Panel Level Packaging Market Forecast(2022 - 2027)
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• Panel Level Packaging Market Size is forecast to reach $3.5 billion by 2026, at a CAGR of 18.5% during 2021-2026. Panel Level packaging (PLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration, larger substrates formats also are targeted. In addition, manufacturers are increasingly driving their suppliers to provide panel -processing tools and materials to allow them to bring wafer-level precision to package processed on panel substrates. This packaging is used in the packaging of field programmable gate array (FPGA), CPU/GPU, power management IC module, baseband, and others. Contact: (+1) 970-2363677 Email: sales@industryarc.com
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Key Takeaways Consumer Electronics sector is expected to witness a highest CAGR of 19.9% the forecast period, as this segment is powering a new wave of developments in electronic packaging. Panel Level Packaging market in Asia-Pacific region held significant market share of 35.5% in 2020. With the presence of several significant vendors in the power electronics market, which are actively investing for the development of advanced panel-level packaging technology is driving the market growth. According to Semiconductor Industry Association (SIA), memory, logic, analog, and MPU related semiconductor products accounts for more than 80% of the total sales in the semiconductor industry; Contact: (+1) 970-2363677 Email: sales@industryarc.com
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By Distribution Channel- Segment AnalysisFan-out Panel Level Packaging segment is expected to hold significant share of 51% in 2020. Several packaging houses are implementing panel-level fan-out, a lowdensity technology that promises to lower the cost of fan-out. Fan-out Panel Level Packaging segment is expected to be essential for future applications on 5G, AI, Biotech, Advanced Driver- Assistance System (ADAS), smart city, and IoT related products. In addition ability to develop advanced packing and testing services and secure customer relations serve as major factors which are diving the market growth in the forecast period. Fan-out Panel Level Packaging segment finds largescale applications in the consumer electronics sector to design ultra-thin portable devices such as smartphones, smart watches, and laptops as they offer high-performing, energy-efficient, thin, and small form factor Contact: (+1) 970-236Inquiry packages. 3677 Email: sales@industryarc.com
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Panel Level Packaging Market Industry Outlook • • • • • • • • •
Amkor Technology, Inc Deca Technologies Lam Research Corporation ASE Group Siliconware Precision Industries Co., Ltd. Fraunhofer Institute for Reliability Micro integration IZM Taiwan Semiconductor Manufacturing Company Shinko Electric Industries Co, Ltd.
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Panel Level Packaging Market - Forecast(2022 - 2027) Learn More About the Report
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