Receptions

2022 ECTC/ITHERM DIVERSITY & CAREER GROWTH PANEL & RECEPTION Solving Diversification Challenges and Workforce Retention Issues

Wednesday, June 1, 2022 6:30 p.m. – 7:30 p.m. Silver Pearl 3 Chairs: Kim Yess, Brewer Science/ECTC and Christina Amon, University of Toronto/ITherm

Moderator: Francoise von Trapp, 3D InCites Bina Hallman – VP IBM System Client Advocacy and Head of D&I System Business Antoinette Hamilton – Head of DEI at Lam Research Najwa Khazal – General Manager, Service Technology Centres Americas, Edwards KT Moore – VP Corporate Marketing at Cadence

2022 PLENARY SESSION Digital Transformation – The Cornerstone of Future Semiconductor and Advanced Packaging Growth

Wednesday, June 1, 2022 7:45 p.m. – 9:15 p.m. Silver Pearl 1 & 2 Chair: Rozalia Beica, AT&S Carolyn Evans – Chief Economist, Intel (US) Doug Yu – VP Pathfinding and System Integration – TSMC (TW) Jean Christophe Eloy – CEO Yole Developpement (FR) Mike Rosa – CMO, SVP Strategy, Onto Innovation (US) Seoung Wook Yoon – VP Corporate R&D, Samsung (KR)Director Mentalization. Atotech

CONTINUING EDUCATION UNITS

The IEEE Electronics Packaging Society (EPS) has been authorized to offer Continuing Education Units (CEUs) by the International Association for Continuing Education and Training (IACET) for all Professional Development Courses that will be presented at the 72nd ECTC. CEUs are recognized by employers for continuing professional development as a formal measure of participation and attendance in “non-credit” selfstudy courses, tutorials, symposia, and workshops. Complete details will be available at the conference. All costs associated with ECTC Professional Development Course CEUs will be underwritten by the conference, i.e., there are no additional costs for Professional Development Course attendees to obtain CEU credit.

2022 IEEE EPS SEMINAR Interconnect Technologies for Chiplets

Thursday, June 2, 2022 8:00 p.m. – 9:30 p.m. Silver Pearl 1 & 2 Chairs: Yasumitzu Orii, Nagase, Japan and Shigenori Aoki, Lintec Ravi Mahajan – Intel: HI Interconnects for today and tomorrow Akihiro Horibe – IBM Research Tokyo: Direct Bonded Heterogeneous Integration DBHi Si Bridge Yu-Hua Chen – Unimicron: The Challenges of Advanced Substrate for Heterogeneous Integration Shin-Puu Jeng – TSMC: Heterogeneous Integration Approaches in Foundry Yu-Po Wang – SPIL: Trend and Solution for Memory Integrated Advanced Packages Hideyuki Nasu – Furukawa Electric: HighDensity Optical Transceivers and Pluggable Electrical Interfaces for Co-Packaged Optics

ECTC STUDENT RECEPTION

Tuesday, May 31, 2022 • 5:00 p.m. - 6:00 p.m. Pacific Jewel Foyer Hosted by Texas Instruments, Inc.

Students, have you ever wondered what career opportunities exist at Texas Instruments and in the industry, and how you could use your technical skills and innovative talent? If so, you are invited to attend the ECTC Student Reception, where you will have the opportunity to talk to industry professionals about what helped them succeed in their first job search and reach their current positions. During this reception, you can enjoy good food while networking with industry leaders and achievers. Don’t miss your opportunity to interact with people who you might not have the chance to meet otherwise! You will also be able to submit your resumes to our sponsoring partners.

GENERAL CHAIR’S SPEAKERS RECEPTION

Tuesday, May 31, 2022 • 6:00 p.m. - 7:00 p.m. Pacific Jewel B Invited session chairs and speakers are requested to attend the reception.

EXHIBIT HALL TECHNOLOGY CORNER RECEPTION

Wednesday, June 1, 2022 • 5:30 p.m. - 6:30 p.m. Eventide Pavilion All attendees and guests are invited.

72nd ECTC GALA RECEPTION

Thursday, June 2, 2022 • 6:30 p.m. OUTSIDE: Eventide Gardens (Exit doors at Seascape Foyer) All badged attendees are invited.