Semiconductor and IC Packaging Materials Market – Global Industry Analysis, Size, Share, Growth, Trends and Forecast, 2013 – 2019
Eddy Tancredi
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Transparency Market Research Reports incorporated a definite business overview and investigation inclines on "Semiconductor & IC Packaging Materials Market". This report likewise incorporates more illumination about fundamental review of the business including definitions, requisitions and worldwide business sector industry structure. Semiconductor and IC Packaging materials are used to guard the electronics components like IC’s and semiconductors from corrosion and external impact. These materials are used along with the several advanced packaging technologies for the packaging of IC’s and semiconductors. The packaging material performs the final stage of semiconductor device fabrication by placing the boards or dies inside the protective package to provide the pins or connectors for connection. Browse Full Report with TOC: http://www.transparencymarketresearch.com/semiconductor-ic-packagingmaterials.html In the span of four years i.e. from 2010 to 2014, product development was the main growth approach adopted by the IC’s and semiconductor packaging materials industry. In the first six months of 2013, the Henkel AG has completed four products. Further, the company was acquired by Hitachi Chemical Co. Ltd., and the expansion has been done by Henkel AG & Company and Hitachi Chemical Co. Ltd. collectively. Atotech Deutschland and Sumitomo Chemical Co. Ltd. are the further key participants in the development activities during this period. The other active players in market development of IC’s and semiconductor packaging materials are Indium Corp. and Shinko Electric Industries Co. Ltd.
Some of the factors driving the growth of semiconductor & IC packaging materials market include increase in the research and development efforts to make the electronic packaging materials highly resourceful, the enormous demand from the electronic component companies due to amplified population that finds electronic packaging materials useful in a myriad of applications. The materials are well perceived in various dominant end-user markets in the last few decades, and are expected to be used for diverse applications in the future.The semiconductor & IC packaging materials market is segmented on the basis of its types which include solder balls, organic substrates, leadframes, bonding wires, encapsulation resins, die attach materials, ceramic packages, thermal interface materials and others (mold compounds). These materials are produced with numerous types of packaging technologies which includes SP, power QFN, DFN and GA. Organic substrate segment contributes the most in the global market and is extensively used as foundation materials for the packaging of Integrated Circuits (IC’s) and semiconductors. The bonding wire segment mostly of gold has been generally used as packaging materials, but recently there has been a change towards copper bonding wires. Encapsulation resin segment is comparatively new types of packaging materials for IC’s and semiconductors and due to this the segment is expected to grow aggressively in the next five years. In addition, the market could be segmented on the basis of geography which includes North America, Europe, Asia-Pacific and RoW. Some of the key players that are dominating this market are Alent PLC, Kyocera Chemical Co. Ltd., Hitachi Chemical Co. Ltd., LG Chemical Ltd., Basf SE, Sumitomo
Chemical Co. Ltd., Henkel Ag & Company, Mitsui High-Tec Inc., Tanaka Holdings Co. Ltd. and Toray Industries Corporation among others. This research report analyzes this market depending on its market segments, major geographies, and current market trends. Geographies analyzed under this research report include
North America
Asia Pacific
Europe
Rest of the World
This report provides comprehensive analysis of
Market growth drivers
Factors limiting market growth
Current market trends
Market structure
Market projections for upcoming years
This report is a complete study of current trends in the market, industry growth drivers, and restraints. It provides market projections for the coming years. It includes analysis of recent developments in technology, Porter’s five force model analysis and detailed profiles of top industry players. The report also includes a review of micro and macro factors essential for the existing market players and new entrants along with detailed value chain analysis. Reasons for Buying this Report
This report provides pin-point analysis for changing competitive dynamics
It provides a forward looking perspective on different factors driving or restraining market growth
It provides a technological growth map over time to understand the industry growth rate
It provides a seven-year forecast assessed on the basis of how the market is predicted to grow
It helps in understanding the key product segments and their future
It provides pin point analysis of changing competition dynamics and keeps you ahead of competitors
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