Ele times nov 2016 pdf 1 (1) by ELE Times

Smart Automotive Telematics

Road to Intelligent Transportation in India

Controlling Electronic

Smart Industry

Devices with Brain Waves

US $7.5, â&#x201A;Ź5 50 Singapore $10

The future of manufacturing

RNI No. DELENG/2012/45770, Mailed on 27-28th of Advance Month Delhi Postal Reg. No. DL(E)20/5424/2016-2018

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Vol : 5, Issue 11, November 2016, Monthly, Pages - 70

new avenues for

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electronics to make that

Open the Gamut of electronics

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Jointly organised by

Supported by:

2017

Ministry of Power Govt. of India

2 Exposition & Conference on Intelligent Electricity nd

2 3 rd - 2 5 th J A N U A R Y 2 0 1 7 INDIA EXPO CENTRE • GREATER NOIDA (NCR-DELHI) INDIA

Mapping the Smart Journey

From Source to Socket INTELECT is the exhibition-cum-conference event, specially designed to demonstrate the new and intelligent digital solutions from Source to Socket. . It is all about redefining and enabling unidirectional flow of electricity to bidirectional flow of electricity. The idea is to transform the energy value chain from analog to digital, to make the flow of electricity intelligent & to make our own lives easier.

Exhibitor Profile

Visitors Profile

Technologies Enabling Smart Supply: Ÿ Distributed generation & Smart Integration Ÿ Intelligent management of renewable energy Ÿ Energy storage - Evolving technologies Ÿ Micro Grids Ÿ Forecasting, scheduling & dispatching of renewable energy Ÿ Regulations/Grid Codes/Standards Ÿ Utility of the future Ÿ Protection & Control System Ÿ Substations Automation System

INTELECT'2017 will attract an eager audience comprising of: Central Govt Ministries - Power, Urban Development, IT, Communication & MNRE among others

Technologies Enabling Smart Consumption: Ÿ Smart Grid – Enabling technologies Ÿ Smart Living – Technologies, last mile connectivity Ÿ Demand responses, Electric Vehicle Charging System Ÿ Intelligent switchgear/transformer in Digital Grid Ÿ Energy Efficiency - Evolving technologies for efficient buildings & campuses Ÿ Asset Management & Advanced Analytics Ÿ IoT to “Grid of Things” & Communication technologies Ÿ Security & Surveillance system Ÿ Cyber Security Ÿ Smart Metering Ÿ Smart Consumption Ÿ System Integrators, Consultants

Distributed Energy Resources, Forecasting & Integration

State Government - Power and Energy Departments

Policy Makers/Regulators

Public and Private Sector Utilities (DISCOMs)

Central & State Public Works Departments

Municipal Corporations

Energy Management Consultants

System Integrators

Electrical Inspectorates

Real Estate Developers

Large Users (e.g. hotel, hospital, offices, malls, etc.)

Builders and Contractors

Architects

Institutions for standards, testing and certification

High Networth Individuals (HNIs)

Academic & Research Institutions List is illustrative

Intelligent Substation, Smart Metering

Energy Storage Predictive Asset Management Cyber Security Wide Area Monitoring

Situational Awareness

Feeder Automation & Self Healing

Demand Response

Micro Grid Electric Vehicle Charging

Roof Top Solar Energy System

Distribution Grid

Smart Homes/Offices

Energy Efficient Light/Devices

Solar Tree

Low Voltage 50 kV

ADVANCED DISTRIBUTION MANAGEMENT

City Network

3 MW substations

For space booking contact: Mr Ajay Mahajan, +919999250355 or ajay.mahajan@ieema.org Supporting Partners:

National Smart Grid Mission Ministry of Power Govt. of India

www.ii-intelect.org

Futuristic Escalator/Elevator/ Air Conditioning

NOTION

Diplomacy for Development Path-breaking Proactive and Pragmatic @devendra1963

History has seen not many people who have changed or channelized the course of history on the global front. Abraham Lincoln, Mahatma Gandhi, Martin Luther King, Albert Einstein, Nelson Mandela are said to be a few names in the recent past. A long gap after MK Gandhi has emerged yet another leadership in Modi who has been able to influence the world populace in the shortest span of time. The common with all these leadership is the economic sustenance, humanitarianism, stand for truth and their acts as the citizen of the world. Our topic here is not to discuss the world personalities but the above reference may be used as the background for the outstanding statesmanship we find in Prime Minister Modi today. We are witnessing a new genre of diplomacy for development. Prime Minister Modi’s articulation and prudence have convinced most people that a fast, inclusive, and sustainable socio-economic development of India and the rest of the world is his government’s primary objective. Modi’s increased cooperation with foreign partners and effective diplomacy are critical to achieve this mission. Though Diplomacy for Development was started with the swearing in ceremony of Prime Minister Modi, it advances with further clarity as path-breaking, proactive and pragmatic—that encapsulate the development-centric diplomatic initiatives and outreach of the Modi government. In the past, diplomacy used to focus on war and peace, security, trade, and other national interests. Prime Minister’s tour to Bangladesh, Bhutan, Brazil, Canada, Germany, Japan, Saudi Arabia, South Africa, United Arab Emirates, Vietnam, China, France and United States and several other states reflect that India is concerned with all those objectives but special priority is now attached to deploying diplomacy to accelerate the nation’s development in a broader sense. Hence, economic diplomacy remains the core of diplomacy for development. Consequently India’s principal development objectives have been specifically defined, converted into projects, and then showcased as new initiatives under Make in India, Skill India, Digital India, and Clean India. Through diplomacy the development issues have consistently been assigned a central place in India’s interactions with world leaders, both at home and abroad, by opening India’s doors to

foreign expertise and leveraging multiple partnerships for common benefit. Indian diplomacy seeks to take the goal of foreign policy for domestic transformation for the common man. Inviting Heads of Government of all SAARC countries in his swearing-in ceremony till acquiring S-400 missile system from Russia are just the diplomatic coup Modi has scored in last two and half years. In between Gwadar Port, bus travel by Northeastern tourists to Yangon and Bangkok through the Trilateral Highway, Neighbourhood First, Act East doctrines, improved relations with USA, surgical strike on Pakistan sponsored terrorist are but firm guidelines of economic development and relationships. All these moves sent a message to belligerent nations as well as to the rest of the world. The common denominator of the talks was the desire to keep bilateral relations in the economic sector moving for the mutual benefits. He stands for collective welfare of the South Asian neighbours when he exhorted for dedicated SAARC satellite to share the fruits of technology like telemedicine, e-learning, etc with the people across South Asia, with the aim of complementing the currently operating Indian Technical and Economic Cooperation Program in the region. Make in India facilitates manufacturing activities by encouraging global companies to set up their facilities in India. During all his foreign visits Modi has highlighted the program and assured global investors how India’s demographic dividend, competitive cost of production of goods, special investment facilities such as tax exemptions, infrastructural facilities etc makes it a lucrative and ideal manufacturing hub. Modi has been engaging the Indian diaspora, which has become an important input to Modi’s foreign policy initiatives in several countries. They are the useful contacts with the overseas companies and establishments for selling the ‘Make in India’ program. Enjoy Reading ELE Times.

Devendra Kumar Editor devendra@newdelhimedia.co.in

ELE Times | 06 | November, 2016

Innovation Everywhere Digital Position Sensor ICs Hall-effect digital position sensor ICs detect movement and position via changes in magnetic flux density. Allegro is the market leader in magnetic sensor ICs* with one of the industry’s broadest portfolios of switch, latch, and speed & direction ICs. They are contactless, require few external components, and are AEC-Q100 qualified. We continue to add new and exciting products: • Vertical Hall sensing enables new, smaller, lower-cost system form-factors and revolutionizes motors/encoders, delivering quadrature signals independent of magnet pitch. • Allegro-developed packaging integrates the typical discrete components for improved EMC performance and PCB-less sensor implementations. • Patented self-test features for safety-critical systems required to meet ISO 26262 (ASIL) guidelines.

• Seat position • Seat motors • Occupant weight • Seat belt buckles • Seat belt pretensioners • Console / glove box light switch • Blower motors • Air mix doors • Mirror position • Wiper motors • Wiper position • Throttle position (TPS) • Valve position • Brake light switch • Clutch pedal position • Driver controls / PRNDL • Gear position / speed • T-case motors • Headlight position • Electric pumps / Fans Hood latch / light switch

• Electric turbo motors • Trunk latch / light switch • Convertible top motors • Shifter position • EPS hand wheel (index) position • HUD position • Ride height / suspension position • Electric parking brakes • Window motors (anti-pinch)

* per IHS Magnetic Sensors Market Tracker, 2H 2014

Visit our website to review product datasheets

allegromicro.com/MDPSIC716 115 Northeast Cutoff, Worcester, Massachusetts 01606 USA 508.853.5000 AvantGarde Solutions Pvt Limited Godrej Coliseum, C-301 3rd Floor, Behind Everard Nagar, Off Eastern Express Highway, Sion Mumbai, INDIA 400 022 Phone: +91-22-49222600 Email: contact@avantgardesolutions.in

contents

Vol : 5, Issue 11, November, 2016

34 Cover Story New Avenues for Electronics

Improving reality and wondering how to make that better Issue Focus Bulletin

Adhesives

Smart Industry

Cyber Security

Electrolube Solves LED Potting Problem In India

Smart Industry The future of manufacturing ADAPT & Neutralize Need of the hour for Web Application Firewalls Innovation

T&M

IoT

e Power

Controlling Electronic Devices with Brain Waves Introduction to RF Spectrum Analysis Mitigating the IoT Attack Surface AC-DC & DC-DC Converters Heart of Electronics system Smart Automotive

Analog-to-digital

Smart Automotive Telematics Road to Intelligent Transportation in India Easy conversion: A look at how to implement an

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analog-to-digital conversion in a low bandwidth application

Technology

Power Electronics

In Conversation

MEMRISTOR from electrons to ions, could revolutionize electronics Electromagnetic Interference in Switching Converters

Is do-it-yourself still an option? UltraSCALE Architecture : Staying a Generation Ahead with an Extra Node of Value New Products

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Editor Devendra Kumar Publisher Shailesh Shukla Sub Editors Dibyoshnata Talukdar Chief Correspondent Dr. Ajay Shukla Corporate Communication Shilpa Shukla Sales & Marketing Shailesh Shukla Design & Print Production Jitendra Sagar Atul Kumar Tiwari Director Technical-Advisory Board K. R. Sripathy Human Resource Development Dr. Anjana Singh Legal Advisor Dharmendra Rajput Sr. Advocate High Court, Delhi Online Media Organisor Sandeep Varma Service Support Rajkumar

Regional Marketing Director Xilinx Inc

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News

Investment upto 2 lakh crores for India's electronics system design, manufacturing space in next four years: IESA

India’s electronics system design and manufacturing sector are on the verge to receive investments up to Rs 2 lakh crore, in within the next four years, the industry body India Electronics and Semiconductor Association (IESA) stated. IESA president M N Vidyashankar said that applications cleared at the Central and state level are worth about Rs 1.5 lakh crore over the last twoand-half years, under various programs in the Electronics System Design and Manufacturing (ESDM) space. Vidyashankar said IESA, the trade body representing the ESDM industry in India, would set up front offices in Taiwan (Taipei) by December and Japan (Fukoka) soon to attract investment. IESA is also contemplating opening offices in the US and South Korea.

NI addresses the different facets of a 'Connected World' at NIDays 2016 NI, the provider of systems that enable engineers and scientists to solve the world’s greatest engineering challenges, on October 19, 2016, successfully hosted the 13th edition of NIDays – an annual conference on graphical system design – in Bangalore. The event was attended by over 500 engineers, scientists, and experts from Industry and Academia who discussed the trends, opportunities, and challenges that lie in the future of connected systems. At the seminar, NI India launched the latest version of its flagship product, LabVIEW 2016, with enhancements in acquiring, processing and managing data from remote data acquisition systems. NIDays offered 21 technical sessions and tutorials along with a wide range of products and application demonstrations. The diverse set of panelists shared their ideas on trends in communication systems, embedded electronics, security and automated test systems that address the challenges and opportunities for the next generation of connected systems. NI also hosted its annual student design contest NIYantra 2016 as an effort to foster spirit of innovation in engineering students and expose them to experiential education. This contest, held over a period of six months, helped the undergraduate engineers design their project ideas and convert them into working models using NI hardware and software.

ELE Times | 09 | November, 2016

News

Government in India IT Spending to Reach $7.2 Billion in 2016 The government in India is on pace to spend $7.2 billion US Dollars (USD) on IT products and services in 2016, an increase of 2.4 percent over 2015, according to Gartner, Inc. This forecast includes spending on internal services, software, IT services, data center, devices and telecom services. Government comprises state and local governments and national government. IT services (which includes consulting, software support, business process outsourcing, IT outsourcing, implementation, and hardware support) is

expected to grow 9.3 percent in 2016 to reach $1.8 billion USD – with the business process outsourcing sub-segment growing 21 percent.

Highest business recorded at Laser World of Photonics India 2016 World of PHOTONICS INDIA took place for the fifth time from September 21-23, 2016 at Bangalore International Exhibition Centre in Bengaluru. Spread over 4,000 m² of exhibition space, 140 exhibitors, and 20 represented companies from 17 countries showcased products, recent developments and market trends from the world of lasers and optical technology. 7,182 visitors attended the trade fair marking a growth rate of 18 percent as compared to the previous year. Bhupinder Singh, CEO, MesseMünchen India, said, “LASER World of PHOTONICS INDIA 2016 saw impressive three days with numerous innovative technologies presented. The overall response is very encouraging and we expect the momentum to follow in coming years as

well.” The next edition of LASER World of PHOTONICS INDIA will take place again in conjunction with electronica India and productronica India, the largest trade fairs presenting the entire value-added electronics industry from 14-16 September 2017 at Pragati Maidan, New Delhi.

Samsung Electronics Invests Rs 1,970 Crore in its Noida Plant Samsung India Electronics announced expansion of its Noida plant with an investment of Rs 1,970 crore, strengthening its commitment to ‘Make in India’ and ‘Make for India’. The Government of Uttar Pradesh approved the investment by Samsung India Electronics under Super Mega A by the state’s Cabinet Committee in Lucknow. A Memorandum of Understanding was signed between Uttar Pradesh Chief Secretary, Rahul Bhatnagar and HC Hong, President & CEO, Samsung India Electronics, in the presence of Chief Minister Akhilesh Yadav. “A bigger and more robust manufacturing facility will help us address the needs and demands of our growing customer base across the country and the region. We plan to further the Samsung innovation promise across our Refrigerator, Mobile and LED TV range,” said HC Hong, President and CEO of Samsung India.

ELE Times | 10 | November, 2016

Indian electronics market to focus on export policy The NITI Aayog has discarded its first keen ‘Make in India Strategy for Electronic Products’ and has introduced another export-oriented policy that favours developing coastal economic zones. The Aayog initially came up with a draft policy that sought to attract global electronic manufacturers to set up units in India and give a push to the Make in India initiative. It suggested a 10-year tax holiday for companies investing over $1 billion in electronics manufacturing or creating 20,000 jobs in India. India’s domestic consumption of electronics hardware was $63.6 billion in 2014-15, with imports accounting for 58% of the total. It has now been canceled and a proposal to set up coastal economic zones for labour-intensive sectors in the country is recommended, much along the lines of China, to enable manufacturers to tap overseas markets without much difficulty.

Global Flexible Electronics Market to Reach $20.67 Billion

The global flexible electronics market is anticipated to grow at a CAGR of 25% during 2016 to 2022. The market has generated the revenue $5.42 Billion in 2016 and is anticipated to reach up to $20.67 Billion by 2022. Increasing consumer goods industry, distinctive features of flexible circuits, light weight and compact structure, environmentfriendliness of the batteries helps to increasing the market of rich communication suite service. The North America accounted for over 30% of the global revenue in 2015. The Asia Pacific is anticipated to witness optimistic growth at CAGR exceeding 17% in the forecasted period. The Europe flexible electronics market was over $5 billion in 2015.

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News

Andhra Pradesh signs two shipbuilding LED Expo 2016: Showing Grandeur MoUs with Russia at BRICS The Andhra Pradesh Economic and Glitterings Development Board has inked two MoUs with Russian corporations in the presence of Prime Minister Narendra Modi and Vladimir Putin, President of the Russian Federation. Krishna Kishore, CEO, Economic Development Board signed the MoUs at the Russia India bilateral Prime Minister Narendra Modi with Russian President Vladimir Putin. meeting. One MoU was signed between Andhra Pradesh Economic Development Andhra Pradesh Economic Board, JSC Alexeev’s Central Hydrofoil Development Board and JSC United Design Bureau, JSC Radar MMS and JSC Shipbuilding Corporation (USC). USC has Morinsis – AGAT and Elcom Systems an order book of over $20 billion with Private Limited which will facilitate substantial orders from Indian defence. investments in the state of Andhra With the signing of this MoU, shipbuilding Pradesh. in Andhra Pradesh will get a major fillip JSC Alexeev’s Design Bureau is a leading and the state will emerge as one of the designer and manufacturer of high-speed biggest shipbuilding hubs in Asia in the vessels in Russia having vast experience in years to come. This facility by USC will not the field of research, design, construction, only cater to the Indian market but also testing and operation of high-speed tap exports. vessels. Another MoU was signed between the

ELE Times | 13 | November, 2016

The 15th edition Led Expo is scheduled to be held from the 2 – 4 December 2016 at Pragati Maidan, New Delhi. This edition will showcase an extensive range of energy efficient LED lighting solutions. These solutions include the LED Lighting Products and Technologies will bring before you an array of services and products to suit your need: LEDs, OLEDs to latest application in design, drivers, components, signage, display, accessories, raw material, luminaries and the finished lighting products. The LED Expo is a must attend for: Architects & interior designers, Lighting engineers, designers, Professionals from hotels, mall management, restaurants, office and commercial establishments, Construction and real estate, Building contractors and project management consultants, Automotive industry, Energy service companies, Dealers and distributors of lighting and LED products, Public Works Department (PWD), Central Public Works Department (CPWD) and municipal corporations, Officials from ministries of power, new and renewable energy, environment and urban development and railway.

Adhesives

Electrolube Solves LED Potting Problem In India

Electrolube’s Indian subsidiary solves an LED lighting unit potting problem, following consultations with the company’s UK based technical division. The resin encapsulation was causing an unacceptable colour shift in the light from an LED strip luminaire, and the UK technical team had little more than 24 hours to come up with a solution.

he Indian LED lighting systems specialist, Rockforest Technologies India Pvt Ltd, was recently contracted to supply LED strip lighting units for luminaires destined for a shopping complex in Bangalore, India. The specification stipulated that Rockforest’s LED lighting strips should provide a ‘neutral white’ (4,000K) colour and that the LEDs in the luminaires be potted in order to protect them from adverse environmental conditions. Electrolube India conducted some initial trials, potting the strip luminaires to a specified depth of 5.5mm using Electrolube’s UR5634, a semi-rigid, optically clear polyurethane resin that is widely used for encapsulating LED lighting systems. With excellent protective and decorative properties, the UR5634 resin is also highly UV resistant, making it especially useful as an encapsulant for applications exposed to direct sunlight. In this particular application the resin

ELE Times | 14 | November, 2016

caused a colour shift from the LED array, from the specified 4,000K (neutral white) to ‘cool white’ (6,500K). Rockforest was under considerable pressure to solve this problem as the 4,000K colour was a nonnegotiable specification; moreover, their customer requested that a new reference sample, which met the 4,000K colour specification, be made available for retesting in just 24 hours. Electrolube India’s General Manager Padmanabha Shaktivelu, needed to act quickly in under 24 hours to help Rockforest meet this very tight deadline, so he approached Electrolube's technical support team in the UK for advice. Responding immediately to Padmanabha’s request, the UK team suggested two different approaches that Rockforest might consider in order to solve the problem. The first of these was a recommendation that they use an LED that provided a colour temperature below the specified

More than 40 years of EMC T&M experience The R&S®ESR is the new test receiver for standard-compliant EMC testing. ❙ Save time The R&S® ESR time domain scan makes EMC measurements faster than ever before, allowing you to dedicate more time to your main mission. ❙ Find everything The realtime spectrogram and the persistence mode seamlessly display the spectrum so you can detect and analyze sporadic or hidden emissions and their cause. ❙ Work ﬂexibly The R&S® ESR combines a test receiver and full-featured spectrum analyzer in a single instrument, giving you all the tools you need for your measurement task. ❙ Simplify measurements The R&S® ESR combines functionality with clear structure for easy navigation on the convenient touchscreen.

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Adhesives “Time was not on our side when we made the discovery of the colour shift from these potted LED units. Our client needed a rapid solution, so we turned to Electrolube India and Padmanabha Shaktivelu’s help was instrumental in achieving the tight turnaround demanded. Electrolube’s UK technical team pulled out all the stops to help us find a solution, the switch to UR5635 proving especially successful as it avoided the need for an additional diffuser medium, thereby saving costs for our client.” Electrolube Managing Director, Ron Jakeman, commented: “At Electrolube, we have branded ourselves as the solutions people because it truly resonates with everything that we strive for in terms of product innovation, customer service and technical support. The solution we suggested for Padmanabha, our General Manager at Electrolube India, and the customer, Rockforest, demonstrates how effective collaboration between our international partners and the UK-based technical team can deliver timely results for our worldwide customer base. We now have a brand new manufacturing plant in India and are represented in over 50 countries, which enables us to provide all our customers with genuine security of scale and a robust global supply chain, so when the unexpected happens, we’re more than capable of delivering a truly unique service anywhere in the world. Together with our expansive product portfolio, our valueadded services enable customers to find successful solutions for all their production needs.” There are several requirements for protection compounds within LED applications. Typical examples include optically clear compounds for protecting the LED itself and thermally conductive materials to help dissipate heat away from the LED array or LED lighting unit. Other necessary properties are UV resistance, colour stability of the resin and minimal colour temperature shift of the LED.

colour temperature - in this case, one operating in the 2,500K to the 3,000K range. By potting these with the UR5634 resin to the specified 5.5mm depth, it potentially could bring the light back to the desired colour. The second option was that Rockforest assesses the amount and type of resin they were using for this project to see if a thinner layer of resin over the top of the LED array would reduce the colour shift effect. Ultimately, Padmanabha Shaktivelu persuaded Rockforest to switch to UR5635, Electrolube’s semi-rigid polyurethane resin, formulated with a ‘hazy/cloudy’ appearance that is ideal for dispersing light. The diffused light produced by this resin meant that an additional diffuser medium was no longer necessary, allowing the customer to achieve the required aesthetic appearance and, through trials with various resin potting depths, the correct colour temperature. During these trials, the rapid gel time of UR5635 caused a complication but Padmanabha solved this problem by suggesting a staged potting procedure.

In this instance, Electrolube's UR5635 was the perfect LED protection solution for the customer. UR5635 is a two-part, semirigid polyurethane resin which has been formulated to have a light diffusing effect. Due to its cloudy appearance and unique capability to diffuse light, UR5635 has been well received by manufacturers as an effective and reliable LED resin for both decorative and protective applications. It exhibits outstanding water and weather resistance, as well as excellent resistance to acids and alkalis making it suitable for a wide range of environments and an extremely durable potting compound. UR5635 is also resistant to UV light, making it especially useful as an outdoor LED encapsulant or for use in other applications where it may be exposed to direct sunlight. Contact: Electrolube India, Padmanabha Shaktivelu, General Manager Electrolube India, Direct:+91 80 2972 3099, Email: info@hkw.co.in

Following the highly successful outcome of this project, Rockforest Technologies India Pvt Ltd, Managing Director, Bipin Rajgopal commented:

ELE Times | 16 | November, 2016

LEDchip Indus PA S S I O N AT E LY I N D I A N

UCT O OD

State to produce 100million LEDs per day with investment of 200 Cr over next 3 years .... A feat only

Kwality Photonics P Ltd signs MOU with Telangana

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Smart Industry

SMART INDUSTRY The future of manufacturing

When most people think of Industry they probably imagine a big, noisy place where everything runs at the steady pace dictated by giant machines. Raw materials are transformed into finished goods, unvaryingly and at a predictable rate, while people working there adapt to the processes and needs of the machines. While this is still true in many cases, the Industrial world is changing in a trend that goes under a variety of names including Industry 4.0, the 4th industrial revolution, Industrial Internet of Thing (IIoT) and smart manufacturing. Often revolutions looks like evolutions to those who are involved at the time. Only with the perspective of history is it clear that a “revolution” happened. At ST we believe that “Smart Industry” is an (r)evolution that builds on the many different technology advances over the past decades (evolution) but which will fundamentally changes the way factories and workplaces function (revolution). For us “Smart” means doing things more efficiently, more flexibly and in a more environmentally friendly manner. It also means the manufacturing will be safer for people working there. To achieve this we see industrial infrastructure evolving in three directions:

More Efficient Ÿ With Industry consuming 50% of the energy in the world and

factories accounting for 80% of that, reducing their energy use will play a major role in putting the planet on a more sustainable course. Ÿ Higher efficiency can be improved at all points in power usage with a particular focus on power conversion and energy harvesting, power management, power storage and motor control (since 50% of the energy in a factory is consumed by

electric motors).

More intelligent and aware Ÿ Machines are aware of the humans around them and provide

new interfaces such as smart tools, augmented reality and touchless interfaces for easier and safer interactions. Ÿ Sensors collect information about every machine all the time. Then safe and secure distributed local processing allows data to be turned into information, allowing real-time monitoring and predictive maintenance and repair. Ÿ Products contain the instructions for their manufacturing and carry that information with them throughout their lifecycle.

More Connected Ÿ Machines are connected inside the factory to the larger

supply chain and to the cloud. When orders can be customized in real time and only what is needed is actually made, this enables optimal planning and flexibility in manufacturing. Ÿ Real-time communication down to the lowest level of sensors and actuators, ensuring optimal reactivity and real-time analysis processes Ÿ And of course all of these communications are secure Semiconductors are a key enabler behind this new Smart Industry, pervasive through the industrial infrastructure and behind the digital intelligence that it makes possible throughout the entire supply chain. As a supplier with over 30 years’ experience in developing products for factory automation and industrial applications, ST is playing a leadership role with its catalog of products that help make smart industry a reality, today. Visit: http://blog.st.com/smart-industry-the-future-of-manufacturing/

ELE Times | 18 | November, 2016

Cyber Security

ADAPT&Neutralize Need of the hour for Web Application Firewalls WAF solutions to provide complete coverage while adapting to changing IT environment

In today’s dynamic and fast moving world, the Web can be a dangerous place to conduct business. SQL injections, cross-site scripting, illegal resource access, remote file inclusion etc. are some of the tools available to hackers attacking web applications. This unfortunate reality compels state-of-the art web application security and enterprise network security solutions to adapt from a nice-to-have into a mission critical mandate. Businesses require a next-generation WAF that is flexible enough to adapt to changing IT infrastructures and the evolving threat landscape, and also change based on the needs of the business. In the background of the above, here are some of the characteristics that a WAF needs to provide to keep businesses on top of their game: Agility Equals SecurityRisks – DevOps and agile development practices are great at creating new applications quickly and efficiently. Unfortunately, the fluidity of these environments also creates a bevy of unintended security risks. Ensurea WAF solution can automatically detect and protect applications as they are added to the network by automatically creating new policies and procedures. Cover That Top Ten List – Industry pundits and experts at security consortiums and communities continue to categorize and identify the greatest web application security risks facing organizations. A WAF solution should provide complete coverage, including all OWASP Top 10 risks. Device Fingerprinting – Bots, crawlers and spammers, using new techniques to disguise malicious traffic, can exhaust resources and scrape sensitive information from websites or cloud-based assets. A good WAF needs to sniff out these clandestine cyber assaulters. Device fingerprinting identifies, blacklists and blocks machines used for attacks regardless of the IP they hide behind. Even if the bot dynamically changes its source IP address, its device fingerprint does not change. Negative + Positive = Zero-Day Protection – Advanced application and “smoke screen” attacks that use DDoS assaults to mask other tactics are becoming commonplace, while zero-day assaults swiftly exploit newly discovered vulnerabilities. Negative and positive security models that automatically detect application domains, analyze potential vulnerabilities, and assign optimal protection policies are critical.

Nikhil Taneja, Managing Director - India & SAARC, Radware

Who’s Knocking at the Door? – Enforcing web access control policies and security procedures is a bread and butter function of any WAF. How to do it is where the devil is in the detail. Ensure any WAF offering supports user authentication and single sign-on (SSO) functions. This applies two-factor authentication and enables access to premise-based applications from outside the enterprise network. In addition, it ensures access to data based on a user’s role/business needs. Two Minds Are Better Than One – Cyber-attacks are increasing in severity and complexity, making it difficult for organizations to stay ahead of the rapidly evolving threat landscape. To assist, a WAF vendor should provide options for fully managed services for both on-premises and cloud-based WAF deployments. This provides the organization with the insight and expertise from security experts that can assume full responsibility to configure and update security policies as well as actively monitor, detect, alert and mitigate attacks in real time. Protection Via Unification – Leading analysts agree that the best WAF solution is one that provides both on-premises and cloudbased offerings. It provides a unified solution that ensures complete availability and protection with no security gaps between on-premises and web applications, and facilitates quick and easy migration of applications to the cloud. AppWall a Better Web Application Firewall Solution AppWall is a Web application firewall solution that ensures fast, reliable and secure delivery of mission-critical Web applications. It enables PCI compliance through mitigation of Web application security threats and vulnerabilities, preventing data theft and manipulation of sensitive corporate data, and protecting customer information. Additionally, it reduces the increasing risk of your enterprise's infrastructure being used to attack others. AppWall is the first WAF to provide a real-time security patching solution for web applications in agile and continuous deployment environments via tight integrations with Dynamic Application Security Testing (DAST) solutions. It detects and patches vulnerable resources automatically whenever an application resource change is introduced. AppWall is a core part of Radware's next-generation Attack Mitigation System (AMS). visit www.radware.com

ELE Times | 19 | November, 2016

Innovation

ith the growing dependence of mankind on the use of different electronic devices in day to day life, man wants to have easy handling to these electronic devices and easiest one is the possible brain wave command to electronic devices. Users want electronic devices to work through the control of brain waves without even to use of hands. Scientists and engineers are working to make this happen and great advances have been achieved towards brain-computer interface (BCI) or controlling electronic devices with brain waves. Forget about keyboard, mouse, touch screens or even voice recognition: the real dream is thinking about what we want our electronic gadget to do. Imagine a future where we can move anything with just our mind. The idea of interfacing minds with machines has long captured the human imagination. Dr. S. S. Verma Department of Physics, SLIET

Controlling Electronic Devices with

Brain Waves

ELE Times | 20 | November, 2016

Innovation sometimes frustratingly nonresponsive—that's how it goes with EEG-based headsets, which pick up only the faintest electroencephalographic echoes of neural activity through the skull. But these technologies are based on real BCI principles, and when they work, they're a fascinating glimpse of mind–machine merging mergers to come. Consider the potential to manipulate computers or machinery with nothing more than a thought. It isn't about convenience -- for severely disabled people, development of a brain-computer interface (BCI) could be the most important technological breakthrough in decades. It may soon be possible for anyone, everyone, to control technologies using a wearable mind control device based on EEG or electroencephalogram technology.

How it works The brain is an electrical device and electricity is its common language and this is what allows us to interface the brain to electronic devices. The brain is made up of billions of brain cells called neurons, which use electricity to communicate with each other. The combination of millions of neurons sending signals at once produces an enormous amount of electrical activity in the brain, which can be detected using sensitive medical equipment (such as an EEG), measuring electricity levels over areas of the scalp. The combination of electrical activity of the brain is commonly called a Brainwave pattern. Our mind regulates its activities by means of electric waves which are registered in the brain, emitting tiny electrochemical impulses of varied frequencies, which can be registered by an electroencephalogram. Recent advances in neuroscience and engineering are making this idea a reality, opening the door to restoring and potentially augmenting human physical and mental capabilities. Medical applications such as cochlear implants for the deaf and deep brain stimulation for Parkinson’s disease are becoming increasingly commonplace. Brain-computer interfaces (BCIs) (also known as brain-machine interfaces or BMIs) are now being explored in applications as diverse as security, lie detection, alertness monitoring, telepresence, gaming, education, art, and human augmentation.

Brain-computer interface A brain–computer interface (BCI), sometimes called a mindmachine interface (MMI), direct neural interface (DNI), or brain–machine interface (BMI), is a direct communication pathway between an enhanced or wired brain and an external device. Brain-computer interface is collaboration between a brain and an electronic device that enables signals from the brain to direct some external activity, such as control of a cursor or a prosthetic limb. When neurons in the brain interact via chemical reactions, measurable currents called brain waves are created. The four main types of brainwave patterns are delta, theta, alpha, and beta, and these can be detected and interpreted and signals sent wirelessly to devices to control them. The interface enables a direct communications pathway between the brain and the object to be controlled. BCIs are often directed at researching, mapping, assisting, augmenting, or repairing human cognitive or sensory-motor functions. BCI (brain–computer interface) has long been a favorite of sci-fi movies. However, some early BCI products are already for sale. These products are crude, imprecise and

The reason a BCI works at all is because of the way our brains function. Our brains are filled with neurons, individual nerve cells connected to one another by dendrites and axons. Every time we think, move, feel or remember something, our neurons are at work. That work is carried out by small electric signals that zip from neuron to neuron as fast as 250 mph. The signals are generated by differences in electric potential carried by ions on the membrane of each neuron. Although the paths the signals take are insulated by something called myelin, some of the electric signal escapes. Scientists can detect those signals, interpret what they mean and use them to direct a device of some kind. With an EEG or implant in place, the subject would visualize closing his or her right hand. After many trials, the software can learn the signals associated with the thought of hand-closing. Software connected to a robotic hand is programmed to receive the "close hand" signal and interpret it to mean that the robotic hand should close. At that point, when the subject thinks about closing the hand, the signals are sent and the robotic hand closes. Once the basic mechanism of converting thoughts to computerized or robotic action is perfected, the potential uses for the technology are almost limitless. Instead of a robotic hand, disabled users could have robotic braces attached to their own limbs, allowing them to move and directly interact with the environment. This could even be accomplished without the "robotic" part of the device. Signals could be sent to the appropriate motor control nerves in the hands, bypassing a damaged section of the spinal cord and allowing actual movement of the subject's own hands. The most common and oldest way to use a BCI is a cochlear implant. For the average person, sound waves enter the ear and pass through several tiny organs that eventually pass the vibrations on to the auditor nerves in the form of electric signals. If the mechanism of the ear is severely damaged, that person will be unable to hear anything. However, the auditory nerves may be functioning perfectly well. They just aren't receiving any signals. A cochlear implant bypasses the nonfunctioning part of the ear, processes the sound waves into electric signals and passes them via electrodes right to the auditory nerves. The processing of visual information by the brain is much more complex than that of audio information, so artificial eye development isn't as advanced. Still, the principle is the same. Electrodes are implanted in or near the visual cortex, the area of the brain that processes visual information from the retinas. A pair of glasses

ELE Times | 21 | November, 2016

Innovation holding small cameras is connected to a computer and, in turn, to the implants. After a training period similar to the one used for remote thought-controlled movement, the subject can see.

Advantages Every technology is said to have its pros and cons and same will be the case with brain wave interface with electronic devices. However, the interest of users is the most important parameter to influence the development and market growth of any technology. The recent history of human technology shows an increasing number of products and services that can be controlled remotely and automatically using computer algorithms. But what are the prospects of controlling devices using our brain waves. A few paralyzed patients could soon be using a wireless brain-computer interface able to stream their thought commands as quickly as a home Internet connection. By reading signals from an array of neurons and using computer chips and programs to translate the signals into action, BCI can enable a person suffering from paralysis to write a book or control a motorized wheelchair or prosthetic limb through thought alone. Current brain-interface devices require deliberate conscious thought but future applications, such as prosthetic control, are likely to work effortlessly.

Challenges One of the biggest challenges in developing BCI technology has been the development of electrode devices and/or surgical methods that are minimally invasive. In the traditional BCI model, the brain accepts an implanted mechanical device and controls the device as a natural part of its representation of the body. Much current research is focused on the potential on noninvasive BCI. One of the biggest challenges facing brain-computer interface researchers today is the basic mechanics of the interface itself. The easiest and least invasive method is a set of electrodes -- a device known as an electroencephalograph (EEG) -- attached to the scalp. The electrodes can read brain signals. However, the skull blocks a lot of the electrical signal, and it distorts what does get through. To get a higher-resolution signal, scientists can implant electrodes directly into the gray matter of the brain itself, or on the surface of the brain, beneath the skull. This allows for much more direct reception of electric signals and allows electrode placement in the specific area of the brain where the appropriate signals are generated. This approach has many problems, however. It requires invasive surgery to implant the electrodes, and devices left in the brain long-term tend to cause the formation of scar tissue in the gray matter. Although we already understand the basic principles behind BCIs, they don't work perfectly and there are several reasons for this as: Ÿ The brain is incredibly complex. To say that all thoughts or actions are the result of simple electric signals in the brain is a gross understatement. There are about 100 billion neurons in a human brain. Each neuron is constantly sending and receiving signals through a complex web of connections. There are chemical processes involved as well, which EEGs can't pick up on. Ÿ The signal is weak and prone to interference. EEGs measure

tiny voltage potentials. Something as simple as the blinking eyelids of the subject can generate much stronger signals. Refinements in EEGs and implants will probably overcome this problem to some extent in the future, but for now, reading brain signals is like listening to a bad phone connection. There's lots of static. Ÿ The equipment is less than portable. It's far better than it used to be -- early systems were hardwired to massive mainframe computers. But some BCIs still require a wired connection to the equipment, and those that are wireless require the subject to carry a computer.

Developments Ÿ Video games have started to use EEG technology, equipping

gamers with sleek headsets that claim to read the gamer’s mind and translate their thoughts into machine-readable instructions. Gamers can use their minds to drive a virtual car and create musically-inspired brain-wave art. A firm has developed what it considers to be the next level in gaming - a headset that lets us to control on-screen and physical objects using just our mind. During the demonstration, the brain waves moved a car the size of a shoebox around a track and each race involves two players wired up to the headset. Ÿ Neural prosthetic devices also use the shared language of electronics to control robotic limbs, but through a somewhat more sophisticated interface with the brain. These devices use neural implants consisting of an array of electrodes that are implanted in the brain to monitor a small set of neurons and detect an individual’s intentions to maneuver an object such as a prosthetic limb. Mathematical formulas then decode these brain signals and turn them into instructions that drive the prosthetic device. Ÿ Today it’s a headband or a helmet that reads brain waves from external EEG sensors, but to get to the subtleties that a true user interface would require we’d need to put sensors inside the head or add more components, such as the vision mentioned in the research above. But if we want to rely on the brain, then we need better electronics that could be implanted into a person’s body, which requires new coatings and research into chips. Ÿ The “mind control” headband unveiled by startup BrainCo. effectively hacks into brain signals with a range of possible applications — from helping to improve attention spans, to detecting disease, controlling smart home appliances or even a prosthetic device. Ÿ The helmet is built around a NeuroSky headset, an EEG device that senses the activity of neurons in the brain and indicates whether a person's thoughts are either meditative or attentive. Ÿ The US Department of Defense is pushing for the development of cheap, wearable systems that can detect the brain waves of people and display the data on smartphones or tablets. Acknowledgement: The use of information retrieved through various references/sources of internet in this article is highly acknowledged.

ELE Times | 22 | November, 2016

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Test & Measurement

Introduction to

RF Spectrum Analysis Background

As many as RF products go around the market of the world, the test and verification challenge of RF signal becomes more and more complicated during Research and development stage. RF Engineers are eager to find a rapid way to figure out the root causes of the problems. Thus, the spectrum analysis methodology has become the most important tool to observe and resolve any kind of problems. As different from time domain signals were measured by oscilloscope, spectrum analysis will transfer the time domain signals into frequency domain element, so it can be performed by power quantities versus each frequency element, and the spectral line will be represented on the screen to definite the signal harmonic elements one by one, that is the existed value of the spectrum analyzer.

Applications

Many RF and Microwave applications were verified by spectrum analyzer today, for example, like Radar signal inspections, Digital modulation transmissions and Wireless transmission etc. Every RF Signal will be observed by spectrum analyzer.

Edward Pan

Marketing Manager International Sales Department Rigol Technologies

The main test parameters include spectral power, frequency deviation, and different marker indication points. For more advanced measurement, it can be applied by Adjacent channel power, multiple traces tracking etc. The spectrum analyzer not only can implement the basic RF Signal retrieving, it can be also used as a simple network analyzer if the tracking generator is built on. The tracking generator could be used as a simple RF synthesizer to generate a swept sinusoidal wave consecutively, so the RF Passive component like antenna, cable etc could be received the test signal and reflect to the receiver terminal of spectrum analyzer, so it becomes a simple network analyzer which can verify S11 and S12 parameters. As more serious competitive environment going, the best CP value of spectrum analyzer has become the main street product among the bloody market.

Rigol Spectrum Analyzer

deviation from the spectral center. The Display Average Noise Level (DANL) can be down to -161dBm, it is the best specification among the same competitive categories. The Resolution Bandwidth can be down to 10Hz to help customers to determine the spectral line as the most accurate way. For the most famous application, Rigol DSA Spectrum Analyzer is the most useful tool to complete the EMI testing. It also provide the NFP-3 near field probe to help customers to find out the EMI root causes by the most efficient way before applying normal verifications. S1210 EMI precompliance test software could enhance the EMI analysis by real time capturing on Laptop bases, it can generate a completed test report and help customers to optimize the project implementation. If customers select the tracking generator options, the spectrum analyzer can be used as a simple network analysis tool to do S11 and VSWR testing. VB1000 series test bridge will be offered for customers to complete the VSWR testing for different bandwidth segments as well.

Conclusion Rigol Technologies was established on 1998 and today it has become the unique and the best test and measurement vendor in great China area. The product sales covered 5 continents around the worldwide. Today Rigol provides DSA800 and DSA700 series spectrum analyzer which covered the highest bandwidth can be up to 7.5GHz and lower down to 500MHz category. From educational to industrial market, DSA series can satisfy customers to complete the measurement task during either R&D stage or mass production procedures. DSA800 series has the best specifications over todayâ&#x20AC;&#x2122;s competitive market, it can provide the best Phase Noise indicators which can be down to -98dBc/Hz at 10KHz

ELE Times | 24 | November, 2016

Spectrum Analyzer indeed is the most powerful RF signal verification tool for product design and manufacturing. Today, more and more applications will cover RF category like the hottest Internet of Things (IoT) application, each RF transmission element in houses and industrial connections are used by wireless communication like WIFI, Bluetooth, Zigbeeand RFID etc. Wireless applications will cover beyond 70% part of our life, so the spectrum analyzer will become the most basic tool to solve all kinds of RF signal problems in the future, if any test vendors can provide the best CP value of the product, it will benefit to whole industry and market.

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IoT

IoT Mitigating the

Attack Surface

ndustries across the globe are gaining competitive advantages by deploying technologies such as Software defined Networking, Hyper converged Infrastructure and Internet of Things (IoT). Unfortunately this also means they are going to face new security vulnerabilities as their IT ecosystem expands. Neil McLellan, Business Development Manager, Wind River

Modern day use cases for “IoT-like” applications date back to the earliest days of manned space flight for monitoring astronaut vital signs and shuttle telemetry – mission critical data points transmitted across a dedicated network. Beyond dedicated and specialized networks, technology once leveraging PSTN has now converged on the global IP network. The public internet has evolved beyond connecting hobbyist PC’s, to becoming modernday critical infrastructure empowering the most essential aspects of our everyday life – including safety critical, connected devices. As such, the convergence of embedded IoT devices and PC/server infrastructure on a common network backbone are surfacing a new set of challenges around two very common issues: o Intrusion prevention o Virus protection Network policies adopted by IT departments to secure the business data and PCs do not account for the different protocols and functionality available within the range of intelligent embedded devices. The intelligent embedded device must have the ability to monitor and protect itself against the threats that exist within the network while at the same time sharing information with trusted devices in real time. With the IoT attack surface spanning clear across the traditional IT ecosystem, the depth of knowledge to mitigate security vulnerabilities across the ecosystem requires security posturing in excess of the traditional IT generalist. The costly omission of designed-in security is often a lack of expertise, or limited budget, pale in comparison to the cost of downtime, data breaches, or compromised autonomous systems.

Device-side The armada of IoT edge devices are coming in all shapes and sizes

and servicing an infinite number of applications – fixed vs. mobile, wired vs. wireless, stored data vs. cut-through data handling, leaving us to consider a broad range of threats. As influencing physical environmental safeguards surrounding a mobile device is most likely not an option, self-contained security countermeasures will dictate the success of your IoT strategy. Securing device operations against known and emerging threats, encrypting data both at-rest and in-motion, and providing the ability to maintain remote accountability of security – as if you were virtually next to the device. Wind River’s portfolio of embedded operating systems have been secured and certified to support the demands of the most advanced IoT strategy. Beyond these technical hurdles, a device manufacturer will need to plan for supporting a connected and secured device strategy consistent with the extended life of such devices. With PC/solution’s reaching an expected useful life of 3-5 years, embedded devices can expect a useful life nearly six-times as long. Combatting the resource limitations of the device at the time of design and commissioning – CPU, memory, etc. are compounded in the field during maintenance operations that sustain the device.

Cloud-side Complementing device-side operations, the cloud side solutions must add comprehensive device management capabilities to augments your growing or existing IoT strategy, completing the “end-to-edge” framework. A solution that enables device manufacturers to query and retrieve vital operating system, file system, and application information, identify gaps and vulnerabilities, and facilitate the deployment critical counter measures to those devices would be the best you could deploy.

ELE Times | 26 | November, 2016

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AC-DC & DC-DC Converters

Heart of Electronics system

Mathew Philip | Manager TDK Lambda

AC-DC Converters and DCDC Converters are used to converter a AC Input supply or a DC Input supply respectively to a required DC out put. They are used in various application as it is considered as the heart of any electrical or Electronics system. The applications where it is used includes Medical equipmentâ&#x20AC;&#x2122;s, Factory automation, Building automations, Process control systems, Signage displays, Telecommunication equipmentâ&#x20AC;&#x2122;s, Renewable energy, Test and Measuring equipmentâ&#x20AC;&#x2122;s, Defence and Aerospace, Transportation systems etc.

The usage of these converters in the applications requires careful consideration of the operating conditions, environment and power loads. It is advised to ensure the converter is not being continually stressed. When selecting a converter beware of the pitfalls in over and under specifying the requirement. For example if the system requires a 100w of DC power , it would be unwise to select a power supply that is exactly rated for 100w because the converter would be operating at 100% of its capacity thereby stressing the electronic components and will likely fail prior to or very shortly after the warranty period. It is hence very important to choose a converter vendor that employs conservative component deratings in the design of their converter. This means they design their converter circuit so that components such as semiconductors, capacitors, inductors etc. are never stressed to their maximum ratings. Sadly many converter vendors that sell low cost products often design their product such that the internal components are working at their maximum ratings. TDK-Lambda gives more importance to selection of the components such that reliability and quality of the products is ensured and provides a low cost of ownership.

Operating conditions: Sometime a low cost converter is selected for applications that require 24/7 operation. Low cost converter construction employs low cost components (capacitors, active

ELE Times | 28 | November, 2016

components, fans etc.) that are unsuited for constant operation. The best solution for 24/7 application is to find an industrial grade converter that includes a 5 year or longer warranty. The warranty period is a good indication of the type of components used on the converter construction Environment - Ambient temperature: One of the biggest killer of a converter is heat. Since all converters generate Heat due to their inherent inefficiencies they require cooling by conduction via heat sink, natural air or forced air cooling. However, whichever cooling method is employed, due consideration to prevailing ambient air temperature range must be included on the end equipment design. When Fan cooled converter are employed in corrosive or dusty environment a scheduled maintenance program must be established to periodically clean air filters and replace fans. In this condition it is wise to consider non fan cooled converters that are cooled vis. conduction or natural airflow.

Power Loads: Many times industrial and control equipment include DC motors, solenoids, etc and these loads typically have a peak start-up current that exceeds their steady state current. The system designer can select a converter that handles peak current. The usage of AC-DC or DC-DC converters is becoming ever more widespread and in some of the applications where it is used, has semiconductor devices which must

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e Power operate at low voltages while handling large currents and supporting high speed operation. This is realized by positioning converters in close proximity to load devices and hence a technique known as Distributed Power Architecture (DPA). TDKLambda offers a broad line up in this area. The products suitable for DPA system include front-end power supplies, bus converters and Point of Load (POL). The features of DPA: It supports more compact and more efficient systems, lower operation voltages, higher currents, higher response speed of semiconductor devices and Digital control. An example of DPA system is shown in the picture below: Front end power converters are that convert AC Source or a DC source which can be of low voltage or high voltage to core required DC voltage. Bus converters are isolated converters that converts the core voltage to the intermediate voltage required by subsequent stage POL (Point of load). POL is a High efficiency, fast response dc-dc converter that is placed close to the load and converts the intermediate voltage into the voltage required by semiconductor devices.

Some of the interesting applications of TDK-Lambda Power supplies A) Sonar Application Sonar systems installed on surface ships, sonar is also fitted extensively on submarines and other submersible vessels. Navigation underwater is usually calculated using the vessel’s distance travelled and direction, but this does not identify the position of other submarines or the existence of a drilling rig. As radar cannot be used below the surface, sonar is the alternative.TDK-Lambda’s compact Z+ programmable power supplies are now being used in sonar systems on submersibles due to their proven reliability B) Process control TDK-Lambda HWS series / DRF series is widely used in distribution control system as these offers relay contact and Class1 Div2

certification especially to be used in harsh environment. Optional conformal coated PCB available to use in harsh/humid environment C) Automotive Instrument cluster test Jig Automotive Instrument Clusters undergo a demanding test regime to ensure high reliability. A manufacturer that assembles and tests these units is now using the TDK-Lambda Z+ programmable DC power supply on its test rig D) UHF/VHF Radio Baseplate cooled PFE500SA AC-DC power modules are used in a number of deployable equipment applications around the world. The need for rugged and dependable operation is paramount. A manufacturer of UHF/VHF radios designed in the 28V version of the PFE500SA for their integral power source, because of proven field reliability and technical support. E) LED Video Display Advertising has been radically changed with the extensive use of eye catching LED video displays. These signs are often positioned outside and the reliability of power supplies is one essential factor for manufacturers. TDK-Lambda’s converters are used in high profile displays because of their specification, and the availability of printed circuit board coating to avoid failures due to condensation or humidity. F)Renewable Energy – Micro Grid The 2500W ,EZA2500-32048, bidirectional DC-DC converter is ideal for solar or wind powered energy storage systems. This power supply can automatically, and continuously, change conversion direction from “grid side” 320Vdc nominal to “battery side” 48Vdc nominal. The EZA2500 is also designed to be used for energy recovery; recycling previously wasted power from battery testers, robots, cranes, elevators and autonomous ground vehicles. When a 300 to 380 high voltage dc source is available, for example from solar panels during daytime, the converter can be programmed to charge 48Vdc rechargeable lithium-ion battery banks. At night the stored energy can then be converted back to high voltage dc to power either DC-AC inverters or dc-input electrical/electronic devices. www.tdk-lambda.com

ELE Times | 30 | November, 2016

Smart Automotive

Smart Automotive Telematics

Road to Intelligent Transportation in India

Ashish Gulati | Country Head Telit India

The next big thing after consumer electronics, computers, and mobile phones is the “Internet of Things” (IoT) which connects all of them in a homogenous way so that they can talk to each other.

An important component of IoT is Vehicle Telematics, an IoT application, an ecosystem in which real-time information and data available in vehicles is brought together seamlessly to provide rich and rewarding experiences to customers and businesses. Vehicle telematics has already evolved from “plain vanilla” location data for vehicle tracking or navigational applications to enterprise applications that harness data and analytics. Telematics services are enabling new driving experiences delivered through continuous connectivity. Services include a variety of entertainment, traffic and navigation services as well as car maintenance and safety features. All these services together add up to what is also called the “Connected Car”.With the increasingly connected lifestyle of today’s consumer, drive time is one of the few places or times when the vehicle owner experiences

limited access to connected assets. While some of us may reminisce fondly about a less connected lifestyle, the bulk of drivers have come to expect a robust connected experience anywhere and everywhere – and automakers are responding to these changes.

Real time access to data in the vehicle by definition promises an enhanced driving experience. As a result, automakers are pushing for more and more connectivity both within the vehicle itself to deliver enhanced “pilot” data to the driver, as well as connectivity to the Internet for traffic and infotainment. Smart modules now address automakers’ growing demand for high-speed mobile data connectivity to support applications like advanced diagnostics, infotainment and remote software updates. These modules have the ability to run complex applications without an external processor ELE Times | 32 | November, 2016

making it an ideal solution for the car makers to optimize cost and simplify manufacturing. Applications closely related to the data connection like hackdetection and prevention, dead-reckoning navigation, and software revision control and re-flashing for the ECU and other onboard electronic control units can all be developed or ported to run in these modules.

Automakers that fully embrace telematics will be able to streamline

operations, improve product quality and strengthen the customer connection to their brand – converting one-time product sales into long-term service oriented relationships. This is the road ahead to greater profitability and competitive advantage for manufacturers, OEMs and other stakeholders in the massive global automotive ecosystem.

Smart Automotive

Telematics opens the road to intelligent transportation. The ultimate goal of telematics is to enable a vehicle to communicate to nearby vehicles and even the infrastructure itself – sensing lane markings, curbs and other vehicles close by and providing enhanced roadway safety. Telematics is not only going to improve driver safety but also deliver new services. Telematics can also help address carmakers’ concerns that tomorrow’s buyers could have very different needs and expectations for their vehicles, including how much technology they want to own. The end-game scenario is to move from what are today many stand-alone systems to a situation where there is a full connectivity between cars and infrastructure – necessary elements to enable automated driving. Vehicle-toVehicle, Vehicle-to-Infrastructure and Advanced Driver Assistance Systems are applications that are already being incorporated by the Auto manufacturers. These applications use sensors to detect the position of the vehicle in front and in adjacent lanes and create an awareness zone around the car. Building a telematics infrastructure will require more than just vehicle hardware and electronics, but an ecosystem of connected cars with tens of billions of sensors requiring telecommunications networks, cloud infrastructure, data storage capacity, integration with applications, and welldesigned human-machine interfaces (HMI) so consumers can comfortably interact with the telematics system.

In India surging economic growth and a rising middle class are driving consumption and domestic demand for vehicle ownership in India. The economic progress combined with the smart cities mission is establishing India as a new market for connected navigation and telematics services. Smart Mobility is a key characteristic that will play a pivotal role in realizing the country’s ‘Smart Cities Mission’. Unlike its early days, the telematics system today is not limited to just tracking a path on the map but connectivity and telematics have the potential to safeguard the fleet and

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improve the overall transportation infrastructure. To improve overall transportation some key factors are playing a crucial role in advancing telematics technology as a response to such challenges. Firstly, rising role of IoT where consumers want vehicles that are safer, entertaining, more efficient and better equipped to cope with congested urban driving environments. Secondly, rising awareness amongst buyers over the necessity and importance of connected services which will drive the market demand for telematics in coming years and lastly, the growing demand for automotive safety where the current telematics environment is not only capable of reporting data on driving behaviour but also can track vehicle performance, sending information pertaining to maintenance issues, vehicle location and crash reports.

Fully autonomous vehicles will turn

cars into mobile extensions of our homes and offices, completely changing the driving experience. Now is the time to capitalize on the promise of a future with connected cars, and establish a solid foundation for the future digital innovations that are sure to come. Telematics will introduce a convergence of multiple connected processes. Automakers can greatly benefit by not restricting these innovations to the basic capabilities of this technology.

Impr wonder

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Cover Story

New Avenues for Electronics

roving reality and ring how to make that better

he future is unfolding all around us. Over the next decade we will see a slew of new technologies that we can hardly imagine today. We can to some extent predict the future technologies based upon current emerging tech and inventions plus trends but at the same time we remain clueless about the technology of future as the advancement in technology is the day to day event. Emerging tech is exciting in and of itself. Future technology will allow the generation of today to live longer due to advances in medicine, use more high tech computers and electronics than we can now imagine, and drive future cars with no emissions and zero carbon footprints. Future energy, smart homes and cars, robots and bionics will make the life easier. Future weapons will actually be smarter, more precise and reduce the need for machismo among countries and will encourage non-proliferation. Future space technology will bring spacecraft to the far reaches of this solar system and beyond. Education technology will mean students will learn faster, retain information longer, process information and retain memory like we can now not even imagine. Electronics will go way beyond the iPad using holograms and other virtual reality technology. Future robotic surgery will mean more precision, less complication and faster healing. Bionics will not only combine man (and woman) and machine, but also artificial intelligence with human intellect. Questions such as what is the mind, consciousness and the soul will be answered and integrated between neurons and electronics. Homes will not only be smart in a green and energy conservation sense but theyâ&#x20AC;&#x2122;ll also be empowered with robotics, food supply management, facial recognition security, resource and energy management plus so much more.

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Cover Story Three-dimensional integrated circuit In microelectronics, a 3D IC is an integrated circuit manufactured by stacking silicon wafers and/or dies and interconnecting them vertically using through-silicon vias (TSVs) so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. 3D IC is just one of a host of 3D integration schemes that exploit the z-direction to achieve electrical performance benefits.

technologies that provide added value to the wearer. They have the ability to do many things that traditional fabrics cannot, including communicate, transform, conduct energy and even grow.

Flexible electronics

Biometrics Biometrics refers to metrics related to human characteristics. Biometrics authentication (or realistic authentication) is used in computer science as a form of identification and access control. It is also used to identify individuals in groups that are under surveillance. Biometric identifiers are the distinctive, measurable characteristics used to label and describe individuals. Biometric identifiers are often categorized as physiological versus behavioral characteristics. It is not limited to fingerprint, palm veins, face recognition, DNA, palm print, hand geometry, iris recognition, retina and odour/scent. Behavioral characteristics are related to the pattern of behavior of a person, including but not limited to typing rhythm, gait, and voice.

Digital scent technology Digital scent technology (or olfactory technology) is the engineering discipline dealing with olfactory representation. It is a technology to sense, transmit and receive scent-enabled digital media (such as web pages, video games, movies and music). This sensing part of this technology works by using olfactometers and electronic noses. In 2005, Japanese researchers announced that they are working on a 3D television with touch and smell that would be commercially available on the market by the year 2020. In 2016, a Chinese company initiated project "ScentRealm" and takes the first step to enter the field of â&#x20AC;&#x153;Digital Scent Technologyâ&#x20AC;?.

Electronic nose An electronic nose is a device intended to detect odors or flavors. An electronic nose was tuned to the perceptual axis of odorant pleasantness, i.e., an axis ranging from very pleasant (e.g., rose) to very unpleasant (e.g., skunk). This allowed the eNose to then smell novel odorants it never encountered before, yet still generate odor pleasantness estimates in high agreement with human assessments regardless of the subject's cultural background. This suggests an innate component of odorant pleasantness that is tightly linked to molecular structure.

E-textiles

E-textiles, are fabrics that enable digital components (including small computers), and electronics to be embedded in them. Smart textiles are fabrics that have been developed with new

Flexible electronics is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic substrates, such as polyimide, PEEK or transparent conductive polyester film. Additionally, flex circuits can be screen printed silver circuits on polyester. Flexible electronic assemblies may be manufactured using identical components used for rigid printed circuit boards, allowing the board to conform to a desired shape, or to flex during its use. An alternative approach to flexible electronics suggests various etching techniques to thin down the traditional silicon substrate to few tens of micrometers to gain reasonable flexibility (~ 5 mm bending radius).

Memristor

A memristor is a hypothetical non-linear passive two-terminal electrical componen trelating electric charge and magnetic flux linkage. The memristor's electrical resistance is not constant but depends on the history of current that had previously flowed through the device, i.e., its present resistance depends on how much electric charge has flowed in what direction through it in the past; the device remembers its history â&#x20AC;&#x201D; the so-called nonvolatility property. When the electric power supply is turned off, the memristor remembers its most recent resistance until it is turned on again.

Molecular electronics Molecular electronics is the study and application of molecular building blocks for the fabrication of electronic components. It is an interdisciplinary area that spans physics, chemistry, and materials science. The unifying feature is use of molecular building blocks to fabricate electronic components. Due to the prospect of size reduction in electronics offered by molecularlevel control of properties, molecular electronics has generated much excitement. It provides a potential means to extend Moore's Law beyond the foreseen limits of small-scale conventional silicon integrated circuits.

Nanoelectromechanical systems

ELE Times | 36 | November, 2016

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Cover Story Nanoelectromechanical systems (NEMS) are a class of devices integrating electrical and mechanical functionality on the nanoscale. NEMS form the logical next miniaturization step from so-called microelectromechanical systems, or MEMS devices. NEMS typically integrate transistor-like nanoelectronics with mechanical actuators, pumps, or motors, and may thereby form physical, biological, and chemical sensors. The name derives from typical device dimensions in the nanometer range, leading to low mass, high mechanical resonance frequencies, potentially large quantum mechanical effects such as zero point motion, and a high surface-to-volume ratio useful for surface-based sensing mechanisms. Uses include accelerometers, or detectors of chemical substances in the air.

Spintronics Spintronics is the study of the intrinsic spin of the electron and its associated magnetic moment, in addition to its fundamental electronic charge, in solid-state devices. Spintronics differs from the older magnetoelectronics, in that spins are manipulated by both magnetic and electrical fields.

Thermal copper pillar bump The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component.

Towards New Avenues in Minimally-Invasive Intracutaneous Electrochemical The subject highlights the development of a novel class of minimally-invasive electrochemical biosensors that facilitate the quantification of relevant metabolomic, ionic, and neurochemical information residing in the viable epidermis in a continuous, realtime fashion. Fabricated through manufacturing processes that are scalable, cost-effective, and highly precise, these novel biosensing modalities seek to bridge the gap between analyticalgrade instrumentation typically found in the hospital laboratory and user requirements for unobtrusive, low-profile, skin-applied devices able to deliver timely, actionable information using existing wirelessly-enabled wearable and mobile platforms.

Home Entertainment & Personal Computing Opens New Avenues for Active Optical Cables The active optical cable market has grown at a rapid pace than what it was in 2007. Cloud and internet data centers are responsible for fueling the growth. Application of these cables were then prominent in esoteric space of HPC data centers. Voracious appetite for internet and emergence of cloud data centers have been responsible for the surge in the active cable industry. What really drives the adoption of the active optical cable market is the demand for much faster and low latency-resistant data centers. The need is growing rapidly not only within internetâ&#x20AC;&#x2122;s huge data centers but also cloud deployments.

Electric Vehicle Charging Opens New Avenues for Semiconductors

The bill of semiconductors used in charging stations is vast, ranging from the power semiconductors that channel electricity between the charger and the vehicle, to the communication chips linking the station to the smart grid. The charging infrastructure for electric vehicles is expanding, buffered by large investments from the automotive industry, government initiatives, and international calls to reduce carbon emissions. As a result, the market for semiconductors used in these charging stations is expected to grow rapidly over the next few years.

Silk Fibroin for Flexible Electronic Devices Flexible electronic devices are necessary for applications involving unconventional interfaces, such as soft and curved biological systems, in which traditional silicon-based electronics would confront a mechanical mismatch. Biological polymers offer new opportunities for flexible electronic devices by virtue of their biocompatibility, environmental benignity, and sustainability, as well as low cost. As an intriguing and abundant biomaterial, silk offers exquisite mechanical, optical, and electrical properties that are advantageous toward the development of next-generation biocompatible electronic devices.

Transparent Smartphones

The chip, known as transparent resistive random access memory, is similar to existing chips known as metal-oxide semiconductor memory, which we use in new electronics. The difference is that TRRAM is completely clear and transparent. It is a new milestone of transparent electronic systems. By integrating TRRAM with other transparent electronic components, we can create a total see-through embedded electronic systems. The technology could enable the windows or mirrors in your home to be used as computer monitors and television screens.

Hollow Flashlight Ann Makosinski invented a battery-free flashlight. A free energy device that is powered by the heat in your hand. Ann recalled reading how the human body had enough energy to power a 100-

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Cover Story watt light bulb. This inspired her to think of how she could convert body heat directly into electricity to power a flashlight. Her idea was to design her flashlight so that when it was gripped in your hand, your palm would come in contact with the topside of the tiles and start heating them. But although the tiles generated the necessary wattage (5.7 milliwatts), she added a transformer to boost the voltage to 5V, which was more than enough to make her flashlight work.

Smartbox Technology The smartbox, similar to a black box for airplanes, records details about how your car is driven, which can result in cheap car insurance for responsible drivers. The device is connected to the electronics in your car and collects a wide criteria of information such as time, speed, braking, cornering, acceleration and location. The smartbox data is wireless transferred in real time to the insurance company and provides a profile of when, where and how you drive. This profile is then used to compare insurance rates and to reward low-risk driving behavior with cheap insurance rates.

Electronic Pills - Collecting Data Inside The Body

These pills contain sensors or tiny cameras that collect information as they travel through the gastrointestinal tract before being excreted from the body a day or two later. These new electronic inventions transmit information such as acidity, pressure and temperature levels or images of the esophagus and intestine to your doctor's computer for analysis. One of the main challenges is determining just what is happening in the stomach and intestines.

Digital Pen Despite the digital age, we still use pens. But it would be great to have our handwritten notes and drawings digitally recorded without having to use a scanner. The Zpen from Dane-Elec is a wireless pen that uses a clip-on receiver to digitally record what you write. It uploads the information to your computer where it can be viewed, edited and filed as a word processing document. The digital pen utilizes character recognition software and works by recording movement.

Instant Prints Creating instant prints from a digital camera is one of the new electronic inventions in printing. The Polaroid PoGo is a small portable printer that weighs only a few ounces. The printer produces full color 2" x 3" prints using an "inkless" technology. The images are created from heat activated crystals in the photo paper. The photos are water proof, tear proof and smear proof.

Position Sensors

Sensors are devices which are able to detect changes in the characteristics of its environment and proportionally convert them into measurable response. These components are used to respond or function as per the variations in the surroundings. Diverse instrument types are available for various physical conditions. Plant automation and process industries are the major industries driving the demand for position sensors. The demand is expected to witness a lucrative growth mainly on account of expanding consumer electronic goods application. Position Sensors Market applications in automotive and mobile phone manufacturing are the major contributors which are expected to propel the market demand.

Intelligent technologies for transport

Connected vehicles filled with communication technologies offer an unprecedented opportunity to achieve the European Unionâ&#x20AC;&#x2122;s dream of an integrated multi-modal transport system. The roadmap contained 40 initiatives for the next decade that are expected to dramatically reduce Europeâ&#x20AC;&#x2122;s dependence on imported oil and cut carbon emissions in transport by 60% by 2050. The objective for the next decade is to create a genuine single European transport area , easing the process of integration and the emergence of multinational and multimodal operators.

Smallest. Transistor. Ever. Engineers have been eyeing the finish line in the race to shrink the size of components in integrated circuits. Now, a team of researchers has succeeded in creating a transistor with a working 1-nanometer gate. The key was to use carbon nanotubes and molybdenum disulfide (MoS2), an engine lubricant commonly sold in auto parts shops. MoS2 is part of a family of materials with immense potential for applications in LEDs, lasers, nanoscale transistors, solar cells, and more.

Atomic sandwiches' could make computers 100X greener Researchers have engineered a material that could lead to a new generation of computing devices, packing in more computing power while consuming a fraction of the energy that today's electronics require. Known as a magnetoelectric multiferroic material, it combines electrical and magnetic properties at room temperature and relies on a phenomenon called planar rumpling. The new material sandwiches together individual layers of atoms, producing a thin film with magnetic polarity that can be flipped from positive to negative or vice versa with small pulses of electricity. In the future, device-makers could use this property to store digital 0's and 1's, the binary backbone that underpins computing devices.

New devices emulate human biological synapses A new type of nano-device for computer microprocessors is being developed that can mimic the functioning of a biological synapse

ELE Times | 40 | November, 2016

Cover Story - the place where a signal passes from one nerve cell to another in the body. Memristive devices are electrical resistance switches that can alter their resistance based on the history of applied voltage and current. These devices can store and process information and offer several key performance characteristics that exceed conventional integrated circuit technology.

New 3-D wiring technique brings scalable quantum computers closer to reality

A new extensible wiring technique capable of controlling superconducting quantum bits has now been developed, representing a significant step towards to the realization of a scalable quantum computer. The quantum socket is a wiring method that uses threedimensional wires based on spring-loaded pins to address individual qubits. The technique connects classical electronics with quantum circuits, and is extendable far beyond current limits, from one to possibly a few thousand qubits.

Physicists pass spin information through a superconductor Every electronic device - from a supercomputer to a dishwasher works by controlling the flow of charged electrons. But electrons can carry so much more information than just charge; electrons also spin, like a gyroscope on axis. Harnessing electron spin is really exciting for quantum information processing because not only can an electron spin up or down -one or zero -but it can also spin any direction between the two poles. Because it follows the rules of quantum mechanics, an electron can occupy all of those positions at once. Imagine the power of a computer that could calculate all of those positions simultaneously. A whole field of applied physics, called spintronics, focuses on how to harness and measure electron spin and build spin equivalents of electronic gates and circuits.

Bioengineers' sweat sensor monitors glucose Researchers are sweating the small stuff in their efforts to develop a wearable device that can monitor an individual's glucose level via perspiration on the skin. They have demonstrated the capabilities of a biosensor they designed to reliably detect and quantify glucose in human sweat.

Melting of frozen electrons visualized It allows electrons to move freely and turns the insulator into a metal and possibly later into a superconductor. The melting of electrons. In the blue areas, the electrons (red dots) are stuck to the atoms in the lattice (green circles), meaning that there is no current. In the red areas, dopant atoms (black circles) are added, giving the electrons room to move and making them behave like a liquid. The researchers expect that once the whole area is molten, the material is a high-temperature

superconductor. Left: Actual measurement. Right: Illustration of concept.

New cost-effective silicon carbide high voltage switch created Researchers have created a high voltage and high frequency silicon carbide (SiC) power switch that could cost much less than similarly rated SiC power switches. The findings could lead to early applications in the power industry, especially in power converters like medium voltage drives, solid state transformers and high voltage transmissions and circuit breakers. Wide bandgap semiconductors, such as SiC, show tremendous potential for use in medium- and high-voltage power devices because of their capability to work more efficiently at higher voltages. Currently though, their high cost impedes their widespread adoption over the prevailing workhorse and industry standard -- insulated-gate bipolar transistors (IGBT) made from silicon -- which generally work well but incur large energy losses when they are turned on and off.

Electrons in graphene behave like light, only better Electrical and computer engineers have directly observed - for the first time - negative refraction for electrons passing across a boundary between two regions in a conducting material. The researchers were able to observe the effect in graphene, demonstrating that electrons in the atomically thin material behave like light rays, which can be manipulated by such optical devices as lenses and prisms. The findings could lead to the development of new types of electron switches, based on the principles of optics rather than electronics. The ability to manipulate electrons in a conducting material like light rays opens up entirely new ways of thinking about electronics. The switches that make up computer chips operate by turning the entire device on or off, and this consumes significant power.

2-D boron may be best for flexible electronics Though they're touted as ideal for electronics, two-dimensional materials like graphene may be too flat and hard to stretch to serve in flexible, wearable devices. "Wavy" borophene might be better. When grown on silver, the two-dimensional form of boron, which is called borophene, takes on corrugations. The metallic material may be suitable for use in stretchable, bendable electronics. The scientists observed examples of naturally undulating, metallic borophene, an atom-thick layer of boron, and suggested that transferring it onto an elastic surface would preserve the material's stretchability along with its useful electronic properties.

Ultra-thin ferroelectric material for next-generation electronics Ferroelectric materials can switch between different states of electrical polarization in response to an external electric field. This flexibility means they show promise for many applications, for example in electronic devices and computer memory. Current ferroelectric materials are highly valued for their thermal and chemical stability and rapid electro-mechanical responses, but creating a material that is scalable down to the tiny sizes needed for technologies like silicon-based semiconductors (Si-based CMOS) has proven challenging.

ELE Times | 42 | November, 2016

Virtual World

Virtual Reality in India What lies in store for the future of Augmentation

Sonia Sharma | Managing Director GoodWorkLabs Virtual Reality is still in its infancy in India. Technology giants from around the world have taken decisive steps towards the expansion of research and development in the field of Virtualization and Augmented Reality, but the state of the Indian market has remained more or less dormant. What seems astounding is that even after all this time thereâ&#x20AC;&#x2122;s still a perception amongst people that Virtual Reality is all about 360 degree videos. Digi-Capital predicts that Virtual Reality (VR) and Augmented Reality (AR) will be an industry worth $150 Billion by 2020. With the right foresight and education, the Virtual Reality market in India has the potential to be world leaders.

Bringing Virtual Reality to your doorstep The main challenge for the Indian market is to move away from mainstream consumer sectors like E-Commerce and invest more time in alternative technologies. Virtual Reality has made its mark in the world with players like Google, Apple, Microsoft, and Samsung heavily investing in VR tech and development. Virtual Reality gear like the Oculus Rift, HTC Vive, and even the Google Cardboard are now easily available and are paving the way for VR to be made available to mainstream audiences. Virtual Reality is about the complete immersion of audiences in a simulated world that will let you delve into new environments and process information in a 3-Dimensional space. Barring a handful of companies in India, there are barely any players considering the vast opportunities that Virtual Reality has in store. VR is not all about gaming or viewing videos in 360 degrees, but it goes far beyond into the world of manufacturing, healthcare, education, engineering, architecture, entertainment, and even therapy, and retail.

The reality of VR The world is looking to move into a more immersive space in terms of technology; people want information faster, and want to learn about the world without restrictions. Virtual Reality ticks all those boxes, it lets you immerse yourself into a simulated environment where one can access information, interact with objects, and even experience scenarios which otherwise would not have been possible.

VR can let you design a new product in the morning, take a tour of our galaxy at noon, and get you to attend your favorite bandâ&#x20AC;&#x2122;s concert in the evening. The options and possibilities with Virtual Reality are endless. All that remains is to open our minds and accept that VR is here to stay and is definitely going to be making a huge impact on our markets. But for VR to make an impact in India we first need to look at more basic issues - connectivity and stable networks are a must for the growth of any high functioning technology sector and this is where India sees possible lost opportunity. If these primary matters are addressed on time, Indian markets can expect to see great demand in the development of VR solutions across industries.

E-Commerce and Virtual Reality The E-Commerce bug has bit India hard and people seem to rarely look away from the sector towards more progressive uses of technology. But then again there is progress, with companies like CommonFloor who use VR gear to showcase their properties in 3D, and Indian tech companies that are creating immersive learning material for children with the use of 3D simulation. Virtual Reality is yet to enter the Visual Merchandising market in India, and that is where lies huge potential for e-commerce businesses. Augmented reality and Virtual Reality can help brands build experiential marketing solutions and even let users create customized solutions for themselves.

Rooting for tomorrowâ&#x20AC;&#x2122;s tech Investing in VR is not only a novel idea but businesses see tremendous future in the VR industry and expect equally beneficial returns. From Education, to training young medics and engineers, to providing immersive entertainment options. Virtual Reality has begun to alter the course of mainstream technology. The Indian market would greatly benefit from original research and development in the field of Augmented and Virtual Reality. VR Games and VR in the education sector has already had a small head-start over other industries. The hope now is that bigger players see the potential in the Virtual Reality sector and invest at least a part of their efforts towards the development of VR tech and solutions.

ELE Times | 43 | November, 2016

Analog-to-digital

Easy conversion A look at how to implement an analog-to-digital conversion in a low bandwidth application

Implementing an analogue-to-digital conversion in a circuit is one of the most common tasks facing designers and one that can be done in various ways. But for many simple and low bandwidth applications, such as a DC voltmeter for example, the goal is to keep the cost of the implementation low but still obtain a high resolution for the analogue-to-digital conversion.

A simplified schematic of such a circuit is shown in Fig. 1. There are two input voltages connected one at a time to op amp U1. Vref is the fixed reference voltage used in calibration and Vmeas is the unknown voltage to be converted. Resistor R1 and capacitor C1 form a charging circuit used to convert input voltage to time. The existence of U1 in the circuit removes the logarithmic characteristic that would occur if the input voltage is directly applied to R1 and C1. This circuit uses a PIC16F5X microcontroller from Microchip to control the U1 operation by turning the four switches (S1 to S4) on and off. Additionally, the microcontroller measures the time and calculates the digital representation of the unknown input voltage.

ELE Times | 44 | November, 2016

Fig. 1: Circuit diagram for an analogue-todigital circuit

The circuit can also be used as a current mode A-D converter. In this case, the input voltage to the current converter is not needed and the reference current and input current are both routed via analogue

Analog-to-digital switches directly into the capacitor. The converter requires only five external components and is software and hardware configurable for conversion resolutions from 6 to 10bit, and conversion times of 250Îźs or longer. The method is usable for both voltage and current conversion and uses a software calibration technique that compensates for time and temperature drift, as well as component errors. To visualise the different stages of conversion, take a look at the U1 output voltage Vo waveform shown in Fig 2.

Fig. 4: Equivalent circuit during measurement

Fig. 2: Operational amplifier output voltage waveform

At t0-t1, S1 and S3 are on, S2 and S4 are off and RA0 is pulled to ground by the software. This yields the equivalent circuit in Fig. 3.

are on, S1 and S4 are off and RA0 is pulled to ground again by the software. This yields the same equivalent circuit in Fig. 3. However, Vo is equal to Vmeas since Vin is equal to Vmeas and S3 to force unity feedback. C1 is discharging from t2 to t3. At the end of t3, S2 remains on, S1 remains off, S3 is off, S4 is on and RA0 is configured as an input pin. This yields the same equivalent circuit in Fig. 4. As a function of Vmeas, Vo is started to ramp-up linearly while C1 is charging. The Vo ramp-up continues until the Vth of the microcontroller trips. This generates a software Vmeas value equal to tmeas. This value is compared with the software calibration value to determine the actual digital representation of Vmeas.

Circuit equations Based on the circuit operation, equations are used by the microcontroller to calculate the conversion result. In Fig. 4, the current through R1 is equal to the current through C1. When the input voltage Vin is equal to Vref, the relation between the two currents is represented as Equation 1 in Fig. 5. When Vin is equal to Vmeas, the relation between the two currents is represented Fig. 3: Equivalent circuit during discharging

Vo is equal to Vref since Vin is equal to Vref and S3 to force unity gain feedback. C1 is discharging or is initially discharged after the reset state. In any case, this stage ensures that C1 is fully discharged before going to the next stage. At the end of t1, S1 remains on, S2 remains off, S3 is off, S4 is on and RA0 is configured as an input pin. This yields the equivalent circuit in Fig. 4. As a function of Vref, Vo is started to ramp-up linearly while C1 is charging. The Vo ramp-up continues until the threshold voltage input Vth of the microcontroller trips. This generates a software calibration value equal to tref. This calibration value is measured and used to calibrate out most circuit errors, including inaccuracies in the resistor and capacitor, changes in the Vth, and temperature variation. After the software calibration value is measured at t2, S2 and S3

Fig. 5: Analogue-to-digital conversion equations

ELE Times | 45 | November, 2016

Analog-to-digital as Equation 2 in Fig. 5. Integrating Equations 1 and 2 yields the results shown in Equations 3 and 4. Since Vref and Vmeas have constant input, Equations 3 and 4 can be further reduced to Equations 5 and 6. At the end of each measurement, Vo of Equations 5 and 6 are both equal to Vth. Therefore, equating both equations yields Equation 7. Here, R1 and C1 can be eliminated and solved for Vmeas, the unknown input voltage. In Equation 8, it is apparent that the measurement is independent of the value of circuit elements R1 and C1. This makes the conversion insensitive to errors in the R1 and C1 value, due to the inaccuracy or temperature variation. However, this does not mean that the values of R1 and C1 are unimportant in the design of the A-D converter. The values of R1 and C1 should be selected based upon the number of bits of resolution. Looking back at Equation 6 and solving R1C1 you get Equation 9 in Fig. 6.

Fig. 6: Calculation of R1C1 value

The actual value for R1C1 should be slightly smaller than calculated to ensure that the PIC16F5X microcontroller does not

over count during the measurement. It should be noted that there will be a difference between the R1C1 value when implementing in Assembly and C because the instruction cycles per count when using C are greater than in Assembly.

Circuit performance In actual applications, if measurement accuracy permits, it may be advantageous to use lower resolution bits and higher clock source. The maths code can be largely reduced and the measure time is reduced by the simpler code and shorter count. The calibration value removes all first order errors (offset, gain, R and C inaccuracy, power supply voltage and temperature) except the reference voltage drift. Any change in the reference voltage, including noise, may result in measurement errors. Other error sources may be analogue switch leakage, resistor and capacitor non-linearities, input threshold uncertainty and time measurement uncertainty (plus or minus one instruction cycle time). Measured performance shows the converter to be accurate within 1% of full scale. Conclusion For a simple and low bandwidth analogue application, it usually requires a low cost yet high resolution A-D converter. By using the PIC16F5X baseline family of microcontrollers, this article has demonstrated how to meet such requirements. The A-D converter does not only use fewer components but also has a capability to calibrate out most circuit errors.

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Technology

MEMRISTOR

From electrons to ions, could revolutionize electronics

Memristor is predicted to change the complete future of PC hardware. It is a pioneering electronic module that consists of memory resistor, two terminal electrical components related to the magnetic flux linkage as well as electric charge.

According to HP Labs Fellow R. Stanley Williams, “The memristor holds its memory longer. It’s simpler. It’s easier to make — which means it’s cheaper — and it can be switched a lot faster, with less energy.” For a long time, electrical engineers were using the three basic components to design circuits – inductors, capacitors, and resistors. In 1971, a physicist, Prof. Leon Chua, Department of the University of California Berkeley, conceptualized the existence of a fourth primary element in the electronic circuit, besides the three that were already in use at the time. Chua argued in his paper that, the memristor has properties that cannot be duplicated by any amalgamation of the other three elements. The introduction of the fourth component made the circuits exponentially more complex. Prof. Chua believed that in

future, an extra component could be constructed to join the resistor, the capacitor and the inductor. He named it "memristor", deriving from the words memory and resistor, as it carries properties of both memory element having memory history and resistor. The memristor can replace flash memory and D-RAM. However the implementation took almost four decades to conceptualize, as the first memristor was built by Hewlett Packard in 2008. Today, this innovation is believed by many researchers to be revolutionary in the field of computing. This is believe to open up new innovations, engineers could, for example, develop a new kind of computer memory that would complement and eventually replace the generally used dynamic

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random access memory (D-RAM). Computers using conventional D-RAM lack the ability to retain information once they loss power. When power is restored to a D-RAM-based computer, a slow, energyconsuming "boot-up" process is necessary to recover data stored on a magnetic disk required to run the system. Memristor-based computers wouldn't require that process, using less power and possibly increasing system resiliency and reliability. Prof. Chua believes the memristor could have applications for computing, cell phones, video games anything that requires a lot of memory without a lot of battery-power drain. This could be used to considerably improve facial recognition technology or to provide more complex biometric recognition systems that could more effectively restrict access to personal information.

Technology These same pattern-matching capabilities could enable appliances that learn from experience and computers that can make decisions. In computer chips, a transistor functions using a flow of electrons, whereas the memristor couples the electrons with ions, or electrically charged atoms. In a transistor, all information is lost once the flow of electrons is interrupted. But a memristor can remember the amount of charge that was flowing through it, and much like a memory stick it will retain the data even when the power is turned off. This can pave the way for computers that will instantly turn on and off like a light bulb and never lose data: the RAM, or memory, will no longer be erased when the machine is turned off, without the need to save anything to hard drives as with current technology. Initially, the technology will be mostly used to create super-fast memory chips that contain more data and consume less energy. This alone would make regular computers much more powerful, but down the line, the memristor could also take on the processing. Jennifer Rupp, professor of electrochemical materials at ETH Zurich, and working with IBM to build a memristor-based machine, says, : "It (memristor) could mean the end of the silicon era, giving us lower power consumption, the ability to compute more information, increased data storage and completely new logic patterns for our computers." Memristors don't require a silicon layer and different materials can be used as a substrate. This could create a new class of microchips, that could eventually be integrated in everyday items such as windows, clothes or even coffee cups. After manufacturing the first ever memristor in 2008, Hewlett Packard has been working on a new type of computer based on the technology planned to be launched by 2020. Christened as "The Machine", it uses "electrons for processing, photons for communication, and ions for storage." "I think there is a race going on," says Rupp. "There is a strong driving force, but at the same time it's very important that there are players like HP, because they

want to get to the market, show everyone that this is real." Right now the manufacturing cost of memristor is high, however specialist believes the initiative to be worthy of its cost on R&D. "Memristors operate at a lower power consumption, with a faster speed, and with a higher volume density of information than anything we have based on silicon microchip transistors," she said. It is also said to have human brain-like characteristics that the technology could one day lead to computer systems that can remember and associate patterns in a way similar to how people do. Rupp says, "Unlike a transistor, which is based on binary codes, a memristor can have multi-levels. You could have several states, let's say zero, one half, one quarter, one third, and so on, and that gives us a very powerful new perspective on how our computers may develop in the future," she said. Such a shift in computing methodology would allow to create "smart" computers that operate in a way reminiscent of the synapses in our brains. Free from the limitations of the 0s and 1s, these more powerful computers would be able to learn and make decisions, ultimately getting us one step closer to creating human-like artificial intelligence.

Global market: As memristor enables to replace the increasing number of transistors used on circuits for amplifing chip performance which only results into the problem of heat generation which affects the devices. Also memristor enables replace D-RAM.

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The computers using the D-RAM lack of ability to retain information once they shut down. Memristors can remember voltage and no need to reboot the computer. These efficient features resulting into increase in applications of memristors, will navigate the global memristor market. Increased awareness among the design engineers regarding the hi-tech progresses and advances in computers enables generate profitable openings for the memristors market. Supervisory bodies are applying severe guidelines towards uphold the mandatory feature of products is major test for the market. However, lack of skilled professionals is the major challenge and memristor costlier than the conventional devices, which may hamper the global memristor market. Global Market can be segmented as Based on RAM: 4 GB, 8 GB, 16 GB, 32 GB and 64 GB; by Product Type: Static RAM (S-RAM), Dynamic RAM (D-RAM) and EPROM. The global Memristors market can be allocated based on applications into Nano Electronic Memories, Computer Logic, Neuromorphic Computer Architecture, Replacement of Transistors, Programmable logic, Signal Processing and so on. Furthermore, the market is also segmented on the type of memristor such as Molecular and iconic thin flirmemristor, Magnetic and spin based memristor. It is expected to reveal a noteworthy CAGR as well as annual growth rate over the estimate period. Worldwide memristor market is gaining acceptance in flow across the globe due to

Technology increased awareness among people. Prominent players in this market include: AMD Inc., Samsung Electronics co. ltd. and IBM Corporation. North America is estimated to have a concentrated stake in global market due to increased awareness about the technology in the countries like US and Canada. They are followed by Asia-Pacific owing to the extreme transformation in Asian countries economy as well as IT industries in developing economies of India and China. This is to be followed by the European region with a significant upsurge witnessed in the global memristor market. Memristor Market: Key players - Some of the key players are: Toshiba Corporation, SanDisk Corporation, Intel Corporation, Fujitsu Ltd., Samsung Electronics Co., Ltd., Cypress Semiconductor Corporation, IBM, Hewlett Packard, Seagate Technology LLC., SK Hynix and Sony Corp.

Future: Non-volatile memory applications: Nonvolatile random access memory, or NVRAM, is pretty much the first to-market memristor application we’ll be seeing. There are already 3nm Memristors in construction now. Crossbar latch memory developed by Hewlett Packard is reportedly currently about one-tenth the speed of DRAM. The fab prototypes resistance is read with alternating current, so that the stored value remains unaffected. Industry analysts analyses that there is industry concurrence that these flash memory or solid state drives (SSD) competitors could start showing up in the consumer market within 2 years.

Ÿ Low-power and remote sensing

applications: As an addition of NVRAM capabilities, the corresponding circuits of the memristor, together with memcapacitors and meminductors, which allow for the storage of charge, memristors can possibly let for nanoscale low power memory and distributed state storage. These are currently all hypothetical in terms of time to market. Crossbar Latches as Transistor Replacements or Augmentors: The high power consumption of transistors has been an obstacle to both miniaturization and microprocessor controller development. Solid-state memristors can be joined into devices called crossbar latches, which could replace transistors in future computers, taking up a much reduced space. To do-away with the snags in this part, a huge amount a capital is required to be invested on R&D. Analog computation and circuit Applications: Analog reckonings exemplified a whole capacity of exploration which, however were not as accessible or dependable as digital solutions. Memristor applications will now allow us to revisit a lot of the analog science that was abandoned in the mid 1960’s. Circuits mimicking Neuromorphic and biological systems – Neuromorphic is a very large area of research, in part because a large part of the analog science has to do with advances in cognitive psychology, artificial

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intelligence modeling, machine learning and recent neurology advances. The ability to map people’s brain activities under MRI, CAT, and EEG scans is leading to a wealth of data about how brains functions. Simple electronic circuits based on an LC network and memristors have been built, and used recently to model experiments on adaptive behavior of unicellular organisms. The experiments show that the electronic circuit, subjected to a train of periodic pulses, learns and anticipates the next pulse to come, similar to the behavior of the slime mold Physarumpolycephalum periodic timing as it is subjected to periodic changes of environment. The recent memristor cat brain is also getting a lot of mention. These types of learning circuits find applications anywhere from pattern recognition to Neural Networks. No more neural pattern algorythm training on stock market data for the pop-sci investor: now, you can grow your own neural network! Just add two drops of memristor. Not anywhere close to reality, FYI, even in the 30 years range, but very realistic in terms of helping advance the science itself, if not the consumer market for intelligent brains-in-a-jar. The memristive applications in the areas Programmable Logic and Signal Processing, will remain relatively the same, because it will only be a change in the underlying physical architecture, allowing their capabilities to expand, however, to the point where their applications will most likely be unrecognizable as related. "To find something new and yet so fundamental in the very mature field of electrical engineering is a big surprise," said R. Stanley Williams, an HP Senior Fellow and director of the Information and Quantum Systems Lab (IQSL).

Technology

Electromagnetic Interference in

Switching Converters Migrating from Linear regulators to switching converters can be a nightmare for system architects especially working in the automotive and avionics market segment. They are aware of the “EMI risk” and the consequences on the product design cycle. But due to a higher efficiency demand and a smaller footprint they are forced to think about switching converters. This article presents a basic view of the cause of EMI in switching converters, best designs practices that can mitigate EMI and an example of a real system. Akshat Garg, Analog Applications Engineer, Texas Instruments Incorporated

Electromagnetic Interference The dI/dt and dV/dtproblem! A magnetic field produced by the changing current in one conductor (source) will induce a voltage in another (victim) according to e = M • di/dt ; where M is the mutual inductance between the source and victim. This principle is used to explain the working of transformers. However it is applicable to any system. The induced voltage can add additional stress on components and needs to be accounted for. As an example, consider a multi- layer PCB. Changing currents

(di/dt) on a layer can induce voltage on the other layers due to the mutual inductive coupling between layers. This coupling is a result of the long return current path for each layer. To reduce the effect, layers are separated by ground planes. In a properly designed layout, the ground plane will provide the shortest (lowest impedance) path for the return currents and thereby reduce the Inductive coupling between layers. An electric field produced by thechanging voltage on a surface of a conductor (source) will induce a current to flow in another conductor (victim) according to i = C• dv/dt; where C is the

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Technology capacitance coupling the source to the victim. This is the most common phenomenon which is also mistakenly ignored. It is the primary source for the common mode currents in any system. Example: Most designers use TO-220 Mosfets for better thermal management and tie them (electrically isolated) to the chassis that act as large heatsinks. The Capacitive coupling between the mosfet and chassis can be 10-12pF because of the TO 220 package. Assuming the Mosfet switches 400V at200Khz with a turn on/off time of 100ns then Ipk = 48mA (Irms = 9.6mA). Measuring the conducted EMI using a 50 ohm impedance LISN on the Chassis ground will give 114 dBuV. The CISPR class B limit for 200Khz is 56 dBuV. Hence 58 dB of attenuation is needed to pass the standard. The problem is aggravated with the presence of higher harmonics of the currents. A design may be under the pass limit at the fundamental frequency (switching frequency of the converter) but may fail at some higher harmonic (figure 1c).

Figure 1c: Passes at the fundamental of 680Khz but fails at higher harmonics

The capacitive and inductive coupling due to the Electric (E) and Magnetic (H) Fields are just a near field phenomenon. The E and H fields result in conducted emissions if the frequency is < 30Mhz. These fields behave as plane waves when the frequency is > 30 Mhz and is seen as radiation or Radiated emissions and is also known as the Far field phenomenon. Figure 2 is the analytical representation of the radiated and conducted EMI from an SMPS. The conducted EMI can couple back to the source and act as noise to other loads on the same source. The radiated noise is mostly a result of the selfoscillations of the inductive or capacitive elements (including the parasitic ones) in the converters or the higher harmonics of the switching frequencies.

Figure 1a: Simple switching of Mosfet Figure 2: Conducted and Radiated EMI in SMPS

Critical Area in Switching Converters Current always takes the path of the least impedance rather than the shortest path. The current waveform in switching converters is a combination of Low frequency currents and high frequency currents. Refer Figure 1 for the Current waveform. Its Fourier transform shows the odd sine harmonics (figure 3) where the amplitude is prevalent in the low frequency harmonics and the sharp rise and fall times are due to the high frequency content. The higher harmonics will have a different path as shown in Figure 3. Naturally the least impedance path for the higher harmonics is via the input and output capacitors rather than the source. Figure 1b: V and I waveforms

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Technology

Figure 4b: CE report when Cin is close to IC

Figure 3a: Odd Harmonics in a square wave

Figure 4c: CE report when Cin away from the IC, 10 dbuV extra

Design practices to mitigate EMI in switching converters 타 In synchronous switching converters the placement of the

Bootstrap capacitor and the bypass capacitors should be as close as possible to the high side FET driver and the low side FET driver respectively. If both the drivers are inside a single IC then the placement should be close to the IC.

Figure 3b: Low and high frequency current paths

The shaded area in figure 4a represents the critical area in a switching converter. To minimize the critical area, position of the input capacitors should be as close as possible. Figure 4b shows the CE emission when the Input capacitor (Cin) is located close to the IC. This minimizes the loop area and hence the impedance (XL is proportional to Area).

Figure 5a

Figure 5b 타 Avoid any Vias in the switch node. Vias add inductance and

Figure 4a: Critical path in Buck converter

can radiate. 타 Route short traces of width > 20mil for CBOOT, CVDD-bypass, and Gate drive. 타 Place output voltage divider resistors close to the Feedback

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Technology (FB) node (high impedance) and away from the switch node or any dv/dt source. The parasitic capacitive coupling from the switch node can induce a current and depending on the value of the resistors, offset the voltage at the output. Ĺ¸ Use an input filter at switching converter to prevent the Conducted EMI generated (from the switching converter) to couple back to the source. Detailed design technique can be found in Application note AN-2162Simple Success With Conducted EMI From DC-DC converters.

Radiated EMI in a power Tree A typical system will have a single power source (example a Battery) and multiple point-of-load conversions. Each converter will have an LC filter or a bypass capacitor which will provide the least impedance path for the high frequency currents to the system ground. However each input filter (or capacitor combinations) will be designed as per the switching converters operating frequency and will likely be different. Figure 6b shows the net (Ideal) impedance of all the filters on the Vdd line. Figure 6c shows the actual impedance. There are few points in the graph where the impedance is very high (peaking) which simply means that those frequencies will not be bypassed to the ground; hence they will have longer return paths and hence radiate. The basic solution is to use moderate ESR capacitors or input filters. Choosing electrolytic capacitors is often the best solution. Figure 6d shows the profile due to added ESR.

Figure 6c: Actual Impedance profile

Figure 6d: Impedance profile due to added ESR

Author: Akshat Garg is an Analog Applications Engineer in Texas Instruments Incorporated. His areas of interest include Power design, Signal chain for Data acquisition systems, communication interfaces and thermal management.

Figure 6a: Real system

Figure 6b: Ideal Impedance profile

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Power Electronics

Why ready-made DC/DC converter modules are often the most cost-effective solution

Is do-it-yourself still an option? Reinhard Zimmermann Product Marketing Manager RECOM Power GmbH

Electrical devices are normally powered through modular power supplies or batteries. Normally, however, these solutions provide only one direct current voltage, so that there is a need for DC/DC converters on the printed circuit board to power the various components. The 5V power supplied by the source is, for instance, converted on the spot to 3.3V for the processor, or to Âą12V for the operational amplifiers. DC/DC converters, however, perform a number of additional tasks, such as isolating assemblies. This might be necessary for safety reasons, as is the case in measuring probes used in medical applications. Sometimes, isolation is required for purely technical reasons, for instance for the galvanic isolation of amplifier channels. It therefore comes as no surprise that virtually all printed circuit boards are equipped with numerous DC/DC converters. Fig. 1: DC/DC converters not only provide the printed circuit board components with the voltage they require, but also act as insulators at interface ports and amplifier channels to prevent ground loops.

he circuitry of DC/DC converters is not exactly complex, and the internet is full of design proposals and ideas. Companies are therefore often tempted to ask their in-house developers to build the necessary DC/DC converters themselves. In theory, this should lead to considerable cost savings. In practice, things are not as simple, as this article on the intricacies of analog circuit technology demonstrates.

Need for expert knowhow in analogue technology There are two main reasons why device manufacturers are hesitant to opt for "offthe-shelf" DC/DC converters, which is common practice for AC/DC power supplies. On the one hand, DC/DC converters operate at much lower input voltages, and therefore appear more manageable. On the other

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Power Electronics hand, they are installed directly on the printed circuit board and manufacturers therefore wish to mount them in an automated process together with the other components. DC/DC converters essentially convert the incoming direct current into a square wave signal of several hundred Hertz, which is then transferred through a small toroidal transformer and subsequently rectified and smoothed. There are numerous free software products available that purport making dimensioning easy. However, analogue technology is a bit more complicated than it might appear at first sight, as it deals with switching transistors, charging capacitors, transformers, inductors and rectifiers that need to be carefully positioned to each other. The length of each conducting track, its distance to other such tracks, to the ground and to the individual components must be carefully considered to minimise parasitic capacitance and inductance. None of the readily available circuit diagrams provides this information. Transformers are tricky devices, as their performance is determined primarily by the quality of the ferrite in the core and the hysteresis curve section at which it is operated. If run near its saturation point, the ferrite becomes hot, losing its magnetic capacity. The fact that most characteristics are only available for sine waves, while the transformer is actually operated with a square wave signal, must also be taken into account. There are a number of alternative circuit topologies that address these issues, but they cannot be discussed here in detail.* The general principles of analogue technology have been known since the 1950s, but a lot of this knowledge has been lost as digitisation and "Industry 4.0" became the buzzwords. Even where engineers with a solid knowledge of analogue technology are at work, they might be struggling to find an optimised design that meets the latest standards. Leading manufacturers such as RECOM estimate that around 75 to 80 percent of the development time needs to be spent on design optimisation. For companies that are not specialising in this technology and still wish to design their own converters, this approach would be ruinous.

Ready-made modules are more efficient When considering the efficiency of DC/DC converters, technicians first of all think about electrical efficiency. With 1W converters, it is around 85 percent, provided that they are operated at full load. Specialist manufacturers, however, spend a lot of time and effort on achieving equally impressive values at the often more important medium load range. This is normally done by optimising the design, which is a task that few non-specialist companies have mastered so far. Let's have a look at a practical example: A cascade of twelve discretely designed 2W converters is operated at an average load of 75 percent. As the efficiency at this point is only 69 percent, 26W are to be provided at the input to obtain 18W at the output. If this cascade is replaced by R2S converters from RECOM, the efficiency jumps to 84 percent under the same operating conditions. While, at first glance, this might not be a huge difference, the power loss along the cascade is nevertheless reduced by nearly 60 percent from 8 to 3.4W! Apart from the obvious advantage of lower power consumption, this brings additional advantages as regards the overall design lifetime as the temperature inside the housing is significantly reduced. At this point, we might have a look at efficiency in a broader context, focussing initially on power density and module size. The packing density of resin-moulded modules is generally much higher that what can be achieved with units that are directly mounted on the printed circuit board. Modular converters therefore often only need half the space taken up by a discrete assembly, which is a major advantage as space tends to be very limited on circuit boards. Does certification have anything to do with efficiency? In a strictly technical sense, the answer is no. From a commercial point of view, certification, however, is crucial as the use of certified converters speeds up the certification process for the end product. This applies especially in cases where the supplier is able to submit relevant test reports such as the CB reports and the UL test results in advance. To avoid nasty surprises, these documents should be requested as early as possible. As a leading manufacturer in the field, RECOM is going one step further offering its customers the option to have their product tested at its in-house EMC lab prior to submission for certification.

Is there a quantity threshold beyond which modular converters are no longer a commercially viable option?

Fig. 2: For the design of its converters, RECOM aims at optimising the efficiency of the modules across a broad load range. This helps reduce heat loss to a minimum.

There is no simple answer to this question as each case must be evaluated individually. Taking into account the costs for development, materials and production, discretely manufactured converters are around half as expensive as fully assembled modules. Let's look at a concrete example: Over five years, 15,000 units of a diagnostic device are to be sold at a price of CHF 3,000. The printed circuit board is equipped with three different converters that can be bought as fully certified units for a combined price of CHF 8.00. The actual material and production costs for these converters is CHF 4.00. In other words, the manufacturer could potentially save around CHF 60,000. What has not yet been taken into account are, however, the unavoidable costs for development and testing, in particular the EMC tests. For each

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Power Electronics converter, we assume that these tasks can be completed within twelve days, plus an additional three days for certification. At labour costs of around CHF 750 per day, and including average expenses for materials and the use of the test lab, the overall savings are now reduced to CHF 20,000 â&#x20AC;&#x201C; assuming that everything goes to plan! In reality, manufacturers must be prepared for some hiccups, especially with regard to the complex topic of EMC. It is therefore only prudent to include at least one redesign per converter, which translates to six additional working days plus waiting time for lab testing. At this point, the savings are reduced to a few thousand Swiss francs, while the launch of the diagnostic device is already delayed by about eight weeks!

converters. In all this, we also have to consider that the power supply is normally the very last component tackled in the design process. For their new products, companies are thus well advised to carefully evaluate whether they want to face the risks associated with the internal development and production of DC/DC converters.

Fig. 4: More and more developers opt for fully certified DC/DC converters such as those of the E series from RECOM as they often provide the cheaper option.

Fig. 3: Testing at the EMC lab reveals whether the product meets the limits set by the certification standard. RECOM customers can have their products tested at the RECOM headquarters prior to the official certification.

Such delays must obviously also be taken into account as they tend to come at a price! If the product has a long service life and the manufacturer is well ahead of the competition, a delay of a few months might not be detrimental. Companies who must make up for lost terrain with an attractive new product, will, however, face an uphill battle. In our example, a delay of eight weeks corresponds to around three percent of the calculated service life. Based on a linear calculation, we are looking at a loss of revenue of just below CHF 1.5 million! At this point, it becomes obvious that, for high-volume items, running the risk of a delayed market launch is not worth the potential savings that can be made with discretely manufactured

Have You Got the Spotlight?

Summary Manufacturers opting for ready-made DC/DC converters from specialist suppliers benefit from shorter development times, free up internal resources, and avoid the risk of failing the EMC tests or certification procedures for their end products. Thanks to mass production, the prices of converter modules have also come down over the past few years, so that internally designed converters are hardly ever a viable option today, even for largevolume products. Companies might also face the problem that their young engineers are not fully familiar with analogue technology, which is another good reason to trust the specialist manufacturers of ready-made modules. We predict that, in a few years, purchasing converter modules from specialist suppliers will be as common as it is now for operational amplifiers and other logics components. Do-it-yourself will just no longer be viable! *For readers who wish to know more, we recommend the DC/DC Book of Knowledge by Steve Roberts, which can be downloaded from www.recom-power.com.

Buy now at 30% off. MRP. Rs 1000/-

Spotlight On Indian

electr nics 2016

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sie2016.in An Essential for Indian Electronics Industry, towards $400bn target by 2020.

In Conversation

UltraSCALE Architecture ELE Times: What are your views on the entry of UltraScale + FPGA, SoC and 3D ICs in the LTE-Advanced, and the wireless 5G. Giles Peckham: 5G is all about securely connecting billions of devices faster, with a solid connection, almost anywhere. It will go well beyond the current mobile experience, improving overall service to help usher in the era of Internet of Things, with 1000X network capacity for 100X the number of connected devices and machines. Over 50 billion connected devices are expected by 2020. As a result, 5G networks must be more scalable, intelligent, and heterogeneous. Technologies such as distributed small cells, massive-MIMO with hundreds of antennas, and centralized base-band processing via CloudRAN, will dramatically increase coverage and data throughput. Networks will need to connect securely through backhaul and optical front haul for processing. For 5G, Xilinx All Programmable technology is helping solve capacity, connectivity, and performance challenges. It also provides the flexibility to support multiple standards, multiple bands and the multiple sub-networks that enable the many diverse IoT driven applications of 5G. Xilinx provides a flexible, standards-based solution that combines software programmability, multi-standard and multiband hardware optimization, and any-to-any connectivity with the security needed for 5G networks. Customers can quickly develop their applications on Zynq MPSoC and UltraScale FPGAs silicon platforms using Vivado High-Level Synthesis, SDSoC, and SDAccel software defined environments. Xilinxâ&#x20AC;&#x2122;s products offer customers multiple differentiating advantages vs. other types of solutions. They offer the benefit of a flexible platform that can give them a 1-2 time to market advantage vs. ASIC alternatives at a >50% lower total cost of ownership as well as a scalable future proof platform. The strength of the advanced 16nm process with new technology innovations will allow customers to create architectures that can span 5X the frequency bandwidth at 3X the number of bands traditionally served with Â˝ the power consumption of older technology solutions. ELE Times: Define megatrends in Xilinx system design and what are the key challenges? Giles Peckham: Over 50 Billion devices and machines will be connected by 2020. Once connected, they must be secure to deter intruders, right down to the hardware level. As these devices, machines, systems, and networks become more context aware, they must adapt to their environments and demands, being more programmable and software defined.

Staying a Generation Ahead with an Extra Node of Value

ilinx's new 16nm and 20nm UltraScale families are based on the first all programmable architecture to span multiple nodes from planar through FinFET technologies and beyond, while also scaling from monolithic through 3D ICs. At 20nm Xilinx pioneered the first ASIC-class All Programmable architecture to enable multi-hundred gigabit-per-second levels of system performance with smart processing at full line rates, scaling to terabits and teraflops. At 16nm, UltraScale+ families combine new memory, 3D-on-3D, and multi-processing SoC (MPSoC) technologies to deliver a generation ahead of value. Giles Peckham, Regional Marketing Director, Xilinx Inc discusses the subject at length with ELE Times. Excerpts.

Giles Peckham

Regional Marketing Director Xilinx Inc

ELE Times | 58 | November, 2016

In Conversation They also must be scalable, with ever more functions virtualized and efficiently mapped onto shared compute resources. As data and video is captured from sensors and cameras everywhere, analytics must enable these machines to recognize, interpret, decide, and act. These systems and networks must also meet the growing demands of impatient end users and real time scenarios that require immediate, low latency response. Yet, behind the scenes, they must process an exponentially growing amount of data, packets, and pixels with ever more sophisticated algorithms while consuming the lowest possible power. And they must be highly differentiated, or they will fail in the increasingly competitive and cost sensitive worldwide market. This can only be accomplished by combining software intelligence with hardware optimization and any-to-any connectivity. Xilinx All Programmable Solutions enable Smarter, Connected, and Differentiated Systems, integrating the highest levels of softwarebased intelligence with hardware optimization and any-to-any connectivity. Xilinx is the only company that can enable differentiation through a combination of software intelligence and programmable hardware optimization. All programmable devices with programmable hardware optimization provide 4 differentiating advantages over the type of devices (ASICs, ASSPs, GPUs, CPUs): performance/watt, any to any connectivity, security and safety and chameleon platforms. ELE Times: How is Xilinx FPGA’ different from the competitors? Giles Peckham: With an exceptional execution on the 28, 20, and now 16 nanometer nodes, Xilinx has worked hard to maintain three generations of technology leadership. Xilinx is the only PL vendor fully committed to silicon products and solutions for all market segments. Xilinx can simultaneously address today’s 3G, 4G, Pre-5G requirements with our 28, 20, and 16nm products. Our roadmaps are aligned to customer’s 5G development needs since they can leverage our currently shipping 16nm FF+ FinFET based products for early development as well as have confidence in our delivery schedules of future 7nm architectures for their volume production. Xilinx launched multiple product families with breakthroughs in integration and optimization which has changed the game in price/performance/watt and enabled programmable systems integration. Breakthroughs also include Software Development Environments supporting C, C++ and Open CL development, in particular SDSoC which is the industry’s only C/C++ full-system optimising compiler. The Xilinx All Programmable product portfolio based on 28nm and 20nm planar and 16Fin FET+ technologies keeps customers a generation ahead of their competition with an expansion of its offerings from three perspectives: Ÿ Portfolio: UltraScale™ architecture-based All Programmable

FPGAs, 3D ICs and SoCs Ÿ Product: Co-optimized with the Vivado™ Design Suite for

extra performance, power, and integration

Ÿ Productivity: Unmatched time to integration and

implementation Xilinx is committed to staying a generation ahead with aggressive roadmaps across each of the three elements of its broader portfolio, with each element supporting and reinforcing the previous generation. With the addition of UltraScale+, Xilinx has built upon the UltraScale architecture which allows for simple migration between planar and FinFET nodes. This allows customers to migrate their 20nm designs and benefit from the performance per watt advantages of FinFET technology. Building on the core UltraScale architecture at 20nm, Xilinx’s 16nm UltraScale+ family of FPGAs, 3D ICs and MPSoCs, combine new UltraRAM and High-Bandwidth Memory (HBM), 3D-on-3D and multi-processing SoC (MPSoC) technologies, delivering a generation ahead of value. To enable the highest level of performance and integration, the UltraScale+ family also includes a new interconnect optimization technology, SmartConnect. These devices extend Xilinx’s UltraScale portfolio - now spanning 20nm and 16nm FPGA, SoC and 3D IC devices - and leverage a significant boost in performance/watt from TSMC’s 16FF+ FinFET 3D transistors. Optimized at the system level, the UltraScale+ family delivers far more systems integration and intelligence, and the highest level of security and safety than previous generations of technology. The newly extended Xilinx UltraScale+ FPGA portfolio comprises Xilinx’s market leading Kintex UltraScale+ FPGA and Virtex UltraScale+ FPGA and 3D IC families, while the Zynq UltraScale+ family includes the industry’s first all programmable MPSoCs. The UltraScale+ MPSoC Architecture, built on TSMC’s 16nm FinFET process technology, enables next generation Zynq UltraScale MPSoCs. This new architecture provides processor scalability from 32 to 64 bits with support for virtualization, the combination of soft and hard engines for real time control, and graphics/video processing, waveform and packet processing, next generation interconnect and memory, advanced power management, and technology enhancements that deliver multilevel security, safety and reliability. These new architectural elements are coupled with the Vivado® Design Suite and abstract

ELE Times | 59 | November, 2016

In Conversation design environments to greatly simplify programming and increase productivity. The high end of the UltraScale+ portfolio leverages the combined power of 3D transistors and 3rd generation of Xilinx 3D ICs. Just as FinFETs enable a non-linear improvement in performance/watt over planar transistors, 3D ICs enable a non-linear improvement in systems integration and bandwidth/watt over monolithic devices. Built from the ground up for Xilinx’s 28nm portfolio, the Vivado Design Suite has been co-optimized with the UltraScale architecture to deliver significant quality of results, routability, utilization, and productivity advantages. When combined with UltraFast, a potent methodology that covers all aspects of board planning, design creation, design implementation and closure, programming and hardware debug, design teams will be able to accelerate their time to predictable success. Productivity for the front end design process is multiplied by more than 4X with high level synthesis and IP integration tools. Productivity in design implementation improves by more than 4X due to faster hierarchical planning and analytic place and route engines as well as support for fast incremental ECOs. Two years ago Xilinx launched the SDx Development Environments for Embedded Computing. The SDAccel and SDSoC Environments offer GPU-like and familiar embedded application development and runtime experiences for C, C++ and/or OpenCL development, while the SDNet Environment enables networking engineers to create high performance programmable data plane designs. All these platforms are available with support for a variety of Xilinx and third party boards, libraries and tools. Xilinx's embedded runtime development environments and tools include comprehensive training and support for developing your ARM or Micro Blaze based platforms. You have access to the debuggers, compilers and other tools you need as well as complete Linux and Multi-OS environments. These embedded runtime environments target multiple boards using readily available reference designs and libraries with development support from videos, Github, Wiki, and other open source resources. ELE Times: Briefly describe the role of FPGA in powering High Performance Computing? Giles Peckham: Today, both commercial and academic HPC computing sitesneed enormous performance to process increasingly complex algorithms on larger data sets while achieving greater energy efficiency. Computing platforms based on Xilinx FPGAs enable up to 25X better performance/watt for data center applications than CPUonly servers. The SD Accel development environment combines the industry's first architecturally optimizing compiler supporting any combination of OpenCL, C, and C++ kernels, along with libraries, development boards and the first complete CPU/GPU like development and run-time experience for FPGAs.

ELE Times: Please explain the necessity of FPGA and its use in Data Centers, 5G wireless and cloud. Giles Peckham: Data centers need to be workload optimized so they can adapt to rapidly changing throughput, latency, and power requirements from a wide range of large scale, virtualized applications. These applications include machine learning, video transcoding, and big data analytics, along with storage and networking. Through workload optimization, Xilinx can enable servers to deliver 10X the throughput with one tenth the latency relative to CPU based alternatives. Applications are written in a mix of languages that include OpenCL, C, and C++. Only Xilinx provides a flexible, standards-based solution that combines software programmability, workload optimization, and high performance data center interconnect with the security needed for the next generation of cloud computing. Xilinx's All Programmable portfolio includes UltraScale technology that serves as a scalable reconfigurable acceleration platform that can be optimized on demand to any workload. Xilinx's software defined development environment, SDAccel, enables customers to quickly develop their unique applications using any mix of OpenCL, C, and C++. SDAccel deploys a unique architecturally optimized compiler and partial reconfiguration technology that together offer the highest quality of results with a flexible runtime capability. Furthermore, Xilinx announced recently the expansion of its 16nm UltraScale+ product roadmap with new acceleration enhanced technologies for the Data Center. The resulting products will deliver the powerful combination of Xilinx's industry-leading 16nm FinFET+ FPGAs with integrated HighBandwidth Memory (HBM), and support for the recently announced Cache Coherent Interconnect for Acceleration technology (CCIX). CCIX is initially driven by a group of seven companies to enable an acceleration framework that works with multiple processor architectures. These acceleration enhanced technologies will enable efficient heterogeneous computing for the most demanding data center workloads. The new products will also be highly leveraged in many other compute intensive applications requiring high memory bandwidth. Built on TSMC’s proven CoWoS process, Xilinx HBM-enabled FPGAs will improve acceleration capabilities by offering 10X higher memory bandwidth relative to discrete memory channels. HBM technology enables multi-terabit memory bandwidth integrated in package for the lowest possible latency. To further optimize data center workloads, the new CCIX technology promotes efficient heterogeneous computing by allowing processors with different instruction-set architectures to coherently share data with accelerators such as the Xilinx HBMenabled FPGAs. Xilinx is collaborating with leading hyperscale data center customers to create accelerated servers customized and optimized for their workloads.

Errata- Rohde & Schwarz Looking forward to a healthy manufacturing eco-system in India We express our apology to Mr. Yatish Mohan, Managing Director, Rohde & Schwarz India, for typographical error in an article “Rohde & Schwarz Looking forward to a healthy manufacturing eco-system in India”. The mistake is unintentional and nothing else. From ELE Times, October 2016 issue — "In our special story of Rohde & Schwarz Looking forward to a healthy manufacturing ecosystem in India (Page 63 and 64), we wrote “Rhode & Schwarz”. In fact, it should be read as “Rohde & Schwarz” on both the pages.

ELE Times | 60 | November, 2016

Industry 4.0 & Robotics

Cloud And Analytics: Key to Finding Success with 5G And IoT

Test Equipments for IIT Labs

Sensors & Machine Vision

Power Management

Interconnects & Switches

Image Sensors & Vision Computing

Encryption & Data Security

January

February

March

April

May

June

July

August

Artificial Inteligence

MEMS technologies & Environmental Sensors

LED Lighting 40.00 Technologies

October

November

December

September Power Supplies & Batteries

Cover Story

ISSUE

Industry 4.0 & IoT

Wireless Communications

T&M: Mobile Network Testing

Biometrics & Authentication

T&M: Wireless Device Test Sets & Wireless Solutions

IoT & The Smart Home

Microcontrollers & Microprocessors

Sensors & Signal Conditioning/MEMS

3D Printing, Rapid Prototyping, Additive Mfg

Prototyping & Development Boards

T&M: Wireless Device Test Sets & Wireless Solutions 4D printing

T&M: RF & Microwawe

Optoelectronics & Photonic Circuits

Adoption of IoT: How is India Positioned In This Race? T&M: Oscilloscopes, Analyzers, Meters

Memory Technologies

Panel Displays and Projectors

Smart Robots

Future-Proofing Big Data

Brain Computer Interface

T&M : Power Measurements

LTE / LTE-Advanced

The Internet Of Things Ecosystem: Unlocking The Business Value of connected devices

Tech-Focus

Real-Time Operating Systems for Embedded Applications

Multicore Software Development Technologies

Essentials of an ideal embedded computing system in an IoT device

Optimization techniques for multicore processors

Embedded software architecture and design optimizations

General embedded optimization techniques

Industrial Automation & Control

Design Apps

Microwave & RF Circuits

IC Design & EDA Tools

Multicore Designs & Hardware Virtualization

Analog and Digital interfaces in High-speed designs

Embedded Systems & Design

LED Based Lighting

VRLA, SMF & Li-ion Batteries

EMS

Aviation & Defence Electronics

Telecommunication

Medical Electronics

Automotive

Alternative Energy

Govt. & PSUs

Consumer Electronics

Electrical & Power

Automation

Industry Focus

Elektrotech 2017, Coimbatore Electronica India & Productronica India 2017, NI DAYS 2017*, ESC 2017*

IPCA Expo 2017, New Delhi

SPS Automation 2017

LED Expo 2017, Mumbai

EL Asia 2017, Mumbai

International Conference on Electronic Technologies: Silicon to Software (ICNETS2)â&#x20AC;? 2017, Chennai

Convergence 2017, New delhi

IESA Vision Summit 2017, Bangalore

IOT Tech Expo 2017, London

IEEMA-INTELECT 2017, Greater Noida

Events & Conferences (Bonus Distribution )

LED Expo 2017 Delhi

COMSOL Conference 2017*

Conferences and trade fairs will be added gradually

IoT and Aerospace

Robotics

Embedded Computing Embedded System Conference, 2017*

Cyber Security

RF and Microwave

Wireless

UAV/Drones

Electronics Warefare

Testing systems

High Rel Components

Aerospace and Defence Electronics

Railways

Government Aviation/Defence

Editorial Calendar 2017

New Products

RC-E discrete IGBTs from Infineon allow for drop-in replacement with benchmark for price/performance Induction cooking appliances commonly make use of resonant topologies which allow bi-directional current flow. Additionally, they demand a discrete IGBT that performs best at switching frequencies from 18 to 40 kHz and has low losses. Infineon Technologies AG launches a new family of discrete IGBTs to address these needs. The new RCE devices are cost optimized and specifically meet the demands of low- to mid-price range induction cookers and induction rice cookers. The RC-E delivers the well-established high-performance of its predecessors with a more attractive price for lower BoM cost. The RC-E is offered in a standard TO-247 package allowing a drop-in replacement for existing designs.Samples are available now and the devices are in production. The family will be launched with two devices: 15 A and 25 A, both with the most commonly used blocking voltage of 1200 V. Visit: www.infineon.com/rc-e.

STMicroelectronics Boosts Access to High-Performance Embedded Design STMicroelectronics has introduced new STM32F7 microcontroller lines and added accessories and options to the development ecosystem, easing access to highperformance embedded design based on the ARM Cortex-M7 core. The latest STM32F722 and STM32F723 microcontrollers in the very high-performance STM32F7 series reduce memory footprint by integrating value-added features including code-execution protection and high-speed USB physical-layer (PHY) circuitry that streamline development of connected applications. The STM32F732 and STM32F733 variants come with extra cryptographic features on-chip, such as an efficient AES256 HW engine. There are versatile package options from a 64-pin LQFP up to 176-pin LQFP or UFBGA for projects demanding high I/O count, and 256KB or 512KB of on-chip Flash memory with 256KB RAM. Visit www.st.com/stm32f7

Astrum Launches Wireless Portable HDD Enclosure: A Smart Wi-Fi Networking Solution Astrum Holdings, the company dedicated in creating intelligent products for use with computers, tablets and mobiles, announced its launch of EN500; 2.5" Wi-Fi SATA HDD Enclosure. With ultra-small external design, this device is most suitable for frequent travelers who want access to their desktop HDDs on regular basis. EN500 is user friendly, USB powered external HDD enclosure for 9.5 mm 2.5" SATA HDD and converts the user's internal hard disk into a portable and protected external drive. The lightweight yet sturdy enclosure is USB 2.0, USB 3.0, RJ45 WAN and 2.5" SATA HDD compatible and utilizes the USB 3.0 transfer capabilities for blazing speeds. Integrated with Wi-Fi technology, this Wi-Fi enclosure provides quick access to the data through personal smart hand-held devices up to 5 devices. Be it iOS or Android device, native applications through the App Store and Google Play market. It also contains USB 3.0 for fast direct access to data from computer, making it perfect solution to access any hard drives in seconds.

Mouser Now Stocking Cypress PSoC 4XX8_BLE Controllers for Sensor-Based IoT Applications

Telit Introduces High-speed IoT Module for the Fixed Wireless LTE Broadband Market Telit, a global enabler of the Internet of Things (IoT), on October 15, 2016, announced it is taking orders for the LE922A6, an LTE Category 6 (Cat 6) module series targeted at the growing market of fixed wireless LTE broadband applications. The module series is planned to evolve in lock step with worldwide carrier deployments of very-high-speed LTE services starting now with Cat 6 at 300Mbps, going up to Cat 9 at 450Mbps and to Cat 12 at 600Mbps in the coming years.

Pasternack Releases Analog Phase Shifter Modules Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the PSoC 4XX8_BLE embedded system controllers from Cypress Semiconductor. Containing the same core features as Cypress’ popular PSoC 4 family of embedded system controllers, these highly integrated, singlechip Bluetooth low energy (BLE) solutions also add a 2.4 GHz radio core that makes the devices compliant with Bluetooth Smart Specification 4.2. The PSoC 4XX8_BLE programmable system-on-achip (PSoC) devices integrate BLE with a 32-bit ARM Cortex-M0 core and deliver a highly scalable and configurable low-cost, single-chip alternative to microcontrollers and external ICs typically required for similar functionality.

Supporting Frequency Bands Ranging from 5 GHz to 18 GHz Irvine, CA - Pasternack, a leading manufacturer and supplier of RF, microwave and millimeter wave products, has introduced a new series of analog phase shifters that are used to control the phase characteristics in the processing of microwave signals and can also be used as phase modulators to control a modulating baseband signal. These versatile analog phase shifters provide a continuously variable phase response that’s controlled by a single voltage source that delivers almost unlimited resolution with monotonic performance. The analog control feature is popular for communications applications, radar systems and test equipment. Visit: https://www.pasternack.com/pages/RF-Microwaveand-Millimeter-Wave-Products/analog-phaseshifters.html. Contact: Tel: +1-949-261-1920

ELE Times | 62 | November, 2016

New Products

Introducing industry's first fully integrated DDR memory power solution

Analog Devices' MEMS Accelerometers Enable Early Detection of Structural Defects

Texas Instruments (TI) on October 03, 2016, introduced the industry’s first fully integrated power management solution for double date rate (DDR)2, DDR3 and DDR3L memory subsystems in automotive and industrial applications. The TPS54116-Q1 DC/DC buck converter is a 2.95-V to 6-V input, 4-A synchronous step-down converter with a 1-A peak sink/source DDR termination and buffered reference that reduces system size by up to 50 percent compared to discrete implementations. Designed for automotive applications such as infotainment, advanced driver assistance systems (ADAS) and instrument clusters, the TPS54116-Q1 can also power DDR memory in telecommunication, test and measurement, and factory automation equipment. Used in conjunction with TI’s WEBENCH online design tools, the TPS54116-Q1 simplifies power conversion and speeds the power-supply design process. Visit: www.ti.com/tps54116q1-pr.

Analog Devices, Inc. (ADI) on September 5, 2016, announced three-axis, MEMS accelerometers that perform high resolution vibration measurement with very low noise to enable the early detection of structural defects via wireless sensor networks. The low power consumption of the new ADXL354 and ADXL355 accelerometers lengthens battery life and allows extended product usage by reducing the time between battery changes. The low noise performance of the ADXL354 and ADXL355 with low power consumption makes it now possible to cost-effectively enable low-level vibration measurement applications such as Structural Health Monitoring (SHM). Additionally, the tilt stability of ADXL354 and ADXL355 accelerometers delivers excellent repeatability over temperature and time, which is ideal for orientation and navigation systems in unmanned aerial vehicles using Inertial Measurement Units (IMUs) and inclinometers. By providing repeatable tilt measurement under all conditions, the new accelerometers enable minimal tilt error without extensive calibration in harsh environments.

TVS Diode Arrays from Littelfuse Guard against ESD, CDE, EFT, and Lightning-Induced Charges SP3374NUTG Series TVS Diode Arrays (SPA Diodes) from Littelfuse are optimized for protecting high-speed differential data lines from ESD, CDE, EFT, and lightning-induced surges. Each device can protect up to four channels or two differential pairs against up to 40A (IEC 61000-45 2nd edition) and up to 30kV ESD (IEC 61000-4-2). The SP3374NUTG’s low capacitance and low clamping voltage make it ideal for 1GbE applications such as the high-speed data interfaces found in notebooks, desktops, servers, switches, etc. Additional applications include 10/100/1000 Ethernet interfaces, WAN/LAN equipment, LVDS interfaces, integrated magnetics, and Smart TVs.

STMicroelectronics and WiTricity to Develop Integrated Circuits (ICs) for Resonant Wireless Power Transfer STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and WiTricity, the industry pioneer in wireless power transfer over distance, today announced their design collaboration to develop semiconductor solutions for magnetic-resonance-based wireless power transfer. The goal is to “cut the last cord,” bringing convenience to the powering and charging of consumer electronics, Internet of Things (IoT) devices, as well as medical, industrial, and automotive applications.

ELE Times | 63 | November, 2016

New Products

AVX announces 5236 Series µSIM memory card connectors from Kyocera Connector AVX Corporation, a leading manufacturer of passive components and interconnect solutions, and the only authorized supplier of Kyocera Electronic Devices to the Americas and Europe, announces the 5236 Series µSIM memory card connectors from Kyocera Connector Products. Available in both single- and dual-card versions, both of which share a common PCB layout and feature 33% more signal pins than comparable connectors — eight for the single and 16 for the double — 5236 Series connectors feature a shell guide mechanism that prevents incorrect card insertion and unwanted ejection, enabling the secure operation of µSIM cards in mobile electronics, including smartphones and tablet PCs. Compact and low profile, with a minimal 0.7mm pitch, the series also features a normally closed internal card switch that detects the presence of an inserted card to lower overall power consumption, as well as a user-friendly push-push, spring-eject mechanism with an assured card ejection distance of 3.8mm for improved workability. Visit http://www.avx.com/products/connectors/memory-products/microsim-card-connectors-5236series/.

Rohde & Schwarz to present T&M solutions for latest technologies at electronica 2016 The 'electronica' trade fair will be held from November 8 to 11, 2016, in Munich. Rohde & Schwarz will present its portfolio of T&M solutions tailored to the requirements of today’s most significant technology trends. The test solutions for advanced technologies will include those for fifth-generation mobile radio (5G) and wireless gigabit. The company’s 5G test setup at electronica will consist of an R&S SMW200A vector signal generator and an R&S FSW85signal and spectrum analyzer. Along with that, state-of-the-art test systems for embedded designs, automotive systems along with signal integrity test solutions will be showcased. Many highly integrated components are developed for Internet of Things (IoT) applications and are equipped with an air interface. The R&S CMW wideband radio communication tester und the R&S RTZVC04 probe can be used to test and monitor. Rohde & Schwarz will present its product portfolio at electronica 2016 in hall A1, booth 307. A press day will be held on Tuesday, November 8, 2016. Journalists are invited to come and find out more about the products on display.

OptiMOS 5 150 V delivers a breakthrough reduction in on-state resistance and reverse recovery charge Aiming at high-efficiency designs and applications, Infineon Technologies AG introduces the OptiMOS 5 150 V portfolio. This product family further expands the industry-leading OptiMOS 5 generation of power MOSFETs. The new 150 V product family is especially optimized for highperformance applications which require low charges, high power density and yet high ruggedness. It is an important contributor to Infineon’s system solutions for low voltage drives, synchronous rectification in telecom rectifiers and brick converters as well as solar power optimizers. Compared to the next best alternative, OptiMOS 5 150 V offers a breakthrough reduction in on-state resistance RDS(on) of 25 percent in a SuperSO8 package. With the same RDS(on) the FOMg of this product family is improved by up to 29 percent over the previous generation. Increased commutation ruggedness is provided by the ultralow Qrr, which is 72 percent lower than the next best alternative in SuperSO8. An additional outstanding feature of this product family is an improved EMI behaviour. Visit: http://www.infineon.com/optimos5-150V

Antenova announces Inca – an “easy integration” antenna with high gain for small devices in the 433MHz band Antenova Ltd, manufacturer of antennas and RF antenna modules for M2M and the Internet of Things, has added a brand new antenna, Inca (part no SRFI028), to its flexiiANT FPC range. This antenna is for small devices in the 433MHz ISM band. The antenna measures 101.0mm x 20.0mm x 0.15mm, and weighs just 0.5g, with a peak gain of 2.80dBi. It is suitable for any small electronic device in the 433MHz band, typically remote monitoring, robot control, smart meters, home automation and medical devices. It can also be used with low power wireless modules, as the 433MHz band is increasingly being chosen for IoT applications that exploit the longer range that can be achieved with this frequency. Inca (SRFI028) is supplied in packs of 100 for convenience and quick delivery. Visit: www.antenova-m2m.com

Mfrs. of:- LED Bulb, Street Lights, Flood Lights Down Lights, Square Panel Lights, Round Panel Lights TM

SMD ELECTRONICS PVT. LTD.

42A/13 1st Floor, Near R-Block, Laxmi Narayan Mandir, Dilshad Garden, Delhi-110095 Ph. : 011-65909412, Cell: 9810282348, 8826114422 Email : info@smdepl.com, pramod@smdepl.com | Web. : www.smdepl.com

ELE Times | 64 | November, 2016

New Products

Murata â&#x20AC;&#x201C; Efficient DC-DC converter designed for rough service or industrial applications

A new development effort for industrial class DC-DC half brick converter modules is available from Murata Power Solutions. The ICH series of industrial grade, isolated DC-DC converters provide highly efficient, baseplate-cooled power from 360W up to 500W from an industry-standard half-brick package measuring 61mm x 64mm x 13.2mm. The series was designed for rough service or industrial applications and incorporates features such as a wide 4:1 input voltage range, from 9VDC to 36VDC, and a specially designed package/baseplate that allows conduction cooling for improved thermal performance including closed-box applications. These highly efficient converters, typically up to 95.7% for the 500W unit, are available in three single-output models providing regulated 12VDC, 24VDC or 28VDC. The electrical and mechanical design allows the ICH series to deliver the full power rating with a baseplate temperature of -40C to +105C without derating.

NAVRANG ELECTRONICS Deals in

Industrial Electronic Components REXNORD-FAN OEN-RELAYS RAVI-PULES TRANSFORMER MOSFETS & DRIVERS BOURNS- TRIMPOT & HELIPOT

AMPTEK-SMF BATTERIES PANKAJ- POTENTIOMETER IGBT TRIACS & SCRS HKC-CRYSTALS

NAVRANG ELECTRONICS

239, Lajpat Rai Market, Delhi-110006 Telephone : 011-23867631, 23860623 M: 9873847233, E-Mail : seleshgupta@yahoo.co.in ELE Times | 65 | November, 2016

Email: sales@tangenttest.com Web: www.tangenttest.com