTG, USB 1.1 135, 216, 270 Linux mDDR/DDR2, USB 2.0 H/OTG 135, 216 Linux mDDR/DDR2, USB 2.0 H/OTG 270 Linux EMAC, DDR2, JTAG, USB 2.0 OTG 216, 270, 300 Linux EMAC, mDDR/DDR2, HPI, voice codec, USB 2.0 H/OTG 594, 729/ Linux, Windows CE EMAC, DDR2, USB 2.0, HPI, PCI, ATA 297, 365 300/600 Linux, Windows CE EMAC, DDR2, USB 2.0, HPI, ATA, Flash card I/F 300/600 Linux, Windows CE EMAC, DDR2, USB 2.0, HPI, ATA, Flash card I/F 256/512 Linux, Windows CE EMAC, DDR2, USB2.0, HPI, ATA, Flash card I/F 20–50 Schedulers and General purpose various RTOS 50–100 Schedulers and ENET 1588 MAC+PHY various RTOS 50–100 Schedulers and USB OTG/H/D various RTOS 50–100 Schedulers and CAN various RTOS

Embedded Processing Guide


Silicon TMS320C55x™ Power-Efficient DSP Generation, Fixed Point Industry’s Best Combination of Standby and Dynamic Power

Texas Instruments 3Q 2009

C5000™ Multicore Devices

TMS320C5000 DSP • Largest installed DSP customer base • Broad product portfolio • Power and cost efficient

C55x™ Devices

s ion

lut

o nS

o

ati

ic un

dio

co

C55x Devices

, Ra

it eK

mm

Fre

le Te

sand s ,H e etric c oi Cl Biom V , l , a ic dio Med Au tion able munica Port es, Com ri o s s e /Acc ny, VoIP Telepho Embedded Signal Processing, Measurement t ien

C5000 Devices

C54x™, C55x Devices

C54x, C55x Devices

C5000™ DSP Platform Roadmap The C5000 DSPs span the applications spectrum with core performance extended to 300 MHz.

8

4

10-Bit SAR ADC

Memory SARAM 192/256 KB

LCD

IS

2

4

SPI

ROM 128 KB

DARAM 64 KB

GPIO

Memory

32-KHz PLL

I2S

4

4

8

USB 2.0 Slave INT

FFT

2

JTAG

4-Ch. 4-Ch. 4-Ch. DMA 4-Ch. DMA DMA DMA

C55x™ DSP Core

7

ANA LDO

RTC

16

3 Timers

4

I2C

I2S

MMC/SD

GPIO

I2S

EMIF/ NAND

2

Peripheral Bus

60

6

MMC/SD

6

GPIO

Applications Feature-rich portable voice/audio products, hands-free car kit, noise cancellation headset, low-cost VoIP system and accessories, DECT/USB phone, software-defined radio, portable medical devices (ECG, digital stethoscope, pulse oximeter), fingerprint pattern recognition, metering, measurement and embedded signal processing applications in general TMS320C5504 / C5505 DSPs – Best-in-Class Standby and Dynamic Power • As low as 18 mW active power • 10-mm × 10-mm small form factor • Four pin-to-pin compatible devices with incremental features and price • Richest feature sets as shown in the block diagram TMS320C5507 / C5509A DSPs – Optimized for Portable Media / Industrial Applications • Dual MAC / 216–400 MIPs • Integrated multi-channel ADC, USB 2.0 full-speed and large on-chip RAM • Very low standby power of 0.12 mW TMS320C5501 / C5502 DSPs – Price and Performance Leaders • Up to 300-MHz clock rate • Two/Three multi-channel buffered serial ports (McBSPs),UART, I2C TMS320C5510 DSP – Ideal for Memory-Intensive Applications • Ultra low power – 69 µA in deep-sleep • Up to 320-KB on-chip memory

Software Compatible

UART

Specifications • TI has extended its popular TMS320C5000 low-power platform to provide a broader portfolio of the industry’s most power-efficient DSPs with standby power as low as 0.12 mW and performance up to 600 MIPs • Extremely low power consumption and more power modes extend battery life • Higher integration with large on-chip memory and a variety of peripheral offerings on a smaller form factor • Software compatible with all C5000 DSPs • Easy-to-use development tools and more value-added third-party solutions speed time to market

Increasing Performance/Power Efficiency/System Density

Get samples, data sheets, tools and app reports at: www.ti.com/c5000

7

13 8

TMS320C5505 DSP Block Diagram The C5505 DSP is one of the latest TI C5000 DSPs with the best-in-class combination of standby and active power and an integration level optimized for portable audio/voice, medical and many other applications.

Embedded Processing Guide

5

TMS320C5000™ DSP Platform


6

TMS320C5000™ DSP Platform Silicon

TMS320C55x™ DSP Generation Part Number TMS320VC5501GZZ3006 TMS320VC5501PGF3006 TMS320VC5501ZZZ3006 TMS320VC5502GZZ2006 TMS320VC5502PGF2006 TMS320VC5502ZZZ2006 TMS320VC5502PGF3006 TMS320VC5502GZZ3006 TMS320VC5502ZZZ3006 TMS320VC5503GHH6

RAM (Bytes) 32 K 32 K 32 K 64 K 64 K 64 K 64 K 64 K 64 K 64 K

DAT/PRO ROM I-Cache EMIF DMA (ADDR) (Bytes) (Bytes) (Bits) (ch) (Words) USB2 32 K 16 32 6 8M – 32 K 16 32 6 8M – 32 K 16 32 6 8M – 32 K 6 8M – 32 K 6 8M – 32 K 16 32 6 8M – 32 K 6 8M – 32 K 6 8M – 32 K 16 32 6 8M – 64 K – 16 6 8M –

ADC3 UART I2C – Y Y – Y Y – Y Y – Y Y – Y Y – Y Y – Y Y – Y Y – Y Y – – Y

RTC McBSP4 – 2 – 2 – 2 – 3 – 3 – 3 – 3 – 3 – 3 Y 3

TMS320VC5503PGE6

64 K

64 K

16

6

8M

Y

Y

3

TMS320VC5503ZHH6

64 K

64 K

16

6

8M

Y

Y

3

TMS320VC5506GHH1086 TMS320VC5506GHHR1086 TMS320VC5506PGE1086 TMS320VC5506ZHH1086 TMS320VC5506ZHHR1086 TMS320VC5507GHH6

128 K 128 K 128 K 128 K 128 K 128 K

– – – – – 64 K

– – – – – –

16 16 16 16 16 16

6 6 6 6 6 6

8M 8M 8M 8M 8M 8M

Y1 Y1 Y1 Y1 Y1 Y1

– – – – – Y1

– – – – – –

Y Y Y Y Y Y

Y Y Y Y Y Y

3 3 3 3 3 3

TMS320VC5507PGE6

128 K

64 K

16

6

8M

Y1

Y2

Y

Y

3

TMS320VC5507ZHH6

128 K

64 K

16

6

8M

Y1

Y1

Y

Y

3

TMS320VC5507ZHHR6

128 K

64 K

16

6

8M

Y1

Y1

Y

Y

3

TMS320VC5509AGHH6

256 K

64 K

16

6

8M

Y1

Y1

Y

Y

3

TMS320VC5509AGHHR6

256 K

64 K

16

6

8M

Y1

Y1

Y

Y

3

TMS320VC5509APGE6

256 K

64 K

16

6

8M

Y1

Y2

Y

Y

3

TMS320VC5509AZHH6

256 K

64 K

16

6

8M

Y1

Y1

Y

Y

3

TMS320VC5509AZHHR6

256 K

64 K

16

6

8M

Y1

Y1

Y

Y

3

TMS320VC5510AGGW1 TMS320VC5510AGGW2 TMS320VC5510AGGWA1 TMS320VC5510AGGWA2 TMS320VC5510AZGW1 TMS320VC5510AZGW2 TMS320VC5510AZGWA1 TMS320VC5510AZGWA2 TMS320VC5510AGPHA2 TMS320VC5504ZCH

320 K 32 K 320 K 32 K 320 K 32 K 320 K 32 K 320 K 32 K 320 K 32 K 320 K 32 K 320 K 32 K 320 K 32 K 256 K 128 K

24 24 24 24 24 24 24 24 24 –

32 32 32 32 32 32 32 32 32 16

6 6 6 6 6 6 6 6 6 16

8M 8M 8M 8M 8M 8M 8M 8M 8M 2M

– – – – – – – – – Y2

– – – – – – – – – –

– – – – – – – – – 1

– – – – – – – – – Y

– – – – – – – – – Y

3 3 3 3 3 3 3 3 3 –

TMS320VC5505ZCH

320 K 128 K

16

16

2M

Y2

Y1

1

Y

Y

MMC/ Voltage (V) SD LCD Core I/O COM Timers5 MHz MIPS – – 1.26 3.3 HPI8 37 300 600 – – 1.26 3.3 HPI8 37 300 600 – – 1.26 3.3 HPI8 37 300 600 – – 1.26 3.3 HPI16/8 37 200 400 – – 1.26 3.3 HPI16/8 37 200 400 – – 1.26 3.3 HPI16/8 37 200 400 – – 1.26 3.3 HPI16/8 37 300 600 – – 1.26 3.3 HPI16/8 37 300 600 – – 1.26 3.3 HPI16/8 37 300 600 – – 1.2/1.35/ 2.7–3.6 HPI16 27 108/144/ 400 1.6 200 (max) – – 1.2/1.35/ 2.7–3.6 HPI16 27 108/144/ 400 1.6 200 (max) – – 1.2/1.35/ 2.7–3.6 HPI16 27 108/144/ 400 1.6 200 (max) – – 1.2 2.7–3.6 – 27 108 216 – – 1.2 2.7–3.6 – 27 108 216 – – 1.2 2.7–3.6 – 27 108 216 – – 1.2 2.7–3.6 – 27 108 216 – – 1.2 2.7–3.6 – 27 108 216 – – 1.2/1.35/ 2.7–3.6 HPI16 27 108/144/ 400 1.6 200 (max) – – 1.2/1.35/ 2.7–3.6 HPI16 27 108/144/ 400 1.6 200 (max) – – 1.2/1.35/ 2.7–3.6 HPI16 27 108/144/ 400 1.6 200 (max) – – 1.2/1.35/ 2.7–3.6 HPI16 27 108/144/ 400 1.6 200 (max) 2 – 1.2/1.35/ 2.7–3.6 HPI16 27 108/144/ 400 1.6 200 (max) 2 – 1.2/1.35/ 2.7–3.6 HPI16 27 108/144/ 400 1.6 200 (max) 2 – 1.2/1.35/ 2.7–3.6 HPI16 27 108/144/ 400 1.6 200 (max) 2 – 1.2/1.35/ 2.7–3.6 HPI16 27 108/144/ 400 1.6 200 (max) 2 – 1.2/1.35/ 2.7–3.6 HPI16 27 108/144/ 400 1.6 200 (max) – – 1.6 3.3 HPI16 2 160, 200 320, 400 – – 1.6 3.3 HPI16 2 160, 200 320, 400 – – 1.6 3.3 HPI16 2 160, 200 320, 400 – – 1.6 3.3 HPI16 2 160, 200 320, 400 – – 1.6 3.3 HPI16 2 160, 200 320, 400 – – 1.6 3.3 HPI16 2 160, 200 320, 400 – – 1.6 3.3 HPI16 2 160, 200 320, 400 – – 1.6 3.3 HPI16 2 160, 200 320, 400 – – 1.6 3.3 HPI16 2 160, 200 320, 400 2 – 1.05/1.3 1.8/2.5/ – 27 60/100 120/200 (Muxed 2.8/3.3 w/ I2S & GPIO) 2 Muxed 1.05/1.3 1.8/2.5/ – 27 60/100 120/200 (Muxed w/ I2S, 2.8/3.3 w/ I2S SPI, & GPIO) UART & GPIO

1-KU Packaging Price1 201 BGA8 4.50 176 LQFP 4.50 201 BGA8 4.50 201 BGA8 6.26 176 LQFP 6.26 201 BGA8 6.26 176 LQFP 8.08 201 BGA8 8.08 201 BGA8 8.08 179 BGA 6.75 144 LQFP

6.75

179 BGA8

6.75

179 BGA 179 BGA 144 LQFP 179 BGA8 179 BGA8 179 BGA

6.50 6.50 6.50 6.50 6.50 9.41

144 LQFP

9.41

179 BGA8

9.41

179 BGA8

9.41

179 BGA

14.40

179 BGA

14.83

144 LQFP

14.40

179 BGA8

14.40

179 BGA8

14.83

240 BGA8 240 BGA8 240 BGA8 240 BGA8 240 BGA8 240 BGA8 240 BGA8 240 BGA8 240 BGA8 196 BGA8

14.40 16.85 17.28 19.87 14.40 16.85 17.28 19.73 20.20 5.60

196 BGA8

6.75

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain New devices are listed in red. the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.. 2 1 = Full speed 2.0; 2 = High speed 2.0 3 1 = 4-ch 10-bit ADC; 2 = 2-ch 10-bit ADC 4 Multi-channel buffered serial port (McBSP). 5 3 = Two general-purpose timers and one 32-bit DSP/BIOS™ kernel counter, 2 = Two general-purpose timers. 6 Extended temperature device, –40 to 85°C case temperature operation. 7 Plus 1 additional programmable watchdog timer. 8 MicroStar BGA™ package. Note: All devices include software PLL. Note: Enhanced plastic and HiRel DSP versions are available for selected DSPs.

Texas Instruments 3Q 2009

Embedded Processing Guide


Silicon TMS320C54x™ DSP Generation, Fixed Point Power-Efficient Performance DSPs Get samples, data sheets, tools and app reports at: www.ti.com/c5000

Specifications • 16-bit fixed-point DSPs • Power dissipation as low as 40 mW • Single- and multi-core products delivering 30–532 MIPS performance • 1.2-, 1.8-, 2.5-, 3.3- and 5-V versions available • Three power-down modes • Integrated RAM and ROM configurations • Auto-buffered serial port • Multi-channel buffered serial port • Host port interface • Ultra-thin packaging (100-, 128-, 144- and 176-pin LQFPs; 143-, 144-, 176- and 169-pin MicroStar BGAs™) • 6-channel DMA controller per core

Applications Digital cellular communications, personal communications systems, pagers, personal digital assistants, digital cordless communications, wireless data communications, hands-free car kit, computer telephony, voice over packet, portable Internet audio, modems

C54x™ DSP Generation Block Diagram This block diagram of the C54x DSP is a comprehensive diagram showing all peripheral options. C54x DSPs are optimized to meet the performance, cost and low-power needs of wireless and wireline communications systems as well as emerging applications like IP phones, VoP and portable applications.

Features • Integrated VITERBI accelerator • 40-bit adder and two 40-bit accumulators to support parallel instructions • 40-bit ALU with a dual 16-bit configuration capability for dual one-cycle operations • 17 × 17 multiplier allowing 16-bit signed or unsigned multiplication • Four internal buses and dual address generators enable multiple program and data fetches and reduce memory bottleneck • Single-cycle normalization and exponential encoding • Eight auxiliary registers and a software stack enable advanced fixed-point DSP C compiler • Power-down modes for batterypowered applications

Texas Instruments 3Q 2009

MicroStar BGA™ Package Comparison The ultra-small physical size (12 mm  12 mm  1.4 mm) of the C5000™ DSP MicroStar BGA (ball grid array) packaging can also help increase the performance per square inch for MIPS-intensive or space-constrained applications. The C5509A DSP is also pictured in a 144-pin LQFP.

Embedded Processing Guide

7

TMS320C5000™ DSP Platform


8

TMS320C5000™ DSP Platform Silicon TMS320C54x™ DSP Generation RAM ROM Part Number (Bytes) (Bytes) TMS320VC5401PGE50 16 K 8K TMS320VC5401GGU50 16 K 8K TMS320VC5401ZGU50 16 K 8K TMS320UC5402PGE80 32 K 8K TMS320UC5402GGU80 32 K 8K TMS320UC5402ZGU80 32 K 8K TMS320VC5402GGU100 32 K 8K TMS320VC5402GGUR10 32 K 8K TMS320VC5402PGE100 32 K 8K TMS320VC5402PGER10 32 K 8K TMS320VC5402ZGU100 32 K 8K TMS320VC5402ZGUR10 32 K 8K TMS320VC5402APGE16 32 K 32 K TMS320VC5402AGGU16 32 K 32 K TMS320VC5402AZGU16 32 K 32 K TMS320VC5404PGE 32 K 128 K TMS320VC5404GGU 32 K 128 K TMS320VC5407PGE 80 K 256 K TMS320VC5407GGU 80 K 256 K TMS320VC5407ZGU 80 K 256 K TMS320VC5409PGE-80 64 K 32 K TMS320VC5409GGU-80 64 K 32 K TMS320VC5409ZGU-80 64 K 32 K TMS320VC5409PGE100 64 K 32 K TMS320VC5409GGU100 64 K 32 K TMS320VC5409ZGU-100 64 K 32 K TMS320VC5409APGE12 64 K 32 K TMS320VC5409AGGU12 64 K 32 K TMS320VC5409AZGU12 64 K 32 K TMS320VC5409APGE16 64 K 32 K TMS320VC5409AGGU16 64 K 32 K TMS320VC5409AZGU16 64 K 32 K TMS320VC5410PGE100 128 K 32 K TMS320VC5410GGW100 128 K 32 K TMS320VC5410ZGW100 128 K 32 K TMS320VC5410APGE12 128 K 32 K TMS320VC5410AGGU12 128 K 32 K TMS320VC5410AZGU12 128 K 32 K TMS320VC5410APGE16 128 K 32 K TMS320VC5410AGGU16 128 K 32 K TMS320VC5410AZGU16 128 K 32 K TMS320VC5416PGE120 256 K 32 K TMS320VC5416GGU120 256 K 32 K TMS320VC5416ZGU120 256 K 32 K TMS320VC5416PGE160 256 K 32 K TMS320VC5416GGU160 256 K 32 K TMS320VC5416ZGU160 256 K 32 K TMS320VC549PGE80 64 K 32 K TMS320VC549GGU80 64 K 32 K TMS320VC549ZGU80 64 K 32 K TMS320VC549PGE100 64 K 32 K TMS320VC549GGU100 64 K 32 K TMS320VC549ZGU100 64 K 32 K TMS320VC549PGE120 64 K 32 K TMS320VC549GGU120 64 K 32 K TMS320VC549ZGU120 64 K 32 K

DAT/PRO EMIF (ADDR) (Bytes) (Bits) UART McBSP 128 K/2 M 16 – 2 128 K/2 M 16 – 2 128 K/2 M 16 – 2 128 K/2 M 16 – 2 128 K/2 M 16 – 2 128 K/2 M 16 – 2 128 K/2 M 16 – 2 128 K/2 M 16 – 2 128 K/2 M 16 – 2 128 K/2 M 16 – 2 128 K/2 M 16 – 2 128 K/2 M 16 – 2 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 1 3 128 K/16 M 1 3 128 K/16 M 1 3 128 K/16 M 1 3 128 K/16 M 16 1 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – 3 128 K/16 M 16 – – 128 K/16 M 16 – – 128 K/16 M 16 – – 128 K/16 M 16 – – 128 K/16 M 16 – – 128 K/16 M 16 – – 128 K/16 M 16 – – 128 K/16 M 16 – – 128 K/16 M 16 – –

Voltage (V) Core I/O 1.8 3.3 1.8 3.3 1.8 3.3 1.8 1.8–3.6 1.8 1.8–3.6 1.8 1.8–3.6 1.8 3.3 1.8 3.3 1.8 3.3 1.8 3.3 1.8 3.3 1.8 3.3 1.6 3.3 1.6 3.3 1.6 3.3 1.5 3.3 1.5 3.3 1.6 3.3 1.6 3.3 1.5 3.3 1.8 3.3 1.8 3.3 1.8 3.3 1.8 3.3 1.8 3.3 1.8 3.3 1.5 3.3 1.5 3.3 1.5 3.3 1.6 3.3 1.6 3.3 1.6 3.3 2.5 3.3 2.5 3.3 2.5 3.3 1.5 3.3 1.5 3.3 1.5 3.3 1.6 3.3 1.6 3.3 1.6 3.3 1.5 3.3 1.5 3.3 1.5 3.3 1.6 3.3 1.6 3.3 1.6 3.3 2.5 3.3 2.5 3.3 2.5 3.3 2.5 3.3 2.5 3.3 2.5 3.3 2.5 3.3 2.5 3.3 2.5 3.3

COM Timers DMA HPI 8 2 6 HPI 8 2 6 HPI 8 2 6 HPI 8 2 6 HPI 8 2 6 HPI 8 2 6 HPI 8 2 6 HPI 8 2 6 HPI 8 2 6 HPI 8 2 6 HPI 8 2 6 HPI 8 2 6 HPI 8 1 6 HPI 8 1 6 HPI 8/16 1 6 HPI 8/16 2 6 HPI 8/16 2 6 HPI 8/16 2 6 HPI 8/16 2 6 HPI 8/16 2 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8 1 6 HPI 8 1 6 HPI 8 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8/16 1 6 HPI 8 1 – HPI 8 1 – HPI 8 1 – HPI 8 1 – HPI 8 1 – HPI 8 1 – HPI 8 1 – HPI 8 1 – HPI 8 1 –

MHz 50 50 50 80 80 80 100 100 100 100 100 100 160 160 160 120 120 120 120 120 80 80 80 100 100 100 120 120 120 160 160 160 100 100 100 120 120 120 160 160 160 120 120 120 160 160 160 80 80 80 100 100 100 120 120 120

MIPS 50 50 50 80 80 80 100 100 100 100 100 100 160 160 160 120 120 120 120 120 80 80 80 100 100 100 120 120 120 160 160 160 100 100 100 120 120 120 160 160 160 120 120 120 160 160 160 80 80 80 100 100 100 120 120 120

Packaging 144 LQFP 144 BGA2 144 BGA 144 LQFP 144 BGA2 144 BGA2 144 BGA 144 BGA 144 LQFP 144 LQFP 144 BGA 144 BGA 144 LQFP 144 BGA2 144 BGA 144 LQFP 144 BGA2 144 LQFP 144 BGA2 144 BGA 144 LQFP 144 BGA2 144 BGA 144 LQFP 144 BGA2 144 BGA 144 LQFP 144 BGA2 144 BGA 144 LQFP 144 BGA2 144 BGA 144 LQFP 176 BGA2 176 BGA 144 LQFP 144 BGA2 144 BGA 144 LQFP 144 BGA2 144 BGA 144 LQFP 144 BGA2 144 BGA 144 LQFP 144 BGA2 144 BGA 144 LQFP 144 BGA 144 BGA 144 LQFP 144 BGA 144 BGA 144 LQFP 144 BGA 144 BGA

1-KU Price1 3.50 3.50 3.50 5.50 5.50 5.50 5.50 5.90 5.50 5.90 5.50 5.90 10.86 10.86 10.86 7.96 7.96 8.93 8.93 8.93 8.47 8.47 8.47 10.42 10.42 10.42 12.29 12.29 12.29 13.64 13.64 13.64 29.43 29.43 29.43 14.79 14.79 14.79 16.42 16.42 16.42 24.68 24.68 24.68 27.39 27.39 27.39 23.94 23.94 23.94 26.36 26.36 26.36 31.64 31.64 31.64

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 2 MicroStar BGA™ package. Note: All devices include software PLL. Note: Enhanced plastic and HiRel DSP versions are available for selected DSPs.

Texas Instruments 3Q 2009

Embedded Processing Guide


Tools, Software and Support TMS320C55x™ and TMS320C54x™ DSP Generation Hardware and Software Development Tools Description

$U.S.1

Part #

C5000™ DSP Starter Kits (DSKs) TMS320C55x Low-Power Optimization DSP Starter Kit (DSK) TMS320C54x DSP Starter Kit (DSK), TMS320C5416 DSP based2 TMS320C55x DSP Starter Kit (DSK), TMS320C5510 DSP based2

TMDSDSK5509 (U.S. part number) TMDSDSK5416 (U.S. part number) TMDSDSK5510 (U.S. part number)

495 395 395

TMDXEVM5505 TMDXMDKEK1258 TMDXMDKPO8328 TMDXMDKDS3254

395 449 395 325

Evaluation Module TMS320VC5505 Evaluation Module Medical Development Kit – Electrocardiogram Analog Front End Module (AFE) Medical Development Kit – Pulse Oximeter AFE Medical Development Kit – Digital Stethoscope AFE

JTAG Emulators Spectrum Digital XDS510PP-Plus Emulator Spectrum Digital XDS510PP-Plus Emulator with European Cords Spectrum Digital XDS510™ USB Emulator Blackhawk XDS560™ JTAG PCI Emulator Blackhawk XDS560 USB High-Performance JTAG Emulator All available Emulators/Analyzers for C5000 DSP Platform

TMDSEMUPP (U.S. part number) TMDSEMUPP-0E (European part number) TMDSEMUUSB TMDSEMU560PCI TMDSEMU560U www.ti.com/c5000toolssftwr

1,095 1,095 1,495 2,995 2,999

TMDSCCSALL-1

3,595

Software Development Tools Code Composer Studio™ Platinum Edition v3.3 Development Tools Bundled with Annual Software Subscription Supports C6000™, C5000, C2000™, DaVinci™ and OMAP™ processor platforms C6000, C5000, OMAP, DaVinci, C2000 DSP Code Composer Studio Development Tools Annual Software Subscription for Version 3.1 and higher Essential Guide to Getting Started with DSP CD-ROM Includes C6000, C5000, C2000, DaVinci and OMAP processor CCStudio 120-Day Free Evaluation Tools3 C54x™ DSP Software Library C55x™ DSP Software Library C55x DSP Imaging Software Library C54x DSP Chip Support Library C55x DSP Chip Support Library C5000 DSP Software Provider/List C5000 DSP Development Tool Provider/List

TMDSSUBALL

600

SPRC119 www.ti.com/freetools SPRC099 SPRC100 SPRC101 SPRC132 SPRC133 www.ti.com/c5000sftwrprov www.ti.com/c5000devtoolprov

Free Free Free Free Free Free

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain New tools are listed in red. the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. Includes a DSK version of Code Composer Studio Development Tools restricted for use only with the DSP target board included in the kit, power supply and cables. 3 Includes full-featured Code Composer Studio Development Tools, code generation tools (C/C++ compiler/assembler/linker), emulator and simulator configurations all limited to 120 days. Please see the tools features matrix on page 59 for more details. 2

C5000 DSP Literature and Related Technical Documentation All documentation and associated literature, user’s guides, application notes and software can be found by clicking on the specific device in the parametric table found on the URLs below. TMS320C54x DSP Generation

Texas Instruments 3Q 2009

www.ti.com/c54x

TMS320C55x DSP Generation

www.ti.com/c55x

Embedded Processing Guide

9

TMS320C5000™ DSP Platform


10

TMS320C5000™ DSP Platform

Power Management Products Power Management Products for the C5000™ DSP Platform Get samples, data sheets, Evaluation Modules (EVMs) and app reports at: power.ti.com

Suggested Texas Instruments Power Management Solutions for the C5000 DSP Platform

Input Voltage 3.3 V 5V

LDO TPS736xx TPS736xx

12 V

TLV1117

Core and I/O Voltages Non-Synchronous Controller (External FET and Diode) TPS64200 TPS64200 TPS40190 TPS5124 TPS5124

24 V

Synchronous Integrated FET Converter TPS62300 TPS62300

Dual-Output Converter TPS62400 TPS62400 TPS54386 TPS54386

TPS62110

TPS54386

I/O supply 3.3 V, current up to 250 mA Core supply down to 1.2 V, current up to 250 mA

Example C5000 DSP Power Supply Design U2 TPS76933DBV 1 5 IN OUT 2 GND 3 4 EN NC/FB

VIN C2

R3

VIO +

C4

Q1 2SC2412K

Sequencing Circuit EN C1

R2

R7 U3 TPS3103K33DBV 6 1 VDD RESET 5 2 PFO GND 4 3 PFI MR

R4

A2 B2 C2 D2

U1 TPS6230XYZD VIN GND EN SW ADJ M/S FB VOUT

RESET

R7

A1 B1 C1 D1

VCORE

L1

C3

R1

For additional power supply designs for TI DSPs, please visit www.ti.com/processorpower. Note: The TI power devices recommended here are based on standard operating conditions. System designers should use device power estimation tools in conjunction with overall application level power requirements to ensure an adequate power supply design is used.

Texas Instruments 3Q 2009

Embedded Processing Guide


TMS320C6000™ DSP Platform

11

Silicon

TMS320C64x™ DSP Generation, Fixed Point Highest-Performance and Performance Value DSPs

Specifications • Broadest portfolio of high-performance DSPs ranging from sub U.S. $10.10 to 3 GHz of raw DSP horsepower • Shipping the industry’s first 1.2-GHz single-core DSPs • Enabling more channels and functionality with high-performance, singlecore and multi-core DSPs • Upward 100% object code compatibility within C6000™ DSP platform • The easiest-to-use integrated development environment with the industry’s best optimizing C compiler Applications Wireless infrastructure (adaptive antennas, basestations, gateways), telecom infrastructure (RAS, PBX, VoIP), digital video (conferencing, surveillance, encoders, statistical remultiplexor/broadband routers, network projector, digital signage), imaging (medical, machine vision/inspection, defense/radar/sonar) Features • VelociTI.2 architecture extensions with new instructions to accelerate performance in key applications • Improved orthogonality with frequently used instructions available in more functional units • Double the bandwidth resulting from more registers, wider load/store data paths and enlarged two-level cache Peripherals • Enhanced direct memory access controller • Peripheral component interconnect • Universal test and operation PHY interface for ATM (UTOPIA) • Viterbi and Turbo coprocessors • External memory interfaces • Multi-channel buffered serial ports • Host port interfaces • Serial RapidIO® • Gigabit Ethernet MAC (SGMII)

Texas Instruments 3Q 2009

Increasing Performance, Memory & Peripherals

Get samples, data sheets, tools and app reports at: www.ti.com/c6000

Software Compatible • Ranging from sub U.S. $10.10 to 3.0 GHz • 30K+ programmers C64x™ • Millions shipped to date Multi-Core

High-Performance Multi-Core

Next C6474 DSP

C6414/5/6 DSP C64x DSP

C6410/2/3/8 DSP

High-Performance Single-Core

C64x Next

C6452/4/5/7 DSP C64x Next

C6421/4 DSP

Performance Value DSP

C6000™ DSP Platform Roadmap The C6000 DSP platform includes a wide range of devices that raise the bar in performance, set new levels of cost efficiency and offer on-chip peripheral integration to enable developers of highperformance systems to choose the device that best suits their specific application. Note: Information on DaVinci™ processor products can be found beginning on page 24.

TMS320C6424

OSC

DDR2 32

PLL

JTAG

DDR PLL

Timer WDT

EDMA 3.0 GPIO

EMIF 16 PCI 33 or VLYNQ™ RMII/MII or HPI RMII

DSP Subsystem L1D 80 KB C64x+™ Core L1P 32 KB

L2 128-KB Cache

McBSP McBSP or McASP Timer ×2 PWM ×3

2

IC

UART ×2 Please check user guide for MUXing options.

The C642x DSPs come in two flavors – the C6421 and C6424 DSPs. These DSPs are pin-for-pin compatible, start from U.S. $10.10 (1-KU volumes) and are completely scalable in speed and/or feature set. Both new DSPs are available in 400, 500 and 600 MHz speeds, and have the same raw processing power, but differ in on-chip memory and peripherals.

Embedded Processing Guide


12

TMS320C6000™ DSP Platform

Silicon

TMS320C64x™ DSP Generation – Performance Value Fixed-Point DSPs

Part Number

Internal RAM (Bytes) L1 Program Cache/ L1 Data Cache/ L2 Unified RAM/Cache 16 K/16 K/128 K 16 K/16 K/256 K 16 K/16 K/256 K 16 K/16 K/256 K 16 K/16 K/256 K 16 K/16 K/512 K 16 K/16 K/512 K 32 K/80 K/128 K 32 K/80 K/128 K 32 K/80 K/128 K 32 K/80 K/128 K 32 K/80 K/128 K 48 K/16 K/64 K 48 K/16 K/64 K 48 K/16 K/64 K 48 K/16 K/64 K 48 K/16 K/64 K

McBSP

Enhanced DMA (Channels)

COM

2 2 2 2 2 2 2 2 2 2 2 2 1 1 1 1 1

64 64 64 64 64 64 64 64 64 64 64 64 64 64 64 64 64

HPI 32/163 HPI 32/163 PCI/HPI/EMAC4 PCI/HPI/EMAC4 PCI/HPI/EMAC4 HPI 32/163 HPI 32/163 PCI/HPI/EMAC6 PCI/HPI/EMAC6 PCI/HPI/EMAC6 PCI/HPI/EMAC6 PCI/HPI/EMAC6 HPI/EMAC6 HPI/EMAC6 HPI/EMAC6 HPI/EMAC6 HPI/EMAC6

Timers MHz

MIPS

Power (W)2 CPU and L1 Total

3200 4000 4000 4800 5760 48005 40005 3200 4000 4000 4000 4800 3200 4000 4000 4000 4800

0.58 0.58 0.66 0.93 0.93 0.82 0.58 0.372 0.397 0.397 0.397 0.628 0.372 0.397 0.397 0.397 0.628

Voltage (V) Core I/O

Packaging

1-KU Price1

288 BGA, 23 mm 288 BGA, 23 mm 548 BGA, 23 mm 548 BGA, 23 mm 548 BGA, 23 mm 288 BGA, 23 mm 288 BGA, 23 mm 361 PBGA, 16 mm 361 PBGA, 16 mm 361 PBGA, 16 mm 376 PBGA, 23 mm 361 PBGA, 16 mm 361 PBGA, 16 mm 361 PBGA, 16 mm 361 PBGA, 16 mm 376 PBGA, 23 mm 361 PBGA, 16 mm

17.24 23.67 34.92 38.41 60.06 44.11 44.11 17.50 21.88 26.25 26.25 27.48 10.10 13.53 16.20 16.20 19.19

Performance Value TMS320C6410GTS400 TMS320C6413GTS500 TMS320C6412AGDK5 TMS320C6412AGDK6 TMS320C6412AGDK7 TMS320C6418GTS600 TMS320C6418ZTSA500 TMS320C6424ZWT4 TMS320C6424ZWT5 TMS320C6424ZWTQ57 TMS320C6424ZDUQ5 7 TMS320C6424ZWT6 TMS320C6421ZWT4 TMS320C6421ZWT5 TMS320C6421ZWTQ57 TMS320C6421ZDUQ5 TMS320C6421ZWT6

3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3

400 500 500 600 720 600 500 400 500 500 500 600 400 500 500 500 600

1.0 1.1 1.3 1.9 2.15 1.7 1.1 0.543 0.87 0.87 0.87 0.838 0.543 0.87 0.87 0.87 0.838

1.2 1.2 1.2 1.4 1.4 1.4 1.4 1.05/1.2 1.2 1.2 1.2 1.2 1.05/1.2 1.2 1.2 1.2 1.2

3.3 3.3 3.3 3.3 3.3 3.3 3.3 1.8/3.3 1.8/3.3 1.8/3.3 1.8/3.3 1.8/3.3 1.8/3.3 1.8/3.3 1.8/3.3 1.8/3.3 1.8/3.3

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain New devices are listed in red. the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 2 Assumes 60% CPU utilization, 50% EMIF utilization (133 MHz for 1.4 V, 100 MHz for 1.2 V), 50% writes, 64-bits, 50% bit switching, 2 2-MHz McBSP at 100% utilization, and 2 75-MHz timers at 100% utilization. See SPRAA59 for the TMS320C6410 and TMS320C6413 DSPs. See SPRA967 for the TMS320C6412A DSP. See SPRAA60 for the TMS320C6418 DSP. See SPRAAO9 for the TMS320C6421 and TMS320C6424 DSPs. 3 HPI is selectable, 32 bit or 16 bit. 4 The C6412 can be configured to have either a 32-bit PCI or 32-bit HPI, or a 16-bit HPI with Ethernet MAC. 5 Plus on-chip Viterbi (VCP) coprocessor. 6 HPI interface is 16 bit. 7 Q designates Q100 automotive reliability. Note: Check www.ti.com for extended temperature and packaging options. Additional information on enhanced plastic and HiRel DSP versions is available on page 103.

TMS320C64x™ DSP Generation – Highest-Performance Fixed-Point DSPs

Part Number

Internal RAM (Bytes) L1 Program Cache/ L1 Data Cache/ L2 Unified RAM/Cache

Enhanced DMA McBSP (Channels)

COM3

Timers MHz

MIPS

Power (W)2 CPU and L1 Total

Voltage (V) Core I/O

Packaging

1-KU Price1

1.2 1.2 1.2 1.1 1.2 1.2 1.2 1.1 1.2 1.2 1.2 1.1

532 BGA, 23 mm 532 BGA, 23 mm 532 BGA, 23 mm 532 BGA, 23 mm 532 BGA, 23 mm 532 BGA, 23 mm 532 BGA, 23 mm 532 BGA, 23 mm 532 BGA, 23 mm 532 BGA, 23 mm 532 BGA, 23 mm 532 BGA, 23 mm

205.80 165.15 103.30 82.65 183.25 138.25 93.95 75.15 173.50 131.40 89.25 71.40

Highest Performance TMS320C6416TBGLZ1 TMS320C6416TGLZ8 TMS320C6416TBGLZ7 TMS320C6416TGLZ6 TMS320C6415TBGLZ1 TMS320C6415TBGLZ8 TMS320C6415TBGLZ7 TMS320C6415TBGLZ6 TMS320C6414TBGLZ1 TMS320C6414TBGLZ8 TMS320C6414TBGLZ7 TMS320C6414TBGLZ6

16K/16K/1M 16K/16K/1M 16K/16K/1M 16K/16K/1M 16K/16K/1M 16K/16K/1M 16K/16K/1M 16K/16K/1M 16K/16K/1M 16K/16K/1M 16K/16K/1M 16K/16K/1M

2+Utopia4 2+Utopia4 2+Utopia4 2+Utopia4 2+Utopia4 2+Utopia4 2+Utopia4 2+Utopia4 3 3 3 3

64 64 64 64 64 64 64 64 64 64 64 64

PCI/HPI 32/16 PCI/HPI 32/16 PCI/HPI 32/16 PCI/HPI 32/16 PCI/HPI 32/16 PCI/HPI 32/16 PCI/HPI 32/16 PCI/HPI 32/16 HPI 32/16 HPI 32/16 HPI 32/16 HPI 32/16

3 3 3 3 3 3 3 3 3 3 3 3

1000 850 720 600 1000 850 720 600 1000 850 720 600

80005 68005 57605 48005 8000 6800 5760 4800 8000 6800 5760 4800

0.44 0.44 0.44 0.39 0.44 0.44 0.44 0.39 0.44 0.44 0.44 0.39

1.65 1.46 1.36 1.1 1.65 1.46 1.36 1.1 1.65 1.46 1.36 1.1

3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 2 Assumes 60% CPU utilization, 50% EMIF utilization (133 MHz for 1.4 V, 100 MHz for 1.2 V), 50% writes, 64-bits, 50% bit switching, 2 2-MHz McBSP at 100% utilization, and 2 75-MHz timers at 100% utilization. See SPRAA45 for TMS320C6414T, TMS320C6415T and TMS320C6416T DSPs. 3 HPI is selectable, 32 bit or 16 bit. 4 UTOPIA pins muxed with a second McBSP. 5 Plus on-chip Turbo (TCP) and Viterbi (VCP) coprocessors. Note: Check www.ti.com for extended temperature and packaging options. Additional information on enhanced plastic and HiRel DSP versions is available on page 103.

Texas Instruments 3Q 2009

Embedded Processing Guide


TMS320C6000™ DSP Platform

13

Tools and Resources

TMS320C64x™ DSP Hardware and Software Development Tools Description

$U.S.1

Part Number

Hardware Development Tool TMS320C6416 DSP Starter Kit (DSK)

TMDSDSK6416-T (U.S. part number) TMDSDSK6416-TE (European part number)

495

TMDXEVM6424

495

Evaluation Module (EVM) TMS320C6424 Evaluation Module (EVM)

JTAG Emulators Spectrum Digital XDS510PP-Plus Emulator Spectrum Digital XDS510PP-Plus Emulator with European Cords Spectrum Digital XDS510™ USB Emulator Blackhawk XDS560™ JTAG PCI Emulator Blackhawk XDS560 USB High-Performance JTAG Emulator XDS560 USB Trace Emulator2

TMDSEMUPP (U.S. part number) TMDSEMUPP-0E (European part number) TMDSEMUUSB TMDSEMU560PCI TMDSEMU560U TMDSEMU560T

1,095 1,095 1,495 2,995 2,999 9,995

TMDSCCSALL-1

3,595

www.ti.com/vlib SPRC847/831 TMDSSUBALL

Free Free 600

SPRC119 (www.ti.com/freetools)

Free

SPRC090 SPRC092 SPRC094

Free Free Free

Software Development Tools Code Composer Studio Platinum v 3.3 Development Tools Bundled with Annual S/W Subscription Supports C6000™, C5000™, C2000™, DaVinci™ and OMAP™ processor platforms VLIB Software Library VICP Signal Processing Library C6000, C5000, C2000, DaVinci and OMAP processor CCStudio Development Tools Annual Software Subscription for Version 3.10 and higher Code Composer Studio IDE Free Evaluation Tools Includes C6000, C5000, C2000, DaVinci and OMAP processor CCStudio 120-Day Free Evaluation Tools3 TMS320C6000 DSP Chip Support Library TMS320C64x™ DSP Library TMS320C64x DSP Image Library 1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers New tools are listed in bold red. are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 2 The XDS560 Trace is designed for use with trace-enabled digital signal processors. Currently the following processors are fully supported by trace: TMS320C6418, TMS320C6416T, TMS320C6415T, TMS320C6414T, TMS320C6413, TMS320C6412, TMS320C6411 and TMS320C6410 processors. 3 Includes full-featured Code Composer Studio Development Tools, code generation tools (C/C++ compiler/assembler/linker) and simulator all limited to 120 days. Please see the tools features matrix on page 59 for more details.

C64x™ Literature and Related Technical Documentation All documentation and associated literature, user’s guides, application notes and software can be found by clicking on the specific device in the parametric table found on the URL below. TMS320C64x DSP Generation

Texas Instruments 3Q 2009

www.ti.com/c64x

Embedded Processing Guide


14

TMS320C6000™ DSP Platform

Silicon TMS320C645x DSP Generation, Fixed Point Highest-Performance DSPs Get samples, data sheets, tools and app reports at: www.ti.com/c6000

Applications Video and voice transcoding, video conferencing servers, high-definition (HD) video encoding and mixer systems, wireless basestation transceivers, HD Radio™, medical imaging, photo labs, industrial vision, military, printing and VoIP infrastructure Features • TMS320C64x+™ core • 720 MHz, 850 MHz, 900 MHz, 1 GHz and 1.2 GHz • Memory • 32-KB L1D, 32-KB L1P cache/SRAM • Up to 2 MB L2 • Up to 1-MB cacheable L2 memory • Acceleration • Viterbi coprocessor (VCP2) • Turbo-decoder coprocessor (TCP2) Peripherals • Serial RapidIO • Gigabit Ethernet MAC • Telecom serial interface port (TSIP) • Other high-bandwidth peripherals: UTOPIA, PCI-66, HPI • Up to two EMIFs: 32-bit DDR2, 64-bit EMIF Texas Instruments 3Q 2009

TMS320C6457 C64x+™ Core

Timers

PLL

Boot ROM L1 D MEM L1 P MEM

TCP2

L2 MEM

VCP2

TCP2

EMIF 64

DDR2

SRIO

HPI

UTOPIA

SGMI

McBSP

I2C

GPIO

EDMA 3.0 with Switch Fabric

TMS320C6457 DSP Block Diagram C6457 DSPs offer superior memory and cache performance, dual-TCP2 accelerators and faster DDR2 interface over C6455 DSPs.

TMS320C64x+ DSP Core Benefits and Features Benefits 20% higher cycle performance improves overall system performance 20–30% smaller code size reduces system cost Enhanced development Better debug

Supporting Architecture Features • Doubled multiplication bandwidth • Instruction set enhancements for FFT, FIR and DCT • EDMA 3.0 engine • 16-bit compact instructions • SPLOOP buffer • Real-time bandwidth management • Memory protection • Exception handling • Cache coherency visibility

TMS320C6452

PLL

DDR2 32b

JTAG

DDR PLL Switch Fabric/EDMA 3.0

VLYNQ™ EMIF 16b UHPI or PCI66 SGMII SGMII

SGMII SGMII

GigSwitch

Specifications • TMS320C6457 DSP offers superior memory and cache performance, dual-TCP2 accelerators, and Serial RapidIO® for DSP-to-DSP, switch and FPGA interconnectivity • TMS320C6455 DSP offers Serial RapidIO for DSP-to-DSP, switch and FPGA interconnectivity • TMS320C6452 DSP offers Gigabit Ethernet switch with two EMAC ports for ease of scalability • Enhanced core enables 20 percent higher cycle performance • 20–30 percent smaller code size from 16-bit compact instructions and SPLOOP buffer

GPIO DSP Subsystem L1D 32 KB C64x+™ Core L1P 32 KB

L2 1.4 MB Cache

McASP or TSIP (×2) Timer ×4 SPI UART UART II2C

The C6452 DSP provides customers lower system cost by offering a greater channel density and more peripheral integration. The C6452 DSP will be offered at both 900 MHz and 720 MHz.

Embedded Processing Guide


Silicon

15

TMS320C6000™ DSP Platform TMS320C645x DSP Generation – Highest-Performance Fixed-Point DSPs

Part Number

Internal RAM (Bytes) L1 Program Cache/ Enhanced L1 Data Cache/ DMA Cores L2 Unified RAM/Cache McASP McBSP TSIP (Channels)

COM3

Power (W)2 Internal Voltage (V) Timers MHz MIPS Logic Total Core I/O

Packaging

1-KU Price1

Highest-Performance DSPs TMS320C6457CMH

1

32 K/32 K/2 M

2+Utopia4 –

64

TMS320C6457CMH2

1

32 K/32 K/2 M

2+Utopia4 –

64

TMS320C6455BZTZ2

1

32 K/32 K/2 M

2+Utopia4 –

64

TMS320C6455BZTZ

1

32 K/32 K/2 M

2+Utopia4 –

64

TMS320C6455BZTZ8

1

32 K/32 K/2 M

2+Utopia4 –

64

TMS320C6455BZTZ7

1

32 K/32 K/2 M

2+Utopia4 –

64

TMS320C6454BZTZ2

1

32 K/32 K/1 M

2

64

TMS320C6454BZTZ

1

32 K/32 K/1 M

2

64

TMS320C6454BZTZ8

1

32 K/32 K/1 M

2

64

TMS320C6454BZTZ7

1

32 K/32 K/1 M

2

64

TMS320C6452ZUT9

1

32 K/32 K/1.4 M

1

2

64

TMS320C6452ZUT7

1

32 K/32 K/1.4 M

1

2

64

Serial RapidIO/HPI/ Gigabit EMAC Serial RapidIO/HPI/ Gigabit EMAC Serial RapidIO/HPI/ PCI/Gigabit EMAC Serial RapidIO/HPI/ PCI/Gigabit EMAC Serial RapidIO/HPI/ PCI/Gigabit EMAC Serial RapidIO/HPI/ PCI/Gigabit EMAC HPI/PCI/ Gigabit EMAC HPI/PCI/ Gigabit EMAC HPI/PCI/ Gigabit EMAC HPI/PCI/ Gigabit EMAC 2×SGMII/Gigabit EMAC Switch/UHPI/PCI/VLYNQ 2×SGMII/Gigabit EMAC Switch/UHPI/PCI/VLYNQ

25

1000 8000

1.85

2.33

1.1

25

1200 9600

2.79

3.27

1.2

25

1200 96006 1.76

2.30

1.25

25

1000 80006 1.66

2.19

1.25

25

850 68006 1.41

1.94

1.2

25

720 57606 1.29

1.81

1.2

25

1200 9600

1.76

2.30

1.25

25

1000 8000

1.66

2.19

1.25

25

850 6800

1.41

1.94

1.2

25

720 5760

1.29

1.81

1.2

45

900 7200 2.173 3.373

1.2

3.3, 1.8, 1.1 3.3, 1.8, 1.2 3.3, 1.8, 1.5, 1.25 3.3, 1.8, 1.5, 1.25 3.3, 1.8, 1.5, 1.2 3.3, 1.8, 1.5, 1.2 3.3, 1.8, 1.5, 1.25 3.3, 1.8, 1.5, 1.25 3.3, 1.8, 1.5, 1.2 3.3, 1.8, 1.5, 1.2 3.3, 1.8

45

720 5760

1.2

3.3, 1.8 529 BGA, 19 mm 80.10

1.92

3.116

688 BGA, 23 mm 111.85 688 BGA, 23 mm 145.41 697 BGA, 24 mm 215.72 697 BGA, 24 mm 171.36 697 BGA, 24 mm 148.86 697 BGA, 24 mm 126.15 687 BGA, 24 mm 175.07 687 BGA, 24 mm 134.13 687 BGA, 24 mm 106.26 687 BGA, 24 mm 87.10 529 BGA, 19 mm 91.31

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain New devices are listed in red. the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. the following conditions: 60% CPU utilization; DDR2 at 50% utilization (250 MHz), 50% writes, 32 bits, 50% bit switching; two 2-MHz McBSPs at 100% utilization, 50% switching; two 75-MHz timers at 100% utilization; device configured for HPI32 mode with pull-up resistors on HPI pins; room temperature (25°C). See SPRAAE8 for TMS320C6455 and TMS320C6454 DSPs. See SPRAAR5 for TMS320C6452 DSPs. 3 HPI is selectable, 32 bit or 16 bit. 4 UTOPIA pins muxed with a second McBSP. 5 64-bit configurable timers. 6 Plus on-chip Turbo (TCP) and Viterbi (VCP) coprocessors. Note: Check www.ti.com for extended temperature and packaging options. Additional information on enhanced plastic and HiRel DSP versions is available on page 103. 2 Assumes

Tools available for the TMS320C645x DSP generation are listed on page 17.

Texas Instruments 3Q 2009

Embedded Processing Guide


16

TMS320C6000™ DSP Platform

Silicon TMS320C647x DSP Generation, Fixed Point Highest-Performance Multi-Core DSPs Get samples, data sheets, tools and app reports at: www.ti.com/c6000

Specifications • Three 1-GHz cores: 48,000 (8-bit) MMACS / 24,000 (16-bit) MMACS peak performance • Software backward compatibility allows for easier porting to new DSP • Fast core-to-core communications, less cycles/lower latency • VCP2 and TCP2 accelerators for significantly speeding up channel decoding operations on-chip, offloading the DSP for other processing • Access memory faster with 667MHz high-performance DDR2 • High-speed interconnect enabled by EMAC, AIF and sRIO SERDES interfaces

Features • 3× 1.0-GHz TMS320C64x+™ cores • Memory • 32-KB L1D, 32-KB L1P cache per core • 3 MB total L2 memory • Configurable allocation per core • Acceleration • Viterbi coprocessor (VCP2) • Turbo-decoder coprocessor (TCP2)

C64x+™ Core

C64x+ Core

C64x+ Core

L1 Data L1 Prog

L1 Data L1 Prog

L1 Data L1 Prog

L2 Memory

L2 Memory

Timers

Others

McBSP

I2C Boot ROM

DDR-2 I/F

Texas Instruments 3Q 2009

10/100/ 1G Ethernet

TCP2

PLL

VCP2

GPIO

Antenna Serial ® Interface RapidIO

TMS320C6474 DSP Block Diagram The highly integrated C6474 DSP integrates three of TI’s flagship TMS320C64x+™ cores per chip. A large amount on-chip memory and fast speed I/O interface enable high-density and highperformance applications. Software compatibility allows a straightforward code porting from C64x+™-core DSPs system.

Same performance, 1/3 less power Power consumption

10 ~9W 5

~6W

50% more performance, same power budget Ex: 25-W DSP power budget 1-GHz DSP

1-GHz DSP

1-GHz DSP

1-GHz DSP

1-GHz DSP

1-GHz DSP

1-GHz DSP

1-GHz DSP

8-GHz raw performance C6474 C6474 C6474 C6474 Multi-Core Multi-Core Multi-Core Multi-Core

0 Peripherals • Gigabit Ethernet MAC (EMAC) • Antenna Interface (AIF)–6 lanes total • Serial RapidIO® (sRIO) – 2 lanes total • 667-MHz, high-performance DDR2 interface • McBSP (TDM)

L2 Memory

EDMA3.0 with Switch Fabric

Watts

Applications Communication infrastructure, video infrastructure, high-performance imaging, server blade, military, aerospace and avionics systems, test and measurement solutions, advanced networking equipments, oil exploration and modeling equipments, training and simulation applications

TMS320C6474

12-GHz raw performance

Board with 25-Watt power limit reached More performance for same power budget

Three 1-GHz One C6474 C6455 DSPs Multi-Core DSP

50% more performance per Watt

Integrated Solution Improves Power Efficiency Smaller process node, TI-patented SmartReflex™ technology and eliminating I/O switch with highly integrated architecture improve power efficiency of C6474 DSP systems.

Embedded Processing Guide


Silicon, Tools and Software

17

TMS320C6000™ DSP Platform TMS320C647x DSP Generation – Multi-Core Highest-Performance Fixed-Point DSP

Part Number

Internal RAM (Bytes) L1 Program Cache/ Enhanced L1 Data Cache/ DMA Cores L2 Unified RAM/Cache McASP McBSP TSIP (Channels)

Power (W)2 Internal Voltage (V) Timers MHz MIPS Logic Total Core I/O

COM3

Packaging

1-KU Price1

Highest-Performance Multi-Core DSPs TMS320C6474ZUN

3

96 K/96 K/3.072 M

2

64

Serial RapidIO®/ SGMII/Gigabit EMAC

64

1000 24000

5.04

5.43 0.9 to1.2 1.8, 1.1 561 BGA, 23 mm 224.81 SmartReflex™

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain New devices are listed in red. the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. the following conditions: 60% CPU utilization; DDR2 at 50% utilization (250 MHz), 50% writes, 32 bits, 50% bit switching; two 2-MHz McBSPs at 100% utilization, 50% switching; two 75-MHz timers at 100% utilization; room temperature (25°C). See SPRAAX3 for TMS320C6474 DSPs. 3 HPI is selectable, 32 bit or 16 bit. 4 64-bit configurable timers. Note: Check www.ti.com for extended temperature and packaging options. Additional information on enhanced plastic and HiRel DSP versions is available on page 103. 2 Assumes

TMS320C645x and TMS320C647x DSP Generations Hardware and Software Development Tools Description

Part Number

$U.S.1

Hardware Development Tool TMS320C6455 DSP Starter Kit (DSK)

TMDSDSK6455

595

Evaluation Modules (EVM) TMS320C6474 DSP Evaluation Module TMS320C6457 DSP Evaluation Module TMS320C6455 DSP Evaluation Module with sRIO TMS320C6452 DSP Evaluation Module

TMDXEVM6474 TMDXEVM6457 TMDXEVM6455 (U.S. part number) TMDXEVM6452

1,995 1,995 1,795 1,295

TMDSEMUPP (U.S. part number) TMDSEMUPP-0E (European part number) TMDSEMUUSB TMDSEMU560PCI TMDSEMU560U TMDSEMU560T

1,095 1,095 1,495 2,995 2,999 9,995

TMDSCCSALL-1

3,595

JTAG Emulators Spectrum Digital XDS510PP-Plus Emulator Spectrum Digital XDS510PP-Plus Emulator with European Cords Spectrum Digital XDS510™ USB Emulator Blackhawk XDS560™ JTAG PCI Emulator Blackhawk XDS560 USB High-Performance JTAG Emulator XDS560 USB Trace Emulator2

Software Development Tools Code Composer Studio™ (CCStudio) Platinum v 3.3 Development Tools Bundled with Annual S/W Subscription Supports C6000™, C5000™, C2000™, DaVinci™ and OMAP™ processor platforms C6000, C5000, C2000, DaVinci and OMAP processor CCStudio Development Tools Annual Software Subscription for Version 3.10 and higher Code Composer Studio IDE Free Evaluation Tools Includes C6000, C5000, C2000, DaVinci and OMAP processor CCStudio 120-Day Free Evaluation Tools3 TMS320C6000 DSP Chip Support Library

TMDSSUBALL

600

SPRC119 (www.ti.com/freetools)

Free

SPRC090

Free

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain New tools are listed in red. the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 2 The XDS560 Trace is designed for use with trace-enabled digital signal processors. The following processors are fully supported by trace: TMS320C6452, TMS320C6454 and TMS320C6455 DSPs. 3 Includes full-featured Code Composer Studio Development Tools, code generation tools (C/C++ compiler/assembler/linker) and simulator all limited to 120 days. Please see the tools features matrix on page 59 for more details.

Texas Instruments 3Q 2009

Embedded Processing Guide


18

TMS320C6000™ DSP Platform

Silicon TMS320C67x™ DSP Generation, Fixed/Floating Point Low-Power DSPs Get samples, data sheets, tools and app reports at: www.ti.com/c6000

Applications

Vehicle diagnostics, Software-Defined Radio (SDR), industrial monitoring, test and measurement equipment (oscilloscopes, seismic analyzers etc.), audio (digital mixers, teleconference systems), medical monitoring, biometrics, music effects, speech recognition, voice over packet, conference/IP phones, and more… C674x DSP • Supports both fixed point and floating point • Fully code compatible with all previous TMS320C6000™ devices • Lowest-power floating-point DSP (2× lower than nearest competitor) • Lowest-cost fixed- or floating-point networking DSP • Networking simplified with advanced peripherals including 10/100 Ethernet MAC, USB 2.0 HS OTG, SATA • Scalable architecture; pin-for-pin compatible with select devices in the OMAP-L1x embedded processor generation • Up to 448 KB of on-chip memory for system cost reduction and lower power consumption • Low power consumption ranging from 7 mW* deep-sleep power to 452 mW‡ total power • Smaller, ergonomic products with 13×13-mm packaging C672x DSP

• Lowest price floating-point device in the market • Sixty-four 32-bit registers • Flexible boot options • dMAX DMA engine tuned for audio performance C671x DSP

• L1/L2 cache architecture • Thirty-two 32-bit registers • EDMA DMA engine

Texas Instruments 3Q 2009

Production

300 MHz 7–440 mW*

Sampling

C6748 DSP

In Development

Fixed

300 MHz 60–470 mW*

Future 300 MHz 60–470 mW*

C6742 DSP

C67x DSP C6745 DSP

C64x DSP

C674x Future

atin

+ Flo

C6746 DSP

C6743 DSP

C6747 DSP

int g Po

C62x DSP

TMS320C674x devices include: • SATA • USB 2.0 HS PHY • USB 1.1 FS PHY • Up to 448-KB on-chip memory • 10/100 Ethernet MAC • mDDR/DDR/SDRAM • Video port (VPIF) • Universal parallel port (uPP) • PWMs • LCD controller

Time

*For typical use case scenarios.

TMS320C674x DSP Roadmap TMS320C674x DSP core is a low-power, scalable, highly integrated connected device which combines the TMS320C64x+™ and TMS320C67x+ DSP cores, and is capable of performing both fixed- and floating-point operations in a single core. EMIFA NAND/ SDRAM (16-Bit)

10/100 Ethernet MAC

EMIFB SDRAM (32-Bit)

128-KB RAM Switch Fabric/EDMA I2C (2) DSP Subsystem L1D 32 KB

MMC/SD USB 2.0

C674x Core

USB 1.1 HPI

L2 256 KB

L1P 32 KB

Timers (2)

UART (3) McASP (3) RTC PWM (3) GPIO LCD Ctl

TMS320C6747

WD Timer

SPI (2)

64b Timer (2)

PLL

uPP or Video In

EMIF1 SDR

TMS320C6747 Block Diagram The C6747 is a low-power processor based on the C674x DSP core. It provides significantly lower power than other members of the TMS320C6000™ platform of DSPs.

128-KB RAM

Switch Fabric/EDMA I2C (2)

EMIF2 MMC/SD (2) USB 2.0 USB 1.1 EMAC UHPI SATA

DSP Subsystem L1D 32 KB C674x Core L1P 32 KB

SPI (2) UART (3)

L2 256 KB

McASP (1) McBSP (2) RTC PWM (2) GPIO LCD Ctl

TMS320C6748

TMS320C6748 Block Diagram The TMS320C6748 DSP provides unmatched connectivity options with fixed- and floating-point capabilities.

* Power-use scenario – deep sleep: 1.0-V core, idle ARM® DSP clock OFF, all peripherals clock OFF, RTC ON, PLL disabled, 25°C. ‡ Power-use scenario – active: 70% max load of CPU running at 300 MHz at 1.2 V, mDDR 133 MHz/16 bit accessed 50% of the time, McBSP, SPI and GPIOs peripherals are active, 25°C

Embedded Processing Guide


TMS320C6000™ DSP Platform

19

Silicon

Connectivity, Portability and Low Cost with TMS320C674x Digital Signal Processors The C674x DSP generation provides the lowest power and a low-cost entry point into the TMS320C6000™ DSP platform. With pricing starting under U.S. $8 in 1,000-unit quantities and pin-for-pin compatibility with the OMAP-L137 processor, designers are easily able to choose the right processor to fit their application needs.

leakage transistor technology, C674x DSPs offer high performance and scalability with power consumption as low as 7 mW* in deep sleep mode. The high-performance and low-power silicon architecture and power-management software technology used for C674x DSPs give designers not only granularity for frequency and voltage, but also the ability to manipulate the individual peripherals to further optimize power consumption.

The high-precision TMS320CC67x+ DSP and high-performance TMS320C64x+™ cores combine to create this C674x processor core which enables designers to develop software using both floatingand fixed-point instructions in a single device. Boasting the lowest power of any floating-point DSP in the industry, the C674x core eliminates barriers that once prohibited designers from developing portable products in the floating-point environment. For current C67x™ and C64x™ customers, through full code compatibility with all existing C6000™ DSP code, the C674x DSP generation allows designers to reduce their time to market through re-use of their code. With the best of both worlds (floating-point and fixed-point) in a single core, designers now have more flexibility than ever.

Chip-level integration includes, but is not limited to: • 10/100 Ethernet MAC • USB 1.1 Host/2.0 Host/Device/OTG • MMC/SD controllers • Universal parallel port (uPP) for interfacing with FPGAs, high-speed data converters (C6748 DSP and C6746 DSP only) • Universal Host Port Interface (UHPI) for interfacing with other processors • LCD controller • Serial ATA Interface (C6748 DSP only) • 448-KB on-chip memory • Video port interface (C6748 DSP and C6746 DSP only)

Increase the Battery Life of Applications Through TI Process Technology Combining industry-leading, cutting-edge 65-nm process technology with low-

Texas Instruments 3Q 2009

C674x Core The TMS320C674x DSP core couples the high precision and wide dynamic range of TI’s floating-point TMS320C67x+ core with the higher system performance of TI’s fixed-point TMS320C64x+ core. C674xbased DSPs are object code compatible with all TMS320C6000 devices so developers can easily design a broad range of

energy-efficient products by leveraging existing software code. Get Started Quickly As the C6747, C6745 and C6743 DSPs are pin-for-pin compatible with the OMAP-L137 processor, designers can start today on their C674x development with the TMDXOSKL137 Starter Kit. This development kit is priced at U.S. $395 and is available through all standard TI sales channels. This board includes builtin emulation and Code Composer Studio™ Integrated Development Environment support. DSP/BIOS™ operating system and device drivers and the associated debugging environment are also included. For more information on C674x processors, visit www.ti.com/c674x. C674x Videos Want to hear more about the exciting new C674x processors? Hear about both the hardware and software that supports these platforms here: www.ti.com/c674x_comm.

* Power-use scenario – deep sleep: 1.0-V core, idle ARM® DSP clock OFF, all peripherals clock OFF, RTC ON, PLL disabled, 25°C.

Embedded Processing Guide


20

TMS320C6000™ DSP Platform

Silicon

TMS320C67x™ DSP Generation – Floating-Point DSPs Part Number

CPU

Frequency L1P L1D L2 RAM External (MHz) (Bytes) (Bytes) (Bytes) (Bytes) Memory I/F DMA Timers

TMS320C6748ZCE

C674x

300

32 K 32 K 256 K 128 K DDR2/mDDR 64 Ch 3 GP, SDRAM 1 GP/WD NAND NOR 32 K 32 K 256 K 128 K DDR2/mDDR 64 Ch 3 GP, SDRAM 1 GP/WD NAND NOR 32 K 32 K 256 K 128 K SDRAM 32 Ch5 1 GP, NAND 1 GP/WD NOR

TMS320C6748ZWT

C674x

300

TMS320C6747ZKB3

C674x

300

TMS320C6747ZKB2

C674x

200

32 K 32 K 256 K 128 K

TMS320C6746ZCE

C674x

300

32 K 32 K 256 K

TMS320C6746ZWT

C674x

300

32 K 32 K 256 K

TMS320C6745PTP3

C674x

300

32 K 32 K 256 K

TMS320C6745PTP2

C674x

200

32 K 32 K 256 K

TMS320C6743PTP3

C674x

300

32 K 32 K 128 K

TMS320C6743PTP2

C674x

200

32 K 32 K 128 K

TMS320C6743ZKB3

C674x

300

32 K 32 K 128 K

TMS320C6743ZKB2

C674x

200

32 K 32 K 128 K

TMS320C6742ZCE

C674x

300

32 K 32 K

64 K

TMS320C6742ZWT

C674x

300

32 K 32 K

64 K

SDRAM NAND NOR DDR2/mDDR SDRAM NAND NOR DDR2/mDDR SDRAM NAND NOR SDRAM NAND NOR SDRAM NAND NOR SDRAM NAND NOR SDRAM NAND NOR SDRAM NAND NOR SDRAM NAND NOR DDR2/mDDR SDRAM NAND, NOR DDR2/mDDR SDRAM NAND, NOR

32 Ch5 1 GP, 1 GP/WD

64 Ch

3 GP, 1 GP/WD

64 Ch

3 GP, 1 GP/WD

32 Ch5 1 GP, 1 GP/WD 32 Ch5 1 GP, 1 GP/WD 32 Ch5 1 GP, 1 GP/WD 32 Ch5 1 GP, 1 GP/WD 32 Ch5 1 GP, 1 GP/WD 32 Ch5 1 GP, 1 GP/WD

Serial Ports

Misc

USB 2.0 HS OTG, USB 1.1, SATA 1 McASP, 2 McBSP, 2 SPI, 2 I2C, 3 UART USB 2.0 HS OTG, USB 1.1, SATA 1 McASP, 2 McBSP, 2 SPI, 2 I2C, 3 UART USB 2.0 HS OTG, USB 1.1, 3 McASP, 2 SPI, 2 I2C, 3 UART USB 2.0 HS OTG, USB 1.1, 3 McASP, 2 SPI, 2 I2C, 3 UART USB 2.0 HS OTG, 1 McASP, 2 McBSP, 2 SPI, 2 I2C, 3 UART USB 2.0 HS OTG, 1 McASP, 2 McBSP, 2 SPI, 2 I2C, 3 UART USB 2.0 FS, 2 McASP, 2 SPI, 2 I2C, 3 UART USB 2.0 FS, 2 McASP, 2 SPI, 2 I2C, 3 UART 2 McASP, 1 SPI, 2 I2C, 2 UART

10/100 Ethernet MAC, 2 MMC/SD, 2 PWMs, LCD controller, uHPI, 3 eCAP, Video I/O 10/100 Ethernet MAC, 2 MMC/SD, 2 PWMs, LCD controller, uHPI, 3 eCAP, Video I/O 10/100 Ethernet MAC, MMC/SD, 3 PWMs, LCD controller, uHPI, 3 eCAP, 2 eQEP 10/100 Ethernet MAC, MMC/SD, 3 PWMs, LCD controller, uHPI, 3 eCAP, 2 eQEP 10/100 Ethernet MAC, 2 MMC/SD, 2 PWMs, 3 eCAP, uHPI, Video I/O 10/100 Ethernet MAC, 2 MMC/SD, 2 PWMs, 3 eCAP, uHPI, Video I/O 10/100 Ethernet MAC, MMC/SD, 3 PWMs, 3 eCAP, 2 eQEP 10/100 Ethernet MAC, MMC/SD, 3 PWMs, 3 eCAP, 2 eQEP 10/100 Ethernet MAC, MMC/SD, 3 PWMs, 3 eCAP, 2 eQEP 2 McASP, 1 SPI, 10/100 Ethernet MAC, 2 I2C, 2 UART MMC/SD, 3 PWMs, 3 eCAP, 2 eQEP 2 McASP, 1 SPI, 10/100 Ethernet MAC, 2 I2C, 2 UART MMC/SD, 3 PWMs, 3 eCAP, 2 eQEP 2 McASP, 1 SPI, 10/100 Ethernet MAC, 2 I2C, 2 UART MMC/SD, 3 PWMs, 3 eCAP, 2 eQEP 1 McASP, 1 McBSP, 2 PWMs, 1 SPI, 1 I2C, 1 UART 3 eCAP, uHPI

64 Ch

1 GP, 1 GP/WD

64 Ch

1 GP, 1 McASP, 1 McBSP, 1 GP/WD 1 SPI, 1 I2C, 1 UART

2 PWMs, 3 eCAP, uHPI

Total Voltage (V) Power Core I/O (mW) Packaging

1-KU Price1

1.2/ 1.8/ 1.1/ 3.3 1.0

4422 0.65-mm 361-pin 15.203 13×13-mm BGA

1.2/ 1.8/ 1.1/ 3.3 1.0

4422 0.8-mm 361-pin 15.203 16×16-mm BGA

1.2

1.8/ 3.3

4836 1.0-mm 256-pin 14.964 17×17-mm BGA

1.2

1.8/ 3.3

3797 1.0-mm 256-pin 12.134 17×17-mm BGA

1.2/ 1.8/ 1.1/ 3.3 1.0

4422 0.65-mm 361-pin 13.503 13×13-mm BGA

1.2/ 1.8/ 1.1/ 3.3 1.0

4422 0.8-mm 361-pin 13.503 16×16-mm BGA

1.2

1.8/ 3.3

4836 176-pin LQFP 25×25 mm

13.024

1.2

1.8/ 3.3

3797 176-pin LQFP 25×25 mm

10.784

1.2

1.8/ 3.3

4836 176-pin LQFP 25×25 mm

9.004

1.2

1.8/ 3.3

3797 176-pin LQFP 25×25 mm

7.854

1.2

1.8/ 3.3

4836 1.0-mm 256-pin 9.004 17×17-mm BGA

1.2

1.8/ 3.3

3797 1.0-mm 256-pin 7.854 17×17-mm BGA

1.2

1.8/ 3.3

4422 0.65-mm 361-pin 6.703 13×13-mm BGA

1.2

1.8/ 3.3

4422 0.8-mm 361-pin 6.703 16×16-mm BGA

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most New devices are listed in red. current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 2 70% DSP load (300 MHz), 50% DDR2 EMIF (133 MHz), 50% McBSP (25 MHz), Timer at 100%, CV = 1.2 V, @ 25°C. 9 Format represents program cache/program or data memory/ROM. DD 3 TMS pricing will come into effect when the device is fully qualified in 1Q10. TMX pricing will be applied until that time. 10 Extended temperature versions available for C6722, C6726, C6727, C6713, C6711D DSPs. 4 TMS pricing will come into effect when the device is fully qualified in 4Q09. TMX pricing will be applied until that time. 11 Also available in 256-pin BGA, 17-mm (GDH) package. 5 Enhanced DMA. 12 McASP2 DIT only. 6 70% DSP (300 MHz), 50% EMIF (133 MHz), 50% McBSP (25 MHz), Timer at 100%, CV = 1.2 V, @ 25°C. 13 The “A” designation is for industrial temperature range. DD 7 70% DSP (200 MHz), 50% EMIF (133 MHz), 50% McBSP (25 MHz), Timer at 100%, CV = 1.2 V, @ 25°C. 14 Format represents cache memory architecture: [data cache] / [program cache] / [unified cache]. DD 8 RFP and ZDH packages are Pb-Free. Note: Check www.ti.com for extended temperature and packaging options. Additional information on enhanced plastic and HiRel DSP versions is available on page 103. Continued on the following page.

Texas Instruments 3Q 2009

Embedded Processing Guide


TMS320C6000™ DSP Platform

21

Silicon

Total Power (mW) Packaging

1-KU Price1

TMS320C67x™ DSP Generation – Floating-Point DSPs (Continued) Part Number

CPU

Frequency L1P L1D L2 RAM External (MHz) (Bytes) (Bytes) (Bytes) (Bytes) Memory I/F

DMA

Timers

Serial Ports

Misc

Voltage (V) Core I/O

uHPI

1.4

3.3

uHPI

1.2

3.3

uHPI

1.2

3.3

uHPI

1.2

3.3

1.2

3.3

1.2

3.3

1.2

3.3

1.2

3.3

1.2

3.3

1.2

3.3

1.26

3.3

TMS320C6727BZDH3508

C67x+

350

32 K

256 K 384 K9

SDRAM

dMAX

1 GP

TMS320C6727BZDH2758,10

C67x+

275

32 K

256 K 384 K9

SDRAM

dMAX

1 GP

TMS320C6727BZDHA2508,11,13 C67x+

250

32 K

256 K 384 K9

SDRAM

dMAX

1 GP

TMS320C6727BZDH3008,10,11 C67x+

300

32 K

256 K 384 K9

SDRAM

dMAX

1 GP

TMSDC6726BRFPA2258,10

C67x+

225

32 K

256 K 384 K9

SDRAM

dMAX

1 GP

TMS320C6726BRFP266

C67x+

266

32 K

256 K 384 K9

SDRAM

dMAX

1 GP

TMS320C6722BRFP2008,10

C67x+

200

32 K

128 K 384 K9

SDRAM

dMAX

1 GP

TMS320C6722BRFPA2258,10,13 C67x+

225

32 K

128 K 384 K9

SDRAM

dMAX

1 GP

TMS320C6722BRFP2508,10

C67x+

250

32 K

128 K 384 K9

SDRAM

dMAX

1 GP

TMS320C6720BRFP2008

C67x+

200

32 K

64 K

384 K9

SDRAM

dMAX

1 GP

TMS320C6712DGDP150

C67x

150

4K

4K

64 K14

SDRAM

16 ch5

1 GP

3 McASP, 2 SPI, 2 I2C 3 McASP, 2 SPI, 2 I2C 3 McASP, 2 SPI, 2 I2C 3 McASP, 2 SPI, 2 I2C 3 McASP12, 2 SPI, 2 I2C 3 McASP12, 2 SPI, 2 I2C 2 McASP, 2 SPI, 2 I2C 2 McASP, 2 SPI, 2 I2C 2 McASP, 2 SPI, 2 I2C 2 McASP, 2 SPI, 2 I2C 2 McBSP

TMS320C6711DGDP200

C67x

200

4K

4K

64 K14

SDRAM

16 ch5

1 GP

2 McBSP

HPI/16

1.26

3.3

TMS320C6711DZDP200

C67x

200

4K

4K

64 K14

SDRAM

16 ch5

1 GP

2 McBSP

HPI/16

1.26

3.3

TMS320C6711DGDP250

C67x

250

4K

4K

64 K14

SDRAM

16 ch5

1 GP

2 McBSP

HPI/16

1.4

3.3

TMS320C6711DZDP250

C67x

250

4K

4K

64 K14

SDRAM

16 ch5

1 GP

2 McBSP

HPI/16

1.4

3.3

TMS320C6711DGDPA16713

C67x

167

4K

4K

64 K14

SDRAM

16 ch5

1 GP

2 McBSP

HPI/16

1.26

3.3

TMS320C6711DZDPA16713

C67x

167

4K

4K

64 K14

SDRAM

16 ch5

1 GP

2 McBSP

HPI/16

1.26

3.3

TMS320C6713BPYP200

C67x

200

4K

4K

256 K14

SDRAM

16 ch5

2 GP

HPI/16

1.2

3.3

TMS320C6713BPYPA16713

C67x

167

4K

4K

256 K14

SDRAM

16 ch5

2 GP

HPI/16

1.2

3.3

TMS32C6713BPYPA200

C67x

200

4K

4K

256 K14

SDRAM

16 ch5

2 GP

HPI/16

1.2

3.3

TMS320C6713BZDPA200

C67x

200

4K

4K

256 K14

SDRAM

16 ch5

2 GP

HPI/16

1.26

3.3

TMS32C6713BGDPA200

C67x

200

4K

4K

256 K14

SDRAM

16 ch5

2 GP

HPI/16

1.26

3.3

TMS32C6713BGDP225

C67x

225

4K

4K

256 K14

SDRAM

16 ch5

2 GP

HPI/16

1.2

3.3

TMS32C6713BGDP300

C67x

300

4K

4K

256 K14

SDRAM

16 ch5

2 GP

2 McBSP, 2 McASP, 2 I2C 2 McBSP, 2 McASP, 2 I2C 2 McBSP, 2 McASP, 2 I2C 2 McBSP, 2 McASP, 2 I2C 2 McBSP, 2 McASP, 2 I2C 2 McBSP, 2 McASP, 2 I2C 2 McBSP, 2 McASP, 2 I2C

HPI/16

1.4

3.3

1400 256-pin 17×17-mm BGA 962 256-pin 17×17-mm BGA 909 256-pin 17×17-mm BGA 1041 256-pin 17×17-mm BGA 778 144 PQFP 22×22 mm 943 144-pin PQFP 22×22 mm 750 144-pin PQFP 22×22 mm 803 144-pin PQFP 22×22 mm 857 144-pin PQFP 22×22 mm 750 144-pin PQFP 22×22 mm 790 272-pin 27×27-mm BGA 953 272-pin 27×27-mm BGA 953 272-pin 27×27-mm BGA 1382 272-pin 27×27-mm BGA 1382 272-pin 27×27-mm BGA 846 272-pin 27×27-mm BGA 846 272-pin 27×27-mm BGA 926 208-pin 28×28-mm TQFP 823 208-pin 28×28-mm TQFP 926 208-pin 28×28-mm TQFP 954 208-pin 28×28-mm TQFP 954 272-pin 27×27-mm BGA 1035 272-pin 27×27-mm BGA 1570 272-pin 27×27-mm BGA

27.13 17.53 19.85 19.85 14.00 13.97 9.31 10.80 10.80 6.63 13.31 14.99 14.99 16.19 16.19 18.74 18.74 17.59 17.59 21.03 23.46 23.46 23.05 30.53

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most New devices are listed in red. current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 2 70% DSP load (300 MHz), 50% DDR2 EMIF (133 MHz), 50% McBSP (25 MHz), Timer at 100%, CV = 1.2 V, @ 25°C. 9 Format represents program cache/program or data memory/ROM. DD 3 TMS pricing will come into effect when the device is fully qualified in 1Q10. TMX pricing will be applied until that time. 10 Extended temperature versions available for C6722, C6726, C6727, C6713, C6711D DSPs. 4 TMS pricing will come into effect when the device is fully qualified in 4Q09. TMX pricing will be applied until that time. 11 Also available in 256-pin BGA, 17-mm (GDH) package. 5 Enhanced DMA. 12 McASP2 DIT only. 6 70% DSP (300 MHz), 50% EMIF (133 MHz), 50% McBSP (25 MHz), Timer at 100%, CV = 1.2 V, @ 25°C. 13 The “A” designation is for industrial temperature range. DD 7 70% DSP (200 MHz), 50% EMIF (133 MHz), 50% McBSP (25 MHz), Timer at 100%, CV = 1.2 V, @ 25°C. 14 Format represents cache memory architecture: [data cache] / [program cache] / [unified cache]. DD 8 RFP and ZDH packages are Pb-Free. Note: Check www.ti.com for extended temperature and packaging options. Additional information on enhanced plastic and HiRel DSP versions is available on page 103.

Texas Instruments 3Q 2009

Embedded Processing Guide


22

TMS320C6000™ DSP Platform

Tools and Software TMS320C67x™ DSP Generation Hardware and Software Development Tools Description

$U.S.1

Part Number

Hardware Development Tools TMS320C6713 DSP Starter Kit (DSK) OMAP-L137/TMS320C6747 Floating-Point Starter Kit Professional Audio Development Kit (PADK) Evaluation Module Professional Audio Development Bundle – includes PADK + CCStudio IDE and XDS560™ USB Emulator

TMDSDSK6713 (U.S. part number) TMDSDSK6713-0E (European part number) TMDXOSKL137BET TMDSPDK6727 TMDXPDB6727

415 395 1,495 5,995

TMDSEMUPP (U.S. part number) TMDSEMUPP-0E (European part number) TMDSEMUUSB TMDSEMU560PCI TMDSEMU560U

1,095 1,095 1,495 2,995 2,999

TMDSCCSALL-1

3,595

JTAG Emulators Spectrum Digital XDS510PP-Plus Emulator Spectrum Digital XDS510PP-Plus Emulator with European Cords Spectrum Digital XDS510™ USB Emulator Blackhawk XDS560 JTAG PCI Emulator Blackhawk XDS560 USB High-Performance JTAG Emulator

Software Development Tools Code Composer Studio™ (CCStudio) Platinum v 3.3 Development Tools Bundled with Annual S/W Subscription Supports C6000™, C5000™, C2000™, DaVinci™ and OMAP™ processor platforms C6000, C5000, C2000, DaVinci and OMAP processor CCStudio Development Tools Annual Software Subscription for Version 3.10 and higher Code Composer Studio IDE Free Evaluation Tools Includes C6000, C5000, C2000, DaVinci and OMAP processor CCStudio 120-Day Free Evaluation Tools2 TMS320C6000 DSP Chip Support Library TMS320C67x DSP Library TMS320C67x DSP Fast Run-Time Support Library (Fast RTS)

TMDSSUBALL

600

SPRC119 (www.ti.com/freetools)

Free

SPRC090 SPRC121 SPRC060

Free Free Free

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 2 Includes full-featured Code Composer Studio Development Tools, code generation tools (C/C++ compiler/assembler/linker) and simulator all limited to 120 days. Please see the features supported by platform matrix on page 59 for more details.

TMS320C67x™ DSP Literature and Related Technical Documentation All documentation and associated literature, user’s guides, application notes and software can be found by clicking on the specific device in the parametric table found on the URL below. TMS320C67x DSP Generation

Texas Instruments 3Q 2009

www.ti.com/c67x

Embedded Processing Guide


TMS320C6000™ DSP Platform

23

Power Management Products

Power Management Products for the C6000™ DSP Platform Get samples, data sheets, Evaluation Modules (EVMs) and app reports at: power.ti.com

Suggested Power Management Solutions for the TMS320C64x™/TMS320C67x™ DSP Generations

Input Voltage 3.3 V 5V

Output Current 3A 6A 3A

12 V

6A 3A

24 V 48 V

Core and I/O Voltages Non-Synchronous Synchronous Controller Integrated FET (External FET and Diode) Converter TPS64200 TPS54317 TPS54610 TPS40200 TPS54317

Synchronous Controller (External FETs) TPS40009 TPS40009 TPS40009

LDO TPS74401 TPS75901 TPS74401 TPS75901

TPS40009 TPS40190

6A 3A 6A 3A 6A

TPS40200

TPS40190 TPS40057 TPS40057 TPS40061 TPS40061

Non-Synchronous Integrated FET Converter

TPS54350

Non-Isolated Power Module PTH04T260 PTH04T230 PTH04T260

TPS54610 TPS54350

TPS54550 TPS54350

PTH04T230 PTH08T260

TPS54550

TPS54550 TPS5430*

PTH08T230 PTN78020*

TPS40200 TPS40200*

Isolated Power Module

MultipleOutput Converter TPS75003 TPS75003 TPS54386

PTB78560* PTB78560* PTMA403033* PTB48560*

TPS5124 TPS54386 TPS5124 TPS54386

*Due to Vout/Vin ratio core voltage may have to be stepped down from 3.3-V I/O.

Example C6000 DSP Power Supply Design 1 2 3 4 5 6 7 8

VCC R6

C9

ENA R7

R5

R17 Open

U1 TPS54350PWP VIN BOOT VIN PH UVLO PH PWRGD LSG RT VBIAS SYNC PGND ENA AGND COMP VSENSE PwrPd 17

16 15 14 13 12 11 10 9

L1

C3

DVDD

123 67

Q1 FDR6674A

4

C4

C2

C13 TP7

R1 C6

+

R18

85

R3

R9

C8

R5 R2

C7

DVDD VCC R5

U2 TPS3808G01 6 1 RST 2 5 VDD 4 SNS/NC GND 3 CT MR

C10 DVDD

DSP_RESET

C10

VCC R11

C15

ENA

R8

R14

R19 Open

1 2 3 4 5 6 7 8

U3 TPS54350PWP VIN BOOT VIN PH UVLO PH PWRGD LSG RT VBIAS SYNC PGND ENA AGND COMP VSENSE PwrPd 17

16 15 14 13 12 11 10 9

L2

C14

CVDD

123 67

Q2 FDR6674A

4

C12 VCC

ON

S1

C18

85

C16

C17 TP8

R13 C10

R21

+

R15

R16

R20

C11

R12

OFF

For additional power supply designs for TI DSPs, please visit www.ti.com/processorpower. Note: The TI power devices recommended here are based on standard operating conditions. System designers should use device power estimation tools in conjunction with overall application level power requirements to ensure an adequate power supply design is used.

Texas Instruments 3Q 2009

Embedded Processing Guide


24

Digital Media Processors with DaVinci™ Technology

Silicon Digital Media Processors with DaVinci Technology Digital Media Processors Get samples, data sheets, tools and app reports at: www.ti.com/davinci Device Production DM64x+ Next

Sampling In Development

DM Next

Future

Infrastructure Video • Cable head-end video systems • Multi-channel security DVRs • Professional-grade broadcastquality systems • Video-conference MCU/ gateways

DM6467T DM648 1.1 GHz

Segment

Targeted Applications • Automotive infotainment • Automotive video sensing • Automotive vision • Broadcast systems • Cable head-end video equipments (routers) • Digital camcorders • Digital still cameras • Digital media adapters • Digital photo frames • Digital signage • Digital TV and server head-ends • Digital video recorders • IP network cameras • IP-based video-conferencing endpoints • IP-based video phones • IP set-top boxes • Hard-copy appliances • Machine vision • Media encoder/decoder appliances • Media gateways • Medical imaging • Network projector • Personal video recorders • Portable media players • Professional-grade video broadcast equipment • Robotics • Security recording systems • Streaming video appliances • Video broadcast transcoding • Video-conferencing, multi-point conference units (MCUs)/gateways • Video infrastructure • Video jukeboxes • Digital video security recorders (DVRs) • Video surveillance cameras • Webpads • Wireless cameras

DM6467

DM64x+ Next

DM647/8 DM6467T DM644x DM64x

DM643x

DM Next

DM648 1.1 GHz DM6467 DM647/8

DM3x+ Next

DM64x

DM365

DM6441 DM355

DM357

Client Video • IP-based video phones • IP set-top boxes • Media encoder/decoder appliances • Networked PVRs • IP video surveillance • IP video-conferencing Portable Video • Digital still cameras • Digital camcorders • Gaming • Multimedia jukeboxes • PDAs • Portable medical

Time

Digital Media Processors Roadmap Digital video customers benefit from TI’s DaVinci technology portfolio of digital media processors, development tools, software and support, enabling them to accelerate development and fuel innovation.

Digital Media Processors: Tuned for Digital Video End Equipments DaVinci Processor DM335 DM355* DM357 DM365 DM6467† DM648* DM647* DM6446* DM6443 DM6441* DM6437 DM6435 DM6433 DM6431

CPU ARM926 ARM926** ARM926 ARM926 C64x+/ARM926 C64x+ C64x+ C64x+/ARM926 C64x+/ARM926 C64x+/ARM926 C64x+ C64x+ C64x+ C64x+

MHz 135, 216 135, 216, 270 270 216, 270, 300 594, 729 / 297, 364.5 720, 800, 900 720, 800, 900 300 / 600 300 / 600 256 / 512 400, 500, 600, 700 400, 500, 600, 700 400, 500, 600, 700 300

Capture/Display Capture/Display Capture/Display Capture/Display Capture/Display Capture/Display Capture/Display Capture/Display Capture/Display Display Capture/Display Capture/Display Capture Display Capture

*Includes video imaging coprocessor. **Includes MPEG-4/JPEG coprocessor. †Includes DaVinci high-definition video/imaging coprocessor.

DaVinci Technology Texas Instruments 3Q 2009

Embedded Processing Guide


Digital Media Processors with DaVinci™ Technology

25

Silicon

DaVinci Technology Overview DaVinci technology is a signal processingbased solution tailored for digital video applications that provides video equipment manufacturers with integrated processors, software, tools and support to simplify the design process and accelerate innovation. DaVinci Processors Reduce System Cost The portfolio of DaVinci processors consists of scalable, programmable signalprocessing system-on-chips (SoCs), accelerators and peripherals, optimized to match the price, performance and feature requirements for a broad spectrum of video end equipments. The DaVinci technology portfolio includes: • TMS320DM646x digital media processors – DSP-based SoCs specifically tuned for real-time, multi-format, HD video transcoding at 10× the performance and 1/10th the price. The DM6467 consists of an integrated ARM926EJ-S core, TMS320C64x+™ DSP core, High-Definition Video/Imaging Co-Processors (HD-VICP), video data conversion engine and targeted video port interfaces. The DM6467 processor is specifically designed to address the HD transcoding challenge for commercial and consumer markets, such as media gateways, multi-point control units, digital media adapters, digital video servers and recorders for the

Texas Instruments 3Q 2009

security market and IP set-top boxes (STBs). • TMS320DM644x digital media processors – Highly integrated SoCs based on an ARM926 processor and the C64x+™ DSP core. The TMS320DM6446, TMS320DM6443 and TMS320DM6441 processors are ideal for applications and end equipments such as video phones, automotive infotainment and IP STBs. • TMS320DM643x digital media processors – Based on the C64x+ DSP core and priced as low as U.S. $9.95*. The TMS320DM6437, TMS320DM6435, TMS320DM6433 and TMS320DM6431 processors are ideal for cost-sensitive applications and include special features that make them suitable for automotive market applications such as lane departure and collision avoidance, as well as machine-vision systems, robotics and video security. • TMS320DM64x™ digital media processors – The TMS320DM64x digital media processors are optimized for video and include a range of highperformance and low-cost options. The TMS320DM64x generation of digital media processors are fully programmable and offer industry-leading performance for the most demanding streaming

multimedia and multi-channel video security and infrastructure applications, including digital video recorders (DVRs), IP video servers, machine-vision systems and high-performance imaging applications. In addition, TI offers a wide range of complementary analog parts, easy-to-use development tools, extensive video and imaging third-party algorithms and more. • TMS320DM3x digital media processsors – Developers can now deliver cost-effective solutions for crystal clear video up to HD resolutions, targeted at both portable and plugged devices. The DM3x generation features an ARM9 processor, with speeds up to 300 MHz, some devices with video coprocessing and bundled codecs to speed development efforts, and all with a video-processing subsystem adding intelligence to video processing. The DM3x generation, including DM335, DM355, DM357 and DM365 processors, is ideal for camera-driven applications as well as video-playback devices such as IP cameras, video doorbells, video conferencing, digital signage, portable media players and more.

*Pricing valid at 10 KU

Embedded Processing Guide


26

Digital Media Processors with DaVinci™ Technology

Silicon TMS320DM646x Digital Media Processor The DM6467 DaVinci processor is a DSPbased SoC specifically tuned for real-time, multi-format, high-definition (HD) video transcoding delivering a 10× performance improvement over previous-generation processors to perform simultaneous, multi-format HD encode, decode and transcoding up to H.264 HP@L4 (1080p 30 fps, 1080i 60 fps, 720p 60 fps). Key application areas include media gateways, multi-point control units, digital media adapters, digital video servers and recorders for the security market and IP set-top boxes (STBs).

Device TMS320DM6467ZUT

TMS320DM6467ZUT7

TMS320DM6467ZUTA

TMS320DM6467ZUTAV

TMS320DM6467ZUTD7

TMS320DM6467ZUTV

Frequency CPU (MHz) C64x+, 594 ARM9 (DSP) DaVinci 297 HD (ARM) Video C64x+, 729 ARM9 (DSP) DaVinci 364.5 HD (ARM) Video C64x+, 594 ARM9 (DSP) DaVinci 297 HD (ARM) Video C64x+, 594 ARM9 (DSP) DaVinci 297 HD (ARM) Video C64x+, 729 ARM9 (DSP) DaVinci 364.5 HD (ARM) Video C64x+, 594 ARM9 (DSP) DaVinci 297 HD (ARM) Video

L1/ SRAM (Bytes) 64 K (DSP) 56 K (ARM)

TMS320DM6467 C64x+™ DSP Core 729 MHz ARM® 926EJ-S CPU 364.5 MHz

HighDefinition Video/ Imaging Co-Processors (HD-VICP)

Video Data Conversion Engine

Video Port Interfaces

Switched Central Resource Program/Data Storage

Standard Connectivity

Serial Interfaces

System Control

L2/ External Video Ports SRAM ROM Memory (Config(Bytes) (Bytes) I/F EDMA urable) 128 K 8 K 1 16-/8-Bit 64 Ch See Note 2 (DSP) (ARM) EMIFA, 1 32-/16-Bit DDR2

64 K 128 K 8 K 1 16-/8-Bit 64 Ch See Note 2 (DSP) (DSP) (ARM) EMIFA, 56 K 1 32-/16-Bit (ARM) DDR2 64 K 128 K 8 K 1 16-/8-Bit 64 Ch See Note 2 (DSP) (DSP) (ARM) EMIFA, 56 K 1 32-/16-Bit (ARM) DDR2 64 K 128 K 8 K 1 16-/8-Bit 64 Ch See Note 2 (DSP) (DSP) (ARM) EMIFA, 56 K 1 32-/16-Bit (ARM) DDR2 64 K 128 K 8 K 1 16-/8-Bit 64 Ch See Note 2 (DSP) (DSP) (ARM) EMIFA, 56 K 1 32-/16-Bit (ARM) DDR2 64 K 128 K 8 K 1 16-/8-Bit 64 Ch See Note 2 (DSP) (DSP) (ARM) EMIFA, 56 K 1 32-/16-Bit (ARM) DDR2

Serial Connectivity I/F I/F 2 McASPs, I2C, 32-Bit PCI (33 MHz), SPI, 3 UARTs USB 2.0, PHY, VLYNQ™, (with IrDA and 10/100/1000 EMAC CIR support) (w/ MII, GMII, & MDIO support), 32-/16-Bit HPI 2 McASPs, I2C, 32-Bit PCI (33 MHz), SPI, 3 UARTs USB 2.0, PHY, VLYNQ, (with IrDA and 10/100/1000 EMAC, CIR support) (w/ MII, GMII, & MDIO support) 32-/16-Bit HPI 2 McASPs, I2C, 32-Bit PCI (33 MHz), SPI, 3 UARTs USB 2.0, PHY, VLYNQ, (with IrDA and 10/100/1000 EMAC, CIR support) (w/ MII, GMII, & MDIO support) 32-/16-Bit HPI 2 McASPs, I2C, 32-Bit PCI (33 MHz), SPI, 3 UARTs USB 2.0, PHY, VLYNQ, (with IrDA and 10/100/1000 EMAC, CIR support) (w/ MII, GMII, & MDIO support) 32-/16-Bit HPI 2 McASPs, I2C, 32-Bit PCI (33 MHz), SPI, 3 UARTs USB 2.0, PHY, VLYNQ, (with IrDA and 10/100/1000 EMAC, CIR support) (w/ MII, GMII, & MDIO support) 32-/16-Bit HPI 2 McASPs, I2C, 32-Bit PCI (33 MHz), SPI, 3 UARTs USB 2.0, PHY, VLYNQ, (with IrDA and 10/100/1000 EMAC, CIR support) (w/ MII, GMII, & MDIO support) 32-/16-Bit HPI

TMS320DM6467 digital media processor block diagram. For more information, visit www.ti.com/dm6467.

Program/ Data Storage Async SRAM, DDR2 SDRAM, Smart Media / SSFDC/xD, NAND Flash, NOR Flash Async SRAM, DDR2 SDRAM, Smart Media / SSFDC/xD, NAND Flash, NOR Flash Async SRAM, DDR2 SDRAM, Smart Media / SSFDC/xD, NAND Flash, NOR Flash Async SRAM, DDR2 SDRAM, Smart Media / SSFDC/xD, NAND Flash, NOR Flash Async SRAM, DDR2 SDRAM, Smart Media / SSFDC/xD, NAND Flash, NOR Flash Async SRAM, DDR2 SDRAM, Smart Media / SSFDC/xD, NAND Flash, NOR Flash

Voltage (V) 1-KU Core I/O Packaging Price1 1.2 1.8/ 529 BGA 66.82 3.3 19 × 19 mm

1.2 1.8/ 529 BGA 83.53 3.3 19 × 19 mm

1.2 1.8/ 529 BGA 80.18 3.3 19 × 19 mm

1.2/ 1.8/ 529 BGA 80.18 1.05 3.3 19 × 19 mm

1.2 1.8/ 529 BGA 93.55 1.05 3.3 19 × 19 mm

1.2/ 1.8/ 529 BGA 66.82 1.05 3.3 19 × 19 mm

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 2 Video port [config. for dual 8-bit SD (BT.565), single 16-bit HD (BT.1120), or single 8-/10-/12-bit raw capture chs]. 1 video port [configured for dual 8-bit SD (BT.565) or single 16-bit HD (BT.1120) display chs], 2 transport stream interface for MPEG transport stream, 1 VDCE for horizontal/vertical downscaling, chroma conversion, edge padding and anti-alias filtering.

Texas Instruments 3Q 2009

Embedded Processing Guide


Digital Media Processors with DaVinci™ Technology

27

Tools

Development Tools for the TMS320DM646x Processors Description

Part Number

$U.S. 1

TMDSEVM6467 TMDSCCSALL-1 TMDSEMU560PCI TMDSEMU560U

1,995 3,595 2 2,995 2,999

TMDSCCSALL-1 TMDSEMU560PCI TMDSEMU560U

3,595 2 2,995 2,999

For Evaluation: TMS320DM6467 Digital Video Evaluation Module (DVEVM)* Code Composer Studio™ (CCStudio) Integrated Development Environment (IDE)* Blackhawk XDS560™ JTAG PCI Emulator (optional) Blackhawk XDS560 JTAG USB Emulator (optional)

For Production: Code Composer Studio™ IDE* Blackhawk XDS560 JTAG PCI Emulator (optional) Blackhawk XDS560 JTAG USB Emulator (optional) 1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. trial version of Code Composer Studio IDE available as part of the free evaluation tools found at www.ti.com/ccstudiofet * Required for digital media software evaluation and/or production Please see the features supported by platform matrix on page 59 for more details. 2 Free

Texas Instruments 3Q 2009

Embedded Processing Guide


28

Digital Media Processors with DaVinci™ Technology

Silicon and Tools TMS320DM644x Digital Media Processors TMS320DM644x digital media processors are highly integrated SoCs based on an ARM926 processor and the TMS320C64x+™ DSP core. They are ideal for applications such as video phones, automotive infotainment and IP STBs.

TMS320DM6446

VideoImaging Coprocessor

ARM926 Subsystem

DSP Subsystem

ARM926 926EJ-S 300-MHz CPU

C64x+ DSP 600-MHz Core

Video Processing Subsystem

Front End

Preview Histogram/3A

CCD Controller Video Interface

Resizer

Back End On-Screen Video Enc Display (VENC) (OSD)

10b DAC 10b DAC 10b DAC 10b DAC

Switched Central Resource (SCR) Connectivity

Peripherals USB 2.0 PHY

EDMA

CPU C64x+, ARM9, DaVinci Video TMS320DM6446AZWTA C64x+, ARM9, DaVinci Video TMS320DM6443AZWT C64x+, ARM9, DaVinci Video TMS320DM6441AZWT C64x+, ARM9, DaVinci Video 1

Timer WD PWM ×2 Timer ×3

Serial Interfaces

Program/Data Storage

I2C

DDR2 Async EMIF/ ATA/ MMC/ Controller NAND/ Compact SD (16b/32b) SmartMedia Flash

Audio Serial Port

Device TMS320DM6446AZWT

VLYNQ™ Interface

System EMAC with MDIO

L1/ L2/ External Frequency SRAM SRAM ROM Memory (MHz) (Bytes) (Bytes) (Bytes) I/F 594 112 K 64 K 16 K 1 16-/8-Bit (DSP) (DSP) (DSP) (ARM) EMIFA, 297 40 K 1 32-/16-Bit (ARM) (ARM) DDR2 513 112 K 64 K 16 K 1 16-/8-Bit (DSP) (DSP) (DSP) (ARM) EMIFA, 256.5 40 K 1 32-/16-Bit (ARM) (ARM) DDR2 594 112 K 64 K 16 K 1 16-/8-Bit (DSP) (DSP) (DSP) (ARM) EMIFA, 297 40 K 1 32-/16-Bit (ARM) (ARM) DDR2 513/405 112 K 64 K 16 K 1 16-/8-Bit (DSP) (DSP) (DSP) (ARM) EMIFA, 256/202.5 40 K 1 32-/16-Bit (ARM) (ARM) DDR2

SPI

UART ×3

Video Ports EDMA (Configurable) 64 Ch 1 Input, 1 Output

Serial I/F ASP, I2C, SPI, 3 UARTs

64 Ch

1 Input, 1 Output

ASP, I2C, SPI, 3 UARTs

64 Ch

1 Output

ASP, I2C, SPI, 3 UARTs

64 Ch

1 Input, 1 Output

ASP, I2C, SPI, 3 UARTs

TMS320DM6446 digital media processor block diagram. For more information, visit www.ti.com/dm644x.

Program/ Connectivity Data I/F Storage USB 2.0, Async SRAM, VLYNQ™, DDR2 SDRAM, 10/100 EMAC NAND Flash, SmartMedia/xD USB 2.0, Async SRAM, VLYNQ, DDR2 SDRAM, 10/100 EMAC NAND Flash, SmartMedia/xD USB 2.0, Async SRAM, VLYNQ, DDR2 SDRAM, 10/100 EMAC NAND Flash, SmartMedia/xD USB 2.0, Async SRAM, VLYNQ, DDR2 SDRAM, 10/100 EMAC NAND Flash, SmartMedia/xD

Voltage (V) 1-KU Core I/O Packaging Price1 1.2 1.8/ 361 BGA 35.63 3.3 16 × 16 mm

1.2

1.8/ 361 BGA 35.63 3.3 16 × 16 mm

1.2

1.8/ 361 BGA 30.54 3.3 16 × 16 mm

1.2/ 1.8/ 361 BGA 30.35 1.05 3.3 16 × 16 mm

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.

Development Tools for TMS320DM644x Processors Description

Part Number

$U.S. 1

TMDSEVM6446 (U.S. part number) TMDSCCSALL-1 TMDSEMU560PCI TMDSEMU560U

2,495 3,595 2 2,995 2,999

TMDSCCSALL-1 TMDSEMU560PCI TMDSEMU560U

3,595 2 2,995 2,999

For Evaluation: TMS320DM644x Digital Video Evaluation Module (DVEVM)* Code Composer Studio™ (CCStudio) Integrated Development Environment (IDE)* Blackhawk XDS560™ JTAG PCI Emulator (optional) Blackhawk XDS560 JTAG USB Emulator (optional)

For Production: Code Composer Studio IDE* Blackhawk XDS560 JTAG PCI Emulator (optional) Blackhawk XDS560 JTAG USB Emulator (optional) 1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. trial version of Code Composer Studio IDE available as part of the free evaluation tools found at www.ti.com/ccstudiofet Required for digital media software evaluation and/or production.

2 Free

Texas Instruments 3Q 2009

Embedded Processing Guide


Digital Media Processors with DaVinci™ Technology

29

Silicon

TMS320DM643x Digital Media Processors TMS320DM643x digital media processors are based on the TMS320C64x+™ DSP core. They are ideal for cost-sensitive digital media applications such as machine-vision systems, robotics, video security, video telephony and automotivevision applications such as lane departure and collision avoidance.

TMS320DM6437

C64x+™ DSP 700-MHz Core

L2 128 KB Cache

Preview Histogram/3A Resizer

Back End On-Screen Video Display Enc (OSD) (VENC)

L1P 32 KB

10b DAC 10b DAC 10b DAC 10b DAC

Switched Central Resource (SCR) Peripherals

Connectivity

I2C

UART ×2 CAN

L1/ L2/ External SRAM SRAM ROM Memory (Bytes) (Bytes) (Bytes) I/F EDMA 64 K 64 K 64 K 1 8-bit 64 Ch EMIFA, 1 16-bit DDR2 112 K 128 K 64 K 1 8-bit 64 Ch EMIFA, 1 16-/32-bit DDR2

64 K

System

PCI or VLYNQ™ I/F or HPI 33 EMAC

Serial Interfaces

1

CCD Controller Video Interface

L1D 80 KB

McBSP ×2 or McASP

112 K 128 K

Front End

DSP Subsystem

EDMA

Frequency Device CPU (MHz) TMS320DM6431ZWT3 C64x+™, 300 TMS320DM6431ZWTQ32 DaVinci TMS320DM6431ZDU3 Video TMS320DM6431ZDUQ32 TMS320DM6433ZWT4 C64x+, 400 TMS320DM6433ZWT5 DaVinci 500 TMS320DM6433ZWTQ52 Video 500 TMS320DM6433ZWT6 600 TMS320DM6433ZWTQ62 660 TMS320DM6433ZWT7 700 TMS320DM6433ZWTL 600 TMS320DM6433ZDU4 400 TMS320DM6433ZDU5 500 TMS320DM6433ZDUQ52 500 TMS320DM6433ZDU6 600 TMS320DM6433ZDUQ62 660 TMS320DM6433ZDU7 700 TMS320DM6433ZDUL 600 TMS320DM6435ZWT4 C64x+, 400 TMS320DM6435ZWTQ42 DaVinci 400 TMS320DM6435ZWT5 Video 500 TMS320DM6435ZWTQ52 500 TMS320DM6435ZWT6 600 TMS320DM6435ZWTQ62 660 TMS320DM6435ZWT7 700 TMS320DM6435ZWTL 600 TMS320DM6435ZDU4 400 TMS320DM6435ZDUQ42 400 TMS320DM6435ZDU5 500 TMS320DM6435ZDUQ52 500 TMS320DM6435ZDU6 600 TMS320DM6435ZDUQ62 660 TMS320DM6435ZDU7 700 TMS320DM6435ZDUL 600

Video Processing Subsystem

1 8-bit 64 Ch EMIFA, 1 16-/32-bit DDR2

Program/Data Storage DDR2 Controller (32b)

Video Ports (Configurable) 1 Input

1 Output

1 Input

PLL

Timer WD PWM 64-bit JTAG Timer ×3 ×2

EMIF (8b)

DDR PLL OSC

TMS320DM6437 digital media processor block diagram. For more information, visit www.ti.com/dm643x.

Program/ Serial Connectivity Data Voltage (V) I/F I/F Storage Core I/O McASP, I2C, 10/100 EMAC Async SRAM, 1.2 1.8/ 1 UART, DDR2 SDRAM, 3.3 1 McBSP, NAND Flash 1 HECC McASP, 32-bit PCI, Async SRAM, 1.05/ 1.8/ 1 McBSP, VLYNQ™, DDR2 SDRAM, 1.2 3.3 I2C, 10/100 EMAC, NAND Flash 1 UART 16-bit HPI

1-KU Price1 11.25 12.38 11.25 12.38 15.28 16.20 18.03 18.03 21.70 21.70 21.70 376 BGA 15.28 23 × 23 mm 16.20 18.03 18.03 21.70 21.70 21.70 McASP, I2C, VLYNQ, Async SRAM, 1.05/ 1.8/ 361 PBGA 15.81 1 McBSP, 10/100 EMAC, DDR2 SDRAM, 1.2 3.3 16 × 16 mm, 16.76 2 UARTs, 16-bit HPI NAND Flash 16.76 1 HECC 18.66 18.66 22.45 22.45 22.45 376 BGA 15.81 23 × 23 mm 16.76 16.76 18.66 18.66 22.45 22.45 22.45

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. Q designates Q100 automotive reliability. 3 McBSP can be configured as an SPI peripheral.

Packaging 361 PBGA 16 × 16 mm, 376 BGA 23 × 23 mm 361 PBGA 16 × 16 mm,

New devices are listed in red.

2

Texas Instruments 3Q 2009

Embedded Processing Guide


30

Digital Media Processors with DaVinci™ Technology

Silicon and Tools

TMS320DM643x Digital Media Processors (Continued) L1/ L2/ External Frequency SRAM SRAM ROM Memory Device CPU (MHz) (Bytes) (Bytes) (Bytes) I/F EDMA TMS320DM6437ZWT4 C64x+™, 400 112 K 128 K 64 K 1 8-bit 64 Ch TMS320DM6437ZWTQ42 DaVinci 400 EMIFA, TMS320DM6437ZWT5 Video 500 1 16-/32-bit TMS320DM6437ZWTQ52 500 DDR2 TMS320DM6437ZWT6 600 TMS320DM6437ZWTQ62 660 TMS320DM6437ZWT7 700 TMS320DM6437ZWTL 600 TMS320DM6437ZDU4 400 TMS320DM6437ZDUQ42 400 TMS320DM6437ZDU5 500 TMS320DM6437ZDUQ52 500 TMS320DM6437ZDU6 600 TMS320DM6437ZDUQ62 660 TMS320DM6437ZDU7 700 TMS320DM6437ZDUL 600

Video Ports (Configurable) 1 Input, 1 Output

Program/ Serial Connectivity Data Voltage (V) I/F I/F Storage Core I/O Packaging McASP, I2C, 32-bit PCI, Async SRAM, 1.05/ 1.8/ 361 PBGA 1 HECC VLYNQ™, DDR2 SDRAM, 1.2 3.3 16  16 mm, 2 McBSPs3, 10/100 EMAC, NAND Flash 2 UARTs 16-bit HPI

1-KU Price1 20.35 24.00 21.55 26.50 24.00 31.90 24.00 28.85 376 BGA 20.35 23  23 mm 21.55 21.55 24.00 24.00 28.85 28.85 28.85

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. Q designates Q100 automotive reliability. 3 McBSP can be configured as an SPI peripheral.

New devices are listed in red.

2

Development Tools for TMS320DM643x Processors Description

Part Number

$U.S. 1

TMDSVDP6437 TMDSCCSALL-1 TMDSEMU560PCI TMDSEMU560U

495 3,595 2 2,995 2,999

For Evaluation and Production: TMS320DM6437 Digital Video Development Platform (DVDP)* Code Composer Studio™ Integrated Development Environment (IDE)* Blackhawk XDS560™ JTAG PCI Emulator (optional) Blackhawk XDS560 JTAG USB Emulator (optional) 1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. trial version of Code Composer Studio IDE available as part of the free evaluation tools found at www.ti.com/ccstudiofet * Required for digital media software evaluation and/or production Please see the features supported by platform matrix on page 59 for more details. 2 Free

Texas Instruments 3Q 2009

Embedded Processing Guide


Silicon TMS320DM64x™ Digital Media Processors Optimized for multi-channel video security and infrastructure applications, including digital video recorders (DVRs), IP video servers, machine-vision systems and high-performance imaging applications. The DM64x digital media processors are fully programmable and offer industryleading performance for the most demanding streaming multimedia applications.

TMS320DM648

Video Acceleration DSP Subsystem L1P 32 KB C64x+™ DSP 1.1-GHz Core

31

Digital Media Processors with DaVinci™ Technology

EDMA 3.0 Video Port ×5

CC L2 512 KB

TC TC TC TC

L1P 32 KB Switched Central Resource Peripherals

System

VLYNQ™ Interface

Timer 64-Bit ×2

Program/Data Storage DDR2 533 32-Bit

Connectivity

Serial Interfaces McASP 10 Ser

SPI

I2 C

EMIFA 16-Bit

Gigabit Switch UART

PCI-66 or UHPI

L1/ L2/ External Frequency SRAM SRAM ROM Memory EDMA Video Ports Device CPU (MHz) (Bytes) (Bytes) (Bytes) I/F (Ch) (Configurable) TMS320DM647ZUT7 C64x+™, 720 32 K/32 K 256 K 64 K 1 16-/8-bit 64 5 video ports TMS320DM647ZUT9 DaVinci 900 EMIFA3, (each configurable Video 1 32-/16-bit as dual capture, DDR2 single capture, display, TSI capture) TMS320DM647ZUTD7 720 TMS320DM647ZUTD9 900 TMS320DM647ZUTA8 800 TMS320DM648ZUT7 C64x+, 720 32 K/32 K 512 K 64 K 1 16-/8-bit 64 5 video ports TMS320DM648ZUT9 DaVinci 900 EMIFA3, (each configurable Video 1 32-/16-bit as dual capture, DDR2 single capture, display, TSI capture) TMS320DM648ZUTD7 720 TMS320DM648ZUTD9 900 TMS320DM648ZUTA8 800 TMS320DM640AGDK4 C64x, 400 16 K/16 K 128 K – 1 32-bit 64 1 8-bit Video TMS320DM640AGNZ4 C64x, 400 16 K/16 K 128 K – 1 32-bit 64 1 8-bit Video TMS320DM641AGDK5 C64x, 500 16 K/16 K 128 K – 1 32-bit 64 2 8-bit Video

Serial I/F 1 I2C, 1 SPI, 1 UART, 1 McASP

2 I2C, 1 SPI, 1 UART, 1 McASP 2 TSIP

GEMAC

GEMAC

Connectivity I/F2 PCI/HPI, VLYNQ™, 10/100/1000 3-pt Ethernet Switch Subsys w/ 1 SGMII Pt

PCI/HPI, VLYNQ, 10/100/1000 3-pt Ethernet Switch Subsys w/ 2 SGMII Pts

EMAC5

TMS320DM648 digital media processor block diagram. For more information, visit www.ti.com/dm64x.

Program/ Data Storage Async SRAM, DDR2 SDRAM, NAND Flash, NOR Flash

Async SRAM, DDR2 SDRAM, NAND Flash, NOR Flash

SDRAM, SBSRAM, Async SRAM 2 McBSP EMAC5 SDRAM, SBSRAM, Async SRAM 2 McBSP HPI/16/EMAC5 SDRAM, SBSRAM, Async SRAM 2 McBSP

Voltage (V) Core I/O Packaging 1.2/ 1.8/ 529 nFBGA 1.2 3.3 19 × 19 mm

1-KU Price1 37.05 46.31

1.2 1.2 1.2 1.2/ 1.2

1.8/ 529 nFBGA 3.3 19 × 19 mm

44.46 53.72 46.31 46.35 57.94

1.2 1.2 1.2 1.2

55.62 67.21 57.94 3.3 548 BGA, 23 mm 21.88

1.2

3.3 548 BGA, 27 mm 21.88

1.2

3.3 548 BGA, 23 mm 25.61

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain New devices are listed in red. the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 2 HPI is selectable, 32-bit or 16-bit. 3 EMIFA does not support SDRAM. 4 The DM642 can be configured to have up to three serial ports in various video/McASP/McBSP combinations. 5 The DM640 has an Ethernet MAC. The DM641 can be configured to have either a 16-bit HPI or Ethernet MAC. The DM643 can be configured to have either a 32-bit HPI or a 16-bit HPI and Ethernet MAC. The DM642 can be configured to have either a 32-bit PCI or 32-bit HPI or a 16-bit HPI and Ethernet MAC. Note: Check www.ti.com for extended temperature and packaging options. Additional information on enhanced plastic and HiRel DSP versions is available on page 103. Continued on the following page.

Texas Instruments 3Q 2009

Embedded Processing Guide


32

Digital Media Processors with DaVinci™ Technology

Silicon and Tools

TMS320DM64x Digital Media Processors (Continued)

Device TMS320DM641AGDK6 TMS320DM641AGNZ6 TMS320DM643AGDK5 TMS320DM643AGNZ5 TMS320DM643AGDK6 TMS320DM643AGNZ6 TMS320DM642AGDK5 TMS320DM642AGNZ5 TMS320DM642AGDK6 TMS320DM642AGNZ6 TMS320DM642AGDK7 TMS320DM642AGNZ7

L1/ L2/ Frequency SRAM SRAM ROM CPU (MHz) (Bytes) (Bytes) (Bytes) C64x™, 600 16 K/16 K 128 K – Video C64x, 600 16 K/16 K 128 K – Video C64x, 500 16 K/16 K 256 K – Video C64x, 500 16 K/16 K 256 K – Video C64x, 600 16 K/16 K 256 K – Video C64x, 600 16 K/16 K 256 K – Video C64x, 500 16 K/16 K 256 K – Video C64x, 500 16 K/16 K 256 K – Video C64x, 600 16 K/16 K 256 K – Video C64x, 600 16 K/16 K 256 K – Video C64x, 720 16 K/16 K 256 K – Video C64x, 720 16 K/16 K 256 K – Video

External Memory I/F 1 32-bit

EDMA (Ch) 64

Video Ports (Configurable) 2 8-bit

1 32-bit

64

2 8-bit

1 64-bit

64

2 20-bit

1 64-bit

64

2 20-bit

1 64-bit

64

2 20-bit

1 64-bit

64

2 20-bit

1 64-bit

64

3 20-bit

1 64-bit

64

3 20-bit

1 64-bit

64

3 20-bit

1 64-bit

64

3 20-bit

1 64-bit

64

3 20-bit

1 64-bit

64

3 20-bit

Program/ Serial Connectivity Data Voltage (V) I/F I/F2 Storage Core I/O 2 McBSP HPI/16/EMAC5 SDRAM, SBSRAM, 1.4 3.3 Async SRAM 2 McBSP HPI/16/EMAC5 SDRAM, SBSRAM, 1.4 3.3 Async SRAM 1 McBSP HPI 32/EMAC5 SDRAM, SBSRAM, 1.2 3.3 Async SRAM 1 McBSP HPI 32/EMAC5 SDRAM, SBSRAM, 1.2 3.3 Async SRAM 1 McBSP HPI 32/EMAC5 SDRAM, SBSRAM, 1.4 3.3 Async SRAM 1 McBSP HPI 32/EMAC5 SDRAM, SBSRAM, 1.4 3.3 Async SRAM 24 McBSP PCI/HPI 32/ SDRAM, SBSRAM, 1.2 3.3 EMAC5 Async SRAM 24 McBSP PCI/HPI 32/ SDRAM, SBSRAM, 1.2 3.3 EMAC5 Async SRAM 24 McBSP PCI/HPI 32/ SDRAM, SBSRAM, 1.4 3.3 EMAC5 Async SRAM 24 McBSP PCI/HPI 32/ SDRAM, SBSRAM, 1.4 3.3 EMAC5 Async SRAM 24 McBSP PCI/HPI 32/ SDRAM, SBSRAM, 1.4 3.3 EMAC5 Async SRAM 24 McBSP PCI/HPI 32/ SDRAM, SBSRAM, 1.4 3.3 EMAC5 Async SRAM

1-KU Packaging Price1 548 BGA, 23 mm 28.17 548 BGA, 27 mm 28.17 548 BGA, 23 mm 28.42 548 BGA, 27 mm 28.42 548 BGA, 23 mm 30.98 548 BGA, 27 mm 30.98 548 BGA, 23 mm 33.80 548 BGA, 27 mm 33.80 548 BGA, 23 mm 37.18 548 BGA, 27 mm 37.18 548 BGA, 23 mm 52.23 548 BGA, 27 mm 52.23

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain New devices are listed in red. the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 2 HPI is selectable, 32-bit or 16-bit. 3 EMIFA does not support SDRAM. 4 The DM642 can be configured to have up to three serial ports in various video/McASP/McBSP combinations. 5 The DM640 has an Ethernet MAC. The DM641 can be configured to have either a 16-bit HPI or Ethernet MAC. The DM643 can be configured to have either a 32-bit HPI or a 16-bit HPI and Ethernet MAC. The DM642 can be configured to have either a 32-bit PCI or 32-bit HPI or a 16-bit HPI and Ethernet MAC. Note: Check www.ti.com for extended temperature and packaging options. Additional information on enhanced plastic and HiRel DSP versions is available on page 103.

Development Tools for TMS320DM64x Processors Description

Part Number

$U.S. 1

TMDSDMK642 (U.S. part number) TMDSDMK642-0E (European part number) TMDSEVM642 (U.S. part number) TMDSEVM642-0E (European part number) TMDSDVP648 TMDSCCSALL-1 TMDSEMU560PCI TMDSEMU560U TMDSEMU560T

6,495

For Evaluation and Production: TMS320DM642 Digital Media Development Kit (DM642 DMDK) TMS320DM642 Evaluation Module (EVM) TMS320DM648 Digital Video Development Platform (DVDP)* Code Composer Studio™ Integrated Development Environment (IDE)* Blackhawk XDS560™ JTAG PCI Emulator (optional) Blackhawk XDS560 JTAG USB Emulator (optional) XDS560 USB Trace Emulator3

1,995 1,295 3,595 2 2,995 2,999 9,995

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 2 Free trial version of Code Composer Studio IDE available as part of the free evaluation tools found at www.ti.com/ccstudiofet 3 The XDS560 Trace is designed for use with trace-enabled digital signal processors. Currently the following processors are fully supported by trace: TMS320DM647 and TMS320DM648 processors. * Required for digital media software evaluation and/or production Please see the features supported by platform matrix on page 59 for more details.

Texas Instruments 3Q 2009

Embedded Processing Guide


Digital Media Processors with DaVinci™ Technology

33

Silicon

TMS320DM3x Digital Media Processors

TMS320DM365

The TMS320DM3x processors are powered by an ARM9 core and a video processing subsystem (VPSS). The DM335 processor is a low-cost, low-power processor providing advanced graphical user interface for display applications that do not require video compression and decompression. Optimized for HD video, the DM355 processor integrates an MPEG-4/JPEG coprocessor to enable ultra-low power consumption. The new DM365 processor includes Image Signal Processing (ISP), production-ready codec bundles and integrated peripherals to provide pixel-perfect 1080p HD video.

CCD Controller Video Interface ®

ARM MJCP Subsystem Coprocessor

HCP Coprocessor

Image Signal Processing (ISP)

Histogram/3A Resizer

MPEG-4

ARM9 CPU

Back End 10b HD/SD DAC Enhanced Video On-Screen Enc 10b HD/SD DAC Display (VENC) (OSD) 10b HD/SD DAC

HCP JPEG

DMA Data & Configuration Bus Connectivity

Peripherals EDMA

Keyscan/ADC

Serial Interfaces ASP ×2

I2 C

HPI

SPI ×3

UART ×2

L1/ L2/ External Frequency SRAM SRAM ROM Memory Device CPU (MHz) (Bytes) (Bytes) (Bytes) I/F EDMA TMX320DM335ZCE135 ARM9, 135 32 K – 8 K 1 16-/8-bit 64 Ch TMX320DM335ZCE216 DaVinci 216 EMIFA, Video 1 16-bit mDDR/DDR2

1

Video Processing Subsystem

Front End

EMAC 10/100

System

USB 2.0 HS OTG

Timer WD PWM ×6 Timer ×4

Program/Data Storage mDDR2/ DDR2 EMIF

NAND/ ECC EMIF

MMC/ SDIO ×2

RTC Voice Codec

Video Ports (Configurable) 1 Input, 1 Output

Serial I/F 3 SPI, 2 ASP, 3 UARTs, I2C

Connectivity I/F USB 2.0 HS

3 SPI, 2 ASP, 3 UARTs, I2C

USB 2.0 HS

TMX320DM355ZCE216 ARM9, TMX320DM355ZCE270 DaVinci Video

216 270

8K

1 16-/8-bit 64 Ch EMIFA, 1 16-bit mDDR/DDR2

1 Input, 1 Output

TMX320DM357ZWT

ARM9, DaVinci Video

270

8K

1 16-/8-bit 64 Ch EMIFA, 1 32-/16-bit DDR2

1 Input, 1 Output

TMX320DM365ZCE270 ARM9, TMX320DM365ZCE300 DaVinci Video

270 300

32 K

16 K

1 16-/8-bit 64 Ch EMIFA, 1 16-bit mDDR/DDR2

1 Input, 3 Outputs

1 SPI, USB 2.0 HS 1 ASP, 3 UARTs, 1 MMD/SD, I2C 5 SPI, USB 2.0 HS, 2 ASP, EMAC 2 UARTs, 2 SD MMC, I2C

TMS320DM365 digital media processor block diagram. For more information, visit www.ti.com/dm365.

Program/ Data Storage Async SRAM, mDDR/DDR2 SDRAM, OneNAND, NAND Flash, SmartMedia/xD Async SRAM, mDDR/DDR2 SDRAM, NAND Flash, SmartMedia/xD Async SRAM, DDR2 SDRAM, NAND Flash, SmartMedia/xD

1.3

1.8/ 329 BGA 13.85 3.3 13  13 mm 18.55

1.2

1.8/ 361 nFBGA 18.30 3.3 16  16 mm

Async SRAM, 1.2/ 1.8/ 338 BGA 19.25 mDDR/DDR2 1.35 3.3 13 × 13 mm 25.05 SDRAM, OneNAND, NAND Flash, SmartMedia/xD

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.

Texas Instruments 3Q 2009

Voltage (V) 1-KU Core I/O Packaging Price1 1.3 1.8/ 337 BGA 9.05 3.3 13 × 13 mm 10.25

New devices are listed in red.

Embedded Processing Guide


34

Digital Media Processors with DaVinci™ Technology

Tools Development Tools for TMS320DM3x Processors Description

Part Number

$U.S. 1

TMDXEVM355 TMDXEVM357 TMDXEVM365 TMDSCCSALL-1 TMDSEMU560PCI TMDSEMU560U

495 895 595 3,595 2 2,995 2,999

TMDSCCSALL-1 TMDSEMU560PCI TMDSEMU560U

3,595 2 2,995 2,999

For Evaluation: TMS320DM355 Digital Video Evaluation Module (DVEVM)* TMS320DM357 Digital Video Evaluation Module (DVEVM) TMS320DM365 Digital Video Evaluation Module (DVEVM) Code Composer Studio™ (CCStudio) Integrated Development Environment (IDE)* Blackhawk XDS560™ JTAG PCI Emulator (optional) Blackhawk XDS560 JTAG USB Emulator (optional)

For Production: Code Composer Studio™ IDE* Blackhawk XDS560 JTAG PCI Emulator (optional) Blackhawk XDS560 JTAG USB Emulator (optional) 1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. trial version of Code Composer Studio IDE available as part of the free evaluation tools found at www.ti.com/ccstudiofet * Required for digital media software evaluation and/or production Please see the features supported by platform matrix on page 59 for more details.

New tools are listed in red.

2 Free

Texas Instruments 3Q 2009

Embedded Processing Guide


Digital Media Processors with DaVinci™ Technology

35

Software/Resources

Complete System Tools Get You to Market Faster Developers can get started today with DaVinci technology-based software and development tools tailored to simplify design in video applications, including: • Digital Video Evaluation Module (DVEVM) – DVEVMs are comprised of both hardware and software, and enable developers to start instantaneous evaluation of DaVinci processors. DVEVMs come complete with a demo version of MontaVista Linux Pro 4.0, drivers, Codec Engine, evaluation codecs and an evaluation board. While customers developing on an ARM926 processor can go into production with a DVEVM, it is not recommended or supported by TI. Customers developing on a DSP will require a DVSPB (see description below) in order to go into production. Available DVEVMs: • TMS320DM365 DVEVM (part number TMDXEVM365) • TMS320DM357 DVEVM (part number TMDXEVM357) • TMS320DM355 DVEVM (part number TMDXEVM355) • TMS320DM6467 DVEVM (part number TMDSEVM6467) • TMS320DM6446 DVEVM (part number TMDSEVM6446) • Digital Video Development Platform (DVDP) – A DVDP enables immediate evaluation of DSP-based DaVinci technology digital media processors. DVDPs include DSP/BIOS™ production-ready kernel, drivers, Codec Engine, evaluation codecs, Code Composer Studio IDE and an evaluation board. A DVDP provides developers with a comprehensive platform that can be used throughout the entire design process. A DVDP is recommended for TMS320DM6437 and TMS320DM648 processors customers only. Available DVDPs: • TMS320DM6437 DVDP (part number TMDSVDP6437) • TMS320DM648 DVDP (part number TMDSDVP648)

For a complete list of DaVinci development tools, see page 119. Or for more information on DaVinci technology DVEVMs, DVSPBs and DVDPs, please visit www.ti.com/davincitools. eXpressDSP™ Digital Media Software Simplifies Development and Reduces Design Time

eXpressDSP Digital Media Software To simplify development and reduce cost in your digital media application, a complete portfolio of eXpressDSP-compliant digital media software is now widely available. TI digital media software is: • Production tested for easy integration into audio, video and voice applications • Optimized to support DaVinci technologybased digital media processors

• Designed to meet the needs of engineers by allowing them to focus on product differentiation instead of codec development • Available via free 60-day evaluation with multiple licensing options • Fully supported by Authorized Software Providers that give customized technical support

Customized Technical Support for eXpressDSP Digital Media Software Provided by Authorized Software Providers (ASPs) To ensure extensive and qualified support, TI has established a worldwide network of ASPs that offer support for TI-enabled IP and customized software and engineering services. ASPs provide four hours of free

Digital Media Software Inventory* Codecs

Target Hardware TMD320DM646x TMD320DM644x TMD320DM643x TMD320DM648 TMD320DM3x OMAP35x

Video & Imaging H.264 Video Decoder H.264 Video Encoder VICP JPEG Imaging Decoder JPEG Imaging Encoder MPEG-2 Video Decoder MPEG-2 Video Encoder MPEG-4 Video Decoder MPEG-4 Video Encoder VC1 Video Decoder

     

         

 

 

 

  

  

 

  

  

 

 

   

   

 

 

  

     

   

   

   

   

Open Source

Open Source

Audio AAC Audio Decoder AAC Audio Encoder AC-3 Audio Decoder MP3 Audio Decoder MP3 Audio Encoder WMA Audio Decoder/ Encoder

   

Voice G.711 Decoder/Encoder G.726 Decoder/Encoder G.723.1 Decoder/Encoder G.729 Decoder/Encoder

Other Network Developer Kit (NDK) * Evaluate at no charge for 60 days with a simple click-wrap license.

Texas Instruments 3Q 2009

Embedded Processing Guide


36

Digital Media Processors with DaVinci™ Technology

Software/Resources Complete System Tools Get You to Market Faster (Continued) support during the free 60-day evaluation stage and up to 40 hours during application development. For more information on ASPs, please visit www.ti.com/asp. Code Composer Studio™ Integrated Development Environment The Code Composer Studio (CCStudio) IDE offers robust, mature core functions with easy-to-use configuration and graphical visualization tools for faster system design. • The CCStudio IDE integrates everything programmers need for application development from start to finish. The CCStudio Platinum Edition (version 3.3) simplifies this process by offering a fully merged IDE that supports the DaVinci processor platform as well as other TI DSP platforms. Free 120-day evaluation tools that include the CCStudio IDE are available. For more information on the Code Composer Studio IDE, visit www.ti.com/ccstudio. VICP Signal Processing Library Improves Performance Capabilities Texas Instruments VICP signal processing library is a collection of highly tuned software algorithms that execute on the VICP

hardware accelerator. The library allows the application developer to effectively utilize the VICP performance without spending significant time in developing software for the accelerator. The availability of well-tested, performance-tuned algorithms with the VICP signal processing library significantly reduces the application development time. The freed-up MIPS on the DSP enable the application developers to include more differentiation features in the final application. The VICP hardware accelerator is a parallel MAC engine. Due to its flexible architecture, the accelerator is very effective in enhancing DSP performance by taking over execution of varied computationally intensive tasks. VICP supports various algorithms to enable additional DSP resource: • Matrix operations/array operations: • Ex: Matrix multiplication/transpose. Block add/average/variance • Ex: Array multiplication/addition/ fillmem. Array scalar operations • Ex: Look-up table • Digital signal processing operations: • Ex: 1D, 2D FIR filtering • Ex: Convolution, correlation

• Digital image and video processing functions: • Ex: Alpha blending, color space conversion • Ex: Image rotation, image pack/unpack • Ex: Median filtering www.ti.com/vicp. VLIB 2.0: Video Analytics & Vision Library TI’s Video Analytics & Vision Library (VLIB) is a collection of software kernels that are commonly used in automotive-vision and video-security applications. The kernels are optimized for both C64x™ and C64x+™ DSP cores and can accelerate software development and enable performance improvements up to 10× over standard C code on TI’s DSPs. The VLIB 2.0 now consists of 50+ royalty-free software kernels including background modeling and subtraction, object feature extraction, tracking, recognition and low-level pixel processing as well as Simulink™ blocks for each function and the bit-exact version for PC testing capabilities. www.ti.com/vlib.

A Comprehensive Developer Network Makes DaVinci Technology Easy to Implement Valued members of TI’s Developer Network provide integral components and tools that complement DaVinci technology. Developers offer various levels of video system integration, optimization and system expertise on DaVinci products worldwide.

Texas Instruments 3Q 2009

For a complete list of developers supporting DaVinci technology, please visit the TI Developer Network catalog at www.ti.com/davincidevelopernetwork.

Embedded Processing Guide


Digital Media Processors with DaVinci™ Technology

37

Resources

A Variety of Resources Keep You in the Know DaVinci Technology Webcasts View the archive of TI on-demand DaVinci webcasts to learn how to accelerate and simplify your video system design. Designed for 24/7 access, these webcasts typically last one hour. Visit www.ti.com/davinciwebcasts. DaVinci Video Casts: Engineering in Front of the Camera Whether you have two minutes or two hours, a variety of DaVinci technology videos are available for on-demand viewing. These four-minute videos provide engineers the technical meat on the TMS320DM355 and TMS320DM6467 DaVinci processor products, tools and software. Check out the line-up at www.ti.com/dm355videocasts or www.ti.com/dm6467videocasts. DaVinci Technology Training Get hands-on experience on DaVinci technology through online training, oneday and multi-day workshops. Check www.ti.com/davincitraining for the next workshop near you, as well as 24/7 online training and webcasts.

• Introduction to DaVinci Technology Online Training – www.ti.com/davinciolt. • DM6467 DaVinci Processor for HD Transcoding – www.ti.com/dm6467olt. • DaVinci Technical Seminar – www.ti.com/davinciseminar. • TMS320DM6437 One-Day Workshop – www.ti.com/dm6437odw. • TMS320DM644x Multi-Day Workshop – www.ti.com/dm644xmdw. DaVinci White Papers and Articles Download the variety of DaVinci white papers and articles to see the possibilities for designing and developing digital video and audio end equipment devices and applications using DaVinci technology. Visit www.ti.com/davinciwhitepaper. DaVinci Technology FAQs Have questions about DaVinci technology? Browse the DaVinci questions and answers to find out everything you need to know about DaVinci processors, development tools, applications frameworks, training and support at www.ti.com/davincifaq.

Delve Into Digital Video with Video360 Podcasts The Video360 podcasts feature industry news, technology updates and practical tips regarding the latest innovations in digital video. Check out the archive at www.ti.com/davincipodcast. Additional Web Links and Community Resources • gstreamer.ti.com – Here engineers can find open source files related to DaVinci and join the DaVinci Linux Open Source mailing list for discussions. • www.ti.com/davinciwikidsg – The Embedded Processors Wiki provides a collaborative environment for digital media engineers using Texas Instruments processors to share technical tips and open source code. The Wiki is designed to get you to market faster by shortening the design knowledge ramp, assist other developers innovate and foster a growth of technology knowledge on hardware and software. • www.ti.com/dspdesignsupport – DSP Design Support provides quick access to all technical documentation, tools and software details – all from one page.

DaVinci Technology Literature and Related Technical Documentation All documentation and associated literature, user’s guides, application notes and software can be found by clicking on the specific device in the parametric table found on the URLs below. TMS320DM3x DSP Generation TMS320DM64x DSP Generation TMS320DM643x DSP Generation

Texas Instruments 3Q 2009

www.ti.com/dm3x www.ti.com/dm64x www.ti.com/dm643x

TMS320DM644x DSP Generation TMS320DM646x DSP Generation

www.ti.com/dm644x www.ti.com/dm646x

Embedded Processing Guide


38

Digital Media Processors with DaVinci™ Technology

High-Performance Analog and Logic Products Compatible Analog Products for DaVinci™-Based Digital Video Applications TI provides engineers with highperformance signal chain, interface, clocking and power management solutions to

VLYNQ

I2C

complete digital video applications based on DaVinci technology. The following block diagram represents a few of the many

TUSB6020 USB 2.0 High-Speed

LEDs

TCA6507 LED Driver

GPIOs

2 × SN74AVC1T45 1-Bit Level Translator

PWMO

PLL1705 Clock Generator

ASP

Video Out

Image In

EMIF

TLV320AIC33 Stereo Codec OPA361 Video Amplifier SN74AVC16T245 16-Bit Level Translator

SN74AVCA406 SMC/xD Level Translator SN74LV4320A CompactFlash Xceiver

Power Management*

USB 2.0 High-Speed Host/Peripheral/OTG

TCA6408A I2C I/O Expander

UART

DM644x DM643x DaVinci Digital Media Processors

high-performance analog and logic products that help maximize the performance and functionality of your application.

SN74AVC32T245 32-Bit Level Translator

TI RS-232 Xceiver

Serial Port

Microphone TPA2010D1 (Mono) or TPA2012D2 (Stereo) Class-D Audio Amplifier

PC Speakers

TVP5146M2 Video Decoder

Analog Video

Smart Media/ xD Card

SN75LVDT1422 Serdes for SMCD CompactFlash Card ATA Card

LEGEND Processor Interface Amplifier Logic Power ADC/DAC Audio Video/Imaging

* Please reference page 120 for Power Management products.

TI offers a broad range of compatible Analog products to complement the Digital Video Evaluation Module (DVEVM).

Texas Instruments 3Q 2009

Embedded Processing Guide


OMAP™ Applications Processors

39

Silicon

OMAP35x Platform System-Level Applications Processors Get samples, data sheets, tools and app reports at: www.ti.com/omap35x

Key Features • Highest-performance ARM® core • Up to 600-MHz Cortex™-A8 with 256-KB L2 cache • Low power • Clock gating and integrated sleep modes reduce power without loss of performance • SmartReflex™ technology and dynamic voltage frequency scaling • Scalable roadmap for enhanced graphics and video • Cortex-A8 core and multimedia rich peripherals: USB 2.0, UART, MMC/SD, display, camera interface • POWERVR SGX™ graphics accelerator with software library for 3-D graphics • TMS320C64x+™ DSP and hardware video accelerator with DaVinci™ software

Device Production Sampling In Development

Performance

Applications • Portable media players (PMPs) • Portable navigation devices (PNDs) • Advanced portable consumer electronics • Digital video cameras • Portable data collection • Point of sale (POS) • Gaming • Web tablets • Medical • Smart white goods • Smart home controllers • Low-cost PCs • And more….

OMAP3530

• 600-MHz ARM® Cortex™-A8 • C64x+™ DSP • Video accelerator • POWERVR SGX™ graphics

• EMAC • USB PHY • 3.3-V I/O • DDR2 • CAN • 3-D graphics

Future

OMAP3525

OMAP3515 OMAP3503

• 600-MHz ARM Cortex-A8 • C64x+ DSP • Video accelerator

OMAP35x

OMAP35x • 600-MHz ARM Cortex-A8 • POWERVR SGX graphics

-A8 Cortex

OMAP Next

• EMAC • USB PHY • 3.3-V I/O • DDR2 • CAN

• 600-MHz ARM Cortex-A8

Time The OMAP applications processors platform delivers a variety of high-performance applications processors with fast, portable power and a robust support network with a software portfolio that includes open source. The complete platform allows for differentiation and rapid development of applications from multimedia-enhanced devices to general-purpose computer applications that require Linux or Windows® CE class operating systems.

ARM® Cortex™-A8 CPU

Display Subsystem

C64x+™ DSP and Video Accelerators (3525/3530 only)

LCD Controller

POWERVR SGX™ Graphics Accelerator (3515/3530 only)

Video 10-bit DAC Enc 10-bit DAC Camera I/F

Image Pipe

Parallel I/F

L3/L4 Interconnect Peripherals

Connectivity

System

USB 2.0 HS USB OTG Host Controller Controller ×2

Timers GP ×12 WDT ×2

Serial Interfaces McBSP ×5 McSPI ×4

I2C ×3

UART ×2 UART w/IrDA

Program/Data Storage HDQ/1-wire

SDRC GPMC

MMC/ SD/ SDIO ×3

OMAP35x application processors are based on the ARM® Cortex™-A8 core with more than four times the processing power of today’s 300-MHz ARM9 devices, the superscalar 600-MHz Cortex-A8 core is integrated into four new OMAP35x applications processors.

Texas Instruments 3Q 2009

Embedded Processing Guide


40

OMAP™ Applications Processors

Silicon and Support OMAP35x Platform OMAP Processors Turn Everyday Products into New Ways to Work, Socialize and Entertain Targeting applications such as portable navigation devices, Internet appliances, portable media players and personal medical equipment, TI’s new scalable OMAP platform offers four distinct single-chip processors with a variety of combinations of the Cortex™-A8 core, multimedia rich peripherals, POWERVR SGX™ graphics accelerator and DaVinci™ technology for applications wanting to incorporate video. The OMAP35x applications processors are pin-for-pin compatible to make it easy for OEMs to efficiently create a complete product portfolio based on the single platform. Complete Hardware, Software and Tools Solution The modular and extensible OMAP35x Evaluation Module (EVM) provides all the components needed to begin developing today on the OMAP35x platform. This EVM includes a complementary, integrated power management and analog solution specifically for OMAP. The modular design allows you to easily upgrade to future devices. Included with the EVM is the OMAP35x Linux board support package

Texas Instruments 3Q 2009

(BSP). The Windows® CE BSP is available for download from TI and open source software is available for the OMAP platform. • OMAP35x Evaluation Module (EVM) available today • Hardware: – OMAP35x processor – 128-MB LPDDR – 128-MB NAND Flash – Touchscreen LCD display with landscape/portrait modes – Expansion connector provides flexible interface capability • Emulator support: TI XDS560™ • Software • OMAP35x Linux BSP: – Peripheral drivers – U-boot for boot loading – Busybox-based root file system • Open source development tools • Reference schematics • Connectivity • Daughter card connectivity • Ethernet, USB 2.0, SDIO, I2C, JTAG, keypad • SD/MMC and DDR • S-Video output via NTSC/PAL and YPbPr/RGB www.ti.com/omap35x.

Developer Network Support Additional applications expertise and support is available from over 400 members of the OMAP Developer Network to help customers take their designs from concept to production as quickly as possible. www.ti.com/omap35x. Online Training Get an inside technical look at the new OMAP35x processor hardware and software. Gain an internal perspective of the possibilities suited for this uniquely compelling generation of OMAP processors. www.ti.com/omap35x. Webcasts Learn more about TI’s OMAP35x processors that combine high performance and low power for automotive infotainment, consumer, medical, industrial and embedded applications. www.ti.com/omap35x.

Embedded Processing Guide


OMAP™ Applications Processors

41

Silicon and Tools

OMAP35x Applications Processors Part Number OMAP3530

Frequency L1P L1D L2 RAM ROM External (MHz) (Bytes) (Bytes) (Bytes) (Bytes) (Bytes) Memory I/F DMA Timers Serial Ports 600 16 K 16 K 256 K 64 K 112 K LPDDR, 32 Ch 12 GP, 5 McBSP, 4 McSPI, NOR, NAND, 2 WDT 3 I2C, 1 HS USB 2.0 430 32 K 32 K + 64 K + 64 K oneNAND, 64 Ch OTG, 1 HS USB 48 K 32 K SRAM Host (3 port), SRAM SRAM 1 HDQ/1-Wire, 3 UART (1 IrDA+CSI) OMAP3525 ARM – 600 32 K 16 K 256 K 64 K 112 K LPDDR, 32 Ch 12 GP, 5 McBSP, 4 McSPI, Cortex-A8, NOR, NAND, 2 WDT 3 I2C, 1 HS USB 2.0 C64x+ 430 32 K 32 K + 64 K + 64 K oneNAND, 64 Ch OTG, 1 HS USB 48 K 32 K SRAM Host (3 port), SRAM SRAM 1 HDQ/1-Wire, 3 UART (1 IrDA+CSI) OMAP3515 ARM POWERVR 600 16 K 16 K 256 K 64 K 112 K LPDDR, 32 Ch 12 GP, 5 McBSP, 4 McSPI, Cortex-A8 SGX NOR, NAND, 2 WDT 3 I2C, 1 HS USB 2.0 oneNAND, OTG, 1 HS USB SRAM Host (3 port), 1 HDQ/1-Wire, 3 UART (1 IrDA+CSI) OMAP3503 ARM – 600 16 K 16 K 256 K 64 K 112 K LPDDR, 32 Ch 12 GP, 5 McBSP, 4 McSPI, Cortex-A8 NOR, NAND, 2 WDT 3 I2C, 1 HS USB 2.0 oneNAND, OTG, 1 HS USB SRAM Host (3 port), 1 HDQ/1-Wire, 3 UART (1 IrDA+CSI) CPU Graphics ARM POWERVR Cortex™-A8, SGX™ C64x+™

Misc HW video accelerator, NEON coprocessor, LCD, TV out, Camera I/F, MMU, 3 MMC/SD/SDIO, 196 GPIO (shared) HW video accelerator, NEON coprocessor, LCD, TV out, Camera I/F, MMU, 3 MMC/SD/SDIO, 196 GPIO (shared) NEON coprocessor, LCD, TV out, Camera I/F, MMU, 3 MMC/SD/SDIO, 196 GPIO (shared)

Voltage (V) 1-KU Core I/O Packaging Price1 1.35 1.82 0.4-mm PoP, 515-pin 41.70 PBGA (12×12 mm), 0.5-mm PoP, 515-pin PBGA (14×14 mm), 0.65-mm, 423-pin PBGA (16×16 mm) 1.35 1.82 0.4-mm PoP, 515-pin 37.50 PBGA (12×12 mm), 0.5-mm PoP, 515-pin PBGA (14×14 mm), 0.65-mm, 423-pin PBGA (16×16 mm) 1.35 1.82 0.4-mm PoP, 515-pin 33.85 PBGA (12×12 mm), 0.5-mm PoP, 515-pin PBGA (14×14 mm), 0.65-mm, 423-pin PBGA (16×16 mm)

NEON coprocessor, 1.35 1.82 0.4-mm PoP, 515-pin 22.55 LCD, TV out, PBGA (12×12 mm), Camera I/F, MMU, 0.5-mm PoP, 515-pin 3 MMC/SD/SDIO, PBGA (14×14 mm), 196 GPIO (shared) 0.65 mm, 423-pin PBGA (16×16 mm)

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 2 MMC1 is 3.0 V.

New devices are listed in red.

OMAP35x Applications Processor Hardware and Software Development Tools Description

Part #

$U.S.1

TMDSEVM3530 (U.S. part number)

1,499

TMDSEMU560 TMDSEMU560U (U.S. part number) TMDSEMU560U-0E (European part number) TMDSEMUPP (U.S. part number) TMDSEMUPP-0E (European part number) TMDSEMUUSB

3,995 2,995

Evaluation Module (EVM) OMAP35x EVM

JTAG Emulators XDS560™ PCI-Based High-Performance JTAG Emulator XDS560 Blackhawk USB High-Performance JTAG Emulator XDS510PP-Plus – Parallel Port Emulator for Windows® XDS510™ USB-Based Emulator for Windows

1,500 1,995

Software Development Tools Code Composer Studio Platinum Edition v3.3 Development Tools Bundled with Annual Software Subscription Supports C6000™, C5000™, C2000™, DaVinci™ and OMAP™ processor platforms C6000, C5000, OMAP, DaVinci, C2000 DSP Code Composer Studio Development Tools Annual Software Subscription for Version 3.1 and higher 1

TMDSCCSALL-1

3,595

TMDSSUBALL

600

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.

Please see the features supported by platform matrix on page 59 for more details.

Texas Instruments 3Q 2009

Embedded Processing Guide


42

OMAP™ Applications Processors

Silicon OMAP-L1x Platform System-Level Applications Processors Get samples, data sheets, tools and app reports at: www.omap.com

Key Features • Integrate feature-rich GUIs into portable designs • Networking simplified with advanced peripherals including 10/100 Ethernet MAC, USB 2.0 HS OTG, SATA • Operating system flexibility with Linux, WinCE, VxWorks or DSP/BIOS™ real-time kernel • Scalable architecture; pin-for-pin compatible with select devices in the TMS320C674x DSP generation • Low power consumption ranging from 7 mW* deep-sleep power to 452 mW‡ total power • Smaller, ergonomic products with 13×13-mm packaging

Device Sampling In Development Future

OMAP-L1x Future

• 300-MHz ARM926 • 300-MHz C674x DSP (C67x+/C64x+) DSP

926

ARM

OMAP-L138

Integration

Applications • Software-Defined Radio (SDR) • Power protection systems • Programmable automation controller (PAC) • Industrial automation • Industrial control • Test and measurement equipment • Audio (digital mixers, teleconference systems) • Portable data terminals • Barcode scanners • And more…

OMAP-L1x8 devices include: • SATA • mDDR/DDR2/SDRAM • Video Port Interface (VPIF) • McASP, McBSP • 10/100 Ethernet MAC • USB 2.0 HS PHY • USB 1.1 FS PHY • Universal parallel port (UPP) • LCD controller

SDRAM

OMAP-L137

• 300-MHz ARM926 • 300-MHz C674x DSP (C67x+/C64x+) DSP • USB 2.0 HS PHY • Ethernet MAC

Time

OMAP-L1x Applications Processors The OMAP-L1x roadmap offers a variety of scalable architectures including the flexible ARM926EJS processor, extensive connectivity peripherals and a unique TMS320C674x DSP core, which combines the TMS320C67x+ and TMS320C64x+™ DSP cores, and is capable of performing both floating- and fixed-point operations in a single core.

ARM9 Subsystem

DSP Subsystem

ARM 926EJ-S CPU

C674x DSP Core (L137/L138 only)

LCD Controller Universal Parallel Port (UPP) (L1x8 only) Video Port Interface (VPIF) (L1x8 only)

Switched Central Resource (SCR) / EDMA Peripherals UHPI

System

Connectivity USB 2.0 HS

USB 1.1

EMAC

Serial Interfaces SPI (2)

* Power-use scenario – deep sleep: 1.0-V core, idle ARM® DSP clock OFF, all peripherals clock OFF, RTC ON, PLL disabled, 25°C ‡ Power-use scenario – active: 70% max load of the DSP running at 300 MHz at 1.2 V, ARM running at 300 MHz doing typical activity (peripheral configurations, other housekeeping activities); mDDR 133 MHz/ 16 bit accessed 50% of the time, McBSP, SPI and GPIOs peripherals are active, 25°C

Texas Instruments 3Q 2009

McBSP McASP (L1x8 only)

I2C (2)

UART (3)

SATA (L1x8 only)

WD Timer

PWM

Program/Data Storage mDDR/ Async MMC/SD DDR2/ EMIF (2) SDRAM 16-bit 16-bit

OMAP-L1x Block Diagram Providing developers with increased connectivity at a low cost and low power levels, the new OMAP-L1x product line includes ARM9 and ARM9-plus-DSP architectures. These new devices will support various high-level operating systems including Linux, WinCE, VxWorks and DSP/BIOS™ real-time kernel.

Embedded Processing Guide


OMAP™ Applications Processors

43

Silicon

OMAP-L1x Platform Connectivity, Portability and GeneralPurpose Processing Made Easy with OMAP-L1x Applications Processors Enabling developers to integrate featurerich GUIs into their portable designs, the OMAP-L1x generation of applications processors include a variety of scalable ARM9 and ARM9-plus-DSP architectures. With pricing starting under U.S. $7 in 1-KU quantities and pin-for-pin compatibility with select devices in the TMS320C674x DSP generation, designers are easily able to choose the right processor to fit their application needs. The high-precision TMS320C67x+ and high-performance TMS320C64x+™ DSP cores combine to create the C674x processor core which enables designers to develop software using both fixed- and floating-point instructions in a single device. Boasting the lowest power of any floating-point DSP in the industry, the C674x core utilized in the OMAP-L1x eliminates barriers that once prohibited designers from developing in the floatingpoint environment. With the best of both worlds (fixed-point and floating-point) in a single core, designers now have more flexibility than ever.

Texas Instruments 3Q 2009

Increase the Battery Life of Applications Through TI Process Technology Combining industry-leading, cutting-edge 65-nm process technology with lowleakage transistor technology, OMAP-L1x processors offer high performance and scalability with power consumption as low as 7 mW* in deep sleep mode. The highperformance and low-power silicon architecture and power-management software technology used for OMAP-L1x processors give designers not only granularity for frequency and voltage, but also the ability to manipulate the individual peripherals to further optimize power consumption.

Get Started Quickly To get started quickly, designers can purchase OMAP-L1x development kits. Get started today with the OMAP-L137/ TMS320C6747 Floating-Point Starter Kit. Development kits vary in price and capability depending on the customer needs. Most include built-in emulation and Code Composer Studio™ Integrated Development Environment support. All kits contain Linux board-support packages, Codec Engine, DSP/BIOS™ kernel and device driver and the associated debugging environment. For more information on OMAP-L1x processors, visit www.ti.com/omapl1x.

Chip-level integration includes, but is not limited to: • 10/100 EMAC • USB 1.1 Host/2.0 Host/Device/OTG • MMC/SD controllers • Universal parallel port (uPP) for interfacing with FPGAs, high-speed data converters • Universal Host Port Interface (UHPI) for interfacing with other processors • LCD controller • Serial ATA Interface (OMAP-L1x8 only) • 448-KB on-chip memory • Video port interface (OMAP-L1x8 only)

OMAP-L1x Videos Want to hear more about the exciting new OMAP-L1x applications processors? Hear about both the hardware and software that supports these platforms here: www.ti.com/omapl1x_comm.

* Power-use scenario – deep sleep: 1.0-V core, idle ARM® DSP clock OFF, all peripherals clock OFF, RTC ON, PLL disabled, 25°C.

Embedded Processing Guide


44

OMAP™ Applications Processors

Silicon and Tools

OMAP-L1x Applications Processors Part Frequency L1P L1D L2 RAM External Number CPU (MHz) (Bytes) (Bytes) (Bytes) (Bytes) Memory I/F OMAP-L137 ARM926EJS, 300 16 K 16 K 128 K SDRAM, C674x 300 32 K 32 K 256 K Shared NAND, NOR OMAP-L138 ARM926EJS, C674x

1

300 300

16 K 32 K

16 K 32 K

256 K

128 K Shared

DDR2, mDDR, NAND, NOR, SDRAM

DMA 32 Ch

64 Ch

Timers Serial Ports 1 GP, USB 2.0 HS OTG, 1 GP/WD USB 1.1, 3 McASP, 2 SPI, 2 I2C, 3 UART 3 GP, USB 2.0 HS OTG, 1 GP/WD USB 1.1, 1 McASP, 2 McBSP, 2 I2C, 3 UART, 2 SPI

Voltage (V) Misc Core I/O 10/100 Ethernet MAC, 1.2 1.8/3.3 MMC/SD, 3 PWMs, LCD controller, 3 eCAP, 2 eQEP, UHPI 10/100 Ethernet MAC, 1.0–1.2 1.8/3.3 2 MMC/SD, 2 PWMs, LCD controller, video interface, UHPI, SATA, 3 eCAP

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.

1-KU Packaging Price1 1.0-mm 256-pin 16.35 BGA (17×17 mm)

0.8-mm 361-pin 18.60 BGA (16×16 mm), 0.65-mm 361-pin BGA (13×13 mm

New devices are listed in red.

OMAP-L1x Applications Processor Hardware and Software Development Tools Description

$U.S.1

Part #

Hardware Development Tool OMAP-L137/TMS320C6747 Floating-Point Starter Kit

TMDXOSKL137BET

395

JTAG Emulators XDS510PP-Plus – Parallel Port Emulator for Windows® XDS510™ USB-Based Emulator for Windows 1

TMDSEMUPP (U.S. part number) TMDSEMUPP-0E (European part number) TMDSEMUUSB

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order.

1,500 1,995

New tools are shown in red.

Please see the features supported by platform matrix on page 59 for more details.

Texas Instruments 3Q 2009

Embedded Processing Guide


OMAP™ Applications Processors

45

Power Mangement Products

Power Management Products for the OMAP35x, OMAP-L137 and OMAP-L138 Applications Processors Get samples, data sheets, Evaluation Modules (EVMs) and app reports at: power.ti.com

Power Management Products for OMAP35x Applications Processors Part Integration SmartReflex™ Number Level Class TPS65950 Full integration Class 3 TPS65930 Full integration Class 3 TPS65920 Full integration Class 3 TPS65073 Full integration Class 3 TPS65023 Semi integration Class 2 TPS62350 Discrete Class 3

DC/DC 3 3 3 3 3 1

LDO 10 4 4 2 3 –

I2C      

USB2.0 HS OTG   

Audio Codecs  (2× stereo) (1×) –

– –

– –

Battery Charger  – –  – –

Touchscreen Controller – – –  – –

Package (mm) 7×7 BGA 10×10 BGA 10×10 BGA 6×6 QFN 5×5 QFN 3×3 QFN 2×1.5 CSP

Power Management Products for the OMAP-L137 Applications Processor Key Careabouts Integration Flexibility Simplest Low part count

1.2-V (PLL) TPS79901 TPS71712 TPS74801 TPS62410

1.2-V (RTC) TPS65023 TPS71712 TPS74801 TPS62410

Voltages 1.2-V (Core) TPS65023 TPS62353 TPS74801 TPS62410

3.3-V (I/O) TPS65023 TPS62200 TPS73633 TPS62410

1.8-V (I/O) TPS65023 TPS71718 TPS71718 TPS71718

TPS65070 The TPS65070 is a dedicated PMU solution for OMAP-L138/ TMS320C6748 applications. The 1-cell Li-Ion battery charger with power path management can be supplied either by a USB port or a wall adapter. Three highly efficient 2.25-MHz buck converters provide the voltages (core, memory, I/O) for the processor. The voltages can be changed by I2C.

1-cell Li-lon

Power Management Products for the OMAP-L138 Applications Processor

Further, two 200-mA LDOs, one boost converter for LED backlighting, a touchscreen controller and 10-bit A/D converter are integrated as well. The TPS65070 comes in a small 6×6-mm QFN package.

For additional power supply designs for TI processors, please visit www.ti.com/processorpower. Note: The TI power devices recommended here are based on standard operating conditions. System designers should use device power estimation tools in conjunction with overall application level power requirements to ensure an adequate power supply design is used.

Texas Instruments 3Q 2009

Embedded Processing Guide


46

Software and Development Tools

eXpressDSP™ Software and Development Tools eXpressDSP Software and Development Tools Complete, Real-Time Software and Development Tools for TI Processors

TI’s real-time eXpressDSP Software and Development Tools portfolio includes tightly knit ingredients that will empower developers to tap the full potential of TI’s TMS320™ DSPs, DaVinci™ and OMAP™ processors. Each element is designed to simplify programming and move development from a custom-crafted approach to a new paradigm of interoperable software from multiple vendors supported by a worldwide infrastructure. There has been an explosive growth in real-time applications demanding the real-time processing power of TI digital signal processing. eXpressDSP tools enable innovators and inventors to speed new products to market and turn ideas into reality. For more information, visit www.ti.com/expressdsp. Standardization and Software Reuse Move Development to a New Level • Standards enabled for modular, reusable multi-function applications • Developers of all experience levels • Integrate your own software • Catalog of interoperable software • Focus on adding value/differentiation • Designed to cut development time by up to 50 percent and increase the modularity

Tools and Standards to Simplify Application Development, Reduce System Cost, Enhance Product Robustness and Innovation and Accelerate Time to Market • Powerful, integrated development environment (IDE) (Code Composer Studio™ IDE) • Scalable real-time kernel (DSP/BIOS™ kernel) • eXpressDSP-compliant algorithms (written to the eXpressDSP Algorithm Interface Standard) • Reusable modular software and support from TI’s DSP Developer Network • Available on TMS320C6000™ and TMS320C5000™ DSPs,

Learn about TI’s offering of development boards and kits to get your design started today (See page 55).

TMS320C2000™ digital signal controllers, OMAP application processors and digital media processors with DaVinci technology • Advanced data visualization and realtime analysis • Powerful code-generation tools What Are eXpressDSP Software and Development Tools? TI’s real-time eXpressDSP Software and Development Tools provide a complete and open digital signal processing software environment to simplify and streamline the product development process. It provides access to a large number of reusable software components, host tooling and target-side content to reduce development time.

SoC (ARM® + DSP) eXpressDSP™ Development Tools Code Composer Studio and Developer Network IDEs

eXpressDSP Software ARM

Code Composer Studio™ IDE Editor ThirdParty IDEs

Compiler Profiler Debugger Simulator

DSP

Codec Engine

Codec Engine Server

eXpressDSP Digital Media Software

eXpressDSP Digital Media Software

Operating Systems

DSP/BIOS™ Kernel; NDK*

Hardware Drivers

eXpressDSP Data Visualization

• SoC Analyzer

• Framework Components • Codec Engine • xDAIS and xDM

Customer Application Framework

See pages 47 and 48

eXpressDSP Data Visualization Tools

Multimedia Framework Products

®

DSP/BIOS Link

See page 52

eXpressDSP Digital Media Software • Video Codecs • Imaging Codecs • Speech / Voice Codecs • Audio Codecs • Other Algorithms See pages 53 and 54

Device Drivers

See page 49

Host Computer

Emulators / Analyzers • XDS560™ Emulator • XDS560 Trace See page 49

Target Board

Emulator

Operating Systems • DSP/BIOS Kernel – DSP/BIOS Link • Network Developer’s Kit (NDK) • MontaVista Linux • VirtualLogix Linux • Windows® CE See pages 50 and 51

Device Drivers

Development Kits and Boards • Starter Kits • Development Boards / EVMs • Development Platforms • Daughter Cards See pages 55 – 57

*NDK only applicable to DSP-centric design

eXpressDSP Texas Instruments 3Q 2009

Embedded Processing Guide


Software and Development Tools

47

eXpressDSP™ Development Tools

Code Composer Studio™ IDE, TI Developer Network IDEs and Development Tools Integrated Development Environment and Debuggers Get more information about Code Composer Studio IDE and TI Developer Network development tools at: www.ti.com/ccstudio

Code Composer Studio Development Tools Simplify DSP Development Code Composer Studio (CCStudio) software is a fully integrated development environment (IDE) supporting Texas Instruments industry-leading DaVinci™, TMS320C6000™, TMS320C5000™, TMS320C2000™ and OMAP™ processor platforms.

IDE • Integrated IDE and debugger • CodeWright Editor • Project manager Debugger • Co-debug of ARM®/DSP processors • Data visualization • Cache visibility • Robust host-to-target connection Real-Time Debug • Non-intrusive memory access • Handle interrupts while halted Advanced Event Triggering • Watchpoints • Event sequences • Non-intrusive counters Code-Generation Tools • Industry-leading performance • Program-level optimization Simulation • Cycle accurate simulation • Rewind back-stepping • Code coverage Profiling • Profile functions and loops • Measure cache activity • Profile pipeline stalls Host Operating System Support • Windows® • Linux (compilers only)

Integrated Development Environment The Code Composer Studio (CCStudio) IDE provides a single-user interface taking you through each step of the application development flow. Familiar tools and interfaces allow users to get started faster than ever before and add functionality to their application thanks to sophisticated productivity tools. The integrated CodeWright Editor greatly improves the code creation experience. Easily manage large multi-user, multi-site projects with the built-in project manager. Debugger Code Composer Studio IDE’s integrated debugger has DSP-specific capabilities and advanced breakpoints to simplify development. Conditional or hardware breakpoints are based on full C expressions, local variables or CPU register symbols. A General Extension Language (GEL) script file can be executed when a particular breakpoint hits. Developers can debug code quickly by selectively stepping into, over or out of C function or assembly subroutines. CodeWright Editor

The memory window allows you to inspect each level of memory so that you can debug complex cache coherency issues. Code Composer Studio IDE supports the development of complex systems with multiple boards or multiple processors on a single target board. Global breakpoints are also available for multiprocessor systems. Code Composer Studio’s Parallel Debug Manager (PDM) provides synchronized control over multiple processors configured in single- or multiple-scan chains. It can be used to launch individual parent windows to control each processor. The PDM can be used to broadcast commands to different groups of CPUs in the JTAG scan path. A global breakpoint command on one processor can halt other processors when this breakpoint is encountered. The PDM lets developers open up separate debug windows for any CPU on any board in the system. Code Composer Studio IDE also supports popular external scripting languages such as Perl and VBA to help developers automate application testing and validation. DSP/BIOS Kernel Configuration Window Memory Window

Project Manager Toolbars

Disassembly Window Data Visualization Watch Window Output Window

Data Visualization

GEL

Code Composer Studio Development Tools include the features you need to edit, build, debug and visualize your applications.

Texas Instruments 3Q 2009

Embedded Processing Guide


48

Software and Development Tools

eXpressDSP™ Development Tools Real-Time Debug TI devices include advanced emulation features which provide simple, inexpensive and speed-independent access to the CPU for debugging. Access to registers and memory can be non-intrusive and realtime mode provides for the debugging of code that interacts with interrupts that must not be disabled. Real-time mode allows you to suspend background code at break events while continuing to execute time-critical interrupt service routines.

Several simulator variants are available allowing users to trade off cycle accuracy, speed and peripheral simulation, with some simulators being ideally suited to algorithm benchmarking and others for more detailed system simulation.

Advanced Event Triggering Advanced Event Triggering (AET) allows a user to halt the CPU or trigger other events based on complex events or sequences. These events include invalid data memory accesses and invalid program accesses. It can also non-intrusively measure performance and count system events (for example, cache events).

Watchpoints allow the user to stop his code on data read or write to a particular memory location. Track memory corruption problems using this feature.

Code-Generation Tools In the past, developing high-performance DSP code has required optimizing assembly code by hand and an intimate knowledge of the particular device architecture. The TI Code Composer Studio IDE compiler tools address this need by shifting the burden of optimization from hand-coded assembly to the C compiler. With these tools it is possible to exploit the high performance of TI processors without ever writing hand-coded assembly. TI compilers can perform program-level optimizations that evaluate code performance at the application level. With a programlevel view, the compiler is able to generate the small, fast code an assembly program developer with a full system view would generate. This application-level view is leveraged by the compiler to make trade offs that significantly increase performance. Simulation Simulators provide a way for users to begin development prior to having access to a development board. Simulators also have the benefit of providing enhanced visibility into application performance and behavior.

Texas Instruments 3Q 2009

The Rewind feature allows you to step and run backward to trace the source of a problem. There is no need to restart the execution of the program. Full reverse mode visibility is available through watch, register and memory windows.

The Interrupt Latency Detector enables you to measure the worst-case interrupt latency of the code, including programming interrupt constraints such as disabling GIE/NMIE and architectural behavior such as non-serviceability of interrupts in branch delay slots. Pipeline analysis of a TMS320C55x™ DSP shows both the stalls and their causes through a detailed pipeline visibility. Code Coverage shows which source lines (both C and assembly) are executed. The CacheTune tool tracks program, data cache activities visualized over time – most effective for improving cache utilization. Real-Time Data Exchange Real Time Data Exchange (RTDX™) and High-Speed RTDX (HS-RTDX) allow a developer to exchange data between the target and the host PC without stopping the target application, thus providing a bi-directional “data pipe” between the application and the host. This allows developers to access data from the application for real-time visibility, or to simulate data input to the device, shortening development time by giving developers a realistic view of the way their systems operate. Profiling Code Composer Studio IDE’s interactive profiler makes it easy to quickly measure

code performance and ensure the efficient use of the DSP target’s resources during debug and development sessions. The profiler allows developers to easily profile all C/C++ functions in their application for instruction cycles or other events such as cache misses/hits, pipeline stalls and branches. Profile ranges can be used to concentrate efforts on high-usage areas of code during optimization, helping developers produce finely-tuned code. Profiling is available for ranges of assembly, C++ or C code in any combination. To increase productivity, all profiling facilities are available throughout the development cycle. Developer Network Development Tools TI is committed to enabling third-party development tools partners to support our ARM®-based SoC devices. GreenHills MULTI® MULTI is a complete integrated development environment for embedded applications using C, C++ and Embedded C++. The MULTI debugger offers an excellent environment for debugging of SoC devices containing both ARM and the TMS320C64x+™ DSP core. MULTI also offers OS-aware debugging for several operating systems including INTEGRITY, velOSity, u-velOSity, MontaVista Linux and DSP/BIOS™ kernel. For more information on GreenHills MULTI, please contact sales@ghs.com. Lauterbach Trace32 Trace32 is an ARM debugger that also supports debugging of TI DSPs and thus can provide co-debug support for the ARM and DSP on TI SoC devices. Lauterbach also provides OS aware debugging for most embedded operating systems including Linux. For more information please visit www.lauterbach.com. Code Composer Studio full-function evaluation tools are available for a free 120-day evaluation. To order your CD-ROM, visit www.ti.com/freetools.

Embedded Processing Guide


Software and Development Tools

49

eXpressDSP™ Development Tools

JTAG Debug and eXpressDSP Data Visualization Emulators and Analysis Tools Get more information about JTAG debug and eXpressDSP data visualization tools at: www.ti.com/emulatoranalyzer

Real-time execution visibility is the key to optimizing and debugging systems. Emulators provide a connection to a target for execution control and system visibility. eXpressDSP Data Visualization Toolsbased solutions graphically simplify complex, interrelated data sets. XDS560™ Emulator The XDS560 Emulation platform provides a robust and reliable IEEE 1149.1 JTAG connection to the target device. It provides high-speed download speeds, Advanced Event Triggering (AET), and High-Speed RealTime Data Exchange (HS-RTDX) capability. Non-Intrusive Debugging TI devices include advanced emulation features which provide simple, inexpensive and speed-independent access to the CPU for debugging. Access to registers and memory can be non-intrusive and realtime mode provides for the debugging of code that interacts with interrupts that must not be disabled. Real-time mode

allows you to suspend background code at break events while continuing to execute time-critical interrupt service routines. • Advanced Event Triggering (AET) allows a user to halt the CPU or trigger other events based on complex events or sequences such as invalid data or program memory accesses and invalid program accesses. It can non-intrusively measure performance and count system events (for example, cache events). • Real-Time Data Exchange (RTDX™) and High-Speed RTDX (HS-RTDX) allow a developer to exchange data between the target and the host PC, without stopping the target application, thus providing a bi-directional “data pipe” between the application and the host. This allows developers to access data from the application for real-time visibility, or to simulate data input to the device, shortening development time by giving developers a realistic view of the way their systems operate.

Blackhawk XDS560 Trace delivers non-intrusive, real-time data capture to expose the toughest real-time bugs.

Texas Instruments 3Q 2009

XDS560 Trace The XDS560 Trace module helps customers find previously “invisible” complex real-time bugs. Trace can detect the really hard to find bugs – race conditions between events, intermittent real-time glitches, crashes from stack overflows, runaway code and false interrupts without stopping the processor. Trace is a completely non-intrusive debug method that relies on a debug unit inside the DSP so it does not interfere or change the application’s real-time behavior. Trace can fine tune code performance and cache optimization of complex switchintensive multi-channel applications. It enables real-time code and event profiling as well as fast and accurate code analysis with profiling, cache view and code coverage for some of the most popular TMS320™ devices today used in applications such as video teleconferencing and medical imaging. SoC Analyzer Data Visualization Tool eXpressDSP Data Visualization SoC Analyzer is TI’s high-level system tuning and visibility tool which enables developers to visualize SoC streaming data rather than be limited to post-mortem static data analysis. By being able to capture and graphically display system interactions and load distribution, isolate bottlenecks, identify unexpected behaviors and benchmark application performance, developers are able to maximize efficiency and overall performance while eliminating tedious manual data collection and comparison. This tool is non-invasive and aids in analyzing and identifying problems by capturing and graphically displaying: system interaction, load distribution, bottlenecks in data throughput and other types of behavior. Read more about real-time debug at www.ti.com/emulatoranalyzer.

Embedded Processing Guide


50

Software and Development Tools

Operating Systems Operating System Solutions DSP/BIOS™ Real-Time DSP Kernel and ARM® Operating Systems Get more information about DSP/BIOS real-time kernel and ARM operating systems at: www.ti.com/expressdspos

Complete Operating System Solutions for Both ARM and DSP-Based Devices • DSP/BIOS real-time kernel • Available royalty-free with Code Composer Studio™ (CCStudio) integrated development environment (IDE) • Supports DaVinci™, OMAP™, TMS320C6000™, TMS320C5000™ and TMS320C2000™ processors • Provides deterministic, preemptive multithreading • DSP/BIOS Link provides ARM–DSP program loading and communications services • Network Developers Kit (NDK) • Integrated with DSP/BIOS kernel • Provides standard TCP/IP networking services • Includes higher-level applications such as HTTP, TELNET, DNS and DCHP • MontaVista Linux • Stable, robust, proven embedded Linux • Fully supported and maintained by MontaVista • Available for DaVinci and OMAP processors • Microsoft Windows® CE • Available on select ARM-based DaVinci and OMAP processors through TI’s Authorized Software Providers (ASPs) • VirtualLogix Linux • Full-featured embedded Linux complete with drivers • Co-exists with DSP/BIOS kernel via real-time VLX virtualization technology • Available on select TMS320C64x+™ DSP corebased processors

Texas Instruments 3Q 2009

DSP/BIOS Software Kernel Foundation DSP/BIOS kernel is a robust multithreading kernel, proven in thousands of embedded applications, and is augmented by the NDK embedded networking stack and DSP/BIOS Link ARM–DSP communications and control software. DSP/BIOS kernel is highly scalable to minimize footprint requirements. DSP/BIOS kernel provides preemptive multithreading, cache and interrupt management and a selection of interprocessor communication services, including mailboxes, semaphores and variable-length message passing that works transparently across single- and multi-core configurations. To aid debugging of complex applications, DSP/BIOS kernel includes real-time logging services that are integrated with the CCStudio IDE graphical real-time analysis displays. DSP programmers can view the sequence of thread execution, CPU load, or use a low-overhead printf for custom instrumentation. DSP/BIOS kernel is frequently deployed as the real-time DSP kernel on multi-core devices like TI’s DaVinci and OMAP SoC processors. In such applications, the DSP/BIOS Link inter-processor communication provides powerful interconnection service to ARM-side operating systems like Linux and Windows CE. DSP/BIOS Link is typically used with TI’s Codec Engine, as shown in the DaVinci software pages of this guide (see page 52). Open Source Community Linux TI provides the latest cutting-edge Linux release for its devices. Support for TI devices is provided directly in the mainstream Linux development tree (GIT tree) and may be downloaded at no charge. Development tool support is provided through Code Sourcery’s Sourcery G++™. Sourcery G++ includes the GNU

C and C++ compilers and the Eclipse™ IDE. Sourcery G++ for ARM supports TI processors with an ARM core, including the OMAP processor family, runs on GNU/Linux® and Windows® and targets GNU/Linux, µClinux™ or EABI (bare board) systems. Sourcery G++ Professional Edition features unlimited support from CodeSourcery’s expert engineers, and Personal Edition is affordably priced for individual and small development teams. TI sponsors the OMAP and DaVinci Linux communities that provide the option to participate in the latest kernel version development. An active community support mailing list is available through the OMAP Linux Community at linux.omap.com. MontaVista Linux For developers who prefer a Linux OS backed by a commercial support operation, TI also partners with MontaVista. MontaVista Professional Edition Linux provides tools for build, debug, profiling and analysis on the host coupled with a full set of hardened drivers and a rich complement of target-based software components. Windows Embedded CE Windows Embedded CE is a componentized, real-time operating system for a wide range of small footprint devices. Developers use Windows Embedded CE for a variety of smart, connected and service-oriented devices, ranging from power-conscious GPS handhelds to realtime, mission-critical industrial controllers.

DSP/BIOS is available royalty-free with the Code Composer Studio fullfunction evaluation tools. To order your CD-ROM, visit www.ti.com/freetools.

Embedded Processing Guide


OMAP35x support is available on Windows Embedded CE 6.0, along with Platform Builder, a Visual Studio 2005

51

Operating Systems

TI offers a Windows® CE DVSDK today for OMAP35x and TMS320DM644x processors.

Software and Development Tools plug-in, that provides an integrated development environment (IDE) that enables you to build both application and Windows Embedded CE 6.0 operating system software in a familiar environment while improving existing or creating new

embedded devices. Along with a portfolio of hundreds of carefully tested operating system components, the innovative tools and features help Windows Embedded CE 6.0 enhance performance, security features, compatibility and flexibility.

USB-Powered, Desktop-Performance and Community-Supported OMAP™ Development Platform You Cannot Afford to Miss The USB-powered Beagle Board is a lowcost, fan-less single-board computer that unleashes laptop-like performance and expandability without the bulk, expense or noise of typical desktop machines. The Beagle Board enables you to flesh out your innovative ideas in conjunction with a large and growing open source development community and utilizes expansion via a wide range of standard PC peripherals. When it becomes necessary to work with greater hardware customization capabilities or to utilize off-the-shelf software, look to the OMAP35x Evaluation Module from Texas Instruments (www.ti.com/omap35x). Specifications include: Hardware: • OMAP 3530 processor • ARM® Cortex™-A8 CPU • HD-capable C64x+™ CPU • 3-D graphics acceleration • 256-MB LPDDR RAM* • 256-MB NAND Flash memory • On-The-Go high-speed USB port • Host-only high-speed USB port* • 8-bit SD/MMC 6-in-1 connector • DVI-D out • S-video (TV) out • Stereo audio out/in • JTAG in-circuit emulation header

• USB/5-V power options • LCD*/serial expansion headers Software: • Bootloader • Diagnostic Linux kernel and tests • Library of open source projects** Applications of BeagleBoard: • Silent digital media center • Web browser (Firefox 3) • 3-D and open source gaming • Android-based appliances • Video codec development • Video teleconferencing • Thin clients • Low-power, low-cost desktop • Autonomous robots • Wearable computers • Digital signs or photo frames • Netbook development • Intelligent security cameras • Automotive vision and media • Software-defined radio • Home automation • And many more…! Hardware expansion: • 802.11b/g/n networking • 3G wireless modems • Web cameras • Analog I/O • HDTVs

• DLP® projectors • Much more… BeagleBoard.org BeagleBoard.org promotes and motivates Open Source software development on OMAP processor-based systems, with over 1,000 developers already participating. The key objectives are to: • Enable innovators and hobbyists to explore new domains and experiment with their ideas on an open platform • Enable such experiments to be conducted cost effectively and thereby nurture innovation • Provide a community collaboration point for OMAP processor platform developers

Go to beagleboard.org to order your Beagle Board (U.S. $149) today!

* New for Rev C. ** See more at beagleboard.org/project

Texas Instruments 3Q 2009

Embedded Processing Guide


52

Software and Development Tools

Multimedia Framework Products Algorithm Standards and Frameworks Standards for Algorithm Interoperability and Integration Get more information on algorithm standards and frameworks at: www.ti.com/frameworks

The xDAIS and xDM standards simplify integration of multiple algorithms into an application. Framework Components enable users to easily develop frameworks that can use xDAIScompliant algorithms. Codec Engine is a low-level framework that automates instantiation of xDAIS and xDMcompliant algorithms. • xDAIS and xDM • eXpressDSP™ Algorithm Interface Standard (xDAIS) • xDAIS for Digital Media (xDM) • Well-established standard first introduced in 1999 • Enhanced in 2006 to support DaVinci™ digital media API • Framework Components • Off-the-shelf modules for querying and allocating xDAIS algorithm memory and DMA resources • Codec Engine • Automated instantiation of xDAIS/xDM algorithms, including resource allocation • Transparent remote or local execution • Easily incorporated into higherlevel frameworks

TI's multimedia framework products include the xDAIS and xDM algorithm standards and the Codec Engine algorithm execution framework. eXpressDSP Algorithm Interoperabilty Standard (xDAIS) xDAIS and the eXpressDSP Digital Multimedia (xDM) standards leverage the ability of DSPs to perform a wide range of multimedia functions on a single device. xDAIS accelerates “time-to-revenue” by eliminating integration problems caused by algorithms having hard-coded access to system resources that must be shared with other algorithms. xDAIS forces an algorithm to let the application framework decide which resources to allocate. xDM specifies a standard API for the application to call a particular algorithm class, enabling an integrator to quickly change to an algorithm from a different source if different functionality or performance is required. The xDM standard defines APIs for several classes of codecs, including video decode/encode and audio encode/decode. eXpressDSP Framework Components For developers who wish to develop eXpressDSP-compliant frameworks, TI

provides low-level components (DSKT, DMAN3) that enable a framework to query xDAIS-compliant algorithms for their memory and DMA resources and then allocate them. Codec Engine Codec Engine is an algorithm execution framework that automates the invocation and instantiation of eXpressDSP-compliant algorithms. Codec Engine can execute in ARM®-only, ARM+DSP or DSP-only environments and supports concurrent execution of multiple channels and algorithms. Codec Engine is designed to be used in conjunction with higher layer frameworks or middleware that provide A/V synchronization, I/O and network services while calling Codec Engine for algorithmprocessing operations. This approach enables system providers to easily differentiate their applications. Codec Engine is currently available for Linux and Windows® CE on ARM-based devices and for DSP/BIOS™ kernel on DSPs. An important feature of Codec Engine is the consistent APIs that it provides across TI SoC and DSP devices, enabling scalable development for multiple TI devices and easier migration to new TI architectures.

Application Framework xDM IVIDDEC APIs MPEG-4 Decode IALG IDMA3

Query & Grant Memory and DMA, Resources

For further technical information or for no-charge downloads of multimedia framework products, go to www.ti.com/frameworks.

H.264 Decode IALG IDMA3

Codec Engine eXpressDSP Framework Components

Query & Grant Memory and DMA, Resources

Application Framework Embedded OS Drivers Memory

DSP

Use of xDAIS and xDM APIs enable easy integration of multiple algorithms into an application.

Texas Instruments 3Q 2009

Embedded Processing Guide


Software and Development Tools

53

eXpressDSP™ Digital Media Software

Digital Media Software Portfolio Encoders, Decoders, Codecs and Libraries Get more information about eXpressDSP Digital Media Software at: www.ti.com/digitalmediasoftware

eXpressDSP Digital Media Software is a set of production-tested encoders, decoders, codecs and libraries that address the most common mediaprocessing functions required by embedded product OEMs. Features and Benefits • High-quality encoding • Tested against PC-based reference encoders to within 0.5 dB PSNR at typical bit rates • Robust, error resilient decoding • Tested with ITU standard test streams and error streams • Application-specific libraries • Video analytics for security applications • Graphics for 2-D and 3-D video on DaVinci™ technology • All TI Digital Media Software is compliant to the xDM API and integrated with the DaVinci software infrastructure • TI Digital Media Software is available through the TI eStore at www.ti.com/codecbundles or through TI Authorized Software Providers (complete list can be found at www.ti.com/asp)

eXpressDSP Digital Media Software is production tested and optimized for TI DSP and SoC platforms. Instead of investing time and effort in standardized media encoders, decoders and libraries, OEMs are able to save years of development time and can focus development efforts on differentiating product features. eXpressDSP Digital Media Software is available for free evaluation on TI EVMs, and numerous flexible production licensing options exist to fit any development need.

Unlike example software or freeware, digital media software components all follow stringent coding guidelines. Each module includes a re-targetable production library featuring reentrant code. Each module is fully documented with a data sheet, release notes, user’s guide and usage examples. All digital media software is unit tested and system tested with thousands of test vectors in world-class testing labs. The encoders and decoders are hardened with a wide range of test vectors from end equipments and applications in which TI digital media software is deployed: wireless handsets, wireless networking equipment, video/IP phones, streaming media appliances, set-top boxes and video infrastructure to name just a few.

Visit www.ti.com/digitalmediasoftware to: • Evaluate or purchase digital media software for your TI DVEVM or DVDP board. • Learn more about flexible production licensing that allows for a range of pricing options based on project quantity • View published suggested resale pricing options.

Broad eXpressDSP Digital Media Software Portfolio Target Hardware Codecs

DM646x

DM644x

DM643x

DM648

DM3x

OMAP35x

    

        

    

   

 

  

 

 

 

  

  

    

  

    

Open Source

Open Source

Video & Imaging H.264 Video Dec H.264 Video Enc JPEG Imaging Dec JPEG Imaging Enc MPEG-2 Video Dec MPEG-2 Video Enc MPEG-4 Video Dec MPEG-4 Video Enc VC1 Video Dec

    

Audio AAC Audio Dec AAC Audio Enc MP3 Audio Dec MP3 Audio Enc WMA Audio Dec/Enc

  

Voice G.711 Dec/Enc

Other Network Developer Kit (NDK)

Request your free evaluation of TI digital media software at www.ti.com/requestfreesoftware.

Texas Instruments 3Q 2009

Embedded Processing Guide


54

Software and Development Tools

eXpressDSP™ Digital Media Software Authorized Software Providers Support TI Digital Media Software The TI Digital Media Software portfolio is a collection of optimized encoders, decoders, codecs and libraries licensed by TI and by TI Authorized Software Providers (ASPs) to customers worldwide. Each software component was developed by TI or by TI Developer Network members in

compliance with the xDAIS eXpressDSP algorithm interface standard and xDM extension for digital media, and each component is packaged for easy integration with DaVinci™ and eXpressDSP software framework building blocks. The entire portfolio is available with support

from highly qualified, trained ASPs, who can also offer additional software IP products or custom engineering services to enable rapid time to market for TI customers.

Authorized Software Providers by Region ASP ATEME eInfochips eSOL Ingenient Ittiam LogicPD MPC Data NSU SEED Electronic Tech. TES Electronic Solutions Wintech Digital

Americas     

 

China 

Region Japan 

 

  

Korea 

India

Asia – Other 

  

 

   

Customers have several entry points to designing with TI SoC and DSP processors, ranging from high-level frameworks and applications to low-level functions. The concept of multiple development entry points is also incorporated in eXpressDSP Digital Media Software, which enables a low-level entry point at the codec API layer and also allows higher-level entry points

Texas Instruments 3Q 2009

Europe  

 

through Codec Engine and application software built on it. Because all TI digital media software components have been tested and integrated with Codec Engine and the full DaVinci software infrastructure, mid-level entry points are fully enabled. Even higher-level entry points are possible via applications and operating systems built on the DaVinci software foundation;

some examples include Windows® CE with the DirectShow media framework and GStreamer for Linux. To request a free software evaluation, sign up for updates or ask questions, go to “Contact Me” at www.ti.com/requestfreesoftware.

Embedded Processing Guide


Software and Development Tools

55

eXpressDSP™ Software and Development Tools

Getting Started Integrated Development Environment, Codecs, Training and Kits

Code Composer Studio™ Integrated Development Environment Free Evaluation Tools • Supports TMS320C2000™, TMS320C5000™, TMS320C6000™, OMAP™ and DaVinci™ processors • 120-day full-featured trial • Online tutorials and multimedia feature demos show off key capabilities • Order CD-ROM online or download at www.ti.com/freetools. Evaluation Codecs • High-quality, production-tested encoders, decoders, codecs and other digital media software modules and algorithms • Free supported 60-day software evaluation • More information on digital media software, including a complete inventory, can be found at www.ti.com/digitalmediasoftware. Training • Workshops • Online training • View online at www.ti.com/training. Development Kits and Boards • DSP starter kits (DSKs) offer complete low-cost evaluator’s bundles including development tools and hardware • Evaluation modules (EVMs) include a wide range of TI and third-party development boards and production bundles • Development platforms combine production-ready, application-specific software and hardware in an easyto-use development environment for rapid prototyping • Daughter cards and plug-on modules compliment TI or third-party DSKs and development boards

Texas Instruments 3Q 2009

TI and members of the TI DSP Developer Network offer a wide range of hardware and software getting started kits and production-ready solutions to jump start new designs. These bundled solutions are an excellent way to evaluate TI processors, digital media codecs and test drive the eXpressDSP tools offering to begin application development. Many productionready bundles include full software licenses, production-ready software and standalone emulators to take an application into production. A wide selection of daughter cards is also available to add capability and new hardware features. Reference designs provide developers with hardware and software ready for rapid product implementation and deployment, for fully system tested end equipment applications. DSP Starter Kits Starting at just U.S. $395, Digital Signal Processing Starter Kits (DSKs) and eZdsp™ Starter Kits are a low-cost entry-level means of evaluating TI processor platforms and eXpressDSP development tools. TI, partnered with Spectrum Digital Inc., offers a variety of processor selections in each platform to let developers test algorithms, benchmark code and write simple programs to prove out designs and evaluate the processor architecture. The DSKs are bundled with a special Code Composer Studio (CCStudio) IDE that runs exclusively through the embedded emulation on the target board, so that developers can explore the rich feature set that CCStudio IDE has to offer. Nearly a dozen DSKs are available today for the TMS320C2000, TMS320C5000 and TMS320C6000 processor platforms.

DaVinci Development Tools/Kits Comprehensive ARM®/DSP system-level tooling helps developers jump start development of any digital video application. The DaVinci kits are designed to simplify development of digital video applications such as video phones, automotive infotainment, digital still cameras, streaming media, IP set-top boxes, video security systems and digital video products that have yet to be invented.(V&I Solns Tools) • Digital Video Development Platform (DVDP) includes both hardware and software to enable immediate evaluation of DaVinci DSP-based processors. Available today for both the TMS320DM648 and TMS320DM6437 digital media processors, the DVDP provides developers with a comprehensive platform that can be used throughout the entire design process. • Digital Video Evaluation Module (DVEVM), comprised of both hardware and software, enables developers to start instantaneous evaluation of DaVinci ARM9-based processors and begin building digital video applications. Available today on TMS320DM6446, TMS320DM355, TMS320DM357, TMS320DM365 and TMS320DM6467 digital media processors. Whether you are just starting a project and need to determine which processor best suits your application or beginning product design, TI’s Starter Kits, Development Platforms and Evaluation Modules offer developers bundled solutions designed to simplify and accelerate the application design process from concept through production.

Embedded Processing Guide


56

Software and Development Tools

eXpressDSP™ Software and Development Tools DaVinci™ Development Tools and Software Evaluation, Development and Production Kits Get more information on DaVinci development tools and software at: www.ti.com/davincitools

TI offers a wide range of development tools specifically for aiding DaVinci technology-based design. For a complete list, visit www.ti.com/davincitools. DaVinci ARM® and ARM+DSP Tools Evaluation and Development Production DM6446 DM355 DM6467 DVEVM DVEVM DVEVM MontaVista Pro U.S. $2,495 U.S. $495 U.S. $1,995 U.S. $8,995

DaVinci DSP Evaluation, Development and Production DM6437 DM648 DVDP DVDP U.S. $495 U.S. $1,295

Hardware DaVinci target board Video camera/LCD Power supply w/ US, EU and UK cables Connectivity cables Mass storage IR remote control On-board EMU

   

 

 

 

 

40-GB HDD

2-GB NAND Flash

40-GB HDD

 

Software Linux-based DVSDK DSP/BIOS™ kernel-based DVSDK MontaVista Linux Pro Third-party software demos and evals C64x+™ Linux code-generation tools Code Composer Studio™ IDE v3.3 VLIB Software Library†

Demo GHS MULTI® Eval

Demo

Demo

License Ittiam

Eval

Eval H/W version

Eval

†VLIB

demonstration requires the TMS320DM6437 Digital Video Development Platform (DVDP) based on DaVinci technology. For more information or to request access, go to www.ti.com/vlib.

Texas Instruments 3Q 2009

Embedded Processing Guide


Software and Development Tools

57

eXpressDSP™ Software and Development Tools

OMAP™ Development Tools and Software Evaluation, Development and Production Kits Get more information on OMAP development tools and software at: www.ti.com/omap35xtools Evaluation and Development

OMAP ARM®

OMAP3503 EVM U.S. $1,495

OMAP-L137 Starter Kit U.S. $395

  

  

64-MB mobile DDR SDRAM 128-MB NAND Flash

4-MB serial Flash 64-MB SDRAM

Production MontaVista Mobilinux for OMAP35x U.S. $26,985

MontaVista Pro for OMAP-L1x U.S. $8,995

Hardware OMAP target board Power supply with US, EU, and UK cables Connectivity cables Memory

Display with touch screen On-board emulation

Software TI platform support (SDK) TI DVSDK Linux BSP (kernel 2.6.22) WinCE BSP Third-party development tools (evaluation)** Code Composer Studio™ IDE (tied to hardware) MontaVista Pro 5 MontaVista Mobilinux production license

 *  * *

* *

 Demo

License

* Available through www.ti.com/omapsoftwareupdates with EVM registration ** Sourcery G++™ evaluation tools from CodeSourcery™ ARM RVDS Evaluation IDE and Microsoft Visual Studio Evaluation tools

DSP Development Tools Evaluation and Development Kits Get more information on DSP development tools and software at: www.ti.com/dspdevkits

DSP Starter Kits Part Number TMDSDSK6713 TMDSDSK6416-T TMDSDSK6455 TMDSDSK5416 TMDSDSK5510 TMDSDSK5509 TMDXEZ28044 TMDSEZD2407 TMDSEZD2812 TMDSEZS2812 TMDSEZS2808 TMDXEZ28335

Description TMS320C6713 DSP Starter Kit (DSK) TMS320C6416 DSP Starter Kit (DSK) TMS320C6455 DSP Starter Kit (DSK) TMS320C54x™ DSP Starter Kit (DSK) TMS320C55x™ DSP Starter Kit (DSK) TMS320C5509 DSP Starter Kit (DSK) TMS320F28044 eZdsp™ Starter Kit TMS320LF2407A eZdsp Starter Kit TMS320F2812 eZdsp Starter Kit F2812 eZdsp Starter Kit (Socketed) F2808 eZdsp Starter Kit (Socketed) TMS320F28335 eZdsp Starter Kit

Texas Instruments 3Q 2009

Embedded Processing Guide


58

Software and Development Tools

TI DSP Developer Network A Wide Variety of DSP Solutions Utilize the TI DSP Developer Network for: • Complete solutions – Members offer complete solutions for quickly solving application problems. Most solutions incorporate TI’s data converters, power management devices and other quality TI devices. • Reduced time to market – Timeconsuming programming and troubleshooting tasks can be eliminated by utilizing proven hardware, software, algorithms and libraries from members. • Lower costs – Don’t spend time and money recreating something that has already been produced. Members enable you to dedicate your resources to producing valueadded, application-specific products. • Additional expertise – Members provide consulting services, training, integration, contract engineering, research and development and much more. They are an extra resource to assist you with your product development efforts. eXpressDSP™-Compliant Products Texas Instruments, in conjunction with its industry-leading DSP Developer Network, offers an array of eXpressDSPcompliant algorithms designed to reduce system integration time and lower support and development costs by eliminating custom coding tasks. DSP Developer Network members also provide eXpressDSP-compliant plug-in tools to reduce development time.

TI DSP Developer Network Overview More than 200 independent DSP Developer Network members provide a vital link between TI silicon and the final application by providing additional hardware, algorithms and libraries, software tools and consulting services. Products/services include: • End-equipment solutions – Production-ready, DSP/SoC applicationspecific resources and collateral bundles, inclusive of block diagrams, application notes, tools, software and other full end-equipment solutionrelated information • Embedded software – Productiontested, application-targeted software components, optimized at the processorspecific level, for popular industry standards • Engineering services – DSP/SoC generation-specific hardware and software design, manufacturing and consulting services, ranging from boardlevel designs to full-turnkey support • Development tools – DSP/SoC generation-specific physical development of evaluation boards and kits, application-targeted companion chips and cards, and other development resources such as emulation tools,

Get additional information and search for Developer Network products and services at: www.ti.com/dspdevnetwork. reference designs, documentation and user’s guides DSP Developer Network Product Catalog on TI’s Website For information regarding the vast array of products available from TI’s DSP Developer Network, check out: www.ti.com/dspdevnetwork. Extensive information can be found through searchable listings of members located worldwide. Search hundreds of listings by company, device supported, keyword, product name or product category. DSP Developer Network Logo Indicates TMS320™ Processor-Based Solution Registered TI DSP Developer Network members use a distinctive DSP Developer Network logo on various printed and electronic collateral. Look for the logo to identify companies that are ready to provide a TMS320 processorbased solution. DSP Developer Network

Embedded Software • Operating systems • Codecs and algorithms • Application-specific libraries • Framework software • Drivers • Signal-processing libraries

Engineering Services • Digital hardware/board design • Software design services • Full turnkey design services • Analog/RF/Power designs • Manufacturing • Consulting

Development Tools • Compilers, assemblers, linkers • Evaluation modules and development boards • Debuggers • Emulators/Analyzers • Daughter cards • Free evaluation tools

End-Equipment Solutions • Video and imaging • Communications and telecom • Security • Wireless

Solutions to reduce development time

Texas Instruments 3Q 2009

Embedded Processing Guide


Software and Development Tools

59

TMDSCCSALL-1 TMDSCCS2000-1 SPRC119 TMDSEVM3530 TMDXOSKL137BET TMDSEVM355 TMDXEVM357 TMDXEVM365 TMDSEVM6446 TMDSEVM6467 TMDSVDP6437 TMDXDVP648 TMDXEVM6474 TMDXEVM6424 TMDXEVM6452 TMDXEVM6457 TMDSDSK6713 TMDSDSK6416-T TMDSDSK6455 TMDXEVM6455 TMDSEVM642 TMDSDMK642 TMDSPDK6727 TMDSPDB6727 TMDSDSK5416 TMDSDSK5510 TMDSDSK5509 TMDXEVM5505 TMDX28027USB TMDXDOCK28027 TMDSDOCK2808 TMDSDOCK28335 TMDXDOCK28343 TMDXDOCK28346-168 TMDSPREX28 TMDSDCDC2KIT TMDSDCDC8KIT TMDSACDCKIT TMDSRESDCKIT TMDSENRGYKIT TMDS1MTRPFCKIT TMDS2MTRPFCKIT TMDSEMU2000U TMDSEMU560PCI TMDSEMU560U TMDSEMU560T TMDSEMU510U

Code Composer Studio™ (CCStudio) IDE Development Tools Platinum Edition C2000 Code Composer Studio IDE Development Tools2 Code Composer Studio IDE Free Evaluation Tools OMAP35x Evaluation Module (EVM) OMAP-L137/TMS320C6747 Floating Point Starter Kit TMS320DM355 Digital Video Evaluation Module (DVEVM) TMS320DM357 Digital Video Evaluation Module (DVEVM) TMS320DM365 Digital Video Evaluation Module (DVEVM) TMS320DM644x Digital Video Evaluation Module (DVEVM) TMS320DM6467 Digital Video Evaluation Module (DVEVM) TMS320DM6437 Digital Video Development Platform (DVDP) TMS320DM648 Digital Video Development Platform (DVDP) TMS320C6474 Evaluation Module TMS320C6424 Evaluation Module TMS320C6452 Evaluation Module TMS320C6457 Evaluation Module TMS320C6713 DSP Starter Kit (DSK)4 TMS320C6416 DSP Starter Kit (DSK)4 TMS320C6455 DSP Starter Kit (DSK) TMS320C6455 Evaluation Module w/ sRIO4 TMS320DM642 Evaluation Module TMS320DM642 Digital Media Development Kit Pro Audio Development Kit (PADK) Pro Audio Development Kit (PADK) Bundle TMS320C54x™ DSP Starter Kit (DSK)4 TMS320C55x™ DSP Starter Kit (DSK)4 TMS320C5509A DSP Starter Kit (DSK)4 TMS320VC5505 Evaluation Module controlSTICK™ USB Evaluation Tool TMS320F28027 Experimenter’s Kit TMS320F2808 Experimenter’s Kit TMS320F28335 Experimenter’s Kit TMS320C28343 Experimenter’s Kit TMS320C28346 Experimenter’s Kit TMS320F28335 Peripheral Explorer Kit Digital Power Experimenter’s Kit Digital Power Developer’s Kit AC/DC Developer’s Kit Resonant DC/DC Developer’s Kit Renewable Energy Developer’s Kit Motor Control and PFC Developer’s Kit Dual Motor Control and PFC Developer’s Kit TMS320C2000 Blackhawk USB JTAG Emulator XDS560™ Blackhawk PCI-Bus High-Performance JTAG Emulator XDS560 Blackhawk USB High-Performance Emulator XDS560 USB Trace Emulator XDS510™-Class USB Plus JTAG Emulator (SDI)

An nu al Su bsc Co rip de tio Co n mp ose r Stu D dio Op SP/B ™ era IOS IDE tin ™ g S Re yst alem Tim T /Ke e Sta MS32 rne nd 0™ lS ard D erv ice De SP vel Alg s o pe orit Co r h ’ d sK m Co emp Ge it iler ner /As atio sem n T Tar ble ools ge tB r/L C/ oa ink C+ rd er + (Ha Sta r nd d w alo are ne ) Em On u bo l a tor ard Em Lin u l a ux DV tor SD K DS P/B IOS DV Pri SD ce $U K .S. 1

Too lD esc rip tio n

TI Pa rt N um be r

Embedded Processing Development Tools Feature Matrix

X X

X X2 L

X X2 L

X X X

X X2 L

3

3

X

X

3

X

X3 L X3 X3 X3 X3 X3 X3 X3 X3

X3 L X3 X3 X3 X3 X3 X3 X3 X3

X X X X X X X X X X

X3 L X3 X3 X3 X3 X3 X3 X3 X3

X

X

X

X

X

X

X X3 X3 X3 X3 X3 X3 X3 X3 X3 X3 X3 X3 X3 X3 X3 X3 X3 X3

X X3 X3 X3 X3 X X X X X X X X X X X X X X

X X X X

X X3 X3 X3 X3 X X X X X X X X X X X X X X

X

X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X

X5 X5 X X X X X X X

X X

X X X X X

X X X X X X X X

3,595 495 Free 1,495 395 495 895 595 2,495 1,995 495 1,295 1,995 495 1,295 1,995 415 495 595 1,795 1,995 6,495 1,495 5,995 395 395 495 395 39 79 89 99 159 189 179 229 325 695 229 349 369 399 299 2,995 2,999 9,995 1,595

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 2 C2000 target support only. DSP/BIOS kernel and C++ compiler are supported on C28x platform only. 4 Orderable part number will vary to specify European power cords 3 Code Composer Studio IDE is limited to use with the target hardware board ONLY. 5 Available at www.ti.com/omapsoftwareupdates with EVM registraiton X = included L = Full featured – Limited to 120 days

Texas Instruments 3Q 2009

Embedded Processing Guide


60

Embedded Processing Support Resources

Support Embedded Processing Support Design Answers at Your Fingertips Obtain additional information on training, technical documentation and more at: www.ti.com

Get to market easily and quickly by leveraging TI support. Customers can access fast and accurate support for their embedded applications. From Getting Started to technical documentation and much more, TI offers expanded technical support for DSP and MCU design and development 24/7. Online training, webcasts, workshops, MCU Day and TI Technology Days provide convenient training choices. Publications eTech Innovations eNewsletter Receive the latest digital signal processing news from TI including: DSP silicon, software, video/imaging systems applications and support information. Subscribe today for this free monthly eNewsletter to be delivered right to your inbox in html or text format. www.ti.com/etechdsg. My.TI.com Newsletter Receive a customized weekly e-Newsletter and choose the topics and stories that you want to read. Learn about the latest technology in audio, communications, control, security, systems, telecom, video/imaging and much more. www.ti.com/myti.

MCU NewsFlash From ultra-low power MSP430 MCUs and high-performance TMS320C2000™ realtime controllers, to 32-bit general-purpose ARM7-based MCUs, TI offers designers the broadest range of embedded control solutions, and provides you the latest MCU news updates via the MCU NewsFlash, published quarterly. Subscribe at www.ti.com/mcunewsflash. Motor Control Newsletter Get the latest information on motor-control solutions from TI – from the industry’s highest-performance optimized controllers to leading analog solutions designed specifically for motor-control applications. We’ll also update you on the latest hardware and software tools to help speed your designs to production. www.ti.com/mcnews.

TI Product Information Center (PIC) Worldwide technical support staff are available to answer questions and troubleshoot problems. Contact the PIC by e-mail or directly by phone. See the worldwide contact information inside the front cover for the e-mail and phone number appropriate to your area. www.ti.com/designsupport. Tech-Working: TI E2E Online Community

Interact with peers and engineers from TI to solve design problems via forums, find and share development tools in community groups or network as you might in your favorite social networking site. You can also log-in to find/follow friends, add favorites, comment, rate, change your avatar and/or receive updates via your personal feed. All while gaining valuable knowledge for your current or next design. e2e.ti.com.

Technical Documentation Find complete and easy-to-use data sheets, user’s guides and application reports for all TI DSP platforms and corresponding DSP software development tools. www.ti.com/techdocsdsg.

Texas Instruments 3Q 2009

Embedded Processing Guide


Getting Started with TI DSP

TI’s web-based “Getting Started” DSP support tool helps engineers get their designs from inspiration to implementation quickly and easily. Designers choosing to use TI DSPs in their real-time applications get easy-to-access introductory DSP content, thus decreasing the learning curve and speeding products to market. www.ti.com/gettingstarteddsg. Video Casts: Engineering in Front of the Camera TI provides a variety of quick videos, all under five minutes, showcasing the OMAP35x and DaVinci™ processors. These on-demand video casts feature complete platform information including hardware, software, system block diagrams and much more. • DM355 Video Casts – The DM355 video casts give engineers the technical meat on the DM355 processor and solutions. Topics include: Codec Engine, software, tools, an architectural overview and discussions on the future of video. www.ti.com/dm355videocasts.

Texas Instruments 3Q 2009

61

Support

DSP Support

Embedded Processing Support Resources • DM6467 Video Casts – View one or all of the DM6467 video casts for a look at why this DaVinci SoC is ideal for HD transcoding. TI experts discuss the future of transcoding, as well as the DM6467 processor, DVEVM and video surveillance. www.ti.com/dm6467videocasts. • OMAP35x Video Casts – Download the newest video casts discussing the benefits of the OMAP35x applications processor and the Open Source Community. www.ti.com/omap35xvideocasts. Podcasts The podcasts feature industry news, technology updates and practical tips regarding the latest innovations from TI in digital signal processing. Check out the archive at www.ti.com/podcasts. Blogs Check out the latest posts by TI DSP leaders. Interesting, enlightening and opinionated, they’ll give you insight into trends at TI and throughout the industry. See what they’re saying at www.ti.com/video360blogdsg. DSP Webcasts TI conducts free DSP webcasts to address topics most critical to designers. A typical webcast includes a presentation followed by a question & answer session with the technical engineering presenter specializing in the topic. After the live event, DSP, OMAP™ and DaVinci technology webcasts are available via the webcast archives. www.ti.com/webcasts.

Open Source Software TI sees open source as a means to drive innovation, ultimately enabling our customers to create market-leading devices that push the envelope with performance and advanced capabilities. TI participates in a number of open source industry initiatives such as the Open Handset Alliance, ARM®’s Mobile Linux Initiative, The Linux Foundation, GStreamer, Eclipse and Helix, among others. This site will serve to foster collaboration between TI and the open source community and provides a list of ongoing open source projects we support. opensource.ti.com. Embedded Processors Wiki The Embedded Processors Wiki provides a collaborative environment for digital media engineers using Texas Instruments processors to share technical tips and open source code. The Wiki is designed to get you to market faster by shortening the design knowledge ramp, assist other developers innovate and foster a growth of technology knowledge on hardware and software. www.ti.com/davinciwikidsg.

Microcontroller Support New Interactive MCU Selection Tool Try our new device selection tool to find the right microcontroller with all the features and functions you need. www.ti.com/mcutool. MCU Development Tools Learn more about the great selection of easy-to-use MCU development tools that add functionality and speed your design cycle. www.ti.com/msp430tools and www.ti.com/controlstick.

Embedded Processing Guide


62

Embedded Processing Support Resources

Support Training Resources Online Training • Webcast Library • One-Day Workshops • Multi-Day Workshops Get updated information on TI training resources at: www.ti.com/training

TI Technology Days TI Technology Days include technical design seminars that focus on the techniques of practical design applications illustrated along with technology exhibits.

The sessions include topics within multiple tracks on analog signal chain, digital signal processing, low-power RF, microcontrollers and power management. There are

also representatives available at various booths for dialog on specific TI products. www.ti.com/techdays2009.

self-paced, online training courses covering DSP, DaVinci™, MSP430, C2000™ and analog applications, easy-to-use software development tools and more.

Visit www.ti.com/onlinetrainingdsg for more FREE courses!

most critical to designers. Designed for 24/7 access worldwide via the Web, these webcasts typically last one hour. Each includes a presentation followed by a

Question & Answer session with the technical engineering presenter specializing in the topic. To access the library, visit www.ti.com/webcastsdsg.

One-day workshops are introductory courses designed to offer product or technology knowledge. These workshops include a significant hands-on section and are ideal introductions to get started with TI DSPs and MCUs. Visit www.ti.com/1dayworkshopsdsg for a complete list of courses.

TMS320F2808 eZdsp™ One-Day Workshop • Basic DSP controller implementation • TMS320F2808 controller architecture • How to use PC-based development tools – F2808 eZdsp and Code Composer Studio™ IDE • System design www.ti.com/f2808ezdsp1dwdsg.

C2000™ Piccolo™ One-Day Workshop • Overview of Piccolo F2802x devices • Basic system initialization • Peripheral set-up • Programming into Flash memory via Flash plug-in utility www.ti.com/eptraining.

TMS320DM6437 DaVinci Technology One-Day Workshop • In-depth look at the core device architecture of TMS320DM643x processors and an overview of the software infrastructure • Audio and video driver usage in DSP/BIOS™ kernel and Linux-based systems • Codec Engine framework • Capabilities of the DSP/BIOS™ kernel and Linux operating systems www.ti.com/dm64371dwdsg.

TMS320F28335 eZdsp™ One-Day Workshop • Basic digital signal controller implementation • TMS320F28335 controller architecture • How to use PC-based development tools – F28335 eZdsp and Code Composer Studio IDE • Peripheral programming and system design www.ti.com/eptraining.

Online Training A variety of free online training courses are available to you at your fingertips 24/7. Learn more about how to design your signal processing application with

DSP Webcast Library The library contains a variety of webcasts ranging from technical “How-Tos” to systems solution presentations and product overviews which address current topics

One-Day Workshops

Texas Instruments 3Q 2009

MSP430 One-Day Workshop • MSP430 introduction • MSP430 nuts and bolts • Ultra-low power concept • Analog peripherals • Timing and communication www.ti.com/eptraining.

Embedded Processing Guide


Embedded Processing Support Resources

63

Support

Multi-Day Workshops Three- or four-day, hands-on, advanced, educational courses are highly technical and designed for engineers who want to sharpen their design and development skills. Managed by TI’s technical training staff, these workshops include extensive hands-on labs emphasizing the demonstration and application of techniques and skills. TMS320DM644x DaVinci™ Technology Workshop • Introduction to DaVinci technology: device, software and tools • Application layer programming • Signal-processing layer programming • Advanced system programming details www.ti.com/dm644xmdwdsg. TMS320DM64x™ Video System Integration Workshop • TMS320DM642 hardware • Code Composer Studio™ IDE introduction • DSP/BIOS™ kernel introduction • Reference frameworks • Video basics • Video peripherals • Using and modifying the FVID driver • Optimizations • Audio • Communications www.ti.com/dm64xmdwdsg. TMS320C6000™ DSP Optimization Workshop • C6000™ DSP architecture and pipeline • Introduction to Code Composer Studio™ IDE using C programs • Optimizing code • Software pipelining techniques • Numerical issues with fixed-point processors • Writing high-speed interruptible code • Internal memory and cache www.ti.com/c6000optmdwdsg.

Texas Instruments 3Q 2009

TMS320C645x DSP System Integration Workshop • Architectural overview • Code Composer Studio IDE basics • Introduction to DSP/BIOS kernel • Basic memory setup, PLL, CSL 3.0 • Interrupts • EDMA 3.0 • Using the EMAC/NDK • Serial RapidIO® and MSGQ • Optimizing your code/system • System design considerations www.ti.com/c645xmdwdsg. TMS320C64x™/C67x™ DSP System Integration Workshop • Use Code Composer Studio Platinum Edition 3.1 IDE • Design a real-time double-buffered system • DSP/BIOS kernel scheduling • McBSP serial ports multi-channel features • EDMA´s advanced features • Evaluate and use C6000 boot loader • Setting up a bootable image in Flash ROM www.ti.com/c64xc67xmdwdsg.

TMS320C28x™ DSP Workshop • Architectural overview • Programming development environment • Peripheral register header files • Reset and interrupts system • Initialization analog-to-digital • Converter control peripherals • Numerical concepts and IQMath • Using DSP/BIOS kernel • System design communications www.ti.com/c28xmdwdsg. Digital Power Multi-Day Workshop • Introduction to digital power • Digital PSU and controller design using the C2000 controller • Digital compensator design • Running multiple stand-alone power supplies from Flash Registration To register for these workshops, please visit www.ti.com/multidayworkshopsdsg.

DSP/BIOS OS Design Workshop • Real-time system concepts • Work with software development tools provided by Code Composer Studio IDE and TMS320C6416 DSP • Software interrupts (SWI) • Multi-tasking • Communicating with tasks • Writing device drivers • Memory management/dynamic object creation capabilities www.ti.com/dspbiosmdwdsg.

Embedded Processing Guide


64

TI Embedded Processor Device Nomenclature

 Texas Instruments embedded processor device nomenclature includes a prefix (signifying the device qualification status), the device family number (i.e., 320 or 32 for TI DSPs), a technology symbol, the device number (typically three to five alpha-numeric characters), a two- or three-character package type code, an

optional temperature range character, and the device speed designation. Other variations do exist on a limited basis. See the specific device data sheet for additional information on device nomenclature for that device. For the most updated information, visit www.ti.com

Typical Digital Signal Processor Nomenclature TMS

320

DM

( )

6437

ZWT

( )

6

Prefix

Device Speed Range

TMX = Experimental device TMS = Qualified device

4 = 400 MHz 5 = 500 MHz 6 = 600 MHz

Device Family Temperature Range (Junction)

320 = TMS320™ DSP family

Blank Q R S

Technology DM = Digital media

Device

= = = =

0°C to 90°C, Commercial Grade –40°C to 125°C, Automotive Grade 0°C to 90°C, Commercial Grade (Tape and Reel) –40°C to 125°C, Automotive Grade (Tape and Reel)

Package Type

C64x+™ DSP: 6437 6435 6433 6431

ZWT = 361-pin plastic BGA, with Pb-Free soldered balls ZDU = 376-pin plastic BGA, with Pb-Free soldered balls (Green)

Silicon Revision Blank = Revision 1.3

Typical Applications Processor Nomenclature X

OMAP3530

B

CBB

Prefix

Package Type

X = Experimental device P = Prototype device null = Production device

CBB = 515-pin PGBA CUS = 423-pin PBGA

Device

Silicon Revision

TMS320C2000™ Microcontroller Nomenclature TMS320

F

28027

ZGM

A

Device Family

Temperature Range

TMS = TMS320™ MCU Family

A T S Q

Technology F = Flash EEPROM C = ROM

= = = =

–40°C to 85°C –40°C to 105°C –40°C to 125°C –40°C to 125°C (AEC-Q100)

Package Type Device Number 280x/281x/282x = Fixed-Point Series 2802x/2803x = Piccolo™ Series 283x = Delfino™ Floating-Point Series

MSP430 Part Number Nomenclature MSP 430 F G 4 6 19 I QZW

R

Prefix

Optional

MSP = Mixed-signal processor XMS = Experimental silicon

R = Tape & Reel

Device Family

Package

430 = 430 MCU platform

Memory Type

Temperature Range

F = Flash C = ROM P = OTP

I = –40°C to 85°C T = –40°C to 105°C

Optional: Special Function

Family

G = Medical E = E-Meter W = Water Meter

Memory size and Peripherals configuration

Optional: Special Function

Series of Similar Function

1xx 2xx

3xx 4xx

5xx

Texas Instruments 3Q 2009

Embedded Processing Guide


Complementary Products for the TMS320™ DSP Family

65

Linear and Logic Products

Analog Switch • Provide a high-speed bidirectional bus interface between DSPs, CPUs, industry standard buses, memory and peripherals. • TI’s analog switches are designed to pass (or isolate) analog signals (both voltage and current) and support analog applications such as audio and video data transmission. • TI’s TS product family encompasses a variety of analog switches with different ON resistances, bandwidth, charge injection and total harmonic distortion to target any application. Voltage Level Translation • Interfacing any low-voltage component with legacy, high-voltage devices. • Protects a DSP that has nonover-voltage tolerant inputs. • These dual-supply devices allow for bidirectional level translation between different voltage nodes from 1.2 V to 3.6 V and 1.65 V to 5.5 V. I/O Expansion • TI’s I2C I/O expanders allow system layout to be greatly simplified. • Two-wire bus reduces PCB complexity through trace reduction and routing simplification. Bus Interface Products • The LVC and ALVC families offer VCC fully specified to match the needs of the TMS320™ DSP family: 3.3 V, 2.5 V and 1.8 V. • Broad range of surface mount packaging options from SOIC to BGA. • Propagation delays of 3 ns and below. • Bus hold on data inputs decreases system component count by eliminating the need for external pull-up/ pull-down resistors.

Texas Instruments 3Q 2009

Analog Switches for TMS320 DSPs Device

Ron Ron Ron Flatness Mismatch V+ (V) (max) (max) (max) (min)

V+ (V) ON Time (max) (ns) (max)

OFF Time (ns) (max) Pins / Package

SPST TS5A3166 TS5A3167 TS5A4594 TS5A4595 TS5A4596 TS5A4597 TS5A1066

0.9 0.9 8 8 8 8 10

0.15 0.15 1.5 1.5 1.5 1.5 5

— — — — — — —

1.65 1.65 2.7 2.7 2.7 2.7 1.65

5.5 5.5 5.5 5.5 5.5 5.5 5.5

7 7 17 17 17 17 5.5

11.5 11.5 14 14 14 14 4.5

5/SC70, SOT-23, WCSP 5/SC70, SOT-23, WCSP 5/SC70, SOT-23 5/SC70, SOT-23 5/SC70, SOT-23 5/SC70, SOT-23 5/SC70, SOT-23, WCSP

0.9 0.9 0.9 10

0.25 0.25 0.4 5

0.1 0.1 0.05 1

1.65 1.65 1.65 1.65

5.5 5.5 3.6 5.5

7.5 7.5 14 5.8

11 11 9 3.6

8/US8, WCSP 8/US8, WCSP 8/MSOP 8/SM8, US8, WCSP

0.9

0.4

0.05

1.65

3.6

14

9

14/TSSOP

0.75 0.9 0.9 0.9

0.25 0.25 0.15 0.15

0.25 0.1 0.1 0.1

2.25 1.65 1.65 1.65

5.5 5.5 5.5 5.5

25 22 16 8

20 8 15 12.5

0.9

0.4

0.05

1.65

3.6

14

9

0.75 0.9 0.9 0.9 0.9 1.1 0.9 10 10 13.8

0.25 0.25 0.15 0.15 0.25 0.15 0.25 5 2 4.5

0.25 0.1 0.1 0.1 0.1 0.1 0.1 0.2 0.14 4.5

2.25 1.65 1.65 1.65 1.65 1.65 1.65 1.65 1.65 1.65

5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5

25 22 16 8 30 35 6 8.5 5 6.8

20 8 15 12.5 20 20 13 6.5 3.4 4.1

8/WCSP 6/SC70 8/US8, WCSP 8/US8, WCSP 6/SC70, SOT-23, WCSP 6/SC70, SOT-23 6/SC70, SOT-23 6/SC70, SOT-23, WCSP 6/SC70, SOT-23 8/SM8, US8

0.9 0.9 10

0.25 0.25 4(typ)

0.1 0.1 0.15 (typ)

1.65 1.65 1.65

5.5 5.5 5.5

13 5.5 5.7

8 10 3.8

10/MSOP, QFN 10/MSOP 10/MSOP, QFN

10

7

0.8

1.65

3.6

8

6.5

16/SOIC, SSOP (QSOP), TSSOP, TVSOP, QFN

1.65 1.65

5.5 5.5

21 6.5

10.5 3.7

8/US8 8/SM8, US8

2.3

3.6

9.5

3.5

16/SOIC, SSOP (QSOP), TSSOP, TVSOP, QFN

SPST x 2 TS5A23166 TS5A23167 TS3A4741 TS5A2066

SPST x 4 TS3A4751

SPDT TS5A6542 TS5A4624 TS5A3153 TS5A3154

8/WCSP 6/SC70 8/US8, WCSP 8/US8, WCSP

SPST x 4 TS3A4751

14/TSSOP

SPDT TS5A6542 TS5A4624 TS5A3153 TS5A3154 TS5A3159A TS5A3159 TS5A3160 TS5A3157 TS5A63157 TS5A2053

SPDT x 2 TS5A23159 TS5A23160 TS5A23157

SPDT x 4 TS3A5018

SP3T TS5A3359 TS5A3357

0.9 15

0.25 0.1 6.5 (typ) 0.1 (typ)

SP4T x 2 TS3A5017

12

9

2

Embedded Processing Guide


66

Complementary Products for the TMS320™ DSP Family

Linear and Logic Products Design Considerations Supply voltages continue to migrate to lower nodes to support today’s low-power, high-performance applications. While some devices are capable of running at lower supply nodes, others might not have this capability. To have switching capability between these devices, the output of each driver must be compliant with the input of the receiver that it is driving. Why use a voltage-level translator? • Easily interface between subsystems operating with different supply voltages

• Provide migration paths from old architectures to new architectures For two devices to have switching capability: • VOH of the driver must be greater than the VIH of the receiver • VOL of the driver must be less than the VIL of the receiver • The output voltage from the driver must not exceed the I/O voltage tolerance of the receiver

VCCA*

ASIC

VCCB* TI Level Translation Solution

I/O Devices

*VCCA not equal to VCCB

Typical situation in which a level translator is needed.

Voltage-Level Translation Single-Supply Translators Device SN74AUP1T57 SN74AUP1T58 SN74AUP1T97 SN74AUP1T98

Bits 3 3 3 3

Trans Low (V) 2.5 2.5 2.5 2.5

Trans High (V) 3.3 3.3 3.3 3.3

VCC (V) 2.3–3.6 2.3–3.6 2.3–3.6 2.3–3.6

DIR Pins No No No No

Bus Hold No No No No

OE Pins No No No No

tpd (max) (ns) 6.2 6.2 6.2 6.2

Dual-Supply Translators Device TXB0101 TXB0102 TXB0104 TXB0104-Q1 TXB0106 TXB0108 TXS0101 TXS0102 TXS0104E TXS0108E SN74AVC1T45 SN74AVC2T45 SN74AVCH1T45 SN74AVCH2T45 SN74AVC2T245 SN74AVC4T245 SN74AVC8T245 SN74AVC16T245 SN74AVC20T245 SN74AVC24T245 SN74AVC32T245 SN74AVCH4T245 SN74AVCH8T245 SN74AVCH16T245 SN74AVCH20T245 SN74AVCH24T245 SN74AVCH32T245 SN74AVC4T774 SN74LVC1T45 SN74LVC2T45 SN74LVC8T245 SN74LVCH8T245 SN74LVC16T245 SN74LVCH16T245

Bits 1 2 4 4 6 8 1 2 4 8 1 2 1 2 2 4 8 16 20 24 32 4 8 16 20 24 32 4 1 2 8 8 16 16

Texas Instruments 3Q 2009

Trans Low (V) 1.2 1.2 1.2 1.2 1.2 1.2 1.8 1.8 1.8 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.8 1.8 1.8 1.8 1.8 1.8

Trans High (V) 5 5 5 5 5 5 5 5 5 5 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 5 5 5 5 5 5

VCCA (V) 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.65 to 3.6 1.65 to 3.6 1.65 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.65 to 5.5 1.65 to 5.5 1.65 to 5.5 1.65 to 5.5 1.65 to 5.5 1.65 to 5.5

VCCB (V) 1.65 to 5.5 1.65 to 5.5 1.65 to 5.5 1.65 to 5.5 1.65 to 5.5 1.65 to 5.5 2.3 to 5.5 2.3 to 5.5 2.3 to 5.5 1.65 to 5.5 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.2 to 3.6 1.65 to 5.5 1.65 to 5.5 1.65 to 5.5 1.65 to 5.5 1.65 to 5.5 1.65 to 5.5

DIR Pins Auto Auto Auto Auto Auto Auto Auto Auto Auto Auto 1 1 1 1 2 2 1 2 2 6 4 2 1 2 2 6 4 4 1 1 1 1 2 2

Bus Hold No No No No No No No No No No No No Yes Yes No No No No No No No Yes Yes Yes Yes Yes Yes No No No No Yes No Yes

OE Pins 1 1 1 1 1 1 1 1 1 1 No No No No 1 2 1 2 2 6 4 2 1 2 2 6 4 1 No No 1 1 2 2

tpd (max) (ns) 4.5 4.5 4 7 4 4 7.5 4.6 4.6 4.8 2.8 2.4 2.8 2.4 2.4 2.9 2.5 2.7 2.9 2.7 2.7 2.9 2.5 2.7 2.9 2.7 2.7 2.4 3.9 3.9 4.2 4.2 4.2 4.2

Embedded Processing Guide


Complementary Products for the TMS320™ DSP Family

67

Linear and Logic Products

Low-Voltage I /O Expanders Selection Guide Device TCA6408A TCA6416A

Max Frequency (kHz) 400 400

I 2C Address 0100 00x 0100 00x

VCC Range (V) 1.65 to 5.5 1.65 to 5.5

Bit or Channel Width 8-bit 16-bit

Low Power  

Interrupt  

Additional Features Configuration Reset Registers    

5-V-Tolerant I/O  

I/O Type PushOpenPull Drain  

Preview products are listed in bold blue.

I /O Expanders Selection Guide Device PCA9536 PCA6107 PCA9534 PCA9534A PCA9538 PCA9554A PCA9554 PCA9557 PCA9535 PCA9539 PCA9555 PCF8574 PCF8574A PCF8575 PCF8575C

Max Frequency (kHz) 400 400 400 400 400 400 400 400 400 400 400 100 100 400 400

I 2C Address 1000 001 0011 xxx 0100 xxx 0111 xxx 1110 0xx 0111 xxx 0100 xxx 0011 xxx 0100 xxx 1110 1xx 0100 xxx 0100 xxx 0111 xxx 0100 xxx 0100 xxx

Texas Instruments 3Q 2009

VCC Range (V) 2.3 to 5.5 2.3 to 5.5 2.3 to 5.5 2.3 to 5.5 2.3 to 5.5 2.3 to 5.5 2.3 to 5.5 2.3 to 5.5 2.3 to 5.5 2.3 to 5.5 2.3 to 5.5 2.5 to 6.0 2.5 to 6.0 2.5 to 5.5 4.5 to 5.5

Bit or Channel Width 4-bit 8-bit 8-bit 8-bit 8-bit 8-bit 8-bit 8-bit 16-bit 16-bit 16-bit 8-bit 8-bit 16-bit 16-bit

Low Power    

  

Interrupt             

Additional Features Configuration Reset Registers               

5-V-Tolerant I/O           

I/O Type PushOpenPull Drain                 

Embedded Processing Guide


68

Complementary Products for the TMS320™ DSP Family

Linear and Logic Products

LED Driver Selection Guide Device TCA6507

Max Frequency (kHz) 400

I 2C Address 100 0101

VCC Range (V) 1.65 to 3.6

Bit or Channel Width 7-channel

Additional Features No. of Enable Dimming and Brightness PWMs Interrupt Pin Control Registers 2  

5-V Tolerant I/O 

I/O Type Push- OpenPull Drain 

Bus Interface for TMS320 DSPs Device SN74ALVC16244A SN74ALVCH16244 SN74ALVCH16245 SN74ALVCH16373 SN74ALVCH16374 SN74ALVC16835 SN74ALVCH16835 SN74ALVCH162244 SN74ALVCH162374 SN74ALVC162835 SN74ALVCH162835 SN74LVC16244A SN74LVCH16244A SN74LVC16245A SN74LVCH16245A SN74LVC16373A SN74LVCH16373A SN74LVC16374A SN74LVCH16374A

Description 16-bit buffer/driver with 3-state outputs 16-bit buffer/driver with 3-state outputs 16-bit bus transceiver with 3-state outputs 16-bit transparent D-type latch with 3-state outputs 16-bit edge-triggered D-type flip-flop with 3-state outputs 18-bit Universal Bus driver with 3-state outputs 18-bit Universal Bus driver with 3-state outputs 16-bit buffer/driver with 3-state outputs 16-bit edge-triggered D-type flip-flop with 3-state outputs 18-bit Universal Bus driver with 3-state outputs 18-bit Universal Bus driver with 3-state outputs 16-bit buffer/driver with 3-state outputs 16-bit buffer/driver with 3-state outputs 16-bit bus transceiver with 3-state outputs 16-bit bus transceiver with 3-state outputs 16-bit transparent D-type latch with 3-state outputs 16-bit transparent D-type latch with 3-state outputs 16-bit edge-triggered D-type flip-flop with 3-state outputs 16-bit edge-triggered D-type flip-flop with 3-state outputs

Little Logic • Ability to place a single gate in critical locations provides for simplified routing and board space savings • Single gates also provide easy state change for control inputs • The NanoStar™ package provides the industry’s smallest logic package

Texas Instruments 3Q 2009

Supply Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V

tpd max (ns) 3 3 3 3.6 4.2 3.6 3.6 4.2 4.6 4.2 4.2 4.1 4.1 4 4 4.2 4.2 4.5 4.5

Package (Number of Pins) TSSOP, SSOP(48) / VFBGA(56) TSSOP, TVSOP, SSOP(48) / VFBGA(56) TSSOP, TVSOP, SSOP(48) / VFBGA(56) TSSOP, SSOP(48) / VFBGA(56) TSSOP, SSOP(48) / VFBGA(56) TSSOP, TVSOP, SSOP, VFBGA(56) TSSOP, TVSOP, SSOP, VFBGA(56) TSSOP, SSOP(48) TSSOP, SSOP(48) TSSOP, TVSOP, SSOP(56) TSSOP, TVSOP, SSOP(56) TSSOP, TVSOP, SSOP(48) / VFBGA(56) TSSOP, TVSOP, SSOP(48) / VFBGA(56) TSSOP, TVSOP, SSOP(48) / VFBGA(56) TSSOP, TVSOP, SSOP(48) / VFBGA(56) TSSOP, TVSOP, SSOP(48) / VFBGA(56) TSSOP, TVSOP, SSOP(48) / VFBGA(56) TSSOP, TVSOP, SSOP(48) / VFBGA(56) TSSOP, TVSOP, SSOP(48) / VFBGA(56)

Little Logic for TMS320 DSPs Device SN74AUC1G00 SN74AUC1G04 SN74AUC1G07 SN74AUC1G08 SN74AUC1G14 SN74AUC1G32 SN74AUC1G79 SN74AUC1G125 SN74AUP1G08 SN74AUP1G57 SN74AUP1G58 SN74AUP1G97 SN74AUP1G98

Description Single 2-input positive-NAND gate Single inverter gate Single buffer/driver with open-drain output Single 2-input positive-AND gate Single Schmitt-Trigger inverter Single 2-input positive-OR gate Single positive-edge-triggered D-type flip-flop Single bus buffer gate with 3-state output Low-power single 2-input positive-AND gate Low-power configurable multiple-function gate Low-power configurable multiple-function gate Low-power configurable multiple-function gate Low-power configurable multiple-function gate

Supply Voltage 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V

tpd max (ns) 2.5 2.5 2.5 2.5 2.8 2.5 1.9 2.5 4.2 5.3 5.3 5.3 5.3

Package (Number of Pins) SOT, DSBGA (5) SOT, DSBGA (5) SOT, DSBGA (5) SOT, DSBGA (5) SOT, DSBGA (5) SOT, DSBGA (5) SOT, DSBGA (5) SOT (5), DSBGA (5) SOT (5), DSBGA (5) SOT (6), DSBGA (6) SOT (6), DSBGA (6) SOT (6), DSBGA (6) SOT (6), DSBGA (6)

Embedded Processing Guide


Complementary Products for the TMS320™ DSP Family

Device

Data Converters Plug-In for Texas Instruments Code Composer Studio™ IDE TI’s Data Converter Plug-In (DCP) is a free development tool that allows the creation of initialization data and configuration software for TI data converters from within the Integrated Development Environment (IDE) of Code Composer Studio. It provides easy-to-use windows for “point-andclick” data converter configuration from within the IDE, preventing illegal combinations of settings. The DCP dialog allows the user to select all the different settings for the data converter from a single screen and to automatically generate the interface software with a single mouse click. The generated well-documented C-source files contain all functions necessary to talk to the external data converter and to set up all of the registers internal to this device. The minimum function set includes read/write functions (single words and blocks of data), initialization functions and data structures and some device-specific functions like power down.

Description

Data Converters

69

C28x™ DSP C54x™ DSP C55x™ DSP C67x™ DSP C64x™ DSP

ADCs ADS1216 ADS1217 ADS1218 ADS1240 ADS1241 ADS1246 ADS1247 ADS1248 ADS1251 ADS1252 ADS1253 ADS1254 ADS1256 ADS1258 ADS1271 ADS1274 ADS1278 ADS1601 ADS1602 ADS1605 ADS1606 ADS1610 ADS1625 ADS1626 ADS7804 ADS7805 ADS7816 ADS7817 ADS7818 ADS7822 ADS7826 ADS7827 ADS7829 ADS7834 ADS7835 ADS7841 ADS7861 ADS7864 ADS7881 ADS7886 ADS7891 ADS8320 ADS8321 ADS8322 ADS8323 ADS8324 ADS8325 ADS8328 ADS8330 ADS8361 ADS8364 ADS8370 ADS8371

The generated code is to a great extent hardware independent, so it can be used together with the analog evaluation modules (EVMs) from our modular EVM system, our DSP Starter Kits (DSKs) or with your own custom board. To download your free 3.5 version of the Data Converter Plug-In for Code Composer Studio IDE, please go to www.ti.com/dcplug-in. New devices are added to the tool on a regular basis. For More Information For additional information on TI data converters, visit www.ti.com/dataconverters.

24-bit, 8-ch, 0.78kSPS, 5 V 24-bit, 8-ch, 0.78kSPS, 3.3 V 24-bit, 8-ch, 0.78kSPS, with flash 24-bit, 4-ch, 15SPS 24-bit, 8-ch, 15SPS 24-bit, 1-ch (diff), 2kSPS 24-bit, 2-ch (diff), 2kSPS 24-bit, 4-ch (diff), 2kSPS 24-bit, 1-ch (diff), 20kSPS 24-bit, 1-ch (diff), 40kSPS 24-bit, 4-ch (diff), 20kSPS, 1.8–3.6 V 24-bit, 4-ch (diff), 40kSPS, 5 V 24-bit, 8-ch, 30kSPS, very low noise 24-bit, 16-ch, 125kSPS, fast channel cycling 24-bit, 1-ch, 105kSPS 24-bit, 4-ch, 128kSPS, simultaneous sampling 24-bit, 8-ch, 128kSPS, simultaneous sampling 16-bit, 1-ch, 1.25MSPS 16-bit, 1-ch, 2.5MSPS 16-bit, 1-ch (diff), 5MSPS, 3.3-V I/O, 5-V analog 16-bit, 1-ch (diff), 5MSPS, 16-word FIFO 16-bit, 1-ch (diff), 10MSPS, 3.3-V I/O, 5-V analog 18-bit, 1-ch (diff), 1.25MSPS, 3.3-V I/O, 5-V analog 18-bit, 1-ch (diff), 1.25MSPS, 16-word FIFO 12-bit, 1-ch, 100kSPS, ±10-V input range 16-bit, 1-ch, 100kSPS, ±10-V input range 12-bit, 1-ch, 200kSPS 12-bit, 1-ch, 200kSPS 12-bit, 1-ch, 500kSPS 12-bit, 1-ch, 200kSPS 10-bit, 1-ch, 200kSPS 8-bit, 1-ch, 250kSPS 12-bit, 1-ch, 125kSPS, 2.7 V, microPower 12-bit, 1-ch, 500kSPS 12-bit, 1-ch, 500kSPS 12-bit, 4-ch, 200kSPS 12-bit, 2+2-ch, 500kSPS, simultaneous sampling 12-bit, 3×2-chs, 500kSPS, simultaneous sampling 12-bit, 1-ch, 4MSPS, int. reference 12-bit, 1-ch, 1MSPS 14-bit, 1-ch, 3MSPS, int. reference 16-bit, 1-ch, 100kSPS, 2.7–5.25 V 16-bit, 1-ch, 100kSPS, 4.75–5.25 V 16-bit, 1-ch (diff), 500kSPS, 5 V 16-bit, 1-ch (diff), 500kSPS, 5 V 14-bit, 1-ch, 50kSPS, 1.8–3.6 V 16-bit, 1-ch, 100kSPS , 2.7–5.5 V 16-bit, 2-ch, 500kSPS 16-bit, 2-ch, 1MSPS 16-bit, 2+2-ch, 500kSPS, simultaneous sampling 16-bit, 6-ch, 250kSPS 16-bit, 1-ch, 600kSPS, unipolar pseudo diff, int. ref. 16-bit, 1-ch, 750kSPS, unipolar input micro power

— — — — — — — — — — — — — — — — — — — — — — — — X X — — — — — — X — — — X — — X — — — — — — — — — X — — —

X X X X X — — — X X X X — — — — — — — — — — — — — — — — — — — — — — — X1 X — — — — — — — — X X — — X — — —

X X X — — X1 X1 X1 X X — — X1 X1 — X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X — X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X X1 X1 X1

X X X X X X1 X1 X1 X X X X X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X X1 X1 X1

— — — — — X1 X1 X1 — — — — X1 X1 — X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X X1 X1 X1

1

Includes DMA support. New devices are listed in bold red. NOTE: An X indicates that the data converter plug-in generates the interface software for the specified TMS320 DSP generation, which not only configures the data converter, but also the DSP peripheral the device is connected to (e.g., the serial port or the memory interface). If no X is present, only the register settings, but no interface functions, are generated.

Texas Instruments 3Q 2009

Embedded Processing Guide


70

Complementary Products for the TMS320™ DSP Family

Data Converters Device

Description

C28x™ DSP

C54x™ DSP

C55x™ DSP

C67x™ DSP

C64x™ DSP

— — — — — X X X X — — — — — — X X — — — X — X — X — X — — — — — — — — — — — — — — — — — — — — — — — — — —

— — — — — — — — — — — — — — — — — X X — X — X — X — X — — — — — — — — X X — X — X X X X X X X X X X X X X

X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X X — X1 — X1 — X1 — X1 — — — — — — — — — — — — — — — — — — — — — — — — — —

X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 — X1 — X1 — X1 — — — — — — — — — — — — — — — X — X — — — X X X X X

X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 — X1 — X1 — X1 — X1 — — — — — — — — — — — — — — — — — — — — — — — — — —

ADCs (Continued) ADS8372 ADS8380 ADS8381 ADS8382 ADS8383 ADS8401 ADS8402 ADS8405 ADS8406 ADS8411 ADS8412 ADS8422 ADS8472 ADS8481 ADS8482 ADS8504 ADS8505 PCM1804 PCM4202 PCM4204 THS10064 THS1007 THS10082 THS1009 THS1206 THS1207 THS12082 THS1209 THS1401 THS1403 THS1408 THS14F01 THS14F03 TLC1514 TLC1518 TLC2551 TLC2552 TLC2554 TLC2555 TLC2558 TLC2574 TLC2578 TLC3541 TLC3544 TLC3545 TLC3548 TLC3574 TLC3578 TLC4541 TLC4545 TLV1504 TLV1508 TLV1570

16-bit, 1-ch (diff), 600kSPS, pseudo bipolar, int. ref. 18-bit, 1-ch, 600kSPS, unipolar pseudo diff, int. ref. 18-bit, 1-ch, 580kSPS 18-bit, 1-ch (diff), 600kSPS, pseudo bipolar, int. ref. 18-bit, 1-ch, 500kSPS 16-bit, 1-ch, 1.25MSPS, unipolar input 16-bit, 1-ch, 1.25MSPS, bipolar input 16-bit, 1-ch, 1.25MSPS, unipolar input 16-bit, 1-ch, 1.25MSPS, bipolar input 16-bit, 1-ch, 2MSPS, unipolar input 16-bit, 1-ch, 2MSPS, bipolar input 16-bit, 1-ch, 4MSPS, pseudo-bipolar, differential input 16-bit, 1-ch, 1MSPS, pseudo-bipolar, differential input 16-bit, 1-ch, 1MSPS, pseudo-differential, unipolar input 16-bit, 1-ch, 1MSPS, pseudo-biploar, fully differential input 12-bit, 1-ch, 250kSPS, ±10-V input range 16-bit, 1-ch, 250kSPS, ±10-V input range 24-bit, stereo, 192kHz, audio ADC 24-bit, stereo, 192kHz, audio ADC 24-bit, 4-ch, 216kHz, audio ADC 10-bit, 4-ch, 6MSPS, 16-word FIFO 10-bit, 4-ch, 8MSPS 10-bit, 2-ch, 8MSPS, 16-word FIFO 10-bit, 2-ch, 8MSPS 12-bit, 4-ch, 6MSPS, 16-word FIFO 12-bit, 4-ch, 8MSPS 12-bit, 2-ch, 8MSPS, 16-word FIFO 12-bit, 2-ch, 8MSPS 14-bit, 1-ch, 1MSPS 14-bit, 1-ch, 3MSPS 14-bit, 1-ch, 8MSPS 14-bit, 1-ch, 1MSPS, 32-word FIFO 14-bit, 1-ch, 3MSPS, 32-word FIFO 10-bit, 4-ch, 400kSPS 10-bit, 8-ch, 400kSPS 12-bit, 1-ch, 400kSPS, 5 V 12-bit, 2-ch, 175kSPS, 5 V 12-bit, 4-ch, 400kSPS 12-bit, 1-ch, 175kSPS, 5 V 12-bit, 8-ch, 400kSPS 12-bit, 4-ch, 200kSPS, 5 V 12-bit, 8-ch, 200kSPS, 5 V 14-bit, 1-ch, 200kSPS, 5V 14-bit, 4-ch, 200kSPS, 5 V 14-bit, 1-ch (diff), 200kSPS, 5 V 14-bit, 8-ch, 200kSPS, 5 V 14-bit, 4-ch, 200kSPS, 5 V 14-bit, 8-ch, 200kSPS, 5 V 16-bit, 1-ch, 200kSPS, 5 V 16-bit, 1-ch (diff), 200kSPS, 5 V 10-bit, 4-ch, 200kSPS 10-bit, 8-ch, 200kSPS 10-bit, 8-ch, 1.25MSPS

1

Includes DMA support. New devices are listed in bold red. NOTE: An X indicates that the data converter plug-in generates the interface software for the specified TMS320 DSP generation, which not only configures the data converter, but also the DSP peripheral the device is connected to (e.g., the serial port or the memory interface). If no X is present, only the register settings, but no interface functions, are generated.

Texas Instruments 3Q 2009

Embedded Processing Guide


71

Data Converters

Device

Complementary Products for the TMS320™ DSP Family

Description

C28x™ DSP

C54x™ DSP

C55x™ DSP

C67x™ DSP

C64x™ DSP

— — — — — — — — X X

X X X X X X X X X X

— — — — — — — — X X

X1 — X1 — — X1 — X1 X X

— — — — — — — — X X

ADCs (Continued) TLV1571 TLV1572 TLV1578 TLV2541 TLV2542 TLV2544 TLV2545 TLV2548 TLV2553 TLV2556

10-bit, 1-ch, 1.25MSPS 10-bit, 1-ch, 1.25MSPS, 2.5–5.5 V 10-bit, 8-ch, 1.25MSPS 12-bit, 1-ch, 200kSPS, 2.7–5.5 V 12-bit, 2-ch, 140–200kSPS, 2.7–5.5 V 12-bit, 4-ch, 200kSPS 12-bit, 1-ch, 140-200kSPS, 2.7–5.5 V 12-bit, 8-ch, 200kSPS 12-bit, 11-ch, 200kSPS , 2.7–5 V 12-bit, 11-ch, 200kSPS, 2.7–5V, int. reference

1 Includes DMA support. NOTE: An X indicates that the data converter plug-in generates the interface software for the specified TMS320 DSP generation, which not only configures the data converter, but also the DSP peripheral the device is connected to (e.g., the serial port or the memory interface). If no X is present, only the register settings, but no interface functions, are generated.

Device

Description

C28x™ DSP

C54x™ DSP

C55x™ DSP

C67x™ DSP

C64x™ DSP

— — — — X X X X X X X X X X X — X — — — — — — — — — — — — — — — — — — — — — —

— — — — — — X1 X X X X — — — X — — — X — — X — — — X X X X X X X — — — — X X X

— — — — X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 — — — — — — — — — — — — — — — — — — — — —

— — — — X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X2 — — X2 — — — X2 X2 X2 X2 X2 X2 X2 — — — — X2 X2 X2

— — — — X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 X1 — — — — — — — — — — — — — — — — — — — — —

DACs DAC1220 DAC1221 DAC7512 DAC7513 DAC7551 DAC7552 DAC7554 DAC8501 DAC8531 DAC8532 DAC8534 DAC8551 DAC8552 DAC8554 DAC8560 DAC8580 DAC8581 DAC8814 TLC5618A TLV320DAC23 TLV5604 TLV5606 TLV5608 TLV5610 TLV5614 TLV5616 TLV5617A TLV5618A TLV5623 TLV5624 TLV5625 TLV5626 TLV5629 TLV5630 TLV5631 TLV5632 TLV5636 TLV5637 TLV5638 1

16-bit, 1-ch, 2 ms 16-bit, 1-ch, 2 ms 12-bit, 1-ch, 10µs, 2.7–5.5 V, int. reference 12-bit, 1-ch, 10µs, 2.7–5.5 V 12-bit, 1-ch, 5µs, ultra-low glitch 12-bit, 2-ch, 5µs, ultra-low glitch 12-bit, 4-ch, 5µs, 2.7–5.5 V 16-bit, 1-ch, 10µs, 2.7–5.5 V, MDAC 16-bit, 1-ch, 10µs, 2.7–5.5 V 16-bit, 2-ch, 10µs, 2.7–5.5 V 16-bit, 4-ch, 10µs, 2.7–5.5 V 16-bit, 1-ch, 5µs, ultra-low glitch 16-bit, 2-ch, 10µs, ultra-low glitch 16-bit, 4-ch, 10µs, ultra-low glitch 16-bit, 1-ch, 200kSPS 16-bit, 1-ch, 1µs 16-bit, 1-ch, 3MSPS, voltage output 16-bit, 4-ch, 2MSPS 12-bit, 2-ch, 2.5µs, 5 V 24-bit, stereo, 96kHz, audio DAC 10-bit, 4-ch, 3µs, 2.7–5.5 V 10-bit, 1-ch, 3µs, 2.7–5.5 V 10-bit, 8-ch, 1µs, 2.7–5.5 V 12-bit, 8-ch, 1µs, 2.7–5.5 V 12-bit, 4-ch, 3µs, 2.7–5.5 V 12-bit, 1-ch, 3µs, 2.7–5.5 V 10-bit, 2-ch, 2.5µs, 2.7–5.5 V 12-bit, 2-ch, 2.5µs, 2.7–5.5 V 8-bit, 1-ch, 3µs, 2.7–5.5 V 8-bit, 1-ch, 1µs, 2.7–5.5 V, int. reference 8-bit, 2-ch, 2.5µs, 2.7–5.5 V 8-bit, 2-ch, 1µs, 2.7–5.5 V, int. reference 8-bit, 8-ch, 1µs, 2.7–5.5 V 12-bit, 8-ch, 1µs, 2.7–5.5 V, int. reference 10-bit, 8-ch, 1µs, 2.7–5.5 V, int. reference 8-bit, 8-ch, 1µs, 2.7–5.5 V 12-bit, 1-ch, 1µs, 2.7–5.5 V, int. reference 10-bit, 2-ch, 1µs, 2.7–5.5 V, int. reference 12-bit, 2-ch, 1µs, 2.7–5.5 V, int. reference

Includes DMA support. DACs share the same driver. Result data may need to be masked.

New devices are listed in bold red.

2 These

Texas Instruments 3Q 2009

Embedded Processing Guide


72

Complementary Products for the TMS320™ DSP Family

Audio Converters and Controllers

Audio ADCs

www.ti.com/adc

Portable Focus

Dynamic Range (dB)

No. of Inputs/ No. of Outputs

Sampling Rate (kHz) (max)

Audio Data Format

Power Supply (V)

Package(s)

Price1

+3.3 and +4

TQFP-48

14.95

+3.3 and +4 +3.3 and +5

TQFP-48 TQFP-64

9.95 7.95

+3.3 and +5 +3.3 and +5

SSOP-28 TSSOP-16

4.95 2.50

Device

Description

PCM4222

2-channel, high-performance ADC

124

2/0

216

PCM4220 PCM4204

2-channel, high-performance ADC 4-channel, high-performance ADC, PCM or DSD, high-pass filter

— —

123 118

2/0 4/0

216 216

PCM4202 PCM4201

Stereo, high-performance ADC, PCM or DSD, high-pass filter Mono, high-performance ADC, PCM or DSD, high-pass filter, wide digital supply range, low power dissipation Stereo ADC, fully differential, high-pass filter Stereo ADC, SE input Stereo ADC, SE input, high-pass filter Stereo ADC w/ 2 × 6 input MUX and PGA, SPI (1850) and I2C (1851) control Stereo ADC, SE input, mute w/ fade, SPI control, S/W (1807) H/W (1808) controlled Stereo ADC, SE input, digital filter, very low power consumption

— —

118 112

2/0 1/0

216 108

6-Bit Modulator, DSD, Normal, I2S, TDM Normal, I2S, TDM Normal, I2S, DSD, TDM Normal, I2S, DSD Normal, DSP

— — — — —

112 105 103 101 101

2/0 2/0 2/0 2/0 2/0

192 96 96 96 96

Normal, I2S, DSD Normal, I2S Normal, I2S Normal, I2S I2S, L

+3.3 and +5 +3.3 and +5 +3.5 and +5 +3.3 and +5 +3.5 and +5

SSOP-28 SSOP-20 SSOP-20 TQFP-32 TSSOP-14

3.95 3.35 1.10 4.80 1.00

90

2/0

50

Normal, I2S, DSP

+2.4 and +3.6

QFN-24

1.80

Stereo, optional DSD format, external filter and DSP interface, SPI/I2C, differential current output: 7.8 mA p-p Stereo advanced segment, 123dB dynamic range, TDMCA serial interface (1798) 4-channel, high-performance, sampling rate up to 216kHz, H/W or S/W controlled Stereo advanced segment DAC, soft mute (1730), 2 optional operation modes (1738): External filter and DSD decoder for SACD playback and digital attenuation Stereo advanced segment DAC, optional DSD format, external filter and DSP interface, SPI/I2C differential current output: 3.2 mA p-p Stereo advanced segment DAC, balanced voltage outputs, improved clock jitter 8-channel, enhanced multi-format DAC, supports DSD with TDMCA

132

0/2

192

+3.3 and +5

SSOP-28

9.95

123

0/2

192

+3.5 and +5

SSOP-28

2.95

118

0/4

216

+3.3 and +5

TQFP-48

4.95

117

0/2

192

Standard, I2S, L Standard, I2S, L Normal, I2S, TDM Normal, I2S, DSD

+3.3 and +5

SSOP-28

5.25/ 5.00

113

0/2

192

+3.3 and +5

SSOP-28

2.10

113

0/2

192

+3.3 and +5

SSOP-28

2.10

108

0/8

192

+3.3 and +5

TQFP-52

5.96

106

0/2

192

Normal, I2S, TDMCA Normal, I2S, Left Justified Normal, I2S, DSD Normal, I2S

+5

SSOP-16

1.10

PCM1804 PCM1802 PCM1803A PCM1850/1 PCM1807/8 PCM1870

Audio DACs PCM1792A PCM1796/8 PCM4104 PCM1738/30

PCM1791A PCM1793 DSD1608

www.ti.com/dac

PCM1780/81/82 Stereo with volume control, software (1780/82) and hardware (1781), open-drain output zero flag (1782), improved jitter performance PCM1753/54/55 Stereo with volume control, software (1753/55) and hardware (1754), open-drain output zero flag (1755) PCM1608 8-channel, highly integrated DAC, higher SNR PCM1606 6-channel, low-cost CMOS, multi-level PCM1680 8-channel, low-cost DAC, improved jitter performance, pin compatible with PCM1780 TLV320DAC23 I2C and SPI control with headphone amp, Pdiss = 23 mW PCM1770/1 Stereo with integrated headphone driver, software (1770) and hardware (1771) controlled

106

0/2

192

Normal, I2S

+5

SSOP-16

1.03

— — —

105 103 103

0/8 0/6 0/8

192 192 192

Normal, I2S Normal, I2S Normal, I2S

+3.3 and +5 +5 +5

LQFP-48 SSOP-20 SSOP-24

4.29 2.00 1.50

 

100 98

0/2 0/2

96 48

Normal, I2S, DSP Normal, I2S

+1.5 to +3.3 +1.6 to +3.6

2.00 1.25

PCM1772/3

98

0/2

48

Normal, I2S

+1.6 to +3.6

 

97 95

0/2 0/2

53 96

Normal, I2S, DSP Normal, I2S, DSP, TDM

+2.7 to +3.6 +2.7 to +3.6

VFBGA-80 TSSOP-28, QFN-28, TSSOP-16, QFN-20 TSSOP-16, QFN-20 QFN-32 QFN-32

TLV320DAC26 TLV320DAC32

Stereo with integrated line out, software (1772) and hardware (1773) controlled Integrated PLL, SPI control, speaker/headphone amp, Pdiss = 11 mW Low-power stereo DAC with PLL and stereo HP/speaker amplifiers

1.25 2.95 2.75

1Suggested resale price in U.S. dollars in quantities of 1,000. For additional information on TI audio products, please visit www.ti.com/audio.

Texas Instruments 3Q 2009

Embedded Processing Guide


Audio Converters and Controllers Audio Codecs

73

Complementary Products for the TMS320™ DSP Family

www.ti.com/codec Portable Focus —

Dynamic Sampling Rate Range (dB) (kHz) (max) 112 96

Audio Data Format Normal, I2S, DSP, TDM Normal, I2S, DSP, TDM

Power Supply (V) 3.3 to 5

Package(s) HTQFP-64

+2.7 to 3.6

BGA-87

5.95

Price1 TBD

Device PCM3168

Description High-performance, 6 in/8 out audio codec

TLV320AIC34

Low-power quad stereo (4-channel) codec, 12 inputs (mic/line), 14 outputs (line, headphone/speaker), 2 PLLs and audio serial buses allow fully asynchronous simultaneous codec operation Low-power stereo codec, integrated PLL, 6 inputs (mic/line), 6 outputs (line, headphone/speaker), notch filtering, low-power analog bypass Low-power stereo codec, integrated PLL, 6 inputs (mic/line), 6 outputs (line, headphone), notch filtering, low-power analog bypass Low-power stereo codec, integrated PLL, 6 SE inputs (mic/line), 6 outputs (line, headphone), notch filtering, low-power analog bypass Low-power stereo codec, integrated PLL, 10 inputs (mic/line), 7 outputs (line, headphone), notch filtering, low-power analog bypass Low-power stereo codec, integrated PLL, 10 inputs (mic/line), 7 outputs (line, headphone, mono integrated Class-D amp) Low-power stereo codec, integrated PLL, 10 inputs (mic/line), 7 outputs (line, headphone, stereo integrated Class-D amp) Low-power stereo codec, integrated PLL, 6 inputs, 3 line out and speaker/HP outputs Low-power stereo codec, integrated PLL, 6 inputs (AIC32-6 single-ended, AIC31-2 differential and 2 single-ended) 2 line out and speaker/HP outputs Low-power, lower cost, stereo codec with headphone amps

102

96

102

96

Normal, I2S, DSP, TDM

+2.7 to 3.6

QFN-32

3.55

102

96

Normal, I2S, DSP, TDM

+2.7 to 3.6

QFN-32

3.25

102

96

Normal, I2S, DSP, TDM

+2.7 to 3.6

QFN-32

3.25

102

96

Normal, I2S, DSP, TDM

+2.7 to 3.6

QFN-32, BGA-80

3.85

102

96

+2.7 to 3.6

QFN

TBD

102

96

+2.7 to 3.6

QFN

TBD

102

96

+2.7 to 3.6

100

96

QFN-48, BGA-80 QFN-32

3.95

Normal, I2S, DSP, TDM Normal, I2S, DSP, TDM Normal, I2S, DSP, TDM Normal, I2S, DSP, TDM

100

96

I2S, L, R

+2.7 to 3.3

3.00

Low-power, stereo DAC, mono ADC, integrated PLL, speaker/HP amp, additional inputs and outputs (AIC29 – differential) Low-power, lower cost, stereo DAC, mono ADC, integrated PLL, speaker/HP amp Stereo audio codec 18 bits, serial interface, software controlled Stereo audio codec 18 bits, serial interface, hardware controlled Low-power, 3-V supply, stereo codec, hardware controlled Low-power, 2.4-V single supply, stereo codec, low-cost, hardware controlled Ultra-low power stereo codec, 6 inputs (mic/line), 3 outputs (line/HP/Class-D speaker) Ultra-low power stereo codec, 6 inputs (mic/line), 5 outputs (line/HP)

95

53

+2.7 to 3.6

97

53

+2.7 to 3.6

QFN-32

3.25

98

48

+4.5 to 5.5

SSOP-28

3.45

98

48

+4.5 to 5.5

SSOP-28

3.45

 

93 88

48 48

Normal, I2S, DSP Normal, I2S, DSP Normal, I2S, DSP Normal, I2S, DSP Normal Normal, I2S

VFBGA-80, TSSOP-28, QFN-28 QFN-48

+2.7 to 3.6 +2.1 to 3.6

SSOP-24 TSSOP-16

3.45 3.10

93

48

+2.4 to 3.6

QFN-32

4.50

93

48

+2.4 to 3.6

QFN-32

4.25

TLV320AIC3101

TLV320AIC3104

TLV320AIC3105

TLV320AIC3106

TLV320AIC3107 TLV320AIC3108 TLV320AIC33 TLV320AIC31/32

TLV320AIC23B TLV320AIC28/29 TLV320AIC26 PCM3000 PCM3001 PCM3006 PCM3008 PCM3793A PCM3794A

Normal, I2S, DSP Normal, I2S, DSP

+2.7 to 3.6

3.45

3.95/3.45

1Suggested resale price in U.S. dollars in quantities of 1,000. For additional information on TI audio products, please visit www.ti.com/audio.

Preview products are listed in bold blue. New products are listed in bold red..

Texas Instruments 3Q 2009

Embedded Processing Guide


74

Complementary Products for the TMS320™ DSP Family

Audio Converters and Controllers

Voiceband Codecs Device AIC111 TLV320AIC12K TLV320AIC14K TLV320AIC20K TLV320AIC24K

Description Lowest power, 20 bit Low power, mono codec, 16 bit, 26ksps voiceband codec with 8driver Low power, mono codec, 16 bit 26ksps voiceband codec Low power, stereo codec, 16 bit 26ksps voiceband codec with 8 driver Low power, stereo codec, 16 bit 26ksps voiceband codec

www.ti.com/codec Sample Number of SNR Analog Supply Logic Supply Power Supply Rate (kHz) Input Channel(s) (dB) Interface (V) (V) (mW) (typ) Package(s) Price1 40 1 87 SPI, DSP 1.1 to 1.5 1.1 to 3.3 0.46 QFN-32, FlipChip 4.14 26 1 90 I2C, S2C, DSP 1.65 to 1.95/2.7 to 3.6 1.1 to 3.6 10 TSSOP-30 1.70 26

1

90

I2C, S2C, DSP 1.65 to 1.95/2.7 to 3.6

1.1 to 3.6

10

TSSOP-30

1.50

26

2

90

I2C, S2C, DSP 1.65 to 1.95/2.7 to 3.6

1.1 to 3.6

20

TQFP-48

2.50

26

2

90

I2C, S2C, DSP 1.65 to 1.95/2.7 to 3.6

1.1 to 3.6

20

TQFP-48

2.30

Audio Converters with Integrated Touch-Screen Controller Device TSC2100 TSC2111 TSC2102 TSC2300 TSC2301 TSC2302

Description 4-Wire touch-screen interface, low power, lower cost, stereo DAC, mono ADC, integrated PLL, speaker/HP amp 4-Wire touch-screen interface, low power, stereo DAC, mono ADC, integrated PLL, speaker/HP amp, additional inputs and outputs (TSC2111 – differential) 4-Wire touch-screen interface, low power, stereo DAC, integrated PLL, speaker/HP amp, low cost 4-Wire touch-screen interface, low power, stereo DAC, mono ADC, integrated PLL 4-Wire touch-screen interface, low power, stereo DAC, stereo ADC, integrated PLL, HP amp, 4 × 4 keypad interface 4-Wire touch-screen interface, low power, stereo DAC, stereo ADC, integrated PLL, HP amp

www.ti.com/touchscreencontrollers Resolution Dynamic Sampling Rate (Bits) (max) Range (dB) (kHz) (max) Configuration 24 97 53 Mono/Stereo 24

95

53

Mono/Stereo

24

97

53

Stereo

20

98

48

Mono/Stereo

20

98

48

Stereo/Stereo

20

98

48

Stereo/Stereo

Audio Data Format Normal, I2S, DSP Normal, I2S, DSP Normal, I2S, DSP Normal, I2S

Power Supply (V) +2.7 to 3.6

Normal, I2S Normal, I2S

Price1 3.95

+2.7 to 3.6

Package(s) QFN-32, TSSOP-32 QFN-48

+2.7 to 3.6

TSSOP-32

3.70

+2.7 to 3.6

TQFP-64

4.75

+2.7 to 3.6

TQFP-64, BGA-120 QFN-48

4.95

+2.7 to 3.6

4.95

4.50

1Suggested resale price in U.S. dollars in quantities of 1,000. For additional information on TI audio products, please visit www.ti.com/audio.

Texas Instruments 3Q 2009

Embedded Processing Guide


Complementary Products for the TMS320™ DSP Family

75

Interface Products

TI provides a complete interface products portfolio that empowers customers to differentiate their products and accelerate time to market. TI’s hardware and software portfolios include 1394a and 1394b, USB fullspeed and USB 2.0 high-speed, PCIto-PCI bridges and PCI Express and interfaces. Our expertise in highspeed, mixed-signal circuits, systemon-a-chip integration and advanced product development ensure that you receive the silicon, support tools, software and technical documentation to create and deliver the best products on time and at competitive prices. TI’s Interface Business Unit (IBU) leverages these technologies and outstanding customer application support to serve the broad-based catalog market. Enabling Faster Time to Market • Industry leading, high performance • Proven system-level reference designs • Available development and evaluation kits Providing System-Level Solutions • Extensive industry compatibility and validation testing • Production test, driver and application software • Detailed technical applications documentation Visit www.ti.com/interface for additional information.

TUSB3410 USB-to-Serial Bridge The TUSB3410 provides an easy way to move a serial-based legacy device to a fast, flexible USB interface by bridging between a USB port and an enhanced UART serial port. The TUSB3410 contains all the necessary logic to communicate with the host computer using the USB bus. Key Features • USB full-speed-compliant: Texas Instruments 3Q 2009

XIO2000A PCI Express® Bridge Chip TI’s PCI Express Bridge Chip, the XIO2000A, is an industry first. It is designed for seamless migration from the legacy PCI to the PCI Express interface. It bridges a ×1 PCI Express bus to a 32-bit, 33-/66-MHz PCI bus capable of supporting up to six PCI devices downstream. The XIO2000A fully supports PCI Express rates of 2.5 Gbps. Its architecture supports the PCI 2.3 interface. The chip’s design enables PC and I/O add-on card manufacturers to begin transitioning to native PCI Express technology while preserving compatibility with existing PCI system software and firmware.

Key Benefits • Lowest power solution available today • 323 mW with two PCI cards at 33 MHz • In mass production for over two years • Proven capability and interoperability with leading PCIe chipsets and plethora of PCI devices • Built-in adaptive receiver equalizer • Improves jitter tolerance thereby reliably increasing PCB trace, or cable length, supported by the XIO2000 • Seven buffered PCI clock outputs (33 MHz or 66 MHz) • Reduces external components, costs and premium board space

XIO3130 4-Lane, 4-Port PCIe Switch TI’s XIO3130 is an integrated PCIe fan-out switch solution with one upstream ×1 port and three downstream ×1 ports. This high-performance, integrated solution provides the latest in PCIe switch technology. It features cut-through architecture and integrated reference clock buffers for downstream ports. The XIO3130 is fullycompliant with the PCI Express Base Specification Rev. 1.1. It supports Advanced Error Reporting as defined in the PCIe base specifications and is backwards compatible with the PCI Local Bus Specification, Rev. 2.3. Key Features • PCIe fan-out switch with ×1 upstream port and three ×1 downstream ports • Fully compliant with PCIe Base Specification, Rev. 1.1

data rate of 12 Mbps • 8052 microcontroller with 16 KBytes of RAM that can be loaded from the host or from external on-board memory via an I2C bus • Integrated, enhanced UART features including: • Programmable software/hardware flow control

• Cut-through architecture • Built-in adaptive equalizer in each of the four ports • Wake-event and beacon support • Support for D1, D2, D3hot, and D3cold • Active State Power Management (ASPM) • Uses both L0s and L1 • Low-power PCIe transmitter mode (pre-emphasis disabled) • Integrated AUX power switch drains VAUX power only when main power is “off” • Integrated hot-plug support • Integrated REFCLK buffers for switch downstream ports • Advanced error reporting to assist with system debug tools • 3.3-V multi-function I/O pins (e.g., for hot-plug status-and-control, or generalpurpose I/Os) • Listed in PCI-SIG compliance list

• Automatic RS-485 bus transceiver control, with and without echo • Software-selectable baud rate from 50 to 921.6 kbaud • Built-in, two-channel DMA controller for USB/UART bulk I/O • Evaluation module to jump-start USB development or for use as a complete USB-to-RS-232 converter Embedded Processing Guide


76

Complementary Products for the TMS320™ DSP Family

Interface Products TUSB60xx Family of USB High-Speed OTG Devices The TUSB60xx family of USB high-speed OTG devices enable application processors (DSPs and MCUs) that do not have integrated USB cores to function as either: 1. an USB 2.0 high-speed peripheral

2. an embedded USB 2.0 high-speed host controller 3. a full USB 2.0 high-speed OTG device

such as DaVinci™ TMS320DM643x and TMS320C642x DSPs. The TUSB6010B bridges to a 16-bit MUXED-NORFLASH host interface such as the OMAP2420, OMAP1710 or OMAP3430 processor.

The TUSB6020 enables functionality on VLYNQ™-enabled application processors,

USB Device

Speed

Ports

I2C

Voltage (V)

Package

Description

2/3 4 7 1/2

No No No Yes

3.3 3.3 3.3 3.3

32 LQFP 32 LQFP 48 LQFP 64 LQFP

2/3-port hub for USB with optional serial EEPROM interface 4-port hub for USB with optional serial EEPROM interface 7-port USB hub with optional serial EEPROM interface 2-port hub with integrated general-purpose function controller

Price1

USB Hub Controllers TUSB2036 TUSB2046B TUSB2077A TUSB2136

Full (1.1) Full (1.1) Full (1.1) Full (1.1)

Device

Speed

Voltage (V)

Remote Wakeup

Package

Full Full High High

3.3 3.3 3.3 1.5, 1.8 & 3.3

Yes Yes Yes Yes

64 LQFP 32 LQFP 80 TQFP 80 MicroStar BGA™

1.45 1.50 2.45 4.10

Description

Price1

USB full-speed general-purpose device controller USB-to-serial converter (RS-232, RS-485) USB 2.0 high-speed, low-power ATA/ATAPI bridge solution USB 2.0 high-speed to muxed NOR Flash bridge controller

3.15 2.85 3.50 5.00

USB Peripherals TUSB3210 TUSB3410 TUSB6250 TUSB6015 Device

Speed

Voltage (V)

Package

Local Bus Interface

1.5, 1.8 & 3.3 1.5, 1.8 & 3.3

80 MicroStar BGA 80 MicroStar BGA

16-Bit Muxed NOR VLYNQ

Description

Price

USB 2.0 high-speed On-The-Go to local bus interface controller USB 2.0 high-speed On-The-Go local bus interface bridge controller

Call Call

USB On-The-Go (OTG) Devices TUSB6010B TUSB6020

High High

Device

Speed

Voltage (V)

Package

Singled-Ended Input

Full, Low Full, Low Full, Low

1.6, 3.6 1.6, 3.6 1.6, 3.6

16 RTZ, 16 RGT 16 RTZ, 16 PW 14 PW, 16 RGT

Yes No No

Description

Price

USB Transceivers TUSB1105 TUSB1106 TUSB2551 1Suggested

USB transceivers USB transceivers USB transceivers

resale price in U.S. dollars in quantities of 100.

Call Call Call Preview devices appear in bold blue.

USB Port Protection—Transient voltage suppressor protects USB 2.0 full-speed and high-speed devices from ESD and electrical noise transients. Device #

# of Channels

Application

IO Capacitance

VBR (Min)

Dual-Bit/ Single Channel Three-Bit/Single-Channel USB OTG ESD Four-Bit/Two Channel Four-Bit/Two-Channel ESD with VBUS Clamp Four-Bit/Two Channel Dual-Bit/Single Channel Four-Bit/Two Channel

USB HS, USB FS USB HS OTG, USB FS OTG USB HS, USB FS USB HS with VBUS Clamp USB HS, USB FS USB FS USB FS

1.5pF 1.5pF 1.5pF 0.9pF 1.6pF 35pF 35pF

11 V 11 V 11 V 7V 6V 7V 7V

Package

Price

USB Transient Suppressors TPD2E001 TPD3E001 TPD4E001 TPD4S012 TPD4E004 SN65220, SN75220 SN65240

Resources Literature Number

DRL, DRY, DZD, DRS DRL, DRY, DRS DRL, DRS DRY DRY DBV, YZP PW, P

web web web web web web web

For a complete list of resources (evaluation modules, data sheets and application notes), visit interface.ti.com Description

Application Notes SLLU043 SLLA170B SLLAA276

TUSB3410 UART Evaluation Board USB/Serial Applications Using TUSB3410/5052 and the VCP Software MSP430 USB Connectivity Using TUSB3410

Texas Instruments 3Q 2009

Embedded Processing Guide


Interface Products System-Level ESD Protection Devices Space-saving, low-capacitance solutions – System-level ESD strikes are a constant threat to device reliability and functionality. Many low-voltage core chips only offer device-level, human-body model (HBM) ESD protection, which doesn’t address the system-level risks. TI’s TPD family of stand-alone ESD devices provides spacesaving and cost-effective solutions to protect the system interconnects from external ESD strikes. For multiple external interfaces including video, audio and serial

data transfer, the TPD family offers IEC61000-4-2 level ESD protection.

• • • • • • • •

Features and benefits: • Low I/O capacitance ideal for highspeed applications • Space-saving package solutions help reduce board footprint • Operating voltage range flexibility for low-power applications End equipments • Mobile handset • STB

77

Complementary Products for the TMS320™ DSP Family

Television Game console External HD Digital camera SIM cards Notebook PDA Consumer medical

Protected I/O Circuit

TPDxE001

I/O

TPDxE001 application schematics

ESD Protection Solutions Device # TPD2E001 TPD3E001 TPD4E001 TPD6E001 TPD4E004 TPD6E004 TPD4S009 TPD8S009 TPD12S520 TPD12S521

# of Channels Supply Voltage (VDD) I/O Level (V) I/O Capacitance (pF) VBR (Min) (V) Package Application 2 0.9–5.5 0–VDD 1.5 11 SOT-5, SON-6 USB 2.0, RS-232 / RS-485 3 0.9–5.5 0–VDD 1.5 11 SOT-5, SON-6 USB OTG 4 0.9–5.5 0–VDD 1.5 11 SOT-6, SON-6 USB 2.0, Ethernet, Firewire, e-SATA, RS-232 / RS-485 6 0.9–5.5 0–VDD 1.5 11 QFN-10, QFN-12 USB 2.0, Ethernet, Firewire, e-SATA, RS-232 / RS-485 4 0.9–5.5 0–VDD 1.6 6 SOT-6, SON-6 USB 2.0, Ethernet, Firewire, e-SATA 6 0.9–5.5 0–VDD 1.6 6 QFN-8 USB 2.0, Ethernet, Firewire, e-SATA 4 0.9–5.5 0–VDD 0.9 9 SOT23-6, SC70-6, e-SATA, LVDS signaling SON-6 8 0.9–5.5 0–VDD 0.9 9 SON-15 HDMI, display port 12 0.9–5.5 0–VDD 0.9 9 TSSOP-38 HDMI receiver port 12 0.9–5.5 0–VDD 0.9 9 TSSOP-38 HDMI transmit port

PCI Bridge Solutions Intel-Compatible Part No.

Speed (MHz)

Expansion Interface (bits)

Hot Swap

MicroStar BGA™ Packaging

Voltage (V)

PCI2050B

21150bc

66

32

Yes

Yes

3.3, 5

PCI2250

21152ab

33

32

Friendly

No

PCI2060

66

32

Yes

Yes

Device

Package(s)

Description

Price1

32-Bit, 66-MHz, 9-master PCI-to-PCI bridge

9.50

3.3, 5

208 LQFP, 208 QFP, 257 BGA 176 LQFP, 160 QFP

6.10

3.3, 5

257 BGA

32-Bit, 33-MHz PCI-to-PCI bridge, compact PCI hot-swap friendly, 4-master 32-Bit, 66-MHz, 9-master, asynchronous PCI-to-PCI bridge

PCI Bridges

1Suggested

9.50

resale price in U.S. dollars in quantities of 1,000.

Texas Instruments 3Q 2009

Embedded Processing Guide


78

Complementary Products for the TMS320™ DSP Family

Interface Products PCI Express Solutions Device

Supply Voltage (V)

PCIe

Parallel Bus Width

Speed (max) (Gbps)

MicroStar BGA™ Packaging

Package

Description

Price*

PCI Express PHY XIO1100

3.3, 1.8, 1.5

×1

8, 16

2.5

Yes

100 BGA

×1 PCI Express PHY, compliant with the PCI Express Base Specification Revision 1.1

Device

Supply Voltage (V)

PCIe

Parallel Bus Masters

Wake/Beacon Support

MicroStar BGA Packaging

Package

Description

3.3, 1.5

×1

6

Yes

Yes

Supply Voltage (V)

PCIe

FIFO (KB)

Speed (max) (Mbps)

MicroStar BGA Packaging

Package

Description

9

400

Yes

175 BGA, 176 BGA

7.00

Price1

PCI Express Bridge XIO2000A Device

175 BGA, 201 BGA ×1 PCI Express-to-PCI bus translation bridge

10.50 Price1

PCI Express Endpoints XIO2200A

3.3, 1.5

×1

XIO2213A

3.3, 1.95, 1.5

×1

8

800

No

167 BGA

PCI Express-to-PCI bus translation bridge with 1394a OHCI and two ports PCI Express-to-1394b OHCI with three-port PHY

Device

Supply Voltage (V)

PCIe

Downstream PCI Ports

Wake/Beacon Support

MicroStar BGA Packaging

Package

Description

3

Yes

Yes

196 BGA

×1 PCI Express 4-port fanout packet switch

7.75 8.70 Price1

PCI Express Packet Switch XIO3130

3.3, 1.5

Device

No. of Inputs

×1

No. of Supply Voltage Outputs Range (V)

rON (typ) ) (

tpd (typ) (ns)

MicroStar BGA Packaging

Package

Description 2-channel PCIe 2:1 multiplexer/demultiplexer passive FET switch 4-channel PCIe 2:1 multiplexer/demultiplexer passive FET switch

Call Price1

PCI Express Signal Switches* TS2PCIE2212

2

1

1.7–1.9

10

0.25

No

48 BGA

TS2PCIE412

2

1

1.5–2.1

12.5

0.25

No

42 QFN

1Suggested

resale price in U.S. dollars in quantities of 1,000. *For additional TI switches, visit www.ti.com/switches

Texas Instruments 3Q 2009

1.61 Preview

Preview products are listed in bold blue.

Embedded Processing Guide


TMS320C2000™ Microcontrollers for Real-Time Control

79

Silicon

TMS320C2000 Microcontrollers, Fixed Point and Floating Point MCU Control. 32-Bit Performance Get samples, data sheets, tools and app reports at: www.ti.com/c2000

Specifications

Applications Green energy (solar, wind, fuel cells), digital motor control (home appliances, industrial drives, medical), digital power supplies (telecom and server rectifiers, wireless basestations, UPS), automotive (electric power steering, driver’s assistance radar, wipers, HVAC)

Features

Production

F2833x

C2834x

Sampling

• 150 MIPS/300 MFLOPS • 128–512 KB Flash • 16-ch, 12-bit ADC • HiRes PWM, QEP

• 300 MIPS/600 MFLOPS • 196–516 KB SRAM Next • HiRes PWM, QEP

In Development Future

Generation

C2834x

Performance

• 32-bit C28x™ MCU core with floating-point option • Industry’s first floating-point MCUs • Highest performance MCUs at 300 MHz and 600 MFLOPS • Only processors with full software compatibility between fixed-point and floating-point • Full software compatibility across all C28x platform controllers • All C28x controllers are AEC Q-100 qualified for automotive applications

Delfino™ Floating-Point Series

Device

F282x F281x • 150 MIPS • 128–256 KB Flash • 12.5 MSPS ADC • QEP

• 150 MIPS • 128–512 KB Flash • 16-ch, 12-bit ADC • HiRes PWM, QEP

F2833x

Piccolo™ Series F282x F2803x

F281x F280x F280x • 60–100 MIPS • 32–256 KB Flash • 16-ch, 12-bit ADC • HiRes PWM, QEP

F2802x Next Generation F2802x

F2803x

• 40–60 MIPS • 32–64 KB Flash • 13-ch, 12-bit ADC • HiRes PWM • Single 3.3-V supply

• 60 MIPS + CLA • 64–128 KB Flash • 16-ch, 12-bit ADC • HiRes PWM, QEP • Single 3.3-V supply

Code-compatible solutions scaling from 40 MHz to 300 MHz

TMS320C2000 Microcontroller Platform Roadmap The C2000™ controller platform provides an optimized combination of DSP performance and MCU integration for digital control systems.

• Industry’s most efficient C compiler for 32-bit controllers • Up to 300-MHz operation • Single-precision 32-bit floating-point unit on F283xx generation • Ultra-fast interrupt response time • Integrated real-time debug simplifies control system development • Single-cycle 32×32-bit multiplyaccumulate • 32-bit and 16-bit instructions optimize performance and code efficiency

Peripherals • Up to 512-KB Flash and 68-KB RAM • Code security module with 128-bit password protection • Ultra-fast 12-bit A/D converter with 80-ns conversion time • High-resolution PWM allows dutycycle modulation with down to 65-picosecond accuracy • Flexible PWM generation allows easy generation of any switching waveform • Quadrature encoder interfaces for easy motor feedback • Multiple communications interfaces

Texas Instruments 3Q 2009

The C2000 microcontroller platform provides an optimized combination of 32-bit performance and integration for digital control systems. Not all devices contain all modules shown.

Embedded Processing Guide


80

TMS320C2000™ Microcontrollers for Real-Time Control

Silicon

TMS320C2000 Microcontrollers

Device

www.ti.com/c2000

Control Interfaces 12-Bit A/D Communications Ports Processor Memory QuadraChan/ External Core On-Chip Speed RAM Flash ROM PWM HiRes ture Event Conversion CompaUART/ Memory Supply GPIO Osc Pins/ (MHz) DMA CLA (KB) (KB) (KB) Chan PWM Encoder Captures Timers2 Time (ns) rators McBSP I2C SCI SPI Lin CAN Bus Volt(s) Pins Regulator Packaging

1-KU Price1

TMS320F2803x Piccolo™ MCUs TMS320F2803x

60

– No/ 20 64– Boot 9–15 Yes 128

7

1

1

4 4 4 4 – –

0 0 0 0 0 0

1 1 1 1 1 1

9–12 13–16/217

3

1

1 1–2 1 1

3.3 26–44 Yes/Yes 56 QFN, 64 TQFP, 80 LQFP, 80 QFP P-Pad

TBD

TMS320F2802x Piccolo MCUs TMS320F28027 TMS320F28026 TMS320F28023 TMS320F28022 TMS320F28021 TMS320F28020

60 60 40 40 40 40

– – – – – –

– – – – – –

12 12 12 12 10 6

64 32 64 32 64 32

Boot Boot Boot Boot Boot Boot

9 9 9 9 9 9

9 9 9 9 9 9

7–13/217 7–13/217 7–13/325 7–13/325 7–13/500 7–13/500

1–2 1–2 1–2 1–2 1–2 1–2

– – – – – –

1 1 1 1 1 1

1 1 1 1 1 1

1 1 1 1 1 1

– – – – – –

– – – – – –

– – – – – –

3.3 3.3 3.3 3.3 3.3 3.3

20–22 20–22 20–22 20–22 20–22 20–22

Yes/Yes Yes/Yes Yes/Yes Yes/Yes Yes/Yes Yes/Yes

38 TSSOP, 48 LQFP 38 TSSOP, 48 LQFP 38 TSSOP, 48 LQFP 38 TSSOP, 48 LQFP 38 TSSOP, 48 LQFP 38 TSSOP, 48 LQFP

2.85 2.65 2.45 2.25 2.20 1.99

6 6 6 6 4 4

19 19 19 19 14 14

– – – – – –

– – – – – –

2 2 2 2 1 1

1 1 1 1 1 1

3 3 3 3 3 3

2 2 2 2 2 2

– – – – – –

2 2 2 2 2 2

16/32 bit 16/32 bit 16/32 bit 16/32 bit 16/32 bit 16/32 bit

1.2 1.1 1.2 1.1 1.2 1.1

88 88 88 88 88 88

– – – – – –

256 GBA 256 GBA, 179 BGA 256 GBA 256 GBA, 179 BGA 256 GBA 256 GBA, 179 BGA

16.39 14.42 12.78 11.25 10.17 8.95

TMS320C2834x Delfino™ Floating-Point Microcontrollers TMS320C28346 TMS320C28345 TMS320C28344 TMS320C28343 TMS320C28342 TMS320C28341

300 200 300 200 300 200

Yes Yes Yes Yes Yes Yes

– – – – – –

516 516 260 260 196 196

– – – – – –

Boot Boot Boot Boot Boot Boot

24 24 24 24 16 16

9 9 9 9 6 6

3 3 3 3 2 2

TMS320F2833x Delfino Floating-Point Microcontrollers TMS320F28335 150 Yes – 68 512 Boot 18 TMS320F28334 150 Yes – 68 256 Boot 16 TMS320F28332 100 Yes – 52 128 Boot 16

6 6 4

2 2 2

6 4 4

16 14 14

16/80 16/80 16/80

– – –

2 2 1

1 1 1

3 3 2

1 – 2 16/32 bit 1.9 1 – 2 16/32 bit 1.9 1 – 2 16/32 bit 1.9

88 88 88

– – –

179 BGA, 176 LQFP 15.65 179 BGA, 176 LQFP 14.75 179 BGA, 176 LQFP 13.85

6 6 4 – – – 6 4 4 16 3 3 3 3 4 4

2 2 2 2 2 2 2 2 2 – 1 1 1 1 0 0

6 4 4 6 6 6 4 4 4 – 2 2 2 2 2 2

16 14 14 8 8 8 14 14 14 24 9 9 9 9 10 10

16/80 16/80 16/80 16/80 16/80 16/80 16/80 16/160 16/160 16/80 16/160 16/160 16/267 16/267 16/267 16/267

– – – – – – – – – – – – – – – –

2 2 1 1 1 1 – – – – – – – – – –

1 1 1 – – – 1 1 1 1 1 1 1 1 1 1

3 3 2 2 2 2 2 2 2 1 1 1 1 1 1 1

1 1 1 1 1 1 4 4 4 1 2 2 2 2 1 1

– – – – – – – – – – – – – – – –

2 16/32 bit 1.9 2 16/32 bit 1.9 2 16/32 bit 1.9 1 16 bit 1.9 1 – 1.9 1 – 1.9 2 – 1.8 2 – 1.8 1 – 1.8 – – 1.8 1 – 1.8 1 – 1.8 1 – 1.8 1 – 1.8 1 – 1.8 – – 1.8

88 88 88 56 56 56 35 35 35 35 35 35 35 35 35 35

– – – – – – – – – – – – – – – –

179 BGA, 176 LQFP 179 BGA, 176 LQFP 179 BGA, 176 LQFP 179 BGA, 176 LQFP 128 LQFP 128 LQFP 100 BGA, 100 LQFP 100 BGA, 100 LQFP 100 BGA, 100 LQFP 100 LQFP 100 BGA, 100 LQFP 100 BGA, 100 LQFP 100 LQFP 100 LQFP 100 LQFP 100 BGA, 100 LQFP

14.55 13.72 12.88 15.75 14.75 13.85 12.95 11.60 8.70 9.95 7.10 5.80 4.75 3.95 3.50 3.25

– – – 3 3

2 2 2 1 1

6 6 6 2 2

8 8 8 9 9

16/80 16/80 16/80 16/160 16/160

– – – – –

1 1 1 – –

– – – 1 1

2 2 2 1 1

1 1 1 2 2

– – – – –

1 1 1 1 1

56 56 56 35 35

– – – – –

179 BGA, 176 LQFP 128 LQFP 128 LQFP 100 BGA, 100 LQFP 100 BGA, 100 LQFP

– – – – –

TMS320F28x Fixed-Point MCUs TMS320F28235 TMS320F28234 TMS320F28232 TMS320F2812 TMS320F2811 TMS320F2810 TMS320F2809 TMS320F2808 TMS320F2806 TMS320F28044 TMS320F2802 TMS320F2801 TMS320F2802-60 TMS320F2801-60 TMS320F28016 TMS320F28015

150 Yes – 68 512 Boot 18 150 Yes – 68 256 Boot 16 100 Yes – 52 128 Boot 16 150 – – 36 256 Boot 16 150 – – 36 256 Boot 16 150 – – 36 128 Boot 16 100 – – 36 256 Boot 16 100 – – 36 128 Boot 16 100 – – 20 64 Boot 16 100 – – 20 128 Boot 16 100 – – 12 64 Boot 8 100 – – 12 32 Boot 8 60 – – 12 64 Boot 8 60 – – 12 32 Boot 8 60 – – 12 32 Boot 10 60 – – 12 32 Boot 10

TMS320C28x ROM MCUs3 TMS320C2812 TMS320C2811 TMS320C2810 TMS320C2802 TMS320C2801

150 150 150 100 100

– – – – –

– – – – –

36 36 36 12 12

– 256 16 – 256 16 – 128 16 – 64 8 – 32 8

1Prices are quoted in U.S. dollars and represent 2009 suggested resale pricing. All 2Timers include CPU timers, PWM timers, eCAP timers and watchdog timers. 3Minimum quantity order for all ROM devices is 10K units, NRE charge is $11,000

16 bit – – – –

1.9 1.9 1.9 1.8 1.8

prices are subject to change.

for C28x™ controllers. Note: All TMS320C28x devices in LQFP packages are available as AEC Q100 qualified. Note: All devices available in Pb-Free/Green packaging.

Texas Instruments 3Q 2009

Embedded Processing Guide


TMS320C2000™ Microcontrollers for Real-Time Control

81

Silicon

TMS320C2000 New Technology Better Integration. Easier Development To learn more about Piccolo™ technology, visit: www.ti.com/piccolo To learn more about Delfino™ technology, visit: www.ti.com/delfino

Key Piccolo™ Features • Up to 60-MHz, 32-bit TMS320C28x CPU • 32-kB to 128-kB embedded Flash • 12-bit ADC, up to 4.6 MSPS • 150-ps high-resolution PWM • Control law accelerator (CLA) • Package options starting at 38-pin TSSOP

Key Delfino™ Features • Up to 300-MHz C28x™ core • 32-bit floating-point precision • Up to 65-ps resolution PWM modules • Multiple capture and 32-bit QEP modules • Direct Memory Access (DMA) controller • External memory interface • Code compatibility across TMS320C2000™ controller platform

Texas Instruments 3Q 2009

C2000™ Piccolo Family The new TMS320F2802x/TMS320F2803x Piccolo family of C2000 MCUs provides unparalleled performance with increased integration to help drive processorintensive real-time control into costsensitive applications. Initial F2802x/ F2803x devices will include 40 to 60 MHz variations, up to 128 kB of Flash memory, high-speed 12-bit ADC, high-resolution enhanced PWMs, along with a host of

other modules such as high-precision on-chip oscillators, analog comparators, communication interfaces and generalpurpose I/O. Available in multiple package options starting at 38 pins, the Piccolo family is the ultimate combination of performance, integration and size. In select F2803x devices, the CLA brings the ability to run floating-point based control loops independent of the CPU.

Delfino: Floating-Point Development at Your Finger Tips With Delfino, TI offers two flavors of floatingpoint MCUs with unparalleled performance. F2833x devices operate at 150 MHz with 300 MFLOPS of performance. The F283xx MCUs offer a 50 percent performance boost, on average, over current C2000 MCUs while operating at the same 150-MHz clock rate. Built on the standard C28x architecture, they are 100 percent software compatible with all current F28xx MCUs.

The new C2834x Delfino MCUs push the limits even further, offering 600 MFLOPS of performance. The C2834x platform allows up to 52 percent code reduction and 70 percent reduction in memory access time over current C2000 MCUs. New speeds enable greater intelligence and efficiency in high-end real-time control applications. www.ti.com/delfino.

Embedded Processing Guide


82

TMS320C2000™ Microcontrollers for Real-Time Control

Silicon The Floating-Point Advantage The Delfino™ TMS320F2833x series features an integrated hardware floating-point unit. These floating-point MCUs, operating at 150 MHz, provide 300 MFLOPS of performance while maintaining pin compatibility with their fixed-point counterparts, the F2823x series. The F2833x floatingpoint controllers offer a 50 percent performance boost, on average, over other C2000™ controllers operating at the same 150-MHz clock rate. The Delfino TMS320C2834x series adds even more performance to the C2000 platform by providing up to 600 MFLOPS at 300 MHz. Built on the standard C28x™ core architecture, both Delfino series are 100 percent software compatible with all current TMS320F28xx controllers. IQMath Provides a Bridge Between Floating Point and Fixed Point Control algorithms typically start life in a floating-point format, often created with PC-based simulation tools, such as MATLAB®. With the availability of the TMS320F283xx floating-point microcontrollers, it is easy to port that floating-point code to the embedded controller. TI’s IQMath library provides seamless portability from the F283xx MCUs to fixed-point members of the C28x™ generation. The TMS320F282xx fixed-point MCUs are pinto-pin compatible with the F283xx MCUs. These microcontrollers offer the first set of processors that provide both hardware and software compatibility between floating point and fixed point.

F283xx

F283xx F283xx F28x

F28x

Math Functions (2.45× Improvement)

F28x

Control Algorithms (1.57× Improvement)

DSP Performance (1.38× Improvement)

F2833x floating-point devices boost performance by an average of 50 percent. C2834x devices add even more processing power.

Slash development time and reduce overall costs with TI’s IQMath: floating-point development on a fixed-point machine. Simulation Platform ® (i.e., MATLAB ) Auto-Code Generation is Made Simpler

“IQMath” Algorithm (C or C++) One Source Set Fits All F28x FixedPoint Controllers

F283xx Floating-Point Controllers

Speedy Algorithm Porting

For more information, visit www.ti.com/iqmath.

TI’s C28x IQMath Library makes code development easier, faster and enables seamless portability of code between fixed- and floating-point devices.

C2000 Microcontroller Literature and Related Technical Documentation All documentation and associated literature, user’s guides, application notes and software can be found by clicking on the specific device in the parametric table found on the URL below. TMS320C2000 Microcontrollers

Texas Instruments 3Q 2009

www.ti.com/c2000

Embedded Processing Guide


TMS320C2000™ Microcontrollers for Real-Time Control

83

Tools

TMS320C2000 New Technology Tools Better Integration. Easier Development To order and learn more about the new C2000™ tools, visit: www.ti.com/c2000tools

Key Tool Features • Stand-alone daughter card for rapid prototyping • Full hardware documentation [including schematics, Gerbers and bill of material (BOM)] • Fully documented open source example software • Full version of Code Composer Studio™ Integrated Development Environment, with 32-KB size limit, included • Low-cost development kits starting at just U.S. $89

C2000™ Development Tools The C2000 controlCARDs™ are the latest tools for C2000 MCUs and feature a C2000 processor and all necessary support devices on one daughter card, requiring only one 5-V supply to be fully functional. The daughter card plugs into a simple motherboard connector that gives access to every pin on the device. Using a

DC/DC Developer’s Kit

AC/DC Developer’s Kit

controlCARD, custom prototyping boards can easily be developed and inexpensively manufactured. TI offers several C2000 development kits based on the controlCARD concept, including two DC/DC power kits and an AC/DC power conversion kit.

Digital Power Experimenter’s Kit

C2000 Experimenter Kits

controlCards

C2000 controlCARD-based tools

The C2000 controlCARDs are the latest tools for TMS320C2000 MCUs. By detaching the C2000 processor and all necessary support devices and putting them on “controlCARDs”, a designer can test multiple processors on one board. Separating the MCU from the base also decreases replacement costs should accidents happen. These controlCARDs require only one 5-V supply and plug into

a simple motherboard connector that gives access to every pin on the device. Currently available with five microcontrollers and seven base boards, select your kits today and start exploring what the C2000 MCU has to offer, right out of the box. Visit www.ti.com/c2000tools for more information.

Piccolo™ controlSTICK™ – U.S. $39 A low-cost USB-based tool that provides instant access to peripherals and pins comes with the Piccolo line of devices. Start developing for just U.S. $39. • Everything you need to work with the 48-pin Piccolo TMS320F28027 • Access to all Piccolo control peripherals through header pins

Texas Instruments 3Q 2009

• On-board USB JTAG emulation (no external emulator required) • Numerous sample labs to get you started immediately • Full software and hardware documentation

Embedded Processing Guide


84

TMS320C2000™ Microcontrollers for Real-Time Control

Tools/Software C2000™ Microcontroller Platform Hardware and Software Development Tools Name

$U.S.1

Device

Part #

Description

F28027 (Piccolo™)

TMDX28027USB

controlSTICK USB evaluation tool

F28027 (Piccolo) F28035 (Piccolo) F28044 F2808 F28335 (Delfino™) C28343 (Delfino) C28346 (Delfino)

TMDXCNCD28027 TMDSCNCD28035 TMDSCNCD28044 TMDSCNCD2808 TMDSCNCD28335 TMDXCNDC28343 TMDXCNDC28346-168

F28027 controlCARD F28035 controlCARD F28044 controlCARD F2808 controlCARD F28335 controlCARD C28343 controlCARD C28346 168-pin controlCARD

F28027 (Piccolo)

TMDXDOCK28027

F2808

TMDSDOCK2808

F28335 (Delfino)

TMDSDOCK28335

C28343 (Delfino)

TMDXDOCK28343

C28346 (Delfino)

TMDXDOCK28346-168

Peripheral Explorer Kit

F28335 (Delfino)

TMDSPREX28

Digital Power Experimenter’s Kit2 Digital Power Developer’s Kit2 AC/DC Developer’s Kit2

F2808 F28044 F2808

TMDSDCDC2KIT TMDSDCDC8KIT TMDSACDCKIT

Resonant DC/DC Developer’s Kit2

F2808

TMDSRESDCKIT

Renewable Energy Developer’s Kit2

F2808

TMDSENRGYKIT

F28027 Experimenter’s Kit. Includes power supply, Code Composer Studio™ (CCStudio) IDE, USB cable, controlCARD and docking station F2808 Experimenter’s Kit. Includes power supply, CCStudio IDE, controlCARD and docking station F28335 Experimenter’s Kit. Includes power supply, CCStudio IDE, controlCARD and docking station C28343 Experimenter’s Kit. Includes power supply, CCStudio IDE, DIM100 controlCARD and docking station C28346 Experimenter’s Kit. Includes power supply, CCStudio IDE, DIM168 controlCARD and docking station F28335 Peripheral Explorer Kit. Includes power supply, CCStudio IDE, controlCARD and peripheral explorer baseboard Two independent channels digital power board with F2808 controlCARD* Eight independent channels digital power board with F28044 controlCARD* Phase-shifted full bridge with power factor correction digitally controlled AC/DC conversion board with F2808 controlCARD* Single-transformer LLC resonant DC/DC EVM with F2808 controlCARD. This kit does NOT require an external JTAG emulator. F2808 controlCARD-based DC/AC inverter EVM with battery charging and management* PFC plus dual-motor driver EVM with isolated USB JTAG emulator, includes 1 motor PFC plus dual-motor driver EVM with isolated USB JTAG emulator, includes 2 motors

controlSTICK™ controlSTICK2

39

controlCARDs™ DIM100 controlCARDs

DIM168 controlCARDs

49 59 59 59 69 109 125

Starter Kits Experimenter’s Kits2 (with on-board emulation)

Experimenter’s Kits2 (external emulator required)

Motor Control and PFC Developer’s Kit F28035 (Piccolo) Dual Motor Control and PFC Developer’s Kit F28035 (Piccolo)

TMDS1MTRPFCKIT TMDS2MTRPFCKIT

Description

79 89 99 159 189 179 229 325 695 229 349 369 399

Part #

$U.S.1

www.signum.com TMDSEMU200U TMDSEMUUSB www.spectrumdigital.com

595 299 1,995 249

JTAG Emulators JTAGjet-TMS-C2000 USB Emulator for Windows Blackhawk USB2000 Controller XDS510 USB-Based Emulator Spectrum Digital XDS510LC USB JTAG Emulator

Software Development Tools C2000 DSP Code Composer Studio Development Tools Bundled with Annual Software Subscription Supports TMS320C24x™ and TMS320C28x™ MCU products Code Composer Studio Platinum Edition Development Tools bundled with Annual Software Subscription Supports C6000™, C5000™, C2000, DaVinci™ and OMAP™ processor platforms C2000 MCU Code Composer Studio Development Tools Annual Software Subscription Code Composer Studio IDE Free Evaluation Tools Includes C6000, C5000, C2000, DaVinci and OMAP processor CCStudio 120-Day Free Evaluation Tools3 TMS320C2000 Digital Motor Control Software TMS320C2000 Digital Power Software TMS320C2000 Signal Processing Libraries

TMDSCCS2000-1

495

TMDSCCSALL-1

3,595

TMDSSUB2000 SPRC119 www.ti.com/freetools www.ti.com/c2000appsw www.ti.com/dpslib www.ti.com/c2000sigproclib

495 Free Free Free Free

1Prices

are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the New tools are listed in red. most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 2Includes 32-KB limited Code Composer Studio IDE. 3Includes full-featured Code Composer Studio Development Tools, code generation tools (C/C++ compiler/assembler/linker), emulator and simulator configurations all limited to 120 days. Alternative Development Tools are available from third parties such as EWA Blackhawk DSP (www.blackhawk-dsp.com), Spectrum Digital (www.spectrumdigital.com), Technosoft (www.technosoft.ch) and Softronics (www.softronx.com). *External emulator required. Please see the tools features matrix on page 59 for more details.

Texas Instruments 3Q 2009

Embedded Processing Guide


TMS320C2000™ Microcontrollers for Real-Time Control

85

Complementary Power Management Products

Power Management Products for the C2000™ Microcontroller Platform Get samples, data sheets, Evaluation Modules (EVMs) and app reports at: power.ti.com Suggested Texas Instruments Power Management Solutions for TMS320C2000* Microcontrollers

Input Voltage 3.3 V 5V 12 V 24 V 48 V

LDO TPS73701 TPS73701 TLV1117 LM317

Synchronous Non-Synchronous Controller Controller (External FETs) (External FET and Diode) TPS40041 TPS64200 TPS40042 TPS40200 TPS40190 TPS40200 TPS40057 TPS40200† TPS40061

Core and I/O Voltages Synchronous Non-Synchronous Integrated FET Integrated FET Converter Converter TPS54110 MC33063 TPS54110 TPS40222 TPS62110 TPS5410 TPS5410†

Non-Isolated Power Module PTH04070 PTH04070 PTH08080 PTN78000†

Isolated Power Module

DualOutput Controller TPS62420 TPS75003 TPS5120

PTB78560† PTMA403033†

†Due to Vout/Vin ratio core voltage may have to be stepped down from 3.3-V I/O. I/O supply 3.3 V, current up to 500 mA.

Multiple-Output Converter TPS54386 TPS54386 TPS54386

*Piccolo™ only requires a single-rail LDO. Core supply down to 1.8 V, current up to 1 A.

Example C2000 Microcontroller Power Supply Design

Power Options for TMS320F2802x/3x Microcontrollers

OUT

OUT

For additional power supply designs for TI Microcontrollers, please visit www.ti.com/processorpower. Note: The TI power devices recommended here are based on standard operating conditions. System designers should use device power estimation tools in conjunction with overall application level power requirements to ensure an adequate power supply design is used.

Texas Instruments 3Q 2009

Embedded Processing Guide


86

MSP430 Ultra-Low Power Microcontrollers

Silicon MSP430 Microcontrollers Ultra-Low Power, Easy-to-Use, 16-Bit RISC Microcontrollers Get samples, data sheets, tools and app reports at: www.ti.com/msp430

Key Features • 16-bit RISC CPU enables new applications at a fraction of the code size • Ultra-low power architecture and flexible clock system extends battery life: • 0.1µA RAM retention • <1µA real-time clock mode • Down to 165 µA/MIPS • Increased performance • Up to 25 MHz • 1.8V ISP Flash erase and write • Fail-safe, flexible clocking system • User-defined bootstrap loader • Up to 1-MB linear memory addressing • Innovative features • Multi-channel DMA supports data movement in standby mode • Industry-leading code density • More design options including USB, RF, LCD interface • Integrated intelligent peripherals including a wide range of highperformance analog and digital peripherals offload the CPU • Easy to get started: Complete development tools starting at only U.S. $20 with integrated development environments available free of charge Coming Soon: All New CC430 RF System-on-Chip • Integrates MSP430F5xx with CC1101 • High analog performance/integration • Ease of development • High RF sensitivity and blocking • Flexible data rate and RF modulation formats

Texas Instruments 3Q 2009

Analog integration: ADC10/12, 16-bit sigma delta, 12-bit DAC, op amps Digital peripherals: 16×16/32×32 multiplier, DMA Communications: USB, UART, I2C, SPI, LIN, IrDA

F551x F552x

100+ devices

F56xx

2xx

F66xx

F51x2

• 16 MIPS • 120KB Flash • 8-KB RAM • 500-nA standby • 1.8–3.6 V

Performance

Key Applications • Low-power wireless applications • Consumer electronics • Utility metering • Intelligent sensing and control • Portable medical and instrumentation • Security systems

CC430

F541x

The New Generation

5xx–6xx • 25 MIPS • 256KB Flash • 16-KB RAM • 1.8–3.6 V • USB, RF • 6xx: LCD Controller • 165-µA/MHz

F543x

F/CG461x 75+ devices

100+ devices

1xx

4xx: LCD

• 8 MIPS • 60KB Flash • 10-KB RAM • 1.8–3.6 V

• 16 MIPS • 120KB Flash • 8-KB RAM • LCD Controller, 160 Segments • 1.8–3.6 V

Integration

MSP430 roadmap

Clocks, Power Management Unified Clock System Supply Supervisors Supply Monitors Brownout

CPU/ Memory Flash

RAM

RISC CPU 16-Bit

DMA Controller

Enhanced Eumulation Module

System Control/ Watchdog

JTAG Spy-Bi-Wire Interface

RF Transceiver

Timing & Control

Packet Handler

GeneralPurpose Timers Capture/ Compare PWM Outputs

Digital RSSI Carrier Sense PQI/LQI CCA Sub-1 GHz Radio CPU Interface

Basic Timer + RTC

HighPerformance Analog ADC

Comparators

Communication

I/O & Display

Universal Serial Communication Interfaces SPI, USART, I2C

GeneralPurpose I/O Pull-Up, Pull-Down, Drive

AES

Segment LCD Static, Muxed

Modem Frequency Synthesizer RF/Analog TX & RX

CC430 — high integration reduces complexity, lets designers do more with less. www.ti.com/cc430

• MSP430x1xx – Flash/ROM-based MCUs offering 1.8V to 3.6V operation, up to 60 kB, 8 MIPS and a wide range of peripherals. • MSP430F2xx – Flash-based family featuring even lower power and up to 16 MIPS with 1.8V to 3.6V operation. Additional enhancements include ±1% on-chip very-low-power oscillator, internal pull-up/pull-down resistors and lowpin-count options. • MSP430x4xx – Flash/ROM-based devices offering 1.8V to 3.6V operation, up to 120-kB Flash/ROM, 16 MIPS with

FLL + SVS along with an integrated LCD controller. Ideal for low-power metering and medical applications. • MSP430F5xx/6xx – New Flash-based microcontroller family featuring the lowest power consumption and performance up to 25 MIPS. It offers a wide operating voltage range from 1.8V to 3.6V. Features include an innovative power management module for optimizing power consumption, an internally controlled voltage regulator, integrated LDC driver on select devices and a wide range of memory options up to 256 kB. Embedded Processing Guide


MSP430 Ultra-Low Power Microcontrollers

87

Ultra-Low Power, 16-Bit RISC

16-Bit RISC CPU • Large register file eliminates accumulator bottleneck • Optimized for C and assembler programming • Compact core design reduces power and cost • Up to 16 MIPS of performance available The MSP430 MCU’s orthogonal architecture provides the flexibility of 16 fully addressable, single-cycle 16-bit CPU

registers and the power of a RISC. The modern design of the CPU offers versatility using only 27 easy-to-understand instructions and seven consistent addressing modes. This results in a 16-bit low-power CPU that has more effective processing, is smaller-sized and more code-efficient than other microcontrollers. Develop new ultra-low power, high-performance applications at a fraction of the code size.

15 RO/PC Program Counter R1/SP Stack Pointer R2/SR/CG1 Status

0

R3/CG2 Constant Generator R4 General Purpose

R15

General Purpose

The MSP430 CPU core with sixteen 16-bit registers, 27 core instructions and seven addressing modes results in higher processing efficiency and code density.

Ultra-Low Power Performance The MSP430 was designed to provide industry-leading ultra-low power performance. A flexible clocking system, multiple operating modes and zero-power alwayson brown-out reset (BOR) are implemented to reduce power consumption and dramatically extend battery life. The MSP430 BOR function is always active, even in all low-power modes to ensure the most reliable performance possible. The MSP430 CPU architecture with 16 registers, 16-bit

data and 16-/20-bit address buses minimizes power consuming fetches to memory and a fast vectored-interrupt structure reduces the need for wasteful CPU software flag polling. Intelligent hardware peripheral features were also designed to allow tasks to be completed more efficiently and independent of the CPU. Many MSP430 customers have developed battery-based products that will last for over 10 years from the original battery!

Ultra-Low Power Checklist: • Multiple operating modes • 0.1µA RAM retention • <1µA real-time clock mode • Down to 165 µA/MIPS • Instant-on stable high-speed clock • 1.8V to 3.6V operation • Zero-power BOR • <50-nA pin leakage • CPU that minimizes CPU cycles per task • Low-power peripheral options

used by the high-speed peripherals. By design, the DCO is active and stable in 1µs (F2xx) or < 6µs (x1xx, x4xx, F5xx). MSP430 device-based solutions efficiently

use 16-bit RISC CPU high performance in very short burst intervals. This results in very high performance and ultra-low power consumption.

Flexible Clock System • Low-frequency auxiliary clock for ultralow power stand-by mode • High-speed master clock for highperformance processing • Stability over time and temperature The MSP430 MCU clock system is designed specifically for battery-powered applications. Multiple oscillators are utilized to support event-driven burst activity. A low-frequency Auxiliary Clock (ACLK) is driven directly from a common 32-kHz watch crystal or the internal very-lowpower oscillator (VLO) – with no additional external components.The ACLK can be used for a background real-time clock self wake-up function. An integrated highspeed digitally controlled oscillator (DCO) can source the master clock (MCLK) used by the CPU and sub-main clock (SMCLK)

Texas Instruments 3Q 2009

Very-Low Power Oscillator (VLO) Up to 20 kHz

ACLK 32 kHz

32.768 kHz fCrystal

Low-Power Peripherals

Control MCLK 100 kHz – 16 MHz Digitally Controlled Oscillator

CPU and Peripherals

Multiple oscillator clock system

Embedded Processing Guide


88

MSP430 Ultra-Low Power Microcontrollers

Silicon

Flash-Based F2xx MCU Family Featuring Lower Power and Up to 16 MIPS* with 1.8–3.6V Operation – Enha

Ultra-Low Power 16-bit RISC MSP430 MCUs are the industry’s lowest-power solution featuring a wide range of integrated peripherals for 8- to 16-bit batterypowered measurement applications. • Zero-power Brown Out Reset (BOR) • 1µs clock startup • <50-nA pin leakage

(F) Flash

MSP430F2001 MSP430F2011 MSP430F2002 MSP430F2012 MSP430F2003 MSP430F2013

I/O

16-Bit Timers2 A B

1 2 1 2 1 2

128 128 128 128 128 128

10 10 10 10 10 10

2 2 2 2 2 2

— — — — — —

     

1 2 4 8 2 4 8

128 128 256 256 256 512 512

16 16 16 16 22 22 22

3, 2 3, 2 3, 2 3, 2 3, 2 3, 2 3, 2

— — — — — — —

      

8 16 32

512 512 1024

32 32 32

3 3 3

3 3 3

  

8 16 32

512 512 1024

32 32 32

3 3 3

3 3 3

  

8 16 32

1024 2048 2048

32 32 32

3 3 3

3 3 3

  

8 16

1024 2048

48 48

3 3

3 3

 

32 48 60 56

4096 4096 2048 4096

48 48 48 48

3 3 3 3

7 7 7 7

   

32 48 60

4096 4096 2048

48 48 48

3 3 3

7 7 7

  

92 92 116 120

4096 8192 8192 4096

48/64 48/64 48/64 48/64

3 3 3 3

7 7 7 7

   

92 92 116 120

4096 8192 8192 4096

48/64 48/64 48/64 48/64

3 3 3 3

7 7 7 7

   

Watchdog

F21xx MSP430F2101 MSP430F2111 MSP430F2121 MSP430F2131 MSP430F2112 MSP430F2122 MSP430F2132

Integrated Peripherals • 10-/12-bit SAR ADC • 16-bit Sigma Delta ADC • 12-bit DAC • Comparator • LCD driver • Supply voltage supervisor (SVS) • Op-amps • 16-bit and 8-bit timers • Watchdog timer • UART/LIN • I2C • SPI • IrDA • Hardware multiplier • DMA controller • Temperature sensor • USB • LDO/PMM

F22x2 MSP430F2232 MSP430F2252 MSP430F2272

F22x4 MSP430F2234 MSP430F2254 MSP430F2274

F23x0 MSP430F2330 MSP430F2350 MSP430F2370

F23x MSP430F233 MSP430F235

F24x/2410

MSP430 Flash Emulation Tools • JTAG-based real-time in-system debugging and programming • CD-ROM includes IDE, assembler, linker, simulator and C compiler

MSP430F247 MSP430F248 MSP430F249 MSP430F2410

F24x1 MSP430F2471 MSP430F2481 MSP430F2491

The Flash Emulation Tool (FET) supports complete in-system development and is available for all MSP430 Flash devices. Programming, assembler/C sourcelevel debug, single stepping, multiple hardware breakpoints, full-speed operation and peripheral access are all fully supported in systems using JTAG.

Texas Instruments 3Q 2009

SRAM (B)

F20xx

Device Configuration • 1KB to 256KB Flash • Up to 16KB RAM • 14- to 100-pin options

The eZ430-F2013 USB development tool is available for only U.S. $20 and includes all the software and hardware you need to start your MSP430 design.

Program (KB)

F241x MSP430F2416 MSP430F2417 MSP430F2418 MSP430F2419

F261x MSP430F2616 MSP430F2617 MSP430F2618 MSP430F2619 1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. * See www.ti.com/msp430 for additional information.

Embedded Processing Guide


MSP430 Ultra-Low Power Microcontrollers

89

Silicon

ancements Include ±1% On-Chip Very-Low-Power Oscillator, Internal Pull-Up/Pull-Down Resistors and Low Pin-Count Options USCI3 Ch A: UART/LIN/ Ch B: IrDA/SPI I2C/SPI

BOR

SVS

USI4: I 2C/SPI

     

— — — — — —

— —    

— — — — — —

      

— — — — — — —

— — — — — — —

  

— — —

  

DMA

MPY (16×16)

Comp_A+

Temp Sensor

ADC Ch/Res

Additional Features

Packages

1-KU Price1

— — — — — —

— — — — — —

— — — — — —

  — — — —

— —    

slope slope 8ch, ADC10 8ch, ADC10 4ch, SD16 4ch, SD16

— — — — — —

14 PW, N, 16 RSA 14 PW, N, 16 RSA 14 PW, N, 16 RSA 14 PW, N, 16 RSA 14 PW, N, 16 RSA 14 PW, N, 16 RSA

0.55 0.65 0.80 0.95 1.20 1.35

— — — — 1 1 1

— — — — 1 1 1

— — — — — — —

— — — — — — —

      

— — — —   

slope slope slope slope 8ch, ADC10 8ch, ADC10 8ch, ADC10

— — — — — — —

20 DGV, DW, PW, 24 RGE 20 DGV, DW, PW, 24 RGE 20 DGV, DW, PW, 24 RGE 20 DGV, DW, PW, 24 RGE 28 PW, 32 RHB 28 PW, 32 RHB 28 PW, 32 RHB

0.75 0.80 1.10 1.40 1.55 1.65 1.75

— — —

1 1 1

1 1 1

— — —

— — —

— — —

  

12ch, ADC10 12ch, ADC10 12ch, ADC10

— — —

38 DA, 40 RHA 38 DA, 40 RHA 38 DA, 40 RHA

1.95 2.20 2.50

— — —

— — —

1 1 1

1 1 1

— — —

— — —

— — —

  

12ch, ADC10 12ch, ADC10 12ch, ADC10

(2) OPAMP (2) OPAMP (2) OPAMP

38 DA, 40 RHA 38 DA, 40 RHA 38 DA, 40 RHA

2.15 2.40 2.70

  

— — —

— — —

1 1 1

1 1 1

— — —

  

  

— — —

slope slope slope

— — —

40 RHA 40 RHA 40 RHA, 49 YFF

1.85 2.15 2.55

 

 

— —

1 1

1 1

— —

 

 

 

8ch, ADC12 8ch, ADC12

— —

64 PM, 64 RGC 64 PM, 64 RGC

2.40 2.90

   

   

— — — —

2 2 2 2

2 2 2 2

— — — —

   

   

   

8ch, ADC12 8ch, ADC12 8ch, ADC12 8ch, ADC12

— — — —

64 PM, 64 RGC 64 PM, 64 RGC 64 PM, 64 RGC 64 PM, 64 RGC

4.05 4.60 4.75 4.85

  

  

— — —

2 2 2

2 2 2

— — —

  

  

— — —

slope slope slope

— — —

64 PM, 64 RGC 64 PM, 64 RGC 64 PM, 64 RGC

3.70 4.25 4.40

   

   

— — — —

2 2 2 2

2 2 2 2

— — — —

   

   

   

8ch, ADC12 8ch, ADC12 8ch, ADC12 8ch, ADC12

— — — —

64 PM, 80 PN, 113 ZQW 64 PM, 80 PN, 113 ZQW 64 PM, 80 PN, 113 ZQW 64 PM, 80 PN, 113 ZQW

5.60 6.10 6.40 6.10

   

   

— — — —

2 2 2 2

2 2 2 2

   

   

   

   

8ch, ADC12 8ch, ADC12 8ch, ADC12 8ch, ADC12

(2) DAC12 (2) DAC12 (2) DAC12 (2) DAC12

64 PM, 80 PN, 113 ZQW 64 PM, 80 PN, 113 ZQW 64 PM, 80 PN, 113 ZQW 64 PM, 80 PN, 113 ZQW

7.10 7.60 7.90 7.60

2 Represents number of capture/compare registers and PWM output generators per timer. 3 USCI channel 1 supports UART/LIN, IrDA and SPI; USCI channel 2 supports I2C and SPI. 4 USI supports I2C or SPI.

Texas Instruments 3Q 2009

New products are listed in red.

Embedded Processing Guide


90

MSP430 Ultra-Low Power Microcontrollers

Silicon

Flash/ROM-Based x1xx MCU Family Offering 1.8–3.6V Operation, Up to 60 kB, 8 MIPS* and a Wide Range of Peripherals (C) ROM (F) Flash x11x1

MSP430F1101A MSP430C1101 MSP430F1111A MSP430C1111 MSP430F1121A MSP430C1121

SVS

USART: (UART/ SPI)

— — — — — —

— — — — — —

— — — — — —

— — — — — —

— — — — — —

 

 

— —

— —

— —

— —

 

— —

— —

1 1

3 3

— —

 

 

— —

48 48

3 3

3 3

 

— —

256 512

48 48

3 3

3 3

 

32 48 60

1024 2048 2048

48 48 48

3 3 3

7 7 7

32 48 60

1024 2048 2048

48 48 48

3 3 3

16 24 32

512 1024 1024

48 48 48

32 48 60 32 48 55

1024 2048 2048 5120 10240 5120

48 48 48 48 48 48

16-Bit Timers2 A B Watchdog BOR

Program (KB)

SRAM (B)

I/O

1 1 2 2 4 4

128 128 128 128 256 256

14 14 14 14 14 14

3 3 3 3 3 3

— — — — — —

     

4 8

256 256

14 14

3 3

— —

4 8

256 256

22 22

3 3

4 8

256 256

22 22

8 16

256 512

8 16

MPY DMA (16×16) Comp_A

Temp Sensor

ADC Ch/Res

Additional Features

Packages

1-KU Price1

     

— — — — — —

slope slope slope slope slope slope

— — — — — —

20 DGV, DW, PW, 24 RGE 20 DW, PW, 24 RGE 20 DGV, DW, PW, 24 RGE 20 DW, PW, 24 RGE 20 DGV, DW, PW, 24 RGE 20 DW, PW, 24 RGE

0.99 1.25 1.35 1.10 1.70 2.15

— —

— —

 

5ch, ADC10 5ch, ADC10

— —

20 DW, PW, 32 RHB 20 DW, PW, 32 RHB

2.00 2.25

— —

— —

 

— —

slope slope

— —

28 DW, PW, 32 RHB 28 DW, PW, 32 RHB

2.15 2.30

1 1

— —

— —

— —

 

8ch, ADC10 8ch, ADC10

— —

28 DW, PW, 32 RHB 28 DW, PW, 32 RHB

2.40 2.50

— —

1 1

— —

— —

 

 

8ch, ADC12 8ch, ADC12

— —

64 PM, PAG, RTD 64 PM, PAG, RTD

3.00 3.60

— —

— —

1 1

— —

— —

 

— —

slope slope

— —

64 PM, RTD 64 PM, RTD

2.00 2.30

  

— — —

— — —

2 2 2

— — —

  

  

  

8ch, ADC12 8ch, ADC12 8ch, ADC12

— — —

64 PM, PAG, RTD 64 PM, PAG, RTD 64 PM, PAG, RTD

5.05 5.75 6.05

7 7 7

  

— — —

— — —

2 2 2

— — —

  

  

— — —

slope slope slope

— — —

64 PM, RTD 64 PM, RTD 64 PM, RTD

4.60 5.30 5.60

3 3 3

3 3 3

  

  

  

1 with I2C 1 with I2C 1 with I2C

  

— — —

  

  

8ch, ADC12 8ch, ADC12 8ch, ADC12

(2) DAC12 (2) DAC12 (2) DAC12

64 PM, RTD 64 PM, RTD 64 PM, RTD

4.95 5.55 5.85

3 3 3 3 3 3

7 7 7 7 7 7

     

     

     

2 with I2C 2 with I2C 2 with I2C 2 with I2C 2 with I2C 2 with I2C

     

     

     

     

8ch, ADC12 8ch, ADC12 8ch, ADC12 8ch, ADC12 8ch, ADC12 8ch, ADC12

(2) DAC12 (2) DAC12 (2) DAC12 (2) DAC12 (2) DAC12 (2) DAC12

64 PM, RTD 64 PM, RTD 64 PM, RTD 64 PM, RTD 64 PM, RTD 64 PM, RTD

6.75 7.45 7.95 8.25 8.65 8.95

F11x2

MSP430F1122 MSP430F1132 F12x

MSP430F122 MSP430F123 F12x2

MSP430F1222 MSP430F1232 F13x

MSP430F133 MSP430F135 F13x1

MSP430C1331 MSP430C1351 F14x

MSP430F147 MSP430F148 MSP430F149 F14x1

MSP430F1471 MSP430F1481 MSP430F1491 F15x

MSP430F155 MSP430F156 MSP430F157 F16x1

MSP430F167 MSP430F168 MSP430F169 MSP430F1610 MSP430F1611 MSP430F1612 1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. number of capture/compare registers and PWM output generators per timer. *See www.ti.com/msp430 for additional information.

2 Represents

Texas Instruments 3Q 2009

Embedded Processing Guide


MSP430 Ultra-Low Power Microcontrollers

91

Silicon

Flash/ROM-Based x4xx MCU Family Offering 1.8–3.6V Operation, Up to 120 kB Flash/ROM, 8 MIPS with FLL + SVS and Integrated LCD Controller* 16-Bit Timers3 A B

Watchdog and Basic Timer

USCI Ch A: USART: UART/LIN/ Ch B: LCD MPY Temp BOR SVS (UART/SPI) IrDA/SPI I2C/SPI Segments DMA (16×16) Comp_A Sensor

(C) ROM Program SRAM (F) Flash (KB) (B) I/O x41x MSP430F412 4 256 48 3 —    — — — 96 — —  — MSP430C412 4 256 48 3 —    — — — 96 — —  — MSP430F413 8 256 48 3 —    — — — 96 — —  — MSP430C413 8 256 48 3 —    — — — 96 — —  — MSP430F415 16 512 48 3,5 —    — — — 96 — —  — MSP430F417 32 1024 48 3,5 —    — — — 96 — —  — F41x2    — 1 1 144 — —  — 16 512 56 2 — MSP430F4152    — 1 1 144 — —  — 8 512 56 2 — MSP430F4132 F42x MSP430F423 8 256 14 3 —    1 — — 128 —  —  MSP430F425 16 512 14 3 —    1 — — 128 —  —  MSP430F427 32 1024 14 3 —    1 — — 128 —  —  FW42x MSP430FW423 8 256 48 3, 5 —    — — — 96 — —  — MSP430FW425 16 512 48 3, 5 —    — — — 96 — —  — MSP430FW427 32 1024 48 3, 5 —    — — — 96 — —  — FE42xx MSP430FE423 8 256 14 3 —    1 — — 128 —  —  MSP430FE425 16 512 14 3 —    1 — — 128 —  —  MSP430FE427 32 1024 14 3 —    1 — — 128 —  —  MSP430FE4232 8 256 14 3 —    1 — — 128 —  —  MSP430FE4242 12 512 14 3 —    1 — — 128 —  —  F42x0 MSP430F4250 16 256 32 3 —   — — — — 56 — — —  MSP430F4260 24 256 32 3 —   — — — — 56 — — —  MSP430F4270 32 256 32 3 —   — — — — 56 — — —  FG42x0 MSP430FG4250 16 256 32 3 —   — — — — 56 — — —  MSP430FG4260 24 256 32 3 —   — — — — 56 — — —  MSP430FG4270 32 256 32 3 —   — — — — 56 — — —  F43x MSP430F435 16 512 48 3 3    1 — — 128/160 — —   MSP430F436 24 1024 48 3 3    1 — — 128/160 — —   MSP430F437 32 1024 48 3 3    1 — — 128/160 — —   F43x1 MSP430F4351 16 512 48 3 3    1 — — 128/160 — —   MSP430F4361 24 1024 48 3 3    1 — — 128/160 — —   MSP430F4371 32 1024 48 3 3    1 — — 128/160 — —   FG43x MSP430FG437 32 1024 48 3 3    1 — — 128  —   MSP430FG438 48 2048 48 3 3    1 — — 128  —   MSP430FG439 60 2048 48 3 3    1 — — 128  —   F44x MSP430F447 32 1024 48 3 7    2 — — 160 —    MSP430F448 48 2048 48 3 7    2 — — 160 —    MSP430F449 60 2048 48 3 7    2 — — 160 —    xG461x MSP430FG4616 92 4096 80 3 7    1 1 1 160     MSP430FG4617 92 8192 80 3 7    1 1 1 160     MSP430FG4618 116 8192 80 3 7    1 1 1 160     MSP430FG4619 120 4096 80 3 7    1 1 1 160     1 Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 3 Represents number of capture/compare registers and PWM output generators per timer. *See www.ti.com/msp430 for additional information.

Texas Instruments 3Q 2009

ADC Ch/Res

Additional Features

Package(s)

1-KU Price1

slope slope slope slope slope slope

— — — — — —

64 PM, RTD 64 PM, RTD 64 PM, RTD 64 PM, RTD 64 PM, RTD 64 PM, RTD

2.60 1.90 2.95 2.10 3.40 3.90

8ch, ADC10 8ch, ADC10

— —

64 PM, 48 RGZ 64 PM, 48 RGZ

1.70 1.90

(3) SD16 (3) SD16 (3) SD16

— — —

64 PM 64 PM 64 PM

4.55 5.05 5.45

slope slope slope

Flow-meter Flow-meter Flow-meter

64 PM 64 PM 64 PM

3.75 4.05 4.45

(3) SD16 (3) SD16 (3) SD16 (2) SD16 (2) SD16

E-meter E-meter E-meter E-meter E-meter

64 PM 64 PM 64 PM 64 PM 64 PM

4.90 5.40 5.95 3.50 3.70

5ch, SD16 5ch, SD16 5ch, SD16

DAC12 DAC12 DAC12

48 DL, RGZ 48 DL, RGZ 48 DL, RGZ

3.10 3.45 3.80

5ch, SD16 5ch, SD16 5ch, SD16

DAC12, (2) OPAMP DAC12, (2) OPAMP DAC12, (2) OPAMP

48 DL, RGZ 48 DL, RGZ 48 DL, RGZ

3.35 3.70 4.05

8ch, ADC12 8ch, ADC12 8ch, ADC12

— — —

80 PN, 100 PZ 80 PN, 100 PZ 80 PN, 100 PZ

4.45 4.70 4.90

slope slope slope

— — —

80 PN, 100 PZ 80 PN, 100 PZ 80 PN, 100 PZ

4.05 4.30 4.50

12ch, ADC12 (2) DAC12, (3) OPAMP 12ch, ADC12 (2) DAC12, (3) OPAMP 12ch, ADC12 (2) DAC12, (3) OPAMP

80 PN 80 PN 80 PN

6.50 7.35 7.95

8ch, ADC12 8ch, ADC12 8ch, ADC12

100 PZ 100 PZ 100 PZ

5.75 6.50 7.05

12ch, ADC12 12ch, ADC12 12ch, ADC12 12ch, ADC12

— — —

(2) DAC12, (3) OPAMP 100 PZ, 113 ZQW 9.45 (2) DAC12, (3) OPAMP 100 PZ, 113 ZQW 9.95 (2) DAC12, (3) OPAMP 100 PZ, 113 ZQW 10.35 (2) DAC12, (3) OPAMP 100 PZ, 113 ZQW 9.95 Preview products are listed in bold blue. 2 Up to 16 MIPS. Continued on the following page.

Embedded Processing Guide


92

MSP430 Ultra-Low Power Microcontrollers

Silicon

Flash/ROM-Based x4xx MCU Family Offering 1.8–3.6V Operation, Up to 120 kB Flash/ROM, 8 MIPS with FLL + SVS and Integrated LCD Controller (Cont’d)* 16-Bit Timers3 A B

Watchdog and Basic Timer

USCI Ch A: USART: UART/LIN/ Ch B: LCD MPY Temp BOR SVS (UART/SPI) IrDA/SPI I2C/SPI Segments DMA (16×16) Comp_A Sensor

(C) ROM Program SRAM (F) Flash (KB) (B) I/O xG461x (Continued) MSP430CG4616 92 4096 80 3 7    1 1 1 160     MSP430CG4617 92 8192 80 3 7    1 1 1 160     MSP430CG4618 116 8192 80 3 7    1 1 1 160     MSP430CG4619 120 4096 80 3 7    1 1 1 160     F47xx MSP430F47832 48 2480 72 3 3 WDT+   — 2 2 160 — 32×32   MSP430F47932 60 2560 72 3 3 WDT+   — 2 2 160 — 32×32   MSP430F47842 48 2048 72 3 3 WDT+   — 2 2 160 — 32×32   MSP430F47942 60 2560 72 3 3 WDT+   — 2 2 160 — 32×32   F471xx MSP430F471662 92 4096 72 3 3    — 2 2 160  32×32  — MSP430F471762 92 8192 72 3 3    — 2 2 160  32×32  — MSP430F471862 116 8192 72 3 3    — 2 2 160  32×32  — MSP430F471962 120 4096 72 3 3    — 2 2 160  32×32  — MSP430F471672 92 4096 72 3 3    — 2 2 160  32×32  — MSP430F471772 92 8192 72 3 3    — 2 2 160  32×32  — MSP430F471872 116 8192 72 3 3    — 2 2 160  32×32  — MSP430F471972 120 4096 72 3 3    — 2 2 160  32×32  — FG47x MSP430FG477 32 2 KB 48 3 3    — 2 2 128 — —  — MSP430FG478 48 2 KB 48 3 3    — 2 2 128 — —  — MSP430FG479 60 2 KB 48 3 3    — 2 2 128 — —  — F47x MSP430F477 32 2 KB 48 3 3    — 2 2 128 — —  — MSP430F478 48 2 KB 48 3 3    — 2 2 128 — —  — MSP430F479 60 2 KB 48 3 3    — 2 2 128 — —  — 1 Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 2 Up to 16 MIPS. 3 Represents number of capture/compare registers and PWM output generators per timer. *See www.ti.com/msp430 for additional information.

ADC Ch/Res

Additional Features

Package(s)

1-KU Price1

12ch, ADC12 12ch, ADC12 12ch, ADC12 12ch, ADC12

(2) DAC12, (3) OPAMP (2) DAC12, (3) OPAMP (2) DAC12, (3) OPAMP (2) DAC12, (3) OPAMP

100 PZ 100 PZ 100 PZ 100 PZ

7.65 8.05 8.40 8.05

(3) SD16 (3) SD16 (4) SD16 (4) SD16

— — — —

100 PZ 100 PZ 100 PZ 100 PZ

7.50 8.05 8.00 8.55

(6) SD16 (6) SD16 (6) SD16 (6) SD16 (7) SD16 (7) SD16 (7) SD16 (7) SD16

RTC RTC RTC RTC RTC RTC RTC RTC

100 PZ 100 PZ 100 PZ 100 PZ 100 PZ 100 PZ 100 PZ 100 PZ

TBD TBD TBD TBD TBD TBD TBD TBD

(1) SD16 (1) SD16 (1) SD16

DAC12, (2) OPAMP DAC12, (2) OPAMP DAC12, (2) OPAMP

80 PN, 113 ZQW 80 PN, 113 ZQW 80 PN, 113 ZQW

5.50 5.65 6.25

(1) SD16 (1) SD16 (1) SD16

DAC12 DAC12 DAC12

80 PN, 113 ZQW 80 PN, 113 ZQW 80 PN, 113 ZQW

4.70 5.20 5.75

New products are listed in red.

Flash-Based F5xx MCU Family Features Lowest Power Consumption, Up to 25 MIPS* with 1.8–3.6V Operation Starting at 12 MIPS

(F) Flash

MSP430F5514 MSP430F5515 MSP430F5524 MSP430F5525 MSP430F5526 MSP430F5527 MSP430F5528 MSP430F5529 MSP430F54183 MSP430F54193 MSP430F54353 MSP430F54363 MSP430F54373 MSP430F54383

Program SRAM (KB) (KB)

I/O

4 + 22 4 + 22 4 + 22 4 + 22 6 + 22 6 + 22 8 + 22 8 + 22 16 16 16 16 16 16

47 63 47 63 47 63 47 63 64 83 64 83 64 83

64 64 64 64 96 96 128 128 128 128 192 192 256 256

1

16-Bit Timers4 A B

5,3,3 5,3,3 5,3,3 5,3,3 5,3,3 5,3,3 5,3,3 5,3,3 5,3 5,3 5,3 5,3 5,3 5,3

7 7 7 7 7 7 7 7 7 7 7 7 7 7

Watchdog and RTC

PMM (BOR, SVS, SVM, LDO)

             

             

USCI Ch A: UART/LIN/ Ch B: IrDA/SPI I2C/SPI

2 2 2 2 2 2 2 2 2 4 2 4 2 4

2 2 2 2 2 2 2 2 2 4 2 4 2 4

DMA

MPY (32×32)

Comp_B

Temp Sensor

ADC Ch/Res

3 ch 3 ch 3 ch 3 ch 3 ch 3 ch 3 ch 3 ch 3 ch 3 ch 3 ch 3 ch 3 ch 3 ch

             

             

— —            

— — 12 ch ADC12 A 16 ch ADC12 A 12 ch ADC12 A 16 ch ADC12 A 12 ch ADC12 A 16 ch ADC12 A 16 ch ADC12 A 16 ch ADC12 A 16 ch ADC12 A 16 ch ADC12 A 16 ch ADC12 A 16 ch ADC12 A

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 2 Additional SRAM available if USB is disabled. 3 Revision A with 25 MIPS available in 4Q09. 4 Represents number of capture/compare registers per timer. *See www.ti.com/msp430 for additional information.

Texas Instruments 3Q 2009

Additional Features

Package(s)

USB 64 RGC, 80 ZQE USB 80 PN USB 64 RGC, 80 ZQE USB 80 PN USB 64 RGC, 80 ZQE USB 80 PN USB 64 RGC, 80 ZQE USB 80 PN 80 PN 18 MIPS 18 MIPS 100 PZ, 113 ZQW 18 MIPS 80 PN 18 MIPS 100 PZ, 113 ZQW 18 MIPS 80 PN 18 MIPS 100 PZ, 113 ZQW

1-KU Price1

3.55 3.65 3.55 3.70 3.80 3.90 3.95 4.00 3.30 3.65 3.90 4.30 4.40 4.85

Preview products are listed in blue.

Embedded Processing Guide


MSP430 Ultra-Low Power Microcontrollers

93

Silicon

Intelligent Peripherals With purely software-driven functions, the CPU is 100% active and consuming power. Effectively utilizing peripherals allows the CPU to be turned off to save power or work on other activities to

achieve the highest performance. MSP430 device peripherals are designed to require the least amount of software service. Additional hardware features allow CPU resources to focus more on differentiated

application-specific features and less on basic data handling. Lower-cost systems can be implemented using less software and lower power.

I/O—MSP430 devices have up to 12 digital I/O ports implemented. Each port has eight I/O pins. Every I/O pin is configurable for input or output direction, and can be individually read or written to. Ports P1 and P2 have interrupt capability. MSP430F2xx, 5xx and some 4xx devices feature built-in individually configurable pull-up or pulldown resistors. LCD/LCD_A—The LCD/LCD_A controller directly drives LCD displays with automatic signal generation for up to 160 segments. The MSP430 LCD controller can support static, 2-mux, 3-mux and 4-mux LCDs. The LCD_A module includes an integrated charge pump for contrast control. MPY—The hardware multiplier module supports 8/16-bit × 8/16-bit signed and unsigned multiply with optional “multiply and accumulate” functionality. It is a peripheral which does not interfere with CPU activities and can be accessed by the DMA. The MPY on new F47xx and F5xx devices features up to 32×32-bit operation. OpAmp—The MSP430 integrated operational amplifiers feature single-supply, low-current operation with rail-to-rail outputs and programmable settling times. Internal, programmable feedback resistors and connections between multiple op amps allow for a variety of software-selectable configuration options including: unity gain mode, comparator mode, inverting PGA, non-inverting PGA, differential and instrumentation amplifier. Real-Time Clock / Basic Timer—The BT has two independent 8-bit timers which can be cascaded to form a 16-bit timer/counter. Both timers can be read and written by software. The BT is extended to provide an integrated RTC. An internal calendar compensates for months with less than 31 days and includes leap year correction. SCAN IF—The Scan IF module is a programmable state machine with analog front end used to automatically measure linear or rotational motion with the lowest possible power consumption. The module features support for different types of LC and resistive sensors and for quadrature encoding. SD16/SD16_A—The SD16/SD16_A module features up to three 16-bit sigma-delta A/D converters with an internal 1.2V reference. Each has up to eight fully differential multiplexed inputs including a built-in temperature sensor. The converters are second-order oversampling sigmadelta modulators with selectable oversampling ratios of up to 1024 (SD16_A) or 256 (SD16).

SVS—The supply voltage supervisor (SVS) is a configurable module used to monitor the AVCC supply voltage or an external voltage. The SVS can be configured to set a flag or generate a POR reset when the supply voltage or external voltage drops below a user-selected threshold. Timer_A/Timer_B—Timer_A and Timer_B are asynchronous 16-bit timer/counters with up to seven capture/compare registers and four operating modes. The timers support multiple capture/ compares, PWM outputs and interval timing and also have extensive interrupt capabilities. USART—The universal synchronous/asynchronous receive/transmit (USART) peripheral interface supports asynchronous RS-232 and synchronous SPI communication with one hardware module. The MSP430F15x and MSP430F16x USART module also supports I2C. The module supports programmable baud rate and independent interrupt capability for receive and transmit. USB—The USB module is fully compliant with the USB 2.0 specification and supports control, interrupt and bulk transfers at 12-Mbps data rate (full speed). The module supports USB suspend, resume and remote wakeup operations and can be configured for up to eight input and eight output endpoints. The module includes an integrated physical interface (PHY), a phase locked loop (PLL) for USB clock generation, and a flexible power supply system enabling bus-powered and self-powered devices. USCI—The universal serial communication interface (USCI) module features two independent channels which can be used simultaneously. The asynchronous channel (USCI_A) supports UART mode, SPI mode, pulse shaping for IrDA and automatic baud rate detection for LIN communications. The synchronous channel (USCI_B) supports I2C and SPI modes. USI—The universal serial interface (USI) module is a synchronous serial communication interface with a data length of up to 16 bits and can support SPI and I2C communication with minimal software. Watchdog+—The WDT+ performs a controlled system restart after a software problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog function is not needed in an application, the module can be configured as an interval timer and can generate interrupts at selected time intervals.

Peripheral Overview ADC10/ADC12—The ADC10/12 module supports fast, >200ksps, 10-bit or 12-bit analog-todigital conversions. The module features a 10- or 12-bit SAR core with 5, 8 or 12 input channels, sample select control, 1.5/2.5V reference generator and internal temperature sensor. ADC10 features a data transfer controller (DTC) and ADC12 features a 16-word conversion-and-control buffer. These added features allow samples to be converted and stored without CPU intervention. BOR—The brown-out reset (BOR) circuit detects low supply voltages and reset circuit resets the device by triggering a POR signal when power is applied or removed. MSP430’s zero-power BOR circuit is continuously turned on, including in all low-power modes. Comparator_A/Comparator_A+—The Comparator_A/A+ module supports precision slope analog-to-digital conversions, supply voltage supervision and monitoring of external analog signals for accurate voltage and resistor value measurement. The module features a selectable reference voltage generator and input multiplexer. (Comp A+) DAC12—The DAC12 module is a 12-bit, voltage output DAC featuring internal or external reference selection, programmable settling time for optimal power consumption and can be configured in 8-bit or 12-bit mode. When multiple DAC12 modules are present, they may be grouped together for synchronous update operation. DMA—The direct memory access (DMA) controller transfers data from one address to another, without CPU intervention, across the entire address range. The DMA increases the throughput of peripheral modules and reduces system power consumption. The module features up to three independent transfer channels. ESP430 (integrated in FE42x devices)—The ESP430CE1 module incorporates the SD16, hardware multiplier and ESP430 embedded processor engine for single-phase energy metering applications. The module performs metering calculations independent of the CPU. FLASH—The MSP430 Flash memory is bit-, byte- and word-addressable and programmable. The main memory segment size is 512 Bytes. Each MSP430 also has up to 256 Bytes of Flash Information Memory for EEPROM emulation. Flash can be read, erased and written (100,000 cycles) through the JTAG debugging interface, the Bootstrap Loader and in system.

Texas Instruments 3Q 2009

Embedded Processing Guide


94

MSP430 Ultra-Low Power Microcontrollers

Tools Development Kits Packages Supported 14-pin PW (TSSOP) 20-/28-pin PW (TSSOP) 38-pin DA (TSSOP) MSP430F23x0 40-pin DHA (QFN) 48-pin DL (SSOP) 64-pin PM (LQFP) 80-pin PN (LQFP) 100-pin PZ (LQFP) MSP430F5xx 100-pin PZ (TQFP) 80-pin PN (LQFP) 64-pin PM (LQFP) MSP430F5xx 100-pin PZ (TQFP) 80-pin PN (LQFP)

Price1 149 149 149 149 149 149 149 149 149 149 75 75 75

Contents Programmer and target board 3 target boards Interface, (2) target boards, battery board Target board, battery board Interface, (2) target boards, battery board, solar energy harvesting board Interface, (3) target boards, 2 battery boards

Included Devices MSP430F2013 MSP430F2012 MSP430F2274, CC2500 MSP430F2274, CC2500 MSP430F2274, CC2500 MSP430F2274, CC2480

Price1 20 10 49 20 149 99

Board Features Microphone, audio output buzzer, LCD, capacitive touch-pad, 2× push buttons, prototyping space, RS-232 communication interface, RF connectivity Socket for MSP430, 3-axis accelerometer, microphone, audio output, dot matrix LCD, joystick, RF connectivity, USB connectivity

Included Devices MSP430FG4618, MSP430F2013

Price1 99

Contents USB FET programming tools and target board

Target board only

Part Number MSP-FET430U14 MSP-FET430U28 MSP-FET430U38 MSP-FET430U23x0 MSP-FET430U48 MSP-FET430U64 MSP-FET430U80 MSP-FET430U100 MSP-FET430U5x100 MSP-FET430U80USB MSP-TS430PM64 MSP-TS430PZ5x100 MSP-TS430PN80USB

eZ430 Tools Part Number eZ430-F2013 eZ430-F2012 eZ430-RF2500 eZ430-RF2500T eZ430-RF2500-SEH eZ430-RF2480

Experimenter Boards Part Number MSP-EXP430FG4618 MSP-EXP430F5438

MSP430F5438

149

Software Development Tools Part Number IAR-KICKSTART MSP-CCE430 MSP-CCE430PRO

Contents Include IAR Embedded Workbench Kickstart Edition (4 KB limited) Code Composer™ Essentials Core Edition (16 KB limited) Code Composer Essentials Professional (Unrestricted)

Devices Supported All All All

Price1 Free Free 499

Devices Supported All All (8 devices at one time) All (except MSP430F20xx)

Price1 99 199 49

Debugging and Programming Interfaces Part Number MSP-FET430UIF MSP-GANG430 MSP-FET430PIF 1Suggested

PC Port USB Serial Parallel

Contents Include Interface only Production programmer Interface only

resale price per unit in U.S. dollars.

Texas Instruments 3Q 2009

New products are listed in bold red.

Embedded Processing Guide


Complementary Products for the MSP430 Family

95

Complementary Analog Products

Amplifiers for MSP430 Microcontrollers Slow mode (Low frequency signals) Slow mode (Low frequency signals) Slow mode (Low frequency signals) Slow mode (Low frequency signals) Slow mode (Low frequency signals) Slow mode (Low frequency signals) Medium / fast modes Medium / fast modes Medium / fast modes Medium / fast modes Medium / fast modes Instrumentation amplifiers Instrumentation amplifiers Instrumentation amplifiers Instrumentation amplifiers Instrumentation amplifiers

Key Feature Ultra-low power Ultra-low power Ultra-low power Ultra-low power Ultra-low power Programmable High performance High performance High performance High performance High performance Measuring very small signals Measuring very small signals Measuring very small signals Measuring very small signals Measuring very small signals

Device OPA369 OPA349 OPA379 OPA333 TLV276x PGA112/113 OPA37 OPA334 OPA376 OPA363/4 TLV278x INA321 INA322 INA331 INA332 INA333

Device Features 1.4-µA Iq (Max) RRIO, zero crossover, 12 kHz 2-µA Iq (Max), RRIO, 10-pA max IB, 70 kHz 5.5-µA Iq (Max), RRIO, 1.5-mV max offset, 90kHz 25-µA Iq (Max), zero drift, 1.1-uVPP noise, 350 kHz 28-µA Iq (Max), 15-pA max offset, RRIO, 500 kHz RRIO, single supply, 2-ch MUX, easy SPI interface. Up to 200× gain with 4-µA shutdown 20 nV/Hz, 25-µV Vos, zero drift, RRIO, 0.9 MHz 5-µV Vos, shutdown, RRO, 2 MHz 25-µV Vos, 7.5 nV/Hz, 5 MHz –500-µV Vos, zero crossover, RRIO, 7 MHz RRIO, shutdown, 8 MHz 60 µA, 10-pA bias, RRO, shutdown 60 µA, 10-pA bias, RRO, shutdown 500 µA, 10-pA bias, RRO, 2 MHz, shutdown 100 µA, 10-pA bias, RRO, 2 MHz, shutdown 75 µA, 25-µV offset, RRIO, zero drift

Data Converters for MSP430 Microcontrollers Analog-to-digital converter

Key Feature Higher speed, precision

Analog-to-digital converter Analog-to-digital converter Analog-to-digital converter Analog-to-digital converter

Higher speed, precision Higher speed, precision Higher speed, precision Higher resolution

Analog-to-digital converter Analog-to-digital converter Analog-to-digital converter Digital-to-analog converter Digital-to-analog converter Digital-to-analog converter

Higher resolution Higher resolution Higher resolution Precision Precision Precision

Device ADS8318

Device Features 16-bit, 500 kSPS, ±1 LSB INL, single supply, 95.2dB SNR @ 10 kHz, 720 µA @ 100kSPS. Performance upgrade MSP430 on-board ADC ADS8326 16-bit 250 kSPS, single supply, 74 µA @ 10kSPS & Vdd= 2.7V, ±1.5 LSB max INL, 91 dB SNR ADS7886/7/8 12-/10-/8-bit, 1 MSPS, 1.5 mA and auto power down, easy speed upgrade ADS7866/7/8 12-/10-/8-bit, 200 kSPS, 100 µA and auto power down, easy power upgrade ADS1248 24-bit, dual-matched current sources, 8 GPIO, low-drift internal reference 4 ppm/°C (typ), oscillator, sensor, burnout detect, 50-/60-Hz rejection. Great for MSP430-based temperature solutions. ADS1232 24-bit, ultra-low noise (17 nV RMS) bridge sensor ADC, designed for weigh-scale MSP430 systems ADS1100 16-bit, internal reference, oscillator, PGA, 90 µA (240 with ref), easily add an SD16 to MSP430 ADS1000 12-bit, low cost, 90 µA, easy interface, PGA, OSC, simple Delta Sigma addition to MSP430 systems DACx311/8411 Tiny, low-power 8- to 16-bit DACs with wide supply and temp ranges. <100 µA/ch., ±1 LSB INL, 5 µS settling time DAC7552 Small, low-power, low-glitch DAC. ±1 LSB INL (max), glitch energy: 0.1 nV-s, 200 µA/ch, 5 µS settling time DAC8830 Low-power, high-speed DAC, ±1 LSB INL, 6 µA typ, 1 µs max settling, low noise: 18 nV/Hz; gain drift: ±0.1 ppm/°C

Temperature Sensors for MSP430 Microcontrollers Key Feature Local Remote + local Remote + local

Device TMP102 TMP400 TMP421/422

Device Features 0.5°C accuracy, 10 µA active current with shutdown 1°C accuracy with N-factor and series resistance Tiny SOT-23-8 1°C accuracy with N-factor and series resistance correction

Voltage References for MSP430 Microcontrollers Key Feature Highest accuracy Lowest power

Device REF32xx REF33xx

Device Features 4 ppm/°C, 0.2% accuracy, 100 µA, SOT23-6 voltage reference 3.9 µA, 0.15% initial accuracy, SC70-3, 30 ppm/°C drift

Interface Products for MSP430 Microcontrollers Device Type I/O Expanders I/O Expanders Line Drivers USB Touch-Screen Controllers

Device TCA64xx PCA953x TRS3227E TUSB3410 TSC2004

Touch-Screen Controllers

TSC2006

Touch-Screen Controllers

TSC2007

Texas Instruments 3Q 2009

Device Features 1.8V I/O expander with interrupt and reset. Great for keypad control. 16-bit low-power bi-directional I/O expander. 3V–5.5V single-channel RS-232 line driver/receiver with ±15-kV IEC ESD protection. A must have for remote RS-232 communication. Add full-speed USB connectivity to the MSP430 using the UART. App note available. 800-µW operation with auto shutdown. I2C interface. Includes noise averaging and zone-detection preprocessing, optimal support for the MSP430. Includes ESD protection. 707-µW operation with auto shutdown, SPI interface. Includes noise averaging and zone-detection processing, optimal support for the MSP430. Includes ESD protection. Lowest power controller, 160 µW operation. I2C interface, auto power down, 4-wire interface. Optimal for the lowest power demands. Includes noise-filter preprocessing. Includes ESD protection.

Embedded Processing Guide


96

Complementary Products for the MSP430 Family

Complementary RF Products Standard-Based Networks • IEEE 802.15.4 • ZigBee® Proprietary Networks • SimpliciTI™ Network Protocol System-on-Chip Solutions TI also offers 8051-based System-onChip solutions. For IEEE 802.15.4 and ZigBee networks, use CC2430/2431; for sub-1 GHz use CC1110/1111 and for 2.4 GHz, CC2510/2511 are recommended. Getting Started with MSP430 and Low-Power RF Devices The MSP430 Code Library for TI RF devices makes communicating to an RF device simple through a MSP430 SPI, USART, USI, USCI or even “bitbanged” I/O port. For more information, visit www.ti.com/msp430_lprf.

MSP430 Ultra-Low Power MCUs and Low-Power RF Devices The Texas Instruments portfolio of MSP430 microcontrollers and Low-Power RF devices are an ideal fit for low-power wireless networks, including standardbased IEEE 802.15.4 and ZigBee® or other proprietary networks. The MSP430 product line offers the unique combination of ultra-low power consumption and

power-saving mechanisms, along with a high-performance 16-bit CPU and integrated analog. Together, MSP430 and TI’s Low-Power RF devices help wireless designers achieve low power consumption, long range and reliable performance at a competitive price.

MSP430 and Low-Power RF Selection Table Standard-Based Network IEEE 802.15.4 ZigBee® CC2520 CC2520 with TIMAC

MSP430F261x MSP430F543x

MSP430F261x MSP430F543x

Proprietary Network

ZigBee PRO SimpliciTI™ CC2529 with TIMAC Sub-1 GHz 2.4 GHz and Z-Stack™ software CC1101/CC1150, CC102x/ CC2500/CC2550 CC1070 MSP430F261x MSP430F543x MSP430 device with >6-KB MSP430 device with >6-KB Flash and 1-KB RAM Flash and 1-KB RAM

These are recommended devices. Any MSP430 device can be used depending on Flash/RAM requirements of the software solution.

MSP430 Ultra-Low Power MCUs and TI-RFid™ Devices The TI portfolio of MSP430 microcontrollers and TI-RFid devices are an ideal fit for low-power RFID reader and transponder solutions. Together, MSP430 and

TI-RFid devices help RF designers achieve low power consumption, best-in-class read range and reliable performance at a competitive price.

MSP430 and TI-RFid Selection Table Applications

TI-RFid

TI MCU

Access control, digital door lock, medical, POS, ticketing, eMetering prepayment, asset tracking, inventory control, product authentication TRF7960 TRF7961 13.56-MHz reader MSP430F2x

Automobile immobilizer, asset tracking, access control, wireless payment, animal tracking, production tracking, medical TMS3705 LF 134-KHz reader MSP430F2x

Ultra-low power data logger, wireless battery-less sensor interface, multi-purpose LF interface to a microcontroller, remote control applications TMS37157 134-KHz transponder IC (RTM: 3Q09) MSP430F2x

These are recommended devices. Many MSP430 and TI-RFid devices can be used depending on Flash/RAM requirements of the software solution.

For more information visit www.ti.com/msp430_rfid.

Texas Instruments 3Q 2009

Embedded Processing Guide


Complementary Products for the MSP430 Family

97

Complementary RF Products

Low-Power RF for MSP430 Microcontrollers Network Proprietary

Key Feature 2.4 GHz

Device CC2500

Proprietary Proprietary Proprietary Zigbee® Zigbee

2.4 GHz Sub 1 GHz Sub 1 GHz Z-Accel Network Processor SoC

CC2550 CC1101 CC1150 CC2480 CC2430/1

Device Features Transceiver with easy SPI interface to MSP430. Low power-down (0.4 µA) and large FIFO designed to maximize power-down time. Lowest-cost transmitter with easy SPI interface to MSP430. Excellent selectivity and very low current consumption. Transceiver with easy SPI interface to MSP430. Fast PLL turn on designed for frequency hopping. Low-cost transmitter with easy SPI interface to MSP430. Fast PLL turn on designed for frequency hopping. Zigbee stack and radio on one chip. Easy-to-use API with 10 calls designed to run on MSP430. Zigbee SoC with 32-MHz 8051. Use MSP430 for measurement and application processing. Industry-leading performance and hardware location engine. Easy MSP430 interface.

Application-Specific Product Recommendations Application Alarm and security (smoke, motion, glass break detector) Automated meter reading (AMR) for utility meters, advanced meter infrastructure (AMI) Wireless sensor networks (monitoring, asset tracking) Building automation (light, temperature, process control) PC peripherals Home and leisure equipment (remote controls, gaming, toys, home electronics) Medical (non-implants)

Texas Instruments 3Q 2009

MSP430 and RF Solution MSP430F20xx, MSP430F22xx CC1101/CC1150, CC1020/CC1070 MSP430FE42x, MSP430FW42x, CC1101/CC1150, CC1020/CC1070, MSP430F41x, MSP430F2618 CC2480, CC2520 MSP430F20xx, MSP430F41x CC1101/CC1150, CC2500/CC2550, CC2480 MSP430F20x1, MSP430F21x1, CC1101/CC1150, CC2500/CC2550, MSP430F41x, MSP430 F2618 CC2520, CC2480 MSP430F22x2, MSP430F21x1 CC2500/CC2550, CC2520 MSP430F20xx, MSP430F23/24x, CC1101/CC1150, CC2500/CC2550 MSP430F41x, MSP430F43x MSP430FG4xxx, MSP430F41x CC1101/CC1150, CC2500/CC2550, CC2480, CC2520

System-on-Chip CC1110/CC1111, CC251x, CC243x CC1110/CC1111, CC251x, CC243x CC1110/CC1111, CC251x, CC243x, CC2520 CC1110/CC1111, CC251x, CC243x CC2430, CC251x CC1110/CC1111, CC251x CC1110/CC1111, CC243x, CC251x

Embedded Processing Guide


98

Complementary Products for the MSP430 Family

Complementary Power Management Products

TPS78233

TPS780330220

TPS62203

TPS62300

150 mA LDO Fixed 3.3Vout

150 mA LDO 3.3V / 2.2Vout

300 mA DC/DC Converter Fixed 3.3Vout

500 mA DC/DC Converter Fixed 3.3Vout

TPS61221

TPS62111

TPS63001

200 mA Boost Converter Fixed 3.3Vout

1500 mA DC/DC Converter Fixed 3.3Vout

1.2 A Buck Boost DC/DC Converter

Power Management Products for MSP430 Microcontrollers Key Careabouts Simple solution Simple, long battery life High efficiency Tiny, high efficiency Ultra-low input voltage High-input voltage Wide-input voltage range

Texas Instruments 3Q 2009

Device TPS78233 TPS780330220 TPS62203 TPS62300 TPS61221 TPS62111 TPS63001

Description 150 mA, ultra-low quiescent current, Iq 1µA, low-dropout linear regulator 150 mA, LDO reg, ultra-low power, Iq 500 nA with pin-selectable, dual-level output voltage High efficiency, SOT-23 step-down, DC-DC converters 500-mA, 3-MHz synchronous step-down converter in chip scale packaging Tiny, low-input (down to 0.7V) voltage boost converter 17V, 1.5-A synchronous step-down converter with shutdown current < 2 µA High-efficient single-inductor buck-boost converter with up to 96% efficiency

Embedded Processing Guide


Stellaris® Family of Microcontrollers

99

Silicon

Stellaris 32-Bit ARM® Cortex™-M3 MCUs Get samples, data sheets, tools and app reports at: www.ti.com/stellaris

256-KB Flash

NVIC

ARM Cortex-M3

SWD

100 MHz

32

96-KB SRAM

32

3 UARTs

ROM Clocks, Reset System Control Systick Timer

2 SSI/SPI 10/100 Ethernet MAC + PHY IEEE 1588

4 Timer/PWM/CCP Each 32-bit or 2×16-bit

USB Full Speed Host / Device / OTG

GPIOs

3 CAN

32-ch DMA

2 I2C

EPI

32

Precision Oscillator

I2S 2 Quadrature Encoder Inputs

System

R T C

8 PWM Outputs

PWM Generator

Analog

In addition to MCUs configured for general-purpose real-time systems, the Stellaris family offers distinct solutions for advanced motion control and energy-conversion applications, real-time networking and real-time internetworking and combinations of these applications including connected motion control and hard real-time networking. Welcome to the future of microcontrollers!

Why Choose the Stellaris Family? Designed for serious microcontroller applications, the Stellaris family provides the entry into the industry’s strongest ecosystem, with code compatibility ranging from U.S. $1 to 1 GHz. • Superior integration saves up to U.S $3.28 in system cost • Over 140 Stellaris family members to choose from • Real MCU GPIOs – all can generate interrupts, are 5V-tolerant and have programmable drive strength and slew rate control • Advanced communication capabilities, including 10/100 Ethernet MAC/PHY, USB and USB OTG and CAN controllers • Sophisticated motion-control support in hardware and software • Both analog comparators and ADC functionality provide on-chip system options to balance hardware and software performance • Development is easy with the royaltyfree StellarisWare™ software 32

JTAG

Serial Interfaces

The Stellaris family is positioned for cost-conscious applications requiring significant control processing and connectivity capabilities, including motion control, monitoring (remote, fire/security, etc.), HVAC and building controls, power and energy monitoring and conversion, network appliances and switches, factory automation, electronic point-of-sale machines, test and measurement equipment, medical instrumentation and gaming equipment.

Why Choose Cortex-M3? Cortex-M3 is the MCU version of ARM’s V7 instruction set architecture family of cores: • Optimized for single-cycle flash usage • Deterministic, fast interrupt processing: always 12 cycles, or just 6 cycles with tail chaining • Three sleep modes with clock gating for low power • Single-cycle multiply instruction and hardware divide • Atomic operations • ARM Thumb2 mixed 16-/32-bit instruction set • 1.25 DMIPS/MHz–better than ARM7 and ARM9 • Extra debug support including data watchpoints and flash patching Capabilities beyond ARM7 for the microcontroller market: • Requires approximately 1/2 the flash (code space) of ARM7 applications • 2–4 times faster on MCU control applications • No assembly code required – ever!

Motion Control

Overview TI’s Stellaris is the industry’s leading family of robust, real-time microcontrollers (MCUs) based on the revolutionary Cortex™-M3 technology from ARM®. The award-winning Stellaris 32-bit MCUs combine sophisticated, flexible mixed-signal system-on-chip integration with unparalleled real-time multi-tasking capabilities. Complex applications previously impossible with legacy MCUs can now be accommodated with ease by powerful, cost-effective and simple-to-program Stellaris MCUs. With over 140 members in its family, the Stellaris family offers the widest selection of preciselycompatible MCUs in the industry.

PWM Interrupt

T

Stellaris family block diagram

Texas Instruments 3Q 2009

Embedded Processing Guide


100

Stellaris® Family of Microcontrollers

Silicon and Tools Memory and Speed

General-Purpose Timer Modules

Motion Control PWM

CAN MAC

USB Full Speed

UART

I2C

SSI/SPI

I2S

ADC Channels

ADC Speed (Ksps)

Internal Temp Sensor

LDO Voltage Regulator

Analog Comparators

Digital Comparators

GPIOs (5 V)

Hibernate

– – – –

– – – –

– – – –

– – – –

1 2 2 2

1 1 1 1

1 1 1 1

– – – –

– 8 8 8

– 500 1000 1000

–   

   

2 3 3 3

– – – –

18 36 36 36

– – – –

4

8

1

8

 8 3

2

3

2

2

8

1000

3

60

 64-LQFP, 100-LQFP, 108-BGA

50

4

8

1

6

 6 1

2   –

3

2

2

8

1000

3

46

 100-LQFP, 108-BGA

LM3S3000s 4 128 64  50

4

8

1

8

 8 4

1

– O/H/D

3

2

2

8

1000

3

61

LM3S5000s 12 256 96  80  4

8

2

8

 8 4

2

2 O/H/D

3

2

2

16 1000

3

7

71

 64-LQFP, 100-LQFP  64-LQFP, 100-LQFP

4

8

1

6

 6 1

2   3

3

2

2

8

1000

3

46

 100-LQFP, 108-BGA

4

8

1

6

 6 1

2   3

3

2

2

8

1000

3

46

 100-LQFP, 108-BGA

LM3S9000s1 6 256 96  100  4

8

2

8

 8 4

2   2 O/H/D

3

2

2

16 1000

3

7

65

 100-LQFP

Package Options

10/100 Ethernet MAC + PHY IEEE 1588

– – 1 1

Internal Precision Oscillator

– 1 1 1

ROM S/W Library

   

Max Speed (MHz)

2 6 6 6

SRAM (KB)

1 1 1 1

Flash (KB)

4 6 6 6

MCUs in Series

2 3 3 3

Series/Device

QEI

Digital

RTC Outputs Fault Inputs

Analog ADC (10-Bit)

16-Bit Timer Watchdog Timers CCP

Serial Interfaces

32-Bit Timer

Core

Low-Pin-Count, Real-Time MCUs LM3S100s LM3S300s LM3S600s LM3S800s

2 8 8 16 11 32 9 64

2 4 8 8

– – – –

20 25 50 50

– – – –

– 6 6 6

28-SOIC 48-LQFP 48-LQFP 48-LQFP

High-Pin-Count, Real-Time MCUs LM3S1000s 29 256 64  50

Ethernet-Connected MCUs LM3S6000s 19 256 64

USB-Connected MCUs

CAN-Connected MCUs LM3S8000s 12 256 64

50

Ethernet + CAN-Connected MCUs LM3S8000s 12 256 64

50

Ethernet USB + CAN MCUs 1

Include external 32-bit peripheral interface

Product Development We provide a range of support designed to get your applications to market faster and easier than ever before. Compact, versatile and connected! Our evaluation kits provide a low-cost and effective means of evaluating our microcontrollers and getting a jump start on your design www.ti.com/stellariskits:

Stellaris LM3S811 Evaluation Kit

Stellaris LM3S1968 Evaluation Kit

Stellaris LM3S2965 Evaluation Kit

Stellaris LM3S3748 Evaluation Kit

Stellaris LM3S8962 Evaluation Kit

Stellaris LM3S9B92 Evaluation Kit

Stellaris LM3S9B90 Evaluation Kit

Stellaris LM3S9B96 Development Kit

Texas Instruments 3Q 2009

Stellaris LM3S6965 Evaluation Kit

Embedded Processing Guide


System Solutions

101

Audio

Audio Systems Solutions Get additional information at: www.ti.com/audio

Additional Resources Audio Solutions Guide

TI’s complete audio solutions offer best-in-class silicon, software, application knowledge and support and include a variety of flexible, costefficient, high-performance analog and DSP products. Design resources like the Audio Solutions Guide provide valuable technical information, including system block diagrams, detailed product specifications, design considerations and more, helping you get to market fast. Download the Audio Solutions Guide to see the complete spectrum of products that meet the demands of your audio signal chain. www.ti.com/audioguide.

Audio Systems Overview Advances in digital audio technologies offer consumers the ability to enjoy their audio at anytime, anywhere and on any device. This new trend in audio is enabled by DSPs that offer this convenience without any sacrifice in quality. DSP technology is also at the forefront of another amazing trend in consumer audio products, the multichannel listening experience. Due to the rapid drop in price points, consumers are enjoying music, movies and television on high-quality, DSP-based 5.1 audio systems.

digital audio techniques, TI provides silicon, software, systems expertise and support focused solely on digital audio technologies. TI currently offers a host of products including DSPs, Class-D amplifiers, A/Ds, D/As and SRCs that are designed from the ground up to deliver the most realistic audio experience possible at costeffective price points. Since TI solutions are based on programmable platforms and flexible analog components, developers have maximum flexibility in designing products that meet the needs of the rapidly changing digital audio landscape.

Just as the consumer audio market is benefiting from advances in audio technology, the professional and musical instrument markets are delivering new products that maintain the highest sonic quality at affordable price points. By leveraging DSP horsepower, these markets are giving musicians and sound engineers the ability to create the exact sounds they want.

TI Audio Systems Benefits • Highest performance allows room for innovation with application-specific digital entertainment solutions • Programmability and scalability provide open-audio platforms for better differentiation • Compact form factor for cool product designs and great sound • Easy-to-use, application-specific software and tools get you to market faster

In order to enable designers of digital audio products to leverage advanced

Device Production

C672x 350 MHz

Future

Segment

Targeted Applications • Musical instruments • Instrument amplifiers • Multi-track recorders • Synthesizers • Guitar effects • Professional audio • Digital mixers • Signal processors • Broadcast encoders • DSP farms • Home audio • AV receivers • DVD receivers • Home audio jukeboxes • Networked audio players • Portable audio devices • HDD-based MP3 players • Flash/CD-based MP3 players • Wireless audio headphones • Digital radio

C67x Next

High-Performance Audio • Broadcast audio • Commercial audio • High-end consumer audio • Professional audio/digital mixers

C67x™ 300 MHz

C55x™ 300 MHz

C54x™ 160 MHz C54x 160 MHz

C672x 350 MHz ® ARM +DSP ARM+DSP Next C55x C55x OMAP35x™ Next 300 MHz C55x Next C55x OMAP35x™ 300 MHz

• From < $5 to 9´ MP3 encoding • From 16-bit fixed point to 32-/64-bit floating point • From portable to multi-channel solution

Personal Audio • Car audio • Digital amplifiers • Instrument amplifiers • Musical instruments • Multitrack recorders • Streaming audio Portable Audio • Handheld gaming • MP3 players • Multimedia players/ Jukeboxes • Toy audio

Time

Audio solutions roadmap

Texas Instruments 3Q 2009

Embedded Processing Guide


102

System Solutions

Audio Audio Integrated Solutions Professional Audio Development Kit (PADK) – The PADK is a hardware/software solution based on the new TMS320C672x floating-point DSPs. The C672x DSPs are optimized for professional audio, musical instruments, broadcast audio and commercial audio applications.

For more information, contact your authorized TI distributor or visit www.ti.com/padk.

The PADK integrates the TMS320C6727 DSP with Burr-Brown ADCs and DACs. This board also features a host of different I/O options and connectors. In addition to the hardware, the PADK includes real-world audio software example code to demonstrate C672x DSP performance and provide a good reference for developers to create customized applications. Further enhancing the utility board is a convenient expansion slot that can allow daughtercards to be used to evaluate other components not featured on the PADK. The comprehensive PADK includes the hardware and software needed to quickly design differentiated pro-audio applications.

PADK includes hardware, software and documentation to get started immediately.

Professional Audio Development Kit Bundle (PADB) – Based on the TMS320C672x floating-point DSPs, the new PADK bundle saves you time and money by combining the PADK with Code Composer Studio™ IDE Platinum and a USB Emulator. Instantly start your proaudio application with the PADK bundle, which includes real-world pro-audio algorithms and software examples to demonstrate C672x DSP performance and exercise the core’s special audio-processing capabilities. Learn more at www.ti.com/padkbundle.

PADK Bundle for pro-audio applications.

Audio Application Notes Application Note Web Search Literature # Initializing the TLC32040 AIC on the TMS320C5x DSK SPRA275 Interfacing TMS320C5x and Parallel Stereo Codec w/ Other SPRA097 TMS320™ DSP Considerations Digital Voice Echo Canceller Implementation on the TMS320C5x SPRA142 Decoding Convolutional and Turbo Codes in 3G Wireless White Paper SPRA878 MP3/AAC™ Player Implementation in RF3 SPRA779 Using the File Navigation API Function in an IACD System SPRA834 Electronic Shock Protection (ESP) for CD Players That Use a C54x™ DSP SPRA831 TMS320C6201/6701 EVM: TMS320C6000™ McBSP to Multimedia Audio Codec SPRA477 Meeting the Pro Audio Challenge White Paper SPRAAA3

Application Note Web Search Literature # Using the TMS320C672x Bootloader SPRAA69 TMS320C6000 McBSP to Voice Band Audio Processor (VBAP) Interface SPRA489 AIC27 Example for the TMS320C5510 DSP Prototype Board SPRA813 Implementation of AC-3 Decoder on TMS320C62x™ DSPs SPRA724 An Audio Example Using DSP/BIOS™ Kernel SPRA598 Interfacing TLC320AD57 Sigma-Delta Stereo ADC (in Master Mode) SPRA090 with TMS320C5x™ DSP TMS320C6713 to TMS320C672x Migration Guide SPRAA78 How to Create Delay-Based Audio Effects on a TMS320C6727 DSP SPRAAA5

Check the TI website for a complete listing of technical documentation including application notes.

Texas Instruments 3Q 2009

Embedded Processing Guide


System Solutions

103

HiRel DSPs

HiRel Defense and Aerospace Solutions Get additional information at: www.ti.com/hirel

Targeted Applications • Defense • Software-defined radio • Secure communications • Radar • Sonar • Smart munitions • Communications • Graphics • Image processing • Aerospace • Motor control • Pumps • Braking systems • Noise cancellation • Sensors • Imaging • Security • Communications • Radar • Space • Satellites • Space-based radar • Critical control systems • Launch vehicles • Data processing • Imaging • Motor control • Harsh environments • High-temperature electronics • Downhole drilling • Jet engines • Undersea communications

TI HiRel offers a vast portfolio of ICs that provide extended temperature, enhanced processing and packaging for aerospace, defense and high-temperature applications. TI HiRel supplies a wide range of TI products to meet rugged and extreme environments. Process capabilities include QML Class Q and Enhanced Product (EP) for defense and avionics applications and QML Class V for space requirements. Pblead finishes are still available for customers needing continued support for nongreen applications. Pb solder ball replacement for commercial non-Pb parts can also be provided.

The DSP selection from HiRel includes ceramic hermetic packaging and QML versions from all the TI DSP generations. From the earliest TMS320C1x to the latest TMS320C6000™ DSP devices, we continue to offer the best parts for defense and military applications. HiRel can support long design and production cycles and help alleviate obsolescence concerns. TI HiRel Enhanced Product offerings provide plastic packaging options for applications that require extended temperature, enhanced change notification and controlled baselines.

TMS320C6000 DSP Platform Fixed Point SM320C6201B SMJ320C6201B SMJ320C6203 SMJ320C6415 SM320DM642-EP SM320C6455-EP SM320C6414-EP SM320C6415-EP SM320C6416-EP SM32C6416T-EP SM320C6201-EP SM320C6202-EP Floating Point SMJ320C6701 SM320C6701-EP SM320C6711D-EP SM320C6712D-EP SM320C6713B-EP

HiRel Fixed-Point Digital Signal Processor HiRel Fixed-Point Digital Signal Processor HiRel Fixed-Point Digital Signal Processor HiRel Fixed-Point Digital Signal Processor HiRel Enhanced Product Fixed-Point Digital Signal Processor HiRel Enhanced Product Fixed-Point Digital Signal Processor HiRel Enhanced Product Fixed-Point Digital Signal Processor HiRel Enhanced Product Fixed-Point Digital Signal Processor HiRel Enhanced Product Fixed-Point Digital Signal Processor HiRel Enhanced Product Fixed-Point Digital Signal Processor HiRel Enhanced Product Fixed-Point Digital Signal Processor HiRel Enhanced Product Fixed-Point Digital Signal Processor HiRel Floating-Point Digital Signal Processor HiRel Enhanced Product Floating-Point Digital Signal Processor HiRel Enhanced Product Floating-Point Digital Signal Processor HiRel Enhanced Product Floating-Point Digital Signal Processor HiRel Enhanced Product Floating-Point Digital Signal Processor

TMS320C5000™ DSP Platform SMJ320LC549 SMJ320VC5416 SM320VC5510A-EP SM320VC5416-160-EP SM320VC5409-EP SM320VC5421-EP

HiRel Fixed-Point Digital Signal Processor HiRel Fixed-Point Digital Signal Processor HiRel Enhanced Product Fixed-Point Digital Signal Processor HiRel Enhanced Product Fixed-Point Digital Signal Processor HiRel Enhanced Product Fixed Point Digital Signal Processor HiRel Enhanced Product Fixed-Point Digital Signal Processor

TMS320C2000™ Microcontrollers SM320F2812 SMJ320F240 SM320F2812-EP SM320F2801-EP SM320F2808-EP SM320LF2407A-EP

HiRel Fixed-Point Digital Signal Controller HiRel Fixed-Point Digital Signal Controller HiRel Enhanced Product Digital Signal Controller HiRel Enhanced Product Digital Signal Controller HiRel Enhanced Product Digital Signal Controller HiRel Enhanced Product Digital Signal Controller

Other Platforms Available in QML Ceramic SMJ320C15, SMJ320C25, SMJ320C3x, SMJ320C40, SMJ320C50, SMJ320C80 DSPs

QML-V Space-Level DSP SMJ320C6701-SP

Texas Instruments 3Q 2009

Rad-Tolerant Class V, Floating-Point Digital Signal Processor

Embedded Processing Guide


104

System Solutions

Industrial Industrial Computing Solutions Get additional information at: www.ti.com/industrial

Targeted Applications • Human-machine interface touchscreen panels • Operator interface panels • Patient monitors • Networked displays • Self-service kiosks • Electronic cash registers • Portable data terminals • Electronic point of sale (EPOS) terminals • EPOS accessories • Digital signage • Programmable automation controllers • Programmable logic controllers • Distributed control systems • Industrial communications • Power protection • Power management • Test equipment • Machine vision For More Information Please refer to product information for the OMAP-L1x platform on page 42 or the OMAP35x platform on page 39.

Industrial Computing Solutions Overview The OMAP-L1x and OMAP35x platforms of processors incorporate low power and scalable performance enabling many industrial applications including programmable automation controllers, human-machine interface panels and EPOS terminals. equipment, and point-of-service accessories like signature pads, currency readers and RFID readers.

OMAP-L1x Overview The OMAP-L1x platform offers single-chip ARM®+DSP products with a rich set of peripherals including SPI, UART, I2C, USB 2.0, 10/100 Ethernet, parallel port, LCD display output and many more. The 300-MHz performance of the ARM9 enables applications requiring either highlevel OS like Linux or Windows Embedded CE (Win CE) as well as multiple real-time operating systems from third parties. The OMAP-L1x SoC devices include the industry’s lowest power fixed-/floating-point DSP, the C674x DSP core. The C674x DSP combines the TMS320C64x+™ fixedpoint and TMS320C67x+ floating-point DSP cores into a single core, which enables the use of high-precision signal-processing algorithms in combination with control functions running on the ARM9 core. This high level of integration leads to reduced board space and overall system cost. OMAP-L1x products are well suited for low- to mid-end programmable automation controllers, test and measurement

OMAP35x Overview For higher-performance applications with feature-rich GUI requirements, the OMAP35x applications processors incorporate the industry’s first ARM Cortex™-A8 CPU with the TMS320C64x™ DSP and POWERVR SGX™ graphics acceleration capabilities. Industrial end equipments like control panels, self-service kiosks, electronic cash registers, etc. can take advantage of the OMAP35x processors supporting both Linux and WinCE operating systems. Various real-time operating systems are also supported on OMAP35x and are available through third-party companies. The first generation of the OMAP35x platform has four pin-compatible product options. The next generation of OMAP35x processors will incorporate 10/100 Ethernet MAC as well as CAN controllers to address industrial connectivity requirements.

Device Production Sampling

Performance/Integration

In Development

OMAP3530

• Cortex-A8 up to 600 MHz • SDRAM/LPDDR EMIF • CAN, 10/100 Ethernet • USB 2.0, SDIO

A8+DSP+ Graphics

Future

OMAP3525 • Cortex-A8 up to 600 MHz • SDRAM/LPDDR EMIF • USB 2.0, SDIO

A8+C64x™ DSP

OMAP351x A8+3D Graphics

OMAP3515 A8+3D Graphics

OMAP3503

8

Cortex-A

OMAP350x Cortex-A8

Cortex™-A8

• Up to 300 MHz • SDRAM EMIF • USB 2.0, 10/100 Ethernet • PWM, eCAP, eQEP

OMAP-L138 OMAP-L137

ARM9

ARM9+C674x DSP

ARM9+C674x DSP

• Up to 300 MHz • mDDR/DDR2 EMIF • USB 2.0, 10/100 Ethernet • SATA, SDIO, uPP • PWM, eCAP, eQEP

Time

Industrial computing solutions roadmap

Texas Instruments 3Q 2009

Embedded Processing Guide


System Solutions

105

Industrial

Digital Control Systems Solutions Get additional information at: www.ti.com/digitalcontrol

Industrial Solutions Overview The TMS320C2000™ Microcontroller family combines advanced control peripherals with the processing power of a 32-bit core. C2000™ MCUs are ideal for embedded industrial applications such as digital motor control, digital power supplies and intelligent sensor applications.

Digital Control Overview TI offers 32-bit performance and advanced peripherals that allow designers of digital motor control, digital power supplies and advanced sensing systems to quickly and easily implement advanced, cost-efficient control solutions. Our broad portfolio of control-optimized processors provides the industry’s highest performance and on-chip integration to drive system cost down to unprecedented levels. The unique combination of processing power, interrupt handling capability, controlspecific peripheral integration and high C efficiency deliver substantial benefits to control systems. These benefits, such as improved system efficiency and added

performance for innovation, are delivered with fewer external components and reduced system costs in amazingly small packages great for space-constrained applications. TI is focused on the digital control systems designers’ needs and is continuing to develop solutions that serve the market. With more than 20 years of experience in processor-based control applications and a worldwide team dedicated to providing progressive embedded control solutions, we offer systems expertise, easy-to-use development tools, an extensive silicon range and unlimited support to get your product to market faster.

Delfino™ Floating-Point Series

Device Production

F2833x

C2834x

Sampling

• 150 MIPS/300 MFLOPS • 128–512 KB Flash • 16-ch, 12-bit ADC • HiRes PWM, QEP

• 300 MIPS/600 MFLOPS • 196–516 KB SRAM Next • HiRes PWM, QEP

In Development Future

Generation

C2834x

Performance

Targeted Applications • Green energy • Solar inverters • Wind turbines • Fuel cells • Digital power supplies • Telecom rectifiers and complex DC/DC converters • Server rectifiers • Industrial power supplies • HDTV power supplies • DC/DC modules • Uninterruptible power supplies (UPS) • Lighting • LED billboards • Streetlight control and networking • Home appliances • Washer drives • Compressor motor • Induction cooktops • Industrial control • Variable-speed AC drives • Soft starters • Process control • Servo control • Stepper motor control • Automotive • Radar for blind spot detection, lane departure warning and automatic cruise control • Electric power steering • Wiper control • HVAC blowers • Medical • CPAP motor control • Patient transport • Blood analysis • Metering • Power line modem for electricity automated meter infrastructure • Flow meters

F282x F281x • 150 MIPS • 128–256 KB Flash • 12.5 MSPS ADC • QEP

• 150 MIPS • 128–512 KB Flash • 16-ch, 12-bit ADC • HiRes PWM, QEP

F2833x

Piccolo™ Series F282x F2803x

F281x F280x F280x • 60–100 MIPS • 32–256 KB Flash • 16-ch, 12-bit ADC • HiRes PWM, QEP

F2802x Next Generation F2802x

F2803x

• 40–60 MIPS • 32–64 KB Flash • 13-ch, 12-bit ADC • HiRes PWM • Single 3.3-V supply

• 60 MIPS + CLA • 64–128 KB Flash • 16-ch, 12-bit ADC • HiRes PWM, QEP • Single 3.3-V supply

Code-compatible solutions scaling from 40 MHz to 300 MHz

Digital control solutions roadmap

Texas Instruments 3Q 2009

Embedded Processing Guide


106

System Solutions

Industrial Digital Motor Control Systems Solutions Get additional information at: www.ti.com/motorcontrol

Digital Motor Control Overview TMS320C2000™ microcontrollers reduce the overall cost of motor control systems by providing the integration and performance necessary to implement advanced control techniques such as sensorless vector control of three-phase motors. Using the more processor-intensive sinusoidal control, for example, allows developers to reduce the size and cost of the motors and power electronics required to meet

their needs. To fully capitalize on the capabilities of the latest advancements in motor designs and control techniques, engineers are turning their focus to C2000™ microcontrollers. TI provides a free library of motor control software systems that are tailored to various control techniques and motor types. Each of these systems is a complete project developed for the Code Composer

Motor-Specific Software Solutions System

Motor Type

Sensored

ACI1-1

1 ph AC Induction

ACI3-1

3 ph AC Induction

ACI3-2

3 ph AC Induction

ACI3-3

3 ph AC Induction

ACI3-4

3 ph AC Induction

PMSM3-1

3 ph Permanent Magnet Synch

PMSM3-2

3 ph Permanent Magnet Synch

PMSM3-3 PMSM3-4 BLDC3-1 BLDC3-2 DCMOTOR Digital Motor Control Library

3 ph Permanent Magnet Synch 3 ph Permanent Magnet Synch 3 ph Trapezoidal Brushless DC 3 ph Trapezoidal Brushless DC Brushed DC All Motor Types

Studio™ Integrated Development Environment. Each is built upon our foundational motor control library software modules and includes complete documentation with step-by-step instructions to guide engineers through the process of bringing up a motor control system. Each system comes with complete C/C++ source code.

www.ti.com/c2000appsw and www.ti.com/c2000sigproclib

Sensorless

• • • • •

Description

Tacho I/P VHz / sinePWM/ closed loop (CL) speed PID Tacho I/P VHz / sinePWM / CL speed PID MRAS (speed estimator) VHz / sinePWM / CL speed PID Tacho I/P FOC / sinePWM / CL current PID for D, Q / CL speed PID

C24x™ Controller

C28x™ Controller

• •

Direct flux estimator + speed estimator FOC / sinePWM / CL current PID for D, Q / CL speed PID

QEP FOC / sinePWM / CL current PID for D, Q / CL speed PID

SMO (sliding mode observer) position estimator FOC / sinePWM / CL current PID for D, Q / CL speed PID

Resolver / FOC / CL current PID for D, Q / CL speed PID

QEP / FOC / position control

3 Hall effect I/P Trapezoidal / CL loop current PID / CL speed PID BEMF / Zero crossing detection Trapezoidal / CL loop current PID / CL speed PID Speed & position / QEP without index

Component modules for motor-specific applications

• • •

• • •

Motor-specific software downloads available today, free of charge, that allow designers to develop solutions for both sensored and sensorless control systems.

Texas Instruments 3Q 2009

Embedded Processing Guide


System Solutions

107

Industrial

Digital Power Systems Solutions Get additional information at: www.ti.com/c2000dps

Digital Power Overview Digital control of power conversion systems results in lower overall cost due to the consolidation of functions into a single programmable controller in place of dedicated discrete components. A single TMS320C2000™ microcontroller can provide full loop control at over 2-MHz switching frequencies or control multiple output levels and simplify the sequencing of multiple supplies through software

rather than dedicated components. A software-based solution enables intelligent monitoring of load conditions in real time and can lead to improved system reliability, efficiency and operating costs. C2000™ microcontrollers provide both isolated and non-isolated solutions from AC-line to point-of-load and are suitable for applications such as uninterruptible power supplies, servers, telecommunications, solar inverters and industrial

equipment. The C2000 controllers connect easily with TI’s UCD7000 series of digital power drivers to interface with the actual power stage. TI provides a free library of power conversion software systems that are tailored to different power conversion topologies, including DC/DC buck and phase-shifted full-bridge, along with power factor correction modules.

TMS320C280xx Digital Power Software Solutions System DC-DC Buck Converter High-Resolution ePWM Standard ePWM Power Factor Correction DC-AC Single-Phase Inverter Phase-Shifted Full-Bridge DC/DC

Description DC-DC buck converter using high-resolution ePWM Demonstrates HRPWM capabilities for digital power applications Demonstrates ePWM capabilities for digital power applications Power factor correction software DC-AC single-phase inverter software Phase-shifted full-bridge DC/DC software

VAC

VRECT

IPRI

Part Number SPRC229 SPRC227 SPRC228 SPRC307 SPRC303 SPRC311

VBOOST

Filter

VOUT

T1 PWM

IPFC

PWM1

PWM7

PWM2

PWM8

T2 PWM

Diode Clamp

Diode Clamp

IphA

VOUTPUT

IphB

TMS320F28xx Microcontroller

COMMS

I/O

ADC

PWM

Microcontroller

CAN Bus or PM Bus

Telecom rectifier (DC-DC converter) example

Texas Instruments 3Q 2009

Embedded Processing Guide


108

System Solutions

Industrial Power Line Communications Systems Solutions Get additional information at: www.ti.com/c2000plc

Power Line Communications Overview Power Line Communications (PLC) transmits data over an existing high-voltage power line instead of requiring dedicated cabling. PLC can thus provide an inexpensive solution for transmitting data in a pre-wired location. TMS320C2000™ microcontrollers are an ideal platform for power-line networked

applications such as electricity metering, office lighting automation and factory automation because their performance of up to 150 MIPS, large on-chip memory and integrated peripheral interfaces provide a single-chip solution for the PLC as well as additional control functions. TI has developed a freely-available PLC software library and hardware reference design for data throughput speeds up to

5 kbps without crossing an isolation transformer (contact your local TI salesperson). For a higher speed and commerciallyhardened system, we recommend our partners at Adaptive Networks, Inc. (www.adaptivenetworks.com). Adaptive Networks deploys systems that provide up to 100-kbps throughput and offer a range of several kilometers.

Power Line Communications Technical Documentation Application Note TMS320C2000 Microcontroller Power Line Communication User’s Guide

Web Search Literature # SPRU714

Check the TI website for a complete listing of technical documentation including application notes.

Power Line

TM

C28x Microcontroller ADC

Power Stage

PWM

CAN I 2C UART SPI McBSP GPIO PWM ADC

Product Functionality

Power line communications implementation

Texas Instruments 3Q 2009

Embedded Processing Guide


System Solutions

109

Industrial

Solar Inverter Systems Solutions Get additional information at: www.ti.com/solar

Solar Inverter Overview There is an emerging concern for future access to energy at the worldwide level. Alternative solutions to fossil fuels have been investigated and are moving to fully industrialized production processes in regions across the globe. One of the most widespread alternative energy sources is solar, and many innovative companies have decided to focus their research and development, as well as manufacturing activities, on the delivery of photo-voltaic (PV) systems. This includes high-performance solar inverters

for electrical utilities, commercial buildings and individual residences. The inverter is a critical part of the entire solar energy system. It performs the conversion of the variable DC voltage output of the PV cells into a clean, sinusoidal 50or 60-Hz current suitable for supplying the commercial electrical grid or local electrical networks. The TMS320C2000™ microcontroller family is the best response to the realtime challenges of the many possible implementations of solar inverters. The 32-bit CPU of the TMS320C28x™ core –

running at a maximum frequency of 150 MHz – effectively executes the very precise algorithms required to operate the panels at their maximum power point, and thus ensure the highest efficiency of the power conversion, even in the most severe and variable conditions. The drive of the main bridge of the DC/AC converter is performed by the highly flexible PWM modules of the C2000™ devices, and is combined with the use of the on-chip, high-speed 12-bit ADC, to perform the current and voltage regulation required to achieve the most regular sinusoidal waveform.

AC Grid

Power Stage

PWM DC-DC Conversion

A/D Converter

• Cell voltage • Cell temperature • Ambient temperature •Metering counter

DC-DC Conversion

DC-AC Conversion

Metering Housekeeping Control Functions

C2000 Microcontroller

CAN / Serial

Software

Communications

Solar inverter example

Texas Instruments 3Q 2009

Embedded Processing Guide


110

System Solutions

Medical Low-Power Medical Processor Solutions Get additional information at: www.ti.com/medical

TI’s complete end equipment solutions for medical applications leverage our product expertise in microcontrollers, Digital Signal Processors (DSPs), SoCs (System-on-Chip devices) and high-performance analog for consumer medical and diagnostic patient monitoring systems. Digital signal processing technology enables medical manufacturers to develop costeffective, state-of-the-art diagnostic and patient-monitoring instruments based on advanced DSP algorithms and bring these products to market quickly. Signalprocessing algorithms are used for signal conditioning, performing measurements, running analytics on measurements to determine the health condition and graphical display of this measured data. Being able to perform such processing at low power is increasingly important for a variety of portable and small-factor medical and consumer devices. Low-power TMS320C55x™ DSP-based SoC devices provide the processing performance and peripherals to support such low-power applications. For processing-intensive applications, TMS320DM644x DSPs provide the processing performance required. User control and interaction is becoming more and more important as medical devices become increasingly sophisticated.

ce an tD wi SP th Pe AR rfo M ® rm

es Hi

+

OMAP35x

R eA

DM3x c OMAP-L1x an m r OMAP35x o erf GPP ased h-P

g

C55x™ C6000™ ARM

M

P DS

-B ARM Low-Power DSP

Low-power ARM®-based generalpurpose processors are extremely useful in this aspect. TI has several ARM-based solutions in this area, including members of the TMS320DM3x, OMAP-L1x and OMAP35x platforms. Furthermore, DSPbased solutions, such as C55x™ DSPs, have an extensive peripheral set and can perform significant user control and interaction for portable systems without the need of an ARM-based processor. The ever-increasing need to minimize healthcare costs is driving remote patient monitoring and telemedicine. These complex yet portable systems need both ARM and DSP processing. For reduced form factor and lower power, it is desirable to have a single-chip solution which has these cores. OMAP™ and DaVinci™ architectures employ this dual-core architecture enabling optimized system partitioning and performance. With TI’s extensive portfolio and roadmap, customers have the freedom to choose an ARM-only, DSP-only or ARM+DSP solution. TI also provides an extensive set of analog, low-power wireless and connectivity solutions to complement the low-power medical processors for portable remote patient-monitoring applications.

• Up to 600-MHz DSP processor • Up to 300-MHz ARM9 processor • Video acceleration

DaVinci™ DM644x

gh

Increasing DSP Performance

TI Medical Solutions Benefits • Programmable solution accommodates customer’s ever-changing IP in medical algorithm implementation and drives faster time to market • High performance at low power enables portable medical applications • Higher integration and extensive peripheral support reduces system cost • Extensive roadmap with ARM®-only, ARM-based GPP and DSP and DSPonly architectures creates scalability and better differentiation

Medical Diagnostics and Patient Monitoring Overview

Hi

Targeted Applications • Diagnostic, patient monitoring and therapy • Electrocardiogram (ECG/portable ECG/heart-rate monitor) • Electroencephalogram (EEG) • Fetal monitoring • Remote (wired and wireless) patient monitoring • Data logging • Blood oxygen (pulse oximetry) and other blood gas analyzers • Digital stethoscopes • Automated external defibrillator (AED) and defibrillators • CPAP and BIPAP therapy devices • Ventilation/respiration • Point-of-care testing

C5000™

• Up to 600-MHz ARM Cortex™-A8 • Up to 450-MHz TMS320C64x+™ DSP • Extensive power management, vector floating point, GFX • Patient monitoring systems, AED • 270-MHz ARM9 or 600-MHz Cortex-A8 • Very low power • Lower cost • Patient monitoring systems, AED • Based on TMS320C55x™ DSP • Extensive power management • AED, pulse oximetry, digital stethoscopes, ECG, EEG, patient monitoring, audiology

Low-power medical processor families

Texas Instruments 3Q 2009

Embedded Processing Guide


System Solutions

111

Medical Imaging

Medical Imaging Solutions Get additional information at: www.ti.com/medical

Targeted Applications • Ultrasound • Digital x-ray • Magnetic resonance imaging (MRI) • Bone densitometer • Endoscopy • Hyperspectral imaging • Optical coherence tomography (OCT) • Medical digital video recorder (DVR) • Computed tomography (CT) • Positron emission tomography (PET) Additional Information For more information on TI components that might be useful in your application, download TI’s Medical Applications Guide (SLYB108B) at www.ti.com/medical.

Medical Imaging Systems Overview Advances in imaging technologies have led to extraordinarily powerful medical imaging equipment, yielding faster and more accurate diagnosis and treatment. This advancement is aided by highperformance DSPs. TI’s high-performance DSP cores are ideal for meeting real-time requirements in imaging modalities such as ultrasound, while the high-bandwidth interfaces and ability to connect multiple DSPs together ensure that there will be enough processing power available in your medical-imaging system. As the algorithms continue to advance, TI’s programmable platforms allow for quick adoption and speed time to market.

TI’s SoC solutions utilizing embedded high-performance DSP and ARM® processors enable smaller end-product foot prints and reduce system boot times while enabling image processing, high-level operating systems, user interface and control functions at low power for extended battery life. TI provides complete signal chain solutions for your medical imaging needs. In addition to DSPs, TI’s medical product portfolio includes amplifiers, clocks, data converters, temperature sensors, interface logic, microcontrollers, power management and RF ICs. TI Medical Imaging Solutions Benefits • High-performance DSPs enable latest imaging algorithms while allowing room for product differentiation • Programmable solution and range of software-compatible processors provides scaleable imaging platforms, saving redesign • Broad range of high-performance cores and highly integrated SoCs • Easy-to-use software and tools get you to market faster

DSP technology is also at the forefront of another amazing trend in medical imaging products: the trend to go portable. As doctors and care givers endeavor to reach more people, creating smaller, more portable medical equipment is a must. TI’s OMAP™ and DaVinci™ architectures are designed for low-power, portable applications enabling medical imaging equipment, such as hand-carried ultrasound units, to be powerful yet power efficient.

Portable

Imaging Segment High Performance

Software Compatible Multi-Core Next

Device

High-Performance Imaging • Diagnostic ultrasound • Digital x-ray • MRI, CT, PET • Back-end imaging

Production Sampling In Development

C64x™ Next

C6474 3× 1 GHz

Future C6457 1 GHz

s

ore

P DS

C6455 1.2 GHz

C

lti-

Mu

C6455 1 GHz

DM64x™ Next

SPs

eD

or le-C

g Sin

DM648 DM6446

s

hip on-C em- Cs) t s y S (So

Portable Imaging System

C6452 900 MHz

• Diagnostic imaging • Portable ultrasound • Medical DVR • Endoscope

OMAP3530

DM6437

• Performance leadership • Best-in-class development tools • Code compatibility • Technology innovators

Time

Medical imaging processor families

Texas Instruments 3Q 2009

Embedded Processing Guide


112

System Solutions

Portable Medical Portable Medical Solutions Get additional information at: www.ti.com/medical

Targeted Applications • Blood glucose meter • Digital thermometer • Heart-rate monitor • Pulse oximeters • Environmental sensors • Industrial sensors • Handheld meters Additional Information The new MSP430FG47x MCUs provide ultra-low power, high performance and analog peripherals for efficient development of low-cost medical and sensor applications. The FG47x MCUs offer on-chip integration of the complete signal chain, reducing design complexity and resulting in significant space and cost savings. These devices will help developers improve the quality and accessibility of healthcare through products such as blood glucose meters, digital thermometers, pulse oximeters and blood pressure/heart rate monitors. The F47x MCUs are also available to support key applications in the industrial, consumer and other general-purpose areas. TI’s full range of embedded processing and analog solutions help designers create more flexible, affordable and accessible medical devices. These solutions offer consumers improved diagnostics through integration and increased intelligence, multi-function devices that simplify treatment, and enhanced portability for easier monitoring and treatment of chronic conditions. For more information, visit www.ti.com/430medical.

Portable Medical Systems Overview As portability becomes a growing trend in medical products, manufacturers are seeking technologies that reduce the design complexity and time in developing the finished product. In most of these medical equipments, the actual physiological signals are analog and require signal conditioning techniques, such as amplification and filtering, before they can be measured, monitored or displayed. The MSP430 microcontroller offers a platform of ultra-low power processors with the high integration of the complete signal chain that is required for applications such as personal blood pressure monitors, spirometers, pulsoximeters and heart-rate monitors.

TI Portable Medical Solutions Features • Complete signal chain integrated on chip • 16-bit Sigma-Delta ADC for applications that require high-resolution signal conversion • 128-segment LCD driver with contrast control for convenient diagnostic display • Flexibility from multiple memory options • Enhanced portability with ultra-low power consumption of the MSP430 MCUs, extending battery life to 20+ years • Integrated intelligent peripherals on MSP430 MCUs provide high performance and consume no power when not in operation • Two package options to meet various printed circuit board (PCB) requirements

MSP430 Devices Optimized for Portable Medical Part Number Description MSP430FG477 16-bit ultra-low power MCU, 32-KB Flash, 2-KB RAM, 16-bit Sigma-Delta A/D, (2) 12-bit D/A, OpAmp, 128-seg LCD MSP430FG478 16-bit ultra-low power MCU, 48-KB Flash, 2-KB RAM, 16-bit Sigma-Delta A/D, (2) 12-bit D/A, OpAmp, 128-seg LCD MSP430FG479 16-bit ultra-low power MCU, 60-KB Flash, 2-KB RAM, 16-bit Sigma-Delta A/D, (2) 12-bit D/A, OpAmp, 128-seg LCD MSP430F477 16-bit, ultra-low power MCU, 32-KB Flash, 2-KB RAM, 16-bit Sigma-Delta A/D, (1) 12-bit D/A, 128-seg LCD MSP430F478 16-bit, ultra-low power MCU, 48-KB Flash, 2-KB RAM, 16-bit Sigma-Delta A/D, (1) 12-bit D/A, 128-seg LCD MSP430F479 16-bit, ultra-low power MCU, 60-KB Flash, 2 KB RAM, 16-bit Sigma-Delta A/D, (1) 12-bit D/A, 128-seg LCD FG47x MCUs are available and fully compatible with the MSP-FET430U100 and the MSP-FET430UIF flash emulation tool kits, speeding development and time to market. See all MSP430 Development Tools at www.ti.com/msp430tools. MSP430FG47x/47x Microcontroller Memory

Power and Clocking

32/48/60 kB Flash

FLL+: LFXT1CLK XT2CLK

2 kB RAM

Debug JTAG w/2 breakpoints Embedded emulation Boot strap loader

Peripherals

DCO FLL

Brownout reset Supply volt supervisor

Timers

Comparator A 2x Op amps (FG47x only) RTC 128-segment LCD driver

Serial Interface 2 x USCI_A ( UART/SPI/lrDA) 2 x USCI_B (I2C/SPI)

Converters 16-bit Sigma Delta A/D converter A

15-bit watch dog timer 16-bit basic timer 16-bit timer A3, with 3 CC registers 16-bit timer B3, with 3 CC w/ shadow registers

Connectivity 48 I/Os

Up to 2x 12-bit D/A converter

MSP430FG47x/47x microcontroller block diagram

Texas Instruments 3Q 2009

Embedded Processing Guide


System Solutions

113

Smart Metering

Smart Metering Solutions Get additional information at: www.ti.com/metering

TI’s comprehensive utility metering portfolio includes devices targeted at electricity, water and gas metering, as well as power line communications (PLC) and radio frequency (RF) interfaces for automated meter reading (AMR) that allow customers to design “smart metering” solutions. As part of a smart solution, previously independent systems like meters, home thermostats and large appliances will communicate wirelessly or over existing power lines to help consumers make more informed choices about electricity. Targeted Applications • Smart electricity meter • Water and gas meter • Programmable communicating thermostat (PCT) • Demand response unit (DRU) • In-home display (IHD) • Pre-payment systems Faster Time to Market • Globally deployed metering knowhow and products • Comprehensive end-to-end systemon-chip (SoC) solutions • Innovation and expertise across a robust portfolio, covering all the major functions of the meter Flexibility • Complete portfolio of hardware, software and SoCs tailored to functional requirements • Future-proof solutions • Upgradeable in-system programmable Flash to support evolving worldwide standards • Available standards include IEC, ANSI, ZigBee®, Wireless, M-Bus, PLC • Scaleable families of solutions to allow optimization of system requirements

Texas Instruments 3Q 2009

TI’s Broad Portfolio Drives Smarter Metering Solutions Designed specifically for the demands of utility metering applications, TI’s MSP430 ultra-low power microcontroller is the perfect combination of ultra-low power and high-performance analog integration. MSP430 MCUs offer devices for one- to three-phase electricity, water and gas metering, as well as radio frequency wireless interfaces for automated meter reading (AMR). Electricity Metering An advanced electronic electricity meter requires an MCU that offers precise voltage and current conversion over a wide dynamic range, programmable Flash, nonvolatile storage, real-time clock function, flexible display and AMR-enabled communications features. The MSP430 family of electricity-metering devices was designed for these demands. The family offers up to four 16-bit independent sigma-delta converters and programmable gain amplifiers along with specific integrated e-metering modules such as the ESP engine or 32×32 hardware multiplier allowing for easy, highperformance energy-metering calculations.

Low-Cost MSP430FE47x2 MCUs Reduce Component Count for Electricity Metering By integrating an ESP energy calculation engine with 2×16-bit sigma-delta ADCs, 128-segment LCD driver, up to 32 KB of Flash memory and 1 KB of RAM, and a real-time clock, the MSP430FE47x2

series of ultra-low power MCUs enable a five-to-one reduction in system components. This high integration makes it an ideal solution for single-phase metering applications. Flow Metering – Gas or Water MSP430 devices are ideal for the ultralow power consumption required in flowmetering applications. The scan interface (SIF) peripheral module available on the MSP430FW42x series of devices is an innovative way to measure rotation of a mechanism. Its advantages lie in its power efficiency and flexibility, operating while the CPU sleeps. It can operate with a variety of sensor types and both rotational and linear motion also can be measured. Automated Meter Reading Essentially like a two-way remote control, an electronic meter with an AMR solution reads billing information and performs meter diagnostics automatically and communicates that information either wirelessly or over existing power lines back to the utility. MSP430’s versatile portfolio of integrated communication modules allows for easy AMR-enabled solutions. TI Smart Metering Solutions Benefits • Faster time to market • Flexibility • Contactless radio frequency technology transforming smart meters with secure pre-payment

Recommended Embedded Processing Devices for Metering Applications MSP430 MCUs MSP430FE427A MSP430FW427 MSP430F427A MSP430F4794 MSP430F47187 MSP430F5xx

TMS320C2000™ MCUs TMS320F280x TMS320F2802x TMS320F2803x

Embedded Processing Guide


114

System Solutions

Telecom Telecom Systems Solutions Get additional information at: www.ti.com/telecom

• Wired telephony • Infrastructure telephony (enterprise, gateway, SOHO) • Client-side telephony – for home networking (voice/data access points) • Remote data collection • Industrial monitoring systems • Full-duplex speakerphones • SMS/MMS phones • Video phones, video conferencing • Intelligent phones • Wireless terminal (excluding handsets) • Broadband wireless access boxes • Military/police wireless communication device • Digital pagers • Mobile Internet Device (MID) • Amateur radios

Telecom Systems Overview Telecom applications require the processing power to handle a wide variety of data, voice, telephony and connectivity functions. Using TI programmable DSPs, you can easily expand product capabilities and feature sets to match the demands of your design. In addition, you can customize, adapt and scale the DSP-based design to suit your particular requirements and focus on end-product differentiation. TI offers complete DSP-based solutions for remote data collection, Internet connectivity, telephony co-processing and voiceband processing client-side telephony applications. These solutions provide hardware including power-efficient/small

form-factor DSPs as well as analog front ends. In addition, comprehensive software is provided supporting industry standards as well as flexible software building blocks that accelerate the design process from concept through production. These complete solutions significantly cut power consumption, reduce development time, minimize board space and enable multi-function applications, making a new class of Internet-access devices possible. When you combine the processing power, high integration and flexibility with their low price points and ease of use, TI DSPs are a perfect fit for telecom applications.

C64x™ Next

Device Production

C6474 3 × 1 GHz C6455/57 1.0/1.2 GHz C6454/55 720/850 MHz C64x+™ C6452 Next 700/900 MHz

Future

Segment

Targeted Applications • Wireless infrastructure • Cellular wireless base stations (Macro, Micro, Pico and Femto base stations) • Broadband wireless base stations (WiMax, McWill, others) • BSC, RNC and core network • IMS (video, data, voice) • Public safety mobile system (TETRA, etc.) • Terminal positioning • Base station backhauls communication • Wireless repeater

C641xT 850M/1 GHz

C55x Next

C641xT 600/720 MHz C55x™ C641x 600/720 MHz C55x 300 MHz 200 MHz C54x™ C54x C54x 300 MHz 100 MHz 200 MHz

C55x Next

Infrastructure Telecom • Wireless infrastructure • Infrastructure telephony • Wireless broadband • Base station backhaul • Public safety mobile system Client Wireless • Broadband wireless – WiMAX • Digital amateur radios • GPS • Head sets • Military wireless terminals • PHS data modems • Police wireless terminals • Radios Client Wired • Advanced phones • Faxes • Full-duplex speakerphones • Hands-free kits • Modems • Point of sale • Remote data collection

Telecom: TI’s telecom solutions include high-performance and low-power DSPs. Remote data collection, analog front ends, comprehensive software supporting industry standards and development tools which significantly cut power consumption, reduce development time, minimize board space and enable wired and wireless data, voice, telephony and connectivity functions.

Time

Telecom solutions roadmap

• Telecom accessories • Hands-free kit • Bluetooth® headset

Texas Instruments 3Q 2009

Embedded Processing Guide


System Solutions

115

Video and Imaging

Video and Imaging Systems Solutions Get additional information at: www.ti.com/videoandimaging

Texas Instruments 3Q 2009

Video and Imaging Systems Overview As the video and imaging markets continue to evolve with new functionality requirements and multiple emerging video standards, developers need to adapt designs with the right balance of processing performance, power consumption and system flexibility. Portable and plugged applications need different levels of power consumption and support for real-time video processing such as video coding, transcoding, transrating and video/imaging instruction sets. TI’s processors provide the processing performance and programmability other processors are unable to provide.

processor portfolio for digital video applications includes: • DaVinci™ Digital Media Technology (see page 24) • TMS320C6000™ DSP Platform (see page 11) • TMS320C5000™ DSP Platform (see page 5) • OMAP™ Platform (see page 39) Numerous application development kits are available to get designs off the ground quickly. These kits provide hardware and software at a variety of integration levels and price points to handle real-time performance, channel density, simultaneous processing of video, audio/voice and data streams across both wired and wireless networks.

TI offers a large product portfolio including hardware, software and integrated system solutions that are perfect for a variety of digital video applications. TI’s large

Device Production DM64x+ Next

Sampling In Development

DM Next

Future

Infrastructure Video • Cable head-end video systems • Multi-channel security DVRs • Professional-grade broadcastquality systems • Video-conference MCU/ gateways

DM6467T DM648 1.1 GHz

Segment

Targeted Applications • Automotive infotainment • Automotive video sensing • Automotive vision • Broadcast systems • Cable head-end video equipments (routers) • Digital camcorders • Digital cameras • Digital media adapters • Digital photo frames • Digital signage • Digital TV and server head-ends • Digital video recorders • IP network cameras • IP-based video-conferencing endpoints • IP-based video phones • IP set-top boxes • Hard-copy appliances • Machine vision • Media encoder/decoder appliances • Media gateways • Medical imaging • Network projector • Personal video recorders • Portable media players • Professional-grade video broadcast equipment • Robotics • Security recording systems • Streaming video appliances • Video broadcast transcoding • Video-conferencing, multi-point conference units (MCUs)/gateways • Video infrastructure • Video jukeboxes • Digital video security recorders (DVRs) • Video surveillance cameras • Webpads • Wireless cameras

DM6467

DM64x+ Next

DM647/8 DM6467T DM644x DM64x

DM643x

DM Next

DM648 1.1 GHz DM6467 DM647/8

DM3x+ Next

DM64x

DM365

DM6441 DM355

DM357

Client Video • IP-based video phones • IP set-top boxes • Media encoder/decoder appliances • Networked PVRs • IP video surveillance • IP video-conferencing Portable Video • Digital still cameras • Digital camcorders • Gaming • Multimedia jukeboxes • PDAs • Portable medical

Time

Video and imaging solutions roadmap

Embedded Processing Guide


116

System Solutions

Video and Imaging Additional Resources Video/Imaging Online Information A wealth of video/imaging information awaits you at www.ti.com/video. Whether you need details about any of TI’s vast array of devices … or block diagrams regarding various end equipments … or links to selection guides, solutions guides and application notes, you’ll find it here. You’ll also find access to: • Development boards and EVMs • Various system block diagrams • White papers • TI device information • Free Digital Media Focus eNewsletter • Video/imaging events around the world • News releases Check out TI’s video/imaging applications page today. And, bookmark it for the future. VICP Signal-Processing Library Improves Performance Capabilities Texas Instruments VICP signal-processing library is a collection of highly tuned software algorithms that execute on the VICP hardware accelerator. The library allows the application developer to effectively utilize the VICP performance without spending significant time in developing software for the accelerator. The availability of well-tested, performance-tuned algorithms with the VICP signal-processing

Texas Instruments 3Q 2009

library significantly reduces the application development time. The freed-up MIPS on the DSP enable the application developers to include more differentiation features in the final application. The VICP hardware accelerator is a parallel MAC engine. Due to its flexible architecture, the accelerator is very effective in enhancing DSP performance by taking over execution of varied computationally intensive tasks. VICP supports various algorithms to enable additional DSP resource: • Matrix operations/array operations: • Ex: Matrix multiplication/transpose. Block add/average/variance • Ex: Array multiplication/addition/ fillmem. Array scalar operations • Ex: Look-up table • Digital signal processing operations: • Ex: 1D, 2D FIR filtering • Ex: Convolution, correlation • Digital image and video processing functions: • Ex: Alpha blending, color space conversion • Ex: Image rotation, image pack/ unpack • Ex: Median filtering www.ti.com/vicp.

Video and Imaging Guide Explore TI’s solutions for a wide variety of video and imaging applications in this comprehensive guide. TI’s Video and Imaging Guide contains valuable video and imaging information for your design needs. Find out everything you need to know in this complete guide that includes system block diagrams, product information, development tools, software, support and various other resources. www.ti.com/visolutionsguide. VLIB 2.0: Video Analytics & Vision Library TI’s Video Analytics & Vision Library (VLIB) is a collection of software kernels that are commonly used in automotive-vision and video-security applications. The kernels are optimized for both C64x™ and C64x+™ DSP cores and can accelerate software development and enable performance improvements up to 10× over standard C code on TI’s DSPs. The VLIB 2.0 now consists of 50+ royalty-free software kernels including background modeling and subtraction, object feature extraction, tracking, recognition and low-level pixel processing as well as Simulink™ blocks for each function and the bit-exact version for PC testing capabilities. www.ti.com/vlib.

Embedded Processing Guide


System Solutions

117

Video and Imaging

Video and Imaging Development Tools TI has a number of hardware/software development tools that can be used for a variety of digital video designs. Digital Video Evaluation Modules (DVEVMs) are comprised of both hardware

and software, and enable developers to start instantaneous evaluation of DaVinci™ processors.

TMS320DM365 Digital Video Evaluation Module (DM365 DVEVM) – The TMS320DM365 Digital Video Evaluation Module (DVEVM) includes both hardware and software enabling developers to start immediate evaluation of the DM365 processor and begin

building digital video applications such as IP security cameras, digital photo frames, digital signage, video doorbells and portable digital video products that have yet to be invented. DVEVMs come complete with a demo version of MontaVista Linux Pro 5.0, drivers, evaluation codecs and an evaluation board. Registered DVEVM users may download TI’s HD H.264, MPEG-4, JPEG, MP3 and G.711 production codecs free of charge from the DaVinci software updates site. The DVEVM allows developers to write production-ready application code for the ARM® and provides access to the HMJCP coprocessor core using DaVinci APIs to begin immediate application development for DM365 digital media processors. The Digital Video Software Production Bundle (DVSPB) MontaVista Linux companion product is recommended for production.

TMS320DM365 Digital Video Evaluation Module

TMS320DM357 Digital Video Evaluation Module (DM357 DVEVM) – The TMS320DM357 processor and DVEVM take advantage of all the tools and support included in the DaVinci technology portfolio to help product developers save months of time. The application programming interfaces (APIs) common across DaVinci offerings also means that developers familiar with DaVinci technology or ARM® development can quickly develop their products with virtually no learning curve. The TMS320DM357 DVEVM includes both hardware and software enabling developers to start immediate evaluation of the DM357 processor. DVEVMs come complete with a demo version of MontaVista Linux Pro 5.0, drivers, evaluation codecs and an evaluation board. Registered DVEVM users may download TI’s JPEG and HD MPEG-4 SP production codecs including JPEG/MPEG-4 SP/H.263/H.264 BP/G.711 and free of charge from the DaVinci software updates site.

Texas Instruments 3Q 2009

For more information, contact your authorized TI distributor or visit www.ti.com/dm365dvevmdsg.

For more information, contact your authorized TI distributor or visit www.ti.com/dm357dvevmdsg.

TMS320DM357 Digital Video Evaluation Module

Embedded Processing Guide


118

System Solutions

Video and Imaging TMS320DM355 Digital Video Evaluation Module (DM355 DVEVM) – The TMS320DM355 Digital Video Evaluation Module (DVEVM) includes both hardware and software enabling developers to start immediate evaluation of the DM355 processor. DVEVMs come complete with a demo version of MontaVista Linux Pro 4.0, drivers, Codec Engine, evaluation codecs and an evaluation board. Registered DVEVM users may download TI’s JPEG and HD MPEG-4 SP production codecs and G.711 codec free of charge from the DaVinci™ software updates site. The DVEVM can be used for the development of digital video applications such as IP security cameras, digital photo frames, digital cameras, video doorbells, portable medical and portable digital video products that have yet to be invented. The DVEVM allows developers to write production-ready application code for the ARM and provides access to the MPEG/JPEG coprocessor core using DaVinci APIs to begin immediate application development for DM355 digital media processors.

TMS320DM355 Digital Video Evaluation Module

The Digital Video Software Production Bundle (DVSPB) MontaVista Linux companion product is recommended for production.

For more information, contact your authorized TI distributor or visit www.ti.com/dm355dvevmdsg.

TMS320DM6467 Digital Video Evaluation Module (DM6467 DVEVM) – The TMS320DM6467 DVEVM includes both hardware and software enabling developers to start immediate evaluation of

the DM6467 processor. DVEVMs come complete with a demo version of MontaVista Linux Pro 4.0, drivers, Codec Engine, evaluation codecs and an evaluation board. The DVEVM can be used for the development of digital video applications such as surveillance digital video servers/recorders, media gateways, multi-point control units digital media adapters, set-top boxes and many other high-definition video applications. The DM6467 DVEVM allows developers to write production-ready application code for the ARM® and provides access to the TMS320C64x+™ DSP and HD-Video/Imaging Coprocessor core using DaVinci APIs to begin immediate application development for the DM6467 digital media processor. The Digital Video Software Production Bundle (DVSPB) MontaVista Linux companion product is recommended for production. For more information, contact your authorized TI distributor or visit www.ti.com/dm6467dvevmdsg.

TMS320DM6467 Digital Video Evaluation Module

For a complete listing of all of TI’s video/imaging hardware and software development tools, please see the chart on the next page.

Texas Instruments 3Q 2009

Embedded Processing Guide


System Solutions

119

Video and Imaging

Video and Imaging Hardware and Software Development Tools Description

Part Number

Price1

TMDSDMK642 (U.S. part number) TMDSDMK642-0E (European part number)

6,495

TMDSEVM6446 TMDSEVM3530 TMDSEVM642 TMDSVDP6437 TMDSDVP648 TMDXEVM355 TMDXEVM357 TMDXEVM365 TMDSEVM6467

2,495 1,499 1,995 495 1,295 495 895 595 1,995

TMDSEMUPP (U.S. part number) TMDSEMUPP-0E (European part number) TMDSEMUUSB TMDSEMU560PCI TMDSEMU560U TMDSEMU560T

1,095 1,095 1,495 2,995 2,999 9,995

SPRC831 TMDSCCSALL-1

Free 3,595

Hardware Development Tool TMS320DM642 Digital Media Development Kit (DM642 DMDK)

Evaluation Modules (EVMs) TMS320DM644x Digital Video Evaluation Module (DVEVM) OMAP35x Evaluation Module TMS320DM642 Evaluation Module (EVM) TMS320DM6437 Digital Video Development Platform (DVDP) TMS320DM648 Digital Video Development Platform (DVDP) TMS320DM355 Digital Video Evaluation Module (DVEVM) TMS320DM357 Digital Video Evaluation Module (DVEVM) TMS320DM365 Digital Video Evaluation Module (DVEVM) TMS320DM6467 Digital Video Evaluation Module (DVEVM)

JTAG Emulators Spectrum Digital XDS510PP-Plus Emulator Spectrum Digital XDS510PP-Plus Emulator with European Cords Spectrum Digital XDS510™ USB Emulator Blackhawk XDS560™ JTAG PCI Emulator Blackhawk XDS560 USB High-Performance JTAG Emulator XDS560 USB Trace Emulator2

Software Development Tools VICP Signal Processing Library (DM6446, DM6441, DM647 and DM648 processors) Code Composer Studio™ (CCStudio) IDE Platinum v 3.3 Development Tools Bundled with Annual S/W Subscription Supports C6000™, C5000™, C2000™, DaVinci™ and OMAP™ processor platforms C6000, C5000, C2000, DaVinci, and OMAP processor CCStudio Development Tools Annual Software Subscription for Version 3.10 and higher Code Composer Studio IDE Free Evaluation Tools Includes C6000 DSP and DaVinci CCStudio IDE 120-Day Free Evaluation Tools3 Video Analytics & Vision Library (VLIB) TMS320C62x™ DSP Image Library TMS320C64x™ DSP Image Library

TMDSSUBALL

600

SPRC119 (www.ti.com/freetools)

Free

www.ti.com/vlib SPRC093 SPRC094

Free Free Free

1

Prices are quoted in U.S. dollars and represent year 2009 suggested resale pricing. All prices are subject to change. Customers are New tools are listed in bold red. advised to obtain the most current and complete pricing information from TI prior to placing orders. TI may verify final pricing prior to accepting any order. 2 The XDS560 Trace is designed for use with trace-enabled digital signal processors. Currently the following processors are fully supported by trace: TMS320C6418, TMS320C6416T, TMS320C6415T, TMS320C6414T, TMS320C6413, TMS320C6412, TMS320C6411, TMS320C6410, TMS320DM648, TMS320DM647, TMS320DM643, TMS320DM642, TMS320DM641 and TMS320DM640 processors. 3 Includes full-featured Code Composer Studio Development Tools, code generation tools (C/C++ compiler/assembler/linker) and simulator all limited to 120 days.

Video and Imaging Integrated Solutions For more information on TI’s video and imaging solutions, go to www.ti.com/videoandimaging.

Texas Instruments 3Q 2009

Embedded Processing Guide


120

System Solutions

Video and Imaging Power Management Products for the TMS320DM3x/DM644x/DM643x/DM64x™ DSP Generations Get samples, data sheets, Evaluation Modules (EVMs) and app reports at: power.ti.com

Suggested Texas Instruments Power Management Solutions for Battery-Powered TMS320DM3x/DM644x/DM643x Processors

Input Voltage 3.3 V 5V

LDO TPS75401 TPS75401

Core and I/O Voltages Non-Synchronous Synchronous Controller Integrated FET (External FET and Diode) Converter TPS64200 TPS62040 TPS64200 TPS62040

Synchronous Controller (External FETs) TPS40041 TPS40042

12 V

TPS40190 TPS5124† TPS5124†

24 V

Non-Synchronous Integrated FET Converter

Multiple-Output Converter TPS65023 TPS65023 TPS54386

TPS54350

TPS40200

TPS5420

TPS40200*

TPS5420*

TPS54386 TPS54386

†Dual-output controller *Due to Vout/Vin ratio core voltage may have to be stepped down from I/O voltage I/O supply 3.3 V, current up to 1 A Core supply down to 1.0 V, current up to 2 A

Suggested Texas Instruments Power Management Solutions for Line-Powered TMS320DM3x/DM644x/DM643x/DM64x Processors

Input Voltage 3.3 V 5V 12 V 24 V 48 V

LDO TPS75401 TPS75401

Synchronous Controller (External FETs) TPS40041 TPS40042

Non-Synchronous Controller (External FET and Diode) TPS64200 TPS40200

TPS40190 TPS5124† TPS40057 TPS5124† TPS40061

TPS40200

Core and I/O Voltages Synchronous Non-Synchronous Integrated FET Integrated FET Converter Converter TPS54317 TPS54317 TPS54350 TPS54350

Non-Isolated Power Module PTH04070 PTH04070

TPS54350

PTH08080

TPS5430*

PTN78000*

Isolated Power Module

Multiple-Output Converter TPS65023 TPS65023 TPS54386 TPS54386

TPS40200*

PTB78560* TPS54386

TPS40200*

PTMA403033*

†Dual-output controller *Due to Vout/Vin ratio core voltage may have to be stepped down from I/O voltage I/O supply 3.3 V, current up to 1 A Core supply down to 1.0 V, current up to 2 A VIN 10Ω VIN

VCC

4.7kΩ VINDCDC1

10F

10F 100kΩ

VINDCDC2 VINDCDC3

SCLK SDAT INT VDCDC1 L1

PWRFAIL_SNS

VDCDC2 L2

4.7kΩ SCLK SDAT

100kΩ

2.2H

VIN_LDO LOW_BATT

VDCDC3

DaVinci™ TMS320DM644x

TPS65023

1F

10F

DSP_EN

2.2H

22F

22F

LOWBAT_SNS

1nF VIN

VDCDC3 1F 4.7F

100kΩ

EN VIN

100kΩ

HOT_RESET TRESPWRON

LDO1

DEFLDO1 DEFLDO2 LDO_EN VSYSIN VBACKUP VRTC PWRFAIL DCDC2_EN DCDC1_EN DCDC3_EN DEFDCDC3 DEFDCDC2 DEFDCDC1

LDO2

2.2F

CVDDDSP USB_VDD1P2LDO CVDD APLLREFV VDDA_1P1V

1.2-V Domain

DVD18 DVDDR2 VDDA_1P8V USB_VDD1P8 M24VDD PLLVDD18 DDR_VDDDL MXVDD

1.8-V Domain

USB_VDDA3P3 DVDD33

3.3-V Domain

2.2F VDCDC3 L3

2.2H

22F 100kΩ

RESPWRON AGND1 AGND2 PGND1 PGND2 PGND3

For additional power supply designs for TI DSPs, please visit www.ti.com/processorpower. Note: The TI power devices recommended here are based on standard operating conditions. System designers should use device power estimation tools in conjunction with overall application level power requirements to ensure an adequate power supply design is used.

Texas Instruments 3Q 2009

Embedded Processing Guide


Appendix

121

Complementary Analog Products for the TMS320DM335 Digital Media Processor

Best Performance

Best Value

Video Amplifier

THS7315 SOIC

• 3 SDTV video amplifiers for OPA361 CVBS, S-Video, Y’U’V, etc. SC70 • 5.2-V/V gain (14.3 dB)

Class-D Amplifier

TPA2013D1 DSBGA QFN

• Constant output power • 1.8-V to 5.5-V operation • 2.2-W into an 8-Ω load from a 3.6-V supply

TPA2010D1 DSBGA

Low-Power Voltage Ref

REF50xx SOIC MSOP

REF33xx SOIC MSOP

Audio Codecs Low-Power Stereo

AIC3107 QFN

• Low-temperature drift [3 ppm/°C (max)] • High accuracy: 0.05% max • Low noise (3 µVPP/V) • Stereo codec with integrated mono Class-D amp • Audio ADC + Audio DAC • Seven audio input pins

Video DAC (Decoder)

TVP5150 TQFP

Low-Power Touch Screen Controller

TSC2008 QFN DSBGA

Low-Power Digital Temp Sensor

TMP102 SOT

Clocks Programmable PLL Synthesizer

CDCE913 TSSOP

Low-Power Wireless 2.4-GHz RF Transceiver

CC2525 QFN

Class A-B Amplifier

TPA6204A1 SON

24-/16-/8-Bit I/O Expander

TCA6424 QFN

Compact Flash Interface

CF4320H LFBGA

ESD Protection ±15-kV Array

TPD4E001 SOT

AIC3104 QFN

Low Power

• 3-V video amp with internal gain and filter • 2-pole reconstruction filter • Integrated level shifter • Input range includes ground – DC-coupled input • Rail-to-rail output • Low quiescent current: 5.3 mA • Shutdown current: 1.5 µA TPA2006D1 • 2.5-W mono filter-free • 1.45-W mono Class-D Class-D • 2.8-mA quiescent current SON • Efficiency: 88% at 400 mW, • 0.5-µA shutdown current 80% at 100 mW • Improved CMRR, PSRR • Low supply current: 3.9 µA (typ) • Low temperature drift: 30 ppm/°C (max) • High initial accuracy: ±0.15% (max) • High output current: ±5 mA AIC3254 • Stereo audio DAC + ADC • 4.1-mW stereo 48ksps • Six audio output drivers DAC playback QFN • Automatic gain control • 6.1-mW stereo 48ksps • 14-mW stereo 48-kHz PB ADC record • Low-power bypass

• Ultra-low power NTSC/PAL video decoder • Two composite inputs or one S-Video input • VBI modes supported include: Teletext, Wide Screen Signaling, etc. • Macrovision copy protection detection • Ultra-low power consumption: 113 mW (typ) • Power-down mode: <1 mW • 1.2-V to 3.6-V, 12-bit nanopower, 4-wire micro touch screen controller with SPI™ • Effective throughput rate: Up to 20 kHz (8 bit) or 10 kHz (12 bit) • Low power (12 bit, 8.2-kHz eq rate): 30.4 mA at 1.2 V, fSCLK = 5 MHz • 1.5 × 2 WCSP-12 and 4 × 4 QFN-16 packages • 44.6 mA at 2.7 V, fSCLK = 10 MHz • Low quiescent current – 10 µA (max) • 10 µA (max) shutdown current • Accuracy: 0.5°C (–25°C to +85°C) • 12-bit resolution • Supply range: 1.4 V to 3.6 V • Programmable 1-PLL VCXO clock synthesizer with 1.8-V and 3.3-V outputs • In-system programmability and EEPROM (serial programmable volatile register and nonvolatile EEPROM) • Flexible input clocking concept (external crystal: 8 MHz to 32 MHz) • Low-noise PLL core [PLL loop filter components integrated and low period jitter (typical 50 ps)] • Flexible clock driver • Separate output supply pins CC2500 • Low current consumption • Wide supply range (2.0 V – 3.8 V) • Low current consumption (27 mA in RX, 31 mA in TX @ 0 dBm) (13.3 mA in RX, 250 kBaud) QFN • –87 dBm sensitivity (at 2 Mbps) • Programmable data rate from 1.2 to 500 kBaud • 1.7 W into 8Ω from a 5-V TPA6205 • 1.25 W into 8Ω from a 5-V TPA721 • 250 to 700 mW @ 3.3, supply at THD = 10% typ supply at THD=1% typ 5 V with 8-Ω load MSOP SOIC • Fast startup • Shutdown pin has 1.8-V • Depop circuitry SON MSOP • Only three external compatible thresholds • Thermal and short-circuit BGA components • Only 5 ext components protection TCA6416 TCA6408 • 16-bit I/O expander • 8-bit I/O expander • 24-bit I/O expander • Internal power-on reset • Low standby current • No glitch on power up TSSOP TSSOP • 5-V tolerant I/O ports • Noise filter on SCL/SDA consumption of 1 µA QFN QFN inputs BGA BGA • Compact Flash bus-interface chip with ±15-kV ESD protection, translation, and card-detect circuitry • Logic-level translation between 1.8-V, 2.5-V, 3.3-V and 5-V supplies • Floating input conditions allowed • Latch-up performance exceeds 250 mA per JESD 17 • 2-channel ESD protection • 4-channel ESD protection TPD2E001 • Low 1-nA (max) leakage current • Low 1.5-pF input DRY capacitance • 0.9-V to 5.5-V supply-voltage range DRL • DRY, DRL and QFN package options QFN

Please visit ti.com/processorpower for complete power solutions.

Texas Instruments 3Q 2009

Embedded Processing Guide


122

Appendix

Complementary Analog Products for the TMS320DM355 Digital Media Processor Best Performance

Best Value

Video Amplifier

THS7315 SOIC

• 3 SDTV video amplifiers for OPA361 CVBS, S-Video, Y’U’V, etc. SC70 • 5.2-V/V gain (14.3 dB)

Class-D Amplifier

TPA2013D1 DSBGA QFN

• Constant output power • 1.8-V to 5.5-V operation • 2.2-W into an 8-Ω load from a 3.6-V supply

TPA2010D1 DSBGA

Low-Power Voltage Ref

REF50xx SOIC MSOP

REF33xx SOIC MSOP

Audio Codecs Low-Power Stereo

AIC3107 QFN

• Low-temperature drift [3 ppm/°C (max)] • High accuracy: 0.05% max • Low noise (3 µVPP/V) • Stereo codec with integrated mono Class-D amp • Audio ADC + Audio DAC • Seven audio input pins

Video DAC (Decoder)

TVP5150 TQFP

Low-Power Touch Screen Controller

TSC2008 QFN DSBGA

Low-Power Digital Temp Sensor

TMP102 SOT

Clocks Programmable PLL Synthesizer

CDCE913 TSSOP

Low-Power Wireless 2.4-GHz RF Transceiver

CC2525 QFN

Analog Front End

24-/16-/8-Bit I/O Expander

VSP01M01 SOIC MSOP TCA6424 QFN

Compact Flash Interface

CF4320H LFBGA

ESD Protection ±15-kV Array

TPD4E001 SOT

AIC3104 QFN

Low Power

• 3-V video amp with internal gain and filter • 2-pole reconstruction filter • Integrated level shifter • Input range includes ground – DC-coupled input • Rail-to-rail output • Low quiescent current: 5.3 mA • Shutdown current: 1.5 µA TPA2006D1 • 2.5-W mono filter-free • 1.45-W mono Class-D Class-D • 2.8-mA quiescent current SON • Efficiency: 88% at 400 mW, • 0.5-µA shutdown current 80% at 100 mW • Improved CMRR, PSRR • Low supply current: 3.9 µA (typ) • Low temperature drift: 30 ppm/°C (max) • High initial accuracy: ±0.15% (max) • High output current: ±5 mA AIC3254 • Stereo audio DAC + ADC • 4.1-mW stereo 48ksps • Six audio output drivers DAC playback QFN • Automatic gain control • 6.1-mW stereo 48ksps • 14-mW stereo 48-kHz PB ADC record • Low-power bypass

• Ultra-low power NTSC/PAL video decoder • Two composite inputs or one S-Video input • VBI modes supported include: Teletext, Wide Screen Signaling, etc. • Macrovision copy protection detection • Ultra-low power consumption: 113 mW (typ) • Power-down mode: <1 mW • 1.2-V to 3.6-V, 12-bit nanopower, 4-wire micro touch screen controller with SPI™ • Effective throughput rate: Up to 20 kHz (8 bit) or 10 kHz (12 bit) • Low power (12 bit, 8.2-kHz eq rate): 30.4 mA at 1.2 V, fSCLK = 5 MHz • 1.5 × 2 WCSP-12 and 4 × 4 QFN-16 packages • 44.6 mA at 2.7 V, fSCLK = 10 MHz • Low quiescent current – 10 µA (max) • 10 µA (max) shutdown current • Accuracy: 0.5°C (–25°C to +85°C) • 12-bit resolution • Supply range: 1.4 V to 3.6 V • Programmable 1-PLL VCXO clock synthesizer with 1.8-V and 3.3-V outputs • In-system programmability and EEPROM (serial programmable volatile register and nonvolatile EEPROM) • Flexible input clocking concept (external crystal: 8 MHz to 32 MHz) • Low-noise PLL core [PLL loop filter components integrated and low period jitter (typical 50 ps)] • Flexible clock driver • Separate output supply pins CC2500 • Low current consumption • Wide supply range (2.0 V – 3.8 V) • Low current consumption (27 mA in RX, 31 mA in TX @ 0 dBm) (13.3 mA in RX, 250 kBaud) QFN • –87 dBm sensitivity (at 2 Mbps) • Programmable data rate from 1.2 to 500 kBaud VSP2582 • 10-bit resolution • CCD signal processing • SNR 8 5dB @ 18dB gain • Programmable gain amp (PGA) QFN • 85 mW at 3.0 V and 36 MHz, 1 mW in standby mode • Two-channel 8-bit DAC TCA6416 TCA6408 • 24-bit I/O expander • 16-bit I/O expander • 8-bit I/O expander • No glitch on power up • Internal power-on reset • Low standby current TSSOP TSSOP • 5-V tolerant I/O ports • Noise filter on SCL/SDA consumption of 1 µA QFN QFN inputs BGA BGA • Compact Flash bus-interface chip with ±15-kV ESD protection, translation, and card-detect circuitry • Logic-level translation between 1.8-V, 2.5-V, 3.3-V and 5-V supplies • Floating input conditions allowed • Latch-up performance exceeds 250 mA per JESD 17 • 4-channel ESD protection TPD2E001 • 2-channel ESD protection • Low 1.5-pF input • Low 1-nA (max) leakage current DRY capacitance • 0.9-V to 5.5-V supply-voltage range DRL • DRY, DRL and QFN package options QFN

Please visit ti.com/processorpower for complete power solutions.

Texas Instruments 3Q 2009

Embedded Processing Guide


Appendix

123

Complementary Analog Products for the TMS320DM365 Digital Media Processor

Best Performance

Best Value

Video Amplifier

THS7315 SOIC

• 3 SDTV video amplifiers for OPA361 CVBS, S-Video, Y’U’V, etc. SC70 • 5.2-V/V gain (14.3 dB)

Class-D Amplifier

TPA2013D1 DSBGA QFN

• Constant output power • 1.8-V to 5.5-V operation • 2.2-W into an 8-Ω load from a 3.6-V supply

TPA2010D1 DSBGA

Low-Power Voltage Ref

REF50xx SOIC MSOP

REF33xx SOIC MSOP

Audio Codecs Low-Power Stereo

AIC3107 QFN

• Low-temperature drift [3 ppm/°C (max)] • High accuracy: 0.05% max • Low noise (3 µVPP/V) • Stereo codec with integrated mono Class-D amp • Audio ADC + Audio DAC • Seven audio input pins

Video DAC (Decoder)

TVP5150 TQFP

Low-Power Touch Screen Controller

TSC2008 QFN DSBGA

Low-Power Digital Temp Sensor

TMP102 SOT

Clocks Programmable PLL Synthesizer

CDCE913 TSSOP

Low-Power Wireless 2.4-GHz RF Transceiver

CC2525 QFN

Analog Front End

24-/16-/8-Bit I/O Expander

VSP01M01 SOIC MSOP TCA6424 QFN

Integrated 1394a PHY and Link

TSB43EA42 BGA

ESD Protection ±15-kV Array

TPD4E001 SOT

AIC3104 QFN

Low Power

• 3-V video amp with internal gain and filter • 2-pole reconstruction filter • Integrated level shifter • Input range includes ground – DC-coupled input • Rail-to-rail output • Low quiescent current: 5.3 mA • Shutdown current: 1.5 µA TPA2006D1 • 2.5-W mono filter-free • 1.45-W mono Class-D Class-D • 2.8-mA quiescent current SON • Efficiency: 88% at 400 mW, • 0.5-µA shutdown current 80% at 100 mW • Improved CMRR, PSRR • Low supply current: 3.9 µA (typ) • Low temperature drift: 30 ppm/°C (max) • High initial accuracy: ±0.15% (max) • High output current: ±5 mA AIC3254 • Stereo audio DAC + ADC • 4.1-mW stereo 48ksps • Six audio output drivers DAC playback QFN • Automatic gain control • 6.1-mW stereo 48ksps • 14-mW stereo 48-kHz PB ADC record • Low-power bypass

• Ultra-low power NTSC/PAL video decoder • Two composite inputs or one S-Video input • VBI modes supported include: Teletext, Wide Screen Signaling, etc. • Macrovision copy protection detection • Ultra-low power consumption: 113 mW (typ) • Power-down mode: <1 mW • 1.2-V to 3.6-V, 12-bit nanopower, 4-wire micro touch screen controller with SPI™ • Effective throughput rate: Up to 20 kHz (8 bit) or 10 kHz (12 bit) • Low power (12 bit, 8.2-kHz eq rate): 30.4 mA at 1.2 V, fSCLK = 5 MHz • 1.5 × 2 WCSP-12 and 4 × 4 QFN-16 packages • 44.6 mA at 2.7 V, fSCLK = 10 MHz • Low quiescent current – 10 µA (max) • 10 µA (max) shutdown current • Accuracy: 0.5°C (–25°C to +85°C) • 12-bit resolution • Supply range: 1.4 V to 3.6 V • Programmable 1-PLL VCXO clock synthesizer with 1.8-V and 3.3-V outputs • In-system programmability and EEPROM (serial programmable volatile register and nonvolatile EEPROM) • Flexible input clocking concept (external crystal: 8 MHz to 32 MHz) • Low-noise PLL core [PLL loop filter components integrated and low period jitter (typical 50 ps)] • Flexible clock driver • Separate output supply pins CC2500 • Low current consumption • Wide supply range (2.0 V – 3.8 V) • Low current consumption (27 mA in RX, 31 mA in TX @ 0 dBm) (13.3 mA in RX, 250 kBaud) QFN • –87 dBm sensitivity (at 2 Mbps) • Programmable data rate from 1.2 to 500 kBaud VSP2582 • CCD signal processing • 10-bit resolution • Programmable gain amp (PGA) • SNR 8 5dB @ 18dB gain QFN • 85 mW at 3.0 V and 36 MHz, 1 mW in standby mode • Two-channel 8-bit DAC TCA6416 TCA6408 • 24-bit I/O expander • 16-bit I/O expander • 8-bit I/O expander • No glitch on power up • Internal power-on reset • Low standby current TSSOP TSSOP • 5-V tolerant I/O ports • Noise filter on SCL/SDA consumption of 1 µA QFN QFN inputs BGA BGA • Integrated 400/200/100 Mbps 2-port/3-port PHY • Supports bus manager functions and automatic 1394 self-ID verification • DTCP encryption support on IEEE 1394 bus • Support for up to two encrypted/decrypted streams at one time • Two configurable high-speed data ports for video data, one port serial, one serial or parallel • 2 × 4K-Byte isochronous buffers for video data • SRAM-like 16-bit asynchronous interface • 2-channel ESD protection • 4-channel ESD protection TPD2E001 • Low 1-nA (max) leakage current • Low 1.5-pF input DRY capacitance • 0.9-V to 5.5-V supply-voltage range DRL • DRY, DRL and QFN package options QFN

Please visit ti.com/processorpower for complete power solutions.

Texas Instruments 3Q 2009

Embedded Processing Guide


124

Notes

ďƒ”

Texas Instruments 3Q 2009

Embedded Processing Guide


Notes

125

 Important Notice: The products and services of Texas Instruments Incorporated and its subsidiaries described herein are sold subject to TI’s standard terms and conditions of sale. Customers are advised to obtain the most current and complete information about TI products and services before placing orders. TI assumes no liability for applications assistance, customer’s applications or product designs, software performance, or infringement of patents. The publication of information regarding any other company’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Safe Harbor Statement: This publication may contain forward-looking statements that involve a number of risks and uncertainties. These “forward-looking statements” are intended to qualify for the safe harbor from liability established by the Private Securities Litigation Reform Act of 1995. These forward-looking statements generally can be identified by phrases such as TI or its management “believes,” “expects,” “anticipates,” “foresees,” “forecasts,” “estimates” or other words or phrases of similar import. Similarly, such statements herein that describe the company’s products, business strategy, outlook, objectives, plans, intentions or goals also are forward-looking statements. All such forward-looking statements are subject to certain risks and uncertainties that could cause actual results to differ materially from those in forward-looking statements. Please refer to TI’s most recent Form 10-K for more information on the risks and uncertainties that could materially affect future results of operations. We disclaim any intention or obligation to update any forward-looking statements as a result of developments occurring after the date of this publication. Trademarks in this issue: The platform bar, C2000, TMS320C2000, C28x, TMS320C24x, TMS320C28x, C5000, TMS320C5000, C54x, TMS320C54x, C55x, TMS320C55x, DaVinci, C6000, TMS320C6000, C64x, TMS320C64x, C64x+, TMS320C64x+, C67x, TMS320C67x, DM64x, TMS320DM64x, TMS320C5x, Code Composer, Code Composer Studio, controlCARD, controlSTICK, DSP/BIOS, eXpressDSP, MicroStar BGA, NanoStar, OMAP, Piccolo, RTDX, SimpliciTI, StellarisWare, TI-RFid, TMS320, VLYNQ, XDS510, XDS560 and Z-Stack are trademarks and Stellaris and DLP are registered trademarks of Texas Instruments. All other trademarks are property of their respective owners.

© 2009 Texas Instruments Incorporated Printed in U.S.A. by Southwest Precision Printers, Houston, TX

Texas Instruments 3Q 2009

Embedded Processing Guide


ion

t ou

t or 07 Repy 20 Ma

at 9– 7/8 lic RAAK 64 tization App SP DM uc 20 Prod S3 d HW TM Spee er oll e gh ntr ing th .... Hi co ify ry spec . d on ......... an , mo to es s es

me h vic on vic s ac de ati de e thi to ... R2 pro ... DD ap vious ecific ry tak tion ... n ... the The pre t sp memothe ula es ... ee sim ... for es. n on vic CT sh ble uld d ... s de the e RA ... ta ati wo ee ed on vic tha R2 rm t. Th nt ... da mp r sp cti de t ST ... of co me h DD rfo me me tru P en AB ... cu ins DS differ ms n sto hig ble pe ... g tai cu n ... ati has areis do tin e tio 7/8 ite in ter ob e using ... mp TI ings Th rou vic ... nta 64is qu ing to Th ) co r. ls. CB ... se de 7/8 s me DM e ify me e timteral. ... tim uired de (P the 7/8 64 thi to ple 20 ac ec e DM in is s ... im S3 erf vic req n mo ard sp custoerfac colla ing 64 er TM int de s tio bo ow ne t to ins Jo low DMoth led en all wa ula it is the int R2 cu nta in theDDR2 ified r fol gle an detai int d h to R2 DD vin an co d ac tly ts sin ec me sim cir Ke nt ou a ining es t the ts the pro ec DD 7/8 sp sto d d t, us ap dir sure 64 lay ins nta g rul, bu en me inefor ach cu ts anprinte em e cu nta B co tin l Sh the ion en DM . 2 do co ing pro Th shee ir PC contard rou ectly uir n. ... 2 ae e, solut to the ap ls. ta n the is ace e tim req tio ... . 3 ch ac dir ca K ple B ca Th erf ac us de da ... ... r the ts Mi erf e rk as ... ... ... 3 am DS PC pli int erf vio mo ir desig. int g ruln wo to al. ... ... ... 5 ex The ughtemeet layou er ap int pre tion the d ing ... ... ... ... . R2 tin sig erred ter e e an da M oth ecific ... ... ... ... ... 6 vid ts. d R2 et Th ula ll as on m tim DD B rou de ref colla ... ... ... ... ... . pro en he K/EV DD me ir sp ... ...... ...... ...... ... ...... 11 sim we ati ste 7/8 PC m is this ac em ... ... ste M 64 as orm sy se to the ... ... ... ... ... ... ... sy lution of EV uir att DS DM e thed inf se ... ... ... ... ... ... ... nt d req an the py therules t for ... ... ... ... ... ... ... clo the vid an so nte . 4 an I th ... ... ... ... ... ... ... g ou r n m ... 6 K EM wi ony co tin lay ... ... ... ...... ... ... ...... Fo d pro tio ste co ... .. 7 nts ... ...... ...... ... ... ...... ... DS C K outs ma rou d ... ... . an ula sy the ... ... ... DS FC nte ... ... ... ... ... ... ... 8 lay r the ize sim R2 ribes a 7/8 Co ...... ... ... ...... ...... ... ...... ... ... ... . 64 pass is R2 me in optim DD sc ... ... ... ... 10 ... ... ... ... ... ... ... ... ... . 12 DM t M DD custoility an de ... ... ... ... ... ... ... ... ... ... ... ... . e tha EV ... ... ... ... ... ... ... e ... ... ... ... ... ... 12 ... es ... ... ... ... ... Th es the Both The flexib riv ... ...... ... ...... ............ .... 13 ... Devic ...... ns ... ... ...... ...... de rul d e. nt. gh ... ... ... ... tio ...... ... ... ... ... ... ... ... ... ... .. 13 an vic me ou r to ... ... ... ... ... ... ... ... ... .. 13 ... ed ... ec ... ... ... s de cu en me ... ... ... ... ... ... ... ...... ... .. ... ort ... nn ... ... ... do ow sto ... Supp n ... l Co ... ...... ...... Figure ...... on ... ...... ...... ............ ...... ... ...... ... .. 14 s all cu ite R2 tio ctrica ...... ... ...... ... ati ... ... ... ... ... ... ... ... ... the t of ... ific ... ...... ...... ... ...... ...... ... ...... ... uis DD nta ... ... ...

g tin en m ple Im

DD

R2

PC

B

La

y

...

1 2 3

1

/8 ... ... ec ... Lis me d Ele ... ...... ... 647 ... ... ... ... req 7/8 tic Sp ... ...... ...... ... ng ... ... ...... ... ...... DM Pre 64 Docu an ...... ... ...... ... ... ... ... uti ... ... ma nt ... the tics ... DM her he me ...... ... ... ...... Ro ... ...... ... ...... ... ... on B Ot hema p ... ... ...... l Sc ce ... ...... ...... ... ck ...... ... ...... ... ... ve Pla n ... PC ... Sc cku nt ... Le vice gio ... ...... ... d Clo...... ... ...... ... me ... R2 h Sta ce ... ... Re nts ... an DD Hig De t me ...... ... ol ...... ... ...... ... Pla uting ing ... ntr ... ...... ... ...... R2 R2 Ou ire ... ent Ro 5 DD d DD Keep Requ ... ...... Co ...... ... ...... ... lem 6 ss, nt ... 7/8 an Imp ... ... ... ... 7 64 7/8 DDR2 Filter ceme ... dre ... ...... ... ...... ... Ad ng ... ... ... L DM 64 ple Pla on nk ... ... DM am d DL rt ati Ba Routi ng ... ... Ex L an te Paecific ss, 0 Routi ng ... 1 te 1 uti ng dre PL cre Sp 2 Ad ta By te 2 Ro uti Dis EF 3 By te Ro 3 VR neral Da ta By 4 Ge neral Da ta Byte 5 Ge neral Da ta 6 Ge neral Da 7 Ge neral 8 Ge 9 10 11

4

Digital Signal Processors

7 y 200atio Ma ent 9– AK cum RA it Do SP bm Su

Digital Media Processors

eNewsletters

d de ors d be ss Emroce P

ARM® Processors

Complementary Analog Components

ack

Fe

Technical Documentation

Applications Processors

Microcontrollers

edb

n

Product Information

e2e.ti.com

Download the latest resources for embedded processors at www.ti.com/processors.

Embedded Processor Selection Made Easy New interactive selection tools Know your next design requirements? Your processor is just a few clicks away. MCU Selection Tool Select ✓

Microcontroller Selection Tool From memory size and type to number of pins and integrated peripherals, find the MCU that best fits your needs and configure results based on analog integration, standby or active current.

www.ti.com/mcutool DSP Selection Tool Select ✓

Applications Processors and DSP Selection Tool Find the best processor fit for your next design based on various parameters for a DSP or SoC. You can also search for processors based on system and software capabilities as well as supported operating systems.

www.ti.com/dsptool

SPRT492C


IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products

Applications

Amplifiers

amplifier.ti.com

Audio

www.ti.com/audio

Data Converters

dataconverter.ti.com

Automotive

www.ti.com/automotive

DLP® Products

www.dlp.com

Communications and Telecom

www.ti.com/communications

DSP

dsp.ti.com

Computers and Peripherals

www.ti.com/computers

Clocks and Timers

www.ti.com/clocks

Consumer Electronics

www.ti.com/consumer-apps

Interface

interface.ti.com

Energy

www.ti.com/energy

Logic

logic.ti.com

Industrial

www.ti.com/industrial

Power Mgmt

power.ti.com

Medical

www.ti.com/medical

Microcontrollers

microcontroller.ti.com

Security

www.ti.com/security

RFID

www.ti-rfid.com

Space, Avionics & Defense

www.ti.com/space-avionics-defense

RF/IF and ZigBee® Solutions www.ti.com/lprf

Video and Imaging

www.ti.com/video

Wireless

www.ti.com/wireless-apps

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2010, Texas Instruments Incorporated


Turn static files into dynamic content formats.

Create a flipbook
Issuu converts static files into: digital portfolios, online yearbooks, online catalogs, digital photo albums and more. Sign up and create your flipbook.