TECH-EXCLUSIVE

Measure What Matters – Sense CO2

to Improve Air Quality in Smart Homes and Smart Buildings

We are an indoor generation, spending most of our time in cars, plains, trains or buildings. The level of CO2 indoor has a severe impact on our wellbeing and performance. The health impact can range from headaches, drowsiness, and poor concentration that could lead to reduced productivity to the undetected build-up of airborne viruses, such as Covid-19. The demand for this sensing capability is immense. A recent 2021 market forecast projects the advanced CO2 sensors market to grow by USD 258.87 million during 2021-2025 at a CAGR of over 7% during the forecast period. The growth of the global construction market is one of the major factors driving the market. System designers have choices for the CO2 sensing technology used in their sensors. Two common choices are non-dispersive infrared (NDIR) sensors and sensors that estimate the concentration of carbon dioxide or eCO2 sensors

NDIR sensors consist of an IR light source, a sample chamber, a spectral filter, and reference and absorption IR detectors. As a result, they are relatively large and expensive. In spite of

making accurate CO2 measurements, their form factor makes them difficult to integrate and unsuitable for installation in small internet of things (IoT) devices or smart home components. Unlike the NDIR sensor, eCO2 sensors can be smaller but they do not perform real-time measurements. Instead, they use algorithms to calculate an equivalent CO2 value. Based on many assumptions, the estimated values do not necessarily improve the air quality at the right moment, resulting in the climate control system consuming an unnecessarily large amount of energy.

Using its extensive microelectromechanical system (MEMS) technology, Infineon has developed a new CO2 sensor based on photoacoustic spectroscopy (PAS) that addresses the shortcomings of existing CO2 sensors. In the PAS sensor (see Figure 1), pulses of light from an infrared source pass through an optical filter tuned specifically to the CO2 absorption wavelength of λ= 4.2 µm. The CO2 molecules inside the measurement chamber absorb the filtered light, causing the molecules to vibrate and generate a pressure wave with each pulse. Detecting the pressure change generated by the CO2 molecules within the sensor cavity, the sensor’s microcontroller converts the output into a CO2 concentration reading. Incorporating an acoustic detector, similar to an internal microphone, Infineon’s XENSIVTM PAS CO2 sensor achieves size and cost benefits compared to NDIR sensors, without compromising performance.

In addition to integrating a photoacoustic transducer with a detector, infrared source, and optical filter on a small PCB, the 14 x 13.8 x 7.5 mm3 XENSIV™ CO2 sensor contains a microcontroller for on-board signal processing, sophisticated algorithms, and a MOSFET for operating the infrared source (see Figure 2). To achieve the highest performance of the detector, the PAS sensor design had to minimize system noise. This required isolating the MEMS detector from external noise so that only the pressure change originating from the CO2 molecules in the chamber is detected. To do this, the absorption chamber is acoustically isolated from external noise to provide accurate CO2 sensing information and minimize the impact of noise. This results in the sensor achieving accurate and robust performance of ±30 ppm ±3% of reading. The integrated microcontroller in the XENSIV™ PAS CO2 sensor performs ppm calculations as well as providing advanced compensation and configuration algorithms for high performance CO2 sensing.

The PAS CO2 kits are now available. Showing how fast and easy the sensor is to use, the kits demonstrate plug & play CO2 measurements in ppm readout for indoor air quality monitoring. A complete suite of product evaluation boards (PAS CO2 evaluation board, Arduino-based Shield2Go board), software libraries, and comprehensive documentation, including application notes, will also be available soon to support customers and accelerate the design-to-market time of the PAS CO2 sensor.

While CO2 is a colorless and odorless gas, Infineon’s XENSIV™ PAS CO2 sensor provides an electronic nose to sniff out potential air quality problems. The new sensor is ideal for high-volume, cost-sensitive smart home and building automation applications such as demand-controlled ventilation systems, air purifiers, thermostats, weather stations, and personal assistants. By integrating CO2 measurement into these systems, energy can be saved by an automated air ventilation system, operation only when needed and indoor air quality can be greatly improved, leading to a lower energy bill and a healthier indoor environment. Infineon is making a valuable contribution to enable everyone to track their environment in a smart, easyto-use and affordable way – for a better and healthier life!

ST Releases Isolated SiC Gate Driver

STMicroelectronics has unveiled STGAP2SiCSN single-channel gate driver, optimized to control silicon-carbide MOSFETs. The gate driver comes in a space-saving narrow-body SO-8 package and delivers robust performance with accurate PWM control.

Features:

• Simplifies design, saves space, and enhances robustness and reliability. •Galvanic isolation between the gate-driving channel and the low-voltage control. •Operates with up to 1700V on the high-voltage rail. •The input-to-output propagation time of less than 75ns ensures high PWM accuracy.

Applications:

Applications include electric-vehicle charging systems, switched-mode power supplies, high-voltage power-factor correction (PFC), DC/DC converters, uninterruptible power supplies (UPS), solar power, motor drives, fans, factory automation, home appliances, and induction heating.

Availability:

Available Now

Infineon’s CIRRENT Cloud ID Service

Infineon Technologies has launched CIRRENT Cloud ID, a service that automates cloud certificate provisioning and IoT device-to-cloud authentication. The easy-to-use service extends the chain of trust and makes tasks easier and more secure from chip-to-cloud while lowering companies’ total cost of ownership.

Features:

• Simplifies the manufacturing processes while maintaining the capability to have individual certificates without complex IT systems and processes • Provides asymmetric key security that leverage Infineon’s trusted security and the strength of the X.509 certificates without the complex infrastructure • Comes with automatic provisioning to the cloud. Users can configure a cloudto-cloud connection and provisioning with a private cloud, public cloud, or AWS IoT Core

Applications:

Ideal for cloud-connected product companies in the industrial, consumer, healthcare, medical and manufacturing industries.

Availability:

Available Now

Infineon’s Automotive Coreless Current Sensor

Infineon Technologies has rolled out its first automotive current sensor: the new XENSIV TLE4972. The coreless current sensor uses Infineon’s well-proven Hall technology for precise and stable current measurements.

Features:

• Compact design and diagnosis modes • State-of-the-art sensing without the negative effects caused by magnetic cores. • Neither core nor shield is required to protect the sensor against stray fields. • The integrated EEPROM allows customization of the sensor for different applications and supports measurement ranges up to 2 kA.

Applications:

Ideal for xEV applications like traction inverters used in hybrid and battery-driven vehicles, as well as for battery main switches.

Availability:

Available Now

Infineon Presents EZ-PD BCR Solution

Infineon Technologies’ EZ-PD™ BCR (Barrel Connector Replacement) is a highly integrated USB-C controller, together with the USB-C connector. The EZ-PD BCR solution supports the USB Power Delivery (PD) standard that interoperates with all USB-C power adapters without the need of firmware development.

Features:

• Allows consumers to charge their devices with the same USB-C charger, regardless of the device brand. • A common charging standard harmonizes fast charging technology and prevents product producers unjustifiably limiting the charging speed when using a charger from a different brand. • Offers higher levels of convenience to consumer by being agnostic to connector types or product manufacturers when selecting a charger.

Applications:

Replaces barrel connectors, custom connectors or legacy USB connectors in electronic devices.

Availability:

Available Now

Murata’s Antenna Array Integrated Module

Murata has introduced a space-saving antenna array integrated module for mmWave 5G. A major disadvantage of existing products on the market is that to get around this problem, they require several radio-frequency integrated circuits (RFICs) to be fitted to emit radio waves in multiple directions.

Features:

• Murata's solution is based around the MetroCirc™ mmWave antenna module board with its superior high-frequency performance. • Ability to disperse IC heat generation effectively thanks to the use of extremely precise packaging technology. • Has a unique L-shape design that delivers a secure mmWave wireless communication environment in two directions using just a single RFIC.

Applications:

Smartphone, Internet of Things (IoT) and local/ private 5G markets.

Availability:

Available Now

ROHM’s High Optical Output Laser Diode

ROHM has developed a high optical output laser diode, the RLD90QZW3. The new launch improves the performance of laser diodes when used as light sources to increase detection distance and accuracy while reducing power consumption.

Features:

• Establishing original patented technology to achieve narrower emission width. • Contributes to a longer range and higher accuracy in LiDAR applications. • This latest product expands applicability in the industrial sector by providing higher optical output. • Designed for LiDAR used in distance measurement and spatial recognition in 3D ToF (Time of Flight) systems.

Applications:

AGVs (Automated Guided Vehicles) and service robots in the industrial equipment sector and robot vacuums in the consumer field that incorporates LiDAR for distance measurement and spatial recognition.

Availability:

Available Now

Vishay’s New Small Signal Schottky Diodes

Vishay Intertechnology has released new surface-mount small signal diodes in the ultra-compact DFN1006-2A plastic package with wettable flanks.

Features:

• Designed to save space and improve thermal performance. • Occupy 90 % less board space than devices in traditional SOD/T packages while offering a 50 % lower profile and better power dissipation. • For protection again excessive voltage, such as electrostatic discharges, the BAS40L features a PN junction guard ring. • The BAS40L and BAS16L offer a moisture sensitivity level (MSL) of 1 under J-STD-020 and a UL 94 V-0 flammability rating. • Soldering can be checked by standard vision inspection; no X-ray is required.

Applications:

Automotive and industrial applications.

Availability:

The 40 V BAS40L Schottky and 100 V BAS16L switching diodes are each available in AEC-Q101 qualified versions.

Cadence Presents Integrity 3D-IC Platform

Cadence Design Systems has introduced the Cadence Integrity 3D-IC platform. The Integrity 3D-IC platform underpins Cadence’s third-generation 3D-IC solution, providing customers with system-driven power, performance and area (PPA) for individual chiplets through integrated thermal, power and static timing analysis capabilities.

Features:

• Industry’s first comprehensive, high-capacity 3D-IC platform • Integrates 3D design planning, implementation and system analysis in a single, unified cockpit. • The platform uniquely provides system planning. • Integrated electrothermal, static timing analysis (STA) and physical verification flow, • Enabling faster, high-quality 3D design closure.

Applications:

N/A

Availability:

Available Now

ST Shares 2021 Third Quarter Financial Results Qeexo and ST Launch MLC Sensors

Infineon, Picovoice to Bring AI to Next-Gen IoT devices

STMicroelectronics (ST) has recently shared U.S. GAAP financial results for the third quarter ended October 2, 2021. ST reported third-quarter net revenues of $3.20 billion, gross margin of 41.6%, operating margin of 18.9%, and net income of $474 million or $0.51 diluted earnings per share. • First nine months net revenues increased 31.8% yearover-year, driven by growth in all product groups, except the RF Communications sub-group. The operating margin was 16.7% and net income was $1.25 billion. • ST’s fourth-quarter outlook, at the mid-point, is for net revenues of $3.40 billion, increasing sequentially by 6.3%; gross margin is expected to be about 43.0%. • For the full year 2021, we now expect net revenues at the mid-point to be about $12.6 billion, translating into 23.3% year-over-year growth. The revenue growth planned for this year reflects continuing strong dynamics in all the end markets we address and our engaged customer programs.” Net revenues totaled $3.20 billion, a year-over-year increase of 19.9%. On a year-over-year basis, the Company recorded higher net sales in all product groups except the RF Communications sub-group. Year-over-year net sales to OEMs and Distribution increased 9.9% and 48.6%, respectively. On a sequential basis, net revenues increased 6.9%, substantially in line with the mid-point of the Company’s guidance. AMS and MDG reported increases in net revenues on a sequential basis while ADG decreased, caused by more severe than anticipated reduced operations at our Malaysian manufacturing facility due to the pandemic. Gross profit totaled $1.33 billion, a year-over-year increase of 38.7%. Gross margin of 41.6% increased 560 basis points year-over-year, mainly driven by improved product mix, manufacturing efficiencies, favorable pricing and lower unloading charges, partially offset by negative currency effects, net of hedging. Third quarter gross margin was 60 basis points above the midpoint of the Company’s guidance mainly due to product mix. Operating income increased 84.0% to $605 million, compared to $329 million in the year-ago quarter. The Company’s operating margin increased 660 basis points on a year-overyear basis to 18.9% of net revenues, compared to 12.3% in the 2020 third quarter. Qeexo and STMicroelectronics have launched ST’s machinelearning core (MLC) sensors on Qeexo AutoML. By themselves, ST’s MLC sensors substantially reduce overall system power consumption by running sensing-related algorithms, built from large sets of sensed data, that would otherwise run on the host processor. Using this sensor data, Qeexo AutoML can automatically generate highly optimized machine-learning solutions for Edge devices, with ultra-low latency, ultra-low power consumption, and an incredibly small memory footprint. These algorithmic solutions overcome die-size-imposed limits to computation power and memory size, with efficient machine-learning models for the sensors that extend system battery life.

Infineon Technologies has partnered with Picovoice to jointly develop an end- to-end voice platform that brings voice AI to edge devices. This collaboration enables smart voice solutions in ultra-low power IoT devices using Infineon’s PSoC 6 microcontrollers (MCUs). This gives designers an alternative approach to evaluating and deploying wakephase and intent recognition on the company’s PSoC 6 products. The joint effort opens up new possibilities with on-device AI-enabled voice technology for the smart home and wearable applications using energy-efficient PSoC 6 MCUs with comprehensive IoT connectivity support. The Picovoice platform creates an accurate and private voice interface that is now easily used with existing Infineon PSoC 6 solutions including seamless pairing with AIROC™ Wi-Fi®, low power CapSense™ touch interface and cloud connectivity. Leading in the highest sound quality capture, Infineon’s XENSIV™ MEMS microphones with the industry’s lowest SNR, wide dynamic range, low distortions and high acoustic overload point are included in this platform. Collaborating with Picovoice expands Infineon’s machine learning and AI ecosystem by allowing system developers using PSoC 6 the option to add a new voice feature for innovative IoT applications. Developers can now use a PSoC 6 Pioneer Development Kit and the IoT Sense Expansion Shield with an option to sign-up for a free Picovoice trial account.

IESA Concludes its Vision Summit 2021 Infineon Rolls Out Automotive Security Controller SLI37

The India Electronics and Semiconductor Association (IESA) has finally drawn the curtains on its 4-day long summit. The ESDM conference’s theme for the year was - ‘India’s Accelerated ESDM Growth: The Defining Decade’. The highlight of the event was the keynote address by Honourable Nirmala Sitharaman, Union Finance Minister, Govt. of India, said, “I would like to highlight that electronic manufacturing has become the backbone of India's Make in India initiative, announced by PM Modi in 2014-15. Since then, we have witnessed rapid growth in the electronics industry. The national policy of electronics introduced in 2019 has a vision to position India as the global hub of electronic system design and manufacturing. With over 330 incubators and accelerators, 50,000 start-ups, with USD 95 billion valuations, these are the right kind of fertile ground for the electronics manufacturing industry. We hope that by the year 2025, India’s digital economy will touch 1 trillion USD that will play a big role in the making of a $5 trillion economy by creating employment for over 10 lakh people. The ESDM sector holds a very big promise for India's economic revival post the pandemic. I believe, IESA Vision Summit 2021 will contribute to India’s lookout for a quick and sustained recovery and help technologically qualified people in foreseeing India’s electronics manufacturing across the country.” It also witnessed the launch of the IESA Western India chapter with an extended invitation to the leading companies, policymakers, and industry experts to join hands in the vision of bringing global recognition to the country. The first day kick-started with the keynote by Saurabh Gaur, IAS, Joint Secretary, MeitY, while the conference witnessed industry veterans such as Sanjay Mehrotra, President & CEO, Micron Technology, Erez Imberman, VP - Business Development & Special Projects, Tower Semiconductor, Ashwini K Aggarwal, Director - Govt. Relations, Applied Materials India, Rangesh Raghavan, Corporate Vice President and GM India, Lam Research, Ajai Chowdhry, Founder – HCL, Chairman - EPIC Foundation, Jeet Vijay CEO of MeitY Startup Hub (MSH), and Suket Singhal, Group CEO, Secure Meters Ltd., were a few amongst others. Infineon Technologies has launched SLI37 automotive security controller, an easy to design in and reliable trust anchor to secure safety-critical automotive applications like 5G-ready eUICC (eCall), V2X communication, car access or SOTA updates. With increasing electrification and connectivity, vehicles are at greater risk of cyberattacks, which can have serious consequences. For this reason, automotive manufacturers must provide adequate protection of telematics data. The unique and robust chip design of the SLI37 offers an extended temperature range as well as a lifetime of 17 years. While it comes with benchmark quality resulting in very low failure rates, its biggest advantage is the ability to be used for multiple applications. For this reason, OEMs can focus on a single qualification and design-in process.

Zhenghai Group, ROHM to Establish SiC Power Module Business

Zhenghai Group and ROHM have entered into a joint venture collaboration to establish a new company in the power module business. The new company, “HAIMOSIC (SHANGHAI) CO., LTD.” is scheduled to be established in China in December 2021, and will be owned 80% by Shanghai Zhenghai Semiconductor Technology Co., Ltd. (Zhenghai Semiconductor) of Zhenghai Group and 20% by ROHM. The new company will engage in the joint venture business of development, design, manufacturing and sales of power modules using silicon carbide (SiC) power devices, to develop a power module business that is ideal for traction inverters and other applications in new energy vehicles. The agreement enables to development of highly efficient power modules by combining the inverter technology of the Zhenghai Group companies, the module technology of both companies, and ROHM's cutting-edge SiC chips. The module products to be developed through the new company are already scheduled to be used in electric vehicles, and mass production will begin in 2022. The Zhenghai Group and ROHM will work closely with this new company to contribute to further technological innovation through the development and widespread use of SiC power modules.

Mouser Adds Almost 25,000 New Parts in September 2021

Digi-Key Presents New Scheme-it Features Arrow Releases AI Thermal Sensing Solution

Mouser Electronics has recently added almost 25,000 semiconductor and electronic component parts as over 1,100 manufacturer brands count on Mouser to help them introduce their products into the global marketplace.

Mouser's customers can expect 100% certified, genuine products that are fully traceable from each manufacturer. Last month, Mouser launched more than 24,740 products ready for shipment. Some of the products introduced by Mouser last month include:

• Maxim Integrated MAX32672 ARM Cortex-M4F Microcontrollers

Maxim Integrated MAX32672 microcontrollers combine a flexible and versatile power management unit with a powerful Arm® Cortex®-M4 processor with a floating-point unit (FPU).

• Futaba LC070HA TFT-LCD Module

The Futaba LC070HA is a touch-controllable display module designed for embedded applications.

• Renesas Electronics FS3000 Air Velocity Sensor Module

Renesas FS3000 is a surface-mount module that provides precision airflow monitoring for detecting system failures, measuring air handling, controlling fan speed, and more.

• STMicroelectronics STEVAL-MKI210V2K iNEMO Inertial Module Kit

STMicroelectronics STEVAL-MKI210V2K iNEMO Inertial Module Kit includes a main board and adapter board for evaluating the ISM330DHCX iNEMO inertial SiP module.

Digi-Key Electronics has introduced new features for its popular Scheme-it tool, a free online schematics and diagramming solution for engineers, educators and students. Scheme-it is a cloud-based tool available to users globally for designing and sharing electronic circuit diagrams and schematics. The new features that were recently released include: • Ultra-Librarian symbol integration: This feature brings in approximately 2 million of Ultra Librarian’s detailed, visually appealing symbols and images from Digi-Key’s product catalog. • Symbol Editor 2.0: A custom symbol editor that allows users to create new symbols that are not currently included in Scheme-it, offering endless ways to customize designs. • Mathematics markup: Powered by LaTeX, users can now properly format and insert mathematical formulas and calculations directly on schematics. The Scheme-it tool includes a comprehensive electronic symbol library and an integrated Digi-Key component catalog that allows for a wide range of circuit designs. Arrow Electronics has rolled out a thermal sensing solution, powered by STMicroelectronics (STM)' X-CUBE AI. The integrated solution is designed to help engineers and product designers rapidly combine AI and thermal sensing technologies for developing smart, reliable, and affordable health monitoring devices. This integrated solution optimizes bill-of-materials and simplifies hardware and software integration, making it a good choice to deploy for temperature-screening devices, and a wide variety of other consumer-grade and healthcare applications. Arrow's AI-powered thermal sensing solution can achieve a quick and accurate temperature screening, with multiple individuals screened simultaneously. This special denoise process runs on a convolutional neural network (CNN). With the STMicroelectronics' AI expansion pack - STM32Cube.AI, the deep-learning algorithm can be exported and executed on STM32 Arm® Cortex®-M-based microcontrollers. The solution can detect target object distance and human presence. Images can be displayed in a heat map or RGB format.