2019 RISC-Based Embedded Solutions by IBASE Technology

Table of Contents

About IBASE

3-4

Your Best Partner RISC for IoT

SMARC Module & 3.5"/2.5" Single Board Computers

Comparison Table

8-10

NEW

RM-N8M Series

Wide-Temperature SMARC™ 2.0 Module with NXP ARM® Cortex-A53/Cortex-M4 i.MX 8M Dual/Quad 1.5GHz Processor

NEW

RM-N8MMI Series

Wide-Temperature SMARC™ 2.0 Module with NXP ARM® Cortex-A53/Cortex-M4 i.MX 8M Mini Quad 1.8GHz Processor

NEW

RP-103-SMC

Carrier Board Compliant with SMARC™ V2.0 CPU Module

RM-F6 Series

Wide-Temperature SMARC™ Module with NXP ARM® Cortex-A9 i.MX 6Dual/6Solo 800MHz Processor

RP-102-SMC

Carrier Board for SMARC™ Modules

IBR210

Low-Power Multimedia IoT 3.5” SBC with NXP ARM® Cortex-A53/Cortex-M4 i.MX 8M Dual/Quad 1.5GHz Processor

IBR117

Low-Power Multimedia IoT 3.5” SBC with NXP ARM® Cortex-A9 i.MX 6Dual 1GHz Processor

IBR115

Low-Power Multimedia IoT 2.5” SBC with NXP ARM® Cortex-A9 i.MX 6Dual-Lite 1GHz Processor

IB113

Low-Power Multimedia IoT 3.5” SBC with NXP ARM® Cortex-A9 i.MX 6Dual 800MHz Processor

NEW

AIoT Solutions

Comparison Table

NEW

ISS-603

7th Gen Intel® Core™ Desktop Processor-based System with NVIDIA MXM Graphics and Four Video Outputs

NEW

ISS-401

NVIDIA Jetson TX2-based System with 1.5 TFLOPS Tensor Performance

IoT Gateway

NEW

ISR201

Ruggedized Embedded System with NXP ARM® Cortex-A9 i.MX 6Dual 1GHz Processor

ISR101

Ruggedized Embedded System with NXP ARM® Cortex-A9 i.MX 6Dual-Lite 1GHz Processor

Digital Signage Player

Comparison Table

SA-112-N

Wide-Temperature Signage Player with NXP ARM® Cortex-A9 i.MX 6Dual/6Quad 1GHz Processor

SA-101-N

Fanless Signage Player with NXP ARM® Cortex-A9 i.MX 6Quad 1GHz Processor

RSP23

23" All-in-One Bar-Type Panel PC with Actions S500 Cortex-A9 Quad-core and CMS Media Stream Updating

About IBASE

Core Activities Design and Manufacture of Robust Industrial Computing Platforms

Company Profile IBASE Technology specializes in the design and manufacture of robust industrial PC products, delivering high quality products and excellent service since its establishment in 2000. IBASE carries out manufacturing and quality control at its own facilities in Taiwan that are certified with ISO 9001, ISO 13485 and ISO 14001 standards. Current offerings comprise x86 and RISC-based industrial motherboards, embedded systems, panel PCs, network appliances and digital signage players. The company is publicly listed in the Taipei Exchange (TPEx: 8050) and is now a leading global provider of innovative industrial and embedded computing solutions.

HEADQUARTERS Taipei, Taiwan

Branch Office

China

Japan

Herts

Shanghai

Tokyo

Headquarters

FOUNDED

Taiwan Taipei

February 2000

Manufacturing Sites Taiwan

Sanchung Hsinchuang

100%

CHAIRMAN

Branch Office

Sunnyvale

Domodossola

USA

C. S. Lin

Italy

Branch Office

Made in Taiwan

Singapore

R&D Capabilities CAPITAL US$57.8M

IBASE's R&D team boasts of talented electronics, layout, system, mechanical hardware, BIOS, firmware as well as software engineers. Half of the team members are seasoned with more than 20 years of experience in their respective fields, while the rest of the engineers carry more than five years of experience. Because of their accumulated expertise, the R&D team is able to design and create new products for the demanding and dynamic market.

EMPLOYEE 670 (Worldwide) Stock Quote TPEx 8050 (Since 2003)

R&D, the Core Competence of IBASE Experienced R&D in IPC Field One-Stop R&D Services H/W, S/W Integration Capabilites

Design+, Manufacture+, Service+ Set up to become a global leading provider of embedded board and system solutions, IBASE manufactures and supplies cutting-edge products based on the latest technologies to match market demands. Our R&D and product management teams have the expertise to design and develop products that are innovative and meet customers’ requirements and design specifications. We attach great importance to research and development, investing heavily in manpower and resources to remain competitive by staying ahead in the technology curve. IBASE is also committed to compliance with environmental policies by working to prevent pollution with non-use of banned or restricted substances in our production process and products, helping our customers respond to their environmental challenges. Customer Requirements

Market Trend

Product Management

Embedded Controller, BIOS, IPMI, FPGA, CPLD & Embedded OS Designs

Manufacturing

Research for Improvement

Electrical, Mechanical & Thermal Designs

By Outstanding Product Management Team

Software Design

Sanchung & Hsinchuang Manufacturing Sites in Taiwan

Technology Trend

Hardware Design

Logistics

Flexible Procurement & Logistics Management

IBASE Manufacturing Sites Hsinchuang New Taipei City

Sanchung New Taipei City

• Board Production

• System Assembly

• Validation

Certifications ISO 9001

ISO 14001

ISO 13485

ISO/TS 16949

Your Best Partner

Aside from developing standard products, IBASE offers ODM (Original Design Manufacturer) and JDM (Joint Design Manufacturer) services and customized products for unique designs and solutions. With our highly-qualified expert engineers, IBASE can tailor its board-level and system designs for customersâ&#x20AC;&#x2122; application-specific needs, ensuring high quality, reliability and longevity.

TIO

IBASE has partnered with mainstream processor vendors such as Intel, AMD and NXP in product development to create edge computing and AIoT solutions with unprecedented levels of performance. IBASE has built its reputation through dedication to serving clients with well-designed products and solutions. To this day, IBASE continue to foster an unbreakable relationship with both its customers and technology vendors, working hand-in-hand to form a lasting win-win partnership.

I AR

TEAMWORK

Y NC

IE FIC

EF 5

RISC for IoT In the coming world of Smart City and Industry 4.0 that is driven by Internet of Things (IoT), a network connected by embedded technologies, intelligent computing will be anywhere and everywhere. There will be a huge opportunity for solutions providers to supply compact and power-efficient intelligent computing platforms based on ARM technology. ARM is the leading technology in energy-efficient devices and intelligent computing solutions.

In fact, a RISC- or an ARM-based device maybe just in front of or beside you right now. Itâ&#x20AC;&#x2122;s a design that is power efficient and requires processors with fewer transistors, reducing costs, heat and power use. Join the ARM community now! One of the products that has implemented the ARM technology is Systems-On-Chip (SoC), which IBASE supports in its ARM-based systems product lineup comprising various Smart Mobility ARChitecture (SMARC), single board computers and custom solutions. IBASE manufactures ARM-based platforms that are both power-optimized and performance-optimized, suitable in a variety of Internet of Things (IoT) and future applications. Aside from various hardware solutions, IBASE also provides professional documentation and design-in service to speed up your product innovation process and implementation with Minimum resource and fast time to market.

+85

-45

C 0

Wide Temperature

Remarks: 1.

Cloud

Green Energy

2. ODM/OEM is available.

Intelligent

SMARC Module & 3.5"/2.5" SBC SMARC Module For different application requirements, IBASE provides versatile ARM-based SBC (Single Board Computer) solutions using standardized and compact platforms such as SMARC module, 2.5” (Pico-iTX) and 3.5” (disk-size) boards to speed up your product solution development. SMARC (Smart Mobility ARChitecture) is a versatile small form factor computer module definition targeting applications that require low power, rich features, and high performance. The modules typically use ARM SoCs similar to those used in many embedded systems found in automation control, multimedia, and transportation control applications.

IBASE provides SMARC products and solutions supporting the NXP i.MX6 and i.MX8 series with powerful multimedia and versatile features. Besides SMARC modules, IBASE also offers a SMARC evaluation kit that comes with carrier boards such as RP-1xx-SMC and other hardware including panels, MIPI-CSI camera, wireless and 4G/ TLE modules to speed up your ARM-based solutions development. 3.5”/2.5” SBC IBASE’s ARM-based SBCs support various display and I/O interface including LVDS/HDMI, RS-232/422/485 and USB ports, as well as Mini PCI-E and M.2 for expansion connectivity. Aside from versatile I/O features, IBASE’s SBC solutions supports low-power consumption and a wide-range operating temperature of -40°C ~85°C for rugged applications. For the software part, we provide the GUI images for Ubuntu, Yocto-Linux and Android to help in your performance testing and ensure your app meets its functional requirements. For a fast and optimized application development, we provide a standard BSP (board support package) to help software developers create, evaluate and test their applications before release.

Two module sizes have been defined: 82mm x 50mm and 82mm x 80mm. The module PCBs have 314 edge fingers that mate with a low profile 314 pin 0.5mm pitch right angle connector. The modules are used as building blocks for portable and standalone embedded systems. Circuits in the module include those of DRAM, boot flash, power sequencing, USB2.0/3.0/OTG interface, Ethernet, LVDS, HDMI and TTL display. The modules are used with carrier boards for versatile applications that implement other features such as audio codecs, touch controllers and wireless devices. The modular approach affords scalability and fast time to market while still maintaining low power consumption and a small form factor.

With the aforementioned hardware and software solutions of ARM-based SBCs, IBASE is your best choice and partner to complete your ARM-based products.

Form Factor

SMARC Module 3.5" and 2.5" SBC

Architecture Compact Peripheral

Cortex™ Low Power, Small Size Wi-Fi, Bluetooth, 3G/GPS, 4G/LTE, Ethernet, Touch, Panel, Display

Software Remarks: 1.

2. ODM/OEM is available.

Comparison Table SMARC

Model

RM-N8M

RM-F6 series

Form Factor

SMARC™ V2.0

SMARC™ V1.0

Processor

NXP Cortex™-A53 and Cortex™-M4 i.MX 8M Dual/Quad, 1.5GHz

NXP Cortex™-A53 and Cortex™-M4 i.MX 8M Mini Quad, 1.8GHz

NXP Cortex™-A9 i.MX 6 Solo/Dual, 800MHz

System Memory

3GB LPDDR4 on board

2GB LPDDR4 on board

512KB/1GB DDR3 on board

Flash Memory

8GB eMMC on board (optional 16/32/64 GB)

4GB eMMC on board (optional 8/16/32/64 GB)

Video Codec

• 4Kp60 HEVC/H.265 • 4Kp60 VP9 decoder • 4Kp30 AVC/H.264 decoder • 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVS, MJPEG, H.263 decoder • TrustZone support

• 1080p60 VP9 • 1080p60 HEVC/H.265 Decoder • 1080p60 AVC/H.264 Baseline, Main, High decoder • 1080p60 VP8 • 1080p60 AVC/H.264 Encoder • 1080p60 VP8 • TrustZone support

• i.MX53 + VP6 / WebM VP8, H.264 MVC • 1080p30 + D1 (Solo) • 1080p60or30 + D1 Dual 1080p decode (Dual) • 1080p30 H.264BP • Dual 720p encode

Graphics

• GC7000Lite • OpenGL ES 1.1, 2.0, 3.0, 3.1, Open CL 1.2, and Vulkan

• GCNanoUltra • Vivante GC320

• Vivante GC880, OpenGL ES 2.0 (Solo) • Vivante GC320 (Solo) • Vivante GC2000, OpenGL, GL ES 2.0 & Halti, CL EP (Dual) • Vivante GC355, OpenVG 1.1 (Dual)

LAN

1x GbE LAN

Audio

2x I²S, 1x SPDIF

1x I²S, 1x SPDIF

SATA

N/A

1x SATA2.0 (Dual)

I²C

4x I²C

4x I²C (Solo) 3x I²C (Dual)

I/O

1x MIPI-DSI 4-lane, 1x HDMI2.0a, 1x MIPI-DSI 4-lane, 1x MIPI-CSI2 4-lane, 2x USB, 1x USB OTG, 4x UART, 1x HDMI, 2x MIPI-CSI2 4-lane, 2x SPI/eSPI, SPI/eSPI, 4x UART, 2x USB2, 1x 18/24bit LVDS/TTL, 2x CAN, 2x SPI, 4x UART, 2x USB3, 2x USB2, 2x PCI-E (x1) 2x 2x PCI-E (x1) Gen1, 1x GbE, 12x GPIO 1x MIPI-CSI, 12x GPIO, 1x PCI-E (x1) Gen1, 1x GbE, 12x GPIO

SDIO

2x MMC/ SDIO interface

3x MMC/ SDIO interface

Watchdog Timer

256 level

Dimensions

82mm x 50mm (3.2” x 2”)

Power Connector

N/A

0°C ~ 70°C (Option: -40°C ~ 85°C)

-40°C ~ 85°C

Operating Temperature 0°C ~ 70°C (Option: -40°C ~ 85°C)

RM-N8MMI

Supported OS

Yocto 2.5 (Kernel 4.14.62) Android 9 (Kernel 4.14.62)

Ubuntu (Kernel 3.0.35) Android 4.3 (Kernel 3.0.35)

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Remarks: 1.

2. ODM/OEM is available.

Comparison Table SMARC 2.0 Carrier Board

Model

RP-103-SMC

RP-102-SMC

Form Factor

Carrier Board Compliant with SMARC™ V2.0

Carrier Board Compliant with SMARC™ V1.0

Processor

N/A

System Memory

N/A

Flash Memory

N/A

Video Codec

N/A

Graphics

N/A

LAN

1x RJ45 GbE LAN

Audio

Built-in audio

SATA

1x SATA2

I²C

1x I²C

2x I²C

I/O

2x USB3.0, 2x USB3.0, 1x OTG MicroUSB2.0, 1x HDMI 2.0, 1x COM(RS232/422/485 by switch), 2x RS232 (RX/TX only), 2x CAN, 1x 2-Ch LVDS, 2x MIPI-CSI2 , 1x MIPI-DSI, 1x 12 GPIOs, 2x SPI, 1x Mini PCI-E, 1x SIM socket, 1x M.2 Key-E (2230), 8x DIO, 1x UART

4x USB2, 1x OTG USB, 1x COM (RS232/422/485 by switch), 2x RS232, 1x HDMI, 1x 8/24bit LVDS/TTL, 2x CAN, 1x SPI, 1x MIPI-CSI, 8x GPIO

SDIO

1x Micro SD

Watchdog Timer

N/A

Dimensions

147mm x 102mm (5.8” x 4”)

170mm x 170mm (6.7” x 6.7”)

Power Connector

12~24V DC-in jack and internal header

19V DC-in jack

Operating Temperature

-40°C ~ 85°C

Supported OS

N/A

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Remarks: 1.

2. ODM/OEM is available.

Comparison Table SBC

Model

IBR210

IBR115

IB113

Form Factor

3.5-inch Disk-Size SBC

2.5-inch Disk-Size SBC

3.5-inch Disk-Size SBC

Processor

NXP Cortex™-A53 and Cortex™-M4 i.MX 8M Dual/ Quad, 1.5GHz

NXP Cortex™-A9 i.MX 6Dual, 1GHz

NXP Cortex™-A9 i.MX 6Dual-Lite, 1GHz

NXP Cortex™-A9 i.MX 6Dual, 800MHz

1GB DDR3 on board

4GB eMMC on board (optional 8/16/32/64 GB)

• 1080p60or30 + D1 Dual 1080p decode • 1080p30 H.264BP • Dual 720p encode

• i.MX53 + VP6 / WebM VP8, H.264 MVC • 1080p30 + D1 • 1080p30 H.264BP • Dual 720p encode

• i.MX53 + VP6 / WebM VP8, H.264 MVC • 1080p60or30 + D1 Dual 1080p decode • 1080p30 H.264BP • Dual 720p encode

System Memory 3GB LPDDR4 on board 8GB eMMC on board (optional 16/32/64 GB) • 4Kp60 HEVC/H.265 • 4Kp60 VP9 decoder • 4Kp30 AVC/H.264 decoder • 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVS, MJPEG, H.263 decoder • TrustZone support • GC7000Lite • OpenGL ES 1.1, 2.0, 3.0, 3.1, Open CL 1.2, and Vulkan

• Vivante GC2000, OpenGL, • Vivante GC880, GL ES 2.0 & Halti, CL EP OpenGL ES 2.0 • Vivante GC355, OpenVG 1.1 • Vivante GC320

• Vivante GC2000, OpenGL, GL ES 2.0 & Halti, CL EP • Vivante GC355, OpenVG 1.1

LAN

1x RJ45 GbE LAN

Audio

internal header (1x line-in, 1x line-out)

1x RJ45 GbE LAN 1x RJ45 10/100 LAN internal header (1x microphone, 1x speaker)

SATA

N/A

1x SATA2.0

N/A

1x SATA2.0

I²C

1x I²C

I/O

2x USB3.0 (Type-A) 1x USB OTG (mini-USB Type-B) 1x HDMI V2.0a 1x RS232/422/485 1x On/Off button 2x 2-wire UART 2x USB3.0 internal header 3x Green LEDs (for Power On/ Off, wireless status, and programmable) 8x GPIO 2x MIPI-CSI 1x MIPI-DSI

2x USB2.0 (Type-A) 1x USB OTG (mini-USB Type-B) 1x HDMI 1x RS232/422/485 1x Reset button 1x Dual channel LVDS (FHD) 2x 2-wire UART 2x USB 2.0 internal header 3x Green LEDs (for Power On/Off, wireless status, and Programmable) 2x CAN Bus2.0B (w/ isolation) pin headers 8x GPIO

1x USB 2.0 (Type-A) 1x USB OTG (mini-USB Type-B) 1x HDMI 1x RS232/422/485 1x Reset button 1x Single channel LVDS (1377x768) 2x 2-wire UART 2x USB 2.0 internal header 8x GPIO 2x Green LEDs (for Power On/ Off, and wireless status)

1x USB 2.0 (Type-A) 1x USB OTG (mini-USB Type-B) 1x COM RS-232/422/485 1x HDMI (Type-A) 1x Reset button 8x GPIO 1x USB2.0 internal header 1x 4/5-wire resistive touch pin header 2x CAN Bus 2.0B (w/ isolation) pin headers 1x Dual channel LVDS (FHD)

Expansion Slots

1x M.2 Key-E (2230) w/ USB, SDIO, UART, PCI-E 1x Mini PCI-E w/ SIM socket 1x SD socket

1x M.2 Key-E (2230) w/ USB, SDIO, UART, PCI-E 1x Mini PCI-E (USB only) w/ SIM socket 1x SD socket

1x M.2 Key-E (2230) w/ PCI-E, USB, SDIO, UART 1x Micro SD socket

1x Full-size Mini PCI-E with USB interface 1x SD socket

Watchdog Timer 256 level

256 level

Dimensions

147mm x 102mm (5.8” x 4”)

100mm x 72mm (3.94” x 2.83”) 147mm x 102mm (5.8” x 4”)

12V DC-in jack

12~24V DC-in jack and internal header

-40°C ~ 85°C

Flash Memory

Video Codec

Graphics

147mm x 102mm (5.8” x 4”)

Power Connector 12~24V DC-in jack and internal header Operating 0°C ~ 70°C Temperature (Option: -40°C ~ 85°C)

IBR117

Supported OS

Yocto v2.5 (Kernel 4.14.62) Android 9 (Kernel 4.14.62)

Yocto v2.1 (Kernel 4.1.15) Android 6.0.1 (Kernel 3.14.52)

Yocto v2.1 (Kernel 4.1.15) Ubuntu (Kernel 3.0.35) Android 4.3 (Kernel 3.0.35)

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Remarks: 1.

2. ODM/OEM is available.

RM-N8M Series

SMARC 2.0 CPU Module Wide-Temperature SMARCTM 2.0 Module with NXP ARM® Cortex-A53/Cortex-M4 i.MX 8M Dual/Quad 1.5GHz Processor

Features I.MX 8M Processor

● With NXP Cortex™-A53/Cortex™-M4, i.MX 8M Dual/Quad 1.5GHz processor ● 3GB LPDDR4, 8/16/32/64GB eMMC ● Rich peripheral I/O support ● Validated with Yocto v2.5 and Android 9 ● Long life time supply with NxP solution ● Compliant with SGeT standard SMARC™ V2.0

LPDDR4

System Form Factor

SMARC™ V2.0

I²C

4x I²C

Processor

NXP i.MX 8M Dual/Quad Cortex™-A53 and Cortex™-M4, 1.5GHz

CAN Bus

N/A

System Memory

3GB LPDDR4 on board

Dimensions

82mm x 50mm (3.2” x 2”)

Flash Memory

8GB eMMC on board (optional 16/32/64 GB)

Display

Video Codec

Graphics

1x MIPI-DSI 4-lane up to 1920 x 1080 at 60Hz 1x HDMI V2.0a, up to 4K, supports HDCP2.2 and HDCP1.4 • 4Kp60 HEVC/H.265 main, and main 10 decoder • 4Kp60 VP9 decoder • 4Kp30 AVC/H.264 decoder • 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVS, MJPEG, H.263 decoder • GC7000Lite • OpenGL ES 1.1, 2.0, 3.0, 3.1, Open CL 1.2, and Vulkan

Audio Interface

2x I²S, 1x SPDIF

LAN

1x GbE LAN

USB

2x USB3.0/USB2.0 with OTG interface

Image Capture Interface

2x MIPI-CSI2 4-lane each

Serial Interface

4x UART, 2x SPI

2x PCI-E (x1) Gen2

SATA

N/A

GPIO

12x GPIO

Remarks: 1.

OS Support

Yocto 2.5 (Kernel 4.14.62) Android 9 (Kernel 4.14.62)

Certification

CE/ FCC Class B

Ordering Information RM-N8M-D308 RM-N8M-D308I RM-N8M-Q316 RM-N8M-Q316I

Media Interface 2x High-speed MMC/SDIO (MMC 8-bit, SDIO 4-bit) PCI-E

Operating Temperature

Humidity: 0 % to 90 % RH at 60° C (non-condensing) Shock: Non-operating: 1G, 15 mins (x-, y-, z-axis) Vibration: Non-operating: 3 Hz to 500 Hz, 15 mins Consumer Grade : 0°C ~ 70°C Industrial Grade : -40°C ~ 85°C

Environment

2. ODM/OEM is available.

RP-103-SMC (Carrier Board)

SMARC 2.0 CPU module, Cortex™-A53 i.MX 8M Dual 1.5GHz, 3GB LPDDR4, 8GB MLC eMMC Industrial grade SMARC 2.0 CPU module, Cortex™-A53 i.MX 8M Dual 1.3GHz, 3GB LPDDR4, 8GB MLC eMMC SMARC 2.0 CPU module, Cortex™-A53 i.MX 8M Quad 1.5GHz, 3GB LPDDR4, 16GB TLC eMMC Industrial grade SMARC 2.0 CPU module, Cortex™-A53 i.MX 8M Quad 1.3GHz, 3GB LPDDR4, 16GB TLC eMMC 3.5” SMARC 2.0 carrier board, 2-CH LVDS, HDMI, 2x CSI, DSI, GbE, RS-234/422/285, USB3.0, M.2 Key-E (2230), Mini PCI-E w/ SIM socket, USB OTG, SATA, CAN, Audio/Speaker out/HP&MIC, MicroSD and 12~24VDC

RM-N8MMI Series

SMARC 2.0 CPU Module Wide-Temperature SMARCTM 2.0 Module with NXP ARM® Cortex-A53/Cortex-M4 i.MX 8M Mini Quad 1.8GHz Processor

Features I.MX 8M Mini Processor

LPDDR4

● With NXP Cortex™-A53/Cortex™-M4, i.MX 8M Mini Quad 1.8GHz processor ● 2GB LPDDR4, 8/16/32/64GB eMMC ● Rich peripheral I/O support ● Validated with Yocto v2.5 and Android 9 ● Long life time supply with NxP solution ● Compliant with SGeT standard SMARC™ V2.0

System Form Factor

SMARC™ V2.0

GPIO

12x GPIO

Processor

NXP i.MX 8M Mini Quad Cortex™-A53 and Cortex™-M4, 1.8GHz

I²C

4x I²C

System Memory

2GB LPDDR4 on board

CAN Bus

N/A

Flash Memory

8GB eMMC on board (optional 16/32/64 GB)

Dimensions

82mm x 50mm (3.2” x 2”)

Display

1x MIPI-DSI 4-lane up to 1920 x 1080 at 60Hz

Graphics

• 1080p60 VP9 • 1080p60 HEVC/H.265 decoder • 1080p60 AVC/H.264 Baseline, Main, High decoder • 1080p60 VP8 • 1080p60 AVC/H.264 encoder • 1080p60 VP8 • TrustZone support • GCNanoUltra • Vivante GC320

Audio Interface

2x I²S, 1x SPDIF

LAN

1x GbE LAN

USB

2x USB2.0 with OTG interface

Image Capture Interface

1x MIPI-CSI2 4-lane

Serial Interface

4x UART, 2x SPI Interface

Video Codec

Media Interface 2x High-speed MMC/SDIO (MMC 8-bit, SDIO 4-bit)

PCI-E

1x PCI-E (x1) Gen2

SATA

N/A

Remarks: 1.

Operating Temperature

Humidity: 0 % to 90 % RH at 60° C (non-condensing) Shock: Non-Operating: 1G, 15 mins (x-, y-, z-axis) Vibration: Non-operating: 3 Hz to 500 Hz, 15 mins Consumer Grade : 0°C ~ 70°C Industrial Grade : -40°C ~ 85°C

OS Support

Yocto 2.5 (Kernel 4.14.62) Android 9 (Kernel 4.14.62)

Certification

CE/ FCC Class B

Environment

Ordering Information SMARC 2.0 CPU module, Cortex™-A53 i.MX 8M Mini Quad 1.8GHz, 2GB LPDDR4, 8GB MLC eMMC Industrial Grade SMARC 2.0 CPU module, Cortex™-A53 i.MX RM-N8MMI-Q208I 8M Mini Quad 1.6GHz, 2GB LPDDR4, 8GB MLC eMMC 3.5” SMARC 2.0 carrier board, Dual LVDS, HDMI, 2x CSI, DSI, RS-234/422/285, USB3.0, RP-103-SMC M.2 Key-E(2230), Mini PCI-E w/ SIM socket, USB (Carrier Board) OTG, Audio/Speaker out/HP&MIC, MicroSD and 12~24VDC RM-N8MMI-Q208

2. ODM/OEM is available.

RP-103-SMC

SPI I/F USB3.0

SMARC 2.0 Carrier Board Carrier Board Compliant with SMARCTM V2.0 CPU Module

Features

SATA PWR SATA UART

SPK L HP&MIC Audio DIO SPK R

Boot selection Mini PCI-E

MicroSD

CAN

● Carrier Board for RM-N8M and RM-N8MMI series SMARCTM 2.0 CPU Module ● Rich peripheral I/O support ● Validated with Yocto v2.5 and Android 9 ● Complete system available for evaluation

M.2 Key-E

COM SIM Slot I2C for Touch B/L

DSI

OTG

LVDS 1~2

COM HDMI (RS-232/422/485)

CSI 1~2

GbE USB3.0 DC-in Reset

System Form Factor

I/O

Internal Headers/ Connectors

Carrier Board Compliant with SMARC™ V2.0 1x 12~24V DC-in Jack 1x RJ45 Gigabit LAN 2x USB3.0 1x OTG Micro USB2.0 1x HDMI 2.0 1x COM (RS232/422/485 by switch) 1x 12~24V DC-in header 2x CAN bus 2.0b 1x 18/24-bit Dual Channel LVDS 1x LCD backlight 2x MIPI-CSI2 1x MIPI-DSI 2x USB3.0 1x 12 GPIOs 2x RS232 (RX/TX only) 1x I2C 1x SATA II and power 1x I2S 2x SPI 1x Full size Mini PCI-E 1x SIM socket 1x M.2 Key-E (2230) 1x MicroSD slot 1x HP&MIC 1x Audio 1x Speaker R and L 1 x Reset 1x UART

Operating Temperature

-40°C ~ 85°C

OS Support

Depending on the CPU module

Certification

CE/FCC Class B

Ordering Information RP-103-SMC (Carrier Board)

Jumpers, Switches & Buttons

1x Boot select switch 1x Power button 1x Backlight power (3V3/5V/12V) switch 1x LCD power 3V3/5V switch

Dimensions

147mm x 102mm (5.8” x 4”)

Remarks: 1.

Environment

Humidity: 0 % to 90 % RH at 60°C (non-condensing) Shock: Non-Operating: 1G, 15 mins (x-, y-, z-axis) Vibration: Non-operating: 3Hz to 500Hz, 15 mins

2. ODM/OEM is available.

3.5” SMARC 2.0 carrier board, 2-CH LVDS, HDMI, 2x CSI, DSI, GbE, RS-234/422/285, USB3.0, M.2 Key-E (2230), Mini PCI-E w/ SIM socket, USB OTG, SATA, CAN, Audio/Speaker out/HP&MIC, MicroSD and 12~24VDC

Computer on Module Wide-Temperature SMARCTM Module with NXP ARM® Cortex-A9 i.MX 6Dual/Solo 800MHz Processor

RM-F6 series

Features DDR3

PMIC

MCU

USB Hub

eMMC

● SMARC Small Form Factor (82mm x 50mm) SoM ● i.MX automotive-grade 6Dual/6Solo core 800MHz CPU ● 1080p hardware encode/decode ● OpenGL ES 2.0 and OpenVG 1.1 hardware accelerators ● 1GB DDR3, 4GB eMMC on board ● Supports 10/100/1000 Mbit Ethernet ● Supports 24-bit parallel LCD, LVDS & HDMI ● Supports Linux 3.0, Android 4.3 ● Wide-range operating temperature (-40°C~85°C)

i.MX6 CPU

System Humidity: 0 % to 90 % RH at 60° C (non-condensing) Shock: Non-Operating: 1G, 15 mins (x-, y-, z-axis) Vibration: Non-operating: 3Hz to 500Hz, 15 mins

Form Factor

SMARC™ V1.0

CPU

NXP i.MX 6Dual/6Solo Cortex-A9 processor Up to 800MHz with 512KB L2 cache

System Memory

I-grade 1GB DDR3 on board

Display

Supports 18/24-bit parallel LCD & LVDS Interface (Up to1366 x 768) Supports HDMI Interface (1920 x 1080)

Video Codec

Multi-format HD1080 video Decode and Encode

Audio Interface

I²S, SPDIF

LAN

1x GbE LAN

USB

2x USB 2.0 port & 1x USB OTG Interface

Image Capture Interface

CSI Interface for MIPI camera

F6DU1-HSD

Heat spreader for F6DU1

Serial Interface

4x UART, 1x SPI Interface

F6SO1-HSD

Heat spreader for F6SO1

Environment Operating Temperature OS Support Certification

-40°C to +85°C (*need heat-sink solution) Ubuntu Linux 11.10 (kernel 3.0)/ Android 4.3 CE/ FCC Class A

Ordering Information RM-F6DU1-SMC

RM-F6SO1-SMC

Media Interface 2x High-speed MMC/SDIO (MMC 8-bit, SDIO 4-bit)

PCI-E

1x PCI-E interface

SATA

1x SATA 2.0 (Dual only)

GPIO

12x GPIO

I²C

3x I²C *(4x I²C in F6SO1)

CAN Bus

2x CAN2.0B

Dimensions

82mm x 50mm (3.2” x 2”)

Remarks: 1.

2. ODM/OEM is available.

RISC System on Module, 82mm x 50mm, SMARC small form factor with onboard NXP i.MX 6Dual 800MHz CPU, 1GB DDR3, 4GB eMMC, -40°C~85°C operating temperature RISC System on Module, 82mm x 50mm, SMARC small form factor with onboard NXP i.MX6 Solo 800MHz CPU, 1GB DDR3, 4GB eMMC, -40°C~85°C operating temperature

RP-102-SMC LVDS

SMARC 1.0 Carrier Board Carrier Board for SMARCTM Modules

8x GPIO 19V DC-in

IC SPDIF MIPI-CSI 2x CAN

SATA II MXM 3.0 connector

I²C

SPI

Backlight-PW

TTL Panel

Mini PCI-E SIM

Micro SD USB

2x RS232, 1x Debug

SP Out

Features ● For SMARC V1.0 modules ● Supports 19V DC-in, reset, power, RTC function ● Supports Gigabit LAN, audio, USB OTG, HDMI, COM (RS232/422/485) ● With Micro SD socket, Mini PCI-E with USB, SIM socket on board ● Supports 2x isolated CAN transceiver, TTL, LVDS, HDMI, MIPI-CSI camera

USB

GbE

Audio

USB HDMI OTG

USB

COM(RS232/422/485)

System Form Factor

Edge I/O

Internal Headers / Connectors

Jumpers, Switch & Buttons

Carrier Board Compliant with SMARC™ V1.0 1x DC-in Jack (12V) 1x RJ45 GbE LAN 1x Mic+Headphone 2x USB 2.0 host 1x USB OTG 1x HDMI 1x COM (RS232/422/485) 2x CAN bus 2.0B 1x 18/24-bit single CH LVDS 1x 18/24-bit TTL box header 1x LCD DDC (I²C) 1x LCD backlight connector 1x CSI-MIPI 2x USB 2.0 host 8x GPIO pin header 2x RS232 box header 1x SIM socket 1x SPDIF 1x Speaker box header 1x Micro-SD socket 2x I²C 1x SATA II 1x Full-size Mini PCI-E with USB interface 1x Boot media select switch (SD/eMMC) 1x Reset button 1x Power button 1x GPI button 1x RS232/422/485 (by jumper selection) 1x Backlight power jumper

Power Input

19V DC-in

Dimensions

170mm x 170mm (6.7” x 6.7”)

Environment

Humidity: 0% to 90% RH at 60° C (non-condensing) Vibration: Non-operating, 3Hz to 500Hz, 15mins

Remarks: 1.

2. ODM/OEM is available.

Operating Temperature

-40° C to +85° C (-40°F~184°F)

OS Support

Depending on the CPU module

Certification

CE/FCC Class A

Ordering Information RP-102-SMC

RISC Carrier Board for SMARC V1.0 modules,12V DC-in, Mini-ITX 170mmx170mm, 2x CAN, Mini PCI-E with USB, Resistive touch header (4-wire), 2x USB header,1x I²C header, 18/24-bit LVDS,TTL connector, Line in/ Line out, EEROM, CSI MIPI bus, 8x GPIO, 2x RS232,1x RS232/422/485, VDDIO=3.3V

Single Board Computer Low-Power Multimedia IoT 3.5” SBC with NXP ARM® Cortex-A53/Cortex-M4 i.MX 8M Dual/Quad 1.5GHz Processor

IBR210

Features Backlight

LVDS

● With NXP Cortex™-A53/Cortex™-M4, i.MX 8M Dual/Quad

DSI

1.5GHz Processor ● Supports 4K HDMI, dual channel FHD LVDS

I2C for Touch

M.2 Key-E(Type2230)

CSI

OTG

COM HDMI (RS-232/422/485)

GbE

GPIO

Form Factor Processor System Memory Flash Memory

Graphics

Edge I/O

Header, Expansion & LEDs

Audio and Ethernet

3.5-inch Disk-Size SBC NXP i.MX 8M Dual/Quad Cortex™-A53 and Cortex™-M4, 1.5GHz 3GB LPDDR4 on board 8GB eMMC on board (optional 16/32/64 GB) 1x Dual Channel LVDS (FHD) 1x HDMI V2.0a, support HDCP2.2 and HDCP1.4 • 4Kp60 HEVC/H.265 main, and main 10 decoder • 4Kp60 VP9 decoder • 4Kp30 AVC/H.264 decoder • 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVS, MJPEG, H.263 decoder • GC7000Lite • OpenGL ES 1.1, 2.0, 3.0, 3.1, Open CL 1.2, and Vulkan 1x RJ45 GbE LAN 2x USB 3.0 Type-A 1x USB OTG (mini-USB Type-B) 1x HDMI V2.0a 1x RS232/422/485 (D-SUB 9 male connector) 1x SD socket (UHS-I SDR-104, 104MB/s max.) 1x On/Off button 1x Dual Channel LVDS 1x Backlight, 3.3V/1A, 5V/1A, 12/1A (jumper selection) 1x MIPI-DSI (2*10 pin header) 2x MIPI-CSI (2*10 pin header) 2x USB3.0 header 1x M.2 Key-E (2230) w/ USB, SDIO, UART, PCI-E 1x Mini PCI-E w/ SIM socket 1x I²C header 1x 2-wire UART header (for Debug Console Port) 2x 2-wire UART header 1x Audio header (Line-in and Line-out) 8x GPIO (2*5 pin header 1.0mm) 3x Green LEDs (for power On/Off, wireless status, and programmable)

Remarks: 1.

for wireless/4G/LTE connectivity

USB DC-in Reset

System

Video Codec

● Supports embedded I/O for COM, GPIO, USB3.0, USB-OTG, ● Supports M.2 Key-E (2230) and mini-PCI-E with SIM socket

UART

Display

● Supports 3GB LPDDR4, 8/16/32/64GB eMMC and SD socket

SD socket

Mini PCI-E USB3.0

Watchdog Dimensions Power Input Operating Temperature

256 Levels, 0~128 secs 147mm x 102mm (5.8” x 4”) 12~24V DC-in Jack and Internal Header

OS Support

Yocto v2.5 (Kernel 4.14.62) Android 9 (Kernel 4.14.62)

0°C ~ 70°C (Option: -40°C ~ 85°C)

Relative Humidity Certification

10%~90% (non-condensing) CE/FCC Class B

Ordering Information 3.5” SBC, i.MX 8M Dual 1.5GHz, 3GB LPDDR4, 8GB MLC eMMC Industrial Grade 3.5” SBC, i.MX 8M Dual 1.3GHz, 3GB LPDDR4, 8GB MLC eMMC 3.5” SBC, i.MX 8M Dual 1.5GHz, 3GB LPDDR4, 16GB TLC eMMC Industrial Grade 3.5” SBC, i.MX 8M Quad 1.3GHz, 3GB LPDDR4, 16GB TLC eMMC

IBR210-D308 IBR210-D308I IBR210-Q316 IBR210-Q316I

2. ODM/OEM is available.

IBR117

Single Board Computer Low-Power Multimedia IoT 3.5” SBC with NXP ARM® Cortex-A9 i.MX 6Dual 1GHz Processor

Features Backlight

LVDS

● With NXP Cortex™-A9, i.MX 6Dual 1GHz Processor

Audio

● Supports HDMI and dual LVDS ● 1GB DDR3, 4GB eMMC and SD socket for expansion

SIM SD socket

Mini PCI-E SATA Power

USB

● Supports embedded I/O, COM, GPIO, USB, USB-OTG, audio and Ethernet

M.2 Key-E(Type2230)

SATA

Boot selection

CAN Bus

● Supports M.2 Key-E (2230) and Mini PCI-E with SIM socket for eireless/4G/LTE connectivity

GPIO RTC battery

UART

COM OTG (RS-232/422/485)

HDMI

GbE

USB DC-in Reset

System Form Factor Processor System Memory Flash Memory Display Video Codec Graphics

Edge I/O

Header, Expansion & LEDs

Watchdog Dimensions Power Input

Remarks: 1.

3.5-inch Disk-Size SBC NXP Cortex™-A9 i.MX 6Dual, 1GHz

Operating Temperature

-40°C ~ 85°C

1GB DDR3 on board

OS Support

Yocto v2.1 (Kernel 4.1.15) Android 6.0.1 (Kernel 3.14.52)

4GB eMMC on board (optional 8/16/32/64 GB) 2x 18/24-bits single LVDS /1x Dual LVDS, up to 1366 x 768 for 2ch, 1920 x 1080 for 1ch 1x HDMI V1.4, up to 1080P at 60Hz • 1080p60or30 + D1 Dual 1080p decode • 1080p30 H.264BP • Dual 720p encode • Vivante GC2000, OpenGL, GL ES 2.0 & Halti, CL EP • Vivante GC355, OpenVG 1.1 1x RJ45 GbE LAN 2x USB Type-A 1x USB OTG (mini-USB Type-B) 1x HDMI 1x RS232/422/485 (D-SUB 9 male connector) 1x SD socket (UHS-I SDR-104, 104MB/s max.) 1x Reset button 1x Dual channel LVDS (FHD) 1x Backlight, 3.3V/1A, 5V/1A, 12/1A (jumper selection) 2x USB 2.0 header 1x M.2 Key-E (2230) w/ USB, SDIO, UART, PCI-E 1x Mini PCI-E (USB only) w/ SIM socket 1x SATA & 4-pin header for the power, 5V/12V 2x CAN Bus 2.0B (2*3 pin header) 1x I²C header 1x 2-wire UART header (for Debug Console Port) 2x 2-wire UART (6-Pin header, 1.0mm) 1x Audio header (Line-in and Line-out) 8x GPIO (2*5 pin header 1.0mm) 3x Green LEDs (for Power On/Off, Wireless status, and Programmable)

Relative Humidity Certification

10%~90% (non-condensing) CE/ FCC Class B

Ordering Information IBR117

3.5” ARM-based SBC, NXP Cortex™-A9, i.MX 6Dual 1GHz, 1GB DDR, 4GB eMMC, Dual LVDS, HDMI, RS-232/422/485, USB, M.2 Key-E (2230) and Mini PCI-E w/ SIM socket

Heatsink

HSIBR117-B

Cables

RF modules

Display

LCD403: Panel cable for 7” LCD404: Panel cable for 15” LCD434: Panel cable for 21.5” IVT-76: Backlight for 7” and 15” panel IVT-82: Backlight for 21.5” panel PK1-135: GPIO PK1-133: COM port USB-81: USB OTG cable PK1-100A: Debug cable WNFT-234ACN: WiFi/BT M.2 module UC20GC: 3G/GPS mPCI-E module AM-1024600ATMQW-A0H: - 7” Capacitive LVDS TFT LCD, 1024 x 600 M150GNN2 R1: - 15” Capacitive LVDS TFT LCD, 1024 x 768 LM215WF3-SLS1: - 21.5” Transmissive LVDS TFT LCD, Full HD

256 Levels, 0~128 secs 147mm x 102mm (5.8” x 4”) 12V DC-in Jack

2. ODM/OEM is available.

Single Board Computer Low-Power Multimedia IoT 2.5” SBC with NXP ARM® Cortex-A9 i.MX 6Dual-Lite 1GHz Processor

IBR115

Features 2x USB 12V DC Jack

M.2 KeyE Type2230

LVDS Reset button Micro SD

RTC battery

● ● ● ●

NXP Cortex™-A9, i.MX 6Dual-Lite, 1GHz Processor Supports HDMI and Single LVDS (1366x768) Supports 1GB DDR3, 4GB eMMC and Micro SD socket Embedded I/O as COM, GPIO, USB, USB-OTG, Audio and Ethernet ● M.2 Key-E (2230) for 4G/LTE connectivity

GPIO

Backlight 2x UART

COM (RS-232/422/485)

GbE

HDMI

USB

OTG

System Form Factor

2.5-inch Disk-Size SBC

OS Support

Yocto v2.1 (Kernel 4.1.15) Android 6.0.1 (Kernel 3.14.52)

Processor

NXP Cortex™-A9 i.MX 6Dual-Lite, 1GHz

10%~90% (non-condensing)

System Memory

Relative Humidity

1GB DDR3 on board

Certification

CE/ FCC Class B

Flash Memory

4GB eMMC on board (optional 8/16/32/64 GB)

Display

1x 18/24-bit single LVDS, up to 1366 x 768 1x HDMI V1.4, up to 1080P at 60Hz • i.MX53 + VP6 / WebM VP8, H.264 MVC • 1080p30 + D1 • 1080p30 H.264BP • Dual 720p encode • Vivante GC880, OpenGL ES 2.0 • Vivante GC320 1x RJ45 GbE LAN 2x USB Type-A 1x USB OTG (mini-USB Type-B) 1x HDMI 1x RS232/422/485 (D-SUB 9 male connector) 1x Micro SD socket (UHS-I SDR-104, max.104MB/s) 1x Reset button 1x Single Channel LVDS (1366x768) 1x Backlight, 3.3V/1A, 5V/1A, 12/1A (jumper selection) 2x USB 2.0 header 1x M.2 Key-E (2230) w/ PCI-E, USB, SDIO, UART 1x I²C header 1x 2-wire UART header (for debug console port) 2x 2-wire UART (1x6 pin header,1.0mm) 1x Audio pin header (Line-in and Line-out 8x GPIO (2*5 pin header 1.0mm) 2x Green LEDs (for power On/Off, and wireless status)

Video Codec Graphics

Edge I/O

Header, Expansion & LEDs

Watchdog

256 levels, 0~128 secs

Dimensions

100mm x 72mm (3.94” x 2.83”)

Power Input

12V DC-in Jack

Operating Temperature

-40°C ~ 85°C

Remarks: 1.

Ordering Information IBR115

2.5” ARM-based SBC, NXP Cortex™-A9, i.MX 6Dual-Lite 1GHz, 1GB DDR, 4GB eMMC, Single LVDS, HDMI, RS-234/422/485, USB, M.2 Key E (2230)

Heatsink

HSIBR115-A

Cables

LCD403: Panel cable for 7” LCD404: Panel cable for 15” IVT-76: Backlight for 7” and 15” panel PK1-135: GPIO PK1-133: COM port USB-81: USB OTG cable PK1-100A: Debug cable

RF modules

WNFT-234ACN: WiFi/BT M.2 module

Display

AM-1024600ATMQW-A0H: - 7” Capacitive LVDS TFT LCD, 1024 x 600 M150GNN2 R1: - 15” Capacitive LVDS TFT LCD, 1024 x 768

2. ODM/OEM is available.

Single Board Computer Low-Power Multimedia IoT 3.5” SBC with NXP ARM® Cortex-A9 i.MX 6Dual 800MHz Processor

IB113

Features Audio

CAN bus

LVDS

SATA

SD socket

DDR3

12~24V DC Jack

COM

GPIO

1st LAN

eMMC

Mini PCI-E

● With NXP ARM® Cortex-A9, i.MX 6Dual 800MHz Processor (Automotive Grade) ● Supports 1GB DDR3, 4GB eMMC on board and SD socket ● Supports resistive touch panel (4/5-wire) & capacitive touch interface ● Supports COM, CAN bus, USB-OTG, SD card, HDMI, dual channel LVDS ● Mini PCI-E with USB interface for wireless connectivity

HDMI USB 2nd LAN Micro USB

System Form Factor Processor System Memory Flash Memory Display Video Codec Graphics

Edge I/O

Headers & Expansion Slots

Watchdog Dimensions Power Input Operating Temperature

Remarks: 1.

3.5-inch Disk-Size SBC NXP Cortex™-A9 i.MX 6Dual, 800MHz (Automotive Grade) 1GB DDR3 on board 4GB eMMC on board (optional 8/16/32/64 GB) 1x 18/24 bit Dual channel LVDS (up to 1920 x 1080) 1x HDMI • i.MX53 + VP6 / WebM VP8, H.264 MVC • 1080p60or30 + D1 Dual 1080p decode • 1080p30 H.264BP • Dual 720p encode • Vivante GC2000, OpenGL, GL ES 2.0 & Halti, CL EP • Vivante GC355, OpenVG 1.1 1x RJ45 GbE LAN 1x RJ45 10/100 LAN 1x USB 2.0 Type-A 1x USB OTG (mini-USB Type-B) 1x HDMI 1x RS-232/422/485 (D-SUB 9 male connector) 1x SD socket 1x Reset button 1x Dual Channel LVDS (FHD) 1x Backlight, 5V/12V (jumper selection) 1x USB 2.0 header 1x Full-size Mini PCI-E with USB interface 1x SATA2.0 1x 4/5-wire Resistive Touch header 1x I²C header 2x CAN Bus 2.0B (w/ isolation) pin headers 1x Debug port 1x Audio pin header (1x microphone, 1x speaker) 8x GPIO pin header 256 levels, 0~128 secs 147mm x 102mm (5.8” x 4”) 12~24V DC-in jack and internal header

Software Supports Relative Humidity Certification

Yocto v2.1 (Kernel 4.1.15) Ubuntu (Kernel 3.0.35) Android 4.3 (Kernel 3.0.35) 10%~90% (non-condensing) CE/FCC Class A

Ordering Information IB113

IB113A HSIB113BGA-A

3.5” SBC w/ Industrial-Grade Freescale i.MX 6Dual core (800MHz), 1GB DDR3, 2x LAN, SD, SATA, 1x COM ports, Mini PCI-E (x1) slot, LVDS, HDMI, 8x GPIO, 2x CAN, 4GB eMMC, resistive touch panel (4/5-wire) 3.5” SBC w/ Industrial-Grade Freescale i.MX6 solo core (800MHz), 1GB DDR3, 1x LAN, SD, 1x COM ports, Mini PCI-E (x1) slot, LVDS, HDMI, 8x GPIO, 4GB eMMC Heatsink for IB113

-40°C ~ 85°C

2. ODM/OEM is available.

AIoT Solutions As technology continues to progress, the amountData of big data has increased the presence of intelligent Center applications to benefit the economy and our daily lives. By co-working with software partners, IBASE provides high-computing AIoT solutions for these applications, including ISS-401, ISS-603, MAI602, MAF800 and SI-614-AI, as well as ODM or JDM services. Deep Learning Data Center

Deep Learning

Behavior Analysis

Image Segment IBASE AIoT Edge Computing

Behavior Analysis

• Violation Alert

• Behavioral Alert

NVIDIA® Intel® AMD® OpenVINO CUDAComputing ROCm IBASE AIoT Edge Intel® OpenVINO

• Violation Alert

• Behavioral Alert

NVIDIA®

Partners CUDA

AMD® ROCm

Image Segment

• Medical Analysis • Machine Vision • Medical Analysis • Machine Vision

Partners

Human Face Analysis

Object Detection Object Tracking

Human Face Analysis

Object Detection Object Tracking

• Gender / age Analysis • VIP Detection • Gender / age Analysis • VIP Detection

• Surveillance

• Pedestrian Track • Vehicle Counting

• Surveillance

• Vehicle Identification • Pedestrian Track • Behavioral Trajectory • Vehicle Counting

• Vehicle Identification • Behavioral Trajectory 20

Remarks: 1.

2. ODM/OEM is available.

Comparison Table IoT Gateway

AIoT Edge Computing

Model

ISS-603

ISS-401

ISR201

ISR101

Processor

7th Generation Intel® Core™ i7/i5/i3/ Pentium® / Celeron® Processors

Dual-Core NVIDIA Denver 2 64-Bit CPU Quad-Core ARM® Cortex®-A57 MPCore

NXP Cortex™-A9, i.MX 6Dual, 1GHz

NXP Cortex™-A9, i.MX 6Dual-lite, 1GHz

Graphics

• NVIDIA GeForce GTX 1080 • 2560 CUDA Cores • 7.96 TFLOPS • 8GB GDDR5X

• NVIDIA PascalTM GPU • 256 CUDA Cores • 1.5 TFLOPS

• Vivante GC2000, OpenGL, GL ES 2.0 & Halti, CL EP • Vivante GC355, OpenVG 1.1 • Vivante GC320

• Vivante GC880, OpenGL ES 2.0 • Vivante GC320

System Memory

16GB DDR4

8GB LPDDR4 on board

1GB DDR3 on board

Storage

2x SATA3

32GB eMMC

4GB eMMC on board

Construction

SGCC

Display

4x DP 1x HDMI for console

1x HDMI

Network

1x RJ45 GbE LAN Option: 2x additional LAN

1x RJ45 GbE LAN Built-in WiFi/BT

1x RJ45 GbE LAN

Standard I/O

2x USB3.0 1x Power button 2x LED for power and storage 4x DP 2x USB3.0 1x RJ45 COM (RS232) 1x 2-pin terminal block for external power switch

2x USB3.0 1x USB2.0 Micro-AB 1x RS232 1x Power On/Off button 1x Reset button 2x CAN Bus 4x GPIO 2x Antenna connector

1x Mini-USB OTG 1x RS232 /422/485 2x USB 2.0 Type-A 1x Reset button 2x RS232 (DB9 connector) 1x GPIO (DB9 connector) 2x Antenna hole (RP SMA jack) 3x Green LEDs (1x power, 1x wireless status, 1x programable)

1x USB Type-A 1x RS232 /422/485 1x Mini-USB OTG 1x USB 2.0 Type-A. 1x GPIO (DB9 connector) 1x Reset button 1x Antenna hole (RP SMA jack)

Watchdog

256 level

Expansion Slots

1x M.2 B-Key (3042) 1x Mini PCI-E (Full-size) 1x SIM card slot

1x mPCIe (PCI-E with USB2.0) 1x mPCIe (PCI-E or mSATA) 1x SD card slot

1x M.2 Key-E (2230) w/ USB, SDIO, UART, PCI-E 1x M.2 Key-E (2230) w/ USB, SDIO, 1x Mini PCI-E (USB only) w/ SIM UART, PCI-E Socket 1x Micro SD slot 1x SD card slot

Fanless

Yes

Certification

CE/FCC class B

Dimensions

340mm x 170mm x 79 mm ( 13.38” x 6.7” x 3.1”)

125mm x 130mm x 50 mm ( 4.9” x 5.12” x 1.97”)

172mm x 162mm x 36 mm ( 6.78” x 6.38” x 1.42”)

122mm x 102mm x 36 mm (4.81” x 4.02” x 1.42”)

Weight

3.5KG

0.7KG

0.6KG

0.5KG

Operating Temperature

0°C~ 45°C

-20°C~ 55°C

0°C~ 60°C

Operating System

Windows10 / Linux

uBuntu 16.04 LTS

Yocto v2.1 (Kernel 4.1.15) Android 6.0.1 (Kernel 3.14.52)

Power Input

19V DC-in (4-Pin power jack)

12~19V DC-in jack

12V DC-in jack

p. 22

p. 23

p. 25

p. 26

Page No. Remarks: 1.

2. ODM/OEM is available.

ISS-603

AIoT Edge Computing 7th Gen Intel® Core™ Desktop Processor-based System with NVIDIA MXM Graphics and Four Video Outputs

Features ● 7th Generation Intel® Core™ i7/i5/i3/ Pentium® / Celeron® Processors ● Nvidia GeForce GTX 1080 MXM (Type-B, Up to 150W) ● 2x DDR4 2133 SO-DIMM, dual channel, Max 32GB ● 1x HDMI 1.4 for console, 4x DP ● 1x Mini PCI-E (full-size) for Wi-Fi, Bluetooth, 4G LTE or capture card options ● 1x M.2 B key (3042) for storage or 4G LTE options ● 2x 2.5" SATA III SSD device

System System Board

MBD614

Processor

7th Generation Intel® Core™ i7/i5/i3/ Pentium® / Celeron® Processors • NVIDIA GeForce GTX 1080 • 2560 CUDA Cores • 7.96 TFLOPS • 8GB GDDR5X

Graphics System Memory

16GB DDR4 (up to 32GB)

Storage

2x SATA3.0 1x M.2 Key-M Type 2280 (SATA shared with PCI-E x4)

Construction

SGCC

Color

Dark blue

Display

4x DP 1x HDMI for console 1x RJ45 GbE LAN Option: 2x additional LAN via IBD192 Mini PCI-E module

Network Watchdog Front I/O

Rear I/O

Dimensions (WxDxH )

340mm x 170mm x 79mm ( 13.38” x 6.7” x 3.1”)

Mounting

Wall Mount

Operating Temperature Relative Humidity

0°C~ 45°C 5%~90% @45°C (non-condensing)

Certification

CE/FCC class B

Operating System

Windows10 / Linux

Ordering Information Intel® Core™ I7-7700 3.6G, NVIDIA GeForce GTX 1080 8GB MXM card, 2x 8GB DDR4 memory, 2x 2.5”SSD 128GB & 270W PSU

ISS-603

256 segments, 0, 1, 2...255 (sec/min) 2x USB3.0 1x HDMI 1.4 for console 1x Power button 2x LED for power and storage 3x RJ45 LAN (2x optional) 4x DP 2x USB3.0 1x RJ45 COM (RS232) 1x DC-in Jack 1x 2-pin terminal block for external power switch

Side I/O

N/A

Expansion Slots

1x M.2 B-Key (3042) 1x Mini PCI-E (Full-sized) 1x SIM card slot

Fanless

Remarks: 1.

2. ODM/OEM is available.

ISS-401

AIoT Edge Computing NVIDIA Jetson TX2-based System with 1.5 TFLOPS Tensor Performance

Features ● NVIDIA Jetson TX2, Quad, 64-bit, 256 CUDA codes ● 8GB Memory / 32GB eMMC ● Provides HDMI, up to 4K resolution, Built Wi-Fi and BT ● SD, Mini PCI-E and mSATA expandable slot

System System Board

NVIDIA Jetson TX2 SOM + Carrier Board

Processor

Dual-Core NVIDIA Denver 2 64-Bit CPU Quad-Core ARM® Cortex®-A57 MPCore • NVIDIA PascalTM GbE • 256 CUDA Cores • 1.5 TFLOPS

Graphics System Memory

8GB LPDDR4 on board

Storage

32GB eMMC

Construction

SGCC

Color

Dark Blue

Display

1x HDMI2.0

Network

1x GbE LAN 2x antenna connectors for Wi-Fi 802.11AC and BT4.0

Watchdog

256 Levels, 0~128 secs

Front I/O

Rear I/O

125mm x 130mm x 50 mm ( 4.9” x 5.12” x 1.97”)

Mounting

Wall Mount

Operating Temperature Relative Humidity

-20°C~ 55°C 10%~90% (non-condensing)

Certification

CE/FCC class B

Operating System

uBuntu 16.04 LTS

Ordering Information ISS-401

NVIDIA Jetson TX2, Quad, 64-bit, 256 CUDA codes 8GB Memory / 32GB eMMC / 1x HDMI / WiFi / BT / SD Slot / 2x CAN Bus / 1x RS232 / 4x GPIO / 2x USB3.0 / 1x OTG USB/ 2x mPCIe (or 1x mPCIe and 1x mSATA)

1x HDMI Type A, up to 4K resolution 2x USB3.0 1x USB2.0 Micro-AB 1x RS232 1x RJ45 GbE LAN 1x Power On/Off Button 1x Reset Button 1x DC Jack (12~19VDC-in) 2x CAN Bus 4x GPIO 2x Antenna connector

Side I/O

N/A

Expansion Slots

1x mPCIe (PCI-E with USB2.0) 1x mPCIe (PCI-E or mSATA) 1x SD card slot

Fanless

Yes

Remarks: 1.

Dimensions (WxDxH )

2. ODM/OEM is available.

IoT Gateway IBASE IoT energy-saving gateway solutions fully support ARM NXP I.MX, serving as a platform to collect and communicate field data to a remote cloud device. Designed as compact IoT gateways suitable for different for a variety of environments, they come with VESA/DIN rail mounting kit options and can fit into constrained-spaces. IBASE rugged IoT gateways perform reliably even in harsh conditions, supporting wide-range operating temperature and anti-vibration features. They support with M.2 / PCI-E expansion modules and a rich set of versatile I/O functions IBASE IoT gateways enable users to seamless interconnect devices and secure the flow of data for various applications. They are provided with a starter kit (BSP) required for industrial applications, to simplify integration, accelerate time-to-market and minimize development cost.

Rugged

Expandable

Wide Temperature Anti-Vibration, Fanless

M.2 & Mini-PCIE For Wireless Connectivity SD Socket For Storage

Remarks: 1.

Compact

Efficient

Slim Size , Ultra Low Power Rich I/O, Versatile Mounting

Customized BSP Package , Modularized SW Complete Programming Guide

2. ODM/OEM is available.

ISR201

IoT Gateway Ruggedized Embedded System with NXP ARM® Cortex-A9 i.MX 6Dual 1GHz Processor

Features ● NXP Cortex™-A9, i.MX 6Dual 1GHz Processor ● 1GB DDR3, 4GB eMMC & SD socket for expansion ● Embedded I/O for COM, GPIO, USB, USB-OTG, Ethernet ● Supports M.2 Key-E (2230) and Mini PCI-E with SIM socket for Wireless/4G/LTE connectivity ● Ruggedized and fanless design

System System Board

IBR117 3.5-inch SBC

Dimensions (WxDxH )

172mm x 162mm x 36 mm ( 6.78” x 6.38” x 1.42”)

Processor

NXP Cortex™-A9 i.MX 6Dual, 1GHz

Mounting

VESA 75 / 100, DIN rail, wall mount

System Memory

1GB DDR3 on board

Storage

4GB eMMC on board (optional 8/16/32/64 GB)

Construction

SGCC

Certification

CE/ FCC Class B

Color

Black

Operating System

Yocto v2.1 (Kernel 4.1.15) Android 6.0.1 (Kernel 3.14.52)

Display

1x HDMI 1.4 (FHD)

Network

1x RJ45 GbE LAN

Watchdog

256 Levels, 0~128 Secs

Front I/O

Rear I/O

0°C~ 60°C (32°F ~ 140°F) 10%~90% (non-condensing)

Ordering Information

RF modules

ARM-based IOT Gateway, NXP Cortex™-A9, i.MX 6Dual 1GHz, 1GB DDR3, 4GB eMMC, HDMI, RS-234/422/285, USB2.0, M.2 Key-E(2230) & Mini PCI-E w/ SIM socket WNFT-234ACN: WiFi/BT M.2 module UC20GC: 3G/GPS mPCI-E module

FSP060-DIBAN2

Power adaptor

ISR201

1x HDMI Type-A, up to FHD 2x USB 2.0 Type-A 1x RJ45 GbE LAN 1x RS232 /422/485 (DB9 coonnector) 1x Mini-USB OTG 1x 12V DC-in Jack 1x Reset button 2x RS232 (DB9 connector) 8x GPIO 2x Antenna hole (RP SMA Jack) 3x LED indicators

Side I/O

1x SD socket (UHS-I SDR-104, 104MB/s max.)

Expansion Slots

1x M.2 Key-E (2230) w/ USB, SDIO, UART, PCI-E 1x Mini PCI-E (USB only) w/ SIM Socket

Fanless

Yes

Remarks: 1.

Operating Temperature Relative Humidity

2. ODM/OEM is available.

ISR101

IoT Gateway Ruggedized Embedded System with NXP ARM® Cortex-A9 i.MX 6Dual-Lite 1GHz Processor

Features ● NXP Cortex™-A9, i.MX 6Dual-Lite 1GHz Processor ● 1GB DDR3, 4GB eMMC, Micro SD socket for expansion ● Embedded I/O for COM, GPIO, USB, USB-OTG, Ethernet ● M.2 Key-E (2230) for 4G/LTE connectivity ● Ruggedized and fanless design

System System Board

IBR115 2.5-inch SBC

Operating Temperature

0°C~ 60°C (32°F ~ 140°F)

Processor

NXP Cortex™-A9 i.MX 6Dual-Lite, 1GHz

10%~90% (non-condensing)

System Memory

Relative Humidity

1GB DDR3 on board

Certification

CE/ FCC Class B

Storage

4GB eMMC on board (optional 8/16/32/64 GB)

Construction

SGCC

Operating System

Yocto v2.1 (Kernel 4.1.15) Android 6.0.1 (Kernel 3.14.52)

Color

Black

Display

1x HDMI 1.4 (FHD)

ISR101

ARM-based IOT Gateway, NXP Cortex™-A9, i.MX 6Dual-Lite 1GHz, 1GB DDR3, 4GB eMMC, HDMI, RS-232/422/485, USB2.0, M.2 Key-E (2230)

Network

1x RJ45 GbE LAN

RF modules

WNFT-234ACN: WiFi/BT M.2 module

Watchdog

256 Levels, 0~128 secs

FSP060-DIBAN2 Power adaptor

Front I/O

Rear I/O Side I/O

Ordering Information

1x HDMI Type-A, up to FHD 1x USB 2.0 Type-A 1x RJ45 GbE LAN 1x RS232/422/485 (DB9 connector) 1x Mini-USB OTG 1x USB 2.0 Type-A 8x GPIO 1x Reset button 1x 12V DC-in Jack 1x Micro SD socket (UHS-I SDR-104, 104MB/s max.) 1x Antenna hole (RP SMA Jack)

Expansion Slots

1x M.2 Key-E (2230) w/ USB, SDIO, UART, PCI-E

Fanless

Yes

Dimensions (WxDxH )

122mm x 102mm x 36 mm (4.81” x 4.02” x 1.42”)

Mounting

VESA 75 / DIN rail / wall mount

Remarks: 1.

2. ODM/OEM is available.

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Digital Signage Applications

Public Venues

Remarks: 1.

2. ODM/OEM is available.

Retail Environment

Comparison Table Digital Signage Players

Model

SA-101-N

Processor

NXP Cortex™-A9 i.MX 6Dual Lite Commercial 1GHz / IMX 6Quad Automotive 1GHz

NXP Cortex™-A9 i.MX 6Quad 1GHz

Chipset

Integrated

Operating System

Android 4.4.2

System Memory

Onboard 1GB DDR3L, 533MHz (1066MT/s)

Onboard DDR3L 2 GB 533MHz, (1066MT/s)

Graphics

2D+3D (2 /3 GPUs) (35Mtri/s / 200Mtri/s)

Display

1x HDMI + 1x VGA

1x Mini-HDMI (C-TYPE)

Ethernet

1x RJ45 (1000M)/AR8031-AL1B

None

Expansion Slots

1x Mini PCI-E (Full-size) 1x SD/SDHC card slot (up to 32GB)

1x MicroSD card slot (up to 32GB)

Video Capability

1x FHD

Fanless

Yes

Certification

CE, FCC class B, cULus & CCC

CE, FCC class A , VCCI class A, TELEC

Storage

1x eMMC (Default 8GB)

USB

2x USB 2.0 1x Mini USB(OTG)

1x USB Host USB 2.0 A-TYPE

Dimensions

117mm(W) x 104.5mm(D) x 35.1mm(H)

85mm(W) x 45mm(D) x 15mm(H)

Weight

0.5 kgs (1.1lbs)

0.1kgs (0.22lbs)

Operating Temperature

-40°C~ 75°C (-40°F~167°F)

0°C~ 50°C (31.9°F~121.9°F)

Power Supply

Optional 25W power adaptor

10W power adaptor

p. 29

p. 30

Page No.

SA-112-N

Remarks: 1.

2. ODM/OEM is available.

SA-112-N

Digital Signage Player Wide-Temperature Signage Player with NXP ARM® Cortex-A9 i.MX 6Dual/6Quad 1GHz Processor

Features ● Supports NXP i.MX 6Dual/6Quad 1GHz processor ● With eMMC NAND Flash 8GB on board ● Onboard DDR3L, 1GB 533MHz, (1066MT/s) ● 1x VGA + 1x HDMI (w/o HDCP) ● 1x GbE RJ45 LAN, 1x COM (RS-232), 1x Mini-USB (OTG), 2x USB, 1x SD card slot ● Supports Wi-Fi 802.11 b/g/n ● 1x SIM card slot and 1x Mini PCI-E slot for 4G function (optional) ● Supports 5V DC-in power input and wide-range operating temperature from -40°C to 75°C ● Ruggedized, fanless and compact design

Specifications

Auto Control and Monitoring Power Requirement Construction Weight Chassis Color Storage Power Supply Mounting Dimensions Operating Temperature Storage Temperature Relative Humidity Vibration Certification Operating System Remarks: 1.

i.MX53 + VP6 / WebM VP8, H.264 MVC 1x RJ45 (1000M)/AR8031-AL1B 1x Wi-Fi (built-in) 1x Mini PCI-E (full-size) for Wi-Fi, Bluetooth, 4G, or TV tuner options 1x HDMI 1x VGA 2x USB 2.0 1x Mini USB(OTG) (USB device; supports host) 1x Power On/Off button 1x COM RS-232 1x 3.5mm Jack for Line out 1x RJ45 LAN 1x DC power jack

Dimensions

110 117

35.1

72.95 104.50

I/O

SA-112-NDL

Onboard DDR3L, 1GB 533MHz, (1066MT/s)

Watchdog Timer:256 segments,0, 1, 2...255(sec/min) +5V DC-in Aluminum + SGCC 0.5kgs (1.1lbs) Black & white 1x eMMC (Default 8GB) 1x SD/SDHC card slot (up to 32GB) Optional 25W power adaptor Standard system bracket 117mm x 104.5mm x 35.1mm (4.61” x 4.11” x 1.38”)

144 134 100

-40°C ~ 75°C (-40°F ~ 167°F) (w/o adaptor) 25 60.47 100

Expansion Slots

SA-112-NQC

NXP IMX6Q Automotive 1GHz / IMX6DL Commercial 1GHz Integrated

-50°C ~ 85°C (-58°F ~ 185°F) 5~90% @ 45°C, (non-condensing) 50

LAN

ARM-based signage player with CPU IMX6QC MCIMX6Q6AVT10AD Automotive 1GHz, eMMC NAND Flash 8GB & DDR3L 1GB on board, 25W power adaptor, (RoHS). ARM-based signage player with CPU IMX6DL MCIMX6U5DVM10AB Commercial 1GHz, eMMC NAND Flash 8GB & DDR3L 1GB on board, 25W power adaptor, (RoHS), (operating temperature 0°C ~ 50°C)

eMMC: 5 grms / 5~500Hz / random operation CE, FCC class B, cULus & CCC SA-112-NDL- Android 4.4.2: HDMI output SA-112-NQC- Android 4.4.2: VGA+HDMI 2. ODM/OEM is available.

Chipset System Memory Graphics

MBD112

Processor

Ordering Information

System Mainboard

SA-101-N

Digital Signage Player Fanless Signage Player with NXP ARM® Cortex-A9 i.MX 6Quad 1GHz Processor

Features ● Supports NXP Cortex™-A9 i.MX 6Quad 1GHz processor ● 1x eMMC NAND flash 8GB on board ● Onboard DDR3L, 2GB, 533MHz, (1066MT/s) ● 1x Mini-HDMI(C-Type) ● 1x USB, 1x microSD card slot (up to 32GB) ● Supports 802.11 a/b/g/n ● 5V DC-in power input ● Ruggedized, fanless and compact design

Specifications System Mainboard Processor Chipset System Memory Graphics I/O Power Requirement Construction

MBD101 NXP Cortex™-A9 i.MX 6Quad 1GHz processor Integrated DDR3L 2GB on board 2D+3D (2 /3 GPUs) (35Mtri/s / 200Mtri/s) 1x USB host USB 2.0 A-Type 1x Mini-HDMI (C-Type) connector 1x MicroSD card 1x Power jack +5V DC-in Aluminum

Weight

0.085kgs (0.19Ibs)

Chassis Color

Silver 1x eMMC (8GB) 1x MicroSD card slot (up to 32GB) 10W power adaptor

Storage Power Supply Mounting Dimensions Operating Temperature Storage Temperature Relative Humidity Vibration Certification Operating System

Dimensions

Standard system bracket 85mm x 45mm x 15mm (3.35” x 1.77” x 0.59”) 0°C~ 50°C (31.9°F~121.9°F) -20°C ~ 70°C (-4°F~157.9°F) 10~90% @ 45 °C, (non-condensing) eMMC: 5 grms/ 5~500Hz/ random operation CE, FCC class A , VCCI class A, TELEC Android 4.4.2

Ordering Information SA-101-NQC

ARM-based signage player with CPU IMX6QC 1GHz, eMMC NAND flash 8GB & DDR3L 2GB on board, 10W power adaptor (RoHS)

Remarks: 1.

2. ODM/OEM is available.

RSP23

Signage Monitor 23" All-in-One Bar-Type Panel PC with Actions S500 Cortex-A9 Quad-core and CMS Media Stream Updating

Features ● ● ● ● ● ●

Specifications

Dimensions

Display Size

23.1"

Display Area

585.6 (H) x 48.19 (V) mm (23.1" diagonal)

Brightness

600 nits

Optimum Resolution

1920 x 158 Pixels

Contrast Ratio

3000:1

View angle

178 / 178

Backlight Life

50,000 hours (typ.)

Processor

Actions S500 ARM® Cortex-A9, Quad Core

Memory

DDR3 1GB, up to 2GB

Storage

8GB eMMC, up to 32GB

Video In

CMS update via Wi-Fi/USB

Network

Ethernet: N/A Wireless: WLAN 802.11b/g/n

I/O

1x USB 3.0 port

Power Input

Input: 12V DC Consumption: 15W

Mechanical

Outline: 600.40 x 60.80 x 21.0 mm Mounting: 200 x 50 / 400 x 50 mm

Operating Temperature Storage Temperature

0°C~ 45°C -20°C~ 55°C

Certification

RoHS 2.0 CE/FCC

Operating System

Android 5.1

Remarks: 1.

23.1" slim stretched bar type Panel PC 600 nits high brightness High contrast ratio 3000: 1 24/7 long-term operation Ultra-wide viewing angle 178 / 178 Built-in digital signage engine

2. ODM/OEM is available.