Featured Products Supplement: February 2016 by EEWeb Magazines

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New Radiation Hardened Multiplexers

Intersil Corporation introduces the ISL71840SEH and ISL71841SEH. The devices are radiation hardened multiplexers that offer best-inclass electrostatic discharge (ESD) protection. The ISL71840SEH and ISL71841SEH are the industry’s highest signal chain accuracy and timing performance. The ISL71840SEH 30V 16-channel multiplexer is a drop-in replacement for Intersil’s widely adopted HS9-1840ARH, which has been aboard nearly every satellite and space exploration mission, including NASA’s recent Orion spacecraft flight test ...Read More

World of Sensors Design Board

The World of Sensors (WoS) is a design board develop for products that may require several types of sensing solutions within the same design. It is a complete and easy to use development platform for Zilog’s series of Mini-Z™ stamp modules and provides customers with simple-to-use platform to develop prototypes and projects incorporating multiple sensors...Read More

20 A Smart 3-Phase Motor Drive Hybrid

The MSK 4323 is a 20 A, 100 V, MOSFET smart high temperature three-phase motor drive hybrid. The output switches of the device are power MOSFETs with intrinsic fast-recovery diodes for the free-wheeling currents of motor drives. This high temp smart power motor drive module is compatible with 5V CMOS or TTL logic levels. The internal circuitry prevents simultaneous turn-on of the in-line half bridge transistors with a built-in 2μS deadtime to prevent shoot-through...Read More

Cryogenic Temperature Resistant Epoxy

The EP29LPSP is a two-component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. It is serviceable from 275°F to 4K, the system for bonding, sealing, coating, potting and casting is NASA low outgassing approved...Read More

Multi-Crystalline Photovoltaic Cell

The D6P is a silicon-based multi-crystalline photovoltaic cell featuring a very low temperature coefficient. The cell has an efficiency of up to 19% in a dynamic optimized setting system. The device measures 156 mm x 156 mm with a 180 µm to 200 µm wafer thickness...Read More

SMBus PWM Fan Speed Controller

The TC665 is an SMBus PWM fan speed controller with fan fault detection intended for use with brushless DC motors. This device permits temperature proportional speed control and therefore accomplishes lower acoustic fan noise and longer fan life. The TC665 reads the voltage provided by an external ther-mistor (or voltage output temperature sensor) and adjust sa 30% to 100% PWM duty cycle output to the fan with respect to the input temperature voltage...Read More

Multiple Function Sensor Development Tool

The SENSOR-PUCK (634-SENSOR-PUCK) is a development tool developed by Silicon Labs featuring sensor demonstration application the runs from internal memory on the Gecko microcontroller. The product also offers Silicon Lab’s advantages on battery-powered applications, with all of its key components operating low power consumptions...Read More

Dual Unbuffered Inverter

The 74HC2GU04 is a dual unbuffered inverter specifically designed to save up to 85% board space. The device is specified from ‑40 °C to +85 °C and ‑40 °C to +125 °C. This high-speed CMOS device is available in TSOP5 and TSSOP5 packages...Read More

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DC-DC Telecom and Networking Solutions

ON Semiconductor provides a wide range of DC-DC solutions for telecom and networking applications. Anyone charged with architecting their system power bussing should be aware of these solutions, and for more information refer to the TND347-D application note from ON Semiconductor...Read More

ATDR Class CC Fuse

The STR4A100 series are off-line PWM controllers with integrated sensing MOSFET intended for switching power supplies. The device features rent-mode type PWM control, random switching function, slope compensation function and leading edge blanking function...Read More

Single-Stage LED Driver IC

Power Integrations rolled out its LYTSwitch™-5 single-stage LED driver IC family. LYTSwitch-5 devices combine PFC and constant-current output, and support multiple common LED driver topologies. Solid-state lighting applications have highly variable driver requirements, and power engineers are often challenged to develop optimized designs quickly in response to requests from lighting designers ...Read More

R-78W RECOM Regulator

This video provides a Digi-Key demonstration of how to use RECOM’s R-78w wire leaded regulator in LED lighting applications and also explains its features, benefits, and intended applications. RECOM’s R-78w wire leaded DC regulator offers designers a way to quickly and easily source multiple voltages. R-78w is available in 32v input and 5, 9, and 12v output. It’s ability to power both a lighting and cooling source using only power source makes it a useful component for LED lighting applications...Video Link

Qi-Certified Medium Power Receiver Reference

ROHM designs the worldâ&#x20AC;&#x2122;s first Qi-certified medium power receiver reference design. The cutting-edge reference design allows ROHM to expand into the wireless charging segment. This BD57015GWL receiver, the first in the world certified to be compliant with the new Qi v1.2 standard for medium power, was showcased last week in the WPC booth during CES 2016...Read More

Digital TV Demodulator for ATSC

MN88436 is demodulator LSI for terrestrial and cable broadcasts. It supports the broadcast specifications of North America, performing demodulation and error correction and outputting a transport stream (TS). Digital terrestrial broadcasts is compliant with ATSC (Advanced Televisions Systems Committee) specifications, and digital cable broadcasts is compliant with open cable specifications....Read More

SuperSpeed USB 3.0 Hub Controllers

Demand for power-efficient, high-speed data transfer is driven by a host of personal electronics and enterprise applications, from notebooks, desktops, and servers to HDTVs, set top boxes, and gaming consoles as well as automotive infotainment. For these applications, USB 3.0 can be a good solution. Capable of transferring 5 Gbps over a 3-foot cable, it provides 10x data transfer compared to USB 2.0, and uses one-third the power that USB 2.0 would use to transfer the same amount of information ...Read More

Secure Low Power Wireless IPv6 Module

The ZWIR4512 enables secure low-power wireless IPv6 communication for sensors and small devices. ZMDI provides a user-programmable, royalty-free 6LoWPAN stack with mesh routing capability with the ZWIR4512. 6LoWPAN is an Internet Engineering Task Force (IETF) standard to build wireless, low-power IP-based sensor and device networks. These networks can easily be integrated into existing information technology infrastructure or can operate autonomously...Read More

MYLINK

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ZMDI

ZSSC1750

System Basis Chip

“Using a shunt, this device is capable of measuring charging and discharging battery current with a huge dynamic range from milliamps to thousands of amps.”

In today’s EEWeb Tech Lab, we will be reviewing ZSSC1750 Data Acquisition System Basis Chip (SBC) from ZMDI (now IDT). A system basis chip is a system on a chip that integrates multiple ECU functions into a single die and the ZSSC1750 does this by integrating a high voltage circuit, sigma delta ADCs, analog input stage, digital filtering, and a LIN transceiver into one IC. It is designed for use with any microcontroller with an SPI interface.

KEY BENEFITS

With the ADCs, the ZSSC1750 can measure

» On-chip voltage reference

rate of 1 kHz or more, as well as resolution

» Robust power-on-reset for harsh automotive environments

lead-acid battery voltage and current at a of up to 18 bits with no missing codes while concurrently measuring temperature. Simultaneous measurement of voltage and current allows for inner resistance

» On-chip low-power oscillator

calculations often used for battery state

» AEC-Q100 qualified solution

and discharging battery current with a huge

» Industry’s smallest footprint

of health estimation. Using a shunt, this device is capable of measuring charging dynamic range from milliamps to thousands of amps. Accumulator registers allow accurately calculating state of charge even in operating modes when the microcontroller is asleep. Click the image below to watch a video demonstration of the ZSSC1750 evaluation kit:

CLICK The ZSSC1750 is an extremely small form factor, ultra-low power consumption IC that will help in any situation, automotive, medical, or industrial, that requires real time monitoring and control of battery systems. To learn more about the ZSSC1750 go to zmdi.com ZMDI.com.

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“Using the ZSSC1750, you can do a large amount of the testing in your lab— you can get a very good review of exactly how this IC is going to work inside of your system.” – Josh Bishop, EEWeb Tech Lab

BD9G341AEFJ

DC-DC Converter From

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ROHM’s BD9G341AEFJ DC-DC Converter reduces design effort due to its integrated FET and current-mode architecture.

This EEWeb Tech Lab looks at ROHM’s BD9G341AEFJ, a singlechannel buck converter with an integrated FET, a wide input voltage range, and output voltage that is variable from 1V to Vcc at 3A. The BD9G341AEFJ implements current mode architecture, providing fast transient response and simple phase compensation setup. Design is further simplified by integrating an 80V, 3.5A, 150 mΩ N-channel MOSFET. The input range of 12V to 76V allows the device to be used in distributed power applications and eliminates intermediate conversions and the associated loss in total conversion efficiency. In addition, a standby current of 0 µA makes it wellsuited for battery powered applications, while a switching frequency of up to 750 kHz supports smaller inductors and provides high efficiency variable output voltage (from 1V to Vcc) at 3A. The device comes with an evaluation kit to see how simple the implementation actually is. The board contains the converter, the output diode, and the output inductor. There is also a 47kΩ resistor that sets the clock to 200

kHz. If you decrease this resistor, you increase the clock frequency, which allows you to reduce this inductor, which ultimately allows you to reduce the size of your implementation. ROHM’s BD9G341AEFJ DC-DC Converter reduces design effort due to its integrated FET and current-mode architecture. To watch a video demonstration of the BD9G341AEFJ, click the image below. For more information, visit rohm.com ROHM.com.

CLICK 15

DUCT INSIGHTS

For this Arrow New Product Insights, we will discuss three DC-to-DC step-down converters from OnSemi, muRata, and Linear Technology. We will also take a look at three JFET based products—two from Infineon and one from GeneSic.

OnSemi’s NCP1529 is an adjustable voltage step-down DC-to-DC converter, using a constant frequency, current mode step-down architecture. Using external resistors to set the output voltage, this IC can output a voltage range between point nine and three point nine volts and can source at least one amp. For greater efficiency, the NCP1529 employs two modes of operation, pulse width modulation for high efficiency with greater current and pulse frequency modulation for higher efficiency with lighter current loads. It also includes features such as soft-start, undervoltage protection, thermal shutdown protection, and current overload protection.

muRata’s LXDC3EP33A-107 is a step-down DC to DC converter with a small 3.5 by 3.2 millimeter footprint due to its inductor embedded ferrite substrate. Using synchronous rectifier technology and an automatic pulse width or pulse frequency modulation selection, this IC achieves up to ninety four percent efficiency. Accepting anywhere from two point five to five point five volts with an output between one and three point three volts, this also has been specially designed for reduced EMI.

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Linear Technology’s LTC3251 DC-to-DC step-down converter uses a dual phase switched capacitor charge pump in order to drop the input voltage. The voltage is regulated by detecting the output voltage through an external resistor network and adjusting the output current based off of those readings. Linear Technology has also implemented its Spread Spectrum Operation technology, smoothing peaks in the frequency domain and decreasing overall EMI.

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Linear Technology has implemented its Spread Spectrum Operation technology, smoothing peaks in the frequency domain and decreasing overall EMI.

This IC provides the Direct Drive JFET Topology, an optimized cascode operation that keeps the JFET in a safe off-state during the startup of the application.

∨

Infineon’s 1EDI30J12C family is a singledriver IC for a normally-on JFET. Using a JFET in conjunction with a low voltage P-channel MOSFET, switching losses are minimized while allowing a high voltage capability of up to 17.5V. This IC provides the Direct Drive JFET Topology, an optimized cascode operation that keeps the JFET in a safe off-state during the startup of the application. When the supply voltage reaches an acceptable level, the MOSFET is permanently turned on and the JFET is driven directly by the input signal.

Infineon’s IJW120R070T1 JFET combines the material properties of silicon carbide with the normally-on JFET concept, allowing for higher performance and ruggedness. To reduce switching losses compared to other conventional cascodes, the JFET is directly switched on and off by applying a negative gate voltage and 0V respectively, with the MOSFET always in an ON state except during start-up and power loss. Both the 1EDI30J12C and IJW120R070T1 are on an Infineon evaluation board, the Eval 1200V CoolSIC for easy prototyping.

∨

GeneSiC’s GA05JT12 is a normally off Silicon Carbide JFET that is compatible with existing silicon gate-drivers. With a max operating temperature of 175 degrees Celsius, high efficiency, and the ability to withstand short circuits, this JFET is ready for usage in applications ranging from uninterruptible power supplies to down hole oil drilling. For more info on the latest products, join us for the next Arrow New Product Insights, or look to Arrow.com. Arrow.com

Infineon’s IJW120R070T1 JFET combines the material properties of silicon carbide with the normally-on JFET concept, allowing for higher performance and ruggedness.

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ARISO Contactless Connectivity Connectivity Platform

Inside the Lab is a webseries sponsored by Arrow Electronics dedicated to exploring the latest in technology and electronics. In this episode weâ&#x20AC;&#x2122;ll introduce you to TE Conncetivityâ&#x20AC;&#x2122;s ARISO Contactless Connectivity Platform, a system delivering contactless power and data that simplifies complex connections and enables completely new applications.

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ARISO PROVIDES TREMENDOUS BENEFITS IN THE FORM OF UNLIMITED MATING CYCLES, RELIABLE OPERATION IN HARSH ENVIRONMENTS, AND THE ABILITY TO REPLACE COMPLEX CONNECTION SYSTEMS. The ARISO Platform is capable of transmitting up to 12 watts and eight channels of data over a 7mm air gap. TE provides a demonstration kit that includes a transmitter, which transmits power to the receive side, which will turn on the light. As the user closes the gap in the 7mm window, the light will turn off. ARISO can tolerate up to 30 degrees of tilt and up to 5mm of misalignment before the connection breaks. The contactless nature of ARISO brings certain benefits to the table. Because it is contactless, it has unlimited mating cycles, whereas a traditional connector will eventually wear out and need to be replaced, causing downtime and maintenance costs. The platform also allows for on-thefly connections. In a manufacturing environment, for example, if a device is passed down a manufacturing line, the user can power them and exchange data with them, whether that is a program or calibration data.

CNC or a lathe, ARISO will continue to provide power and data to them as they rotate. This is a great replacement for slip rings, which also have problems in harsh environments, and is something that ARISO is designed to work in. TEâ&#x20AC;&#x2122;s ARISO Contactless Connectivity platform is a truly innovative system for transferring data and power. ARISO provides tremendous benefits in the form of unlimited mating cycles, reliable operation in harsh environments, and the ability to replace complex connection systems. For more information, visitARROW.COM Arrow.com. Click the image below to watch a video demonstration of the ARISO Platform.

CLICK

Another one of the benefits of ARISO is rotation. The transmitter can be rotated and it will remain working, even at high RPMs. If you have a

LINK HERE zQSFP+ LINK HERE

Interconnects from TE Connectivity

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As data usage continues to rise, designers need interconnect solutions that can provide increased data rates while maintaining a consistent level of reliable performance. TE Connectivityâ&#x20AC;&#x2122;s comprehensive zQSFP+ interconnect portfolio helps to meet this need by offering 2.5 times more throughput than existing interconnect solutions while offering backwards compatibility with QSFP products. These features provide a flexible upgrade path to increase data rates from 10 Gbps to 25 Gbps, providing four channels with data rates of 25 GB/s, the zQSFP+ interconnect supports 100 Gbps Ethernet and 100 Gbps InfiniBand enhanced data rate requirements for high-speed designs.

TEâ&#x20AC;&#x2122;s zQSFP+ interconnects help optical, module, and cable assemblies reach new levels, increasing data transfer rates by 2.5-times more than existing solutions. Since increased data rates can make EMI protection more challenging, the ZQSFP+ interconnect product portfolio is designed to enable improved EMI protection through 25 Gbps. Design flexibility for thermal management is crucial for customers. As such, TEâ&#x20AC;&#x2122;s single-row cages have

been designed to be belly-to-belly compatible so that in higher-load thermal applications, customers can separate ports for improved thermal transfer. With a comprehensive portfolio, including behind and thru bezel cages with various light pipe and heatsink options, designers achieve ultimate flexibility in function and performance. In response to the significant market demand for technology and data center

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applications, TE offers a comprehensive zQSFP+ interconnect product portfolio, providing customers with one of the widest product selections in the market. Enable faster speeds in todayâ&#x20AC;&#x2122;s designs with TEâ&#x20AC;&#x2122;s comprehensive zQSFP+ interconnect portfolio, providing a scalable interface to easily move from 10 gigabitsper-second to 25 gigabits-per-second data rates. To learn more, contact your TE representative or distributor today.

Innovative

ASSEMBLY Services from Ohmite

Ohmiteâ&#x20AC;&#x2122;s 75,000 squarefoot facility includes product assembly and manufacture

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Ohmite’s decades of experience in building electromechanical assemblies has led to a broad set of capabilities and extensive expertise. Ohmite’s own power resistor and rheostat applications involve assembling multiple components in series or parallel, combined with fans and heat sinks to achieve power ratings exceeding 5000 watts. The company’s recent acquisition of ARCOL adds to the product base available in these assemblies, particularly ARCOL’s robust aluminum housed resistors. ARCOL is located in the UK and improves Ohmite’s worldwide reach.

Ohmite’s 75,000-square-foot facility includes metal fabrication, epoxymolding, connector fabrication, wire winding, and welding capabilities to manufacture and assemble nearly any product. Ohmite also provides custom thickfilm solutions, including double-sided, multilayer, and via capabilities in a QS9000-approved facility. Substrates include ceramic, FR4, insulated metal alloys, aluminum nitride, and plastic, with sizes up to 6-inches x 5-inches. A variety of conductors and dielectric materials are available with line width and spacing from 4- to 8-mils and sheet resistance from 0.10 to 1000 MΩ/square and tolerance as low as 0.25%. Ohmite offers automated laser trimming for tight tolerance thick film parts. For highenergy thick film applications, Ohmite provides scan cut laser trimming to provide better pulse handling capabilities.

Ohmite’s PCB assembly service supports high-mix, low- to mid-volume assembly of PCBs with SMD, through-hole, or mixed components in an ISO 90012008 approved facility. Ohmite can offer inventory management services for all subcomponents. Beyond assembly, Ohmite provides design engineering support to help the customer transition from prototype to production volumes as well as cost reduction through component sourcing and designing for manufacturability. For more information on Ohmite’s extensive assembly service portfolio, visit Ohmite.com. ohmite.com

Substrates include ceramic, FR4, insulated metal alloys, aluminum nitride, and plastic, with sizes up to 6-inches x 5-inches.

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