No.1 Benchmark World Records

Taking advantage of the AMD EPYC™ 9004 processors' compute leadership performance, ASUS servers powered by EPYC™ 9004 achieved the No.1 result for performance – securing a top ranking across SPEC CPU2017 benchmarks on SPEC org. The results demonstrate that ASUS leadership with the new AMD EPYC™ processors, delivering outstanding performance for the server industry.

* ASUS RS700A-E12 & RS520A-E12 servers are tested the highest scores on SPEC CPU2017 multiple benchmarks. All results can be veri ed on 10, November, 2022 at SPEC.org

Air Cooling Solutions

Independent Air ow Tunnel Design

90 29.6 44 2

Wider Ventilation Holes for Component Longevity

8

400W GPUs

Custom-focused ASUS Design

350W GPUs

ASUS servers are designed with our customers in mind, o ering exibility to enable easy scale-up of con gurations to meet increasing data-center workloads.

CPU-balanced Architecture

Offers reliable, optimal CPU performance efficiency between CPUs

Extends I/O availability for more computing capability

Scalable Storage Solutions

Unlock SSD GRAID performance with RAID technology, deliver up to 24 NVMe

More scalable options in middle and rear bays

Comprehensive Cooling Solutions

New HDD tray and independent airflow tunnel design deliver energy-efficient performance

Immersion and direct-to-chip liquid cooling solutions for improved PUE and reduced operational costs

Multiple GPU and FPGA Support

Flexible design to configure PCIe5 x16 slots for specific workloads GPU servers designed with space optimization for liquid cooling solutions

Stand-out AI training and inference performance proved by MLPerf benchmarks

Improved Air Cooling Solutions

HDD Tray Design

This new design improves airflow by 44% open ratio and thermal airflow, extending storage lifecycle and better user experience.

Improved Air ow Tunnel Design

The independent CPU and GPU airflow tunnels allows to support two processors consuming up to 400 watts each, and eight graphics cards consuming up to 350 watts each.

ASUS Power Balancer

Dynamic Monitoring and feedback CPU loading to have more accurate management on the system and adjusting CPU frequency based on current utilization to reduce power consumption and optimize performance per watt for a better power efficiency system.

Front Bezel Design

An enhanced protection with a lock to avoid accidental removal and usage.

Thermal Radar 2.0

Multiple sensors are embedded on the front panel, CPU socket, NVMe SSD slots, OCP slot, PSU socket and memory slots. Fans are also grouped for dynamic fan curve adjustment in different fan zones to achieve more precise thermal monitoring.

*Product specifications are subject to change without notice, although every effort is made to ensure that they are correct up to the point of launch. Please contact your suppliers or local dealers for exact product launch schedules, specifications and availability.

HPC Data Center Solutions with

4th G en I ntel® Xeon® S calable Processors

HPC Data Center Solutions powered by 4th Gen I ntel®

Xeon® Scalable Processors

ASUS se r v e r s p o w e r ed b y 4t h G e n I n t el® X e o n® S c al a ble or hi gh-b a ndw i dt h mem o r y ( HB M ) p ro c ess o rs a re o ptim i zed t o del i v e r sup reme co mput i ng pe r fo r ma n ce an d ene rgy e fficien c y fo r H P C , A I, d a ta a nalyti c s a nd v i r tual i z a ti o n. Our en h a n ced t h e r m a l des i g n a nd inn o va t i v e l i qu i dcooling solutions improve data- center power-usage effec tiveness, enabling scale up and scale out to accelerate and optimize complex work loads

Superior Per formance

• Suppor t the highest per formance CPUs and GPUs and the latest PCIe 5.0, DDR5 CXL 1.1 technologies

• Ex tends I/O availability and high bandwidth memor y for more computing capability

Scalable Storage Solutions

• Unlock SSD RAID per formance with SupremeRAID™ Technology, deliver up to 24 NVMe

• More scalable options in middle and rear bays

Comprehensive Cooling Solutions

• New HDD tray and independent air flow tunnel design deliver energy- efficient per formance

• I mmersion and direct-to - chip liquid cooling solutions for improved PUE and reduced operational costs

Liquid Cooling Solutions Air Cooling Solutions

Over Lower fan power

92% Over Lower noise level

Multiple GPU and FPGA Suppor t

• Flexible design to configure PCIe5 x16 slots for specific work loads

• GPU ser vers designed with space optimization for liquid cooling solutions

• Stand- out AI training and inference per formance proved by MLPer f benchmarks

Tunnel Design

29.6% 350W CPUs

8 with Enhanced Volume Air cooling (EVAC )

8 x 350 W CPUs

2 350W GPUs