ASUS IoT 2024 Product Guide

ABOUT ASUS

ASUS is a global technology leader that provides the world’s most innovative and intuitive devices, components and solutions to deliver incredible experiences that enhance the lives of people everywhere. With its team of 5,000 in-house R&D experts, ASUS is world-renowned for continuously reimagining today’s technologies for tomorrow, garners more than 11 awards every day for quality, innovation and design, and is ranked among Fortune’s World’s Most Admired Companies.

Over 16,000 Employees worldwide

5,000+ World-class R&D team

200+ Countries

A VISIONARY APPROACH TO UBIQUITOUS COMPUTING TECHNOLOGY

In the contemporary landscape of ubiquitous computing, ASUS has seamlessly integrated itself, embracing the interconnected fabric of our digital era. Rooted in a robust foundation of personal and mobile computing, we've extended our purview to encompass IoT computing, cloud computing, and advanced AI computing, aiming to contribute to a more enriched future for people's lives.

Computin

AI Computing

IN SEARCH OF INCREDIBLE

Worldwide Recognition

An ever-growing portfolio of products, solutions, and services that continue to garner global accolades

One of the World's Most Admired Companies

(for 8 years)

Best Global Taiwan Brand (for 9 years)

World’s Best Employers 2022

ABOUT ASUS IoT

Accelerating AIoT Transformation with ASUS IoT

ASUS IoT is a sub-brand of ASUS dedicated to the creation of incredible solutions in the elds of AI and IoT. Our mission is to become a trusted provider of embedded systems and a partner in the AIoT solutions ecosystem. ASUS IoT strives to deliver best-in-class products and services across diverse vertical markets – providing convenient and efcient environments for people everywhere.

Exceptional AI technology

Innovative technology and flexible design

Strong partnerships for assured timely production and stable supply chain

Exclusive technical support

Committed to longevity

Exceptional quality control for compatibility and safety

DESIGN & MANUFACTURING SERVICE

ASUS is known for creating products and services that exceed industry standards. Our engineers design to exacting standards to guarantee quality, and we use only the best components to ensure real-world performance and reliability. Along with offering customized production at low or high volumes, ASUS also provides flexible options for modied standards or fully customized design and manufacturing services for modules, motherboards or systems.

DESIGN REVIEW GATE PROCESS

Planning

Design Development Validation & Verification Production

All ASUS products undergo a series of strict validations, so customers can rest assured that they will receive consistent results of the highest quality.

Dynamic tests - Altitude, vibration, shocks,

drops

Environment tests - Temperature, humidity, thermal, acoustic noise

hardware monitor

Emissions tests - EMC, EMI

Function tests - BIOS for UEFI, system utilities, OS, and external hardware compatibility

ABOUT ASUS IoT

REVOLUTIONIZING AIOT THROUGH COLLABORATIVE SOLUTIONS

ASUS IoT's approach with the AIoT Partner Alliance Program aims to transform AI and IoT with a collaborative model. Focused on joint creation development, it combines hardware, AI software, design and quality for complete market solutions. The ASUS AIoT Alliance Program unites industry partners for end-to-end AIoT solutions, providing benefits like training, project engagement, customer support, and marketing resources.

Co-Developing

Global Reach, Local Touch

ASUS has hundreds of local service centers around the world that provide ef cient, timely service by enabling customers to drop of ce items in need of repair instead of shipping them to a remote location. These service centers are either owned or operated by ASUS or by authorized service providers trained and certi ed by ASUS to provide the best service and quality.

ASUS in Smart Manufacturing

Centralized monitoring and control platform

i. Real-time data visualization

ii. Integrates factory big data

HMI in production line

i. Panel pc series

ii. Intuitive user interface

AOI equipment

i PE3000G/4000

ii. PE1100N

i. PE3000G/4000G/60000G

Ai-based defect inspection

Ai-based defect

i. AI-powered AOI

i AIdAO

ii. MES integration for easy traceability

Equipment & parameter monitoring

i. Empowers predictive maintenance and health management

ii. Real-time AI analysis and on-site motor modeling

MANAGEMENT PRODUCTION

Collaborative robotics

i. Human-robot collaboration

ii. Adaptive task allocation

Ai-based defect detection in packaging

i. AI-powered AOI

ii. MES integration for easy ytilibaecart

i. PE2000U

ii. PE1100N

AI and Rugged Edge Computers

Edge

i. Intuitive dashboard to visualize potential risks

ii. Leverage AI technology to increase workplace safety

AI-based EHS solution

ingle

Chapter 7

Tinker Series Chapter 11

Panel PCs Chapter 12

Intelligent Integrated Solutions Chapter 15

AISVision & AISEHS Chapter 5

TikSi 11

7

ASUS in Smart Retail

Intelligent vending machine

i. Innovative technology and flexible design

ii. Outstanding design capabilities

Self-checkout

i. Efficient checkout process

ii. Lower overhead, increased productivity

Edge

NUCs and Mini PCs

Chapter 8

Tinker Series

Chapter 11

Industrial Single Board Computers

AISVision

Chapter 5

ALPR Edge AI Dev Kit Chapter 6

pter 10

AI-based behavior analysis

i. Customer traffic-pattern recognition

ii. Personalized shopping recommendations

Digital signage

i. Reliable fanless design

ii. 24/7 reliability

Digital menu

i. 4K triple-display support

Self-service ordering

i. Empowers customers to tailor own orders

ii. Integration with loyalty programs

Service robots

i. Customer assistance and guidance

ii. Automated inventory scanning

Electronic shelf labeling solution

i. Real-time price updates

ii. Integration with inventory management

AI-based smart replenishment

i. Integrate ai technology into existing processes

ii. Optimize efficiency for ofitability

p increased profita

ASUS in Smart Healthcare

Medical PCs

i.

ii.

Commercial/clinical monitors

i.

ii.

Ai-based image processing

i.

ii. Instant polyp

i.

i.

i.

ii.

i.

ASUS

ASUS

ASUS

Water management

i. Iot-based leak detection

ii. Real-time water-quality monitoring

Smart energy

i. Microgrid solutions

ii. Energy-efficiency optimization

Smart lighting

i. Adaptive street lighting

ii. Centralized lighting control

Smart transportation

i. Intelligent traffic management

ii. Connected public transportation

Smart parking

i. Parking-space availability tracking

ii. License-plate recognition

i. Smart-bin monitoring

ii. Automated waste-collection scheduling

Waste management

ALPR Edge AI Dev Kit

Industrial Single Board Computers

Chapter 10

Tinker Series

Chapter 11

Chapter 6

Motherboards & 10

APPLICATION STORIES

Smart manufacturing

Smart inspection of each and every screw and nut: San Shing Fastech uses AI to implement zero-defect management

San Shing Fastech Corp, a global leader in the nut industry, grappled with the challenge of meeting the ‘zero-defect’ inspection requirements of an automotive manufacturer, fueling the quest for an advanced AI solution to enhance quality control.

SOLUTION FEATURES

• ASUS IoT AISVision, an easy-to-use AI toolkit and SDK for computer vision, suitable for model training and inference

• Zero-code machine-learning toolkit, generate AI model in only four steps

• ASUS's unique AI technique for supervised and unsupervised learning

CUSTOMER BENEFITS

• Boost quality inspection efficiency to achieve Zero PPM

• Empowers in-house R&D team to rapidly develop and deploy an AI-powered visual-inspection system

Smart manufacturing Unicomp and ASUS IoT create high-speed computing, massive image processing, and high-performance X-ray inspection system

X-ray inspection, integral in manufacturing and research, has evolved with Unicomp's LX9200, partnering with ASUS IoT for high-precision needs in semiconductors and new energy, driving automation and increasing demand for large-scale testing.

SOLUTION FEATURES

• ASUS IoT EBS-4U700 designed for enhanced performance, reliability and efficient high-speed data processing

• Powered by Intel® Core™ i9/i7 (14th/13th/12th gen) processors for optimized IIoT performance

• ASUS IoT CToS provides rapid time-to-market and production flexibility

CUSTOMER BENEFITS

• Empowers a robust X-ray inline automatic inspection system

• Boosts inspection capacity for quicker and more precise results

• Ensures reliability and efficiency, meeting diverse industrial demands

Smart factory

DIP-process defects inspection with AI

A Chinese electronic manufacturing facility's DIP process relies on manual visual inspection post-soldering, leading to a significant human labor burden.

SOLUTION FEATURES

• AI modeling with a handful of samples

• Automatic reading of serial numbers and essential machine-readable information

• Designed for pre-wave soldering, reducing rework

• MES management for production alignment and traceability

CUSTOMER BENEFITS

• Enhance DIP production

• Quick setup, with no reprogramming for diverse products

• Trim inspection time, boosting operator flexibility

• Refine post-solder rework, minimize board damage

Smart factory SMT line enhancement with AI re-inspection

To address a high AOI overkill rate in its SMT line, a Vietnamese company utilizes AI technology from ASUS IoT. This solution collaborates with AOI, focusing on RLC component overkill reduction without replacing the existing AOI system.

SOLUTION FEATURES

• Pre-trained AI model for easy deployment

• Significantly reduce RLC components AOI overkill rate, saving 80-90% overkill

• Reduce operator (OP) manpower and allow flexible OP usage

• Compatible with TRI 3rd-gen AOI machines

CUSTOMER BENEFITS

• Achieve a 76% reduction in re-inspection time, enhancing overall operational efficiency

• Transition from manual re-inspection to a more efficient and accelerated workflow

• Improve overall operational efficiency and output quality with streamlined re-inspection

AISDID 100

APPLICATION STORIES

Smart factory

High-precision backplane docking pin-defect inspection

Streamlining the inspection of high-density backplane docking pins, our all-in-one station enhances precision during assembly, minimizing oversights before shipment.

SOLUTION FEATURES

• High-precision photo capture with minimal distortion using a telecentric lens

• Automatic object pin alignment and photo capture

• Inspection for pin bending, missing pins and foreign-object defects

CUSTOMER BENEFITS

• Ensure high precision for top-notch product quality

• Automatic processes and inspections to prevent human errors

• Flexibility in production processes and locations with a cart-type design

Smart factory

Automatic optical in-line CPU-socket pin inspection with AI

Conventional visual inspection of CPU socket pins risks worker fatigue. Our solution, using automatic optical inspection, guarantees accuracy, eliminating the chance of injuries and fatigue-induced oversights.

SOLUTION FEATURES

• In-line inspection during barebone assembly and testing

• Automatic socket alignment and photo capture

• Detects pin bending, missing pins and foreign objects

CUSTOMER BENEFITS

• High precision for superior product quality

• Automated processes to prevent human errors

• In-line production flexibility for various socket configurations

Smart transportation

ALPR applications take advantage of ASUS IoT PE1000N’s

rformance and high

The ASUS IoT PE1000N Edge computer offers a potentially game-changing solution for smart parking and traffic enforcement in Korea. Tailored for automated license-plate recognition (ALPR) applications, this compact edge-computing solution ensures resilience and efficiency in technology-driven initiatives.

SOLUTION FEATURES

• ASUS IoT PE1000N with NVIDIA® Jetson for precise ALPR image analytics

• Compact design with efficient cooling for reliable outdoor operation

• ASUS IoT guarantees availability of both product and technical suppor t for five years

CUSTOMER BENEFITS

• Reliable outdoor operation, eliminating overheating for improved performance

• Effortless integration with existing infrastructure and optimized utilization of previous investments

Smart transportation

ASUS IoT and Fortune Electric collaborate on AI-powered EV-charging station technology in Taiwan

SOLUTION FEATURES

• The ALPR Edge AI DevKit precisely recognizes license plates, adeptly addressing challenges like insufficient lighting, poor weather, reflections, blurring and license-plate-bezel issues

• AI-powered technology enhances billing accuracy

• Compact, versatile design seamlessly integrates

PE1000N

PE1000

ASUS IoT collaborates with Fortune Electric to transform the EV-charging landscape in Neihu, Taiwan, using the ASUS IoT Tinker Edge R and ALPR Edge AI DevKit for up to 99.99% accurate license-plate recognition.

APPLICATION STORIES

Smart city

Innovating for progress: ASUS IoT and PE1000N drive smart city initiatives in Bình Dinh province

Bình Dinh province in Vietnam is actively pursuing smart city initiatives to drive tourism and sustainable growth. The establishment of the Binh Dinh Smart City Monitoring Center addresses challenges of traffic and urbanization.

SOLUTION FEATURES

• ASUS IoT PE1000N for efficient vehicle data collection

• Real-time monitoring, equipment oversight and violation proof capabilities

• Energy-efficient computing for cost-effective operations

Smart city

CUSTOMER BENEFITS

• Effectively reduces traffic congestion, shortens passenger travel time, saves fuel consumption and contributes significantly to carbon emission reduction

• Crucial role in emergency response for enhanced security

• The monitoring center attracts experts and investments, fostering regional growth

• T fo

SOLUTION FEATURES

The power of partnership: ASUS IoT and Skidata transform access control and parking at Brazilian business park

The Perini Business Park in Brazil sought to address slow entry processes for its 10,000+ daily visitors. In collaboration with ASUS IoT, Skidata implemented a smart access control and parking-management solution, ensuring fast, touchless entry and improving daily parking management for over 4,500 vehicles.

• Co-developed by ASUS IoT and Skidata

• Compact and powerful design, energy-efficient at 1.5 watts maximum by Tinker Edge R

• Fast access in under 15 seconds with license plate recognition, achieving up to 99% accuracy with high-inference performance

• Real-time monitoring and statistical insights for business park management

CUSTOMER BENEFITS

• Streamlined access enhances visitor experience

• Improved parking management for 4,500+ vehicles daily

• Valuable data insights support park management

• Scalable solution for real-time occupancy detection

Camera

Smart City Monitoring Center

Tinker Edge R

PE1000N

Smart healthcare

ASUS IoT PE200U enhances patient safety in operating rooms

Smart Sensing Ltd., incubated by HKSTP, specializes in AIoT solutions for smart cities and business intelligence. Its adoption of the PE200U industrial PC from ASUS IoT addresses healthcare challenges, specifically minimizing the risk of retained foreign objects during clinical procedures.

SOLUTION FEATURES

• ASUS IoT PE200U industrial PC with AI-powered item recognition

• Compact size, stable computing and low power consumption

• Fanless thermal design for hygiene control and quiet operation

• Diverse I/O interface, expansion options for medical devices

SOLUTION FEATURES

• Reduced hospital equipment check-up time

• Lowered risk of guidewire retention for enhanced patient safety

• Accurate and prompt recognition of used guidewires

• ASUS IoT's smart hospital development boosts efficiency and patient-centric environments

Smart healthcare

ASUS IoT EBE-4U: Powerful, stable performance at the heart of digital radiography

A prominent Chinese medical equipment manufacturer, with over 20 years of industry presence, seeks global expansion by establishing a comprehensive medical imaging and dental equipment platform. It faced challenges with its existing control computer for digital radiography (DR) and required an efficient and reliable solution.

SOLUTION FEATURES

• Industrial-grade hardware performance and medical sector expertise for optimal functionality

• EBE-4U's 19-inch 4U rackmount chassis is tailored for medical computing applications.

• High-performance Intel® H110 chipsets ensure effective DR image processing

• Access one-stop consulting and after sales service for comprehensive support

CUSTOMER BENEFITS

• Achieves enhanced performance and stability for DR equipment

• Delivers improved overall performance, leading to lower costs

• Enhances DR rack control with versatile connectivity for increased operational efficiency

PE200U

EBE-4U

APPLICATION STORIES

Smart retail

Bringing automated intelligence to store operations

ASUS IoT and Macnica DHW collaborate to bring automation to food retail, providing heightened operational efficiency, reduced wastage and increased profitability through the smart replenishment and electronic shelf-labeling solutions.

SOLUTION FEATURES

• AI-driven 24/7 restocking with real-time alerts

• Dynamic e-paper pricing label updates

• Eliminates manual inspections for reduced labor costs

• GDPR-compliant image processing ensures accuracy

• Designed by Macnica DHW for reliability and adaptability

CUSTOMER BENEFITS

• Optimal stock levels and efficient pricing

• Cost-effective operations and increased profitability

• Scalable solutions for diverse retail environments

Smart retail

Smart inspection of each and every Screw and nut: San Shing Fastech uses AI to implement zero-defect

In the Industry 4.0 era, the retail sector leverages digital transformation, focusing on AI applications like people-counting, facial recognition and object analysis. ASUS IoT collaborates with TMA Innovation to offer a smart retail solution, enhancing customer experience, automating analytics, and providing real-time data insights.

SOLUTION FEATURES

• People-counting, facial recognition, and emotional analysis

• Real-time monitoring, heatmaps, and automatic alerting

• Automated AI systems for cost-effective and accurate results

• ASUS IoT-Intel EBS-I70, a compact box PC with extreme CPU/GPU performance

CUSTOMER BENEFITS

• Utilization of data for statistical analysis

• Improved facility management

• Increased operational efficiency

• Reduced operational cost

EBE-4U

EBS-I70

CHAPTER 4

New Product Highlights

PE8000G

Intel® Core™ processors (13th/12th gen)-based rugged edge AI GPU computer supporting up to dual 450W GPU cards

‧Supports up to dual 450W GPU card for real-time AI inferencing at the edge

‧13th/ 12th Gen Intel® Core™, 16C/24T 35W/65W CPU, Intel R680E chipset

Up to 64GB ECC/ non-ECC DDR5 4800 SDRAM

‧1 x M.2 M key (NVMe), 1 x M.2 B key (5GNR), 1 x M.2 E key (WiFi6)

‧Military-grade (MIL-STD-810H) durability, and exceptional thermal design ensuring reliable operation under -20°C to 60°C

‧8 to 48V wide-range DC input with built-in ignition power control and power monitoring

PE5101D

Intel® Core™ processors (13th/12th gen)-based rugged high-performance edge computer with Intel® R680E Chipset supporting 2.5” hot-swappable HDD tray, RAID 0/1, and up to 200W graphics card

‧Supports 13th/ 12th Gen Intel® Core™ CPU with R680E chipset Supports dual 2.5” hot-swappable HDD tray & RAID 0/1

‧Rich I/O with 3 x 2.5 GbE, 10 x USB, 6 x COM

‧PCIe x16 & PCIe x4 expansion slots support up to 200W GPU card

8 to 48V wide-range DC-in with built-in ignition power control

‧Wide operating temperature range: -25° C to 60° C

PE3000G

Intel® Core™ processors (12th gen)/NVIDIA® or Intel® MXM GPU-based rugged fanless edge AI computer

‧Supports NVIDIA® Ampere/Turing™ or Intel®Arc™ A-series MXM GPU, for varied edge AI computing

‧12th Gen Intel® Core™ 45W CPU, up to 64GB DDR5 4800 SDRAM

Patented system architecture and thermal design to ensure -20°C to 60°C fanless operation*

‧3 x 2.5 GbE and 1 x GbE ports with optional PoE+ support

‧1 x M.2 M key (NVMe), 1 x M.2 B key (4G/5G NR), 1 x M.2 E key (WiFi 6) 8 to 48V wide-range DC-in input with built-in Ignition power control

‧MIL-STD-810H and withstand 5 Grms vibration

* R.O.C Patent No. M638395

PE5100D

Intel® Core™ processors (13th/12th gen)-based rugged high-performance edge computer with Intel® R680E Chipset supporting 2.5” hot-swappable HDD tray, RAID 0/1, and rich I/O

‧Supports13th/12th Gen Intel® Core™ CPU with R680E chipset

Supports dual 2.5” hot-swappable HDD tray & RAID 0/1

‧Rich I/O with 3 x 2.5 GbE, 10 x USB, 6 x COM

‧8 to 48V wide-range DC-in w/ built-in ignition power control

Wide operating temperature range: -25°C to 70°C

PE2200U

Intel® Core™ Ultra processors (Series 1)-based compact fanless edge computer with diverse connectivity, up to 64GB DDR5, 2-4 x LAN, 4 x COM, 7 x USB, and 9-36V DC

‧Supports Intel® Core™ Ultra 100U-series processor offering tremendous performance

‧Rugged embedded computer with industrial compact fanless design

‧Various wireless connectivity options: Wi-Fi 5/6, Bluetooth, 4G/5G and GPS

‧Rich expansion capacity including POE and CANbus expansion module for diversified demand

‧Wide range of power inputs (9-36V) and operating temperatures (-20°-60°C)

PE1000S

Intel Atom® processor x6000 Series-based or Celeron J6412-based ultra-compact and rugged fanless DIN-rail gateway featuring 2.5 GbE and PoE+

‧Intel® Atom® x6000 Series or Celeron® J6412 processor with DDR4 up to 32 GB Ultra-compact design supports DIN-rail mount

‧Rich I/O with up to 4 x 2.5 GbE, 6 x USB, 6 x COM

‧Wide voltage range: 9 to 36V

‧Wide operating temperature range: -25°C to 70°C

R680EA-IM-Z

Intel® Core™ processors (14th/13th/12th gen)-based ATX, with Intel® R680E Chipset, integrated I/O shield, dedicated V-core and M.2 heat sink design, three 2.5GbE LAN ports, auto BIOS recovery, EC and iBMC integrated and wide operating temperature

Support up to 125W Intel® CPU (14th/13th/12th Gen)

‧4 x U-DIMM up to 128GB DDR5 4400 MHz

‧2 x PCIe x16 slots and 3 x PCIe x4 slots

2 x 2280 NVMe M.2 Slots

‧3 x 2.5G RJ45

‧OOB smart management, EC and iBMC integrated Ruggedized DIMM lock and PCIe bracket

‧7-year longevity supply

X642ES-IM-A

Intel Atom® processor-based 3.5” SBC with DDR4 SO-DIMM, DP, HDMI, LVDS/eDP, dual LAN, multiple COM, and 9V to 36V wide DC input

‧Up to six COM ports, includes two RS-232/422/485 and four RS232

‧Supports three display configuration via DP/HDMI/LVDS

‧Supports I2C, SMBus and GPIO

‧Wide temperature range endurance: -40-85°C

N97T-IM-A

Intel® Processor N97-based Thin mini-ITX, ultra thin design with 25mm in height, low power consumption and 9V to 36V wide DC input

One SO-DIMM up to 16GB DDR5 4800 MHz

‧Intel UHD Graphics (12th gen), up to 4K/60 Hz

‧Supports three display configuration via multiple interface HDMI/DP/LVDS/eDP(optional) 7-year longevity supply

‧Wide temperature range: 0-60°C

*Preliminary Design

Coming Soon

MDS-M700

Intel® Core™ processors (13th/12th gen)-based medical-grade AI system, with four PCIe slots, ultra-low noise, patient-centric design, uninterrupted protection and alcohol resistance.

‧13th CPU processor and A5000/A4000 GPU card for high loading speeds and minimal noise

‧Three Ethernet ports for various data transmissions

Supports four Display Port connections

‧M.2 2230/2280 expansion slot

‧CE, FCC, CCC, and IEC 60601-1/-2 compliant device

EBS-500W

Intel® Core™ Ultra processors-based Box PC, AI-Capable, DDR5 5600 MHz, DP, HDMI, USB-C, LVDS/eDP, dual-LAN, multiple COM, M.2 B/E/M key, nano-SIM and 9V to 36V wide DC input

‧AI-capable and power-efficient

Configured with a USB-C port supporting USB3.2 Gen2 (DP 1.4 Alt. Mode) and additional display

‧Equipped with three M.2 slots for LTE/5G/Wi-Fi 6E/BT 5.2

Wide range of power inputs (9~36V) and operating temperatures (-20~60℃ )

EBS-P300

Intel® Celeron® processor J6412-based extremely-light and adaptable box PC with LPDDR4, eMMC, dual HDMI, dual COM ports, dual USB 3.2, dual USB2.0, M.2, and TPM

‧Fanless design for rugged environments

‧Supports 2.5GbE and 1Gbe Ethernet for various data transmission. Fixing holes for antenna, wall mount, DIN-rail kit (optional)

‧Excellent expansibility with essential I/O ports on front/back side bezel

‧TPM 2.0 on board or optional

AI Solutions

easy- -use nd S o visio

An easy-to-use AI toolkit and SDK for computer vision, AI model training and inference.

ASUS IoT AISVision, a user-friendly toolkit, streamlines computer-vision development with AI techniques, offering Trainer and Runtime modes for simplified AI model creation, batch training and inference, while its API empowers developers to build AI applications and export results for analysis or visualization.

Zero-code AI training in just four steps

User-friendly labeling, high-precision algorithms, a no-code training tool and flexible inferencing, supporting NVIDIA® GPUs and Intel® OpenVINO™ — all integrated through AISVision API (C, C++, C#).

Flexible model training configuration

Use AISVision default setting to train Al model or use configurable hyperparameter to come out a customized training steps, support supervised (classification, object detection, segmention) and unsupervised learning (anomaly detection).

Intuitive labelling tool

Easy-to-use and intuitive integrated labelling, including pen, polygon, ellipse, rectangle and line tools.

Dual inference architecture

Unique model capabillites, backed by NVIDIA® and Intel® OpenVINO framework, empowers efficient, high-accuracy inferencing in any scenario.

User-friendly software development

Strong API support for customized development, including C, C++, and C#.

Efficient Training, Deployment, and Analysis

Efficiently generate AI model on an NVIDIA GPU server via AISVision AI Toolkit. Developers configure the GPU or Intel OpenVINO inference engine, utilizing the AISVision API for AOI image analysis. Activation requires a dongle for seamless integration.

System Diagram – How AISVision works?

Training Server

Inference Engine

Dongle

Metal

EMS

Can

Machine Tool

Plastic

PCB

Semiconductor

Retail

Wood

Thermal Module

Steel

AI-powered

ASUS IoT AISEHS is an enterprise-level intelligent risk-analysis platform, engineered with advanced, AI-powered, computervision-analysis technology. It connects with security-monitoring systems to effectively manage field safety, such as dangerous machine operations, perilous behavior, unsuitable personal protective equipment (PPE) and more.

‧Versatile AI Detection:

Adjusts model settings for diverse scenarios, integrating multiple models for comprehensive workplace safety on a unified platform.

‧Real-time Alerts and Permissions:

Provides continuous detection, real-time assistance, and flexible role-based permissions for optimized resource allocation.

‧Preventive Efficiency:

Records events and presents trends for proactive risk prevention, aiding in future planning and management.

‧Resource Management Scheduler:

Enhances efficiency with task scheduling, allowing flexible adjustments for better control over operational costs.

10 AI missions

Personal protective equipment

Detects specialized equipment or clothing worn by individuals.

People counting

Counts the number of personnel in the area, with maximum and minimum numbers for the control area.

People fence

Monitors whether individuals are entering unauthorized areas.

Vehicle fence

Monitors whether vehicles (including cars, trucks, motorcycles and trains) are entering unauthorized designated areas.

Flame detection

Monitors for the presence of flames.

Smoke detection

Monitoring for the presence of smoke.

Human-machine interface

Detects entry into forbidden areas or incorrect postures when operating machinery.

Point confirmation

Detects if personnel are following specific safety practices via physical gesturing.

Dangerous-object detection

Monitors the environment for the presence of dangerous item, such as knives or guns.

Detection of risky behaviors

Monitors for risky behaviors, including falls, violent behavior, fatigue actions and more.

AISPHM

Predictive Maintenance of Rotating Machinery

ASUS IoT AISPHM employs AI and vibration analysis for advanced predictive maintenance on rotating equipment. Detecting issues in real-time, it adapts to diverse operational needs, reducing downtime and extending equipment life for continuous improvement in production, whether on-site or in the cloud.

Low to no code for exceptional simplicity

Combining ISO-108163 with FFT spectrum AI modeling

Dedicated AI models are established for each device, continuously monitoring their operational status. Any deviations from the original AI model are recorded as abnormal events.

Web-based private and public cloud architecture

A fully containerized architecture enhances deployment flexibility across multiple platforms, including PCs,smartphones, and tablets.

Cost-effective CPUbased modeling and inferencing

Intel i5 or equivalent machines can support data processing for up to 120 sensors without the need for additional GPU resources.

Supports the EdgeX open-source framework

For diverse industrial applications, modules can be developed for data reuse without the need for extensive code refactoring.

to USB

Third-party wired sensors

AISSENS

AISSENS 100AW, a state-of-the-art 6K wireless vibration/temperature sensor, is a cornerstone in the realm of condition monitoring. Designed to excel in the early identification of gear, belt, and bearing anomalies, its tri-axial 6K vibration sensitivity is pivotal for implementing strategic maintenance protocols. This approach not only guarantees operational continuity but also significantly extends the lifespan of machinery. By adopting condition monitoring, organizations can transition from routine preventive measures to a more dynamic, data-driven maintenance strategy, optimizing resource allocation and minimizing unexpected downtime.

Edge Device

Wifi AP

ASUS wireless sensors

RS422

6K wireless vibration / temperature sensor

AISDetector

Product quality analysis and anomaly-detection solutions

AISDetector, powered by advanced AI, efficiently identifies abnormal signals with minimal high-quality sensor data, eliminating the need for prior AI expertise. Handling diverse signal types, it streamlines the process from sensor data preprocessing to model training, enabling developers to swiftly create superior AI models through an intuitive interface within minutes for enhanced abnormal signal identification.

Rapid AI Model Generation

Train a model in minutes using just five 30-second high-quality signal data samples. *compatible with 13th Intel® Core™ i3 processors and above

Instant AI Analysis

Quickly obtain AI models with AISDetector and perform real-time data inference through the web API.

Versatile Data Support

AISDetector handles diverse time series data, including sound, vibration, voltage, or current from various sensors.

Effortless Integration

Seamlessly integrate AISDetector into your system using a rich web API available in C, C++, C#, and Python.

AISDetector Revolutionizes Motor Quality Inspection

In a crucial instance of monitoring air conditioner motor operation sounds, our client examined DC/AC motor parts using traditional QC and acoustic test, contributing to operational challenges and posing hurdles for internal quality assurance and result consistency.

Challenges

1. Operators, tasked with making daily decisions for 1000 motors based on sound inspection, face inherent risks of human errors.

2. The manual inspection process, with its extended learning period.

Before ─ Human Inspection

Anechoic Room

Get quality sound signal

Microphone

Operator

Anechoic Room

Get quality sound signal

Microphone

OKNG

AI Inference

Identify abnormal signal

Solution Features:

Empowers developers to efficiently identify abnormal signals using advanced AI techniques that leverage time series data, including sound, vibration, voltage, or current from sensors, providing a reliable alternative to human inspection.

Customer Benefits:

The implementation ensures not only a streamlined and error-free inspection process but also significantly reduces the learning curve for operators, thereby enhancing productivity.

Market Ready Solutions

ALPR Edge AI Dev Kit

ASUS IoT ALPR Dev Kit is a comprehensive automatic license-plate recognition (ALPR) solution that includes both the necessary hardware and software to enable systems integrators (SIs) to create edge applications that mesh seamlessly with existing ALPR infrastructure. Power by ASUS IoT Tinker Board Edge R and PE1000N for AI applications, ALPR Dev Kit is capable of up to 99% accuracy with high, 160ms inference performance. It integrates easily with existing USB or IP cameras and, with builtin machine-learning (ML) technology, it’s able to learn from each inference – delivering continuously improving detection. ASUS IoT is able to fine-tune the ALPR software to service specific needs or cater to particular demands, empowering ALPR Dev Kit to provide accurate, fast and tailor-made detection that is ideal for almost any scenario.

Highly-flexible mounting methodsNovelty license-plate noise reductionEdge AI empowers ALPR accuracy

Usage Scenario

‧ Access control

‧ Vehicle-tracking

‧ EV-charge monitoring

‧ Custom vehicle tags

‧ Parking analysis reports

ASUS IoT PE1000N

NVIDIA Jason Nano

CPU: 4 x Arm® Cortex®-A57

GPU: 128-core NVIDIA

Maxwell

Memory: 4GB 64-bit LPDDR4

Operating system: Ubuntu

Government / Security Service

‧ Access control

‧ Monitoring potential threat

‧ Improve law enforcement

‧ Connect to smart home

‧ Real-time notification

ASUS IoT Tinker Edge R

Rockchip RK3399Pro

Retail / HospitalityWarehousing Logistics

‧ Auto car wash or service

‧ Drive-thru restaurant

‧ Upgrade retailers’ existing camera to AI camera

CPU: Dual-core 1.8 GHz ARM Cortex A72 + Quad-core 1.4 GHz ARM Cortex A53

GPU: 800 MHz ARM Mali T860 MP4

Rockchip NPU processor

Memory: 4 GB dual-channel LPDDR4 for system +

2 GB LPDDR3 for NPU

Operating system: Debian 9 / Android 9

‧ Dock occupation detection

‧ Tally control

‧ Vendor access management

ASUS IoT ALPR Software

Supported car-plate regions: Taiwan, China and EU countries

Supported OS: Debian, Jetpack, and Ubuntu Inference performance: 160 ms

Accuracy: 99% within 3- to 5-meter range, with custom retraining service available

Supported cameras: USB webcams, and IP cameras on a project-by-project basis

Parking Lot

Solution Portfolio

Face Recognition Edge AI Dev Kit

The ASUS IoT Face Recognition Edge AI Dev Kit employs advanced AI technology for precise face and marker identification. Offering accurate AI models and APIs, it streamlines development, enhancing operational efficiency. Paired with ASUS IoT Tinker Board and PE1000N series, it achieves up to 99% recognition accuracy with fast inference speeds. Supporting Android and Linux, it caters to diverse biological system needs, making it a potent platform for enterprise, retail, hospitality, and public spaces applications.

Anti-spoofing

Usage Scenario

Enterprise

‧

Solution Portfolio

ASUS IoT PE1000N

NVIDIA Jason Nano

CPU: 4 x Arm® Cortex®-A57

GPU: 128-core NVIDIA Maxwell

Memory: 4GB 64-bit LPDDR4

Operating system: Ubuntu

Contactless check-in/out

ASUS IoT Tinker Board 2

Rockchip RK3399

CPU: Dual-core ARM Cortex A72 @ 1.8 GHz

and Quad-core Arm Cortex A53 @ 1.4 GHz

GPU: Arm Mali T860 MP4 @ 800 MHz

Memory: Dual-channel LPDDR4 2/4 GB

Operating system: Debian 10 / Android 11

Face Recognition Solution

ASUS IoT Face Recognition Solution is a one-stop solution for accurate and stable security monitoring. Face Recognition  Solutions are ideal for all types of buildings and workplaces, providing a backend management system that is easy to manage  and monitor, simplifying security processes and improving operational efficiency.

IP Cameras

Usage Scenario

AI Model

Face Detection/ Facial Recognition

Integrated SW

Database Maintenance/ Dashboard

IoT Edge Computing

Edge AI computer

Edge AI computer

CHAPTER 7

Edge AI and Rugged Edge Computers

Revolutionize Computing Power with

ED GE AI SYSTEMS

The Game-Changing Platform for AI Applications

ASUS IoT edge AI systems combine GPU computing with AIoT potential. They offer embedded MXM GPU modules from both NVIDIA® and Intel®, NVIDIA® Jetson-based platforms, and GPU computing platforms for diverse market needs. With unparalleled performance, they enable real-time AI inferencing at the edge, transforming industries. Designed with a rugged, fanless, anti-vibrationbuild, wide temperature

support and low power consumption, they excels in demanding edge AI applications like factory automation, machine vision, video analytics, and autonomous vehicles. ASUS IoT ensures robustness and reliability for the most challenging scenarios, driving innovation and efficiency in this new era.

POWERFUL

GPU COMPUTING

T pioneers the industry's first edge AI system that suppor ts up to dual 450-watt GPUs. ASUS IoT rom suppor t for Intel Arc™ A-series MXM, NVIDIA PCIe cards, and Je fering a oice effici nt options thr gh to reme high hr

LATEST COMPUTING PLATFORM

INDUSTRIAL FEATURE SET & RICH I/O

Supports PoE, isolated DIO, multiple COM ports, CAN bus, and more, enabling seamless connectivity for a wide range of applications.

DESIGN

ROBUST POWER DESIGN

Innovative high-current tolerance power design ensures extreme reliability under a wide range of DC inputs and power-hungry GPU computing. Suppor t for ignition power control adds further stability.

CERTIFICATION COMPLIANCE

Rest assured with our system-validated cer tification readiness. Our edge AI systems comply with MIL-STD 810H and offer vibration resistance up to 5 Grms.

ASUS IoT edge AI systems are available in a variety of form factors embedded with the latest Intel 14th/13th/12th Gen CPUs and NVIDIA Jetson Orin™ series, meeting the dynamic requirements of the market.

With a robust mechanical design featuring structured support, GPU retainer, cable screw lock, and damping bracket, ASUS IoT edge AI systems excel at in-vehicle situations for smooth and uninterrupted operation.

EXCLUSIVE THERMAL DESIGN

diffu perip rugg This fanle

patented system design effectively iffuses heat from the CPU, GPU, and all ripherals, delivering extreme ggedness with a fanless structure. is ensures stable operation while the ess design further reduces dust generation and thus enhances durability.

SOFTWARE SUPPORT FOR EASY INTEGRATION

Simplify the integration process with comprehensive software support, including APIs, middleware, and device control toolkits tailored for various vertical applications.

Edge AI GPU Computers

Case System

I/O Interface

Dimension Weight

Chassis

Construction

Processor

PE8000G

225 x 288 x 443 mm

12.2 kg

Aluminum alloy with heavy duty metal

Intel® CoreTM i9-12900E/ i9-12900TE

Intel® CoreTM i7-12700E/ i7-12700TE

Intel® CoreTM i5-12500E/ i5-12500TE

Intel® CoreTM i3-12100E/ i3-12100TE

R680E

Chipset Graphics

Memory PoE

Ethernet

Display Port

Serial Port

USB 2.0

USB 3.2/ 3.1

Audio

Digital I/O

SATA HDD

Intel® UHD Graphics 770

2 x SO-DIMM, up to 64GB ECC/ non-ECC DDR5 SDRAM

1x Intel® i219-LM (1 GbE)

1x Intel® i226-IT (2.5 GbE)

2x HDMI

2x DP

2x COM: RS-232/422/485

4x COM: RS-232 (optional)

2x USB2.0, type A

1x USB 3.2 Gen2x2 (20G), type C

4x USB 3.2 Gen2x1 (10G) ,type A

2x USB 3.2 Gen1 (5G), type A

Mic in; Line out

4x DI, 4 x DO support isolation (optional)

PE6000G

mm

225 x 221 x

9.2 kg

Aluminum alloy with heavy duty metal

Intel® CoreTM i9-12900E/ i9-12900TE

Intel® CoreTM i7-12700E/ i7-12700TE

Intel® CoreTM i5-12500E/ i5-12500TE

Intel® CoreTM i3-12100E/ i3-12100TE

R680E

Intel® UHD Graphics 770

2 x SO-DIMM, up to 64GB ECC/ non-ECC DDR5 SDRAM

1x Intel® i219-LM (1 GbE)

1x Intel® i226-IT (2.5 GbE)

2x HDMI

2x DP

2x COM: RS-232/422/485

4x COM: RS-232 (optional)

2x USB2.0, type A

1x USB 3.2 Gen2x2 (20G), type C

4x USB 3.2 Gen2x1 (10G) ,type A

2x USB 3.2 Gen1 (5G), type A

Mic in; Line out

4x DI, 4 x DO support isolation (optional)

PE4000G

225 x 198 x 350 mm

8 kg

Aluminum alloy with heavy duty metal

Intel® CoreTM i9-12900E/ i9-12900TE

Intel® CoreTM i7-12700E/ i7-12700TE

Intel® CoreTM i5-12500E/ i5-12500TE

Intel® CoreTM i3-12100E/ i3-12100TE

R680E

Intel® UHD Graphics 770

2 x SO-DIMM, up to 64GB ECC/ non-ECC DDR5 SDRAM

1x Intel® i219-LM (1 GbE)

1x Intel® i226-IT (2.5 GbE)

2x HDMI

2x DP

2x COM: RS-232/422/485

4x COM: RS-232 (optional)

2x USB2.0, type A

1x USB 3.2 Gen2x2 (20G), type C

4x USB 3.2 Gen2x1 (10G) ,type A

2x USB 3.2 Gen1 (5G), type A

Mic in; Line out

4x DI, 4 x DO support isolation (optional)

Storage Interface Expansion Power Supply

Environmental

mSATA

M.2 (M-key)

eMMC

SD Card mPCIe

M.2 ( E-key)

M.2 (B-key)

SIM

PCI/ PCIe

4 x hot-swappable 2.5” HDD/SSD

1 (mux with mPCIe)

4 x hot-swappable 2.5” HDD/SSD

1 (mux with mPCIe)

2 x hot-swappable 2.5” HDD/SSD

1 (mux with mPCIe)

1

1 (mux with mSATA)

1 1 3 7 x PCIe slots (1 x PCIe Gen4 x16 + 3 x PCIe Gen3 x4

+ 2 x Gen3 x1 or 2 x PCIe Gen4 x8 + 3 x PCIe Gen3 x4 + 2 x PCIe Gen3 x1)

MXM

DC Input

Ignition Control

Operating

Temp.

Certification

Shock & Vibration

8-48V DC Integrated

-20~60°C with 35W CPU

-20~55°C with 65W CPU

CE, FCC, CB, BSMI

MIL-STD 810H

1 (mux with mSATA)

1 1

3

5 x PCIe slots

(1 x PCIe Gen4 x16 + 3 x PCIe Gen4 x4

or 2 x PCIe Gen4 x8 + 3 x PCIe Gen4 x4, auto detect)

8-48V DC Integrated

-20~60°C with 35W CPU

-20~55°C with 65W CPU

CE, FCC, CB, BSMI

MIL-STD 810H

1 (mux with mSATA)

1 1 3

4 x PCIe Gen4 slot (1 x PCIex16 + 2 x PCIex4 or 2 x PCIex8 + 2 x PCIex4, auto-detect)

8-48V DC Integrated

-20~60°C with 35W CPU

-20~55°C with 65W CPU

CE, FCC, CB, BSMI

MIL-STD 810H, and 5-500 Hz; 3+ Grms

Case System

Dimension Weight Chassis Construction Processor Chipset

Graphics

240 x 230 x 125.7 mm

8.2 kg

Intel® Core™ i7-12800HE

Intel® Core™ i5-12600HE

-

Intel® Iris® Xe Graphics eligible (i7/i5)

Intel® UHD Graphics (i3)

2x SO DIMM, up to 64GB DDR5 SDRAM

3x IEEE 802.3at (25.50 W) by Intel® I226-IT (2.5 GbE) ;

1x IEEE 802.3at (25.50 W) by Intel® I219-LM (1 GbE)

3x Intel® i226-IT (2.5 GbE)

1x Intel® i219-LM (1 GbE)

2x HDMI 1.4

2x DP ++

4x DP*

* The four DP ports are only functional when supported by an optional MXM GPU module

2x COM: RS-232/ 422/ 485, DB9

2x COM: RS 232, DB9 (optional)

1x USB 2.0, type A

USB 3.2/ 3.1

Audio Digital I/O

SATA HDD mSATA

M.2 (M-key) eMMC

SD Card mPCIe

M.2 ( E-key)

M.2 (B-key)

SIM PCI/ PCIe MXM

3x USB 3.2 Gen2 x1 (10 G), type A

Mic in; Line out

4x DI, 4 x DO support isolation (optional)

-

1 (NVMe)

1 1 1 21

8-48V DC

Integrated -20~60°C with 45W CPU and 60W MXM

Temp.

Shock & Vibration

CE, FCC, CB, BSMI

(Optional SKU for CE, FCC Class B)

-

NVIDIA® Jetson Orin™

-

NVIDIA® Ampere GPU with Tensor Cores

LPDDR5

-

1x NVIDIA SoM (1 GbE)

1x RTL8153BI-CG (1 GbE)

-

2x COM: RS-232/422/485, DB9

1x CAN bus, DB9

1x USB 2.0, Micro-USB for OS Flash

2x USB 2.0, Pin Header (Internal)

-

4 x DI, 4 x DO (2x5 Terminal Block, w/ isolation)

-

-

-20~50°C with 25W SOM (max)

CE, FCC, CB, BSMI

5~500 Hz; 3 Grms

152 x 114 x 62 mm

kg

NVIDIA® Jetson Nano™

NVIDIA® Jetson TX2 NX

NVIDIA® Jetson Xavier™ NX

NVIDIA® Maxwell™ GPU / NVIDIA® Pascal™ GPU / NVIDIA® Volta™ GPU"

PE1000N -

1x NVIDIA SoM (1 GbE)

1x RTL8153BI-CG (1 GbE)

1x HDMI

2x COM: RS-232/422/485, DB9

1x CAN bus, DP9 (by SKU)

1x USB 2.0, Micro-USB for OS Flash

2x USB 2.0, Pin Header (Internal)

3x USB 3.2 Gen1 (5G), Type-A

4 x DI, 4 x DO (2x5 Terminal Block, w/ isolation)

-1-1 1 243

-20~60°C with 20W SOM (max)

CE, FCC, CB, BSMI

5~500 Hz; 3 Grms

Rugged Edge Computers

Case System I/O Interface Storage Interface Expansion Power Supply Environmental Dimension Weight Chassis Construction Processor Chipset Graphics Memory PoE Ethernet Display Port Serial Port USB 2.0 USB 3.2/ 3.1 Audio Digital I/O SATA HDD mSATA M.2 (M-key) mPCIe M.2 ( E-key) M.2 (B-key) SIM PCI/ PCIe DC Input Ignition Control Operating Temp. Certification Shock & Vibration 44

PE5101D

242 x 241.4 x 137mm

5.81 kg

Aluminum alloy with heavy duty metal

Intel® CoreTM i9-13900TE

Intel® CoreTM i7-13700TE

Intel® CoreTM i5-13500TE

Intel® CoreTM i3-13100TE

R680E

Intel® UHD Graphics 770

2 x SO-DIMM (supports DDR5 ECC/ non-ECC, up to 4800 MHz, max. 64GB)

3 x Intel® i226-IT (2.5 GbE)

1x HDMI

2x DP

2x COM: RS-232/422/485

4x COM: RS-232

2 x USB 2.0, type A

6 x USB 3.2 Gen 2 (10Gbps)

2 x USB 3.2 Gen 1 (5Gbps)

Mic in; Line out

4x DI, 4 x DO support isolation (optional)

2 x hot-swappable 2.5” HDD/SSD1 (NVMe)

PE5100D

242 x 241.4 x 79mm

5.07 kg

Aluminum alloy with heavy duty metal

Intel® CoreTM i9-13900TE

Intel® CoreTM i7-13700TE

Intel® CoreTM i5-13500TE

Intel® CoreTM i3-13100TE

R680E

Intel® UHD Graphics 770

2 x SO-DIMM (supports DDR5 ECC/ non-ECC, up to 4800 MHz, max. 64GB)

3 x Intel® i226-IT (2.5 GbE)

1x HDMI

2x DP

2x COM: RS-232/422/485

4x COM: RS-232

2 x USB 2.0, type A

6 x USB 3.2 Gen 2 (10Gbps)

2 x USB 3.2 Gen 1 (5Gbps)

Mic in; Line out

4x DI, 4 x DO support isolation (optional)

2 x hot-swappable 2.5” HDD/SSD1 (NVMe)

PE1000S

56 x 110.2 x 160mm

63 x 110.2 x 160mm (PoE SKU) 1.017kg / 1.265kg (PoE SKU)

Aluminum alloy with heavy duty metal

Intel® Atom® X6425E

Intel® Atom® X6413E

Intel® Celeron® J6412

Intel® UHD Graphics for 10th Gen Intel® Processors

1 x SO-DIMM, DDR4 supports up to 3200 MHz, max 32 GB

2 x Intel® i226-IT (PoE SKU)

2 x Intel® i226-IT (2.5 GbE)

1x HDMI 1x DP

1x COM: RS-232/422/485

3 x 3-wire RS-232 or 1 x RS-422/485

2 x RS-232 (optional, mux with GPIO)

2 x USB 2.0, type A

2 x USB 3.2 Gen 2 (10Gbps)

2 x USB 3.2 Gen 1 (5Gbps)

1 x 8bit GPIO, DB9 (optional, mux with GPIO)

1 x 2.5” HDD/SSD (standard SKU only)

1 (NVMe/SATA)

8-48V DC

Integrated -20~70°C

CE, FCC, UKCA, BSMI, CB, CCC

MIL-STD 810H, and 5-500 Hz; 3+ Grms

8-48V DC

Integrated -20~70°C

CE, FCC, UKCA, BSMI, CB, CCC

MIL-STD 810H, and 5-500 Hz; 3+ Grms

PE2200U

x

254

2.45 kg

9-36V DC

POE SKU only

-25°C to 70°C

-25°C to 60°C (PoE SKU)

CE, FCC, UKCA, BSMI, CB, CCC

MIL-STD 810H, and 5-500 Hz; 5+ Grms

Intel® Core™ Ultra processor 100U series

2 x Intel® i210-IT (optional)

1 x Intel® i219-LM (1 GbE)

1 x Intel® i226-IT (2.5 GbE)

1x HDMI

1x DP

4x COM: RS-232/422/485

2 x USB 2.0, type A

1 x USB 3.2 Gen2x2 (20G), type C

4 x USB 3.2 Gen 2, type A

Mic in; Line out

1 x 8bit GPIO, DB9 1 x 2.5” HDD/SSD

PE2100U

254 x 147 x 57 mm

2.45 kg

Aluminum alloy with heavy duty metal

Intel® CoreTM i7-1365UE

Intel® CoreTM i5-1345UE

Intel® CoreTM i3-1315UE

Intel® Iris® Xe Graphics eligible

2 x SO-DIMM, DDR5 4800 MHz, supports up to 64GB

2 x Intel® i210-IT (optional)

1x Intel® i219-LM (1 GbE)

2x Intel® i210-IT (optional)

1x Intel® i225-V (2.5 GbE)

2x HDMI

1x DP

2x COM: RS-232/422/485

2x COM: RS-232

2 x USB 2.0, type A

4 x USB 3.2 Gen 2, type A

Mic in; Line out 1 x 8bit GPIO, DB9

1 x 2.5” HDD/SSD1 (NVMe/SATA)

1 11 -

12-24V DC -

-20~60°C

CE, FCC, VCCI, BSMI, RCM, UL, CB, CCC

MIL-STD 810H

PE2000U

254 x 147 x 57 mm

2.45 kg

Aluminum alloy with heavy duty metal

Intel® CoreTM i7-1265UE

Intel® CoreTM i5-1245UE

Intel® CoreTM i3-1215UE

Intel® Iris® Xe Graphics eligible

2 x SO-DIMM, DDR5 4800 MHz, supports up to 64GB

2 x Intel® i210-IT (optional)

1x Intel® i219-LM (1 GbE)

2x Intel® i210-IT (optional)

1x Intel® i225-V (2.5 GbE)

2x HDMI 1x DP

2x COM: RS-232/422/485

2x COM: RS-232

2 x USB 2.0, type A

4 x USB 3.2 Gen 2, type A

Mic in; Line out 1 x 8bit GPIO, DB9

1 x 2.5” HDD/SSD1 (NVMe/SATA)

1 11 -

12-24V DC -

-20~60°C

CE, FCC, VCCI, BSMI, RCM, UL, CB, CCC

MIL-STD 810H

PE2100S (Preliminary)

254 x 147 x 57 mm

2.45 kg

Aluminum alloy with heavy duty metal

Intel® Atom® x7211RE

Intel® Atom® x7213RE

Intel® Atom® x7433RE

Intel® Atom® x7835RE

Intel® UHD Graphics

1x SO-DIMM, up to 16GB DDR5

SDRAM

2x IEEE 802.3af (12.95 W) by Intel® i210-IT (1 GbE) (Optional)

1x Intel® i226-IT (2.5 GbE)

1x Intel® i210-IT (1 GbE)

2x Intel® i210-IT (1 GbE) (Optional)

1x HDMI 2.0

1x DP1.4

2x COM: RS-232/422/485, DB9

4x COM: RS-232, DB9

2x COM: RS232 (Optional)

2x USB 2.0, type A

2x USB 3.2 Gen2 (10 G), type A

2x USB 3.2 Gen1 (5 G), type A

1 x Mic in / 1 x Line out

1 x 8bit GPIO, DB9

1x 2.5” HDD/SSD

1 (NVMe/SATA)

9-36V DC

-20~60°C

CE, FCC, CB, BSMI

MIL-STD 810H, and 5-500 Hz; 5 Grms

PE2000S

254 x 147 x 57 mm

2.45 kg

Aluminum alloy with heavy duty metal

Intel® Processor N97

Intel® Processor N200

Intel® Core™ i3-N305

Intel Atom® x7425E -

Intel® UHD Graphics

1x SO-DIMM, up to 16GB DDR5 SDRAM

2x IEEE 802.3af (12.95 W)

by Intel® i210-IT (1 GbE) (Optional)

2x lntel® i210-AT (1 GbE)

2x Intel® i210-IT (1 GbE) (Optional)

1x HDMI 2.0

1 x DP1.2

2x COM: RS-232/422/485, DB9

4x COM: RS-232, DB9

2x USB 2.0, type A

4x USB 3.2 Gen 2 (10 G), type A

1 x Mic in / 1 x Line out

1 x 8bit GPIO, DB9

1x 2.5” HDD/SSD -

1 11 -

1 9-36V

CE, FCC, CB, BSMI

MIL-STD 810H, and 5-500

Rugged Edge Computers

Case

System

I/O Interface

Storage

Interface

Expansion

Serial Port

USB 2.0

USB 3.2/ 3.1

Audio Digital I/O

SATA HDD

mSATA

M.2 (M-key)

mPCIe

M.2 ( E-key)

M.2 (B-key)

SIM

PCI/ PCIe

PE200U

254 x 147 x 57 mm

2.45 kg

Aluminum alloy with heavy duty metal

Intel® Core® i7-8665UE

Intel® Core® i5-8365UE

Intel® Core® i3-8145UE

Intel® UHD Graphics 620

1 x SO-DIMM, DDR4 2400 MHz, supports up to 32GB

2 x Intel® i210-IT (optional)

1 x Intel® i219 (1 GbE)

1 x Intel® i211-AT (1 GbE)

2 x Intel® i210-IT (optional)

1x HDMI

1x DP

2x COM: RS-232/422/485

4x COM: RS-232 (optional)

4 x USB 2.0, type A (optional)

4 x USB 3.2 Gen 2, type A

Mic in; Line out

1 x 8bit GPIO, DB9

1 x 2.5” HDD/SSD

1 (mux with mPCIe)

1 (NVMe/SATA)

1 (mux with mSATA)

1

1 1

1

-

PE200S

254 x 147 x 57 mm

2.45 kg

PE400D

x 210 x 250

176.6

Aluminum alloy with heavy duty metal

Aluminum alloy with heavy duty metal

Intel® Core™ i9-10900E / Intel® Core™ i7-10700E

Intel® Atom® X5-E3940

Intel® HD Graphics 505

1 x SO-DIMM, DDR3L 1866 MHz, supports up to 8GB

2 x Intel® i210-IT (optional)

2 x Intel® i210-IT (1 GbE)

2 x Intel® i210-IT (optional)

1x HDMI

1x DP

2x COM: RS-232/422/485

4x COM: RS-232 (optional)

2 x USB 2.0, type A (optional)

4 x USB 3.2 Gen 1

Mic in; Line out

1 x 8bit GPIO, DB9

1 x 2.5” HDD/SSD

Intel® Core™ i5-10500E / Intel® Core™ i3-10100E

Intel® Xeon® W-1290TE

W480E

Intel® UHD Graphics 630

3 x Intel® i210-IT (1 GbE)

1 x HDMI 2.0

1 x HDMI 1.4

1 x DP 1.2

-

4x USB 3.2 Gen1 (5 G), type A

2x USB 3.2 Gen2 (10 G), type A

1 x Mic in / 1 x Line out

4x DI, 4 x DO support isolation

2 x hot-swappable 2.5” HDD/SSD

1 (mux with mPCIe)

1 (NVMe/SATA)

1 (mux with mSATA )

12

3x PCIe slot

*2 configuration: 1x PCIex16 + 1x PCIex4 or 2 x PCIex8 + 1x PCIex4, auto-detect *Max. length<192mm; Max. 100W power supply from mainboard for total 3 slots

Power Supply Environmental

DC Input

12-24V DC -

-20~60°C

Operating Temp.

Certification

Shock & Vibration

CE, FCC, VCCI, BSMI, RCM, KCC, UL,CB, CCC

Vibration:0.21Grms, 5~500 Hz, 20min duration

Shock:50 G, half sine 11ms duration

12-24V DC

9-36V DC -

20~60°C

-20~60°C

CE, FCC, VCCI, BSMI, UL,CB, CCC

Vibration:0.21Grms, 5~500 Hz, 20min duration

CE (IEC 61000-6-2/4), FCC, VCCI, RCM, BSMI, UL, CB, CCC

Vibration: 0.5 Grms, sine, 5-500 Hz (with SSD)

Shock: 50 Grms, half sine, 11ms(with SSD)

Arm-based Gateways

PE100A

55.5 x 145 x 78 mm

0.775 kg

Aluminum alloy with heavy duty metal

NXP® i.MX 8M ARM Cortex-A53 Quad core , 1.3 GHz

4 GB LPDDR4 onboard

1x Intel® i210-AT (1 GbE)

1 x Realtek® RTL8211 (1 GbE)

1x HDMI

1x COM: RS-232/422/485 (by terminal block)

1x COM: RS-232 (by terminal block)

USB 3.2/ 3.1

2x USB 3.2 Gen1, type A

1x USB 3.2 Gen1, support OTG, type C

4x DI, 4 x DO support isolation

1 (mux with mPCIe)

PV100A

216 x 112 x 70.5 mm

1.62 kg

Aluminum alloy with heavy duty metal

NXP® i.MX 8M ARM Cortex-A53 Quad core , 1.3 GHz

2 GB LPDDR4 onboard

1x Intel® i210-IT (1 GbE)

1 x Realtek® RTL8211 (1 GbE)

1x HDMI

1x COM: RS-232/422/485 (DB9)

2x COM: RS-232/422/485 (by HDC)

1x COM: RS-232/422 (DB9)

2x USB 3.2 Gen1, type A

1x USB 3.2 Gen1, support OTG, type C

Mic in; Line out (by HDC)

4x DI, 4 x DO support isolation (by HDC)

1 (mux with mPCIe)

16GB

16GB 1 12-24V DC

1 (mux with mSATA)

1 (mux with mSATA)

-20~60°C

CE, FCC, VCCI, BSMI, RCM, KCC, UL,CB, CCC

Vibration:0.21Grms, 5~500 Hz, 20min duration

Shock:50 G, half sine 11ms duration

9-36V DC

Integrated

-25~75°C

E-Mark, SO-7637-2, SAE J1455, EN50155, CE, FCC, CB, BSMI, UL, CCC

MIL-STD 810H

CHAPTER 8 NUC

SMALLER, FASTER, BETTER, AI READY

The ASUS NUC represents a commitment to continuous improvement in technology, prioritizing user-friendly product design. Developed through a partnership between ASUS and Intel, the compact ASUS NUC integrates the power of a full-sized computer with top-notch quality, reliability, modular design, extended lifespan, smart cooling solutions, and advanced AI capabilities. Its versatility shines through an array of configurations catering to diverse user needs, from power users to casual home use. With a focus on supporting diverse businesses and enhancing PC applications, the ASUS NUC aspires to make a lasting impact in the ever-evolving tech landscape.

MADE FOR MANUFACTURING

Empowering edge-embedded solutions for autonomous manufacturing, error detection, and mitigation. NUC Rugged is designed for tough, dirty environments.

HELPING TRANSPORTATION RUN

Ideal for interactive digital screens, wayfinding kiosks, and more, with powerful graphics, computing, and connectivity.

A BIG HELP FOR HEALTHCARE

Powering medical imaging devices, patient monitors, and bedside terminals with powerful performance.

RELIABLE COMPUTE POWER FOR RETAIL

Ensures continuous operation of digital signage, even during unexpected failures. Powers up to four extended displays for menus, kiosks, and more.

Delivers best-in-class performance thanks to the all-new Intel® Core™ Ultra processor family. With cer tified Bluetooth® dongle-free connectivity and three AI engines, NUC 14 Pro delivers robust computing capabilities. It is a comprehensively capable mini PC, built with Intel vPro® Enterprise for exceptional security, manageability and stability.

Offers exceptional performance, rich

Features both Intel® Processor N50 and Intel Atom® processors, and offers the perfect combination of performance, connectivity and reliability in a fanless, dust-resistant ruggedized chassis designed to protect against shock. The tall chassis is able to withstand extended external ambient temperatures between 0-50°C, ensuring uninterrupted performance in the most challenging conditions.

NUC 14 PRO

NUC 13 PRO

NUC 13 RUGGED

Compact, Fanless, Reliable Built For Indoor Industrial Appliction

Digital Signage - Advantages

• Enjoy stunning 4K resolution for crystal-clear visuals

• Triple display support through HDMI ports, allowing for expanded multitasking

Target Market

INTRODUCING ASUS PL SERIES MINI PCs

ASUS PL Series mini PCs are designed mainly for indoor industrial applictions. PL Series mini PCs are subjected to strict testing standards, offer legacy connectivity and long product life cycles to cater to a diverse range of uses.

Kiosk & Store OA - Avantages

• Supports operational ambient temperatures up to 50°C, ensuring reliable performance in various environments

IoT Control Unit - Advantages

• Triple LAN ports featuring 2.5GbE LAN deliver faster Ethernet connectivity

• Compact in size with a durable metal chassis, providing a robust and space-efficient solutiondelivering faster Ethernet connectivity

• Wi-Fi 6E networking ensures stable and high-speed data transfers

• Rigorously tested for 24/7 reliability, ensuring long-term performance

ASUS Mini PC PL64-D1 features EDID (Extended Display Identi cation Data) emulation, it retains your signage format regardless of display power or connectivity interruptions. With EDID emulation, you can get your ne signage content back after display is temporary disconnected or connected. It makes PL64-D1 perfectly t for signage usages

MODEL

OPERATING SYSTEM

CPU

CHIPSET

Windows®11 Pro 64Bit, Windows®11 64Bit, Windows®IoT Enterprise or W/O OS

Intel® Core™ i7-1255U, i5-1235U, i3-1215U, Celeron® 7305 (cTDP 15W)

Integrated

Integrated - Intel® Iris® Xe Graphics (i7/i5) or Intel® UHD Graphics (i3/ Celeron 7305) *

*Intel® Iris® Xe Graphics requires 128-bit dual channel memory for optimal performance

2 x SO-DIMM , DDR4-3200MHz memory (up to 32GB*2)

1 x M.2 2280, up to PCIe Gen4x4, 256G~1TB SSD *Support NVMe

Intel® WiFi 6E/ 6 and Bluetooth® 5, 2*2

3 x Intel® I225VLAN,10/100/1000/2500Mbps, each ports support up to 30W output (802.3at)

Realtek® ALC3251 HD Audio CODEC -

3

1

3

ChromeOS

Chrome Enterprise

Intel JSL N4500

Integrated LPDDR4X 4G/8G/16G

eMMC 32G/64G/128G

Intel® Wi-Fi 6 AX201

Gb LAN

3

Audio Jack (Mic/Headphone Jack) 2

0-50° C(only for models that support 16 GB memory and below) 0-35° C (for all other models)

PL64-D1

Fanless

CHAPTER 9

Modularized Systems

ASUS IOT CONFIGURE TO ORDER

Meet your specific needs and optimize your systems

ASUS IoT CTOS process flow

How to start your personalized ASUS IoT CTOS tech journey

Choose your foundation

enut-eniF hardware

Begin your customization journey by selecting products from our foundational list.

Application

Industrial manufacturing

ezilanosreP software

Customize your device with the necessary hardware configurations – including processors, memory and storage — aligning with your performance standards.

htiw ecnahnE accessories

Tailor your tech experience by choosing pre-installed operating systems, software packages and drivers to ensure your system suits your workflow.

Medical / Healthcare

5.

lacol htiw tcennoC support

Improve your setup with various accessories —extra ports, expansion cards and so on — customizing your device to meet specific needs.

In the final stage, review your configuration, then contact ASUS local support. We're here to provide ASUS CTOS products and solutions tailored just for you.

Smart Retail Transportation

meets seamless management

Crafting your unique service experience!

ASUS CTOS redefines service by offering personalized choices in hardware, software and accessories. Our ecosystem partners, with robust expertise, deliver swift and diverse solutions locally. Join us for a unique tech service tailored to your needs!

ASUS CTOS strengths and highlights

DEDICATED RD TEAM

SUPPORT

1. SWIFT SUPPORT WITHOUT

Our local technical support team enables us to deliver fast and efficient support services, resulting in reduced downtime and improved system availability and stability.

2. OVER 25 REGIONAL SERVICE CENTERS

We track customer needs and offer timely assistance and solutions.

SPECIALIZED R&D SUPPORT

Our dedicated CTOS R&D team enables us to promptly address CTOS customer needs and adapt our research and development direction effectively.

Benefiting from our extensive experience in CTOS projects, the ASUS IoT R&D team excels in addressing customer issues and providing expert advice.

FLEXIBLE CTOS SOLUTIONS

SOLUTIONS

Key parts can be added to ensure that solution aligns with customers’ business processes.

2. PROVIDE KPS WITH COMPETITIVE PRICING AND EXPEDITED DELIVERY

By leveraging the ASUS group vendor pool, we have multiple supplier options reduces the risk of relying on a single supplier and allows for better price and quality comparisons.

AI Medical System

MDS-M700

Dimension

MB

Qualified MB

CPU

Displays

Memory

320 x 335 x 145 mm

Micro-ATX

Q670EM-IM-A

LGA1700 for Intel® 13th/ 12th Gen. Core™

i9/ i7/ i5/ i3/ Pentium® /Celeron® Processors

4 DP++ 1.4, support up to 3840 x2160 @ 60Hz

DDR5 4400MT/s (2DPC - 1DIMM 1R & 2R)

4000MT/s (2DPC - 2DIMM 1R)

3600MT/s (2DPC - 2DIMM 2R)

OP. temperature

Voltage

COM, USB

0°C~40°C

Medical PSU 500W

2 x USB 3.2 (Rear)

4 x USB 3.2 (Rear)

1 x Serial Port (Rear)

3 x USB 3.2 (Internal)

4 x USB 2.0 (Internal)

9 x Serial Port (Internal)

Expansion slot

1

1

1

1

Fanless Embedded Computers

EBS-P300

Dimension

CPU LAN

Displays

Memory

OP. temperature

Voltage

COM, USB

137 x 81

x

1 x HDMI 2.0

1 x HDMI 1.4

1 x LPDDR4 support max. 8GB, on board

0°C~60°C standard (-20°C~60°C extend)

137 x 81 x

x USB

3.2 2

x

M.2 E key for WIFI/BT device 1 x 2242 M.2 B Key (Support PCIE & SATA Storage)

Intel® Atom™ x6425E

Intel® Atom™ x6413E

Intel® Atom™ x6211E 2 x RJ45

1

x HDMI 2.0 1 x HDMI 1.4

0°C~60°C standard (-40°C~60°C extend)

mm

70

Intel® Atom™ x6425E

Intel® Atom™ x6413E

Intel® Atom™ x6211E 2 x RJ45

1 x HDMI 2 .0, supports up to 4K x 2K @ 60 Hz

1 x DP++1.2, supports up to 4096 x 2160 @ 60 Hz

1 x DDR4 SO-DIMM support max. 32GB

0°C~60°C standard (-40°C~60°C extend)

9V-36V

2 x USB 3.2 2 x USB 2.0

2

4 x USB 3.2 2 x USB 2.0

2 x RS232/422/485 4 x RS232

x 2230 M.2 E key for WIFI/BT device

1 x 2230 M.2 E key (USB2.0, PCIe) for WIFI/BT device

1 x 3042/3052 M.2 B key (USB 2.0) for LTE device with on-board Nano-SIM slot

55

Fanless Embedded Computers

EBS-S500W

Dimension

CPU LAN

Displays

Intel® Core™ Ultra 7 processor 165U

Intel® Core™ Ultra 5 processor 135U

Memory

OP. temperature

Voltage

COM, USB

1

1 x DP1.4a, supports up to 4096 x 2304 @ 60 Hz

x DDR5 SO-DIMM support max. 64GB

-20°C~60°C standard

9V-36V

1

Intel® Atom™ x7425E

Intel® Core™ i3-N305

Intel® Processor N200

Intel® Processor N97

1

slot

1

Embedded Computers

Q670EA-IM-A

Q470EA-IM-A

Q170A-IM-A

H610A-IM-A

H310A-EM-A

H110A-IM-AB

EBE-4U

Q670EA-IM-A

Q470EA-IM-A

Q170A-IM-A

H610A-IM-A

H310A-EM-A

H110A-IM-AB

Industrial Motherboards & Single Board Computers

Superior Technology

Excellent Quality

High Compatibilities and Reliability

Configure-To-Order Services (CTOS) and Customization Service

ASUS IoT provides robust, long-lifecycle industrial motherboards and single-board computers designed for reliable 24/7 operation in challenging environments. Our products feature industrial-grade components, providing a full range of form factors, comprehensive connectivity and outstanding design capabilities – offering both standard and customized solutions for diverse applications.

Meet You r Specific Needs And Optimize You r S ys t ems

Deep partnership with key vendors

Leverage OneASUS expertise to accelerating your business

• Close partnerships with Intel, AMD, NVIDIA and ARM for product development

• Participation in the IC vendor's early access program ensures dedicated support

• Pioneers in bringing leading products to the industrial market

• Embracing the OneASUS philosophy, we leverage expertise across diverse business units, covering servers, clients, graphics cards, laptops and and more

• Recognized for world-leading BIOS development, including vBIOS

Accelerated innovation and quality advancements

• By leveraging all the ASUS resources with IC vendors, ASUS IoT delivers excellent quality, reliability, high compatibility, and accelerated time to market

Tailored CTOS and customization services

• BIOS/vBIOS modi cation, BOM and layout adjustments

• Dedicated R&D for Con gure-To-Order Services (CTOS)

• Comprehensive design and manufacture services tailored to speci c needs

Unleashing success:

A proven application in action

Active-fan heatsink for in-flight entertainment

• 3.5” single-board computer (SBC) for embedded applications

• Custom thermal solution combining heatsink and active fan, suitable for enclosure integration

• Rapid design and validation ensuring timely delivery

Panel integration product kit for COVID-19 test machines

• Tailored BIOS to match panel specifications

• High-value solution for panel integration product kit

• Expert panel-testing team

• Accelerated time to market with 12th-gen CPU technology

Outdoor EV charger in challenging environments

• Efficient operation in extremely high-temperature environments, including Southeast Asia

• Swift provision of transition boards during global IC shortage periods

ATM for limited spaces

• Fan-less mini-ITX industrial motherboard with a compact design

• Customized BIOS services and solutions are available

• Unique thermal design enabling 100% CPU-load operation

Processor

System

Memory

Display

Expansion Slot

R680EA-IM-A, Q670EA-IM-A

Intel® Core™ 14th/13th/12th Gen (Socket LGA1700)

Intel® Core™ i9/i7/i5/i3 Processors

Intel® R680E / Q670E Chipset

DDR5

128GB

4 x U-DIMM 2 1 1

1 x PCIe 5.0 x16 slot (1 x16 mode/ 2 x8 mode)

1 x PCIe 4.0 x4 slot (x4 mode, open slot)

1 x PCIe 5.0 x16 slot (x8 mode)

1 x PCIe 3.0 x4 slot (x4 mode, open slot)

1 x PCIe 4.0 x4 slot (x4 mode, open slot)

2 1 x M.2 M key, type 2242/2260/2280 (PCIe x4 /SATA mode)

1 x M.2 E key, type 2230 for WIFI/BT device (only support Intel® CNVi)

Ethernet

Storage

Rear I/O

10/100/1000/2500 Mbps

1 x Intel® i210AT

1 x Intel® i226V

1 x Intel® i226LM (Intel vPro supported)

7, up to 6Gb/s

0,1,5,10

Internal I/O

6 (5 x Type-A, 1 x Type-C)

0 0 3 x RJ45

1 (RS232/422/485)

3 (Line-Out, Line-In, Mic in)

5 (1 x

Power

Environment

Q470A-EM-A

Q470EA-IM-A

Intel® Core™ 10th Gen (Socket LGA1200)

Intel® Core™ i9/i7/i5/i3 Processors

Intel® Q470E Chipset

4 x U-DIMM

2 1 1

2 x PCIe 3.0/2.0 x16 slots (1 x16 mode/ 2 x8 mode)

2 1 x M.2 M key, type 2242/2260/2280 (PCIe x4/ SATA mode)

1 x M.2 B key, type 3042/3052/2260/2280 (PCIe x1/USB 3.2 Gen1/USB 2.0)

*type 3042/3052 support 4G/5G module

1 x M.2 E key, type 2230 (PCIe x1/USB 2.0)

10/100/1000/2500 Mbps

1 x Intel® i219LM (1 GbE), support WOL/PXE

1 x Intel® i225V (2.5 GbE), support WOL/PXE

6, up to 6Gb/s

0,1,5,10

4 (3 x Type-A, 1 x Type-C) N/A

2 2 x RJ45

1 (RS232/422/485)

3 (Line-Out, Line-In, Mic in) AT/ATX mode 0~60°C

Q170A-IM-A

Intel® Core™ 7th/6th Gen (Socket LGA1151)

Intel® Core™ i7/i5/i3 Processors

Intel® Q170 Chipset

DDR4

32GB

2x U-DIMM 0

1 1 x PCIe 3.0 /2.0 x16 slot

1 x PCIe 3.0/2.0 x16 slot (x 4 mode) 1x PCIe 3.0/2.0

3 1 x M.2 M key, type 2242/2260/2280 (SATA mode)

H310A-EM-A

Intel® Core™ 9th/8th Gen (Socket LGA1151)

Intel® Core™ i7/i5/i3 Processors

Intel® H310 chipset

DDR4

64GB

2 x U-DIMM

1 1 1x PCIe 3.0/2.0 x16 slot 3x PCIe 2.0 x1 slots

3 1 x M.2 socket 3 with M key, type 2242/ 2260/2280 storage devices (SATA mode)

H610A-IM-A

Intel® Core™ 14th/13th/12th Gen (Socket LGA1700)

Intel® Core™ i9/i7/i5/i3 Processors

Intel® H610 Chipset

10/100/1000 Mbps

1 x Intel® i219LM

1 x Intel® i210AT

4, up to 6Gb/s

PCIe 0,1,5 / SATA 0,1,5,10

4 6 2 x RJ45

2 (RS232/422/485)

3 (Line-Out, Line-In, Mic in)

Mbps

ATX

Processor

System

Memory

Display

Expansion Slot

H110A-IM-AB

Intel® Core™ 7th/6th Gen (Socket LGA1151)

Intel® Core™ i7/i5/i3 Processors

Intel® H110 chipset

H110A-IM-A

Intel® Core™ 7th/6th Gen (Socket LGA1151)

Intel® Core™ i7/i5/i3 Processors

Intel® H110 chipset

DDR4 32GB

M key, type 2242/2260/2280 (SATA mode)

R680EA-IM-Z

Intel® Core™ 14th/13th/12th Gen (Socket LGA1700)

Intel® Core™ i9/i7/i5/i3 Processors

Intel® R680E Chipset

DDR5 (2DPC)

128GB

4 x U-DIMM

2 1 1

1 x PCIe 5.0 x16 slot (1 x16 mode/ 2 x8 mode)

1 x PCIe 3.0 x4 slot (x2 mode, open slot)

1 x PCIe 5.0 x16 slot (x8 mode)

1 x PCIe 4.0 x4 slot (x4 mode, open slot)

1 x PCIe 4.0 x4 slot (x4 mode, open slot)

2 2 x M.2 M key, type 2242/2260/2280 (PCIe x4 /SATA mode)

1 x M.2 E key, type 2230 for WIFI/BT device (only support Intel® CNVi)

Ethernet  Storage

10/100/1000 Mbps

10/100/1000 Mbps

1 x Intel® i219V

I211AT,

10/100/1000/2500 Mbps

1 x Intel® i210AT

2 x Intel® i226V

1 x Intel® i226LM (Intel vPro supported)

6, up to 6Gb/s

0,1,5,10

(3 x type A, 1 x Type C)

x RJ-45

1 (RS232/422/485)

3 (Line-Out, Line-In, Mic in)

AT/ATX mode

0~60°C

Micro-ATX

Processor System

Memory

Display

Expansion Slot

H110M-IM-A

Q670M-EM-A (Q1'24)

Intel® Core™ 14th/13th/12th Gen (Socket LGA1700)

Intel® Core™ i9/i7/i5/i3 Processors

Intel® Q670 chipset

DDR4 32GB

4 x U-DIMM

2, Supports 4096 x 2304 @60Hz

1

1 x PCIe 4.0 x16 slot (x4 speed)

Q370M-IM-A

Ethernet  Storage

Rear I/O

1 x M.2 M key, type 2242/2260/2280 (PCIe 4.0 x4/SATA mode)

1 x M.2 M key, type 2242/2260/2280 (PCIe 4.0 x4 mode)

10/100/1000 Mbps

1 x Intel® I219LM (vPRO)

1 x Realtek RTL 8111H 4, up to 6Gb/s

PCIe 0,1,5 / SATA 0,1,5,10

Internal I/O

1 x 8-pin ATX Power connector

connector

0~60°C

Intel® Core™ 9th/8th Gen (Socket LGA1151)

Intel® Core™ i9/i7/i5/i3 Processors

Intel® Q370 Chipset

DDR4

64GB

4 x U-DIMM

2, Supports 4096 x 2304 @60Hz

1, Supports 4096 x 2160 @24Hz / 2560 x 1600 @60Hz

1 x PCIe 3.0/2.0 x16 slot

2 x PCIe 3.0/2.0 x1 slots 1 x PCI slot

2 x M.2 M Key, type 2242/2260/2280 with IRST support (SATA/PCIe mode)

*SATA mode ready for Intel® Optane Memory

1 x M.2 E Key, type 2230 Wi-Fi Devices Support

10/100/1000 Mbps

1 x Intel® I219LM, supports WOL/PXE

6, up to 6Gb/s

PCIe 0,1,5 / SATA 0,1,5,10

2, support additional 4 x USB 3.2 Gen1 ports

1, support additional 2 x USB2.0 ports

1 x RJ45

2 (RS232)

1 x keyboard port, 1 x mouse port

Line-Out, Line-In, Mic-In

1 x 8-pin ATX 12V Power connector

1 x 24-pin ATX Power connector

Micro-ATX

Processor

System

Memory

Display

Expansion Slot

H610M-IM-A

Intel® Core™ 14th/13th/12th Gen (Socket LGA1700)

Intel® Core™ i9/i7/i5/i3 Processors

Intel® H610 chipset

1 x M.2 M key, type 2242/2260/2280 (SATA/PCIe x4 mode)

Ethernet

Storage

Rear I/O

Internal I/O

10/100/1000 Mbps

1 x Realtek® 8111H, 1 x Intel®  i219V

4,

H310M-IM-A

Intel® Core™ 9th/8th Gen (Socket LGA1151)

Intel® Core™ i7/i5/i3 Processors

H310 Chipset

Mini-ITX-x86

Processor System

Memory

Display  Expansion Slot  Ethernet  Storage

Rear I/O

Q370I-IM-A R3.0

Intel® Core™ 9th/8th Gen (Socket LGA1151)

Intel® Core™ i7/i5/i3 Processors

Intel® Q370 chipset

DDR4

2

Q670EI-IM-A

Intel® Core™ 13th/12th Gen (Socket LGA1700)

Intel® Core™ i9/i7/i5/i3 Processors

Intel® Q670E Chipset

DDR5

64GB

2 x SO-DIMM *R680E support ECC memory

3 0 1 1 x Header (eDP & LVDS can be switched by BIOS)

1 x PCIe x16 slot

1 x M.2 E key, type 2230 for WIFI/BT device (support Intel® CNVi, PCIe)

1 x M.2 M key, type 2242/2260/2280 (PCIe & SATA mode)

10/100/1000 Mbps

1 x Intel® i210AT

1 x Intel® I219LM

4,

PCIe

1 x M.2 E key, type 2230 for WIFI/BT device (PCIe & CNVi)

1 x M.2 M key, type 2242/2260/2280 (PCIe x4 & SATA mode)

10/100/1000/2500 Mbps

1 x Intel® i210AT

1 x Intel® I225LM (Intel vPro supported)

4, Up to 6Gb/s

PCIe 0,1,5 / SATA 0,1,5,10

3 1

0

3 (2 x Type-A + 1 x Type-C)

1 (Type-A)

4 (Type A) 2 1 (RS232/422/485)

1 x Keyboard, 1x Mouse Line-Out, Mic-In

Q470EI-IM-A

R3.0

Intel® Core™ 10th Gen (Socket LGA1200)

Intel® Core™ i9/i7/i5/i3 Processors

Intel® Q470E Chipset

DDR4

64GB

2 x SO-DIMM

2 0

0 (1 x DVI-D)

1 x Header (eDP & LVDS can be switched by BIOS)

1 x PCIe 3.0/2.0 x16 slot

1 x M.2 E key, type 2230 for WIFI/BT device (PCIe & CNVi)

1 x M.2 M key, type 2242/2260/2280 (PCIe x4 & SATA mode)

10/100/1000 Mbps

1 x Intel® I210AT

1 x Intel® I219LM

3, Up to 6Gb/s

PCIe 0,1,5 / SATA 0,1,5,10 2

3 (2 x Type-A + 1 x Type-C)

1 (Type-A)

4 (Type A)

2

1 (RS232/422/485)

1 x Keyboard, 1x Mouse Line-Out, Mic-In

W480EI-IM-A R3.0

Intel® Core™ 10th Gen (Socket LGA1200)

Intel® Core™ i9/i7/i5/i3 Processors

Intel® W480E Chipset

DDR4

64GB

2 x SO-DIMM

2 0 0 (1 x DVI-D)

1 x Header (eDP & LVDS can be switched by BIOS)

1 x PCIe 3.0/2.0 x16 slot

1 x M.2 E key, type 2230 for WIFI/BT device (PCIe & CNVi)

1 x M.2 M key, type 2242/2260/2280 (PCIe x4 & SATA mode)

10/100/1000 Mbps

1 x Intel® I211AT

1 x Intel® I219LM

3, Up to

1

1

0~60°C

Mini-ITX-x86

Processor

System

Memory

Display

Expansion Slot

Ethernet

Storage

Rear I/O

N100I-EM-A

Intel® Processor N100

N/A

DDR4

16GB

1 x SO-DIMM

N/A

1 1 LVDS  (co-lay with eDP)

1 x PCIe 3.0/2.0 x1 slot

1 x M.2 E key, type 2230 for WIFI/BT device (PCIe x1 /USB2.0)

1 x M key, type 2242/ 2260/ 2280 (SATA/ PCIex1)

10/100/1000 Mbps  1 x Realtek RTL8111H, supports WOL/PXE

2,

H610I-EM-A

Intel® Core™ 14th/13th/12th Gen (Socket LGA1700)

Intel® Core™ i9/i7/ i5/i3 Processors

Intel® H610 Chipset

DDR4

64GB

2 x SO-DIMM 1

H610I-IM-A

Intel® Core™ 14th/13th/12th Gen (Socket LGA1700)

Intel® Core™ i9/i7/i5/i3 Processors

Intel® H610 Chipset DDR4

H310I-IM-A R3.0

Intel® Core™ 9th/8th Gen (Socket LGA1151)

Intel® Core™ i7/i5/i3 Processors

1 x M.2 E key, type 2230 for WIFI/BT device (PCIe & CNVi)

1 x M.2 M key, type 2242/2260/2280 (PCIe x4/SATA mode support NVME)

10/100/1000 Mbps 2 × RTL8111H

2, Up to 6Gb/s

1 x M.2 E key, type 2230 for WIFI/BT device

1 x M.2 M key, type 2242/2260/2280 (PCIe x4/SATA mode)

1 x M.2 E key, type 2230 for WIFI/BT device

1 x M.2 M key, type 2242/2260/2280 (PCIe & SATA mode)

Internal I/O

Power

Processor System

Memory

Display  Expansion Slot

Ethernet  Storage

Rear I/O

R680EI-IM-A

Intel® Core™ 14th/13th/12th Gen (Socket LGA1700)

Intel® Core™ i9/i7/i5/i3 Processors

Intel® R680E / Q670E Chipset

DDR5

64GB

2 x SO-DIMM *R680E support ECC memory

3 0 1

1 (eDP & LVDS can be switched by BIOS)

1 x PCIe 3.0/2.0 x16 slot

1 x M.2 E key, type 2230 for WIFI/BT device (PCIe & CNVi)

1 x M.2 M key, type 2242/2260/2280 (PCIe x4 & SATA mode)

10/100/1000/2500 Mbps

1 x Intel® i210AT (co-lay i211AT)

1 x Intel® I225LM (Intel vPro supported)

4, Up to 6Gb/s

PCIe 0,1,5 / SATA 0,1,5,10

3 1

3 (2*Type A, 1*Type C)

1 (Type A)

4 (Type A)

2 x RJ45

2

1 (RS232/422/485)

N5105I-IM-A R2.0

Intel® Celeron® Processor N5105

Integrated DDR4 32GB

2 x SO-DIMM

1 x PCIe 3.0 / 2.0 slot

PCIe slot (support PCIex1/USB2.0 mode, connect to SIM holder)

J3455I-CM-A R2.0

Intel®

Mbps

RTL8111H, support WOL/PXE

Mini-ITX-AMD

R2314I-IM-A

AMD RyzenTM Embedded R2314

DDR4 up to 2667 MHz, ECC support 32GB

2 x SO-DIMM

4, max. resolution 3840x2160 @60Hz

4 x DP(default)

3 x DP+LVDS (optional)

3 x DP+eDP (optional)

1x PCIe 3.0 x8 slot (x8 mode)

1 x M.2 E key, type 2230 (PCle x1, USB 2.0)

1 x M.2 M key, type 2242/2260/2280 (PCIe x2, SATA)

10/100/1000 Mbps

2 x Realtek® 8111H, support WOL/PXE

1 , up to 6Gb/s

4

4, max. resolution 3840x2160 @60Hz

4 x DP(default)

3 x DP+LVDS (optional)

3 x DP+eDP (optional)

3, max. resolution 3840x2160 @60Hz

4 x DP(default)

3 x DP+LVDS (optional)

3 x DP+eDP (optional)

Memory

R1505I-IM-A

AMD RyzenTM Embedded R1505

DDR4 up to 2667 MHz, ECC support

32GB

2 x SO-DIMM

3, max. resolution 3840x2160 @60Hz

4 x DP(default)

3 x DP+LVDS (optional)

3 x DP+eDP (optional)

1x PCIe 3.0 x8 slot (x8 mode)

1 x M.2 M key, type 2242/2260/2280 (PCIe x2, SATA)

R1305I-IM-B

AMD RyzenTM Embedded R1305

DDR4 up to 2667 MHz, ECC support

32GB

2 x SO-DIMM

3, max. resolution 3840x2160 @60Hz

4 x DP(default)

3 x DP+LVDS (optional)

3 x DP+eDP (optional)

1x PCIe 3.0 x8 slot (x8 mode)

1 x M.2 M key, type 2242/2260/2280 (PCIe x2, SATA)

10/100/1000 Mbps

2 x Realtek® 8111H, support WOL/PXE

1, up to 6Gb/s

10/100/1000 Mbps

2 x Realtek® 8111H, support WOL/PXE

V1605I-IM-A

AMD RyzenTM Embedded V1605

DDR4 up to 2667 MHz, ECC support 32GB

2 x SO-DIMM

4, max. resolution 3840x2160 @60Hz

4*DP(default), 3DP+LVDS (optional), 3DP+eDP (optional)

1x PCIe 3.0 x8 slot (x8 mode)

1 x M.2 E key, type 2230 (PCle x1, USB 2.0)

1 x M.2 M key, type 2242/2260/2280 (PCIe x2, SATA)

10/100/1000 Mbps

2 x Realtek® 8111H, support WOL/PXE

1, up to 6Gb/s

Thin Mini-ITX

H610T-EM-A

Intel® Core™ 14th/13th/12th Gen (Socket LGA1700)

Intel® Core™ i9/i7/i5/i3 Processors

DDR4

32GB

2 x SO-DIMM

3 0 0

1 (colay with LVDS)

1 x E key, type 2230 for WIFI/BT device (PCIE & CNVi)

1 x M key, type 2242/2260/2280 (PCIE x4 / SATA mode)

10/100/1000 Mbps

1 x Realtek® 8111H

1 x Intel® I219V 3 N/A

1

1

N97T-IM-A

Intel® Processor N97

DDR5

16GB

1 x SO-DIMM

1 (Default)

1 (optional by request , colay with

1 (Default),

(optional by request, colay with LVDS)

for WIFI/BT device (PCIE x1 & USB2.0 & CNVI)

M key, type 2242/2260/2280 (PCIE x2/ SATA mode) supports NVMe

J6412T-IM-A

Intel® Celeron® Processor J6412

DDR4

32GB

2 x SO-DIMM

1 (Default)

1 (optional by request , colay with HDMI)

1 0 LVDS: 1 (Default), eDP (optional by request, colay with LVDS)

1 x Full/Half-size PCIe mini card slot (w/ SIM holder) (PCIE x1 mode)

PCIe 3.0/2.0 x1

1 x E key, type 2230 for WIFI/BT device (PCIE x1 /USB2.0)

1 x M key, type 2242/2260/2280 (PCIE x2 / SATA mode) supports NVMe

1 x Full-size SD card slot

10/100/1000 Mbps

2 x Realtek RTL8111H (Support WOL/PXE) 1 0

12V DC-in (1x external DC jack; 1 x internal 4-pin power connector)

0~60°C

J3455T-IM-A R2.0

Processor System

Memory

Display

Expansion Slot

Intel® Celeron® Processor J3455

DDR3L

8GB

2 x SO-DIMM

1 (colay with VGA)

1

1 (colay with DP++)

LVDS: 1 (Default), eDP (optional by request, colay with LVDS)

1 x Full/Half-size PCIe mini card slot (w/ SIM holder)

1 x PCIe 2.0 x1 (colay with M.2 E key)

1 x M.2 Socket 1 with E key, type 2230 for WIFI/BT device (colay with PCIe)

0

Ethernet

Storage

10/100/1000 Mbps

2 x Realtek® 8111H, supports WOL/PXE

2

1 x Full/Half-size mSATA slot (shared with Mini PCIe)

1

AT/ATX mode and DC in

0~60°C

N3350T-IM-A

Intel® Celeron® Processor N3350

DDR3L

8GB

2 x SO-DIMM

1 (colay with VGA)

1 1 (colay with DP++)

LVDS: 1 (Default), eDP (optional by request, colay with LVDS)

1 x Full/Half-size PCIe mini card slot (w/ SIM holder)

1 x PCIe 2.0 x1 (colay with M.2 E key)

1 x M.2 Socket 1 with E key, type 2230 for WIFI/BT device (colay with PCIe) 0

10/100/1000 Mbps

2 x Realtek® 8111H, supports WOL/PXE 2

1 x Full/Half-size mSATA slot (shared with Mini PCIe)

N4200T-IM-A

Intel® Pentium® Processor N4200

DDR3L

8GB

2 x SO-DIMM

1 (colay with VGA)  1

1 (colay with DP++)

LVDS: 1 (Default), eDP (optional by request, colay with LVDS)

1 x Full/Half-size PCIe mini card slot (w/ SIM holder)

1 x PCIe 2.0 x1 (colay with M.2 E key)

1 x M.2 Socket 1 with E key, type 2230 for WIFI/BT device (colay with PCIe)

H110T-CM-A R2.0

Intel® Core™ 7th/6th Gen (Socket LGA1151)

Intel® Core™ i7/i5/i3 Processors

DDR4

32GB

2 x SO-DIMM

1, Supports up to 4096 x 2160 @ 60 Hz

1, Supports up to 4096 x 2160 @ 24 Hz / 2560 x 1600 @ 60 Hz

0

1, Supports up to 1920 x1200 @ 60Hz

0 0

1 x M.2 Socket 3 with M key, type 2242/ 2260 storage devices (SATA & PCIE mode)

1 x M.2 Socket 1 with E key, type 2230 for Wi-Fi/BT devices (PCIE/USB mode)

0

10/100/1000 Mbps

2 x Realtek® 8111H, supports WOL/PXE

10/100/1000 Mbps

1 x Realtek RTL8111H

1 x Intel I219V, support WOL/PXE

2 x SATA 6Gb/s port(s)

1 x SATA PWR

1 x Full/Half-size mSATA slot (shared with Mini PCIe)

AT/ATX mode and DC in

0~60°C

3.5-inch SBC

Processor System

Memory

Display

C381ES-IM-AA

Intel® Core™ i7-8665UE/i5-8365UE/ i3-8145UE Processor

DDR4

32GB

1 x SO-DIMM

DP 1.2a up to 4096 x 2304 @ 60 Hz

HDMI 1.4 up to 4096 x 2160 @ 24 Hz

LVDS (co-lay with eDP)

Expansion Slot

1 x Full-Length Mini PCIe slot with on-board Nano-SIM socket

1 x E key, type 2230 for WIFI/BT device and Intel® CNVi

1 x M key, type 2242 (PCIe & SATA mode)

10/100/1000 Mbps

1 x Intel® i219LM, supports vPro/ WOL/PXE

1 x Intel® i211AT, supports WOL/PXE

1 x SATA Gen 3.0, up to 6Gb/s

C7126ES-IM-AA / C5124ES-IM-AA C3121ES-IM-AA / C7125S-IM-AA C5123S-IM-AA / C3121S-IM-AA

Intel® Core™ 12th Gen (Socket LGA1700)

Intel® Core™ i7/i5/i3 Processors

DDR5

64GB

2 x SO-DIMM

DP1.2 up to 4096 x 2304 @ 60 Hz

HDMI 2.0 up to 4096 x 2160 @ 60 Hz

LVDS  (co-lay with eDP)

1 x Full-Length Mini PCIe slot with on-board Nano-SIM socket

1 x E key, type 2230 for WIFI/BT device and Intel® CNVi

1 x M key, type 2280/2242 (PCIE & SATA mode)

10/100/1000 Mbps

1 x Intel® I219LM & 1 x Intel® I225V

1 x SATA Gen 3.0, up to 6 Gb/s

SATA 0, 1 Support

1

-20~60°C

-20~60°C

C7136ES-IM-AA

C5134ES-IM-AA

C3131ES-IM-AA

Intel® Core™ 12th Gen (Socket LGA1700)

Intel® Core™ i7/i5/i3 Processors

DDR5

64GB

2 x SO-DIMM

DP1.2 up to 4096 x 2304 @ 60 Hz

HDMI 2.0 up to 4096 x 2160 @ 60 Hz

LVDS  (co-lay with eDP)

1 x Full-Length Mini PCIe slot with on-board Nano-SIM socket

1 x E key, type 2230 for WIFI/BT device and Intel® CNVi

1 x M key, type 2280/2242 (PCIE & SATA mode)

10/100/1000 Mbps 1x Intel® I219LM & 1x Intel® I225V

1 x SATA Gen 3.0, up to 6 Gb/s

SATA 0, 1 Support

1

1

C786ES-IM-AA R2.0

C583ES-IM-AA R2.0

Intel® Core™ i7-8665UE/i5-8365UE/ i3-8145UE Processor

DDR4

32GB

1 x SO-DIMM

DP 1.2a up to 4096 x 2304 @ 60 Hz

HDMI 1.4 up to 4096 x 2160 @ 24 Hz

LVDS (co-lay with eDP)

1 x Full-Length Mini PCIe slot with on-board Nano-SIM socket

1 x E key, type 2230 for WIFI/BT device and Intel® CNVi

1 x M key, type 2242 (PCIe & SATA mode)

10/100/1000 Mbps

1 x Intel® i219LM, supports vPro/ WOL/PXE

1 x Intel® i211AT, supports WOL/PXE

1x SATA Gen 3.0, up to 6Gb/s

1 x 4-pin ATX Power connector

-20~60°C

-20~60°C

1 x 4-pin ATX Power connector

C381S-IM-AA

Intel® Core™ i7-8665UE/i5-8365UE/ i3-8145UE Processor

DDR4

32GB

1 x SO-DIMM

DP 1.2a up to 4096 x 2304 @ 60 Hz

HDMI 1.4 up to 4096 x 2160 @ 24 Hz

LVDS (co-lay with eDP)

C7146ES-IM-AA (Q1'24)

DDR5

64GB

2 x SO-DIMM

DP 1.4 up to 4096 x 2160 @ 60 Hz

HDMI 2.0 up to 4096 x 2160 @ 60 Hz

LVDS  (co-lay with eDP)

1 x Full-Length Mini PCIe slot with on-board Nano-SIM socket

1x E key, type 2230 for WIFI/BT device and Intel® CNVi

1x M key, type 2242 (PCIe & SATA mode)

10/100/1000 Mbps

1 x Intel® i219LM, supports vPro/ WOL/PXE

1 x Intel® i211AT, supports WOL/PXE

1x SATA Gen 3.0, up to 6Gb/s

N/A

1 x B Key, type 3042/3052 for LTE/5G connected to Nano-SIM socket (PCIe x1)

1 x E key, type 2230 for Wi-Fi 6E/BT 5.2 (USB 2.0/ PCIe x1/ CNVi)

1 x M key, type 2280 Gen 4 (PCIe x4)

10/100/1000/2500 Mbps

1 x Intel® i219LM, 1 x Intel® I226IT

1 x SATA Gen 3.0, up to 6Gb/s

SATA 0, 1 Support

Core™ Ultra 5 Processor 135U

DDR5

64GB

2 x SO-DIMM

DP 1.4 up to 4096 x 2160 @ 60 Hz

HDMI 2.0 up to 4096 x 2160 @ 60 Hz

LVDS  (co-lay with eDP)

N/A

1 x B Key, type 3042/3052 for LTE/5G connected to Nano-SIM socket (PCIe x1)

1 x E key, type 2230 for Wi-Fi 6E/BT 5.2

(USB 2.0/ PCIe x1/ CNVi)

1 x M key, type 2280 Gen 4 (PCIe x4)

10/100/1000/2500 Mbps

1 x Intel® i219LM, 1 x Intel® I226IT

1 x SATA Gen 3.0, up to 6Gb/s

SATA 0, 1 Support

Intel Atom x6211E/x6413E/x6425E Processor

DDR4

32GB

1 x SO-DIMM

DP1.2 up to 4096 x 2160 @ 60 Hz

HDMI 2.0 up to 4096 x 2160 @ 60 Hz

LVDS (default), eDP (optional)

N/A

1 x E key, type 2230 for WIFI/BT device 1 x M key, type 2280

(SATA mode & PCIe x2 mode)

1 x M.2 B key (USB 2.0)

10/100/1000 Mbps

2 x Intel® i210IT, supports WOL/PXE

1 x SATA Gen 3.0, up to 6Gb/s

DC power input, 12V-24V

-40~85°C

DC power input, 12V-24V

-40~85°C

DC power input, 12V-24V

-40~85°C

3.5-inch SBC

N97S-IM-AA / N200S-IM-AA

N305S-IM-AA / X742ES-IM-AA

Intel® Processor N97/N200/N305

Intel® Atom® x7425E Processor

DDR5

16GB

1 x SO-DIMM

DP1.2 up to 4096 x 2304 @ 60 Hz

HDMI 2.0 up to 4096 x 2160 @ 60 Hz

LVDS(co-lay with eDP)

1 x Full-Length Mini PCIe slot with on-board Nano-SIM socket

1 x E key, type 2230 forTPU/WIFI/BT device (PCIE/USB/CNVi)

1 x M key, type 2280/2242 (SATA mode)

10/100/1000 Mbps

2 x Intel® i210AT, supports WOL/PXE

1 x SATA Gen 3.0, up to 6 Gb/s

N420S-IM-AA R3.0

Intel® Pentium® N4200 Processor

DDR3L

8GB

1 x SO-DIMM

DP1.2 up to 4096 x 2160 @ 60 Hz

HDMI1.4b up to 3840 x 2160 @ 30 Hz

LVDS(co-lay with eDP)

1 x Full-Length Mini PCIe slot with on-board Nano-SIM socket

1 x M.2 E key, type 2230 for WIFI/BT device

1 x M.2 M key, type 2242 (SATA mode)

10/100/1000 Mbps

2 x Intel® i210IT, supports WOL/PXE

1 x SATA Gen 3.0, up to 6Gb/s

DC power input, 12V-24V

-20~60°C

Intel® Atom® x7-E3950 Processor

Intel® Atom® x5-E3930 Processor

DDR3L

8GB

1 x SO-DIMM

DP1.2 up to 4096 x 2160 @ 60 Hz

HDMI1.4b up to 3840 x 2160 @ 30 Hz

LVDS(co-lay with eDP)

1 x Full-Length Mini PCIe slot with on-board Nano-SIM socket

1 x M.2 E key, type 2230 for WIFI/BT device

1 x M.2 M key, type 2242 (SATA mode)

10/100/1000 Mbps

2 x Intel® i210IT, supports WOL/PXE

1 x SATA Gen 3.0, up to 6Gb/s

DDR3L

8GB

1 x SO-DIMM

DP1.2 up to 4096 x 2160 @ 60 Hz

HDMI1.4b up to 3840 x 2160 @ 30 Hz

LVDS(co-lay with eDP)

1 x Full-Length Mini PCIe slot with on-board Nano-SIM socket

1 x M.2 E key, type 2230 for WIFI/BT device

1 x M.2 M key, type 2242 (SATA mode)

10/100/1000 Mbps

2 x Intel® i210IT, supports WOL/PXE

1 x SATA Gen 3.0, up to 6Gb/s

DC power input, 12V-24V -40~85°C

DC power input, 12V-24V

-40~85°C

ARB-SBC

Memory  Display

Expansion

Processor System

Memory

Display

CPU Chipset Technology

Max.

Socket

Display Port  HDMI MIPI DSI eDP/LVDS

Expansion Slot

Ethernet

Storage

Front I/O

PCIe M.2

Others Speed Controller SATA port eMMC RAID

Display Port  HDMI

USB3.2 Gen2

USB3.2 Gen1

USB2.0

Ethernet

Audio jack

PS/2 Power Button Reset Button

Internal I/O

LPDDR4 4GB On board 0

1, Supports HDMI 2.0 up to 3840 x 2160 @ 60 Hz

1, Supports MIPI DSI (4 lane) up to 1920 x 1080 @60Hz 0 0

1 x M.2 2230 E Key for BT/WiFi module (cooperate with Google EdgeTPU Module)

1 x Micro-SD Card connector

10/100/1000 Mbps

1 x Realtek® RTL8211, supports WOL

1 x Intel I210-AT, supports WOL

1 x 16GB onboard eMMC

Power  Environment

x 40-pin headers includes:

up to 6 x GPIO pins

up to 2 x I2C bus

up to 1 x UART

up to 2 x PWM

up to 1 x PCM/I2S

2 x 5V power pins

2 x 3.3V power pins

8 x ground pins

Supports MIPI DSI up to 1920 x 1080 @ 60 Hz 2, support Two MIPI-CSI Camera Inputs (4-lane each) DC

Jetson

Orin Nano / NX

Tinker Board Series

System

Storage

Ethernet

Connectivity

Display Camera

Wired

Interface

SoC CPU

GPU NPU

Memory

Memory Card eMMC

SPI Flash

Ethernet PoE

Wi-Fi/BT Cellular/GPS

HDMI DP LVDS/eDP

MIPI DSI Multi Output

MIPI CSI-2

USB

Audio

Expansion

Serial

Interface

Other

Internal I/O & Header

M.2 E-Key mPCIe

M.2 B-Key SIM slot

Tinker Board 3N PLUS

Rockchip RK3568J

Quad-core Arm® Cortex®-A55 @ 1.8 GHz

Arm® Mali™-G52 2EE @ 800 MHz

Rockchip NPU (1 TOPS)

2GB / 4GB / 8GB LPDDR4X

Micro SD (TF) card slot (push/pull)

32GB /64GB

16MB

2 x GbE LAN RTL8211FI

1 x PD mode, 802.3at 25W (option)

Wi-Fi 5 & BT 5.0 (2T2R), default occupied M.2 E key 4G / 5G (Optional)

1 x HDMI™ 2.0 (4096x2160)

1 x 40-pin header

LVDS (1920x1080) / eDP (2560x1600)

HDMI + LVDS / HDMI + eDP

1 x USB 3.2 Gen1 Type-C® OTG

2 x USB 3.2 Gen1 Type-A

2 x USB 2.0 Pin header

1 x 3.5mm Phone Jack

1 x 4-pin Stereo Speaker, 4ohm, 2 x 3W

1 x HDMI™ audio

1 x S/PDIF TX pin (from GPIO)

1 x PCM/I2S pins (from GPIO)

2230 (PCIe 2.0x1, USB2) for Wi-Fi/BT

3042, 3052 (PCIe 3.0x1, USB3, USB2, SIM) for 4G/5G

1

1

2

Rockchip RK3568B2

Quad-core Arm® Cortex®-A55 @ 2.0 GHz

Arm® Mali™-G52 2EE @ 800 MHz

Rockchip NPU (1 TOPS)

2GB / 4GB / 8GB LPDDR4X

(push/pull)

Wi-Fi 5 & BT 5.0 (2T2R), default occupied M.2 E key

1 x HDMI™ 2.0 (4096x2160)

header

LVDS (1920x1080) / eDP (2560x1600)

HDMI + LVDS / HDMI + eDP

Rockchip RK3568B2

Quad-core Arm® Cortex®-A55 @ 2.0 GHz

Arm® Mali™-G52 2EE @ 800 MHz

Rockchip NPU (1 TOPS)

2GB / 4GB / 8GB LPDDR4X

Micro SD (TF) card slot (push/pull)

32GB /64GB

1 x GbE LAN RTL8211F

Wi-Fi 5 & BT 5.0 (2T2R), default occupied M.2 E key

1 x HDMI™ 2.0 (4096x2160)1 x 40-pin header

LVDS (1920x1080) / eDP (2560x1600)

HDMI + LVDS / HDMI + eDP -

1 x USB 3.2 Gen1 Type-C® OTG

2 x USB 3.2 Gen1 Type-A

2 x USB 2.0 Pin header

1 x 3.5mm Phone Jack

1 x 4-pin Stereo Speaker, 4ohm, 2 x 3W

1 x HDMI™ audio

(from GPIO)

x PCM/I2S pins (from GPIO)

2230 (PCIe 2.0x1, USB2) for Wi-Fi/BT

3042, 3052 (PCIe 3.0x1, USB3, USB2, SIM) for 4G/5G 1 x Nano SIM slot

header

2 x RS-232 header with flow control 1

1 x PCM/I2S

- up to 1 x S/PDIF TX

1 x 4-pin Power-on & Reset header

1 x 2-pin Recovery Mode header

1 x 2-pin Maskrom (eMMC) header

1 x Maskrom (SPI) DIP switch

1 x 3-pin Debug UART header

1 x 3-pin IR receiver header

1 x RTC header

1 x 4-pin DC Fan header

3 x LEDs side view

- 1 x Panel VCC power select jumper

- 1 x 5V Panel Backlight header

Power Input

Dimensions

12~24V DC, Barrel Jack (5.5/2.5mm) & 4-Pin Header

100 x 100 mm

Operation temperature -45˚C ~ 85˚C

Non operation temperature

Non operation humidity

Operating System

-45˚C ~ 85˚C

10% ~ 85% (Non condensing)

Linux Debian, Android, Yocto

Linux

1 x S/PDIF TX pin (from GPIO)

1 x PCM/I2S pins (from GPIO)

2230 (PCIe 2.0x1, USB2) for Wi-Fi/BT

1 x RS-232/422/485 header

1 x RS-232 header with flow control1 x 14-pin GPIO headers:

- 1 x 5V

- 1 x 3.3V

- 1 x GND - 2 x ADC (8 bit)

- up to 2 x UART

- up to 1 x SPI bus (2 select)

- up to 1 x I2C bus

- up to 4 x PWM

- up to 1 x PCM/I2S

- up to 1 x S/PDIF TX"

1 x 4-pin Power-on & Reset header

1 x 2-pin Recovery Mode header

1 x 2-pin Maskrom (eMMC) header

1 x 3-pin Debug UART header

1 x 3-pin IR receiver header

1 x RTC header

1 x 4-pin DC Fan header

3 x LEDs side view

- 1 x Panel VCC power select jumper

- 1 x 5V Panel Backlight header

12~24V DC, Barrel Jack (5.5/2.5mm) & 4-Pin Header

100 x 100 mm

0˚C ~ 60˚C

-45˚C ~ 85˚C

10% ~ 85% (Non condensing)

Linux Debian, Android, Yocto

Tinker Board 3N

Tinker Board 3N LITE

Tinker Board 3S

System Storage

Ethernet

Connectivity

Display Camera

Wired

Interface

SoC CPU GPU NPU Memory Memory Card eMMC SPI Flash Ethernet PoE

Wi-Fi/BT Cellular/GPS

HDMI DP LVDS/eDP

MIPI DSI Multi Output

MIPI CSI-2 USB

Audio

Expansion

Serial

Interface

Other

Internal I/O & Header

M.2 E-Key mPCIe

M.2 B-Key SIM slot

Rockchip RK3566

Quad-core Arm® Cortex®-A55 @ 1.8 GHz

Arm® Mali™-G52 2EE @ 800 MHz

Rockchip NPU (1 TOPS)

2GB/ 4GB LPDDR4X

Micro SD (TF) card slot (push/pull)

16GB

1 x GbE LAN RTL8211F

Wi-Fi 5 & BT 5.0 (2T2R), default occupied M.2 E key

1 x HDMI™ 2.0 (4096x2160)

1 x 22-pin (4 lane, 1920x1080)

1 x USB 3.2 Gen1 Type-A

2 x USB 2.0 Type-A

1 x USB 2.0 Micro-B (Device only)

1 x USB2.0 Pin header

1 x 3.5mm Phone Jack

1 x HDMI™ audio

1 x S/PDIF TX pin (from GPIO)

1 x PCM/I2S pins (from GPIO)

2230 (PCIe 2.0x1, USB2) for Wi-Fi/BT

1 x 40-pin headers: - 2 x 5V power

- 2 x 3.3V power

- 8 x Ground pins

- up to 28 x GPIO pins

- up to 2 x SPI bus

- up to 2 x I2C bus

- up to 2 x UART - up to 3 x PWM

- up to 1 x PCM/I2S

- up to 1 x S/PDIF TX

1 x 4-pin Power-on & Reset header

1 x 2-pin Recovery Mode header

1 x Maskrom DIP switch

1 x 3-pin Debug UART header1 x RTC header

1 x 2-pin DC Fan header

3 x LEDs side view

Power Input Dimensions

12~19V DC, Barrel Jack (5.5/2.5mm)

3.37" x 2.125" (85 x 56 mm)

Operation temperature 0˚C ~ 60˚C

Non operation temperature

Non operation humidity

Operating System

-40˚C ~ 85˚C

10% ~ 85% (Non condensing)

Linux Debian, Android, Yocto

Tinker Board 3

Rockchip RK3566

Quad-core Arm® Cortex®-A55 @ 1.8 GHz

Arm® Mali™-G52 2EE @ 800 MHz

Rockchip NPU (1 TOPS)

2GB/ 4GB LPDDR4X

Micro SD (TF) card slot (push/pull)

1 x GbE LAN RTL8211F

Wi-Fi 5 & BT 5.0 (2T2R), default occupied M.2 E key -

1 x HDMI™ 2.0 (4096x2160)

1 x 22-pin (4 lane, 1920x1080)

1 x USB 3.2 Gen1 Type-A

2 x USB 2.0 Type-A

1 x USB 2.0 Micro-B (Device only)

1 x USB2.0 Pin header

1 x 3.5mm Phone Jack

1 x HDMI™ audio

1 x S/PDIF TX pin (from GPIO)

1 x PCM/I2S pins (from GPIO)

2230 (PCIe 2.0x1, USB2) for Wi-Fi/BT

-1 x 40-pin headers:

- 2 x 5V power - 2 x 3.3V power

- 8 x Ground pins - up to 28 x GPIO pins

- up to 2 x SPI bus

- up to 2 x I2C bus

- up to 2 x UART

- up to 3 x PWM

- up to 1 x PCM/I2S

- up to 1 x S/PDIF TX

1 x 4-pin Power-on & Reset header

1 x 2-pin Recovery Mode header

1 x Maskrom DIP switch

1 x 3-pin Debug UART header1 x RTC header

1 x 2-pin DC Fan header

3 x LEDs side view -

12~19V DC, Barrel Jack (5.5/2.5mm)

3.37" x 2.125" (85 x 56 mm)

0˚C ~ 60˚C

-40˚C ~ 85˚C

10% ~ 85% (Non condensing)

Linux Debian, Android, Yocto

Tinker Board 2S

Rockchip RK3399

Dual-core Arm® Cortex®-A72 @ 2.0 GHz +

Quad-core Arm® Cortex®-A53 @ 1.5 GHz

Arm® Mali™-T860 MP4 @ 800 MHz

2GB / 4GB LPDDR4

Micro SD (TF) card slot (push/pull)

16GB / 32GB

1 x GbE LAN RTL8211E/F

Wi-Fi 5 & BT 5.0 (2T2R), default occupied M.2 E key -

1 x HDMI™ 2.0 (4096x2160)

1 x DP Alt Mode via USB Type-C® (4096x2160)

1 x 22-pin (4 lane, 1920x1080)

HDMI + Type-C / HDMI + DSI / Type-C + DSI

1 x 15-pin (2 lane)

1 x USB 3.2 Gen1 Type-C® OTG

3 x USB 3.2 Gen1 Type-A

1 x HDMI™ audio

1 x S/PDIF TX pin (from GPIO)

1 x PCM/I2S pins (from GPIO)

2230 (PCIe 2.0x1, USB2) for Wi-Fi/BT

---

1 x 40-pin headers:

- 2 x 5V power

- 2 x 3.3V power

- 8 x Ground pins

- up to 28 x GPIO pins

- up to 2 x SPI bus

- up to 2 x I2C bus

- up to 2 x UART

- up to 3 x PWM

- up to 1 x PCM/I2S

- up to 1 x S/PDIF TX

1 x 2-pin Power-on & Reset header

1 x 2-pin Recovery Mode header

1 x 2-pin Debug UART header (in GPIO)

1 x RTC header

1 x 2-pin DC Fan header

3 x LEDs -

12~19V DC, Barrel Jack (5.5/2.5mm)

3.37" x 2.125" (85 x 56 mm)

0˚C ~ 60˚C

-40˚C ~ 85˚C

10% ~ 85% (Non condensing)

Linux Debian, Android, Yocto

Tinker Board Series

System

SoC CPU

GPU NPU

Memory

Storage

Ethernet

Connectivity

Display Camera

Wired

Interface

Memory Card eMMC

SPI Flash

Ethernet PoE

Wi-Fi/BT Cellular/GPS

HDMI DP LVDS/eDP

MIPI DSI Multi Output

MIPI CSI-2

USB

Audio

Expansion

Serial

Interface

Other

Internal I/O & Header

M.2 E-Key mPCIe

M.2 B-Key SIM slot

COM

CAN

GPIO

Rockchip RK3399

Dual-core Arm® Cortex®-A72 @ 2.0 GHz +

Quad-core Arm® Cortex®-A53 @ 1.5 GHz

Arm® Mali™-T860 MP4 @ 800 MHz2GB / 4GB LPDDR4

Micro SD (TF) card slot (push/pull)

1 x GbE LAN RTL8211E/F

Wi-Fi 5 & BT 5.0 (2T2R), default occupied M.2 E key

1 x HDMI™ 2.0 (4096x2160)

1 x DP Alt Mode via USB Type-C® (4096x2160) -

1 x 22-pin (4 lane, 1920x1080)

HDMI + Type-C / HDMI + DSI / Type-C + DSI

1 x 15-pin (2 lane)

1 x USB 3.2 Gen1 Type-C® OTG

3 x USB 3.2 Gen1 Type-A

1 x HDMI™ audio

1 x S/PDIF TX pin (from GPIO)

1 x PCM/I2S pins (from GPIO)

2230 (PCIe 2.0x1, USB2) for Wi-Fi/BT

Rockchip RK3288.CG-W

Quad-core Arm® Cortex®-A17 @ 1.8 GHz

Arm® Mali™-T760 MP4 @ 600 MHz

2GB LPDDR3

Rockchip RK3288.CG-W

Quad-core Arm® Cortex®-A17 @ 1.8 GHz

Arm® Mali™-T760 MP4 @ 600 MHz

2GB LPDDR3

Micro SD (TF) card slot (push/push)

1 x GbE LAN RTL8211E/F

Wi-Fi 4 & BT 4.2 -

1 x HDMI™ 1.4 (3840x2160)

1 x 15-pin (2lane, 1280x720) HDMI + DSI

1 x 15-pin (2 lane)

4 x USB 2.0 Type-A

1 x 3.5mm Phone Jack

1 x HDMI™ audio

(contact point)

1 x PCM/I2S pins (from GPIO)

Keys Debug IR receiver RTC FAN

LED Others

1 x 40-pin headers: - 2 x 5V power - 2 x 3.3V power - 8 x Ground pins

- up to 28 x GPIO pins

- up to 2 x SPI bus

- up to 2 x I2C bus

- up to 2 x UART - up to 3 x PWM

- up to 1 x PCM/I2S

- up to 1 x S/PDIF TX

1 x 2-pin Power-on & Reset header

1 x 2-pin Recovery Mode header

1 x 2-pin Debug UART header (in GPIO)

1 x RTC header

1 x 2-pin DC Fan header

3 x LEDs -

Power Input

Dimensions

x 40-pin headers:

2 x 5V power

2 x 3.3V power

8 x Ground pins

up to 28 x GPIO pins

up to 2 x SPI bus

up to 2 x I2C bus

up to 4 x UART

- up to 2 x PWM

- up to 1 x PCM/I2S 1

1 x S/PDIF TX pin (contact point) 1 x PCM/I2S pins (from GPIO)

---1 x 40-pin headers:

- 2 x 5V power

- 2 x 3.3V power

- 8 x Ground pins - up to 28 x GPIO pins

- up to 2 x SPI bus

- up to 2 x I2C bus

- up to 4 x UART

- up to 2 x PWM

- up to 1 x PCM/I2S"

1 x 2-pin Power-on header

1 x 2-pin Recovery Mode header

1 x 2-pin Debug UART Contact Point-3 x LEDs

1 x 2-pin contact points includes:

- 1 x PWM signal - 1 x S/PDIF signal

12~19V DC, Barrel Jack (5.5/2.5mm)

3.37" x 2.125" (85 x 56 mm)

Operation temperature 0˚C ~ 60˚C

Non operation temperature

Non operation humidity

Operating System

-40˚C ~ 85˚C

10% ~ 85% (Non condensing)

Linux Debian, Android, Yocto

5V, Micro USB Power Input

3.37" x 2.125" (85 x 56 mm)

0˚C ~ 60˚C

-40˚C ~ 85˚C

10% ~ 85% (Non condensing)

Linux Debian, Android, Yocto

Tinker Board 2

Tinker Board S R2.0

Tinker Board R2.0

System

SoC

CPU

GPU NPU

Memory

Storage

Ethernet

Connectivity

Display Camera

Wired

Interface

Memory Card

eMMC

SPI Flash

Ethernet PoE

Wi-Fi/BT Cellular/GPS

HDMI DP LVDS/eDP

MIPI DSI Multi Output

MIPI CSI-2

USB

Audio

Expansion

Serial

Interface

Other

Internal I/O & Header

M.2 E-Key mPCIe

M.2 B-Key SIM slot

COM

CAN

GPIO

Rockchip RK3399Pro

Dual-core Arm® Cortex®-A72 @ 1.8 GHz +

Quad-core Arm® Cortex®-A53 @ 1.4 GHz

Arm® Mali™-T860 MP4 @ 800 MHz

Rockchip NPU (3 TOPS)

2GB / 4GB LPDDR4 (SYSTEM)

1GB / 2GB LPDDR3 (NPU)

Micro SD (TF) card slot (push/pull)

16GB

1 x GbE LAN Realtek RTL8211F

Wi-Fi 5 & BT 5.0 (2T2R), default occupied M.2 E key

4G (Optional)

1 x HDMI™ 2.0 (4096x2160)

1 x DP Alt Mode via USB Type-C® (4096x2160)

1 x 22-pin (4 lane, 1920x1080)

HDMI + Type-C / HDMI + DSI / Type-C + DSI

1 x 15-pin (2 lane)

1 x USB 3.2 Gen1 Type-C® OTG

3 x USB 3.2 Gen1 Type-A

1 x 3.5mm Phone Jack

1 x HDMI™ audio

1 x S/PDIF TX pin (from GPIO)

1 x PCM/I2S pins (from GPIO)

Full (USB2, SIM) for 4G

1 x Nano SIM slot

-1 x 40-pin headers:

- 2 x 5V Power pins

- 2 x 3.3V Power pins

- 8 x Ground pins

- up to 28 x GPIO pins

- up to 2 x SPI bus

- up to 2 x I2C bus

- up to 2 x UART

- up to 3 x PWM

- up to 1 x PCM/I2S

- up to 1 x S/PDIF TX

Keys

Debug IR receiver RTC

FAN

LED Others

Power Input

Dimensions

Operation temperature

Non operation temperature

Non operation humidity

Operating System

1 x 2-pin Power-on header

1 x 2-pin Reset header

1 x 2-pin Recovery Mode header

(in GPIO)

1 x RTC header

1 x 2-pin DC Fan header

3 x LEDs

1 x 2-pin NPU Debug UART header

12~19V DC, Barrel jack (5.5/2.5mm) & 4-pin header

Pico-ITX, 3.9" x 2.8" (100 × 72 mm)

0˚C ~ 60˚C

-40˚C ~ 85˚C

10% ~ 85% (Non condensing)

Linux Debian, Android

NXP i.MX 8M

Quad-core Arm® Cortex®-A53 @ 1.5 GHz

GC7000 Lite

Google Edge TPU (4 TOPS)

1GB LPDDR4

Micro SD (TF) card slot (push/pull)

8GB -

1 x GbE LAN Realtek RTL8211F

Wi-Fi 5 & BT 4.2 (2T2R) -

1 x HDMI™ 2.0 (4096x2160)-

1 x 22-pin (4 lane, 1920x1080) HDMI + DSI

2 x 24-pin (4 lane)

1 x USB 3.2 Gen1 Type-C® OTG

2 x USB 3.2 Gen1 Type-A

1 x HDMI™ audio

1 x S/PDIF TX pin

1 x PCM/I2S pins (from GPIO)

Renesas RZ/Five

RISC-V Single-core AndesCore™ AX45MP 1.0 GHz

1GB DDR4

Micro SD (TF) card slot (push/pull)

none / 16GB

none / 16MB

2 x GbE LAN Realtek RTL8211FI----

1 x USB 2.0 Micro-B OTG

1 x USB 2.0 Micro-B

1 x 40-pin headers:

- 2 x 5V Power pins

- 2 x 3.3V Power pins

- 8 x Ground pins - up to 28 x GPIO pins

- up to 1 x SPI bus

- up to 2 x I2C bus

- up to 2 x UART

- up to 3 x PWM

- up to 1 x PCM/I2S

1 x 2-pin Reset header 1 x Boot mode switch

-1 x 2-pin DC Fan header

4 x LEDs -

12~19V DC, Barrel jack (5.5/2.5mm)

3.37" x 2.125" (85 × 56 mm)

0˚C ~ 50˚C

-40˚C ~ 85˚C

10% ~ 85% (Non condensing)

Mendel

2 x RS-232 (10-pin terminal block)

2 x CAN Bus (6-pin terminal block

1 x 20-pin headers:

- 1 x 3.3V Power pin

- 5 x Ground pins

- 1 x SPI bus

- up to 4 x GPIO pins

- up to 2 x I2C bus

- up to 2 x UART

- up to 2 x ADC

1 x 2-pin Power-on header

1 x 2-pin Reset header

JTAG pin header1 x 2-pin DC Fan header

3 x LEDs side view -

10~24V DC, Barrel Jack (5.5/2.5 mm)

Pico-ITX, 3.9" x 2.8" (100 × 72 mm)

-20˚C ~ 60˚C

-40˚C ~ 85˚C

10% ~ 85% (Non condensing)

Linux Debian, Yocto

Tinker Edge R

Tinker Edge T

Tinker V

Tinker Board Series - Accessories

Input Interface

Output

Power input

Power output (supply Tinker)

MIPI to LVDS Converter Board

22-pin MIPI DSI (4 lane)

LVDS (3.3V/5V)

HD, FHD

Supported (5V/12V)

- LVDS power select jumper (3.3V/5V)

- Backlight power select jumper (5V/12V)

- Backlight power enable jumper (High/Low Active)

- 12V~24V (5.5/2.5 DC Jack)

- 12V~24V (Phoenix Jack)

- 5V pin header

- 12V pin header

3.37" x 2.125" (85 x 56 mm)

POE SPLITTER BOARD PoE Standard

x 2.125" (85 x 56 mm)

Tinker Board Systems

Tinker System 3N

Arm-based fanless edge system, with versatile applicability for industrial use, provided low power consumption, and rich interfaces make IIoT and IoRT feasible, flexible, and productive

Fanless design for great heat conductivity

‧Certified with RF regulation for WiFi (CE, FCC, VCCI, BSMI)

‧High expandability, including Dual-LAN, COM, CAN and M.2 for cellular module

Wide range DC power 12-24V and -40-60°C operating-temperature range

‧Embedded design with wall mount and DIN rail clip

‧Linux, Android, and Yocto supported

Tinker System 2

Arm-based embedded system, featuring 64-bit Armv8 architecture, offers enhanced computing performance with low power consumption

Fanless design for great heat conductivity

‧Certified with RF regulation for WiFi (CE, FCC, VCCI, BSMI)

‧High peripheral extensibility: Reserved I/O for antenna and accessory extension

‧Wide 12-19.5V DC inputs offers stable power delivery

‧Linux, Android and Yocto supported

CHAPTER 12

Panel PCs

PP-156W-3568

ARM System 15.6” Panel PC provides an industrial-grade touch display with front IP65, multi-serial ports support, wide operating temperature, plug-and-play integrated into Automation, Industry applications embedded solution

Fanless design with embedded Rockchip RK3568 processor

‧15.6-inch, 1920x1080, projected-capacitive multi-touch display

‧Android, Linux Debian and Yocto operating systems supported Rich connectivity, including HDMI, dual GbE Lan, dual RS-232, one RS-232/422/485 and one CAN bus

‧Supports IEEE 802.3af/at PoE-PD module (optional)

‧Wide 12-24V DC power inputs supported

‧Wide -20-60°C operating-temperature range

PP-156W-3399

ARM System 15.6” Panel PC provides an industrial-grade touch display with front IP65, plug-and-play integrated into kiosks, and commercial applications embedded solution

‧Fanless design with embedded Rockchip RK3399 processor 15.6-inch, 1920x1080, projected-capacitive multi-touch display

‧Cross-platform compatibility with both Linux Debian and Android

‧Supports HDMI output up to 4K UHD video resolution

‧Supports IEEE 802.3af/at PoE-PD module (optional)

‧Supports VESA, Wall and Panel mounting (optional)

PP-101W-3399

ARM System 10.1” Panel PC providese an industrial-grade touch display with front IP65, plug-and-play integrated into kiosks, and commercial applications embedded solution

‧Fanless design with embedded Rockchip RK3399 processor

‧10.1-inch, 1280x800, projected-capacitive multi-touch display

Cross-platform compatibility with both Linux Debian and Android

‧Supports HDMI output up to 4K UHD video resolution

‧Supports IEEE 802.3af/at PoE-PD module (optional)

Supports VESA, Wall and Panel mounting (optional)

CHAPTER 13

Computer-On-Modules

Type 6 COM Express Module

RPLB6-IM-A

COM Express Type 6 basic-size module with 13th gen Intel® H/P/U processor , DDR5 SO-DIMM, PCIe 4.0, USB 3.2 Gen2, 2.5Gb Ethernet, discrete TPM 2.0, eDP and SATA

13th Gen Intel® Core™ Celeron® (13th gen) processors in Intel 7 lithography

‧Up to 6X performance core +8x efficient core, and up to 96X graphic execution units

‧2 x DDR5-5200 non-ECC SO-DIMMs up to 96GB

‧1 x PCIe 4.0 x8(H series), 2 x PCIe 4.0 x4

Options for industrial temperature range -40°C up to +85°C

‧Options for onboard PCIe NVMe SSD

RPLC6-IM-A

COM Express Type 6 compact-size module based on 13th gen Intel® Core™ processors family (U/P/H) with DDR5 SO-DIMM, DDI, PCIe 4.0, USB4, USB 3.2 Gen 2, 2.5 GbE TSN Ethernet, discrete TPM 2.0, eDP and SATAIII

‧13th gen Intel® Core™ processors series family (U/P/H) processors

Up to 14C/20T, and up to 96X graphic execution units

‧2 x DDR5-4800 non-ECC SO-DIMMs up to 64GB, 2 x PCIe 4.0 x4, and 8 x PCIe 3.0 x1

‧4 x USB 3.2 Gen 2, 8 x USB 2.0, 2 x SATAIII, 3 x DDI, VGA, eDP/LVDS, 2 x USB4 (optional)

‧Industrial temperature range -40°C to +85°C (optional)

Onboard PCIe NVMe SSD (optional)

Type 7 COM Express Module

RV3B7-IM-A

COM-Express® Type 7 Basic module with AMD® Embedded Ryzen™ V3000 CPU Family equipped on-module NVME SSD

‧AMD® Embedded Ryzen™ V3000 processor

2 x DDR5 4800 MT/s SO-DIMM, 2 x 10G KR port

‧10W-54W cTDP with -40-85 °C support on selected SKUs

‧Up to 16x PCIe 4.0 lanes for high-speed interconnection

‧Optional on-module PCIe x2 NVME storage

ICLB7-IM-A

COM Express Type 7 basic module based on Intel® Xeon® D-1700 processors with three channels and four SO-DIMM slots

‧Intel® Xeon® D-1700 processors for edge IoT

‧Intel® Deep Learning Boost and Time Coordinated Computing 4 x USB2.0/3.2 Gen 2×1, 2 x SATAIII, 4 x 10G KR, 2 x UART

‧Three memory channels with maximum four SODIMM slots

‧Selected SKUs support -40°C to 80°C extended temperature range for extreme environments

Type 10 COM Express Module

EHLMA-IM-A

Intel® Atom® x6000-series SoC based on Type 10 Mini COM-Express® module with LPDDR4 SDRAM

Intel® Atom® x6000E-series processor

‧LPDDR4-3200 MT/s on-board memory up to 16GB with in-band ECC support

‧Dual 4k display, eDP/LVDS/HDMI/DPI interfaces

‧4 x PCIe 3.0 x1, 2 x USB 3.1, 8 x USB 2.0 and 2 x SATA III 2.5GbE with Intel TCC/TSN support

‧Wide voltage input from 4.75V to 20VDC

‧Industrial temperature range from -40°C to 85°C on selected SKUs

APLMA-IM-A

Intel® Atom® E3900-series SoC based on Type 10 Mini COM-Express® module with LPDDR4 SDRAM, eMMC and USB 3.0

Intel® Atom® E3900, Pentium® N4200 or Celeron® N3350 processor

‧Supports LPDDR4-2400 MT/s on-board memory up to 8GB

‧Supports DDI, LVDS/eDP display interfaces

‧Support 8 x USB 2.0 or 4 x USB 2.0 and 3 x USB 3.0, 2 x SATA III and 4 x PCIe 2.0 x1

Supports wide voltage input from 4.5V to 20V

‧Supports a wide -40°C to 85°C extended temperature range (via E39XX SKUs)

COM-HPC Module

ICLHE-IM-A

COM-HPC server, Size E module with Intel® Xeon® D-2700 processor

Intel® Xeon® D-2700 processors for edge IoT computing AI/deep-learning accelerated data analytics with Intel AVX-512 and VNNI

‧8 x 10G KR, 4 x USB2.0/3.2 Gen 2×1, 2 x SATAIII, 2 x UART

‧Eight DIMM slots and maximum 1024GB memory support

Selected SKUs support -40-80°C for extended-temperature applications

RPLHC-IM-A

COM-HPC Size C client module with with Intel® 13th /14th gen socket-type processor, plus DDR5 SO-DIMM, DDI, PCIe 5.0, USB 3.2 Gen2, 2.5G Ethernet, discrete TPM 2.0, eDP and SATA

Intel® Core™ (13th gen), Pentium® or Celeron®-series socket-type processors in Intel 7 lithography

‧Up to 8X Performance cores and 16X Efficiency cores, and up to 32X graphic execution units

4 x DDR5 ECC/non-ECC SO-DIMM up to 128GB capacities

‧1 x PCIe 5.0 x16, 4 x PCIe 4.0 x4, 3 x PCIe 3.0 x4 4x USB3.2 Gen2 x2, 2x SATA, 3x DDI and eDP

GPU & AI Accelerator Cards

Coral Edge TPU

Build your own edge AI applications from sketch to reality

ASUS IoT is dedicated to providing ideal solutions for the era of IoT and AI. Together with Google technology and the Coral toolkit, the Coral Edge TPU empowers you to build products that are efficient, private, fast, and offline.

Solutions for on-device intelligence

Object detection

Draw a square around the location of various recognized objects in an image.

Coral M.2/mPCIE Module

Pose estimation

Estimate the poses of people in an image by identifying various body joints.

Integrate the Edge TPU into legacy and new systems using a Mini PCIe or M.2 interface.

Coral Dev Board Micro Series

A microcontroller board with a camera, mic and Coral Edge TPU. PoE

Image segmentation

Identify various objects in an image and their location on a pixel-by-pixel basis.

Key phrase detection

Listen to audio samples and quickly recognize known words and phrases.

Coral USB Accelerator

A USB accessory that brings machine learning inferencing to existing systems.

Accelerator Module

A solderable multi-chip module including the Edge TPU.

Coral System-on-Module (SoM)/Dev Board

A fully-integrated system for accelerated ML applications.

Chapter 14 GPU & AI Accelerator Cards

MXM-M23B-E5

MXM-M23B-P7

MXM-M23B-P5

65W

Windows

*Depend

MXM-M23A-M7

MXM-M23A-M5

Defect Inspection with AI

Defect Inspection with AI – DID 100

Features:

Suitable for various types of PCBAs

‧Both front- and back-view camera inspection

Just a handful of golden samples to train AI projects for inspection

In-line inspection prevents PCBAs with defective DIP components from wave soldering

Automatic retention of production data for further tracking

Specifications:

Vision system

Method

Camera

Lens Imaging resolution

Lighting

Inspection performance Board handling Functions

Imaging Speed

AI algorithm, image comparison

15KP color-line-scan camera x 2 (Front) 40um/px; (Back) 35.7um/px

Max PCB Size

PCB thickness

Max PCBA height

550mm x 510mm

Bar codes: Code 39, code 93, code 128, UPC-A

Two-dimensional barcodes: QR code, DataMatrix Missing, reverse polarity, rotation, skew, bent pin/pin loss

Defect Inspection with AI

Defect Inspection with AI – DIP 100

Features:

Just a handful of samples for AI modeling

Automatically reads serial number and other necessary machine-readable information

Designed for pre-packaging mainboards

‧Connect to MES for production alignment and traceability

Specifications:

Vision system Inspection performance Board handling Functions  Industrial computer

AI algorithm, image comparison

15KP color-line-scan camera

40um/px M95 mount

0.04mm

White LED light

50mm/sec

610 x 510mm

0.6-2.4mm

125mm

710-790mm

Bar codes: Code 39, code 93, code 128, UPC-A

Two-dimensional barcodes: QR code, DataMatrix

Missing, Polarity, Rotation, Shift, Defective, Upside down, Foreign materials

Defect Inspection with AI

SMD Incoming Quality Inspection – DIQ 100

Features:

Designed to assist with incoming SMD-type component-specification inspection

* Pre-trained OCR model for surface marking, color dot, and dimensions

* Inspection performed in 10 seconds

Specifications:

Board Warpage Inspection

Board Warpage Inspection - DIW100

Features:

‧Suitable for various types of PCBAs

Board Warpage Inspection

* Each project user can independently set the tolerance for board warpage.

* Rapid inspection, measuring only three lines, is sufficient to identify board warpage issues.

Specifications:

@Desktop motherboard model: ITX, mATX, ATX, EATX

@Server motherboard model: ITX, mATX, ATX, EATX, 500mm x 630mm

0.6-2.4 mm

Front: 45mm

Back: 10mm

Board Warpage

@Desktop motherboard model: 788mm x 482mm x 300mm

@Server motherboard model: 995mm x 775mm x 300mm

@Desktop motherboard model: 40 kg

@Server motherboard model: 50 kg

SMT AOI Re-inspection with AI

SMT post AOI re-inspection – DIR 100

Features:

Pre-built AI model, capable to be pre-installed in E500 workstation

Resister, Capacitor, Inductor type of component post-reflow oven AOI defect re-inspection on missing, Tombstone, Cold-solder, Side-stood, Skew and short Capable for TRI* TR7700Q SII 3rd-gen AOI software inter-operation

* TRI is 3rd party name and trademark

Specifications:

AR Smart Glasses System

AR Smart Glasses System – ARG1000

Features:

Smart inspection - mobile situation room (Machine condition and manufacturing dashboards)

AR glasses swiftly scan QR codes on equipment or dashboards, providing instant access to vital information. This enables hands-free machine inspections and maintenance, enhancing operational efficiency.

Remote collaboration

AR glasses facilitate seamless remote guidance for training, maintenance, and issue resolution. On-site operators connect with experts who guide them in realtime through the backend system, ensuring prompt issue resolution.

Specifications:

Smart inspection

Remote collaboration

Operation

QR code

Identity authentication

Machine condition

Manufacturing dashboards

Video-call function

Gesture support requires Jorjin J7EF+

Voice support requires MX1,MC1,AR01-BTR (explosion proof)

Push messages

Remote collaboration

One-way video streaming (AR glasses => server)

Two-way voice-call function (AR glasses <=> server)

Voice calls between smart glasses

Video recording

Video wall with up to four AR glasses simultaneously

Photo transmission

Network environment check, and network-bandwidth optimization if needed

One-on-one voice push

Group-voice push

Electronic whiteboard

AR glasses support the display of SOP files (PDF/images/MP4)

Recommended Hardware Specifications:

AR glasses

Supports Jorjin J7EF PLUS, BT-45C, MX1, MC1, AR01-BTR (explosion proof)

Smart phone

Supports ASUS ROG Phone 6

Supports Android 8.0 or above

USB Type-C, supporting DisplayPort Alt Mode

PC

Minimum requirements：

Processor: Intel Core i5 or above

Memory: 8GB or above

OS: Windows 10/Windows 11, 64-bit editions

Internet speed: 100Mbps or above

ASUS IoT Cloud Console

ASUS IoT Cloud Console (AICC) is a unified platform for managing and analyzing big data collected by IoT devices running different operating systems. With an intuitive user interface and advanced data-encryption technology, AICC enables you to collect and analyze comprehensive information in a variety of smart-technology sectors, such as transportation, retail and farming, to assist you in making the best decisions at the right times to seize business opportunities.

Smart Traffic

Remotely manage traffic monitors on highways and overpasses to analyze traffic flow.

Smart Retail

Manage POS systems and dataanalysis boxes in retail stores.

Smart Farms

Collect and analyze information about soil, temperature, sunlight, and more.

Dashboard Menu

Visualization Chart

ASUS Android & Linux FOTA

ASUS IoT and Tinker Board's Android & Linux FOTA is an advanced system for seamless updates. Tailored for ASUS IoT devices and Tinker Boards, it streamlines firmware updates without manual intervention. Users receive timely notifications, and the FOTA mechanism provides flexibility for update installation, aligning with user preferences. Security is paramount, ensuring a protected IoT and Tinker Board ecosystem with prompt delivery of patches for vulnerabilities. In essence, ASUS IoT and Tinker Board's FOTA prioritizes user convenience and security for an optimized and secure experience.

ASUS Official Image Update

Offers seamless official image updates for devices, ensuring an easy way to keep devices current with the latest features and security enhancements directly from ASUS.

Customized Image Updates via a Single Cloud Portal

Provides personalized image updates via a single cloud portal, empowering users to tailor device updates to specific preferences for a flexible and usercentric experience.

On-Premises Image Update

Enables on-premise image updates, giving organizations local control for firmware deployment, ensuring heightened security and meeting strict data governance requirements.

Solid service experience with over 20 million devices upgrade in mobile market

Single Interface with global content delivery network

Enhanced system flexibility, remote functions and long-term maintenance

Report management with progress, quantity and problem

Product Advantage

ASUS IoT Middleware

ASUS IoT Middleware simplifies system customization and application development on ASUS IoT platforms, by providing easy-to-use tools to configure and protect systems. It takes just a few clicks to configure a plethora of interfaces and options, including GPIO, UART, I2C, I2S, SPI, PWM, boot logo, power-on schedule, fan-trigger thresholds, watchdog and more.

The suite also provides a rich set of APIs that empower you to take full advantage of ASUS hardware. These include an SDK, sample code and programming guides. It also offers cross-platform support for Windows, Linux and Android.

In addition to the provision of industrial protocols such as Modbus, MQTT, BACnet, ASUS IoT Middleware enables automatic network recovery and network failover to eliminate worries about disconnections — and ensuring that systems are always online and available.

Key Features

Config & Protection Tools API

‧Easily builds and testing

Watchdog and fan control

Scheduled power cycling

AICC EDGE

On-Prem Secure | Schedule Routine Tasks | Remote Monitor and Update

Introducing AICC EDGE, revolutionary software designed to optimize your IoT operations through on-premises infrastructure, schedule routine tasks, remote monitor and update. Our integrated design ensures your sensitive IoT data is secured on premises, effortless routine tasks management, and super-convenient remote control and update.

All devices : Remote BIOS update

Self-order kiosk: Error recover

Outdoor device:

Fan control

Self-checkout kiosk: Recover USB issues

Platform

Signage : Schedule daily power on off

AICC EDGE offers a supercharged solution with operational intelligence and management tools. Our comprehensive routine automation includes remote monitoring, control, troubleshooting, app deployment and device management for streamlined IoT deployments.

The key features of AICC EDGE include on-premises infrastructure, schedule routine tasks, remote monitor and update to address diverse use cases, from monitoring outdoor drive-through kiosks to conducting remote BIOS updates. Elevate your IoT operational efficiency with our comprehensive solution.

Remote control software optimizes IoT operations

Securely, Effortlessly, and Remotely in retail and industry.

Scenarios and Key Features

On-Prem for sensitive IoT data

Schedule routine tasks

All devices: Performs remote BIOS updates.

Outdoor drive-through kiosk: Monitors temperature and controls fans.

Schedule routine tasks. Effortless management

3 am

7 am

8 am

Self-order kiosk: Detects and recovers from App errors.

Signage: Schedules daily power on/off.

Self-checkout kiosk: Recovers USB issues or locks USB.

Self-order kiosk: Implements watchdog and recovery mechanisms.

Powers on all devices, performs regular BIOS/FW updates, powers off all devices

Sets drive-through kiosk temperature and fan control

Powers on signage

3 pm

Monitors all devices during business hours

Group 1

Group 2

9 pm

10 pm

Powers off signage

Powers off all devices

Group 3