JULY, 2014 足 ISSUE NO. 7, VOL. 12
DESIGN & MANUFACTURING
EP&Dee ELECTRONICS
PRODUCTS
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DESIGN
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THE EAST EUROPEAN RESOURCE FOR EMBEDDED APPLICATIONS
JULY 2014 Table of Contents
DESIGN FEATURES 5 Microsemi Enables OEMs to Expedite Prototyping and Application Development with its Comprehensive New SmartFusion2 SoC FPGA Evaluation Kit Feature-rich, affordable platform enables OEMs to leverage SmartFusion2’s lowest power consumption in its class, high reliability capabilities and best-in-class security to build highly differentiated products with significant time to market advantage.
6 Microchip Extends Spotify® Connect Support in New JukeBlox® Platform Release 8 First 8Gb DDR3 components and 16GB unbuffered DIMMs & SO-DIMMs by I'M Intelligent Memory 10 The RZ/A as used in an application example The key target market for the RZ/A device is the Human Machine Interface market, for driving medium to large TFT panels. The RZ/A family is an ARM cortex A9 based embedded MPU solution that brings many advantages to the HMI application space. The article will be a discussion of the requirements of such an application space as well as of how the RZ/A meets these requirements and offers system level advantages to the design engineering community.
Win a Microchip LCD Explorer Development Board! EP&Dee is offering its readers the chance to win an LCD Explorer Development Board (#DM240314) from Microchip. The LCD Explorer Development Board supports Microchip’s 100-pin Microcontrollers with x8 common Segment LCD Drivers. This board provides an ideal platform for a customer to evaluate a MCU with a x8 Common LCD Driver on a 38 segment × 8 common LCD display. PICtail™ Plus connections allow a customer to evaluate the selected MCU in a complex system by adding Microchip’s PICtail Plus daughter boards.
16 Aurocon COMPEC always offers new products 20 EM Microelectronic Releases COiN, a Complete Bluetooth® Smart Beacon COiN Offers Longest Lasting, Longest Range, Most Secure & Flexible Bluetooth® Beacon
26 Contrinex presents a world first: M12 size, full-metal sensors with an extremely long operating distance of 15 mm No fewer than four new, full-metal versions (PNP, NPN, NO, NC) in size M12 offer the unique benefit of a 15 mm operating distance. In this way, Contrinex adds an innovative technology to its Full Inox Extreme range as a solution for customers who need robust sensors with maximum operating distances.
36 EcoCWave by Dürr Ecoclean: Superior quality, cost-efficiency and process reliability in aqueous parts cleaning 38 parts2clean 2014
Features • 96 Segment 37 Segment × 8 Common LCD Glass • 4 Buttons and 1 mTouch Capacitive Button • Analogue potentiometer and temperature sensor • Power input from 9V power supply, battery or USB power source • Separate Vbat battery supply • RJ11 and 6 pin PICkit™ 3 programming and debug connectors
PRODUCT NEWS Embedded Systems (p 4 - 9) (p 14, 18, 19) (p 21 - 25) Sensors (p 27, 29) Lighting Solutions / Display (p 28)
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For your chance to win an LCD Explorer Development Board from Microchip, please visit: http://www.microchip-comps.com/epdee-lcdexplorer and enter your details in the entry form.
Active Components (p 30 - 35) Group Publishing Director Gabriel Neagu Managing Director Ionela Ganea Accounting Ioana Paraschiv Advertisement Irina Ganea WEB Eugen Vărzaru © 2014 by Eurostandard Press 2000
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The on-board potentiometer, temperature sensor, 4 buttons, mTouch key and PICtail Plus expansion connectors provide a versatile platform for low power system development. The kit contains the LCD Explorer Development Board, a 100-pin PIC24FJ128GA310 LCD PIM and example software programmed on PIM
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Contributing editors Radu Andrei Ross Bannatyne Consulting Marian Blejan Bogdan Grămescu Mihai Savu Asian Reprezentative Taiwan Charles Yang Tel: +88643223633 charles@medianet.com.tw
EP&Dee Web page: www.epdee.eu EP&Dee Subscriptions: office@epdee.eu
EUROSTANDARD PRESS 2000 Tel.: +40 31 805 9955 Tel: +40 31 805 9887 office@esp2000.ro www.esp2000.ro VAT Registration: RO3998003 Company number: J03/1371/1993
EP&Dee (Electronics Products & Design Eastern Europe) is published 11 times per year in 2014 by Euro Standard Press 2000 s.r.l. It is a free to qualified electronics engineers and managers involved in engineering decisions. Starting on 2010, this magazine is published only in digital format. Copyright 2014 by Euro Standard Press 2000 s.r.l. All rights reserved.
INDUSTRY NEWS Save up to 91% Power and up to 50% Space with Industry’s Fastest 20-Bit SAR ADC Maxim Integrated’s versatile SAR ADC integrates internal reference buffers and designers now get a wider dynamic range with no trade-off in precision, speed, or power. Engineers can achieve the industry’s highest resolution and fastest sampling rate at the lowest power with the MAX11905, a 20-bit, 1.6Msps successive approximation register (SAR) analog-to-digital converter (ADC) from Maxim Integrated Products, Inc.
Typically, when engineers require high-precision data conversion, they turn to a deltasigma ADC. However, to produce high precision and wide dynamic range, those ADCs must consume at least 100mW of power. In contrast, the MAX11905 SAR ADC consumes only 9mW – a 91% power savings. With this power savings comes very high (20-bit) precision and the fastest sampling (1.6Msps) rate available. The MAX11905 also integrates internal reference buffers, which reduces cost and time to market, and saves up to 50% space compared to competitive discrete solutions. With this versatility, the MAX11905 is ideal for a wide range of applications, including process control, automatic test equipment, medical instrumentation, and battery-powered devices. Key Advantages • High speed: the MAX11905 enables 1.6Msps throughout with no latency and settling time limitation. • High performance: the ADC achieves 98.3dB signal-to-noise ratio (SNR) and -123dB THD*); improves static and dynamic performance; guarantees monotonic function; and provides best-in-class power consumption. • Versatility: the SAR ADC delivers high 20bit resolution with no missing codes, at 1.6Msps of speed, at 9mW of power, enabling flexibility in designs without compromises. • Simplified designs: the MAX11905 integrates internal reference buffers, reducing design time and cost. MAXIM INTEGRATED 4
www.maximintegrated.com
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EMBEDDED SYSTEMS Altera Achieves Industry Milestone: Demonstrates FPGA Technology Based on Intel 14 nm Tri-Gate Process 14 nm FPGA Test Chips Confirms the Performance, Power and Density Advantage Altera Receives Using Industry’s Most Advanced Process Technology Altera Corporation announced the demonstration of its FPGA technology based on Intel’s 14 nm Tri-Gate process. The 14 nm-based FPGA test chips incor-
porate key intellectual property (IP) components – transceivers, mixed-signal IP and digital logic – used in Stratix® 10 FPGAs and SoCs. Altera and Intel collaborated on the development of the industry’s first FPGA-based devices leveraging Intel’s world-class process technology and Altera’s industry-leading programmable logic technology. Altera leverages a comprehensive test chip program to de-risk the rollout of all its next-generation products by validating how Altera IP performs using innovative process improvements and circuit design techniques prior to final product tape out. Through the use of multiple 14nm devices, Altera continues to see very positive results in the high-speed transceiver circuitry, digital logic and hard-IP blocks that will be used in Stratix 10 FPGAs and SoCs. Intel offers a true die shrink with its second-generation 14 nm Tri-Gate process, relative to alternative FinFET technologies. As a result, Altera will
deliver unmatched performance, power, density and cost advantages with its nextgeneration FPGAs and SoCs. Leveraging Intel’s 14 nm Tri-Gate process and an enhanced high-performance core fabric architecture, Stratix 10 FPGAs and SoCs are designed to enable the most advanced, highest performance applications in the communications, military, broadcast and compute and storage markets, while slashing system power. Stratix 10 FPGAs and SoCs deliver 2X the core performance of current highend FPGAs with industry’s first Gigahertz-class FPGA featuring core operating performance up to 1 GHz. For high-performance systems that have the most strict power budgets, Stratix 10 devices allow customers to achieve up to a 70 percent reduction in power consumption. Stratix 10 FPGAs and SoCs also provide the industry’s highest levels of system integration, which include: • The highest density monolithic device with greater than four million logic elements (LEs) • Over 10 TeraFLOPs of single-precision, hardened floating point DSP performance • More than 4X serial transceiver bandwidth compared to previous generation FPGAs, including 28-Gbps backplane capable transceivers and a path to 56 Gbps transceivers • A 3rd-generation high-performance, quad-core 64-bit ARM Cortex-A53 processor system • Multi-die solutions capable of integrating DRAM, SRAM, ASICs, processors and analog components in a single package. ALTERA www.altera.com
Forward Looking Statement This press release contains a forward-looking statement regarding Stratix 10 devices that is made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Investors are cautioned that forward-looking statements involve risks and uncertainty that can cause actual results to differ from those currently anticipated, including without limitation statements regarding product development and availability, the potential risk in introducing a new process node, anticipated performance of future products, Altera’s and third parties’ development technology and manufacturing capabilities as well as other risks discussed in Altera’s Securities and Exchange Commission filings, copies of which are posted on Altera’s website and are otherwise available from the company without charge.
INDUSTRY NEWS
EMBEDDED SYSTEMS
Microsemi Enables OEMs to Expedite Prototyping and Application Development with its Comprehensive New SmartFusion2 SoC FPGA Evaluation Kit Feature-rich, affordable platform enables OEMs to leverage SmartFusion2’s lowest power consumption in its class, high reliability capabilities and best-inclass security to build highly differentiated products with significant time to market advantage. Microsemi Corporation, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, announced the availability of the company’s new leading-edge SmartFusion®2 SoC FPGA Evaluation Kit.
The new SmartFusion2 Evaluation Kit is an easy-to-use, feature-rich, affordable platform designed to enable designers to quickly and easily accelerate evaluation or prototype their application. Utilizing Microsemi’s mainstream SmartFusion2 FPGAs enables original equipment manufacturers (OEMs) to leverage the device’s lowest power consumption in its class, high reliability capabilities and best-inclass security technology to build highly differentiated products that help them gain a significant time to market advantage. A prime example is that the SmartFusion2 Evaluation Kit allows for simplified development of transceiver I/O-based MICROSEMI CORPORATION
Cert-Kit from Embedded Office simplifies development of safety -critical railway applications with C167 microcontroller
FPGA designs necessary in today’s PCI Express (PCIe) and Gigabit Ethernet-based systems. For faster evaluation and prototyping, Microsemi’s leading-edge evaluation board is small form-factor PCIe compliant, which can be used on any desktop PC or laptop
with a PCIe slot. According to market research firm Infonetics, the carrier Ethernet market will grow to approximately $39 billion in 2017. The kit offers a comprehensive set of features that include PCIe, Gigabit Ethernet, full-duplex SERDES SMA pairs, DDR memory, SPI Flash, USB On-The-Go and several expansion interfaces that create the needed flexibility for a wide range of application development. With purchase of the evaluation kit, developers also have access to Microsemi’s full array of industry leading development resources such as reference designs and the ability to launch example application demonstrations.
Embedded Office, a specialist company for embedded systems that specialises in safety-critical applications, has extended the range of its Cert-Kits and is now offering for μC/OS-II a component pre-certified on the 16-bit microcontroller C167 from Infineon, which supports manufacturers of safety-critical systems in the standard-compliant development according to DIN EN50128 SIL-4. The C167 is a proven microcontroller, which is used very frequently in industry. The C167 is typically used in the automotive sector, in medical engineering and in industry, for example in railway applications. By using the real-time kernel μC/OS-II as a pre-certified component, this product facilitates the development of safetycritical applications and considerably reduces the certification process. The Cert-Kit comprises all the elements required for creating an executable application. These include the certified source code, various software manuals such as safety, target integration, user, reference and system manual. The Cert-Kit also contains validation software (including reference board support package) and the TÜV certificate pertaining to the type approval of the pre-certified software component. Upon request, the test environment can also be made available to customers. The Cert-Kit provides flexibility so Embedded Office can adapt the certification of μC/OS-II with minimum effort to other CPUs and development environments. In addition to the standard EN50128, it is also suitable for the development of safetycritical devices according to the standards IEC62304 (med ical sector) and IEC61508 (industrial applications). EMBEDDED OFFICE www.embedded-office.de
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INDUSTRY NEWS Renesas Electronics Europe: TES Electronic Solutions’ Guiliani Graphical User Interface Software Now Supports Renesas’ RZ/A1 Microprocessors (MPU) Renesas Electronics Europe, a premier provider of advanced semiconductor solutions, announced the availability of Guiliani graphical user interface software from TES Electronic Solutions for the RZ/A1 “Renesas Starter Kit” (RSK) development suite. Renesas’ RZ/A1 microprocessor (MPU) has been designed to give an optimal cost / performance balance for Human Machine Interface (HMI) applications. In contrast to a standard microprocessor architecture, the RZ/A1 Group incorporates up to 10MB of embedded SRAM, eliminating the need for external RAM. It can also give a significant performance boost compared with devices needing to run code over an external bus interface. This achieves a high performance and with no external RAM required, system cost and complexity can be reduced dramatically. Of course, hardware requires optimised software too. Supported by TES Electronic Solutions’ Guiliani HMI software, the RZ/A1 provides a complete and very cost-effective solution.
EMBEDDED SYSTEMS Microchip Extends Spotify® Connect Support in New JukeBlox® Platform Release Microchip Technology Inc., announced a new release of Spotify® Connect in the standard Microchip JukeBlox® Platform. This release extends support to more than 8 million audio products based on Microchip’s network audio processors and includes a number of key improvements on the initial release. Audio brands can easily add Spotify Connect to existing products through firmware upgrades and new designs based on all of Microchip’s CX870 Wi-Fi® modules and DM860 Ethernet processor. To speed product and firmware availability to consumers, Microchip’s APT Lab is the first to offer pre-certification services to Microchip customers using Spotify Connect. Spotify Connect does not require the mobile device to continuously stream content to a wireless speaker or AV receiver. The key benefit of Spotify Connect is that once a track has been selected, the audio stream is delivered directly from Spotify’s servers to the wireless speaker using the local network. This frees the mobile device for use during music playback which greatly
tracks. Spotify makes it easier than ever to discover, manage and share music. Spotify Premium users can control and play their music through their phone, tablet and audio devices simply and effortlessly, at the touch of a button. Spotify Connect is available in 28 markets including USA, UK, Sweden, Finland, Norway, Denmark, France, Switzerland, Germany, Austria, Belgium, The Netherlands, Spain, Australia, New Zealand, Ireland, Luxembourg, Italy, Portugal, Singapore, Hong Kong, Malaysia, Poland, Estonia, Latvia, Lithuania, Iceland and Mexico, with more than 24 million active users, and over 6 million paying subscribers. “We are very pleased to be working with Spotify and adding a leading music streaming service,” said Sumit Mitra, vice president of Microchip’s Wireless Products Group. “Microchip’s latest JukeBlox platform release allows audio brands to add Spotify Connect into previously sold audio products with just a firmware upgrade or to new designs based on the DM8xx family of Wi-Fi and Ethernet processors.”
reduces battery depletion and allows the mobile device to move anywhere in the network without interrupting music playback. Audio devices powered by Microchip’s JukeBlox platform, such as wireless speakers, AV receivers, Internet radios, home heatre systems, wireless speakers and portable music player docking stations, will be part of the Spotify Connect experience. Spotify Connect is an awardwinning digital music service that provides on-demand access to more than 20 million
“Spotify is committed to delivering the industry’s best home listening experience with Spotify Connect. Partnering with Microchip, one of the leading providers in the industry, allows us to grow our base of partners even further,” said Sten Garmark, vice president of Spotify’s Platforms. “We’re especially pleased to be able to deliver Connect to devices that are already in consumer’s homes using firmware upgrades.” MICROCHIP TECHNOLOGY www.microchip.com/get/NBWE
Guiliani is a platform independent HMI framework designed to meet todays’ user expectations for smartphone-like HMIs on highly cost-driven embedded systems. Being OS- and CPU-agnostic and without requiring an expensive hardware GPU, it covers a wide range of cost efficient MCUs and MPUs and is an ideal complement to Renesas’ RZ/A series. Guiliani is delivered with a customisable and extensible set of modern widgets and features like carousels, wheels, gauges, drop boxes, animations, transition effects, multilanguage support and skinning. Applying its modern graphics processing features, including sub-pixel accurate rendering, anti-aliasing, scaling, filtering and blending in combination with smart redraw and caching mechanisms, provides an eye-catching and highperformance visual experience. Guiliani’s PC drag and drop editor and simulator support rapid HMI design and prototyping, resulting in fast development cycles. TES ELECTRONIC SOLUTIONS RENESAS ELECTRONICS
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INDUSTRY NEWS
EMBEDDED SYSTEMS
Silicon Labs Delivers Best-in-Class Digital Isolators for Consumer Electronics Market New Si80xx Isolators Outperform Optocouplers for Household Appliance Applications Requiring MultiChannel 1 kV Functional Isolation Silicon Labs introduced a family of digital isolators offering the highest channel count, performance, reliability and data rates for costsensitive consumer electronics applications requiring functional isolation of up to 1 kV. Based on Silicon Labs’ patented CMOSbased digital isolation technology, the new Si80xx family provides a superior alternative to optocouplers for washers, dryers, food mixers, vacuum cleaners and other household appliances, as well as test and measurement equipment requiring functional isolation.
Used for more than 40 years, optocouplers are inherently limited by an antiquated LED-based technology resulting in significant output variations over input current, temperature and age. These variations reduce the operating performance of optocouplers over their lifetime, causing increased design complexity and reduced product reliability. Silicon Labs’ Si80xx digital isolators overcome these limitations through capacitive isolation based on mainstream CMOS process technology. Higher reliability and longer device lifetimes enable manufacturers to support longer product warranties and reduce costs associated with repair or
replacement. Less variability, especially in the input turn-on current, simplifies system design. Developers no longer need to anticipate aging effects when they switch from using optocouplers to Si80xx digital isolators in their product designs. The operating parameters of the Si80xx digital isolators remain stable across wide temperature ranges and throughout their long service life for ease of system design and highly uniform performance in consumer applications. The Si80xx family offers a superi-
or functional isolation solution than other digital isolators for applications that require multiple isolated signal channels. Available in a choice of 3- to 6channel configurations, the Si80xx family is the industry’s widest channel count series of unidirectional isolators supporting up to 1 kV isolation ratings. The Si80xx family’s industryleading isolation channel count also helps simplify timing and isolation challenges in systems with wide digital buses by enabling developers to minimize the number of separate isolators, thereby reducing bill of materials (BOM) cost and board space. SILICON LABS www.silabs.com/isolation
Revealing a New and More Efficient Approach to Mobile Picking Captec, manufacturers of ruggedised industrial computers and mobile devices, have developed a new Mobile Picking Solution targeted to optimise retailers’ order fulfilment requirements. Combining a customisable trolley and totes with a mounted tablet, extended battery and 1D/2D barcode scanner, the MPS-761 is fully integrated and ready for deployment in any order picking or internet fulfilment setting.
A 9.7” tablet with capacitive touchscreen simplifies and improves the order picking process by not only providing a large graphical and intuitive display for ease of use, but also by allowing virtually hands free operation. Enhancing order fulfilment times and maintaining high levels of accuracy empowers businesses with greater cost-effectiveness and reduces wrong orders, thereby providing a better service to their customers. Captec offer this solution fully integrated, taking the costly and time consuming work of testing and assembling the units away from retailers, while also simplifying supply chain management. The trolley itself is fully customisable, ensuring that it is best suited to the unique requirements of where it will be used, allowing it to be designed according to aisle sizes, product requirements and store layouts, as well as any other factors that allow the order fulfilment system to flow smoothly. Captec’s solution ensures that order fulfilment can not only flow effectively, but for prolonged periods of time. With an extended battery allowing up to 26 hours continuous use, the Mobile Picking Solution can be used for a full day and even through the night before needing a charge, especially useful in stores that operate on 24 hour days. Find out more about the MPS-761 Mobile Picking Solution today. Please visit www.captec-group.com/product-category/ mobile-picking-solutions/ CAPTEC www.captec-group.com
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INDUSTRY NEWS
EMBEDDED SYSTEMS
First 8Gb DDR3 components and 16GB unbuffered DIMMs & SO-DIMMs by I'M Intelligent Memory I'M Intelligent Memory, a Hong Kong based fabless DRAM manufacturer, announces availability of the world's first 8 Gigabit (Gb) DDR3 components with a single chip-select, doubling the amount of memory per chip compared to other DDR3 DRAM devices on the market. Based on these new 8Gb components, I'M is also in-troducing the first 16 Gigabyte (GB) DDR3 UDIMM and SO-DIMM memory modules with optional ECC error-correction. The JEDEC specification JESD79-3 has always allowed an 8Gb density for DDR3 memory devices. While most DRAM manufactures are waiting for a 2x nm process to fit such high memory ca-pacity into a single DRAM IC package, I'M has developed it's own a revolutionary way to manufacture 8Gb DDR3 components with single chipselect utilizing existing 30nm manufacturing technologies. The I'M 8Gb components are 100% compatible with the JEDEC standard pinout, timing and row/column/bank addressing, providing the simplest path to higher density DDR3 upgrades. These devices allow for a new level of memory capacity without altering existing board-layouts or designs. Orderable devices include a x8 (1G×8) configuration in FBGA 78 ball package, a x16 (512M×16) type in FBGA 96 ball package as well as a x32 (256Mx32) configuration in 8
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FBGA 136 ball package. In addition, I'M offers DDR3L low-voltage (1.35V) versions of these devices. The products are available in commercial and industrial temperature ranges. Based on their new 8Gb device, I'M releases the very first 16GB DDR3 240 Pin unbuffered DIMMs (UDIMMs) and 204 Pin SO-DIMMs to the market. These new highcapacity memory modules are also available with a 72 Bit width for ECC error correction. The 8Gb components and 16GB modules have been verified to be compatible with processors and microcontrollers from AMD, Cavium, Freescale, Tilera and many others.
market for these new memory products. Notebook, PC and motherboard manufacturers such as HP, Lenovo, Apple, Dell or others may contact their Intel field representative to push and request a change of Intel's POR to support the new memory through future BIOS/ MRC updates. EndCustomer may contact their board-manufacturers customer-support to ask for compatibility of the memories. I'M is also working with Intel to address this gap. ASUS confirmed that it is now possible to upgrade their X79-DELUXE, RAMPAGE IV BLACK EDITION and other ASUS X79 platform motherboards with 8 pieces of IM 16GB DDR3 modules to reach a total of 128GB memory utilizing their newest own BIOS/MRC. Most Intel LGA-2011socket CPUs like Sandybridge E or Ivybridge E can be used on these ASUS X79 motherboards. By offering their own special BIOS and Memory Reference Code to support the new memory on Intel CPU's, ASUS shows their engi-neering-expertise for high-end products. Motherboard manufacturers such as ASRock, Supermicro, AIC, Portwell and others have verified and approved the IM 16GB DDR3 memory modules for many motherboards based on AMD, Tilera, Intel's C2000 'Avoton' series and other processors already.
Intel currently supports 8Gb components and 16GB modules only on their Atom C2000 series (Codename 'Avoton') and Atom E3800 (Baytrail-I) processor series. New BIOS versions for these plat-forms are required to use the memory and are available now. For most standard Intel processors that are used in desktop PC's, laptops or servers, Intel is not yet supporting the new high capacity memories. According to Intel, “it is not POR” (-> Plan Of Record) for them to analyze the possibility to support them, unless they can see a demand from the
The German company Rausch Netzwerktechnik announced their Intel Avoton-based 'Tormenta Megacore Blade-System' to be up-gradable to an impressive 12,800 GB of RAM with Intelligent Memory 16GB ECC SO-DIMMs. With the new I'M Intelligent Memory 8Gb DDR3 chips and high density DDR3 modules, I'M sees potential markets in embedded/industrial, networking and telecommunication applications, as well as PC, laptops, servers and microservers, allowing to reach previously unattainable memory capacities. I'M INTELLIGENT MEMORY www.intelligentmemory.com
INDUSTRY NEWS
EMBEDDED SYSTEMS
Microchip expands XLP low-power PIC® microcontroller portfolio with integrated hardware encryption engine Microchip announces the expansion of its eXtreme Low Power (XLP) PIC® microcontrollers (MCUs) with the PIC24F “GB2” family. This new family features an integrated hardware crypto
put. This is another example of Microchip’s Core Independent Peripherals, which can run with no CPU supervision. Also, a Random Number Generator creates random keys for data
Ericsson embeds dynamic loop compensation and increases current output to 50A in new digital point-of-load regulator The new Ericsson 3E series BMR464-50A is a third-generation digital point-of-load (POL) regulator that features Dynamic Loop Compensation (DLC) and also extends output current up by 25% to 50A from the 40A offered by the BMR464-40A, yet it comes in a fully compatible footprint. The product also features a full set of PMBus commands enabling systems architects to fully monitor and dynamically control the energy delivered to strategic components, such as processors, FPGAs and ASICs, down to a very low and highly economical level.
engine, a Random Number Generator (RNG) and One-TimeProgrammable (OTP) key storage for protecting data in embedded applications. The PIC24F “GB2” devices offer up to 128 KB Flash and 8 KB RAM in small 28- or 44pin packages, for battery-operated or portable applications such as “Internet of Things” (IoT) sensor nodes, access control systems and door locks. Several security features are integrated into the PIC24F “GB2” family, to protect embedded data. The fully featured hardware crypto engine, supporting the AES, DES and 3DES standards, reduces software overhead, lowers power consumption and enables faster through-
encryption, decryption and authentication, to provide a higher level of security. For additional protection, the One-TimeProgrammable (OTP) key storage prevents the encryption key from being read or overwritten. These security features increase the integrity of embedded data without sacrificing power consumption. With XLP technology, the “GB2” family achieves 180 μA/MHz Run currents and 18 nA Sleep currents, for very long battery life in portable applications. For connectivity, the “GB2” family integrates USB for device or host connections, as well as a UART with ISO7816 support, which is helpful for smartcard applications.
Key Facts: • New PIC24F “GB2” MCUs enable secure data transfer and storage in portable embedded applications • On-chip hardware crypto engine, random number generator and one-time-programmable key storage supports enhanced security • eXtreme Low Power (XLP) technology minimises power consumption for longer battery life • Compatible with Microchip’s embedded wireless solutions to enable low-power wireless connectivity for Internet of Things applications MICROCHIP TECHNOLOGY www.microchip.com/get/GNUT
Ericsson / Studio Phos
Embedding the latest Dynamic Loop Compensation technology, the BMR464-50A runs the DLC algorithm as default following the enabling of the output. However, three more settings are also available via the PMBus for systems architects to choose the most appropriate method for the application with the DLC algorithm run every second or every minute or simply disabled. In addition to standard methods, designers can also use the Loop Compensation Tool featured in the latest Ericsson Power Designer software to set their own loop compensation profile to match the requirements of specific applications. Patrick Le Fèvre, Marketing and Communication Director, Ericsson Power Modules, says: “This new module is an extension to the third generation of Ericsson 3E POL regulators, which have rapidly became the reference digital point-of-load modules in the market. Working closely with customers in its development, the BMR464-50A meets the demands of volume markets by offering a higher current output and, very importantly, embedding Dynamic Loop Compensation. While this new module enables additional flexibility and simplicity, it also means that system architects retain the ability to control parameters to match specific applications.” ERICSSON POWER MODULES
www.ericsson.com/powermodules
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DESIGN
EMBEDDED SYSTEMS
The RZ/A as used in an application example The key target market for the RZ/A device is the Human Machine Interface market, for driving medium to large TFT panels. The RZ/A family is an ARM cortex A9 based embedded MPU solution that brings many advantages to the HMI application space. The article will be a discussion of the requirements of such an application space as well as of how the RZ/A meets these requirements and offers system level advantages to the design engineering community. The RZ/A features up to 10MB of embedded SRAM on chip, which makes it the largest embedded RAM in the market and the article will show to make best use of this embedded RAM to optimise both system cost and performance of your HMI system. Author: Robert Kalman,
Product Marketing Manager Industrial Communications Business Group Renesas Electronics Europe GmbH
In June 2013, Renesas released its newest platform. The RZ/A family is aimed firmly at the Human Machine Interface market, for driving medium to large TFT panels. This is a market expanding at an enormous pace. Before Apple took the world by storm, there was the constant dismissive discussion in technical circles about “who would want to have a colour 10
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screen on their telephone?” but we were all proved wrong. Apparently, we all do want a colour screen on our phones. It is not just phones either! The number of coffee machines, refrigerators, vending machines and the likes that are fitted with a TFT panel is set to rise significantly over the next few years. I noticed with excitement that in a number of
shops recently the piece of plastic upon which a receipt is normally placed such that you can sign it, has now been replaced by a 7-inch TFT display showing advertising for products available in the store. The rise of “bathroom advertising” from companies across Europe and the world shows that soon there will really be no escape from the TFT panel.
DESIGN
So what do you need for your application? Let’s start by looking at the heart of the problem. What do you actually need in order to drive a TFT screen? Most TFT pan-
EMBEDDED SYSTEMS
bits and the green by 6 bits (giving 16 bits per pixel). Alternatively, instead of a standard digital interface a screen could be using an LVDS connector, as is increasingly becoming the standard with larger screens.
stored in the desired format. Thus, a screen size of WVGA for example (which is 480 × 800) will need for an RGB888 image just over 1MB of RAM to store the image (480 × 800 × 24 bits = 1.125MB).
Memory use for WVGA screen els today use a digital RGB interface, whether that be RGB888 or RGB565. The RGB value is a standard whereby the colours red, green and blue of each pixel are represented by the corresponding number of bits. So for 888 each is given a full 8 bits of data (giving 24 bits per pixel), whereas in 565 the red and blue are represented by 5
As such, the RGB signals are transferred over a differential signal, but the format of the data is still the same. So to start with, you need a device that supports the generation of an RGB signal and / or an LVDS interface. Second to that, the RGB data has to come from a frame buffer, which is typically stored in RAM. This frame buffer is a bitmap image
In addition to this frame buffer containing the current picture being displayed on the screen, a typical application will have a “back buffer” that contains the next picture to be driven to the screen. This way, the CPU can manipulate the next picture without the user seeing a half-manipulated picture flickering on the screen before the CPU is finished. www.epd-ee.eu | July, 2014
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DESIGN
EMBEDDED SYSTEMS
This system of double buffering is very common and gives an overall higher quality of HMI, but also means that the WVGA screen needs a further 1.125MB of RAM to store the buffer. The RAM story is sadly not finished, however. In a typical HMI application it is not always necessary to manipulate the whole screen. For example, if an icon or button is pressed, it might animate, glow, rotate or somehow react prior to the action being taken.
these different layers with one another, and perhaps apply a level of transparency to some of those pictures. This can be done in software if the CPU is fast enough, or in hardware if it is available. So, to complete the RAM requirements story, a reasonable HMI application can use in the region of 3MB as frame data for a WVGA screen size. If the code is running on RAM too, as is the case with most processors, then a further 0.5MB of code is needed.
transfer of a different image. At the same time as this, the CPU may be manipulating the aforementioned icon, and reading its own code from the RAM. This puts a lot of pressure on the bandwidth of the bus to the RAM. This bus is very often the bottleneck in the application, so a good system of bus architecture is required to mitigate the risk of overloading the bus and of the user seeing some half-finished images, or worse still a non-functional GUI.
RZ/A System Block Diagram In this case, what an HMI designer would do would be to define a different layer of the picture. There would be a background layer that would be unchanged and the icon or button would be a foreground layer, which would then be animated. However, this obviously also needs additional RAM, not a full screen but “some” more. It depends on the size of the image, but with a 200 × 200 pixel button we would need an additional 100k of RAM. What is also required here is the ability to blend all 12
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Thus the starting point for a WVGA screen should be to look for a system with a minimum of 3.5MB of RAM. Of course, the speed of access to the RAM is also very important. As you will have likely just realised, the RAM here is being written to and read from by several different sources concurrently. For example, the front buffer (the original image data) will be read by the IP block to drive the data to the screen. At the same time, the back buffer will be updated by the CPU or by a DMA
Special attention should also be paid to the performance of the CPU. A system delivering 24 frames per second to the screen will need to manipulate and create data (in our example of a WVGA screen) of over 24MB per second. This can be done entirely in software, or in some parts in hardware, but whatever happens the CPU must be fast enough to cover these requirements. As we are now clearly talking about a processor solution, which is likely not going to have any flash memory on chip, the next
DESIGN
requirement is that of a connection to external flash memory. The typical method for today is to use an external parallel NOR flash to store the code and then during boot mode to transfer this code into the RAM to support fast execution. Newer devices, however, support other memory technology to allow system architects to reduce system cost without having the overhead of an “expensive” NOR flash on the PCB. Most of these applications typically do more than just drive a screen. They need to be connected to the rest of the system too. Automotive applications are typically connected to the CAN or MOST bus. Industrial and consumer devices today generally require Ethernet and USB connections. These connections also mean that the most suitable product will have to not only incorporate the hardware IP, but also have sufficient performance to manage their operation and sufficient code space to support their stacks. So how about the RZ/A? The RZ/A family is an ARM Cortex A9 based embedded MPU solution that brings a great many advantages to the HMI application space. The RZ/A features up to 10MB of embedded SRAM on chip, which makes it the largest embedded RAM in the market. There are 3 variations in the family. The RZ/A1H which includes the full 10MB of RAM, the RZ/A1M which has just 5MB of RAM, and the RZ/A1L which includes the lowest 3MB of RAM. So from the discussion above, where we calculated that the HMI application would need approximately 3.5MB of RAM, the RZ/A1M looks ideally suited to meet these
EMBEDDED SYSTEMS
requirements. It is of course possible to find several other solutions on the market that will use external RAM, whether it be DDR or SDRAM, to cover this size of memory but the RZ/A family is the only product that the author is aware of that can offer such a high level of internal RAM. The RZ/A1H gives the system designer room to increase the screen size and also to decrease the screen size depending on requirements, and create a cost-optimised version for smaller resolution products. The 400MHz CPU performance is more than enough to run a simple HMI application and maintain communication through whichever protocol the system dictates, because all versions of the RZ/A family include CAN (up to 5 channels) Ethernet, USB (up to 2 channels) and even support MOST in the automotive qualified versions. In fact, the 400MHz CPU is more than enough due to two unique features of the RZ/A. The first feature is the VDC. The video display controller from Renesas supports in hardware many of the functions required for creating the final screen image. The VDC will support up to 4 different graphics layers, two of which can be inputs from an external camera. It will also support alpha blending hardware. Alpha blending is a process whereby each pixel is allocated an additional 8-bit alpha value. This alpha value determines the transparency of the pixel, such that it can be overlaid on top of another pixel to create the resulting image. The VDC also supports chromakey operation, the most well-known use of which is in “green screen” videography, where a particular colour is defined as transparent so that an object can be overlaid again on another picture. In some systems all of this would be done in software, but the RZ/A does it in hardware, thus the 400MHz in reality equates to a much higher equivalent performance. The VDC also supports the RGB digital connection to a TFT screen as well as the LVDS.
bound to slow down the core. The RZ/A, in contrast, has 5 separate RAM banks. Each bank is connected to its own dedicated 128bit wide bus, such that it is actually possible to both write to the back buffer, read from the front buffer, manipulate an icon and complete a DMA transfer all whilst running code from the internal RAM. This is a significant performance boost. Of course, we mentioned earlier that a connection to external flash memory is also needed, and the RZ/A supports all the normal connections to non-volatile memory such as NOR, NAND, SDIO, MMC etc. However, it also has a special SPI Multi-I/O serial flash connection, which supports the new quad SPI protocol. This QSPI can achieve similar or better performance figures to those of parallel flash while providing the economic advantages of serial flash, as well as saving pins on the microprocessor and reducing PCB size. Simply put: The RZ/A is simple The newly released RZ/A device from Renesas has been specifically designed for the Human Machine Interface market. There are several requirements in this market which are not unique on their own, but their combination makes the market a difficult one to cover with traditional systems. The need for RAM is large, but not so large that a microprocessor with 128MB of DDR3 RAM is required. The performance requirements are low, as long as the device is supported by a welldesigned display controller, but they are not so low that a microcontroller running at, say, 100MHz could cover them. The RZ/A contains just enough connectivity for any HMI application, more than enough performance, and a good amount of RAM allowing for flexibility. It is a cost optimised and dedicated solution that will not only profit from the booming market for display technology but also help drive it forward n www.renesas.com
The second performance factor of the RZ/A family that boosts the CPU performance is the removal of the bus bandwidth problem we saw earlier. A quad-core terahertz processor is only as fast as it can get the data. When that data is all stored in a single RAM block to be accessed over a single bus, this is www.epd-ee.eu | July, 2014
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INDUSTRY NEWS Future Electronics extends ARM Accreditation scheme after success of first wave of ARM Cortex-M training Future Electronics is to extend the scope of its ARM Accreditation Corporate Partnership to include ARM’s microprocessor Accredited Engineer qualification.
In February, Future Electronics announced that it had become an ARM Accreditation Corporate Partner, the first distributor to do so. As part of its partnership agreement with ARM, Future Electronics committed all of its field applications engineers (75 in the EMEA region) to gain the prized ARM Accredited MCU Engineer (AAME) certificate. To gain the AAME certificate, the engineer must cover a broad range of topics laid down in the AAME syllabus, practise the implementation of ARM-based designs and then demonstrate knowledge in an exam independently administered by Prometric. The initial phases of the corporate partnership scheme have produced encouraging results both for Future Electronics and its customers. In particular, the deeper knowledge and understanding of the ARM® Cortex®-M cores which engineers are able to offer have proved extremely popular with Future Electronics’ industrial customers. Few small and medium-sized engineering businesses are able to devote the necessary time and resources to training their design engineers to AAME level, but the Future Electronics training scheme enables them to access specialist ARM core expertise as part of the distributor’s technical support service. In the first phase of the programme, 45 Future Electronics engineers around the world (15 in EMEA) have been trained as ARM Accreditation educators. The company is now to extend the scheme, providing extra training to half of these educators to equip them to take the ARM Accredited Engineer (AAE) examination. FUTURE ELECTRONICS www.FutureElectronics.com 14
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EMBEDDED SYSTEMS XJTAG unveils integrated XJFlash feature XJTAG has unveiled an integrated XJFlash feature for up to 50 times faster flash programming. XJFlash allows engineers to automatically generate customised programming solutions that can overcome the speed limitations generally associated with using boundary scan to program flash
achieved. Previously only available as a consultancy service, the XJFlash module supports a wide range of flash and FGPA configurations, and can now be used as part of an XJDeveloper boundary scan test project by the end user to create a programming solution. The integration comes
memories connected to FPGAs. By creating custom programming designs for each flash/FPGA combination, XJFlash relieves the JTAG chain of unnecessary traffic (usually generated by repetitive functions such as shifting in control, address and data bits). By doing so, programming speeds close to the device’s theoretical maximum can be
alongside XJTAG’s recent release of version 3.2 of its test development system. The innovative approach of the XJFlash module allows it to erase, program and verify any flash memory provided there is access to it from an FPGA on the target board, all within the XJTAG software. XJTAG www.xjtag.com
RUTRONIK EMBEDDED: New SBC from Advantech for IoT and Intelligent Systems Distributor Rutronik offers the new Single Board Computer (SBC) MIO-5271 from Advantech. It comes in a 3.5” MI/O Extension (146x102mm) form factor, based on Intel® 4th generation Core™ i5/Celeron® processors (Mobile U-series
platform). The SBC supports 1600/1333MHz DDR3L, USB 3.0, SATA up to 6Gb/s (600MB/s), Intel® AMT 9.5 Release and has triple independent display capability. With these features, MIO5271 responds to the requirements for greater performance, high network connectivity, and smart manageability of IoT and embedded systems.
The SBC adapts the latest microarchitecture with 64-bit, multi-core processors built on 22nm process technology. It delivers improvements in CPU processing, graphics, security capabilities, and I/O flexibility. With an upgrade to Intel® AVX 2.0, the new SBC shows a big enhancement in integer/matrix-based calculation abilities, with Intel® AES-NI allowing security algorithms to take advantage of hardware acceleration for data encryption and decryption. It allows system integrators to build intelligent systems more easily, with improved performance and reliability. An optimized thermal solution for MIO-5271 makes fanless design possible on this kind of compact, high performance platform. It is a sound choice for medical, automation, military or transportation applications. MIO-5271 also has both iManager and SUSIAccess, developed by Advantech, integrated to monitor and control system operation remotely and effectively. RUTRONIK www.rutronik.com/d293116c.l
INDUSTRY NEWS
EMBEDDED SYSTEMS
Aurocon COMPEC always offers new products PANASONIC ERJP PULSE PROOF RESISTORS The 0805 format high power (0.5W) SMD thick film anti-surge chip resistors have excellent ESD surge characteristics in comparison to standard metal film resistors. Additionally the ERJP6W series is highly reliable, featuring a double-sided metal glaze thick film resistive element, and three layers of electrodes.
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Highly reliable multilayer electrode construction Compatible with all soldering process Applications include telecommunication equipment, automotive industry & video cameras RS COD: 763-4461
HARTING HAN POWER T3 CONNECTOR Han-power®T with 3 × Han®Q 5/0 allows for easy power connection to using existing or new cabling systems. The connector has 5 + E contacts, featuring four power contacts and one earth – one contact is unconnected - all with a 16A current capacity, and the “T” layout enables easy installation or removal.
RS DIGITAL INSPECTION CAMERA This professional inspection camera can takeover 200 stills and record more than 60 seconds of video. View difficult places for a detailed inspection of corrosion, leaks, damage, broken parts, blockages, cables and more.
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Small 5.5mm size Battery saver Internal memory and SD card slot Audio and video output USB port RS COD: 790-3381
ANALOG DEVICES DATA CONVERTERS The award winning AD8232 low cost, single chip heart rate monitor AFE is designed to extract, amplify, and filter small biopotential signals in the presence of noisy conditions, such as those created by motion or remote electrode placement. This design allows for an ultra low power analog-to-digital converter (ADC) or an embedded microcontroller to acquire the output signal easily.
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RS COD: 786-3145 POWERTRAVELLER PORTABLE CHARGERS Discover the wide range of highly efficient, performance-rich portable power products. From the waterproof powermonkey extreme for 5V devices and the iPad, to the mighty powergorilla laptop charger, each product comes with a selection of interchangeable tips for the most popular devices. Range includes:
OSRAM DURIS S8 SERIES MID-POWER LEDS Compact multi-chip LEDs available in 2 different levels of luminous flux (6 or 8 chips). Featuring colour consistency that corresponds with 3-step, 5-step or 7-step McAdam ellipses, the DURIS S 8 LED is binned at a junction temperature of 100°C to reflect real world operating conditions.
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Flexible connection types for power Uses standard Han Q5/0 Inserts IP65 / IP67 Rating RS COD: 787-1751
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Fully integrated single-lead ECG front end Two or three electrode configurations 2-pole adjustable high-pass filter Accepts up to ±300 mV of half-cell potential Fast restore feature improves filter settling
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Powermonkey Powergorilla Minigorilla Solargorilla Solarmonkey
Small Light Emitting Surface (LES) improves optical behaviour in directional lighting High Colour rendering index (CRI): 80 minimum for 3 and 5 step versions Low thermal resistance to enable high operating power Operating temperature range: -40 ... +110°C Small footprint for clustering RS COD: 791-6946
RS COD: 797-4927
Aurocon Compec www.compec.ro www.designspark.com
INDUSTRY NEWS Analog Devices and Renesas Wireless Communications Platform Achieves Wi-SUN Alliance Certification Analog Devices, Inc. and Renesas Electronics Corporation announced that a co-developed wireless communications platform received Echonet Lite Profile Certification from the Wi-SUN Alliance. The certification ensures compliance to Wi-SUN International Wireless Communications Standards adopted for use in energy management applications for the home and used by smart meters and home energy management systems appliances. The Wi-SUN Alliance promotes the adoption of open industry standards and seeks to advance wireless smart utility networks worldwide and related interoperability and compliance certification programs. The sub-GHz wireless communications platform is composed of ADI's ADF7023-J RF IC transceiver and Renesas' RL78/G13 microcontroller (MCU) and communications software. The platform complies with the Wi-SUN for Echonet Lite Profile for PHY layer, MAC layer, network layer (6LoWPAN, IPv6) and security layer (PANA) and is targeted to be a standard reference for certification testing. Developers using this reference platform for today's M2M, smart grid and IoT applications receive the benefits of a standards-compliant design, enabling faster time to market. Get questions answered by ADI engineers on EngineerZone™, ADI's online technical support community:
EMBEDDED SYSTEMS Next Generation Multi-Channel Data Logging System Test sourcing specialist Livingston now stocks Sefram’s latest paperless data recorder. The DAS1600 has a 100MHz bandwidth and offers 18 channel operation as standard, with provision for determining voltage, strain, pressure, temperature and a broad variety of other parameters through utilisation of the series of accompanying measurement boards available. There is considerable scope for operational upgrades, so that new application demands can be met as they arise. This is achieved through employment of an extension chassis, which allows 3 extra slots to be incorporated - resulting in access to 72 analogue channels in total. A 500GByte hard disk is included, delivering an impressive storage capacity of up to 128M words of acquired data. Once the readings have been taken they can be transferred from the recorder to a PC, tablet or other computing platform for further analysis - via its 6 × USB interfaces, the LAN (Ethernet) interface or alternatively through Wi-Fi communication. It has a 15.4-inch, 1280 × 800 pixel resolution, touch-enabled display which provides
engineers with a highly intuitive user interface, thereby facilitating the execution of data collection procedures and subsequent manipulation/examination. The data recorder is supplied with the SeframViewer software for both data transfer and analysis purposes. Virtual Network Computing software can also be sourced, which permits users to remotely control their unit directly from an external computer. Numerous triggering options are offered, as well as a Fast Fourier Transform (FFT) analysis capability. Comprehensive power analysis of single, dual and three phase electrical infrastructure can be undertaken, with fre-
quencies of 50Hz, 60Hz, 400Hz and 1kHz supported. The Sefram DAS1600 is packaged within a compact, streamlined enclosure measuring 298mm × 394mm × 218mm and weighing just 8kg. LIVINGSTON www.livingston.com
https://ez.analog.com/community/energy-metering About the Wi-SUN Alliance:
Hybrid SiC Power Modules from Mitsubishi Electric fo
www.wi-sun.org/ Learn more about ADI's energy innovations and find technical content:
http://energy.analog.com/en/segment/nrg.html As promoter members of the Wi-SUN Alliance, ADI and Renesas are committed to furthering the mission of certifying wireless communications interoperability across a broad spectrum of smart grid devices. WiSUN seeks to enable reliable, cost-effective, low power wireless products based on open global standards, including IEEE802.15.4g. ANALOG DEVICES RENESAS ELECTRONICS
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www.analog.com www.renesas.eu
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Mitsubishi Electric Corporation introduces new hybrid silicon carbide (SiC) power semiconductor modules for high-frequency switching applications. These latest additions to the NFH series of power semiconductor modules enable design engineers to reduce electric power losses by 40%. Featuring SiC Schottky Barrier Diodes (SBD) and Silicon IGBTs, the modules achieve high efficiency,
downsizing and weight reduction in inverters.
The Modules are designed for typical
INDUSTRY NEWS
EMBEDDED SYSTEMS
Plessey expands its distribution network in Europe with CODICO Partnership for Central, East Europe and Italy Plessey announced that it has David Owen, Plessey's Regional entered into a distribution Sales Director, added, “Plessey is agreement with CODICO very pleased to work with a disGmbH, a demand creation distributor that has a wide coverage tributor for electronic compoin the region. CODICO's line card nents, headquartered in complements the Plessey LED Perchtoldsdorf, Austria and with portfolio in the lighting segment offices across Europe. With CODICO, Plessey will be expanding its European network with coverage in Central and East European, Michael LeGoff, CEO of Plessey (left) with Italian and Sven Krumpel, CEO of CODICO (right) Danish market for its GaN-on-Si LED products. and together with its focused Sven Krumpel, President and team that brings considerable CEO of CODICO GmbH, said knowledge of the lighting industry “CODICO is very pleased to and customer base, will accelerate announce this partnership with the time to market for Plessey Plessey. We are convinced that GaN-on-Si LEDs in the region.” the innovative technology of Plessey's MaGIC™ (Manufactured Plessey and CODICO's deep on GaN-on-Si I/C) High knowledge of the market will Brightness LED (HBLED) technolenable both companies to turn on ogy has won numerous awards a bright light within the solid state for its innovation and ability to lighting market. I strongly believe cut the cost of LED lighting by that the GaN-on-Si technology is using standard silicon manufacgoing to be the next revolution in turing techniques. the lighting field and that Plessey PLESSEY and CODICO will be driving it.” www.plesseysemiconductors.com
r High-frequency Switching Applications switching frequencies of more than 20 kHz. The new hybrid SiC power modules are packaged as 2 in 1 configurations with a rating of 1200V and currents of 100A (CMH100DY-24NFH), 150A (CMH150DY-24NFH), 200A (CMH200DU-24NFH), 300A (CMH300DU-24NFH), 400A (CMH400DU-24NFH) or 600A (CMH600DU-24NFH). All module packages are compatible with Mitsubishi Electric’s conventional pure-silicon based power modules. The 100A and 150A modules, which are inte-
grated in a package with a footprint of 48mm × 94mm, offer a reduced internal inductance which is about 30% lower than in the conventional modules. The 200A and 300A modules’ footprint measures 62mm × 108mm, while the 400A and 600A modules require just 80mm × 110mm baseplate size. Typical applications are e. g. uninterruptible power supplies (UPS) and medical device power supplies. MITSUBISHI ELECTRIC http://global.mitsubishielectric.com
MSC adds nanoRISC Processor Module with Freescale i.MX6 MSC Technologies, a business group of Avnet Electronics Marketing EMEA, a business region of Avnet Inc., announces a new nanoRISC embedded processor module which is based on the Freescale i.MX6 System-on-Chip. Different members of the i.MX6 family of ARM Cortex-A9 processors, from single-core to quad-core, will be used for the module resulting in an extremely wide range of usable performance.
The MSC nanoRISC-MX6x module can hold up to 4 Gbytes of DDR3 DRAM, up to 4 GBytes of SLC NAND Flash and optionally up to 64 Gbytes eMMC Flash. A microSD card holder on the module enables the addition of Flash memory cards. The MSC nanoRISC-MX6x module is fully compliant with the nanoRISC specification and provides for popular embedded I/O signals such as Ethernet, USB, CAN, UART, SPI, I2C and I2S audio. The entry-level module nanoRISC-MX6S will use the singlecore processor Freescale i.MX6S clocked at 800MHz for the industrial temperature module or 1GHz for the standardtemperature range. This module version features the lowest power consumption of typically 2.5W. There will be two dual-core versions using the Dual-Lite processor clocked at 800MHz/1GHz and the regular dual-core processor clocked at 800MHz/1.2GHz for industrial/standard temperature, respectively. The quad-core processor clocked at 800MHz/1.2GHz is used for the high-end module consuming typically 4.5W. The new nanoRISC module based on these i.MX6 processors gives designers of target systems the opportunity to achieve different performance and price points by alternatively using the entry-level module or any of the higher-performance products, making use of the total hardware and software compatibility between them. Considering the other nanoRISC modules available from MSC Technologies, system designers now have an extremely wide choice of performance, price and features among the versatile nanoRISC family of embedded “supercomponents”. MSC TECHNOLOGIES
www.msc-technologies.eu
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INDUSTRY NEWS
EMBEDDED SYSTEMS
EM Microelectronic Releases COiN, a Complete Bluetooth® Smart Beacon COiN Offers Longest Lasting, Longest Range, Most Secure & Flexible Bluetooth® Beacon EM Microelectronic introduced the COiN Bluetooth beacon. COiN is a versatile, high performance, low power solution that can be deployed anywhere iBeacon™ technology is used, but which also supports wireless sensor networking and many other applications over Bluetooth® Smart (Bluetooth with a Low Energy Core Configuration) wireless communications. Low Power Due to its unique design, COiN consumes less than 20μA average in a typical application, resulting in more than 18 months’ operation from a single CR2032 battery, which is included in the beacon. COiN also contains a built-in pushbutton switch, thus guaranteeing that your beacons have a full charge when they are deployed. Integrated red and green LEDs provide users with feedback about the device’s operating mode. Just click and stick! Long Range The COiN’s integrated printed circuit antenna not only minimizes cost, but maximizes communication range. At the 0dBm output power setting, EM Microelectronic’s beacons can be detected 75 meters away by an iPhone® 5S, and at maximum output power, that distance extends up to 120 meters. Secure Due to COiN’s optimized circuit architecture, it is completely immune to over-the-air attacks, meaning that a well-placed beacon is very secure. It cannot be “hacked” or modified unless the 20
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perpetrator has complete physical possession of the device. Weatherproof COiN is shipped pre-programmed, complete with a Renata CR2032 battery and a weatherproof plastic enclosure for easy deployment, making it suitable for use at outdoor music festivals, sporting events and arenas, and anywhere a beacon is required to withstand the elements.
the desired use case. Should more extensive firmware modifications be desired, EM offers a complete development kit. The COiN Development Kit includes five (5) COiN beacons, programming board and programming cable and is fully compatible with EM’s line of software development tools for the EM6819; EM’s ultra-low power microcontroller. Using these tools, customers have complete control over the firmware and
Flexible Though COiN is available instock pre-programmed and with a standard housing, the standard COiN hardware and firmware are easily modified to fit most applications. At the most basic level, COiN firmware can easily be modified to change the UUID, MAJOR ID, MINOR ID, output power, and beacon interval. These changes are useful for adapting the beacon for whatever smartphone software application/API is being used, segregating beacon populations and sub-populations, and for optimizing battery lifetime based on
can create their own Bluetooth Smart advertising packets and transmit real-time sensor data such as temperature, light level, battery voltage, or other physical phenomena. The COiN enclosure can be customized to sport any embossed logo desired, making the beacon truly your product. No one will know that you leveraged EM’s decades-long experience and engineering effort and expertise to create your Bluetooth beacon, and we won’t say a word, though enclosure customizations are subject to a minimum purchase volume and tooling charges.
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Not much larger than the CR2032 battery that powers it, COiN can be used almost anywhere. To assist in attaching and deploying COiN, EM offers a suite of accessories. The Key Fob Accessory snaps over COiN for attachment to key rings or for hook or loop-based attachment methods such as zip-ties. The Wall Mount Accessory can be nailed or screwed to a solid surface, and then COiN is snapped into place, completely hiding the Wall Mount. COiN can also be snapped into the Watch Band Accessory and any of a number of wrist bands for wrist-worn applications. “COiN leverages EM’s expertise in ultra-low power wireless and computing as well as our high quality standards and synthesizes them into a high performance, Bluetooth beacon that is ready to deploy out of the box, but flexible enough to be modified for many different applications,” commented Michel Willemin, EM President. “We are already engaged with many companies who are using COiN with their App, API, SDK, or service to improve their performance and lower their overall cost. We believe that the availability of such a flexible, optimized Bluetooth beacon will enable a truly pervasive Internet of Things.” Availability COiN, the COiN Development Kit and the Key Fob, Wall Mount, and Watch Band accessories are available through your local EM salesperson or distributor. EM MICROELECTRONIC www.emmicroelectronic.com
INDUSTRY NEWS
EMBEDDED SYSTEMS
Microchip releases the RN4020 Bluetooth® Smart Module Microchip announces its first Bluetooth® 4.1 Low Energy module. The RN4020 builds on Microchip’s deep Bluetooth Classic experience and carries both worldwide regulatory certifications and is Bluetooth
a microcontroller for basic data collection and communication, such as a beacon or sensor. This standalone operation is facilitated by Microchip’s unique nocompile scripting, which allows module configuration via a simple
Ericsson Power Modules strikes gold with Best Power Product win at Electrons d’Or 2014
Special Interest Group (SIG) certified. The integrated Bluetooth Low Energy (BTLE) stack and onboard support for the common SIG low-energy profiles speeds time to market while ensuring Bluetooth compatibility, eliminating expensive certification costs and reducing development risks. The module is also pre-loaded with the Microchip Low-energy Data Profile (MLDP), which enables designers to easily stream any type of data across the BTLE link. Because the RN4020 is a stackon-board module, it can connect to any microcontroller with a UART interface, including hundreds of PIC® microcontrollers, or it can operate standalone without
ASCII command interface, with no tools or compiling required. Designers of cost-sensitive embedded applications are looking for turnkey solutions that make it easy to add the low power consumption and simplicity of Bluetooth LE connectivity, which enables several years of operation from a single battery and has a large installed base of compliant smartphones, tablets and computers. Example markets that need these low-power wireless command-and-control solutions include home automation and appliances; medical and wearable devices; toys, tags, fobs and remote controls; pulse and proximity sensor-based systems; and even industrial applications.
Key Facts: • Integrates a Bluetooth 4.1 Low Energy (BTLE) stack for use with or without a host MCU • Turnkey solution includes all the hardware, software and certifications for low-power wireless command-and-control connectivity • Simple ASCII command configures stack-on-module for standalone operation • Ensures Bluetooth compatibility whilst eliminating certification costs MICROCHIP TECHNOLOGY www.microchip.com/get/K6QA
Ericsson / Studio Phos
Ericsson has won the Best Power and Energy Conversion Product category of the Electrons d’Or 2014, one of Europe’s most coveted electronics industry awards. The prize was awarded for Ericsson’s BMR463-25A, the company’s third-generation 25A digital point-of-load (POL) regulator that features Dynamic Loop Compensation (DLC). The Electrons d’Or celebrates the very best of innovation in electronics in categories including power, test and measurement, displays, memory processors, microcontrollers, and RF circuits, as well as the most innovative French start-up.
The trophies for the 17th edition of Electrons d'Or were presented at the awards ceremony held on June 18 at the FIEEC (Fédération des industries électriques, électroniques et de communication) in Paris. Ericsson’s BMR463-25A delivers a 25% increase in output current over the previous module yet comes in a fully compatible footprint. Part of the company’s 3E* series of digitally controlled DC/DC converters, the module also embeds the latest DLC technology to improve stability and shorten time-to-market. Patrick Le Fèvre, Marketing and Communication Director, Ericsson Power Modules, commented: “The development of the BMR463-25A results from very close cooperation with systems architects. Winning this prestigious award is yet more evidence that we have a world-class R&D team and employ successful business processes and strategy to deliver new products that deliver better flexibility, simplicity and control parameters to match specific applications.” The BMR463-25A runs the DLC algorithm as default each time the output is enabled. However, three more settings are also available via the PMBus for systems architects to fully monitor and dynamically control the energy delivered to strategic components while reducing costs. ERICSSON POWER MODULES
www.ericsson.com/powermodules
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INDUSTRY NEWS Renesas Electronics Europe Works with ASTC to Produce a Virtual Platform and Fast Linux Porting for a new ASIC Renesas Electronics Europe announced a collaboration with the consulting firm ASTC in which it developed a new ASIC for a consumer electronics customer and was able to provide a full board support package (secure boot, drivers and OS) before the silicon was available. The speed and efficiency of the development and the multinational team collaboration between Renesas and ASTC enabled Renesas to produce the ASIC exceptionally fast, while the customer reduced time to market for its new imaging solution. Next-generation ASIC for imaging Renesas’ next generation ASIC is designed to significantly enhance image quality and video analytics performance by incorporating custom hardware accelerators into a standard ARM Cortex-based ASIC. While Renesas was engaged on the hardware development, ASTC used its VLAB Virtual Platform solution, together with existing ARM toolboxes and models, to create and integrate a virtual platform for the new Renesas ASIC. Due to the pre-silicon availability of the VLAB virtual platform for software development, and its advanced hardware/software debug capabilities, the Linux port only took a few weeks. As a result, ASTC delivered a Linux kernel running on the virtual platform well before the silicon was available. Fast development with no need for hardware ASTC used VLAB with the standard ARM Virtual Platform Toolbox to accelerate the development and integration of the virtual platform for the new Renesas device. The VLAB ARM Toolbox includes the ARM Cortex-A9 ISS models, the ARM PrimeCell Toolbox, and a QuickStart Reference Virtual Platform. The QuickStart Reference Virtual Platform for customization comprises a preintegrated platform with sample kernel and test cases, enabling developers to kick-start development by allowing immediate loading and running of software applications. Linux port in little more than two weeks After assembling the platform for the Renesas device, Renesas took a standard Linux kernel and ported it to this virtual board in just a few weeks, helping the team achieve the goal of having software running long before the hardware is available. Renesas also used this platform to develop the boot code – software that will cause a respin of the ASIC if it is wrong – and test that it was sufficiently robust for the application. RENESAS ELECTRONICS www.renesas.eu 22
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EMBEDDED SYSTEMS Rutronik: Bluetooth 4.1 and Over-the-Air Firmware Upgrade from Nordic Semiconductor for nRF51 Series Distributor Rutronik presents the S110 SoftDevice v7.0, the next major release of Nordic Semiconductor’s Bluetooth® low energy stack for the nRF51822 Bluetooth low energy (BLE) and 2.4GHz proprietary System-on-Chip (SoC) and the nRF51422 ANT™ and ANT/Bluetooth low energy multiprotocol SoCs. It enables simple, secure and reliable field updates of both stack and application and makes it easier to design ULP wireless products. The S110 SoftDevice v7.0 offers a broad range of new features: The Over-The-Air Device Firmware Upgrade (OTA-DFU), together with the nRF51 Series SoC’s flash-based architecture, support a flexibility to firmware upgrades that is not possible on alternative static ROM/OTPbased ULP wireless SoCs. Thus, the nRF51822 and nRF51422 SoC’s stacks and application firmware can be upgraded quickly and easily using the devices’ own wireless link. The OTA-DFU feature allows complete application and protocol stack upgrades and is not limited to partial updates and patching. Concurrent
Peripheral/ Broadcaster roles is another feature of the latest S110 SoftDevice, that allows the nRF51 series SoC to broadcast data whilst in a connected state.
With the new support for concurrent multiprotocol Bluetooth low energy and 2.4GHz RF proprietary operation, Bluetooth low energy operates from the S110 SoftDevice itself while the 2.4GHz proprietary protocol runs from the application space. RUTRONIK www.rutronik.com/877a0fde.l
Intersil Introduces HD-SDI Transmitter and Receiver Enabling Transition from Analog to HD Video over Existing Coax Intersil Corporation announced the TW6872 HD-SDI video transmitter and TW6874 quad HD-SDI receiver with Dirac VC-2 mezzanine compression, an end-toend solution enabling picture perfect, latency free video over extended cable distances. The new devices are designed to conform to the SMPTE standards for SD, HD and 3G serial digital transmission and offer an unprecedented level of integration to enable reduced system costs for video surveillance cameras, industrial cameras, digital video recorders (DVRs) and video mixers and switches. HD-SDI usage in the security and industrial markets has been limited by cable reach and the high cost of cabling infrastructure. The TW6872 triple-rate HD-SDI video transmitter and TW6874 quad HD-SDI video receiver deliver the full benefits of HD quality
without requiring expensive cabling upgrades. Offering robust operation in real-world installations, the TW6872/4 devices use SMPTE VC-2 based Dirac
compression to enable HD video transmission at SD-SDI cable distances of 300+ meters. High quality, picture perfect and latency free video with extended reach is achieved through built-in features in the TW6872/4 devices that leverage both the latest standards and Intersil's innovative circuit architecture. INTERSIL www.intersil.com/tw6872-4
INDUSTRY NEWS
EMBEDDED SYSTEMS
Freescale RF Industrial Portfolio Expands with Introduction of Rugged Plastic Packaged Power Amplifiers Legacy of plastic packaging innovation for wireless infrastructure equipment continues with an industry first for harsh industrial environments Continuing its long track record of RF power technology leadership, Freescale Semiconductor introduces its first plastic packaged devices designed specifically for high ruggedness applications. The new MRFE6VP5150N/GN and MRFE6VP5300N/GN power amplifiers are the industry’s first > 65:1 VSWR rated devices to be housed in over molded plastic packaging. Compared to ceramic RF packages, plastic packaging features superior manufacturability, outstanding thermal impedance and significant cost benefits. By combining the advantages of plastic packaging with the ruggedness traditionally associated with ceramic-housed devices, Freescale has achieved a significant technology milestone for the benefit of its RF power customer base. Industrial environments are notoriously harsh. Devices are
required to not only survive, but perform optimally under varying voltages and operating conditions. With a survivability rating of > 65:1 VSWR with simultaneous over voltage and overdrive, Freescale’s new MRFE6VP5150 and MRFE6VP5300 devices are designed to thrive in these environments while delivering outstanding system reliability and low maintenance costs. Target applications for the new products include FM broadcast, CO2 lasers for medical applications, and VHF and UHF base stations for public safety radio installations. These new RF power LDMOS transistors support wide frequency range utilization – from 1.8 and 600 MHz.
the best noise and dynamic range performance in its class. The new Analog Devices AD9652-310EBZ Dual ADC Evaluation Board, available from Mouser Electronics is required to begin designing with the AD9652 ADC, which targets
Amplicon has recently launched a brand new product section on their website containing industrial grade wired modems and routers. Providing many new additions to the Amplicon portfolio, these modems and routers support a wide range of data transmission technologies from broadband ADSL/VDSL to legacy 56k dial-up.
FREESCALE SEMICONDUCTOR www.freescale.com/RFpower
Mouser First to Stock Analog Devices AD9652 16-bit ADC Evaluation Board with 310MSPS Mouser Electronics, Inc., is the first to stock the AD9652-310EBZ Dual 16-bit analog to digital converter (ADC) Evaluation Board from Analog Devices. The AD9652 ADC captures data at 310MSPS, has a high speed pipelined architecture, and boasts
Amplicon introduce exciting new range of wired modems and routers.
demanding high speed signal sampling applications requiring exceptional dynamic range over a wide frequency range. The AD9652 can sample signals as fast as 465 MHz. Analog signals are first fed to a dual, buffered frontend sample-and-hold circuit. The signal then goes into a pipelined switched-capacitor ADC. This unique architecture combines the accuracy of a pipelined converter, with the stability and performance of a buffered sample-andhold. The AD9652 has digital processing blocks to continuously track and correct any internal errors that occur at any pipeline stage, ensuring continuous performance over various operating conditions. MOUSER ELECTRONICS www.mouser.com
Manufacturers that can be found in the Amplicon portfolio of wired modems and routers include INSYS icom, Digi International and Moxa. Working with quality manufacturers has allowed Amplicon to supplement their ever increasing product range of high quality, high reliability and industrial grade data communication products. Amplicon wired modems and routers product range includes products that are used for applications such as remote access, remote machine diagnosis, predictive maintenance, remote device alarm notification, SCADA applications, remote metering, accessing serial devices and SNMP management. Industrial grade modems and routers differ from their commercial counterparts with various features directed at network reliability and resilience. In the brand new Amplicon Wired Modems and Routers web section you will find products that are designed specifically for challenging environmental conditions with resilience to electromagnetic interference, shock, vibration and extreme ambient temperatures. You will also find some unique redundancy features such as dual SIM card fail-over and even dual integrated modems for a backup WAN connection such as ADSL to 3G fall back. AMPLICON
www.amplicon.com
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INDUSTRY NEWS Pelagicore and Renesas Electronics Europe Collaborate to Bring Ethernet Audio Video Bridging to In-Vehicle Infotainment Renesas Electronics Europe announced a close collaboration with Pelagicore with the goal of bringing innovation to in-vehicle infotainment networks. The combination of Renesas expertise – with its new generation of automotive infotainment Systems-onChip (SoC), the R-Car series, and Pelagicore with its open source solutions for vehicle networking, is designed to enable multimedia systems with efficient Ethernet Audio Video Bridging (EAVB) capabilities. Carmakers are looking for robust, low latency networks with high quality of service for in-vehicle infotainment. Modern infotainment systems consist of entertainment features like radio receivers, amplifiers and media players, which can all integrate multiple connected sources. These robust systems need an efficient and high-bandwidth automotive network to ensure the quality that consumers expect in high-end, automotive environments. Automotive networks are a challenging network environment and modern Ethernet AVB is designed to address that environment with very high quality of service (QoS). These networks often carry data from navigation systems and multiple camera views of the surrounding environment directly to passengers and drivers. Ethernet is a popular solution for in-vehicle networking due to its popularity in consumer and industrial markets, its costeffectiveness, and available software. Using the R-Car H2 E-AVB HW support, Pelagicore has developed an open source implementation of EAVB that demonstrates an infotainment use case using the Ethernet AVB network. This work is directly related to the AVB project started by Pelagicore in the GENIVI consortium in order to produce an automotive Ethernet AVB Reference Software Stack to be made available to all GENIVI members as open source. The Renesas R-Car H2 SoC platform has been chosen because of its special E-AVB support in the MAC, which provides the necessary level of performance and precision for in-vehicle audio and video applications. Pelagicore and Renesas consider this proof of concept as the first step of their cooperation and plan to work together to bring more innovation in the future for invehicle infotainment networks. RENESAS ELECTRONICS www.renesas.eu 24
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EMBEDDED SYSTEMS Freescale extends RF technology leadership with secondgeneration Airfast power amplifier solutions RF power industry leader Freescale Semiconductor is introducing its second generation of Airfast™ RF power solutions, delivering a new level of performance for advanced wireless infrastructure equipment, including GSM/UMTS, CDMA/WCDMA, LTE, and TD-LTE applications. Freescale’s newest Airfast family of RF power solutions builds on the success and proven performance of the previous generation, which was comprised of 28V discrete, single-stage power amplifiers. Leveraging and enhancing first-generation Airfast circuitry, die, matching network and packaging technologies, Freescale has reached another industry milestone with the next generation of Airfast technology, which includes the first production RF power LDMOS parts to achieve 50 percent efficiency in a Doherty configuration. Additionally, second-generation Airfast power amplifiers expand the portfolio’s breadth to include two-stage integrated circuits, incorporating multiple gain stages in a single package; as well as adding new offerings based on gallium nitride (GaN) and 48V LDMOS process technology. Product Details The initial second-generation Airfast products include: • A2T07H310-24S – 300W asymmetrical Doherty transistor for wireless infrastructure applications in the 720-960 MHz frequency band. In a Doherty configuration, this device breaks the 50 percent efficiency barrier at 8dB back-off
with 55dBm peak power and 18.9dB gain in a NI-1230S-4L2L package. • A2T07D160W04S – 160W dualpath transistor for wireless infrastructure applications in the 728-960MHz frequency band. In Doherty configuration, this device has 51 percent efficiency at 7dB output back-off with 52.5dBm peak power and over 21.5dB of gain in a NI780S-4L package. • A2T26H160-24S – 160W RF asymmetrical Doherty transistor for wireless infrastructure applications in the 24962690MHz frequency band. In a Doherty configuration, this device has 47 percent efficiency at 8dB back-off with 52.5dBm peak power and 15.7dB gain in a NI780S-4L2L package. • A2I25D012N – 12W RF integrated circuit for wireless infrastructure applications in the 2300-2690MHz frequency band. In Doherty configuration, this device has 41 percent efficiency at 8dB output back-off with 43.5dBm peak power and 29dB gain in a new TO270WB-15 plastic package. • A2I22D050N – 50W RF integrated circuit for wireless infrastructure applications in the 2000-2200MHz frequency band. In Doherty configuration, this device has 42 percent efficiency at 8 dB output back-off with 49dBm peak power and 28dB gain in a new TO-270WB-15 plastic package.
FREESCALE SEMICONDUCTOR www.freescale.com/RFpower
IAR enhances Renesas’ R-IN32M3 development platform IAR Systems® announces that its worldleading development tools for ARM enhances and extends the R-IN32M3 platform for industrial Ethernet protocols from Renesas Electronics, a premium supplier of advanced semiconductor solutions. The R-IN32M3 is tailored for industrial networking applications. It significantly improves industrial Ethernet network performance with optimized hardware accelerators, while reducing costs by supporting multiple protocols such as EtherCAT®, EtherNet/IP®, PROFINET®, CANopen® and more, from a single device. It can be used for real-time network communication in gateways, I/O controllers, PLCs/PACs, embedded controllers,
industrial drives and countless other networked applications. Its design flexibility allows one system design to serve a diversity of networks and applications. To ease development and evaluation of RIN32M3, IAR Systems has launched its starter kit IAR KickStart Kit™ for R-IN32M3 which includes IAR Embedded Workbench® for ARM. IAR Embedded Workbench for ARM is a complete and high-performance development toolchain including the highly-optimizing IAR C/C++ Compiler™ and the feature-rich CSPY® Debugger in a user-friendly integrated development environment. IAR SYSTEMS www.iar.com/renesas/R-IN32M3
INDUSTRY NEWS
EMBEDDED SYSTEMS
Easy to use, secure and reliable ADSL routers from Amplicon Amplicon have introduced the INSYS MoRoS ADSL to their portfolio of industrial grade wired modems and routers. The MoRoS ADSL provides industrial devices with internet access over phone lines and enables data rates of up to 25Mbps. The MoRoS name stands for Modem, Router and Switch. Its name represents its functionality by combining the features of an ADSL/ADSL2/ADSL2+ modem, secure router and 4port Ethernet switch, all built into one box for maximum flexibility. The MoRoS ADSL has been designed for reliability in demanding applications such as transport, factory automation, building management and security systems. Reliability is achieved through German engineering using the highest quality components, extensive electromagnetic compatibility and low voltage directive testing, IP40
hardened enclosure and a -20°C to +55 °C wide operating temperature range. The MoRoS ADSL’s enclosure has been designed for easy integration into cabinets and other industrial environments with secure DIN rail mounting, 10 to 60 Volt DC power inputs via screw terminals and a robust, compact design. To aid engineers to configure the device, the MoRoS has a built in web GUI that is extremely easy to
The Freescale FRDM FXS 9AXIS Freedom Development Platform available from Mouser Electronics
Altera Corporation changed the game as it relates to floatingpoint DSP performance in an FPGA. Altera is the first programmable logic company to integrate hardened IEEE 754-compliant, floating-point operators in an FPGA, delivering unparalleled levels of DSP performance, designer productivity and logic efficiency. The hardened floating point DSP blocks are integrated in Altera’s 20 nm Arria 10 FPGAs and SoCs – currently shipping – as well as 14 nm Stratix 10 FPGAs and SoCs. Integrated hardened floating-point DSP blocks, combined with an advanced high-level tool flow, enable customers to use Altera’s FPGAs and SoCs to address an expanding range of computationally intensive applications, such as high-performance computing (HPC), radar, scientific and medical imaging.
use and navigate, all of the options are clearly explained, supporting those who are not so familiar with the intricacies of IT equipment. AMPLICON www.amplicon.com
Free your Sensors with the Freescale 9-Axis Freedom Development Platform from Mouser Mouser is now shipping the Freescale® Freedom Development Platform for Xtrinsic Sensors. This small Arduino compatible Freedom development board from Freescale Semiconductor is a cost-effective platform for evaluating Freescale's digital gyroscope, accelerometer, magnetometer, and position sensors.
Altera Changes the Game for Floating Point DSP in FPGAs
allows developers to program and evaluate two of Freescale's advanced digital sensor chips. The first is the FXAS21000 XTRINSIC 3 Axis Gyroscope, a small, low power digital gyroscope that measures yaw, pitch, and roll angular rates. The board also supports the powerful FXOS8700CQ 6-Axis digital sensor which combines the functions of a 3 axis 14 bit accelerometer and a 3 axis 16 bit magnetometer on a single chip. Both sensors provide I2C and SPI interfaces. These chips can be used in a number of applications including an electronic compass for mobile devices, smartphones, virtual reality games and personal navigation devices. MOUSER www.mouser.com
The hardened single-precision floating point DSP blocks included in Arria 10 and Stratix 10 devices are based on Altera’s innovative variable precision DSP architecture. Unlike traditional approaches that implement floating point by using fixed point multipliers and FPGA logic, Altera’s resource efficient, hardened floating point DSP blocks eliminate nearly all the logic usage required for existing FPGA floating-point computations. This game-changing technology enables Altera to deliver up to 1.5 TeraFLOPs (floating point operations per second) DSP performance in Arria 10 devices and up to 10 TeraFLOPs DSP performance in Stratix 10 devices. DSP designers are able to choose either fixed or floating-point modes and the floating point blocks are backwards compatible with existing designs. FPGAs Deliver the Highest Performance-per-Watt FPGAs feature a finegrained, highly pipelined architecture that make them ideally suited for use as high-performance compute accelerators. The inclusion of hardened floating-point DSP blocks enable customers to use Altera FPGAs to address the world’s most complex HPC problems in big data analytics, seismic modeling for oil and gas industries and financial simulations. ALTERA
www.altera.com
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DESIGN
SENSORS
Contrinex presents a world first: M12 size, full-metal sensors with an extremely long operating distance of 15 mm No fewer than four new, full-metal versions (PNP, NPN, NO, NC) in size M12 offer the unique benefit of a 15 mm operating distance. In this way, Contrinex adds an innovative technology to its Full Inox Extreme range as a solution for customers who need robust sensors with maximum operating distances. Equipped for the most extreme conditions thanks to their one-piece stainless steel housing (V2A/AISI 304) and hermetically sealed cable exit, the new Contrinex Extreme sensors with a particularly long operating distance of 15 mm resist aggressive chemicals and are waterproof up to 80 bar. The operating temperature range is between -25°C and +70°C (-13°F and +158°F). The devices feature factor 1 on both
ferromagnetic and non-ferromagnetic materials and are suitable for the most demanding applications. Sensors from the Extreme range are equipped with a high-quality Contrinex ASIC. This offers guaranteed switching distances, highest repeatability and optimum temperature compensation. Even when used in extreme environments, it will ensure prolonged sensor life expectancy. An IO-Link interface, integrated at no
A world first with 15 mm operating distance: Contrinex presents four new M12 size, full-metal sensors in PNP, NPN, NO and NC versions 26
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extra charge, offers possibilities that include advanced diagnostic information for easy error localization, to help minimize downtime. Inductive full-metal sensors from the Contrinex Full Inox Extreme range (series 700) with increased operating distance have proved highly effective worldwide wherever harsh environments exclude the use of sensors with a plastic sensing face - whether in the automotive and machine building industries, or in mobile equipment and packaging machines.
• Tel. +40 256-201346 • office@oboyle.ro • www.oboyle.ro
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AUTOMATION Omron launches its most accurate pressure sensor A new highly accurate absolute pressure sensor from Omron Electronic Components Europe can detect height differences of as little as 50cm. Based on Omron’s MEMs technology, the tiny sensor module can measure altitude, atmospheric pressure or water depth in wearable electronics, activity monitors, industrial and marine instruments and mobile phones and cameras. The new Omron 2SMPB-01-01 absolute pressure sensor is the company’s most accurate ever pressure sensor, providing readings relative to a perfect vacuum to ± 6Pa. The module is
just 3.8mm × 3.8mm × 1 mm maximum, small enough to integrate into portable instruments. It provides an I2C output for
easy integration into digital electronics. The sensor uses piezo resistance in a full bridge circuit to
The highly accurate absolute pressure sensor from Omron Electronic Components can detect height differences of as little as 50cm. Source: Omron Electronic Components.
detect pressure, and is fully temperature compensated giving an absolute temperature accuracy of ±2°C. The 2SMPB01-01 offers the benefit of low power consumption of just 9 μA typical, further simplifying its integration into portable and other battery powered electronic systems. The 2SMPB-01-01 can operate in three different power modes: standard, high accuracy and low power mode. Product is packaged in 8 pin QFN structure with surface mounting terminals. OMRON http://components.omron.eu
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PRODUCT NEWS
Lighting Solutions / Display
MSC Technologies Announces High-Quality 39.5cm (15.6”) LC Outdoor Display from NLT
Aito’s UX Design Studio streamlines touch panel development
MSC Technologies, an Avnet Inc. company, announced the availability of the wide-format TFT LCD module (NL13676BC2503F) from NLT Technologies, Ltd. The new product’s key fea-
Aito BV, the leader in software enhanced piezo (SEP) touch control technology, revealed its UX Design Studio development tool to streamline the creation of “user experience” (UX) designs for physical user interfaces based on SEP touch technology. This software suite is targeted at both product designers, concerned with the operation and response of touch controls, and the embedded hardware and software engineers who will implement the design. UX Design Studio is an essential tool that, when used in conjunction with Aito’s evaluation boards and the Arduino host platform, dramatically eases the adoption of touch controls by allowing the rapid evaluation of design concepts and the validation of ideas without needing to prototype early designs or have any detailed knowledge of the underlying technology. Later in
tures include typical brightness of 1100 cd/m², a contrast ratio of 900:1 and a wide operating temperature range of -20°C to +70°C. These characteristics make it ideal for use in industrial applications, particularly outdoors. Images and text are easy to view and read on the NL13676BC25-03F. Even in unfavourable lighting conditions, the display’s optical qualities are
significantly better than average. The display diagonal is 39.5cm (15.6”) and features a resolution of 1366 × 768 pixels on a display area of 344.2mm (H) ×193.5mm (V). Its external dimensions
measure 363.8mm (W) × 215.9mm (H) × 12.65mm (D). This makes the NL13676BC2503F the largest display in the NLT High Bright product range. It is especially suited to applications requiring a multifunction display to show various types of information and data simultaneously on a single display. MSC TECHNOLOGIES www.msc-technologies.eu
the development cycle, Design Studio provides a comprehensive capability for easily configuring the touch interface by adjusting the touch sensitivity and pro-
viding various tactile, audible and visual feedback signals. With an intuitive GUI, Aito’s Design Studio software provides an easy access interface that allows developers to create code that can either be uploaded directly to the Arduino Nano platform, included with Aito’s evaluation kits, or used by the customer’s embedded software engineers to quickly create device drivers for their own host processor, using Aito’s Arduino Library. AITO www.aitochip.com
Everlight Electronics showcases new Argus LED for automotive headlights
Molex’s Lite-Trap™ SMT wire-to-board connectors available through TTI, Inc.
Everlight Electronics announces the high-performance Argus Series for automotive headlight applications. Argus meets the demands and technical criteria of the highest quality in the market particularly for the high temperature and harsh environment in the headlight assemblies. Low thermal resistance and high heat dissipation rate with outstanding cost/performance ratio Everlight’s high-power Argus series of LED headlight modules feature low thermal resistance and a high heat dissipation rate. The overall package size is reduced to allow flexible space for the component manufacturers to design their headlight products. During the car LED
Ideal for thin LED lighting-module applications, Molex’s LiteTrap™ SMT wire-to-board connectors can now be ordered from TTI, Inc., the world’s leading specialist distributor of passive, connector, electromechanical and discrete components. The components offer a low profile, easy wire removal, as well as low wire insertion and high wire retention forces. With a low profile height of just 4.20mm, the LiteTrap connectors offer the lowest profile available of similar wire-removable types. Other lower-profile versions are available in the market, but these are permanent one-time connection types that do not allow wire removal.
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design stage, Everlight works with several leading car lighting manufacturers for the demands and concepts of car LED products in the product design.
From heat dissipation to optical design, EVERLIGHT has developed double-chip, 4-chip, 5chip and 6-chip designs based on top-notch cooperation of optical and heat dissipating technologies. EVERLIGHT www.EVERLIGHT.com
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The termination method of the Lite-Trap connector system is similar to Molex’s Wire-Trap connectors, and also to certain competitive “Poke-In” style versions. A stripped wire is inserted into the connector and pushes open a gate-style termi-
nal that “traps” the wire. To unmate, a button-style lever on the housing top is pushed down to allow the wire to be disengaged. TTI, INC. www.ttieurope.com
PRODUCT NEWS
SENSORS
Sensirion’s liquid flow sensor flies into space On May 6, a rocket lifted off findings. Sensirion stands for bound for the International innovation. Existing and new Space Station (ISS). On board products from Sensirion continwas a liquid flow sensor from ue to set standards and show Sensirion AG, Stäfa, Switzerland. that in the measurement of temThe sensor is part of a research perature, humidity, gas and liqproject by Minnehaha uid flows using sensors, Academy in Minnesota that is Sensirion’s expertise and innovainvestigating the impact of microgravity on the Image source: fotalia effectiveness of liquid flow. Among other potential findings, the project has aimed to shed light on the effects of weightlessness on the circulatory system. The LS16 liquid flow sensor from Sensirion on board the ISS has measured the flow of demineralized water generated by a piezoelectric tive drive have made it number pump in zero gravity, and com- one worldwide. The research pared the results with those of a team at Minnehaha Academy control experiment on earth. was delighted to have Sensirion’s Numerous applications in fluid support: “Sensirion has been a dynamics, physics, biology and champion of companies to have hemodynamics (the forces as a partner to make this studentinvolved in the circulation of designed project a reality.” blood) will benefit from these SENSIRION www.sensirion.com
Get Sensitive with Honeywell's Nanopower Magnetoresistive Sensor ICs Available from Mouser Mouser Electronics, Inc. is now shipping the new Magnetoresistive Sensor ICs from Honeywell. These miniature sensors are capable of detecting weak magnetic fields regardless of polarity. These sensor ICs are part of Honeywell's Nanopower Series and consume very little power. The new Honeywell Nanopower Series of Magnetoresistive Sensor ICs, available from Mouser Electronics, are sensitive enough to detect magnetic fields as weak as 7Gauss while drawing only 360nA with a 1.8V supply voltage. This makes these sensor ICs the highest sensitivity and lowest power sensors in their class. Pinout for these 3pin sensors are power, ground, and output. The supply voltage is flexible and can handle from
1.65VDC to 5.5VDC. In the presence of a magnetic field that trips the sensor, the output pin is
near the supply voltage. In the absence of a magnetic field, the output pin is close to ground. The push-pull output stage does not require an external pull-up resistor. These Magnetoresistive Sensors are available in the SOT 23 subminiature surface mount package and are only 1.6×2.9 mm in size. MOUSER ELECTRONICS www.mouser.com
Visionary Retail Technology Empowered by Zytronic Touch Sensors Opticians store wows customers with mirrored point of sale system that encourages online social interaction Zytronic has built up a strong, widely recognized brand - producing highly responsive, accurate and durable touch sensors of sizeable proportions. Through the success of these sensors, based on its patented Projective Capacitive Technology (PCT™), the company now boasts an expansive client base, as well as a series of high profile industry awards. Furthermore, the array of end applications its products have been specified for is growing constantly.
their friends and family can look at the chosen frames and give their opinions. In addition to the Zytronic PCT sensor, the system consists of an ultra-thin LCD digital signage monitor, supplied by Display Technology, with high brightness output, 1920×1080 pixel resolution and wide viewing angle. Moreover, the Logitech HD Pro C920 web camera provides high resolution photos and video that can be stored on the host PC, then manipulated
One area of increasing interest is putting touchscreen functionality into reflective surfaces. This is seeing significant uptake in both domestic and retail sectors. Through its integration partner Display Technology, Zytronic’s proprietary sensing technology has been involved in a recent deployment of this kind, carried out for fashionable high street optician Kite GB. The trailblazing, touch-enabled point of sale unit located at Kite’s flagship store in London’s East End, utilizes a PCT touch sensor with a 42-inch active area, sourced from Zytronic. The sensor has been applied to mirror-finished toughened glass and is capable of supporting up to 40-point multi-touch operation. Via the unit, customers are able to take photos of themselves wearing different frames, then post them on Twitter, Facebook, Instagram and other social media platforms - so that
and subsequently uploaded. The customized software facilitates social interaction and the sharing of content with others. Zytronic’s PCT touch sensors rely on a matrix of 10μm thick copper capacitors, in an XY configuration, embedded inside a laminated substrate. This protects the sensor matrix from sources of damage, such as scratches, impacts, extreme temperatures and exposure to harsh chemicals that often compromise the lifespan of touch sensors based on resistive and surface capacitive technologies. Likewise, in contrast to infrared (IR), optical and surface acoustic wave (SAW) technologies, PCT negates the need for a bezel in which to accommodate sensors/emitters, so that sleek, attractive, smoothfronted designs can be realized. This is particularly in keeping with the aesthetic demands of the Kite project. ZYTRONIC www.zytronic.co.u
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PRODUCT NEWS
ACTIVE COMPONENTS
X-REL Semiconductor extends XTR2N0x MOSFET transistors family X-REL Semiconductor, the specialist in highreliability and extreme-temperature integrated circuits, has broadened its XTR2N family of high-temperature MOSFET transis-
The small signal transistors released are the XTR2N0307 30V P-channel MOSFET, and the XTR2N0807 80V N-channel MOSFET. The XTR2N0307 small signal 30V P-channel
tors by introducing two new mid-power Pchannel and two small-signal P- and N-channel transistors. Intended for high-reliability, extreme temperature and extended lifetime applications such as power conversion, power management, level translation and sensor interfaces, the new devices provide excellent switching and linear characteristics, as well as very low leakage current. The mid-power P-channel transistors introduced are divided into two families depending upon the maximum operating voltage. Devices XTR2N0325 and XTR2N0350 are intended for a maximum operation drain-source voltage of -30V, whereas XTR2N0525 and XTR2N0550 can sustain drain-source voltages of up to -50V. In each sub-family, two different transistor sizes, “25” and “50”, are available providing two possible maximum drain currents.
has an on-state resistance at 230°C of 7Ω, whereas that of the XTR2N0807 small signal 80V N-channel is 9.1Ω, with respective continuous drain currents of 350mA (900mA peak) and 200mA (450mA peak). As with all other X-REL Semiconductor prod-
above the -60°C to +230°C (5 years at +230°C) temperature range. Being operational at high temperatures is mandatory not only in applications where the environment is at elevated temperature, but also where selfheating of a power device makes the temperature increase inside the application casing. Additionally, all X-REL Semiconductor products can be used in applications running at lower temperatures (e.g. from 100°C to 200°C) where extended lifetime is expected or where failing is not an option. For example, the expected lifetime of X-REL Semiconductor parts in a driver application operating at Tj=150°C is over 35 years. The XTR2N devices are already available and can be immediately deployed on niche as well as on large-scale markets in high-reliability compact hermetic or plastic packages, as well as tested bare dies. A table of performance characteristics can be found here:
ucts, parts from the XTR2N transistors family are able to reliably operate well below and
X-REL SEMICONDUCTOR www.x-relsemi.com
IR Expands Portfolio of 60V StrongIRFET™ MOSFETs for Industrial Applications International Rectifier has expanded its portfolio of 60V StrongIRFET™ power MOSFETs available in various standard and performance power packages. The new MOSFETs, which feature ultra-low on-state resistance (Rds(on)), are designed for a wide range of industrial applications including power tools, Light Electric Vehicle (LEV) inverters, DC motor drives, Li-Ion battery pack protection, and Switched Mode Power Supply (SMPS) secondary-side synchronous rectification. Available in through-hole and surface mount packages, the expanded 60V StrongIRFET™ family includes the IRF7580M. Housed in a low profile, ultra30
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compact Medium Can (ME) DirectFET® package that delivers high current density while reducing overall system size and cost,
the IRF7580M is well suited for space constrained high power industrial designs. The family of 19 60V StrongIRFET™ power MOSFETs offers ultra-low on-state resistance (Rds(on)) for improved performance in low frequency applications, very high-current carrying capability, soft body diode, and 3V typical threshold voltage to improve noise immunity. Each device in the family is 100% avalanche tested at industry highest avalanche current levels to ensure the most robust solution for demanding industrial applications. INTERNATIONAL RECTIFIER www.irf.com
PRODUCT NEWS
ACTIVE COMPONENTS
Ultra compact light and low power SMD piezoelectric sounder Murata announced they have commenced mass production of, what they believe, to be the smallest and lightest surface mount piezoelectric sounder available. Occupying significantly less surface area, and with a combined weight and area reduction of 44% compared to previous Murata products, the PKMCS0909E4000-R1 measures just 9 × 9 × 1.7mm and weighs only 160mg. Sound pressure level output, measured 10 cm from sounder, is better than 65dB when driven with a ±1.5V 4kHz square wave. Maximum peakto-peak voltage is ±12.5V. Power consumption is typically 0.6mW, which helps preserve battery life in power
budget constrained consumer electronic devices. Since the sounder does not use any magnets or coils to create sound it doesn’t generate any electrical noise and therefore has minimum impact on surrounding circuitry. Typical applications for the PKMCS0909E4000-R1 include blood glucose meters, personal
thermometers, camera strobe flash and Bluetooth dongles. MURATA www.murata.eu
Intersil Announces First Single-Chip Multiple Channel Video Decoder for Around-View Automotive Applications Intersil Corporation announced the TW9966 four-channel analog video decoder with a built-in analog video encoder for aroundview automotive applications. Based on Intersil's market leading multi-channel video surveillance technology, the TW9966 features four analog video decoders and an analog video encoder integrated into a single chip, replacing up to five discrete components to simplify design and save board space. The TW9966 video decoder and encoder is optimized for automotive applications, offering the industry's best analog decoding performance resulting in excellent picture quality for generating 360-degree surround images for drivers. To increase
driver safety and reduce damage to vehicles, many leading automotive original equipment manufacturers (OEMs) are providing around-view technology as an option in their latest models. An around-view monitor, also referred to as a surround view
monitor, processes video from four cameras and then combines the four images into a single birdseye view as if a camera was stationed directly above the vehicle. INTERSIL www.intersil.com
Ultra compact 15 Watt AC-DC power supply targets medical applications XP Power announced the EML15 series of 15 Watt single output AC-DC power supplies suitable for use in medical equipment. Complying with 3rd edition EN60601-1, ES60601-1, CSA-C22.2 No. 60601-1, IEC60601-1 medical safety standards, this extremely compact power supply is believed to be the smallest device at this power rating available in the industry. The supply provides two means of patient protection (MOPP) between primary and secondary. Measuring just 62.0 × 30.7 × 24.4 mm (2.44 × 1.21 × 0.95 inches) for the openframe pcb mount version, the EML15 occupies very little board space and also offers a very high power density for this type of supply of 5.3 Watts per cubic inch. With its Class II construction no earth connection is required, this being ideal where a reliable ground connection may not be available. Eight single output models are available in the common nominal output voltages from +3.3 to + 48 VDC. A peak load capability allows the EML15 to provide 130% of rated output power in order to accommodate short-term high power loads. This approach allows designers to avoid having to specify a higher rated power supply and saves both extra cost and board space. In addition to an open frame PCB mounting format other optional mounting packages are available, these include open frame chassis mount with connectors, and encapsulated models with either PCB mounting or screw terminals. A DIN rail mounting clip is also available for use with the encapsulated screw terminal package option. The EML15 series is convection cooled and able to operate in most environments with a wide temperature range of – 25 degrees C to +70 degrees C. Derating is applied above +50 degrees C. No forced air flow or additional heat sinking is required. The series meets the limits for Class B conducted and radiated EMC specifications of EN55022 without the need for any additional external filtering components. The EML15 is available from Farnell, element14, approved regional distributors, or direct from XP Power and come with a 3 year warranty. XP POWER
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PRODUCT NEWS
ACTIVE COMPONENTS
Avago Technologies Introduces New Family of Optocouplers in 14.2mm Wide Creepage and Clearance for High Voltage Applications Avago Technologies announced a new family of 14.2mm optocoupler devices, the ACNT-Hxxx, designed for high voltage appli-
cations. The ACNT-Hxxx family consists of three major product series: the ACNT-H3xx, high efficiency gate drive optocouplers for driving IGBTs; the ACNTH6xL, low power 10MBd digital optocouplers for system control and data communications; and the ACNT-H79x, high linearity isolation amplifiers for current and voltage sensing applications. Features and Benefits: • Safety Approvals for CSA, UL and IEC - IEC/EN/DIN EN 60747-5-5:
VIORM = 2,262 Vpeak - UL1577: VISO = 7,500 Vrms - Robust, reliable and fail safe reinforced insulation • 14.2mm Creepage and Clearance - Industry’s highest insulation voltage in compact 14.2mm SSO-8 package - Meets stringent system and equipment regulatory requirements • High Gate Driving Current and Noise Immunity (ACNT-H3xx) - Minimum 2A output current for driving IGBT - Minimum 40kV/µs CMR at VCM = 1.5 kV minimizing erroneous signals in driving IGBT in noisy environment • Low Power Consumption (ACNT-H6xL) - Less than 20 mW - Industry’s lowest power 10MBd optocoupler in compact 14.2mm SSO-8 package • Excellent Linearity and Gain Accuracy (ACNT-H79x) - Advanced sigma-delta A/D modulation technology with full differential isolation - 0.05% linearity and -50ppm/°C gain drift for enhanced accuracy. AVAGO TECHNOLOGIES www.avagotech.com
Murata’s MLCC with interposer substrate reduces acoustic “squealing” noise Murata announced the ZRB series of monolithic ceramic capacitors (MLCC) packaged on an interposer substrate designed specifically to reduce acoustic “squealing” noise typically induced by mechanical vibration of the capacitor. Available in the same size as conventional MLCCs, the ZRB is available in EIA 0402 (1.0 × 0.05mm) and EIA 0603 (1.6 × 0.8mm) package formats with working voltages of 6.3, 10, 16 and 25 VDC, With this approach, the ZRB becomes an ideal replacement part to update an end-application design without the need for modification of the PCB layout. This form of acoustic noise has become of concern for the 32
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electronics industry and effects many types of consumer electronics devices such as laptops, tablets and smartphones. The PCB can amplify the audio noise generated by the capacitor, so by using an interposer
substrate the MLCC becomes mechanically isolated from the PCB. Reduction in audio noise can be achieved against a traditionally designed MLCC. MURATA www.murata.eu
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New LYTSwitch-2 Isolated LED-Driver ICs from Power Integrations Deliver More Output Power Power Integrations announced its LYTSwitch™-2 family of isolated LED drivers. The new IC family, which delivers up to 12 watts of accurately controlled output power, substantially reduces component count, resulting in simpler, smaller, more reliable LED lighting designs. LYTSwitch-2 LED-driver ICs use primary-side control, resulting in costeffective, single-sided PCBs with low component counts. In addition, driver isolation allows the LEDs to be affixed directly to a metal heat sink, avoiding the added expense of an electrically isolating enclosure that is often required for non-isolated drivers. Accurate constant-current (CC) output tolerance across temperature (better than ±5% at both low-line and high-line voltages) reduces the need to over-design systems in order to meet requirements such as the U.S. ENERGY STAR® minimum-
lumens-delivered specification. Designs using LYTSwitch-2 ICs are also highly efficient – up to 90% in typical applications. LYTSwitch-2 ICs protect the LED
load from surges in line voltage, increasing bulb lifetime in regions where the mains voltage is subject to frequent peaks. The constant-current and constantvoltage (CC/CV) control function maintains a constant voltage on the output of the driver during no-load operation, preventing damage to the output filter or shutting down the driver when being tested or installed with no LED string connected. POWER INTEGRATIONS www.powerint.com
Exar Offers Wide Frequency Universal Clocks with Ultra-Low Jitter Exar Corporation announced an addition to its range of telecommunications timing products with a new family of Universal Clocks. The XR811xx series offers a wide range of output frequencies from 10MHz to 1.5GHz, with ultralow phase noise jitter of less than 200fs. Designed for communications, audio/video and industrial applications, the QFN-10 and TSSOP-8 packaged devices are footprint compatible with industry standard synthesizers, providing a superior performance second source option. The design of Exar’s XR811xx synthesizers utilizes a highly flexible delta-sigma modulator and a
very wide-ranging VCO in a PLL block that has been optimized to be extremely power efficient. With a core current consumption
of just 20mA, these parts dissipate 60% less power than equivalent competitive devices, providing a very compelling power efficiency benefit to system designers. EXAR www.exar.com
PRODUCT NEWS
ACTIVE COMPONENTS
Avago Technologies Introduces New Series of Reflective Optical Encoders for Low Power Miniaturized Motion Control Systems Avago Technologies announced a new series of 3-channel reflective optical encoder devices, the AEDR-87xx. The devices are ideal for use in low power miniaturized motion control systems such as stepper motors, electrical actuators, piezoelectric drives and portable medical appliances. Expanding upon previous generation devices, the new AEDR-87xx with encoding resolution up to 318 lines per inch (LPI) supports 3.3V and 5V supply voltage for low power applications and dual analog outputs interfacing directly with external interpolator for high precision motion control measurements. The devices are packaged in industry’s smallest form factor for 3channel reflective optical encoder. “Reflective optical encoder technology is vital to
many miniaturized motion control systems. As modern appliances get smaller in size and consume less power, so too are the critical components such as a motion control encoder embedded inside many of these appliances,” said Hassan Hussain, vice president and general manager of the
Motion Control Product Division (MCPD) at Avago. “Avago’s latest AEDR-87xx is the best-in-class reflective optical encoder solution with added flexibility addressing a wide range of design challenges for modern miniaturized motion control systems.” AVAGO TECHNOLOGIES www.avagotech.com
Analog Devices AD9139 16 bit 1.6Gsps DAC Available from Mouser Electronics Mouser Electronics, Inc. is now shipping the AD9139 digital to analog converter (DAC) from Analog Devices. The AD9139 is a 16 bit DAC with a high dynamic range and a sampling rate of 1.6 Giga-samples per second (Gsps). The AD9139 digital to analog converter, available from Mouser Electronics is a high speed, high dynamic range DAC which permits multicarrier signal generation up to the desired Nyquist frequency. These features specifically target wideband communications systems and high speed instrumentation. Latency between the 16 bit digital input and the output analog signal is as low as two DAC clock cycles. The 16 bit word to be converted can be loaded into the DAC as a 16 bit word or as 8
bit bytes, making this device suitable for use with 8-bit microcontrollers. A high performance, low noise phase lock loop (PLL) is onchip to reduce component
count. The AD9139 is designed for low power and draws only 700mW when converting at 1230 Msps. A proprietary filter provides for very low noise that minimizes signal distortion of the output signal. A 16 bit Low Voltage Differential Signaling (LVDS) bus is both byte and word addressable. MOUSER www.mouser.com
Rutronik presents Single Chip Audio Power Amplifier from Toshiba With the single chip audio power amplifier TB2909FNG from Toshiba, distributor Rutronik offers a compact solution, that adds the sound of a conventional internal combustion engine to electric and hybrid electric vehicles to ensure a minimum level of sound. Electric and hybrid electric vehicles operating in allelectric mode are much quieter than vehicles driven by internal combustion engines. To protect other road users, several vehicles are equipped with an acoustic vehicle alerting system (AVAS). It is anticipated that such systems will become more prevalent as legislators seek to establish a minimum level and type of sound for low-speed, allelectric operation. Due to road users’ familiarity with traditional vehicles, a preferred sound is that of a normal vehicle engine. The TB2909FNG power IC is a
single-channel, Class-AB, singleended push-pull (SEPP) amplifier specifically developed to amplify the simulated sound of a conventional engine. The device operates from a supply of
between 6 and 16V and can deliver a maximum output power of 5W. Total harmonic distortion (THD) is rated at 0.08% for an output power of 0.125W and output noise voltage is 50μV. Guaranteed operation between -40° and +110°C supports use in EV warning sound systems where stable performance and extended temperature is required. RUTRONIK www.rutronik.com/89da1022.l
6 Watt encapsulated DC-DC converter with 4:1 input range meets 3rd edition medical safety standard Murata announced the NCM6 series of isolated 6 Watt single and dual output DC/DC converters from Murata Power Solutions. Accommodating up to an ultra wide 4:1 input range, these DCDC converters are available in three nominal input voltage ranges of either 5VDC input (4.5 – 9VDC 2:1 range), 12VDC (9 – 36 VDC 4:1 range) or 48 VDC (18 – 75VDC 4:1 range). Each nominal input voltage variant offers seven output voltage models. Four of these are single output versions with +3.3, +5, +12 or +15VDC output. Three dual output models provide +5, +12 or +15VDC output options. Recognition of certification to international safety standards UL60950 for IT equipment and 3rd edition med-
ical safety standard UL60601 for 2 MOOP is pending. The DC/DC converters are encapsulated in order to achieve high levels of thermal performance and are housed in an industry standard package measuring 20.0 × 32.0 ×
10.75 mm. The operating temperature range is from – 40 to +85°C and the device is protected against damage due to excess operating temperatures. MURATA www.murata.eu
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PRODUCT NEWS
ACTIVE COMPONENTS
New TCVCXO from IQD delivers ±0.14ppm stability in a 5 × 3.2mm package IQD’s new IQXT-210 series TCVCXO, offers frequency stabilities down to ±0.14ppm over the full industrial temperature range of -40 to 85 degrees C. This new model is approaching OCXO performance levels, whilst being packaged in a miniature 8-pad 5 × 3.2mm package. Powered from a 3.3V supply the IQXT-210 has a typical current draw of only 12mA dependent upon the frequency, which can be specified between 10MHz to 50MHz. 11 standard frequencies are initially offered, including 12.8MHz, 19.2MHz and 26.0MHz. Output can be specified as either HCMOS, 15pF load or Clipped Sine, into 10k Ohms load. The oscillator can be specified to include various pulling range options, from ±5ppm to ±10ppm and also ±10ppm to ±15ppm. This enables the frequency
to be adjusted by a fixed amount for various applications and also allows for the oscillator to be used remotely. The IQXT-210 is primarily designed for low power consumption applications such as Femtocells, Smart Wireless Devices, Fibre Optic Networking (PON), Microwave Satellite Communications, LTE/4G Base Stations,
XP Power extends range of low power AC input LED drivers XP Power announced additions to the DLE series of AC input LED drivers. Adding to the extensive range of 15 – 60 Watt LED drivers, the DLE25 & 35 series of AC input LED drivers incorporate universal input with active power factor correction in a two power stage design, eliminating flicker while providing a high efficiency solution. Designed as a class II isolation product, without the need for a safety earth, DLE series LED drivers are also approved as a class 2 limited power source, making them suitable for a wide range of LED applications. Dimmable constant current versions are available with the facility for PWM, voltage and resistance programming.
Backhaul Infrastructure, Packet Transport Network (PTN) Computer Networking, RF Modules, Wi-Fi plus Test & Measurement Equipment. IQD www.iqdfrequencyproducts.com
Packaged in an IP67-rated enclosure measuring 93.5 × 73.5 × 33.0 mm (3.68 × 2.89 × 1.29 inches), the drivers are protected against dust ingress and are waterproof to depths up to 1 metre making them suitable for use in almost any outdoor application. Typical operating efficiency is in the range of 78% to 83%. Accommodating the extended universal input voltage range from 90 VAC up to 305 VAC the DLE series supports the 277 VAC system used in the United States. The series complies with EN61347 and UL8750 safety approvals and to Class B conducted and radiated noise limits as specified by EN55015. The DLE25/35 series is available from Farnell, element14, Digi-Key, approved regional distributors, or direct from XP Power and come with a 3 year warranty. XP POWER 34
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www.xppower.com
PRODUCT NEWS
ACTIVE COMPONENTS
Vishay’s high radiant power and high speed VSMY98545 series infrared emitting diode can now be ordered through TTI, Inc. TTI, Inc., the world’s leading specialist distributor of passive, connector, electromechanical and discrete components, now stocks a new diode from Vishay. Part of the SurfLight™ portfolio from Vishay, the VSMY 98545 series is an infrared, 850nm emitting diode based on surface emitter technology with high radiant power and intensity, as well as high speed and high reliability. It comes molded in a low thermal resistance SMD package with lens. A 42 mil chip provides outstanding low forward voltage and allows DC operation of the device up to 1A and up to 5A pulses. Further technical details of the
VSMY98545 series diode include an angle of half intensity of φ = ± 45°, low thermal resistance of Rthjp =
10K/W, a floor life of 168 h, MSL 3, according to J-STD-020. The components also benefit from lead (Pb)-free reflow soldering. Main target applications are infrared illumination for CMOS cameras (CCTV), illumination for cameras (3D gaming), machine vision and 3D-TV. TTI, INC. www.ttieurope.com
Omron launches new lighting control relay Omron Electronic Components Europe is addressing lighting control with two new energy saving latching relays featuring the capacity to handle the high inrush currents associated with this application. The new Omron G5RL U/K latching relays are also ideal for movement control, smart meter, power line switching and PV inverter applications. Latching relays are only energised while switching and use less power than non-latching designs in most applications. Commenting, Fabrizio Petris, Global Application Oriented Team Manager - Building Automation, at Omron said, “Capacitors used in fluorescent lamps as starters and in parallel to LED drivers lead to particularly high inrush currents in lighting circuits. Omron’s new latching relays are a great switching solution for this and other energy manage-
ment applications, offering probably the best price performance on the market.” Both the G5RL-U and the G5RL-K can switch up to 16A and are capable of dealing
with inrush currents of up to 150A. Both are offered in SPSTNO form, and are approved to a VDE standard demanding resistance to over 150A inrush. They also carry UL TV-8, a standard that exposes components to 117A inrush currents. The G5RLU features a single coil whilst the G5RL-K has a double coil architecture. An SPDT version is also available, though the specifications for this device are lower. OMRON http://components.omron.eu
A cool approach to flexible electronics A nanoparticle ink that can be used for printing electronics without high-temperature annealing presents a possible profitable approach for manufacturing flexible electronics. Printing semiconductor devices particles. These ligands must be are considered to provide lowremoved by annealing to make cost high performance flexible the ink conducting. Takeo electronics that outperform Minari, Masayuki Kanehara and amorphous silicon thin film tran- colleagues found a way around sistors currently limiting developments in display technology. However the nanoparticle inks developed so far have required annealing, which limits them to substrates that can withstand high temperaFully printed organic thin film transistors tures, ruling out a (OTFTs) on a paper substrate. (a) Schematic lot of the flexible of the device structure for a fully printed plastics that could OTFT on paper. (b) Arrays of fully printed otherwise be OTFTs fabricated on a paper substrate inkjet used. Researchers printed with the NIMS logo before adding at the National the device. (c) An optical microscope image Institute of of fully-printed OTFT arrays. (d) A magniMaterials Science fied optical microscope image of the individand Okayama ual device. Arrays of fully printed organic University in thin film transistors fabricated on paper subJapan have now strates that had the the NIMS logo ink jet developed a printed on before processing. nanoparticle ink that can be used with roomthis difficulty by developing temperature printing procenanoparticles surrounded by dures. Developments in thin film planar aromatic molecules that transistors made from amorallow charge transfer. The gold phous silicon have provided nanoparticles had a resistivity of wider, thinner displays with around 9 × 10-6 Ωcm – similar higher resolution and lower to pure gold. The researchers energy consumption. However used the nanoparticle ink to further progress in this field is print organic thin film transistors now limited by the low response on a flexible polymer and a to applied electric fields, that is, paper substrate at room temthe low field-effect mobility. perature, producing devices Oxide semiconductors such as with mobilities of 7.9 and 2.5 InGaZnO (IGZO) offer better cm2 V-1 s-1 for polymer and performance characteristics but paper respectively – figures require complicated fabrication comparable to IGZO devices. procedures. Nanoparticle inks As the researchers conclude in should allow simple low-cost their report of the work, “This manufacture but the nanopartiroom temperature printing cles usually used are surrounded process is a promising method in non-conductive ligands – mol- as a core technology for future ecules that are introduced dursemiconductor devices.” ing synthesis for stabilizing the MANA www.nims.go.jp/mana www.epd-ee.eu | July, 2014
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INDUSTRY NEWS
CLEANING TECHNOLOGY
EcoCWave by Dürr Ecoclean:
Superior quality, cost-efficiency and process reliability in aqueous parts cleaning With its EcoCWave, Dürr Ecoclean has developed an innovative equipment system for aqueous cleaning processes which can handle a wide range of tasks – from coarse to fine cleaning – in an efficient manner. To this end, the new allround talent comes with a list of features which ensure superior cleaning quality and process reliability, shorter idling times, and major energy savings. Moreover, this flexible machine sets standards in terms of space demand, operator-friendliness and design. Aqueous part cleaning with alkaline, neutral or acidic media ranks among the most widely employed technologies in many industries, e.g., automotive manufacturing and its tiered suppliers, medical equipment production, mechanical workshops performing machining, punching, drawing or bending tasks, precision mechanics and optical systems. Application levels range from coarse to intermediate and, ultimately, fine cleaning. Dürr Ecoclean's new EcoCWave system, superseding the existing Universal 81W line, covers this entire application spectrum thanks to its modular, forward-looking technology. With its very small footprint the system can easily be integrated in any production process. It also provides versatility, being easily adaptable to changing cleanliness and throughput specifications so that the user will enjoy investment certainty. Intelligent technology yields superior cleaning quality The EcoCWave is equipped with two or three flooding tanks, depending on customer specifications. The tanks exhibit a flow-optimized rounded geometry and are of upright 36
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design. Unlike the low-mounted rectangular containers used in conventional aqueous cleaning equipment, the round tanks prevent the formation of chip and dirt traps. Improved cleaning quality and a longer service life of the cleaning fluid are the result. Moreover, each tank has its own separate
fluid circuit comprising full-flow filtration. The cleaning and rinsing fluid is filtered on filling and draining as well as in the bypass. Bag filters or cartridge filters can be fitted in a combination-type filter housing. The system's filtration characteristics can thus be adapted to changing cleanliness requirements quickly
Thanks to its design the new EcoCWave does not only meet any cleaning task but also cares for optimized quality and efficiency in cleaning processes.
INDUSTRY NEWS
and without any hardware modifications. Another contributor to improved performance is the optimized rollover unit in the working chamber. It ensures that the fluid and mechanical cleaning devices – e.g., ultrasonic units and spraying nozzles – can reach the product effectively from all sides. In addition, the design of the rollover unit minimizes fluid drag-out. Faster processes cut per-unit costs Powerful pumps and large-diameter piping used throughout the EcoCWave accelerate the operations of filling and draining the work chamber and tanks. As a result, nonproductive times are minimized, product throughput is increased and per-unit clean-
CLEANING TECHNOLOGY
ing costs are reduced. These improvements benefit spray cleaning processes as well. Here, an increased number of nozzles working in optimized arrays deliver a more effective cleaning performance and hence, shorter cycle times even in removing coarse contamination. In order to shorten cycles still further, the vacuum drying system available in addition to hot-air drying has also been improved. Equal to any cleaning task Due to the use of variable-frequency driven pumps, volumetric flow rates can be adjusted precisely as needed. Major energy savings are achievable as a result. On the other hand, the cleaning process can be selective-
Unlike the low-mounted rectangular containers used in conventional aqueous cleaning equipment, the round tanks prevent the formation of chip and dirt traps.
ly adapted to meet specific requirements. Thus, different work chamber filling levels may be defined in immersion processes, e.g., with filling and draining cycles suitable for cleaning parts having blind holes or complex geometries. An intense fluid exchange in critical component areas substantially boosts the system's cleaning performance. In spraying processes, the jet strength can be adapted exactly to the part being processed. Moreover, the ability to control the spraying pressure expands the range of cleaning agents that can be used. Continuous reconditioning of the rinsing fluid is provided by an Aquaclean system which can be integrated into the machine. The cleaning fluid in the first flooding tank is heated entirely by waste heat from the evaporation process. Flexibility includes adaptable batch volume The EcoCWave has a vacuum-tight work chamber designed for batches measuring up to 670 × 480 × 300 mm. As an alternative, an enlarged work chamber for 670 × 480 × 400 mm containers may be installed without enlarging the footprint. The volume adapted batch configuration reduced per-unit costs. Easy operation with process visualization A new colour display with self-explanatory pictographs makes the EcoCWave easy, fast and reliable to operate. Diverse process data such as the work chamber fluid level are indicated in real time by the built-in process visualization system. An acquisition of all relevant process parameters (e.g., for the development of cleaning programs) can be implemented optionally. Exterior design: space-saving and open to modification Apart from its high performance, Dürr Ecoclean's engineers focused their attention on minimizing the system's footprint. Accordingly, a machine configured with two flooding tanks needs only 1.8 sq.m. of floorspace. The EcoCWave features a stylish appearance with integrated loading system and all-round safety-glazed enclosure. n Contact: Dürr Ecoclean GmbH, Rainer Straub, Sales, Tel. +49 711 7006-246, rainer.straub@ecoclean.durr.com www.durr-ecoclean.co www.epd-ee.eu | July, 2014
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INDUSTRY NEWS
CLEANING TECHNOLOGY
parts2clean 2014 (24 to 26 June)
parts2clean attracts record visitor turnout – Synergies with O&S boost trade visitor count – Motivated buyers: over 50% of visitors came with definite capital investment projects in mind It may have been only eight months since parts2clean 2013, but parts2clean 2014 served up all the quality and quantity its exhibitors and visitors were hoping for and more. In this, its twelfth season, the international trade fair for industrial-parts and surface cleaning was co-located with the O&S international trade fair for surface treatments and coatings for the very first time. Held from 24 to 26 June, the premiere of this double act brought over 10,900 visitors to the Stuttgart Exhibition Center. “The resulting synergies were a major plus for the exhibitors and visitors of both parts2clean and O&S,” said Olaf Daebler, the project director in charge of the two fairs at Deutsche Messe. “Sixty-two percent of all O&S visitors also attended parts2clean.” As a result, the post-show visitor statistics for parts2clean indicate that the show attracted no fewer than 8,460 visitors, which is just on 70 percent up on parts2clean 2013. Twenty-one percent of these visitors came from outside Germany, as compared with 20 percent in 2013. In all, 33 countries were represented in their number. The visitor cross-over between the two shows was greeted with enthusiasm by exhibitors, including Nathalie Etienne, CEO of Weber Ultrasonics GmbH: “For us as manufacturers of ultrasound components, there 38
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were definitely major synergies with O&S. Given our product range, we actually need to have a presence at both of these trade fairs, and so this year it was great to achieve that with a single showcase. This year’s parts2clean went very well for us.” parts2clean 2014 featured 269 (2013: 265) exhibitors from 14 countries. It occupied 6,627 square meters (71,332 sq. ft.) of net exhibition area, up a good four percent compared with 2013.
Quality visitors with decision making authority and firm investment intentions The gains this year were not purely quantitative. Exhibitors were equally pleased with the high level of technical understanding and decision making authority of the visitors they encountered. In their survey forms, 86 percent of the visitors indicated that they were involved in their organizations’ operational investment decisions, and 51 percent said they were at the show with concrete
INDUSTRY NEWS
investment projects in mind. “parts2clean is well established in the market and is very effective at targeting visitors who are interested in industrial parts cleaning. The meetings and dialogue we had with visitors this year were of an even higher quality than in previous years. We believe this is due in part to the fact that this year’s parts2clean, coming as it did only eight months after the previous show, had a higher-than-usual concentration of serious visitors with concrete capital investment projects in mind. The other reason, we believe, is that companies are generally taking industrial cleaning more seriously than before,” said Rainer Staub, Sales Director at Dürr Ecoclean GmbH. parts2clean 2014 also went well for LPW Reinigungssysteme GmbH, as its CEO, Gerhard Koblenzer, reports: “We are very satisfied with this year’s parts2clean. The quality and quantity of the visitor contacts we made this year were on a par with last year, if not better. Every year, the ratio of new prospects to existing customers in the contacts we make works out at about 60:40. Another interesting thing this year is that we encountered a fairly high number of visitors from outside Germany – from places like Turkey, India, China and Eastern Europe.”
Apart from Germany, the most heavily represented countries in terms of visitor numbers were Switzerland, Austria and Italy, followed by the UK and France. Betul Coker, a Freelance Business Consultant at Intersonik, Turkey, is also happy with this
CLEANING TECHNOLOGY
year’s show: “parts2clean is a specialist trade fair that enables us to establish and build new business relationships. This year, we also encountered relatively strong interest from commercial agents. Our parts2clean showcase attracted a lot of German-based visitors, but also high numbers of industry professionals from other countries, such as the UK, Sweden, Finland, Denmark, Switzerland, the Czech Republic and France. We are very satisfied with this year’s show and will be back again in 2015.” Another person who will definitely be back at parts2clean in 2015 is Chuck Sexton, Sales Manager Industrial Products at Kyzen, USA: “parts2clean always gives us a whole lot of quality new contacts. And, no less importantly, it’s also a great opportunity to manage our relationships with plant manufacturers. We sell cleaning chemicals that are used in industrial plants, and so it’s always nice to come to a show like this, where we can meet up with large numbers of them at one convenient location. We’ll definitely be exhibiting again at parts2clean in 2015.” This year’s parts2clean show attracted visitors from all key industries. The following industries were among the most strongly
represented: mechanical and plant engineering, automobile and automotive components, metalworking, chemical and process engineering, surface technology and processing, electronics and electrical, plastics processing, medical and pharmaceutical equipment, precision engineering
and optics, micro-tool- and micro-moldmaking, and aeronautics. And it’s clear that the visitors were satisfied with the show’s exhibition offering, given that 94 percent of them said they would recommend parts2clean to others and 60 percent said they already had definite plans to attend again in 2015. Upcoming surface technology shows by Deutsche Messe Deutsche Messe’s next surface technology show in Germany is the SurfaceTechnology fair, which is part of the HANNOVER MESSE industrial technology fair that runs from 13 to 17 April 2015. parts2clean is an annual show, whereas O&S is two-yearly, meaning that the next parts2clean show will be a solo affair, running from 9 to 11 June 2015, and the next parts2clean/O&S double act will be held from 31 May to 2 June 2016. Deutsche Messe’s next overseas trade fairs with surface technology content are Surface Technology INDIA, which runs from 10 to 13 December 2014 in New Delhi and includes a parts2clean pavilion, and Surface Treatment EURASIA, which runs from 12 to 15 February 2015 in Istanbul, Turkey, and likewise features a parts2clean pavilion.
Contact person for further information on parts2clean: Deutsche Messe Onuora Ogbukagu onuora.ogbukagu@messe.de www.parts2clean.de www.epd-ee.eu | July, 2014
| EP&Dee
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