Thin Wafer Processing and Dicing Equipment Market Forecast 2016 - 2024

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Thin Wafer Processing and Dicing Equipment Market to Partake Signi몭cant Development during 2024 By Transparency Market Research Published February 1, 2022

Transparency Market Research (TMR) estimates that the global thin wafer processing and dicing equipment market has a highly consolidative landscape. Disco Corp. accounted for largest share of 56.4% in 2015 and likely to be dominant in the coming years. This is creating monopoly in the thin wafer processing and dicing equipment market in terms of competitive presence. The other key players such as EV Group, Plasma-Therm LLC, Lam Research Corp, Advanced Dicing Technologies, and Tokyo Electron Ltd. are operating in the global thin wafer processing and dicing equipment market. According to TMR, the global thin wafer processing and dicing equipment market is likely to expand at a CAGR of 6.80% over the forecast period to attain a value of US$692.5 mn by 2024-end. The market had acquired a value of US$388.9 mn in 2015. Get PDF brochure for Industrial Insights and business Intelligence @ https://www.transparencymarketresearch.com/sample/sample.php? 몭ag=B&rep_id=15611 Based on the type, the blade-dicing segment dominated the global thin wafer processing and dicing equipment market and is expected to remain dominant by the end of the forecast period. However, the laser-dicing segment is expected to expand with the fastest CAGR over the predicted years. This growth of the market

is attributable to the demand for the high-speed dicing coupled with superior breakage strength. Based on the region, Asia Paci몭c accounted for the leading share of 64.2% in 2015 and is anticipated to remain dominant over the forecast period. This growth is due to growing semiconductor manufacturing along with growing industrialization in the region is boosting its adoption. However, North America held the second largest share in the thin wafer processing and dicing equipment market. Highest Applications in RFID to Propel Market Growth The thin wafer processing and dicing equipment market is gaining traction due to the incorporation of microelectronics across consumer electronics. The demand for technologies such as power devices and MEMS devices are boosting demand for the thin wafers. Additionally, this demand is boosting demand for better manufacturing processes, which is an important phase in the ultra-thin wafer manufacturing processes. Additionally, the thin wafer processing and dicing devices have robust applications among radio-frequency identi몭cation devices (RFID) for wafer processing and dicing equipment. Some of the traditional methods are trying to lower the size of the wafer to make it suitable for RFID applications. As RFID requires the thin wafer as thin as 50 to 120 micrometers, the thin wafer processing meets this demand. Growing applications of RFID across identity solutions and consumer electronics is resulting in extensive the growth of the global thin wafer processing and dicing equipment market. Furthermore, RFID has widened its application across smart cards and other identi몭cation tags. These applications demand for a smooth surface with the thinned wafer, which is encouraging the use of the thin wafer processing and dicing equipment market. Investment for Improvement in Wafers to Offer Lucrative Opportunities Further, growing advancements and lowering size of the wafers is boosting its application across chemical mechanical polishing (CMP). The wafers are increasingly integrated into processing mainly to the high-quality 몭at surface of the wafer. This is propelling growth of the global thin wafer processing and dicing equipment market. Nonetheless, growing investments for improvement in deposition systems and multiple designs from customers of numerous sectors is offering lucrative opportunities for growth of the thin wafer processing and dicing

equipment market. Manufacture of the technologies based on radio frequency (RF) devices supporting to 4G and 5G wireless infrastructure is expected to offer opportunities for growth over the forecast period. Request for Discount – https://www.transparencymarketresearch.com/sample/sample.php? 몭ag=D&rep_id=15611 This information is encompassed in the report by TMR, titled, “Thin Wafer Processing and Dicing Equipment Market (Application – Logic and Memory, Micro Electro Mechanical Systems (MEMS), Power Device, Radio Frequency Identi몭cation (RFID), and CMOS Image Sensor; Wafer Thickness – 750 micrometer, 120 micrometer, and 50 micrometer; Dicing Technology – Blade Dicing, Laser Dicing, and Plasma Dicing) – Global Industry Analysis, Trend, Size, Share and Forecast 2016 – 2024.” For the study, the thin wafer processing and dicing equipment market has been segmented as follows: Application Logic and Memory MEMS (Micro Electro Mechanical Systems) Power Device RFID (Radio Frequency Identi몭cation) CMOS Image Sensor Dicing Technology Blade Dicing Laser Dicing Plasma Dicing Wafer Thickness 750 μm 120 μm 50 μm Purchase our Premium Research Report at:

https://www.transparencymarketresearch.com/checkout.php? rep_id=15611&ltype=S TMR Latest News Publication: Active Electronic Components Market – Advancements in the electronics industry have boded well for the growth of the global active electronic components market. Manufacturers of electronic devices follow meticulous approaches to develop archetypes and 3D models for the end products. This has helped these entities ensuring seamless control over the manufacturing process, while also fostering quality, accuracy, and resilience in manufacturing. Several manufacturers have deployed dedicated teams for product designing and development, enabling them to gather comprehensive insights about the entire manufacturing process. Targeting Pods Market – Targeting pods are increasingly being integrated with combat aircrafts by militaries around the world. Advances in optical targeting pods (OTPs) have paved way to the deployment of precision targeting system. Particularly, the demand for laser-guided weapons is expected to rise. Manufacturers of defense aircrafts and aerospace companies are collaborating on electro-optical sighting for targeting daytime and infrared-sighting during night time. OTPs equipped with features notably laser designators, electro-optics, and infrared radars. Apart from being deployed in aircrafts, targeting pods are also deployed in unmanned aerial vehicles. About Us Transparency Market Research is a global market intelligence company, providing global business information reports and services. Our exclusive blend of quantitative forecasting and trends analysis provides forward-looking insight for thousands of decision makers. Our experienced team of Analysts, Researchers, and Consultants, use proprietary data sources and various tools and techniques to gather, and analyse information. Now avail 몭exible Research Subscriptions, and access Research multi-format through downloadable databooks, infographics, charts, interactive playbook for data visualization and full reports through MarketNgage, the uni몭ed market intelligence engine. Sign Up for a 7 day free trial! Contact

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In this article: Latest Industry News, Thin Wafer Processing and Dicing Equipment Market Analysis, Thin Wafer Processing and Dicing Equipment Market Demands, Thin Wafer Processing and Dicing Equipment Market Forecasts , Thin Wafer Processing and Dicing Equipment Market Growth, Thin Wafer Processing and Dicing Equipment Market Key Players , Thin Wafer Processing and Dicing Equipment Market Opportunities, Thin Wafer Processing and Dicing Equipment Market Overview, Thin Wafer Processing and Dicing Equipment Market Report, Thin Wafer Processing and Dicing Equipment Market Research, Thin Wafer Processing and Dicing Equipment Market Share, Thin Wafer Processing and Dicing Equipment Market Size, Thin Wafer Processing and Dicing Equipment Market Trends

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