JUNE, 2015 足 ISSUE NO. 5, VOL. 13
DESIGN & MANUFACTURING
EP&Dee ELECTRONICS
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JUNE 2015 Table of Contents
DESIGN FEATURES 12 Designer electronics out of the printer Optimized printing process enables custom organic electronics They are thin, light-weight, flexible and can be produced cost- and energy-efficiently: printed microelectronic components made of synthetics. Flexible displays and touch screens, glowing films, RFID tags and solar cells represent a future market.
14 HSIC vs. USB A look at the advantages of HSIC over USB and the connection procedures that are involved.
16 Counterfeiting:how it occurs and ways to mitigate risk The growth in counterfeit components over the past decade has become a key source of concern for everyone in the electronics industry, from component manufacturers through to end-users. Since the early 1990s, the trade in counterfeit goods has risen eight times faster than trade in legitimate goods. The Electronic Component Industry Association (ECIA) has estimated between 5 and 25 per cent of the total available electronic components are counterfeit.
18 #KinetisConnects: Turn your curiosity into tomorrow’s greatest invention 19 Tighter code for your IoT edge node 20 How current technology will be adapted for tomorrow’s needs in automotive 22 The path toward augmented reality with Renesas R-Car family The combination of powerful 3D graphics, outstanding computer vision capabilities and optimized video capture to form single chip SoC solutions is key to t he success of future parking assistance solutions that include surround view systems using multiple cameras. The second SoC generation from Renesas, called R-Car, aims at providing the appropriate solution to enable ready to use advanced 3D surround view applications and offer the driver an immersive and safe experience.
28 Maximum Integration on Minimum Space Infineon's new TLE986x/7x product series is a third-generation system-on-chip solution (SoC) that offers a wide range of functions – all in particularly compact housings. This makes Infineon one of the first semiconductor manufacturers to offer a highly-integrated embedded power series with a powerful microcontroller, flash memory, MOSFET gate driver and an extensive range of analog and mixed signal peripherals on the market.
30 Tape extension sensors 32 Leuze’s optical sensors for packaging applications 33 PASCAL Ci4 from LABOM - The intuitive pressure and differential pressure transmitter meeting highest standards 42 Production Packaging Do you need various products at a high level quality? Do you want a single provider for a wide range of technical products, which at the same time can offer you offline or online technical support free of charge? If you want all the above and more like orders without threshold value in a short amount of time, you can choose with confidence the only authorized dealer of RS in Romania.
PRODUCT NEWS 4 Embedded Systems (p 4, 5, 6, 7, 8, 9, 10, 11) Sensors (31, 34, 35) Active Components (p 36 - 39) Lighting Solutions/Display (p 40, 41) Passive Components (p 48 - 49)
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Group Publishing Director Gabriel Neagu Managing Director Ionela Ganea Accounting Ioana Paraschiv Advertisement Irina Ganea WEB Eugen Vărzaru © 2015 by Eurostandard Press 2000
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41 Contributing editors Radu Andrei Ross Bannatyne Consulting Marian Blejan Bogdan Grămescu Mihai Savu Asian Reprezentative Taiwan Charles Yang Tel: +88643223633 charles@medianet.com.tw
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EP&Dee (Electronics Products & Design Eastern Europe) is published 10 times per year in 2015 by Euro Standard Press 2000 s.r.l. It is a free to qualified electronics engineers and managers involved in engineering decisions. Starting on 2010, this magazine is published only in digital format. Copyright 2014 by Euro Standard Press 2000 s.r.l. All rights reserved.
INDUSTRY NEWS Altera Arria 10 Chosen to Support Real-Time HighSpeed Airborne Ethernet Interconnection Technology in Demanding Environments Altera Corporation announced that its Arria® 10 FPGAs have been chosen by Silkan, a provider of real-time data transmission, for its new deterministic real-time high-speed Ethernet interconnection technology.
EMBEDDED SYSTEMS Freescale Solid State RF Power Innovation Enables Disruptive New Concept for Cooking at Home Connected oven proof of concept is designed to dramatically boost convenience and quality of home cooking, enable compelling new business models and opportunities Freescale Semiconductor introduced its vision for a radically innovative appliance concept that leverages solid state radio frequency (RF) technology to revolutionize cooking.
Freescale's breakthrough cooking appliance concept will enable fresh, chef-quality meals at home with virtually no effort or prep time. (Photo: Business Wire)
The Silkan CETRAC switch is a plug-and-play solution, using an Ethernet cable to connect critical systems in aerospace and defense (A&D) and instrumentations & controls (I&C) markets. It was developed to provide safe connectivity, low latency, and rapid delivery of information between these onboard systems, without any data corruption. The solution also supports avionics applications that must meet the requirements for Design Level Assurance (DAL) A, and B, two of the highest safety levels in avionics. Altera Arria 10 enables Silkan to meet Ethernet IEEE802.3 standards with a onechip programmable platform, and to achieve new levels of performance, and improve connectivity safety and reliability, along a lower cost of ownership. CETRAC switches can also support non-critical applications needed in flight, offering guaranteed data integrity and low latency. CETRAC is also provided as IP core and is embeddable in Line-Replaceable Unit (LRU), which is a modular component on an airplane, ship or spacecraft. CETRAC offers full retro-compatibility with the company’s Arion100 product, an integrated, industrial, and real-time environment providing complete virtualization for a system. ALTERA SILKAN CETRAC 4
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Developed in partnership with global product strategy and design firm frog, this breakthrough proof of concept will help enable fresh, chef-quality meals available at home with virtually no effort or prep time. With the convenience of a microwave and quality of a traditional oven, this smart, connected RF cooking concept can control where, when and how much heating energy is directed into food – enabling more precise cooking for dramatically improved consistency, taste and nutrition. This fine-tuned heating capability helps prevent overcooking, which can destroy nutritional content, reduce moisture and waste energy. Freescale’s solid state RF cooking technology can also enable appliance OEMs to create products capable of cooking multiple dishes and items at the same time within the same appliance, significantly simplifying meal preparation. By precisely controlling the location, cycles, and levels of cooking energy, the appliance will bring food from a raw or frozen state to a cooked temperature rapidly and without intervention. With the addition of convection heating to enable browning and crisping, the oven concept can also support a wide array of cooking types and qualities, from searing to browning to baking to poaching. Freescale’s connected RF cooking proof of concept is expected to enable new levels of consumer convenience, on par with the single-brew coffee pod’s popularity among coffee drinkers at home and in the workplace. This convenience paves the way for a host of new business models and opportunities, including internet-driven home delivery of freshly prepared meals from a variety of sources – including restaurants, grocery stores and farm-to-table cooperatives – all quickly and easily cooked in the appliance. The concept also holds the broader potential of improving food supply chain efficiency by collecting and transmitting Big Data sets which can contribute to more efficient food distribution, targeted services and enhanced products. An Internet of Things solution, this connected RF cooking concept could access a virtually unlimited library of recipes, learn new cooking methods within online social communities, adapt to consumer cooking preferences, and add and store recipes in real-time. Additionally, the concept appliance’s solid state RF power technology keeps form factors small, allowing for stylish, modern countertop designs. Appliance manufacturers are free to imagine and create highly differentiated design geometries, features, and functions. And the solution’s narrow band energy allows it to coexist with WiFi, Bluetooth and other connected devices. FREESCALE SEMICONDUCTOR www.freescale.com
INDUSTRY NEWS
EMBEDDED SYSTEMS
Microchip Introduces the PIC32 Harmony Software Decoder Framework and Microsoft WMA Decoder Library
Microchip announces the PIC32 Harmony Software Decoder Framework and Microsoft Windows® Media Audio (WMA) Decoder Library for 32bit PIC32 microcontroller (MCU)-based consumer-audio application development within the MPLAB® Harmony Integrated Software Framework. The WMA Decoder Library includes a new modular framework for audio decoders, including support for MP3 and AAC, allowing easier audio application development.
Win an MPLAB Starter Kit for Digital Power from Microchip EP&Dee is offering you the chance to win an MPLAB Starter Kit for Digital Power (#DM330017). This starter kit allows the user to easily explore the capabilities and features of the dsPIC33F GS Digital Power Conversion family. It is a digitally controlled power supply board that consists of one independent DC/DC synchronous Buck converter and one independent DC/DC Boost converter. Each power stage includes a MOSFET controlled 5W resistive load. The kit features an On-Board InCircuit Debugger /Programmer via USB, LCD display for voltage, current, temperature and fault conditions and an on-board temperature sensor.
Microchip’s Audio Decoder Framework allows for audio software codecs to be easily added to a PIC32 design project. Rather than having to rewrite large sections of application code, the framework allows for easier integration into an existing customer application after the corresponding decoder library has been purchased. The WMA Decoder increases the depth of the library for PIC32 MCU-supported audio decoders, in addition to MP3 and AAC. This increases the range of audio formats that designers can choose to support. The audio decoder framework within the Harmony environment allows designers to easily add, subtract and switch between various software-based audio decoders. Additionally, including a WMA decoder gives developers an even wider set of options and support for audio playback. The WMA Decoder Library is targeted for low-cost applications in the consumer markets, such as audio docks, home audio receivers and automotive head units. It gives developers added flexibility in decoder options that play back from internal or removable media. The addition of a WMA decoder library further expands the audio application flexibility of PIC32-based designs, building upon existing USB and Bluetooth® streaming audio solutions. The Microsoft WMA Decoder Library is supported by Microchip’s free MPLAB Harmony Integrated Software Framework and the PIC32 Bluetooth Audio Development Kit (DV320032) priced at $199.99. Both are available now. The Microsoft WMA Decoder Library is available for purchase today in two variants: SW320015 priced at $199.97; and SW320025-1HPM priced at $199.00. MICROCHIP TECHNOLOGY
The Digital Power Starter Kit provides closed-loop Proportional-Integral-Derivative (PID) control in the software to maintain the desired output voltage level. The dsPIC® DSC device provides the necessary memory and peripherals for A/D conversion, PWM generation, analog comparison and general purpose I/O, preventing the need to perform these functions in external circuitry. For the chance to win an MPLAB Starter Kit for Digital Power, please visit: www.microchip-comps.com/epdee-mplabdigpower and enter your details in the entry form.
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June, 2015 | EP&Dee
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INDUSTRY NEWS
EMBEDDED SYSTEMS
Intersil’s Latest Automotive Video Decoder with MIPI-CSI2 Output Interface Supports Next-Generation SoCs Intersil Corporation announced the TW9992 analog video decoder, which features an integrated MIPI-CSI2 output interface that provides compatibility with the newest SoC processors. The decoder’s MIPICSI2 interface simplifies design by making it easier to interface with SoCs, while also lowering the system’s EMI profile. The TW9992 decoder takes both single-ended and differential composite video inputs from a vehicle’s backup safety camera, and is the latest addition to Intersil’s video decoder product family for automotive applications.
IAR Systems partners with Renesas Electronics for complete IoT solutions platform The leading development tools vendor responds to needs for simplified development workflows with high customization possibilities by providing its tools as part of the new Renesas Synergy™ Platform As presented by Renesas Electronics, Renesas Synergy™ is a complete embedded development platform designed to simplify the creation of innovative products in the embedded space, particularly for the growing Internet of Things (IoT) market. IAR Systems® now announces that the company, as the only commercial tools vendor, will provide build and debugger tools as part of the new platform. Customers using Renesas Synergy will be able to start product development at a much higher level of abstraction and be able to focus completely on designing innovative and differentiated features for embedded applications and connected devices. Meanwhile, they will benefit from the high-performance code created by the powerful IAR C/C++ Compiler™.
Designed with built-in diagnostics and superior video quality, the TW9992 addresses the biggest challenges faced by automotive video systems. For example, the decoder’s Automatic Contrast Adjustment (ACA) image enhancement feature overcomes a major challenge for backup camera systems by adapting to rapidly changing lighting conditions. ACA is able to automatically boost up or reduce the brightness/contrast of an image for greater visibility and safety. In addition, vehicle backup cameras typically employ differential twisted pair cables that require designers to use an operational amplifier (op amp) in front of the video decoder to convert the differential signal to single-ended. The TW9992 decoder eliminates the need for an external op amp by supporting direct differential CVBS inputs, thus reducing system cost and board space. The built-in shortto-battery and short-to-ground detection capability on each differential input channel further enhances video performance and automotive system reliability. Key Features and Specifications: • NTSC/PAL 10-bit ADC analog video decoder with 4H adaptive comb filter • MIPI-CSI2 output interface • Software selectable analog input control allows for combinations of single-ended or differential CVBS • Advanced image enhancement features: automatic contrast adjustment, and programmable hue, brightness, saturation, contrast and sharpness • Output voltage: 1.8V to 3.3V with 3.3V tolerance • Low power consumption: 100mW typical • Integrated short-to-battery and short-to-ground detection tests • AEC-Q100 qualified INTERSIL 6
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The embedded market is ready for a change. Recent development has been rapid, leading towards more connectivity and globalized development teams. Combined with increased demands for more time-efficient, less costly projects, this trend has created urgent needs for simplified development workflows with high customization possibilities and without geographical limitations. IAR Systems responds to these needs with easy-to-use, integrated and flexible development tools for IoT and other applications. The company now takes its offering to the next level by supplying build and debugger tools as part of a complete all-inclusive solution platform. The Renesas Synergy Platform integrates qualified software with a new family of MCUs and an ecosystem of tools and support options into one scalable and secure platform. As the Renesas Synergy Platform is a fully integrated product and not a set of separately sourced software and hardware components, Renesas provides technical support and licensing for the platform. General availability of the first products in the Renesas Synergy Platform is scheduled for Q4 CY 2015. To learn more, go to www.RenesasSynergy.com IAR SYSTEMS www.iar.com
INDUSTRY NEWS
EMBEDDED SYSTEMS
Gamma Radiation-Resistant Memory Provides Calibration and Protects from Unsanitary Reuse in Medical Disposables Maxim Integrated’s gamma radiation-resistant memory uses only one contact to simplify implementations in small, disposable medical sensors. Maxim Integrated Products, Inc. makes it easy to calibrate a consumable medical sensor and to monitor or control unsanitary reuse of medical disposables with the DS28E80 gamma-radiation-resistant, nonvolatile (NV) 1-Wire® memory.
Gamma radiation sterilization is typically used on single-use disposable medical sensors and consumables because the method is predictable, reliable, faster to process, and usable across a wide array of product materials and packaging types. But, gamma radiation is incompatible with traditional floating-gate memory technologies used in semiconductors because gamma’s high-ionizing radiation erases the memory. The new DS28E80 NV memory, however, is resistant to gamma radiation up to 75kGy (kilo gray). With flexible programming options, it allows OEMs to factory calibrate their sensors, tools, and accessories to their host medical instrument in the field. It can be used to monitor or even prevent unsanitary reuse of a disposable medical sensor and consumables. It operates over the company’s trusted 1-Wire interface, so consumable manufacturers can replace multiple cumbersome cables with a single contact. Key Advantages: • Manufacturing calibration: OEMs can automatically detect and calibrate sensors and accessories to ensure quality. • Usage tracking: guards against incorrect attachment and warns or prevents unsanitary reuse of consumables. • Embedded identification: embedded 1-Wire protocol provides unalterable 64-bit factory-assigned serial ID which allows for tracking and can prevent usage of unauthorized consumables. • Reprogrammable: 248 bytes of user memory organized in 8-byte blocks • Permanent write protection: flexible per-block options for use memory MAXIM INTEGRATED
www.maximintegrated.com
Registration Opens for Microchip’s European MASTERs Conference; Premiere Technical Training Event for Embedded-Control Engineers 15th-17th September 2015 at HTW Berlin; Classes Available for All Experience Levels, From Beginner to Expert
Microchip Technology announces that registration is open for its European MASTERs Conference at HTW - Berlin, Germany. The European MASTERs Conference is a valuable resource for designing with Microchip’s products. It provides design engineers with an annual forum for sharing and exchanging technical information on the Company’s 8-, 16- and 32-bit PIC® microcontrollers, high-performance analog and interface solutions, dsPIC® digital signal controllers, wireless and mTouch® sensing solutions, memory products, and MPLAB® development systems - including the industry’s only singular IDE to support an entire 8-, 16- and 32-bit microcontroller portfolio. This three day conference offers a selection of more than 50 classes that cover a broad range of topics, taught by Microchip’s application and design engineers as well as selected industry experts. Learn from these experts and leave with everything needed to get up and running on new designs. Lectures, hands-on classes and unique Open Experts Lab sessions will cover a wide range of embedded control topics including new products and peripherals, C programming, firmware design, connectivity sessions on TCP/IP, USB, CAN and Bluetooth, graphics and capacitive-touch interface development, intelligent power supplies, motor control, selecting op-amps for sensor applications using an RTOS and low-power system design. Extracurricular events include a BBQ Dinner and a Dinner Cruise along the river Spree. Registration is now open, with an early-bird discount available until 27th June 2015. MICROCHIP TECHNOLOGY www.microchip.com/eumasters www.epd-ee.eu |
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INDUSTRY NEWS Altera Reveals Stratix 10 Innovations Enabling the Industry’s Fastest and Highest Capacity FPGAs and SoCs Altera Corporation revealed architectural and product details of its Stratix® 10 FPGAs and SoCs, the next generation of high-end programmable logic devices delivering breakthrough levels of performance, integration, density and security.
Stratix 10 FPGAs and SoCs leverage Altera’s revolutionary HyperFlex™ FPGA fabric architecture built on the Intel® 14 nm Tri-Gate process to provide 2X higher core performance over previous generation FPGAs. Combining the industry’s highest performance, highest density FPGA with advanced embedded processing capabilities, GPUclass floating point computation performance and heterogeneous 3D SiP integration, enables Altera customers to uniquely address design challenges in the next generation of communications, data center, IoT infrastructure, military and high-performance computing systems. HyperFlex Architecture “Registers Everywhere” Approach Stratix 10 FPGAs and SoCs are the first Altera devices to leverage the company’s new HyperFlex architecture, the FPGA industry’s most significant fabric architecture innovation in over a decade. The HyperFlex architecture, along with a full process node advantage from the Intel 14 nm Tri-Gate process, provides a 2X core logic frequency improvement over competing next-generation highend FPGAs. The HyperFlex architecture enables high-performance designs to operate up to 70 percent lower power by reducing logic area requirements. Find more information at www.altera.com/hyperflex. ALTERA 8
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EMBEDDED SYSTEMS Microchip’s new Smart Hub with FlexConnect broadensapplication space of USB3.0 Hubs Microchip announces, from Computex Taipei, the first USB3.0 Smart Hubs that enable host and device port swapping, I/O bridging, and various other serial communication interfaces. The USB5734 and USB5744 feature an integrated microcontroller that enables new functionality for USB hubs while lowering overall BOM costs and reducing software complexity. The USB5734/44 family is USB-IF logo certified (TID 330000058) and features best-in-class signal integrity enabling more robust PCB designs and reducing sensitivities to cable, connector and layout variations. A Smart Hub is a USB hub that integrates system-level functions typically associated with a separate MCU or processor. Microchip’s new USB3.0 Smart Hubs enable the upstream host controller to communicate to numerous types of external peripherals beyond the USB connection through direct bridging from USB to I2C™, SPI, UART and GPIO interfaces. This integrated functionality can greatly reduce the complexity of system design by eliminating the need for additional external microcontroller, while providing improved control from the USB host hardware. Microchip’s patented Flex Connect technology provides the USB5734 Smart Hub the unique ability to dynamically swap between a USB host and a USB device through hardware and/or software system commands giving the new USB host access to downstream resources. This same Flex Connect technology can also switch common downstream resources between two different USB hosts. Incorporating FlexConnect into a system simplifies the overall software requirements of the primary host, as class drivers and application software stay local to the Device-turned-Host. System developers can easily configure ports and choose application settings with low-cost resistor bootstraps. If more advanced functionality is required, the USB5734/44 can be configured and programmed with Microchip’s configuration tool, ProTouch2. The USB5734 and USB5744 USB3.0 controller hubs serve a wide range of applications in the computing, embedded, medical, industrial and networking markets. Examples of end applications include HDTV, tablets, notebooks, eReaders, cameras, docking stations, monitors, handheld devices, point-of-sale equipment, ATMs, set-top boxes, break-out boxes and motion sensors, among others. Available in a 56-pin, 7 × 7 mm package, the USB5744 is the industry’s smallest USB3.0 Hub for applications where board space is important. The USB5734 and USB5744 are supported by Microchip’s USB 3.0 Controller Hub Evaluation Board (EVB-USB5734) priced at $399.00, and USB 3.0 Small Form Factor Controller Hub Evaluation Board (EVB-USB5744) priced at $299.00, which are available today. The EVB-USB5734 includes mezzanine cards that can be used as preset application configurations for easy testing and development of a USB5734 system. The USB5734 is available today for sampling and volume production in a 64-pin QFN (9 × 9 mm) package. The USB5744 is available today for sampling and volume production in a 56-pin QFN (7 × 7 mm) package. MICROCHIP TECHNOLOGY
www.microchip.com/USB5734-Page-060215a
INDUSTRY NEWS
EMBEDDED SYSTEMS
Dialog Semiconductor Achieves Highest Power Density and Efficiency in Powering Future Computing Platforms
Dialog Semiconductor plc, a provider of highly integrated power management, AC/DC power conversion, solid state lighting (SSL) and Bluetooth® Smart wireless technology, announces the DA9312, a power management IC that enables the design of smaller, thinner notebook computers and tablets powered by dual cell stacked (2S) Li-ion or LiPolymer batteries. The notebook industry is moving towards designs powered by 2-cell, rather than 3-cell batteries and tablets are moving from single cell to 2-cell batteries. Dialog is supporting these trends with the most integrated power management solution currently available. Using the DA9312 with a just few external components requires only 80 mm2 of board space, a fraction of that of discrete component power converters. The device delivers industry-leading efficiency of 98%, minimising thermal management challenges and boosting product reliability. Rated at 90W, the DA9312 is the first high power device of its type in the industry. It accepts an input voltage from 5.5V to 10.5V, which then feeds three independent power supplies. The main power converter uses capacitors to store charge and requires no external inductor. The device’s two high-frequency buck converters switch at a frequency of 1.5MHz, so tiny 1 mm high inductors and very small capacitors can be used on the outputs. The power converter, which outputs half the input voltage, is rated at up to 10A and the two buck converters can each deliver up to 5A at between 2.8V and 5.35V. Alternatively, the buck converter outputs can be combined to turn the device into a dual phase regulator capable of supplying up to 10 A on each output. All power supplies within the PMIC have integrated FET power switches to minimise external component count and board size, and no Schottky diodes are needed. The DA9312 comes in a WL-CSP 6.345 x 2.815 mm package and implements Dialog’s RouteEasy™ ball layout for high density routing on low cost printed circuit boards. The PMIC operates with a die temperature from -40°C to +125°C. DIALOG SEMICONDUCTOR
www.dialog-semiconductor.com
MSC Technologies presents two COM Express module families with latest Intel processors MSC Technologies presents two COM Express™ Type 6 module families, which are based on the latest Intel® 14 nm process technology. The MSC C6C-BW module with quad-core or dual-core Intel® Pentium® or Celeron® processors (codenamed Braswell) offers outstanding graphics performance with low power consumption.
The MSC C6B-8SB high-end module, which is equipped with quad-core 5th GenerationIntel® Core™ processors (Broadwell), features a significant leap forward in computing and graphics performance. Thanks to the integrated Gen8 Intel® HD Graphics, the MSC C6C-BW module family ‒ in the compact form factor of 95 mm x 95 mm ‒ offers twice the graphics performance of the previous model with Intel® Atom™ CPU (Bay Trail). Three independent displays with up to 3840 × 2160 pixels can be connected via the HDMI, DisplayPort and Embedded DisplayPort graphics interfaces. DirectX® 11.1, OpenGL 4.2 and OpenCL™ 1.2 are supported. The Computer-On-Module (COM) is therefore particularly suitable for graphics-intensive embedded applications for the presentation of highresolution imaging and fast videos. The low power consumption of the embedded platform is between 6 W and 9W, and the integrated Braswell processors have a thermal design power (TDP) of 4W to 6W. The modules can be equipped with up to 8GB dual-channel DDR3L SDRAM with high memory bandwidth via two 204-pin sockets. The wide range of modern interfaces includes two SATA 3, four USB 3.0, four USB 2.0 and up to five PCI Express™ x1 channels. A microSD card can be plugged in as an on-board mass storage device. With the MSC C6B-8SB module platform, which integrates the latest 5th Generation processors, MSC Technologies rounds off the top end of its COM Express™ product portfolio based on the 4th Generation Intel® Core™ processors. The module is offered with two different Intel® Core™ processors (i7-5700EQ or i7-5850EQ), each with four processor cores. In addition to a comprehensive range of interfaces, the COM ‒ in the Basic form factor of 125 mm × 95 mm ‒ offers an Intel® HD Graphics controller GT2 or GT3e with additional graphics memory, Turbo Boost capabilities for the CPU and graphics controller, hardware-accelerated video encoding and decoding as well as enhanced security features. MSC TECHNOLOGIES www.epd-ee.eu |
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INDUSTRY NEWS Freescale introduces world’s smallest integrated smart system for the IoT Today at the Freescale Technology Forum (FTF) in Austin, Texas, Freescale unveiled the first product in its new SCM portfolio.Designed to function as a computer on a chip, the i.MX 6Dual SCM is enabled for DDR memory and combines the performance of Freescale’s i.MX 6Dual applications processor together with a power management integrated circuit (PMIC), flash memory, embedded software/firmware, and system-level security technology including random number generation, cryptographic cipher engines and tamper prevention.
Freescale's breakthrough single chip module technology integrates a full featured dual core processor and more than 100 other components into a package the size of a U.S. dime. (Photo: Business Wire) SCM products are engineered to dramatically reduce time-to-market, allowing an estimated 25 percent reduction in hardware development time – as well as greater than 50 percent reduction in size versus current discrete solutions. The module’s exceptional performance and connectivity allow customers targeting IoT markets to incorporate sophisticated predictive data analytics capabilities into their products, allowing for highly compelling and potentially disruptive endproducts. Freescale’s SCM modules are ideal for applications such as 3D gaming goggles, where battery life and power are important; next-generation IoT drones requiring extreme processing performance for object recognition; and other IoT products, where highly advanced graphics and user interfaces are considered key to more mainstream adoption. Other markets well suited for Freescale’s SCM technology include wearables, next-generation medical equipment and autonomous sensing applications. Freescale’s SCM portfolio products are delivered as a fully tested and softwareenabled platform for consumer and industrial applications. FREESCALE SEMICONDUCTOR
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EMBEDDED SYSTEMS Silicon Labs Introduces Industry’s Most Flexible Dual-Mode Bluetooth Module Solution Easy-to-Use Module, Software Stack and Scripting Language Accelerate Applications Requiring Bluetooth Smart and Bluetooth® Classic Connectivity Silicon Labs unveiled a dual-mode Bluetooth® Smart Ready module solution that gives embedded developers unparalleled flexibility to integrate both Bluetooth Smart and Bluetooth Basic Rate/Enhanced Data Rate (BR/EDR) wireless technologies while minimizing design time, cost and complexity. The new Bluetooth Smart Ready BT121 module from Bluegiga, a Silicon Labs company, provides a pre-certified, fully integrated, high-performance solution that includes the Bluetooth radio, microcontroller (MCU) and on-board Bluetooth software stack supported by Silicon Labs’ complimentary Bluetooth Smart Ready software development kit (SDK) and easy-to-use BGScript™ scripting language. The BT121 Bluetooth Smart Ready module and software are designed to help developers accelerate time to market and reduce development costs and compliance risks by providing a versatile, plug-and-play Bluetooth solution. The BT121 module is ideal for applications requiring connectivity to legacy devices that only support Bluetooth BR/EDR, as well the latest applications using Bluetooth Smart such as connected home, health and fitness, wearables and point-of-sale terminals. There are millions of legacy smart phones, tablets and PCs still in service that do not support Bluetooth Smart technology. Additionally, some applications require the higher throughput advantages of Bluetooth Classic technology, which Bluetooth Smart is not designed to achieve. The BT121 module provides a “best of both worlds” solution for both ultra-lowpower and high-data-rate Bluetooth connectivity applications. The module can connect to legacy devices that only support Bluetooth SPP or Apple® iAP2 profiles, for example, as well as to devices that support Bluetooth Smart. The easy-to-use BT121 module integrates a high-performance Bluetooth radio with an extended range of up to 400 meters, a low-power ARM® MCU, and a fully certified Bluetooth Smart Ready protocol stack in a compact 11 mm × 14 mm surface-mount package, making this one of the smallest Bluetooth Smart Ready modules in the market. No RF or Bluetooth protocol development expertise is necessary to implement the BT121 module in Bluetooth designs. The module can be used as a peripheral along with an external host MCU, or applications can be embedded into the built-in MCU with the Bluegiga BGScript scripting language, creating a completely standalone design with minimal external components. Available for download at no charge from Bluegiga (www.bluegiga.com), the Bluetooth Smart Ready SDK is a set of software tools for simplifying the development of Bluetooth Smart Ready applications. Developers can access dozens of example Bluetooth Smart application profiles, which can be used as templates, enabling them to accelerate development time. Silicon Labs continues to expand its library of Bluetooth profiles as part of its roadmap to support new and emerging wireless applications and use cases. The Bluetooth Smart Ready stack and SDK are fully compatible with Silicon Labs’ recently announced Blue Gecko Bluetooth Smart modules. This compatibility makes it easy for developers to migrate their designs between Silicon Labs’ Bluetooth Smart and Smart Ready modules with a consistent set of application programming interfaces (APIs) and software tools. SILICON LABS www.silabs.com
INDUSTRY NEWS
EMBEDDED SYSTEMS
Support All Narrowband Powerline Communications Utility Standards with One Modem
Designers of electrical utility meters now have the flexibility to accommodate the G3-PLC™, Prime, and P1901.2 standards in the CENELEC A, ARIB, and FCC frequency bands with a single chip, the ZENO™/MAX79356 powerline communications (PLC) modem system on a chip (SoC) from Maxim Integrated Products, Inc. Powerline communication standards and frequency bands vary by region and country, and until now PLC modems could not support them all. Meter manufacturers had to develop multiple modems to ensure standards compatibility, or even pass up markets because they did not have the time or resources to develop new modems. That dilemma is now solved. The ZENO/MAX79356 PLC modem SoC is software configurable to accommodate all worldwide standards. Now manufacturers and utilities can use the same device to build meters and data concentrators for any region that wants to use powerline communication. This allows meter designers to bring their products to market faster and be prepared for future standards. In addition, the integration of the analog front-end (AFE) and baseband in a single chip reduces chip count and lowers expenses.
Key Advantages • Versatile: software configurability supports today’s PLC standards and will adjust for future standards; certified by the G3-PLC Alliance for all three major frequency bands (CENELEC A, ARIB, and FCC) and for PAN Device and PAN Coordinator • Low power: uses 80% less power when listening for PLC communication (55mW vs. 300mW); active transmission power consumption is 70mW • Space efficient: up to 3x smaller than other PLC modems.
MAXIM INTEGRATED
www.maximintegrated.com
Excelsys Xsolo Power Supplies Meet Medical Performance Specifications Excelsys Technologies announced today that its Xsolo power supplies have been designed and tested to meet both the B and BF type requirements per the IEC 60601 standard. This makes them suitable for applications that need these levels of performance for power supplies used in medical applications. Excelsys’ testing procedures were performed in accordance with requirements for B (body) and BF (body floating) medical end products. The goal of the testing was to help manufacturers optimize their medical designs to achieve the highest performance and safety levels, enabling firstpass success during agency approvals.
B-type applied parts, which are not typically attached to the patient for long periods of time, include LED lighting, medical lasers, medical imaging (e.g., MRI), hospital beds and phototherapy equipment. Type BF applied parts have conductive long-term contact with a patient. These can include incubators, therapy systems patient heating and cooling equipment, ultrasound monitoring, cardiac monitoring, as well as long-term diagnostic equipment and blood pressure monitoring. To demonstrate that its power supplies are suitable for these applications, Excelsys tested both its basic and low-leakage Xsolo models (XS1000-48N-000 and XS1000-48N-004) to the 60601 standard using an AC source providing 264 VAC at 63 Hz to recreate worsecase conditions. Copies of the test report are available on request. Manufacturers often need to incorporate multiple power supplies into a given system and still meet stringent requirements. To help meet these requirements, Excelsys also offers low-leakage power supply versions, which enable the incorporation of multiple power supplies into various medical-type rated systems, depending on the application. As a world-class power supply manufacturer, Excelsys has a global applications team to support and assist customers with their specific system needs. EXCELSYS
www.excelsys.com www.epd-ee.eu |
June, 2015 | EP&Dee
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ORGANIC ELECTRONICS
Designer electronics out of the printer Optimized printing process enables custom organic electronics They are thin, light-weight, flexible and can be produced cost- and energy-efficiently: printed microelectronic components made of synthetics. Flexible displays and touch screens, glowing films, RFID tags and solar cells represent a future market. In the context of an international cooperation project, physicists at the Technische Universität München (TUM) have now observed the creation of razor thin polymer electrodes during the printing process and successfully improved the electrical properties of the printed films. To manufacture the components on an industrial scale, semiconducting or insulating layers – each a thousand times thinner than a human hair – must be printed onto a carrier film in a predefined order. “This is a highly complex process, whose details need to be fully understood to allow custom-tailored applications,” explains Professor Peter Müller-Buschbaum of the Chair of Functional Materials at TU München. A further challenge is the contacting between flexible, conducting layers. Hitherto electronic contacts made of crystalline indium tin oxide were frequently used. However, this construction has numerous drawbacks: The oxide is more brittle than the polymer layers over them, which limits the flexibility of the cells. Furthermore, the manufacturing process also consumes much energy. Finally, indium is a rare element that exists only in very limited quantities.
Claudia M. Palumbiny investigates transparent thin film electrodes made of conducting polymers printed on flexible substrates. Photo: Wenzel Schürmann / TUM
Solar cells out of a printer? This seemed unthinkable only a few years ago. There were hardly any alternatives to classical silicon technology available. In the mean time touch screens, sensors and solar cells can be made of conducting polymers. 12
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Flexible monitors and glowing wall paper made of organic light emitting diodes, socalled OLEDs, are in rapid development. The “organic electronics” are hailed as a promising future market. However, the technology also has its pitfalls:
Polymers in X-ray light A few months ago, researchers from the Lawrence Berkeley National Laboratory in California for the first time succeeded in observing the cross-linking of polymer molecules in the active layer of an organic solar cell during the printing process. In collaboration with their colleagues in California, Müller-Buschbaum’s team took advantage of this technology to improve the characteristics of the polymer electronic elements. The researchers used X-ray radiation generated in the Berkley synchrotron for their investigations. The X-rays are directed to the freshly printed synthetic layer and scattered. The arrangement and orientation of the
DESIGN
molecules during the curing process of the printed films can be determined from changes in the scattering pattern. “Thanks to the very intensive X-ray radiation we can achieve a very high time resolution,” says Claudia M. Palumbiny. In Berkeley the physicist from the TUM investigated the “blocking layer” that sorts and selectively transports the charge carriers in the organic electronic components. The TUM research team is now, together with its US colleagues, publishing the results in the trade journal Advanced Materials. Custom properties “In our work, we showed for the first time ever that even small changes in the physico-chemical process conditions have a significant influence on the build-up and properties of the layer,” says Claudia M. Palumbiny. “Adding solvents with a high boiling point, for example, improves segregation in synthetics components. This improves the crystallization in conducting molecules. The distance between the molecules shrinks and the conductivity increases”. In this manner stability and conductivity can be improved to such an extent that the
ORGANIC ELECTRONICS
material can be deployed not only as a blocking layer, but even as a transparent, electrical contact. This can be used to replace the brittle indium tin oxide layers. “At the end of the day, this means that all layers could be produced using the same process,” explains Palumbiny. “That would be a great advantage for manufacturers.” To make all of this possible one day, TUM researchers want to continue investigating and optimizing the electrode material further and make their know-how available to industry. “We have now formed the basis for pushing ahead materials development with future investigations so that these can be taken over by industrial enterprises,” explains Prof. Müller-Buschbaum. The research was supported by the GreenTech Initiative “Interface Science for Photovoltaics” (ISPV) of the EuroTech Universities together with the International Graduate School of Science and Engineering (IGSSE) at TUM and by the Cluster of Excellence “Nanosystems Initiative Munich” (NIM). Further support came from the Elite Network of Bavaria’s International Doctorate Program “NanoBioTechnology” (IDK-NBT)
and the Center for NanoScience (CeNS) and from “Polymer-Based Materials for Harvesting Solar Energy” (PHaSE), an Energy Frontier Research Center funded by the U.S. Department of Energy, Office of Basic Energy Sciences. Portions of the research were carried out at the Advanced Light Source which receives support by the Office of Basic Energy Sciences of the U.S. Department of Energy ￭ Publication: The Crystallization of PEDOT:PSS Polymeric Electrodes Probed In Situ during Printing Claudia M. Palumbiny, Feng Liu, Thomas P. Russell, Alexander Hexemer, Cheng Wang, and Peter Müller-Buschbaum Advanced Materials, June 10, 2015, 27, 22, 3391-3397 – DOI: 10.1002/adma.201500315 http://onlinelibrary.wiley.com/doi/10.1002/a dma.201500315/full Contact: Prof. Dr. Peter Müller-Buschbaum Technische Universität München Department of Physics, E13 Chair for Functional Materials E-mail: muellerb@ph.tum.de www.functmat.ph.tum.de www.polymer.ph.tum.de
“Organic electronics”, based on conducting polymers, are hailed as a promising future market. Cover illustration of “Advanced Materials” (10.1002/adma.201570148. Artwork: Christoph Hohmann / Nanosystems Initiative Munich
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June, 2015 | EP&Dee
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USB
HSIC vs. USB A look at the advantages of HSIC over USB and the connection procedures that are involved.
Author: Andrew Rogers, Applications Engineer, Microchip Technology Inc.
The high-speed inter-chip (HSIC) interface is becoming more popular due to its notable advantages over USB for hard-wired inter-chip applications. The interface is a two signal, source synchronous interface that can provide USB high-speed data at 480Mbit/s. The data transfers are 100% host driver compatible with traditional USB topologies. Full-speed (FS) and low-speed (LS) are not supported by the format, however a hub with HSIC can provide FS and LS support. The interface differs from USB in the physical layer only. Significant features include no chirp protocol, source-synchronous serial data transmission and no hot removal or attach as the interface is always connected. It has 1.2V signal levels designed for low-power applications at standard LV CMOS levels. Maximum trace length is 10cm. The protocol for data transactions between host and device via HSIC is the same as USB, as shown in figure 1. The primary difference is that all information is transmitted via a single data line, and a strobe signal communicates when to sample the received data signal. HSIC uses double data rate (DDR) signalling; data are sampled at both the rising and falling edges of the strobe signal. The strobe signal oscillates at a frequency of 240MHz, which provides a total data rate of 480Mbit/s. Advantages over USB As mentioned, HSIC has significant advantages over USB. For a start, it is a fully digital standard and thus no analogue front end is required. The lack of an analogue front end means die sizes can be reduced, and thus so can cost. 14
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Figure 1: Data packet transferred from host to device.
DESIGN
Additional die reduction can also be made due to the decreased amount of digital logic required by the simplified connection protocol. The HSIC standard does not inherently reduce power consumption, but the removal of the analogue front end can lead to lower power designs, especially since analogue circuitry does not necessarily scale one-to-one with digital circuits for reductions in process feature size. HSIC is especially low power when placed into the suspended state as there is no current draw on the strobe or data lines. By comparison, standard USB draws a minimum of 200μA on D+ through a 1.5kΩ pull-up resistor when suspended. Because HSIC is only different from USB at the physical layer, migrating from USB to HSIC is not like changing to a completely new standard. This means existing USB software stacks and USB protocol knowledge bases can be quickly transitioned to HSIC. Data sampling With standard USB, every data packet begins with a sync pattern to allow the receiver clock to synchronise with the phase of the incoming data. The differential sign of the D+/D- signal is then sampled according to the sync pattern. HSIC uses a separate strobe line to tell the receiver when to sample the incoming data. The HSIC data signal is sampled at the rising and falling edges of the strobe signal. If the strobe and data signals become skewed for any reason, the sampled data may become corrupted. The HSIC Electrical Specification defines the maximum allowable skew as 15ps. To make sure skew does not become an issue, the HSIC traces must be kept as short as possible and must not be longer than 10cm. The data and strobe traces must be the same length and they should be routed to 50Ω single-ended impedance. To illustrate the amount of skew possible in the real world, figure 2 shows the beginning of a test packet transmitted from a host to a device with equal lengths.
USB
or receiver side. HSIC signals are more sensitive and thus transmission line theory should be considered when attempting to probe them. A good general guideline is to probe at the side opposite to the source of the signal that needs to be observed. For instance, to observe the signals originating from a device, place a probe at the host-side terminals. To observe the signals originating from a host, place the probes at the device-side terminals.
Figure 3: Strobe trace 10cm longer than data trace. When attempting to probe signals originating from a device while probing at the device side, the signal becomes distorted. This is likely due to interference caused by the signal reflecting back on itself. The middle of the trace can also be probed, but the results are typically not as clean as if probed properly from one side. The ideal would be to probe simultaneously from both ends. A series protocol analyser may be able to sample the signals accurately in both directions, but the 10cm trace length restriction makes this option impractical. Making the connection The HSIC interface is structured such that a host or peripheral can be powered on in any order. To ensure a false connection is not detected, the host, hub and peripherals must ensure that the strobe or data lines do not float to an undetermined value, commonly referred to as tri-stated.
Figure 2: Equal HSIC trace lengths. The same packet transmitted from the same host with a strobe trace that is about 10cm longer than the data trace is shown in figure 3. The resulting skew is about half of a nanosecond. This is an extreme example, but the results suggest that even a small amount of length mismatch may result in an HSIC specification violation. The single-ended nature and differences in signal termination cause some difficulties when attempting to probe HSIC lines. Standard USB signals can be easily monitored and deciphered by placing a differential probe connected to an oscilloscope at either the transmitter side
Figure 4: The connect sequence from idle and suspend to connecting and resuming signalling. www.epd-ee.eu |
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USB
INDUSTRY NEWS
Figure 4 shows an oscilloscope capture of a connect sequence. This connect sequence is much simpler than the USB connect sequence because there are no speeds to negotiate. This sequence can be handled by a very simple state machine, reducing die size requirements. With standard USB, the host can determine if a downstream port has been disconnected by monitoring the magnitudes of the DP/DM signal voltages. If the voltage exceeds the disconnect voltage threshold, the host can conclude that the device has been disconnected. HSIC does not support a disconnect protocol because it is intended to be a hard-wired, always on connection. However, it is still possible to have a situation where a downstream device may appear to have disconnected, and care must be taken to ensure the host does not permanently lose its connection with the device. This apparent disconnection or standoff can occur because the host always maintains an idle state while the bus is unused, and the idle state is identical to the suspend state from a signal perspective. The host has no way of knowing if or when a downstream device has been powered down or disconnected. Since the suspend signalling is identical to the idle signalling, it is possible to reach a state where a downstream device believes it is has been suspended while the upstream host thinks there is no device downstream and waits indefinitely for a connect signal to arrive. A similar standoff condition could occur if the upstream host disables the port while the device believes it has been suspended. This condition is not likely to occur between hosts and devices that never cycle power or soft reset. If this issue is encountered it must be dealt with in an application specific manner at either the link or software stack level. This can be done by programming the software stack or designing the link in a way that prevents the condition from occurring in the first place. Alternatively, the SoC can attempt to deal with a downstream device after it disconnects by resetting the HSIC hub. The device discovery sequence will occur and the connection will be re-established. On Microchip’s USB254x, USB3613, USB3813, USB4604 and USB4624 devices, the SoC can use the VBUS_- DET pin to re-establish the connection. Pulling the pin low suspends the hub while pulling the pin high will wake it up.
Counterfeiting:
Conclusion The HSIC standard has advantages over USB in hardwired applications as long as the correct connection and disconnection procedures are observed. These procedures are particularly important when troubleshooting some issues involving HSIC connectivity ￭ www.microchip.com
Very often, counterfeit goods are not cheap copies but failed, unsuitable or non-functional components made to look like high-value parts. If these parts enter the supply chain there is a high risk that equipment using them will not be able to perform the job for which it is designed. This presents concerns to any manufacturer. But for those making industrial and critical systems it can lead to dangerous situations. Counterfeit circuit breakers have been found in nuclear power plants – barely functional devices that probably would not trip correctly in the event of an overload. In 2011, counterfeit parts were tracked down to night-vision systems used by the military. There are a number of ways in which counterfeiters attempt to pass their products off as working components.
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how it occurs and ways to mitigate risk
Author: Dave Doherty President and COO Digi-Key
The growth in counterfeit components over the past decade has become a key source of concern for everyone in the electronics industry, from component manufacturers through to end-users. Since the early 1990s, the trade in counterfeit goods has risen eight times faster than trade in legitimate goods. The Electronic Component Industry Association (ECIA) has estimated between 5 and 25 per cent of the total available electronic components are counterfeit. The association believes the practice of counterfeiting costs the electronics industry as much as $100bn a year.
INDUSTRY NEWS
Some high-volume, relatively simple parts are copied by manufacturers and made to function similarly to their targets, albeit without the guarantees provided by legitimate manufacturers. These devices are harder to identify as counterfeits by functional testing as they are likely to have similar behaviour to the real parts. Such devices can be identified by chemical testing – as manufacturers will use subtly different recipes for key processes in their plants – and by discrepancies with the packages used by the real product. Many counterfeiters make no attempt to provide functional devices. Instead they exploit weaknesses in the supply chain itself. Manufacturers will normally mark products with logos and identifying codes but it may not be clear to a customer whether the marks they find on a received part distinguish it as a genuine product or a clever fake. A common technique is overmarking in which a cheaper device suitable only for use in systems are used in the standard temperature range is repackaged as a part that is claimed to be able to withstand more extreme temperatures. These components are then sold at a very high margin. Manufacturers of critical systems face the brunt of this type of counterfeiting because the high-value parts designed for safetycritical systems and equipment intended for extreme environments provide the greatest profit to the counterfeiter. Another technique used by counterfeiters is to locate products that were rejected during test but which were not destroyed properly, or to use products recovered from electronic waste when it is recycled. These parts may be repackaged to make them look new although they are commonly simply ‘blacktopped’ to remove any old markings and date codes and a new set of markings screenprinted over the top. Simple attempts at black-topping can be identified by chemical tests and often simply by rubbing the surface of the component as the new ink will just rub off. The real markings are often etched into the surface of the package and are therefore much harder to remove. One technique that has appeared in recent years is for contract manufacturers to ‘overbuild’ – make too many products and then attempt to sell the excess on the grey market. Although these are not counterfeits in the same sense as blacktopped or copycat prod-
COUNTERFEITING
ucts, they do not have the same support or guarantees as genuine parts and expose customers to greater supply-chain risk. Companies supplying industrial, medical and military are often likely to find themselves the targets of counterfeiters because they have to maintain long-term support for their systems and therefore are more exposed to component obsolescence. The production cycles of many components, particularly those based on semiconductors, have been compressed dramatically. Many devices are designed primarily for use in consumer markets, where the emphasis is on a rapid pace of development. For example, IC manufacturers attempt to take full advantage of the advances in process technology that occur typically on a two-year cadence to reduce prices and improve performance. Manufacturers of industrial, medical and military systems cannot move as rapidly as they need to seek approvals for redesigns and will often commit to long-term support agreements for their systems. The ability to source replacement parts for these products gets harder as time passes and legislative changes, such as the introduction of bans on materials such as lead, increase the risk of counterfeits entering the supply chain. When manufacturers discontinued the manufacture of some of their leadbased components because sales volumes did not justify redesigns to use lead-free materials, counterfeiters stepped in. They simply took similar lead-free parts and marked them up with the codes used by the lead-based components. Even if the parts worked correctly, the use of these components increased the risk of solder-based failures in the field. There is no single solution to the problem of counterfeiting but customers can protect themselves from the practice. Manufacturers are actively investigating the use of anticounterfeiting measures, such as the use of packaging marks that are very hard to copy. One example is laser marking, in which a unique pattern is inscribed into the surface of the package. Only legitimate devices will pass an optical inspection using equipment designed to read the laser-marked codes. However, these efforts are at an early stage and so cannot protect the majority of devices on a BoM. It is possible to use direct analysis of parts to determine their provenance. But many of these techniques involve destructive testing
and are expensive to implement as they require access to equipment such as X-ray sources and mass spectrometers. Even then only a sample of goods incoming can be inspected this way. The only 100 per cent certain method for ensuring that no counterfeit items have entered the factory is to test all of them – leaving none remaining with which to build the systems. Intelligence on the techniques that counterfeiters are using to mark their products can be a useful weapon in dealing with fakes. Manufacturers are now much more careful about the way in which they put trademarks and other identifying marks on their products. Counterfeiters often miss these subtleties and hope that their victims will as well. But databases introduced by supplychain organisations in recent years provide users with vital information on which fakes to look out for. However, this is a strategy that relies on constant vigilance from the user. The most effective strategy is to engage with supply-chain partners who work to ensure that they have access to legitimate parts. Many counterfeit components enter the supply chain through the grey market. By presenting them as overstocked parts or devices that have been returned from OEMs, counterfeiters can effectively launder their wares through conventional sales channels. Franchised distributors engage directly with manufacturers and can establish a complete audit trail, complete with detailed information on date codes and other supporting evidence, for the components they supply. To help counter the rise in fake components, the ECIA has put together a number of initiatives that include the creation of the Advocacy and Industry Promotion Council, of which Digi-Key is a member, to raise awareness of the issues caused by counterfeit parts. The ECIA is active in advising on legislation designed to reduce the supply of counterfeit parts and is actively supporting the role of franchised distributors through services such as ECIAauthorized.com, recognising that these supply-chain partners have the relationships with manufacturers and resources to maintain counterfeit-free networks. Counterfeiting remains a hazard for any user of electronic components but armed with the right information and with access to the right partners, there is no need to become a victim and aid the growth of this insidious crime ￭ www.digikey.com
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MCUs
#KinetisConnects: Turn your curiosity into tomorrow’s greatest invention By Kathleen Jachimiak Kathleen Jachimiak is product marketing manager for Kinetis MCU at Freecale
We all are born with an innate sense of curiosity about the world. A curiosity that parents and teachers know all too well as children are very inquisitive – constantly asking questions about the world around them. Feeding that curiosity is important because as we grow older, it becomes increasingly more difficult to find the time to learn new things. Working at Freescale, I am so fortunate to be surrounded by marketleading technologies that help make the world a smarter and more secure place. At the heart of these technologies are engineers, who have fostered their curiosity – turning those questions of ‘why’ and ‘how’ into the next greatest things. Regardless of your profession, I think we all still harness a curiosity at times about how things work and perhaps even have ideas on how to make things better. For example: Ever wonder why your remote control batteries have to be replaced so often or how the tray in your microwave spins around? Or what makes your refrigerator run?
Enter Kinetis MCUs … It is no secret that Kinetis MCUs are ‘connected’ to people, making things better for our lives every day. Whether we realize it or not, MCUs are an important part of our daily lives; from the moment our alarm clock goes off in the morning until the moment we finish our book and turn off the eReader for the evening. In fact, even the bed we sleep in may be using an MCU. Microcontrollers are embedded in almost every device connected to power or a battery. I would venture to say that the average household has at least 50 electronic gadgets and appliances with MCUs in them – spanning from your garage door opener to your smart watch, and everything in between. The increasing popularity of microcontrollers in end products is because MCUs are more full-featured, lower cost, and easier to develop with than ever before. Kinetis MCUs in particular, are focused on the following four key areas to make the experience even better for the engineers designing with them and the consumers using the end products. Security – But with the added privilege of connectivity, comes the increasing responsibility to secure it all. We want to make sure that only authorized users are seeing our information, using our devices, and that the devices in our home are not easily accessed by hackers. The security features of the Kinetis MCUs are designed to prevent unwanted attacks and protect the device. Freescale.com/security Connectivity – Our homes are getting smarter. I am old enough to remember the days before remote controls – when changing the channel required us to physically get up and change the dial. The wireless remote control was invented as a way to connect the user and the TV remotely. That idea has spanned throughout much of the home and the way in which devices connect is more advanced than ever. The thermostat is talking to the
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ceiling fan, the home alarm system is talking to the iPAD, and I feel like my kids are able to control way too many things around the house just from their gaming system. Integrated into Kinetis MCUs are smart ways for the devices to connect with each other – both wireless and wired connections. Freescale.com/Kinetis Low Power – Have you ever missed the opportunity to capture a video or picture of an important milestone because your camera battery died or got disconnected from something important as the battery icon on your phone drifted to 0%? The low-power capabilities of Kinetis MCUs enable longer battery life and are more “green” for the environment by helping save on overall system power. Freescale.com/lowpower Ease-of-Use – Kinetis MCUs are enabled by a variety of software and hardware tools. Just like a hammer and screwdriver make it easier to build a house, tools like the Freescale Freedom boards and Kinetis SDK make it easier to build the next great electronics product. By making Kinetis MCUs easier to use and design with, we allow the engineers to focus their time on new features and added differentiation. Freescale.com/Kinetis/SW As the world of technology continues to evolve, I’m excited to see what the future holds. But it first starts with you and your curiosity. What challenges do you have with technology today? How could you use Kinetis MCUs to design the next great thing? Comment below and let us know. Also, stay tuned for more information on how #KinetisConnects and how you can get involved in 2015 ￭ www.freescale.com
DESIGN
MCUs
Tighter code for your IoT edge node By David Edwards, SOMNIUM Founder and CEO/CTO
SOMNIUM® Technologies has been working closely with Freescale to provide solutions for Kinetis MCU software developers to address the IoT node design challenges. This blog was contributed by David Edwards, founder, CEO and CTO of SOMNIUM. The degree of sophistication within modern embedded system designs is phenomenal. MCUs today provide more processing and memory capacity than ever before. At the same time, IoT node design brings a familiar set of challenges – the constraints of cost, memory capacity, processing power and energy consumption. IoT edge nodes may have the most severe constraints, perhaps only containing 8 KB of flash, and 1 KB of RAM, but still requiring a conventional software development environment. 100% GNU GCC compatible with patented resequencing technology SOMNIUM DRT builds upon the heritage of the Eclipse IDE and GNU tools technology, widely deployed for almost 30 years across a huge number of users. DRT’s toolchain is fully GNU GCC compatible, so your existing CodeWarrior GCC and Kinetis Design Studio IDE source code will migrate with no changes required. Our patented resequencing technology improves developer productivity, automatically optimizing to build smaller, faster executables. This enables you to potentially use a more cost-effective Kinetis solution than you would otherwise. DRT users also benefit from access to SOMNIUM’s support team, providing help and advice on our product, when you need it.
Using Kinetis MCU demonstration applications as shown on the Freescale IoT Center community, we’ve seen impressive results of the DRT product in action. Code size reductions of over 20% coupled with performance improvements have proven that DRT lets you do more with less. An example application can fit into a 64 KB flash device rather than 128 KB device typically required using traditional development tools. This can enable a step-change in the capability and range of your IoT design choices, further reducing system cost and development time. DRT’s familiarity and compatibility with existing Kinetis tools and source code combined with patented optimizations generate the best result for the Kinetis MCUs you are using, and enable an expanded range of choices.
Faster, tighter code for your specific edge node SOMNIUM DRT uses our patented Device-aware Resequencing to optimize for performance, code size and energy. Traditional code generation tools only consider the processor’s instruction set and don’t optimize for your chosen device’s memory system. DRT is different. The entire code generation flow is device-aware and considers the respective Kinetis MCUs core architecture, which is based on an ARM Cortex®-M core, and the memory hierarchy (e.g. cache configuration, buffers, on-chip flash, RAM etc.) for your specific IoT edge node design. The whole process is automated and transparent, with no new commands or extra compilation steps. From the first invocation of the compiler, code generation is tuned for your Kinetis MCU. At the linking stage, the whole program is resequenced to get the best “fit” for how it interacts with the processor and memory system, to ensure the smallest most efficient program is generated. No changes to your source code or working practices are required. DRT’s features allow you to leverage your existing source code, and continue to use Freescale’s Processor Expert software and the Kinetis software development kit (SDK) to access the rich set of onchip peripherals and off-chip interfaces provided on Kinetis MCUs. This is key to getting your IoT design to market quickly, in a highly cost optimized form.
What’s next? SOMNIUM DRT, Freescale Kinetis MCU edition, will be on general availability for product purchase and 30-day evaluation later this month. For further information and demonstrations of DRT’s features and benefits please take a look at the SOMNIUM page on the Freescale IoT Center. ￭ www.freescale.com www.epd-ee.eu |
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MCUs
How current technology will be adapted for tomorrow’s needs in automotive By Luis Olea Luis Olea is an Automotive Applications Engineer at Freescale Semiconductor. Google shocked the automotive industry by showing the world its self-driving car, which doesn’t have a steering wheel or pedals. BMW showed the public its “highly autonomous driving” demo during CES 2014, in which the car takes control of the wheel using various sensors and actuators. Audi has their own self driving system called “Piloted Driving,” which can steer to follow lanes and maintain distance with nearby vehicles controlling the pedals, assisted by light detection and ranging. But when are the drivers going to enjoy the perks of semi or fully assisted driving? Is the market ready to adopt these technologies? Although most people may cringe at the idea of relaying the control of their vehicle to a computer or a processor, they are likely unaware that most of the functions of their cars, and the majority of cars on the road, are already being managed by devices such as sensors, processors, and microcontrollers that are the backbone of the autonomous vehicle. Let’s take a quick look under the hood Engine control units (ECUs) or powertrain control modules (PCMs) are computers that control a series of actuators on internal combustion engines based on arrays of sensors to ensure optimal engine performance. They read a multitude of embedded sensors within the engine and decide in real time when to open and close the air and fuel intakes and when to fire the spark plugs. Computers have been in charge of these vital vehicle functions for more than three decades. In 1980, Freescale (Motorola at the time) introduced the world’s first electronic engine control unit and since then the microprocessor controlled electronic fuel injection system has been the standard approach. Transmission control units are devices that control modern electronic automatic transmissions. These controllers typically use sensors from the vehicle as well as data provided by the engine to calculate how and when to change gears in the vehicle for optimum performance, fuel economy, and durability. Automatic gear changes in vehicle transmissions are no longer enacted by transmission fluids or mechanical means. 20
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Instead, a computer is in charge of deciding when to change gears and uses an electromechanical actuator to shift the gear. Anti-lock Braking Systems (ABS) are automated systems that allow the wheels of a vehicle to maintain tractive contact with the road while braking, this prevents the wheels from ceasing rotation to avoid uncontrolled skidding. This means that a computer decides in real time how much braking fluid is actually applied to the braking system using hydraulic valves. Auto manufacturers such as Chrysler and Mercedes have relied on processors to control this vital function in vehicles since 1971, with others adopting this soon after. Drive by wire uses an electromechanical system to replace the traditional human machine interfaces of a vehicle. For example, when you turn the steering wheel or press the gas pedal, the driver is no longer driving a mechanical system that is ultimately causing the wheels to turn or more gas to be pumped to the engine. Instead, this action is causing sensors to be activated and information is transmitted to the appropriate control unit, and a computer applies the intended mechanical action steering, acceleration or braking. Nissan was the first manufacturer to place this system in a production model, allowing flexibility and configurability in the drivers’ operation. How will the current technology connect to the future? These are examples of the current marked adoption of embedded electronics, and clearly indicate the auto manufacturers’ trust in current solutions. They are also ready to be part of autonomous driving systems because they communicate with their environment through a CAN or Flexray communications bus. These computer signals will not distinguish if a turn or acceleration command was originated by human action or by an electronic control unit that decides what to do based on maps and sensors. But what will the future entail? What elec-
tronic systems and underlying silicon solutions can enable autonomous driving to become a reality in production models? Freescale and its partners have paved the road with hardware and software solutions to achieve this as soon as 2017. The market is ready to adopt active safety systems that take the wheel to avoid danger,
such as safety brake assist, traction control, and collision avoidance systems. Safety brake assist detects when a potential dangerous situation exists and pumps up the power of the brakes. Studies have shown that even when drivers react in time, they may not apply enough brake to avoid a collision. Collision avoidance systems use radar, laser, and camera sensors to detect an imminent crash. Once the detection is made, the system may just provide a warning or take action autonomously without any driver input. Applications include 360 degree surround view and camera based park assist, cross traffic alert and blind spot detection. People will remain skeptical handing over control of their vehicle to a computer, but as I’ve explained above, the foot is already in the door for most OEMs. Slow, useful, and practical implementation by OEMs may just be the key to mainstream acceptance. Driving a car can be one of the most dangerous, risky, time consuming activities in your day. Autonomous vehicles are not about taking control away from the driver, rather, making the process of driving a safer and stress free experience ￭ www.freescale.com
DESIGN
AUGMENTED REALITY
The path toward augmented reality with Renesas R-Car family
Author: Simon Oudin, Senior Marketing Engineer Renesas Electronics Europe
The combination of powerful 3D graphics, outstanding computer vision capabilities and optimized video capture to form single chip SoC solutions is key to the success of future parking assistance solutions that include surround view systems using multiple cameras. The second SoC generation from Renesas, called R-Car, aims at providing the appropriate solution to enable ready to use advanced 3D surround view applications and offer the driver an immersive and safe experience. Key words: ADAS, 3D surround view, 3D graphics, computer vision, image recognition, structure from motion, Ethernet AVB, video compression, low latency 22
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DESIGN
INTRODUCTION Surround view monitoring will become a common functionality in cars. This feature is part of the parking assistance system. From a niche market first driven by Asian car makers, it has become an option offered by the majority of car manufacturers, with the consequence of a higher requirement in terms of driver experience and solution scalability. Renesas, as a lead SoC vendor for infotainment and ADAS applications, is already a major player for supporting surround view requirements in their early phase. Today, Renesas provides a new generation of SoC to answer global market needs with a scalable and innovative approach. SURROUND VIEW WITH R-CAR GEN2 FAMILIE The purpose of surround view monitoring is to display a panoramic view of the car’s immediate surroundings. This representation, at 360 degrees with 2D perspective from the sky, is called “bird view” or “top view”. The different views are stitched together thanks to the correct geometric alignment of the cameras. The brightness and colour of the different cameras’ videos are modified for the harmonization of the surround view [1] [2]. Nevertheless, displaying only this representa-
AUGMENTED REALITY
tion does not generally help the driver during the parking process. To facilitate this manoeuvre, additional information can be shown to the driver as 2D overlays or rear view [1]. A complementary approach is to improve the driver apprehension of the distances with a 3D representation of the car’s surroundings. The target is to use 2D cameras around the car to create a 3D comprehensive representation of its immediate vicinity with a 3D generated car as a driver perspective reference. It should reflect a realistic representation of the distances to nearby elements (pedestrians, cars and buildings). The 3D sphere perspective should dynamically change according to the car movement. The model car has to be properly integrated in the overall scene with light or reflection on the model car [2]. This level of application drives the performance required in terms of 3D graphics and computer vision in an automotive embedded platform. Renesas created the SoC family called R-Car in order to enable this level of applications. The second R-Car generation was first officially released in March 2013 and supports a wide variety of applications, such as connectivity, entertainment expansion and ADAS. This family provides outstanding performance with optimal power consumption capabilities [3] and a
common API for reducing customer development efforts. From this family, two devices support surround view application: the R-Car H2 and the R-Car V2H. 3D IMMERSIVE EXPERIENCE WITH R-CAR H2 R-Car H2 is the first device released in March 2013 and tailored to integrated cockpit solutions with the 3D surround application. For this utilisation, we first need to consider 3D graphic engine performance requirement. We should particularly pay attention to the two parts of the scene: the texture mapping of the 2D camera images on a 3D sphere and the 3D car representation. The polygon count of the scene depends on the deformation of the 3D sphere and the rendering effects on the car model. For better rendering, the graphic engine must be able to process a significant polygon count in a short time. Moreover, as the application can use different shader programs for one scene, the graphic engine must come with a powerful shader engine. Those performance requirements must be supported by a high GPU frequency, which will allow fast data processing. All these performance aspects justify Renesas’ decision to integrate an outstanding 3D graphics engine in R-Car H2. Indeed, its 3D graphic engine provides similar performance than the latest iPad Air 3D graphic engine.
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DESIGN
AUGMENTED REALITY
THE PATH TOWARDS AUGMENTED REALITY The sensing of the scene in 3D is the other important aspect required to provide easy to understand content. This can be achieved with two techniques. The first is human-like stereo vision, although it has the disadvantage of double the camera cost and integration effort. The other option is to create the Structure from Motion (SfM) of the car, thus providing stereo vision over time. Renesas has implemented vision-dedicated hardware accelerators into the R-Car family to power this algorithm on the four cameras in real-time, meeting both performance and low power consumption requirements. The SfM algorithm issues a list of flow vectors representing the motion of the vehicle and surrounding objects. The next non-trivial task is to find the car’s egomotion by calculating the essential movement from flow vectors and matching the majority of them. From this fundamental matrix, flow vectors can be sorted corresponding to static and dynamic objects in the surroundings. Static object flow vectors directly provide the dis-
tance of the object inversely proportional to the flow length. Figure 1 (a) shows an example running on RCar H2. The circles represent the static feature points which are the outcomes of the structure computation. The colours correspond to the clustered objects which are then fed back to the model deformation. Those can then be used to adapt the 3D model of the environment in real time as shown in Figure 1 (b). Finally, a realistic representation of the car environment is created based on this 3D model mapped with the 3D sphere generated by the graphic engine. ETHERNET: FLEXIBLE APPROACH WITH R-CAR V2H The R-Car family also includes the R-Car V2H, which provides a unique video path approach from the camera video acquisition over the Ethernet network down to the display interface. This pipelined approach not only releases the requirements to the rest of the system (e.g. overall latency, memory bandwidth and CPU intervention), but also drastically
reduces the software development complexity for the system maker. Figure 2 shows this special video path of the R-Car V2H. There is no external memory access from the four cameras demultiplexing to the geometric video transformation and each hardware accelerator is dedicated for one camera. System cost reduction is a main aspect contributing to the higher adoption of the surround view. Cabling is a non-negligible portion of that. In the past year, two approaches have emerged to reduce current LVDS based surround view systems [4]. One uses Ethernet over an unshielded twisted pair, the alternative being an update of LVDS to cost-effective coaxial cables. Both approaches lead to a similar system cost. However, the Ethernet solution not only helps system cost reduction but also offers flexibility for future applications. For example, with the increasing adoption of drive recording systems, new features like multi-channel simultaneous video recording could be supported with very limited impact on costs, as only the SD card interface would be required.
Figure 1: SfM algorithm implemented in R-Car H2. Outcome of SfM algorithm running on one camera with R-Car H2 (above). 3D model of the environment based on SfM process outcomes (below) 24
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DESIGN
The other benefit of Ethernet over LVDS lies in the standardized approach from both MAC levels with AVnu Alliance and PHY level with Open Alliance.
AUGMENTED REALITY
OPTIMAL LATENCY VIDEO PATH One of the main aspects requiring careful design is latency – in the transport including compression and decompression, as well as
in the processing chain. Indeed, the overall latency from camera capture to display should be below 100ms in order to enable real-time perception to the driver.
Figure 2: Surround view video path on R-Car V2H with Ethernet input
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DESIGN
AUGMENTED REALITY
Currently, cameras run at a frame-rate of 30 frames/sec. When using the global shutter, the sensor cells charge during the exposure
The first multi-camera systems with Ethernet used low latency Motion JPEG (MJPEG) compression. This technology is based on the
overall latency in an Ethernet network is reduced in comparison with a classic LVDS approach, as shown in Figure 3.
Figure 3: Latency for video transportation and geometric transformation time and all at the same time. Then the imager starts to output pixel by pixel. Consequently, the last pixel is sent around 1 frame (33ms) after the capture. This is the first frame delay, which cannot be reduced. The other incompressible delay is for the display, where pixels must all be transmitted before they can be displayed, again around 33ms. Finally only 33ms remain to perform the rest of the tasks described in Figure 3. The first item of the chain is the data transmission. The Ethernet protocol does not provide dedicated mechanisms to ensure low latency transport and camera synchronization. This is why Renesas introduced the first Gigabit Ethernet MAC with advanced AVB hardware support in the R-Car family [5]. This specific implementation provides the necessary hardware to reduce CPU load and optimize the overall compressed video reception. Some specific mechanisms have been implemented as intelligent packet decapsulation and camera video filtering. The multi-view camera applications are part of the AVnu Alliance AVB Automotive profile with fast start-up, low latency (maximum delay of 2ms) considerations for camera video [6]. 26
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well-known JPEG standard widely used in consumer digital cameras. Nevertheless, the impact on quality video with this technology could limit the vision processing performance [7]. Consequently, Renesas considered H.264 compression technology to be the best solution for camera video transmission [8]. It provides a better compression ratio for improved vision processing performance [7] [9]. It has been also massively adopted in all consumers’ equipment that could be connected to the car through Renesas Infotainment connectivity solution. With the R-Car V2H, Renesas has implemented the first HD multi-channel, H.264 compliant, low latency decoder in an automotive SoC. The ultimate step to reduce the latency is to decrease the latency in the processing portion. Indeed, traditional DSP based systems require a double buffering approach for the video capture. The R-Car V2H features a dedicated engine called IMR that processes the image geometric transformation on the fly. This feature supports direct streaming from up to 5 low latency video decoders. Thanks to the direct path in R-Car V2H, the
REPRESENTATION AND DETECTION The IMR is also capable of using a look-up table (LUT) to modify the viewpoint transformation to a 2D or 3D surround view representation on the fly. The camera viewpoint can be modified for each input frame, enabling animated transition between the user’s viewpoints. Bilinear filtering is natively supported, providing excellent image quality. Thanks to this approach, the R-Car V2H natively supports 3D surround view with very low memory requirements. The R-Car V2H offers the same image recognition hardware as the RCar H2. Consequently, it can also enable SfM computation or even pedestrian detection. It is capable of detecting pedestrians for each of the four cameras in parallel, using histogram of gradient and support vector machine classification. This feature has been already demonstrated on the R-Car V2H during the Renesas Developer Conference last September in Japan, and at Electronica last November in Germany. Figure 4 shows this proof of concept [10].
DESIGN
AUGMENTED REALITY
Figure 4: 3D surround view demonstration with pedestrian detection based on R-Car V2H CONCLUSION In this article, we have presented the trend of automotive multi-camera applications focusing on the 3D surround view for parking assistance systems. We have also introduced the scalable R-Car automotive SoC family. R-Car H2 is capable of creating 3D comprehensive representa-
tion of a car’s immediate surroundings to facilitate parking manoeuvres. In the R-Car V2H, a unique direct Ethernet video path has been introduced with Ethernet AVB MAC and multi-channel H.264 low latency decoder for ultra-low latency video processing and memory bandwidth reduction. Considering that this application would be part of an autonomous parking assistance
system, Renesas has already introduced key features to target an ASIL B at system level ￭ www.renesas.com Simon Oudin is Senior Marketing Engineer for surround view applications in the newly created “Global ADAS Solution Group” at Renesas Electronics Europe.
References [1] Mengmeng Yu and Guanglin Ma, Delphi Automotive “360° Surround View System with Parking Guidance”, May 2014 [2] M. Friebe, J. Petzold, “Visualisation Functions in Advanced Camera-Based Surround View Systems”, 2014 [3] Peter Fiedle, “Mehr Power weniger Leistungsaufnahme”, February 2014 [4] N. Noebauer, “Is Ethernet the rising star for in-vehicle networks?”, September 2011 [5] S. Oudin, N. Kitajima „Das zukünftige Ethernet-AVB Netzwerk“, November 2012 [6] AVnu Alliance White Paper “AVB for Automotive Use” http://www.avnu.org/knowledge_center, October 2014 [7] J. Forster, X. Jiang and A. Terzis “The Effect of Image Compression on Automotive Optical Flow Algorithms”. 2011 [8] T. Wiegand, G. J. Sullivan, G. Bjøntegaard, and A. Luthra, “Overview of the H.264/AVC Video Coding Standard”, Juli 2003 [9] T. Nguyen, D. Marpe, “Performance analysis of HEVC-based intra coding for still image compression”, May 2012 [10] http://am.renesas.com/edge_ol/topics/21/index.jsp www.epd-ee.eu |
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DESIGN
POWER ICs
Embedded Power ICs
Maximum Integration on Minimum Space Mathias Müller, Product Sales Manager Power Semiconductors and member of the new Automotive Business Unit , Rutronik Elektronische Bauelemente GmbH
Infineon's new TLE986x/7x product series is a third-generation system-on-chip solution (SoC) that offers a wide range of functions – all in particularly compact housings. This makes Infineon one of the first semiconductor manufacturers to offer a highly-integrated embedded power series with a powerful microcontroller, flash memory, MOSFET gate driver and an extensive range of analog and mixed signal peripherals on the market.
With various versions, graded by the size of the internal RAM and flash memory, CPU clock speeds and communication interfaces, developers are free to choose the ideal module for each application. Two base types with an integrated two-phase gate driver or three-phase gate driver form the core structure of the embedded power ICs. Both are based on single-chip technology and include an ARM® Cortex™ M3 processor with a clock speed of 24 MHz or 40 MHz. The Cortex™ M3 Core opens up entirely new opportunities in the field of motor control algorithms. The 32-bit μC range addresses 28
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precisely the BLDC segment that was served by 16-bit controllers in the automotive industry in the past. Infineon has also set new standards in the selection of the housing – the space-saving housing concept, known as the “VQFN48 package”, which has only been available to the automotive sector since recently. This package enables automotive system manufacturers to develop much more compact and efficient systems that are optimized to use the available space. Whereas up to 150 different components may be used in modern circuits, the use of the new TLE986x/7x embedded power range enables this to be reduced to less than 30.
Of course, all TLE986x/7x components are AEC Q100-qualified. Today, with the numerous intelligent and highly complex motor drive systems that vehicles host, it is more important than ever to develop refined control systems in order to keep system costs manageable, optimize systems in terms of their energy efficiency, and ultimately also improve convenience in development. Infineon's new third-generation range of products unites all of this. The TLE986x series with gate drivers for four n-channel FETs with H-bridge topology as a power stage was specifically conceived to drive two-phase DC motor systems.
DESIGN
It is conceivable that it might be used in automated car sunroofs or to control door windows. Of course, the modules of the TLE986x series can also be used for all H-bridgebased drive systems in the car. The TLE987x product group with its six nchannel FET drivers is suitable for driving three-phase (BLDC) motor applications, including fuel pumps, motor fans, blowers for air conditioning systems, water pumps, and a variety of other pumps and fans in sensorless or sensor-based PWM motor control applications. The optional LIN transceiver of the TLE986x/7x product group is consistent with the LINstandard 2.2, and has been certified by IBEE Zwickau and the C&S Group.
The peripheral set of both modules includes a current sensor and a 10-bit ADC (analog-digital converter) that operates using the successive approximation method and is synchronized with the capture/compare unit (CAPCOM6) for PWM (pulse width modulation control) and 16-bit timers. This is especially important in timesynchronized signal generation, for example with PWM or the synchronous analog signal processing in the ADC. For communication with the component, an integrated LIN transceiver, UARTs, SPIs and a variety of general purpose I/Os (GPIOs) are
POWER ICs
available. Both product families have a linear voltage controller integrated on the chip to supply the internal modules and a controller for external loads (e.g. sensors), as well as between 36 kB and 128 kB of scalable flash memory. A nominal voltage supply range of 5.4 to 28 V is also accommodated. The integrated charge pump enables low-voltage operation of the MODFET bridge at as low as 5.4 V with the minimal external integration of two capacitors into the circuit. This cuts the BoM (bill of material) costs significantly when compared to the frequently used bootstrap method for low-voltage operation. The bridge drivers can also be used to program the charge and discharge currents. Combined with the patented flank control for the power profile, this enables the EMC behavior to be optimized at system level for a wide variety of MOSFETs.
product family module in question, and enables a motor to be started directly thanks to the MOSFETs present on the board. The design of the evaluation boards allows for the handling of loads with a maximum power consumption of 30 A. Depending on the model, the MOSFETs on the evaluation boards are either arranged in an H-bridge configuration for a DC motor or in a B6 pattern for BLDC motors. UART and LIN communication, direct access to all I/O pins, and a J-Link debugger are also available.
Both series can support up to 40 V and can therefore accommodate typical 'load dump' scenarios. At the same time, an expanded operating range of up to 3 V is enabled through keeping the microcontroller and the flash memory fully functional.
Power at Rutronik Power semiconductors and their applications have been a focus of Rutronik since back in 1980, meaning that today's team can provide many years of experience, in-depth knowhow and close partnerships with the world's leading semiconductor companies ďż
For this, Infineon offers a testing and debugging tool for the TLE986x and TLE987x embedded power IC series. The TLE986X EVALB_JLINK or TLE987X EVALB_JLINK evaluation board provides a full testing interface for all functions, peripherals and properties of the TLE986x/7x
An extensive toolset, ranging from an editor, compiler and debugger to a code configurator and a variety of example programs, are available to level out the learning curve of application development with the TLE986x/7x module family.
Rutronik www.rutronik.com More information at: www.rutronik-tec.com/power Contact: Power@rutronik.com
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29
PRODUCT NEWS
AUTOMATION
Tape extension sensors Looking to extend and improve its already wide range of linear measurement sensors, ASM has taken the basic principal of a standard manual tape measure and re-engineered it to give an electronic output using a high specification stainless steel tape that is highly flexible. Integration of this to a re-wind spring arrangement and an ASM PRAM encoder results, says the company, in the operating principles of a new measuring device. A similar principle has been used for many years using a plaited stainless steel wire winding over the circumference of a precision drum. More demanding industrial applications requiring higher duty cycles mean that in certain cases this is no longer suitable for the life expectancy of the process equipment.
PRAM absolute, multi-turn encoder with on board signal conditioning. This is magnetically coupled to the drum arrangement which allows the tape to be over wound onto its self in continuous spiralling layer which is all kept under a constant tension with a tensator spring. To attain the high positional accuracy required the sensor is only programmed and linearised after assembly. This is due to the over winding of the tape which would otherwise not give a linear output. This new improved system enables us to offer a standard linearity of 0.10%. Optionally a higher linearity of 0.05% is also available all in a wide range of compact housings.
ASM has made significant improvements by utilising a 10mm wide and 0.08mm thick stainless steel tape. This is the core difference in the evolution of the Tape Sensor compared to a wire sensor. The life of the tape is unaffected when using multiple direction changing pulley’s for those difficult to reach places. In a wire sensor the life can be reduced by as much as 80% by using multiple pulleys. The Tape Sensor gives the life requirement and reliability expected by today’s industries. Its flat smooth surface prevents ice build-up so it is also suited to harsher climates where mechanical devices are often prone to failure. At the heart of the sensor is an ASM none-contact 30
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The main failure mode of conventional ‘contacting’ position sensors is that they wear out much more quickly than ‘non-contacting’ systems. By using the ASM PRAM non-contact Magnetic Encoder the performance is immediately improved compared to systems using potentiometers or other contacting technologies. The performance of the stainless steel tape enables the operating life expectancy of the sensor to be unaffected especially when incorporating directional changing pulleys. Also due to the overwind design of the internal tape pulley if the sensor is accelerated beyond its specification then the tape is unable to ‘jump off’ the pulley as is sometimes the case with a ‘wire draw’ system. The new PRAM sensing element electronics are fully encapsulated enabling them to work in much harsher environments where shock and vibration as well as dust, grease and condensation may have caused previous concerns. For safety critical areas devices can also be offered with a redundant output which can be used as an independent output or for error checking and failure of supply voltage A wide range of both analogue and digital absolute outputs are available including CAN bus options to meet today's varied requirements. Tel. +40 256-201346 • office@oboyle.ro • www.oboyle.ro
PRODUCT NEWS
Leuze n n n
Optical sensors Sensors for logistic applications Safety at work
SENSORS
ASM n n n
GMW
Linear Sensors Angle Sensors Tilt Sensors
n n n n
Contrinex n n
Optical Sensors Inductive Sensors
Selec n n n
Digital panel meters Panel indicators Bus bar isolators Current transformers
Industrial connectors
PLCs Temperature Controller Timer
n n n n
Circular connectors M8; M12; M23 Cable and Connectors for Sensors Valve Connectors Distribution Blocks
Special Approvals
Sensor Instruments n n n
Color Sensors True Color Sensors, Spectrometers Gloss Sensors
Kobold n n n
Flowmeters Level Indicators and Switches Pressure Sensors and Switches
n
IP69K Tel. +40256201346 office@oboyle.ro www.oboyle.ro
AUTOMATION
Cost-effective solution with Contrinex C44 Container-handling cranes in busy British seaports operate around the clock. Sensors on each hoist carriage detect its position
with respect to the crane structure and prevent it travelling outside preset limits. Mechanical play in the hoist carriage allows a small
amount of lateral drift as it travels along the crane structure. Adequate sensing distance is essential to prevent the sensor colliding with the crane structure. Customer value • Reliable sensing of hoistcarriage position in a busy container seaport • Significant reduction in crane downtime • Marked decrease in maintenance costs for replacement sensors
Advantages of C44 inductive sensor from Contrinex • Sensing distances up to 20 mm in industry-standard 40 × 40 mm housing • IP68/IP69K
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PRODUCT NEWS
SENSORS
Leuze’s optical sensors for packaging applications Container detection Triggering sensors Leuze PRK 3B/6.42 – the clear solution ￭ Works perfect with transparent containers – no time and costs for changing the form and kind of container ￭ Teach button – easiest adjustment with optimized function reserve and highest sensor performance for your machine. Don`t waste time and money with down time! ￭ Small and robust – easy to integrate. Space saving design of your machines is no problem ￭ The universal solution – for all functions of your machine. Triggering, presence detection or break control – solve all challenges with the same sensor
Container detection Triggering sensors Leuze PRK 5 – the economical alternative ￭ Robust plastic housing for industrial use – safes function of your machine even in a harsh environment ￭ Integrated metal threads – mounting is easy and saves your time and costs. Mechanical damage will be eliminated compared with plastic threads ￭ Bright light spot and LED indicator – easy start-up and function check saves time and money during installation and operation ￭ The universal economical solution – for all functions of your machine. Triggering, presence detection or break control – solve all challenges with the identical technology
End of tape detection with diffuse sensor Leuze HRTR 3B-XL – the solution for clear on clear labels ￭ Detects all materials due to a special designed extended light spot – also clear on clear. No expenses for changeover work ￭ Adjustment is easy and fast with a visible light spot and LED monitor – all this will bring you a benefit in time and costs ￭ No reflector needed – you will get less expenses for mounting and installation
End of tape detection with diffuse sensor Diffuse sensor Leuze FT 5 – the economical alternative ￭ Visible light spot and LED indicator – easy start-up and function check ￭ Robust plastic housing with integrated metal threads – reduction of maintenance time and costs caused by mechanical damaged sensors ￭ Flush fit mounting with cable exit at the corner – space saving design is possible without any compromise to the functionality
End of tape detection with diffuse sensor Leuze HRTR 3B - end of roll detection without reflector ￭ Detects all materials with smallest influence from the surface of the material. No readjustment necessary when the label change. ￭ Adjustment is easy and fast with a visible light spot and LED monitor – all this will bring you a benefit in time and costs ￭ No reflector needed – you will get less expenses for mounting and installation ￭ Sensors with measuring function and output are available from Leuze electronic as well Tel. +40 256-201346 • office@oboyle.ro • www.oboyle.ro 32
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PRODUCT NEWS
SENSORS
PASCAL Ci4 from LABOM The intuitive pressure and differential pressure transmitter meeting highest standards - High-resolution graphic display - Intuitive operation The all-rounder for maximum performance The ultimate in measuring accuracy, process robustness combined with intuitive and convenient operation - that‘s the PASCAL Ci4 range. The HART7 standard guarantees flexible integration into control systems and compatibility with similar equipment. The high-resolution, illuminated graphic display can also be read in poor light and can be fitted up to 10 metres away to service hardto-reach measuring points. Even unusual temperatures of - 30°C and up to + 80°C do not harm the readability of the display. The intuitive 4-button operation assists users with help texts and information dialogues. With just a few clicks, users can have rapid access to device parameters directly on the display. Comprehensive diagnostic and simulation functions round off this high grade measuring instrument. Process connections ￭ Wide range of different threaded connectors ￭ Suitable for use with all LABOM diaphragm seals ￭ Additional components, like capillaries or temperature decouplers, are also available ￭ Optional rear-sided connection or front flange for flush mounting
Communication ￭ HART7 standard ￭ Integration in SIEMENS PDM 6 and 8 ￭ Integration in FDT environments (z. B. PactWare, FieldCare) via DTM ￭ Field Communicator 375 / 475 ￭ Simple icons indicate device status
- Quick setup function - Removable display / control unit
Case design Proven basic concept with process connection underneath, electrical connection at the rear and front display ￭ IP 65 / 67 or IP 69K protection rating
￭
￭
￭
Fully-operational control module with the same functionality as when operating directly on the unit It can be fixed in place by means of a wall bracket or clips
Electrical connection ￭ Circular connector M 12 × 1, cable gland M 16 × 1.5, M 20 × 1.5, both polyamide or stainless steel, 1/2“ NPT polyamide ￭ Multi-chamber housing with large, easily accessible terminal compartment ￭ Three different terminal blocks (spring clamp, pole, screw terminals)
External features ￭ Type plate with indestructible laser marking ￭ Material: Wetted parts are made of stainless steel 316L ￭ Hygienic version: Stainless steel front cover with safety glass
Removable control unit ￭ The display and control unit can optionally be fitted up to 10 metres away from the measuring point if it is concealed or hard-to-reach
Optimised menu navigation The quick setup summarises all the major parameters in a single menu. Various configurable displays enable users to select which and how many subordinate variables are displayed. All parameterisation data can be copied from the devices into the configuration memory in the display module. The data is permanently stored there. The parameters can be transferred simply and quickly to other devices. Calibration options ￭ Zero point correction ￭ Position correction ￭ Lower / upper adjustment ￭ Current adjustment Diagnostic functions ￭ Resettable pointers for pressure and temperature (sensor) ￭ Operating hour counter ￭ Maintenance timer, device generates a service signal after a period of time that can be set (displayed by the icon on the display and by HART) ￭ Error messages: The device displays the last error message in plain text
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PRODUCT NEWS
AUTOMATION
Contrinex C23 Full Inox: flat, rugged, efficient The new, flat C23 from Contrinex is ideal for applications where space is scarce but long operating distances are still indispensable. ous parameterization options, such as switching between NO and NC operation or programming an ON or OFF delay. Your advantages • Indestructible sensor • Factor 1 on steel and aluminum • Long operating distances • IO-Link Typical applications • Grippers and clamping devices • Gantry robots With this sensor’s all-metal housing, applications do not need to pull any punches. Shock and vibration can do no harm to this little problem solver, thanks to its Condet technology and stainless steel housing.
Installation is very simple from the front of the device using the two drill holes. Thanks to Contrinex ASIC technology, the new C23 is highly accurate and has an IOLink interface. This gives the customer vari-
• Tel. +40 256-201346 • office@oboyle.ro • www.oboyle.ro
ContriNet: the powerful RFID network for low and high frequency Users of industrial RFID can maximize the flexibility of their systems with the powerful ContriNet RS485 network from Contrinex. mechanical shocks, corrosive chemicals and high-pressure jetting. Despite these challenges, identification systems must operate continuously with high reliability. Typically, RFID tags are mounted on the part carriers. On arrival at the washing station, information from the tag is used to select the correct washing cycle for the part type and process.
ContriNet not only allows up to 31 read/write modules (RWMs) to be connected to an industrial fieldbus, but also the mixing of low and high frequency RWMs in the same network. In addition, since all Contrinex high frequency transponders are ISO/IEC 15693 compatible, equipment from different manufacturers can be combined. Threaded RWMs are available with S12 connector and RS485 output. The range includes rugged all-metal RWMs with an 34
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impervious sensing face and high-temperature RWMs for up to +125°C (257°F). Interfaces are provided for most industrial fieldbuses and USB. The highly flexible ContriNet network is a powerful tool in the hands of RFID system integrators for smart factories. Application: washing station In the harsh environment of a washing station, RFID transponders and read/write modules are exposed to hot water,
ConIdent advantages ConIdent passive tags require no power source and minimal maintenance. Rugged, low frequency tags with all-metal housings are sealed to IP67 or IP69K to resist water penetration and can withstand temperatures up to 180°C (+356°F). Their extended sensing range reduces the risk of mechanical damage. Read/write units interface directly with customer control systems
• Tel. +40 256-201346 • office@oboyle.ro • www.oboyle.ro
PRODUCT NEWS
SENSORS
Mouser Stocking Industry’s Smallest Inertial Measurement Unit, the BMI160 6-Axis from Bosch Sensortec Mouser Electronics is now stocking the BMI160 6-Axis Inertial Measurement Unit (IMU) from Bosch Sensortec. This low-power, low-noise unit is designed for mobile applications that require highly accu-
rate, real-time sensor data, such as augmented reality, immersive gaming and indoor navigation. The BMI160’s tiny 2.5 × 3.0 × 0.83mm, 14-pin LGA package and built-in configurable power management unit (PMU) make it the smallest inertial measurement unit in the market.
The Bosch Sensortec BMI160 6Axis Inertial Measurement Unit, available from Mouser Electronics, features a 16-bit, 3axis accelerometer and an ultralow power 16-bit, 3-axis gyroscope that consume only 950 μA in full operation without internal duty cycling — ideal for always-on applications like wearable devices. Further supporting always-on applications, a configurable on-chip interrupt engine provides context awareness for operations such as any- or no-motion detection, tap/double tap sensing, orientation detection, free-fall, or shock events. The IMU also offers 6- and 9-axis sensor fusion, synchronizing data with an external sensor, such as a magnetometer. MOUSER ELECTRONICS www.mouser.com
Hoffmann-Krippner Unveils Sensor Solutions for the Internet of Things and M2M SensoInk is an innovative, reliable and highly accurate sensing solution based on printed polymer pastes. SensoInk is a 5V analog solution with low power requirements and operates at 5V. By using polymer thick film technology, SensoInk is extremely flexible, and can be printed as potentiometers, resistors, switches or keyboard contacts on circuit boards or electronic components. It enables device developers to quickly and easily implement individual specifications without sacrificing quality. By using SensoInk, there are no negative electromagnetic effects (Electromagnetic compatibility). Only two components are required for signal transformation: a printed
potentiometer track on a carrier material (e.g. FR4 or PET foil) and a conductive wiper. Sensofoil® thin-film membrane potentiometers are the world's most reliable membrane position sensors. SensoFoil offers a flat design of 0.5 mm to 1 mm, repeat accuracy of 1mm to 10μm, easy to achieve redundancy and problem-free device
integration. The standard linear Sensofoil is available in lengths of 50 mm up to 500 mm, 40mm wide rotary, and custom sizes and shapes. HOFFMANN + KRIPPNER GROUP www.hoffmann-krippner.com
‘Plug & Play’ proximity switches from Panasonic are thin, and feature background suppression for more reliable detection
Avago Technologies Launches New High Resolution Motion Feedback Encoders for Industrial Motion Control
Panasonic Automotive & Industrial Systems has introduced a new series of human detection proximity sensors. MA Motion series sensors are 35 % thinner than previous versions and are simple to install thanks to their ‘plug and play’ nature. More, the new devices feature built-in trigonometric background suppression, so they are unaffected by changing scenes or by people passing by outside the detection range. Also, changing light conditions and bright daylight measuring up to 30k lux at the sensor’s surface will not affect the performance of the sensor. Like previous versions, the proximity sensors measure
Avago Technologies announced a new series of high resolution 3-channel optical incremental encoder modules, the AEDT981x, designed to enable a new generation of robust, high precision motion control applications including DC servo motors, linear and rotary actuators, factory automation equipment, 3D printers, robotics and drones. Expanding upon Avago’s market-proven HEDS914x module series, the new AEDT-981x module series features a built-in interpolator supporting a wide range of encoding resolution from 1,000 to 5,000 counts per revolution (CPR) using a codewheel of 11mm optical radius. The new module series is industrial grade with operating tem-
10mm wide and 20mm high, but their depth is only 12.7mm compared with 19.5mm. The timing of the signals can be adjusted so that the beam frequency of each adjacent sensor will not interfere with the other. For adjacent use or energy saving Panasonic also offers a version with external trigger input. Thin MA Motion proximity switches feature a detection distance of 5 to 200cm and are available with NPN and PNP output trans./versionsin PNP or NPN open collector versions. They operate from 4.5 to 5.5VDC or in a wilder voltage version from 5.5 to 27 VDC. PAISEU http://eu.industrial.panasonic.com
perature from -40°C to +115°C. Compared to competitive solutions on the market, the AEDT981x is 70% lower in supply current minimizing encoder
power consumption and has a wide spatial play tolerance and codewheel gap, providing ease of motor shaft alignment and enhancing photo detector signal integrity. AVAGO TECHNOLOGIES www.avagotech.com
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PRODUCT NEWS New HiperPFSTM-3 Power Factor Correction ICs from Power Integrations Target Light-Load Performance Power Integrations announced its HiperPFSTM-3 family of power factor correction ICs, which offer high power factor and high efficiency across the entire load range. Targeting applications with continuous power demands up to 405 W for universal input and 900 W for high-line, the ICs feature efficiency levels of better than 95% from 10% load to full load and consume less than 60 mW under noload conditions. A power factor of above 0.92 is easily achievable at 20% load.
The highly integrated HiperPFS-3 devices include the variable frequency CCM controller, high-voltage power MOSFET and a Qspeed™ low QRR boost diode. The new devices also employ an innovative means of controlling EMI without adversely affecting power factor at light loads. Poor system power factor at light load is caused by X capacitors that are used to reduce differential mode EMI being fed back to the AC line. HiperPFS-3 ICs incorporate a digital power factorenhancing circuit that activates during light load conditions; this increases the compensation to overcome the reactance of X capacitors in the EMI filter, minimizing the phase angle difference between the input voltage and the current. Consequently, designers may increase the size of the X capacitors while minimizing or eliminating differential-mode chokes, thereby reducing EMI without degrading light load power factor performance. This results in a smaller, lower cost, EMI filter stage. Comments Edward Ong, product marketing manager at Power Integrations: “Standby energy-use standards such as ErP Lot 6 have previously forced designers of PCs and other systems to include both a main PSU and standby power supply. The excellent light load efficiency of our new HiperPFS-3 ICs enables them to eliminate the standby power supply, saving components, design time, space and cost.” POWER INTEGRATIONS www.power.com 36
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ACTIVE COMPONENTS Murata improves performance of ceramic ESD device series by 20% Murata announced it has increased the performance of it’s LXES ceramic ESD protection device series by 20% compared to the peak voltage performance characteristic of previous models. Murata’s ceramic protection devices use the gap between two electrodes as a discharge element. By narrowing the gap between the electrodes the dielectric strength of the ceramic becomes weaker when high voltages up to 8KV are repeatedly applied. In order to overcome this weakness Murata has applied it’s many years of ceramic technology expertise in order to fabricate a multi-layer ceramic technology that can offer low voltage ESD protection together with the dielectric strength to withstand continued high voltage discharge. Bringing the voltage
protection down by typically 20% the new LXES15AAA1-153 and LXES03AAA1-154 devices bring a level of ESD protection performance that is equivalent to that of a siliconbased transient voltage suppression
device (TVS) but with a ultra-low capacitance. Such TVS ESD protection devices are not able to achieve the performance characteristics available with these new ceramic devices. MURATA www.murata.com
6 Watt DC-DC converters offer an extra wide 4:1 input range in a compact SIP package XP Power announced the ITQ series of 6 Watt DC-DC converters. Packaged in a compact SIP 8-pin format, with a footprint measuring just 21.9 × 11.1 × 9.2mm, the ITQ series takes up less board space, giving designers more room to add features or the ability to reduce end product size. The converter delivers a power density of up to 44 Watts per cubic inch and is highly efficient, typically 87%, making it well suited to modern green standard end products. The high efficiency means the ITQ produces less wasted heat and does not require forced airflow or heatsinking for cooling. The fully regulated single and dual output models accept a wide 4:1 input voltage range of 9-36 VDC or 18-75 VDC. Single output models provide standard +3.3, +5, +9, +12, +15, +24 VDC and duals ±5, ±12 or ±15 VDC. Standard input/output isolation is rated at 1.5 kVDC with an optional 3k VDC isolation available in –H models. All models provide a remote on/off input that allows external control of the converter for sequencing or automatically powering it on or off. The ITQ series can operate in most
environments without requiring forced airflow and has a wide operating temperature range from -40 to +100°C. Full output power can be delivered up to +70°C without derating. The ITQ range compliments the 2:1 input version of 6
Watt SIP DC-DC converters, the ITX series, released recently. The ITQ series is available from Farnell, element14, Digi-Key, approved regional distributors, or direct from XP Power and come with a 3 year warranty. XP POWER www.xppower.com
PRODUCT NEWS High-side current/power sensor from Microchip is world’s first to feature both a configurable analogue output and a 2-Wire digital bus Microchip announces, from the Sensors Expo, a combined analogue and digital current sensor: the PAC1921. This new device is the world’s first high-side current sensor with both a digital output, as well as a configurable analogue output that can present power, current or voltage over the single output pin. Simultaneously, all power-related output values are also available over the 2-Wire digital bus, which is compatible with I2C™. The PAC1921, available in a 10-lead 3×3 mm VDFN package, was designed with the 2-Wire bus to maximise data and diagnostic reporting, while having the analogue output to minimise data latency. The analogue output can also be adjusted for use with 3V, 2V, 1.5V or 1V microcontroller inputs.
The PAC1921 is ideal for networking, power-distribution, powersupply, computing and industrial-automation applications that cannot allow for latency when performing high-speed power management. A 39-bit accumulation register and 128 times gain configuration make this device ideal for both heavy and light system-load power measurement, from 0V to 32V. It has the ability to integrate more than two seconds of power-consumption data. Additionally, the PAC1921 has a READ/INT pin for host control of the measurement period. This pin can also be used to synchronise readings of multiple devices. The PAC1921 is supported by Microchip’s new PAC1921 High-Side Power and Current Monitor Evaluation Board (ADM00592), which is available today priced at $64.99. The PAC1921 is available now for sampling and volume production, in a 10-lead 3×3 mm VDFN package. Key Facts: • PAC1921 maximises data and diagnostic reporting while minimising data latency • Outputs power, current or voltage over a single pin and over the 2-Wire digital bus • Analogue output adjustable for 3V, 2V, 1.5V or 1V microcontroller inputs • Integrated 39-bit accumulation register and 128 times gain configuration • Supports high-speed power management of light and heavy loads from 0V to 32V MICROCHIP TECHNOLOGY www.microchip.com/PAC1921-042915a
ACTIVE COMPONENTS Silicon Labs Announces Industry’s First Single-Chip Clock IC For Wireless Base Stations Silicon Labs introduced the industry’s most highly integrated clock IC for wireless infrastructure applications including small cell and macro cell base stations. Silicon Labs’ new Si5380 clock generator is the industry’s first clock IC capable of replacing a low phase noise integer-N clock, voltage-controlled crystal oscillator (VCXO), discrete loop filters and voltage regulator components with one single-chip device. The Si5380 clock provides comparable phase noise performance to discrete conventional solutions while delivering breakthrough advancements in solution footprint, bill of materials (BOM) cost, power consumption, performance and ease of use. According to a recent Cisco study, global mobile data traffic will soar nearly ten-fold between 2014 and 2019, driven by video streaming services and the widespread adoption of IoT-connected devices. While base station suppliers are tasked with developing new 4G/LTE equipment that increases network capacity and coverage, it is becoming an increasingly difficult design challenge for small cells because they are often deployed in space-constrained, low-power outdoor locations in congested urban environments. Silicon Labs’ new Si5380 clock is the industry’s first single-chip wireless clock IC optimized for size, power, integration and performance, making it an ideal fit for small cell applications. The Si5380 clock leverages Silicon Labs’ latest fourth-generation DSPLL technology to provide a purpose-built solution optimized for next-generation small cells and macro cell remote radio head (RRH) designs. DSPLL technology’s innovative dual-loop mixed-signal architecture integrates a single high-performance 15 GHz analog voltage-controlled oscillator within a digital phase-locked-loop (PLL) architecture that eliminates the need for discrete loop filters and low-drop-out (LDO) regulators. The resulting clock solution provides an optimal combination of ultra-low phase noise clock synthesis with best-in-class PLL integration. The Si5380 clock has a 66 percent smaller printed circuit board (PCB) footprint and 30 percent lower power consumption than competing VCXO-based clock IC solutions. Power-efficient timing components are especially important for today’s small cells, which have limited power budgets and often are powered using Power over Ethernet (PoE) technology. Given that the DSPLL integrates all PLL and power supply regulation elements on-chip, the Si5380 device delivers high board-level noise immunity, integrated power supply noise rejection and consistent, repeatable phase noise performance across temperature. While VCXO-based clock solutions often suffer from degraded spurious performance when subjected to vibration, the Si5380 device’s integrated DSPLL technology provides excellent spurious response regardless of the system environment. SILICON LABS www.silabs.com www.epd-ee.eu |
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PRODUCT NEWS
ACTIVE COMPONENTS
Murata’s cost effective powered data isolator module provides data and power isolation in critical USB environments Murata has introduced the NMUSB202MC, an extremely competitively priced surface mount powered data isolator module that conveniently provides dual port USB data and power isolation from a single upstream port with full power (500mA) available from each port. Used with a host controller a single module counts as two USB hubs for cascaded applications with the level of safety isolation additionally providing effective breaking of ground loops and immunity to EMI in harsh environments.
The module is aimed at industrial control applications where USB is becoming increasingly common for communications with sensors. It is also ideal for use in medical environments with the increasing use of USB for low cost sensing and communication where isolation is necessary for safety and noise immunity. ‘Full’ USB speed operation (12Mbps) is supported, limited by the data isolation chipset. The module is also able to switch automatically between low (1.5Mbps) and full speed operation, as the application requires. The module’s full compliance with USB 2.0 specification enables hassle free, full ‘plug and play’ operation and its surface mount package for placement on the host motherboard enables the USB isolation function with a single SMT component. Full power, 5V/0.5A, meeting the USB bus standard is available from each downstream port and users may power any USB compatible device from the NMUSB module. The ports are short circuit and overload protected. The source power of 5V can be provided by an external adapter or system voltage rail. The NMUSB202MC’s reinforced safety isolation barrier meets the requirements of 250VAC systems in IT and medical environments for operator protection, so users may confidently use the product to provide safety isolation in USB connections in critical applications. MURATA 38
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ZTE Chooses Lattice Semiconductor for Feature Differentiation and Integration on Star 2 Smartphone Lattice Semiconductor Corporation announced its iCE40 LM FPGA has been integrated in the recently released ZTE Star 2 flagship smartphone to perform IR remote control, and sensor hub functions. From wearables to smartphones, the iCE40 LM family of devices offer exceptionally low power consumption and extremely small footprint – and have been specifically designed to enable manufacturers of mobile consumer products to implement top of line features fast and efficiently, without sacrificing performance. The ultra low power iCE40 LM device allowed ZTE to set the Star 2 apart by implementing critical alwayson functions. In the crucial battle to reduce energy consumption, it can recognize various gestures and activities while the application processor remains inactive, significantly reducing power usage. Minimizing the applica-
tion processor usage allows ZTE to maximize the battery life of the Star 2. ZTE considered a software-based solution for IR remote control, but integrated hard IP found in Lattice’s iCE40 LM offered better reliability
and performance. ZTE was able to individually decide which functions to incorporate, targeting the features of each model, while simultaneously saving board space, cost and power. LATTICE SEMICONDUCTOR www.latticesemi.com
Exar Introduces Industry’s Smallest 20A Power Module Exar Corporation, a leading supplier of high-performance integrated circuits and system solutions, introduces the XR79120 – a 20A single output, synchronous step-down power module in a compact, market leading 12mm × 14mm × 4mm footprint. Although small, the XR79120 still offers greater than 93% peak efficiency and leverages Exar’s patented advanced constant on-time (COT) control architecture across a 4.5V to 22V input voltage range. The XR79120 provides an easy to use, fully integrated power converter integrating MOSFETs, inductors, and internal input and output capacitors. QFN-based package technology provides superior thermal per-
formance, eases electrical debugging and improves manufacturability with higher assembly yield and the ability to visually inspect solder joints. At 50°C with no airflow, no thermal deratings are required for output voltages of 1.8V and below. The XR79120 will be available in a RoHS compliant, green/halogen free, space-saving 74-pin 12mm x 14mm x 4mm QFN package. The XR79120 is priced at $13.95 in 1,000-piece quantities. EXAR www.exar.com
PRODUCT NEWS IDT Adds 3.3V PCIe Clock Generators to World’s Lowest Power PCI Express Timing Family Integrated Device Technology, Inc. (IDT®) announced the addition of 6 and 8 output 3.3V clock generators to its low-power PCI Express® (PCIe) portfolio of clock generators. The 3.3V family of devices joins the existing 1.5V and 1.8V families. The new products operate at approximately 100 milliwatts, making them the lowest power 3.3V PCIe clock generators on the market. By operating at roughly one-fifth the power of traditional PCIe clock devices, the IDT 3.3V devices effectively eliminate thermal concerns.
With their integrated terminations, the 9FGL06 and 9FGL08 devices’ ultra-compact 5×5- and 6×6-millimeter packages can deliver up to a 90 percent reduction in board area. Factory programmable versions provide quick turn device optimizations to meet exact customer requirements. The SoC-friendly devices greatly exceed the phase jitter requirements of the PCIe Gen3 specification in anticipation of the upcoming PCIe Gen4 specification, and are also suitable for applications needing less than 3ps rms 12k-20M phase jitter, such as gigabit Ethernet and other high-performance applications.. The 3.3 V devices are pin-compatible to IDT’s highly successful 1.5 V 9FGU-series and 1.8 V 9FGV-series PCIe clock generators. The timing family targets power- and space-constrained designs in both consumer and high-performance applications, providing enterprise-level performance while lowering the total cost of ownership. Potential applications include multi-function printers, servers, set-top boxes and solid state drives. The entire family is compliant with PCIe generations 1, 2 and 3. The 3.3 V (L-series) family offers industry firsts that include: • Output-by-Output configuration of output impedances, allowing a single part to be used in mixed impedance environments without external termination components. • Factory programmable versions that allow user-defined default configurations including output impedance, control input polarity, internal pull up or pull down resistors, and wake-on-LAN mode for the crystal oscillator. This removes the need for practically all external glue logic. IDT plans to quickly follow this initial offering with 3.3 V versions of low-power PCIe buffers and multiplexers that are pin-compatible to the successful 9DBU/V and 9DMU/V families. IDT www.idt.com
ACTIVE COMPONENTS Go for the Triple Play with the TDK-Lambda 75W Triple-Output, Low-Profile CUT75 AC/DC Power Supplies Now at Mouser Mouser Electronics, Inc. is now stocking the CUT75 Series Power Supplies from TDK-Lambda. Based on a two-converter topology, the CUT75 series of 75W triple-output, low-profile AC/DC power supplies supports zero minimum load operation, good regulation, and convection-cooling; and provides 500VAC isolation between the 5V and the secondary outputs for easier system configuration. The CUT75 series is available in two standard models: The CUT75-522 offers 5V and ±12V output voltages, while the CUT75-5FF comes with 5V ±15V output voltages; both can be configured as dual-output power supplies (5V/24V or 5V/30V).
The TDK-Lambda CUT75 Series Power Supplies, available from Mouser Electronics, feature a 64 percent smaller design, lighter weight, and up to 85 percent better efficiency than the earlier generation of TDK JWT75 power supplies. The CUT75 Series has a universal operating input voltage of 85 to 265VAC, with 500VAC isolation between the 5V and the secondary outputs. The 5V output is user adjustable from 5V to 5.25V. Both the CUT75-522 and the CUT75-5FF are convection-cooled and feature a wide operating temperature range from 20°C to 70°C ambient (with appropriate de-rating above 60°C). Standard features of the CUT75 Series include overcurrent protection and overvoltage protection, and neither power supply model requires minimum loading. For easier system configuration, output 1 of the CUT75 Series is isolated from outputs 2 and 3. The CUT75 Series from TDK-Lambda is now available at Mouser Electronics in a 3 in. × 5 in. footprint with a 1.06 in. height. The CUT75 Series meets the conducted and radiated EMC requirements of EN55011/EN55022-B, FCC-B and VCCI-B, as well as IEC61000-4-2, -3, -4, -5, -6, -8, -11 immunity and safety approvals to EN/UL/CSA60950-1. It is also approved for medical applications by IEC60601-1 3rd Edition (2×MOOP) and designed to meet ANSI/AAMI ES60601-1. Both models are delivered with TDKLambda’s 3-year warranty, and carry the CE mark according to the LV (low voltage) and RoHS2 Directives. TDK-Lambda’s CUT75 Series Power Supplies are ideal for a variety of power supply applications within the industrial, broadcast and test and measurement sectors. MOUSER ELECTRONICS www.mouser.com www.epd-ee.eu |
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PRODUCT NEWS
Lighting Solutions / Display
Spotlight Shines on Lumileds LUXEON CoB Compact Range LEDs, Available Now at Mouser Electronics Mouser Electronics, Inc. is now stocking LUXEON CoB Compact Range LEDs from Lumileds. These LEDs offer high flux densities in a very small light emitting surface (LES), which provides good center beam candle power (CBCP).
The Lumileds LUXEON CoB Compact Range LEDs, available from Mouser Electronics, feature a single 6.5mm optical LES that provides high flux densities and high efficacy. Industry-leading thermal resistance allows for smaller heat sinks, and the assembly’s ceramic substrate offers excellent protection in high-potential (HiPot) testing. All the LUXEON CoB Compact Range LEDs devices are binned with a single 3-step (80 and 90 color index rating) MacAdam ellipse to ensure optical performance in retrofit lamps and spotlight applications. LUXEON CoB Compact Range LEDs are all hot-tested at 85°C, so that luminaire design is simplified and testing can be minimized. The LUXEON CoB Compact Range LEDs from Lumileds are now available through Mouser Electronics, designed for a broad array of general purpose lighting and directional lighting applications including retrofit lamps, spotlights, and luminaires. To learn more, visit: www.mouser.com/new/lumileds/lumileds-luxeon-cob-compact To visit Mouser’s Lighting Applications site, go to: www.mouser.com/applications/lighting With its broad product line and unsurpassed customer service, Mouser caters to design engineers and buyers by delivering What’s Next in advanced technologies. Mouser offers customers 21 global support locations and stocks the world’s widest selection of the latest semiconductors and electronic components for the newest design projects. MOUSER ELECTRONICS 40
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New 19.5-inch Full HD Auto-Stereoscopic LCD with HxDP Technology NLT Technologies, Ltd. has developed a prototype 19.5-inch auto-stereoscopic LCD developed by NLT Technologies with full HD resolution in 3D mode, adopting the company’s proprietary glassless 3D display technology, H×DP (Horizontal × times Density Pixels). The new prototype is expected to be utilized for educational or high-end medical applications that demand more precise and realistic three-dimensional imaging than achieved with traditional naked-eye 3D displays. The display has a 19.5-inch diagonal screen size, which is the largest NLT auto-stereoscopic display demonstrated to-date. The display combines full HD 3D resolution with a high luminance of 700cd/m2, enabling bright, high-resolution display
of 3D images. In the 2D display mode, the display achieves a wide viewing angle of 176 degrees at vertical and horizontal, providing vivid images without color inversion even when viewed off-angle. HxDP is a multi-viewable
auto-stereoscopic display technology that uses a unique pixel alignment to achieve crisp high-density 3D images (the prototype is a 2-view model). TIANMA NLT EUROPE www.tianma-nlt.eu
A Masterful Blend of Elegance and Intelligence The Electronic Assembly EA eDIPTFT70 ATC graphic display is a perfect symbiosis of intelligence and attractive design. The TFT touch panel display features an extensive set of intelligent display functions, making it ideal for microcontroller system architectures. Other outstanding features include a bright, high-contrast screen and an elegant appearance. The display has a 7 inch diagonal screen, 800 x 480 pixel resolution and an optional capacitive touch panel. It is the perfect centerpiece of your machine and equipment “command center”. Its highly attractive appearance makes it equally suitable for high-quality consumer goods which look nice in the living room. The extremely bright, high-contrast screen is easy to read even in bright sunshine, making the EA eDIPTFT70 ATC perfect for parking ticket vending machines and information booths. The 6H surface is absolutely scratch resistant and dirt repellent, guaranteeing excellent longterm optical performance. The display retains its attractive appearance even
when strong cleaning agents are used, for example on the production floor or in machine rooms. For the really tough jobs, the display can be easily mounted behind a protective glass panel up to 4 mm thick which acts as a deterrent to vandalism. In addition, the EA eDIPTFT70 ATC has a highgrade capacitive touch panel which reacts even when the user is wearing
gloves. The display copes well with multi-touch action. The high-precision sensor function ensures that user commands are executed correctly. The touch screen reacts to user input with 80 different messages, change of output voltage level or data sent over the on-board RS 232, SPI or I²C ports. ELECTRONIC ASSEMBLY www.lcd-module.de
PRODUCT NEWS OLED Alphanumeric Display Designed for Wide Temperature Range Electronic Assembly has added the EA W202 XDLG to its range of high-quality alphanumeric displays. The technology has the advantage of high contrast for good visibility combined with low energy consumption. The new EA W202 XDLG also features an onboard controller which supports user-friendly connectivity options, and it operates over a temperature range, making it suitable for automotive applications.
The EA W202 XDLG displays two lines containing 20 characters each. The character height is 9.66 mm which is currently the maximum in the OLED display range. The onboard controller is compatible with the popular HD44780, so when using the EA W202 XDLG system developers will find themselves on familiar ground. The controller has an SPI interface for communication with the outside world. It can also be connected to a 4 or 8 bit data bus also. A range of functions including Clear Display, Shift Display, Shift Cursor and Cursor on/off can be performed with a single command. The complete ASCII character set including special characters is factory installed in the character ROM. The user has the choice of 4 different fonts: English, European I, European II and Cyrillic. In addition, 8 characters are user definable. ELECTRONIC ASSEMBLY www.lcd-module.de
Lighting Solutions / Display Development of new prototypes applied “Wet & Glove” technology, that keeps touch panels functional even when the screen is wet or the operator is wearing gloves NTL Technologies, Ltd. has developed new prototypes which applied "Wet & Glove" technology enabling projected capacitive (PCAP) touch panels to be operated even when the screen is wet and the operator is wearing gloves. The prototypes allow the touch screen be operated even when the operator is using a medical gel on the surface of the screen, or when the operator wearing gloves up to 5mm thickness. With these added capabilities coupled with NLT’s advanced product specifications, this touch display is ideally suited for high-end medical, such as surgical or examination equipment used with gels, or gloves up to 5mm thickness. The touch display may also be useable in equipment in work environments where thick gloves (5mm thickness or less) are used as protection against certain hazard.
EVERLIGHT Electronics introduces new IR emitter and PIN photodiode The main features of the NLT’s Wet & Glove technology are as follows.
EVERLIGHT ELECTRONICS CO., LTD. introduces a new infrared emitting diode in a miniature SMD package, IRR60-48C/TR8, and a high speed, high sensitive PIN photodiode, PD60-48C/TR8, both sized 6×4.8×1.1mm for oximeter detector applications. According to past experience, red 660nm together with infrared 905nm appear best to detect the oxygenation of the blood which provides accurate diagnosis on oximeters. EVERLIGHT's IRR6048C/TR8, together with PD60-48C/TR8, feature such unique optimized wavelengths of red 660nm and infrared 905nm, enabling a most accurate oximeter diagnosis. The infrared 905nm can also be customized upon request to 940nm or 910nm. Furthermore, both IRR60-48C/TR8 and PD60-48C/TR8 are discrete designs which allow the feasibility on use, no matter if the oximeter requires a transmission or reflective design. Both products are Pb free. EVERLIGHT ELECTRONICS www.everlight.com
(1) Combination of two detection methods Touch coordinates are detected using a combination of mutualcapacitance and self-capacitance sensors. This enables the touch position to be detected with high precision even when the screen is wet and the user is wearing gloves, and means the panel can also support multi-touch functionality and gesture operation. (2) Proprietary sensitivity adjustment tool enables operation while wearing thick gloves Due to the touch panel’s sensitivity adjustment, using a proprietary touch panel controller developed by NLT, accurate position or touch detection is still possible even when the screen is wet and the user is wearing gloves. (3) Wide variety of design specifications accommodated Wet and Glove touch technology also supports various design options such as glass bonding or surface film, as with all PCAP products NLT offers. Treatments to protect against fingerprints or reduce glare can be accommodated so end-product designers can set specifications to suit a broad range of applications. TIANMA NLT EUROPE
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INDUSTRY PRODUCT NEWS
Production Packaging Do you need various products at a high level quality? Do you want a single provider for a wide range of technical products, which at the same time can offer you offline or online technical support free of charge? If you want all the above and more like orders without threshold value in a short amount of time, you can choose with confidence the only authorized dealer of RS in Romania. Aurocon COMPEC is the solution for your needs, giving you the option to choose more than 600.000 products from over 2.500 manufacturers, being the optimum choice for a wide range of technical products for several industries. We rely on 20 years of experience and on our qualified personnel so we can guarantee the best products and high quality services at competitive prices, based on customer feedback. We put at your disposal all of this so that you can place the order very easy by email, phone, fax or online on our user friendly website. On our website, you can find details about each product including the technical data sheet, prices, information regarding product availability or several methods of packaging and shipment.
About Production Packaging We supply parts in industry standard packaging types Industry standard packaging and production packaging (look for the logos below when you're ordering)
What is it?
Production Packaging Benefits
We are permanently adding new technology devices to our electronics range, and now offer more than 75,000 components in industry-standard packaging ready for insertion into your production machinery. Wherever you see the “P” symbol, you can purchase electronic products in flexible quantities direct from stock, and competitively priced – including free re-reeling. With a range of support services for prototyping and small-batch production orders, RS helps keep your production running. • Industry standard packaging: a full reel or tube of components for your pre-production needs, at a very attractive price. This can be more cost effective than buying individual items as you'll always get our best price. • Production packing: if you need a small number of components for samples, prototypes or small batch production, we can supply them individually or packaged ready for insertion into your pick and place machinery.
With Production Packaging and our range of Production Services, we help reduce costs and increase reliability in small-batch production runs.
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• Flexible quantities that mean no MOQs or long lead-times. Just order the amount you need for your production run. • Competitive prices so you save money when buying from RS. We give volume discounts on higher quantities for production, and continually pass on new price reductions • Reduce costs with free re-reeling on our range of reeled products, and no hidden charges on delivery • Available when you need because all our Production Packaging range is available direct from stock to your order schedules • Quality you can trust in our packaging standards and delivery service. You'll get the products you need, in the packaging required, exactly when you want them
INDUSTRY PRODUCT NEWS
Several representative items To give you some brief view of our products we illustrate several representative items that our company can offer you.
If you're looking for a wide variety of Amplifiers and Comparators, then RS Components can help. We stock all the latest technologies and can support your existing design or future projects - order today and remember to go to our Electronics Centre to see how our free design tools can help you. AD835ARZ, Analogue Multiplier 4-Bits 8-Pin SOIC
Also available in industry standard packaging
The AD835 is a complete four-quadrant, voltage output analog multiplier, fabricated on an advanced dielectrically isolated complementary bipolar process. It generates the linear product of its X and Y voltage inputs with a −3dB output bandwidth of 250MHz (a small signal rise time of 1ns). Full-scale (−1V to +1V) rise to fall times are 2.5ns (with a standard RL of 150Ω), and the settling time to 0.1% under the same conditions is typically 20ns. Its differential multiplication inputs (X, Y) and its summing input (Z) are at high impedance. The low impedance output voltage (W) can provide up to ±2.5V and drive loads as low as 25Ω. Normal operation is from ±5V supplies.
• RS Stock No.: 523-6973 / 523-6973P • Mfr. Part No. : AD835ARZ
Though providing state-of-the-art speed, the AD835 is simple to use and versatile. For example, as well as permitting the addition of a signal at the output, the Z input provides the means to operate the AD835 with voltage gains up to about ×10. In this capacity, the very low product noise of this multiplier makes it much more useful than earlier products. www.compec.ro
Semiconductors
You are able to develop and improve your electronics design with our range of Clocks, Timing & Frequency Control Circuits. Our partnership with leading semiconductor brands means we always have a great choice of products for you to buy from. STMicroelectronics M41T11M6F Real Time Clock, Calendar, Clock, 56B RAM, I2C, 5.5 V, 8-Pin SOIC
Also available in industry standard packaging
The M41T11 is a low-power serial real-time clock (RTC) with 56 bytes of NVRAM. A built-in 32.768 kHz oscillator (external crystal controlled) and the first 8 bytes of the RAM are used for the clock/calendar function and are configured in binarycoded decimal (BCD) format. Addresses and data are transferred serially via a twoline bidirectional bus. The built-in address register is incremented automatically after each write or read data byte. The M41T11 clock has a built-in power sense circuit which detects power failures and automatically switches to the battery supply during power failures. The ener• RS Stock No.: 829-0399 / 829-0399P gy needed to sustain the RAM and clock operations can be supplied from a small • Mfr. Part No.: M41T11M6F lithium coin cell. Typical data retention time is in excess of 5 years with a 50mA/h, 3V lithium cell. The M41T11 is supplied in an 8-lead plastic small outline package or 28-lead SNAPHAT® package. The 28-pin, 330 mil SOIC provides sockets with gold plated contacts at both ends for direct connection to a separate SNAPHAT housing containing the battery and crystal. The unique design allows the SNAPHAT battery package to be mounted on top of the SOIC package after the completion of the surface mount process. Insertion of the SNAPHAT housing after reflow prevents potential battery and crystal damage due to the high temperatures required for device surface-mounting. The SNAPHAT housing is keyed to prevent reverse insertion. www.compec.ro
Semiconductors www.epd-ee.eu |
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INDUSTRY PRODUCT NEWS
STWD100YNPWY3F, Watchdog Timer, 2.7 → 5.5 V, 5-Pin SOT-23 The STWD100 watchdog timer circuits are self-contained devices which prevent system failures that are caused by certain types of hardware errors (non-responding peripherals, bus content, etc.) or software errors (bad code jump, code stuck in loop, etc.).
Also available in industry standard packaging
The STWD100 watchdog timer has an input, WDI, and an output, WDO. The input is used to clear the internal watchdog timer periodically within the specified timeout period, twd. While the system is operating correctly, it periodically toggles the watchdog input, WDI. If the system fails, the watchdog timer is not reset, a system alert is generated and the watchdog output, WDO, is asserted. The STWD100 circuit also has an enable pin, EN, which can enable or disable the watchdog functionality. The EN pin is connected to the internal pull-down resistor. The device is enabled if the EN pin is left floating.
• RS Stock No.: 829-1516 / 829-1516P • Mfr. Part No.: STWD100YNPWY3F
Features: • Current consumption: 13μA typ. • Available watchdog timeout periods are 3.4 ms, 6.3 ms, 102 ms and 1.6 s • Chip enable input • Open drain or push-pull WDO output • Operating temperature range: –40 to +125 °C • Package SOT23-5, SC70-5 (SOT323-5) • ESD performance – HBM: 2000 V / RCDM: 1000 V Applications: telecommunications, alarm systems, industrial equipment, networking, medical equipment, UPS (uninterruptible power supply). www.compec.ro
Semiconductors
Choose from our large range of Interface ICs. We stock products from the world's leading Semiconductor Manufacturers which mean you're sure to find the ideal product for your application. CAN Controller MCP2515T-I/ST 1Mbit/s CAN 2.0B Sleep 20 TSSOP Microchip Technology’s MCP2515 is a stand-alone Controller Area Network (CAN) controller that implements the CAN specification, version 2.0B. It is capable of transmitting and receiving both standard and extended data and remote frames. The MCP2515 has two acceptance masks and six acceptance filters that are used to filter out unwanted messages, thereby reducing the host MCU’s overhead. The MCP2515 interfaces with microcontrollers (MCUs) via an industry standard Serial Peripheral Interface (SPI). Technical characteristics Maximum Data Rate Number of Transceivers Standard Supported Power Down Mode Maximum Supply Current Mounting Type Package Type / Pin Count Dimensions Operating Supply Voltage Range Operating Temperature
1Mbit/s 1 CAN 2.0B Sleep 10 mA Surface Mount TSSOP / 20 6.6 mm × 4.5 mm × 1.05mm 2.7V - 5.5V -40°C to +85°C
www.compec.ro
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Also available in industry standard packaging
• RS Stock No.: 823-7890 / 823-7890P • Mfr. Part No.: MCP2515T-I/ST Semiconductors
June, 2015 | www.epd-ee.eu
INDUSTRY PRODUCT NEWS
We stock a full range of sensors and transducers for everyday electronics applications. The range includes temperature, image, pressure, and Hall Effect sensors. Murata SCR1100-D02-004 Gyroscope 50 Hz SPI 3 → 3.6 V, 4.75 → 5.25 V, 32-Pin SMD SCR1100-D02 is a single axis high performance gyroscope. It is part of Murata's high performance gyro family and it has the same gyro section as the combined gyro acceleration product SCC1300-D02. The sensor is based on Murata's proven capacitive 3D-MEMS technology and it has highly sophisticated signal conditioning ASIC with digital SPI interface. Small robust packaging guarantees reliable operation over product lifetime. The housing is suitable for SMD mounting and the component is compatible with RoHS and ELV directives. SCR1100-D02 is designed, manufactured and tested against high stability, reliability and quality requirements. The angular rate sensor provides highly stable output over wide ranges of temperature and mechanical noise. The bias stability is in the elite of MEMS gyros and the component has several advanced self diagnostics features. SCR1100-D02 is targeted to applications with high stability and tough environmental requirements.
Typical applications are: • Inertial Measurement Units (IMUs) for highly demanding environments • Platform stabilization and control • Motion analysis and control • Roll over detection • Robotic control systems • Guidance systems • Navigation systems
Also available in industry standard packaging
• RS Stock No.: 799-9244 / 799-9244P • Mfr. Part No.: SCR1100-D02-004
www.compec.ro
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INDUSTRY PRODUCT NEWS
We are offering a wide range of memory chip products from leading Semiconductor suppliers. If you're looking for all those products that are essential for the creation of your next design, then check out our Electronic Essentials page to find everything you need in one place. AT45DB642D-CNU, Parallel, Serial-SPI Flash Memory, 8192 pages x 1056 bytes 64Mbit, 6ns, 2.7 → 3.6 V, 8-Pin
Also available in industry standard packaging
AT45DB642D is a 2.7V, dual-interface sequential access Flash memory ideally suited for a wide variety of digital voice-, image-, program code- and data-storage applications. AT45DB642D supports RapidS™ serial interface and Rapid8™ 8-bit interface. RapidS serial interface is SP compatible for frequencies up to 66MHz. The dualinterface allows a dedicated serial interface to be connected to a DSP and a dedicated 8-bit interface to be connected to a microcontroller or vice versa. However, the • RS Stock No.: 696-3474 / 696-3474P use of either interface is purely optional. Its 69,206,016-bits of memory are organ• Mfr. Part No.: AT45DB642D-CNU ized as 8,192 pages of 1,024-bytes (binary page size) or 1,056-bytes (standard Data-Flash® page size) each. In addition to the main memory, the AT45DB642D also contains two SRAM buffers of 1,024-(binary buffer size) bytes/1,056-bytes (standard DataFlash buffer size) each. The buffers allow receiving of data while a page in the main Memory is being reprogrammed, as well as writing a continuous data stream. EEPROM emulation (bit or byte alterability) is easily handled with a self-contained three step read-modify-write operation. Unlike conventional Flash memories that are accessed randomly with multiple address lines and a parallel interface, the DataFlash uses either a RapidS serial interface or an 8-bit Rapid8 interface to sequentially access its data. The simple sequential access dramatically reduces active pin count, facilitates hardware layout, increases system reliability, minimizes switching noise, and reduces package size. The device is optimized for use in many commercial and industrial applications where high-density, low-pin count, low-voltage and low-power are essential. To allow for simple in-system reprogrammability, the AT45DB642D does not require high input voltages for programming. The device operates from a single power supply, 2.7V to 3.6V, for both the program and read operations. www.compec.ro
Semiconductors
Unlock your electronics design with our range of Power Management ICs. Our Partnership with Leading Semiconductor brands means we always have a great choice of Power Management products for you to buy from stock. LTM4609EV#PBF Buck/Boost Converter, 4A, Adjustable, 0.8 → 34 V, 400 kHz, 141-Pin LGA
Also available in industry standard packaging
The LT M®4609 is a high efficiency switching mode buck-boost power supply. Included in the package are the switching controller, power FETs and support components. Operating over an input voltage range of 4.5V to 36V, the LTM4609 supports an output voltage range of 0.8V to 34V, set by a resistor. This high efficiency design delivers up to 4A continuous current in boost mode (10A in buck mode). Only the inductor, sense resistor, bulk input and output capacitors are needed to finish the design. The low profile package enables utilization of unused space on the • RS Stock No.: 711-2523 / 711-2523P bottom of PC boards for high density point of load regulation. The high switching • Mfr. Part No.: LTM4609EV#PBF frequency and current mode architecture enable a very fast transient response to line and load changes without sacrificing stability. The LTM4609 can be frequency synchronized with an external clock to reduce undesirable frequency harmonics. Fault protection features include overvoltage and fold back current protection. The DC/DC μModule ® regulator is offered in small 15mm × 15mm × 2.82mm LGA and 15mm × 15mm × 3.42mm BGA packages. www.compec.ro
Semiconductors
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PRODUCT NEWS
PASSIVE COMPONENTS
Mouser Electronics Now Shipping the Vishay VEML6070 UV Light Sensor Mouser Electronics, Inc. is now stocking the VEML6070 UV Light Sensor from Vishay Intertechnology. The VEML6070 is an advanced, CMOS ultraviolet (UV) light sensor with an I2C protocol interface and high dynamic
detection resolution. With an integrated signal conditioning IC, photodiode, amplifiers, and analog/digital circuits in a single chip, the VEML6070 provides excellent measurement in a small 2.35
× 1.8 × 1.0mm package, which makes it ideal for applications such as handheld devices, wearables, and health and fitness devices. The Vishay VEML6070 UV Light Sensor, available from Mouser Electronics, contains an 8-bit command register written via the I2C bus. All operations can be controlled by the command register, with a simple command structure that enables engineers to easily program the operation setting and latch the light data from the sensor. The sensor offers 16-bit resolution to convert solar UV light intensity to digital data, and includes an active acknowledge feature that allows it to transmit ultraviolet index (UVI) alerts based on programmable thresholds. MOUSER ELECTRONICS www.mouser.com
Vishay Intertechnology's New Miniature Housing Enables Rapid Prototyping for IR Reflective Presence and Proximity Sensors Vishay Intertechnology, Inc. broadens its optoelectronics portfolio with the introduction of a miniature plastic housing for the rapid prototyping of reflective presence and proximity sensors. The housing is uniquely designed to provide optical isolation between a 3 mm (T1) infrared (IR) emitter and any of Vishay's TSSP-type presence or proximity sensors. For reflective sensor applications such as automatic hand dryers, automatic towel dispensers, toys, and vending machines, optical isolation between the emitter and sensor is an absolute necessity. With their extremely high sensitivity, Vishay Semiconductors TSSP sensors can be inadvertently activated by even very small light leakage. To prevent this, designers have traditionally had to spend valuable time constructing their own mechanical housings and light isolation. VISHAY INTERTECHNOLOGY www.vishay.com
New Vishay Intertechnology 20 V Chipscale MOSFET in 0.8 mm by 0.8 mm Package Saves Space and Power in Mobile Applications Vishay Intertechnology, Inc. introduced a new TrenchFET® 20 V n-channel MOSFET in the chipscale MICRO FOOT® 0.8 mm by 0.8 mm package with an ultrathin 0.357 mm profile. Designed to save space, decrease power consumption, and extend battery usage in smartphones, tablets, wearable devices, solid-state drives, and portable medical devices such as hearing aids, the Vishay Siliconix Si8824EDB provides the industry's lowest onresistance for any 20V device with a 1 mm square or < 0.7mm square outline. Optimized for use as a load switch, smallsignal switch, and high-speed switch in power management applications, the Si8824EDB features extremely low onresistance of 75 mΩ at 4.5V, 82mΩ at 2.5V, 90mΩ at 1.8V, 125mΩ at 1.5V, and 175mΩ at 1.2V. These ratings are up to 25% lower than the closest competing 20V MOSFET in an identical CSP package, and up to 65% lower than the closest competing 20V device in the DFN 1 mm by 0.6 mm package. The MOSFET's 20V VDS, ESD protection, ratings down to 1.2V, and low onresistance provide a combination of safety margin, gate drive design flexibility, and high performance for lithium-ion battery-powered applications. VISHAY INTERTECHNOLOGY www.vishay.com 48
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PRODUCT NEWS
PASSIVE COMPONENTS
Vishay Intertechnology High-Voltage Thin Film Flat Chip Resistors Enable Precise Voltage Measurement While Reducing Component Counts and Saving Board Space
Würth and Würth Elektronik inaugurate IT technology center: Modern data center for the Würth Group
Vishay Intertechnology, Inc. introduced a new series of high-voltage thin film flat chip resistors that is the industry's first to combine precision properties - low VCR < 1 ppm/V, tight tolerances to ±0.1%, and low TCR down to ±10 ppm/K - with high operating voltages to 1000V. With typical thin film chip resistors in comparable case sizes only offering voltages to 200V, Vishay Draloric TNPV e3 series devices reduce component counts to save board space and lower costs in precision high-voltage circuits by replacing larger resistors and multiple devices in similar case sizes. Special high-voltage thick film resistors can also be replaced, which allows for significantly enhanced performance due to superior voltage coefficient and unrivaled precision properties at high voltages. Available in the 1206 and 1210 case sizes, Vishay's TNPV e3 series covers a resistance range from 121kΩ to 3.01MΩ, operates over a temperature range of -55°C to +125°C, and offers rated dissipation to 0.33W at an ambient temperature of 70°C. VISHAY INTERTECHNOLOGY www.vishay.com
On 10 June 2015, the Würth Group inaugurated the Group's new data center in Waldzimmern, Germany. The 5,220sqm building complex accommodates a 1,000sqm state-of-the-art, energy-efficient data center as well as 125 workplaces for software development, IT infrastructure, network technology, virtualization, server technology and storage of both the Würth Group and the Würth Elektronik Group. Prof. Dr. h. c. mult. Reinhold Würth, Chairman of the Supervisory Board of the Würth Group's Family Trusts, District Administrator Dr. Matthias Neth and Achim Beck, Mayor of the town of Niedernhall, participated in the inauguration ceremony. The IT technology center in Waldzimmern will be the new “digital heart” of the Würth Group. The new data center with its forwardlooking architecture forms part of the so-called “Hohenlohe ring”, which also comprises the existing data centers in Gaisbach and Waldenburg. This real-time backup network can be considered a milestone of IT availability and IT security for the entire group of companies. Owing to modern air conditioning including the use of waste heat thanks to heat exchangers, the new data center will require 70 percent less energy than comparable facilities. Almost all facilities have an efficiency of more than 90 percent.
Rutronik presents Real-Time Clocks with Best in Class Accuracy from Epson Epson announces the volume production of its new RX8130CE and RX8900CE Real-Time Clocks (RTCs). Thanks to its long battery life, small size, and best in class accuracy they are the most advanced Real-Time Clocks available on the market. Distributor Rutronik offers them as of now. Both new modules, RX8130CE and RX8900CE RTC, are offered in Epson’s smallest ever (3.2 × 2.5 × 1.0mm) package and include an IC and crystal in the package. By integrating the crystal, the modules save board space, reduce cost, and improve accuracy as well as functional safety. Applications using real time clocks are much more reliable and can be more accurate compared to applications using clock crystals with 32,768kHz. They keep track of time in all sorts of electronic equipment and are extensively used in automotive, smart meter, internet security, wireless and wireline networking, datacenter, medical, and IoT. Epson’s RX8130CE is a cost optimized low power (300nA) RTC Module featuring a built-in power switch function optimized for rechargeable batteries and achieving an accuracy of 5 ±23 ppm at 25°C. It is designed for use of any power source including discharging battery as primary supply. Due to the built-in power switch function no external circuits are required for the switch from primary to backup power supply in case the main supply is turned off. The RX8900CE module uses DTCXO technology to achieve ±5 or ±3.4 ppm accuracy over the entire -40 to +85°C operating range. Its power is 700nA, which is three times lower than competing DTCXO RTCs. RUTRONIK www.rutronik.com
Commitment to the region Besides Prof. Dr. h. c. mult. Reinhold Würth, District Administrator Dr. Matthias Neth and Mayor Achim Beck, Bernd Herrmann, Member of the Central Managing Board of the Würth Group, Jörg Murawski, Executive Vice President of the Würth Group, Oliver Konz, Managing Director of the Würth Elektronik eiSos Group and architect Siegfried Müller emphasized the significance of the new technology center in their addresses and speeches. The new building complex in Waldzimmern is trend-setting not only with regard to technology and its architecture. As a large investment including high-end workplaces, it is above all a commitment of the globally operating Würth Group to their home region preparing the ground for future growth. WÜRTH ELEKTRONIK
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