EP&Dee no 1, 2015 by Electronica Azi

FEBRUARY, 2015 足 ISSUE NO. 1, VOL. 13

DESIGN & MANUFACTURING

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FEBRUARY 2015 Table of Contents

Win a Microchip 3DTouchPad

DESIGN FEATURES 8 An introduction the ‘Sudden Impact’ Series The wearable fitness market is entering a new phase and with the industry predicted to be worth $12billion by 2018, there is the opportunity for manufacturing and technology firms to establish themselves as market leaders. It is time for these businesses to take an active role and enable innovative solutions to promote healthier living, prevent injuries and ultimately, save lives.

10 Trends in Power Electronics: Power Goes Fast and Smart Growth markets and applications such as wireless charging, energy harvesting and digital power also require new technologies and new processes from the field of power electronics.

12 Increasing Automotive Safety Through Embedded Radar Technologies In response to a need for active and predictive safety systems within the automotive sector, semiconductor suppliers are developing innovative radar-based embedded solutions. These next-generation technologies present unique capabilities for designers of Advanced Driver Assistance Systems (ADAS), enabling life-saving safety features as well as compliance with the latest regulatory standards.

EP&Dee is offering you a chance to win a Microchip 3DTouchPad! Microchip introduces the first 2D/3D input sensing Development Platform. The 3DTouchPad (DM160225), is a productionready development kit and reference design which combines 2D tracking of up to ten fingers, with 3D air gesture recognition for fast development of advanced input sensing for PC peripherals and other applications.

18 The power of three to increase digital power adoption Digital power is becoming an increasingly important technology in our industry. Energy consumption is reaching extremely high levels worldwide and particularly so in Information and Communication Technology (ICT) and in data centers even more so. In addition to which, the increasing complexity of power distribution systems means that the flexibility of digital power can help with the sheer number of different voltage rails required for microprocessors, ASICs, FPGAs and other digital logic.

22 Managing the evolution of PLC standards Do they fulfil todays and future requirements and is there a “best way” to deal with the plethora of standards? As always it’s not only the technical aspects, but also the commercial ones.

24 MIPS P5600 CPU sets new record for embedded processing performance 28 What accuracies can color sensors and mini-spectrometers achieve? Spectrometers are used as reference devices in color measurements. However, they usually are to expensive and bulky for active usage in most applications.

PRODUCT NEWS 20 Embedded Systems (p 4, 5, 6, 7, 9, 20, 26, 27) Sensors (p 32) Active Components (p 34 - 39) Passive Components (p 40)

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For the chance to win a Microchip 3DTouchPad, visit: http://www.microchip-comps.com/epdee-3dtouchpad

Based on Microchip’s GestIC® technology, 3DTouchPad’s robust and innovative 3D gesture recognition technology offers a detection range of up to 10 cm, whilst the highly responsive 2D projected-capacitive multi-touch input sensing supports up to 10 touch points and multi-finger surface gestures. As a plug-and-play PC peripheral, 3DTouchPad connects to a PC using a single USB cable and includes a free Graphical User Interface (GUI), Software Development Kit (SDK) and Application Programming Interface (API). It also offers out-ofthe-box driverless features to enhance the user experience for Windows® 7/8.X and MacOS®.

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Contributing editors Radu Andrei Ross Bannatyne Consulting Marian Blejan Bogdan Grămescu Mihai Savu Asian Reprezentative Taiwan Charles Yang Tel: +88643223633 charles@medianet.com.tw

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EP&Dee (Electronics Products & Design Eastern Europe) is published 10 times per year in 2015 by Euro Standard Press 2000 s.r.l. It is a free to qualified electronics engineers and managers involved in engineering decisions. Starting on 2010, this magazine is published only in digital format. Copyright 2014 by Euro Standard Press 2000 s.r.l. All rights reserved.

INDUSTRY NEWS Deciso delivers new open source firewall alternative By releasing the full potential of the AMD GSeries SOC for wire speed gigabit network security it is now possible to protect networks with affordable and turnkey open source firewall appliances. The new OPNsense firewall appliances provide an easy-to-use yet powerful platform to users and developers. Its source code is open and verifiable for all. The AMD G-Series SOC made it possible to design a product without bottlenecks that is stable, cost effective and durable. “At Deciso we are proud that the new network platform is fully designed and made in The Netherlands" said Jos Schellevis, chief technical officer and shareholder of Deciso. “The great co-operation with AMD Embedded Solutions has made this possible.”

The embedded low-power design eliminates high cooling requirements that current high performing server-like designs demand. A typical power usage of only 20W for the powerful quad-core version demonstrates this. It is this combination of hardware and software that not only provides the required performance, but at the same time it spares your budget and saves the planet. “As an innovator in embedded networking solutions, AMD is proud to collaborate with Deciso to offer a new open source firewall alternative,” said Scott Aylor, corporate vice president and general manager, AMD Embedded Solutions. “The AMD Embedded G-Series SOC enables Deciso to deliver an ultra-low power design for the new OPNsense firewall appliance, without comprising performance and stability.” The large feature set of the OPNsense firewall software includes several high end features like load balancing, high availability and captive portal, all without licensing costs. This feature set and the powerful hardware foundation makes the product a viable alternative for many expensive proprietary solutions. DECISO AMD 4

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EMBEDDED SYSTEMS New Microchip GestIC® controller enables one-step design-in of 3D gesture recognition in embedded devices Microchip announces the second member of its award-winning and patented GestIC® family. The new MGC3030 3D gesture controller features simplified user-interface options focused on gesture detection, enabling true one-step design-in of 3D gesture recognition in consumer and embedded devices. Housed in an easy-to-manufacture SSOP28 package, the MGC3030 expands the use of highly sought after 3D gesture control features to high-volume cost-sensitive applications such as toys, audio and lighting. Watch a short video on GestIC technology: www.microchip.com/Video-012015a The simplicity of gesturedetection integration offered by the MGC3030 is also achieved through Microchip’s free, downloadable AUREA Graphical User Interface (GUI) and easily configurable generalpurpose IO ports that even allow for host MCU/processor-free usage. The MGC3030’s on-chip 32-bit digital signal processor executes real-time gesture processing, eliminating the need for external cameras or controllers for host processing, and allowing for faster and more natural user interaction with devices. Further simplifying the design process and accelerating time to market, the MGC3030 makes full use of the GestIC family development tools. For example, Microchip’s Colibri Gesture Suite, an on-chip software library of sophisticated yet easy-to-use gesture features. Intuitive and natural movements of the human hand are recognised, making the operation of a device functional, intuitive and fun. Without the need to touch the device, features such as Flick Gestures, the Air Wheel or proximity detection perform commands such as changing audio tracks, adjusting volume control or backlighting, as well as many other commands. All gestures are processed on-chip, allowing manufacturers to realise powerful user interfaces with very low development effort. Unique to GestIC technology, the programmable Auto Wake-Up On Approach feature begins operating in the range of 100 microwatts power consumption, enabling always-on gesture sensing in power-constrained applications. If user interaction is detected, the system automatically switches into full sensing mode and alternates back to auto wake-up mode once the user leaves the sensing area. To enable development with the MGC3030, Microchip’s Woodstar MGC3030 Development Kit (DM160226) was also announced today, priced at $139. The kit includes the AUREA Graphical User Interface, the central tool to configure the MGC3030, and the Colibri Suite to meet the needs of any design. AUREA is available via a free download and the Colibri Gesture Suite is an extensive library of proven and natural 3D gestures for hands and fingers that is pre-programmed into the MGC3030. The MGC3030 featuring GestIC technology is available today in a 28-pin SSOP package. MICROCHIP TECHNOLOGY

www.microchip.com/GestIC-Page-012015a

INDUSTRY NEWS Microchip expands family of Serial Quad I/O™ SuperFlash® Memory devices with 1.8V low-power 4-Mbit and 8-Mbit memory Microchip announces an expansion of its 1.8V Serial Quad I/O™ (SQI) SuperFlash® Memory with the SST26WF080B and SST26WF040B devices. These devices offer 4-Mbit and 8-Mbit of memory and are manufactured with Microchip’s high-performance SuperFlash technology, which provides the industry’s fastest erase times and superior reliability. The SST26WF080B/040B provide the fastest erase times of any competing device due to the use of SuperFlash technology. Sector and block erase commands are completed in just 18 ms and a full chip erase operation is completed in 35 ms. Competing devices require in the range of 5 to 15 seconds to complete a full chip erase operation, making SST26WF080B/040B approximately 300 times faster. The fast erase times can provide a significant cost savings to customers by minimising the time required for testing and firmware updates, therefore increasing their manufacturing throughput.

The SQI interface is a high-speed 104 MHz quad I/O serial interface which allows for high data throughput in a low pin-count package. This interface enables a low latency execute-in-place (XIP) capability, allowing programmes to be stored and executed directly from the Flash memory and eliminating the need for code shadowing on a RAM device. The SST26WF080B/040B provides faster data throughput than a comparable x16 parallel Flash device without the associated high cost and high-pin count of parallel Flash. The SQI interface also offers full command-set backwards compatibility to the traditional Serial Peripheral Interface (SPI) protocol. Designed for low-power consumption, the SST26WF080B/040B helps to maximise battery life in portable powered applications. Standby current consumption is 10 μA typical and a deep power-down mode further reduces current consumption to 1.8 μA typical. Active read current at 104 MHz is 15 mA typical. The combination of 1.8V operation with low-power consumption and small form factor packaging makes the SST26WF080B/040B an excellent choice for applications such as mobile handsets, Bluetooth® headsets, GPS, camera modules, hearing aids and any battery-powered devices. The SST26WF080B/040B devices are available for sampling and volume production in 8-contact WSON (6mm × 5mm), 8-lead SOIC (150 mil), 8-contact USON (2mm × 3mm) and 8-ball XFBGA (Z-Scale) packages. MICROCHIP TECHNOLOGY www.microchip.com/SST26WF080B-040B-Page-011915a

EMBEDDED SYSTEMS

Digital Controller Family with VR12/12.5 Compliant Interface Powervation Ltd. announced its latest series of digital DC/DC controllers for servers, high-end desktop, and embedded computing systems. The PV3103, PV3104, and PV3202 devices feature single and dual phase outputs and support both PMBus and Intel’s VR12.5 Serial VID (SVID) bus. The highly flexible, fully programmable digital controllers provide precision regulation and telemetry to support the latest high efficiency computing system designs. The PV3202 is Powervation’s latest full-featured VR12.5

dual phase digital controller with Auto-Control®, which provides superior transient performance and real-time adaptive loop compensation. The PV3104 is a single phase controller offered in the standard 5 mm × 5 mm QFN package and is footprint compatible with the PV3202. Completing the family of SVID controllers is Powervation’s PV3103, an ultra-small, digital synchronous buck controller in the 4 mm x 4 mm QFN package – PV3103 is ideally suited to high density or compact design needs. Summary of Key Features • Single & Dual Phase Synchronous Buck Controllers • Auto-Control® Real-Time Adaptive Loop Compensation • Intel Compliant Serial VID VR12,5 (SVID) Interface • SMBus Interface with PMBus™ Power System Management Protocol • ±0.5% VOUT, ±1.5% VIN, & ±3% IOUT Accuracy Over Temperature • Precision Measurement & Telemetry Reporting (VOUT, IOUT, VIN, EOUT, Temperature, Duty Cycle, and Switching Frequency) • Programmable Fault Protection (OVP, OCP, SCP, LOS, UVLO, OVLO, OTP) • Configurable Phase Add/Drop (Automatic or via PS1 Command) • Single-Pin CONFIG™ with Memory for Eight Profile Tables • Anti-Fuse Based Non-Volatile Memory (NVM) • Temperature Compensated Phase Current Sense & Matching • 0.6 V to 1.52 V Output • Programmable Frequency 375 kHz to 1 MHz POWERVATION www.powervation.com

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INDUSTRY NEWS Toshiba to Showcase Portfolio of Solutions for Wearable Technology and the Internet of Things Toshiba Electronics Europe (TEE) will be showcasing technologies from across its wide range of standard and custom semiconductor solutions at Embedded World 2015. Demonstrations featuring various application processors from Toshiba’s ApPLiteTM range that support secure communication and provide timely processing of text, sound, image and sensor data. In combination with recent advances in big data, these application processors make it easier to develop services that provide users with greater value and convenience. In addition to the application processors, Toshiba’s latest Bluetooth® 4.0 / 4.1 devices will be demonstrated, including its recently announced Bluetooth - NFC-Tag combo IC that enables effortless “click and connect” pairing. Toshiba’s comprehensive range of storage technologies, including

hard disk drives (HDDs) and solid state drives (SSDs) will be on display at the show. Also featuring prominently will be Toshiba’s extensive range of NAND-based memory technology, including SD cards, USB flash drives, and embedded NAND solutions such as BENANDTM and e•MMC™ memory solutions. Other sections of the stand will highlight solutions that help to accelerate application development in areas including industrial, multimedia, telecoms, smart communities, networking, home appliances and consumer devices. These will include microprocessors / microcontrollers, TransferJetTM technology, wireless power ICs, motor drivers, ASICs, FFSA and CMOS sensors. Automotive solutions for ADAS and infotainment will also be on display – including high-performance, low-power ARM-based MCUs.

EMBEDDED SYSTEMS

Microchip Joins The Linux Foundation and Automotive Grade Linux; New Linux Driver Enables MOST® Technology for Linux Ecosystem Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that it joined The Linux Foundation and Automotive Grade Linux (AGL), a collaborative open source project developing a common, Linux-based software stack for the connected car. Additionally, Microchip has begun enabling designers to use the Linux operating system with its portfolio of MOST® network interface controllers. To learn more about Microchip’s MOST network interface controllers, visit: http://www.microchip.com/MOSTControllers-010615a IHS projects that by 2020, Linux will lead the estimated 130 million unit in-vehicle-infotainment (IVI) market with a 41.3 percent share, taking 53.7 million units. Linux adoption is growing because it provides automotive designers with an opensource platform that allows them to maximize the reuse of existing work, while making their own incremental improvements. Additionally, AGL was built on top of a well-tested and stable Linux stack that is already being used in embedded and mobile devices. The combination of MOST technology and Linux provides a solution for the increasing complexity of IVI and advanced-driver-assistance systems (ADAS), accelerating development via open-source software and the automotiveindustry-proven MOST networking technology. The MOST network technology is a time-division-multiplexing (TDM) network that transports different data types on separate channels at low latency and high quality-of-service. Microchip’s MOST network interface controllers offer separate hardware interfaces for different data types. In addition to the straight streaming of audio or video data via dedicated hardware interfaces, Microchip’s new Linux driver enables easy and harmonized access to all data types. Besides IP-based communication over the standard Linux Networking Stack, all MOST network data types are accessible via the regular device nodes of the Linux Virtual File System (VFS). Additionally, high-quality and multi-channel synchronous audio data can be seamlessly delivered by the Advanced Linux Sound System Architecture (ALSA) subsystem.

* ARM® and Cortex® are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. * ApPLiteTM is a trademark of Toshiba Corporation. * Bluetooth, Bluetooth Smart and Bluetooth Smart Ready are registered trademarks owned by Bluetooth SIG, Toshiba uses them under license. * All other trademarks and trade names are properties of their respective owners. TOSHIBA ELECTRONICS EUROPE www.toshiba.semicon-storage.com 6

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MICROCHIP TECHNOLOGY www.microchip.com/MOST-Controllers-010615a

INDUSTRY NEWS

Toshiba Power Management IC Optimises Electronic Power Functionality for Consumer and Industrial Mobile Products Toshiba Electronics Europe (TEE) has announced a new system power management IC (PMIC) designed to help optimise power management functions for a wide range of mobile products, such as smartphones, tablets, handheld medical devices, industrial PDAs, barcode readers and portable instruments. The TC7734FTG PMIC adopts a 130-nanometer analogue semiconductor process with very low on-resistance (power path FET’s on-resistance typically 220mΩ) and low gate charge characteristics, and integrates various power management blocks within a single device.

EMBEDDED SYSTEMS

SGET adopts ‘embedded NUC™’ standard The SDT.03 (Standard Development Team) work group of the SGET Standardization Group for Embedded Technologies e.V. has officially adopted Version 1.0 of the SGET embedded NUC™ specification, its first standard development. embedded NUC™ is based on the compact Intel® NUC system (NUC: Next Unit of Computing), which combines a wide range of PC functions in an extremely slim format. With its 10 × 10 cm baseboard, in particular Intel® is targeting consumer applications such as home theater systems, digital jukeboxes and gaming appliances as well as space-saving solutions for the home office.

First embedded computing design according the embedded NUC™ standard (Source: ies / Pentair)

Rising demand for mobile products is driving concurrent growth in the market for PMICs, as manufacturers continually seek to reduce their products’ power consumption. According to Transparency Market Research, the current compound annual growth rate (CAGR) for the global PMIC market (2013-2019) is currently 6.15 per cent.[1] To overcome the conflicting challenges faced when designing battery-powered products compact, efficient and highly reliable power management solutions, such as the TC7734FTG, are needed in a short time-to-market window. TC7734FTG integrates power path, switching charger, four buck converters, three low-dropout (LDO) regulators and two LED backlight drivers. The charger block detects various USB™ port conditions and restricts the input current to 100mA, 500mA, 1000mA or 1500mA. All charger functions operate automatically without the need for any external control signals and it automatically changes the system power source between the battery and USB connection as needed. The IC also features an external thermistor that detects the battery’s temperature, helping to prevent overheating while the mobile device is charging. Various thresholds and settings of the charger functions can be programmed by the on-board I2C interface. Individual settings of various output voltage levels, power sequences and many other functions can be programmed via I2C. In addition, user-programmable eFuse register settings enable the device to meet the needs of a wide variety of platforms. Housed in a compact 9mm × 9mm QFN64 package, the TC7734FTG supports input voltage ranging from 3.4V to 5.5V. The IC integrates various error detect functions, including thermal detect, over current limitation and LED open/short detection. TOSHIBA ELECTRONICS EUROPE

http://toshiba.semicon-storage.com/eu

As this PC power in such a compact format presents a highly attractive solution for industrial applications, the SDT.03 was founded within the standardization consortium to make NUC operational for the embedded industry. Version 1.0 of the specification – and, of course, this applies to future advancements – will be transferred into an open standard according to the statutes of the SGET e.V. “NUC is a success story both in the industrial as well as the consumer markets,“ comments Martin Steger, Chairman of the SDT.03 and Managing Director of the ies GmbH & Co. KG. “The standardization of embedded NUC™ paves the way for a major success. Within less than 12 months, the SGET has managed to progress from its first considerations of the specification to achieving a resilient specification for embedded NUC™, and even kept it to such 16 pages.” Engelbert Hörmannsdorfer, Chairman of the SGET e.V., is also pleased with the results: “Just on announcing that SGET e.V. was working on a future standard for embedded NUC™, inspired many new members to join.” ies GmbH & Co. KG has already been offering its own NUC boards for Qseven or SMARC modules since the end of 2013. With the passing of the embedded NUC™ standard, Martin Steger is now expecting a further boost in interest: “Whether for industrial applications, Internet of Things or small customized server formats – with embedded NUC™ we have something similar to a historical chance to develop an open industry standard which puts emphasis on the customer benefit while at the same time takes further development potential into account.” At the coming industry trade fair ‘embedded World 2015’, SGET expects visitors to be able to view several working samples of the first boards according to the newly approved embedded NUC™ specification. SGET (Standardization Group for Embedded Technologies) www.sget.org

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DESIGN

‘SUDDEN IMPACT’

An introduction the ‘Sudden Impact’ Series Author: Christian DeFeo, eSupplier and Innovation Manager, Newark element14

This is the first in a series of exclusive blog posts for EP&Dee that will explore the challenges of designing wearable medical devices, inspired by elemenet14’s new ‘Sudden Impact’ Wearable Design Challenge.

The wearable fitness market is entering a new phase and with the industry predicted to be worth $12billion by 2018, there is the opportunity for manufacturing and technology firms to establish themselves as market leaders. It is time for these businesses to take an active role and enable innovative solutions to promote healthier living, prevent injuries and ultimately, save lives. Inspiring a generation To kick-start this proactive approach, at element14 we have challenged our 280,000 strong online Community of design engineers and hobbyists to get involved in the ‘Sudden Impact’ Wearable Design Challenge. We asked our participants to create unique technological solutions that provide real-time, critical insights to a user group that would benefit from these specific capabilities – athletes. Equipped with a range of advanced tools including a single-lead heart rate monitor, advanced protection polymers and a temperature sensor, our participants will also 8

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have access to support from Tektronix, Electrolube and Analog Devices and a $500 budget for any additional parts they may need. With the appropriate tools and right level of support, we aim to inspire designs that will one day have a widespread reach to athletic environments across the globe. From concept to creation The twelve designers proposed some fantastic ideas and we’re looking forward to watching them develop. While simple devices that monitor and relay uncomplicated data are prevalent in the wearable and fitness market, the designs our participants are creating are aimed at specific

sports. With this level of specificity, athletes would be able to customise their device and training programme accordingly. Designers in this area include Cosmin Iorga from the US who is building head, foot and arm modules for tennis players to track their body temperature, heart rates and blood oxygen amount, as well as their dehydration and exhaustion levels. Meanwhile, Norbert Kovacs from Hungary is designing smart clothing for bikers that can log their heart rate, body temperature, acceleration and even provide an analysis of their journey.

DESIGN

Another focus for our designers is on the impact-related injuries that are most common within a specific sport. Notorious for accidents, skiing has been a common theme as Germany-based Hendrik Lipka shows with his helmetmounted impact monitor, aimed at tracking skiers’ heart rates as they hit the slopes. This group also includes two designs inspired from India, both aimed at footballers. While Shubham Garg is developing a system to monitor fatigue and internal bleeding, Ravi Butani aims to measure chest, head and spinal injuries amongst American football players. Impact measurement These ideas, along with the others, will be thoroughly tested by the School of Computing, Creative Technology and Engineering at Leeds Beckett University. Each design will be judged on how well they meet the following criteria: effective use of the equipment, ease of use for a secondary school pupils, durability against various athletic grounds and arguably the most critical – the device’s ability to provide medical professionals with valuable and accurate diagnostic information. All twelve designs are currently in progress and the participants will be sharing their journey with blogs, videos and photos on the dedicated Sudden Impact Challenge page on the element14 Community. In the next post, I will be delving deeper into the intricacies of the design techniques our participants are using to carry their designs from an idea into a functional prototype. About the Author Christian DeFeo is the e-supplier and innovation manager at Farnell element14, a global electronics distributor and online community of more than 280,000 design engineers and tech enthusiasts. Recently, he oversaw the Beyond the Phone challenge in which element14 members developed wirelessly powered medical devices. He is currently leading the Sudden Impact design competition ￭

INDUSTRY NEWS

EMBEDDED SYSTEMS

ADLINK Announces First COM Express Compact Size Type 6 Module with 5th Generation Intel Core Processor With graphics support up to 4K resolution and high-efficiency processing, cExpress-BL provides performance per watt targeting latest industrial designs ADLINK Technology, a leading global provider of cloud-based services, intelligent gateways, and embedded building blocks for edge devices that enable the Internet of Things (IoT), announced its first COM Express Compact Size Type 6 module, the cExpress-BL, based on the 5th generation Intel Core processors i7-5650U, i55350U and 5th generation Intel Core i35010U processor (codename Broadwell U), with support for up to 16 GB dual channel DDR3L memory. Featuring improved graphics and processing performance compared to the previous generation Intel processor, the cExpress-BL is suitable for fanless edge device solutions that demand intense graphics performance and multitasking capabilities in a space-constrained environment, such as digital signage for medical, transport and retail, or machine vision applications in factory automation. “The ADLINK cExpress-BL is pin-to-pin compatible with the previous generation cExpress-HL module and facilitates system integrators with a seamless scale-up to 5th generation Intel Core processors are designed to lower development costs and reduce time to market,” said Henk van Bremen, director of ADLINK's Module Computing Product Segment. “End customers can easily upgrade their equipment with minimized investment and get the most out of their existing infrastructure with excellent CPU and graphics performance, extended life cycle and maximized ROI.” “The new 5th generation Intel Core processor family built using Intel's latest 14nm process technology is designed to deliver ADLINK TECHNOLOGY

excellent graphics and performance in a small thermal envelope, supporting the next generation of Internet of Things solutions,” said Samuel Cravatta, IOTG Product Line Director. “With 5th generation Intel Core processors inside, edge devices can have stunning video performance and fast computing power in optimized cost modes for end users.” The ADLINK cExpress-BL features Intel HD Graphics 5500 and 6000 integrated in the CPU and provides two DDI channels (with up to 4K resolution) and one LVDS channel supporting three independent displays, enabling it to drive multiple HD screens without the need for a discrete graphics card. In addition, Embedded DisplayPort (eDP) is optionally available to support next generation displays. The cExpress-BL also provides high-bandwidth I/O, including four PCIe x1 or single PCIe x 4, four SATA 6 Gb/s, two USB 3.0 and six USB 2.0 for peripheral devices and data transfer. A wide range of operating systems are supported, including Linux, Windows 7 and 8.1u, Windows Embedded Standard 7, Windows Embedded Industry 8.1, and VxWorks. A complete range of COM Express engineering test tools accompany the cExpress-BL to expedite application development. These tools include the COM Express Type 6 starter kit, which allows customers to proceed with carrier board design and software verification simultaneously; the T6-DDI video adapter card, which provides easy access to the cExpress-BL's DDI ports; and the LPC POST debug board. www.adlinktech.com

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DESIGN

POWER

Trends in Power Electronics

Power Goes Fast and Smart Author: Andreas Glaser, Senior Marketing Manager Power Semiconductors, Rutronik Elektronische Bauelemente GmbH

In these times of smartphones and iPads, Industry 4.0 and the Internet of Things, you would think the “heavyweights” of the semiconductor industry would be taking something of a backstage position. But appearances are deceiving – power supplies that are more intelligent, more digital, more independent from networks, more localized, and more efficient make power management ICs, switched controllers and MOSFETs core components of such systems. Growth markets and applications such as wireless charging, energy harvesting and digital power also require new technologies and new processes from the field of power electronics. The fight is on for every last modicum of efficiency. Most innovations are achieved along three main lines: ▶ Reductions in static and dynamic power dissipation enable the development of smaller constructions with the same power, significantly lower heat generation in applications and also higher efficiency of the overall system, which in respect of various standards (e.g. 80+ certificate) is becoming ever more important for product development. ▶ The optimization of thermal properties increases the service life of the components and the system. ▶ The increased integration of construction elements ensures for example more compact construction, easier processing, and simplified procurement of materials. IGBTs Bipolar switches, with their popular representatives, the discrete IGBTs and IGBT modules, are currently seeing considerable growth in their use thanks to the greater 10

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integration of components and higher switching frequencies. The applications range from traditional motor control mechanisms to solar inverters to switched-mode PSUs. Modular solutions enable the creation of reliable, efficient and compact system solutions. Rutronik works with the suppliers Infineon, ST, Rohm, Vishay, BYD, Bosch and Vincotech to offer a wide range of state-ofthe-art products. MOSFETs Modern unipolar switches, the most prominent of them being the metal oxide semiconductor field-effect transistor (MOSFET), fulfill the need for miniaturization and reduction in power dissipation with their lower internal resistance (Rd(son)) and lower parasitic capacitance. However, they present developers with new challenges, because such measures not only result in reduced losses but also higher switching frequencies. The miniaturization of the housing also contributes towards achieving faster switching speeds thanks to smaller chip surfaces.

Controlling these fast-switching MOSFETs and thereby ensuring EMC (electromagnetic compatibility) is a key task in systems development. Such a problem can often be solved with the correct actuation of the MOSFET and with an optimized circuit/PCB layout. Fewer conductive tracks and intelligently arranged system components can reduce inductive leakage considerably. Perfectly coordinating or adapting the upstream MOSFET driver is one of the most critical aspects of circuit development. AECQ-100-certified components with an expanded temperature range of up to 125°C are increasingly in demand for automotive applications. In extreme environmental conditions, such as those under the hood of a car, components may even need to withstand temperatures up to 200°C. Manufacturers here are called upon to meet these more stringent customer needs with innovative bonding solutions. Conventional processing methods here reach limits that prevent functional safety and robustness from being guaranteed.

DESIGN

Wide Band Gap Switches Wide band gap components with silicon carbide (SiC) and gallium nitride (GaN) switches and J-FETs stand out with their high performance in terms of power dissipation and with their excellent thermal properties. They achieve low power dissipation levels while maintaining high switching frequencies and high cut-off voltages, which is of particular interest in energy-efficient systems such as UPS, solar, photovoltaic and emobility applications. In order to assess whether the higher costs involved in such technology or components are financially worthwhile, the system costs must be taken into consideration, because these generate

POWER

savings elsewhere. For example, where significantly smaller passive components are adequate, solenoids and filters can also be smaller. Heatsinks â&#x20AC;&#x201C; a cost factor in their own right â&#x20AC;&#x201C; can also be significantly reduced in terms of construction and size, or may even be rendered fully unnecessary. These innovations will contribute towards developing more efficient, more convenient, more powerful, and more compact end devices. They enable power supply adapters to be installed directly into the device (laptop), and also allow sensors, small motors and devices connected to the internet of things to be self-sufficiently sup-

plied with power. Even the wireless transfer of power is possible with higher power densities. Technologies such as SiC and GaN, which are in a nascent phase of their product lifecycle, serve as an extra boost for this development. As these technologies continue to mature, they will also continue to conquer new markets and applications. Still, they won't completely replace the technologically mature, highly reliable silicon components, as these offer major benefits in terms of horizontal integration, robustness and cost ďż Rutronik www.rutronik.com

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DESIGN

MCUs

Increasing Automotive Safety Through Embedded Radar Technologies Authors: Andrew Robertson, Senior Applications Engineer, Freescale Automotive MCUs Maik Brett, System Architect, Freescale Automotive MCUs Ralf Reuter, Systems Engineering Manager, Freescale Analog Safety Systems

In response to a need for active and predictive safety systems within the automotive sector, semiconductor suppliers are developing innovative radar-based embedded solutions. These next-generation technologies present unique capabilities for designers of Advanced Driver Assistance Systems (ADAS), enabling life-saving safety features as well as compliance with the latest regulatory standards. Introduction There is a global trend in the increasing numbers of road fatalities. In 2010, 1.24 million people were killed on the world’s roads, the eighth leading cause of death globally (World Health Organization). Within the developed regions, passive car safety systems, seat belts, airbags, and crumple zones have proven essential in decreasing fatalities and serious injuries to the occupants of cars and pedestrians. Even within the developed regions of the world - where vehicles are becoming more connected and providing an increasing level of information to the vehicle’s operator analysts recognize driver distraction as a real potential source for fatalities and serious injury. The demand for improving automated safety systems exists and is increasing year-to-year. While the global automotive industry strives for a goal of zero vehicle-related fatalities, and consumer demand and government legislation drive improved automotive safety standards, the adoption of active and predictive crash avoidance safety systems has become more prevalent in modern vehicles. 12

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Proliferation of Advanced Driver Assistance Systems (ADAS)—such as electronic stability control and rear-view facing cameras, and vision-based pedestrian detection systems—has been possible due to improvements in MCU and sensor technologies. Enhanced radar-based embedded solutions offer complementary safety features to ADAS designers. Increasing Use of Radar-Based Safety Systems As more advanced ADAS systems are expected to become government-mandated in the future following the recent introduction of legislation such as rear-view facing cameras in vehicles and advanced emergency brake assist (AEBA) for commercial vehicles, Freescale has developed new products to support these much-needed applications. Radar-based safety systems manage blind spot and side-impact detection, as well as long-range and mid-range frontal radar for adaptive cruise control. Freescale is the market leader in embedded radar solutions and has a highly skilled design team driving new innovations in embedded MCUs and 77

GHz millimeter wave integrated circuits specifically tailored for radar applications. A typical radar module consists of a transmit solution (Tx), a voltage-controlled oscillator (VCO), and a three-channel receiver IC (Rx), along with a MCU. The chips are connected via the local oscillator (LO) signal, around 38 GHz. The individual control of each chip is implemented by a serial peripheral interface (SPI) bus. The main controller and modulation master is a single MCU with integrated highspeed analog-to-digital converters (ADCs) and appropriate signal processing capability, such as Fast Fourier Transforms (FFTs). Freescale introduced the next-generation of embedded radar-based products with the Qorivva MPC577xK MCU and the MR2001 77 GHz radar transceiver chipset. The radar transceiver chipset consists of a VCO (MR2001VC), a two-channel Tx transmitter (MR2001TX), and a three-channel Rx receiver (MR2001RX). These new products deliver a complete embedded radar system for automotive designs. These state-of-the-art radar solutions complement Freescale’s existing arsenal of highperformance ADAS solutions.

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For example, Freescale’s embedded camera/video offerings - such as the SCP220x image cognition processor (ICP) family and the Qorivva MPC5604E MCU - are designed for advanced vision processing to address object detection from vehicle to pedestrians. With the release of the new radar-based products, Freescale now offers a comprehensive ADAS solution for automotive manufacturers’ requirements.

This white paper will address the benefits of the MPC577xK MCU from both a technical and bill of materials (BOM) optimization perspective. The Qorivva MPC577xK MCU: Industry-Leading Integration and Performance Many current radar systems are based around the Qorivva MPC5675K MCU - ,

QORIVVA

including external FPGA, ADC, DAC, SRAM, and analog front-end for transmitting and receiving. The MPC577xK MCU is specially designed to enable a cost-effective radar system with increased performance in a single chip solution.

In addition to the two 266 MHz e200z7 processing cores, the MPC577xK MCU also features a state-of-the-art signal processing toolbox (SPT). This contains the hardware modules required for processing sampled signals from short, medium and long-range

Figure 2: Qorivva MPC577xK MCU Block Diagram The MPC577xK family attains its cost-advantage by providing high levels of digital and analog integration within a single 356 BGA package and removes the requirement of having an external FPGA, ADC, DAC and SRAM, thereby reducing the number of components required, the PCB size, and the complexity of software (Figure 1).

radar applications. The SPT is a powerful processing engine containing high-performance signal processing operations driven by a specific instruction set. Its programmability ensures flexibility while removing the CPU from frequent scheduling of hardware operations, while still controlling and interacting with the processing flow. ▶ Highly integrated MCU reduces the total number of components required, the size of the PCB, and the complexity of the software ▶ Easy-to-use MCU with integrated FFT accelerator ▶ Large-density memories to support scalable radar applications ▶ Supports open-loop and phase-locked looped systems, enabling design flexibility ▶ Contained power dissipation improves efficiency ▶ Helps system manufacturers meet the functional safety ISO 26262 ASIL-D target

Figure 1: Radar Chipset Evolution

The MR2001 77 GHz Radar Transceiver Chipset: High Performance and Scalable to Multi-Channel The MR2001 77 GHz radar transceiver chipset is an expandable, high-performance, three-package solution for automotive radar modules. www.epd-ee.eu | February, 2015

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The chipset consists of a VCO, a two-channel Tx transmitter, and a three-channel Rx receiver. These three parts are each packaged in a 6 mm × 6 mm fan-out wafer-level package on a 500 μm pitch. This package technology is ideal for 77GHz radar applications since it provides extremely low insertion loss and parasitics at frequencies up to 100GHz. The packaged chipset simplifies the end user’s assembly of

▶ Best phase noise performance < -93 dBc/Hz at 1 MHz, offset to improve target separation ▶ Integrated baseband filter and VGA saves system BOM cost ▶ Local oscillator at 38 GHz to lower the distribution loss and reduce system interference ▶ Bi-phase modulator on the transmitter chip supports rejection of parasitic signals

The open-loop concept is typically used in combination with a fast chirp FMCW modulation with a chirp time in the range from 10 μs to 100 μs. Fast chirp systems lower the duty-cycle and improve the SNR of a radar system because a full radar image is captured quicker. The potential disadvantage of high-baseband frequencies is that they drive higher analog bandwidth and sampling rates of the required ADC.

Advanced Packaging Technology The MR2001 radar transceiver chipset is designed with advanced packaging technology that delivers excellent thermal and electrical performance. The package is qualified to support rigorous automotive standards including solder joint reliability, deep temperature and humidity cycling, and EMC performance. The packaging technology is available for leading suppliers and is compatible with reduction of hazardous substances (RoHS) standards.

The MPC577xK MCU overcomes this potential problem since it has integrated up to 8 ΣΔ-ADC with 5 MHz bandwidth and an internal sampling clock of 320 MHz. In an open-loop radar system, the MCU is the chirp master with a digital-to-analog converter (DAC) providing the tuning voltage for the VCO. Depending on the tuning voltage, the VCO generates a high-frequency signal (LO), which then drives the different receiver and transmitter chip. During normal operation, linear frequency chirps are transmitted and reflected signals are received. The receivers in combination with the transmitter are arranged as homodyne system so that the received signals are down-converted directly into the baseband. Such baseband signals are then filtered and amplified (filters and variable gain amplifiers are implemented in the receiver chips) and differentially feed to the ΣΔ-ADC

Figure 3: MP2001 77 GHz Packaged Radar Chipset

the radar module since there is no need for chip and wire assembly techniques for bare die. Furthermore, the chipset readily scales up to four Tx channels and 12 Rx channels, enabling a single radar platform capable of electronic beam steering across a wide fieldof-view and supporting long-, mid-, and short-range radar applications over a full selection of vehicles - from budget to luxury. ▶ Scalable to two Tx channels and 12 Rx channels with simultaneous active channels to enable a single platform capable of electronic beam steering across a wide field-of-view ▶ Advanced packaging technology to ensure the highest performance and minimum signal interference on the customer PCB ▶ Low power consumption - 2.5 W typical for the complete transceiver ▶ Supports fast modulation at 100MHz/100ns 14

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Open-Loop Radar The MPC577xK MCU and the MR2001 77 GHz packaged radar transceiver chipset are designed to support an open-loop radar system. In such systems, a phase-locked loop is not required to generate linear chirps (FMCW modulation). This approach lowers the total system power consumption.

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of the MPC577xK MCU. By converting the baseband signals into the digital domain, following the digital beam forming approach, applying FFTs and tracking algorithms, objects can be identified in terms of distance, velocity, and angular position. Radar Application The MPC577xK MCU is suitable for radar applications that may require up to eight antennas each, acquiring up to 2048 possible samples simultaneously, which are then converted by a 12-bit ΣΔ-ADC at a sample rate of up to 10M samples-per-second-perchirp. This can be achieved through Freescale’s new 8-channel ADC architecture in conjunction with flexible/programmable decimation filtering and inherent anti-alias filtering. It’s also designed with excellent immunity to substrate noise and complete isolation from the rest of the MCU’s peripherals, while still meeting low-power targets designed for low-power applications.

QORIVVA

After all the data for a chirp is acquired, the data is transferred to the SPT’s local SRAM using the programmable DMA engine and frequency transformed using the new embedded FFT engine. The hardware accelerated FFT module can perform complex and real FFTs with a configurable length and can also execute a windowing operation which can be calculated with the data. The FFT is capable of 16/24-bit integer FFTs of up to 4K points and 2x real by complex. For further signal processing, the data can be transferred to the system SRAM or directly to the CPU tightly coupled memories (TCM) where it can be processed by the e200z7 cores utilizing the SPE2 (a 16-bit four-way SIMD integer unit) or the VFPU (two-way SIMD single-precision FPU). The command sequencer executes a sequence of commands required for processing the radar data, and in conjunction with the new cross timing engine (CTE), defines the individual timing of signals for

Embedded Radar Components The SPT (as seen in Figure 3) consists of: ▶ Acquisition Block • Channel muxing - Sample re-ordering to simplify PCB routing • Sample DMA—Merging ADC samples into memory words, arranging the data into packets, and distributing to memory locations ▶ Programmable DMA (PDMA) • Transfers data between the system RAM/Flash/TCM to operand RAM or twiddle RAM (SPT internal RAMs) and vice-versa • Performs special packing and unpacking schemes on the fly, for reduced storage ▶ Memory • Operand RAM stores the operands for operations like FFTs • Twiddle RAM stores constants like coefficients used in FFT operations

Figure 4: Radar Applications Once a measurement cycle consisting of possibly 256 chirps is acquired, this data is then pre-processed using the on-chip data acquisition block and grouped according to the antennas. It’s then transferred to the system SRAM using the sample direct memory access (DMA). The data acquisition module receives samples from the SDADC, extracts the samples in the acquisition window.

the radar system and controls the complete radar processing flow, including the analog front end (AFE). The integration of the new high-performance AFE also includes a new best-in-class 12-bit resolution DAC which has a maximum of 2 Ms/s. In the radar system, the DAC converts the chirp waveform to an analog signal that controls an external VCO for voltage-to-frequency conversion.

• Work registers store single values for calculation (such as coefficients) ▶ Hardware Accelerator • FFT - Radix4 and Radix2 butterfly and twiddle multiplication - Windowing for pre- and post-multiplication with coefficients • COPY www.epd-ee.eu | February, 2015

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- Primarily moves data from one location to another - Can transpose and pack complex data and manipulate real/imaginary parts ▶ Command Sequencer • The command sequencer reads and interprets instructions in the command queue and triggers the operation specific scheduler depending on the instruction These newly integrated, high-performance radar HW modules are also supported by communication interfaces for off-chip communication: ▶ FlexRay: Up to 20Mb/s dual-channel data to other controllers (e.g., object information, active/passive safety relevant data) ▶ DSPI/IIC/LIN: E.g., setup/status information from the front-end ASIC ▶ CAN/CAN-FD: Up to 3Mb/s arbitrary data to other car components ▶ Ethernet: 100Mb/s data ▶ LFAST: Inter-processor communication (IPC) data to other tightly coupled MCUs for the radar processing system

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Safety Features As part of the Freescale SafeAssure program, the MCP577xK MCU has been designed with two high-performance e200z7 cores - based on Power Architecture® technology - for signal processing and can help car manufacturers achieve a minimum ISO 26262 Automotive Safety Integrity Level-B (ASIL-B). In addition to supporting the requirements of automotive functional safety applications, there are two e200z4 cores in a lockstep configuration specifically designed for decision-making and safety-critical requirements, helping to achieve ISO 26262 ASIL-D certification. Some additional key safety features include online logic built-in self-test (LBIST) and memory built-in self-test (MBIST), end-toend error-correcting code (ECC), clock and

power generation supervisor, and a failurehandling module—which also enable customers to obtain ASIL-D certification. Conclusion The increasing global need for active and predictive safety systems in mainstream vehicles is driving the need for semiconductor suppliers to deliver new innovations. These solutions must enable system suppliers and OEMS to optimize the bills of materials of current radar systems in terms of not only cost but also footprint. Manufacturers are further incorporating radar for blind spot and side-impact detection, in addition to long-range and mid-range frontal radar. As a market leader in embedded radar systems, Freescale’s newest radar-based solutions present unique capabilities for designers of next-generation ADAS systems enabling them to not only comply with the latest regulatory standards, but also (and best of all) save lives ￭ www.freescale.com/adas

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POWER

The power of three to increase digital power adoption Author: Patrick Le FĂ¨vre,

Marketing and Communication Director at Ericsson Power Modules

Digital power is becoming an increasingly important technology in our industry. Energy consumption is reaching extremely high levels worldwide and particularly so in Information and Communication Technology (ICT) and in data centers even more so. In addition to which, the increasing complexity of power distribution systems means that the flexibility of digital power can help with the sheer number of different voltage rails required for microprocessors, ASICs, FPGAs and other digital logic. It was the development of off-the-shelf digital power converter modules that has accelerated the adoption of digital power over the past few years â&#x20AC;&#x201C; the trend was kicked off back in 2008 when Ericsson launched the BMR453 intermediate bus converter. It has become readily apparent to those that look that digital control has been particularly successful in improving the efficiency of data network power systems. When data traffic demand is low, networks operate well below capacity and their processors can run at lower clock speeds. Accordingly, this means the power supplies are operating 18

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well within their capability, which in effect means they become relatively inefficient and results in excessive energy consumption and waste heat generation. By implementing a digital control loop encompassing both intermediate bus and POL (Point-Of-Load) converters, the intermediate bus voltage can be varied dynamically in response to varying loads. The input voltage to the POL converters is reduced under low-load conditions, which can mean significantly increased conversion efficiency. In addition to which, digital power devices are increasingly employing techniques such as dynamic

voltage scaling (DVS) and adaptive voltage scaling (AVS) using open-loop and closedloop approaches, respectively, to even more closely adapt the supply near to the minimum voltage required by the processor, and in the case of AVS also compensating automatically for temperature variations in the processor. These advanced capabilities have led to the wider adoption of DC/DC power modules, which in turn has meant increasing demands for the standardization of products from different manufacturers, especially for reasons

DESIGN of supply-chain reliability and second sourcing. This has led to the formation of trade associations including power supply and component vendors. However, these alliances have resulted on little more than the specification of standard footprints and pin-outs for certain categories of power converter, such as non-isolated and isolated DC-DC converter modules. While this has enabled a degree of interchangeability, there has never been consensus on implementation of all of the electrical functions. And this is particularly the case for digital power, which adds another layer of complexity to the challenge of ensuring compatibility between solutions. On top of which, the development of the PMBus standard, an open standard for communications with a protocol dedicated to power subsystem management, further complicates matters.

POWER However, all of this brings us to the set up last year of the Architects of Modern Power (AMP) Consortium, which makes a significant step in driving forward the adoption of digital power technology. Ericsson Power Modules and its co-founders CUI and Murata of the AMP Group envisage that this initiative will go far beyond the ambitions, and certainly the achievements, of previously established trade associations within the power industry. The goal of the alliance is to realize the most technically advanced end-to-end solutions and provide a complete ecosystem of hardware, software and support. More specifically, the AMP Group will work on standards for mechanical specifications, monitoring, control and communications functions, as well as the creation of common configuration files that will ensure compatibility between each companyâ&#x20AC;&#x2122;s products.

And in fact, the first standards have already been defined, and announced at Electronica 2014, by the AMP Group for digital POL converters. These new first standards detail mechanical footprints, electrical features and configuration files. Working together in close cooperation, the three founding companies of the AMP Group can achieve far more than one acting alone: they can pool R&D resources, share a long-term strategic roadmap, and bring to bear high levels of collaborative effort in the development of leading-edge digital power technology. n

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INDUSTRY NEWS Renesas Electronics Europe: First European MCU Car Rally Competition for Students Speeds into the Home Stretch at embedded world 2015 Renesas Electronics Europe announced that the final of its MCU Car Rally competition for university students will be announced at embedded world 2015, to be held 24-26 February in Nuremberg, Germany. Teams from universities and technical colleges all over Europe were invited to participate in the competition, which involves developing a functioning model racing car based on electronic components and software from Renesas. Seventeen teams comprising almost

one hundred students have been working on their designs since the event was launched at Embedded World 2014 in preparation for this year’s race. The prizes include racing experiences, tablets and cash vouchers. The competition gives final-year engineering students a great opportunity to develop a real-world “product” using state-of the-art solutions from Renesas, including the popular RX 32-bit microcontroller. The teams include students from universities in Germany, Austria, Bulgaria, Spain, Romania, France, England, Wales and other countries, with some countries being represented by more than one team. In terms of technical support and coordination for the MCU Car Rally competition, Renesas has been assisted by its UKbased Platinum Alliance Partner, AND Technology Research. For many of the participating teams, the Renesas MCU Car Rally event has become a highlight in their year. The institutions consider the students’ work on the Renesas rally cars as bona fide coursework, where professors award the students points for the completed project that count towards their degree. RENESAS ELECTRONICS EUROPE www.renesas.eu 20

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EMBEDDED SYSTEMS Microchip’s free code configuration plug-in for MPLAB® X IDE makes it faster and easier to develop firmware on 8- and 16-bit PIC® MCUs Microchip announces the expansion of its MPLAB® Code Configurator Plug-In to support 16-bit PIC® MCUs, in addition to the 8-bit devices already supported. This code development tool enables developers to enhance the design experience with faster application development. Based on the popularity of this tool for 8-bit products, Microchip has added support for more than 50 16-bit devices into the latest release of the MPLAB Code Configurator. The MPLAB Code Configurator is a free user-friendly plug-in tool for the MPLAB® X Integrated Development Environment (IDE) that leverages drivers and GUI for controlling and driving the peripherals inside PIC microcontrollers with simple and clearly documented driver APIs. The configurator tool simplifies software development, using an intuitive GUI to configure peripherals, accelerating time to market for customers designing with 8- and 16-bit PIC microcontrollers. It is easy to change peripheral configurations or add/remove peripherals from a project. Also, the generated code is reliable and designed for efficient use of CPU and memory resources. The tool offers many powerful features such as visual setup for I/O pin management with both a chip-level and tabular view. Also, once a system-level clock rate is set, the tool will automatically calculate timer periods, duty cycles and baud rates for peripherals. With a simple drag-and-drop style interface, this tool generates easy-to-read code that includes peripheral configuration setup, drivers and pin mapping to efficiently solve application development obstacles. Designers can benefit from this easy-to-use code development solution, which is better able to meet their ever-shorter product design schedules and decreasing budgets. MICROCHIP TECHNOLOGY

Digital power consortium formed by CUI, Ericsson Power Modules and Murata Three leading power supply manufacturers announced the formation of a new power industry consortium, the Architects of Modern Power (AMP). The founding members are CUI, Ericsson Power Modules and Murata – all global players developing advanced power conversion technology for distributed power architectures. The aim of the alliance is to create the most technically advanced, end-to-end distributed power solutions – a complete ecosystem of hardware, software and support. The advent of digital control in DC-DC converters and point-of-load regulators, driven initially by telecom and datacom companies experiencing a staggering rise in IP traffic and now proliferating into other industries, has made multi-sourcing of leading-edge power conversion products more difficult for customers. A level of software compatibility will be required in order to achieve a true multi-source solution, including compatibility of PMBus commands, proprietary controller commands, and configuration files. The AMP Group was formed to address this challenge. The AMP Group’s work will extend well beyond defining mechanical dimensions and product footprints for intelligent DC-DC power modules and AC-DC power supplies. The consortium’s long-term strategic alliance will foster close collaboration between members to develop shared technology roadmaps. AMP GROUP

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MCUs

Managing the evolution of

PLC standards Do they fulfil todays and future requirements and is there a “best way” to deal with the plethora of standards? As always it’s not only the technical aspects, but also the commercial ones.

Author: Kevin Jones, Renesas Electronics Europe

Communication technologies and related standards have probably been one of the most discussed topics in the last two decades when it comes to smart metering or smart grid installations as they have the potential to revolutionise the smart grid. The whole industry was claiming the lack of “open standards” covering the needs for smart metering and smart grids overall. For power line communication, as for other technologies, thousands of experts have been working on standards since then and now they are in place, in abundance.

Looking to the European utility landscape, there are variations from country to county. Monopolist electricity markets like France or Italy, with one dominant distribution company. Countries with a small number of big distribution companies like Spain, and the very fragmented markets with multiple utilities. The large installations and pilot trials in Europe so far show that power line communication is the most adopted technology and this is probably valid independent of the market fragmentation. The requirements towards the power line technology

have changed since 2001 when Enel deployed the first smart metering solution worldwide in Italy. The application requirements evolved from AMR (Automatic Meter Reading) over AMI (Advanced Metering Infrastructure) to AMM (Automated Meter Management) with requirements reaching from low data rate single directional communication, to real time bi-directional communication. The latter required in smart grid applications for demand response and supply management to control peak demand and overall load balancing. This trend is not expected to stop here. As a result there is continuous evolution in standards. If we consider power line communication then there are a plethora of types; low speed / medium speed narrowband technology, high speed or broadband technology. All use some form of modulation technique; DCSK, FSK, SFSK, OFDM etc. If we consider OFDM based narrowband technology alone, then there too are many standards; PRIME versions 1.3.6 and 1.4, ITU-T G.9903 (G3 PLC) and IEEE P1901.2 to name a few. So where have they come from? Probably the most important driving factor behind these standards are the utility companies themselves. If we delve deeper then we could probably say that these are driven by the utility companies operating in the monopolist electricity markets or certainly

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ones with a very large share of a fragmented market. One of the original standards was PLAN or IEC 61334-4 developed by ERDF who are now one of the driving forces behind the ITU-T G.9903 (G3-PLC) standard. Another of the most widely adopted standards is PRIME as driven by Iberdrola, and the aforementioned Enel is behind the Meters and More Alliance. The major advantage of a standard is that it can be adopted by industry as a de-facto technology. This leads to multiple inter-operable implementations by the suppliers to the utility companies or meter makers which provides a choice of vendors, increases competition and ultimately drives down the cost of the solution. In recent years we have seen the introduction of government imposed targets. Arguably the most important of these being the EU’s ambitious 20:20:20 target which states that EU Member Countries must “ensure the implementation of intelligent metering systems” with 80% coverage by 2020 and full deployment by 2022. Local regulations then mandate the use of open standards. All in all this forces utilities to act quickly and select an open standard to start deployment of meters within already tight timescales. This doesn’t just affect the utility companies. Just because a standard exists or is open, it does not mean there are many implementations of it, or that they are interoperable. When you consider the scale of the deployments these factors become critical. Consider the Zigbee Alliance, the Alliance was formed in 2002 but it wasn’t until 4 years later that the first Zigbee products became available. It was then another 2 years before certified products were available. For Smart Metering the semiconductor companies must have a device capable of implementing the lower layers. Then there are the protocol stacks, which need development by semiconductor vendors, 3rd parties or meter makers. These solutions need integrating into meters and testing extensively in pilot trials. These factors help explain why the utility companies themselves are driving the standards. Even when we consider narrowband OFDM based PLC solutions then the differences span many layers of the OSI Model. At the physical layer there are differences in the carrier frequencies and spacing, the number of constellations used in the mapping, repetitions in the encoders and different error cor-

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rection techniques. These all affect the robustness and the achieved data rates of each standard at the theoretical level. At the MAC layer there are subtleties in the channel access, security, tone mapping, addressing and sizes, segmentation lengths which again all have an effect on the throughput of data frames and arguably the robustness of the solution. Next is the network layer, here the differences are even more varied, compression techniques, header sizes, maximum transmission units, routing protocols (Ondemand or table based and the different topologies that are formed, Mesh, Star, Tree…). We could of course continue through the rest of the OSI layers. Whilst there is no obvious leader or best performing PLC standard for smart metering, the meter makers are almost forced to support them all.

Cool Phoenix family which keeps the flexible concept allowing a single device to support multiple standards for instance G3 and PRIME. Whilst the device is pin compatible to its predecessor it offers more memory as well as higher performance supporting multiple frequency bands like CENELEC, FCC and ARIB. The AES security engine features ECB, CBC and CCM modes with key lengths of 128, 192 or 256 bit respectively. This kind of flexible, software based solution is advantageous for meter makers who are targeting worldwide markets. Multiple standards and/or frequency bands can be supported with a single platform which significantly reduces the design effort and cost. Any potential changes or enhancements to the standards can be integrated seamlessly by reprogramming installed meters remotely, and this is a benefit for any market, independent of its fragmentation.

Looking to the investments that are required for semiconductor solutions as well as the development cycles, the most efficient approach to support the ongoing evolution and the variety of standards is to implement a purely software based solution. Renesas has launched Cool Phoenix 2 (CPX2), the second generation device of the award winning

Whilst the software based architecture of CPX2 is offering the flexibility, the integrated analogue front end (AFE) with an adaptive gain amplifier and automatic gain control (AGC) functions, ensure an exceptional signal quality.

Cool Phoenix 2 Block Diagram

Cool Phoenix 2 System Block Diagram

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This results in outstanding robustness especially important in highly dynamic and harsh network environments as found in metering applications. The very low power consumption is also one of the major selection criterion from utilities. In combination with a wide range of Renesas pin, software compatible and scalable microcontrollers for metering applications, the CPX2 power line modem solution provides a perfect fit for cost sensitive smart meter platforms. Renesas also offers fully certified protocol stacks for PRIME and G3, free of charge. As time to market is of similar essence to the technical features, Renesas offers the “Connect it! – Powerline Communication Solution Kit”. This simple to use tool enables customers to evaluate the robustness of the CPX2 PLC solution in all frequency bands. The PC GUI allows flexible device configuration and power line communication analysis. In combination with the world wide support infrastructure and Renesas’ commitment to its customers everything is available to ensure an efficient and short development time. There has been a lot of activity on communication standards over the last few years, especially for power line communication. During this time there have been major advancements made, driven by the utility companies, but most of these for the smart metering market. There have also been industry discussions within Europe to open up the spectrum and allow the use of frequencies up to 500 kHz for smart metering or smart grid applications. However, it’s difficult to imagine that these advancements will still meet the requirements of tomorrow’s smart energy demands. The recent introduction of IPv6 goes a long way to solve the vast number of connected devices but the standards will continue to evolve. The applications that could be added to this infrastructure appear endless, demand management via appliance control, home automation, car charging, security etc. As each new application is added then the demands on the communication increase and so too the demands on the devices running these protocol stacks. All told, the only way to future proof any design is to select a wellfounded roadmap and ensure its flexibility. RENESAS www.renesas.com 24

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INDUSTRY NEWS

MIPS P5600 CPU sets new record for embedded processing performance http://blog.imgtec.com/mips-processors/mips-p5600-cpu-sets-new-performance-record

By Alexandru Voica December 17, 2015 in MIPS Processors, Processors

Two months ago I was returning home from our first ever Imagination Summit in Japan. While waiting to board the airplane that would take me back to England, I saw a billboard sign for Nissan – “WHAT IF_the world’s fastest man went even faster?”. That’s an interesting question, I said to myself. A few weeks later a new email arrived in my inbox from my colleagues in the engineering team informing me that MIPS P5600 had entered the CoreMark chart straight at the top with a record-breaking score of 5.6 CoreMark/MHz per CPU. The world’s fastest single-threaded CPU had gone even faster. This increase in performance was no accident. Like Nissan, we have always been driven to beat the best, even when the best is ourselves; P5600 is now the new king of CoreMark, beating the previous top score held by our award-winning MIPS proAptiv processor. The result has also been certified by EEMBC, the premier and long-standing embedded processor benchmarking consortium that designs and maintains CoreMark; you can find the complete list of certified results on their website. To put this new result into perspective, a MIPS P5600 CPU delivers 20% more performance than its direct competitor while being significantly smaller in area.

MIPS P5600 offers 20% more raw performance in a smaller area MIPS P5600 even scores higher in CoreMark/MHz than Intel’s desktop line of CPUs. For example, an Intel® Core™ i72640M processor achieves 14513.79

CoreMark at 2.8GHz, or 5.18 CoreMark/ MHz – nearly 10% lower than the latest result for MIPS P5600. MIPS P5600 has the highest certified CoreMark score of all licensable CPUs This unprecedented level of performance efficiency will offer a welcome boost to MIPS-based embedded processors used for power-sensitive applications such as mobile, home entertainment, networking, automotive and many others. Even more importantly, these outstanding results have been achieved using the latest off-the-shelf GCC compiler. All of our customers can access this highperformance toolchain either as source from partners or packaged in SDKs from Imagination. This approach is in contrast with some of our competitors that achieve their best benchmark scores with expensive, closed-source toolchains. Instead, Imagination is focused on building an open ecosystem that delivers performance quickly and painlessly, an important consideration for reducing timeto-market in mobile and embedded applications. A quick recap of MIPS P5600 P5600 is a member of our MIPS Warrior P-class processor family and targets ultimate performance for mobile and embedded applications.

EMBEDDED SYSTEMS

P5600 is a 32-bit CPU based on Release 5 of the MIPS architecture and includes a series of unique features such as: • A fast 128-bit SIMD engine for accelerating multimedia processing and other matrix-type operations • Full hardware virtualization supporting multiple fully isolated guest operating systems running in parallel. • Enhanced security for consumer and enterprise applications; this includes the ability to support multiple TEEs (Trusted Execution Environments) on a single CPU. • Best in class, advanced branch prediction mechanisms, page table walking hardware in TLB for optimal performance, instruction bonding for up to 2x increase on memory -intensive data movement routines • Enhanced Virtual Addressing (EVA) for more flexible usage of virtual address space, providing easy and efficient use of memory; eXtended Physical Addressing (XPA) support to fully utilize up to 1 Terabyte of memory (40-bits) This high-end MIPS CPU is also part of our third generation of multi-issue, OoO (Outof-Order), fully synthesizable processors; the figure below illustrates the evolution of high-performance MIPS CPUs over time, from 74K and proAptiv to present day. MIPS P5600 features a series of improve-

ments over previous generation proAptiv CPUs, including enhanced fetch efficiency, reduced L2 cache latency and pre-fetching; additionally, improvements in cache replay and memory disambiguation contribute to gains in performance for a wide variety of real world-applications (e.g. memcopy performance).

MIPS P5600 features a powerful, feature-rich micro-architecture We are very proud of the record-breaking results in performance that the new MIPS Warrior CPUs continue to deliver.

This achievement is built on a heritage of designing high-performance MIPS CPUs; advancements in instruction set architecture (e.g. Release 6) and memory subsystems together with the continuous innovation in micro-architecture implementations will lead to even better results. By combining MIPS Warrior CPUs, PowerVR multimedia IP and Ensigma connectivity IP, system engineers can design state of the art embedded processors that deliver best in class performance at lower power consumption and smaller area; you can read more about building highly competitive platforms using our hardware IP here [ http://blog.imgtec.com/multimedia/building-next-generation-apps-processors-formobile-computing ] and here [ http://blog. imgtec.com/powervr/chipsets-for-smart-glasses-and-other-high-end-wearables ]. If you want to get the latest news and updates about MIPS, make sure to follow us on Twitter (@ImaginationPR, @MIPSGuru, @MIPSdev), Facebook and LinkedIn. For those interested in knowing more about CPU benchmarks, come back to our blog for an upcoming article detailing CoreMark, DMIPS and other industry benchmarks. ,

IMAGINATION TECHNOLOGIES www.imgtec.com

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PRODUCT NEWS Based Microcontrollers For Use In Both Home And Industrial Appliances TMPM470FDFG and TMPM475FDFG enable dual control of two brushless DC motors Toshiba Electronics Europe has announced two new products to join their range of ARM® Cortex®M4F based TX04 series microcontrollers. Both the TMPM470FDFG and TMPM475FDFG are capable of operating two brushless DC motors simultaneously. The new microcontrollers aim to satisfy everincreasing demand for more energy efficient motors and incorporate vectoring technology to ensure highly efficient motor control.

The TMPM475FDFG further integrates a CAN (Controller Area Network) controller which is required for use in specialist factory automation systems. Both chips are ideal for a wide range of uses ranging from industrial applications to use in home appliances, such as washing machines, fridges and air-conditioning units. The TMPM470FDFG and TMPM475FDFG are based upon the high-performance ARM® Cortex®M4F and can operate at up to 120MHz. They incorporate two modules, each containing a programmable motor drive, 12-bit AD converter and vector engine, ensuring the efficient and simultaneous operation of two brushless DC motors from a single chip. Housed in a compact 14mm × 14mm LQFP100 package both the TMPM470FDFG and TMPM475FDFG offer an operating voltage ranging from 4.5 to 5V. *ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. TOSHIBA ELECTRONICS EUROPE www.toshiba.semicon-storage.com 26

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EMBEDDED SYSTEMS Lattice Semiconductor’s New iCE40 UltraLite Device Enables OEMs to Accelerate Time-to-Market of Feature-Rich Mobile Devices Lattice Semiconductor Corporation, the leader in ultra-low power, small form factor, customizable solutions, today announced its new iCE40 UltraLite™ FPGA, which enables manufacturers to accelerate the time-to-market of new mobile devices that incorporate unique and compelling features. The newest addition to Lattice’s successful iCE40 Ultra™ product family, the iCE40 UltraLite FPGA is the industry’s most compact and lowest power device. Its combination of exceptionally low power consumption, an extremely small footprint and a high level of integration enable manufacturers to easily add multiple capabilities and features to their mobile devices including: • The ability to function as a TV remote control thanks to its IR control and learning mode capability • RGB LED control to simulate multicolor breathing effects for notification • White LED control to enable a flash-

light function on smartphones • Motion gesture capability that reduces the need to use the touch screen to awaken devices and launch applications • A high accuracy pedometer that requires very little power

• Maximized battery life as it eliminates the need for less efficient microcontrollers and can minimize the use of devices’ power-hungry application processors LATTICE SEMICONDUCTOR www.latticesemi.com

RUTRONIK EMBEDDED: New Development Board from Vekatech with 32-bit Embedded Microprocessor from Renesas Distributor Rutronik presents Vekatech’s new development board VK-RZ/A1H with the embedded microprocessor RZ/A1H from Renesas with an ARM® Cortex®-A9. The board is available via the webshop Rutronik24.com. The embedded microprocessor RZ/A1H with running at up to 400MHz clock speed integrates up to 10MB of on-chip RAM, OpenVG compatible graphics accelerator, dual LCD-drivers and camera inputs. The huge internal SRAM can hold two layers of WXGA size images making external SRAM redundant. Using serial QSPI-flashes enables compact HW-designs with low pin count ICs. The VK-RZ/A1H board is equipped with the 10MB-version of the RZ/A1H in the package BGA256. The processor has 2x32MB SDRAM and 2x8MB QSPI-flash next to it. Debugging can be performed via standard J-TAG connector. Additional USB function inter-

face, provided by a RL78/G1C connectivity microcontroller is connected to RZ/A1H’ UART. The Board Support Package includes U-Boot, Linux-GCC, FreeRTOS and CycloneTCP both compiled for EWARM from IAR and can

be downloaded from Vekatech’s website (www.vekatech.com). An SD-Card bootloader allows for easy loading and running of applications from the internal SRAM, SDRAM or serial flash. RUTRONIK www.rutronik.com

PRODUCT NEWS Microchip introduces world’s first H.264 video I/O companions optimised for MOST® high-speed automotive infotainment and ADAS networks Microchip announces the world’s first H.264 video I/O companion Integrated Circuits (ICs) optimised for the proven and robust Media Oriented Systems Transport (MOST®) high-speed automotive infotainment and Advanced Driver Assistance Systems (ADAS) network technology. The OS85621 and OS85623 devices expand Microchip’s existing family of MOST I/O companions with a cost-effective video codec solution.

EMBEDDED SYSTEMS

Toshiba announces commercial production of FFSATM for NEC iPASOLINKTM microwave backhaul products Toshiba Corporation has announced that NEC Corporation (NEC), having previously chosen the Toshiba FFSATM (Fit Fast Structured Array) flexible custom LSI solution, has now moved to the commercial production phase of its iPASOLINKTM high capacity microwave communication equipment for mobile networks, utilizing this innovative solution. “NEC has adopted FFSA for its water-resistant, durable, compact microwave system iPASOLINK AOR (All Outdoor Radio) and will expand the adoption of FFSA to other iPASOLINK systems,” said Mr. Atsushi Noro, deputy general manager, Mobile Wireless Solutions Division, NEC. “By changing from conventional FPGAs to a FFSA, NEC was able to achieve high performance with low power consumption, as well as a timely product launch to address the needs of the quickly growing mobile network,” added Noro.

According to global information company IHS Technology, the automotive display market will grow exponentially over the next six years. Driver Information Displays (DIDs) are one of the fastest growing segments, with an expected increase from 30.8 million units in 2014 to 102.8 million in 2020. Driven by safety requirements, the camera market in motor vehicles is also projected to explode. These predictions reflect the increasing demand for video content in all car classes. Featuring a low-latency, high-quality H.264 codec and an onchip Digital Transmission Content Protection (DTCP) coprocessor, the OS85621 enables automotive designers to implement a comprehensive content-protected video transmission solution within days. Video streams with restricted access from devices such as DIDs, digital media drives and TV tuners can now be easily transmitted as encrypted H.264 over a MOST network, satisfying today’s market demand for high-quality audio and video within the automotive environment. The OS85621’s on-chip DTCP coprocessor supports hardware acceleration of the computation-intensive operations required for DTCP authentication and content protection. Up to eight independent data streams can be simultaneously routed through the DTCP coprocessor’s cypher engine for M6 or AES128 encryption/decryption. The ultra-low-latency mode of the H.264 codec enables singledigit millisecond latency from video input to video output, including encoding, transmission over a MOST network and decoding. This real-time, high-speed video processing makes the OS85623, with no DTCP coprocessor, ideal for camera-based ADAS applications that are designed to enhance vehicle safety. MICROCHIP TECHNOLOGY www.microchip.com/OS85621-Page-020315a

Toshiba addresses the customer’s main development criteria such as performance, power, and time to market with its FFSA solution, using licensed technology from BaySand Inc. FFSA offers a new and flexible custom LSI solution to replace broad FPGA series and ASICs with pre-designed masters featuring configurable I/Os, SerDes (Serializer Deserializer), and SRAMs which can be configured according to the customer’s requirements. FFSA supports various types of SerDes protocols for wired and wireless networking, as well as storage and consumer applications. Going forward, Toshiba will position FFSA solutions as a new choice for custom LSI development to help customers optimize their system design and to enable timely product development. To find out more about FFSA, visit http://toshiba.semicon-storage. com/ap-en/product/asic/structured-arrays.html Note: *FFSA is a trademark of Toshiba Corporation *iPASOLINK is a trademark of NEC Corporation NEC CORPORATION BAYSAND INC. TOSHIBA ELECTRONICS EUROPE TOSHIBA CORPORATION

www.nec.com www.BaySand.com www.toshiba.semicon-storage.com www.toshiba.co.jp

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SENSORS

What accuracies can color sensors and mini-spectrometers achieve? Author: M.A. Kevin Jensen, Dipl.-Inf. Thomas Nimz , MAZeT

Spectrometers are used as reference devices in color measurements. However, they usually are to expensive and bulky for active usage in most applications. Color sensors and mini-spectrometers are effective solutions in this case. But which sensors and detectors are suited best for specific applications? Which factors, characteristics and accuracies need to be considered? 1. Introduction Colorimetry or measurement of colors is becoming more and more important in modern applications. In the past simple RGB sensors have been used for some solutions. Nowadays the sensor or detector requirements are even more complex. Color measurement is a complex task and requires know-how and sophisticated sensor solutions depending on the respective application. The perception of color is not based on a physical values like current or pressure, but also includes a subjective or physiological element. Each colorimetrical application requires an adequate system and sensor setup, including filter, electronics, lighting as well as a target for calibration to optimize the accuracy and output. The choice of light sources, the general system operation and filter characteristics decide what the sensor modules will be able to detect. The electronics set the quality level of the sensor signal values and define the time frame and speed of measurement values. An 28

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ideal combination of light, sensor filters and amplifiers leads to ideal results. Missing or inaccurate calibration can lead to misinterpretation of the measurement values. This paper intends to analyze the adequate usage of sensors and detectors (RGB sensors, True Color sensors, multi-spectral sensors and Mini-spectrometer) in relation to the application and demonstrate the finding via measurement values. The applicationbased choice of sensors will also be aligned with cost, speed, size and color accuracy characteristics. 2. Sensors & Detectors 2.1. Overview: Sensors & Detectors Most commonly two different device kinds are used for colorimetric applications. First; the traditional spectrometer as reference and calibration device and secondly color sensors, as cost-efficient option with various resolutions and characteristics. MiniSpectrometers are seen as an option. In the next chapters the various sensors and detectors will be used to perform test measure-

ments in application-based setups to further evaluate the advantages and disadvantages of the types. RGB sensors RGB sensors, based on absorption filters, consist of three band-pass filter in the visual range. The peaks of the spectral graphs are not set uniformly in relation to certain wavelengths but are defined during the manufacturing process based on measurement task and costs. One needs to know that this kind of color measurement is not based on human eye perception, however can or cannot be used in colorimetric tasks - depending on the required accuracy. Even with complex calibration methods, there are accuracy limitations. True Color sensors True Color sensors are used for absolute value color measurements. They use interference filter as a technological basis to implement color standards and are able to measure values more accurately than the

DESIGN

human eye. The term “True Color” is in relation to the characteristics of a sensor type, which consist of filters featuring “better than human eye” standards, the DIN 5033 (or CIE 1931 XYZ color space). These filters consist of a specific allocation of the sensitivity values of a color channel to the spectral wavelength. Deviations lead to a misinterpretation of the measurement values. Via calibration it is possible to determinate the color values as XYZ coordinates, which are used as base values for conversions into other color spaces. Based on the CIE 1931 standard observer characteristics, the True Color sensors measure absolute accuracy values, comparable to the ones of a human eye. Therefore it is possible to describe the color of fabrics or print products in the same way the eye would do. Multi-spectral sensors If the spectral composition of objects needs to be measured or if metamerism effects are expected, the utilization of multi-spectral sensors is recommended. Multi-spectral sensors consist of a chosen spectrum that is separated into spectral areas. The filters are arranged in such a way that their limiting ranges overlap, and almost no gaps in the visible spectrum exist. For multi-spectral sensors the color evaluation takes place on the radio metric level and not the colorimetric level. As result one receives the spectrum of the sample and determines the color point via these values. Mini-spectrometers Mini-spectrometers are compact and sturdy solutions, which measure spectral values and allow an interpretation of the color space. The resolution is limited in comparison to common spectrometers. However based on this fact and the fewer spectral scanning spots they are faster than normal spectrometers but still slower, compared to RGB or True Color sensors 2.2. Comparison Color sensors are characterized by their small chip surface and high operation speed. They are capable of simple color comparisons up to absolute color measurements and radiometric measurements via multi-spectral sensors. Comparison means that one ore multiple samples are measured and used as reference values. A limiting value is set for RGB (relative measurements) or colorimetrical value YXZ like .EL*a*b* (absolute measurement) and used for further classification of measured samples. A

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requirement for comparison measurements is a known array of colors. If the color point alone is not enough, one needs to use mini-spectrometer or multispectral sensors. These allow to perform measurements of an entire spectrum (up to a certain resolution) and compensate metamerism effects. To compare the mentioned sensors and detectors various test setups based on actual applications (using the different sensor types and mini-spectrometers) will be used to demonstrate, when which kind of measurement characteristics are preferred. 3. Measurements 3.1. Application: LED regulation with color sensors RGB and True Color sensors More and more LEDs are replacing tradi-

tional lamps and are used as energy-efficient light source. Examples are display backlights, projectors or ambient lighting in for example in hotels, automation or aviation engineering as well as in medical applications. Often it is required to generate mixed colors or specific color temperatures at a high Color Rendering Index (CRI). Additionally, effects like color shifts related to binning, temperature drifts or aging need to be compensated. Color differences at a . u’v’ = 0.005 can be seen by the human eye. A trained eye can even visualize color differences up to a . value of 0.003. The following test results describe the characteristics of RGB and True Color sensors based on the example of D65 and white light. Table 1 shows the D65 measurement values from the test setting.

Table 1: Comparison of RGB and True Color sensors during a D65 measurement

Table 2: Comparison of Mini-spectrometer and True Color sensors

Table 3: Overview of the analysis factors and interpretation www.epd-ee.eu | February, 2015

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Two systems using a feedback control loop with RGB and True Color sensors have been setup and calibrated at a temperature of 40°C (104°F). Afterwards the temperature of the LEDs has been changed which results in a color drift of the entire system. This drift was compensated by the feedback control loop. Table 1 shows that the RGB sensor has a control accuracy > 0.007 at 20°C (104°F) with further drift while increasing the temperature. However, the True Color sensor remains beneath visual range of the human eye - at a color distance of 0.0011. 3.2. Application: Display technologies True Color sensors and Mini-spectrometers In medical technology it is important that screens of diagnosis devices are capable of a high contrast ratio for detailed display options. Therefore display measurement devices with high precision and measure-

ment sensitivity are required. To date display calibration was performed by calibration laboratories at high costs and efforts. With modern color sensors technologies and applications cost-efficient calibration system alternatives are available. The second test measurement series was performed by illuminating a diffusor plate with LED light at room temperature and 20°C (104°C) LED operating temperature and measuring the color point. With an application-based background the measurement values of a True Color sensor and a mini-spectrometer have been compared in reference to the values of a spectrometer. The measurement results demonstrated that the sensors as well as the mini-spectrometer are capable of processing the signals faster than the reference spectrometer, however the error and accuracy values vary. The measurement values of the mini-spec-

trometer show a mean error of the color point measurement ranging from . u‘v‘ 0.01 to 0.03 - hence are in the visual range of the human eye. The measurements with the True Color sensor provides results with a mean error range of .u‘v‘ 0.001 - 0.005. Tolerance limits that are far below the visual range. 3.3. Application: Printing industry True Color sensors and multi-spectral sensors The printing industry has requirements for spectral value measurements during the printing process. In-line measurements can be a challenging task, since the measurement values are used directly to react and control the overall process. For a practical test series a X-Rite ColorChecker was used for absolute color

Image 1: Typical characteristics of RGB Sensors based on absorption filters

Image 2: Typical characteristics of True Color sensors (XYZ) based on interference filter

Image 3: Typical characteristics of multi-spectral sensors, here with 6+1 characteristic lines

Image 4: RGB sensor (absorption filter) with color drift.

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measurements. For this purpose a multispectral color sensor with an multi-channel transimpedance amplifier and flexible amplification levels was used. A white LED was used as standard light source. The multispectral sensor was used to measure the 24 spaces of the ColorChecker which have been compared with the reference values of a spectrometer. Via regression equation for spectral approximation it is possible to achieve average accuracies of .E00 = 0.72 (compare image 3). Using a True Color sensor at identical conditions average accuracies of .E00 = 1.57 have been achieved.

Image 5: True Color sensor in comparison with a mini-spectrometer (in u'v')

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An advantage of multi-spectral sensors is the greater accuracy and the possibility to use spectral approximation methods. If the printing colors are known, the results can be improved via calibration of the specific colors. Therefore it is possible to achieve absolute accuracies of . E00 < 1 independent of the standard observer and standard light source. The deviation values of the sensor compared to the spectrometer are .E00 = 0.3 for Cyan, .E00 = 0.9 for Magenta and .E00 = 0.3 for Yellow. 4. Summary The evaluation demonstrated that True Color sensors are capable of achieving the accuracy of a mini-spectrometer regarding color measurements - in specific applications they even show superior accuracy. Therefore it is advised to review the specific application in the design phase to implement an adequate solution for the specific task at hand. It is necessary to know what kind of color or spectral information is required and how this data should be processed. The most suitable sensors or detectors are chosen depending on the required data, measurement procedure, accuracy and price.

For example: Mini-spectrometers are not capable of measuring consistent values for PWM controlled LED light measurements and therefore are inadequate for this kind of application. However, RGB and True Color sensors are not based on spectral measurements and therefore cannot be used in applications that require spectral values. In this case multi-spectral sensors or mini-spectrometer are the choice at hand. Image 6 demonstrates a summary of the sensor and detector comparison. These results are based on a five-stage ranking: 1 Very high, 2. High, 3. Medium, 4. Low and 5. N/A. The is a suitable sensor solution for every application. RGB sensors are a perfect match for simple color detection, True Color sensors are ideal for absolute color measurements and multi-spectral or mini spectrometer are suitable for absolute or spectral measurements. n MAZeT www.mazet.de

BIBLIOGRAPHY: (1) MAZeT-Homepage: www.mazet.de (2) Color sensor product information: www.mazet.de/en/products/jencolor (3) Application note, Calibration of JENCOLOR sensors based on the example of LED light sources, MAZeT GmbH, 2012 (4) F.Hailer, F. Krumbein, Application of JENCOLOR multispectral sensors in dermatology, Ilmenau University of Technology (Thur.), 2011, urn:nbn:de:gbv:ilm1-2011imeko-083:6 (5) Walter Alt, Nichtlineare Optimierung, Vieweg+Teubner, 2002, 978-3528031930 (6) DIN5033. Farbmessung; Normvalenz-Systeme (7) Friedhelm KĂśnig. Die Charakterisierung von Farbsensoren. 2001

Image 6: Evaluation of the measurement results via multi-spectral measurement

(8) Georg A. Klein. Farbenphysik fĂźr industrielle Anwendung. 2004. www.epd-ee.eu | February, 2015

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PRODUCT NEWS

Panasonic launches first ever surface mount thermopile array sensor identifies movement, direction and multiple objects Panasonic Automotive & Industrial Systems has launched the first–ever surface mount thermopile array sensor. Grid-EYE features 64 thermopile elements in an 8×8 grid format that detect absolute temperatures by infrared radiation. Grid-EYE is able to measure actual temperature and temperature gradients, providing thermal images. It is easily possible to detect multiple persons, identify positions and direction of movement, almost independent of ambient light conditions without disturbing privacy as with conventional cameras.

Cost-effective and compact solutions for contactless temperature measurement across the entire specified area can be and with very accurate results. The built-in silicon lens provides a viewing angle of 60°. The measurement values can be read out via I²C interface in 1 or 10 frames per second. The interrupt signal output delivers a quick response to time-critical events or additional energy saving capabilities in stand-by mode, offering a high degree of flexibility. Measuring 11.6 × 4.3 × 8.0mm, Grid-EYE arrays have an operating voltage of 3.3V or 5V and a typical current consumption of 4.5mA (normal mode); 0.8mA (stand-by mode); and 0.2mA (sleep mode). Object temperature range is 0-80°C for the high gain amplification version and -20-100°C with low gain. Overall Temperature accuracy is ± 2.5°C with an NETD (Noise Equivalent Temperature Difference) of ± 0.5°C, depending on P/N. Compared to single element thermopile sensors and pyroelectric detectors, Grid-EYE sensors offers extended possibilities for detecting persons and objects, enabling advanced Applications. Applications include: Digital Signage; Security; Lighting Control; Kiosks/ATMs; Medical Imaging; Automatic Doors, People counting. PANASONIC AUTOMOTIVE AND INDUSTRIAL SYSTEMS EUROPE http://eu.industrial.panasonic.com 32

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SENSORS New click-in design for disposable infusion flow sensor Sensirion stands for innovative products, customer-specific solutions and excellent support. The company's products continually set new standards in various markets across the globe. At this year's MD&M West trade fair, Sensirion will present new and enhanced sensor solutions for measuring gas, liquid flow and differential pressure. The leading sensor expert will exhibit a redesign of the innovative disposable liquid flow sensor LD20-2000T. With the goal of separating the core sensing element from other complex electronics, Sensirion has developed a two-piece, clickin design that radically improves the cost-efficiency of the solution while retaining high performance liquid flow measurement on a minimum footprint. With the reduction of the disposable part to a bare minimum,

Sensirion’s flow measurement solution is ideal for medical applications such as infusions, catheters, etc. In these applications, flow rates and monitoring of failure modes are essential to patient safety and the quality of the therapy. The click-in connection between the disposable sensor element

and reusable part offers a quick and easy solution for communication and mechanical integration of the sensor. The click-in design illustrates the strength of Sensirion’s technology in providing small, cost-effective sensing solutions that offer high performance at low flow rates, typical for medical applications. SENSIRION www.sensirion.com/ld20-2000T

Sensirion’s mass flow measurement for smart gas boilers Sensirion AG extends its expertise in the smart energy market and makes gas boilers more comfortable and environmentally sound. The Swiss manufacturer’s completely calibrated and temperaturecompensated sensors and sensor solutions ensure precise and reliable measurement of the air mass to a combustion chamber. This expertise enables not only higher boiler efficiency but also a significant increase in the modulation ratio, which, in turn, enhances the comfort and lifetime of the boiler. Thanks to their compact size and flexible modification options, Sensirion’s solutions for mass flow measurement can be installed in

any boiler. In addition, the proven sensors guarantee a wide dynamic control range, the elimination of zeropoint drift, outstanding repeatability and accuracy and

the option of certified intrinsic safety. Sensirion also offers sensor solutions for the measurement of temperature and relative humidity, as well as natural gas with gas quality compensation. SENSIRION www.sensrion.com/technology

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AUTOMATION Murata’s automotive industry focused crystals are high performance and very cost effective Murata announced the launch of the XRCGB-F-A series crystal units for automotive applications. The crystals are the first in the world to use an exclusive new, proprietary package technology that delivers consistent superior quality, mass production capabilities, and importantly for customers, a highly cost-effective product. In recent years demand has grown in the automotive market for electronic control units (ECUs) that provide sophisticated control capabilities. As a consequence, this has resulted in a trend towards ECUs that operate at higher frequencies. In response to this organic demand from the market,

Murata has developed and commercialized the XRCGB-F-A series crystal units that are compact, 2016-size (2.0 × 1.6mm), and highly precise while supporting high frequencies. The line up of crystals in the series support frequencies from 24 to 48MHz, and products supporting other frequencies will be added in the future. Combining small size with high precision, the crystal units feature a frequency tolerance of plus or minus 30ppm and a frequency temperature stability of plus or minus 35ppm within the typical operating temperature range of automobiles (-40 to

+125°C). This makes them suitable for nextgeneration automotive LANs such as Ethernet or image processing ECUs. The crystals are also ideal for use in ADAS ECUs (camera, millimeter wave, laser, etc.), and gateway ECUs. TOSHIBA ELECTRONICS EUROPE www.toshiba.semicon-storage.com

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PRODUCT NEWS

ACTIVE COMPONENTS

Intersil Announces Industry’s Smallest Dual 3A/Single 6A StepDown Power Module Intersil Corporation announced the ISL8203M, a dual 3A/single 6A step-down DC/DC power module that simplifies power supply design for FPGAs, ASICs, microprocessors, DSPs and other point of load conversions in communications, test and measurement, and industrial systems. The module’s compact 9.0mm × 6.5mm × 1.83mm footprint combined with industry-leading 95 percent efficiency provides power system designers with a high performance, easy to use solution for their low power, low voltage applications. The ISL8203M is a complete power system in an encapsulated module that includes a PWM controller, synchronous switching MOSFETs, inductors and passive components to build a power supply supporting an input voltage range of 2.85V to 6V. With an adjustable output voltage between 0.8V and 5V, designers are able to use one device to build a single 6A or dual output 3A power supply.

Toshiba Expands Range of Automotive N-ch MOSFETs With Low Resistance TO-220SM(W) Package Toshiba Electronics Europe (TEE) has expanded its line-up of automotive N-channel power MOSFETs with the launch of two new devices: TK160F10N1, a 100V, 160A product and TK200F04N1L, a 40V, 200A class product. Target applications include EPS, DC-DC converters and load switches. Each device features a chip using the UMOSVIII-H process in a TO-220SM(W) package that has had its package resistance reduced to its limit with a new internal copper connector. In this way, the products have achieved industry leading low on-resistance characteristics measured @ VGS = 10V. RDS(ON) = 0.78mΩ (typical) for the TK200F04N1L RDS(ON) = 2.0mΩ (typical) for the TK160F10N1.

Both devices feature low thermal resistance of Rth(ch-c) = 0.4˚C/W (max) and 175˚C max channel temperature rating. The new MOSFETs realize higher efficiency and lower heat generation. In addition, the U-MOSVI-

II-H has a better switching ripple suppression capability than the previous generation. It can contribute to EMI noise reduction in applications. TOSHIBA ELECTRONICS EUROPE www.toshiba.semicon-storage.com

Toshiba Launches New Power Amplifier IC for Car Audio Designed to maximize efficiency, the ISL8203M power module offers best-in-class 15°C/W thermal performance and delivers 6A at 85°C without the need for heat sinks or a fan. The ISL8203M leverages Intersil’s patented technology and advanced packaging techniques to deliver high power density and the best thermal performance in the industry, allowing the ISL8203M to operate at full load over a wide temperature range. The power module also provides over-temperature, over-current and under-voltage lockout protection, further enhancing its robustness and reliability. “Our customers are building increasingly compact DC/DC solutions,” said Mark Downing, senior vice president of Infrastructure and Industrial Power Products at Intersil. “The ISL8203M analog power module offers the smallest footprint for a dual output low power solution without performance compromise, making it possible for customers to get the footprint and the efficiency they require.” Key Features and Specifications • Dual 3A or single 6A switching power supply • High efficiency, up to 95 percent • Wide input voltage range: 2.85V to 6V • Adjustable output range: 0.8V to 5V • Internal digital soft-start: 1.5ms • External synchronization up to 4MHz • Overcurrent protection INTERSIL 34

EP&Dee | February, 2015

www.intersil.com | www.epd-ee.eu

Toshiba Electronics Europe has launched a new, 45W per channel power amplifier IC for automotive applications. The new 4-channel power amp IC, TCB001HQ, has been designed to offer enhanced noise tolerance and to limit the effect of interference generated by in-car mobile phone use. Stopped vehicles fitted with engine idling reduction technology can suffer significant drops in battery output voltage, which can adversely affect the sound quality and clarity of in-car entertainment systems. By reducing the minimum operating voltage from 8V to 6V, the all new power amplifier offers more stable operation and prevents loss of sound and reduces noise disturbance. With mobile phone interference protection, the

TCB001HQ provides a superior in-car listening experience. The TCB001HQ also offers a newly developed filter circuit and reinforced protection circuits, including thermal overvoltage, output to VCC, output to

GND and output to output protection, to ensure increased reliability. Built in mute and standby functions help to maintain battery charge. TOSHIBA ELECTRONICS EUROPE www.toshiba.semicon-storage.com

PRODUCT NEWS Renesas Electronics Unveils New Solution to Increase Productivity and Security for Industrial Internet of Things Applications Renesas Electronics announced the availability of the RX71M Group as the new flagship product in the RX Family of 32-bit microcontrollers (MCUs). Developed for use in industrial equipment, the new series doubles the CPU operating frequency to 240 megahertz (MHz) from the 120 MHz of previous products and is available with up to 4 MB of on-chip flash memory. Systems are more complex and larger in scale than previous versions while manufacturers are eager to adopt product development platforms to address increased development times and increased costs.

On-chip flash memory MCUs are extensively used in midrange industrial equipment that are popularly priced in order to achieve a good balance between performance and system cost. M2M communication in industrial equipment has created demand for MCUs that are optimized for a range of performance levels, from sensor nodes operating at around 30 MHz to controllers operating at 200 MHz and above, and also for scalability in order to reduce the man-hours required for software and hardware development. Recently, industrial customers are increasingly dispersing their system development efforts among multiple facilities and pursuing joint development arrangements with partners with strengths in specific technologies. This will result in reduced development costs of the new and advanced functions associated with transitioning to the IoT while increasing efficiencies and reducing development times. Such dispersed development and joint development approaches could bring risks to the customer’s own core technologies (such as important algorithms) such as leaks or unauthorized duplication. It has therefore become necessary to pursue development in a way that ensures one’s own software resources are protected. Industrial equipment demands real-time performance since the sequence of processing steps, from data input to arithmetic processing to output of results must always finish within a set duration. When an MCU’s CPU operating speed is faster than the speed at which the flash memory can be accessed, dedicated high-speed on-chip SRAM can be added so that algorithms that require real-time processing can be run from the high-speed SRAM, but using dedicated SRAM in addition to the on-chip flash memory increases the cost. RENESAS ELECTRONICS EUROPE www.renesas.eu

ACTIVE COMPONENTS

ON Semiconductor unveils new family of ultra-low power precision operational amplifiers New zero drift, low voltage devices highly suited to precision applications in industrial, consumer, wireless, IoT and automotive where strong stability across wide operating temperature ranges is mandated ON Semiconductor has introduced a family of affordable, precision CMOS operational amplifiers (op amps) that deliver zero drift operation and industry leading quiescent current for frontend amplifier circuits and power management designs. Targeted at industrial, white goods, telecom, wearables, Internet-of-Things (IoT), test equipment and instrumentation applications, the NCS325 and NCS333 op amp devices enhance the accuracy of motor control feedback and power supply control loops, thereby contributing to higher overall system efficiency. These devices are complemented by the new NCV333 automotive-qualified (AEC-Q100 grade 1) op amp offering similar functional performance for power train, braking, electronic power steering, valve controls, fuel pump and fuel injection system applications. Featuring high DC precision parameters, such as the 10 micro Volts (μV) maximum input offset voltage at ambient temperature and the 30 nV/°C of offset temperature drift, make these amplifier devices extremely well optimized for low side current sensing and voltage differential measurement on front-end sensor functions. Minimal voltage variations over temperature along with close to zero offset ensure the efficiency of systems exposed to wide operating temperature ranges without the need for complex software calibration algorithms, resulting in a more manageable design and longer product lifespan. The NCS325 and NCS333 provide rail-to-rail input and output performance and are optimized for low voltage operation of 1.8 volt (V) to 5.5V, with a best in class quiescent currents of 21 μA and 17 μA respectively at 3.3V. The devices operate with a gain bandwidth of 350 kilohertz (kHz) with ultra-low peak to peak noise down to 1.1μV from 0.1Hertz (Hz) to 10Hz. “By offering precision operational amplifiers that deliver industryleading analog performance, these new devices meet the stringent objectives of our customer’s projects as well as addressing the ever growing industry demand for more energy efficient end designs,” said Simon Keeton, vice president Integrated Circuit Products at ON Semiconductor. “Historically, engineers have preferred to utilize zero drift precision op-amps but the traditionally high cost of such solutions has discouraged implementation. With the introduction of this family of amplifiers, we have been able to make precision affordable.” ON SEMICONDUCTOR www.onsemi.com www.epd-ee.eu | February, 2015

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PRODUCT NEWS Murata’s combined LC type EMI suppression filters have high attenuation characteristics for modern devices Murata announced the launch of its BNX series of surface mount, LC combined-type EMI suppression filters for the automotive, industrial electronic equipment, and healthcare markets. The filters employ an exclusive circuit configuration combining capacitors and ferrite beads to achieve superior frequency characteristics and excellent attenuation characteristics for highly effective noise damping. In recent years, the trend toward more sophisticated functionality in set devices has intensified the need to reduce noise levels and this has driven the demand for noise filters with improved attenuation characteristics. In response to this market demand,

Murata has developed the BNX026/27/28/29 series of EMI suppression filters that deliver high attenuation characteristics over a wider bandwidth range. The new series of DC line noise filters cover a wide range of frequencies, from the kilohertz to the gigahertz bands. The filters are also compatible with large currents and high voltages, making them suitable for a broad range of applications. Insertion loss characteristics enable high attenuation rates of 35dB or more over a wide range from 15kHz to 1GHz. BNX filters with a current rating of 15A are ideal for power supply circuits susceptible to low-frequency-band noise, whilst parts with a voltage rating of 50V (BNX026H01 and BNX027H01) are suitable for automotive applications requiring support for high voltages. Murata’s BNX series of EMI filters are suitable for noise reduction on DC power lines in electronic equipment, automobiles, medical equipment, factory automation equipment, control equipment, communication equipment, digital AV equipment, and other applications. Mass production is currently underway at plants in Japan. MURATA www.murata.com 36

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ACTIVE COMPONENTS New LinkSwitch-4 Switcher ICs from Power Integrations Pass US DoE-6 and European CoC Efficiency Rules Power Integrations announced the LinkSwitch™-4 family of CV/CC primary-side regulated (PSR) switcher ICs. The LinkSwitch-4 product family features an advanced adaptive base and emitter switched drive scheme for bipolar junction transistor switches (BJTs) that substantially improves power conversion efficiency and eliminates reliability concerns due to secondary breakdown. The new family of devices targets chargers and adapters required to meet stringent new efficiency rules from the US Department of Energy (DoE) and European Code of Conduct (CoC), both of which are scheduled to come into force in January 2016. The new DoE rules, known as DoE-6, require efficiency compliance measurements to be taken at the end of the charger USB cable; LinkSwitch-4 exceeds the requirements while using a low-complexity Schottky diode secondary, even for high-current 1.5A

and 2A smartphone chargers. LinkSwitch-4 ICs incorporate a multimode PWM/PFM controller with a quasi-resonant switching strategy to maximize the efficiency, meet <30 mW no-load and at the same time maintain

fast transient response. A high operating frequency of up to 65 kHz enables transformer size to be minimized, and the minimum peak current is fixed to improve transient load response. POWER INTEGRATIONS www.power.com

ALPS Develops and Commences Mass Production of “UGZZF Series” Bluetooth®/Wireless LAN All In One Module for Automotive Use ALPS has developed the “UGZZF Series” Bluetooth®/Wireless LAN All In One Module* for Automotive Use, ideal for wireless connection between automotive equipment, such as car navigation systems, and mobile devices. Mass production began in December 2014. Smartphone functionality is being constantly enhanced and a shift from 3G to 4G LTE as the main communication standard has made high-speed, highcapacity data communication possible. This has given rise to a host of new services making use of cloud-based data, a trend creating spillover effects for the automotive electronics market. Car navigation, display audio and other automotive systems incorporate Bluetooth® communication functionality for such features as hands-free calls and music playback using a smartphone or similar device. In recent years, however, wireless LAN is increasingly being added to enable high-speed

communication with cloud networks via LTE-capable smartphones. Additionally, systems which use Bluetooth®, as modules that also contain an antenna, must have Bluetooth® SIG certification, as well as any certification specified by radio legislation in

each country. Furthermore, many car audio and other automotive systems have CPUs with low processing capability, feeding demand for modules with integrated Bluetooth® protocol stack and wireless LAN driver. ALPS ELECTRIC www.alps.com

PRODUCT NEWS New power MOSFET drivers from Microchip feature thermally efficient, small packages for improved efficiency Microchip announces the first power MOSFET drivers in a new product family: the MCP14A005X and MCP14A015X. These drivers feature an entirely new driver architecture for high-speed operation, the first in the MCP14A product line. Available in SOT23 and 2 × 2 mm DFN packages, the new devices are among the smallest packaged MOSFET drivers on the market today. The small packaging enables higher power densities and smaller solutions, while the design targets fast transitions and short delay times that allow for responsive circuit operation. Additionally, these MOSFET drivers include low input threshold voltages that are compatible with low voltage MCUs and controllers, while still maintaining strong noise immunity and hysteresis.

• • • • •

Key Facts: MCP14A005X and MCP14A015X allow fast transitions of large capacitive loads SOT-23 and 2 x 2 mm DFN packages are among the industry’s smallest for MOSFET drivers Combines low input threshold voltages with strong noise immunity and hysteresis Reduces power loss in the controller and conduction loss in the power MOSFET Compatible with MCUs with operating voltages down to 2.0V

The MCP14A005X and MCP14A015X MOSFET drivers’ low input threshold is compatible with various Microchip PIC® microcontrollers (MCUs) and dsPIC® Digital Signal Controllers (DSCs), even when operating at lower voltages. This enables customers to design applications with MCUs operating as low as 2.0V, using the MOSFET driver to boost the output signals to 18V, reducing power loss in the controller and minimising conduction loss in the power MOSFET. The threshold levels balance the need for noise immunity with the ability to function with a wider variety of controller products, including Microchip’s devices. These drivers are designed for use in power supply, lighting, automotive and consumer electronics markets, including embedded power conversion, brushed DC motor, unipolar stepper motor and solenoid/relay/valve control applications, among others. The MCP14A005X and MCP14A015X are available now for sampling and volume production in SOT-23 and 2 × 2 mm DFN packages. MICROCHIP TECHNOLOGY www.microchip.com/MCP14A005X-MCP14A015X-Page-012715a

ACTIVE COMPONENTS

Renesas Electronics’ New Microcontroller Solution Brings Unprecedented Levels of Integration and Reduced Power Consumption during Standby Mode by Approx. 30% for Home and Industrial Sensing Systems Renesas Electronics announced the availability of the RL78/I1D Group of microcontrollers (MCUs). The RL78/I1D Group realizes the industry’s lowest power consumption and integrates a wealth of analog functions usable in various sensing applications. More specifically, the RL78/I1D functions are optimized for detectors that sense minute variations in the output of sensors used to monitor for smoke, gas, and motion or vibrations. The ability to use functions such as the data transfer controller

(DTC), event link controller (ELC), and data operation circuit (DOC) to perform data processing and transfer, and implement long-interval timers, all without the need for CPU intervention, helps to further reduce power consumption during intermittent system operation by approximately 30 percent. In the low-power operation mode, the RL78/I1D Group has an operating current level much lower than that of competing products, and it wakes up from the stop-mode state very quickly. The MCU alone can make a substantial contribution to the overall power efficiency of the system. To help reduce system cost and allow for greater compactness, the new RL78/I1D Group integrates general-purpose differential input operational amplifiers, a 12-bit A/D converter, and a comparator. This brings together on a single chip all the analog peripheral functions required to interface with sensors. Key Features of the RL78/I1D Group of MCUs: • Innovative snooze mode functions enabling data processing and transfer without CPU intervention • Dynamic switching of the operation mode to match the system status • On-chip analog peripheral functions necessary for detecting minute sensor signals RENESAS ELECTRONICS EUROPE www.epd-ee.eu | February, 2015

www.renesas.eu | EP&Dee

INDUSTRY PRODUCT NEWS

The Food And Beverage Industry Aurocon Compec www.compec.ro www.designspark.com

The Food and Beverage industry is a global and complex collective of diverse businesses. This industry represents a exhaustive range of products, systems and services. Aurocon Compec offer integrated solutions which can help you to set a new standard for efficiency and productivity. Manufacturing businesses directly involved in the production of foodstuffs and beverages – including processing of meat, dairy, cereals, and vegetables, and the final manufacture of packaged foods, bakery, wines & spirits. This would also include the production of animal feed and pet food products. 1. HYGIENE Application: Solution: l

Reacting quickly to accidental spills and leaks can help reduce hygiene risks and potential downtime Special products to prevent contamination

IP69K TAB PIEZO SWITCH Illuminated piezo buttons Vandal-proof aluminium housing No mechanical parts Supply voltage: 24Vdc Switching current: 0.1A Switching capacity: 1W Make pulse duration: 0.02 → 1s. Capacitance: 30pF

RS Stock No.: 254-030 ( Schurter )

IP69K 16 KEY KEYPAD Resistant to extreme ambient conditions such as negative temperatures, ice and snow IP 69K protection Free from mechanical parts Long lifetime of more than 20 million actuations Aluminium front plate IK 05 impact strength Contact rating; 200mA @ 50Vdc Keypad Layout: 4 × 4

RS Stock No.: 708-2848 ( Schurter )

2. REDUCE DOWNTIME Application: Solution: l

Many sensing products are exposed to intense cleaning regimes or have the potential for direct food contact and the right choice of product can affect its performance and reliability. F&B focused sensing products

INDUCTIVE PROXIMITY SENSOR From freezing: -25°C to sterilization at +85°C Cylindrical stainless steel and plastic bodies Connector sensor conforming to IEC 60529, IP67 Cabled sensor conforming to IP68 (double insulation) DIN 40050 IP69K (cabled and connector types) Pre-cabled or connector for quick disconnect Tamper-proof laser identification Non-flush mount

EP&Dee | February, 2015

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RS Stock No.: 181-792 ( Telemecanique )

INDUSTRY PRODUCT NEWS l

PBS HYGIENIC PRESSURE SWITCH Hygienically-graded pressure switch Wetted parts are made from stainless steel 1.4435 Individually programmable switching outputs and analog output Pressure values are indicated on the display Unit of pressure value in the display can be switched Output states are indicated separately via large LEDs Suitability for CIP and SIP ensures high system availability Rotatable housing for optimum cable routing

Sick Stock No.: PBS HYGIENIC ( Sick )

3. ENERGY MANAGEMENT Application: Solution: l

Knowing how much electrical energy is used by different parts of your process will enable energy efficiency measures to implemented. Local Power Monitoring

POWER QUALITY ANALYSER Measurement Type: Crest Factor, Current, Energy, Frequency, Harmonics, Phase Angle, Power Factor, Voltage Absolute Maximum Current Measurement: 3000A Absolute Maximum Power Measurement: 9999kVA Maximum Voltage: 600V Memory Capacity: 8000Records Dimensions: 130mm × 80 mm × 43mm Display Type: LCD

RS Stock No.: 697-3743 ( ISO-TECH )

TM320 DATA LOGGER Recording Storage Conditions of Materials Including Pharmaceuticals, Food and Chemicals Monitoring Critical Equipment and Computers Evaluating Conditions in Coolers and Storage Rooms 2 Number of Input Channels Number of Readings Per Channel: 16000 Interface Type: CF Card, Serial, USB Maximum Temperature Measurement: 70 °C Best Temperature Measurement Accuracy: ±0.4 °C Maximum Humidity Measurement: 95%RH Best Humidity Measurement Accuracy: ±2 %RH

RS Stock No.: 539-1878 ( Dickson )

4. LEGISLATION COMPLIANCE Application: Solution: l

Maintaining compliance with the current COSHH requirements and food safety guidelines can be challenging. COSHH guidance & approved cleaners

FLYING INSECT KILLER Can be used free standing, wall mounted or suspended from ceiling (chain supplied) Case Material:Stainless Steel Depth: 130 mm Individual Lamp Wattage: 20W Number of Lamps Required:2

RS Stock No.: 473-0856 ( RS )

TESTO 106 DIGITAL THERMOMETER Optical limit value monitoring Waterproof and dishwasher-safe inside “Topsafe” case Optical & Audible alarm Auto hold facility Probe tip: ø2.2mm (reinforced to 3mm after 15mm) Absolute Maximum Temperature Measurement: +275°C Temperature Scale: Centigrade, Fahrenheit Resolution: 0.1°C Battery type: 2 × AAA

RS Stock No.: 620-9758 ( Testo ) www.epd-ee.eu | February, 2015

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PRODUCT NEWS

PASSIVE COMPONENTS

ON Semiconductor introduces next generation 13 megapixel CMOS image sensor with industry-leading sensitivity

Smallest Buzzer in the World from Kingstate now at Rutronik

ON Semiconductor, driving energy efficient innovations, has announced the latest addition to its expansive range of imaging products with the

As of now, distributor Rutronik offers world’s smallest buzzer KSSGI3J12-A from Kingstate. Thanks to its small architecture, it is ideal for wearable and portable devices. Measuring only 4 ×4 × 2mm, the KSSGI3J12-A from Kingstate is the smallest buzzer throughout the world. It features high frequency 4,000 ±300Hz and

introduction of its next-generation 13 megapixel (MP) image sensor - the AR1335. Based on advanced 1.1 micron (μm) pixel technology, the

AR1335 sets a new benchmark in sensitivity along with dramatic increases in quantum efficiency (QE) and linear full well capacity. Designed specifically for smartphone camera applications, this image sensor delivers a near digital still camera quality experience with power consumption and footprint that are optimised for mobile devices. ON Semiconductor has developed its innovative 1.1 μm pixel technology for performance smartphone sensors with cutting-edge pixel and colour filter array (CFA) processing advancements, which has increased the sensitivity by nearly 20 percent compared to the previous generation. This world-class sensitivity allows for more light to be captured so image quality is significantly improved, especially in low light. ON SEMICONDUCTOR

www.onsemi.com

rated voltage of 3Vop with a minimum SPL of 70dB. Furthermore, the buzzer does not contain hazardous substances. Therefore, the high-efficient, ultra-thin and heat-resistant component is ideally suited for wearable and portable devices, car and home electric, GPS navigation devices, as well as for consumer products, hand held, office and medical equipment. RUTRONIK

www.rutronik.com

IDT introduces high-performance crystal oscillators with Best-in-Class jitter performance, low cost and short production lead times Integrated Device Technology, Inc. (IDT®) expanded its comprehensive timing portfolio with the introduction of two new families of crystal oscillators. The IDT XU and XL families offer unparalleled features and flexibility at an industry-leading price-vs.-performance ratio. The high-performance, low-phase jitter crystal oscillators are customizable for frequencies from 16 kHz to 1.5GHz, with 300 fs RMS phase jitter, and are available in HCMOS, LVPECL, LVDS, and HCSL outputs. To shorten time to market, IDT is offering fast delivery of its custom-frequency oscillators. Engineers used to waiting up to months from other vendors can expect to receive the new IDT crystal oscillators in two weeks or less. The new timing devices feature a typical jitter value of 300 fs RMS with a maximum value of 400 fs, integrated over 12 kHz to 20 MHz. These devices offer frequency stabilities as low as ±20 ppm with a temperature range as wide as -40C to 85°C in industry standard packages - 7 × 5 mm, 5 × 3.2 mm. IDT 40

EP&Dee | February, 2015

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