Flip Chip Technology Market Forecast(2021 - 2026)
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• The Flip Chip market is forecast to reach $36.7 billion by 2026, growing at a CAGR of 8.2% from 2021 to 2026. • Flip chip is a packaging technology that interconnects the chip and substrate of a package carrier using a bump. It is also used in interconnecting semiconductor devices such as IC chips, printed circuit boards (PCBs) and microelectromechanical systems (MEMS) to external circuitry with soldier bumps to be deposited on to the chip pads. • Flip chips mostly appear in high-volume consumer products such as computer peripherals, mobile phones, digital cameras and MP3 players. Flip chips offer a wide variety of benefits as compared to wire-bond packaging and has good electrical performance, high-speed and reliability. Contact: (+1) 970-2363677 Email: sales@industryarc.com
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Key Takeaways
• The demand for flip chip technology is high during the forecast period due to advancement of copper pillar and micro bumping metallurgy and its extensive application in consumer electronics and mobile phones. • Flip chips mostly appear in high-volume consumer products such as computer peripherals, mobile phones, digital cameras and MP3 players. • Flip chips offer a wide variety of benefits as compared to wire-bond packaging and has good electrical performance, high-speed and reliability. • Asia-Pacific is anticipated to dominate the global market over the forecast period due to countries like China and India are major manufacturing hubs of flip chips. Contact: (+1) 970-2363677 Email: sales@industryarc.com
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Flow Battery Market Segment Analysis - By Power Source • There are three types of packaging technologies such as 2D, 2.5D and 3D integrated circuits. Three dimensional integrated circuits contain multiple layers of active devices which have the potential to enhance chip performance, functionality and semiconductor device packing density and are projected to grow at fastest rate of 10.1% through 2026. It has additional advantages over 2.5D IC such as enhanced capacity, improved performance and low power consumption. 3D integrated circuits are preferred over 2D and 2.5D due to reduced latency, high density, and greater bandwidth. Hence, 3D integrated circuit to register a highest growth in the forecast period. Contact: (+1) 970-2363677 Email: sales@industryarc.com
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Flip Chip Technology Market Landscape • Chang Chun Petrochemical Co. Ltd • United Integrated Services Co. Ltd • Mirle Automation
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Flip Chip Technology Market – Forecast (2021 - 2026) Learn More About the Report
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