Global RadiationHardened Electronics Market Focus on Manufacturing Technique, Component, and End User – Analysis and Forecast, 2020–2025 January 2021
Table of Content
Global Radiation-Hardened Electronics Market
BIS Research is a leading market intelligence and technology research company. BIS Research publishes in-depth market intelligence reports focusing on the market estimations, technology analysis, emerging high-growth applications, deeply segmented granular country-level market data and other important market parameters useful in the strategic decision making for senior management. BIS Research provides multi-client reports, company profiles, databases, and custom research services.
Copyright © 2021 BIS Research Inc. All Rights Reserved. This document contains highly confidential information and is the sole property of BIS Research. Disclosing, copying, circulating, quoting, or otherwise reproducing any or all contents of this document is strictly prohibited. Access to this information is provided exclusively for the benefit of the people or organization concerned. It may not be accessed by or offered whether for sale or otherwise to any third party.
All rights reserved at BIS Research
2
Global Radiation-Hardened Electronics Market
Preface This report has been designed to address some of the most crucial questions about the radiationhardened electronics market: ▪
What are the trends in the global radiation-hardened electronics market across different regions?
▪
What are the major driving forces expected to increase the demand for radiation-hardened electronics during the forecast period 2020-2025?
▪
What are the major challenges inhibiting the growth of the radiation-hardened electronics market?
▪
What was the revenue generated in the global radiation-hardened electronics market by various segments in 2019, and what are the estimates by 2025?
▪
Which end user of the radiation-hardened electronics market [space, military, nuclear power plants, aerospace, other (healthcare and mining)] is expected to dominate the market in the coming years?
▪
What is the estimated revenue to be generated by the global radiation-hardened electronics market across different regions (North America, Europe, Asia-Pacific, and Rest-of-theWorld) during the forecast period?
▪
Which are the key players in the global radiation-hardened electronics market, and what are the new strategies that are being adopted by them to make a mark in the industry?
▪
What major opportunities do the radiation-hardened electronics market companies foresee in the next ten years?
▪
What is the impact of COVID-19 on the electronics and manufacturing value chain in upstream, midstream, and downstream parts?
▪
What is the competitive strength of the key leading players in the radiation-hardened electronics market?
All rights reserved at BIS Research
3
Global Radiation-Hardened Electronics Market
The report highlights the key driving factors and challenges for this market as well as the opportunities for the global radiation-hardened electronics market. In the extensive primary research process undertaken for this study, the primary sources include industry experts and key executives from prominent companies and their distributors in the radiation-hardened electronics market. This report segments the market region-wise, as North America (U.S. and Canada), Europe (France, Germany, Russia, U.K., and Rest-of-Europe), Asia-Pacific (China, India, Japan, and Rest-of-Asia-Pacific), and Rest-of-the-World (Africa, Latin America, and Middle East).
BIS Aerospace and Defense January 2021
All rights reserved at BIS Research
4
Global Radiation-Hardened Electronics Market
Table of Contents Executive Summary……………………………………………...……………. 18 1.
Market Dynamics ................................................................................................33 1.1
1.2
1.3
2.
Drivers ........................................................................................................... 33 1.1.1
Rising Satellite Launches and Deep Space Activities.................... 33
1.1.2
Establishment of Autonomous Military Operations in Hostile Environment ...................................................................................... 35
1.1.3
Growing Demand for Radiation-Hardened Electronics in Nuclear and Healthcare Industry...................................................... 36
Market Restraints ......................................................................................... 36 1.2.1
High Initial Investment ...................................................................... 36
1.2.2
Difficulties in Creating Real Testing Environment ......................... 37
Opportunities................................................................................................ 38 1.3.1
Increasing Demand for COTS Radiation-Hardened Electronics in Different Verticals ..................................................... 38
1.3.2
Rising Requirement for Reconfigurable Radiation-Hardened Electronics ......................................................................................... 39
Competitive Insights ..........................................................................................40 2.1
Key Market Strategies and Development ................................................... 40 2.1.1
Partnerships, Collaborations, Contracts, and M&A ....................... 41
2.1.2
New Product Launches and Other Developments.......................... 43
2.2
Competitive Benchmarking ......................................................................... 44
2.3
Market Share Analysis ................................................................................. 45
3.
Industry Analysis................................................................................................47 3.1
Industry Overview ........................................................................................ 47
3.2
Comparison of Radiation-Hardened Products Standard Requirements and Regulations (by End User) .......................................... 48
3.3
Impact of New Technologies on Radiation-Hardened Electronics in New Space .................................................................................................... 49
3.4
Radiation-Hardened Electronics Manufacturers and Certifications ........ 49
3.5
Patent Analysis ............................................................................................ 54
All rights reserved at BIS Research
5
Global Radiation-Hardened Electronics Market
3.6
Supply Chain Analysis................................................................................. 55
3.7
Impact of COVID-19 On Radiation-Hardened Electronics Market ............ 57 3.7.1
4.
COVID-19 Effect on Manufacturing Sector ...................................... 57
Global Radiation-Hardened Electronics Market, 2020 to 2025 .......................58 4.1
Assumptions and Limitations ..................................................................... 58
4.2
Market Overview ........................................................................................... 59
5.
Global Radiation-Hardened Electronics Market (by Manufacturing Technique) ..........................................................................................................60 5.1
6.
Market Overview (by Manufacturing Technique) ....................................... 60 5.1.1
Rad-Hard by Design (RHBD) ............................................................ 61
5.1.2
Rad-Hard by Process (RHBP) ........................................................... 62
5.1.3
Rad-Hard by Software (RHBS) ......................................................... 63
Global Radiation-Hardened Electronics Market (by Component) ..................65 6.1
7.
Market Overview ........................................................................................... 65 6.1.1
Microprocessors and Controllers .................................................... 67
6.1.2
Discrete Semiconductors ................................................................. 68
6.1.3
Power Sources .................................................................................. 69
6.1.4
Memory............................................................................................... 70
6.1.5
Field-Programmable Gate Array....................................................... 71
6.1.6
Analog and Mixed Signals ................................................................ 72
6.1.7
Sensors .............................................................................................. 73
6.1.8
Application-Specific Integrated Circuit ........................................... 74
6.1.9
Others ................................................................................................. 75
Global Radiation-Hardened Electronics Market (by End User) ......................77 7.1
Market Overview ........................................................................................... 77
7.2
Space ............................................................................................................ 79
7.3
7.2.1
Satellite............................................................................................... 79
7.2.2
Launch Vehicles ................................................................................ 80
Military........................................................................................................... 81 7.3.1
Missiles .............................................................................................. 82
All rights reserved at BIS Research
6
Global Radiation-Hardened Electronics Market
7.3.2
Defense vehicle ................................................................................. 83
7.3.3
Munitions ........................................................................................... 84
7.4
Nuclear Power Plant .................................................................................... 85
7.5
Aerospace ..................................................................................................... 86
7.6
Others ........................................................................................................... 87
8.
Global Radiation-Hardened Electronics Market (by Region) ..........................89 8.1
Market Overview ........................................................................................... 89
8.2
North America .............................................................................................. 91 8.2.1
North America Radiation-Hardened Electronics Market Size (by End User) ..................................................................................... 92
8.2.2
North America Radiation-Hardened Electronics Market Size (by Component) ................................................................................. 94
8.2.3
North America Radiation-Hardened Electronics Market Size (by Manufacturing Technique) ......................................................... 95
8.2.4
North America Radiation-Hardened Electronics Market Size (by Country) ....................................................................................... 95
8.2.4.1
U.S. ..................................................................................................... 95
8.2.4.1.1
U.S. Radiation-Hardened Electronics Market (by End User) .......... 97
8.2.4.1.2
U.S. Radiation-Hardened Electronics Market (by Component) ...... 98
8.2.4.1.3
U.S. Radiation-Hardened Electronics Market (by Manufacturing Technique) ............................................................. 99
8.2.4.2
8.3
Canada .............................................................................................. 100
8.2.4.2.1
Canada Radiation-Hardened Electronics Market (by End User) ............................................................................................ 101
8.2.4.2.2
Canada Radiation-Hardened Electronics Market (by Component) ................................................................................. 103
8.2.4.2.3
Canada Radiation-Hardened Electronics Market (by Manufacturing Technique) ........................................................... 104
Europe ......................................................................................................... 105 8.3.1
Europe Radiation-Hardened Electronics Market (by End User) ................................................................................................. 106
8.3.2
Europe Radiation-Hardened Electronics Market (by Component) ..................................................................................... 107
8.3.3
Europe Radiation-Hardened Electronics Market (by Manufacturing Technique) .............................................................. 108
All rights reserved at BIS Research
7
Global Radiation-Hardened Electronics Market
8.3.4
Europe (by Country) ........................................................................ 109
8.3.4.1
U.K. ................................................................................................... 109
8.3.4.1.1 8.3.4.2 8.3.4.2.1 8.3.4.3 8.3.4.3.1 8.3.4.4 8.3.4.4.1 8.3.4.5 8.3.4.5.1 8.3.4.6 8.3.4.6.1 8.4
U.K. Radiation-Hardened Electronics Market (by End User) ........ 110 Germany............................................................................................ 111 Germany Radiation-Hardened Electronics Market (by End User) ............................................................................................ 112 France ............................................................................................... 112 France Radiation-Hardened Electronics Market (by End User) ... 113 Russia ............................................................................................... 114 Russia Radiation-Hardened Electronics Market (by End User) .... 115 Spain ................................................................................................. 115 Spain Radiation-Hardened Electronics Market (by End User) ..... 116 Rest-of-Europe .................................................................................. 117 Rest-of-Europe Radiation-Hardened Electronics Market (by End User) ..................................................................................... 118
Asia-Pacific ................................................................................................. 118 8.4.1
Asia-Pacific Radiation-Hardened Electronics Market (by End User) ................................................................................................. 120
8.4.2
Asia-Pacific Radiation-Hardened Electronics Market (by Component) ..................................................................................... 121
8.4.3
Asia-Pacific Radiation-Hardened Electronics Market (by Manufacturing Technique) .............................................................. 122
8.4.4
Asia-Pacific (by Country) ................................................................ 123
8.4.4.1
China ................................................................................................. 123
8.4.4.1.1 8.4.4.2 8.4.4.2.1 8.4.4.3 8.4.4.3.1 8.4.4.4 8.4.4.4.1 8.4.4.5
China Radiation-Hardened Electronics Market (by End User) ..... 124 Japan................................................................................................. 125 Japan Radiation-Hardened Electronics Market (by End User) ..... 126 South Korea ...................................................................................... 126 South Korea Radiation-Hardened Electronics Market (by End User) ............................................................................................ 127 Australia ............................................................................................ 128 Australia Radiation-Hardened Electronics Market (by End User) ............................................................................................ 129 India................................................................................................... 129
All rights reserved at BIS Research
8
Global Radiation-Hardened Electronics Market
8.4.4.5.1 8.4.4.6 8.4.4.6.1 8.5
Rest-of-Asia-Pacific ........................................................................... 131 Rest-of-Asia-Pacific Radiation-Hardened Electronics Market (by End User) ............................................................................... 132
Rest-of-the-World ....................................................................................... 133 8.5.1
Rest-of-the-World Radiation-Hardened Electronics Market (by End User) ................................................................................... 134
8.5.2
Rest-of-the-World Radiation-Hardened Electronics Market (by Component) ............................................................................... 135
8.5.3
Rest-of-the-World Radiation-Hardened Electronics Market (by Manufacturing Technique) ....................................................... 136
8.5.4
Rest-of-the-World Radiation-Hardened Electronics Market (by Country) ..................................................................................... 137
8.5.4.1
Brazil ................................................................................................. 137
8.5.4.1.1 8.5.4.2 8.5.4.2.1 8.5.4.3 8.5.4.3.1 8.5.4.4 8.5.4.4.1 8.5.4.5 8.5.4.5.1 9.
India Radiation-Hardened Electronics Market (by End User) ....... 131
Brazil Radiation-Hardened Electronics Market (by End User) ...... 138 U.A.E ................................................................................................. 138 U.A.E. Radiation-Hardened Electronics Market (by End User) .... 139 South Africa ....................................................................................... 140 South Africa Radiation-Hardened Electronics Market (by End User) ............................................................................................ 141 Mexico ............................................................................................... 141 Mexico Radiation-Hardened Electronics Market (by End User) ... 142 Others................................................................................................ 143 Others Radiation-Hardened Electronics Market (by End User) .... 144
Company Profiles .............................................................................................145 9.1
9.2
3D Plus (HEICO Corporation) .................................................................... 145 9.1.1
Company Overview ......................................................................... 145
9.1.2
Financial Overview .......................................................................... 145
9.1.3
Product Portfolio ............................................................................. 147
9.1.4
Strategic Overview .......................................................................... 147
9.1.5
SWOT Analysis of 3D Plus (HEICO Corporation) ......................... 148
Analog Devices Inc. ................................................................................... 149 9.2.1
Company Overview ......................................................................... 149
All rights reserved at BIS Research
9
Global Radiation-Hardened Electronics Market
9.3
9.4
9.5
9.6
9.7
9.2.2
Financial Overview .......................................................................... 150
9.2.3
Product Portfolio ............................................................................. 151
9.2.4
Strategic Overview .......................................................................... 153
9.2.4.1
Conferences and Expo ...................................................................... 153
9.2.4.2
Business Collaboration ...................................................................... 154
9.2.5
SWOT Analysis of Analog Devices ................................................ 155
Anaren Inc. (TTM Technologies) ............................................................... 156 9.3.1
Company Overview ......................................................................... 156
9.3.2
Financial Overview .......................................................................... 156
9.3.3
Product Portfolio ............................................................................. 157
9.3.4
SWOT Analysis: Anaren Inc. (TTM Technologies)........................ 158
BAE Systems .............................................................................................. 159 9.4.1
Company Overview ......................................................................... 159
9.4.2
Product Portfolio ............................................................................. 160
9.4.3
Financial Overview .......................................................................... 160
9.4.4
Strategic Overview .......................................................................... 161
9.4.4.1
New Product Launch ......................................................................... 161
9.4.5
SWOT Analysis of BAE Systems ................................................... 162
Cobham plc................................................................................................. 163 9.5.1
Company Overview ......................................................................... 163
9.5.2
Financial Overview .......................................................................... 164
9.5.3
Product Portfolio ............................................................................. 165
9.5.4
Business Strategies ........................................................................ 166
9.5.5
SWOT Analysis of Cobham PLC .................................................... 167
Data Device Corporation ........................................................................... 168 9.6.1
Company Overview ......................................................................... 168
9.6.2
Product Portfolio ............................................................................. 168
9.6.3
Business Strategies ........................................................................ 169
9.6.4
SWOT Analysis: Data Device Corporation .................................... 170
Honeywell International Inc. ...................................................................... 171 9.7.1
Company Overview ......................................................................... 171
9.7.2
Financial Overview .......................................................................... 172
All rights reserved at BIS Research
10
Global Radiation-Hardened Electronics Market
9.7.3
Product Portfolio ............................................................................. 173
9.7.4
Corporate Strategies ....................................................................... 174
9.7.4.1
Contract ............................................................................................. 174
9.7.5
SWOT Analysis: Honeywell ............................................................ 174
9.8
IBM Corporation ......................................................................................... 175 9.8.1
Company Overview ......................................................................... 175
9.8.2
Financial Overview .......................................................................... 176
9.8.3
Product Portfolio ............................................................................. 177
9.8.4
SWOT: IBM Corporation ................................................................. 178
9.9
Infineon Technologies Inc. ........................................................................ 179 9.9.1
Company Overview ......................................................................... 179
9.9.2
Financial Overview .......................................................................... 180
9.9.3
Product Portfolio ............................................................................. 181
9.9.4
Business Strategies ........................................................................ 182
9.9.5
SWOT: Infineon Technologies Inc ................................................. 183
9.10
Microchip Technology Inc. ........................................................................ 184
9.10.1
Company Overview ......................................................................... 184
9.10.2
Financial Overview .......................................................................... 185
9.10.3
Product Portfolio ............................................................................. 186
9.10.4
Business Strategies ........................................................................ 187
9.10.5
SWOT: Microchip Technology Inc ................................................. 188
9.11
Micropac Industries Inc. ............................................................................ 189
9.11.1
Company Overview ......................................................................... 189
9.11.2
Product Portfolio ............................................................................. 189
9.11.3
Strength and Weakness of Micropac Industries Inc..................... 190
9.12
Renesas Electronics Corporation ............................................................. 191
9.12.1
Company Overview ......................................................................... 191
9.12.2
Financial Overview: Renesas Electronics Corporation ............... 192
9.12.3
Product Portfolio ............................................................................. 192
9.12.4
Business Strategies ........................................................................ 193
9.12.5
SWOT: Renesas Electronics Corporation ..................................... 193
9.13
Solid State Devices Inc. ............................................................................. 194
All rights reserved at BIS Research
11
Global Radiation-Hardened Electronics Market
9.13.1
Company Overview ......................................................................... 194
9.13.2
Product Portfolio ............................................................................. 194
9.13.3
Business Strategies ........................................................................ 196
9.13.3.1 New Product Launch ......................................................................... 196 9.13.4 9.14
SWOT: Solid State Devices ............................................................ 197
STMicroelectronics N.V ............................................................................. 198
9.14.1
Company Overview ......................................................................... 198
9.14.2
Financial Overview .......................................................................... 199
9.14.3
Product Portfolio ............................................................................. 200
9.14.4
Business Strategies ........................................................................ 201
9.14.5
SWOT: STMicroelectronics N.V..................................................... 202
9.15
Texas Instruments Inc ............................................................................... 203
9.15.1
Company Overview ......................................................................... 203
9.15.2
Financial Overview .......................................................................... 204
9.15.3
Product Portfolio ............................................................................. 205
9.15.4
Business Strategies ........................................................................ 206
9.15.5
SWOT: Texas Instruments Inc. ....................................................... 207
9.16
Teledyne Technologies Incorporated. ...................................................... 208
9.16.1
Company Overview ......................................................................... 208
9.16.2
Financial Overview .......................................................................... 208
9.16.3
Product Portfolio ............................................................................. 210
9.16.4
Business Strategies ........................................................................ 210
9.16.5
SWOT: Teledyne Technologies ...................................................... 211
9.17
The Boeing Company ................................................................................ 212
9.17.1
Company Overview ......................................................................... 212
9.17.2
Financial Overview .......................................................................... 213
9.17.3
Product Portfolio ............................................................................. 214
9.17.4
Business Strategies ........................................................................ 215
9.17.5
SWOT: The Boeing Company. ........................................................ 216
9.18
Xilinx Inc. .................................................................................................... 217
9.18.1
Company Overview ......................................................................... 217
9.18.2
Financial Overview .......................................................................... 218
All rights reserved at BIS Research
12
Global Radiation-Hardened Electronics Market
9.18.3
Product Portfolio ............................................................................. 219
9.18.4
Business Strategies ........................................................................ 219
9.18.5
SWOT: Xilinx Inc .............................................................................. 220
9.19
10.
11.
Other Key Players ...................................................................................... 221
9.19.1
AIS Tech Space................................................................................ 221
9.19.2
Hiber Global ..................................................................................... 221
9.19.3
Hera Systems ................................................................................... 222
9.19.4
Helios Wire ....................................................................................... 222
9.19.5
Kepler Communications ................................................................. 223
9.19.6
Swarm Technology.......................................................................... 223
9.19.7
Sen .................................................................................................... 224
9.19.8
Unseen Labs .................................................................................... 224
Research Scope and BIS Methodology ..........................................................225 10.1
Scope of the Report ................................................................................... 225
10.2
Global Radiation-Hardened Electronics Market Research Methodology ............................................................................................... 226
Appendix ...........................................................................................................232 11.1
Related Reports .......................................................................................... 232
All rights reserved at BIS Research
13
Global Radiation-Hardened Electronics Market
List of Tables Table 1:
Market Snapshot: Global Radiation-Hardened Electronics Market, $Million, 2019 and 2025 ................................................................................................................... 26
Table 2:
Comparison between COTS and QML Rad-Hard ............................................................ 37
Table 3:
Partnerships, Collaborations, Contracts, and M&A .......................................................... 41
Table 4:
New Product Launches and Other Developments ........................................................... 43
Table 5:
End User Specification, Requirements ............................................................................. 48
Table 6:
List of Certifications............................................................................................................ 49
Table 7:
Major Patents Granted for Radiation-Hardened Electronics ............................................ 54
Table 8:
Global Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025 ........................................................................................................... 61
Table 9:
Global Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025 .......................................................................................................................... 66
Table 10: Global Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 .......................................................................................................................... 78 Table 11: Global Radiation-Hardened Electronics Market (by Region), $Million, 2019-2025 ......... 90 Table 12: North America Radiation-Hardened Market (by End User), $Million, 2019-2025 .......... 92 Table 13: North America Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 .......................................................................................................................... 93 Table 14: North America Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 .......................................................................................................................... 93 Table 15: North America Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025 .......................................................................................................................... 94 Table 16: North America Radiation-Hardened Market (by Manufacturing Technique), $Million, 2019-2025 ........................................................................................................... 95 Table 17: U.S. Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025......... 97 Table 18: U.S. Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 .......... 97 Table 19: U.S. Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 .......... 98 Table 20: U.S. Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025 .......................................................................................................................... 98
All rights reserved at BIS Research
14
Global Radiation-Hardened Electronics Market
Table 21: U.S. Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025 ........................................................................................................... 99 Table 22: Canada Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 101 Table 23: Canada Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 ........................................................................................................................ 102 Table 24: Canada Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 ........................................................................................................................ 102 Table 25: Canada Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025 ........................................................................................................................ 103 Table 26: Canada Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025 ......................................................................................................... 104 Table 27: Europe Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 106 Table 28: Europe Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 ........................................................................................................................ 106 Table 29: Europe Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 ........................................................................................................................ 107 Table 30: Europe Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025 ........................................................................................................................ 107 Table 31: Europe Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025 ......................................................................................................... 108 Table 32: U.K. Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025...... 110 Table 33: Germany Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 112 Table 34: France Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 113 Table 35: Russia Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 115 Table 36: Spain Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 116
All rights reserved at BIS Research
15
Global Radiation-Hardened Electronics Market
Table 37: Rest-of-Europe Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 118 Table 38: Asia-Pacific Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 120 Table 39: Asia-Pacific Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 ........................................................................................................................ 120 Table 40: Asia-Pacific Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 ........................................................................................................................ 121 Table 41: Asia-Pacific Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025 ........................................................................................................................ 121 Table 42: Asia-Pacific Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025 ..................................................................................... 122 Table 43: China Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 124 Table 44: Japan Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 126 Table 45: South Korea Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 127 Table 46: Australia Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 129 Table 47: India Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ...... 131 Table 48: Rest-of-Asia-Pacific Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ......................................................................................................... 132 Table 49: Rest-of-the-World Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ......................................................................................................... 134 Table 50: Rest-of-the-World Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 ......................................................................................................... 134 Table 51: Rest-of-the-World Radiation-Hardened Electronics Market, by End User, $Million, 2019-2025 ......................................................................................................... 135 Table 52: Rest-of-the-World Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025 ......................................................................................................... 135
All rights reserved at BIS Research
16
Global Radiation-Hardened Electronics Market
Table 53: Rest-of-the-World Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025 ..................................................................................... 136 Table 54: Brazil Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 138 Table 55: U.A.E. Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 139 Table 56: South Africa Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 141 Table 57: Mexico Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 142 Table 58: Others Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 ........................................................................................................................ 144 Table 59: 3D Plus (HEICO Corporation): Product Portfolio ............................................................ 147 Table 60: Contract ............................................................................................................................ 147 Table 61: Analog Devices: Product Portfolio................................................................................... 151 Table 62: Conferences and Expo .................................................................................................... 153 Table 63: Business Collaboration .................................................................................................... 154 Table 64: Anaren Inc. (TTM Technologies): Product Portfolio ....................................................... 157 Table 65: BAE Systems Product Portfolio....................................................................................... 160 Table 66: New Product Launch ....................................................................................................... 161 Table 67: Cobham PLC: Product Portfolio ...................................................................................... 165 Table 68: Business Strategies ......................................................................................................... 166 Table 69: Data Device Corporation: Product Portfolio .................................................................... 168 Table 70: Business Strategies ......................................................................................................... 169 Table 71: Honeywell International Inc.: Product Portfolio ............................................................... 173 Table 72: Long Term Contract ......................................................................................................... 174 Table 73: IBM Corporation Product Portfolio .................................................................................. 177 Table 74: Infineon Technologies Inc.: Product Portfolio ................................................................. 181 Table 75: Infineon Technologies Inc..: Long Term Agreement ...................................................... 182 Table 76: Microchip Technology Inc: Product Portfolio .................................................................. 186 Table 77: Acquisition ........................................................................................................................ 187 Table 78: Micropac Industries Inc.: Product Portfolio ..................................................................... 189
All rights reserved at BIS Research
17
Global Radiation-Hardened Electronics Market
Table 79: Renesas Electronics Corporation: Product Portfolio ...................................................... 192 Table 80: Product Developments .................................................................................................... 193 Table 81: Solid State Devices: Product Portfolio ............................................................................ 194 Table 82: New Product Launch ....................................................................................................... 196 Table 83: STMicroelectronics N.V.: Product Portfolio..................................................................... 200 Table 84: New Product Launch ....................................................................................................... 201 Table 85: Texas Instruments Inc.: Product Portfolio ....................................................................... 205 Table 86: Internal Management....................................................................................................... 206 Table 87: Teledyne Technologies Incorporated: Product Portfolio ................................................ 210 Table 88: Business Strategies ......................................................................................................... 210 Table 89: The Boeing Company: Product Portfolio ........................................................................ 214 Table 90: Licensing .......................................................................................................................... 215 Table 91: Xilinx Inc.: Product Portfolio............................................................................................. 219 Table 92: Collaboration .................................................................................................................... 219
All rights reserved at BIS Research
18
Global Radiation-Hardened Electronics Market
List of Figures Figure 1:
Global Radiation-Hardened Electronics Market, $Million, 2019-2025 ............................. 25
Figure 2:
Global Radiation-Hardened Electronics Market (by Manufacturing Technique), $Million, 2019-2025 ........................................................................................................... 27
Figure 3:
Global Radiation-Hardened Electronics Market (by Component), $Million, 2019-2025 .......................................................................................................................... 28
Figure 4:
Global Radiation-Hardened Electronics Market (by End User), $Million, 2019-2025 .......................................................................................................................... 29
Figure 5:
Global Radiation-Hardened Electronics Market (by Region), 2019-2025 ....................... 30
Figure 6:
: Market Dynamics Snapshot ............................................................................................ 33
Figure 7:
Satellites Launches, 2014-2019 ........................................................................................ 34
Figure 8:
Key Strategies Adopted by Market Players ...................................................................... 40
Figure 9:
Competitive Benchmarking, 2019 ..................................................................................... 44
Figure 10: Market Share Analysis, 2019 ............................................................................................ 45 Figure 11: Industry Insights ................................................................................................................. 47 Figure 12: Supply Chain Analysis, 2019............................................................................................. 55 Figure 13: Global Radiation-Hardened Electronics Market (by Manufacturing Technique) ............. 60 Figure 14: Global Radiation-Hardened Electronics Market (Rad-Hard by Design), 2019-2025 .......................................................................................................................... 62 Figure 15: Global Radiation-Hardened Electronics Market (Rad-Hard by Process), 2019-2025 .......................................................................................................................... 63 Figure 16: Global Radiation-Hardened Electronics Market (Rad-Hard by Software), 2019-2025 .......................................................................................................................... 64 Figure 17: Global Radiation-Hardened Electronics Market (by Component) .................................... 66 Figure 18: Global Radiation-Hardened Electronics Market (Microprocessors and Controllers), 2019-2025 ..................................................................................................... 68 Figure 19: Global Radiation-Hardened Electronics Market (Discrete Semiconductors), 2019-2025 .......................................................................................................................... 69 Figure 20: Global Radiation-Hardened Electronics Market (Power Sources), 2019-2025 .............. 70 Figure 21: Global Radiation-Hardened Electronics Market (Memory), 2019-2025........................... 71
All rights reserved at BIS Research
19
Global Radiation-Hardened Electronics Market
Figure 22: Global Radiation-Hardened Electronics Market (Field-Programmable Gate Array), 2019-2025 .............................................................................................................. 72 Figure 23: Global Radiation-Hardened Electronics Market (Analog and Mixed Signals), 2019-2025 .......................................................................................................................... 73 Figure 24: Global Radiation-Hardened Electronics Market (Sensors), 2019-2025 .......................... 74 Figure 25: Global Radiation-Hardened Electronics Market (Application-Specific Integrated Circuit), 2019-2025 ............................................................................................................ 75 Figure 26: Global Radiation-Hardened Electronics Market (Others), 2019-2025 ............................. 76 Figure 27: Global Radiation-Hardened Electronics Market (by End User) ....................................... 77 Figure 28: Global Radiation-Hardened Electronics Market (by Space), 2019-2025......................... 79 Figure 29: Global Radiation-Hardened Electronics Market (by Satellite), 2019-2025 ...................... 80 Figure 30: Global Radiation-Hardened Electronics Market (by Launch Vehicle), 2019-2025 ......... 81 Figure 31: Global Radiation-Hardened Electronics Market (by Military), 2019-2025 ....................... 82 Figure 32: Global Radiation-Hardened Electronics Market (by Missile), 2019-2025 ........................ 83 Figure 33: Global Radiation-Hardened Electronics Market (by Defense Vehicle), 2019-2025 ........ 84 Figure 34: Global Radiation-Hardened Electronics Market (by Munitions), 2019-2025 ................... 85 Figure 35: Global Radiation-Hardened Electronics Market (by Nuclear Power Plant), 2019-2025 .......................................................................................................................... 86 Figure 36: Global Radiation-Hardened Electronics Market (by Aerospace), 2019-2025 ................ 87 Figure 37: Global Radiation-Hardened Electronics Market (by Others), 2019-2025 ........................ 88 Figure 38: Global Radiation-Hardened Electronics Market (by Region) ........................................... 89 Figure 39: Regional Distribution of the Global Radiation-Hardened Electronics Market, 2019 and 2025 ................................................................................................................... 90 Figure 40: North America Radiation-Hardened Electronics Market (by Country), 2019 - 2025 ........................................................................................................................ 92 Figure 41: U.S. Radiation-Hardened Electronics Market, 2019-2025 ............................................... 96 Figure 42: Canada Radiation-Hardened Electronics Market, 2019-2025 ....................................... 101 Figure 43: Europe Radiation-Hardened Electronics Market, 2019-2025 ........................................ 105 Figure 44: U.K. Radiation-Hardened Electronics Market, 2019-2025 ............................................. 110 Figure 45: Germany Radiation-Hardened Electronics Market, 2019-2025 ..................................... 111 Figure 46: France Radiation-Hardened Electronics Market, 2019-2025......................................... 113 Figure 47: Russia Radiation-Hardened Electronics Market, 2019-2025 ......................................... 114
All rights reserved at BIS Research
20
Global Radiation-Hardened Electronics Market
Figure 48: Spain Radiation-Hardened Electronics Market, 2019-2025 ........................................... 116 Figure 49: Rest-of-Europe Radiation-Hardened Electronics Market, 2019-2025 ........................... 117 Figure 50: Asia-Pacific Radiation-Hardened Electronics Market, 2019–2025 ................................ 119 Figure 51: China Radiation-Hardened Electronics Market, 2019-2025........................................... 124 Figure 52: Japan Radiation-Hardened Electronics Market, 2019-2025 .......................................... 125 Figure 53: South Korea Radiation-Hardened Electronics Market, 2019-2025................................ 127 Figure 54: Australia Radiation-Hardened Electronics Market, 2019-2025 ...................................... 128 Figure 55: India Radiation-Hardened Electronics Market, 2019-2025 ............................................ 130 Figure 56: Rest-of-Asia-Pacific Radiation-Hardened Electronics Market, 2019-2025 .................... 132 Figure 57: Rest-of-the-World Radiation-Hardened Electronics Market, 2019-2025 ....................... 133 Figure 58: Brazil Radiation-Hardened Electronics Market, 2019-2025 ........................................... 137 Figure 59: U.A.E. Radiation-Hardened Electronics Market, 2019-2025 ......................................... 139 Figure 60: South Africa Radiation-Hardened Electronics Market, 2019-2025 ................................ 140 Figure 61: Mexico Radiation-Hardened Electronics Market, 2019-2025 ........................................ 142 Figure 62: Others Radiation-Hardened Electronics Market, 2019-2025 ......................................... 143 Figure 63: 3D Plus (HEICO Corporation): Financial Overview, 2017-2019 .................................... 145 Figure 64: 3D Plus (HEICO Corporation): Segment Split, 2017-2019 ............................................ 146 Figure 65: 3D Plus (HEICO Corporation): Regional Split, 2017-2019 ............................................ 146 Figure 66: Analog Devices: Financial Overview, 2017-2019 ........................................................... 150 Figure 67: Analog Devices: Segment Split, 2017-2019 ................................................................... 150 Figure 68: Analog Devices: Regional Split, 2017-2019 ................................................................... 151 Figure 69: Anaren Inc. (TTM Technologies): Financial Overview, 2017-2019 ............................... 156 Figure 70: Anaren Inc. (TTM Technologies): Segment Split, 2017-2019........................................ 157 Figure 71: BAE Systems: Financial Overview, 2017-2019 .............................................................. 160 Figure 72: BAE Systems: Segment Split, 2017-2019 ...................................................................... 161 Figure 73: Cobham PLC: Financial Overview, 2017-2018 .............................................................. 164 Figure 74: Cobham PLC: Segment Split, 2017-2018 ...................................................................... 164 Figure 75: Cobham PLC: Regional Split, 2017-2018 ....................................................................... 165 Figure 76: Honeywell International Inc.: Financial Overview, 2017-2019 ....................................... 172 Figure 77: Honeywell International Inc.: Segment Split, 2017-2019 ............................................... 172 Figure 78: Honeywell International Inc.: Regional Split, 2017-2019................................................ 173 Figure 79: IBM Corporation.: Financial Overview, 2017-2019......................................................... 176
All rights reserved at BIS Research
21
Global Radiation-Hardened Electronics Market
Figure 80: IBM Corporation.: Segment Split, 2017-2019 ................................................................. 176 Figure 81: IBM Corporation: Regional Split (2017-2019)................................................................. 177 Figure 82: Infineon Technologies Inc.: Financial Overview, 2017-2019 ......................................... 180 Figure 83: Infineon Technologies Inc.: Segment Split, 2017-2019.................................................. 180 Figure 84: Infineon Technologies Inc.: Regional Split, 2017-2019 .................................................. 181 Figure 85: Microchip Technology Inc: Financial Overview, 2018-2020........................................... 185 Figure 86: Microchip Technology Inc: Segment Split, 2018-2020 ................................................... 185 Figure 87: Microchip Technology Inc: Regional Split, 2018-2020 ................................................... 186 Figure 88: Renesas Electronics Corporation: Financial Overview, 2017-2019 .............................. 192 Figure 89: STMicroelectronics N.V.: Financial Overview, 2017-2019 ............................................. 199 Figure 90: STMicroelectronics N.V.: Segment Split, 2017-2019 ..................................................... 199 Figure 91: STMicroelectronics N.V.: Regional Split, 2017-2019 ..................................................... 200 Figure 92: Texas Instruments Inc: Financial Overview (2017-2019) ............................................... 204 Figure 93: Texas Instruments Inc: Segment Split, 2017-2019 ........................................................ 204 Figure 94: Texas Instruments Inc: Regional Split, 2017-2019......................................................... 205 Figure 95: Teledyne Technologies Incorporated: Financial Overview, 2017-2019 ........................ 208 Figure 96: Teledyne Technologies Incorporated: Segment Split, 2017-2019................................. 209 Figure 97: Teledyne Technologies Incorporated: Regional Split, 2017-2019 ................................. 209 Figure 98: The Boeing Company: Financial Overview, 2017-2019................................................. 213 Figure 99: The Boeing Company: Segment Split, 2017-2019 ......................................................... 213 Figure 100:The Boeing Company: Regional Split, 2017-2019 ......................................................... 214 Figure 101:Xilinx Inc.: Financial Overview, 2017-2018 ..................................................................... 218 Figure 102:Xilinx Inc.: Regional Split, 2017-2018 ............................................................................. 218 Figure 103:Global Radiation-Hardened Electronics (Market Segmentation) ................................... 225 Figure 104:Radiation-Hardened Electronics Market Research Methodology .................................. 226 Figure 105:Data Triangulation ........................................................................................................... 228 Figure 106:Top-Down and Bottom-Up Approach.............................................................................. 229 Figure 107:Global Radiation-Hardened Electronics Market Influencing Factors ............................. 230 Figure 108:Assumptions and Limitations........................................................................................... 231
All rights reserved at BIS Research
22
Global Radiation-Hardened Electronics Market
BIS Research Offerings: We are on a mission to harness the potential of disruptive technologies to make businesses thrive in today’s digital age. We have a vision to be a leading and a preferred knowledge partner for corporates and institutions worldwide and assist them with market intelligence in the area of emerging technologies, advisories, and other innovative solutions.
Know More
Know More
Know More
Know More
All rights reserved at BIS Research
23
Global Radiation-Hardened Electronics Market
Disclaimer BIS Research Inc. provides valuable market intelligence to an exclusive group of customers in response to orders. The report is licensed for the customer's internal use only and is subject to restrictions set henceforth. This document and its contents are confidential and may not be further distributed, published or reproduced, in whole or in part, by any medium or in any form for any purpose, without the written consent of BIS Research. The customer will not disclose the contents of the report, whether directly through any medium or indirectly through incorporation in a database, marketing list, report or otherwise, or use or permit the use of information to generate any statistical or other information that is or will be provided to third parties, or voluntarily produce information in legal proceedings.
Market reports are based on expectations, estimates and projections as of the date such information is available. Any recommendation contained in this report may not be suitable for all investors or businesses. The market conclusions drawn are necessarily based upon a number of estimates and assumptions that, while considered reasonable by BIS Research as of the date of such statements, are inherently subject to market fluctuations and business, economic and competitive uncertainties and contingencies.
For more details regarding permission, please contact us: Email: sales@bisresearch.com
Tel: +1 510 404 8135
All rights reserved at BIS Research
24
Global Radiation-Hardened Electronics Market
BIS RESEARCH INC. 39111 Paseo Padre PKWY, Suite 313 Fremont, CA 94538 -1686 E-mail: info@bisresearch.com | Call Us: +1-510-404-8135
Global Delivery Center Tower B First Floor, Tapasya Corporate Heights, Greater Noida Expressway, Sector 126, Noida, U.P., 201303, India Tel: +91 120 4261540 / 4261544
All rights reserved at BIS Research
25