50 minute read
BIG PICTURE
Kuldeep Malik
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Director – Corporate Sales MediaTek India
Kuldeep Malik | Director – Corporate Sales | MediaTek India
in an exclusive interview with Niloy from BISinfotech underlines MediaTek with its tagline of “Incredible In, Incredible Out,” aims at creating a connected ecosystem that can flourish on the capabilities of the ultra-fast 5G network. The tagline is applicable especially to MediaTek Dimensity 5G series of chipsets which are bolstered with smart and intelligent technologies to deliver super-performing capabilities to devices, not just smartphones but also modems, laptops and hotspots. The hotshot also elaborates on the company’s 5G portfolio and their expertise in the SoC domain. Edited Excerpts Below.
QKindly elaborate about your 5G portfolio specifically the Dimensity SoC series?
MediaTek has launched a series of SoCs featuring some of the top innovations and cutting-edge technologies that can contribute towards building a robust 5G smartphone ecosystem. MediaTek Dimensity series is the newest 5G chipset technology that combines a fully integrated 5G modem and a revolutionary power saving enhancement, MediaTek 5G UltraSave. Built on the latest global standards, these chipsets support all popular network technologies, ensuring enhanced coverage, reliability and competitive performance. They also pack built-in technologies for imaging, video, and gaming, yielding an unrivalled 5G experience to the user.
MediaTek has introduced its popular chipsets from the Dimensity series in India, including the Dimensity 800U, Dimensity 700, and Dimensity 1200, and now the latest 1200AI. Leading OEMs are opting for MediaTek SoCs for their unique, customization capabilities. The latest Dimensity 1200AI is a major breakthrough in this regard, as it allows OEMs to enhance AI capabilities of
the device across several elements including camera, display, security and more. Dimensity 1200, the flagship in the Dimensity 5G series, is marked by several enhancements including the 3GHz Ultra-Core in a powerful octa-core CPU, MediaTek HyperEngine 3.0 gaming technology, enhanced MediaTek APU 3.0, MediaTek MiraVision 4K HDR video playback with AIvideo and AV1 video decoding, MediaTek Imagiq staggered 4K HDR video capture, up to 200MP photos and AI-camera. MediaTek 5G Dimensity chipsets build on the capabilities of its predecessors, but feature several major advancements, bringing incredible 5G experience to devices everywhere, not just smartphones but laptops, routers, mobile hotspots and more.
QHow it is like developing a chip in a 5G world. Challenges you identify in terms of reliability, performance while beholding the power of more connectivity?
Developing a chip technology is complex process involving years of R&D followed by the design, testing and trials. Designing an SoC in a 5G world not only necessitates building capabilities around reliable connectivity and network access, but also demands enhanced performance for features like camera, video playback, gaming capabilities, etc. Perceiving these demands, we have invested hugely in our R&D to bring the most innovative products suitable for the markets worldwide. As the 5G device ecosystem expands, we foresee even greater challenges with regard to meeting the demands of the customers. We anticipate a surge in the demand for devices as 5G gains popularity, especially in countries like India where data consumption is growing at an unpredictable level. The growing volume of data-hungry applications like AR/ VR, gaming and streaming will demand even more powerful chips in the near future. Thus, we need to be able to meet the demand from our customers, not only in terms of supply volume but also on innovations on all fronts.
QKindly elaborate about “Incredible In, Incredible out” – MediaTek’s vision of a connected and smart ecosystem.
MediaTek with its tagline of “Incredible In, Incredible Out,” aims at creating a connected ecosystem that can flourish on the capabilities of the ultra-fast 5G network. The tagline is applicable especially to MediaTek Dimensity 5G series of chipsets which are bolstered with smart and intelligent technologies to deliver super-performing capabilities to devices, not just smartphones but also modems, laptops and hotspots. The “Incredible In” symbolizes the power of the fully integrated in-chip 5G modem, combined with the MediaTek 5G UltraSave, capable of delivering sub-6GHz performance. The “Incredible Out” signifies the infinite possibilities enabled by our advanced chip technologies that support the latest standards and global cellular network technologies, offering incredible coverage, reliability and performance. MediaTek builds technologies keeping humans and their evolving demands in mind.
QMediaTek’s upcoming plans for the Indian Market?
As we await the launch of 5G network in India, MediaTek is investing in 5G technologies with intent on making them accessible to the entire community in India, thus empowering them with the digital tools required to manage their day-to-day affairs. The ongoing pandemic has taught that technology is the cornerstone to development, so we believe technology exclusion of any kind will lead to discrimination and unfair distribution of the benefits of the societal development. Also, anticipating the wider adoption of 5G by late next year. We will also invest more in the marketing/communication efforts to educate end users about the latest advancements at MediaTek. We plan to engage with industry associates to launch brand connect initiatives wherein the brand can come in direct contact with the end users who really benefit from these technologies. This will be a great learning platform for us to feel the market pulse and perform better in the coming days. Besides, we will be investing more in R&D, with a focus on emerging technology trends like AIoT, AR/VR and WiFi6.
QExperts’ purview it’s not anymore about just leadership in semiconductor but combining the power of network technology with advance 5G R&D. Hence MediaTek’s strength in leading innovations in the indigenous market?
As a leading chipset player, MediaTek believes technology innovation is the most critical aspect to gain an edge in this highly competitive market. Forward-thinking in R&D will help us explore newer possibilities and build momentum around them. When it comes to combining the power of network technology with 5G R&D and modern-day devices, we can say they all are interdependent. Without the presence of a network, devices are not of much use and vice versa. Thus, to succeed in 5G chipset market, we need to fine-tune the technologies to deliver the best customer experience across each element.
From the perspective of 5G, the future holds numerous possibilities for device ecosystem players. From owning smartphones to making our homes smart with 10s and 20s of connected devices, we have come a long way. MediaTek aims at bringing unending possibilities for its users to fulfill their requirements in this fast evolving century.
QSystem flexibility becomes a critical design challenges. The 5G standard is still evolving with new releases issued periodically and no end in sight. Any comments.
System flexibility is one of the major demands of the industry. To meet the demands, we have launched 5G Open Resource Architecture to open the in-chip resources for device makers, especially for features like camera, display, graphics, AI processing units, sensors, and connectivity sub-systems in select Dimensity 5G chips. Dimensity 1200AI is our latest open resource architecture, which can be seen in the leading brand OnePlus. MediaTek chip technologies are designed on par with international standards. Our 5G solutions are 3GPP Release 16 compliant, offering comprehensive connectivity across 2G through 5G. They deliver incredible 5G performance at both mmWave and Sub-6 GHz frequencies. Further, we have made several advancements in connectivity realm, especially with features like 5G NR Carrier Aggregation with Mixed Duplex (TDD+FDD) and Dynamic Spectrum Sharing (DSS).
Power Modules -
Empowering a New Era of Healthcare With an Evolution of IGBT Modules
Hitesh Bhardwaj
General Manager | Mitsubishi Electric India Pvt. Ltd.
Over the years, innovations in technology and business models have changed the world and the way we live. With industry 4.0, a blend of artificial intelligence (AI), robotics & automation, big data, internet of things (IoT), simulation, additive manufacturing, cyber-physical systems and sensorbased technologies in line, each and every sector has been making full use of these advancements that can help save time and ensure productivity. There is no denying that the healthcare sector is also in the same league, seeking support from tech giants. Being a major focus in most of the countries, especially during the pandemic, the healthcare sector is looking for innovations that can plan, scan and diagnose issues faster; thereby ensuring precision healthcare to support the growing needs in less time. Even today, the access and availability of quality radiology and laboratory services have been a key challenge for the healthcare system.
However, the technology sector has been doing its bit and providing additional support to the industry. The technology companies offering semiconductors and devices are changing the healthcare industry in India. Many of the devices used in healthcare are in-built with semiconductors that include Magnetic Resonance Imaging (MRI) systems, radiography, blood pressure monitors, pacemakers, etc.
Many global leaders in the industry have also come forward with a range of semiconductors and devices designed with cutting-edge technology that provides energy-saving solutions for various devices. One of the leading manufacturers of electrical and electronic products in the world, Mitsubishi Electric India has extended their support to the healthcare industry as well.
Whether in appliances, railcars, EVs, or industrial systems, Mitsubishi Electric offers power modules that are the key elements in changing the way we utilize energy. These power modules provide an easy way to cool the device as well as connect them to the outer circuit and are mechanically and thermally optimized for ease of assembly, long life and reliable operation. The power modules are often classified by the type of diode that they feature (fast recovery, standard SCR, Schottky, etc). Gradually, the companies also customize devices according to needs and preferences. The IGBT (Insulated Gate Bipolar Transistor) module is one such innovation. The IGBT module is used in power electronic applications such as inverters and the power supply in many types of industrial equipment.
With a long history of providing high currents and high voltage IGBT modules, Mitsubishi Electric India has innovated their chip structure from a flat planar structure to a trench gate structure. Also, from the 5th generation onwards, low loss CSTBT (Mitsubishi Electric India's unique IGBT that makes use of the carrier cumulative effect) modules are being offered. The Medical power supply is one of the key applications where the 5th generation high-frequency modules are being used. From the 5th generation IGBT, the line-up has further extended with a thin profile (NX type) package, in addition to the former (standard type) package in the S series (6th generation IGBT). Mitsubishi Electric India is now offering the T/T1 series (7th generation IGBT) as the latest version. The company has developed the IGBT module technology, both chip structure and packaging, over the years. The introduction of a new generation every time helped achieve better results, including low power loss and compactor features, which enables better efficiency and size reduction in the customers’ equipment. The IGBT modules are also used for amplifying magnetic resonance Imaging (MRI) systems. The need for advanced MRI systems is rapidly increasing as there is an urgent need to diagnose more cases in less time.
For seamless operations, the application of IGBT modules in MRI systems requires power modules assembly. It acts as a switching device that quickly initiates fast switching with high efficiency. The efficient power supply provides amplifiers for switching or processing complex wave patterns with pulse width modulation. As a result, these systems can capture anything to everything, including those minute details of a torn ligament to diagnosing tumours.
The other application of IGBT modules can be seen in radiography systems as well. Radiology is the key diagnostic tool for many health problems and has an important role in monitoring treatment and predicting results. The advanced radiography systems provide excellence in imaging and the optimization of workflow. IGBT modules help turn on the device and maintain a regular power supply to the system. The regular supply of the power and amount of the voltage delivered ensures low power loss and the maintenance of effective resistance of the circuit currents, delivering better quality images.
These IGBT modules by Mitsubishi Electric India are constantly supporting the healthcare structure of our country. Mitsubishi Electric India aims to provide equipment with the best semiconductor technology. The company is striving hard to offer services that act like a heart for the machines and effectively powers the systems.
Steer the Future of an ATMS With Secure Data Acquisition & Transmission
As traffic congestion continues to increase and take a heavy toll on existing infrastructure, the environment, and commuting time, city administrators and traffic engineers are turning to intelligent transportation systems (ITS) for practical and cost-effective solutions to improve road safety and traffic management. These systems leverage cutting-edge analytics, made possible by vast amounts of high-quality data that was collected by various sensors.
At the core of an ITS, the Advanced Traffic Management System (ATMS) incorporates sensors with communication and control technology to monitor traffic conditions and transmit relevant data to the traffic control center via a citywide network. The control center then consolidates information from other sources to formulate, evaluate, and execute traffic control strategies, as well as deliver relevant information to all road users for route planning and safety purposes.
Increasing Components of an ATMS
ATMS integrates traffic monitoring, analysis, and control into a single application via a network. The more real-time traffic data is fed to the central control system, the more robust it becomes. A reliable network is therefore key to enabling operators to make the right traffic management decisions. An ATMS contains the following necessary components:
Control Mechanism: At each road intersection, the control mechanism analyzes the traffic information coming from various sensors to decide the optimal timing for each traffic signal. This is made possible by multiple subsystems and devices, such as traffic lights, variable message systems (VMS), traffic information from road weather information systems (RWIS), or CCTV systems.
Sensors: Sensor data is important as data forms the basis for recognizing traffic patterns and formulating a traffic control plan. Common sensors in an ATMS include loop detectors and laser or radar sensors for motion detection. Cameras are also widely used in these applications.
Communications: Control mechanisms at each intersection also need to be interconnected for communication with the central control system via wired or wireless networks. That way, signal switching at multiple intersections can be coordinated effectively.
Central Control Systems: At the heart of the ATMS is the Central Control System (CCS), which oversees the entire traffic management operation of the ATMS.
Thanks to the increasing adoption of cloud-based traffic management systems and the wider deployment of smart sensors, today’s ATMSs are more efficient and robust. However, these advanced sensors and systems also raise several connectivity concerns. Before revamping your existing traffic management systems, you should ask yourself the following three questions.
First, does my connectivity solution make network integration of various sensors easy?
An ATMS relies on multiple sensor data to provide insights for both traffic management input systems and information output devices used to convey messages to road users. The interfaces required may include serial-based or digital/analog data points, so your connectivity solution should offer multiple yet flexible communication interfaces in one compact hardware design to make installation and maintenance efficient. Thus,
choose a compact and reliable solution to connect various sensors for clean and robust integration.
Second, does my connectivity solution provide sufficient cybersecurity safeguards for critical infrastructure?
Transportation systems are critical infrastructure important to national security and safety. Networked and cloud-based services can become an easy target of malicious hackers. Proper device configuration and up-to-date installation of firmware and security patches help secure both data and communication within the network. Thus, choose a solution that
is secure by design and provides essential security functions to ramp up your device security.
Third, how do I manage multiple field devices spread across different networks and sites?
The increasing number of smart sensors that are deployed at different field sites requires more networking devices for data acquisition and communication. Consequently, traffic system networks can become a tremendous undertaking and easily overwhelmed. Configuring, maintaining, and troubleshooting these devices and networks can also be labor-intensive and time-consuming. For this reason, you need an efficient solution from the very beginning. For example, a network management tool
that visualizes your networking device statuses and provides a user-friendly
interface for mass configurations can be a great help.
As an industrial connectivity and networking solution provider, Moxa has helped numerous clients connect and build reliable networks for ATMS in intelligent transportation systems. Download our case studies and see how we have helped other companies enable future-proof communication for their ATMS.
Looking for the right connectivity or networking products for your application? Download our E-book to find out what key criteria you should consider to choose the best solution for your needs.
Hyperscale
Just after Sachin Bhalla VP and Country GM – Secure Power, Schneider Electric India and SAARC joins in to the leadership team of Schneider Electric India, Niloy from BISinfotech gets along the veteran exploring his new journey, vision and his key strategies upfront. Sachin during this exclusive interview shares his expertise across the importance of IoT and edge computing in data center, how Modular UPS can help data centers, trend of micro data centers and cues the scenario of hyperscale data centers in India. Edited Excerpts Below.
Sachin Bhalla
VP & Country GM – Secure Power, Schneider Electric India and SAARC
QFirstly congratulations, Sachin on your new leadership position. In this new role what will be your key responsibilities and your strategies to take the company ahead to new dimensions?
Thank you. It is indeed a matter of immense pride for me to take on the mantle of Schneider Electric’s Secure Power division which is distinguished as one of the most dynamic and revolutionary divisions of the organization. My new role comes at a time where we are exploring and defining new paradigms for edge computing and data center operations, integrating new-age technologies in empowering sustainability and stepping forward towards our goal of a zero-net future.
The key responsibilities and strategies that I have delineated to expand the frontiers of our Secure Power division include growing the business further, post pandemic, through our Data Center and infrastructure offerings. I will help our enterprise client grow their businesses, and achieve their Sustainability goals. I would also want to ensure resilient and sustainable business growth for our channel partners.
QThe importance of IoT and edge computing in data center and how critical the security factor becomes and the benefits clients can tap with these evolving co-technologies?
Technical buzzwords like the Internet of Things (IoT) and edge computing that we increasingly use exist in conjunction, especially when we speak about data centers. IoT empowers devices with unparalleled data processing power and robust connectivity through superior cloud networks. While we have been gearing up to embrace edge computing as ‘next big thing’, this technology has pervaded our industries and operations, accelerating workflows and breaking down silos and deploy next-gen solutions. Edge computing integrates its distributed networks that brings data
closer to data storage units, making operations faster and secure. These evolving technologies render immense benefits to clients, some of which include increased cost efficiency and savings, scalability and improved reliability. Security is an imperative factor and is inalienable across data center operations. The growth of data centers and their use of new and emerging technologies help in identifying and mitigating potential breaches to security. With decentralised data, the extended footprint using edge computing increases the surface area for attacks exponentially. Multiple unsecured endpoints are used as entry points to the core network or in distributed denial-of-service attacks.
Today, edge computing is present everywhere in different forms. It can be mobile as in the case of a smartphone or vehicle. Or it can be static as in the case of manufacturing plants or offshore oil rigs, building management solutions. It can also be an amalgamation of both as seen in hospitals and other medical environments. With edge computing, the possibilities are limitless. The importance of edge computing can be realised by the fact that by 2025, 75% of enterprise data will be generated and processed on the edge.
QHow a Modular UPS can Help Data Centers Protect and Scale their Operations?
With the ever increasing demand for data, data center densities will continue to rise. The global data center market will grow at a CAGR of 4.5% over the next five years. With physical space being a limiting factor, data center managers are challenged to add power and expand operational capacity without adding physical space or scheduling downtime. This is where Modular uninterruptible power supply (UPS) present themselves as the ideal solution. The Modular UPS offers flexible, cost efficient solutions that extend multiple advantages for data centers. They follow the pay-as-you-grow model that not only is extremely cost-efficient but also emphasizes on employee safety.
Some advantages of the modular UPS approach include smaller footprint, scalability, availability, safety, keep data center employees safer, and scale fast with no scheduled downtime.
QThe trend of Micro Data Centers as a service and why it is becoming pivotal?
Micro Data Centers (MDC) stores all the computing, storage, and networking power combined with cooling, power, and other factors that are intrinsic to a data center’s operations. Owing to their small size, they are used at places where a traditional data center is significantly larger and cannot be deployed. MDCs are witnessing a growing trend as they offer easy installation. This is because majority of the micro data centers are shipped preassembled and only require installation by the user. Moreover, they offer several business benefits such as low latency, increased resilience, faster deployment times, standardisation, scalability, and reduced costs. Some increasingly popular and preferred micro data center use cases today include IoT, content delivery, 5G, and hybrid cloud architectures.
MDCs are booming within the data centers vertical and becoming a pivotal part as they have a smaller footprint, reduced costs and deployment times while also increasing resilience and scalability. With the explosion in the number of IoT devices sending raw data to a single, central data center, the issue of latency comes into play. This is where micro data centers step in as the solution. They collect the data from devices around them and process it locally, thus combating the latency issue.
QThe scenario of Hyperscale data centers in India and your strategies to explore this segment?
Hyperscale data centers are mushrooming globally and have pervaded the Indian enterprise segment as well, especially as a consequent factor following the current pandemic. There is a significant shift towards operations becoming hyperscale with the increasing patterns of data consumption and utilization. The hyperscale data center market is projected to grow to USD 80.65 billion by 2022, with a CAGR of 26.32%.
With the rapid adoption of cloud and edge computing along with the shift in demand from on-premises to colocation providers, hyperscale data centers will be propelling digital transformation while supporting robust, scalable operations end-to-end. Hyperscale data centers empower energy efficiency. With the integration of cooling mechanisms including hot aisle isolation, economizers and liquid cooling, they help in scaling back power consumption.
The demand for hyperscale data centers in India is developing phenomenally. A key driving factor for the same is the consumer demand for app based and OTT services that run on the cloud. With data utilisation from half a billion digital users in India, the scale of cloud adoption is unprecedented. Increased digitisation efforts by the Indian government and plans for smart cities is another driver. Data localisation mandates driven by the government is also a contributor as organizations are shifting to hyperscale data centers in order to service their clients in India.
QHow important is the India market for Schneider Electric when it comes to data center market?
The Indian data center market is expected to grow at a CAGR of over 12% during the period 2020-2026 when looking from the lens of investments. With the outbreak of the coronavirus pandemic, the Indian market is witnessing huge investments as a result of high demand from BFSI, e-commerce, transportation, logistics, and government agencies. Within the span of two years, the demand for hyperscale data centers has skyrocketed as more businesses are moving towards the cloud.
The Indian market has immense potential for growth and expansion for Schneider Electric. What we look forward to the most is to cater to the needs of our booming population and empower them with our ethos of being sustainable, scalable and secure.
QSupport clients (pre-after sales) can bag while aligning with Schneider Electric’s solution and also if you can highlight about your esteem partners ecosystem?
Schneider Electric is a leader in providing physical infrastructure solutions for data centres. The main challenges that we address include speed, cost, availability risk, modernising, and integration, and we empower end-to-end data center operations that are future-proof and reliable.
Sanjay Dhar
Director India Elektrobit (EB)
Advanced technologies such as IOT and AI are bringing in transformational changes in the automotive industry. It is not only revolutionizing the way people travel from one point to another but is also unfolding a whole new world of opportunities and possibilities for the OEMs and all the other players in the ecosystem states Sanjay Dhar - Director India, Elektrobit (EB) during an interview with Niloy from BISinfotech. The veteran also pans across many facets of modern automotive industry. Edited Excerpts Below.
QIs Elektrobit’s key focus on the need for a shift from hardware- to software-defined vehicles?
As the vehicle continues to transition itself from a hardware-based machine to a software-based electronic device, the amount of software (or lines of code) and the complexity of software in the vehicle is continuously increasing. In the past, the vehicles were assembled from many different hardware components with no software or connectivity at all. Then embedded software enabled new functions and first connectivity was introduced to connect the different ECUs in an in-vehicle network. Today vehicles getting connected to the cloud have become common and standard. In the future, autonomous driving along with new mobility solutions will have a fundamental impact on the vehicle software and the ecosystems in which the connected vehicle is embedded.
In addition, hardware is becoming commoditized and the percentage of software costs compared to the overall vehicle costs is continuously increasing, hence shifting the focus from hardware- to software-defined vehicles.
QAs automakers take a vigorous shift towards EVs, the space of vehicle-to-grid (V2G) charging is changing. What are the differences between V1G and V2G?
As the percentage of electric vehicles on the road increases, optimal charging of these vehicles becomes a key focus area. The primary difference between V1G and V2G is that V1G is unidirectional while V2G is bidirectional. To elaborate a bit more, V1G involves varying the time or rate at which an electric vehicle is charged in order to provide ancillary services to the grid, while V2G additionally includes reverse power flow which means that the electric vehicles are equipped to provide electricity back to the grid. There are other concepts such as “vehicle-to-home (V2H)” and “vehicle-to-building (V2B)” which means the vehicle can act as a source of power and can power homes and buildings. We have our own solution for V2G charging (https://www.elektrobit.com/products/ecu/ebtresos/v2g-chargein/) through which we help carmakers and Tier 1 suppliers to implement charging solutions inside charge control ECUs within short development cycles with our off-theshelf Classic AUTOSAR basic software products, tailor-made for OEM requirements.
QAt what level does Elektrobit assist automotive players and their respective clients? Are there any key flagship offerings that you want to highlight stating this dynamic market?
Elektrobit (EB) is an award-winning and visionary global supplier of embedded and connected software products and services for the automotive industry. A leader in automotive software with over 30 years serving the industry, EB’s software powers over one billion devices in more than 100 million vehicles and offers flexible, innovative solutions for car infrastructure software, connectivity & security, automated driving and related tools, and user experience.
QBeing an international supplier of embedded software solutions and services for the automotive industry, what changes and trends do you reckon have been shaping up this space?
‘CASE’ is a megatrend that is transforming the automotive industry globally. Some of the key global trends across each area of CASE is as follows: • Connected – With connected vehicles becoming ubiquitous, data has become the new oil. Every player in the ecosystem wants to own and monetize the data. And with concerns around data privacy and security, topics such as cybersecurity is coming to prominence. • Autonomous – We are observing trends such as autonomous delivery, autonomous public transport, and modular autonomous PODs in this space. • Shared – AI-enabled personalized experience is one of the key trends emerging in this space. • Electric – V2G and automatic billing in charging stations are some of the key trends in this space.
QHow distant is the future of an autonomous car and at what level of autonomy is Elektrobit supporting its clients?
Fully autonomous vehicles are already being driven in some parts of the world. We have our products and offer services for automated driving functions across the following categories: 1. Automated driving software components; 2. Automated driving test and validation; 3. ADAS and automated driving engineering services; 4. Environmental model.
https://www.elektrobit.com/products/automated-driving/
For markets such as India, until the fully autonomous car becomes a reality, we will focus on providing advanced driver assistance functionalities such as driver fatigue detection, lane departure warning, adaptive cruise control, automatic emergency braking, adaptive lighting to name a few, to improve drivability and make the drive safer.
QImpact of advanced technologies such as IoT and AI in the automotive space?
Advanced technologies such as IOT and AI are bringing in transformational changes in the automotive industry. It is not only revolutionizing the way people travel from one point to another but is also unfolding a whole new world of opportunities and possibilities for the OEMs and all the other players in the ecosystem. Broadly speaking, IOT technologies are transforming the vehicles in the following two ways: 1. The customer’s vehicle will become a part of their personal IoT environment consisting of smart home functions, wearable devices, etc.; 2. The vehicle will become an IoT device in the smart city environment where it will have to interact with other vehicles, intelligent street lights, intelligent traffic signals, and other infrastructure components. Application of AI technology in the automotive space is enabling functionalities across the following areas: 1. Personalized and customized experience to the drivers and passengers; 2. Increasing safety for the drive, the road, and the driver through driver assistance functionalities; 3. Enhancing the vehicle-customer relationship (VRM) through remote diagnostics and predictive maintenance functionalities.
QHow do you see India as a market for Elektrobit and trends specific to India to sculpture the indigenous market?
India is an important market for us, and we are focusing to grow our business in the India market. Some of the key trends we are observing in the India market are: • Connected vehicle services and apps • Remote diagnostics and OTA features • Four-wheelers and two-wheelers with ADAS and ARAS functionalities respectively • Security and functional safety
QLately, Elektrobit (EB) successfully completed five years in India. Is there an anecdote on the journey so far and outlook specific to the business model and market strategies to keep the momentum strong?
In the last five years we have grown tremendously in size, content, and our areas of operations. Our constant endeavor has been to create and deliver more value to our headquarters, other EB locations, and to the local market. We view our R&D engineering center in Bangalore as an automotive software hub from where we can also enhance our local customer business offerings. India is also looked at as an innovation partner for our product development activities for our global customers. Hence, we will continue investing in similar proportions and add head count in India in the future too.
The Virtual Key to Unlock 5G & 4G Data
Fergus Wills
Data is at the heart of nearly everything in today’s hyperconnected world. This is particularly true for mobile telecom networks. Yet mobile operators have found that their legacy data management systems are unable to keep up, failing to provide the capabilities they need to monetize and access services as they transition from 4G to 5G.
With 5G networks, it’s all about agility. When it comes to launching new services and network slices across public and private networks, fast access to data is critical. Application, profile, and subscriber data have to be available accurately, seamlessly, with low latency, across many different sites in a decentralized model. Otherwise, operators cannot bring innovative new services to life quickly and effectively monetize their 5G investment.
The beating heart of 5G
Not all 5G ecosystems are created equally, and many operators lack a comprehensive view across vertical data silos. This not only hinders their ability to launch new services and on-board new clients, but duplicate and fragmented data drives up the costs of storage, access and operational management. In order to realize their return on 5G, mobile operators should consider deployment of a common network data layer architecture across legacy and 5G systems. A cloud native fabric of data access which allows control and user plane functions to write and update data to a common layer but make it accessible anywhere in the system.
The challenge faced is that operators are still at the mercy of vendor lock-in and lack sufficient control of their (own) data. That’s why Enea introduced the industry’s first telco grade virtualized 5G data schema, based on 3GPP guidelines to unlock the 4G/5G data path from the network core to the edge. Developed for the Stratum Network Data Layer, its open standard virtual schema allows operators to take full control and ownership of their data by mapping 4G and 5G data models into single customizable read/write views. The telco-grade solution breaks through vertical data silos, enabling operators to implement new use cases such as edge computing, network slicing and IoT, while interworking seamlessly with 4G systems and the 5G core. This powerful 5G data management system can seamlessly access multiple data sources — an important factor for synchronization to resolve latency and performance issues. By breaking down vertical data silos and creating a harmonized data model, the virtual schema provides the solid foundation that operators need to build agile 5G ecosystems.
Life on the edge
A common problem with yesterday’s proprietary, centralized databases is a lack of scalability, due to an architecture that requires all data to be stored and distributed in a small number of large databases. This means that a service at the edge has to make multiple transactions back to the core site just to get the data they need to function, which results in accumulated delay and latency. This lost time is the enemy of 5G. In other words, a fast access system is slowed down by the slowest link to an old data management system. This legacy pain point significantly hinders mobile operators trying to introduce a new service where changes need to be made and selectively replicated in different parts of the network.
The 5G virtual schema provides dynamic read-write capabilities, allowing operators to make changes quickly. Data that is created or updated in one location can be accessed and read anywhere— from the core to the edge — securely and instantly while avoiding synchronization issues. This robust data management solution allows data to live at the edge to deliver low latency, but selectively and automatically synchronizes data across the region or whole network, delivering safe data management at the edge. With virtual schema and Stratum’s cloud-native capabilities, mobile operators can have full control and visibility of when, where and how their data feeds their architecture dynamically.
EVDevelopment Series by ICAT ASPIRE &
MathWorks Turned Heads of the Electrification Community
The virtual 5-part Electric Vehicle Development series focused on the end-to-end workflow for electric vehicle modelling and simulation concluded on 15th Sept, 2021. There were more than 3000 attendees from the automotive industry at the virtual event, from the commercial, academia and startup community. The sessions imparted guidance on how to simulate a whole electric vehicle and analyze design including vehicle architecture in a single environment. The event was organized by ICAT ASPIRE and MathWorks under the noble initiative of Azadi Ka Amrit Mahotsav – the 75th Anniversary of India’s Independence. Ministry of Heavy Industries’ (MHI), Govt. of India, has taken an initiative to promote innovation and to develop an eco-system for the same by creating 6 technology platforms through the organizations under its aegis. In line with this initiative and recommendation by MHI, International Centre for Automotive Technology (ICAT), Manesar, has launched a new technology platform, in the form of an e-Portal, named “ASPIRE” (Automotive Solutions Portal for Industry, Research & Education). The key objective of this initiative is to enhance the technological capability of Indian automotive sector through exchange of knowledge & expertise, in order to facilitate the growth of automobile sector and overall socio-economic progress of the country. This technology platform will facilitate auto industries (including OEMs, Tier 1, Tier 2 & Tier 3 companies), R&D institutions and students & academia (colleges & universities) to provide technology solutions, suggestions, expert opinions etc. on issues involving technology advancement. Further, it will facilitate exchange of knowledge with respect to research & development and other technological aspects of the automotive sector. The e-portal will act as one stop solution. One can register on this portal for the own organization (industry / R&D Institute / Institution/ Start-ups) or as an individual as expert (or academia) or user or student. There is no registration fee at present. Here is the link for the same: https:// aspire.icat.in/ oauth/register. We believe that this initiative will bridge the gap between Industry and Academia and help the overall technological innovation in the country. MathWorks, a mathematical computing company, creators of MATLAB and Simulink has been heavily invested in helping companies accelerate their electrification journeys through their tools, training and experts. Speakers included Mr. Saugata Pal (Advisor, ICAT), Mr. Devesh Pareek (Manager, Electrical Electronics Lab, ICAT) together with client facing engineers from MathWorks, Speedgoat and partners. Mr. Saugata shared details on the ICAT ASPIRE platform and how this could be leveraged by the automotive community as a medium for technology innovation and collaboration to help the Indian automotive industry to become self-reliant. Mr. Devesh spoke about how ICAT provided the validation requirements for electric vehicles and their critical components using dedicated facilities with specific capabilities.
Trending topics that were discussed
• Model-Based system Engineering for translating requirements to vehicle architecture to system design. • Building detailed battery cell and pack models for developing and implementation of battery management system (BMS) • Building accurate motor models for designing and implementing motor control algorithms. • Leveraging Model-Based Design for the software development and verification process to meet industry standards like ISO26262 • Re-use system models for real-time testing of BMS, MCU and VCU. If these topics interest you, you may view the recording of the event series that is available freely here.
Infineon Upgrades EconoDUAL 3 Portfolio
Infineon Technologies has released new current ratings for its EconoDUAL 3 portfolio with TRENCHSTOP IGBT7 chips. With the broad range of current classes from 300 A up to 900 A, the portfolio offers inverter designers a high degree of flexibility while also providing increased power density and performance. In addition to solar and drive applications, the portfolio is also tailored for commercial, construction and agricultural vehicles (CAV) as well as for uninterruptible power supply (UPS) inverters.
Based on the new micro-pattern trench technology, the EconoDUAL 3 with the TRENCHSTOP IGBT7 chip performs with much lower static losses compared to the modules with an IGBT4 chipset. Additionally, its on-state voltage is reduced by up to 30 percent for the same chip area. This brings significant loss reduction
ST with Feig Develop Contactless Logistics System Cadence Pegasus Verification System Verified
STMicroelectronics and Feig Electronic have collaborated to join their RFID know-how in a time-saving logistics solution that can help cut numerous costs and enhance flexibility for vendors of high-tech products such as smart industrial, consumer, and medical devices. Together the Companies have created a production-ready contactless system capable of personalizing palletized items containing ST’s ST25DV NFC dynamic tags in just a few seconds, eliminating the need to power up or even remove the products from their packaging. With this system, end users can eliminate the costs associated with inline programming and leverage contactless NFC technology to enjoy efficient, economical, and flexible stock management and logistics. A typical application configures setup parameters such as manufacturer ID, serial number, and default language in new products before they are shipped. Historically a laborious and time-consuming process that requires connecting each unit to a programmer, basic setup can now take place at any convenient point in the supply chain using this new contactless solution. The innovative solution extends the readable range for contactless NFC interactions beyond the typical distance of only a few centimeters, to create a 1m x 1m x 1m readable space. By connecting the Feig ID LR2500 long-range reader/ writer to two pairs of long-range antennas positioned on either side of the reading area, the Feig system can simultaneously program batches of products containing the ST25DV dynamic NFC tags placed in the reading area. in applications, especially for industrial drives, which usually operate at moderate switching frequencies. The oscillation behavior and the controllability of the IGBT have been improved. Additionally, the new power modules feature a maximum overload junction temperature of 175°C. The new chip dimensions enable optimization of the module layout to reduce switching losses. As a result, the switching losses for the 600 A module are reduced by up to 24 percent compared to the former generation.
This leads to a simplified design-in for applications with higher switching frequency. Furthermore, all features can be implemented in the same footprint facilitating the upgrade of existing inverter system designs.
With the extended 750 A and 900 A versions, the EconoDUAL 3 package addresses an improved inverter power range. In addition, the PressFIT housing enables a fast and cost-efficient assembly.
Cadence Design Systems has reported that the Cadence Pegasus Verification System is now qualified for the GlobalFoundries (GF) 12LP/12LP+ and 22FDX technologies. The collaboration with GF confirmed that the Pegasus Verification System meets the rigorous accuracy and runtime targets customers have come to expect with physical verification for these advanced GF nodes. GF-qualified rule decks are now available to help customers who are designing and taping out hyperscale, aerospace 5G communications, consumer and automotive applications ramp up quickly. The Pegasus Verification System offers several benefits to customers designing on GF 12LP/12LP+ and 22FDX technologies. Architected from the ground up to provide massively scalable runs, the Pegasus Verification System provides fast turnaround times and more predictable design cycle times with design rule checks (DRC), layout versus schematic (LVS), metal fill and design-for-manufacturing (DFM).
It features tight in-design integration with Cadence’s Innovus Implementation System and Virtuoso platform, providing improved productivity and checks throughout the implementation flow. Also, designers can easily fulfill mandatory DFM requirements by leveraging integrated hotspot detection with seamless automated fixing. The Pegasus Verification System is part of the broader Cadence digital full flow, which provides optimal power, performance and area (PPA) with a faster path to design closure and supports Cadence’s Intelligent System Design™ strategy, enabling SoC design excellence.
ST Presents eSIMs for M2M Applications
STMicroelectronics has reported mass-market availability of its ST4SIM, eSIM (embedded SIM) ICs for Machine-to-Machine (M2M) applications through e-distribution.
Features:
• Provide all the services needed to connect IoT devices to cellular networks. • Allowing remote management of the SIM profile under the GSMA specification. • Let customers change the connectivity provider without having access to the device. • ST also takes care of activation and deployment by arranging for customers to use device-onboarding and service-provisioning platforms provided by ST Authorized Partner Truphone.
Applications:
Machinery condition monitoring and predictive maintenance, as well as asset tracking, energy management and connected healthcare devices.
Availability:
Available through e-distribution. The ST4SI2M0020TPIFW is now available at the eStore. Other package options are available to order, including the highly miniaturized wafer-level chipscale package (WLCSP)
Infineon Presents 22 kW Reference Design
Infineon Technologies has launched a pretested industrial reference design for motor drive which reduces the time to market significantly.
Features:
• A general-purpose motor featuring a nominal power of 22 kW and can be operated directly on a 380 to 480 V three-phase grid. • The design can be fully reused for customization. • Allows customers to evaluate Infineon’s products under real operating conditions. • The design combines Infineon’s latest technologies in one system. • The system is optionally available with a 3D-printed housing, which encloses all electronic components and the cooling system.
Applications:
Pumps, fans, compressors, and conveyor belts.
Availability:
Available Now
Microchip’s Compact 1.6T Ethernet PHY
Microchip Technology unveils PM6200 META-DX2L reducing power per port by 35 percent compared to its 56G PAM4 predecessor, META-DX1, the industry’s first terabit-scale PHY solution.
Features:
• Industry’s most compact, 1.6T (terabits per second), low-power PHY (physical layer) solution. • High-density 1.6T bandwidth. • Space-saving footprint • 112G PAM4 SerDes technology • Supports for Ethernet rates from 1 to 800 GbE • Connectivity versatility to maximize design reuse.
Applications:
Handling escalating data center traffic driven by 5G, cloud services and Artificial Intelligence (AI) and Machine Learning (ML) applications.
Availability:
Available Now
MORNSUN Launches Buck-Boost DC DC Converter
MORNSUN has introduced KUB4836EB(F)-10A(-RS), a 1/8 brick non-isolated step-up & step-down DC/DC converter, meeting the customer's demand for voltage and current.
Features:
• Input voltage range: 9 - 60V • Output voltage range: 0 - 60V • Output current range: 0 - 10A • Output voltage and current are both adjustable • High efficiency up to 95% • Input under-voltage protection, output short-circuit protection, over-temperature protection
Applications:
Various applications
Availability:
Available Now
Littelfuse launched the first high-voltage optically-isolated MOSFET gate driver on the market that requires no external power supply, yet can provide fast load turn-on speeds in the order of tens of microseconds.
Features:
• Provides fast turn-on switch speed (typically 40µs) • Enabling designers to create a custom, higher power, optically isolated, DC-only or AC/DC solid-state relay (SSR) with external MOSFET(s). • To increase the switching speed, simply utilize the product’s unique load-biasing, on-board circuit. • The use of load-biasing eliminates the need for an opto-gate driver auxiliary power supply.
Applications:
Demanding fast turn-on application requirements.
Availability:
Available Now
TDK’s MEMS Barometric Pressure Sensor Platform
TDK Corporation launched the InvenSense ICP-20100 platform, a new generation, featurerich barometric pressure sensor.
Features:
• Improves on the industry-leading accuracy, long-term drift, and temperature stability of the SmartPressure™ product family. • Combines a barometric pressure and a temperature sensor in a small 2.0 mm x 2.0 mm x 0.8 mm package. • The device enables flexible user designs with multiple input voltage levels including 1.2V, 1.8V and 3.3V, and a choice of I²C, I3CSM and SPI interfaces.
Applications:
Smartphones, tablets, drones, and smart home appliances.
Availability:
Available Now
Analog Devices Launches LTC3337
Analog Devices has launched the LTC3337, a nanopower primary (non-rechargeable) cell State-of-Health (SoH) monitor with precision coulomb counter, designed to be placed in series with a primary battery with minimal associated series voltage drop.
Features:
• The patented infinite dynamic range coulomb counter tallies all accumulated battery discharge and stores it in an internal register accessible via an I2C interface. Quiescent current consumption is the only 100nA, increasing battery run time. • The LTC3337 integrates additional SoH variable monitoring which measures and reports via I2C: battery voltage, battery impedance, and temperature. • To accommodate a wide range of primary battery inputs, the peak input current limit is pin selectable from 5mA to 100mA.
Applications:
The LTC3337 is ideal for primary cell applications that require only occasional power such as applications in remote locations, electronic door locks, or glass break detectors.
Availability:
Available Now
iW-RainboW-G34S Single Board Computer
iWave has recently introduced the iW-RainboW-G34S, a single board computer based on NXP i.MX 8M Mini applications processor in a PICO-ITX form factor. iWave supports Linux 5.4.70, Ubuntu 20.04, Buildroot 2021.02 and Android 11 on the platform, supported with an extensive BSP support team and continuous updates.
Features:
• i.MX 8M Mini Q/QL/D/DL/S/SL CPU • Up to 4GB LPDDR4 & 128GB eMMC • Multi-OS Platform Support • Wi-Fi 802.11a/b/g/n/ac & BT 5.0 • Wide range of high-speed interfaces • 1000/100/10 Mbps Dual Ethernet • HDMI Output or LVDS Display • MIPI CSI Camera Connector
Applications:
The SBC is designed for connectivity applications with an onboard Wi-Fi & Bluetooth module. Built with an M.2 connector with optional PCIe support, you can plug in an external cellular connectivity modem.
Availability:
The iW-Rainbow-G34S is designed for mass production with iWave assuring product longevity of 10+ years.
Doxel-
A Computer-VisionPowered Predictive Analytics Enabler for Construction Industry TECHNOVATORS
Founded in 2016, Doxel leverages the first computer-vision-powered predictive analytics solution for the construction industry. By integrating into existing digital assets such as Building Information Modeling (BIM), Schedule, and Budget, Doxel empowers decision-makers with timely warnings on potential schedule delays, cost overruns, and quality issues which enables owners and General Contractors to increase control over outcomes and deliver projects with higher predictability. While talking with Nitisha from BISinfotech; Saurabh Ladha, CEO and Co-founder, Doxel.AI explains how the company plans to scale its artificial intelligence platform and expand its already-active Go-To-Market function.
Saurabh Ladha
CEO and Co-founder, Doxel.AI
QKindly explain Doxel and its special offerings.
Doxel is the only solution in the market that can take video footage of a job site, 3D designs, project budget, and project schedule and tell clients exactly how much progress has occurred on their job site today and how much will occur in a week, a month, or a year. Additionally, based on this data, tell clients how delayed their project will be and how much money this delay will cost. This look into the future is unique to Doxel and enables our clients to proactively mitigate schedule delays and cost overruns - critical when a single week delay can result in millions of dollars of losses.
Some Doxel specific capabilities which we don’t see in the market today:
y Doxel can track all trades and systems y Doxel can track any project type y Doxel can track 100% of the site y Doxel can granularly track progress to the 100th decimal y Doxel can turn around critical insights every 72 hours y Doxel predictions are >96% accurate after the second scan
Couple of Industry-specific Notes
y On average (without Doxel) customers receive progress data for their job site every 3-6 weeks y On average (without Doxel) 20% of the progress data is incorrectly reported y Typically building owners and contractors (without Doxel) can only track a fraction of the total project (ex. large customer ~15%)
QKindly share Doxel's technology and benefits of the USPs solution.
This is the part which excites most of us! Given we work at the intersection of Building Information Models, MLbased Computer Vision, big data pipelines & business analytics, we use a large spectrum of tools to build the end-to-end stack. For BIM and CAD, we have built custom plugins on top of standard construction software (like Autodesk NavisWorks). We use managed services from standard cloud providers to power our backend flow (k8s, database, data pipelines, security, etc). Our persistent data is stored at secured cloud storage across multiple services. Spark and Airflow are used for our batch processing data pipelines. For ML,
we use Tensorflow and PyTorch frameworks for writing deep learning models. We also use advanced VSLAM techniques to localize panoramas to enable accurate object detection in 2D. Our frontend is powered by React and uses REST APIs to communicate with backend infrastructure.
QTell us about your recent funding, revenues and user base. Also, tell us about the challenges that you have faced in your journey.
We’ve raised $56.5 to date from well-respected VCs to continue developing our platform, hiring talented staff, and better serve our customers. New customers continue to reach out to us with interest and existing customers' average spend is continually increasing as we’re brought onto more of their projects. We are deeply committed to serving our customers.
The journey actually started with a tremendous focus on customer discovery. We spent time with customers in the industry trying to understand the most important challenges needing to be solved. We first focused on capturing quality data on a job site so owners and general contractors could have visibility into the current job site status. A key learning came from one of our customers which left an imprint on us. This customer said, “telling me what is happening today is good, but come back when you can tell me what is going to happen next.” This was a game-changer for us and started the next three years of product development, customer feedback, iteration, and ultimately large scale customer acquisition - the sole driver of which is our AI-Powered Project Controls platform which can tell owners and general contractors where they are today, objectively, and exactly where they will be in the future in terms of cost and schedule on their project. This look into the future is what allows project teams to improve project performance and mitigate schedule delays and cost overruns, saving millions of dollars per project in the process.
QHow predictability can keep projects on time and on budget?
By knowing what is around the corner on your project, whether that be days, weeks, or months, you can react to it today. This ability to mitigate problems before they occur is what allows our clients to take proactive measures and avoid delays and cost overruns.
QKindly highlight opportunities in India post Series B funding.
We are continuing to build out the India team which is pivotal to Doxel’s success and also exploring client opportunities as they arise.
QKindly share future plans for the Indian market.
Our India head is one of our engineering leaders and foundational to our technological success. The team in India brings deep technological expertise and construction expertise, especially in the discipline of Building Information Modeling (BIM). Doxel will continue to invest in this team which is pivotal to Doxel’s success. Additionally, our fully integrated India/US workforce has a blended culture which ultimately underpins our success.
QKindly highlight an upcoming project.
We have a host of new clients with exciting new projects - stay tuned as we disclose these publicly if and when possible.
Digi-Key Allies with Power Integrations
Digi-Key Electronics has partnered with Power Integrations to offer its InnoSwitch3 IC family with PowiGaN technology as a part of its power focus campaign. This technology delivers high-impact performance for demanding consumer and industrial applications while simultaneously reducing energy consumption. Digi-Key Electronics has joined with Power Integrations to offer the InnoSwitch™3 IC family, as part of its Power Focus campaign. As more applications increase their reliance on smart devices and power automation, demand for higher-efficiency solutions with stronger thermal performance is rising and GaN is quickly replacing silicon. PowiGaN is Power Integrations' internally-developed technology that allows InnoSwitch3 ICs to achieve 95% efficiency across the full load range and up to 100 W in enclosed adapter implementations without heat sinks.
Mouser Electronics has collaborated with the DERBI Foundation to build a component bank at the Mouser Innovation Lab in India.
The partnership will help innovators and early-stage start-ups to build their proofs-of-concept and allow them to overcome the challenges of procuring the components for their designs. DERBI Foundation, a world-class incubation center fuelling entrepreneurship dreams of ambitious start-ups, launched a survey to find out which components and equipment Mouser Innovation Lab users need to help them minimize the high costs, component shortages and procedural delays that can hinder a proof of concept.
The component bank will be stocked with the evaluation modules, test and measurement equipment, capital equipment, and discrete components that the survey respondents requested.
The Mouser component bank will enable innovators to check out equipment as necessary and then return it after use, facilitating a rapid turnaround time from idea to proof of concept.
Rochester Collaborates with ST
Rochester Electronics has partnered with STMicroelectronics to provide a growing range of both active and end-of-life stocked products helping customers with extended product lifecycle management and safety inventory during times of constrained supply, through a broad portfolio of Discrete, Analog and Mixed-Signal ICs, Microcontrollers and Microprocessors. Rochester Electronics is the world’s largest continuous source of semiconductors–100% Authorized by over 70 leading semiconductor manufacturers.
As an original manufacturer stocking distributor, Rochester has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
Mouser & DERBI Foundation Partners
In addition, Mouser is planning a series of Tech Talk sessions for late 2021 to highlight the latest product offerings available from Mouser’s manufacturer partners. The first Tech Talk will occur on September 30, 2021, co-hosted by DERBI Foundation and Analog Devices.
Technical experts from Analog Devices will explore the basics and challenges of precision technology, as well as Analog Devices’ extensive health care product portfolio.
What if the future isn’t something we dream, but something we create?
At Analog Devices, we believe staying ahead of what’s possible means embracing new opportunities to make our company stronger. And now that Maxim Integrated is joining Analog Devices, our collective expertise in power management, advanced sensing, and connectivity will help make what if become what is. See What If: analog.com/Maxim
