www.ibase.com.tw
RISC-Based Embedded Solutions 2017 Edition
Table of Contents About IBASE
3-5
About IBASE ODM / JDM Services Manufacturing
3 4 5 6~20
RISC SBCs Why Choose an ARM Platform
6
3.5”/2.5” SBC / SMARC Module Introduction
7
Comparison Table
8-9
RM-F6 Series
Wide Temperature SMARC Module with NXP i.MX6 Cortex-A9 800MHz SoC
10
RP-101-SMC/ RP-102-SMC
Carrier Board for SMARC Modules
11
RM-N6 Series
Wide Temperature SMARC Module with NXP i.MX6 Dual Plus Cortex-A9 852MHz SoC
12
RP-103-SMC
Carrier Board for SMARC Modules
13
IB100
Low-power SBC with TI AM3517 Cortex A8 600MHz SoC
14
IB102
ARM-Based SBC with NXP i.MX6 Cortex-A9 Solo Core 1GHz SoC
15
IB112
ARM-Based SBC with NXP i.MX6 Cortex-A9 Dual Core 800MHz SoC
16
IB113
Wide Temperature SBC with NXP i.MX6 Cortex-A9 Dual Core 800MHz SoC
17
IBR115
ARM-Based SBC with NXP i.MX6 Cortex-A9 Dual Core 1GHz SoC
18
IBR117
ARM-Based SBC with NXP i.MX6 Cortex-A9 Dual Core 1GHz SoC
19
Development Kit
20
SMARC Development Kit Introduction
20
SMARC-EVK1
21
SMARC Development Kit
ARM-Based Digital Signage Player
22~25
Digital Signage Player Introduction
22
Comparison Table
23
SA-101-N
i.MX6 Dual/Quad Processor-Based Fanless Signage Player with HDMI
24
SA-112-N
i.MX6 Dual/Quad Processor-Based Fanless Signage Player with HDMI and VGA
25
26~35
ARM-Based Panel PC Panel PC / HMI-Introduction
2
26
BYARM-W071-PC / BYARM181-PC
ARM-Based i.MX6 All-in-One Panel PC
27-29
MRS-800 / MRS-801-RE
ARM-Based Power-Over-Ethernet Panel PC
30-32
IPPC-H04/ IPPC-H07 / IPPC-H10
Samsung S3C2440A-40 400MHz Panel PC
33-35
About IBASE
IBASE TECHNOLOGY INC. IBASE Technology is a reputable supplier specializing in the design and manufacture of robust industrial PC products. The company is publicly listed in the Taipei Exchange (TPEx: 8050). Since its establishment in 2000, IBASE has been committed to the production of high quality products, and to the rendering of excellent services. In addition to providing ODM/JDM/OEM services, IBASE has a product offering comprising x86 and RISC-based industrial motherboards, embedded systems, industrial panel PCs, digital signage players and network appliances for various applications in the automation, digital signage, gaming, transportation, smart building, medical, retail and networking markets. RESEARCH & DEVELOPMENT Our R&D team boasts of talented electrical, layout, system, mechanical hardware, BIOS, as well as software engineers. Because of their accumulated expertise, the R&D team is able to design and create new products for the demanding and dynamic market, faithfully delivering according to the specific requirements of customers within the shortest period. The team also collaborates with the most respectable ODM/JDM companies in the IPC industry. MANUFACTURING IBASE has two manufacturing sites, one in Sanchung and another one in Hsinchuang, New Taipei City, Taiwan. Both factories are ISO9001 and ISO13485 certified, while the Sanchung factory has achieved ISO 14001 certification. IBASE factories are designed with anti-static protection using ESD floor protection and proper grounding to eliminate static on every floor. A static monitoring device checks the grounding impedance in the entire factory. At IBASE, we use state-of-the-art production, testing and inspection equipment to provide products with the highest quality and reliability.
PRODUCTS & SERVICES IBASE RISC computing products are designed for use in the automation, smart building, transportation, medical and other industries. IBASE specializes in the manufacture of ARM-based Freescale i.MX6 SBCs, SMARC modules and carrier boards, and provides a SMARC development kit supporting Linux 3.0, Android 4.3 and a rich I/O interface for BOM customization. Aside from offering off-the-shelf RISC platforms, IBASE also offers ODM/JDM/OEM services to help customers create customized RISC solutions based on their requirements, while providing technical research and R&D expertise, in order to offer one-stop shopping services to our clients. OUR COMMITMENT IBASE is built on the corporate cornerstones of “teamwork, sharing, innovation, efficiency, and service�. These hold the key to our extraordinary competitiveness and continuous growth. As a team, IBASE is committed to consistently provide products and services of the highest quality and competitiveness to strategically position customers in a win-win situation.
INNOVATION
SHARING
SERVICE
TEAMWORK
EFFICIENCY
Company Philosophy
3
ODM / JDM Services R&D Capabilities IBASE’s R&D team boasts of talented electrical, layout, system, mechanical, BIOS, as well as software engineers. Almost half of the team are seasoned with more than 15 years of experience in their respective fields, while the remaining team members carry more than five years of experience. Because of their accumulated expertise, our R&D team can design and create new products for the demanding and dynamic market according to the specific requirements of customers within the shortest period of time. The team has also collaborated with the most respectable ODM/JDM companies in the IPC industry.
Hardware Design Capabilities
R&D, the Core Competencies of IBASE Experienced R&D in IPC Field One-Stop R&D Services H/W, S/W Integration Capabilites
Software Design Capabilities
Electrical Design
Embedded Controller
Observer
Mechanical Design
BIOS IPMI
iSMART
FPGA CPLD
Thermal Design Safety & Regulation Certifications
Embedded OS
Customized Testing Plan
ODM / JDM Services Off-the-Shelf
Board Level ODM/JDMServices
Current Offerings for Time to Market
Off-the-Shelf
System Level ODM/JDMServices
4
Current Offerings for Time to Market
Features Removal/ Addition
0 days
Minor Changes Based on Existing Offerings
30 days
Features Removal/ Addition
0 days
Minor Changes Based on Existing Offerings
Custom Baseboard Design
Custom ETX / COM Express Baseboard
Partial Custom Design
10 days
Customer’s Own Design
Clean Sheet Board Design
40 days
Clean Sheet Board Design
88 days (Estimated Working Days)
Clean Sheet System Design
20 days
Clean Sheet System Design
38 days (Estimated Working Days)
Manufacturing IBASE Technology has two manufacturing sites, one in Sanchung and another one in Hsinchuang, New Taipei City, Taiwan. Both factories are ISO9001 and ISO13485 certified, while the Sanchung factory has also achieved ISO 14001 certification. IBASE factories are designed with anti-static protection using ESD floor protection and proper grounding to eliminate static on every floor. A static monitoring device checks the grounding impedance in the entire factory. Hsinchuang New Taipei City ● System Assembly ● Validation
Size 127,270 Square-feet (11,824 m2 / 3,577 Ping)
Certifications ISO 9001 REGISTERED
100% Made in Taiwan
MGMT. SYS. RvA C 024 DNV Certification BV
ISO 9001
ISO 14001
ISO 13485
Capacity SMT Lines x 3 DIP Assembly Lines x 2 System Assembly Lines x 4 Burn-in Rooms x 6 (4 hours per run) Clean Rooms x 2
Sanchung New Taipei City ● Board Production ● System Assembly ● Validation
Advanced Manufacturing Facilities At the Sanchung Factory
At the Hsinchuang Factory
ENVIRONMENTAL TEST CHAMBERS
IBASE Manufacturing Processes IQC
Incoming Materials
DIP
SMT
Reliability Test
PCBA Functional Test
Clean Room
System Assembly
Hi-Pot
Burn-in
Final Inspection
System Functional Test
Finished Products Warehouse
Packing
5
Why an an ARM Platform? WhyChoose Choose ARM Platform? In the coming world of Smart Cities that is driven by Internet of Things (IoT), a network connected by embedded technologies, intelligent computing will be anywhere and everywhere. There will be a huge opportunity for solutions providers to supply compact and power-efficient intelligent computing platforms based on ARM technology. ARM is the leading technology in energy efficient devices and intelligent computing solutions.
Health Care
IoT
Smart Retail
Smart Mobility
Smart Home
Green Energy
Smart City In fact, a RISC- or an ARM-based device maybe just in front of or beside you right now. It’s a design that is power efficient and requires processors with fewer transistors, reducing costs, heat and power use. Join the ARM community now! One of the products that has implemented the ARM technology is Systems-On-Chip (SoC), which IBASE supports in its ARM-based systems product lineup comprising various Computer-on-Modules (SMARC), single board computers and panel solutions. IBASE manufactures ARM-based platforms that are both power-optimized and performance-optimized suitable in a variety of Internet of Things (IoT) and future applications. Aside from various hardware solutions, IBASE also provides professional documentation and design-in service to speed up your product innovation process and implementation with minimum resource and fast time to market.
+85
-45
C 0
Wide Temperature
6
Cloud
Green Energy
Intelligent
IBASE ARM Solutions - 2.5"/3.5" SBC & SMARC module
IBASE ARM Solutions
2.5"/3.5" SBC & SMARC Module
ARM-Based 2.5”/3.5” SBC For different application requirements, IBASE provides versatile ARM-based SBC (Single Board Computer) solutions using standardized and compact platforms such as 2.5” (Pico-iTX) and 3.5” (disk-size) boards to speed up your product solution development. IBASE’s ARM-based SBCs support various display and I/O interface including LVDS/ HDMI, RS-232/422/485 and USB ports, as well as reserved mini-PCIe and M.2 for expansion connectivity. Aside from versatile I/O features, IBASE’s SBC solutions supports low-power consumption and a wide-range operating temperature of -40°C ~85°C for rugged applications. For the software part, we provide the GUI images for Ubuntu and Android to help in your performance testing and ensure your app meets its functional requirements. For a fast and optimized application development, we provide a standard Yocto Linux BSP (board support package) to help software developers create, evaluate and test their applications before release. With the aforementioned hardware and software solutions of ARM-based SBCs, IBASE is your best choice and partner to complete your ARM-based products. ARM-Based SMARC Module SMARC (Smart Mobility ARChitecture) is a versatile small form factor computer module definition targeting applications that require low power, rich features, and high performance. The modules typically use ARM SoCs similar to those used in many embedded systems found in automation control, multimedia, and transportation control applications.
Two module sizes have been defined: 82mm x 50mm and 82mm x 80mm. The module PCBs have 314 edge fingers that mate with a low profile 314 pin 0.5mm pitch right angle connector. The modules are used as building blocks for portable and standalone embedded systems. Circuits in the module include those of DRAM, boot flash, power sequencing, USB2.0/3.0/OTG interface, Ethernet and LVDS, HDMI and TTL display. The modules are used with carrier boards for versatile applications that implement other features such as audio codecs, touch controllers and wireless devices. The modular approach affords scalability and fast time to market while still maintaining low power and a small form factor. IBASE has started to provide SMARC products and solutions supporting the NXP i.MX6 series with powerful multimedia and versatile features since 2013. Besides SMARC modules, IBASE also offers a SMARC evaluation kit that comes with carrier boards such as RP-1xx-SMC and other hardware including panels, MIPI-CSI camera and wireless modules to speed up your ARM-based solutions development.
Form Factor
SMARC Module 2.5" and 3.5" SBC
Architecture
Cortex-A9
Compact
Peripheral
Low Power, Small Size
Wi-Fi, Bluetooth, 3G/LTE, Ethernet Touch and panel, HDMI, SATA
Software 74
Comparison Table SMARC with -40°C ~ +85°C Support
Coming Soon Coming Soon Model CPU Socket
SMARC V1.1
CPU Type
RP-101/102-SMC (carrier board) MXM3.0 slot
RP-103-SMC (carrier board)
RM-N6 series
CPU on board
N/A SMARC V1.1 NXP i.MX6 Dual Cortex-A9 (RP-101-SMC: carrier board NXP i.MX6 Plus Cortex-A9 (automotive grade) RP-102-SMC: SMARC V1.0 carrier board )
N/A (SMARC V2.0 carrier board)
TI AM3517 Cortex A8
CPU Speed
800MHz
N/A
1GHz
N/A
600MHz
Memory
I-grade DDR3 1GB on board MPEG-4, H.264 BP, H.263, MPEG-2,MJPEG OpenGL ES 2.0 for 3D, BitBlt for 2D and OpenVG 1.1
N/A
I-grade DDR3 1GB on board H.264, H.263, MPEG4, MPEG2, VC1, RV10, DivX and MJPEG H/W engine OpenGL® ES 3.0 for 3D and OpenVGTM 1.1
4MB SPI NOR Flash
DDR2 256B on board
N/A
NEON™ SIMD and Vector Floating-Point (FP)
LAN
AR8031 LAN PHY
RJ45
AR8033 LAN PHY
RJ45
10/100 Base-T fast Ethernet w/ PoE (820.3af)
Audio
I2S, SPDIF
Built-in audio
I2S
Built-in audio
1x Microphone 1x Line-out 1x Speaker
SATA
1x SATA II
SATA interface
1x SATA II
SATA interface
N/A
I²C
3x I²C
2x I²C
5x I²C
2x I²C
1x I²C
Common I/O
2x USB host 1x USB OTG 4x UART 1x HDMI 1x 18/24bit LVDS 1x 18/24bit TTL 2x CAN 2x SPI 1x MIPI-CSI 12x GPIO 1x Mini PCI-E (VDDIO, 1.8V/3.3V)
1x USB host 1x USB OTG 4x UART 1x HDMI 2x 18/24bit LVDS 1x 18/24bit TTL 2x CAN 2x SPI 1x MIPI-CSI 12x GPIO 1x Mini PCI-E (VDDIO, 1.8V)
3x USB 1x USB OTG 1x RS232/422/485 2x 4 wires RS232 2x 2 wires RS232 1x HDMI 2x 18/24bit LVDS 1x Backlight 1x 18/24bit TTL 2x CAN 1x SPI 1x MIPI-CSI 12x GPIO 1x Battery header (VDDIO, 1.8V)
1x USB 1x USB OTG 1x RS232 1x Reset button 1x TTL Connector 1x 4-wire resistive touch header
N/A
4x USB 1x USB OTG 1x RS232/422/485 2x RS232 1x Debug port 1x HDMI 1x 18/24bit LVDS 1x 18/24bit TTL 2x CAN 1x SPI 1x MIPI-CSI 8x GPIO
(RP-101-SMC: VDDIO, 1.8V ) (RP-102-SMC: VDDIO, 3.3V )
SMARC V2.0
IB100
MXM3.0 slot
Display Controller
8
RM-F6 series
SDIO
3x SDIO
1x microSD
1x SDIO, USH-I U1
1x SD
1x SD
Watchdog Timer
256 level
N/A
256 level
N/A
256 level
Expansion Slots
N/A
1x Mini PCI-E
N/A
1x Mini PCI-E
1x Mini PCI-E (USB signal only)
Form Factor
82mm x 50mm
170mm x 170mm
82mm x 50mm
170mm x 170mm
160mm x 130mm
Power Connector
3V~5.25V DC in
19V DC-in
3V~5.25V DC in
12V DC-in
12V DC-in
Operating Temperature
-40°C~85°C
-40°C~85°C
0°C~60°C/-40°C~85°C
-40°C~85°C
0°C~50°C
OS
Ubuntu Linux 11.10 (kernel 3.0) Android 4.3
by SMARC
Yocto Linux / Android
by SMARC
Android 2.3/ Linux kernel V3.0 / WinCE 6.0
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p. 11
p. 12
p. 13
p. 14
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
Comparison Table 3.5-Inch RISC SBC
Coming Soon Model
IB102
IB112
IB113
IBR115
IBR117
CPU Socket
CPU on board
CPU on board
CPU on board
CPU on board
CPU on board
CPU Type
NXP i.MX6 Solo Cortex-A9 (extended consumer grade)
NXP i.MX536 Cortex-A8 (Industrial grade)
NXP i.MX6 Dual Cortex-A9 (Industrial grade)
NXP i.MX6 Dual-Lite Cortex-A9
NXP i.MX6 Dual Cortex-A9
CPU Speed
1GHz
800MHz
800MHz
1GHZ
1GHZ
Memory
DDR3 1GB on board
DDR3 1GB on board
DDR3 1GB on board
DDR3 1GB on board
DDR3 1GB on board
Display Controller
MPEG-4, H.264 BP, H.263, MPEG-2,MJPEG OpenGL ES 2.0 for 3D, BitBlt for 2D and OpenVG 1.1
MPEG4, MPEG2, H.263, H.264, MJPEG OpenGL ES 2.0 for 3D OpenVG 1.1 for 2D
MPEG-4, H.264 BP, H.263, MPEG-2,MJPEG OpenGL ES 2.0 for 3D, BitBlt for 2D and OpenVG 1.1
MPEG-4, H.264 BP, H.263, MPEG-2,MJPEG OpenGL ES 2.0 for 3D, BitBlt for 2D and OpenVG 1.1
LAN
Gigabit LAN
LAN1: Gigabit LAN LAN2: 10/100 (option)
MPEG-4, H.264 BP, H.263, MPEG-2,MJPEG OpenGL ES 2.0 for 3D, BitBlt for 2D and OPENVG 1.1 LAN1 Gigabit LAN LAN2: 10/100 LAN
Gigabit LAN
Gigabit LAN
Audio
Built-in audio
Built-in audio
Built-in audio
1x Line-in, 1xLine-out
1x Line-in, 1xLine-out
SATA
N/A
SATAII 3Gbps
SATAII 3Gbps
N/A
SATAII 3Gbps
1x I²C
1x I²C
N/A
N/A
Common I/O
2x USB 2.0 1x USB OTG 1x RS232/422/485 1x Debug 1x DC-in jack 1x Reset button 8x GPIO 1x Debug 1x 4/5-wire resistive touch pin header 1x Single channel LVDS
2x USB 2.0 1x USB OTG (mini-USB Type-B) 1x RS232/422/485 1x RS232 1x Debug port 1x DC-in jack 1x HDMI (Type-A) 1x Reset button 8x GPIO 1x VGA 1x Debug 1x 4-wire resistive touch pin header 2x CAN Bus 2.0B 1x Dual channel LVDS
2x USB 2.0 1x USB OTG 1x RS232/422/485 1x Debug port 1x DC-in jack 1x HDMI (Type-A) 1x Reset button 8x GPIO 1x Debug 1x 4/5-wire resistive touch pin header 2x CAN Bus 2.0B 1x Dual channel LVDS
3x USB 2.0 1x USB OTG 1x RS232/422/485 2x RS232 1x Debug port 1x HDMI 1x LVDS 1x Backlight 1x Debug port 1x line-in 1x line-out 1x M.2 Key-E 1x Reset button 2x green LEDs (Power & M.2 status)
4x USB 2.0 1x USB OTG 1x RS232/422/485 2x RS232 1x Debug port 1x HDMI 2x LVDS 1x Backlight 1x Debug port 1x line-in 1x line-out 1x Reset button 3x green LEDs (Power, wirelwss status & programable)
SDIO
1x SD
1x SD 1x microSD
1x SD
1x microSD
1x SD
Watchdog Timer
256 level
256 level
256 level
256 level
256 level
Expansion Slots
1x Mini PCI-E (w/ USB IF)
1x Mini PCI-E (USB I/F only)
1x Mini PCI-E (w/ USB IF)
1x M.2 Key-E(2230)
1x M.2 Key-E(2230) 1x Mini PCI-E (w/ USB)
Form Factor
131mm x 102 mm
102mm x 147mm
131mm x 102 mm
100mm x 72 mm
146mm x 102 mm
Power Connector
12V or PoE (IEEE 802.at Class3)
12V~24V DC-in
12V~24V DC-in
12V DC-in
12V DC-in
Operating Temperature
0°C~60°C
-10°C~60°C
-40°C~85°C
0°C~60°C/-40°C~85°C
0°C~60°C/-40°C~85°C
Ubuntu Linux 11.10 Extra Features (kernel 3.0) Android 4.3
Ubuntu Linux 10.04 (kernal 2.6.35) Android 2.3 WinCE7
Ubuntu Linux 12.04 (kernel 3.0) Android 4.3
Yocto Linux / Android
Yocto Linux / Android
Page No.
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p. 17
p. 18
p. 19
I²C
1x I²C
p. 15
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
9
RM-F6 series
SMARC SBC Wide Temperature SMARC Module w/ NXP i.MX6 Cortex-A9 800MHz SoC
Features DDR3
PMIC
MCU
USB Hub
eMMC i.MX6 CPU
● SMARC Small Form Factor (82mm x 50mm) SoM ● i.MX6 automotive-grade Dual/Solo core 800MHz ● 1080p hardware encode/decode ● OpenGL ES 2.0 and OpenVG 1.1 hardware accelerators ● 1GB DDR3, 4GB eMMC on board ● 10/100/1000 Mbit Ethernet ● Supports 24-bit parallel LCD, LVDS & HDMI ● Supports Linux 3.0, Android 4.3 ● Wide-range operating temperature (-40°C~85°C)
System Form Factor
SMARC™
CPU
NXP i.MX6 Dual/ Solo Cortex-A9 Up to 800Mhz with 512KB L2 cache
System Memory I-grade 1GB DDR3 on board Display
Supports 18/24-bit parallel LCD & LVDS Interface (Up to1366 x 768) Supports HDMI Interface (1920 x 1080)
Video Codec
Multi-format HD1080 video Decode and Encode
Audio Interface
I²S, SPDIF
LAN
AR8031 LAN PHY on board
USB
2x USB 2.0 port & 1x USB OTG Interface
Image Capture Interface
CSI Interface for MIPI camera
Serial
4x UART, 1x SPI Interface
Media Interface 2x High-speed MMC/SDIO (MMC 8-bit, SDIO 4-bit)
10
PCI-E
1x PCI-E interface
SATA
1x SATA 2.0 (Dual only)
GPIO
12x GPIO
I²C
3x I²C *(4x I²C in F6SO1)
CAN Bus
2x CAN2.0B
Dimensions
82mm x 50mm (3.2” x 2”)
Remarks: 1. Specifications are subject to change without prior notice.
Environment
Humidity: 0 % to 90 % RH at 60° C (non-condensing) Shock: Non-Operating: 1G, 15 mins (x-, y-, z-axis) Vibration: Non-operating: 3 Hz to 500 Hz, 15 mins
Operating Temperature
-40°C to +85°C (*need heat-sink solution)
Software Support
Ubuntu Linux 11.10 (kernel 3.0)/ Android 4.3
Certification
CE/ FCC Class A
Ordering Information RISC System on Module, 82mm x 50mm, SMARC small form factor with onboard NXP i.MX6 Dual RM-F6DU1-SMC 800MHz CPU, 1GB DDR3, 4GB eMMC, -40°C~85°C operating temperature RISC System on Module, 82mm x 50mm, SMARC small form factor with onboard NXP i.MX6 Solo RM-F6SO1-SMC 800MHz CPU, 1GB DDR3, 4GB eMMC, -40°C~85°C operating temperature F6DU1-HSD
Heat spreader for F6DU1
F6SO1-HSD
Heat spreader for F6SO1
F6Sxx-HSK
Heat sink for F6DU1-HSD an F6SO1-HSD
2. ODM/OEM is available.
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
RP-101-SMC/RP-102-SMC LVDS
8x GPIO 19V DC-in
I ²C SPDIF MIPI-CSI 2x CAN
SATA II MXM 3.0 connector
I²C
SPI
Backlight-PW
TTL Panel
Mini PCIE SIM
Micro SD USB
2x RS232, 1x Debug
SP Out
USB
Gb LAN
Audio
2 USB
USB HDMI OTG 3 COM
USB
Carrier Board Carrier Board for SMARC Modules
Features ● For SMARC SMARC V1.x modules ● 19V DC-in, reset, power, RTC function ● Supports Gigabit LAN, audio, USB OTG, HDMI, COM (RS232/422/485) ● Micro SD socket, Mini PCI-E with USB, SIM socket on board ● 2x isolated CAN transceiver, TTL, LVDS, HDMI, MIPI-CSI camera
COM(RS232/422/485)
1 1 SATA 10/100/1000
System Form Factor
Standard Mini-ITX RP-101-SMC: SMARC V1.1 modules RP-102-SMC: SMARC V1.0 modules
Edge I/O
1x DC-in Jack (12V) 1x Gigabit 1x Mic+Headphone 2x USB 2.0 host 1x USB OTG 1x HDMI 1x COM (RS232/422/485)
2x CAN bus 2.0B 1x 18/24bit single CH LVDS 1x 18/24bit TTL box header 1x LCD DDC (I²C) 1x LCD backlight connector 1x CSI-MIPI 2x USB 2.0 host 8x GPIO pin header Internal Headers 2x RS232 box header /Connectors 1x SIM socket 1x SPDIF 1x Speaker box header 1x Micro-SD socket 2x I²C Slots: 1x SATA II 1x Full-size Mini PCI-E with USB interface
Jumpers, Switch & Buttons
1x Boot media select switch (SD/eMMC) 1x Reset button 1x Power button 1x GPI button 1x (RS232/422/485) selection jumper 1x Backlight power jumper
Power
19V DC-in
Dimensions
170mm x 170mm (6.7” x 6.7”)
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
Operating Temperature
-40° C to +85° C (-40°F~184°F)
Devices
Linux, Android
Software Support
Non-operating: 3 Hz to 500 Hz, 15 mins
Relative Humidity
0 % to 90 % RH at 60° C (non-condensing)
Certification
CE/FCC Class A
Ordering Information RP-101-SMC
RISC Carrier Board for SMARC V1.0 modules,12V DC-in, Mini-ITX 170mmx170mm, 2x CAN, Mini PCI-E with USB, Resistive touch header (4-wires), 2x USB header,1x I²C header, 18/24 bit LVDS, TTL connector, Line in/ Line out, EEROM, CSI MIPI bus, 8x GPIO, 2x RS232,1x RS232/422/485, VDDIO=1.8V
RP-102-SMC
RISC Carrier Board for SMARC V1.0 modules,12V DC-in, Mini-ITX 170mmx170mm, 2x CAN, Mini PCI-E with USB, Resistive touch header (4-wires), 2x USB header,1x I²C header, 18/24 bit LVDS, TTL connector, Line in/ Line out, EEROM, CSI MIPI bus, 8x GPIO, 2x RS232,1x RS232/422/485, VDDIO=3.3V
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
11
RM-N6 series
SMARC V2.0 Wide Temperature SMARC Module w/ NXP i.MX6 Dual Plus Cortex-A9 852MHz SoC
Features
Coming Soon
● i.MX6 automotive-grade Dual plus core 852MHz ● 1080p hardware encode/decode ● H.264, H.263, MPEG4, MPEG2, VC1, RV10, DivX and MJPEG H/W engine ● OpenGL® ES 3.0 for 3D and OpenVGTM 1.1 ● 1GB DDR3, 4GB eMMC on board and SDIO ● Embedded I/O as PCI-E, SATA, USB, OTG, UART, SPI, I²C, CAN, GPIO and GbE ● 24-bit parallel LCD, dual LVDS & HDMI and MIPI-CSI ● Yocto Linux and Android support ● Wide-range operating temperature (-40°C~85°C)
System Form Factor
SMARC™ V2.0
CPU
NXP i.MX6 Dual Plus Cortex-A9, 852Mhz
System Memory I-grade 1GB DDR3 and 4GB eMMC on board Display
1x 24-bit parallel LCD (Up to 1920x1080 at 60 Mhz) 2x 18/24bit LVDS (Up to1366 x 768 / ch, Up to 1920 x 1080 for 2ch at 60Mhz) 1x HDMI 1.4 (1920 x 1080 at 60Mhz)
Video Codec
H.264, H.263, MPEG4, MPEG2, VC1, RV10, DivX and MJPEG H/W engine OpenGL® ES 3.0 for 3D and OpenVGTM 1.1
Audio Interface
I²S, supports MP3, WMA, AAC
LAN
i.MX6 integrated RGMII w/ PHY
USB
1x USB 2.0 port & 1x USB 2.0 OTG Interface
Image Capture Interface
1x MIPI-CSI 4 Lane for MIPI camera (800Mbps/Lane)
Serial
4x UART (Up to 5Mbps/port), 2x SPI Interface
Environment
Humidity : 0 % to 90 % RH at 60° C (non-condensing) Shock: Non-Operating: 1G, 15 mins (x-, y-, z-axis) Vibration: Non-operating: 3 Hz to 500 Hz, 15 mins
Operating Temperature
0°C~ 60°C (32°F ~ 140°F) / -40°C ~85°C (-40°F ~ 185°F) (with optional thermal solution)
Software Support
Yocto Linux / Android
Certification
CE/ FCC Class B
Ordering Information RM-N6DUP-SMC
SMARC V2.0 Module, 82mm x 50mm with NXP i.MX6 Dual Plus 852MHz CPU, 1GB DDR3, 4GB eMMC, Full HD engine, -40C~85°C operating temperature
Media Interface 1x 4bit SDIO, USH-I U1 (Max. 104MB/s)
12
PCI-E
1x PCI-E Gen. 2x 1 Lane
SATA
1x SATA II, 3.0Gbps
GPIO
12x GPIO, 3.3V level
I²C
5x I²C, 400kbps
CAN Bus
2x CAN2.0B (Max. 1Mbps/port)
Dimensions
82mm x 50mm (3.2” x 2”)
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
RP-103-SMC
Carrier Board Carrier Board for SMARC Modules
Features
Coming Soon
● For SMARC V2.0 modules ● 12V DC-in, reset, power, RTC function ● Supports Gigabit LAN, audio, USB, USB OTG, HDMI, COM (RS232/422/485) ● SD socket, Mini PCI-E with USB, SIM socket on board ● CAN, TTL, LVDS, HDMI, MIPI-CSI camera
System Form Factor
Standard Mini-ITX
Edge I/O
1x DC-in jack (12V) 1x Gigabit LAN 1x Line-In and Line-out 2x USB 2.0 host 1x USB OTG 1x HDMI 2x COM (RS232/422/485)
2x CAN bus 2.0B 2x 18/24bit LVDS box header 1x Backlight power (12V/2A, 5V/1A, 3.3V/1A jumper selection) 1x 24bit TTL box header 2x I²C 1x MIPI-CSI Internal Headers 2x USB 2.0 host 12x GPIO pin header /Connectors 2x RS232 box header 1x SIM socket 1x Lithium battery connector 1x Reset (pin header) Slots: 1x SATA II 1x Full-size Mini PCI-E with USB interface
Jumpers, Switch & Buttons
1x Boot media select switch (Module SPI/eMMC, Carrier SPI/SD/SATA) 1x Power On/Off button 1x Sleep/Wake-up button 1x LID button 2x (RS232/422/485) selection jumper 1x Backlight power (3.3/5/12V) jumper
Power
12V DC-in
Dimensions
170mm x 170mm (6.7” x 6.7”)
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
Operating Temperature
-40° C to +85° C (-40°F~184°F)
Devices
Linux, Android
Software Support
Non-operating: 3 Hz to 500 Hz, 15 mins
Relative Humidity
0 % to 90 % RH at 60° C (non-condensing)
Certification
CE/FCC Class B
Ordering Information RP-103-SMC
RISC Carrier Board for SMARC V2.0 modules,12V DC-in, Mini-ITX 170mmx170mm, 2x CAN, Mini PCI-E with USB, 2x USB header,2x I²C header, 18/24 bit LVDS, TTL connector, Line in/ Line out, MIPI-CSI, 12x GPIO, 2x RS232,2x RS232/422/485, VDDIO=1.8V
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
13
RISC SBC
IB100
Low-Power SBC with TI AM3517 Cortex A8 600MHz SoC
USB COM
POE+
USB_OTG
Features
DC-In Reset
● ● ● ●
Mini PCI-E SD Socket
TI ARM Cortex-A8, AM3517 600Mhz, Supports 12V DC input and PoE (802.3af) 256MB DDR2 and SD socket for expansion Resistive touch panel (4-wires) and capacitive touch interface via USB ● Supports the embedded I/O as COM, I²C, USB-OTG, Audio and Ethernet ● Supports Mini PCI-E (only USB signal) for wireless connectivity
Light Bar
1 USB
2 COM
1 SD
1 POE+
System
14
Form Factor
Disk-Size SBC
CPU
TI Cortex™-A8 AM3517 600MHz,
Operating Temperature
0°C~ 50°C (32°F ~ 122°F)
System Memory 256MB DDR2 on board
Devices
WIFI/BT/3G module (option)
Data Memory
SD socket (up to 32GB)
Software Support
Android 2.3/ Linux kernel V3.0 / WinCE 6.0
Display
TTL up to 1280 x 720
10%~90% (non-condensing)
Video Codec
N/A
Relative Humidity
LAN
10/100 Base-T fast Ethernet w/ PoE (820.3af)
Certification
CE/FCC Class A
Touch
Four wires resistive touch IC for RTP USB headers for CPT
Audio
Audio pin header (1x microphone,2x speaker)
RTC
N/A
Watchdog
256 Levels
NVRAM
N/A
Edge I/O
1x Fast Ethernet w/ PoE (RJ45 connector) 1x USB Type-A 1x USB_OTG 1x RS-232 port (RJ45 connector) 1x SD slot 1x Reset button
Headers & Expansion Slots
1x TTL connector 1x Debug port header 1x Audio pin header set (1x microphone, 2x speaker) 1x I²C connector (reserved ) 1x Battery: BR2032 with socket 1x 4 wire resistive touch header Slots: 1x Full-size Mini PCI-E(x1) with USB signal only
Dimensions
131mm x 160mm (5.16” x 6.3”)
Power
12V DC-in / PoE Remarks: 1. Specifications are subject to change without prior notice.
Ordering Information IB100-MRS
2. ODM/OEM is available.
RISC, TI AM3517 CPU (Cortex-A8, 600MHz), w/256M DDR2 Memory, 512MB NAND flash, Single CH TTL, Mini PCI-E (with USB function only)
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
RISC SBC
IB102
ARM-Based SBC with NXP i.MX6 Cortex-A9 Solo Core 1GHz SoC
Features
POE+
USB COM
USB_OTG
Reset
DIP Switch Mini PCI-E
SD Socket
LVDS (at the back side)
1 USB
● NXP ARM Cortex-A9, 1GHz CPU ● 1GB DDR3, 4GB eMMC on board ● Supports POE+, COM, USB-OTG, SD card, LVDS ● Supports Resistive touch header (4/5-wires) and capacitive touch interface ● Supports OpenGL ES 2.0 ● Supports rich I/O interface for BOM customization
Light Bar
2 COM
1 POE+
1 SD
System Form Factor
Disk-Size SBC
CPU
NXP Cortex™-A9 i.MX6 Solo 1GHz
System Memory 1GB DDR3 on board
Operating Temperature
0°C~ 60°C (32°F ~ 140°F)
Devices
WiFi / GPS / 3G module (option)
Data Memory
4GB eMMC on board SD socket (up to 32GB)
Software Support
Ubuntu Linux 11.10 (kernel 3.0.35) / Android 4.3
Display
18/24-bit single channel LVDS (up to 1366 x 768)
Video Codec
Decode: 1080p, 30fps Encode: 1080p, 30fps
Relative Humidity
10%~90% (non-condensing)
LAN
1st LAN: 10/100/1000 Base-T Ethernet (Gb LAN)
Certification
CE/FCC Class A
Touch
PM6000 resistive touch IC (4/5-wires) on board USB/ I²C header on board (for capacitive touch)
Audio
Audio pin header (1x microphone, 1x speaker)
RTC
Seiko RTC IC on board
Watchdog
256 Levels
NVRAM
N/A
Edge I/O
1x 10/100/1000 LAN (Gb LAN) 1x USB 2.0 Host (Type-A) 1x USB OTG (mini-USB Type-B) 1x COM (RS232/422/485) 1x SD socket (up to 32GB) 1x DC-in jack 1x Reset button
Headers & Expansion Slots
Headers: 8x GPIO pin header 1x Debug port pin header 1x USB2.0 host box header 1x I²C pin header 1x 4/5-wire resistive touch pin header 1x Single channel LVDS box header (up to 1366 x 768) 1x Audio pin header (1x microphone, 1x speaker) Slots: 1x Full-size Mini PCI-E with USB interface Others: 1x LED light bar (Green/Red/Orange configurable)
Dimensions
131mm x 160mm (5.16” x 6.3”)
Power
12V DC-in or PoE (IEEE 802.at Class3)
Others
Supports POE/POE+ (802.3at 25.5W)
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
Ordering Information IB102
NXP i.MX6 Solo (1GHz) SBC, 1GB DDR3, Gb LAN, SD, COM ports, Mini PCI-E, HDMI, 8x GPIO, 4GB eMMC, 4/5-wire R-touch, Light Bar, 12V and POE+ support
IB102A
NXP i.MX6 Solo (1Ghz) SBC, 1GB DDR3, Gb LAN, SD, COM ports, Mini PCI-E, 8x GPIO, 12V DC-in support
Accessory (Optional)
RF: - 3G+GPS Combo (Mini PCI-E card) - WIFI+BT Combo (Mini PCIe card) - WIFI module (USB I/F) - BT module (USB/IF) Display: - 800 x 600, resistive touch panel (5 wires) - LVDS cable: LCD326 Debug cable: - PK1-100A
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
15
IB112
RISC SBC ARM-Based SBC with NXP i.MX536 Cortex-A8 Dual Core 800MHz SoC
Features Digital I/O
Micro SD Socket SD Socket
SATA
LCD Backlight LVDS
Mini PCI-E
12V~24V COM DC Jack
4 USB
1st LAN
2 COM
HDMI USB 2nd LAN Micro USB
1 SATA
● NXP ARM Cortex-A8, 800Mhz CPU ● Supports DC 12V~24V input voltage ● 1GB DDR3, eMMC (option) on board ● Supports Resistive touch header (4-wires), and I²C/USB header for capacitive touch ● Supports OpenGL ES 2.0 and OpenVG 1.1 hardware accelerators ● Supports COM, CAN (option), USB-OTG, SD/micro-SD card, VGA, HDMI, LVDS ● Supports rich I/O interface for BOM customization
1~2 LAN
System Form Factor
3.5" Disk-Size SBC
CPU
NXP Cortex™-A8 i.MX536 800MHz
System Memory 1GB DDR3 on board eMMC (IB112T:8GB; IB112S: 16GB) on board Data Memory SD socket (up to 32GB) Micro SD socket (up to 32GB) HDMI (IB112F/IB112S/IB112T) Display 18/24 bit single channel LVDS (up to 1366x768), VGA ( IB112F) Decode: 1080p, 30fps Video Codec Encode: 1080p, 30fps 1st LAN: 10/100 Base-T Ethernet (Gb LAN) LAN 2nd LAN: 10/100 Base-T Ethernet (IB112S) Resistive touch IC (4-wires) on board Touch USB/ I²C header on board ( for capacitive touch) Audio Audio pin header (1x microphone, 1x speaker) RTC RTC IC on board Watchdog
256 levels
NVRAM
Dimensions
32K NVRAM on board (IB112F/IB112S) 1x 1st 10/100 LAN 1x 2nd 10/100 LAN (IB112S) 1x USB 2.0 Host (Type-A) 1x USB OTG (mini-USB Type-B) 1x COM RS-232/422/485 1x SD socket (up to 32GB) 1x DC-in jack 1x HDMI (Type-A) 1x Reset button Headers: 8x GPIO pin header (IB112F/IB112S) 1x VGA pin header (112F) 1x Debug port pin header 1x USB2.0 host box header 1x I²C pin header 1x RS232 pin header 1x 4-wire resistive touch pin header 2x CAN Bus 2.0B (w/ isolation) pin headers (IB112S/ IB112T) 1x Dual channel LVDS box header (supports full HD) 1x Audio pin header (1x microphone, 1x speaker) 1x SATA header (IB112F) Slots: 1x Full-size Mini PCI-E (w/ USB interface only) 102mm x 147mm (4” x 5.8”)
Power
12V~24V DC-in
Edge I/O
Headers & Expansion Slots
16
Remarks: 1. Specifications are subject to change without prior notice.
Operating Temperature
-10°C~ 60°C (-14°F ~ 140°F)
Devices
WiFi / GPS / 3G module (option)
Software Support
Ubuntu Linux 10.04 (kernel 2.6)/ Android 2.3.4/ WINCE7
Relative Humidity
10%~90% (non-condensing)
Certification
CE/FCC Class A
Ordering Information IB112
3,5-inch SBC w/ Industrial-Grade NXP i.MX536 (800Mhz), DDR3 1GB, 10/100 LAN, SD, Micro-SD, 3x COM ports, Mini PCI-E(x1) slot
IB112F
3,5-inch SBC w/ Industrial-Grade NXP i.MX536 (800Mhz), DDR3 1GB, 10/100 LAN, SD, Micro-SD, 3x COM ports, Mini PCI-E(x1) slot, HDMI, 8x GPIO, VGA, 32K NVRAM, SATA
IB112S
3,5-inch SBC w/ Industrial-Grade NXP i.MX536 (800Mhz), DDR3 1GB, 10/100 LAN, SD, Micro-SD, 3 COM ports, Mini PCI-E(x1) slot, HDMI, 8x GPIO, 2x CAN, 2nd LAN, 32K NVRAM, 16GB eMMC
IB112T
3,5-inch SBC w/ Industrial-Grade NXP i.MX536 (800Mhz), DDR3 1GB, 10/100 LAN, SD, Micro-SD, 3x COM ports, Mini PCI-E(x1) slot, HDMI, 2x CAN, 8GB eMM
Accessory (Optional)
RF: -WIFI module (USB I/F) -BT module (USB/IF) Display: -800 x 600, Resistive touch header (4-wires) panel Debug cable: -PK1-100A
2. ODM/OEM is available.
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
RISC SBC
IB113
Wide Temperature SBC with NXP i.MX6 Cortex-A9 Dual Core 800MHz SoC
Features Audio
CAN bus
LVDS
SATA
SD socket
DDR3
12~24V DC Jack
GPIO
COM
4 USB
1st LAN
1 COM
eMMC
Mini PCI-E
HDMI USB 2nd LAN Micro USB
1 SATA
1st
10/100/1000
● NXP ARM Cortex-A9, i.MX6 Dual 800Mhz, automotive-grade processor ● Supports -40°C~ 85°C environment, all industrial-grade components ● Supports 12V~24V DC input voltage ● 1GB DDR3, 4GB eMMC on board ● Supports resistive touch panel (4/5-wires) and capacitive touch interface ● Supports OpenGL ES 2.0 and OpenVG 1.1 hardware accelerators ● Supports COM, CAN bus, USB-OTG, SD card, HDMI, dual channel LVDS ● Supports rich I/O interface for BOM customization
2nd 10/100
System Form Factor
3.5" Disk-Size SBC
CPU
NXP Cortex™-A9 i.MX6 Dual 800MHz, automotive grade CPU
System Memory 1GB DDR3 on board
Operating Temperature
-40°C~ 85°C (-40°F ~ 185°F)
Devices
WIFI/BT/3G+GPS moduel (option)
Data Memory
4GB eMMC on board SD socket (up to 32GB)
Software Support
Ubuntu Linux 12.04(kernel 3.0.35)/ Android 4.3
Display
HDMI 18/24 bit dual channel LVDS (up to 1920 x 1080)
Relative Humidity
10%~90% (non-condensing)
Video Codec
Decode: 1080p, 30fps Encode: 1080p, 30fps
Certification
CE/FCC Class A
LAN
1st LAN: 10/100/1000 Base-T Ethernet (Gb LAN) 2nd LAN: 10/100 Base-T Ethernet
Touch
PM6000 resistive touch IC (4/5-wires) on board USB/ I²C header on board (for capacitive touch)
Audio
Audio pin header (1x microphone, 1x speaker)
RTC
Seiko RTC IC on board
NVRAM
N/A
Watchdog
256 levels
Edge I/O
1x 1st 10/100/1000 LAN 1x 2nd 10/100 LAN 1x USB 2.0 Host (Type-A) 1x USB OTG (mini-USB Type-B) 1x COM RS-232/422/485 1x SD socket (up to 64GB) 1x DC-in jack 1x HDMI (Type-A) 1x Reset button
Headers & Expansion Slots
Headers: 8x GPIO pin header 1x Debug port pin header 1x USB2.0 Host box header 1x I²C pin header 1x 4/5-wire resistive touch pin header 2x CAN Bus 2.0B (w/ isolation) pin headers 1x Dual channel LVDS box header (supports full HD) 1x Audio pin header (1x microphone, 1x speaker) 1x SATA header Slots: 1x Full-size Mini PCI-E with USB interface
Dimensions
102mm x 147mm (4” x 5.8”)
Power
12V~24V DC-in
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
Ordering Information IB113
3.5-inch SBC w/ automotive-grade NXP i.MX6 dual core (800Mhz), 1GB DDR3, 2x LAN , SD, 1x COM ports, Mini PCI-E(x1) slot, HDMI, 8x GPIO, 2x CAN, 2nd LAN, 4GB eMMC, Resistive touch panel (4/5-wire) support
IB113A
3.5-inch SBC w/ automotive-grade NXP i.MX6 solo core (800Mhz), 1GB DDR3, 1x LAN , SD, 1x COM ports, Mini PCI-E(x1) slot, LVDS, HDMI, 8x GPIO, 4GB eMMC
HSIB113-BGA-B
Heatsink for IB113
HSIB113-BGA-A
Heatsink for IB113A
Accessory (Optional)
RF: - 3G+GPS Combo (Mini PCIe card) - WIFI+BT Combo (Mini PCIe card) - WIFI module (USB I/F) - BT module (USB/IF) Display: - 800 x 600, resistive touch panel (5 wires) - LVDS cable: LCD 341 Debug cable: - PK1-100A
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
17
IBR115
RISC SBC 2.5” ARM-Based SBC with NXP Cortex™ A9 i.MX6 Dual-Lite 1GHz SoC
NEW
Features
2x USB 12V DC Jack
M.2 KeyE Type2230
LVDS Reset button Micro SD
RTC battery
● NXP Cortex™-A9, i.MX6 Dual-Lite 1GHz, ● HDMI and single LVDS ● 1GB DDR3, 4GB eMMC and Micro SD socket for expansion ● Embedded I/O as COM, GPIO, USB, USB-OTG, audio and Ethernet ● M.2 Key-E (2230) for wireless connectivity ● OpenGL ES 2.0 for 3D BitBlt for 2D and OpenVG1.1
GPIO
Backlight 2x RS232
COM (RS-232/422/485)
GbE
HDMI
USB
OTG
System
18
Form Factor
2.5” SBC
CPU
NXP Cortex™-A9 i.MX6 Dual-Lite 1GHz
Operating Temperature
0°C~ 60°C (32°F ~ 140°F) / -40°C ~85°C (-40°F ~ 185°F)
System Memory 1GB DDR3 on board
Devices
WIFI/BT module (option)
Data Memory
4GB eMMC on board
Software Support
Android / Yocto Linux
Display
1x 18/24bits single LVDS, up to 1366 x 768 1x HDMI V1.4, up to 1080P30 at 60Hz
Relative Humidity
10%~90% (non-condensing)
Video Codec
Encoder: MPEG-4 SP, H.264 BP, H.263, MJPEG BP Decoder: MPEG-4 ASP, H.264 HP, MPEG-2 MP, MJPEG BP
Certification
CE/ FCC Class B
LAN
10/100/1000 Mbps
Touch
USB headers for CPT
Audio
2x 5 pin header,1.0mm (1x line-in, 1x line-out)
RTC
AnalogTEK AT8565S
Watchdog
256 levels, 0~128 secs
Edge I/O
1x GbE (RJ45 connector) 1x USB Type-A, 1x USB OTG Mini-USB 1x HDMI 1x RS232 port by D-SUB 9 male connector) 1x Micro SD socket (UHS-I SDR-104, max.104MB/s) 1x Reset button for power on/off
Header, Expansion & LEDs
1x LVDS connector (Hirose DF13-20) 1x Backlight, 3.3V/1A, 5V/1A, 12/1A (jumper selection) 1x 4 pin-wafer (for debug console port) 1x Audio pin header (1x line-in /1x line-out) 2x 2-wire RS-232 (2x3 pin header, 1.0mm) 2x USB 2.0 (2x5 pin header 1.0mm) 1x M.2 Key-E (2230) w/ PCI-E, USB, SDIO, UART 8x GPIO (2x5 pin header 1.0mm) 2x Green LEDs (1x power on/off, 1x M.2 wireless status)
Dimensions
100mm x 72mm (4” x 2.8”)
Power
12V DC-in by DC-jack
Remarks: 1. Specifications are subject to change without prior notice.
Ordering Information IBR115
2. ODM/OEM is available.
2.5” ARM-based SBC, NXP Cortex™-A9, i.MX6 DualLite 1GHz, 1GB DDR, 4GB eMMC, Single LVDS, HDMI, RS-234/422/285, USB, M.2 Key E(2230)
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
IBR117
RISC SBC 3.5” ARM-Based SBC with NXP Cortex™ A9 i.MX6 Dual 1GHz SoC
NEW
Features
Coming Soon
Reset DC-IN
COM (RS-232/422/485)
GbE
USB
USB OTG
● NXP Cortex™-A9, i.MX6 Dual 1GHz, ● HDMI and dual LVDS ● 1GB DDR3, 4GB eMMC and SD socket for expansion ● Embedded I/O as COM, GPIO, USB, USB-OTG, Audio and Ethernet ● M.2 Key-E (2230) and Mini PCI-E w/ SIM socket for wireless connectivity ● OpenGL ES 2.0 for 3D BitBlt for 2D and OpenVG1.1
HDMI
System Form Factor
3.5” SBC
CPU
NXP Cortex™-A9 i.MX6 Dual 1GHz,
Operating Temperature
0°C~ 60°C (32°F ~ 140°F) / -40°C ~85°C (-40°F ~ 185°F)
System Memory 1GB DDR3 on board
Devices
WIFI/BT Cellular module (option)
Data Memory
4GB eMMC on board
Android / Yocto Linux
Display
2x 18/24bits single LVDS / 1x dual LVDS, up to 1366 x 768 for 1ch, 1920 x 1080 for 2ch 1x HDMI V1.4, up to 1080P30 at 60Hz
Software Support Relative Humidity
10%~90% (non-condensing)
Video Codec
Encoder: MPEG-4 SP, H.264 BP, H.263, MJPEG BP Decoder: MPEG-4 ASP, H.264 HP, MPEG-2 MP, MJPEG BP
Certification
CE/ FCC Class B
LAN
10/100/1000 Mbps
Touch
USB headers for CPT
Audio
2x5 pin header, 1.0mm (1x line-in, 1x line-out)
RTC
AnalogTEK AT8565S
Watchdog
256 Levels, 0~128 secs
Edge I/O
1x GbE (RJ45 connector) 2x USB Type-A, 1x USB OTG Mini-USB 1x HDMI 1x RS232 port (D-SUB 9 male connector) 1x SD socket (UHS-I SDR-104, 104MB/s max) 1x Reset button for power on/off
Header, Expansion & LEDs
2x LVDS connector (Hirose DF13-20) 1x backlight, 3.3V/1A, 5V/1A, 12/1A (jumper selection) 1x 4 pin-wafer (for debug console port) 1x Audio pin header (1x line-in /1x line-out) 2x 2-wire RS-232 (2x3 pin header, 1.0mm) 2x USB 2.0 (2x 5 pin header, 1.0mm) 1x M.2 Key-E (2230) w/ USB, SDIO, UART 1x Mini PCI-E (PCI-E + USB) w/ SIM socket 3x Green LEDs(1x Power, 1x wirelwss status, 1x programable) 2x CAN Bus via 2x3 pin header
Dimensions
146mm x 102mm (5.7” x 4”)
Power
12V DC-in by DC-jack
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
Ordering Information IBR117
3.5” ARM-based SBC, NXP Cortex™-A9, i.MX6 Dual 1GHz, 1GB DDR, 4GB eMMC, dual LVDS, HDMI, RS-234/422/285, USB, M.2 Key E(2230) and Mini PCI-E w/ SIM socket
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
19
IBASE ARM Solutions
The benefit of IBASE SMARC Development Kit The IBASE SMARC Development Kit allows users to start their performance evaluation and validation immediately and complete the development process easily and quickly by using the necessary tools provided, while eliminating peripheral noncompatibility or non-support arising from device driver issues. IBASE is committed to offering the embedded community a reliable development platform for ARM-based SMARC solutions. It offers a complete set of tools that are needed by the SMARC module, carrier board, related I/O boards such as MIPC-SCI camera, audio and GPIO, as well as necessary software images, utilities and validation tools to allow users to perform a complete and quick performance evaluation. Furthermore, we also provide GUI (Graphical User Interface) images that can used for Android and Ubuntu, and a user manual for product evaluation purposes.
20
SMARC Development Kit
For more advanced requirements, IBASE also furnishes a validated peripheral devices list for the LCD panel, touch panel module and wireless modules that can proved to be useful for future reference. The IBASE SMARC Development Kit for ARM solutions provides a shortcut to your ARM platform evaluation and development needs to give you ample time to finish your product innovations. With the IBASE professional support team to help you experience fast-to-market speeds, developing your ARM-based solutions would be easier and faster.
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
SMARC-EVK1
Development Kit SMARC Development Kit
Features ● RM-F6DU1-SMC: i.MX6 Dual SMARC module ● RP-101-SMC: carrier board with rich I/O ● 7” (800 x 480) capacitive touch panel ● Supports 1080p Encode/ Decode ● Supports HDMI, I²C, SPI, GPIO/ Mini PCI-E/ USB/ Gigabit LAN/ Audio/ COM port ● WIFI/BT/3G/GPS modules (option) ● Android 4.3/ or Linux kernel 3.0 (Ubuntu11.10) preload in eMMC ● Cable kits inside
System System Mainboard CPU Memory Display Graphics Storage
Internal Header/ Connectors
Edge I/O
Jumpers, Switch & Buttons Chassis Color Power Supply Dimensions
RM-F6DU1-SMC + RP-101-SMC NXP i.MX6 Dual-Lite 1GHz DDR3 1GB on board 7” (800 x 480) capacitive touch panel 1080p hardware encode/decode OpenGL ES 2.0 and OpenVG 1.1 hardware accelerators 1x 4Gb eMMC on board 1x Micro-SD socket (up to 32GB) 1x 18/24-bit parallel LCD header 1x 18/24 bit dual CH LVDS box header 2x CAN bus 2.0B connectors 1x LCD DDC (I²C) 1x LCD backlight connector 1x CSI-MIPI 2x USB 2.0 host 8x GPIO 3x COM port box header 1x Debug port header 1x Mini PCI-E with USB 1x SIM socket 1x Resistive touch header (4-wires) 1x Speaker box header Slot/ Socket: 1x Full-size Mini PCI-E with USB interface 1x SD socket ( up to 32GB) 1x Gb LAN 1x Headphone + MIC_In 2x USB 1x USB OTG 1x HDMI 1x COM (RS232/422/485) 1x DC-in jack 1x Boot media select switch (SD/eMMC) 1x Reset button 1x Power button 1x GPI button 1x (RS232/422/485) selection jumper 1x Backlight power (5/12V) jumper Black 100V-240V AC to 19V adaptor 450mm(W) x 350mm(D) x 170mm(H) 17.7”(W) x 13.7”(D) x 6.7”(H)
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
Operating Temperature
0°C~ 45°C (32°F ~ 113°F)
Storage Temperature
20° ~ 80°C (-4°F ~ 176°F)
Relative Humidity
5~90% @ 45°C, (non-condensing)
Ordering Information SMARC-EVK1
SMARC(RM-F6DU1-SMC) & Carrier Board (RP-101SMC), 7” PCT touch panel, AC adaptor, cable kits, recovery SD card, BSP DVD; (Preload Android/ Linux by order)
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
21
IBASE ARM Solutions
Digital Signage Player
High Quality Signage Players that Cater to Your Needs
IBASE’s Signature Book™ digital signage players have created unique and successful experiences for our users across different industries. Our players are widely adopted in different applications, covering major cities around the world. So contact us now and explore new opportunities!
Digital Signage Applications
Public Venues
22
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Education
Remarks: 1. Specifications are subject to change without prior notice.
Retail Environment
2. ODM/OEM is available.
Internal Communication
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
Comparison Table ARM-Based Digital Signage Player
Model
SA-101-N
SA-112-N
CPU
NXP Cortex™-A9 i.MX6 Quad 1GHz
NXP Cortex™-A9 i.MX6 Dual Lite Commercial 1GHz / IMX6 Quad Automotive 1GHz
Chipset
Integrated
Integrated
Operating System
Android 4.4.2
Android 4.4.2
Memory
Onboard DDR3L 2 GB 533MHz, (1066MT/s)
Onboard 1GB DDR3L, 533MHz, (1066MT/s)
Graphics
2D+3D (2 /3 GPUs) (35Mtri/s / 200Mtri/s)
2D+3D (2 /3 GPUs) (35Mtri/s / 200Mtri/s)
Display
1x Mini-HDMI (C-TYPE)
1x HDMI + 1x VGA
H/W EDID
-
-
Ethernet
None
1x RJ45 (1000M)/AR8031-AL1B
Expansion Slots
1x microSD card slot (up to 32GB)
1x Mini PCI-E (Full-size) 1x SD/SDHC card slot (up to 32GB)
Video Capability
1x FHD
1x FHD
Specify Firmware
-
-
Fanless
Yes
Yes
iAMT/DASH
-
-
Certification
CE, FCC class A , VCCI class A, TELEC, BSI & CCC
CE, FCC class B, cULus & CCC
Storage
1x eMMC (Default 8GB)
1x eMMC (Default 8GB)
USB
1x USB Host USB 2.0 A-TYPE
2x USB 2.0 1x mini USB(OTG) (USB device, supports host)
Dimensions
85mm(W) x 45mm(D) x 15mm(H)
117mm(W) x 104.5mm(D) x 35.1mm(H)
Weight
0.1kgs (0.22lbs)
0.5 kgs (1.1lbs)
Operating Temperature
0°C~ 50°C (31.9°F~121.9°F)
-40°C~ 75°C (-40°F~167°F)
Power Supply
10W power adaptor
Optional 25W power adaptor
p. 24
p. 25
Page No.
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
23
SA-101-N NEW
RISC Based
Entry-Level Digital Signage Player i.MX6 Quad Processor-Based Fanless Signage Player with 1x Mini-HDMI
Fanless
Features ● Supports NXP Cortex™-A9 i.MX6 Quad 1GHz Processor ● 1x eMMC NAND flash 8GB on board ● Onboard DDR3L, 2GB, 533MHz, (1066MT/s) ● 1x Mini-HDMI(C-Type) ● 1x USB, 1x microSD card slot (up to 32GB) ● Supports 802.11 a/b/g/n ● 5V DC-in power input ● Ruggedized, fanless and compact design
Specifications
Dimensions
System Mainboard
MBD101
CPU Type
NXP Cortex™-A9 i.MX6 Quad 1GHz, CPU
Chipset
Integrated
Memory
DDR3 2GB
Graphics
2D+3D (2 /3 GPUs) (35Mtri/s / 200Mtri/s)
I/O Interface
1x USB Host USB 2.0 A-Type 1x Mini-HDMI (C-Type) connector 1x microSD card 1x power jack
Power Requirement
+5V DC-in
Construction
Aluminum
Weight
0.1kgs (0.22lbs)
Chassis Color
Silver
Storage
1x eMMC (8GB) 1x microSD card slot (up to 32GB)
Power Supply
10W power adaptor
Mounting
Standard system bracket
Dimensions
85mm(W) x 45mm(D) x 15mm(H) 3.35”(W) x 1.77”(D) x 0.59”(H)
Operating Temperature
0°C~ 50°C (31.9°F~121.9°F)
Storage Temperature
-20°C ~ 70°C (-4°F~157.9°F)
Relative Humidity
10~90% @ 45 °C, (non-condensing)
Vibration
eMMC: 5 grms/ 5~500Hz/ random operation
Certification
CE, FCC class A , VCCI class A, TELEC, BSI & CCC
Operating System
Android 4.4.2
Ordering Information SA-101-NQC
24
ARM-based signage player with CPU IMX6QC 1GHz, eMMC NAND flash 8GB & DDR3L 2GB on board, 10W power adaptor (RoHS).
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
SA-112-N RISC Based
Entry-Level Digital Signage Player i.MX6 Dual/Quad Processor-Based Fanless Signage Player with 1x HDMI and 1x VGA
Features
Wide Temperature
Fanless
● Supports NXP i.MX6 Dual/Quad Processor ● eMMC NAND Flash 8GB on board ● Onboard DDR3L, 1GB 533MHz, (1066MT/s) ● 1x VGA + 1x HDMI (w/o HDCP) ● 1x GbE RJ45 LAN, 1x COM (RS-232), 1x Mini-USB (OTG), 2x USB, 1x SD card slot ● Supports Wi-Fi 802.11 b/g/n ● 1x SIM card slot and 1x Mini PCI-E slot for 4G function (optional) ● 5V DC-in power input ● Wide-range operating temperature from -40°C to 75°C ● Ruggedized, fanless and compact design
I/O Interface
Auto Control and Monitoring Power Requirement Construction Weight Chassis Color Storage Power Supply Mounting Dimensions Operating Temperature Storage Temperature Relative Humidity Vibration Certification Operating System
SA-112-NDL
ARM-based signage player with CPU IMX6DL MCIMX6U5DVM10AB Commercial 1GHz, eMMC NAND Flash 8GB & DDR3L 1GB on board, 25W power adaptor, (RoHS), (operating temperature 0°C ~ 50°C)
Dimensions
110 117
35.1
+5V DC-in Aluminum + SGCC 0.5kgs (1.1lbs) Black & white 1x eMMC (Default 8GB) 1x SD/SDHC card slot (up to 32GB) Optional 25W power adaptor Standard system bracket 117mm(W) x 104.5mm(D) x 35.1mm(H) 4.61”(W) x 4.11”(D) x 1.38”(H)
144 134 100
-40°C ~ 75°C (-40°F ~ 167°F) (w/o adaptor) -50°C ~ 85°C (-58°F ~ 185°F)
25 60.47 100
Expansion Slots
SA-112-NQC
5~90% @ 45°C, (non-condensing) eMMC: 5 grms / 5~500Hz / random operation CE, FCC class B, cULus & CCC SA-112-NDL- Android 4.4.2: HDMI output SA-112-NQC- Android 4.4.2: VGA+HDMI
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
50
LAN
NXP IMX6Q Automotive 1GHz / IMX6DL Commercial 1GHz Integrated Onboard DDR3L, 1GB 533MHz, (1066MT/s) i.MX53 + VP6 / WebM VP8, H.264 MVC 1x RJ45 (1000M)/AR8031-AL1B 1x Wi-Fi function built-in 1x Mini PCI-E (Full-size) for Wi-Fi, Bluetooth, 4G, or TV tuner options 1x HDMI 1x VGA 2x USB 2.0 1x mini USB(OTG) (USB device & supports host) 1x Power On/Off button 1x COM RS-232 1x 3.5mm Jack for Line out 1x RJ45 LAN 1x DC power jack Watchdog Timer: 256 segments, 0, 1, 2...255 (sec/min)
ARM-based signage player with CPU IMX6QC MCIMX6Q6AVT10AD Automotive 1GHz, eMMC NAND Flash 8GB & DDR3L 1GB on board, 25W power adaptor, (RoHS).
50
Chipset Memory Graphics
MBD112
4.
CPU Type
Ordering Information
4.
System Mainboard
72.95 104.50
Specifications
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
25
IBASE ARM Solutions
Panel PC / HMI
IBASE is dedicated to providing reliable x86-based and ARM-based panel PCs and low-power display solutions with a versatile and wide-range of display sizes from 4.3”, 7”, 8” to 18.5”. These panel PCs support different types of touch screens using resistive and capacitive touch technologies as well as essential I/O features such as audio, USB, Ethernet, SD sockets, and Mini PCI-E for wireless expansion.
NEXT STOP
Features
Also available are panel PC designs for outdoor applications that come with IP65-protection front bezel. IBASE has the display solutions you need for your embedded applications in automotive control, HMI, kiosks, POS and self check-in systems. BYARM Series
HMI Series MRS Series
TI and Freescale platform WinCE, Android, Linux support PoE function 26
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
ARM-Based i.MX6 All-in-One Panel PC
BYARM-W071-PC / BYARM-181-PC 8
BYARM series
7 18
BYARM-W071-PC
BYARM-181-PC
RISC Based
F Panel IP65
Flat Bezel
Features ● NXP i.MX6 high performance processor
● 12V DC and PoE support (BYARM-181-PC only)
● Projected capacitive touch screen, flat bezel
● Programmable LED light bar at rear side ● External SD card slot for storage expansion
design
● Android 4.3x support
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
27
ARM-Based i.MX6 All-in-One Panel PC
BYARM-W071-PC / BYARM-181-PC Specifications Model No.
BYARM-W071-PC
7” TFT-LCD
18.5” TFT-LCD
Max. Resolution
1024 x 600
1366 x 768
Luminance (cd/m2)
500
300
Contrast
800:1
1000:1
Max. Color
16.7M
16.7M
160/160
170/160
Backlight Lifetime(hrs)
50000
50000
Touch Type
Projected capacitive
Projected capacitive
Touch Interface
USB
USB
Light Transmission (%)
85
85
Point of touch
2
2
USB 3.0
0
0
USB 2.0
1x USB 2.0 Type A flag type 1x mini USB OTG support
1x USB (USB Host. A-Type) (Flag type) 1x USB OTG (mini AB type)
RS-232/422/485 Selectable under BIOS
1
1
RS-232
0
0
LAN
1x GbE
1x GbE
Additional Graphics
None
None
Audio
None
None
Digital I/O
None
None
Power Connector
Power jack
Power jack
Power Button
Reset button
Reset button
Dimensions (mm)
211.5 x 143.5 x 45.8
520 x 341 x 68.3
Net Weight (kgs)
1.5
6.1
Processor
NXP i.MX6 Dual-Core @ 800MHz
NXP i.MX6 Cortex A9 Solo Core @ 1GHz
Memory
1 GB DDR3L on board
1GB DDR3 memory on board
Thermal Design
Fanless
Fanless
Membrane Control
None
None
Built-in Speaker/MIC
2x speaker
2x speaker
Internal Expansion Bus
1x Mini PCI-E(x1) [full/half-sized]
1x Mini PCI-E slot (full/half size)
Expansion Slot
None
None
Wireless
Optional Wi-Fi/BT
Optional Wi-Fi/BT
Storage Space
HDD
4GB eMMC on board
4GB eMMC on board
Removable
1x SD slot
1x SD slot
Power
Power Input Range
12V ~ 24V DC
12V DC / PoE+
Chassis Material
Aluminum front bezel and white steel back cover with aluminum heat-sink
Black aluminum front bezel and black steel back cover
Color (Front/Back)
Black / White
Black / Black
IP Rating
IP65 front bezel
IP65 front bezel
Mounting
Panel mount and VESA 50x50 mm
VESA 75x75, 100x100 mm
Operating Temperature
-20°C~ 60°C
0°C~ 50°C
Storage Temperature
-30°C~80°C
Display & View Angle (H°/V°) Touch Screen
I/O Interface
Mechanical
System
Expansion
Construction
Environmental Storage Humidity
Certification Supported Operating Systems
28
BYARM-181-PC
Display Size
Remarks: 1. Specifications are subject to change without prior notice.
-20°C~60°C 10%~90% (non-condensing) CE/FCC Class B Android 4.X
2. ODM/OEM is available.
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
ARM-Based i.MX6 All-in-One Panel PC
BYARM-W071-PC / BYARM-181-PC Dimensions 190
BYARM-W071-PC
211.5
45.8
50
75
114
143.5
10.75
12
50 75
BYARM-181-PC 520
100 75
341
100 75
41 68.3
Ordering Information BYARM-W071-PC
RISC 7” Panel PC with projected capacitive touch, i.MX6 Cortex A9 CPU, 1GB DDR3 on board, supports Android, w/ 40W power adaptor
BYARM-181-PC
RISC 18.5” Panel PC with projected capacitive touch, i.MX6 Cortex A9 CPU, 1GB DDR3 on board, supports Android, w/ 60W power adaptor
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
29
8" ARM-Based Power-Over-Ethernet Panel PC
MRS-800 / MRS-801-RE MRS series
8
MRS-800
MRS-801-RE
RISC Based
Features ● High-performance ARM-based processor
● Android support
● 8" SVGA TFT LCD with resistive touch screen ● User-defined status LED light bar ● Supports USB OTG (USB On-The-Go) ● Compact fanless design with plastic housing ● Supports Android 4.0X (MRS-801-RE only)
● 12V DC or PoE power input
● Programmable LED light bar
● SD card slot with safety cover
30
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
8" ARM-Based Power-Over-Ethernet Panel PC
MRS-800 / MRS-801-RE Specifications Model No.
MRS-800
Display Size Max. Resolution Luminance (cd/m2) Contrast Max. Color Display & View Angle (H°/V°) Touch Screen Backlight Lifetime(hrs) Touch Type Touch Interface Light Transmission (%) Point of touch USB 3.0 USB 2.0
I/O Interface
Mechanical
RS-232/422/485 Selectable under BIOS RS-232 LAN Additional Graphics Audio Digital I/O Power Connector Power Button Dimensions (mm) Net Weight (kgs) Processor
Memory Thermal Design Membrane Control Built-in Speaker/MIC Internal Expansion Bus Expansion Slot Expansion Wireless HDD Storage Space Removable Power Input Range Power Chassis Material Color (Front/Back) Construction IP Rating Mounting Operating Temperature Storage Temperature Environmental Storage Humidity Certification Supported Operating Systems System
MRS-801-RE
8” TFT LCD 800 x 600 250 500:1 262K 140/120 20000 Resistive USB 80 1 0 1x USB (USB Host. A-Type) 1x USB OTG (mini AB type)
8” TFT LCD 800 x 600 250 500:1 262K 140/120 30000 Resistive USB 80 1 0 1x USB (USB Host. A-Type) 1x USB OTG (mini AB type)
0
1 (via RJ-45 connector)
1 (via RJ45 connector) 1x 10/100 LAN w/ PoE None None None Power jack Reset button 211.6 x 171.2 x 33.5 1.1
DDR2 256MB Fanless None None 1x Mini PCI-E slot (full/half size) None Optional Wi-Fi/BT NAND 512MB 1x SD card slot 12V DC / PoE Plastic Black / Black IP65 front bezel VESA 75x75 mm
0 1x GbE w/ PoE None None None Power jack Reset button 211.6 x 171.2 x 33.5 1.1 NXP i.MX6 Cortex A9 Solo (Single-Core @ 1GHz) 1GB DDR3 memory Fanless None None 1x Mini PCI-E slot (full/half size) None Optional Wi-Fi/BT 1x 4GB eMMC on board 1x SD card slot 12V DC / PoE+ Plastic Black / Black IP65 front bezel VESA 75x75 mm
0°C ~ 45°C
0°C ~ 50°C
-20°C ~ 80°C 5~90% @ 45°C, (non-condensing) CE/FCC Class B
-20°C ~ 60°C 10%~90% (non-condensing) CE/FCC Class B
Android 2.2X
Android 4.X
TI AM3517 600 MHz
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
31
8" ARM-Based Power-Over-Ethernet Panel PC
MRS-800 / MRS-801-RE Dimensions
MRS-800
MRS-801-RE 34.5
171.28
211.58
Ordering Information
32
MRS-800
RISC 8” Panel PC with resistive touch TI AM3517 600MHz CPU, 256MB DDR2 on board, 512MB NAND flash, w/ 60W power adaptor
MRS-801-RE
RISC 8” Panel PC with resistive touch, i.MX6 Cortex A9 CPU, 1GB DDR3 on board, supports Android, w/ 60W power adaptor
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
Samsung S3C2440A-40 400MHz Panel PC
IPPC-H04/ IPPC-H07/ IPPC-H10 ARM-Based HMI
4
7 10
H07 I/O
H010 I/O
Fanless
RISC Based
Features ● RISC 400MHz processor ● Supports 64MB memory ● Front keypads for OSD adjustment and function keys for IPPC H07/N10 ● IP65 front-panel protection ● Resistive touch panel ● Fanless design
Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
33
Samsung S3C2440A-40 400MHz Panel PC
IPPC-H04/ IPPC-H07/ IPPC-H10 Specifications Model No. System
IPPC-H04L-P
IPPC-H04L-N
Processor
IPPC-H07L-P
System Memory 1x USB 1.1 host type A 1x USB 2.0 device type B
USB: 1x Device, 1x Host
1x RS232 DB9, COM1 1x RS422/485 share DB9, COM1
2x RS232/422/485 1x RS232 COM1 2x RS232/422/485 COM1/2 2x RS232/422/485 COM1/2 1x RS422/485 1x RS422/485 COM1/2 1x RS422/485 COM2 COM3 COM3
Audio
None
Graphics
None
LAN
None
None
None
Membrane Control
None
Front home key
DC 24V±20%
Onboard 128M Flash
Removable Slot
None
1x SD card
Onboard Expansion Bus
None
Expansion Slot
None 4.3" TFT LCD
Luminance (cd/m ) 2
7” TFT LCD
10.2” TFT LCD
480 x 272
800 x 480
65536
65536
330
250
140/120
140/120
Contrast
140/100
500:1
Backlight Lifetime(hrs)
20000
Type
4-wire resistive touch
Touch Screen Interface
Processor built-in
Light Transmission (%)
78
Power Input
24V±20% DC, Isolated power
Construction
Plastic
IP Rating
IP65 (Front panel with mount)
Mounting
Panel mount only
Dimensions (mm)
127.7 x 89.7 x 36.7
199.8 x 147.8 x 40.1
279.5 x 195.5 x 40.1
Net Weight (kgs)
0.25kg
1.0kg
1.52kg
Operating Temperature
0°C~ 40°C
0°C~ 50°C
Storage Temperature
-20°C~60°C
Storage Humidity Certification
10~90RH (No frosting) FCC class A EN 55022:2006 complies, class A, EN 61000-3-2:2006 EN 61000-3-3:1995 + A1:2001 + A2:2006 standard
Supported Operating Systems
34
1x 10/100M
24V±20% DC, isolated power
HDD
View Angle (H°/V°)
Environmental
None
Keyboard/Mouse
Max. Color
Mechanical
1x 10/100M None
Display Type
Power
None
None
Max. Resolution Display
1x 10/100 base-T RJ45
Digital I/O
Power
Expansion
IPPC-H10L-N
Onboard DDR2 128MB 400 MHz
Serial/Parallel
Storage Space
IPPC-H10L-P
SAMSUNG S3C2440A-40 400MHz processors
USB
External I/O
IPPC-H07L-N
Remarks: 1. Specifications are subject to change without prior notice.
Linux 2.6X
2. ODM/OEM is available.
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
Samsung S3C2440A-40 400MHz Panel PC
IPPC-H04/ IPPC-H07/ IPPC-H10 Dimensions
IPPC-H04L
IPPC-H07L
132.10
133.20
40.10
7.30
147.83
185.20
184.09
260.20
IPPC-H10L 259.17 177.20
176.15
40.10
7.30
195.48
279.48
259.17
Ordering Information IPPC-H04-P (With iFace) IPPC-H04L-P (Pure Linux) IPPC-H04-N (With iFace) IPPC-H04L-N (Pure Linux) IPPC-H07-P (With iFace) IPPC-H07L-P( Pure Linux)
4.3" RISC PPC, 480x272 pixel, 64K color, ARM 400MHz, Flash 128M, RAM 128M, Data Memory 8K, COM1 (RS232/RS422/485), USB (1 Host/1Device), 24V ± 20% DC 4.3" RISC PPC, 480x272 pixel, 64K color, ARM 400MHz, Flash 128M, RAM 128M, Data Memory 8K, COM1 (RS232/RS422/485), USB (1 Host/1Device), Ethernet, 24V ± 20% DC 7" RISC PPC, 800x480 pixel, 64K color, ARM 400MHz, Flash 128M, RAM 128M, Data Memory 8K, COM1 (RS232), COM2 (RS422/485), USB (1 Host/1Device), 24V ± 20% DC 7" RISC PPC, 800x480 pixel, 64K color, ARM 400MHz, Flash 128M, RAM 128M, Data Memory 8K,
IPPC-H07-N (With iFace) COM1 (RS232/422/485), COM2 (RS232/422/485), COM3 (RS422/485), USB (1 Host/1Device), IPPC-H07L-N (Pure Linux) Ethernet, SD Card, 24V ± 20% DC
IPPC-H10-P (With iFace) 10.2" RISC PPC, 800x480 pixel, 64K color, ARM 400MHz, Flash 128M, RAM 128M, Data Memory 8K, IPPC-H10L-P (Pure Linux) COM1 (RS232/422/485), COM2 (RS232/422/485), USB (1 Host/1Device), 24V ± 20% DC 10.2" RISC PPC, 800x480 pixel, 64K color, ARM 400MHz, Flash 128M, RAM 128M, Data Memory 8K,
IPPC-H10-N (With iFace) COM1 (RS232/422/485), COM2 (RS232/422/485), COM3 (RS422/485), USB (1 Host/1Device), Ethernet, IPPC-H10L-N (Pure Linux) SD Card, 24V ± 20% DC Remarks: 1. Specifications are subject to change without prior notice.
2. ODM/OEM is available.
3. For user’s manual & datasheet download, visit www.ibase.com.tw.
35
INDUSTRY LEADER IN EMBEDDED COMPUTING
HEADQUARTERS IBASE Technology Inc.
Bldg. G, 11F, No. 3-1, Yuan Qu St., Nankang, Taipei 115, Taiwan, R.O.C 廣積科技股份有限公司 台北市115南港區園區街3-1號11樓G棟
Tel: +886-2-2655-7588 Fax: +886-2-2655-7388 sales@ibase.com.tw www.ibase.com.tw
Woldwide Offices Europe
TMC Technology U.K. Co., Ltd. 12 Wedgwood Court Stevenage, Herts, SG1 4QR United Kingdom Tel: +44-1438-842300 Fax: +44-1438-842308 sales@ibase-europe.com www.ibase-europe.com
USA
IBASE Technology (USA), Inc. 1050 Stewart Drive,Sunnyvale, CA 94085, U.S.A. Tel: +1-408-992-0888 Fax: +1-408-992-0808 sales@ibase-usa.com www.ibase-usa.com
China
IBASE (Shanghai) Technology Inc. 2F, Building 3, No. 2005, HongMei Road, 201103 Shanghai, China
USA
IBASE Technology (USA), Inc. Eastern Coast Office
Singapore
IBASE Singapore Pte Ltd.
1 Chestnut Street, Suite 3-H, Nashua, NH 03063, U.S.A. Tel: +1-603-791-4144 Fax: +1-603-791-4145 sales@ibase-usa.com www.ibase-usa.com
10, Ubi Crescent #07-60, Ubi Techpark (Lobby D), Singapore 408564 Tel: +65-6842-5112 Fax: +65-6842-5113 sales@ibase-singapore.com www.ibase-singapore.com
China
Japan
IBASE (Shanghai) Technology Inc. Beijing Office
上海广佳信息技术有限公司 中国上海市虹梅路2005号3号楼2层 邮编: 201103
Room 1622, GuoFengMeiTang Building 5, No. 106, KeXing West Road, Changping District, 100029 Beijing, China
Tel: +86-21-6090-5088 Fax: +86-21-6090-6388 sales@ibase-china.com www.ibase-china.com
上海广佳信息技术有限公司-北京办事处 中国北京市昌平区回龙观科星西路106号 国风美唐5号商务楼1622室 邮编: 100029
Tel: +86-133-113-80499 sales.bj@ibase-china.com www.ibase-china.com
IBASE Japan Corp. 3F Bansei Muromachi Bldg., 4-3-12 Nihonbashi Muromachi, Chu-O ku, Tokyo, Japan
IBASE
ジャパン株式会社 東京都中央区日本橋室町4-3-12 バンセイ室町ビル3 F
Tel: +81-3-6262-1303 Fax: +81-3-6262-6106 sales@ibase-japan.com www.ibase-japan.com
RI-Vol.17.03