High‐performance thermal conductive pad
The LG series high performance, thermal conductive pad designed with extremely high thermal conductivity and fitting performance, which is from the boron nitride powder of the raw material compound, its thermal conductivity in the thermally conductive gap filling materials is unparalleled.
Features & benefits: ● High compressibility, soft and flexible, designed for low‐stress application environment ● Good thermal conductivity ● Electrical insulation ● Meet with the environmental requirements of ROHS and UL ● Natural stickiness Typical applications: ● Laptop ● Communication hardware equipment ● High‐speed hard disk drive equipment ● Automobile engine control mould ● Micro processor, memory chip and graphics processor ● Mobile equipment
CHICPLANT TECH COMPANY LTD.
Thermal silicon pad
Physical properties:
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Thermal conductive silicon pad LC series thermal conductive silicon pad is high‐ performance, thermal conductive gap filling materials, mainly for the transmission interface between the electronic equipment and heat sink or product outer coving. Nice stickiness,flexibility,good compression performance and excellent heat conductivity are designed for HC series, which make the products can discharge gas from the electronic original and heat sink,to achieve fully conforming and obviously cooling effect. Compared to common thermal conductive & insulating materials, HC series has certain nature stickiness which bring great convenience in the product installation processing, not easy to fall off and easy to operate. Features & benefits: ●High reliability & High thermal conductivity ●High compressibility, soft and flexible ●Natural stickiness, no extra surface frontal adhesives ● Meet with the environmental requirements of ROHS and UL Typical applications: ●Communication equipment ●Mobile equipment ●LED Light ●Video equipment ●Switching power supply ●Networking equipment ●Back light model ●Household appliances ●Medical equipment ●PC server/workstations Application modes: ●The filling between PCB and heat sink ●The filling between IC and heat sink or product outer coving ●The filling between IC and similar heatsink cooling materials
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CHICPLANT TECH COMPANY LTD.
Thermal silicon pad
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CHICPLANT TECH COMPANY LTD.
Thermal silicon pad Physical properties:
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Thermal silicon pad with 3M adhesive
The LCB series is adhesive thermal conductive silicon pad, mainly for the thermal conductivity between the heating device and the heat sink or the product outer covings without fastening devices. Features & benefits: ●Ultra‐stickiness ●Without fastening devices ●Electrically isolating ● Meet with the environmental requirements of ROHS and UL Typical applications: ●LED light ●Power conversion equipment ●Between the semiconductor or magnetic body and heat sink ●HID ballast ●Household appliances Physical properties:
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CHICPLANT TECH COMPANY LTD.
Thermal silicon pad
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Thermal silicon pad coated with fiberglass
The LCP series thermal conductive silicon pad coated with fiberglass is an anti‐piercing & anti‐tearing product with a high shear strength,which consisted by the low modulus polymer attached to the glass fiber substrate,so the product can be used as a filler between the machine's contact interface. Features & benefits: ●Low hardness with ultra‐conforming ●Enhanced shear strength, piercing and tearing resistance ●Electrically isolating ● Meet with the environmental requirements of ROHS and UL Typical applications: ●Communications industry /AC/DC power ●Power conversion equipment ●The framework, chassis or other area need to transfer heat ●HID ballast ●Auto control unit (ECU) ●Uninterruptible power supply (UPS) Physical properties:
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CHICPLANT TECH COMPANY LTD.
Thermal silicon pad
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Fiberglass reinforced thermal silicon pad
The LCG series fiberglass reinforced thermal silicon pad is an anti‐piercing & anti‐tearing product with a high shear strength , which consisted by the low modulus polymer attached to the glass fiber substrate, so the product can be used as a filler between the machine's contact interface.
Features & benefits: ●Low hardness with ultra‐conforming ●Enhanced shear strength, piercing and tearing resistance ●Electrically isolating ● Meet with the environmental requirements of ROHS and UL Typical applications: ●Communications industry /AC/DC power ●Power conversion equipment ●The framework, chassis or other area need to transfer heat ●HID ballast ●Auto control unit (ECU) ●Uninterruptible power supply (UPS)
CHICPLANT TECH COMPANY LTD.
Thermal silicon pad
Physical properties:
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Fiberglass reinforced thermal acrylic adhesive LCT series is a kind of thermal acrylic adhesive applied in the bond between heat sink and other power consumption semiconductor, the adhesive is in the nature of strong bonding strength and low thermal resistance, which can replace thermal silicon grease and mechanical fixation effectively.
Features & benefits: ●High acrylic adhesive tape for pressure sensitive of various surfaces ●High‐performance, thermal conductive acrylic tape Typical applications: ●Make the heat sink fixed to the encapsulated chip ●Make the radiator fixed to the power supply circuit board or the vehicle control circuit board ●Efficient thermal conductive acrylic adhesive tape ●Replace the fixed mode of hot melt adhesive, screw and buckle Physical properties:
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CHICPLANT TECH COMPANY LTD.
Thermal acrylic tape
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Thermal graphite sheet
The thermal graphite sheet is a kind of totally newthermal & radiating material,heat conducting evenly along vertical & horizontal direction, shielding with heat and component while improving the performance of the consumer electronic products. Key property: ●Ultra‐high thermal conductive performance / easy to operate ●Low thermal resistance ●Light weight Application: ●IC ; CPU; MOS; LED; Heat sink; LCD‐TV; Laptop; Communication equipment; Wireless switch; DVD; Hand‐held device; Camera/digital camera; Mobile phone Physical properties:
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CHICPLANT TECH COMPANY LTD.
Thermal graphite sheet
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High‐performance thermal graphite film LGS800 high‐performance thermal graphite film is a thermal interface material which is very thin, synthetically made, and has high thermal conductivity, and is made from a higly oriented graphite polymer film.
It is ideal for providing thermal management/heat‐sinking in limited spaces or to provide supplemental heat‐sinking in addition to conventional means. This material is flexible and can be cut into customizable shapes. Applications: Cellular phone, DVC,PC and peripherals, pickup ,Semiconductor manufacturing equipment, MID table PC, Game Console, Optical communications equipment Physical properties:
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CHICPLANT TECH COMPANY LTD.
Thermal graphite sheet
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LV series thermal silicon pad
The LV series silicon pad is cloth production which made by special process with the base material‐‐ silicon gel and fiberglass, because of its nice thermal conductivity,insulation and convenient assembly,it's widely used in electronic appliances industry. According to the size of the fever interface and the height of the clearance select different thickness of the thermal conductive silicon tape cut zhe pad into different sizes, and put the silicon tap in the gap between the fever interface and their components to play as an heat‐conducting medium. Key property: ●Heat resistance, insulation, fire prevention, shock resistance . Typical application: ●Heating power components, Automobile electronic heating module, Power module, Household appliances,Computer and peripherals, the filling and any place need heat dissipation between the heating element and the bottom plate. Physical properties:
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CHICPLANT TECH COMPANY LTD.
Silicon insulation
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Thermal silicon cap set
silicon‐based thermally conductive cap set
LU series silicon‐based thermally conductive cap set is cap shape product designed with fiberglass & silicon as basic material and made through special processing. Because of its excellent thermal conductivity, insulation, shock resistance and easy installation, the product is widely used in fever transistor, diode and audion, made it can installed directly on the heating tube while Using the product. The SH series suggested to be used for low‐stress application environment. Key property: ●Heat resistance, insulation, fire prevention, environmental protection and compression resistance Typical application:
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CHICPLANT TECH COMPANY LTD.
Silicon insulation
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Thermal silicon tube
LS series silicon‐based, thermally conductive tube is tube shape product designed with fiberglass & silicon as basic material and made through special processing. Because of its excellent thermal conductivity, insulation, shock resistance and easy installation, the product is widely used in fever transistor, diode and audion, made it can installed directly on theheating tube while Using the product.The LS series is suggested to used for low‐stress application environment. Typical application: ●Home appliances, Machine (Heat resistance, insulation, fire prevention, etc.), Electronic Components Instructions: ●LS‐100A‐‐‐general silicon tube ●LS‐200A‐‐‐high tension silicon tube ●LS‐300A‐‐‐FDA silicon tube ●LS‐400A‐‐‐silicon‐based, thermally conductive tubes ●LS‐500A‐‐‐ fire prevention silicon tube Notes: The most thin wall thickness is 0.5mm currently, Specific shape and color could be provided according to your requirements.
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CHICPLANT TECH COMPANY LTD.
Silicon insulation
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TO series thermal silicon pad
The TO series silicon pad is cloth production which made by special process with the base material‐‐ silicon gel and fiberglass,because of its nice thermal conductivity,insulation and convenient assembly,it's widely used in electronic appliances industry. According to the size of the fever interface and the height of the clearance select different thickness of the thermal conductive silicon tape cut the pad into different sizes, and put the silicon tap in the gap between the fever interface and their components to play as an heat‐conducting medium. Key property: ●Heat resistance, insulation, fire prevention, shock resistance . Typical application: ●Heating power components, Automobile electronic heating module, Power module,Household appliances,Computer and peripherals, the filling and any place need heat dissipation between the heating element and the bottom plate.
CHICPLANT TECH COMPANY LTD.
Silicon insulation
Physical properties:
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K‐10 silicon pad
Sli‐Pad K10 silicon pad,which is high‐performance,elastomer insulating material made with the special mylar,because of its good thermal conductivity, insulation and convenient assembly,it's widely used in electronic appliances industry.According to the size of the fever interface and the height of the clearance select different thickness of the thermal conductive silicon tape cut zhe pad into different sizes, and put the silicon tap in the gap between the fever interface and their components to play as an heat‐conducting medium. Key property: ●Heat emission, insulation , fire prevention, shock resistance. Features & benefits: 1 Thermal impedance: 0.41°C‐in2/w(50psi) 2 Breakdown voltage can reach at 7000V 3 Designed for the substitutes of theceramic insulators
CHICPLANT TECH COMPANY LTD.
Silicon insulation
Typical application: ●Heating power components; Automobile electronic heating module; Power module; Household appliances; Motor control;Power semiconductors; Military project Physical properties:
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TO series Bushing Insulator
Physical properties:
CHICPLANT TECH COMPANY LTD.
Silicon insulation
Model number:
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BC phase change interface material
The material is heat reinforced polymer, designed to meet the thermal conductivity and reliability demand for the thermal conductivity of high application terminal. In addition, the heat sink’s performance benefits a lot from the low heat resistance. And improve the microprocessor, DC‐DC converter of memory module and the reliability of power module. The phase change characteristics:the material is solid in room temperature and the installation is completely convenient,used between heat sink and devices. The material can be softened and flowing when the products reach phase‐change temperature to fill the devices'tiny irregular contact surface.Thus,the material has the ability to fill the gap between the devices and heat sink completely,make the phase change better than non‐current elastomers or thermal graphite pad and get the performance of thermal conductive silicon grease.
CHICPLANT TECH COMPANY LTD.
Phase change material
The material is nonconductive,however,as the material has endured the phase change at high temperature, may make the metal get to the metal, so the phase change interface material can not be used as electrical insulating material. Features & benefits: ●Low heat resistance und low stress ●Flowing but not silicone oil ●Low volatility—less than 1% ●Self‐adhesive , easy to use ●No radiator preheating Typical applications: ●High frequency microprocessors ●Chipset ●Graphics chips & Amplifiers chip ●Cache memory chips ●Bridge rectifiers
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CHICPLANT TECH COMPANY LTD.
Thermal silicon pad Physical properties:
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Thermal conductive silicon adhesive
LD120 has good electric insulativity,thermal resistance,dielectric properties,anti‐chemical corrosion etc.,it is widely used for the insulationarcing, moistureproofof heatsink, TV, FBT component and household appliances. Features: 1. fast curing 2. proper adhesion, to splice the heatsink and the component, and it is removable when it is in need of repair 3. Eco‐friendly and thermostable How to use: The gel is a single component silicon sealant in a room temperature, insulate and non‐poisonous, solvent‐free, pollution‐free and of ageing resistance, the surface tack free time is 30minutes( in a 25 degree temperature, relative humidity ≥60% ), to spread the gel on the desired part of the component directly. How to store: To place it at a dry place and protect it from sun in a 30 degree temperature for 9 months.
CHICPLANT TECH COMPANY LTD.
Thermal grease
Packaging: 100ml/pcs, 100pcs/box LD120 Physical properties (after curing):
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Thermal grease
LE series thermal grease has good thermal conductive performance and reliability, which is extremly suitable for the heat transfer of the CPU, GPU and other heating power components. How to use： As LE series has low adhesion, it can fully contact with the surface, which result in very low interface thermal resistance and high thermal conductivity.Please apply the grease by the screen printing, the 60‐80 Me SH nylon mesh and 70‐80 hardness rubber scraper are recommended, leave 45 degrees between the scraper and the apply surface. Typical applications: ● between Semiconductor and heatsink ● between CPU and heatsink ● between power resistor and base ● thermoelectric cooler ● the surface of temperature regulator and assembly ● high‐power LED lighting Physical properties：
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CHICPLANT TECH COMPANY LTD.
Thermal grease
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Silicon fever pad
1. Power density is 1 to 5w/Cm'.The power density changes strikingly as the temperature control methods are different, please contact with us when you choose the products. 2. Hang the electric heater on the 20Cm' still air of the surface temperature. 3. As the using environment, material and shape of the heating objects are different, the electric heater will happened to change.
CHICPLANT TECH COMPANY LTD.
Silicon fever pad
Use precautions: 1.Because of no waterproof construction, please do not get wet. 2. Please do not use the controller and the electric heater separately. 3. Please do not use in the flammable gas, or applied in low flash point objects.
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Oil Bucket Heater
Oil bucket heater makes the liquid, concretion take out from the oil bucket easily bycheating, such as the adhesion, oil, pitch, paint, paraffins and kinds of the resin, the viscosity falls equably during the heating to reduce the powe of the pump. Features: The senser is fixed on the surface of the heater, to control the temperature directly by the thermoregulation Specifications: 200L oil bucket heater 20L oil bucket heater 200L oil bucket heater Size: 250×1740 Size: 200×860 Volume: 200V 2000W Volume: 200V 800W Thermoregulation: 30~150°C EGO
Size: 125×1740 Volume: 200V 1000W
Weight: 0.5kg
Weight:
Weight:
0.4kg
CHICPLANT TECH COMPANY LTD.
Silicon fever pad
0.3kg
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LTD 315 silicon thermal potting glue
Thermal conductive silicon encapsulant is silicon encapsulant designed with a low viscosity and flame retardancy through bi‐component and additional moulding processing,which can cure by room temperature or heating,the higher the temperature, the curing faster.The product don't produce any by‐products in the curing reaction, and can be used in the PC (Poly‐carbonate),PP,ABS,PVC materials and metal surfaces,it is suitable for thermal conductivity,insulation waterproof and flame retardance of electronic accessories,the flame retardancy can reach UL94‐V0,and meet with european Union ROHS completely. Features & benefits: ●Nice thermal conductivity and flame retardancy ●Strong adhesive force ●Heat resistance, humidity resistance, cold resistance ●Low viscosity and nice levelling property ●Insulation, cold resistance, shock resistance, electric corona resistance,electric leakage resistance and the performance of chemical mediator resistance. Typical applications: ● Deep potting of Power Supply Module, electronic components, especially for the potting of HID power supply module. ● The potting of LED outdoors display screen ● TV,CRT power supply, Communication equipment and other electric components' mechanical sealing & adhesion or adhesive fixed. ● Other products'(mental, plastics, glass, etc.) adhesion & sealing with flame retardant requirement.
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CHICPLANT TECH COMPANY LTD.
Thermal conductive silicon encapsulant
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CHICPLANT TECH COMPANY LTD.
Thermal conductive silicon encapsulant Technical properties before & after curing:
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LTD 312 silicon thermal potting glue
potting glue Thermal conductive silicon encapsulant is silicon encapsulant designed with a low viscosity and flame retardancy through bi‐component and additional moulding processing, which can cure by room temperature or heating,the higher the temperature, the curing faster. The product don ’t produce any by‐products in the curing reaction, and can be used in the PC (Poly‐ carbonate),PP,ABS,PVC materials and metal surfaces,it is suitable for thermal conductivity, insulation waterproof and flame retardance of electronic accessories,the flame retardancy can reach UL94‐V0, and meet with European Union ROHS completely. Features & benefits: ●Nice thermal conductivity and flame retardancy ●Strong adhesive force ●Heat resistance, humidity resistance, cold resistance ●Low viscosity and nice levelling property ●Insulation, cold resistance, shock resistance, electric corona resistance, electric leakage resistance and the performance of chemical mediator resistance Typical applications: ● Deep potting of Power Supply Module, electronic components, especially for the potting of HID power supply module. ● The potting of LED outdoors display screen ● TV,CRT power supply, Communication equipment and other electric components' mechanical sealing & adhesion or adhesive fixed. ●Other products’ (mental, plastics, glass, etc.) adhesion & sealing with flame retardant requirement.
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CHICPLANT TECH COMPANY LTD.
Thermal conductive silicon encapsulant
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CHICPLANT TECH COMPANY LTD.
Thermal conductive silicon encapsulant Technical properties before & after curing:
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