EP&Dee no 1 - January 2013 by Electronica Azi

JANUARY, 2013 足 ISSUE NO. 1, VOL. 11

DESIGN & MANUFACTURING

EP&Dee ELECTRONICS

PRODUCTS

DESIGN

足

EASTERN

EUROPE

Intuitive ease-of-use combined with modern

industrial design Low power LED Lighting applications: a Power-Management Technique

p10

Control and protection rests on measurement precision

p18

T H E E A S T E U R O P E A N R E S O U R C E F O R E M B E D D E D A P P L I C AT I O N S

JANUARY 2013 Table of Contents EDITORIAL 4 Top Technology developments that will shape 2013 In the consumer world we saw the tipping point for 3D Television, Tablets outgrowing the demand of laptops and the continued rise of the maker movement with Raspberry Pi, Beagleboard and Arduino giving more opportunity to experiment, explore and develop with electronics.

INDUSTRY NEWS 6 EMC inaugurates Center of Excellence in Herzliya The global information security leaders create a new nerve center in Israel, headed by Israeli hi-tech entrepreneur Orna Berry.

COVER STORY 14

Win a Microchip enhanced mTouch™ Capacitive Touch Evaluation Kit! EP&Dee is offering its readers the chance to win a Microchip enhanced mTouch™ Capacitive Touch Evaluation Kit. The enhanced mTouch Capacitive Evaluation Kit (P/N DM183026-2) provides a simple platform for developing a variety of capacitive touch sense applications using PIC16F, PIC18F, PIC24F, PIC24H and PIC32 microcontrollers. The Diagnostic Tool provided allows the user to analyze application-critical information in real-time as it relates to touch sensor behavior.

Intuitive ease-of-use combined with modern industrial design Glass displays in the 16:9 widescreen format exude modern design and high quality. If they additionally feature multi-touch functionality, then the door to totally new operating concepts is opened.

DESIGN FEATURES 8 Low power Cortex-M4 microcontrollers; all down to the IDM’s implementation The term ‘low power’ is now so endemic that it has lost a lot of its impact and some of its meaning.

10 Low power LED Lighting applications: a Power-Management Technique The balance of LED luminous versus electrical power is an essential specification when determining the quality of visible light when a set of LEDs is controlled in a lighting application.

16 USB Audio Simplified The rapid expansion of the universal serial bus (USB) standard in consumer electronics products has extended the use of USB connectivity to propagate and control digital audio.

18 Control and protection rests on measurement precision Designers of solar power – photo-voltaic or PV – generating systems face some of the same problems as their counterparts in any other power-related technology; the need to constantly improve performance, reliability, longevity and above all, efficiency.

22 Use of passive components in compliance with specifications The automotive market's requirements regarding the construction of parts are increasing constantly, and the differentiation between specific series and types is also growing.

PRODUCT NEWS 26 34 36 38 39 40 42

Embedded Systems Active Components LEDs Passive Components Display Sensors 26 Connectors

For your chance to win a Microchip enhanced mTouch™ Capacitive Touch Evaluation Kit, visit: http://www.microchip-comps.com/epdee-encap and enter your details in the online entry form.

35 Group Publisher Director Gabriel Neagu

EP&Dee | January, 2013 | www.epd-ee.eu

These evaluation boards are intended to be used to develop a capacitive touch sense application using Microchip’s mTouch Sensing Solution technologies. A board is used by first connecting a sensor daughter board, and then supplying power to the board via USB, a PICkit™ 3 In-Circuit Programmer/Debugger, or the PICkit Serial Analyzer. The enhanced kit now contains 4 motherboards featuring PIC16F1937, PIC18F46J50, PIC24FJ64GB106 and PIC32MX795F512H microcontrollers. It also contains four sensor daughter boards consisting of a Direct 8-Key Board, 12-Key Matrix Sensor Board, 4-channel Slider Sensor Board and 2-Channel Slider Sensor Board. Also included in the kit is a PICkit Serial Analyzer and USB cable.

Contributing editors Radu Andrei Ross Bannatyne Consulting Marian Blejan Bogdan Grămescu Mihai Savu Asian Reprezentative Taiwan Charles Yang Tel: +88643223633 charles@medianet.com.tw

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EP&Dee (Electronics Products & Design Eastern Europe) is published 10 times per year in 2013 by Euro Standard Press 2000 s.r.l. It is a free to qualified electronics engineers and managers involved in engineering decisions. Starting on 2010, this magazine is published only in digital format. Copyright 2013 by Euro Standard Press 2000 s.r.l. All rights reserved.

EDITORIAL

EMBEDDED SYSTEMS

Top Technology developments that will shape 2013 by Bee Thakore European Technical Marketing Manager Farnell element14

In the consumer world we saw the tipping point for 3D Television, Tablets outgrowing the demand of laptops and the continued rise of the maker movement with Raspberry Pi, Beagleboard and Arduino giving more opportunity to experiment, explore and develop with electronics. element14 and our partners are at the heart of new technology development and most techies like me go straight from one holiday wish list to pencil in what would feature in the next one as many announcements make big waves in the early part of the year at CES in Las Vegas ( Jan) and then the Embedded industry’s crown jewel, Embedded World (Feb). So, here is the technology news and developments I am most looking forward to in 2013. 1. TV transformers – is your TV upgradable? Let’s start with the theme of transitioning technology from 2012 to 2013... Back in February last year, I needed a new HD screen for my Raspberry Pi and found myself unprepared but amazed; stood next to one of those huge video-walls evaluating several sets. It makes so much sense now to get an internet enabled TV that can connect to all my mobile devices with the same content. The best thing I came away with was Samsung’s Smart TV with an ‘Evolution Kit’ – which upgrades the TV’s CPU, GPU and memory. It allows us to stop buying new hardware (upto a certain point) and just upgrade its functionality! The latest version of the Evolution kit is available with new features in 2013 and hence you get a brand new TV each time with better motion control, voice control and even facial recognition – Philip K Dick will be happy too! Expect to see more of this and further improvements that require upgrades on the hardware – like the 4K Ultra HD.

2. Flexible foldable unbreakable phones 2012 saw an unprecedented surge of smartphones with the worldwide user base exceeding the one Billion mark, smartphone design

EP&Dee | January, 2013 | www.epd-ee.eu

went from miniaturisation to the mini-tablet. Smartphone shape, design and usability features remain paramount in winning consumer votes and I believe we are only months if not weeks away from not just being excited about rounded rectangles but fully foldable and unbreakable flexible phones which can be bent, curved around your wrist and wearable!

sion (x3) of scratch resistant surfaces on tablets. Nokia has announced a prototype of a foldable phone, as have NEC. All in all, beginning of where we think wearable smart electronics are going (See below #4): the modern tri-coder is going to look better than in Star Trek.

Samsung's new phones use OLED technology, but the firm is also looking into graphene and Nokia’s Morph phone prototype. This would mean that your phone would become a much smarter device; a health and fitness and multimedia unit all in one, activated by voice or touch. Corning is geared to announce Gorilla Glass 3, a newer tougher ver-

3. Gesture control Gesture control (as with TVs) isn’t entirely new but we are going to see it making big waves: with Orange partnering with Movea for ges-

EDITORIAL ture control set top boxes, eyeSight’s partnership with Lenovo, and Leap motion’s arrangement with Asus means we will be interacting much more with Gesture. Microchip has also dived straight into this releasing its GestIC® with solutions for mobile friendly 3D gesture controls.

EMBEDDED SYSTEMS 5. Cheaper, better, smaller

7. 3D Printing is here everyone!

Of course CES is also abuzz with the excitement that game consoles and Kinect would be announcing better 3D spatial recognition and gesture tracking devices. The above mainly refers to us seeing gesture control applications beyond gaming devices, possibly on our desktops/tablets, and in our car infotainment devices.

2012 saw NXP launch ARM Cortex-M0, Freescale launch ARM Cortex-M0+ MCUs for less than 50 cents USD, and the Raspberry Pi offer a full 1080p Multimedia center with an ARM11 for less than the price of a school textbook. With low power co nsu m pt i o n, better standby control and easier migration paths, design is increasingly shifting to 32bit and what we saw in 2012 is just a start.

For years we have been waiting with baited breath for 3D printing to become mainstream with much benefit for businesses and consumers and we have started to see an emergence of giants such as MakerBot and 3D Systems dominating the landscape. I need no convincing about the ‘why’ of 3D printing – I am a convert, ever since being an engineering student at the University of Bath. But if you want to see a 3D printer in action, or better still win one, visit us at Embedded World!

4. Wearable sensors will be everywhere

6. ARM gets stronger with internet of things

When Google teased I/O conference attendees with Project Glass – (a pair of wearable augmented spectacles), several set out to make their own from jail broken iPods and video projectors and it marked a peak of some 11 million wearable electronics devices that

Keeping on with the theme of lower power consumption, ARM continues to be a name that everyone wants to work with enabling intelligent, connected networks that can constantly learn and improve experiences. Imagine this: You invite a friend for dinner, you could browse receipes on your phone and with a click of a button you can order all ingredients to be delivered 1.5 hr before they arrive even if you are in another timezone or country. Based on your and their social profile or upcoming travel, the TV could recommend films or if you are going to miss your favourite show, it can automatically record it.

were sold in 2011. This number is rising steadily due to increasing popularity of health devices, which saw Nike+ FuelBand partnership stores pop up in several places for the 2012 holiday season, proudly showcasing the STMicroelectronics Low Power sensors at work. Now with kits like the expansion modules for ST’s highly popular discovery platform, we will be seeing more and more such devices – including those that can even sense sleep patterns like Basis, the motion based, single sensor wristband with API available soon and Kickstarter success story - customisable smartwatch Pebble. At CES, Vuzix is rumoured to also announce its M100 augmented reality gaming eye wear running with Android!

Our virtual assistants and devices are all going to be connected – for example, my car could signal when I reach a certain proximity to my house and turn on the heating or my favourite piece of music. We are talking about Siri or your ‘ittn’ (if this then that) assistants which will all grow up and be invisible butlers. We may not have all of this seamlessly in 2013, but it is going to be the defining year. One thing we will see in 2013 for sure is the car as a sandbox for the internet of things. Many car manufacturers have also been tinkering with open-source platforms like Tizen (a collaboration between Samsung and Intel) Linux, GENIVI, and Android to power their infotainment systems and in-vehicle systems (nav, video, audio, controller OS). For example, Renault’s new Clio features the Android-based R-Link.

The reason why I am excited about 2013 is an announcement from the Univeristy of Warwick, a research team led by Professor Simon Leigh has developed a material called Carbomorph, which is basically an inexpensive, printable conductive plastic. This would mean that one can spec out electronic tracks, sensors, and touchsensitive areas into their designs, and print out things like functioning game controllers or sensor-embedded objects. (To prove the latter, the research team printed a mug that could detect how much liquid it was holding seen here in the image.) So, it transpires that the future isn’t all about flying cars, but technology is going to be more on and around us in an invisible, foldable, intelligent non-intrusive way making 2013 happen. Experience some of these key products live with Farnell element14 at Embedded World 2013. • Hands-on with the ST F4 Discovery Expansion Boards • Meet the Raspberry Pi Founders and Designers n • Win a 3D printer! www.epd-ee.eu | January, 2013 | EP&Dee

INDUSTRY NEWS

EMBEDDED SYSTEMS

EMC inaugurates Center of Excellence in Herzliya The global information security leaders create a new nerve center in Israel, headed by Israeli hi-tech entrepreneur Orna Berry. by Rivka Borochov

Israel boasts the largest number of PhDs per capita of any country in the world. Its engineers are highly sought after globally, and all the major telecommunications and Internet giants from Intel to IBM, Google to Apple are opening R&D centers and hubs of excellence to tap into Israel’s talented engineering resource pool. With ears and eyes on the ground, the global firms are first in line when they find an Israeli startup worth acquiring. EMC (http://israel.emc.com/), a US-based global IT Fortune 500 company specializing in information security, big data storage, processing infrastructure and now cloud computing, sees Israel as a major force for its success. Israel proved itself after 9/11 - particularly in making banking transactions more secure - and now EMC is looking to Israel to improve its cloud computing technologies. Cloud computing is an IT movement that takes information typically stored on a physical server and moves it to a network as a metered service. For instance, cloud computing allows you to check your emails on a variety of devices and from a number of locations. EMC is currently working on about six cloud computing projects in Israel.

In December 2011, EMC inaugurated a new building for the Center of Excellence facility in Herzliya, a city north of Tel Aviv, to unite its Israeli acquisitions and innovations. This followed the opening of an EMC R&D center in Beersheva (with Israeli government backing), a continuation of EMC’s entry in Israel that began in 1996 when the company first opened a sales and services operation in Tel Aviv. About 1,000 Israelis now work for EMC in Israel, with engineers, innovation and sales support staff dispersed across Herzliya, Beersheva and Petah Tikvah.

Israel aided post-9/11 recovery Without the contribution of Israeli innovations to EMC, the world post-9/11 might look a little different today. EMC Israel's input led to significantly better disaster management, says Orna Berry, a founding member of the Israeli hightech industry. Berry is an EMC corporate vice president and general manager of the Center of Excellence in Israel since January 2010.

To celebrate the inauguration of the new Center of Excellence (COE) facility, EMC's CEO and chairman, Joe Tucci, arrived in Israel for his first visit, accompanied by RSA Division President Tom Heiser and Sanjay Mirchandani, chief information officer and chief operating officer at EMC Global Centers of Excellence. The new COE consolidates EMC’s Israeli research and development, which was previously handled at various locations in the central region of Israel. It joins a global network of EMC COEs in the United States, China, Egypt, India, Ireland, and Russia focusing on security, virtualization, information management and enterprise content management. The new Center of Excellence will combine the know-how and tools of several Israeli companies acquired by EMC in 2006.

Orna Berry, VP at EMC “With regard to information security innovations, it was recently announced that RSA, the security division of EMC, shut down over 500,000 cyber attacks across 185 countries. That translated to an estimated $7.5 billion in savings for financial institutions,” Berry reveals.

Israeli startups that were acquired and assimilated by EMC include Kashya data replication and CDP (continuous data protection) solutions; nLayers (www.emc.com/domains/n-layers/index.htm) software for the automatic detection and mapping of various applications running on computing systems; ProActivity (www.emc.com/about/news/press/us/2006/06192006-4457.htm) software solutions for analysis and automatic processing of business processes; and Zettapoint (www.zettapoint.com/Eng/Index.asp) database optimization solutions

The Israeli EMC Center of Excellence opened in December 2011.

EP&Dee | January, 2013 | www.epd-ee.eu

Some of EMC’s Israeli investments, such as Kashya, have panned out globally, multiplying sales assets by a factor of 10. Others have fit in nicely with EMC's 50,000-strong global workforce, helping to keep the data of banks and biotech firms secure and backed up. (www.emc.com/about/news/press/us/2006/05092006-4371.htm)

INDUSTRY NEWS Israeli innovation, she points out, has been critical in maintaining data integrity during disaster recovery. This means the ability to both store and maintain a high quality of data that may need to be recovered –– a situation faced by many companies in the wake of 9/11, when their servers melted down. “The companies that had backup systems and disaster recovery systems from EMC were the first to come back online,” she says. Helping megafirms return to a sense of normalcy was possible as a result of “the integrity and architecture of the systems developed by Israeli engineers.” According to Berry, Israelis are good at devising sophisticated algorithms that compress and save the integrity of data in distributed computing. This field requires a fine balance of math and computer science.

EMC-Israel partnership began three decades ago

EMBEDDED SYSTEMS Interface of computers and life science

Computers won’t replace brains

Berry held off joining the Israeli computer science industry until she felt it was mature enough. “I knew the time would come,” she says, “and I wanted to join the ‘forces’ when it was getting to be more fun.”

“The question of where chemistry, physics and biology intersect with computers is a very important research topic,” she says. Through her work over the years, most notably as the only woman to serve as chief scientist of the Israeli Ministry of Industry, Trade and Labor, she was able to plug her know-how into both the high-tech and biotech industries of Israel.

Growing up in computer sciences when the field was still embryonic was something she calls "amazing." According to Berry, the field never excluded women. Instead, she believes it was quite the opposite. Today she is in touch with female friends from college who have similarly moved on to senior management positions.

Despite her vast experience with computers, Berry still believes that "computers are not a replacement for the human mind. However, they can help analyze massive amounts of data to see if any results found in science, for instance, are replicable.”

Berry says that success is “still dependent on the individual’s desire and the will of the woman. There is no structure that makes women’s lives easier in [computer science] in Israel.”

Much loved and lauded in the research community in Israel, Berry has more than 25 years of entrepreneurial experience in the science, computer science, high-tech and ven-

Berry credits the serial Israeli entrepreneur Moshe Yanai, who worked for EMC in Massachusetts in the late 1980s, with steering the business from a memory extension company to a storage leader. Yanai helped create a new market segment at EMC, says Berry. In particular, he worked on developing the EMC Symmetrix, believed to be the most successful storage system for computers today. EMC has a solid history with Israeli technology, says Berry. “From a historical perspective, EMC is tied to Israel, and appreciates and respects Israeli innovation,” she says.

Orna Berry – Computer science pioneer Born in Jerusalem in 1949, Orna Berry (http://en.wikipedia.org/wiki/Orna_Berry) studied math and statistics and received her BSc and MA at the University of Haifa and Tel Aviv University, respectively. In 1977 she moved to the United States to continue her studies. Berry, today a mother of three and grandmother of four, earned a PhD in computer science at the University of Southern California (USC). While in California, Berry brushed elbows with the most famous computer scientists in the world, including professors Len Kleinrock from UCLA, who developed the precursor to the Internet, Jerry Estrin from UCLA, who built the first computer outside the US and the UK (the Weizac at Israel’s Weizmann Institute), as well as Len Adelman from USC (Adelman is the “A” in RSA, the best-known public key cryptography algorithm), computer science author Ellis Horowitz and machine vision expert Gerard Medioni.

Orna Berry in front of the Herzliya EMC Center of Excellence. During the exciting 10 years she spent in the US, Berry had a fellowship at the RAND Corporation, and then worked at the Systems Development Corporation, later acquired by Burroughs and merged with Sperry to form UNISYS.

ture capital industries, and is celebrated as a woman who knows how to promote innovation in Israeli society.

“When I first came to the States I wasn't planning on pursuing computer science. I was trying to work in a way that was feasible in genetics and computing, trying to work on models in medicine related to genetic evolution,” says Berry. “The computing systems were insufficient at the time.” Today she is helping develop the tools to handle complicated and massive sets of data – Big Data.

Today, EMC in Israel is working on the development of flash storage technology, by means of a new project called Lightning, based on cloud computing. As the head of EMC in Israel, Berry will be steering her team skyward, taking some of the best engineering brains in Israel into the future of cloud computing.

Lightning through the clouds

n www.epd-ee.eu | January, 2013 | EP&Dee

DESIGN

MCUs

Low power Cortex-M4 microcontrollers;

all down to the IDM’s implementation by Andreas Eieland Senior Product Manager Atmel

The term ‘low power’ is now so endemic that it has lost a lot of its impact and some of its meaning. From an MCU manufacturer’s point of view, low power is relative to the competition and it should be apparent to engineers that not all Cortex-M4 based MCUs, for example, operate within the same power envelope. In order to really deliver low power, independent device manufacturers (IDMs) must develop their own low power technologies and methodologies, which they can apply to the Cortex-M4 IP. In Atmel’s case for example, its low power solution is picoPower™. When an MCU is designed for low power it must deliver across a range of use-cases. Measuring power isn’t straightforward under the best of conditions, so being able to rely on the entire architecture to deliver low power operation under all conditions is essential. Benchmarking MCUs for power is largely dependent on two states of operation – static and dynamic. Under dynamic conditions, the frequency of operation clearly has an impact, as power is ‘nominally’ only consumed in a CMOS circuit when there is a logic transition. Reducing the frequency, therefore, lowers the transitions per second, but doesn’t address the number of times a transistor must switch in order to achieve a given task. Voltage has an exponential impact on power consumption. Lowering the supply voltage delivers greater power savings than scaling the frequency alone. Operating from a lower supply voltage isn’t as simple as lowering the clock frequency, however. It must be ‘designed in’ at the process level.

EP&Dee | January, 2013 | www.epd-ee.eu

Figure 1 One of the most efficient MCUs available, Atmel’s SAM4L achieves up to 28 CoreMark™/mA when using the IAR Embedded Workbench, version 6.40.

DESIGN Static power is consumed when the CMOS gates are supposed to be in a quiescent state. While this should, in theory, be zero, in practice it is impossible to create a transistor with no leakage current in modern geometries. In general, the smaller the geometry, the greater the leakage current, therefore, the more transistors integrated in a device the higher the overall potential static leakage current. By developing low leakage transistors, a proprietary process like picoPower can successfully address these issues and get the leakage close to the theoretical zero without sacrificing performance. As the fastest and most frequently switching transistors in an MCU will be found in the core’s RAM and the core itself, it follows that all the time the core and its sub-system is active it will dissipate the greatest amount of system power. For this reason, sleep modes are now ubiquitous among MCUs. The Cortex-M4 has been developed by ARM to support two sleep modes, each of which turns off a greater or lesser degree of system clocks. IDMs choose how to implement their own sleep modes but they all essentially require the core to halt and store system-critical information in registers and RAM, ready to be reinstated when exiting sleep mode. This all takes time and in a typical MCU application, time is synonymous with responsiveness. Because of this, low power goes far beyond a transistor’s switching characteristics. It is a direct result of the overall system architecture. Only by approaching the architectural design from this systemic viewpoint can an IDM truly develop a low power solution. By addressing all aspects of power consumption, IDMs are better able to design an MCU that offers true low power operation. Implementing a Cortex-M4 in a low leakage process will, of course, result in lower system power than if it were implemented in a high performance process, but if the system design is entirely core-centric, it is likely that even the most mundane tasks will require the core’s intervention. For example, a simple interrupt service routine, even where no action is taken, would require the core, Flash and other system modules to be fully woken from a sleep mode. With a high performance core like the CortexM4, the action of waking the core and its entire sub-system from deep sleep, just to execute a service interrupt routine or some other simple task, would actually take considerably longer than the time needed to process the actual task. This would not only consume a significant amount of valuable system power, but most of it would be used just in waking the system. It follows that through a holistic approach that adopts low power techniques complementary to the core, an IDM can develop and implement features that make extensive use of low leakage transistors in the core and peripherals while also reducing the time spent processing. Consequently, they can

MCUs maximize low power operation. This holistic approach is proving to be the most relevant and effective way for manufacturers to optimize for power. The degree to which it is employed is what really differentiates IDMs within the Cortex-M4 sphere. Before static power became a major factor in system design, active power was possibly the only design parameter that concerned most engineering teams. IDMs like Atmel have a long history of delivering MCUs that offer more performance at lower active power. This legacy isn’t by accident.

tion are essential if they are to manage tasks normally handled by a high performance core. For example, the Peripheral Event System in Atmel’s SAM4L is independent of both the CPU and its clocking system. With its own access control to the real-time clock the Peripheral Event System is able to continue operating when the CPU and the system clock are effectively ‘off’. Atmel’s picoPower approach to low power was first used in the 8-bit AVR XMEGA family and continues with Atmel’s first picoPower Cortex-M4 device, the SAM4L. picoPower is

Figure 2: Block diagram of Atmel’s SAM4L microcontroller. One aspect of maintaining low active power is finding the most efficient way of moving in and out of sleep modes. The faster the system clock can be re-established, the faster the core can complete its task and the less active power used. Further to this for example, Atmel implements features that can operate independently of the core. Intelligent, autonomous peripherals are able to process inputs and outputs independently of the CPU. Running off a dedicated clock, this approach allows the core to remain in sleep mode for longer and through carefully architected inter-communication features, peripherals are also able to exchange data using shared buses, enabling them to make intelligent decisions based on external stimuli without having to wake the core. Enabling peripherals to operate autonomously is now recognized as a key addition to low power operation. However, it is, again, crucial that the implementation is integral to the overall system architecture. Peripherals that exhibit a fast response time to the point of real-time opera-

used to address the three key areas of power consumption within an MCU – sleep mode, active mode and wake-up times. Within the SAM4L, the use of picoPower lets the device achieve an active mode power consumption that is significantly lower than the competition; 90μA/MHz, which is achieved in part through the development of an ultra-low power buck regulator that not only gets the voltage down for the majority of frequently switching gates, but also does it with high efficiency. Thanks to the holistic low power design approach that also includes the process development the SAM4L can operate down to 1.62V. The SAM4L consumes as little as 1.5μA in WAIT mode, with full RAM retention. Bundled with an unrivalled wake-up time of less than 1.5μS, the SAM4L gives the lowest total power consumption. In sleep mode, the SAM4L draws as little as 0.5μA with the RealTime Clock still running, and with a wake-up time of less than 2μS. n www.atmel.com www.epd-ee.eu | January, 2013 | EP&Dee

DESIGN

LEDs

Low-Power LED Lighting Applications: A Power-Management Technique by Ezana Haile Principal Applications Engineer, Analog & Interface Products Division Microchip Technology Inc.

The balance of LED luminous versus electrical power is an essential specification when determining the quality of visible light when a set of LEDs is controlled in a lighting application. Illuminating an entire set of LEDs simultaneously to achieve the maximum luminous level may not be possible in low-power applications, due to the limited current source. To produce optimum luminosity the power dissipation per LED must be managed efficiently, from the low-power source. This requires a power-management technique where, within the set, only one bank of LEDs is powered for a given time. The alternating banks of LEDs will remain visually undetected as the required luminous intensity is achieved. The available power and the luminous intensity required for the application must be established in order to determine the number of LEDs for a given time interval. A comparison between luminous intensity and forward-current characteristics must be made to select LEDs with the required intensity level. Once the number of LEDs required has been established, that number can be powered at a given time interval is determined by taking the ratio of the total current required for the LEDs and available current, as follows: # of LEDs in a bank = Total Required Current for LEDs / Total Available Source Current

EP&Dee | January, 2013 | www.epd-ee.eu

The frequency at which the bank of LEDs is turned ON/OFF must be tuned so that the ON time is long enough for full illumination of a bank, and the OFF time is limited by the time it takes before the bank starts to visibly dim. The OFF time limits the number of additional LED banks that can be controlled via timeinterval management. This technique can be implemented at low cost with a clock source, digital flip-flops to control banks of LEDs, and an OR gate to detect a start condition with a simple On/Off switch. Figure 1 shows a block diagram of a D flip-flop configuration to control four banks of LEDs.

To start, the flip-flop is in a no-change state and requires a start pulse, which must be at least once clock cycle, so that it can be detected by the first flip-flop at the rising edge of the clock. The duration of the start signal must be momentary and cannot be longer than one clock cycle, otherwise the first two flip-flop outputs will be set at the same time and since the source current is limited, the lighting application will not function properly. A bank of LEDs is fully illuminated at the rising edge of every clock with this configuration and to the human eye it appears as though all LEDs are fully turned on, simultaneously.

DESIGN This implementation is monotonic, however, and does not provide design flexibility. It only has an on or off state. This circuit may be adequate for applications such as LCD backlights, but if dimming or pattern generation is needed, a microcontroller (MCU)-based circuit provides the greatest flexibility with minimum impact to the total cost of the solution.

LEDs The circuit is simpler to build, with fewer components as the MCU controls each bank of LEDs, and can also detect user inputs for dim control and pattern selection. A low-cost and low pin count 8-bit microcontroller, such as Microchip’s PIC10F or PIC12F family, with an I/O port expander such as Microchip’s MCP23018 would deliver a cost-effective imple-

Figure 1: LED lighting time-interval using a flip-flop circuit.

mentation. I/O expanders can also be useful for driving LEDs, when the lighting circuit is remotely located with respect to the MCU. I/O port expanders expand the I/O ports of a microcontroller. In this application, the MCU controls the I/O expander ports via the I2C™ protocol to drive the LEDs on or off, and the MCU’s I/O pins can be used to detect user inputs via a push-button switch, or with the built-in analog to digital converter to detect a potentiometer level for dim control. I/O expanders are available with open-drain or push-pull output configurations. Microcontrollers can operate at 3.3V or lower, so an open-drain-output I/O expander lends itself well to this application. The advantage is that it permits the LEDs to operate at 5V or higher while the microcontroller and the I/O expander are powered at a lower voltage. The MCP23018 is a 16-bit I/O port expander with an open-drain output and an I2C interface. Figure 2 shows a circuit diagram for an opendrain-output I/O expander pulled up to a higher voltage than the MCU’s supply voltage. When the I/O port is set as low, then the voltage at the I/O expander port is 0V and current flows, which forward biases and turns on the LED. The LED-biasing resistor, limits the current to the LED for the required luminous intensity and also functions as a pull-up resistor for the open-drain output.

void main (Void){ initialize(); //initialize the PICmicro peripherals including Timer0, and I/O expander peripherals bank_counter = 0; //Clear the bank counter variable while(1){} //infinite while loop } Void Interrupt int_service(void){ TurnOffAll_LEDs(); //subroutine to turn off all previously lit LEDs I2C_start(); //I2C protocol – start signal subroutine I2C_send(Comand_byte); //I2C protocol – send byte subroutine If(bank_counter == bank1){ // bank1 is a constant defined as 0 I2C_send(Address_pionter_bank1n2); //Send peripheral register address pointer I2C_send(‘0000 1111’); //I2C protocol – send bank status (bank 1 on and bank 2 off) bank_counter = bank_counter + 1; } If(bank_counter == bank2){ // bank1 is a constant defined as 1 I2C_send(Address_pionter_bank1n2); //Send peripheral register address pointer I2C_send(‘1111 0000’); //I2C protocol – send bank status (bank 2 on and bank 1 off) bank_counter = bank_counter + 1; } If(bank_counter == bank3){ // bank1 is a constant defined as 2 I2C_send(Address_pionter_bank3n4); //Send peripheral register address pointer I2C_send(‘0000 1111’); //I2C protocol – send bank status (bank 3 on and bank 4 off) bank_counter = bank_counter + 1; } If(bank_counter == bank4){ // bank1 is a constant defined as 3 I2C_send(Address_pionter_bank3n4); //Send peripheral register address pointer I2C_send(‘1111 0000’); //I2C protocol – send bank status (bank 4 on and bank 3 off) bank_counter = 0; } I2C_stop(); //I2C protocol – stop signal subroutine }

Pseudo Code 1: Microcontroller interrupt service routine code flow

Figure 2: Low-cost, microcontroller-based lighting solution using I/O port expander. When the I/O-expander output port is set as high, the open-drain output is off or high impedance and the voltage at the I/O expander port is pulled up to 5V by the pullup resistor. The LED is in an off state because current will not flow. An open-drain-output configuration also offers the advantage that when the port is configured as high impedance, it takes longer for the LED to turn off due parasitic capacitance. This enables the next bank of LEDs to turn on for slightly longer duration, compared to similar applications with push-pull output. www.epd-ee.eu | January, 2013 | EP&Dee

DESIGN The MCP23018’s 16 I/O ports can drive up to 16 LEDs. The amount of current that can be sunk into the I/O port when the LED is fully turned on can be limited by the I/O expander’s output drive. The I/O port’s low-level voltage is specified for 0.6V maximum at 8.5mA of current. If the current is higher than 8.5mA, the low-level voltage will exponentially increase. The absolute maximum current is 25mA. If the source current is limited to 5V/50mA, for example, and 2mA is budgeted for the microcontroller, the I/O expander and the resistors for user-input detection, the rest of the available current can be dedicated for LED lighting. Four LEDs can be controlled per bank if the luminous intensity of the LED at approximately 10mA is adequate. In this example the current-limiting resistor value will be approximately 440Ω. The timing shown in Figure 1 can be replicated using a short MCU instruction code. For example, referring to the Pseudo Code 1, the main subroutine can be an infinite while-loop. At the MCU timer intervals (Timer0) an interrupt service routine sends an I2C command to the I/O expander to turn on only one bank of LEDs. The interrupt service routine counts or keeps track of the LED bank status, such as the bank that is currently turned on, and the corresponding I/O expander port configuration as high or low. Initially, or after the MCU resets, on the first Timer0 interrupt, bank 1 is turned on. And, on the second interrupt, bank 1 is off and bank 2 is on. Then, on the third interrupt, bank 2 is off and bank 3 is on. Finally, on the fourth interrupt, bank 3 is off and bank 4 is on, and the bank counter variable is cleared. On the next interrupt, the cycle repeats by turning on bank 1 and turning off bank 4. Other variables, such as Command_byte, Address_ pointer_bank1n2 and Address_pointer_ bank3n4 are constants defined in the header file. With such an implementation, the circuit outputs the required luminous intensity, and it appears that all LEDs are turned on simultaneously from the available power source. Dim Control and LED Pattern Generation Interesting lighting patterns can be easily generated with a microcontroller-based application, The I/O port expander’s output states are loaded from 2 bytes of RAM variables, labeled as Bank1n2_pattern and Bank3n4_pattern. The nibble of each byte corresponds to each bank. A predefined look-up table contains various patterns of 1s and 0s for each bank. To continuously monitor the push-button switch on/off state, an IF THEN statement is added to the MCU code–the main subroutine’s infinite while-loop. When the push-button is momentarily pressed, a pattern from the look-up table is loaded in the two bytes of RAM, labeled as Bank1n2_pattern and Bank3n4_pattern. When the Timer0 interrupt occurs, the new pattern is sent to the I/O

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LEDs expander and the LEDs are lit according to the pattern. The main subroutine cycles through the look-up table, as the push-button switch continues to be momentarily pressed by the user. To display an alternating light, simply send the complement of the previous pattern. For example, if the bank1 pattern is ‘0101’ then the complement is ‘1010,’ as shown in Pseudo Code 2, which is a snippet from Pseudo Code 1.

However, a delay must be added in the interrupt subroutine, before the bank on/off IF THEN statements to visually inspect the alternating patterns. This is created with a Delay_ON flag, so that on the following interrupt, only a delay counter is decremented to count down the number of interrupts for delay. The delay value can also be user-selected using a potentiometer, where the centre tab is connected to the MCU’s on-chip analog

* * * If(bank_counter == bank1){ // bank1 is a constant defined as 0 I2C_send(Address_pionter_bank1n2); //Send peripheral register address pointer Bank1n2_pattern = ~Bank1n2_pattern; //complement the variable using ‘~’ I2C_send((Bank1n2_pattern | ‘0000 1111’)); //I2C protocol – send bank status //(use OR ‘|’ to set bank 1 on and bank 2 off) bank_counter = bank_counter + 1; } * * *

Pseudo Code 2: Pattern generation * * * Void Interrupt int_service(void){ TurnOffAll_LEDs(); //subroutine to turn off all previously lit LEDs If (Delay_ON == ON){ // ON is a constant defined as 1 Update_Timer0_Counter(Timer0delay_interval); //subroutine to update Timer0 // Timer0delay_interval is a constant to set the minimum delay Delay_Counter = Delay_Counter – 1; //count down the number of interrupts for delay If(Delay_Counter == 0){ Delay_ON = OFF; // Clear the delay flag for the next interrupt Delay_Counter = Get_Delay_Counter(); //subroutine to detect user input //and set the delay counter variable }else{ Delay_ON = ON; // leave delay flag ON Return; //exit the interrupt service routine } } I2C_start(); //I2C protocol start signal subroutine I2C_send(Comand_byte); //I2C protocol – send byte subroutine If(bank_counter == bank1){ // bank1 is a constant defined as 0 I2C_send(Address_pionter_bank1n2); //Send peripheral register address pointer Bank1n2_pattern = ~Bank1n2_pattern; //complement the variable using ‘~’ I2C_send((Bank1n2_pattern | ‘0000 1111’)); //I2C protocol – send bank status //(use OR ‘|’ to set bank 1 on and bank 2 off) bank_counter = bank_counter + 1; Delay_ON = ON; // turn on the delay flag } * * *

Pseudo Code 3: Delay code implementation to view the lighting pattern

DESIGN Void get_PWM_ratio(void) { Double PotScale; //local variable to store ADC output scale Double PWM_Percentage; //local variable to store PWM change percentage PotScale = (ADRESH)/16 + 1; //Scale ADC output high byte PWM_Percentage = 1/16 * PotScale; //Scale the output from from 0 to 1, equivalent to 100% PWM_High = Frequency_counter * PWM_Percentage; //set PWM high Timer0 value PWM_Low = Frequency_counter * (1 – PWM_Percentage); //set PWM low Timer0 value //PWM_High and PWM_Low are global variables, //and Frequency_counter is a constant Timer0 value to set frequency. }

Pseudo Code 4: Subroutine to calculate PWM ratio

Figure 3: Timing diagram for PWM output and timing delay. * * * If(bank_counter == bank1){ // bank1 is a constant defined as 0 If (PWM_High_Low_flag == OFF){ //check PWM status flag get_PWM_ratio(); //Detect user input for PWM ratio Timer0_counter = 65535 – PWM_High; //set Timer0 counter variable Update_Timer0_Counter(Timer0_counter); //subroutine to update Timer0 I2C_send(Address_pionter_bank1n2); //Send peripheral register address pointer Bank1n2_pattern = ~Bank1n2_pattern; //complement the variable using ‘~’ I2C_send((Bank1n2_pattern | ‘0000 1111’)); //I2C protocol – send bank status //(use OR ‘|’ to set bank 1 on and bank 2 off) PWM_High_Low_flag = ON; //Set flag Delay_ON = OFF; }else{ Timer0_counter = 65535 – PWM_Low; //set Timer0 counter variable Update_Timer0_Counter(Timer0_counter); //subroutine to update Timer0 I2C_send(Address_pionter_bank1n2); //Send peripheral register address pointer I2C_send(‘1111 1111’)); //I2C protocol – turnoff all LEDs bank_counter = bank_counter + 1; PWM_High_Low_flag = OFF; //Clear flag Delay_ON = ON; } } * * *

LEDs to digital converter (ADC) input. The ADC’s digital data is scaled from minimum to maximum delay by detecting the top four bits, which provide 16 levels. A finer ratio can be set by detecting the top five bits, or 32 levels. The maximum delay is the slowest the LEDs can blink and, with minimum delay, it appears that all LEDs are fully turned on. The timing diagram in Figure 3 shows the delay position, tDELAY. To control the duration for the time-interval of each bank, the dim control uses pulse width modulation (PWM). The Timer0 interrupt duration has two values, one for high duration and another one for low duration, proportional to the PWM percent ratio, set using a thumb-wheel potentiometer; the centre tab is connected to the ADC input. The resolution level can be adjusted by selecting the top 4 or 5 bits from the ADC. The Timer0 counter position is adjusted ratiometrically, with the scaled ADC data, where the 100% PWM is equal to the maximum counter position, fully lit, and 0% minimum or lowest dim level. Pseudo Code 4 shows the PWM scaling equation for 16 levels, and Figure 3 shows the timing diagram for the PWM duration, tPWM_LOW and tPWM_HIGH. The interrupt service routine must update the Timer0 counter positions for the next interrupt. It also has to detect whether the duration is for PWM high or low time. Therefore, a few instructions must be added to detect the potentiometer level for dim control and ratiometrically scale the Timer0 counter position with the PWM_High and PWM_low values shown in Pseudo code 4. Pseudo Code 5 shows the code for adjusting the PWM; an IF THEN statement is used to detect the PWM state. This methodology can also be implemented on a mid-range 8-bit microcontroller with additional program memory, such as Microchip’s PIC16F family. An upgrade would enable the main subroutine to handle sophisticated lighting patterns, such as chasing lights. The MCU’s Timer1 module can be employed to vary the duration where the two RAM bytes are updated for the chasing pattern. Designers are always looking for novel ways to cut costs without compromising performance. There are many methods to efficiently drive the banks of LEDs used in LCD backlights or lighting-pattern applications for efficient illumination. In low-power applications, LEDs can be controlled by managing the time interval for each bank of LEDs. In addition, low pin count microcontrollers and I/O port expanders provide a low-cost alternative for lighting solutions with additional design flexibility. n www.microchip.com

Pseudo Code 5: Code flow for PWM ratio setting www.epd-ee.eu | January, 2013 | EP&Dee

DESIGN

DISPLAY

Kontron's new Panel-PC generations with projectedcapacitive 16:9 glass multi-touch screens

Intuitive ease-of-use combined with modern industrial design by Max Scholz Product Manager HMI Kontron

Glass displays in the 16:9 widescreen format exude modern design and high quality. If they additionally feature multi-touch functionality, then the door to totally new operating concepts is opened. Projective-capacitive operation is a particularly elegant solution. With the introduction of Kontron's new Panel-PC families all these features are becoming available for the first time in industrialpurpose designs. The potential for designing Human Machine Interfaces (HMI) with graphical user interfaces (GUI) and SCADA terminals in factories has evolved significantly in the past few years. This potential is being driven by the increasing availability of multi-touch displays suitable for industrial use, as used in tablet PCs, for example. Completely new forms of user interaction have emerged, like turning screen content using two fingers, zooming into content by spreading fingers or scrolling by simply swiping.

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New operating concepts It is even possible to implement two hand operation in order to facilitate switching motors on or off, and even the mechanical dead man's switch could be replaced. But whatever concrete solution needs to be created, the most convincing form of operation is one which is simply carried out by hands. It is only natural for people to want to work with their hands rather than type with their fingers. But even typing is simpler with multi-touch displays. In comparison to one-fin-

ger operation the Shift-key can be activated. The 16:9 format provides more room for gesture control or for virtualizations. If the display is used in portrait mode, a complete keyboard can be blended in on the lower part of the screen which does away with the need for a physical keyboard - both space- and cost-saving. Projected-capacitive or resistive Which touch technology is the right one though? If thick work gloves do not have to be

DESIGN worn, the projective-capacitive version of the glass touch surface is the most comfortable choice for the operator. It is especially touchsensitive thus achieving a high level of operation precision. A further practical feature is that the field which is projected on the glass surface can already perceive the proximity of the hand, so that it is only necessary to lightly glide over the glass surface. The operating haptics are consequently completely different from resistive touch, which requires physical pressure on the screen. But resistive touch has its advantages too. It is recommendable for those applications in which thick gloves have to be worn. For industrial applications the 5-wire technology is appealing. It can be operated by every type of glove and offers – in comparison to the 4-wire version - a much higher level of precision. Compared to the 8-wire technology it comes at a much lower price and offers a longer lifecycle, which significantly reduces the Total-Cost-of-Ownership. New Look & Feel Improved ease-of-use though is not the only aspect why HMIs should get a new Look & Feel. Glass touch displays are also setting a new design trend which optically excels with its smooth and seamless glass surfaces. At the same time though this is where the challenge begins: Where robust designs are concerned, the glass panel cannot just be stuck on the back with an assembly kit, like, for example, is the case with ceramic cooking areas, in order to create a shock- and vibration-proof hold. Especially not when the opening of the housing on the machine or equipment has to offer comprehensive protection against dust and spray water. One good way to solve this is to embed the glass display of the touch panel into an aluminum shell, which at the same time protects the edges of the glass displays from knocks and bumps. In this way, mounting equipment can be integrated into the shell, which fixates the PanelPC in the case front with the appropriate sealing. This results in an industrial-purpose product solution featuring a completely flat glass surface on the front. Two new Panel-PC families At the SPS/IPC/Drives in Nuremberg, Kontron introduced two such new Panel-PC families which target this application area and offer a convincing price-performance ratio. The major difference between the two families is their target application area: The Micro Client 3 family has been designed for surveillance and control of individ-

DISPLAY ual production lines and the new OmniClient family for managing production lines and supervising whole manufacturing facilities. Focussing on process industries Application areas for the new Panel-PC families will be in shopfloor systems in process industries such as chemical and pharmaceutical, food and beverage or the power industry, or in complex machines and equipment of numerous other branches or in the factory or facility management. Both familes have highly reliable and near-to maintenance-free operation in common. Only high-quality and longlife components, like gold-caps, are used, so that the need for swapping batteries is eliminated. The LED back light offers a long lifecycle

the mid-performance class. It is equipped with all the standard interfaces and optionally also includes WLAN and RFID support. The new OmniClients are scalable in configuration and feature 15.6 to 22 inch screens while offering a more complex array of interfaces. They also deliver much higher multi-core performance based on the second generation of the Intel Core i5/i7 processors and up to 8 GB RAM can be integrated. A wide scope of connectivity Both lines of Panel PCs have a projected capacitive touch widescreen made of glass and a range of interfaces matched to industrial needs. The Kontron Micro Client 3 features 2x Gigabit Ethernet, 2x USB 3.0 and 2x USB 2.0, 1x RS232, a

The new Panel-PC generations from Kontron impress with their capacitive multi-touch panels in 16:9 format while offering an industrial-purpose range of interfaces. of at least 50,000 hours. The front panels are IP65-protected against dust and damp and even in the resistive-capacitive version can be operated reliably with surgical gloves. Lots of variants The design and configuration of the Panel-PCs can be configured to meet the requirements of the application area. Within the families, the major differences are in terms of performance, the available dipslay sizes and the range of interfaces. The first Panel-PC of the Kontron Micro Client 3 family which is completely fanless is available with a 15.6 inch display with glass and projective-capacitive touch technology. Further models are available with 10 to 17 inch screens with resistive 5-wire touch technology. Based on the Intel® Atom™ Dual-Core processor D2550 with 2x 1.86 GHz and up to 4 GB DDR3 memory, this model covers the requirements of

The projective-capacitive glass touch display of the new Kontron Panel-PC series offers a new level of ease-of-use. How is this possible? A network of x- and y-electrodes which run vertically and horizontally, project electrical fields over and beyond the glass surface, so that fingers can operate the PCs in an extremely easy way by elegantly gliding over the glass surface. There is no longer any need for active pressure as is the case with resistive displays.

graphical output (DVI, DP) for a secondary display and several further options, e.g. CAN, WiFi and RFID. The Kontron OmniClient comes standard with a larger feature set which includes: 3× Gigabit Ethernet, 2× Display Port, DVI-I and 6× USB 2.0. Optionally, the OmniClient can be extended to include: eighteen GPIOs, as well as two serial ports that can be configured as RS232/485/422 or CAN Bus. Further options include WiFi, WiFi with Bluetooth® and RFID. For application-specific expansions the Kontron Micro Client 3 offers a single mini PCIe socket while the Kontron OmniClient features two mini PCIe slots and one PCIe ×16 slot. Data storage media may be connected using a SATA connector suitable for 2.5” media. The Kontron OmniClient also integrates up to two 3.5 SATA hard drives. Both the Kontron Micro Client 3 and OmniClient lines additionally support rugged and small-sized flash memory devices by way of a mSATA connector. Besides being fitted with a projected capacitive touch widescreen made of glass, the Kontron Micro Client 3 is also being produced in a 4:3 format with resistive touch technology for display sizes 10.4” to 17”. Windows XP, Windows 7, and embedded Linux operating systems are all supported. Windows 8 is available on the Kontron OmniClient. n www.kontron.com www.epd-ee.eu | January, 2013 | EP&Dee

DESIGN

USB

USB Audio Simplified by Pedro Pachuca Marketing Manager, MCU Interface Products Silicon Laboratories

The rapid expansion of the universal serial bus (USB) standard in consumer electronics products has extended the use of USB connectivity to propagate and control digital audio. USB provides ample bandwidth to support high-quality audio; its ease of use has been well accepted by consumers and has made USB a popular audio interface. However, extracting the audio data from a USB port is not a simple task. USB itself is a complex protocol that requires considerable domain expertise. In addition, other audio-related challenges, such as synchronization of data streams and programming codec and digital-to-analog converter (DAC) configurations, can challenge even the most experienced embedded and audio designers. USB bridge devices are now available that not only eliminate USB software development complexity but also provide a novel standard audio configuration interface and methods to synchronize audio data streams in a low-cost, highly-integrated single-chip solution. USB is a versatile interface that provides many ways to propagate and control digital audio; however, it is important for the industry to follow a standardized mechanism for transporting audio over USB to secure interoperability, which has been the cornerstone for the adoption of USB. To respond to this fundamental request, the USB organization has developed the Audio Devices Class, which defines a very robust standardized mechanism for transporting audio over USB. The USB audio class specification is available to the public from the USB Implementers Forum (www.usb.org).

Table 1: USB Audio Synchronization Modes One of the major issues with streaming audio over USB is the synchronization of data streams from the host (source) to the device (sink); this has been addressed by developing a robust synchronization scheme on â&#x20AC;&#x153;isochronous transfers,â&#x20AC;? which has been incorporated into the USB specification. The Audio Device Class definition adheres to this synchronization scheme to transport audio data reliably over the bus. However, the implementation of this synchronization mechanism is not a trivial task, and legacy implementations have required high-end embedded systems with complex data rate converters or expensive phase-locked

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loops (PLLs) to support the clock accuracy demanded by the system. In a system with a sampling rate of 48 kHz, the host sends a frame containing 48 analog output samples every millisecond. The sink must buffer the audio output data so it can be sent to the DAC one sample at a time. Any clock mismatch between host and device (however slight) will result in an overrun or underrun condition. The USB specification defines several methods for accommodating host/device clock mismatch. USB defines modes that govern the operation of sources and sinks according to Table 1. (For audio-out, the host is the source and the device is the sink. For audio-in, the device is the source and the host is the sink.) Asynchronous Mode For asynchronous operation, the sink provides explicit feedback to the source. Based on this feedback, the source adjusts the number of samples that it sends to the sink. Figure 1 illustrates asynchronous mode with an analog output device.

Figure 1: Asynchronous Mode

DESIGN This feedback mechanism accommodates source/sink clock mismatch without requiring the sink device to implement PLL hardware to synchronize with the host clock.

Figure 2: Buffered System to Support Asynchronous Mode Figure 2 shows a buffered system for a 48 kHz sampling rate. Initially, the host starts streaming data at 48 samples every USB start-of-frame (SOF) operation, which occurs each millisecond. However, if the device’s buffer begins to approach the full or empty condition due to clock mismatch, the device can request that the host send more (49) or fewer (47) samples so that buffer overrun or underrun does not occur. This method is implemented in Silicon Labs’ CP2114 USB-to-I2S digital audio bridge device. The Audio Device Class is supported by the CP2114 device without any additional software development.

USB A solution to this design challenge is to offer a standard codec/DAC configuration interface that can group the most typical capabilities to configure a codec or DAC. This interface would enable a smooth transition among codecs and DACs, and would enable quick evaluation of multiple codec/DAC options. An example of this interface can be found in the CP2114 audio bridge, which supports a wide range of codecs/DACs using a standard configuration interface. Table 2 lists a portion of the CP2114 standard audio configuration programming interface. The standard programming interface of the CP2114 device enables the most common capabilities found in codecs and DACs, such as DAC register sizes, audio format, volume control and audio clock ratio. In addition, the interface offers open fields for custom programming and an abstraction layer encapsulating the most typical configuration capabilities in an easy-to-understand format. Once the developer is familiar with this interface, switching between codec and DAC devices becomes a simple task. The CP2114 digital audio bridge provides access to this interface via USB to allocate all needed values to configure codecs or DACs. The configuration is applied once and resides in EPROM memory. Dynamic changes are also allowed from the host to dynamically access the codec/DAC and change its configuration values. Table 2

Synchronous Mode For synchronous operation, the source and the sink use implicit feedback, and clocks are locked to the USB SOF. The sink device must synchronize with the USB SOF as shown in Figure 3.

Figure 3: Synchronous Mode A simple yet robust implementation of synchronous mode can be accomplished by a closed-loop control that can correct any mismatches from the USB SOF and the internal oscillator of the sink device. This implementation is shown in Figure 4.

Figure 4: Closed-Loop Control to Support Synchronous Mode Using Internal Oscillator The USB SOF that is sent by the host every millisecond is used to calibrate the internal oscillator. For this method to work properly, the internal oscillator of the sink device must be adjustable through a calibration register that can move the internal oscillator frequency up or down in very small steps. The CP2114 digital audio bridge device is able to implement this functionality due to the dynamic trim capability of its internal oscillator. The CP2114 audio bridge enables the developer to select between synchronous and asynchronous modes depending on the host capabilities available in the system design. All popular platforms (Windows, Linux, Mac OS and iOS for the Apple iPad) now support asynchronous mode. Standard Codec/DAC Configuration Interface Today’s leading codec and DAC suppliers provide unique ways to configure the capabilities of their devices. However, this variability in device configuration increases the complexity of software design for developers needing to support multiple codec/DAC platforms across their product lines.

CP2114 Standard Audio Configuration Programming Interface Conclusion The popularity of USB is extending its use to applications for propagating and controlling audio. However, streaming audio over USB is a complex and time-consuming design task. Major design issues, such as synchronization of audio data streams and codec/DAC configurations, can challenge even the most expert embedded and audio designers. Digital audio bridges, such as the CP2114 device, minimize this complexity by providing a plug-and-play solution that does not require software development. Next-generation digital audio bridge solutions implement novel methods of supporting a wide range of codecs and DACs through a standard configuration interface, support asynchronous and synchronous modes of operation with minimal external components, and eliminate the need for external components, such as crystal oscillawww.silabs.com tors and EEPROM. n www.epd-ee.eu | January, 2013 | EP&Dee

DESIGN

POWER

Control and protection rests on measurement precision by Stéphane Rollier & Bernard Richard LEM

Designers of solar power – photo-voltaic or PV – generating systems face some of the same problems as their counterparts in any other power-related technology; the need to constantly improve performance, reliability, longevity and above all, efficiency. As with any engineering endeavour, improved performance requires with higher-quality and more accurate measurements. Of the installations worldwide that are actively feeding power into national and transnational power grids, around 40% of the total installed capacity is located in Europe: and of that, the largest national installed base is in Germany. In 2011, Germany's cumulative PV generating capacity was just under 25 GW, and in that year its PV power stations generated some 18 TWh (tera-Watt-hours) for the German grid. The rapid ramp-up in PV installations can be judged from the fact that, although connection of solar generating capacity to the grid dates back to the early 1990s, the “first GW” figure in Germany was reached only in 2004, and installed capacity grew by 7.5 GW from 2010 to 2011 alone. Other countries have seen PV installations grow at a similar rate. This almost-exponential growth has been partly driven by generous feed-in tariffs available to those who contracted to provide solar power to the grid, early in the adoption of the technology. In many territories, those initial attractive terms are no longer available, increasing the pressure on system designers to deliver more and more power to the grid from each unit of incident solar radiation and, as systems become more powerful, to do so safely. PV system efficiency comes from a number of sources; semiconductor technologists strive to further increase the conversion efficiency of the basic silicon cells, but much attention focuses on inverter architecture and control. Maximising inverter performance is based on accurate measurements of current and voltage and precision measurements of basic parame-

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ters underpin several functions of the solar inverter. The most obvious is fiscal; metering exactly how much billable energy has been generated and transferred to the grid in a given period. Next, there is the need to maximise power conversion; and finally, there is a need to monitor possible leakage current paths to ensure that the solar arrays and their inverters are safe for those working on and around them. Isolated measurement technology At all points in the power conversion chain, it is advantageous to carry out current measurements with non-intrusive technologies, that is, with sensors that are not directly connected into the circuit being measured. This provides galvanic isolation from the – possibly very high – potentials of the power-generation path; and it also eliminates I2R losses associated with inserting resistive sensing elements into power paths. Key to conversion efficiency is maintaining the maximum peak power transfer point. Power output from the PV array is the product (VxI) of the terminal voltage and the DC current delivered. As with any DC supply that has a source impedance, the voltage drops as the current increases. In solar cells, the relationship is not linear, and also varies with the level of light energy reaching cells. The algorithms that control the inverter must constantly adjust the operating point to maintain operation at MPPT. The DC values that determine MPPT change relatively slowly, and moderate measurement precision is sufficient to determine

the optimum operating point, and therefore these DC current measurements can be made with current transducers that use open- or closed-loop Hall-effect technology. A number of inverter designs are used in PV installations. Commercial and large PV arrays on industrial or agricultural sites usually seriesconnect solar panels to deliver a high DC voltage to a high-power inverter with a single feed to the grid. In smaller, typically domestic or commercial installations, work continues to optimise the micro-inverter concept in which conversion to mains voltage is done at each panel. Today micro-inverters are not costeffective in comparison with traditional technology. Monitoring the aggregate AC fed to the grid in this arrangement presents a separate measurement challenge. Connection of the solar array through an inverter to the grid can be made either by using a transformer or directly without transformer. Transformerless installations have no galvanic isolation, with a consequent risk of leakage to earth: Both configurations may also be used with or without energy storage in a battery. Four main inverter designs are commonly encountered. Two designs use a transformer (at low or high frequency) and two designs are transformer-less; with or without a DC chopper or step-up converter. The low-frequency transformer design switches the DC from the PV array at the 50-Hz mains frequency, and the transformer (depending on the DC potential available) steps it up to the grid voltage. This provides isolation, eliminates the possibi-

DESIGN

POWER

Figure 1a)

lity of DC injection into the grid but implies a large transformer, and is not maximally efficient. It requires measurements at the output of the solar panel and at the AC output to the grid. An alternative is to switch the DC at a higher frequency (tens of kHz) into a step-up transformer, rectify that to an intermediate DC at grid potential, and then use a further switch to generate AC synchronised to the grid. This is more complex, and depending on the accuracy of the output switch, may inject DC into the grid. Transformerless architectures switch a DC potential, either direct from the PV array, or via a step-up “chopper” stage into synchronised AC that is fed directly (via a filter) to the grid. As there is no galvanic isolation between PV panel and grid, fault and leakage paths can potentially expose personnel working on and around the panels to dangerous or lethal voltages. All of these inverter configurations require current and voltage measurements both at the output of the PV array, and at the AC output of the inverter, both for control of the inverter and to detect fault conditions. Again, open- and closed-loop Hall-effect transducers can provide the necessary accuracy, with fast-response modes providing shortcircuit protection.

Figure 1b)

HO user-programmable current transducers Figure 1c)

Figure 1d) Figures 1a) b) c) d): Four main inverter designs commonly encountered with their current measurements (with transfomer and transformerless)

Addressing exactly this class of application, LEM recently introduced the HO series of open-loop Hall-effect-based transducers that measure up to 25A DC, AC or pulsed currents, with accuracy as good as 1% at +25°C. The HO series provides designers with great flexibility as the devices are highly programmable and configurable so that one part can perform multiple roles. A separate over-current-detection function also adds an extra level of safety and circuit protection. DC-to-grid, and leakage detection In transformerless designs and in high-frequency transformer configurations, the DC current injected into the grid must be limited to a maximum value of between 10 mA and 1 A, according to different standards that apply in different countries (relevant standards www.epd-ee.eu | January, 2013 | EP&Dee

DESIGN include IEC 61727, IEEE 1547, UL 1741, and VDE 0126-1, IEC 62109-2). This necessitates use of transducers with very high accuracy and very low offset and gain drifts; an ideal technology is the closed loop Fluxgate transducer.

POWER Similar demands apply to earth fault current detection, arising from an insulation defect. The transducer used to measure the earth fault current must be able to measure AC and DC signals as the earth fault current could be AC or DC, depending where the fault (for example, a short circuit) occurs; and depending on whether the PV panel is grounded or not. To achieve the targets in terms of accuracy with small currents, LEM applied its Closed Loop Fluxgate technology and created the LEM “CTSR” current transducer range (picture below).

to safe galvanic isolation, and high reliability. Their closed-loop operating principle, together with sophisticated internal signal processing, yields a transducer that achieves accurate measurement of very small residual DC or AC currents with very low offset and gain drifts over a wide operating temperature range from –40°C to +105°C. The residual-current capability measures the sum of all of the instantaneous currents flowing through the transducer aperture, in single- or three-phase configurations, with a very high overload potential up to 3300 A for a pulse duration of

CAS/CASR/CKSR current transducer series using Closed Loop Fluxgate technology Transformerless inverters without galvanic isolation have a potential for leakage currents to occur and it is a requirement to monitor leakage current. Any AC, 50/60 Hz, leakage currents will be small, and must be lower than 300 mA , depending on the capacitance due to the solar panel-roof configuration and is measured as the residual component remaining from a differential measurement of currents in several conductors. A person contacting a panel in a fault condition will generate a sudden current leakage variation, and this condition must be recognised. In current transducer terms, this requires accuracy and, especially, low offset and gain drifts, to ensure resolution of these small measured currents; physically, it means the ability to accommodate several conductors, to cater for single or three phase system within the transducer aperture.

CTSR current transducer series using Closed Loop Fluxgate technology (available with test winding integrated) Closed Loop current transducers measure current over wide frequency ranges, including DC. They provide contact-free coupling to the current that needs to be measured, in addition

100μsec, and with a rise time of 500 A/μsec: conductors may be carrying primary currents of up to 30A/wire, AC or DC. n www.lem.com

Low-cost 50 A current transducers improve on shunt measurement techniques At the SPS/IPC/Drives Exhibition (Nuremberg, Germany) LEM introduced its new HLSR series of current transducers, that provide a costeffective and technically superior alternative to resistive shunt/optocoupler configurations for insulated current measurements up to 50 Amps. The five new HLSR transducers will satisfy application requirements in, for example, industrial inverters and motor drives; switchmode and uninterruptible power supplies; specialist power supplies such as welding units; air conditioning; home appliances; but also in renewable-energy systems, for example, in solar combiner boxes and in solar inverters to track the maximum-power-point (MPPT). LEM's HLSR series uses open-loop Hall-effect current sensing technology, to measure AC, DC or pulsed currents with nominal values of 10, 20, 32, 40 or 50 ARMS. LEM's proven

EP&Dee | January, 2013 | www.epd-ee.eu

expertise in open-loop Hall-effect technology allows these new devices to achieve a response time of only 2.5μsec, with very low gain and offset drift over their operating temperature range of -40 to +105°C. HLSR transducers deliver their output as an analogue voltage proportional to the primary

measured current. In most applications, this voltage will be converted to a digital value by an analogue-to-digital converter: LEM has equipped the HLSR with an internal voltage reference of 1.65 or 2.5V made available on a dedicated pin for use by an external device such as A/D converter, for example, or designers can choose to use an external reference from 0.5 to 2.65V. The voltage reference is just one feature of the new ASIC (ApplicationSpecific Integrated Circuit) that LEM's designers created for this development, which enables the HLSR series to deliver typical accuracy of ±1% at +25°C, and ±3.4% at +105°C, with a bandwidth of 100kHz (-3dB). LEM offers versions that operate from either + 3.3 or + 5V single supplies. LEM www.lem.com

DESIGN

PASSIVE COMPONENTS

Use of passive components in compliance with specifications by Geier J端rgen Rutronik

The automotive market's requirements regarding the construction of parts are increasing constantly, and the differentiation between specific series and types is also growing. Thus, the appropriate component now needs to be selected not just for the application in question, but for a specific function. This now applies to passive components. Passive components with appropriate specifications and qualifications are therefore in increasing demand. This applies in particular to safety-relevant applications such as airbags or ABS and to power management, especially with respect to the direct connection with the car battery (terminal 30). The primary demands relate to a very high resistance to temperature and vibration and to protection against short circuiting. Other demands are laid out by automotive regulations and documentation, for example the 8D Report, IMDS (International Material Data System), PPAP (Part Production Approval Process), Batch Tracing etc. There is practically no way around AEC-Q200 qualified components (Automotive Electronics Council, Q200: Stress Test Qualification for Passive Components). That are tested and audited to a much greater extent than commercial components, primarily with respect to stability

EP&Dee | January, 2013 | www.epd-ee.eu

under high temperatures and temperature changes, resistance to humidity, mechanical stress (shock, vibration, board flex) as well as brazeability and solderability under more challenging conditions (e.g. "steam aging"). Capacitors In the field of capacitors, the most frequent used in the automotive segment is the MLCC (multi-layer ceramic capacitor). They are extremely reliable, because their service life is practically unending. However, they do have a

reductions to resistance values to short circuit with all the resultant risks, fires for example. This is why MLCCs are provided with features such as open mode, float mode (internal serial switching) and soft termination (also Flexiterm, polymer termination, soft electrode) for critical functions such as terminal 30. For the growing number of sensors, radially and axially connected MLCCs with AEC-Q200 certification are available, providing optimum interference prevention by connecting them directly to the sensor, usually via lead frames.

Structure of various MLCC types. high mechanical sensitivity to bending forces. This can cause cracks, which usually ends in

There are also other capacitor technologies that continue to serve their purpose, because

DESIGN

PASSIVE COMPONENTS While there will be no AEC-Q200 certified models in this area, even in the long term â&#x20AC;&#x201C; they are unable to adhere to the specified temperature criteria â&#x20AC;&#x201C; distributors and automotive OEMs/suppliers are working particularly closely with the manufacturers to define components and systems that meet the actual criteria required for the given application or function.

A comparison of the benefits of different capacitor technologies. each technology has its specific advantages. While film capacitors are limited in their temperature range, their mechanical and electrical stability is excellent. The first AEC-Q200 certified series are available on the market. The DC-Link field will specifically play a larger role in hybrid and electric cars in the future. Tantalum capacitors also stand out with their high stability and very good volume efficiency. Due to their sensitivity to inrush pulses, however, they must not be used as input filter capacitors. Aluminium electrolytic capacitors (Elcas) provide particularly attractive value for money with respect to their capacity. To ensure the required life, their usage conditions must be determined and observed precisely. 'Mission profiles' are used here to effectively address the required voltage peaks, temperatures and ripple currents as well as occurring vibrations using the appropriate types, for example using special anti-vibration electrolytic capacitors.

EDLCs (electric double-layer capacitors), also known as UltraCaps or SuperCaps, are gaining importance specifically in hybrid and electric motors thanks to their broad grid support and recuperation.

SuperCap cells used successfully in automotive applications.

Anti-vibration electrolytic capacitor. Anti-vibration sockets for through-hole electrolytic capacitors.

Resistors Even electronic components that are as simple as resistors must satisfy increasing demands. In the automotive sector, these are in particular long-term stability, pulse resistance, and also resistance to harmful gases. Typical for standard resistors is the thick-film technology with a rated tolerance of 1% and a temperature coefficient of 100ppm/K in the sizes 01005 to 2512. A design specifically for automotive applications is the sulphur-resistant thick-film resistors with a low proportion of palladium in the electrodes. An even protective layer of epoxy coating provides mechanical protection against penetration of harmful gases and allows use in rough environments.

Thin-film resistors are typically used in applications that require a high level of long-term stability, high precision or even low current noise. In comparison to thick-film resistors, these allow for lower rated tolerances, have a lower temperature coefficient, have a lower parasitic inductance and capacity, and provide greater stability at high frequencies. This enables the resistance to remain practically constant in spite of influences such as temperature, time and pulses. Current-sensing resistors, also known as shunt resistors, are suitable for all types of measurement applications. The voltage drop on these low-ohm resistors is measured in accordance with Ohm's law and analysed. They can be operated at up to 275Â°C and 5W. Resistance values in the milliohm range and temperature coefficients of 50ppm/K are offered. Examples of typical applications in the automotive sector are airbag control, battery management, ABS, locking systems, motor management and air conditioning. An SMD resistor network (array) integrates two, four or eight resistors in a single housing. The solder pad connections are available in both concave and convex forms. There are also different models among the various resistors that vary in terms of tolerance, or tracking. www.epd-ee.eu | January, 2013 | EP&Dee

DESIGN

PASSIVE COMPONENTS

Arrays have the advantage in comparison to individual resistors of incurring lower order, storage and fitting costs. Inductors When it comes to voltage supplies in vehicles, the main drive is towards miniaturisation, even as circuit frequencies increase. This means that power inductors, which are used for EMI filtering on high-power lines and the storage of energy for the DC/DC converters, must become smaller and flatter, and also be capable of withstanding ever higher temperatures.

SAW components. Compared to crystal oscillators, they have smaller dimensions, are more resilient to mechanical stress, and are usually better in terms of pricing. Resonators are not excluded from the stricter certification processes. They must undergo regular audits, satisfy strict final testing requirements, be subjected to careful quality testing and pass strict environmental tests. They also have an extended working temperature range of -40 to +125°C (150°C). For the temperature test, they are passed through 500

High-current inductor and its internal structure. High-power inductors that are fully magnetically shielded have a jacket-insulated copper wire that can withstand operating temperatures of up to 200°C. It is ultrasonically welded onto a lead frame that is moulded into a mixture of ferromagnetic iron powder and epoxy adhesive (composite technology). These constructions are also available in AEC-Q200 certified form. With their very low DC resistance and resultant high current ratings, they are the first choice for DC/DC converters and EMI filters, and satisfy demands for cleanly regulated and filtered high currents. There is an increasing number of AEC-Q200 certified standard inductors and ferrite beads available for signal lines and low-current lines, both in multilayer and wire-wound forms. There are also new common-mode chokes optimised for CAN and FlexRay networks with a temperature range of 150°C. This is provided by an optimised structure, a resistant, conductive adhesive and a pressure absorbent internal structure. Ceramic resonators Ceramic resonators are used in a similar fashion to crystal oscillators, but do not have their frequency precision or stability. Typically, they exhibit 0.5% frequency tolerance at room temperature, 0.3% deviation above the temperature range -20/+80°C and 0.5% ageing after 10 years. Nonetheless, they are still used in many automotive applications alongside crystals and

EP&Dee | January, 2013 | www.epd-ee.eu

to 1,000 cycles instead of 10. In the frequency range of 4MHz to 7.99MHz, for example, there are automotive series with improved temperature characteristics, with which customer-specific resonators with a maximum total tolerance of 0.27% could be produced within a temperature range of -40/+125°C for an HS-CAN application. Many manufacturers offer an evaluation service for this purpose, to adapt the resonator to the circuit. At the end, the customer receives a recommendation for a resonator with a specific part number.

Crystals There is a wide variety of crystals in each vehicle, because these provide the required precision within the ppm range and temperature stability within the range of 150°C/160°C. Their aging process is also within the singledigit ppm range, such that they exhibit an overall tolerance of less than 200ppm as required for the specification-compliant operation of the bus systems. When making a selection, there is the need to decide whether the crystals will be used in multimedia applications or in safety applications such as brakes, airbags or TPMS. A board evaluation is generally performed in

Ceramic resonators are used in many applications in addition to crystals and SAW components.

DESIGN

PASSIVE COMPONENTS

the early development state to check the configuration of the oscillator switching and ensure that it is working correctly. In order to ensure the quality of the automotive crystals, the manufacturers must adhere to standards such as AEC-Q200, TS16949, QS900, and PPAP documentation is required for approval. Components produced under cleanroom conditions stand out with their resistance to heat shocks in up to 3,000 temperature cycles, acceleration values that are appropriate for the application at hand, and extensive tests, certified at least in accordance with AEC-Q200 and special quality checks. Many manufacturers meet these requirements by far. The range of products on the market encompasses crystals, oscillators and realtime clock modules. The frequency range of the crystals ranges from 32.768kHz and 4–40MHz; oscillators are available with 2–60MHz, in the temperature range -40 + 125°C with 100ppm and from 1.8V to 3.3V. The traditional real-time clock module has a 32.768kHz and a 1Hz output with a temperature range of -40°C to +85°C or +125C° and I²C, SPI and parallel bus interfaces. In addition to the common automotive types made of HC49 metal in SMD form through to ceramic derivatives with a size of 2.5x2.0mm, customer-specific types are also available.

Quality has its price Nowadays developers have a wide selection of passive components that meet the extensive, strict requirements of automotive applications. The flip-side of the coin is that these components are not available for the price of standard components. In product development and introduction, the required production facilities and raw materials need to produce products that are as flawless as possible are considerably more cost-intensive. Added to this are the higher process costs caused by the disproportionately longer times needed for more in-depth tests, approval procedures and documentation. If we compare this to the costs of non-acceptance, however, especially with faulty components, or consider the risk of recall actions, then there is no alternative to components that are certified for automotive use as per AECQ200, including passive components. In addition to specialising and selecting the best possible components, second sourcing is also growing in importance. After all, automotive manufacturers, OEMs and suppliers also need to be on the safe side at all times in the production process. This security is provided by a partner who is capable of offering at least two comparable alternatives for each component. n www.rutronik.com

PRODUCT NEWS

EMBEDDED SYSTEMS

Rutronik includes new automotive power inductor from KOA in its programm

Rutronik at embedded world: Hall 1, stand 1-318 Meet tomorrow now!: Innovative products for future technologies

KOA has launched the new wire-wound, unshielded power inductor of the

Rutronik is exhibiting at embedded world (stand 1-318) under the motto ‘Meet tomorrow now!’. The focus is on the technological and logistical developments of tomorrow. Visitors to the trade fair can call up applications on touch-screens and view suitable components with their

moned anywhere at the push of a button without the need for a mobile phone. Diagnostics products from HMM, such as blood pressure monitors, body-fat scales and pedometers transmit readings wirelessly, providing a comprehensive Telehealth Monitoring System. Product and

technical data. Using customer projects, Rutronik will demonstrate innovations and product trends for a wide variety of market segments, including the world’s first emergency watch from Limmex, which thanks to its integrated Telit GE865-QUAD wireless module enables assistance to be sum-

application engineers from the six vertical market teams – Lighting, Medical, Energy, Industrial, Automotive und Home Appliance – and all product areas will be present to provide visitors with expert advice. RUTRONIK www.rutronik.com

LPC4545 series. The smallsized 4mm inductor (4.1x4.6mm) allows a higher rated DC current and has a lower DC resistance than 6mm inductors. The product is available at distributor Rutronik as of now. The LPC4545 series is optimized for excellent solderability, robustness and reflow soldering. An automated visual solder inspection of the

side electrodes is possible. The available inductance values from 1μH up to 2200μH with tolerances down to ±10% cover a wide inductance range. Due to the operating temperature ranging from 40°C up to +125°C, the inductor fits in a broad range of applications, for example LED lighting, power supply circuits, car audio, navigation and antenna circuits, DC/DC converters, body control, motor control for power windows, sunroofs, doors etc. The power inductors are tested according to AEC-Q200 requirements, PPAP documentation is available. RUTRONIK www.rutronik.com

www.epd-ee.eu | January, 2013 | EP&Dee

PRODUCT NEWS

EMBEDDED SYSTEMS

element14 drives the Raspberry Pi revolution forward with new double memory 512MB board

Microchip boosts 32-bit MCU performance by 25% on low-cost, small package PIC32 MX1/MX2 series

element14, the first collaborative community and electronics store for design engineers and electronics enthusiasts and a part of global electronics distributor Premier Farnell, announced its continued partnership with Raspberry Pi with the launch of a new 512MB board version of the revolutionary, creditcard sized computer. Now with double the RAM, the new higher performance Raspberry Pi 512MB board is suited to multimedia, highmemory and mobile applications. The additional memory is also an enabler to allow the Raspberry Pi to run a future version of an Android 4.0 operating system. The 512MB Raspberry Pi board is being manufactured for element14 in the UK by Sony UKTec, as part of the multi-million pound manufacturing deal, which was announced last month. element14 has global stock of the Raspberry PI 512MB board available now on a first come first served basis through its brands Farnell element14 in

Microchip announces a 25% performance boost on its 32-bit PIC32MX1/MX2 microcontrollers (MCUs). By increasing their speed to 50 MHz or 83 DMIPS, Microchip is taking the PIC32 MX1/MX2 MCUs’ performance to a new level, supported by featurepacked peripherals and 4-channel DMA. The PIC32MX1/MX2 series includes Microchip’s smallest 32-bit MCU, with sizes down to 5 mm x 5 mm and a 0.5 mm pitch, as well as the lowest-cost PIC32 MCUs. These devices include up to 128K Flash and 32K RAM, and integrate peripherals for touch-sensing, audioprocessing and advanced control applications. The integrated peripherals include a hardware module for adding mTouch™ capacitive-touch buttons or advanced sensors; an 8-bit Parallel Master Port (PMP) interface for graphics or external memory; a 10-bit 1 Msps 13channel Analogue-to-Digital Converter (ADC) and serial communications peripherals. The MX2 series also adds USB

Europe, Newark element14 in North America and element14 in Asia Pacific, as well as through subsidiaries CPC in the UK and MCM Electronics in the US.

Costing $35, the same as the previous board, the Raspberry Pi 512MB will initially be sold in one uncased configuration – which has two USB ports, 512MB of RAM, HDMI port, SD memory card slot and an Ethernet port. With 512MB of RAM, the faster, more rapidly accessible memory can be used to create a more effective multimedia performance. It also means that both CPU and GPU both now have sufficient RAM to function optimally. element14 www.element14.com

World’s First 19nm NAND Solid State Drive at Rutronik The world’s first family of solid state drives (SSDs) with a 19nm NAND Flash process from Toshiba Electronics Europe (TEE) offers an unrivalled combination of capacity, performance and power efficiency. The THNSNF range is available in different capacities and sizes at distributor Rutronik. The new THNSNF series from Toshiba is the world’s smallest and highest density NAND flash solid state drive, utilising its advanced Multi-Level Cell (MLC) 19nm NAND technology. It will help OEMs balance the increasing demand for high storage capacity with the

demand for more streamlined devices. The THNSNF family is twice as fast as the previous generation, offering read transfer rate of 524MB/s and write transfer rate of up to 461MB/s. It features Toshiba’s QSBCTM (Quadruple SwingBy Code), a strong and highly efficient Error Correction Code (ECC) protecting against any read errors in the device. The ‘data corrupt protection’ feature protects any data which is being moved internally, against unexpected powerloss and write errors. RUTRONIK www.rutronik.com

EP&Dee | January, 2013 | www.epd-ee.eu

On-the-Go (OTG) capabilities. The PIC32MX1 and MX2 MCUs are designed for low-cost applications in the consumer and automotive markets, such as consumer music-player docks, noisecancelling headsets, clock radios, and entertainment system sound

bars, as well as touch screens with buttons and sliders, graphic displays and USB device/host applications. In the medical and industrial markets, applications include industrial-grade noisecancelling headsets in addition to medical and industrial displays with touch-sensing capabilities. The PIC32MX1and PIC32MX2 MCUs are available now in 28pin SOIC, SPDIP and SSOP packages, in addition to a 36-pin VTLA package and 44-pin QFN, TQFP and VTLA packages. MICROCHIP TECHNOLOGY www.microchip.com/get/049F

Laird Technologies Releases Android Support for 40 Serie Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, has released Android 2.3 Gingerbread support for its Summit 40 Series radio modules, which support dual-band 802.11n (802.11a/b/g/n) and Bluetooth 2.1. “Business-critical mobile devices such as handheld mobile computers are beginning to run Android instead of Windows Embedded Handheld or Windows Embedded Compact,” said Laird Technologies Product Director Chris Bolinger. “40

Series radio modules now offer the same proven enterprisegrade features on both Windows and Android.” Those enterprise-grade features include secure, reliable connectivity in both the 2.4 GHz and 5 GHz frequency bands, fast roaming from one access point to another, certified support for Version 4 of Cisco Compatible Extensions (CCX), and easy configuration and management using the Summit Client Utility (SCU), trusted on more than one million mobile devices worldwide. With 40 Series radio modules, SCU also supports configuration and management of Bluetooth profiles,

PRODUCT NEWS

EMBEDDED SYSTEMS

Microchip launches world’s first Wireless Audio Platform for iOS, Android™, Windows® 8 and Mac®—the New JukeBlox® 3.2 SDK Microchip announces the first and only Wi-Fi® audio connectivity platform - featuring the new JukeBlox® 3.2 platform and software development kit - to support all major mobile and PC operating systems together with the DLNA® standard. This includes seamless support for iOS/AirPlay®, Android™, Windows® 8 (mobile and PC), and Mac® in one solution. JukeBlox 3.2 operates on all of Microchip’s existing JukeBlox network media processors and modules, and further adds JB Cloud, which enables a compelling new consumer experience by directly streaming cloud-based music services while using mobile devices as remote controls. This eliminates the need for mobile devices to act as servers, where they consume power and must stop the music to take phone calls or support other personal audio functions, freeing them up to be what they were intended to be: personal communication and Internet devices. In addition, the SDK has expanded whole-home audio functionality via JB MultiZone 2.0, enabling more robust and extensive simultaneous synchronised audio streaming and control to multiple JB-enabled devices in the home. Because Microchip’s JukeBlox Platform is the first wireless audio connectivity platform to provide compatibility with all of the major operating systems and audiointeroperability standards in a compre-

hensive SDK, it is the best and only complete solution for developers. This platform includes SoCs and modules for WiFi networking and media processing; an

application software layer for mobile devices and control interfaces; peripheral interfaces and control; and GUI options. It is also cost-effective enough to enable consumer products which retail for as little as $129. The new JB Cloud software offers product developers and Internet music service providers a compelling new use case and architecture for enabling direct cloud music service streaming with mobile device control, all managed from the native music service app. The JukeBlox Platform’s expanded MultiZone 2.0 capability supports all the core technologies needed for compelling wholehome audio applications, including the discovery, pairing, group management, control, streaming and synchronisation of any audio input source to multiple JBenabled devices throughout the home. MICROCHIP TECHNOLOGY www.microchip.com/get/KLB2

es Radio Modules giving administrators a single interface for both Wi-Fi and Bluetooth. 40 Series radio module software is avail-

able for Android 2.3 Gingerbread, Linux kernel version 2.6.37, Windows Embedded Handheld 6 and 7, and Windows Embedded Compact 6 and 7. The software and a full array of technical support services are included with every 40 Series module at no additional charge. Embedded wireless solutions from Laird Technologies include Summit Wi-Fi radio modules, a full line of Bluetooth® radio modules, and innovative RangeAmplified MultiPoint (RAMP) radio modules. These unique product solutions are ideal for applications in the automotive, industrial, medical, IT/computing, and M2M communications industries. LAIRD TECHNOLOGIES www.lairdtech.com

IAR Systems extends development tools offering with a special edition for the smallest ARM cores The new edition of IAR Embedded Workbench is specifically designed for developers working with ARM Cortex-M0 and ARM Cortex-M0+. IAR Systems® announced the availability of a new edition of the development tool suite IAR Embedded Workbench®, tailored for the small ARM® Cortex™-M0 and ARM Cortex-M0+ cores. The ARM Cortex-M0 edition of IAR Embedded Workbench targets developers working with MCUs based on these very small and energy-efficient cores, and is offered at a considerably reduced price from that of the full version which supports all ARM cores. Based on the full edition of the recently announced version 6.50 of IAR Embedded Workbench for ARM, support for this special edition is limited to the development of MCUs based on ARM CortexM0, Cortex-M0+ and Cortex-M1 cores. During the last year, IAR Systems has added a comprehensive list of new features to its worldleading development tool suite, including a new source browser, an enhanced text editor, and stack usage analysis functionality. In addition, enhancements to the optimization technology in the powerful IAR C/C++ Compiler™ result in outstanding code execution speed. The ARM Cortex-M family is optimized for cost and power sensitive applications such as smart metering, human interface devices, automotive and industrial control systems, white goods, consumer products and medical instrumentation. The ARM Cortex-M0 and Cortex-M0+ processor families are developed to be physically small with low power consumption and minimal code size, with the ambition to supply developers with 32-bit performance at an 8-bit price point. Customers who opt for the ARM Cortex-M0 edition of IAR Embedded Workbench will have an easy migration upgrade path to a full edition with complete support for all ARM Cortex-M/R/A cores.

IAR Systems www.iar.com www.epd-ee.eu | January, 2013 | EP&Dee

PRODUCT NEWS

EMBEDDED SYSTEMS

Vodafone approves global operation of Kontron M2M Smart Services Developer Kit on its cellular networks

Kontron M2M Smart Services Developer Kit supports Cumulocity M2M Application Platform

Kontron announces that the M2M Smart Services Developer Kit has passed the extensive 2G/3G tests carried out by the Vodafone Test & Innovation Center and is approved to operate globally on Vodafone cellular networks with immediate effect. OEMs can use this application-ready Machine-toMachine platform to connect their distributed systems via GSM-based 2G/3G networks to the Internet-of-Things (IoT) and to embedded cloud applications. Thanks to these verified cellular communication characteristics, OEMs benefit from the wide-spread reach of Vodafone network for the M2M connection of their applications as well as from the powerful processing capability of the M2M smart edge platform. The Kontron M2M Smart Services Developer Kit offers scalable processor performance via Computer-on-Modules and

Kontron announces that the Kontron M2M Smart Services Developer Kit now fully supports the Cumulocity M2M Application Platform. The cloud-based horizontal machine-to-machine (M2M) application platform delivers an integrated serverside database platform, network agents and sensor libraries to significantly reduce the efforts needed to bring the M2M connected sensors and devices into the cloud. Application engineers can consequently concentrate on the development of M2M services for their distributed devices. The server-side database platform is designed to collect and analyze data from thousands of Kontron M2M Smart Services Developer Kit connected sensors and devices. It controls these devices in a reliable, secure and scalable manner so that the entire service kit is perfectly tailored for a host of vertical M2M industries such as

an optional extension for demanding audio-video smart services over M2M. The kit's 802.11a/b/g/n WLAN (Wireless Local Area Network) and 802.15.4 WPAN (Wireless

Personal Area Network) support rapid development of applications with local wireless connectivity. Cellular network connection to the cloud applications is offered with pre-installed 3G WWAN (Wireless Wide Area Network), which can be extended for higher bandwidth applications via a 4G module. KONTRON www.kontron.com

fleet management, smart energy grids, digital signage and many other appliances that are connected to the Internet-of-Things. With the addition, the Kontron Smart Services Developer Kit sig-

nificantly reduces the complexity involved in communicating with diverse device types, each having its own data model, protocol and transport mechanisms. It also provides developers with ready-to-use components for rapid development of their individual applications. These are, for instance, tools for supervision and control of meters and sensors via the cloud. KONTRON www.kontron.com

Flex-ATX motherboard with AMD R-Series APU for graphics-intensive and highly parallel applications

PLX and Kontron announce PCI Express Fabric breakthrough

Kontron launched the featurepacked, yet highly cost-efficient, embedded Flex-ATX motherboard KTA75/Flex based on the new AMD Embedded R-Series Accelerated Processing Unit (APU) and the AMD A75 controller hub. It is designed for graphics intensive and highly parallel embedded computing applications and provides outstanding, long-term stability and reliability due to its sophisticated board layout with long-term stable solid capacitors and a high-quality selection of components. With its integrated discrete-class AMD Radeon HD 7000 Series Graphics it delivers leading edge 3D/HD graphics and accelerated processing capabilities together with the ability to drive up to four displays simultaneously, either as independent displays, or as a single large surface. This makes the long-term available Kontron

PLX Technology, Inc. and Kontron, announced an industry breakthrough in the deployment of PCI Express (PCIe) technology as a backplane interconnect. Built around PLX ExpressLane PCIe 3.0 (Gen3) switches, Kontron's VX3042 and VX3044 Intel Core i7-based single-board computers (SBCs) routinely achieve 5.6 gigabytes per second (GB/s) in data throughput between any boards in a VPX rack. The Kontron VX3042 and VX3044 Intel Core i7based SBCs leverage PLX's PCIe Gen3 switching technology along with Kontron's exclusive VXFabric software. In addition to having two 10 Gigabit Ethernet channels already featured on the boards, VXFabric implements TCP/IP over PCI Express as a second data plane for higher-performance embedded computing. This combination of features enables efficient system convergence, as

KTA75M/Flex an ideal solution for applications requiring high graphics and/or parallel computing performance in markets such as industrial automation, medical, and POS/POI, digital signage as well as gaming. Developers can

furthermore utilize the up to 563 GFLOPs provided by the integrated GPU to accelerate both graphics- and compute-intensive applications while using industrystandard libraries such as OpenCL, DirectX 11 and DirectCompute, which help to minimize development times and simplify design-in processes. KONTRON www.kontron.com

EP&Dee | January, 2013 | www.epd-ee.eu

all devices and subsystems offer native PCIe, which permits immediate use of an existing infrastructure, thereby lowering latency, cost and power. Kontron VXFabric provides the software between the PLX ExpressLane

switch and the bottom of a standard TCP/IP stack, which allows the boards to use their existing TCP/IP-based application without having to be modified. PLX switches offer the ability to combine different data types in a single converged pathway. PLX TECHNOLOGY www.plxtech.com KONTRON www.kontron.com

PRODUCT NEWS

EMBEDDED SYSTEMS

24 low-power MCUs in 64-pin and 80-pin packages for the drive of up to 376 LCD segments

PLS’ latest Universal Debug Engine 4.0 sets new standards in the development of multicore targets

MSC now offers the new RL78/L13 Group of low-power microcontrollers (MCUs) from Renesas Electronics. These new MCUs are ideal for use in metering applications, medical devices and household appliances. The new RL78/L13 MCUs consist of 24 different types in 64-pin and 80-pin packages. With up to 128 KB of flash memory, these MCUs can drive up to 376 LCD segments and therefore belong to the most powerful MCUs in their class. Additional features of the RL78/L13 Group of MCUs include comparators that enable reliable zero cross detection and timers that support variable pulse width modulation (PWM) control in real-time. The timers include a forcible output stop function and can contribute to improved safety in applications such as motor controls. Compared to the real-time clock (RTC) provided in the RL78/L12 Group MCUs, the RTC in the RL78/L13 MCUs increases the correction resolution and thus increases the clock precision. The date and time values of the RTC

PLS Programmierbare Logik & Systeme presents its new Universal Debug Engine (UDE) 4.0 at its Booth 4-310 in Hall 4 at embedded world 2013, February 26 28, 2013 in Nuremberg, Germany. The new UDE 4.0 features greatly enhanced debug capabilities for multicore targets, optimized visualization options during system test and dedicated support for a wide range of the latest 32-bit multicore SystemOn-Chips (SOCs) from various manufacturers. With help of the newly developed target manager for the UDE 4.0, among other things, cores and functional units can now be specifically selected for debugging. In order to also be able to retain an overview with several cores, debugger window tabs and toolbars are corespecifically colored. The concept is enhanced by visibility groups for windows of individual cores or freely according to user requirements definable collections of debugger views. Furthermore, new names (alias) can be assigned freely for the window titles. Various compiler

are retained without being cleared by reset factors external to the MCU, so that the clock must not be corrected manually. These advanced functions make the new MCUs ideal for use in electricity, gas and water meters, and other systems that require a permanently running high-precision RTC. In addition, these new RL78/L13 MCUs include all innovative features of the RL78 Family

and support the IEC 60730 standard, which is a required home appliance safety standard in Europe. For this purpose, Renesas provides a software library certified by VDE. Samples of the RL78/L13 Group of MCUs are available now. Mass production of the RL78/L13 devices is scheduled to begin in February 2013. MSC www.msc-ge.com

concepts for multicore targets are supported by a newly implemented multicore / multiprogram loader. Among other things, this loader enables the separate loading of memory images and symbolic information from the output files of the compiler, specifically

for each individual core. For the control of a multicore target, the UDE 4.0 enables the synchronization of two or more cores to so called run control groups in order to define common start and stop or common individual step. The user interface is the same for different onchip synchronization mechanisms. The generalized concept ensures the greatest possible flexibility when controlling a multicore target, without the need to know the underlying on-chip logic in detail. PLS www.pls mc.com

GreenPeak Announces the GP690 ZigBee PRO solution and the Open Smart Home Framework The GreenPeak OPEN SMART HOME FRAMEWORK is the integrated networking architecture for ZigBee ased Smart Home applications GreenPeak Technologies, a leading low power RF-communication semiconductor company, today announces the GP690, adding ZigBee PRO to its product portfolio and offering full support for its Open Smart Home Framework, integrating all three ZigBee networking variants Green Power, RF4CE and PRO into a single overall architecture defining the “second wireless network for the home”. This second network is complementary to Wi-Fi, the first wireless network in the home for content distribution (internet, movies, TV, etc.). ZigBee implements wireless networking for sense and control devices (such as remote controls, lights and light switches, thermostats, security devices, wellness and fitness devices, and many more).

EP&Dee | January, 2013 | www.epd-ee.eu

The GP690 ZigBee PRO solution is part of the Open Smart Home Framework that combines the three flavors of ZigBee networking into a single architecture. This framework seamlessly connects the ZigBee network to the internet by allowing a single ZigBee radio device in the set-top box/gateway to master a complete sense and control home network at very low cost of implementation. The Open Smart Home Framework features: 1. ZigBee PRO, for highly reliable sense and control networking, supporting applications such as Home Automation and Light Link; 2. RF4CE, for very low cost, low power (long battery life) and low latency (immediate response) devices, such as remote controls and other human interface devices;

3. Green Power, for maintenance-free devices (battery-less, or with battery life exceeding product life time). Many large operators are rolling out millions of set-top boxes/gateways that include ZigBee for enabling the management of smart home services. By including the set-top box/gateway in the Open Smart Home Framework the home network seamlessly connects the ZigBee network both to the indoor Wi-Fi network as well as to the broader internet, enabling transparent and secure access to the home control network from any place in the world. ZIGBEE www.zigbee.org GREENPEAK TECHNOLOGIES www.greenpeak.com

PRODUCT NEWS

EMBEDDED SYSTEMS

Laird Technologies Releases New AA-250 Outdoor Cooler Series Laird Technologies, Inc. announced the release of its new AA-250 Outdoor Cooler Series. The AA-250 Outdoor Cooler Series are ruggedized Air-to-Air thermoelectric assemblies that use impingement flow and custom designed thermoelectric modules to transfer heat. Designed for outdoor enclosures, this product line cools battery backup systems that are susceptible to degradation when exposed to elevated temperatures or heats when exposed to very cold temperatures. The standard product offering is open loop and comes in 24 or 48 volt configurations: • AA-250-24-44-00-XX • AA-250-48-44-00-XX The Outdoor Cooler Series product line requires no maintenance, resulting in a low total cost of ownership. In addition the AA-

250 Series is mountable in the vertical or horizontal orientation with optional control of airflow direction on the cold side. This series is RoHS compliant and environmentally friendly as it contains no compressor or CFC refrigerants. This new product line is ideal for the battery backup systems used in wireless base stations and outdoor kiosks used in industrial applications. LAIRD TECHNOLOGIES www.lairdtech.com

Isolated 60 W DC/DC converter series PEAK electronics offers the isolated PO60HB series of 60 W DC/DC converters. The converters in a compact half-brick format (2.40 x 2.28 x 0.5 inch) are delivered in a five-sided shielded aluminum metal case. The ambient operating temperature range of the converters is from -55°C to +95°C with derating. The DC/DC converters PO60HB are available with a wide 4:1 input voltage range of 9 - 36 V or 18 - 72 V. The series deliver output voltages of optionally 5 V, 12 V and 24 V. The high efficiency is between 82 and 86% (typical), depending on the converter type. Besides remote on/off control, the most interesting features of the PO60HB converters include output short circuit protection (hiccup & auto recovery), output overvoltage protection

(clamp mode) and over-temperature protection. The input/output isolation is 1500 V DC (1.5 kV DC). The main applications of the compact PO60HB series of DC/DC converters are battery powered equipment, measurement equipment, telecommunication system, wireless network, industrial control system and industrial control equipment. PEAK ELECTRONICS www.peak-electronics.de

Plessey launched ECG monitor at Electronica Plessey launched a hand held, ECG monitor at this year’s Electronica Show. Aimed at the home health market, the imPulse™ will allow the routine, quick and accurate recording of ECG signals outside of the medical environment and without the need for conductive gel or skin preparation. This compact, hand-held device detects an ECG signal when the user’s two thumbs are placed on the two sensor pads using two Plessey PS25201 sensors to recover the ECG signals. It measures the left and right signals and transmits the data via a Bluetooth link to a Smartphone or Tablet where custom software can then display the ECG trace and per-

form some simple analysis of heart rate. Using the latest generation of the EPIC sensor, which typically uses only 1.5mA during the short (15 seconds) period needed for ECG sensing, the imPulse has a very long battery life of several months before recharging. PLESSEY www.plesseysemiconductors.com

Future Lighting Solutions and LG Innotek announce a Worldwide Strategic Partnership Future Lighting Solutions, a division of Future Electronics, and LG Innotek, an affiliate of LG Group, announced today a strategic worldwide distribution agreement that will introduce LG Innotek’s entire portfolio of LED lighting solutions to the market. The portfolio features one of the industry’s broadest selection of LED products to fit virtually any lighting application, from LED packages to integrated solutions. Future Lighting Solutions’ extensive LED expertise, from design support services to world class supply chain and business solutions, creates a synergistic partnership that will allow both companies to further their leading positions within the rapidly growing LED lighting market. Future Lighting Solutions’ expertise, combined with LG Innotek’s capabilities, the 4th ranking global LED producer, will deliver unprecedented value to the lighting OEMs. “We are excited about LG Innotek’s exceptionally strong portfolio of LED products, aggressive technology road map, and unparalleled quality manufacturing capabilities for the general illumination market,” said Gerry Duggan, Executive Vice-President of Future Electronics. “This will further strengthen our proficiency in serving our customers’ growing demand for best-in-class LED lighting solutions.” “This agreement will significantly increase the availability of our products around the world as well as help us continually broaden our product line to offer the right solution for different lighting scenarios,” said Harry Kang, Vice-President of the LED Business Division at LG Innotek. “By joining forces with Future Lighting Solutions, we will be better able to equip lighting OEMs with the products and tools they need to put more LED-based lighting products on store shelves.” Future Lighting Solutions www.FutureLightingSolutions.com LG Innotek www.lginnotek.com

www.epd-ee.eu | January, 2013 | EP&Dee

PRODUCT NEWS

EMBEDDED SYSTEMS

Xsens and STMicroelectronics Demonstrate Wearable Wireless 3D Body Motion Tracking

Xsens and STMicroelectronics demonstrated the world’s first wearable wireless 3D body motion tracking system based on consumer-grade MEMS combo sensors at Electronica 2012 in Munich, Germany. Xsens built the demonstrator by combining Xsens’ patented sensor-fusion algorithms and wireless protocols with STMicroelectronics’ iNEMOM1, the 9-axis “Smart System” combining iNEMO MEMS motion combo sensors and the STM32 microprocessor from ST. The demonstrator leverages ST’s industry-leading motion-MEMS technology to showcase Xsens’ strategy to leverage IP originally developed for the professional market (B2B) in movement science and the movie industry. Having supplied the motion-capture technology for Hollywood productions such as Alice in Wonderland, Iron man 2 and XMen, Xsens is now reaching out to partners in consumer electronics to help create unique next-generation user experiences and solutions for 3D body motion tracking. "After our tremendous success in adding better realism and functionality to gaming systems, smartphones and tablets through Motion MEMS, it's time to inspire and lead new emerging applica-

tions,” said Benedetto Vigna, Executive Vice President and General Manager, Analog, MEMS and Sensors Group, STMicroelectronics. Wearable wireless 3D body motion tracking will enable the next wave of innovation in cloud-connected wearable sports, fitness, healthcare and gaming sensor accessories for smartphones. “Real-time 3D body motion data enables the development of apps that can recognize and classify complex motions such as sports techniques by digitizing your exact movements for immediate feedback and live sharing of the performance. With over a decade of experience in developing value added applications based on MEMS motion sensors, we are uniquely positioned to enable our partners to take the lead in this new era for Motion MEMS,” adds Per Slycke, CTO and founder, Xsens. ABI Research, a market analyst, predicts that over the next five years, the total market for wearable wireless devices in sports and healthcare will grow to 169.5 million devices in 2017, up from 20.77 million in 2011. STMICROELECTRONICS www.st.com XSENS www.xsens.com

EP&Dee | January, 2013 | www.epd-ee.eu

Ericsson Wins 2012 Product of the Year Award from Electronic Products Ericsson has won a ‘Product of the Year’ award for the company’s leading-edge 3E* BMR456 and BMR457 digital power DC/DC Advanced Bus Converters (ABCs) from Electronic Products, a leading trade publication for electronic design engineers. The BMR456 and BMR457 offer unprecedented performance and flexibility to system architects developing equipment for information and communication technologies (ICT) requiring smart and efficient board power solutions. The 2012 Product of the Year Awards were announced in the January 2013 issue of Electronic Products. “We are delighted to win this highly prestigious award from Electronic Products,” said Patrick Le Fèvre, Marketing and

Communication Director, Ericsson Power Modules. “It is an important industry recognition of the advanced capabilities of the BMR456 and BMR457 converters to dynami-

cally control bus voltages, making it possible to reduce board power consumption from anywhere between 3 and 10 percent, depending on the board application, delivering significant energy savings.” ERICSSON POWER MODULES www.ericsson.com/powermodules

Silicon Labs Simplifies Digital Class D Audio Development for 32-Bit Embedded Designs Silicon Laboratories Inc. introduced a cost-effective USBbased evaluation kit that enables developers to add digital Class D audio capabilities to 32-bit embedded designs based on Silicon Labs’ feature-rich SiM3U1xx Precision32™ microcontrollers (MCUs). The new Class D ToolStick kit demonstrates how easy and economical it is to upgrade basic “buzzer/beeper” alert sounds used in personal medical devices, fitness equipment, high-end toys, small appliances and other consumer electronics products to more sophisticated voice prompts, music, sound clips and even streaming audio. Silicon Labs’ highly integrated SiM3U1xx MCUs are well suited for digital Class D power amplification applications without the hassle and expense of adding discrete Class D amplifiers. The SiM3U1xx MCUs include a 300 mA high-drive I/O capable of

directly driving a small speaker, a crystal-less USB transceiver compatible with the USB audio interface, two 250 ksps 12-bit analogto-digital converters (ADCs), and an I2S receiver that supports audio streaming from a PC, a

portable music player or a wide range of I2S-enabled audio devices. The only external components required to drive Class D audio from SiM3U1xx MCUs are inexpensive inductors, some capacitors and ferrite beads. SILICON LABORATORIES www.silabs.com

PRODUCT NEWS

EMBEDDED SYSTEMS

Murata launches highly efficient 100 Watt DC/DC converter in 1/16th package Murata announced the ULS series of 100 Watt fully regulated DC/DC converters designed for use in distributed or intermediate bus power architectures. Delivering up to 100 W from an industry standard 1/16th brick package opens new design opportunities for power engineers needing to maximize power density where board space and efficiency are top priorities. The ULS series delivers efficiency’s up to 92% on the 12Vout model and 91% on the 3.3 and 5Vout models. The ULS series power modules utilize advanced mechanical design techniques, components and materials to optimize the electrical performance and thermal properties. Couple the advanced thermal management properties and the

high efficiency of the ULS series together in an industry standard 1/16th brick package and the result is a power module that will deliver the rated power with less reliance on forced air cooling in most applications.

Within the ULS series three single output models are available providing engineers with options including 3.3, 5 or 12 VDC outputs. The modules include all of the features expected for today’s demanding applications. MURATA www.murata.eu

XP Power targets harsh environment and sealed enclosure applications with 90% efficient baseplate cooled 400 W & 600 W power supplies XP Power announced the CCH400 and CCH600 series of compact single output baseplate cooled 400 W and 600 W AC-DC power supplies suited to harsh environment applications. With its highly efficient design, up to 90%, the CCH series generates substantially less waste heat that current product on the market, this being critical for use in sealed box applications. All heatgenerating components are attached to the baseplate allowing heat dissipation through the sealed box chassis or heatsink. No forced air cooling is required. Measuring just 214 x 102 x 43 mm (8.43 x 4.02 x 1.69 inches) the compact CCH series is up to 50% smaller than other baseplate cooled products of a similar power level, allowing more space in the endapplication or use of a smaller

enclosure. With its high efficiency rating a smaller heatsink can also be specified, reducing the overall footprint required. Both the 400 W CCH400 and the 600 W CCH600 series accom-

modate the full universal input range of 90 – 264 VAC without derating, making them suitable for designs used worldwide. These single output units are available with the popular nominal output voltages of +12, +24, +28 or +48 VDC. XP POWER www.xppower.com

Silicon Labs to Highlight Mixed-Signal Innovations at Embedded World 2013 Silicon Laboratories Inc. will showcase an array of embedded mixed-signal products and development tools at Embedded World in Nuremburg, Germany, February 26-28 at Booth 4A-211. Embedded World provides a world-class venue to demonstrate silicon solutions and development tools that simplify the embedded design process. Silicon Labs’ latest embedded mixed-signal solutions on display at Embedded World will include a single-chip, CMOS-based relative humidity sensor, the industry’s most energy-efficient 32-bit microcontrollers (MCUs) coupled with “power-aware” tools, smart interfaces and development tools for digital audio applications, high-performance wireless ICs, next-generation oscillators for frequency control and robust digital isolators for power supplies. Silicon Labs’ hands-on demonstrations at Embedded World will include: • Silicon Labs’ new Si7005 relative humidity sensor advances the state of the art for RH sensing by combining a mixed-signal IC manufactured on standard CMOS with a proven technique of measuring humidity using a polymer dielectric film. This demo highlights the Si7005 sensor’s advanced functionality with a demonstration board that features Silicon Labs’ ultra-low-power SiM3L1xx Precision32™ MCU and an LCD that displays humidity and temperature readings. The Si7005 sensor is ideal for applications that monitor or control humidity ranging from HVAC control to asset tracking to industrial applications. • The ultra-low-power SiM3L1xx 32-bit microcontrollers (MCUs) are the latest addition to Silicon Labs’ Precision32™ MCU family based on ARM® Cortex™-M3 processors. Discover how easy it is to optimize your SiM3L1xx application for the lowest system power using Silicon Labs’ low-power development boards and Precision32 power-aware tools including Power Estimator and Power Tips. • Silicon Labs provides mixed-signal ICs and evaluation kits that simplify the process of adding digital audio to embedded designs. The CP2114 digital audio bridge chip eases USB audio accessory design by streamlining audio data transfer from USB to I2S without time-consuming code development. Silicon Labs’ Class D ToolStick evaluation kit shows how easy it is to add digital Class D audio capabilities to 32-bit embedded designs based on SiM3U1xx MCUs without the hassle and expense of including separate Class D amplifiers. • Silicon Labs’ EZRadioPRO® transceivers and Ember® ZigBee® products provide ideal wireless solutions for demanding RF applications such as smart meters, security alarm systems and home automation devices. This demonstration highlights the simplicity and design flexibility of implementing robust wireless links using Silicon Labs’ Wireless Development Suite tools while showcasing the best-in-class range, lowpower operation and sub-GHz performance of EZRadioPRO devices. • Highlighting Silicon Labs’ state-of-the-art digital isolation solutions, this power supply demo shows how Silicon Labs’ Si87xx digital isolators provide a perfect pin configuration, package and footprint replacement for outmoded optocoupler products while offering superior noise immunity, more robust performance and greater reliability. • In this groundbreaking timing solution demo, Silicon Labs introduces a unique single-chip oscillator family that will change the way developers implement frequency control in a wide range of industrial, embedded, consumer and communications applications. For more information about Silicon Labs’ participation and exhibits at leading electronics industry events, visit www.silabs.com/events. SILICON LABORATORIES www.silabs.com www.epd-ee.eu | January, 2013 | EP&Dee

PRODUCT NEWS

ACTIVE COMPONENTS

NXP and Murata collaborate to deliver dual interface RFID solution

Silicon Labs Expands Wireless Portfolio to Include Ember® ZigBee® Solutions for the “Internet of Things”

NXP Semiconductors N.V. and Murata announced a new addition to the Murata MAGICSTRAP® RFID module family incorporating NXP’s UCODE I2C technology. In addition to delivering state-of-the-art RF performance, the bridge mode of the UCODE I2C chip uniquely enables a wireless communication link between the application processor and the UHF reader, enabling bidirectional and unlimited data transfer. The module provides consumer electronics products and white goods with both a consistent ID and the ability to perform zero-power configuration at any point in the value chain. Based on passive UHF RFID standards, data can be read or written into the memory of the MAGICSTRAP®+I²C using a standard UHF reader, even while the device or appliance is switched off. Practically, this means that an electronics product can be configured for different languages and markets when already packed in a carton box and ready for shipment. By

Silicon Laboratories Inc. announced the addition of Ember® ZigBee® solutions to its portfolio of low-power wireless embedded devices for the Internet of Things (IoT). Available now through Silicon Labs’ global distribution channel, the EM35x system-onchip (SoC) and network co-processor (NCP) products and EmberZNet PRO software enable designers to develop high-performance, low-power and reliable 2.4 GHz wireless mesh networking solutions for smart energy, home automation, security, lighting, and other monitoring and control applications for the rapidly growing IoT market. Industry experts predict that the number of connected devices for the IoT will surpass 15 billion nodes by 2015 and reach 50 billion nodes by 2020. By adding Ember ZigBee solutions to its portfolio of sub-GHz wireless ICs, wireless microcontrollers (MCUs), and 8- and 32-bit mixed-signal MCUs, Silicon Labs is uniquely positioned to provide the wireless connectivity and low-power processing platforms for many of the connected

removing the need to configure products during assembly and when powered on, OEMs can make significant savings in manufacturing and logistics costs by responding precisely to regional

and model demand. A protected unique ID built into the UCODE I²C enables protection against counterfeit and grey markets. This can be combined with cryptographic algorithms to have a strong protection. The possibility to write to the MAGICSTRAP® even without connected booster antenna makes it the perfect choice for such uses. Full traceability from begin till end of life of a product is thus given. MURATA www.murata.eu/rfid/index.html NXP SEMICONDUCTORS www.nxp.com

Ultra wide 8:1 input range DC-DC converter designed for railway applications Murata launched the UCR100 series of DC-DC converters from Murata Power Solutions designed specifically for railway power conversion and battery applications. Accommodating an ultra wide 8:1 input range, from 16.8 to 137.5 VDC, the UCR100 series comprises 3 single output models providing 5, 12, or 24 VDC outputs. Additional model-specific options include current share, holdup and an adjustable undervoltage lockout feature. Packaged in a Euro Cassette format measuring 3U x 4TE x 165 mm, the UCR100 series is footprint and pin compatible with competitive product offerings. The UCR units offer customers ease of installation and better

energy efficiency ratings than comparable models. Typically a single UCR module can take the place of up to 5 alternative modules currently used in customers’existing applications.

The series also can improve overall system reliability through use of the input hold up option that requires just a single capacitor to provide up to 10 ms holdup. MURATA www.murata.eu

EP&Dee | January, 2013 | www.epd-ee.eu

devices that enable the IoT. The Ember ZigBee platform is the most integrated, comprehensive and feature-rich ZigBee solution available for 2.4 GHz wireless networks, delivering unmatched wireless performance, low power consumption

and code density in a compact package. The most widely used ZigBee platform for mesh networking applications, EM35x devices can be deployed as SoCs for cost-sensitive, lowpower sensor networks and other simple connected devices or configured as NCPs for complex applications running on high-performance applications processors. The EM35x devices integrate a 2.4 GHz IEEE 802.15.4 transceiver with an +8 dBm power amplifier, ARM Cortex-M3 core, up to 192 kB flash memory and 12 kB RAM. SILICON LABORATORIES www.silabs.com

Multi-output 60 W power supplies meet latest green pow XP Power announced the ECP60 series of compact low profile 60 Watt AC-DC power supplies. These highly efficient units, typically 88% efficiency, measure just 101.6 x 50.8 x 30.4 mm (4 x 2 x 1.20 inches) and fit into an industry standard footprint. Also, having a no load power consumption of less than 0.5 W the ECP60 series helps designers ensure their products comply with internationally recognized "green" energy efficiency specifications. The ECP60 series comprises 8 models offering a +5 VDC single output, three dual-output and four triple output models. Dual output models have +5 VDC

and an additional +12, +15 or +24 VDC output option. Triple output models offer +5 VDC on output 1 with options of +/-12 VDC, +/-15 VDC, +24/+12 VDC and +24/-12 VDC on outputs 2 and 3. The units also feature a peak load capability that can provide up to 130% of rated output power for up to 30 seconds. This is ideal for applications, such as motor start-up, where a higher wattage supply is very occasionally required. Customers need not design in a higher wattage power supply thus saving additional cost and valuable space. The ECP60 are convection

PRODUCT NEWS

ACTIVE COMPONENTS

New Digital Power Software Tool Unlocks Unprecedented Levels of Flexibility to Optimize Energy Consumption • First of its kind in the industry, Ericsson DC/DC Digital Power Designer software tool closes the gap between system architects and board-power designers, shrinking time-to-market with an unprecedented level of flexibility; • New tool manages a wide range of configurations — from simple to highly complex setups and from a single unit to a complete system — in both online and offline modes; • First software tool to integrate tools that support system development from concept and early evaluation to final board production, significantly reducing timeto-market and cost. Ericsson has unveiled an advanced industry-first toolkit that provides board-power designers with highly advanced software to configure, implement and monitor power conversion devices - from a single unit to a complete system — including the Ericsson 3E* digital Point-Of-Load (POL) regulators, 3E Advanced Bus Converters (ABCs) and 3E Power Interface Modules (PIMs). Called the ‘Ericsson DC/DC Digital Power Designer’, the software is totally free of charge and can reduce time-to-market, total cost of ownership and energy consumption overall. The software includes two essential parts – a design tool and a production tool. The Ericsson Power Designer design tool is based on a simple and intuitive inter-

face and offers board-power designers a wide range of possibilities to configure standalone 3E POLs, 3E ABCs and 3E PIMs, or a combination of multiple products as integrated in the final application. The production SMBus-based tool makes it possible to upload configuration files into a set of modules during manufacturing: not only reducing inventory costs, but also increasing flexibility to upgrade configurations with the implementation of new power schemes. “Since the introduction of the first digital power module in 2008, we have been working in close cooperation with our

DIALOG semiconductor announces most powerful integrated power management IC for ARM® QUAD-CORE application processors Flexible, scalable, multi-platform, 14.2A output current PMIC. Dialog Semiconductor plc announces the most powerful and most integrated configurable power management IC (PMIC) for ARM® quad-core and dualcore application processors. The DA9063 can deliver up to 12A from its six DC/DC converters, 24% more than its nearest rivals. It simultaneously powers the processor (the core at up to 5A plus other processor supplies), external memories, wireless communications (WLAN and Bluetooth), GPS and FM receivers, and data modems. The DC/DC converters can be paralleled to provide 3A and 5A rails. This means that the PMIC is scalable and adaptable for different system requirements in smartphones, tablets and embedded applications. It comes in an 8 x 8mm BGA package that facilitates simple routing, allowing lowcost, 2-layer PCBs to be used for some designs.

customers to develop hardware and software solutions that really unlock the amazing possibilities offered by digital power technology,” said Patrick Le Fèvre, Marketing and Communication Director, Ericsson Power Modules. ERICSSON POWER MODULES www.ericsson.com/powermodules

wer specifications cooled units, with no additional forced air cooling being required. They are capable of operating over a wide range of temperatures from -20 to + 70 degrees C, with no derating until +50 degrees C. Meeting the IT equipment safety specifications of UL/EN/IEC 60950-1 and the current 3rd edition medical safety standards of EN 60601-1 and ANSI/AAMI ES60601-1 including risk management files and 2 x MOPP the series suit a broad range of information technology, industrial and medical equipment. They also comply with the EN55011 / EN55022 level B standard for conducted emissions without the need for additional filtering components. XP POWER www.xppower.com

The DA9063 has 11 SmartMirror™ LDOs, 16 GPIOs and two rail switches, in addition to the six main DC/DC outputs. Any start up sequence, output voltage and DVC ramps can be programmed, giving unprecedented opportunities for designers to minimise their system energy consumption. For example, the application can be completely powered down and started again under the DA9063’s supervisory function. The PMIC further maximises battery life by providing dynamic voltage scaling (DVS), something that is not available with discrete solutions. Furthermore, its multimode buck converter runs at 3MHz switching frequency, enabling inductors just 1mm high to be utilised, while maintaining the high peak current. The wide supply range of 2.7V to 5.5V enables the use of single cell lithium-ion batteries as well as a standard 5V supply or a USB power supply. This is especially important for non-mobile systems. The operating temperature range is -40 to +85°C. The device is available now. Dialog Semiconductor www.dialog-semiconductor.com www.epd-ee.eu | January, 2013 | EP&Dee

PRODUCT NEWS

LEDs

Everlight Lighting Components Complete LM80 Testing Everlight Electronics introduced several low, mid, and high power LED lighting components that adopted the LM80 test, in order to provide a broad range of high quality LED lighting components and strengthen EVERLIGHT's concept of “The Right LED for The Right Application.”

ing. It is a standardized test method of at least 6,000 hours and at certain controlled conditions that is required of all lighting LEDs so that each LED tested, regardless of manufacturer, can be judged against other tested LEDs on an equal scale and compared. Everlight's LEDs that will complete LM80 testing in 2013

Standardization has become a key factor in LED adoption in the global lighting market - not only in safety standards and performance standards but also more importantly, in reliability and lifetime testing. LM80 is the lighting standard by which all major LED manufacturers are complying with for lumen maintenance test-

are tested at higher case temperatures, higher driving currents, and with more CCTs. Under these criteria, EVERLIGHT can demonstrate the durability and consistency of its lighting LED products and provide confidence for our lighting customers. EVERLIGHT ELECTRONICS www.everlight.com

Cree's XLamp® XM-L2 LEDs Now at Mouser Increases Lumen Output up to 20% Over Original XM-L Series Mouser Electronics, Inc., announced it is stocking the new XLamp® XM-L2 LEDs from Cree, increasing the lumen output up to 20% over the original XM-L LEDs. Cree XLamp® XM-L2 LEDs are the highest-performing, commercially available, single-die LEDs, delivering breakthrough lumen output and efficacy in the XM package. These LEDs build on the unprecedented performance of the original XM-L by increasing lumen output up to 20% while providing a single die LED point source for precise optical control. Built on the SC³ Technology™ Platform, XM-L2 LEDs are available in white, 80-CRI white, 85CRI white, and 90-CRI white. The XM-L2 LED shares the same footprint as the original XM-L, providing a seamless upgrade path and shortening the design cycle. The XM-L2 LED offers the unique combination of high effi-

cacy and high lumen output at high drive currents, delivering an unprecedented 1198 lumens at 116 lumens-per-watt efficacy at 3A, 25ºC. XLamp XM-L2 LEDs are the ideal choice for lighting applications where high light output and maximum efficacy are required, such as LED light bulbs, outdoor lighting, portable

lighting, indoor lighting, and solar-powered lighting. With its broad product line and unsurpassed customer service, Mouser caters to design engineers and buyers by delivering What’s Next in advanced technologies. MOUSER ELECTRONICS www.mouser.com

EP&Dee | January, 2013 | www.epd-ee.eu

Power Integrations sets new standard for power density in LED-Driver Reference Design New design delivers small size, high efficiency and long-lifetime for retrofit tube applications. Power Integrations announced two new reference designs describing high-efficiency, nonisolated, high-power-factor (PF) LED drivers for T8 tubes. The designs feature low component count and leverage simple magnetics and singlesided boards yielding industryleading power densities of 14.2 W/in³. Based on the LNK460KG LED driver from Power Integrations’ LinkSwitch-PL family of ICs, the circuits detailed in DER-337 (high-line) and DER345 (low-line) use single-stage non-isolated topologies which result in a profile of only 8 mm small enough to be mounted behind the LEDs in the T8 tube. The buck-boost (DER-337) or

buck (DER-345) configurations deliver a power factor greater than 0.9 and low THD, meeting EN61000-3-2 C limits. The designs are EMI compliant, easily meeting the EN55015 (EMI) class B specification. The integrated

single-stage driver IC controls both PFC and constant-current output resulting in a solution that uses fewer than 30 components. Both drivers deliver 20 W (85 V at 240 mA) at an efficiency as high as 92 % (DER-337) and 89 % (DER-345). POWER INTEGRATIONS www.powerint.com

New LED-Lighting driver design from Power Integrations delivers long lifetime and high efficiency Power Integrations announced a new long-lifetime LED-driver reference design. DER-340 describes a wide-range (90 VAC to 308 VAC), high-power-factor LED-driver power supply that is suitable for high-bay, exterior and streetlighting applications. The LED driver detailed in DER-340 uses Power Integrations’ LinkSwitch-PH family of power conversion ICs which combine single-stage PFC and accurate CC output control. Single-stage LED driver architectures typically yield up to 5% higher efficiency than two-stage designs, which combine losses from separate PFC and constantcurrent circuits. High-voltage aluminum electrolytic bulk capacitors - the least reliable component in traditional lighting power

supply circuits - are not required in the single-stage approach, making 50,000-hour lifetimes attainable. In addition to providing a very effective solution for

standard lighting applications in benign environments, DER-340 copes with conditions of poor ventilation and high temperatures in industrial applications through the use of ceramic output capacitors and an accurate hysteretic thermal shutdown feature included in the LinkSwitch-PH IC. POWER INTEGRATIONS www.powerint.com

PRODUCT NEWS

PASSIVE COMPONENTS

Cost-effective and energy-efficient: RTC modules in ultra-small HTCC package MSC now offers four new real time clock (RTC) modules in C3 package from Micro Crystal. The modules feature small dimensions of only 2.7 mm x 2.5 mm x 0.9 mm. The RTC module types RV-3029-C3 and RV3049-C3 with an embedded 32.768 kHz crystal and integrated temperature compensation are specified for an operating temperature of up to +125°C. An accuracy of ±6 ppm is guaranteed from 40°C to +85°C. Current consumption of the low-power RTC module type RV-8564-C3 is only 250 nA at 3 V supply voltage. The ultra-low-power RTC module type RV-8523-C3 has an even lower current consumption of only 130nA.

As with the larger C2 high temperature co-fired ceramic (HTCC) package versions, the new more compact C3 versions can be operated with supply voltages of 1.2 V/1.3 V to 5.5 V.

All other electrical parameters are also compatible with previous versions. The new RTC modules in C3 package are qualified according to AEC-Q200, RoHS compliant and 100% lead free. MSC www.msc-ge.com

High peak current electrical double-layer capacitors offer low ESR in small slim package Murata introduced a high peak current electrical double-layer capacitor (EDLC) series with a profile of 2.5mm±0.2mm. The newest EDLC series from Murata also features lowest resistance (40mΩ to 60mΩ) and stable temperature characteristics, enabling it to be charged and discharged frequently over the operating range of 30°C to +70°C. Initially, the DMF EDLC series will offer 330mF and 470mF capacitance values to support various energy requirement demands. Package thickness ranges from 2.5mm±0.2mm to 3.2mm ± 0.2mm and all products in the series provide an instantaneous maximum working voltage of 5.5V. The slim DMF series features the highest power density levels available on the market, making the advanced supercapacitors ideal for use as an auxiliary power source in LED flash units, digital cameras and cell phones.

Additional applications include peak load assist for GSM PA’s, smart meters, compact motor starters, and USB power bus. The new EDLC series provides an optimized internal configuration to improve energy and power density. In addition, the DMF series offers a simplified, inline terminal configuration that

optimizes board space. The low ESR allows for high output current with quick charge and discharge characteristics. DMF series samples are available from stock to 2 weeks with production lead times of 8 weeks. MURATA www.murata.eu

EP&Dee | January, 2013 | www.epd-ee.eu

Compact Chassis Mount Ac-Dc Power Supplies Ease Installation in Challenging Environments CUI Inc announced the release of five new series of encapsulated ac-dc power supplies ranging from 5 W to 25 W. The VSK-T family is housed in a potted and encapsulated chassis mount package, providing a convenient mounting solution when a dedicated circuit board for the power system is either not feasible or is cost prohibitive. The units are compact, measuring as small as 76 x 31.5 x 24 mm (2.99 x 1.24 x 0.94 in) in the 5 W series. The package design also protects against environmental factors such as dust, moisture, and shock and vibration, making these ac-dc modules ideally suited for use in a range of low power ITE, industrial, security and transport applications. The VSK-T family provides a universal input of 85 to 264 Vac and fully regulated dc outputs of 3.3, 5, 9, 12, 15, 24, and 48 Vdc depending on the series. The modules reach efficiencies of up to 87% and carry UL/cUL and CE

60950-1 certifications. Protections for over voltage, over current, over temperature and short circuit are included as well as isolation voltages of 4K Vac in the 5 and 10 W versions and 3 K

Vac in the 15, 20, and 25 W versions. The VSK-T family is available immediately with prices starting at $8.90 USD for 1000 pcs. Summary Product name: VSK-T series Availability: Stock to 6 weeks Possible users: ITE, industrial, security, transportation Primary features: Chassis mount package, rugged potted design Cost: $8.90 for 1000pcs CUI www.cui.com

Murata launches world's first MLCC on interposer substrate Murata announced mass production of the first monolithic ceramic capacitor (MLCC) on a interposer substrate. Believed to be the world's first MLCC to have this construction technique, the ZRA series has been designed specifically to absorb mechanical vibration generated within the capacitor, typically sounding as "squealing", when a voltage is applied to it. "Squealing" has become an industry issue especially in the design of power supply circuits of consumer applications such as laptops, smartphones and digital cameras. The PCB can amplify the audio noise generated by the capacitor, so by using an interposer substrate the MLCC

becomes mechanically isolated from the PCB. Tests conducted by Murata have indicated as much as a 20 dB reduction in audio noise measured at 3 kHz

when compared against a traditionally constructed MLCC. The ZRA series currently comprises 22 uF 6.3 WV values with X5R temperature rating in both 0804 and 0906 formats. More capacitance values, in the range 1 to 22 uF, will be added shortly. MURATA www.murata.eu

PRODUCT NEWS

DISPLAY

High-Brightness Outdoor LED Displays from Chilin Solutions at Rutronik Chilin Solutions has launched two ruggedized high-brightness outdoor LED displays in 55” (ODX55LBHa) and 46” (ODX46LBHa). The innovative enclosure design and optical treatment enable high-quality image performance in demanding outdoor environments. The displays are available at distributor Rutronik as of now. Chilin’s displays are in Full-HD (1080p) with a display resolution of 1920x 1080 (16:9) and a brightness of 600cd/m². The contrast ratio amounts either 3000:1 (46”) or 4000:1 (55”). They are waterproof (IP56) with integrated waterproof speakers and can be used in a wide temperature range from -20°C up to +45°C. Extensive tests with a broad variety of analog/digital PC and video modes ensure a wide compatibility. IRFM™ technology helps to prevent image retention.

The displays come with a heat-dissipating aluminum housing and a D-LaB liquid glass bonding consisting of a 4mm tempered glass, anti-reflection and anti-IR coatings. Their DACS cooling and filtration system has lifetime ruggedized membrane filters. Providing DisplayPort, HDMI, DVI, VGA, video and audio as well as networked control interface, they offer enhanced connectivity. RUTRONIK www.rutronik.com

It's all about the contrast: OLED displays are now also available for industrial applications A high contrast ratio combined with a good readability from all angles are key quality factors for many display applications. These characteristics are standard features of screens based on organic light-emitting diodes (OLEDs), which in the past have not been rugged enough to be broadly implemented for industrial use. The display manufacturer Electronic Assembly

is aiming to target that issue. The implementation of a patented technology can dramatically increase the life time of OLED displays. Using OLED displays is not just a favorable option in terms of aesthetics , since they also feature an extremely high contrast ratio of at least 2000: 1. A high contrast considerably improves the readability of displays. The same applies for a further important characteristic of OLED displays, the extremly wide viewing angle. Industrial applications where high-quality materials and pre-fabricated assemblies are often processed that also require quick response times. A good readability can significantly contribute to the safety of the overall system as well as for the persons working on it. ELECTRONIC ASSEMBLY www.lcd-module.com

Ultra-Slim 43 cm and 38 cm Panel PCs with many interfaces The Ultra-Slim Panel PCs that DSM Computer, presented for the first time at the sps ipc drives 2012 are available in two variants. The PN17-A2 Panel PC has a 43 cm (17 inch) TFT display with 5-wire single touchscreen; the PN15-A2 model has a similar 38 cm (15 inch) display. The luminance of the displays with LED backlight is 350 or 400 cd/m², respectively; the maximum resolution is 1280 x 1024 (PN17-A2) or 1024 x 768 (PN15-A2). Despite their very small installation depth of approximately 50 mm, the robust Panel PCs offer a wide range of interfaces via various extension I/Os. In addition to the serial connections, USB 2.0, VGA

Ideally suitable for indoor areas:

New high-quality family of displays by Chi Mei Innolux for cost-sensitive industrial applications With the Basic Industrial Line by Chi Mei Innolux (CMI), Gleichmann Electronics will be offering a new inexpensive high-quality family of displays especially for cost-sensitive indoor industrial applications as from January 2013. The first two members of the family, which are identical to the same-sized Classic Industrial Line models except for the integrated backlight unit, are the 30.7 cm (12.1“)

G121AGE-L03 SVGA display with an allround viewing angle of 89°, 450 cd/m² brightness and a contrast ratio of 1000:1 and also the 38.1 cm (15“) G150AGE-L05 XGA display with horizontal and vertical viewing angles of 160° and 140° respectively, brightness of 250cd/m² and a contrast ratio of 700:1. In addition to a reverse scan function and a wide working temperature range of -30°C to +80°C, the displays also have an LVDS interface.

and DVI-I, two LAN interfaces that support the EtherCAT protocol are supported as standard. The integrated solid state disk (SSD), the optional hard disk drive (HDD) and the Compact Flash memory are accessible externally and easy to replace. DSM COMPUTER www.dsm-computer.com

As with all other Industrial Line displays, CMI also guarantees that the two new 12.1“ and 15“ models G121AGE-L03 and G150AGE-L05 will be available for a minimum of five years from the start of production. Gleichmann & Co. Electronics www.msc-ge.com www.epd-ee.eu | January, 2013 | EP&Dee

PRODUCT NEWS

SENSORS

Omron extends MEMS gauge pressure sensor range New negative sensor pressure for medical and other applications Omron Electronic Components Europe has added a new piezo-resistive gauge

pressure sensor featuring an extended pressure range as well as low power consumption and very small size. The new Omron 2SMPP-03 MEMS based pressure sensor is ideal for medical applications such as negative pressure wound therapy (NPWT) as well as leak detection, movement control, level indicators, home appliances and industrial control instruments. It offers precise measurement between 50kPa to +50kPa, complementing the 2SMPP-02 with a 0 to 37kPa range.

Both devices share exceptionally compact external dimensions, of just 6.1 by 4.7 by 8.2mm. They offer a reduced offset voltage and span dispersions of ±4.0 mV and 3.1 mV, which makes trimming unnecessary. The low power consumption of 0.2mW associated with a drive current of just 100 micro-Amps provides significant energy savings. The specifications include a non-linearity of less than 0.8% of full-scale and a hysteresis of 0.5% of full-scale. Another outstanding feature is low temperature influence span of ±1% and offset of ±3% of full-scale. Omron is a world leader in home use blood pressure monitors, having shipped well over 100 million such instruments. This success is partly based on its leadership in MEMS pressure sensor technology. The company is actively developing further pressure sensing devices. OMRON http://components.omron.eu

Honeywell Expands its Zephyr™ Airflow Sensor Portfolio with High Airflow Versions Designed for Direct Implementation into the Main Flow Channel, Saving Customers Time and Effort Honeywell announced it has expanded its Zephyr™ airflow sensor HAF Series portfolio with new digital versions that provide airflow ranges of 0 to 20 SLPM (Standard Liters per Minute) and 0 to 200 SLPM. With this new product, Honeywell has leveraged its original Zephyr building block airflow sensor via a bypass to the main flow channel of the sensor, eliminating the need for a customer-designed bypass in equipment such as ventilators. Honeywell’s new Zephyr™ airflow sensors with the builtin bypass offer customers three important benefits:

1. High performance that includes a narrow Total Error Band (the most comprehensive and meaningful measurement that provides the sensor’s true accuracy) of ±4% reading and a high accuracy of ±3.5% reading, allowing for very precise airflow measurement-often ideal for demanding applications with high accuracy requirements. 2. Ease of integration provided by simple electrical interfaces (regulated, compensated, calibrated, linearized) and multiple mechanical configurations (manifold mount, male and female fittings). 3. Custom calibration, including forward flow direction and optimized custom calibration for many gases (dry air, helium, argon, nitrogen, nitrous oxide, carbon dioxide), which eliminates the need to implement gas correction factors. HONEYWELL www.honeywell.com

EP&Dee | January, 2013 | www.epd-ee.eu

PRODUCT NEWS

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AUTOMATION Honeywell Introduces 6 Degrees of Freedom Inertial Measurement Unit, 6-D Motion Variant Honeywell announced it has introduced its Inertial Measurement Unit (IMU), 6-D Motion Variant, 6DF Series, designed to provide motion, position, and navigational sensing from a durable single device over six degrees of freedom. The six degrees of freedom is achieved by using MEMS (microelectromechanical system) technology to sense translational movement in three perpendicular axes (surge, heave, sway) and rotational movement about three perpendicular axes (roll, pitch, yaw). Because the movement and rotation along the three axes are inde-

pendent of each other, such motion is said to have “six degrees of freedom”. The 6DF Series IMU measures the motion of the equipment onto which it is attached and delivers the data to the equipment’s control module using an industrystandard CAN SAE J1939 communications protocol. This capability allows the equipment operator to focus on other functions, enabling more precise control than can be achieved by using only the human eye, thus increasing safety, stability, and productivity. Honeywell’s IMU 6DF Series pro-

vides three key benefits: - Highly accurate 6-D rotation and acceleration outputs; - Industry-leading durability; - Ease of integration. The 6DF Series may potentially be

used in the following applications: • Transportation • Industrial • Non-ITAR aerospace/military HONEYWELL www.honeywell.com

www.epd-ee.eu | January, 2013 | EP&Dee

PRODUCT NEWS

CONNECTORS

HotShoe fast-mate, reliable connector family now rated to IP68 Harwin has launched an IP68rated version of its HotShoe connector technology which enables rapid and simple connection. Available in standard 8, 12 and 16 way versions, HotShoe connectors employ springloaded contacts which maintain a positive contact force against the mating half of the connector, ensuring reliable connection even under the most demanding conditions. HotShoe connectors have always provided a high degree of resistance to dust, water, and chemical ingress – the new IP68 versions are also dust tight and provide protection against total and continuous submersion in water to a depth of 1.5 meters for two hours. Fabricated using highly durable

plastics, HotShoe connectors are very robust, ensuring continued reliability throughout a product’s entire lifecycle. HotShoe connectors are suitable for harsh environment applications and use in

portable equipment where separate battery modules are used, for data transfer docking stations, and for battery charging and data communications equipment. HARWIN www.harwin.co.uk

SUYIN – A Tailoring Shop for Connectors The great benefit that SUYIN provides lies primary in its ability to adapt connectors to meet its customers’ exact requirements and to satisfy the needs of the given application in terms of form and function. To do this, SUYIN – as a Taiwanese company with production locations and development teams in China, but with technical support, service, sales and logistics teams based in Germany for its European customers – draws on both standardized subcomponents and on the tremendous expertise that it has developed in recent decades in areas such as industrial, automotive and communications applications. Another good example of how this works can be seen in a recently implemented 4 position vertical USB A connector (receptacle, fig. 1) for THT mounting on a PCB. The connector only had an overall maximum mounting height of just 3.25 mm above the board surface to work with in order to comply with the very tight space constraints. Although the decision was made to go with a heightoptimized connector solution for inboard mounting, achieving that

goal seemed unattainable at first, because the production requirements made it impossible to bend the contacts within the tight radius limitations.

SUYIN www.suyin-europe.com

EP&Dee | January, 2013 | www.epd-ee.eu

New from SUYIN: Ultra-low-profile, flexible batteryconnector solution with cable connection For all applications that require a separable, miniaturized, safe, reliable and particularly flexible connection between electronic equipment and a battery, SUYIN now offers an ultra-low-profile battery plug-and-socket combination that can be varied to meet customer-specific needs. With this solution, the 060087GS four-position plug can be placed at any suitable position on the board and mounted using through-hole technology (THT), and the 060088HS socket is equipped with a flexible cable that can be adapted to match nearly any customer requirements by varying the length along with all other specifications (cross section, color, shielding, etc.). The compact overall dimensions for the female connector (without the cable) and male connector when mated are 12,6 mm (width) x 8,75 mm (length) x 2 mm (height). The

long-lasting blade contacts with a pitch of 1.8 mm can conduct 12 VDC / 5 A per pin, and the high level of mating reliability is tested at the factory at 500 ±50 mating cycles per hour. Other key techni-

cal characteristics that this completely halogen-free battery connector solution offers include the extremely low contact resistance of 30 mΩ (initial), the excellent insulation resistance of 1000 MΩ as well as the wide range of operating temperatures, which extends from –40°C to +105°C. SUYIN www.suyin-europe.com

ALPS Develops “RKJXW2 Series” Multi Control Device ALPS has developed the RKJXW2 Series Multi Control Device ideal for integrated control of automotive equipment. Samples will be available from December. Car navigation systems are now essential items for vehicles and the number of units in the market keeps rising, topping 50 million units in March 2012, an increase of around 12% from the same time the previous year, and 53 million units in September 2012*. Besides improvements to navigation accuracy, the popularity of navigation systems is sustained by increasing functionality as they take on features like automatic map updating, TV viewing, music playback, rear view camera, and interoperability with smartphones. But while this enhances the comfort and convenience of the vehicle cabin, greater functionality requires more buttons and dials for operating those functions. Add other controls, such as for the air-conditioning

system, and operation becomes very complicated. Another issue, stemming from the use of bigger displays to improve visibility and make watching of TV or DVDs easier, is that more systems are being installed on top of the dashboard rather than in the cen-

ter console and therefore hard to control via a touch panel in the display. In such cases, safety demands that the driver can have certainty about the controls when operating them directly to keep the amount of time that the eyes are averted from the road to a minimum. ALPS ELECTRIC www.alps.com