CompactPCI and AdvanctedTCA Systems - August 2008 by kwitte

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The Magazine for Developers of Open Communication, Industrial, and Rugged Systems

FEATURES

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COLUMNS 8

Editor’s Foreword

AdvancedTCA: Living large By Joe Pavlat

Small is beautiful 10

By Tony Romero, Performance Technologies

Global Technology

Hearing you loud and clear By Hermann Strass

AdvancedMCs are finding their place By Venkataraman Prasannan, RadiSys

Software Corner

Switching at the speed of light By Curt Schwaderer

PRODUCT GUIDE

E-LETTER AdvAnCed MezzAnine CArdS

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AUGUST: Leveraging the communications server ecosystem

From Host Board Adapters (HBAs) to card edge connectors to modules for high-density WAn WA to the latest content-aware, wirespeed solutions, this issue’s AdvancedMC Guide presents a comprehesive set of recently introduced AdvancedMCs and related offerings, with an expanded guide online at advancedmc-systems.com.

By Hermann Berg and Larry Terry, Emerson Network Power Embedded Computing

E-CASTS www.opensystems-publishing.com/ecast AUGUST: The hottest DSP trends, from algorithms to Zulu, powering today’s military systems

COVER: Suitable for wireless baseband and other processingintensive applications such as WiMAX and Long Term Evolution of 3GPP (LTE), the AMC-6487C from CommAgility is based on the Texas Instruments (TI) multicore TMS320TCI6487 DSP. Additional AdvancedMC solutions can be found beginning on page 26.

August 27 • Moderator: Chris Ciufo Presented by: Annapolis Micro Systems, Inc. and Jacyl Technology, Inc.

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August 2008

CompactPCI and AdvancedTCA Systems

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August 2008

CompactPCI and AdvancedTCA Systems

CompactPCI AdvancedTCA Systems ®

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CompactPCI and AdvancedTCA Systems

EDITOR’S FOREWORD

CompactPCI and AdvancedTCA Systems

By Joe Pavlat

AdvancedTCA: Living large

he annual NXTcomm telecom trade show was held June 17-19 this year at the Las Vegas Convention Center. The show will alternate between Las Vegas and its regular Chicago venue every other year going forward. Attendance topped 13,000, down a bit from last year. Folks I talked to weren’t all that happy with Las Vegas as a trade show location, in part due to its distance from East Coast cities and its triple-digit temperatures, but there was a lot of excitement about the products being shown. Several of the keynotes from industry heavies drew large crowds, too. Of course this observer was interested in seeing AdvancedTCA equipment, and NXTcomm did not disappoint. Indeed, AdvancedTCA was almost impossible to miss, especially given the “sizable” interest in it, as evidenced at the Spirent Communications booth (Figure 1). Spirent created a 3D billboard presentation of its flagship product Spirent TestCenter featuring an AdvancedTCA board. “Tradeshow exposure and visibility always present a challenge, so we took a page from the outdoor advertising playbook,” said Scott Gregory, Corporate Communications Manager at Spirent Communications. Interestingly, many of the systems I saw were not from AdvancedTCA vendors but from applications providers that in some cases did not even know that their product was running on an AdvancedTCA platform or even what AdvancedTCA was. That’s a very important step in the maturation and widespread acceptance of AdvancedTCA as a platform that is the basis for many new products and applications. Most, as is the nature of things these days, are IP based and are pieces of the emerging All-IP network. As in prior years, PICMG sponsored a pavilion-style booth with 35 member companies displaying their products and technologies (Figure 2). Booth traffic was fairly good, although a number of companies that were farthest from the main aisle did not see as many prospective customers as those nearer the main aisle. A redesign for next year might be in order. In addition to AdvancedTCA products, including racks, shelves, boards, and fully functioning systems, many Advanced Mezzanine Card and MicroTCA products were on display. CompactPCI and AdvancedTCA Systems team members Rosemary Kristoff, Ernest Godsey, Pat Hopper, and Anne Fisher were on hand to conduct interviews with PICMG members. The interviews

will be included in a series of CompactPCI and AdvancedTCA Systems E-letters (www.compactpcisystems.com/eletter). A drawing for a Chumby (yes, I checked www.chumby.com, too) encouraged both attendeees already familiar with PICMG, as well as those just becoming familiar with the AdvancedTCA/MicroTCA/CompactPCI ecosystem, to visit the PICMG Pavilion. A brochure that included a map locating booths within the Pavilion and featuring product news was popular with Pavilion visitors.

Versatile MicroTCA Having noticed the impressive number of MicroTCA products displayed at NXTcomm, it was interesting to return from the show and preview Tony Romero’s article on MicroTCA, “Small is beautiful.” The article is in this issue and Tony, Senior Product Manager at Performance Technologies, says, as others have, that the military is very interested in the MicroTCA platform for a wide range of applications. It is worth noting that several prime military suppliers are actively participating in the two PICMG technical committees developing standards for rugged aircooled and conduction-cooled MicroTCA systems. A related topic is the Advanced Mezzanine Cards that are the basis of MicroTCA. Venkataraman Prasannan, Senior Director AdvancedTCA Product Line Management from RadiSys, digs into when and how to use AdvancedMCs, the thermal issues associated with their use, connectivity and I/O constraints, and usage models. As the AdvancedMC market continues to grow and products proliferate, designers need to understand the many variables when making cost/performance tradeoffs.

Photo courtesy Spirent Communications

In his Global Technology column, Hermann Strass updates us on activities and shows in Europe. Meanwhile, in the Software Corner Curt Schwaderer tells about a new optical switching interconnect technology designed to help large storage arrays and data warehouses manage information flow. Using lasers and lenses, this unique technology is a departure from traditional fiber optic point-to-point systems, and requires some very sophisticated software to make it all work.

Figure 1 8

August 2008

CompactPCI and AdvancedTCA Systems

Figure 2

Joe Pavlat, Editorial Director

CompactPCI and AdvancedTCA Systems

GLOBAL TECHNOLOGY

CompactPCI and AdvancedTCA Systems

By Hermann StraSS

Hearing you loud and clear

lassical telephone communication has developed over a long time. It has transformed from analog to digital. Because of this digital nature there is a tendency to merge telephone communication with data communication, which these days is almost exclusively based on Ethernet/IP/TCP. Even though both are digital, there are fundamental architectural differences. A telephone connection is direct and in real time. Data communication (TCP/IP) is indirect and comes in pieces (packets). Since the convergence is on TCP/IP rather than on telephony, there is a big problem getting clear and reliable real-time communication via a packet network. It is therefore mandatory that at least the technical quality of a packet network for Voice over IP (VoIP) is as high quality as possible. Making it real time is a matter of packet priorities and congestion avoidance.

Testing the interoperability of VoIP interfaces

In order to guarantee a properly working network for VoIP traffic a continuous analysis of the quality of contents and services is necessary. In this application a Single Board Computer (SBC) based on a PowerQUICC II CompactPCI board from MEN Micro (Germany), is used to test interoperability of VoIP interfaces (Figure 1, courtesy MEN Micro). The system emulates multiple IP telephones or gateways. It generates the call signaling and delivers the signaling and traffic to a system under test. Perceptual Speech Quality Measure (PSQM) and Perceptual Evaluation of Speech Quality (PESQ) measurements are made in real time for voice quality analysis. The system executes Domain Name System (DNS) and network element registration. It requests and measures the capacity of servers to perform these actions.

(TDMs), four Serial Communications Controllers (SCCs) for High Level Data Link Control/System Network Architecture (SNA) Data Link Control (HDLC/SDLC) or Universal Asynchronous Receiver/Transmitter (UART) applications, and two Serial Management Controllers (SMCs) for low-speed operations. On this card the channels of the MCCs, FCCs, and SCCs are routed to a COM extension connector for implementation of ATM, E1/T1, Fast Ethernet, or HDLC interfaces. The remaining ports are used for Fast Ethernet and UART operation. Different physical interface configurations such as RS-232, RS-422/RS485, or 10BASE-T are available for two SCCs. Some features of the VoIP test system are: F6 SBC: 6U, 64-bit CompactPCI PowerPC MPC8260 (PowerQUICC II) Two Fast Ethernet channels Four SCCs, two multichannel interfaces One FCC for telecom interfaces, like Asynchronous Transfer Mode (ATM), T1/E1, and HDLC n Hot-plug functionality n Linux n n n n n

The original single Eurocard (3U) has been modified to 6U height to become the F6 card. The modular CompactPCI architecture allows the configuration of optimized systems based on individual requirements. In addition, the test set can expand as the network grows or new offices come online. The system scales from 1 to 3,328 two-party simultaneous calls. It accommodates from 1 to 13 10/10/1000BASE-T autosensing Ethernet ports.

European events

The Automatica 2008 exhibition and conference in Munich also hosted the largest German robotics conference. About 30,000 visitors from 90 countries came to Munich between June 10 and June 13 to see what more than 870 exhibitors from 41 countries had to show. Figure 1 The main element of the system is an SBC based on the highly communication-oriented PowerPC MPC8260 processor. The integrated Communication Processor Module (CPM) of the MPC8260 comes with three Fast Communications Controllers (FCCs), two Multichannel Controllers (MCCs) for Time Division Multiplexers 10

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CompactPCI and AdvancedTCA Systems

Highlights were the Titan KR1000 robot from KUKA, Germany (Figure 2, courtesy KUKA), which is the

Figure 2

world’s strongest robot. It is listed in the Guinness Book of World Records and it also got the “Red Dot” award for excellent industrial design, like several KUKA robots before. It lifts one ton at the end of a 3-meter arm, made up of six joints (axes) with a repeatability of 0.2 mm. The KR1000 is controlled by a ruggedized PC using a patented fail-safe combination of Windows (for display only) and a real-time operating system. The Titan was already shown at the Hannover Industrial Fair (see VME and Critical Systems, August 2008, (www.vmecritical.com). SMErobot is the name of a European project, started in 2005, to design and produce robots for Small and Medium-sized Enterprises (SMEs). First results were shown at Automatica in Munich. These robots, some just a third hand for the factory worker, are innovative, low cost, and easy to use. Established robot makers including KUKA, research institutes, universities, and small system integrators from all over Europe participate under the coordination of the Fraunhofer Institute IPA in Stuttgart, Germany. The Mechatronics Airport in hall B1 was using all kinds of experimental approaches to explain mechatronic thinking in an exciting way. For more information, contact Hermann at hstrass@opensystems-publishing.com.

CompactPCI and AdvancedTCA Systems

August 2008

CompactPCI and AdvancedTCA Systems

SOFTWARE CORNER

By Curt Schwaderer

CompactPCI and AdvancedTCA Systems

Switching at the speed of light

ultiprocessor, multinode, and multicore systems and the applications that drive them are at a technical crossroads. Increasing processor performance by riding Moore’s law isn’t yielding nearly what it was. Now the path to increased computing performance appears to lie with multicore processor technology and distributed computing. At the same time, services and data access through networks continues to increase at an alarming rate. For example, a recent IDC study reports that 40 percent of organizations see data warehouses growing at 50 percent annually. And 18 percent of organizations report their data warehouse size doubles annually. The key to moving past this crossroads lies in making the interconnect in multiprocessor or multinode systems more efficient and higher performing. This will enable multiple compute nodes to work together to achieve higher overall performance. In this month’s Software Corner column we’ll look at a new interconnect technology from Lightfleet Corporation called Corowave. Corowave uses a unique laser technology with special broadcast properties that promises to be the foundation for the interconnect of the future, enabling systems to achieve next-level performance through more efficient, scalable distribution of computations between nodes. Today’s interconnect issues The slower performance gains in processing power and doubling of data warehouse growth aren’t the only issues putting increased pressure on today’s point-topoint interconnect. Varying latency and bandwidth expansion problems arise when running broadcast-oriented applications. Traditional interconnects add latency between participating nodes that make multimedia applications such as video meetings difficult to use. And the large latencies are not the only issue. Differences in latency between nodes working on a common application can also lead to problems and inefficiencies for that application.

Bandwidth expansion is another big concern regarding capacity problems within the interconnect itself. When a videoconferencing application between multiple sites is run, each endpoint sends out a packet stream that then must be copied and sent to each of the other endpoints in the conference. These point-to-multipoint data streams are transmitted in the form of multicast packets. From the source endpoint’s perspective this is a single packet going to a single multicast address. The interconnect is responsible for expanding a multicast address packet into multiple packets that go out multiple ports to multiple destinations that make up the multicast group. This results in a one-packet-in, many-packets-out problem that can congest traditional methods of connecting multiple processors or nodes. What does all this mean? In a nutshell, we’re using a fundamentally point-to-point interconnect for complex applications that are becoming increasingly point-to-multipoint and perhaps should be multipoint-to-multipoint (or all-to-all). The Corowave switching interconnect solution provides the foundation for the development of a broadcast switching interconnect. The fundamental concept behind the technology is the use of lasers to send packets from a single source to multiple destinations simultaneously. This eliminates the latency problems discussed previously. How it works Figure 1 illustrates how the laser technology component works. A single transmitter beam is sent through a spreading lens. The broadcast light bounces off a mirror into a focusing lens destined for multiple receivers. So each node receives the data from a single source simultaneously using spreading and focusing lenses. The resulting transmission affords a flat and constant latency to each receiving node in the system. It’s also important to note that this laser broadcast technology is different from fiber initiatives being employed today. Fiber is a point-to-point transmission medium that uses laser light for data transmission. The Corowave technology uses light and lenses to achieve simultaneous broadcast interconnect. Software impact As with most disruptive technologies, it’s not enough to have the physical layer solution by itself. Disruptive technology requires a software architecture that takes advantage of

Figure 1 CompactPCI and AdvancedTCA Systems

August 2008

new capabilities yet can seamlessly interface to legacy software applications for graceful transition. Geoff Smith, Director of Software at Lightfleet, is chartered with that task. Geoff described the new software architecture as creating a distributed shared memory environment without the shared memory overhead. Nodes can subscribe to the shared memory groups (called wavegroups) they are interested in and ignore the rest. Each node is allocated a single wavegroup for transmitting its information to the other nodes in the system. The rest of the wavegroups are used as the receive areas from the other transmitting nodes in the system. This kind of software architecture nicely parallels the broadcast architecture of the hardware interconnect component.

Geoff Smith

You’ll notice in Figure 2 that there are three paths to the hardware. The first is through the block called “cwnet.” The “cwnet” driver acts just like an Ethernet driver that lives below a TCP/IP stack. This way, socket applications can operate over the Lightfleet interconnect without any changes. The “cwblk” component implements the block I/O path, the second path shown in Figure 2. This way, standard block I/O and/or file system applications have a standard way of communicating through the Lightfleet interconnect. Finally there is a direct path through the hardware. The application programming interface exposes the wavegroup concept to the application. This enables applications to be written that take full advantage of the highly parallel reader/writer environment provided by the hardware. The Figure 2 block labeled “cwfm” stands for “Corowave Fabric Manager.” This component performs the initialization, assignment, and shared memory initialization of all the wavegroups between the nodes in the system.

August 2008

CompactPCI and AdvancedTCA Systems

Chris Kruell

Lightfleet Corporation

Figure 2

Geoff described the fabric manager as performing the following functions:

n Fabric mastership and allocation – The fabric manager of one node is designated the “master” and coordinates the assignment of nodes to wavegroups. From there, the fabric manager arbitrates allocation of nodes to wavegroups. n Maintaining coherency – Locking wavegroups and updating the comings and goings of nodes in wavegroups. n Scheduling updates

Chris also spoke of other natural parallel processing applications like manufacturing and design simulations. “There are many types of simulations, such as computational fluid dynamics, that are natural parallel processing applications that have historically been limited by the interconnect,” he said. “By leveraging the Lightfleet Corowave technology into systems used for such simulations, the technology can enable all-to-all computational capability with fewer nodes, or more nodes can be added in the same amount of physical space.” Financial services applications such as those that drive stock and commodity trading are very much publish and subscribe model applications. These applications take in all kinds of data feeds, and the amount of computation they are doing on a specific node is quite complex. Financial trading applications are also extremely sensitive to latency. These applications need to distribute hundreds of thousands, if not millions, of messages per

Now you might remember some previous columns where I described Data Delivery Service (DDS), which employs a publish/ subscribe model for software applications. If you do, you’ll notice the nice parallels between DDS and the Corowave software architecture described here. The software architecture not only supports the technical benefits of the hardware interconnect, but also dovetails nicely with application programming initiatives like DDS. So companies leveraging DDS for their new applications will find a natural distributed programming and hardware interconnect environment within this new laser-based broadcast interconnect. Which markets will see the biggest impact Chris Kruell, Director of Corporate Communications for Lightfleet Corporation, said that while the implications of this technology are far-reaching, the immediate initiatives lie within the government and financial services sector. These sectors use algorithms that are very sensitive to congestion and latency. Implementing the algorithms also enables scaling by using more parallel components. Lightfleet’s Corowave technology allows for broadcast with flat latency, so these applications can be scaled for the parallelism the performance target requires. Specific algorithms Chris mentioned involve pattern matching. For example, taking various audio samples and matching these samples against a database of voice tracks, key phrases, or other properties. The more nodes involved in the algorithm, the faster the matching can be performed, which can sometimes be a matter of life and death. With the current interconnect environment, a distributed database with regular high-speed switching runs into congestion issues fairly quickly. The bandwidth expansion issues described earlier can also lead to network congestion, which limits the scalability of this kind of application. CompactPCI and AdvancedTCA Systems

August 2008

second while maintaining extra-low, predictable latency. The shared data interconnect of the Lightfleet Corowave technology and the flat latency property it affords are extremely attractive for these kinds of applications. Summary The industry has been moving toward using optics and optical communication for a while. Major system vendors have projects that use optics to communicate between processors. But these initiatives continue to look at point-to-point communications. But the majority of high-volume network applications are broadcast by nature. The Lightfleet Corowave broadcast interconnect technology, coupled with a software architecture that takes advantage of the technology, is complementary to the publish/ subscribe initiatives of many application developers and interoperates with legacy applications. It adds an important piece to the puzzle of advancing todayâ&#x20AC;&#x2122;s communication infrastructure to the next level of usefulness. For more information, contact Curt at cschwaderer@opensystems-publishing.com.

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CompactPCI and AdvancedTCA Systems

SPECIAL

g ADvANCEDMCS Tony reminds us of the objectives aimed for during PICMG’s development of the Advanced Mezzanine Card (AdvancedMC) specification and notes that specification’s place in endeavors including Long Term Evolution (LTE) and WiMAX.

By tony romero

uring the energy crisis of 1973, E.F. Schumacher, a British economist, published a collection of essays called “Small is Beautiful.” One of his arguments dealt with the false notion of how people measure their standard of living – assuming that people who consume more have a higher standard of living. He argued that since consumption is merely a means to well-being, the aim should be to maximize wellbeing with the minimum of consumption. With the current economic and energy situation similar to his day, this mantra holds true with embedded applications – maximize innovation with minimum costs and time-to-market. To meet this need, the small and multifaceted Advanced Mezzanine Cards, also known as AdvancedMC modules, provide standards-based, flexible, lowprofile, low-power, and cost-effective building blocks for numerous applications ranging from telecommunications to aerospace and defense to enterprise, industrial automation, and medical. AdvancedTCA was defined more than five years ago as a next-generation, high-performance telecommunication architecture for core and aggregation layer applications. It was clear that

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CompactPCI and AdvancedTCA Systems

designing large footprint, monolithic AdvancedTCA blades would never satisfy a wide breadth of applications. Hence, the AdvancedMC mezzanine standard was born to provide myriad mix-andmatch options that can hot swap into AdvancedTCA carrier boards. The PICMG AdvancedMC subcommittee developed the AdvancedMC specification with flexible and high-bandwidth serial interconnect options with throughputs as high as 12.5 Gbps per lane, standardsbased IPMI management, multiple form factors, and power requirements so that AdvancedMC modules could be characterized into numerous functions. Many of the first AdvancedMC modules were designed specifically for AdvancedTCA-based applications, including high-compute modules with high-bandwidth interconnects, highspeed, high-density I/O interface modules, and storage modules. AdvancedMCs are not limited to processor-based modules, although some AdvancedMCs are called PrAMCs, with the “Pr” standing for “processor.” PICMG also had the foresight to support not only AdvancedTCA blades, but also future architectures, an approach that enables AdvancedMCs to be plugged directly onto a backplane. It has been a little more than two years since PICMG members ratified the MicroTCA platform specification, and its low-cost, low-profile, flexible, and appliance-style architecture blasts the doors wide open for the type of applications that AdvancedMC modules can take on. MicroTCA’s size and costeffectiveness make it a natural fit for edge or access layer telecommunications applications, military applications where space and power are at a premium such as in an aircraft fuselage or in a Humvee, medical applications such as diagnostic and imaging equipment demanding highperformance and compute-dense solutions, or cost-effective industrial automation or enterprise-level appliances. See Figure 1 for examples of AdvancedMCs and the low-profile MicroTCA platform. Today AdvancedMC modules incorporate a wide array of functions to meet the growing demand for numerous embedded applications. The AdvancedMC ecosystem is strong and evolving, supported by a multitude of vendors, leading to new innovations and products at a fast rate.

Market forces at work

Many market forces are swelling the demand for AdvancedMCs, and MicroTCA has helped boost this demand substantially. Embedded designers want to add higher levels of innovation, reach more customers,

reduce the costs, and launch the product quickly. Their architectures are testing the boundaries in higher computing densities, higher bandwidth, lower power, and lower profiles. Listed here are a few examples.

4-G wireless network applications

Figure 1

Sprint is working to roll out a WiMAX service, while AT&T and Verizon are focused on Long Term Evolution (LTE), which is the successor to GSM/UTS. The base stations that support these networks need to be modular and scalable, high-bandwidth, low-profile (to fit small cabinets in remote locations), and cost-effective. In addition, an organization called Open Base Station Architecture Initiative (OBSAI, www.OBSAI.org) is focused on creating an open market for base stations to reduce development efforts and costs. With many network equipment providers implementing IP Multimedia Subsystems (IMS) for Voice over IP (VoIP), and video (IPTV), and many other services, OEMs have designed their products with AdvancedTCA and AdvancedMCs. These same vendors can develop scaled-down versions using MicroTCA for smaller deployments and continue to leverage the same AdvancedMC modules. In fact, the use of MicroTCA, which provides ample compute and networking capacity for many installations, has the potential to increase vastly the quantity of AdvancedMCs used in these types of applications.

Aerospace and defense

On the aerospace and defense side, two significant trends are generating demand. The first is the continuing migration to COTS standards-based embedded platforms. The main drivers are to reduce material and development costs while compressing the time needed to reach the market. The second trend is the U.S. Department of Defense (DoD) initiative called Network-Centric Operations (NCO) and the UK’s Network Enabled Capability (NEC), whose doctrine is to develop standard communication infrastructures to link the diverse set of intelligence gathering platforms, policy makers, commanders, war fighters, and support personnel for all the services. Improved information sharing will ensure a higher level of interoperability and situational awareness and enable highly synchronized missions. Initiatives include the DoD’s Global Information Grid (GIG), the U.S. Army’s Future Combat Systems (FCS), and the U.S. Navy’s Cooperative Engagement Capability (CEC). Some applications will require a fully ruggedized platform and benefit from the efforts underway within PICMG to specify a ruggedized version of MicroTCA. Other applications, housed in spaces with humans where neither extended temperatures and low air pressure nor extreme shock and vibration are factors, will be able to take advantage of the existing MicroTCA platforms and their low costs. Development budgets are getting tighter, performance and service expectations are increasing, densities are getting smaller, and consumers are demanding lower prices. In this atmosphere the drive to lower Total Cost of Ownership while offering innovative high-performance applications continues to push the envelope. The “Small is Beautiful” AdvancedMC ecosystem is there to help meet these needs. Tony Romero is a Senior Product Manager with Performance Technologies. Tony has worked extensively in system architecture and product development of platforms with CompactPCI packet-switched backplanes, both pre-PICMG 2.16 and PICMG 2.16. His responsibilities have included managing computing platform products that comprise chassis, midplanes, system management, power supplies, and cooling. Prior to working at Performance Technologies, Tony worked for Primus Knowledge Solutions and Dell Computer Corporation.

Performance Technologies • www.pt.com • tony.romero@pt.com CompactPCI and AdvancedTCA Systems

August 2008

SPECIAL

g ADvANCEDMCS

AdvancedMCs are finding their By venkataraman PraSannan

AdvancedMCs provide an effective means to implement standards-based modular entities, but they might not be a solution for everything. Determining the right fit requires an understanding of thermals, connectivity, usage models, and functional modularity.

AdvancedMCs are ideal for introducing modularity, flexibility, and scalability while addressing many telco requirements including hot swap. However, the requisite thermal and form factor specifications place limits on the computational and I/O configurations these mezzanine cards can implement. Understanding the AdvancedMC solution space, many system designers use modules for adjunct functionality, as evidenced by most AdvancedTCA implementations incorporating a module site, particularly compute blades. The market for modules is strong, creating demand for a large number of available products that support solutions for computing, CompactPCI and AdvancedTCA Systems

August 2008

storage, and I/O, just to name a few. In addition to telecom, there are AdvancedMC success stories in Military, Aerospace, and Government (MAG) and also in low-end gateway appliances such as WiMAX base stations and other access boxes. Access deployments exceed core and edge, so the sheer size of the opportunity bodes well for AdvancedMC. The excitement over AdvancedMC benefits, which include hot swap, fewer field replaceable units, and a Lego Block design approach, has some enthusiasts believing modules should be the staple for system designers. Designers need to consider these data flow and system requirements, however:

n 1 GbE versus 10 GbE fabric n Which processor architecture is used n Options for addressing security, line cards, and redundancy After considering the points just noted there will be circumstances where modules are too limiting. It’s essential to determine the right fit for AdvancedMCs in light of thermals, connectivity, usage models, and functional modularity requirements.

Thermal testing

Whether a designer is working with a quad module AdvancedTCA carrier blade or a compute blade with a single site, it’s necessary to evaluate the airflow. For example, a storage module with a hard disk drive mounted on top can block the air needed to cool downstream components. Thermal solutions require engineering and validation effort, and it’s not enough to just dial down the power or the number of AdvancedMC modules. Having conducted thermal modeling on our carrier card with four module sites, we published guidelines informing customers how to work with it. There are no universal thermal guidelines for AdvancedMC because environmental conditions are codependent on the type of modules employed and how they affect the airflow. System designers should be careful, because even if all the specs are met, it’s still possible to run into cooling issues. “One of the pain points for most people working in AdvancedTCA is cooling the blades. To address that, we’ve developed a set of interoperability requirements based around thermals and, of course, test procedures corresponding to those requirements,” says Todd Keaffaber, Communications Platforms Trade Association (CP-TA) Technical Work Group Chair. Module designers might not be able to max out the memory or use the highest performance CPU and still comply with the 40 W limit for a single-width board. As the silicon technology advances, shrinking die sizes and lowering thermals, AdvancedMCs will become increasingly more attractive. Progress is being made on performance-per-watt by devices such as the 2.2 W Intel Atom processor, which might be a good fit for AdvancedMC. Still, more help is needed from silicon makers to lower the power consumption of processors, memory, and physical layer chips.

Connectivity challenges

When it comes to I/O, it’s really about Ethernet, and the question is whether to deploy 1 GbE or 10 GbE. E1/T1 and STM-1 aren’t going away, but the dominance of Ethernet will continue for at least the next few years. Has any technology taken on Ethernet and won? AdvancedMC is a good fit for I/O functionality, such as generic E1/T1, but designers must match their I/O throughput with their processing capability. Placing multiple 1 GbE and 10 GbE interfaces requires a lot of processing horsepower, 22

August 2008

CompactPCI and AdvancedTCA Systems

and without a multicore processor and hardware acceleration the design could be unbalanced. We implemented an OCTEON CN58xx/CN38xx from Cavium, which can provide wirespeed packet processing for L2-L7 for the full line rate of 4 Gbps (4 x 1 GbE), as shown in Figure 1. As networks transition to 10 GbE, module designers anxiously await optimized 10GBASE-T physical layer components (PHYs) that consume less power than the 10 to 12 W solutions launched last year. More costly 10 GbE optical modules consume about 3 W, but they are not cost-effective for some applications. Fortunately, lower-cost copper-based solutions, which operate within the same power specifications as todayâ&#x20AC;&#x2122;s optical modules, are projected in the not too distant future.

Figure 1

For faster line rates, transceivers that support the new IEEE 802.3ap standard (also referred to as 10GBASE-KR) are available for running 10 Gbps serial data over backplane systems. Historically, Ethernet-based backplane interfaces were not standardized because Ethernet was designed for box interfaces. As a serial protocol, 802.3ap is simpler to route than Ethernet. Still, designers should be judicious when dealing with 10 Gbps, which might call for a beefed-up processor to handle the high throughput. AdvancedMC is a clear winner for access devices where modularity is a requirement, GbE performance is sufficient, and thereâ&#x20AC;&#x2122;s less emphasis on availability and redundancy. Performance bottlenecks are less common in systems with lower I/O and computing requirements, and OEMs can easily employ standards-based modules that provide I/O scalability and reduce development effort.

Isolate and protect

The modularity of AdvancedMCs supports some practical usage models. It provides a means for customers to protect their Intellectual Property (IP) by isolating functionality onto custom modules. For example, customers with proprietary accelerators or failover mechanisms can deploy their functionality without revealing crucial details to third parties. Customers can also create a family of products using module options, like offering storage modules with a range of capacity or computing modules with different levels of performance. MAG and some other verticals value standards-based modularity because it reduces certification and inventory costs. Modules can be upgraded as more processing power becomes available CompactPCI and AdvancedTCA Systems

August 2008

without having to upgrade and recertify the entire system. This is valuable because MAG design cycles are extremely long due to the need to address special requirements for security, ruggedization, sealed enclosures, and multiple radios. So CPU processing technology can be outmoded by the time the system actually starts to be deployed, and a modular approach allows the prime contractor to swap out the module when instructed to do so. Is AdvancedMC a commodity? Not exactly. Yes, AdvancedMCs offer more reuse and economies of scale for relatively generic functionality (general-purpose computing versus application-specific protocols). But because low value subsystems are typically commoditized, this doesn’t apply to many AdvancedMC modules that implement fairly sophisticated functionality. AdvancedMCs are used to standardize and reuse functionality, but it’s difficult to achieve the large volumes needed to make them commodities. So don’t expect to buy AdvancedMC modules at your neighborhood electronics store.

Functional modularity

It’s important to take a top-down approach when identifying functional modules. System designers should take a platform or system approach by first partitioning the architecture into efficient subsystems and then modularizing those subsystems. In this way, they will define the right modules without messing up the data flow and the architecture. When using a bottom-up approach – defining and piecing together a set of common modules – bottlenecks might arise from poorly provisioned modules lacking sufficient processing or I/O resources. In other words, designers shouldn’t skip performing thorough data throughput analysis when building complex equipment out of modules.

Cost/performance trends are key

AdvancedMC modules won’t solve every computing and I/O challenge, but they have their place, and developers are figuring out where they make the most sense. AdvancedMCs may play a key role in access equipment located at the network’s edge, where the scalability, size, and relatively low cost of MicroTCA are compelling. This growing access equipment market can deploy bare-bones, low-end MicroTCA systems, including chassis, backplane,

August 2008

CompactPCI and AdvancedTCA Systems

and virtual carrier card, for less than $500. Customers in other vertical markets, where cost, modularity, and standards-based solutions are highly valued, will pay close attention to the cost/performance trends of AdvancedMC-based solutions. Venkataraman Prasannan (VP) is the Senior Director of ATCA Product Line Management at RadiSys Corp. He has more than 15 years of telecom and networking experience in marketing products and business management. Venkataraman is a frequent speaker and author on computer/communications topics for the communications industry. Prior to joining RadiSys, Venkataraman was with Tektronix where he was involved in various video networking and telecom test products for SONET/SDH, ISDN, and DS1/DS3 products. He holds Masters degrees in Business and Engineering and has prior experience as a software engineer working on real-time instrumentation.

RadiSys Corporation www.radisys.com • vp@radisys.com

ProduCt GuIdE AdvancedMC

Shown here are recently introduced AdvancedMC modules and AdvancedMC development tools, controllers, connectors, and handles. An expanded guide is available at advancedmc-systems.com.

ATMIV

AMC controller designed for use in all aspects of telecom networks • The ATMIV includes support for ATM host termination, switching, and L2/L3/L4 or higher interworking between Gbe and ATM interfaces • With support for AAL2 and AAL5, the ATMIV has the ability for real-time voice and video over AAL2, as well as signaling and IP over AAL5 in 3G networks • Enables development flexibility in building next generation infrastructure and can be configured in many ways depending on customer specifications and preferred architecture • Application examples: 3G RNC, MSC, SGSN, and Node B; Voice over Packet; Video Streaming; Broadband Networks; ATM to IP gateways; Femtocell access controllers

HDCIII-SS7/ATM

Signaling controller • 8 software selectable trunks of full E1, T1, or J1 per card • 2, 4, and 8 trunk card options available • A combination of up to 248 MTP2 LSLs and 8 MTP2 HSLs • Simultaneous support for MTP2 LSLs, HSLs, and SS7 ATM AAL5 • Supports up to 256 channels of one or a combination of protocols on one card, including Fr,, HDLC, X25, LAPB/D/F/V5 • PMC, AMC, PCI/X, and PCIe board formats supported from a single driver

Adax Europe Ltd. www.adax.com

AMC-1000

AdvancedMC processor board • Core 2 Duo single-width, mid-, full-size • Intel 3100 chipset • Single channel PC3200 DDR2 REG/ECC SODIMM RAM • Supports a 2 GB single channel PC3200 DDR2 REG/ECC SODIMM RAM and AMC.1 Type 1/4 or 8x PCIe x1; AMC.2 Type E2 (GbE 2x at Port 0-1); AMC.3 Type S2 (SATA 2x at Port 2-3) interfaces • Fully implements the Advanced Mezzanine Card modular design concept and brings featurerich processor capabilities to an AdvancedMC carrier board and MicroTCA systems with the appropriate mechanical and electrical connections

ADLINK www.adlinktech.com

Core Duo/Core 2 Duo PrAMC

Highly integrated single-width, mid-size processor AMC • Supports Intel Core Duo/Core 2 Duo processor LV • Intel 3100 chipset 400/533 MHz FSB • Up to 2 GB DDRII 400 MHz SDRAM with ECC • One GbE (RJ-45), one USB 2.0 port, and one console port (mini-USB) to front panel • AMC connector routes dual GbE SerDes x2, SATA x2, USB x2, dual PCIe x4, or single PCIe x8 • Supports IPMI v1.5 and Serial-over-LAn function

Pentium M/Celeron M PrAMC

Highly integrated single-width, mid-size processor AMC • Supports Intel Pentium M processor Low Voltage or Celeron M processor Ultra Low Voltage • Intel 3100 chipset 400/533 MHz FSB • Up to 2 GB DDRII 400 MHz SDRAM with ECC • One GbE (rJ-45), one USB 2.0 port, and one console port (mini-USB) to front panel • AMC connector routes dual GbE SerDes (x2), SATA (x2), USB (x2), dual PCIe x4, or single PCIe x8 • Supports IPMI v1.5 and Serial-over-LAN function

Advantech www.advantech.com 26

August 2008

CompactPCI and AdvancedTCA Systems

ProduCt GuIdE AdvancedMC

V3020

Single-width half-height AMC supporting PCi express over the backplane • High-performance low-power connectivity and packet processing for applications running in AdvancedTCA or MicroTCA platforms

AdvancedIO Systems www.advancedio.com

A3803-AMC

Serial Attached SCSI (SAS) host board adapter • 3 GBps per port, 8 ports • Connects to both SAS and SATA hard disk drives • AMC.3 support • AMC.1 support for PCI Express (x1, x2, x4, or x8) • LSI Logic’s Fusion-MPT featuring more than 140,000 I/O per second • Aggreg2ate I/O port bandwidth of 24 Gbps and full duplex capability • Leverages existing SCSI infrastructure for investment protection and ease of migration • Allows point-to-point connection and higher availability with dual ported drives • Software support for all major operating systems including Windows, Linux, vxWorks, and LynxOS

A7404-AMC

4 channels of 4.25 Gbps Fibre Channel performance • Aggregate I/O port bandwidth of 17 Gbps matched to a 20 Gbps PCI Express interface • Four port, 4 Gbps Fibre Channel Host Bus Adapter (HBA) with support for initiator and target mode SCSI and IP protocol • AMC.0, AMC.1 compliant • Supports PCI Express x8 for up to 20 Gbps of aggregate data transfer • 4 independent channels at 4 Gbps each via SFP optical interface • Auto-negotiation support for 1, 2, and 4 Gbps links, fabric, point-to-point, and arbitrated loops • Can operate as an initiator (HBA) or as a target mode device allowing system builders to create RAID systems • Support for Windows, Linux, and vxWorks operating systems

Astek Corporation www.astekcorp.com

F1/GX-AMC

Hybrid TI TCI6487 DSP and Altera Stratix II GX reconfigurable AMC • High-performance multicore TI TMS320TCI6487 DSP: 3.0 GHz of total raw DSP processing power; 3 MB of on-chip L2 SRAM/cache; OBSAI and CPRI antenna interface support; specialized coprocessors • High-density Altera Stratix II GX FPGA implementing BittWare’s ATLAnTiS framework for control of i/O, routing, and processing: 15 full-duplex SerDes transceivers; up to 132,540 equivalent LEs; 252 embedded 18x18 multipliers (63 DSP blocks); 6.7 Mbits of RAM • IP available for: Serial RapidIO, PCI Express, Gbe, 10 Gbe/XAUi, CPri, and OBSAi

FPGA + DSP AMCs

Building blocks for communications and wireless applications • Combining the inherent flexibility of MicroTCA with a reconfigurable AMC and a variety of AMC front panel modules creates a system that can be easily upgraded or modified without initiating frequent redesigns, enabling system designers to extend product life cycles, enable hardware reuse, and decrease time-to-market

BittWare www.bittware.com

AMC Connector

AMC mezzanine compression-style connectors • Meets AMC specifications

Cinch Connectors, Inc. www.cinch.com CompactPCI and AdvancedTCA Systems

August 2008

ProduCt GuIdE AdvancedMC

AMC-D1F1-1200

A mid-size AdvancedMC module that offers a compact, high-performance DSP/FPGA signal processing solution for AdvancedTCA and MicroTCA systems • Texas Instruments TMS320C6455 digital signal processor running at 1.2 GHz and a Virtex-4 FX100 FPGA from Xilinx • Optimized for applications requiring high-end signal i/O /O bandwidth in a compact mid-height AMC form factor, such as wireless baseband, image processing, defense, and aerospace

AMC-6487C

An Advanced Mezzanine Card offering signal processing performance and bandwidth in a highly compact package • First single-width, full-height AdvancedMC card to be based on Texas instruments (Ti) multicore TMS320TCI6487 DSP • Suitable for wireless baseband and other processing-intensive applications such as WiMAX and Long Term evolution of 3GPP (LTE) • Three software programmable TCI6487 DSPs, each containing three high-performance C64x+ cores running at 1 GHz as well as 3 MB on-chip memory • Multicore DSP provides significantly more effective performance than Ti’s ’s single core TMS320C6455 device, and also affords a myriad of high-speed peripherals including Gbe, ddr2, antenna interface links (OBSAi/CPri), and two Serial rapidiO interfaces

CA-AMC-D4F1

A single-width AdvancedMC module designed for high-bandwidth, high-performance signal processing, providing DSP and FPGA processing and 10 Gbps Serial RapidIO • 4x Texas Instruments TMS320C6455 DSPs running at 1 GHz, each with 256 MB of x32 DDR2-500 SDRAM • Xilinx FX40, FX60, or FX100 FPGA • Separate 32-bit 125 MHz EMIF connection to each DSP plus I/O • Up to 18 MB of x36 NBTRAM • Serial RapidIO using onboard Tundra Tsi578 switch gives full 4x 10 Gbps bidirectional links between all processing elements plus two external links to AdvancedMC connector and one front panel port

CommAgility www.commagility.com

Card Edge Connectors for AMC and MCH

170-pin high-speed signal connector • Used for the interconnection of AMC and MCH modules into the backplane • Transfer high data rates of up to 12.5 Gbps • AMC backplane connector features press-fit eye of the needle contacts • Designed to allow up to 200 mating cycles • Integrated shield between the contact rows insures the connector performance in transferring high data rates

Conec Corporation www.conec.com

CEN-RL20-CAVM

20 Gbps programmable Cavium OCTEON/FPGA AMC • CEN-RL20 Cavium OCTEON daughter card • One (1) Cavium OCTEON 38XX or 58XX processor • 4 to 16 MIPS64 processors • 10 Gbps full-duplex application performance • Advanced security and intelligent application hardware acceleration including TCP, pattern matching, and compression/decompression • Memory: 2 GB DDR2 SDRAM (SODIMM); two (2) 36 MB RLDRAM, 64 MB flash • Front panel mini-USB serial console port • CEN-RL20 Xilinx Virtex-5 FPGA base card • One (1) Xilinx Virtex-5 LX110T FPGA for I/O, processing, and functional customization • Memory: Two (2) 18 Mb QDR memory (10 Gbps+ bandwidth), 64 MB DDR2 SDRAM, 64 MB flash • Custom, third-party, or off-the-shelf IP support • Support for one fabric and four telecom clocks • 20 Gbps wirespeed architecture • 20 Gbps packet streaming bandwidth via dual SPi4.2 interfaces between Cavium OCTeOn processor and Xilinx Virtex-5 FPGA • Front panel 10 Gbps CX-4 I/O connector to Xilinx Virtex-5 FPGA • Multiple 1 GbE, 10 GbE (XAUI), PCI Express, and Serial RapidIO backplane interfaces • Ports 0 & 1: 1 GbE • Ports 4-7, 8-11, 17-20: 10 GbE, PCIe, Serial RapidIO.

CorEdge Networks www.coredgenetworks.com 28

August 2008

CompactPCI and AdvancedTCA Systems

ProduCt GuIdE AdvancedMC

AM 100/20x

A Dual-Core Intel Xeon processor AdvancedMC module • Double-width, full-height AdvancedMC, 2.0 GHz or 1.66 GHz Dual-Core Xeon processor, up to 16 GB ECC SDRAM • Suitable for AdvancedTCA, MicroTCA, and proprietary platforms • Utilizes 64-bit Intel 3100 server chipset, interfacing up to 16 GB of soldered DDR2 ECC memory • x8 PCI Express fabric connection (AMC.1 Type 8) • IPMI 1.5 and hot-swap compliant to AMC.0 • Serial ATA150 (AMC.3 Type S2) and dual GbE channels (AMC.2 Type E2) • Front panel supports graphics interface, RS-232 port, two USB ports • Support for Linux, Windows 2000, Windows Server 2003, Windows XP, Windows XP Embedded, and QNX

CRT and DFP AMC

Single-width, full- or mid-height AdvancedMC, CrT, and dFP graphics adapter, option for 2.5" SATA Hard Disk Drive fitted • Suitable for AdvancedTCA, MicroTCA, and proprietary platforms • Analog CRT output, up to 1,280 x 1,024 pixels at 85 Hz refresh rate • Up to 24-bit color • Digital flat panel output, up to 1,280 x 1,024 pixels at 60 Hz refresh rate • Up to 24-bit color • SATA150 (AMC.3 Type S2, port 2) • x1 PCI Express fabric connection (AMC.1 Type 1, port 4) • IPMI 1.5 and hot-swap compliant with AMC.0 • Support for Linux, Windows 2000, Windows Server 2003, Windows XP, Windows XP Embedded, and QNX

Single/Dual HDD AMC

Double/single-width full- or mid-height AdvancedMC • Option of one or two 2.5" SATA hard disk or CompactFlash drives fitted • Suitable for AdvancedTCA, MicroTCA, and proprietary platforms • Compatible with RAID 0 and RAID 1 systems • Serial ATA150 (AMC.3 Type S2, ports 2 and 3) • IPMI 1.5 compliant to AMC.0

SY AMC/108 MicroTCA Development System

Preconfigured system for development or testing AdvancedMC modules or a target MicroTCA application • High-performance processor board based on a 2.16 GHz Intel Core 2 Duo processor, graphics, and storage as well as MCH, PSU, and cooling system

Concurrent Technologies, Inc. www.gocct.com

AMC Extender Card

The NAMC-EXT is an extender board for Advanced Mezzanine Cards (AMCs) • Support for all fabric interfaces • 3 clock lines • Management and payload power can be disconnected individually to enable power measurement

AMC Load Board

AdvancedMC full-size (single-width, full-height) load board dedicated for testing the cooling and power of MicroTCA systems • The board is hot-swap pluggable and has IPMI support • AdvancedMC load board with IPMI support • Configurable load from 0 W to 70 W in 7 steps • Configurable load by IPMI commands or push button the front panel • Onboard temperature sensors

Elma Electronic www.elma.com

AMC.0 B+ Connectors

170-circuit AdvancedMC connector solution for signal transmission up to 12.5 Gbps, with low cross talk • ept’s AMC.0 B+ connectors support PICMG AdvancedTCA industry specifications • The new press-fit design was optimized to provide significant cost and reliability advantages over other termination technologies • The press-fit process allows for the use of a standard “flat rock” insertion tool, requiring no custom tooling • The connector is also available without pegs for applications in which the AdvancedTCA guiding system is not desired • ept’s AMC.0 B+ connectors are RoHS compliant

ept, Inc. USA www.ept.de CompactPCI and AdvancedTCA Systems

August 2008

ProduCt GuIdE AdvancedMC

KSI8560 AMC Module

Flexible single-wide AdvancedMC (AMC) module that serves as a General Purpose Processor (GPP) AMC or a high-density WAN I/O AMC • As a GPP module, the KSi8560 gives networking equipment manufacturers a cost effective and powerful modular processing element with its onboard Freescale PowerQUICC III MPC8560 processor • With its add-on WAn interface, the KSi8560 8560 provides users a high-density i/O /O module ideal for data and signaling applications such as signaling gateways and softswitch signaling interface cards • Up to eight T1/E1/J1 interfaces are available • AMC (PICMG Advanced Mezzanine Card Base Specification) with up to 8 software selectable e1/T1/J1 1/T1/J1 interfaces • Freescale Semiconductor MPC8560 PowerQUICC III integrated communications processor • Up to 256 MB Double Data Rate (DDR) SDRAM with Error-Correcting Code (ECC) • 4 MB boot flash with redundancy, and up to 1 GB user flash • 16 MB Pseudo Static RAM (PSRAM) • One 100 and two 10/100/1000 Ethernet ports • PCI Express fat pipe • Optional front panel E1/T1/J1 interfaces

PrAMC-6210 Processor AMC Module

MPC8641d PowerPC based AdvancedMC Module is designed to the PiCMG AdvancedMC specification • Full and mid AdvancedMC form factor • Freescale MPC8641D PowerPC microprocessor • Dual-core processor capable of symmetric or asymmetric multiprocessing • Up to 2 GB Double Data Rate 2 (DDR2) SDRAM using dual memory controllers • Dual 4 MB NOR flash banks • 1 GB NAND flash • PCI Express and GbE fat pipes region interfaces

PrAMC-7210/7211 AMC

designed to the AdvancedMC spec, making it usable in AdvancedTCA and MicroTCA based applications requiring high availability, scalability, and low cost • Intel Core 2 Duo processor core with 4 MB L2 cache running at 1.5 GHz • 667 MHz front side bus, connecting processor and Intel 3100 chipset • Up to 4 GB DDR-400 memory with ECC support • MontaVista CGL or Wind River Pne Linux operating environment combined with Basic Blade Services software compliant to the SA Forum HPI layer • AdvancedMC front panel support for USB 2.0, Intel 82551 based 10/100 Fast Ethernet and serial console port • 2 MB of BIOS flash with boot failover support

SpiderWareM3 Intelligent Platform Management Tool

Platform management software designed for remote management, monitoring, and maintenance of multiple IPMI-compatible platforms • Automated acquisition and update of IPMI information from AMC modules and platforms • Intelligent alarm monitoring and prioritization • Fault and alarm alerts • Sensor threshold setting • Monitoring of CPU and memory usage • Temperature monitoring and threshold setting • Field-replaceable unit information • HPI and XML over TCP/IP interfaces • DHCP configuration management

Emerson Network Power Embedded Computing www.emersonnetworkpower.com/embeddedcomputing

August 2008

CompactPCI and AdvancedTCA Systems

ProduCt GuIdE AdvancedMC

XPedite5140

Freescale dual-Core MPC8641d Processor-based AMC module (AdvancedTCA/MicroTCA) with Dual-Bank DDR2 and Quad GbE • Freescale MPC8641D processor with dual e600 cores at 1.0 to 1.5 GHz each • Dual-bank DDR2-400/533/600 SDRAM, up to 4 GB (2 GB per bank) • AMC.1 x1/x2/x4/x8 PCI Express at 2.5 GBauds per lane • Quad GbE interfaces • 32-256 MB soldered NOR flash • 1-4 GB NAND flash • 1 MB SSRAM • Dual SATA II over AdvancedMC • VxWorks BSP • INTEGRITY BSP • QNX BSP • Linux LSP

XPedite6240

Dual Freescale MPC7448 PowerPC Processor AMC module with two GbE ports • Dual Freescale MPC7448 PowerPC processors running at up to 1.7 GHz • Supports up to 1 GB of DDR SDRAM • Supports up to 128 MB of soldered flash • Two GbE ports • Two RS-232 ports • Optional PCI Express AMC Transport • Optional Ethernet AMC Transport • Green Hills INTEGRITY • QNX Neutrino BSP with SMP support • Linux LSP with SMP support • VxWorks BSP with VxMP support

XPedite6244

Freescale MPC7448 PowerPC Processor AMC module with Gbe,, USB, and SATA support for MicroTCA/ AdvancedTCA systems • Freescale MPC7448 PowerPC processor running at up to 1.7 GHz • Complies to AMC.0 and MicroTCA.0 • Supports up to 1 GB of 400 MHz DDR SDRAM • Supports up to 64 MB of Soldered NOR Flash • Two SFP Ethernet ports • Two RS 232 ports • One USB port • Optional Ethernet AMC transport • Optional SATA transport • Green Hills INTEGRITY BSP, QNX Neutrino BSP, Linux LSP, VxWorks BSP

XPedite7040

intel Core duo or intel Core2 duo processor-based AMC module with Gbe,, USB, and SATA support (for AdvancedTCA and MicroTCA systems) • Intel 3100 chipset • Front-panel GbE • Front-panel RS-232 serial • Front-panel USB 2.0 • Complies with AMC.0 and MicroTCA.0 • AMC.1 x4 PCI Express Fat Pipe interface • AMC.2 dual GbE 1000BASE-BX interfaces • AMC.3 Dual SATA interfaces • Two PC3200 SO-RDIMMs, up to 8 GB • Up to 4 GB of NAND flash • Up to 4 MB of Firmware Hub (FWH) storage • AMI BIOS • Windows XP/Vista support Linux LSP • VxWorks BSP • QNX BSP

XPedite8040

P.A. Semi dual-Core PWrficient ficient PA6T-1682 Processor-Based AMC module (for AdvancedTCA and MicroTCA) • P.A. Semi PWRficient PA6T-1682 processor with dual PA6T Power Architecture cores at up to 2.0 GHz each • Dual front-panel GbE • Complies with AMC.0 and MicroTCA.0 (µTCA) • AMC.1 x8 PCI Express • AMC.2 10 GbE XAUI • AMC.2 GbE • Up to 4 GB of NAND flash • Two channels of DDR2 ECC SDRAM, up to 4 GB (2 GB each) • Up to 3 MB of LPC NOR flash • Front-panel Micro DB-9 RS-232 serial port • Linux LSP • VxWorks BSP • QNX BSP

XPort1040

Multiprotocol four port Serial AMC module based on the MPC8270 PowerQUICC II Series • PC8270 at up to 450 MHz with integrated PCI • Four SCCs support a broad range of serial protocols • Software configurable serial interface modes • Hot swap support • 32-256 MB SDRAM • 16-128 MB soldered flash • 512 KB socketed flash • Two RS-232 SMC ports • Front or rear I/O • VxWorks BSP • Linux LSP

Extreme Engineering Solutions www.xes-inc.com

August 2008

CompactPCI and AdvancedTCA Systems

ProduCt GuIdE AdvancedMC

Telum 210 SAS

An AdvancedMC supporting 2.5" onboard SAS hard disk drive storage with an LSi 1064e 1064 SAS controller designed for use with AdvancedTCA Single Board Computers (SBCs), carriers, and MicroTCA platforms • 4 SAS channels • AMC.1 and AMC.3 compliant • Supports up to 2 off-board SAS channels • Supports up to 8 PCI Express lanes at transfer rates of 2.5 Gbps per lane full duplex • SAS hard disk drive up to 146 GB capacity • Supports 1.5 and 3.0 Gbps SAS data transfers • IPMI v2.0 compliant MMC • Supports RAID with integrated striping and mirroring firmware; no software support required • Supports single and dual port SAS drives • Support for Solaris, Linux, Windows 2000, and Windows XP • Available with mid-size or full-size faceplates

Telum NPA-58x4

Intelligent high-performance 4-port GbE IP Packet Processor AdvancedMC • Designed for NEBS compliance • Meets requirements of demanding applications such as 3G/4G networks and IPTV • Enables secure, high-speed connectivity and complex security processing for content-aware applications that need wirespeed performance • 600 MHz Cavium OCTEON CN5850 multicore Secure Communications Processor • U to 4 Gbps line-speed packet processing for Layers 2-7 • Suitable for either AdvancedTCA or MicroTCA platforms • Single-width module available in either full-size or mid-size form factor • Can be optionally configured with either four front panel GbE ports supporting 1000BASe-T or 1000BASe-SX -SX via Small Form Factor Pluggable (SFP) transceivers or four ports of Gbe to the AdvancedMC Extended Options Region to support Rear Transition Module applications • With four GbE lanes to the Fat Pipes Region, the module is fully optimized to avoid potential bottlenecks

GE Fanuc Intelligent Platforms, Inc. www.gefanucembedded.com

AdvancedMC Plug Connector

injection molding tolerances are much tighter than what can be achieved in PCB production • Sophisticated design significantly reduces insertion and extraction forces • Consistent quality guarantees 200 mating cycles and long service life • Enables the use of PCBs outside of the 1.6 mm ±10% thickness range • Completely AMC.0 R2 spec. compliant • The plug connector is replaceable, potentially reducing board scrap costs

AdvancedMC Connector (B+ style)

AdvancedTCA - MicroTCA Connectors • Press-fit termination technology for connection reliability and assembly • Optimized footprint enables routing on low layer count; Fully compliant with PICMG AMC.0 and MicroTCA specs • Excellent routing capabilities with wide-routing channels and low cross talk • *con:card+ Design Enhancements • GuideSpring offsets PCB finger tolerance deviations by constantly pressing module against the opposite wall • GuideSpring secures module position against shocks and vibrations preventing loss of contact and surface water

Harting Technology Group www.harting.com

LeanSTOR

Directly incorporates NAND flash on AMC boards • Frees space to mount additional components onto AdvancedTCA system boards • Free up 7" x 3" (approx.) of space on the AdvancedTCA board for more components • Create a lighter product by eliminating the heavier solid state or hard drive case • Improve shock and vibration performance with flash components directly on board • Improve time to market with the completed solution, fully tested and ready for integration • Simplify your design and procurement efforts • Capacities available: 32 GB to 128 GB

Intelliam, Inc. www.intelliam.com CompactPCI and AdvancedTCA Systems

August 2008

ProduCt GuIdE AdvancedMC

iSPAN 36CA AMC

AdvancedMC, 4 port GbE packet processing • Delivers a high capacity line rate engine for use in AdvancedTCA, MicroTCA, and other form factors to address the needs of iPSeC acceleration, policy management and routing, and content inspection and management in the emerging 3G/4G, iMS, and voiP infrastructure application elements • AMC implementation of the Cavium Networks next generation 58xx multi-core Octeon network Services Processor family up to 600 MHz with support for 4 to 12 cores • 4x GbE interfaces on front panel • 4x GbE (AMC.2) + PCIe x1 (AMC.1) interfaces to the AdvancedMC connector with management support across either interface • Up to 1 Gb of DDR2 SDRAM and optional RLDRAM for pattern matching and fast lookup • Delivered with software solutions for applications such as iPSeC acceleration, TCP/iP, and SrTP TP ofload

Interphase www.interphase.com

Kaparel AdvancedMC

AdvancedMC modules are plugged directly into a backplane without a carrier card • MicroTCA stands out due to its very small design and its high scalability and reduced system costs • Compact design allows a variable installation in 300 mm deep, 482.6 mm (19" ) enclosures or instrument cases and wall-mounted enclosures • Complies with PICMG MicroTCA 0 R1.0 and AMC 0.R1.0 • System availability of at least 99.999% • Hot-swap compatible • 19" rack-mount, 482.6 mm, 3U, 200 mm deep • Stainless steel construction provides excellent corrosion resistance • Available with 14 slots • MCH and AdvancedMC and power modules plugged directly into the backplane • Compact design for variable installation • RoHS compliant • Slot cooling 20 to 80 W per module • Full range of faceplates and ﬁller panels • Air management panels and handles available

Kaparel www.kaparel.com

AM4100

1.5 GHz Dual Core Freescale PowerPC MPC8641D • Up to 2.3 MIPS/MHz computing performance and highest ethernet thernet bandwidth suitable for modular AdvancedTCA carriers or highly integrated, redundant MicroTCA multiprocessing systems • Integrated Altivec 128-bit Vector Processing Unit, which also replaces DSPs • Fits telecommunication equipment manufacturers and enterprise datacoms’ needs • Also suitable for medical, industrial imaging, and military/aerospace • Four GbE interfaces have advanced capabilities for TCP and UDP checksum acceleration • QoS support • Packet header manipulation • Able to sustain highest data rates • Suits applications with a demand for high data throughput • Vector processing unit minimizes cache pollution while processing massive amounts of data • Up to 2 GB of soldered DDR2-SDRAM • 4 MB bootable redundant NOR flash

AM4520 SAS AMC

Full-size/mid-size (AMC.0 Rev 2.0); AMC.3 compliant • Management through IPMI 1.5 implementation • Up to 146 GB capacity; 10,000 rpm, 4.1 ms average seek time; 8 MB cache buffer for improved performance • S.M.A.R.T. technology capable • Power On Hour (POH) IPMI counter support to diagnose disk usage in terms of number of hours

AM5010

AMC processor module • Double-width/mid-size • Low power budget with Intel Core2 Duo 1.5 GHz • Up to 4 GB SDRAM memory (soldered) with ECC running at 400 MHz • Graphics interface • Onboard SATA HDD optional • Up to 8 GB NAND flash memory via onboard USB 2.0 flash controller • Flexible Gigabit and PCI Express fabric interface • Monitoring features • PICMG AMC.0/.1/.2/.3 compliance • IPMI v1.5 support

Kontron www.kontron.com 34

August 2008

CompactPCI and AdvancedTCA Systems

ProduCt GuIdE AdvancedMC

LTC4223-1

Dual supply (12 V and 3.3 V) hot swap controller for Advanced Mezzanine Card • Allows safe insertion into live AdvancedMC or MicroTCA backplane • Controls 12 V Main and 3.3 V auxiliary supplies • Limits peak fault current in ≤1µs • High side current sense, adjustable current limit with circuit breaker • Integrated 0.3Ω AUX switch • LTC4223-1: Latch Off After Fault LTC4223-2: Automatic retry after fault • Thermal shutdown protection • 16-lead SSOP and 5 mm x 4 mm dFn packages

Linear Technology www.linear.com

Ensemble MPC-102

A dual-core 8641D AMC module • Offers Serial RapidIO or PCI Express connections to the carrier card, along with four Gbe connections (two to the panel and two to the AdvancedMC connector), a SATA port, and dual RS-232 connections • Up to 10 Gbps raw I/O bandwidth on Serial RapidIO • 1.3 GHz PowerPC • 2 GB DDR2 SDRAM • Ideal for networking applications that process radar or sonar data

Ensemble MPQ-101

Serial RapidIO PowerQUICC III AMC Module • Exceptionally powerful processing and Serial RapidIO connectivity • Onboard Freescale MPC8548E PowerQUICC III processor running at up to 1.3 GHz • Single-width, full-height AMC • Front-panel USB and GbE connector • IPMI controller, firmware, and IMPB links • Supports Linux

Ensemble MTI-104

Full-height AdvancedTCA AMC module designed for application development on four Texas instruments TCi6482 rapidiO dSPs • Application developers can optimize application code with the Quad TI DSP AMC module and get to market faster • Advanced performance for baseband development applications, with robust application development infrastructure • 4 TI RapidIO DSPs operating at 850 MHz core frequency • RapidIO and GbE interfaces, with 1x Serial RapidIO infrastructure to each DSP • 64 MB of DDRII memory at 500 MBps per DSP • IPMI management software

Ensemble MTI-203

rapidiO dSP/FPGA SP/FPGA signal and video processing AdvancedMC Card for developing and deploying LTe, WiMAX, next-generation video, or basestation applications • High-performance AMC for next-generation mobile broadband applications • Supports 20 MHz WiMAX multiantenna solutions on a single AMC • Combined DSP and FPGA technology for optimal application partitioning • Flexibility and value for LTE and WiMAX basestation developers • One Xilinx Virtex-4 FX100 FPGA with dual integrated Power Architecture cores, running at 400 MHz • Two 4x RapidIO fat pipes for data exchange • Two 1 GbE ports for configuration and control

Mercury Computer Systems Inc. www.mc.com CompactPCI and AdvancedTCA Systems

August 2008

ProduCt GuIdE AdvancedMC

Edge Connector

Meets MicroTCA requirements • Easy press-fit termination • Cost effective termitermi nal design • Excellent high-speed differential performance • Second source available • Product can be configured to serve many other high-speed interconnect needs

Molex www.molex.com

Gigabit Ethernet AdvancedMC

GbE AdvancedMC board with a native PCI Express design • Four GbE copper ports for use in a wide variety of next generation wireless and storage networking equipment • Single-width full height module, making it suitable for telecom equipment manufacturers to add multiple 10/100/1000 ethernet thernet ports to networking equipment that utilizes the new AdvancedMC form factor • OEMs can use the LAn AdvancedMC board in high-performance embedded systems according to MicroTCA specifications • AdvancedMC cards are switch fabric based, hot-swappable, and fully managed for use in carrier and enterprise-class applications • Designed to deliver full wire-speed performance on all four Gigabit ports simultaneously, the LAN AdvancedMC board is based on two Marvell Yukon 88E8062 GbE controllers • 88E8062 controller is based on Marvell’s Concurrent Data Streaming (CDS) architecture that utilizes a highly innovative scheme to reduce the impact of system and peripheral latencies on PCie throughput to enable superior data streaming and application performance

One Stop Systems www.onestopsystems.com

August 2008

CompactPCI and AdvancedTCA Systems

ProduCt GuIdE AdvancedMC

AMC111

High-performance computing solution for AdvancedTCA and MicroTCA systems • Single board compute module designed for high-performance embedded applications • 64-bit single-core AMD Turion 2.0 GHz processor • Mid-size, single compute module • 64-bit memory addressability to 4 GB • PC3200 DDR SDRAM with ECC • Supports both 32- and 64-bit operating systems: Linux x64, Windows XP x64, Solaris 9/10 x64 • Full compliance with AMC.0 R1.1 specifications

AMC121

High-performance Intel Core2 Duo computing solution for AdvancedTCA and MicroTCA systems • 64-bit Intel Core2 Duo Processor (1.5 GHz) single board compute module designed for high-performance embedembed ded applications • Mini-SD Site for onboard program and OS storage • Single-width, mid-size module • 2v GB PC2-3200 DDR2 DRAM with ECC • Supports both 32- and 64-bit operating systems: NexusWare CGL OS, Linux x64, Windows XP x64, Solaris 9/10 x64 • Full compliance with AMC.0 R2.0 specifications

AMC131

32-bit AMC compute module designed for high-performance embedded applications • Freescale™ Dual-Core 1 GHz MPC8641D PowerPC Processor • Mid-size, single compute module • High-performance computing solution for AdvancedTCA and MicroTCA systems • Up to 2 GB ECC DDR2 SDRAM • Four GbE interfaces • AMC .0, .1, and .2 compatible • MiniSD Site for Onboard Program and OS Storage • Supports Both 32- and 64-bit Operating Systems incluiding NexusWare CGL

AMC141

64-bit AMC compute module with the PA6T-1682 PowerPC processor designed for high-performance embedded applications • Single-width, mid-size compute module with PA6T-1682 PowerPC 2.0 GHz with 2 MB shared L2 cache • CompactFlash site for onboard program and OS storage • Up to 4 GB of DDR2 SDRAM with ECC w/PC2-5300 interface • Quad 1G or 2.5 G Ethernet • Dual 10G Ethernet • Supports both 32- and 64-bit versions of the nexusWare CGL OS and development environment

AMC335

Intelligent Synchronous WAN Communications Module • Multipurpose Intelligent Synchronous WAN Communications Module for AdvancedTCA and MicroTCA systems • Mid-size single AMC module • Full compliance with AMC.0 R2.0, AMC.1 R1.0, and AMC.2 R1.0 specifications • Four high-speed channels capable of sustaining 2 Mbps per port • Freescale MPC8270 PowerQUICC II Processor • 128 MB Dedicated Processor SDRAM Memory handles extensive onboard traffic and Protocol Requirements • 32 MB Application Flash • NexusWare WAN Protocol Software: Radar Receiver, TADIL-B, HDLC, X.25, Frame Relay, ASYNC • NexusWare CGL OS and Development Environment • Broad Operating System Support includes Solaris, Windows, and Linux

AMC590

Video/Storage AdvancedMC module with audio • Mid-size, single AdvancedMC form factor • Highperformance 2D, 3D, and multimedia video with 128 MB GDDR3 Memory and DAC speeds of 400 MHz • QXGA resolution up to 2048 x 1536 • HDMI Connection for 480p, 720p, and 1080i output • Video acceleration and dual-display support for VGA, HDMI, and DVI-D • Supports Standard SATA and SAS hard drives • 2.5-in. hard drive with 300+ GB capacity (based on market availability) • Compatible with RAID array applications • Dual-port access for storage (SAS mode only) • PCM and Dolby Digital 5.1 audio formats • Drivers available for 32- and 64-bit Operating Systems including: NexusWare CGL OS and Development environment, Linux x64, WindowsXP and Windows vista (32/64-bit support)

PMC531/532

Mid-size, single AdvancedMC form factor • High-performance 2D, 3D, and multimedia video with 128 MB GDDR3 Memory and DAC speeds of 400 MHz • QXGA resolution up to 2048 x 1536 • HDMI connection for 480p, 720p, and 1080i Output • Video Acceleration and Dual-Display Support for VGA, HDMI, and DVI-D • Supports standard SATA and SAS hard drives • 2.5-in. hard drive with 300+ GB capacity (based on market availability) • Compatible with RAID array applications • Dual-port access for storage (SAS Mode Only) • PCM and Dolby Digital 5.1 audio formats • Drivers Available for 32- and 64-bit Operating Systems including nexusWare CGL OS and development environment, Linux x64, Windows XP, and Windows vista (32/64-bit support)

Performance Technologies www.pt.com CompactPCI and AdvancedTCA Systems

August 2008

ProduCt GuIdE AdvancedMC

AMC

Advanced Mezzanine Cards • Phillips Components is able to help you with your custom and standard requirements

Phillips Components www.phillipscomponents.net

AMC-A2 PrAMC board

High performance hot-swappable AdvancedMC processor module conforms to PiCMG AMC.0 r2.0 • Supports AMD Athlon single- and dual-core processors with true multitasking for increased performance • SOCDIMM socket supports DDR2 667 MHz ECC memory up to 2 GB • Up to 8 GB optional onboard microDOC flash for local boot drive • Front panel interfaces - Two USB 2.0, one Serial • Pigeon Point module management • Extended availability assured

Pinnacle Data Systems, Inc. www.pinnacle.com

AMC7211

A suitable component for Gigabit line card solutions • Based on the Cavium OCTEON Plus multicore processor • Capable of meeting wirespeed packet processing for L2-L7 for the full line rate of 4 Gbps • AMC7211 is compliant with AMC.0, AMC.1, and AMC.2 with support for front or front i/O or rear i/O through build options

RadiSys Corporation www.radisys.com

AMC-62E

AMC.3 compliant disk drive module utilizing newly available extreme-environment SATA drives with enhanced thermal, shock and duty cycle characteristics • The module provides storage up to 80G, with temperature support of 0 ºC to +85 ºC, full (7 x 24) duty cycle and MTBF of 750,000 hours, combining the extended environmental requirements of neBS and AdvancedTCA chassis with the price/performance of SATA disk technology • Augments existing AdvancedMC disk offerings from SANBlaze, which include solid state disks, SATA disks, and SAS disks

SANBlaze www.sanblaze.com

IEA-R Handle

Robust die-cast latch • Intuitive inject/eject operation • Industry-leading ergonomic design • Push-button activation of micro-switch • Positive locking with audible feedback • ID labels for customization

Schroff www.schroff.us CompactPCI and AdvancedTCA Systems

August 2008

ProduCt GuIdE AdvancedMC

Flush Mount AdvancedMC Module Handle

Microswitch protection against short-circuits during modular board hot-swapping in network, telecom, and general computing applications • Minimizes protrusion on the front of the module faceplate • Satisfies all requirements of the PICMG AMC.0 R2.0 standard • Designed to align neatly with the faceplate for better appearance and to prevent potential snagging of cables in use

Southco www.southco.com

SurfRider/AMC

A roHS-compliant AdvancedMC dSP resource board, preintegrated with AdvancedTCA and MicroTCA chassis • Provides flexible yet heavy-duty multimedia processing capabilities • Complete media processing package for audio, video, modem, and fax • Flexible and scalable modular design supporting up to 8 TI C64x DSPs onboard • Carrier-grade, field-proven, and cost-effective • Built-in diagnostics provide easier troubleshooting and better application control • Can be provided as hardware-only solution for dSP-intensive applications

Surf Communication Solutions www.surf-com.com

TAMC100

A standard single-width mid-size or full-size AMC.1 (PCI Express) compliant carrier for one single-size IndustryPack (IP) module • AMC.1 type 1 interface • IPMI interface • 8/32 MHz IP interface, no DMA • Routing of all iP interrupts on PCie inTA/MSi, local interrupt status register • Self healing fuses and RF-filtering for the power supply of the IndustryPack slot • HD50 SCSI-2 type connectors and status LEDs in EMI front panel • Operating temperature -40 °C to +85 °C

TAMC863

A standard single-width/mid-height AMC.1 compliant module with four high-speed serial data communication channels • Synchronous/asynchronous serial interfaces implemented in FPGA logic • I/O access: front panel LEDs • Physical interface (individually programmable per channel): EIA-232, EIA-422, EIA-449, EIA-530, EIA-530A, V.35, V.36 and X.21 • Maximum data rate: 10 Mbps (synchronous), 2 Mbps (asynchronous), internal or external provided clock • EIA-232 up to 115.2 Kbps • Temperature range -40 °C to +85 °C

TAMC900

High-performance analog to digital converter AdvancedMC • Virtex-5 FPGA and high-speed onboard memory • Single-width, mid-height PICMG AMC.1 module; x8 PCI port (AMC.1 Type 8 compliant) • Virtex-5 LXT FPGA; 4 MB QDR-II SRAM • Analog-to-Digital Converter: 8x LTC2254 ADCs, 105 MSps, 14 bit • Signal Conditioning Adapter for flexible adoption to customer analog input requirements • 3 external clock inputs, 3 external trigger inputs • Operating temperature 0 °C to +55 °C

TEWS Technologies LLC www.tews.com 40

August 2008

CompactPCI and AdvancedTCA Systems

ProduCt GuIdE AdvancedMC

TPS2358/2359

Dual-slot controllers • Manage two 12 V rails and two 3.3 V rails for Advanced Mezzanine Cards in AdvancedTCA, MicroTCA, or custom systems • Hot swap, ORing, and status indicators for all four paths • Optional I C interface provides programmability and monitoring with the highest integration, flexibility, and performance in one small package • Full power control for two AdvancedMC modules • Independent 12 V current limit and fast trip • 12 V FET ORing for MicroTCA • Internal 3.3 V current limit and ORing • Power Good and fault reporting through I2C • 36-pin QFN package (TPS2359); 48-pin QFN package

Texas Instruments www.ti.com

AMC207

Dual-port 10BASE2 (with two additional 10/100 ports as media converter) AdvancedMC module • VadaTech offers this product in a single-width, mid-height form factor based on the AMC.1 specification (option for full-height design, see ordering options). The 10-BASE2 50 Ohm termination is set by a jumper on the board • AMC.1• Single-width, mid-height (Full-height option available) • Dual 10-Base2 Ethernet ports • Dual 10/100 Ethernet ports as media converter • PCIe x4 lanes • IPMI 2.0 compliant • RoHS compliant

AMC603

2.5 inch SATA HDDs in a single-width, full-height storage module in the Advanced Mezzanine Card (AMC) form factor based on the AMC.1 or AMC.3 specifications • The hard disk drives can support data transfer rates of over 150 MBps and provides up to two 200 GB of storage capacity (total of 400 GB) Suitable for adding high-capacity storage and can run as RAID zero (striping across the two drivers for increased space and performance) or RAID one (mirroring two drives for fault failure) • It can also run as two independent disks • Two 2.5 inch SATA HDDs available up to 400 GB (two disks) • Optional Solid State Disk (SSD) • AMC.1 or AMC.3 options • IPMI 2.0 compliant • RoHS compliant • Support for: Linux, Windows, Solaris and VxWorks

VadaTech Inc. www.vadatech.com

XS-AMC2

4 x OC-3/STM1 or 1 x OC-12/STM-4 • 4 x GbE • ATM AAL0, AAL1, AAL2 & AAL5, and POS • Automatic Protection Switching • WinPath2 Network Processor • Termination, switching, and interworking capabilities from any port to any port • Suited for applications such as wireless networking, Voice over Packet, DSLAM, and media signaling gateways • Wintegra’s WinPath2 Network Processor • Interface to handle both ATM and IP simultaneously • Onboard 24K MIPS processor can run advanced protocols (3GPP, SS7, ATM, VoIP) while the Network Processor handles all the data path • I/O ports are highly configurable and supports a mix of: OC-3/STM-1, OC-12/STM-4, 10BASe-T, 100BASe-TX, 100BASe-FX, 1000BASe-T, and 1000BASe-X • Compliant with PICMG AMC.0, AMC.1 and AMC.2, XS-AMC2 can be used on AdvancedTCA, MicroTCA, CompactTCA, PC, and proprietary platforms

Xaylo www.xalyo.com

Dual-Slot AMC Connector

Can stack two mid-size modules at 1U height • Yamaichi’s unique connector mounting technology, CMT (Compression Mount Technology), requires less PCB inner layers • CN074 AdvancedMC combines our CMT and patented flexible circuit board, YFLEX • This combination reduces insertion loss and cross talk to the absolute minimum • Our CN080 complies with the MicroTCA design, having 170 contacts on 0.75 mm pitch • The CN084 fits into the aggregated AMC backplane connectors with low insertion force and is available in various combinations

Yamaichi www.yeu.com CompactPCI and AdvancedTCA Systems

August 2008

ProduCt GuIdE AdvancedMC

Externally Adjustable AMC Baffle

Uses a faceplate mounted control knob to control airflow • With the external control knob, users can direct airflow away from blank boards and towards the active boards where the flow is most needed • FMC Meets the requirements of PMC module manufacturers who require a solution that is compatible with the AMC standard • The FMC merges AMC and PMC technologies to create a new, mechanically sound solution

Hybrid AMC Carrier

Suitable to support full-size legacy AMC modules • Working within the current AMC standard, XTech solutions engineers adapted their mid-size carrier technology to accommodate full-size configurations • Hybrid AMC carrier solution enables mid-size and full-size bays in a robust, extrusion-based carrier • Unlike other full-size carriers, the XTech Hybrid AMC carrier uses standardized, easy-to-use AdvancedTCA ejectors with mid-size bays on either end • XTech carriers come fully assembled and can be customized to your application requirements

XTech www.xtech-outside.com

ZLE60400

AdvancedMC optical extender card for Serial RapidIO • Zarlink PFOM Technology zLe60400 AMC optical extender card integrates two zL60304 four-port optical transceivers • Interoperability with RapidIO 25 Gbps total bandwidth • JTAG interface • MMC control for IMPI • 12 VDC power requirement, local power option for standalone operation • Half/full height, single-width size • AdvancedMC slot (180 mm x 74 mm), weighs just 425 g • Standard operating temperature of 0 °C to 50 °C, extended operating temperature available • Standards compliance with AMC.0, AMC.1 AMC.4 and RoHS-5 • ZL60304 Parallel Fiber Optic Module: Four transmit and four receive channels each operating at up to 3.125 Gbps for a maximum throughput of 12.5 Gbps per module;transmission range of 300 meters at 2.5 Gbps and 100 meters at 3.125 Gbps

Zarlink Semiconductor www.zarlink.com

To view more recently introduced AdvancedMC modules and AdvancedMC development tools, controllers, connectors, and handles, an expanded guide is available at advancedmc-systems.com. 42

August 2008

CompactPCI and AdvancedTCA Systems