Global Semiconductor Packaging and Assembly Equipment Market 2016-2020
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Global Semiconductor Packaging and Assembly Equipment Market 2016-2020 
The analysts forecast global semiconductor packaging and assembly equipment market to grow at a CAGR of 4.68% during the period 2016-2020. For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation. The increasing application of semiconductor ICs across many segments has increased the demand for semiconductor packaging and assembly equipment.
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This report covers the present scenario and the growth prospects of the global semiconductor packaging and assembly equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sale of die-level and wafer-level packaging and assembly equipment to semiconductor manufacturers.
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Global Semiconductor Packaging and Assembly Equipment Market 2016-2020 The market is divided into the following segments based on type: Die- level packaging and assembly equipment Wafer-level packaging and assembly equipment This report, Global Semiconductor Packaging and Assembly Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. This report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market. Purchase a Copy of this Report @ http://www.rnrmarketresearch.com/contacts/purchase?rname=459288
Global Semiconductor Packaging and Assembly Equipment Market 2016-2020 Key vendors - Applied Materials, ASMPT, DISCO, EVG, Kulicke and Soffa Industries, TEL, Tokyo Seimitsu Other prominent vendors - Rudolph Technologies, SEMES, Suss Microtec, Ultratech, Ulvac Technologies Market driver - Rising demand for polymer adhesive wafer bonding equipment Market challenge - Fluctuating foreign exchange rates Market trend - Higher number of mergers and acquisitions (M&A) Inquire on the Report @ http://www.rnrmarketresearch.com/contacts/inquire-before-buying?rname=459288
Global Semiconductor Packaging and Assembly Equipment Market 2016-2020 Key questions answered in this report What will the market size be in 2020 and what will the growth rate be? What are the key market trends? What is driving this market? What are the challenges to market growth? Who are the key vendors in this market space? What are the market opportunities and threats faced by the key vendors? What are the strengths and weaknesses of the key vendors?
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