Global 3D IC Market 2014-2018 On 15th December 2014
Summary About 3D IC A 3D IC is an IC with multiple layers (more than two) of active electronic components which are integrated into a single circuit. These layers are integrated both vertically and horizontally. 3D ICs are the perfect solution for meeting the growing demand to minimize the size and reduce the cost of products in the Consumer Electronics segment. The transistor density is greater in 3D ICs than that in other ICs, which means that 3D ICs offer better performance. 3D technology emerged as a result of the continuous advancements being made in IC design. Some of the major applications of 3D ICs are in memory products (flash and DRAM), sensors, LEDs, and MEMS systems. TechNavios analysts forecast the Global 3D IC market to grow at a CAGR of 18.4 percent over the period 2013-2018.
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This report covers the present scenario and the growth prospects of the Global 3D IC market for the period 2014-2018. The report includes the overall revenue generated from the sales of 3D ICs. The 3D ICs that are discussed in this report are developed by using through-silicon via (TSV) interconnect technology. The report also presents the vendor landscape and a corresponding detailed analysis of the top four vendors in the Global 3D IC market. In addition, the report discusses the major drivers that influence the growth of the Global 3D IC market. It also outlines the challenges faced by the vendors and the market at large, as well as the key trends that are emerging in the market. Browse Full Report @ http://www.jsbmarketresearch.com/electronics/r-global-3d-ic-market2014-2018-140830 Key Regions Americas APAC EMEA Key Vendors Advanced Semiconductor Engineering Samsung Electronics STMicroelectronics Taiwan Semiconductor Manufacturing Other Prominent Vendors 3M Company
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IBM Micron Technology STATS ChipPAC United Microelectronics Xilinx Market Driver Huge Demand for Memory-enhanced Applications For a full, detailed list, view our report Market Challenge Thermal Conductivity Issues For a full, detailed list, view our report Market Trend Multi-chip Packaging For a full, detailed list, view our report Key Questions Answered in this Report What will the market size be in 2018 and what will the growth rate be? What are the key market trends? What is driving this market? What are the challenges to market growth? Email ID- contact@jsbmarketresearch.com Tel No- 91 2241236650 Published by- http:/www.jsbmarketresearch.com/
Who are the Key Vendors in this market space? What are the market opportunities and threats faced by the Key Vendors? What are the strengths and weaknesses of the Key Vendors?
Other industries we cover: • • • • • • • • •
Advertising and Media Automotive and Parts Consumer Goods Healthcare and Medical Finance and Banking Food and Beverages Travel and Tourism Textiles and Clothing SWOT Analysis
Discounts on Market Research Reports till 31st December, 2014 For more inquiries, contact at +91 - 998 729 5242 / contact@jsbmarketresearch.com Table of Content 01. Executive Summary 02. List of Abbreviations 03. Scope of the Report 03.1 Market Overview 03.2 Product Offerings 04. Market Research Methodology 04.1 Market Research Process 04.2 Research Methodology 05. Introduction 06. Market Landscape 06.1 Industry Overview Email ID- contact@jsbmarketresearch.com Tel No- 91 2241236650 Published by- http:/www.jsbmarketresearch.com/
06.2 Technology Landscape 06.2.1 Monolithic 06.2.2 Wafer-on-wafer 06.2.3 Die-on-Wafer 06.2.4 Die-on-die 06.3 Market Size and Forecast 06.4 Five Forces Analysis 07. Market Segmentation by Product 07.1 Global 3D IC Market by Product 2013-2018 08. Market Segmentation by End-users 08.1 Global 3D IC Market by End-users 2013 09. Geographical Segmentation 09.1 Global 3D IC Market by Geographical Segmentation 2013-2018 09.2 Global 3D IC Market by Geographical Segmentation 2013-2018 09.3 3D IC Market in the APAC Region 09.3.1 Market Size and Forecast 09.4 3D IC in the Americas 09.4.1 Market Size and Forecast 09.5 3D IC Market in the EMEA Region 09.5.1 Market Size and Forecast 10. Key Leading Countries 10.1 US 10.2 China 10.3 South Korea 11. Buying Criteria 11.1.1 Consumer Electronics Sector 11.1.2 ICT Sector 11.1.3 Military, Aerospace, and Defense Sector 11.1.4 Automotive Sector 11.1.5 Others 12. Market Growth Drivers 13. Drivers and their Impact 14. Market Challenges 15. Impact of Drivers and Challenges 16. Market Trends 17. Trends and their Impact Email ID- contact@jsbmarketresearch.com Tel No- 91 2241236650 Published by- http:/www.jsbmarketresearch.com/
18. Vendor Landscape 18.1 Discussion about Key Vendors 18.1.1 Taiwan Semiconductor Manufacturing Co. Ltd. 18.1.2 Advanced Semiconductor Engineering 18.1.3 Samsung Electronics 18.1.4 STMicroelectronics 18.2 Other Prominent Vendors 18.2.1 Micron Technology 18.2.2 Xilinx 18.2.3 3M Company 18.2.4 STATS ChipPAC 18.2.5 United Microelectronics 18.2.6 IBM 19. Key Vendor Analysis 19.1 Advanced Semiconductor Engineering 19.1.1 Key Facts 19.1.2 Business Overview 19.1.3 Business Segmentation by Revenue 2013 19.1.4 Business Segmentation by Revenue 2012 and 2013 19.1.5 Geographical Segmentation by Revenue 2013 19.1.6 Business Strategy 19.1.7 Recent Developments 19.1.8 SWOT Analysis 19.2 Samsung 19.2.1 Key Facts 19.2.2 Business Overview 19.2.3 Business Segmentation by Revenue 2013 19.2.4 Business Segmentation by Revenue 2012 and 2013 19.2.5 Geographical Segmentation by Revenue 2013 19.2.6 Business Strategy 19.2.7 Recent Developments 19.2.8 SWOT Analysis 19.3 STMicroelectronics 19.3.1 Key Facts 19.3.2 Business Overview 19.3.3 Product Segmentation by Revenue 2013 Email ID- contact@jsbmarketresearch.com Tel No- 91 2241236650 Published by- http:/www.jsbmarketresearch.com/
19.3.4 Product Segmentation by Revenue 2012 and 2013 19.3.5 Geographical Segmentation by Revenue 2013 19.3.6 Business Strategy 19.3.7 Recent Developments 19.3.8 SWOT Analysis 19.4 Taiwan Semiconductor Manufacturing Company 19.4.1 Key Facts 19.4.2 Business Overview 19.4.3 Business Segmentation by Revenue 2013 19.4.4 Geographical Segmentation by Revenue 2013 19.4.5 SWOT Analysis 20. Market Summary 21. Other Reports in this Series List Of Figures Exhibit 1: Market Research Methodology Exhibit 2: Global Semiconductor Market Overview 2013 Exhibit 3: Global NAND Flash Market Segmentation by Technology 2013-2018 Exhibit 4: Global 3D IC Market 2012-2016 (US$ billion) Exhibit 5: Global 3D IC Market by Product Type 2013 Exhibit 6: Global 3D IC Market Segmentation by End-user 2013-2018 Exhibit 7: Global Spectrum Analyzer Market by End-user Segmentation 2013 Exhibit 8: Global 3D IC Market Segmentation by End-user 2013-2018 Exhibit 9: Global Smartphone Power Management IC Market by Geographical Segmentation 2013 Exhibit 10: Global 3D IC Market by Geographical Segmentation 2013-2018 (Percentage Split) Exhibit 11: Global 3D IC Market by Geographical Segmentation 2013-2018 (by Revenue US$ billion) Exhibit 12: CAGR Comparison between Geographies 2013-2018 Exhibit 13: 3D IC Market in the US 2013-2018 (US$ billion) Exhibit 14: 3D IC Market in China 2013-2018 (US$ billion) Exhibit 15: 3D IC Market in South Korea 2013-2018 (US$ billion) Exhibit 16: CAGR Comparison of Key Leading Countries 2013-2018 Exhibit 17: Buying Criteria for Consumer Electronics Sector Exhibit 18: Buying Criteria for ICT Sector Email ID- contact@jsbmarketresearch.com Tel No- 91 2241236650 Published by- http:/www.jsbmarketresearch.com/
Exhibit 19: Buying Criteria for Military, Aerospace, and Defense Sector Exhibit 20: Buying Criteria for Automotive Sector Exhibit 21: Buying Criteria for Others Exhibit 22: Advanced Semiconductor Engineering: Business Segmentation by Revenue 2013 Exhibit 23: Advanced Semiconductor Engineering: Business Segmentation by Revenue 2012 and 2013 (US$ million) Exhibit 24: Advanced Semiconductor Engineering: Geographical Segmentation by Revenue 2013 Exhibit 25: Samsung: Business Segmentation by Revenue 2013 Exhibit 26: Samsung: Business Segmentation by Revenue 2012 and 2013 (US$ billion) Exhibit 27: Samsung: Geographical Segmentation by Revenue 2013 Exhibit 28: STMicroelectronics: Product Segmentation by Revenue 2013 Exhibit 29: STMicroelectronics: Product Segmentation by Revenue 2012 and 2013 (US$ million) Exhibit 30: STMicroelectronics: Geographical Segmentation by Revenue 2013 Exhibit 31: Taiwan Semiconductor Manufacturing Company: Business Segmentation by Revenue 2013 Exhibit 32: Taiwan Semiconductor Manufacturing Company: Geographical Segmentation by Revenue 2013 Exhibit 33: Global 3D IC Market by Product Types 2013-2018 Exhibit 34: Global 3D IC Market by End-users 2013-2018
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