A N AV N E T E L E C T R O N I C S M A R K E T I N G P U B L I C AT I O N
V OL U M E 1 // IS S U E 1 // MAR C H 2 0 1 3
Solutions That Keep Your World Connected
Increase Network Speed Page 06
Information is Power Page 31
What’s New – Training, Products and Resources Page 34
Find Out the Keys to Selecting a Wireless Sensor Network Protocol Page 11
Connect with the Next Great Technology Page 14
I n n o v a t o r s
i n
E l e c t r o n i c s
Robert, Lester and Charles Avnet
Avnet Headquarters Phoenix, Arizona
Rick Hamada Avnet Chief Executive Officer
1987
Tom Lynch TE Connectivity Chief Executive Officer
2013
In 1987, British inventor Clive Sinclair launched the Z88 portable computer weighing in at just under two pounds. That same year, Avnet and TE Connectivity launched a distribution partnership for interconnect products that has grown to span the globe. In the ensuing years, the two companies have experienced tremendous growth, and fueled their share of innovation. Avnet is proud to connect customers to TE Connectivy’s offering of more than half a million high-tech products. Last year, we celebrated our 25th anniversary and look forward to shaping the future of technology together. Here’s to the next 25 years!
President’s Message
What does connectivity mean to you? At first blush it might mean you want to make sure your smartphone is synced with your laptop and your tablet, and maybe port it over to download to your car. Dig a little deeper and you’ll find those of us in the electronics industry are tasked with making those connections – and more – happen for the rest of the world. In the coming pages of this issue of AXIOM, Avnet’s new technology magazine, you’ll hear more about connectivity. We’ll start with the big ideas. First, you’ll hear from our own Ron Moore, who will talk about connectivity trends from an engineer’s perspective. Ron has a unique view of the design chain, as he sees a wide range of customer issues and how our field applications engineers are helping to resolve them with the latest technologies in interconnect, passive, electromechanical components, wireless technology and other solutions for the IO market. As well, RoweBots Research founder Kim Rowe shares her insight on how to choose a wireless sensor network (WSN) protocol. She reveals factors companies should consider in making their selections as they look to deploy a WSN. We round out this issue of AXIOM with upcoming training and events so you can find out what seminars are coming to your area or what’s available online. And, of course, we bring you the latest information on new products and technologies from our supplier partners and the resources you have available from Avnet Electronics Marketing. I hope you enjoy our premiere issue of AXIOM as you look to make connections of your own. Feel free to drop us a line at axiom@avnet.com and tell us what you think about the new publication; we’d love to hear your feedback!
Regards,
Ed Smith, Avnet Electronics Marketing Americas President
AXIOM
s t n e t n o c
2013 . March . ISSUE 1 1 e m lu Vo
Welcome to the premier issue of AXIOM. Axiom, which comes from the French root axiome, Latin root axioma and the Greek roots axiõm and axios, is defined as information that is thought fitting and worthy. Our goal with this new publication is to bring you, our design community, news and information from some of the best technology companies in the world that is both thought fitting and worthy of your time. Each issue will revolve around a different theme, with this first issue focusing on “Connections”. Connections can take many forms, from wired and cabled or simply connecting you to knowledge about new products that solve your pressing design challenges.
Future issues will cover technological innovations in various Market Segments, Power and Processing, and advances from you, our customers. Since this publication was specifically designed to meet your needs, we are looking forward to receiving your feedback, whether good or bad, at axiom@avnet.com. Thank you in advance for your support on this journey.
6
Rondekka Moore, Demand Creation Director & AXIOM Editorial Director, Avnet Electronics Marketing
TE CONNECTIVITY
Increase Network Speed
IN THIS ISSUE
14
Feature Story
Bluetooth Low Energy… The World’s Next Great Technology
31
Supply Chain Velocity
Information Is Power: Find out how Avnet can optimize your supply chain
34
Training & Events
Get up to speed about the latest technology, products and solutions
37
What’s New
New product introductions
41
Resources
Market & Technology Trends
Copyright © 2013, Avnet, Inc. All rights reserved. Published by Avnet Electronics Marketing, a group of Avnet, Inc. Produced by Sketchfolio. Avnet, Inc. disclaims any proprietary interest or right in any trademarks, service marks, logos, domain names, company names, brands, product names, or other form of intellectual property other than its own. AVNET and the AV logo are registered trademarks of Avnet, Inc. No part of this publication may be reproduced or transmitted in any form or by any means without written permission.
Printed in the U.S.A. AXIOM-0313
Av n e t E l e c t r o n i c s M a r k e t i n g
11 17
Keys to Selecting a
Wireless Sensor Network Protocol
 Products & Solutions
Everything you need to know about new and focus manufacturer products and solutions, highlighting design issues, solutions, innovations and trends. Learn more from: Maxim
TE Connectivity
Molex
Toshiba
Analog Devices
Panasonic
Renesas
Microchip
Questions, Comments, Suggestions
AXIOM In Your In-Box
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AXIOM
Smart Phones. Tablets. Social Media. Cloud Computing. Virtualization. Today’s consumer and enterprise data-intensive applications are driving the need for constantly increasing data throughput in every aspect of the computing, storage and data center networks.
IT managers, data system architects and data communication equipment manufacturers are responding by increasingly driving system IO at even higher data rates. More and more servers, SANs, base stations and network switches implement IO at 10Gbps and higher at the physical layer. While the technical merits of copper and optical physical layers must be considered, an increasing number of these data intensive equipment applications are adopting the SFP+ standard as the default physical layer interconnect. The SFP+ standard offers several benefits over competing solutions. SFP+ interconnect solutions consume less power versus their copper equivalents. SFP+ cables have longer reaches and SFP+ optical modules have almost no system latency, thus optimizing system performance. Additionally, they have no cross talk sensitivity. How do the benefits of SFP+ interconnect solutions affect equipment and system design? As an example, low cable and system latency ensures fast response time and reduced CPU idling. This increases data center efficiency and maximizes ROI. Additionally, lower power consumption in SFP+ ports drive system and data center power savings.
Addressing SFP+ Design Challenges While SFP+ connector technologies have many benefits, several design challenges need attention to drive the desired system performance. As port density increases and higher data rates (>10 Gbps) are supported, system EMI emission and thermal performance concerns must be addressed while allowing for several system design trade-offs. Many variables affect EMI emissions, including leakage from optical transceivers, myriad types of board-level components (integrated chips, power supply module, etc.), and other improperly shielded connectors used in today’s communications equipment. If EMI emissions are not mitigated properly, these disturbances may degrade the effective performance of the circuit or prevent standards compliance. These effects can range from a decrease in performance to a total loss of data transmission.
S F P + E n h a n c e m e n t s E n a b l e N e t wo r k N e e d fo r S p e e d
There are also internal and external variables that affect thermal performance of pluggable IO products and dictate whether or not a cooling solution is required. Unfortunately there is no clear answer to this question and therefore system architects must consider many options and restrictions when designing end products. The form factor of the product must be taken into account as different configurations have unique airflows. A “pizza box” (whether a 1U or 4U) that is mounted in a standard rack may have front-to-back airflow or side-to-side airflow. A blade style switch, or piece of equipment, may be mounted vertically within an enclosure that is in turn mounted in a standard rack. This type of configuration almost always has bottom-to-top airflow. The number and density of ports mounted to the PCB must also be well thought out. These ports can be single port cages, 1xN ganged cages, 2xN stacked cages or a combination of all three. This is in addition to other IO connectors at the face of the product. The spacing between these cages must also be taken into account as well as port density, ambient air temperature, airflow and allowable temperature rise and backpressure created by baffling. Finally, heat dissipation of the optical transceiver itself must be considered. Commercially available optical transceivers are rated up to 70 °C but there are extended temperature range transceivers that can operate up to 85 °C. Newer SFP+ connector modules that are used in short reach and long reach applications are still dissipating 1 watt or less but extended reach and fixed DWDM (dense wavelength division multiplexing) transceivers can range from 1.25 to 1.5 watts per port.
Figure 1 – Standard Gasket Retention Plate
Figure 2 – Right Angle Gasket Retention Plate
The industry has found that trying to cool these higher wattage transceivers in SFP+ stacked cages is quite challenging. Managing the temperature of the inner lower row of ports that are not exposed to airflow is especially difficult. TE Connectivity has made several enhancements to their standard SFP+ connector portfolio to control EMI emissions while dissipating extra heat in dense, high-speed applications.
EMI Enhancements Through extensive research and testing, TE engineers have redesigned two components to improve EMI performance. The first component identified was the gasket retention plate shown in figure 1. This component acts as a backer plate for the conductive elastomeric gasket that interfaces with the inside of the front bezel. This retention plate was redesigned to utilize a right angle design with more attachment points to the cage body. These additional attachment points minimize the chance for EMI emissions to escape between the cage body and gasket retention plate. The redesigned gasket retention plate can be seen attached to the cage body in figure 2.
Figure 3 – Detail view of stacked cage with four lightpipes in latch plate.
The second component that was identified for improvement was the latch plate, which is the component that separates the bottom port from the upper port. This component also houses the light pipes that transmit light from LEDs mounted on the PCB to the front face of the cage assembly. Industry standards dictate the design of the latching mechanism, so this was left unchanged. But, within the latch plate a secondary component was added to improve EMI performance and prevent leakage. Since this component is integral to the cage body there is no difference in appearance or functionality between standard SFP+ stacked cages and SFP+ stacked enhanced cage assemblies. See figure 3 for detail view of latch plate.
07
S F P + E n h a n c e m e n t s E n a b l e N e t wo r k N e e d fo r S p e e d
The optimization of the gasket retention plate and the addition of the component to the latch plate yielded a significant improvement in EMI performance in the 1015 Ghz range. Test results shown in figure 4.
Figure 4 – EMI test data comparing standard SFP+ stacked cages vs. SFP+ stacked enhanced cages.
Thermal Enhancements The real estate that the latch plate provides was also used to create an airflow channel throughout the cage body in order to allow for the cooling of the lower row of SFP+ ports. This included the addition of square shaped perforations to the outside cage walls and vertical port separators, as well as two thermal vent holes in the front of the latch plate. These perforations were optimized in size and shape in order to maintain the same improved level of EMI performance, and the two thermal vents holes added to the front of each latch plate still allow for the use of two lightpipes per column. See figures 5 and 6 for a side view of cage assembly that includes side wall perforations, and for a detailed view of latch plate that includes the two thermal vent holes. Standard SFP+ stacked 2x4 cages were tested in order to establish baseline test data which would be compared against thermally enhanced cages. The test setup consisted of three cages mounted to a mock PCB with half-inch spacing between each cage. The PCB was then placed within a wind tunnel that allowed the front face of each cage to protrude through a bezel. Each port was simultaneously populated with a modified SFP+ module that allowed the use of thermocouples for measurement data and allowed testing of various wattages. Thermocouples were also attached to the top, sides and back of cage to record surface temperatures. An adjustable baffle was added to the exit end of the wind tunnel to induce backpressure. The following parameters were used for the baseline testing and follow up testing with enhanced cages: Figure 5
Figure 6
• Airflow: 500 LFM • Backpressure: 0.25” H20 • Altitude: Sea level
• Temperature: Room ambient (results adjusted for 55 °C ambient) • Power: 1.5W/transceiver
• Air gap above cage: 50 mm • Air gap below PCB: 9.5 mm • Temperature rise limit: 70 °C
Test data using 1.5 watts per transceiver indicates thermally enhanced cages outperform standard SFP+ cages by a 3% reduction in temperature, in this particular test environment. This testing also verifies that the lower inner row of ports is the most difficult to effectively draw heat away from and will remain a challenge as data rates continue to increase. TE’s thermally enhanced 2xN cages include the same EMI enhancements mentioned above.
Conclusion These SPF+ EMI and thermal enhancements demonstrate TE’s commitment to providing engineered electronic components for data communications applications, while providing innovative solutions the market demands. Avnet’s longstanding relationship with TE enables rapid adoption of these and all of TE’s solutions. More information can be found at www.em.avnet.com/te including links to technical documentation and product information.
Contributors
08
Matthew Schmitt
Product Engineer, TE Connectivity
Dave Dedonato
Test Engineer, TE Connectivity
Patrick Recce
Product Engineer, TE Connectivity
Matt Burns
Global IP&E Technical Marketing Specialist, Avnet Electronics Marketing
In today’s fast paced design environment, finding the right pieces to complete your design can be critical to the success of your project. Add to that the increasing complexity of software in designs that can challenge even the most talented development team. For example, simple schedulers need to be replaced with full featured RTOSs, and simple interfaces such as serial ports are being replaced with complex interfaces like CAN, USB and Ethernet. These tasks can cripple a development project if appropriate solutions are not identified, tested and integrated into a system - quickly. Wouldn’t it be great to have a one-stop shop for these kinds of critical software components? Now one exists with the new Embedded Software Store. Developed jointly by Avnet Electronics Marketing and ARM, the Embedded Software Store provides an embedded marketplace that brings developers and software vendors together, providing solutions for engineers in the embedded software space. By leveraging components and solutions from the Embedded Software Store, engineers can focus on the aspects of the system design that differentiate their products from their competitors, making for quicker time-to-market. Visit the Embedded Software Store at EmbeddedSoftwareStore.com and find out about the incredible breadth of products available to enable your success!
One-Stop Shop for Accessing and Acquiring Software Avnet Electronics Marketing and ARM have come together to launch the Embedded Software Store. This online information and e-Commerce-based website provides software downloads from a wide range of partners that are active in the ARM Connected Community® and Avnet’s partner ecosystem. By consolidating a large number of software options that support the ARM architecture within a single domain, the Embedded Software Store will help developers tackle the challenges presented by increased software and SoC design complexity.
• Browse popular categories such as: »» Board Support »» Services Packages »» Tools »» Middleware »» Operating Systems • Choose from a broad array of reputable embedded software vendors • Quickly download software and preview all license agreements in advance of purchase • Participate in the Embedded Software Store’s online community
In the mind of every engineer, there is a new embedded software solution. Start making yours a reality by visiting www.embeddedsoftwarestore.com today.
CODE TIME TECHNOLOGIES
W i r e l e ss S e n so r N e t wo r k P r o t oco l s
Keys to Selecting A Wireless Sensor Network Protocol By Kim Rowe, Founder and CTO, RoweBots Research
As more sensors surround us, and the diversity of their measurements and technology increases, seamlessly integrating these sensors into wireless networks creates new opportunities for innovation. Choosing a wireless sensor network (WSN) protocol involves sorting through a number of considerations. Exploring those considerations and the best approach for some applications yields insight as to how software for WSNs will evolve. Some popular protocols for WSNs are shown in the following table. The first set of decisions in deploying a WSN involves the topology, number of nodes, range (implementation dependent) and data rate desired. Protocol
Radio
Band
Topology
Nodes
Range
Max data rate
6LoWPAN 6LoWPAN
802.15.4
2.4 GHz
Star or Mesh
64 k
100 m
250 kbps
UHF
Sub-1 GHz
Mesh
64 k
800 m
50 kbps
UHF
2.4 GHz
Channel
64 k
30 m
1 Mbps
802.15.1
2.4 GHz
Master-slave
7
100 m
3 Mbps
802.15.1
2.4 GHz
Master-slave
7
50 m
260 kbps
ISO 18000-7
433.92 MHz
Multicast
1000
250 m
200 kbps
ISO 13157
13.56 MHz
Point to point
2
4 cm
424 kbps
UHF
TV white space
Base station
–
10 km
100 kbps
®
Wi-Fi
802.11
2.4 or 5 GHz
Star
255
100 m
54 kbps
Wi-Fi Direct
802.11
2.4 or 5 GHz
Point to point
2
100 m
54 kbps
ANT+
®
Bluetooth® Bluetooth Smart Dash7 NFC Weightless
802.16
2.5-5.8 GHz
Base station
60
20 km
70 Mbps
WirelessHART
802.15.4
2.4 GHz
Mesh
8
100 m
250 kbps
ZigBee®
802.15.4
2.4 GHz
Mesh
64 k
100 m
250 kbps
Z-Wave
UHF
Sub-1 GHz
Mesh
232
30 m
40 kbps
WiMAX
®
®
In this simplified comparison, it should be clear different technologies fit certain applications. For example, home lighting control is ideally suited to IEEE 802.15.4 radios because both range and data rate are limited. In comparison, a video monitoring function may require a Wi-Fi connection with sufficient bandwidth for transmitting images in real-time. For many embedded applications designed around microcontrollers (MCUs), network bandwidth and range are just part of the criteria of concern. Power consumption and power management start to factor in as stronger considerations for many applications.
Power consumption is extremely important since it dramatically affects usability of a device. If wireless sensors require frequent battery replacement or constant recharging, maintenance needs increase, user satisfaction drops and enthusiasm for a device diminishes quickly. Even in a highly optimized design, the transmitter is often the largest power consumer in a wireless sensor device. This is one of the main reasons one type of WSN does not fit all protocols. The minimum power radio suitable for an application with the needed bandwidth and range is often the technology chosen.
11
W i r e l e ss S e n so r N e t wo r k P r o t oco l s
Power management takes the next step, providing the means to actively reduce device power consumption at critical times, thus extending battery life. How power modes become visible to the application suggests how a device needs to be managed. Typical power modes for an MCUbased device would be normal, sleep and deep sleep. An MCU can power down the radio into a sleep or deep sleep mode, but its software must know what reduced power modes mean in terms of higher level protocols and expected system behavior of the device.
Sleep modes are typically used where a wireless link waits for an incoming message, waking the MCU when one is received. Consider the idea of a digital electronic leash, where two devices remain paired even if they go into various sleep modes, and automatically generate an alarm if they are separated by more than a programmed distance. By supporting deep sleep modes, better battery usage is achieved; however, higher level protocols must understand that the link is still active and change the power status of the device, maintaining the wireless connection through the transition.
Another brief example relates to sports. Teams and athletes are interested in better training methods and improving in-game performance, and fans are interested in understanding physiology, getting better results in fantasy leagues or gaining an edge in wagering. Imagine each player on a team is instrumented with sensors, monitoring many different parameters of interest including: • heart rate • respiration rate • “helmet cam” for player point-of-view display
Consider just the sensor technology issues for a moment. Designers of such a player monitoring system have choices of what data to transmit and how often, which leads directly to choices of wireless protocols. For example, heart and respiration rates change relatively slowly and could be transmitted on an 802.15.4 radio. Combining those measurements with other faster-varying sensor data like accelerometers might mean a Bluetooth Smart link is better, because all data can be transmitted on a single link. Adding a helmet cam would require a Bluetooth or Wi-Fi link for full HD without a heavy electronics package for compression. One approach to implementation would be a player-areanetwork, where individual sensors transmit locally to a chestor back-mounted collection point, which can provide a higher speed wireless connection for aggregated data to the outside world. Very low power sensors are already being integrated directly into smart uniforms and powered by energy harvesting. This approach, with different wireless protocols in use in the same system, implies software for interoperability.
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• temperature • pulse oximetry • 3D linear and rotational acceleration for various body parts
Diversity of sensors, power management and interoperability are key implications for WSN software. Wireless protocols are at different stages of standardization, and it will be some time before there is complete harmonization of advanced requirements such as support for MCU power modes and interoperability between protocols. As WSNs evolve, new software supporting these factors will make the difference in the seamless integration of devices.
Integrated packages for the standards based wireless options are available in the Embedded Software Store in the hardware vendors sections and the RoweBots Research section. These low cost packages are turnkey designs that allow evaluation and demonstration of the wireless protocol software stack and the associated hardware platform in just a few minutes. Check out these package options at EmbeddedSoftwareStore.com.
RoweBots Research was founded in 1987 by a group of University researchers. From the outset, RoweBots had its roots in real-time multiprocessor software and has broadened into an embedded signal processing systems company. Extensive work has been done on industrial productivity to deliver the value that customers require during software development. The evolution of the business has been built on a broad base of technology and rich business understanding that remains in the company today. Find out how RoweBots Research can match your development environment more closely with your business goals at www.rowebots.com.
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AXIOM
Bluetooth
Low Energy The world’s next great technology By Mr. Richard Trueman, Product Manager, Wireless Devices, Panasonic
We often think of the information age as beginning with the birth of the internet, or perhaps, for those of us who have been around a bit longer, it may feel that the information age began at the dawn of the computer age. Although in reality, the information age began much earlier with Johannes Gutenburg’s invention of the printing press in 1450 — for it was only after books were no longer written by scribes that information became available to the masses. Prior to the printing press, scribes copied manuscripts by faithfully reproducing each character with pen and ink, restricting books and the distribution of information to the very wealthy. In 1450, innovation and its resulting technology broke through.
Every so often a technology emerges that has a profound impact on the world. The printing press, computer and internet are some of those technologies. An important note with all of these technologies is that they affect the movement of information. And, now, a new technology has appeared on stage that will again significantly impact the world and change the movement of information. Bluetooth Low Energy (BLE) is the next technology that is poised to revolutionize our interaction with the world around us. BLE is an ultra-low power wireless network technology capable of forming truly wireless networks. While other wireless network technologies have been introduced, like cellular for example, they are not truly wireless technologies. By their nature, cellular devices must be tethered to accommodate frequent recharging. To be truly wireless, a technology must be capable of operating from a battery not for days or months, but years. BLE accomplishes this goal and does it using a small coin cell. (In fairness, other wireless technologies can operate on a battery, but none of the competing topologies combine the unique feature set found in BLE.) 14
BLE was designed by the Bluetooth Special Interest Group (BT SIG) as a white board design, free of interoperability constraints, to move data quickly and securely using the least amount of power possible. This is achieved primarily using two strategies: first, keep the Bluetooth radio off as much as possible and second, keep the data load small, so when the radio is active it’s on for only a tiny amount of time — think in terms of microseconds. To maximize BLE’s power efficiency the Bluetooth SIG designed a new network without the constraint of compatibility with existing networks. Yes, that’s right, BLE is incompatible with existing networks such as Bluetooth, now referenced as Bluetooth Classic or Bluetooth 2.1. To overcome this obstacle, BLE devices are available as dual mode, BLE plus Bluetooth Classic.
B l u e t oo t h Low E n e r g y
To be truly wireless, a technology must be capable of operating from a battery not for days or months, but years. Panasonic has eight different BLE solutions to address a wide range of application requirements. Both single mode, BLE and dual mode, BLE plus Bluetooth Classic modules are available. PAN1720
Single Mode, Bluetooth Low Energy
PAN1721
Single Mode, Ultra-Low Power Bluetooth Low Energy
PAN1326
Dual Mode, Host Controlled Interface Bluetooth Low Energy plus Bluetooth Classic
Why will BLE have the impact that other wireless network topologies have been unable to achieve? The answer is the coattails. Bluetooth was launched to eliminate the dangling wires between the cell phone and ear bud. As a consequence of this application, Bluetooth is the default Personal Area Network (PAN) technology used by nearly all cell phone manufacturers for the past several years. This gigantic base of installed nodes has caused other products, such as laptop computers, games, medical devices and many more, to adopt Bluetooth. The BT SIG expects the number of Bluetooth nodes to grow to over four billion in the not so distant future. Cell phone manufacturers have already adopted dual mode Bluetooth plus BLE, so BLE is on path to being the ubiquitous PAN standard; the coattails. Panasonic is a world leading RF module manufacturer that has over 110 different RF module solutions. In addition, Panasonic partners with world class IC manufacturers such as Texas Instruments, Intel and Toshiba as well as cutting edge software partners to offer customers cost engineered, system solutions. Every customer purchasing Panasonic RF modules has the security of Panasonic’s platform guarantee.
Cost engineered host controlled interface modules are well suited for high volume applications. These modules may be ordered with or without an integrated antenna for maximum design flexibility. Available USB, UART and I2C interfaces simplify integration to existing designs. And, optional software stacks from BlueRadios and StoneStreetOne eliminate the need of becoming a Bluetooth expert to develop firmware. And, finally Panasonic’s evaluation kits for all modules speed hardware designs.
Visit panasonic.com/rfmodules for datasheets, reference designs, CAD files and demonstration software. Once your design is complete, Panasonic’s engineering team will review it to make certain that the application will be successful. All Panasonic modules are fully certified to operate worldwide.
To learn more and purchase a Panasonic BLE module visit em.avnet.com/axiom_picble
15
OMNIMATE enables high density 2.0 The trend toward miniaturization continues. So start the space savings with your signal connectors. Our new OMNIMATE B2CF/S2C connectors offer the perfect advantages: • Double-row design in 3.5 mm pitch • Maximum installation density because they can be aligned side-by-side without loss of poles • A space savings of 30% on the front panel • Push-In connection technology to reduce wiring time
Call Nicole at 804-379-6036 to order your free Design-In kit. www.weidmuller.com
Av n e t E l e c t r o n ics M a r k e t i n g
Avnet Electronics Marketing brings together everything you need to know about new and focus manufacturer products and solutions. The following pages highlight design: M A n u FA C t u r e r p r O d u C t S & S O l u t I O n S
PROBLEMS What problem does this product or solution solve for the design team? SOLUTIONS How does this product or solution innovate in its segment?
Avnet Electronics Marketing em.avnet.com proBlem
• Designers need to get to market faster with flexible devices that are smaller in size, faster in speed, integrate complex features and so much more.
Associated products: design resour ce Center
solution
TRENDS What current or future trends does this product or solution address?
• Avnet Electronics Marketing offers all of the key ingredients for your success.
design Zones
• Avnet offers electronic components, supply-chain and design-chain services for original equipment manufacturers and electronic manufacturing services providers.
FAes
• With these component solutions and myriad services, Avnet can help you get to market faster on your next design. trenD
Feat ured pr omotions Market & tech tr ends training & events and more
• Together with over 250 industry-leading line card suppliers, best-in-class Field Applications Engineers, supply-chain and design-chain services, Avnet keeps you one step ahead of the next industry trend.
Sample
Associated Products
And, every page includes information on USB 3.0 Connectors associated parts or links to more information em.avnet.com/axiom_tyeusb3 and purchase opportunities.
proBlem
• Applications where IO is used for the transfer of data. • Applications that require faster data rates or greater power efficiencies in their IO interconnect.
solution
• USB 3.0 connector is designed to meet market trends driving: – – – –
trenD
Faster data transfer rates – 10 times faster than its predecessor, USB 2.0 Improved device interaction time Elimination of device polling Improved charging and power capabilities
Associated products: rJ point f ive connector systems board- to-boar d (0.8 mm Fh connector s) Wire- t o-boar d (AMp Ct & A Mp mini Ct connector s)
GET THE INSIDE TRACK NOW
• Saving and sharing media drives the need for faster data transfer rates among all IO connectors. • Power requirements are saved due to reduced power consumption.
17
AXIOM
Manufacturer Products & Solutions Raychem C-Wrap Side Entry Repair Sleeve em.avnet.com/axiom_tyecwrap Problem
• Need to reduce time, labor and overall cost for the repair. • Need a permanent repair. • Protection against corrosion.
Solution
• The easy installation of the Raychem C-Wrap side wire repair sleeve helps save time, labor and costs.
Associated products: C o l d a p p lied s p lice RT- 555 hig h t e m p e ra tu re ta p e Si d e e ntr y b u s hing s
• These sleeves are color-coded to ensure proper sizing for each application. • Long term performance helps provide a permanent repair. • Side entry is available for easy access to damaged wire. • Wrap-around design eliminates de-pinning of connector for repair, saving time, cost and manpower. Trend
• Harsh environmental applications require easy installation.
Modular Jacks and Plugs em.avnet.com/axiom_tyemodular Problem
• Global standardization of network connections needed. • Solid performance in voice, data and high-speed networking is difficult to achieve.
Solution
• These modular jacks and plugs offer excellent performance at a competitive price. • Variety of configurations and depth within the portfolio. • Ease of use.
Trend
18
• As more and more devices are added to the network, the growth of Ethernet-based equipment will remain steady and the demand for modular jacks will continue.
Associated products: R J p o i nt f ive c o n n e ctor s y s tems
M a n u fa c t u r e r P r o d u c t s & S o l u t i o n s
SFP+ Connectors em.avnet.com/axiom_tyesfpconnectors Problem
Solution
• PC board space is at a premium and thermal management is a constant concern.
Associated products:
• Applications require robust IO products to run at 10 Gbps speeds.
SF P c onnectors
• The SFP+ connectors’ belly-to-belly configuration supports high density design.
O t h e r p lu g g a b le I O p r o d u cts
• Innovative heat sink designs maximize system thermal management.
Q SF P + connectors
• Light pipe options provide easy identification of interface running status. Trend
• The SFP+ family meets the increased demand for higher speeds and greater bandwidth. • More efficient thermal solutions to meet system thermal requirements.
AMP-LATCH Connectors em.avnet.com/axiom_tyeamplatch Problem
• Future scalability and reuse in a design—designs are constantly changing based on industry requirements, hence scalability of a design is important to keep up with current system architectures. Board and cable assemblies need to be reused based on the new requirements for smaller or larger systems. • Laborious, complex and time consuming termination activity must be reduced.
Solution
• Offered in cable-to-cable or cable-to-board configurations, AMP-LATCH connectors help plan for future lengthening and shortening of cable assemblies at a very low cost. • Ejection latches ensure secure connection with simple mating and unmating of the plug and receptacle. • These connectors are one of the most efficient ribbon cable-to-board solutions on the market as they use IDC technology, allowing for mass termination of up to 64 conductors simultaneously. Wire prepping or stripping is eliminated adding efficiency and reducing the cost to assembly.
Trend
• Customers need cost-effective products, now. AMP-LATCH connectors are widely available in the market and are one of the lowest cost-per-signal solutions available. With the influx of new companies and solutions, TE makes it easier to build standardized systems by designing plugs and receptacles intermateable with competitive product.
19
Blackfin® Embedded Vision Starter Kit
The Ultimate IQ Booster for Embedded Vision Systems
The Blackfin® Embedded Vision Starter Kit, featuring FinBoard™, combines a versatile hardware platform with the necessary software development tools to enable the building of high performance, embedded vision systems. Based on the low-cost, dual core Blackfin BF609 processor, the kit is ideal for exploring advanced video analytics. The Pipeline Vision Processor (PVP) included on the BF609 simplifies and accelerates image processing algorithms. The CrossCore™ Embedded Studio development tools streamline software development, while the included ICE-100B In-Circuit Emulator speeds application debug. The Starter Kit includes it all and is a great way to begin exploring the growing applications of embedded vision technology.
What’s in the kit?
»» Avnet FinBoard BF609 baseboard »» Analog Devices ICE-100B JTAG debugger »» 2 GB microSD card »» 5 V power supply »» HDMI cable »» Micro USB cable »» Tripod »» 5 White dice »» 12-month CrossCore™ Embedded Studio license (two, 6-month licenses)
»» Quick Start card »» Downloadable documentation and reference designs
»» Download Blackfin Embedded Vision Starter Kit Product Brief.pdf
$100
Discount
The Blackfin Embedded Vision Starter Kit retails for $299. For a limited time, Avnet Electronics Marketing is offering a $100 discount to the first 500 customers who place an order for the kit.
Order your kit today at finboard.org, our new community-based site dedicated to the promotion and support of the Blackfin® Embedded Vision Starter Kit.
M a n u fa c t u r e r P r o d u c t s & S o l u t i o n s
ADL5324 ½ W SOT-89 RF Driver Amplifier Problem Solution
• Designers need the ability to tailor driver amplifier performance to the specific needs of the design. • The ADL5324 amplifier incorporates a dynamically adjustable biasing circuit that allows for the customization of OIP3 and P1dB performance from 3.3 to 5 V, without the need for an external bias resistor. • Its adjustable bias also allows for the driver to be dynamically biased in order to conserve power consumption when the full performance of the driver amplifier is not required, such as when a system is in stand-by mode. This scalability reduces the need to evaluate and inventory multiple driver amplifiers for different output power requirements, from 25 to 29 dBm output power levels.
Trend
• Customers need solutions for designs that will experience higher temperatures and much wider frequency trends. • With a rated operational temperature range of -40 to +105 °C and a wide frequency range of 400 to 4000 MHz, this amplifier addresses that trend.
ADF4351 Integrated Multi-band Silicon VCO Circuit em.avnet.com/axiom_anasynthesizer Problem
Solution
• Supporting the wide range of wireless standards requires a large range of local oscillator frequencies, which typically require multiple voltage controlled oscillators (VCO) together with complex switches and filtering. • The ADF4351 integrated multi-band silicon VCO circuit covers a range of frequencies from 35 to 4400 MHz with no frequency gaps. • It includes a Fractional-N PLL synthesizer that permits differing channel spacing resolution with no degradation to in-band noise. This is useful for supporting the different radio standards which may have differing channel bandwidths. • Extra features include phase control of the PLL output, which enables applications like digital beam forming and phased array antennas.
Trend
• Small footprint of 5 x 5 mm together with the integrated PLL & VCO reduces board size, time-to-market and iterations. • Wideband VCO enables software defined radio (SDR), which is increasingly popular.
21
AXIOM
Manufacturer Products & Solutions PAN1720 Series Bluetooth® Low Energy RF Module em.avnet.com/axiom_picpan1720 Problem
• Battery life is a critical requirement in low energy applications. • Short transition times and power efficient hardware are needed to help prevent the loss of battery life.
Solution
• The PAN1720 series is a cost-effective, low-power, true system-on-chip (SoC) complete Bluetooth 4.0 Low Energy solution that includes an embedded processor, antenna and Bluetooth Low Energy stack.
Associated products: ENW - 8 9820A1KF ENW - 8 9820A3KF E VA L _ PAN1720 E VA L _ PAN1720- BR
• The module includes an eight-channel, twelve bit analog-to-digital converter, 19 GPIOs plus battery and temperature sensors. • Available with Bluetooth Low Energy protocol stacks and applications from Texas Instruments and BlueRadios™. Trend
• The PAN1720 is an ideal choice where battery life is a critical application requirement since it uses only 500 nA in sleep mode. • Short transition times between operating modes – 3uS Wake-Up – and power efficient hardware further reduce current consumption.
PAN1326/1316 Series Dual-Mode Bluetooth and Bluetooth Low Energy em.avnet.com/axiom_picpan1326 Problem
Solution
• There is a need for a low cost, ultra-low power wireless networking solution for short range applications. • PAN1326/1316 series RF modules features both Bluetooth Low Energy and Bluetooth connectivity. • Maximum power consumption is less than 15 mA and the average power consumption is about 1 uA. A small coin cell – such as a CR2032 – is capable of powering a device for up to 10 years of operation. • The PAN1326/1316 Host Controlled Interface (HCI) series also brings Texas Instruments, CC2564 to an easy-to-use module format.
Trend
22
• The Bluetooth Low Energy standard is designed to reduce power consumption, establishing very fast connections (few ms) and transferring small amounts of data. Using these techniques, energy consumption is reduced to a tenth of Classic Bluetooth. Bluetooth Low Energy devices can be put into sleep mode and activated for event activities such as sending files to a gateway, PC or mobile phone.
Associated products: ENW - 8 9823A2J F ENW - 8 9823C2J F E VA L _ PAN1323
M a n u fa c t u r e r P r o d u c t s & S o l u t i o n s
MX150L™ Industrial Sealed Connector System em.avnet.com/axiom_mlxmx150L Problem
• Commercial vehicle, marine and non-automotive applications are exposed to harsh chemical and outdoor environments that place extreme demands on interconnect systems. • Electrical connections need to be protected from dust, water ingress, chemical contamination, wide temperature swings and vibration.
Solution
• The MX150L™ Industrial sealed connector system is designed for harsh and rugged environments. • Offered in wire-to-wire (in line plug and receptacle), wire-to-panel (sealed panel mount plug), and wire-to-board (right angle PCB mount header plug) configurations, the system supports both low-level signal as well as power applications up to 40 A. • An integral matte and interfacial seal design exceeds IEC IP67 “waterproof” requirements. This innovative preassembled design eliminates the need to purchase, handle and crimp individual wire seals, therefore lowering labor costs, as the system ships pre-assembled with no need to procure extra or individual components.
Trend
• Electrical systems on boats, farm equipment and trucks continue to evolve. The increased intelligence of today’s OEM products requires a versatile, sealed connector that will operate dependably under harsh conditions.
Note: This system is not designed for automotive applications such as USCAR-2, USCAR-25, GMW3191, AK Testing, J2030, Volvo Technology Requirements and Toyota Connector Spec (TCS).
Brad® Micro-Change® M12 Harsh Duty Receptacles em.avnet.com/axiom_mlxbrad Problem
• EMI noise can degrade signal integrity in harsh duty applications such as manufacturing or non-automotive vehicles. • Plastic housings are unable to eliminate such shielding issues.
Solution
• The Brad ® Micro-Change ® M12 receptacles are designed to withstand harsh commercial and industrial environments. • They offer a sealed, shielded connection to ensure a reliable connection for control elements in commercial and factory automation equipment. • Tooled for network connectivity in both Ethernet and Controller-Area Network (CAN bus) protocols, as well as passive applications such as discrete and analog sensor applications. • And, they are constructed of a heavy-duty die metal housing, providing 360° EMI/RFI shielding.
Trend
• Industrial and commercial vehicle applications will continue to require more complex networks with high data-rates in environments that are exposed to vibration, heat and other hazards. These applications will demand Ethernet products that are designed to meet the challenges posed by harsh Ethernet applications such as robustness and integration. • The Brad Micro-Change M12 harsh duty receptacles are ideal for Class 2 power and network circuit applications including petrochemical, factory-automation and commercial vehicles. 23
AXIOM
Manufacturer Products & Solutions MCP19111 Digitally Enhanced Power Analog Controller em.avnet.com/axiom_mcccontroller Problem
Associated products:
• Power conversion applications require more flexibility to address energy efficiency targets and aggressive product development schedules.
M C P 19111
Solution
• Enter the world’s first digitally enhanced power analog controller – Microchip’s MCP19111.
M C P 87018
• Combines a high-speed, high-performance analog PWM controller with a fully-functional, 8-bit MCU. This hybrid, or mixed-mode, implementation provides the performance of an analog controller with the on-the-fly flexibility of a digital interface.
M C P 87030
M C P 87022 M C P 87050 M C P 87055 M C P 87090 M C P 87130
• Feedback loop is wholly in the analog domain, eliminating the need for a highperformance MCU, while still offering cost-effective performance and integration. • Wide 4.5 to 32 V input voltage range makes the MCP19111 ideal for point-of-load DC/DC converters on 5, 12 and 24 V rails. • Integrates a peak-current mode analog controller; synchronous buck (i.e. high-side/low-side) MOSFET driver capable of driving up to 50 A power trains; mid-voltage LDO, allowing it to be directly powered from the input voltage; and a fully-functional 8-bit MCU. Trend
• Microchip is on a technology and product development path to support higher voltages and currents, while providing analog power supply designers flexibility approaching that of a fully-digital solution.
Digitally-Enhanced Power Analog Product Family Device MCP19111
Topologies
Integrated Driver
Driver Strength (Source/Sink - A)
Integrated PIC® MCU
Flash (KB)
RAM (bytes)
Pins
Package
Buck
Yes
2/4
Yes
8
256
28
5 x 5 mm QFN
Power MOSFET Product Family
24
Product ID
Type
Config
Vds (V)
Vgs (V)
Rds_on @ 4.5 V (mΩ-typ)
Qg (nC)
Package(mm)
MCP87018
N
Single
25
+10/-8
1.8
35
5 x 6 DFN
MCP87022
N
Single
25
+10/-8
2.2
25
5 x 6 DFN
MCP87030
N
Single
25
+10/-8
3
13.3
5 x 6 DFN
MCP87050
N
Single
25
+10/-8
5
9
5 x 6 DFN
MCP87055
N
Single
25
+10/-8
5.5
6
3.3 x 3.3 DFN
MCP87090
N
Single
25
+10/-8
9
4
5 x 6 DFN, 3.3 x 3.3 DFN
MCP87130
N
Single
25
+10/-8
13
2.9
5 x 6 DFN, 3.3 x 3.3 DFN
M a n u fa c t u r e r P r o d u c t s & S o l u t i o n s
Peripheral Modules Facilitate Rapid Prototyping em.avnet.com/axiom_mxmpmod Problem
• To help reduce their design cycles, customers need more complete design solutions instead of just the silicon. • Some traditional evaluation kits still prove useful, but it is often difficult to test ICs in a final system environment. This is due to hardware interface compatibility issues, unsupplied source code, and the complexity of porting code into the end application.
Solution
• The Pmod™ form factor and connector standard enable the attachment of a small IC or subsystem to an end user’s system. The modules support SPI, I2C, GPIO, and UART interfaces at low and medium transfer rates for simple plug-in to any FPGA that supports the Pmod standard. • Maxim Integrated supplies C-language software for the basic operations of the IC and a simple demo program. • Maxim offers many low-cost Pmod evaluation boards. A bundled collection of 15 of the most popular functions, including ADCs, DACs, and real-time clocks, is available for under $90. This collection includes the FPGA code and software that is compatible with Avnet’s LX9 Spartan®-6 FPGA board and the new Zynq®-based Zedboard. • New Pmod reference designs are in development and will be released in 2013. Many of these newer Pmods will be based on subsystems rather than single ICs.
All trademarks are the property of their respective owners.
Maxim Pmod Family Product ID
Product Type
Product Description
MAXPMBAE1
Analog Essential Collection
A bundled collection of 15 of the most popular functions, including ADCs, DACs and real-time clocks
MAX11205PMB1#
Precision 16-Bit ADC
ADC offers low supply current, low noise, and compact 10-pin package for space-constrained designs
MAX5216PMB1#
Precision 16-Bit DAC
Industry’s lowest-power 16-bit DAC
DS1086LPMB1#
Programmable Oscillator
Low-EMI oscillator reduces system cost through innovative architecture
MAX4824PMB1#
Octal Relay Driver
Octal relay driver reduces access time and power consumption and improves relay switching speed
MAX3232PMB1#
RS-232 Transceiver
Space-saving RS-232 transceiver works from a single supply voltage
MAX44000PMB1#
Proximity Detector
Industry’s most advanced proximity/ambient-light sensor offers lowest power consumption to conserve battery life
MAX5487PMB1#
Dual Nonvolatile Digital Pot
Space-saving, 256-tap nonvolatile digital potentiometer
MAX14840EPMB1#
RS-485 Transceiver
High-speed (40Mbps) transceiver extends cable lengths
MAX31723PMB1#
Temperature Sensor/Switch
Industry’s only 3-wire/SPI temperature sensor operates from as low as 1.7V, saving both space and power
MAX7304PMB1#
16-Port I/O Expander
Compact I/O expander increases flexibility through I/O expansion and integrated ESD protection
MAX9611PMB1#
Programmable Current Limiter
Easy to design and flexible current limiter
MAX31855PMB1#
Thermocouple to Digital
Complete, space- and power-saving solution converts thermocouple signals into a digital temperature reading
DS3231MPMB1#
3PPM Real-Time Clock (RTC)
Rugged crystal-less RTC keeps accurate time in challenging environments
MAX14850PMB1#
SPI/UART Isolator
Robust isolator with capacitive technology has high immunity to magnetic fields
MAX5825PMB1#
Octal 12-Bit DAC
Space-saving octal DAC with integrated watchdog timer and predefined power-on-reset states improves safety
MAXREFDES4
16-Bit AFE
High accuracy 4-20 mA input isolated Analog Front End
MAXREFDES5
16-Bit AFE
High accuracy multi-input isolated Analog Front End
MAXREFDES11
16-Bit AFE
High accuracy 0 to 10 V input isolated Analog Front End 25
Choose Renesas RX or RL78 MCUs Get Micrium RTOS, Middleware, Support and More for FREE! FREE Micrium RTOS
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The new customer project must use a Renesas RX or RL78 MCU, and it must be used in a commercial application.
No royalties. No licensing fees. All source code supplied!
μC/OS-III
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© 2013 Renesas Electronics America Inc. (REA). All rights reserved. All trademarks are the property of their respective owners.
M a n u fa c t u r e r P r o d u c t s & S o l u t i o n s
Circular Power Connectors (CPC) em.avnet.com/axiom_tyecpc Problem
Solution
• Applications where space is too limited to accommodate interconnect for separate power and signal connections.
Associated products:
• Applications exposed to harsh environments where mechanical shock, moisture and debris are prevalent.
I n d u s t r ia l Ether net
• The Circular Power Connector (CPC) family is a versatile, rugged, and circular-shaped signal and power connector system.
I C C ON s ing le- p ole p o w e r connectors
K OA X X A RF i n t e r c o nnects
• The connectors can be utilized to make complex wiring situations more manageable. • They are capable of both signal and power in a single interconnect. • They allow for more positions compared to connectors that are rectangular in shape with the same area. Trend
• Offers power and signal in one connector supporting the trend for more cost effective power and signal interconnect solutions. • Design engineers prefer easy-to-assemble products with quick connect/ disconnect capability and easy mating.
USB 3.0 Connectors em.avnet.com/axiom_tyeusb3 Problem
• Applications where IO is used for the transfer of data. • Applications that require faster data rates or greater power efficiencies in their IO interconnect.
Solution
• USB 3.0 connector is designed to meet market trends driving: –– –– –– ––
Trend
Faster data transfer rates – 10 times faster than its predecessor, USB 2.0 Improved device interaction time Elimination of device polling Improved charging and power capabilities
Associated products: R J p o i nt f ive c o n n e ctor s y s tems B o a r d - to- b oa rd ( 0. 8 mm F H c o n n e ctors ) W i r e - to- b oa rd ( A M P CT & AM P m i n i C T connectors )
• Saving and sharing media drives the need for faster data transfer rates among all IO connectors. • Power requirements are saved due to reduced power consumption.
27
AXIOM
Manufacturer Products & Solutions
CeeLok FAS-T Connectors em.avnet.com/axiom_tyeceelok Problem
• Designers need to acheive greater speeds in a smaller and lightweight solution. • Increased EMI protection is required. • Easy termination and field reparability required.
Solution
Associated products: M o l d e d b oots Te r m i na tion d evices
• The CeeLock FAS-T connectors’ noise-cancelling contact arrangement minimizes cross talk. • Achieves speeds up to 10 Gigabit Ethernet with Cat 6a or Cat 7 wire (1 Gigabit with Cat 5e). • The small design helps allow for improved performance with less space. • Backshell integrated in plug body provides low profile, low cost, low weight strain relief and EMI protection.
Trend
• Increased high speed protocols and faster data rates. • Field reparability. • Harsh environmental applications require faster speeds.
MULTIGIG RT 2-R Connectors em.avnet.com/axiom_tyemultigig Problem Solution
• High vibration levels in harsh environments.
Associated products:
• With a new quad redundant contact structure, this ruggedized version of the MULTIGIG RT 2 product helps provide an additional level of reliability under extreme vibration.
VI TA 6 1 comp lia nt M e z a l ok mez z a nine c o n n e ctors
• Supports high speed protocols: Serial RapidIO, PCIe, Ethernet, Fiber Channel, and InfiniBand protocols. • Modular, lightweight connector system. • Robust “pinless” interface resists damage. • Compliant to VITA 46 for Open VPX applications. • VITA 46 compliance enables upgrades in existing VPX applications. Trend
• These connectors are used in harsh environmental applications. • There is strong growth in VPX for rugged embedded computing.
28
VI TA 6 7 comp lia nt R F m o d u les VI TA 6 6 comp lia nt o p t i c s mod u les
V
Pluggable Input/Output Solutions
irtual Sample Kit
Virtual Sample Kit Avnet and TE are offering over 40 of the most popular Pluggable I/O products in a Virtual Sample Kit. Click through the link below to:
»» View product details including pricing & availability »» View product data sheet or related specifications »» Request sample(s) em.avnet.com/axiom_tyevirtualsamplekit
Pluggable High Speed I/O Kit
SFP Dust Plug 1761394-1
SFP 1x1 Cage 1489669-1
SFP+ 1x1 Cage 2007198-1 SFP/SFP+ Conn 1888247-1
SFP+ 1x1 Cage + Heat Sink 2007464-1
XFP 1x1 Cage 1489951-1
XFP Conn 1367500-1
QSFP+ 1x1 Cage + Heat Sink 1888631-1
SFP+ 1x3 Cage + Light Pipe + Heat Sink 2057042-2
QSFP+ 1x1 Cage QSFP+ Light Pipe 1888674-1 1888634-1
zSFP+ Connector (Samples available in April 2013) 2170088-2
QSFP/ XPF EMI Plug 1888810-2
SFP 1x2 Cage 1761014-1
SFP+ EMI Plug 1888901-1
SFP+ 1x2 Cage + Light Pipe 2007262-1
SFP+ 2x1 Assy 2007492-5 QSFP Conn 1761987-9
Belly to Belly
SFP 2x1 Assy 1658391-1
CXP Standard Assy 2149699-1
CXP Extended Assy 2149731-1
CXP Assy + Light Pipe + Heat Sink and CXP Dust Plug 2149159-5 2149126-3
Mini-SAS HD 1x1 Cage Assy 2149027-1
zQSFP+ 1x1 Cage + Heat Sink and Connector 1551892-1 1551920-2
X2 Guide Rails 1367710-1
SFP+ Cable Assembly and QSFP+ Cable Assembly (Request information) 2127934-1 2053638-1
SFP+ 1x4 Cage 2007093-1
SFP+ 2x2 Cage 2007417-5
zQSFP+ 1x3 Cage 2173239-1
TE Connectivity and the TE connectivity (logo) are trademarks. Other logos, product and company names mentioned herein may be trademarks of their respective owners.
CFP
X2 Conn 1367337-1
2057592-2 - CFP GUIDE RAIL 2057629-1 - CFP MODULE CONN ASSY 2057630-1 - CFP RECEPTACLE CONN ASSY 2057631-1 - CFP RECEPTACLE COVER ASSY 2057930-1 - CFP BACKER PLATE ASSY 2057626-1 - CFP EXTERNAL BRACKET ASSY 1963856-1 - HEAT SINK, 100 GIG PLUGGABLE 2149151-1 - EMI/DUST COVER, CFP
AXIOM
Manufacturer Products & Solutions
TransferJet™: Connectivity with a Simple Touch Problem
• The transfer of large files, quickly, easily and safely is still a perplexing problem even with today’s advanced technologies. For example, users want to not only swap large files between smartphones, tablets and laptops, but they also want to print photos directly from their camera or smartphone, or stream videos to their large screen TV. It is possible with cables, flash drives and set-up menus, but cables and flash drives can be easily lost or forgotten. • For Wi-Fi to be effective you need access to a strong connection and configuration issues can affect both Wi-Fi and Bluetooth®. While many different wireless technologies are available on devices, there simply isn’t a technology that is easy to use, secure, consistently reliable and has the ability to quickly transfer large amounts of data. Or is there?
Solution
• TransferJet™ is a close-proximity wireless data transfer technology with a very high effective data rate, up to 375 Mbits/s, and short range of just a few centimeters. This allows users to swap files between devices by merely “touching” them together. • This technology can move a 10-Mpixel photo between devices in milliseconds and a 100-Mbyte video file in as little as two seconds. • This very short range, point-to-point communication, inductive coupling technology and simple pairing all improve the security of the TransferJet wireless transfer technology. • It avoids interference common with Wi-Fi since it operates on an unlicensed frequency band (4.48 GHz) and has very low transmission power (-70 dBm/MHz) similar to Bluetooth. • Both the Toshiba TJM35420 LSI and the TJM35420XLG ultra-small module support the TransferJet technology.
Trend
• To increase proliferation of the technology, Toshiba has recently announced a microSDIO card, USB and microUSB adaptors that incorporate the TransferJet technology. • This technology can now be quickly added to after-market products and ease OEM integration.
Price and Availability Part Number
Toshiba TransferJet Products
Sample Availability
Sample Price (1,000 pc)
TJM35420XLG
LSI
Now
$3.00
TJM35420XL
Ultra-small module
Q213
$5.00
TJM35420UX
USB Adaptor
Now
$29.00
TJM35420MU
MicroUSB Adaptor
Now
$25.00
TJM35420US
MicroSDIO Card
Now
$9.00
Check out the video at www.toshiba.com/taec/components/Description/pop_transferjetvideo2.html TransferJet is a trademark of the TransferJet Consortium, a 45-member organization dedicated to the proliferation of the TransferJet Technology. Toshiba is a member of the TransferJet Consortium. Bluetooth is a registered trademark owned by Bluetooth SIG, Inc.
30
D E S I G N : S U P P LY C H A I N V E L O C I T Y
I n f o r m a t i o n i s P o w e r i n S u pp l y C h a i n Ri s k M a n a g e m e n t
By Gerry Fay, Chief Global Logistics & Operations Officer, Avnet Inc.
Visibility into the supply chain lets you anticipate and respond quickly to risk factors, both upstream and downstream. In today’s outsource-dominated global electronics industry, much of the value in an OEM brand owner’s operations is highly dependent on businesses outside of the company’s four walls — and increasingly outside their home region. With the volatility, complexity and uncertainty of market demand and the global economy, more comprehensive supply chain risk management is quickly becoming a major competitive differentiator.
06
31
AXIOM
Avnet’s new "Control Tower" service is designed to provide transparency into the multiechelons of the supply chain. Control Tower serves as a collaborative execution based hub for all the supply and demand data Avnet collects from members of the customer’s extended supply chain, such as demand forecasts; channel inventory; SKU level sell-out; work-in-progress (WIP) inventory; shipping data, and purchase orders. Risk has always been inherent in the supply chain. However, when you factor in geopolitical and global economic instability, increased regulatory and environmental compliance, and threat of natural disaster, the likelihood and potential severity of a supply chain disruption are greater than ever before. This is why Avnet advocates that companies implement supply chain risk management programs that are not only proactive, but also multitiered. Typically, these efforts just scratch the surface of the problem because they are often limited to tier 1 suppliers. This trend is demonstrated by the results of a 2011 survey by Gartner Group on Multi-tier Supply Chain Visibility, in which twothirds of respondents reported having upstream visibility processes for tier 1 suppliers, but only one-third had such processes for tier 2 and tier 3 suppliers. Shared data is most often limited to updates on inventory, shipments and order/lead time status. With the competitive pressure on the supply chain, there is very little room for error. Since supply chains may encompass hundreds of different companies around the globe, each with distinct roles in getting a final product to market, OEMs
32
need to have transparency into the operations of all critical supply chain partners, regardless of tier, if they hope to mitigate their supply chain risk meaningfully. This transparency enables companies to proactively shift or reprioritize their supply chains based on changing supply or demand signals in multiple tiers of the supply chain — both up and downstream. To date, there are few commercial solutions on the market designed to facilitate this level of visibility throughout the supply chain. Gartner Group reports that the most frequently utilized visibility tools for both multitier suppliers are spreadsheets and homegrown collaboration tools. In an effort to provide a more standard and user-friendly means of monitoring extended supply chains, Avnet recently introduced a new “Control Tower” service. Designed to provide transparency into the multiechelons of the supply chain, Control Tower serves as a collaborative execution based hub for all the supply and demand data Avnet collects from members of the customer’s extended supply chain, such as demand forecasts; channel inventory; SKU level sell-out; work-in-progress (WIP) inventory; shipping data, and purchase orders.
I n f o r m a t i o n i s P o w e r i n S u pp l y C h a i n Ri s k M a n a g e m e n t
In addition, Control Tower customers receive push notifications alerting them to a change in conditions that might have an impact on their supply chain, such as a shortage in supply, an expansion in lead time, concerns over costs related to currency conversion, or a natural disaster affecting the availability of raw materials.
to focus their risk management emphasis based on their relative performance versus their peer set and whether they are managing their supply chain based on cost versus reliability, responsiveness or agility.
SCC’s Value at Risk metric takes the probability of an event and multiplies it by the expected impact of the event (i.e., if this happens, what does it mean for Avnet is able to provide this service because of our the organization?). It provides a more methodical unique role in both the downstream design and and financially based means of evaluating upstream supply points of high tech supply chains. each risk factor, Now, our customers can enabling companies leverage our scale and A robust process for calculating risk is to consider the return scope to better manage also essential in moving an organization on investment (ROI) of their supply chains and from simply addressing response any mitigation effort mitigate their risk. and either reduce the capabilities to better assessing where Access to information, probability of the risk supply chains are most vulnerable. however, is just one occurring (prevention) element of a risk or the impact that the management strategy. A robust process for risk might have on the business (recovery). calculating risk is also essential in moving an No matter what size your organization or what organization from simply addressing response market you play in, it is crucial for companies to capabilities to better assessing where supply support and protect their supply chains with a chains are most vulnerable. The Supply Chain proactive multitier supply chain risk management Council (SCC) offers a number of tools to help program. Visibility into multiple echelons of companies begin to identify and prioritize their the supply chain enables companies to either risks, including the Supply-Chain Operations anticipate or respond more quickly to supply Reference (SCOR) model and the Value at Risk chain risk factors, avoiding costly disruptions to (VAR) metric. operations, impacts on product quality and lasting SCOR enables users to gain better insight into their reputational damage. risk relative to industry averages by benchmarking For more information on how to get started, please metrics against similar companies in their industry. contact us at avnet.velocity@avnet.com Using this information, they can determine where
Risk has always been inherent in the supply chain. OEMs need to have transparency into the operations of all critical supply chain partners, regardless of tier, if they hope to mitigate their supply chain risk meaningfully. Douglas Kent explains the importance of prioritizing Supply Chain Risk
Watch Video at: http://goo.gl/PPQrN
This article was reprinted with permission from Avnet Supply Chain Velocity. 33
AXIOM
Training
&
Events
Avnet Great Lakes: Embedded World • April 24 in Plymouth, Michigan. • This one-of-a-kind, full day event will provide attending customers with a tour of the Embedded World. • Hear from key lines and talk trends in embedded processing, displays, software and storage. Register: em.avnet.com/axiom_avnetgreatlakes_ew
Embedded Vision Summit • April 25 in San Jose, California. • Unique opportunity for engineers to learn about the hottest technology in the electronics industry – embedded computer vision, which enables “machines that see and understand.” • Includes “how-to” presentations, product and technology demonstrations and distinguished speakers. Register: embedded-vision.com/embedded-vision-summit
Building a Security Surveillance System: Timesys University Local Edition Workshop • Learn how to build an embedded Linux-based Qt application and leverage RTOS controlled sensors on the PHYTEC phyCORE-Vybrid Development Kit. • Using open source Linux, MQX RTOS, Timesys and ARM® tools, and the PHYTEC phyCORE-Vybrid development kit, attendees of this hands-on training session will build a security surveillance system. Register: em.avnet.com/axiom_timesyssecurity
Avnet Wi-Go Design Challenge • Avnet invites YOU to design the latest wireless software. • Using the Avnet Wi-Go System, we are looking for you to design software for the application of your choice. • One (1) grand prize winner will be chosen to win an 11’’ Apple MacBook Air! Register: em.avnet.com/axiom_wigodesignchallenge
34
Training & Events
Microsemi SmartFusion2 SoC FPGA SpeedWay Design Workshops™ • These workshops feature the new Microsemi SmartFusion2 SoC FPGAs, the only devices that address fundamental requirements for advanced security, high reliability and low power in critical applications. • Taught by Avnet technical experts, these workshops combine informative presentations with hands-on labs progressing from introductory labs to more complex labs and demos. • Includes a free SmartFusion2 Starter Kit! Register: em.avnet.com/axiom_mswsmartfusionworkshop
Video-based Xilinx® Zynq™-7000 AP SoC SpeedWay Design Workshops™ • This workshop series features three online courses progressing from introductory, through running a Linux operating system on the Zynq-7000 SoC, and finally to the integration of the high-speed analog signal chain with digital signal processing from RF to baseband for wireless communications. • Training is recommended equally for engineers who are new to FPGAs as well as those seeking to enhance their expertise with Zynq-7000 SoC development tools. Register: zedboard.org/trainings-and-videos
Freescale Kinetis-L Online Customer Training Modules • Freescale’s exciting new Cortex M0+ based Kinetis-L Series offer a versatile combination of energy efficiency, easeof-use and value as well as scalability from existing 8-bit (S08P) and 32-bit Cortex-M4 (Kinetis-K) MCUs. • Watch these short “On-Demand” training modules that provide prospective users with quick insights into key aspects of what makes these parts so compelling. Register: em.avnet.com/axiom_frskinetistraining
In addition to the events above, Avnet offers a robust selection of On-Demand Training and Demos, Behind the Wheel™ Dev Tool Product Overviews and Technical Webcasts. Check out our offerings at em.avnet.com/axiom_training
35
Simplified. SUPPLY CHAIN SOLUTIONS FROM AVNET Your job is to develop and market innovative products; our job is to reduce your risk along the way. Even leading edge products need a cost-effective and dependable supply chain to be a success. That’s where Avnet can help. Around the world and around the clock, you can rely on our expertise at every point in the supply chain – from supply chain assessment to solution design to global planning. Avnet’s supply chain solutions save you inventory and infrastructure. That’s money in the bank, and the edge you need to stay ahead of the competition. Simple, really. What can we do for you? www.avnetexpress.com
Accelerating Your Success!™ 1 800 332 8638 | www.avnetexpress.com |
@avnetdesignwire
New Product Introductions
What’s New
Analog Devices Microwave PLL Synthesizer The ADF41020 frequency synthesizer can be used to implement local oscillators as high as 18 GHz in the up conversion and down conversion sections of wireless receivers and transmitters. It consists of a low noise, digital phase frequency detector, a precision charge pump, a programmable reference divider, and high frequency programmable feedback dividers (A, B, and P). em.avnet.com/axiom_npiana
Emerson Network Power MVME2500 VME64 Processor Board The Emerson MVME2500 single-board computer (SBC) features the latest Freescale QorIQ™ processors — the single-core P2010 and dual-core P2020. The e500 v2 core QorIQ processor uses 45 nm technology, which delivers an industry-leading performance-to-power ratio with single-core or dual-core frequencies up to 1.2 GHz at less than 8 W. em.avnet.com/axiom_npiefj
IDT VersaClock Low Power Clock Generator The IDT5P49EE801 is a programmable clock generator intended for low power, battery operated consumer applications. There are four internal PLLs, each individually programmable, allowing for up to eight different output frequencies. The frequencies are generated from a single reference clock, which can come from either a TCXO or fundamental mode crystal. em.avnet.com/axiom_npiidt
Intel® Platform for Large Scale Communications Infrastructure Systems Check out the new Intel® Xeon® Processor E5-2600 and E5-2400 Series with Intel® Communications Chipset 89xx Series. This range of Intel® Xeon® processors paired with the Intel® Communications Chipset 89xx Series enable application, control and packet processing workloads with hardware acceleration of cryptographic and compression functions. em.avnet.com/axiom_npiitl
Kontron Digital Signage Evaluation Kit DSEK-12 Fast-track digital signage solutions with this Open Pluggable Standard (OPS)-compliant evaluation kit – complete with media player and key software evaluation licenses. This fully validated solution from Intel, Kontron, Microsoft and their ecosystem partners Flypaper and Scala lets you experience preconfigured digital signage examples and move straight into application development within minutes of opening the box. em.avnet.com/axiom_npiknt
MathWorks DSP Design Package for Xilinx Kits The MathWorks Software Package for Xilinx DSP Kits includes MATLAB®, Simulink ®, HDL Coder™ and several other MathWorks products that enable engineers to design, test and implement algorithms with high-speed analog data acquisition on Xilinx FPGAs using Model-Based Design. This approach has proven to save time and reduce design errors over traditional workflows involving hand-coding HDL. em.avnet.com/axiom_npimth 37
AXIOM
What’s New
Microsemi SmartFusion2 SoC FPGA Microsemi’s next-generation SmartFusion2 SoC FPGAs are the only devices that address fundamental requirements for advanced security, high reliability and low power in critical industrial, military, aviation, communications and medical applications. SmartFusion2 integrates an inherently reliable flash-based FPGA fabric, a 166 MHz ARM® Cortex™-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM, and industry-required high-performance communication interfaces all on a single chip. em.avnet.com/axiom_npimsw
Molex Top-Contact FPC Connector Molex’s top-contact 0.25 mm FPC connector provides greater PCB space savings and contact reliability — even when subjected to shock or vibration — compared to similar competitive designs. The top-contact 0.25 mm pitch FPC connector expands Molex’s range to provide customers with the industry’s largest offering of 0.25 mm pitch FPC connector choices. Molex is currently the only maker to offer both top-and bottom-contact designs. em.avnet.com/axiom_npimlx
Molex Ruggedized Interconnect Products Molex offers a variety of interconnect products designed to meet the need for a rugged, environmentally sealed connector system supporting both low-level signal applications as well as power applications. Options are available in wire-to-wire, wire-to-panel and wire-to-board configurations. These products deliver optimal performance especially in wet, high-vibration and wide-operating-temperature conditions. em.avnet.com/axiom_npimlx2
Murata Power Solutions 400 W AC-DC Converter The new industry-leading MVAC400 power converters feature 400 W of power packaged in a standard 1U open frame format measuring just 76.20 x 127.00 x 35.56 mm (3 x 5 x 1.4 inches). The MVAC400 models accommodate the universal AC input voltage range from 90 to 264 VAC with active power factor correction (PFC) and active inrush protection. em.avnet.com/axiom_npicdt
OCZ Z-Drive R4 PCIe SSDs Designed and manufactured for a wide range of enterprise environments, including cloud computing and data centers, the Z-Drive R4 features OCZ’s Virtualized Controller Architecture (VCA) 2.0. This architecture provides top performance, flexibility, durability and enhanced reliability, allowing data centers to rely on a PCIe-based SSD as their primary tier one storage solution for the first time. em.avnet.com/axiom_npiocz
Panasonic Bluetooth® Triple Mode RF Modules The PAN1323 series provides easily integrated Bluetooth Version 4.0 and ANT connectivity into new and current designs by removing RF design and certification barriers from the development of the application. Gain unprecedented access using this three mode gateway module that can connect 14 million ANT nodes to over 3 billion Bluetooth nodes. em.avnet.com/axiom_npipic 38
New Product Introductions
What’s New
STMicroelectronics L6480 cSPIN Motor Driver The L6480, a member of the STMicroelectronics’ cSPIN family, is an advanced fully integrated motion controller solution suitable for driving two phase high power bipolar stepper motors with microstepping. Precision movement and positioning systems can be smaller, lighter, simpler and more efficient thanks to the L6480’s integration and embedded intelligence to manage the motion. em.avnet.com/axiom_npistm
Texas Instruments TPS92510 Constant Current Buck Converter for HBLEDs The TPS92510 is a 60 V, 1.5 A peak current-mode step-down converter with an integrated high-side MOSFET. It is specifically designed for driving high-brightness LEDs with a constant current. The tight-tolerance, 200 mV internal reference voltage reduces power dissipation in the current-sense resistor. em.avnet.com/axiom_npitis
STMicroelectronics TSX56 Series Micropower Op Amps The TSX56 op amp series delivers new levels of accuracy, energy, efficiency, space savings and rugged performance. It benefits from a new generation of advanced 16 V CMOS op amps that simplify the design of sensors for applications from automotive electronics to smart buildings and industrial controls. The new process, developed in-house, enables tiny die sizes, resulting in available ultra-small surface-mount packages. em.avnet.com/axiom_npistm2
TE Connectivity zQSFP+ Interconnect System The zQSFP+ (z-Quad Small Form-factor Pluggable Plus) connector and cage assembly is a high-density, highspeed product solution designed for applications in the telecommunications, data center and networking markets. The interconnect offers four channels of high-speed differential signals with data rates ranging from 25 Gbps up to potentially 40 Gbps. em.avnet.com/axiom_npitye
TE Connectivity Interconnect, Passive and Electromechanical Products TE releases 100s of new products each year and Avnet Electronics Marketing consistently stocks all of the latest components and design kits to support new designs. New products are clearly marked in the part selector tool, and are available in multiple packages with many offered via the cut reel program. em.avnet.com/axiom_npitye2
Texas Instruments Precision Amplifier Value Line The Texas Instruments Precision Amplifier Value Line was conceptualized to enable the designer to address performance needs in price sensitive designs across a wide variety of applications. The line offers three best-in-class performance amplifier families to solve design challenges in low power, low voltage and wide supply designs. em.avnet.com/axiom_npitis2
39
Design Zones
Instant Access to the Materials & Information You Need As an engineer, it’s your job to bring innovative products and solutions to market quickly. To help make this happen, Avnet Electronics Marketing has created new Design Zones that bring you instant access to rich product details, selector guides, technical resources and up-todate industry trends in key market areas such as:
Discover the endless possibilities of designing with Avnet!
www.em.avnet.com/designzones
AXIOM
Market & Technology Trends
Real-Time Information on Pricing and Lead Times Looking for new and innovative ways to get your designs to market faster? With Avnet Electronics Marketing’s Market & Technology Trends, you can track lead times, market updates, pricing and new technology information on HUNDREDS of different products in 15 different commodities.
Sign up to receive this innovative eNewsletter today: www.avnetpreferencecenter.com Watch the most recent Market & Technology Trends report highlights: http://youtu.be/R3w9GgX7EIk
Lead Time Trend Product
Current
Trend vs. Previous Month
Price Trend Trending
From 2/13 to 5/13
Comments
Analog
2-16+ weeks
Both pricing and lead times are stable overall.
Communications
4-22 weeks
Both pricing and lead times are stable overall.
Digital Signal Processors
2-20 weeks
Lead times are stable to improving slightly for some products. Overall pricing is stable, however we are seeing increases for some legacy/mature products.
Discrete
4-26 weeks
Both pricing and lead times are stable overall.
Logic
4-10 weeks
ASPs have stabilized and lead times remain stable at a low level.
Memory
4-12 weeks
Both pricing and delivery is stable overall.
Microcontrollers
2-16+ weeks
Lead times have moved in slightly at the high end and ASPs have stabilized overall, however we are seeing some price increases for legacy/mature products.
Opto
4-14 weeks
Both pricing and lead times have stabilized overall.
Processors
4-22 weeks
Both lead times and pricing are stable overall, however we are seeing price increases for some legacy/mature products.
Progammable Logic
4-16 weeks
Both pricing and lead times remain stable.
RF
2-26 weeks
Both lead times and pricing are stable overall, however we are seeing price increases for some legacy/mature products.
IPE Commercial Electromechanical
Stock to 19 weeks
Pricing is stable overall. Lead times are beginning to decline back to normal as manufacturing “catches up” from the Lunar New Year.
Miltary Electromechanical
Stock to 24 weeks
Pricing is stable overall, however it should be monitored closely because of the fluctuation of raw material cost for the foreseeable future. Lead times are beginning to decline back to normal as manufacturing “catches up” from the Lunar New Year.
Commercial Interconnect
Stock to 9 weeks
Following the price increases in January, pricing and lead times are now stable. Customers should review their applications and ask the question – Do they really need gold plating when gold flash might suffice?
Millitary Interconnect
Stock to 16 weeks
Lead times are stable and in some cases coming in slightly. Pricing has also been stable and should be for the short term.
Commercial Passive
Stock to 54 weeks / COE
Lead times continue to vary across the Passive Commodities ranging from stock to 54 weeks. Keep in mind that some products may require contacting the manufacturer for accurate lead times. Pricing is stable.
Military Passive
6-16 weeks
Lead times have come in slightly for some products and the overall trend is very stable. Pricing is also stable.
Power Supply
Stock to 24 weeks
Pricing is stable overall. Lead times are beginning to decline back to normal as manufacturing “catches up” from the Lunar New Year.
41
AXIOM
A Quick Glance Links and page references to the big ideas and industry trends, products, solutions, trainings and more featured in this issue.
BIG IDEAS AND INDUSTRY TRENDS
SUPPLY CHAIN VELOCITY
Panasonic: Bluetooth Low Energy is the World’s Next Great Technology. . . . . 14
Information is Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Rowebots Research: Keys to Selecting a Wireless Network Protocol. . . . . . . 11
Simplified Supply Chain Solutions from Avnet. . . . . . . . . . . . . . . . . . . . . . . 36
TE Connectivity: SFP+ Enhancements Enable Network Need for Speed. . . . . . 6
TRAINING & EVENTS
em.avnet.com/axiom_picble rowebots.com
em.avnet.com/te
MANUFACTURER PRODUCTS & SOLUTIONS
ebnonline.com/velocity/ or contact avnet.velocity@avnet.com avnetexpress.com
Avnet Great Lakes: Embedded World. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
em.avnet.com/axiom_avnetgreatlakes_ew
Analog Devices Blackfin® Embedded Vision Starter Kit, featuring FinBoard™ . 20
Avnet Wi-Go Design Challenge. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Analog Devices ADL5324 ½ RF Driver Amplifier. . . . . . . . . . . . . . . . . . . . . 21
Embedded Vision Summit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
finboard.org
Analog Devices ADF4351 Integrated Mulit-band Silicon VCO Circuit. . . . . . 21
em.avnet.com/axiom_anasynthesizer
Analog Devices Delivers Unequaled RF Performance, Selection and Integration. 43
analog.com/RF
Maxim Peripheral Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
em.avnet.com/axiom_mxmpmod
Microchip MCP19111 Digitally Enhanced Power Analog Controller. . . . . . . . 24
em.avnet.com/axiom_mcccontroller
Molex MX150L™ Industrial Sealed Connector System. . . . . . . . . . . . . . . . . . 23
em.avnet.com/axiom_mlxmx150L
Molex Brad Micro-Change M12 Harsh Duty Receptacles . . . . . . . . . . . . . 23 ®
®
em.avnet.com/axiom_mlxbrad
Panasonic PAN1720 Series Bluetooth® Low Energy RF Module. . . . . . . . . . . 22
em.avnet.com/axiom_picpan1720
em.avnet.com/axiom_wigodesignchallenge
embedded-vision.com/embedded-vision-summit
Freescale Kinetis-L Online Customer Training Modules. . . . . . . . . . . . . . . . . 35
em.avnet.com/axiom_frskinetistraining
Microsemi SmartFusion2 SoC FPGA SpeedWay Design Workshops™. . . . . . 35
em.avnet.com/axiom_mswsmartfusionworkshop
Building a Security Surveillance System: Timesys University Local Edition Workshop. . . . . . . . . . . . . . . . . . . . . . . . . 34
em.avnet.com/axiom_timesyssecurity
Video-based Xilinx® Zynq™-7000 AP SoC SpeedWay Design Workshops™ . 35
zedboard.org/trainings-and-videos
On-demand trainings and demos, technical webcasts and new training announcements. . . . . . . . . . . . . . . . . . . . . . . . . 35
em.avnet.com/axiom_training
WHAT’S NEW
Panasonic PAN1326/1316 Series Dual-Mode Bluetooth & Bluetooth Low Energy. 22
Analog Devices ADF41020 Microwave PLL Synthesizer. . . . . . . . . . . . . . . . 37
Renesas RX or RL78 Microcontroller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Emerson Network Power MVME2500 VME64 Processor Board. . . . . . . . . . 37
TE Connectivity Modular Jacks and Plugs . . . . . . . . . . . . . . . . . . . . . . . . . . 18
IDT VersaClock Low Power Clock Generator. . . . . . . . . . . . . . . . . . . . . . . . 37
TE Connectivity SFP+ Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Intel® Platform for Large Scale Communications Infrastructure Systems. . . . . 37
TE Connectivity AMP-LATCH Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Kontron Digital Signage Evaluation Kit DSEK-12 . . . . . . . . . . . . . . . . . . . . . 37
TE Connectivity Circular Power Connectors. . . . . . . . . . . . . . . . . . . . . . . . . 27
MathWorks DSP Design Package for Xilinx Kits. . . . . . . . . . . . . . . . . . . . . . 37
TE Connectivity USB3.0 Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Microsemi SmartFusion2 SoC FPGA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
TE Connectivity CeeLok FAS-T Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . 28
Molex Top-Contact 0.25 mm FPC Connector. . . . . . . . . . . . . . . . . . . . . . . . 38
TE Connectivity MULTIGIG RT 2-R Connectors. . . . . . . . . . . . . . . . . . . . . . . 28
Molex Ruggedized Interconnect Products . . . . . . . . . . . . . . . . . . . . . . . . . . 38
TE Connectivity Virtual IO Sample Kit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Murata Power Solutions 400 W AC-DC Converter. . . . . . . . . . . . . . . . . . . . 38
Texas Instruments WEBENCH® Design Center . . . . . . . . . . . . . . . . . . . . . . . 13
OCZ Z-Drive R4 PCIe SSDs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Toshiba TransferJet™ Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Panasonic Bluetooth® Triple Mode RF Modules . . . . . . . . . . . . . . . . . . . . . . 38
Weidmuller OMNIMATE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
STMicroelectronics L6480 cSPIN Motor Driver. . . . . . . . . . . . . . . . . . . . . . . 39
RESOURCES
STMicroelectronics TSX56 Series Micropower Op Amps . . . . . . . . . . . . . . . 39
em.avnet.com/axiom_picpan1326 am.renesas.com/micrium
em.avnet.com/axiom_tyemodular
em.avnet.com/axiom_tyesfpconnectors em.avnet.com/axiom_tyeamplatch em.avnet.com/axiom_tyecpc
em.avnet.com/axiom_tyeusb3
em.avnet.com/axiom_tyeceelock
em.avnet.com/axiom_tyemultigig
em.avnet.com/axiom_tyevirtualsamplekit em.avnet.com/axiom_tiswebench
toshiba.com/taec/components/Description/pop_transferjetvideo2.html Contact Nicole at 804.379.6036
Design Zones by Avnet Electronics Marketing . . . . . . . . . . . . . . . . . . . . . . . 40
em.avnet.com/designzones
Embedded Software Store. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9, 10
embeddedsoftwarestore.com
Market & Technology Trends . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
em.avnet.com/publications
em.avnet.com/axiom_npiana em.avnet.com/axiom_npiefj
em.avnet.com/axiom_npiidt em.avnet.com/axiom_npiitl
em.avnet.com/axiom_npiknt
em.avnet.com/axiom_npimth
em.avnet.com/axiom_npimsw em.avnet.com/axiom_npimlx em.avnet.com/axiom_mlx2
em.avnet.com/axiom_npicdt
em.avnet.com/axiom_npiocz em.avnet.com/axiom_npipic
em.avnet.com/axiom_npistm
em.avnet.com/axiom_npistm2
TE Connectivity zQSFP+ Interconnect System. . . . . . . . . . . . . . . . . . . . . . . . 39
em.avnet.com/axiom_npitye
TE Connectivity Interconnect, Passive and Electromechanical Products. . . . . . 39
em.avnet.com/axiom_npitye2
Texas Instruments TPS92510 Constant Current Buck Converter for HBLEDs . . 39
em.avnet.com/axiom_npitis
Texas Instruments Precision Amplifier Value Line . . . . . . . . . . . . . . . . . . . . . 39
em.avnet.com/axiom_npitis2
42
Unequaled RF performance, selection, and integration. ADI delivers. 1000+ RF ICs, industry-leading tools, and reference circuits optimize radio designs. No one is delivering more ways to meet RF design challenges than Analog Devices. We provide 1000+ high performance ICs for every part of the RF signal chain. From high performance discrete building blocks to integrated subsystems on a chip, ADI offers solutions for every RF challenge. Complete reference circuits, best-in-class online design tools, webinars, evaluation boards, and technical support forums further assure optimum design success. Explore our innovative products and design resources at analog.com/RF.
High performance ICs for every part of the RF signal chain
Rx MIXER
ADC
ADC DRIVER
ADC
I/Q DEMOD
VGA DGA
LNA
ADC DRIVER
AMP Tx/Rx DUPLEXER
PLL/PRESCALER AMP HPA LINEARIZATION
DAC
VGA DGA
AMP
I/Q MOD
Tx MIXER
DAC
LOG/RMS CONTROL
Integrated functions for multiple frequencies › › › › › ›
Design resources › RF Tools: ADIsimPLL,™ ADIsimRF,™ ADIsimSRD,™ ADIsimCLK™ › Circuits From the Lab™: dozens of RF reference circuits › EngineerZone™: online support community
ADF435x: Wideband PLL, VCO ADRF660x: Mixer, PLL, VCO ADRF670x: Modulator, PLL, VCO ADRF680x: Demodulator, PLL, VCO ADRF6510/ADRF6516: Dual VGAs, filters ADRF6850: Demodulator, PLL, VCO, VGA
analog.com/RF
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From antennas to wireless, and from high-speed connectors
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There’s hundreds of ways to connect… which method will you choose?
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