Moisture Sensitivity Of Plastic Packages Of Ic Devices
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Microelectronics and microsystems packaging technology.- Packaging reliability.- Moisture related reliability test and specifications.- Moisture absorption, desorption and transport.- Characterization of moisture behaviors.- Hygroscopic swelling characterization.- Vapor pressure evolution.- Hygro-thermal mechanics.- Caviation instability.- Effect of moisture on material properties.- Electrochemical metal migration and corrosion.- Methodology for accelerated moisture sensitivity test.- Applications. EAN/ISBN : 9781441957191 Publisher(s): Springer, Berlin, Springer Science & Business Media Discussed keywords: Integrierte Schaltung, Mikroelektronik, Optoelektronik Format: ePub/PDF Author(s): Fan, X. J. - Suhir, Ephraim
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