engineered to connect
Board eDGE cONNECTOR Family connector solutions
Board Edge Connector (BEC) with 230 Pins for MXM 1.0 / QSEVEN Module Cards Yamaichi Electronics presents the BEC series for applications with requirements especially for the automotive industry. This connector is able to fulfill tough specifications such as vibration, shock and temperature range.
Specifications Number of pins: Contact type: Height: Contact plating:
230 pins SMT 7.8mm 3 variations possible mating area - Au Flash, 15µ“ and 30µ“ Au solder area - Au Flash
Special Features Mechanical Stability
Tolerance Compensation
• Connector ensures good contact in applications with vibrations because of the contact shape and form of insulator • Improved mechanical stability due to enlarged SMT tabs • Additional fixation of module card in the connector is possible
• The contact design can compensate tolerances of the module fixation angle and the PCB regardless of thickness within specified dimensions
Further Improvements
Applications
• Improved EMI protection with additional ground connection • PCB chamfer on mating area recommended, but not obligatory • Automatic assembly of module card is possible • Mating area compatible with QSEVEN and MXM 1.0 standard cards
• Automotive devices, e.g, infotainment systems • Medical devics • Rough industrial applications
Versions BEC sTANDARD
hIGH sPEED bec
• Normal speed type • Capable for signals such as USB2.0, PCIe1.3
• Based on special contact design this new generation of BEC is able to transfer data rates up to 5Gbps and is capable for signals such as USB3.0, HDMI, S-ATA or PCIe 2.0.
Part Number: BEC-0.5-230-S9-*F-R-EDC
Part Number: BECHS-0.5-230-S9-*F-R-EDC
Power Connector The optional Power Connector (BECPOW) supports the system with10 pins, where each pin can transfer 1.5A. Another function is the fixing support of the module during the mounting. The spring in the middle of the connector holds the module down, so that it is easier to fix with the screws on the flanges.
Specifications Number of pins: Contact type: Mating height: Contact plating:
Part Number: BECPow-1.5-10S9-*F-R-EDC 10 pins SMT 5mm 3 variations possible mating area: Au Flash, 15µ“ and 30µ“ Au solder area: Au Flash
Features • Transferring power via 10 x 1.5A • For use together with BEC High Speed (BECHS) version • Assembly of module supported by additional spring
• Additional fixation of the module with screws possible • Production site TS16949 certified
High-Speed BEC Connector (BECHS)
Power Connector (BECPOW)
Test Adapter SystemS for Embedded Modules uSING Board Edge AND pOWER cONNECTOR The product range includes vertical and horizontal test adapters for both burn-in and functional testing. They stand out for their reliability and endurance combined with high electrical performance. Tailor-made solutions are also available.
Features • Performance controlled system acc. to customized pinout • Flexible in module size • In-line volume test • Volume test ready
Test Adapter for QSEVEN modules
Test Adapter for BEC standard and High Speed BEC (BECHS)
Test Adapter for High Speed BEC (BECHS) and Power Connector (BECPOW)
TECHNICAL DATA ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE
Yamaichi Elec tronics Deutschland GmbH Concor Park Bahnhofstraße 20 85609 Aschheim-Dornach Germany
Yamaichi Elec tronics Italia s.r.l. Centro Direzionale Colleoni Via Colleoni, 1 Palazzo Taurus Ing. 1 20864 Agrate Brianza (MB) Italy
Yamaichi Elec tronics GB Ltd. 6 The Clockhouse Stratton Park Micheldever Hampshire SO21 3DP Great Britain
Phone +49 (0)89 45109 - 0 Fax +49 (0)89 45109 - 110 E-Mail info@yamaichi.de Web www.yamaichi.eu
Phone +39 039 6881-185 Fax +39 039 6892-150 E-Mail sales@yamaichi.it Web www.yamaichi.eu
Phone +44 (0)7808 493377 Fax +44 (0)1962 774902 E-Mail sales@yamaichi.co.uk Web www.yamaichi.eu
Version Nov. 2013