w w w. s m a l l f o r m f a c t o r s . c o m w w w. p c10 4 o n l i n e . c o m
Volume 12 • Number 3
COLUMNS
FEATURES
8 PC/104 Embedded Consortium
Embedded community rallies at pc104.org By Dr. Paul Haris
10 Small Form Factor SIG Low power is the new black By Colin McCracken
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SPECIAL: Low-power portable devices It doesn’t look anything like the picture By Don Dingee
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12 Focus on Form Factors: Qseven
Small, efficient COMs remedy mobile medical electronics demands By Christine Van De Graaf, Kontron America
Low-power module standard poised to open new markets By Christian Eder
14 European Technology
Maneuvering in outer space and underwater
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PC/104-Plus: The brains behind the DARwIn humanoid robot By Karl Muecke and Dennis Hong, PhD, Virginia Tech RoMeLa
By Hermann Strass
46 Editor’s Insight
HARDWARE: PC/104: New frontiers
32
An inside look at PCI/104-Express By Jim Blazer, RTD Embedded Technologies
Everything’s coming up ‘small form factors’ By Chris A. Ciufo
DEPARTMENTS 38-40 Editor’s Choice Products By Don Dingee
42-45 New Products
EVENTS Intel Developer Forum August 19-21 • San Francisco, CA www.intel.com/idf
By Robin DiPerna
E-CASTS Techcast: Trends in Small Form Factor Computing
E-LETTER Summer: www.smallformfactors.com/eletter
UMPCs get a direct connection to users’ primary PCs By Alex Chow, PLX Technology
Portable fuel cell powers PC/104 platforms By Amar Ganwani and Ted Prescop, UltraCell
Archived at www.opensystems-publishing.com/ecast
On the cOver: Advances in processing technology like the new Intel Atom chip are achieving fast performance while conserving power, a major perk when it comes to designing mobile devices. Special Atom coverage starts on page 16.
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4 / Summer 2008 PC/104 and Small Form Factors
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6 / Summer 2008 PC/104 and Small Form Factors
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Embedded community rallies at pc104.org Today’s world is plagued by the compulsion to obtain short-term savings at the expense of long-term value. This often leads to solutions that look good at face value, but when you get down to the details, problems arise. This usually occurs only after the project is well under way and sunk costs are high. So what are OEMs to do? Today’s technologies are often complex and sometimes fleeting. To minimize risk, it is critical that project designers start with specifications that have undergone rigorous development and debate. This is where the PC/104 Embedded Consortium shines and why its PC/104, PC/104-Plus, PCI-104, EPIC, and EBX specifications have been so successful in withstanding the test of time. And with the newly pub published PCI/104-Express – which has as its backbone the PCI Express bus and spans over the 104, EPIC, and EBX form factors – current and future designers can continue to leverage the vast PC industry technology base. As with the Consortium’s other specifications, PCI/ 04-Express allows OEMs to standardize around one architecture that has all the necessary interchangeable components for both simple and complex systems now and in the future. PCI/104-Express was the result of 22 of the 68 (and growing) Consortium members coming together in the Technical Committee to create a solution for stackable PCI Express that not only addresses what is happening in the industry today but also what could happen tomorrow. This group consists of individuals and companies with inside knowledge of chip vendor roadmaps, along with expertise in manufacturing techniques, board layouts, and signal integrity and vast knowledge of embedded trends. (Editor’s note: See page 32 for an article on PCI/104-Express penned by one of these insiders.) But having technology is not enough. Designers must be able to easily find products and information about the technology. With that goal in mind, the Consortium completely restructured its website to give members, designers, and OEMs access to a wealth of information. The end result went live April 15 and has received rave reviews thus far. The new website is a portal to the expansive, unified PC/104 community. This website provides users with official up-to-date specifications and opportunities to develop first-order solutions to their requirements. All levels of the embedded community can now benefit from this easy-touse resource. Members can directly update product offering information. Component manufacturers can list products that target the PC/104 industry. Board-level manufacturers can obtain information on current specifications and see which components are being targeted for the long term. OEMs can find products and manufacturers based on the PC/104, EBX, and EPIC architectures. It’s a one-stop resource for the embedded market at all levels. 8 / Summer 2008 PC/104 and Small Form Factors
Already hundreds of product listings have been uploaded to the new website spanning more than 55 main and subcategories: Processors CPU or SBC, DSP, coprocessors Data acquisition Analog I/O, digital I/O Industrial I/O Load cell, motor controller, synchro, resolver, LVDT encoder, optocoupled I/O Bus interfaces Avionics bus interfaces Human interfaces Display interfaces, frame grabbers, video processors, MPEG, touch interfaces, keypad and keyboard interfaces, sound and speech Communications Modem or fax, network interfaces, serial I/O, USB, FireWire, cellular phone, GPS Mass storage Floppy and hard disk, PCMCIA, solid-state disk Power Power supply, uninterruptible power supply Enclosures Commercial, rugged, industrial Software Operating system and BIOS, drivers, software development tools Connectors Bus connectors, I/O connectors ICs and devices Processors, chipsets, disk storage Hardware and miscellaneous Prototyping modules and development stations, bus adapter boards and cables, other form factors with PC/104 interfaces And more are being added all the time. Need I say more? PC/104 Embedded Consortium 415-674-4504 info@pc104.org www.pc104.org
Low power is the new black More than just a common positioning phrase, “low power” appears to be the major thrust of silicon vendors in 2008 judging by the recent Embedded Systems Conference and Embedded World shows. New processors and chipsets are suddenly aligned with system requirements for performance and power across many applications. All that’s missing is a new generation of suitable board- and systemlevel specifications to facilitate the explosive growth of eco-friendly, off-the-shelf building blocks. Board vendors are rushing to take advantage of the brand new two-chip x86 processor solutions with an unprecedented combination of Gigahertz performance and sub 10 W power consumption. Application requirements in the low-power sector are so diverse that the debut of multiple form factors and expansion interfaces is inevitable, giving the appearance of fragmentation. Even before the low-power two-chip solutions, this “Wild West” frontier was saddled with at least 50 form factors, mostly single-vendor proprietary in nature. SFF-SIG is pioneering deeply into this lawless territory where conventional approaches to specifications development are not rapid enough to keep pace. SFF-SIG isn’t working on graphics-intensive applications like digital signage, gaming, imaging, or similar products – other form factors are well established, CPU cards don’t need to be particularly small, and heat removal of 30-60 W tends to be the limiting factor. Instead, SFF-SIG is working on specifications to simplify product development and production beginning with low-power x86 architecture processors. Leading processor and chipset manufacturers have achieved breakthrough two-chip solutions up to 1.6 GHz and 10 W total using tiny Ball Grid Array (BGA) packages. This comes at a time when three-chip solutions occupy twice as much board
space, not even including the thermal solutions, with power consumption starting at 20 W and rising sharply. The integrated I/O of the appealing twochip solutions (CPU + single-chip chipset) does not map well to existing form factors and buses, so it’s no wonder that new SBC and Computer-On-Module (COM) form factors are arriving at a fast rate of several per month. Whether designing a new application or simply trying to minimize system redesign due to end-of life notices, these low-power processor solutions are the best news since the 486 derivatives and Systems-on-Chip (SoCs) hit the market 10 years ago.
SFF-SIG is taking a broad platformbased approach to ensure that two-chip processor technology is easy to implement in many of the popular SBC, COM, and stackable formats.” SFF-SIG is taking a broad platform-based approach to ensure that two-chip processor technology is easy to implement in many of the popular SBC, COM, and stackable formats. For example, there are already two form factors – Pico-ITX and Express104 – that use the SUMIT bus interface SFF-SIG announced in April. SUMIT features a mix of high-speed signals such as PCI Express and USB 2.0 and low-speed easy connectivity buses like
10 / Summer 2008 PC/104 and Small Form Factors
Low Pin Count (LPC) bus, I2C/SMBus, and Serial Peripheral Interface (SPI). This breadth of functionality allows simple, low-cost I/O cards to be developed for virtually any low-power application. Also, a working group is now under way for the Qseven COM form factor, and additional reviewers are encouraged to join SFF-SIG to help complete the specification in a timely fashion. (Editor’s note: Qseven is featured in this issue’s Focus on Form Factors column on page 12.) Some might argue that competing ideologies about how to bring PCI Express off a board in a small, embeddable format signify that the “bus wars” are back. We don’t see it that way. The low-power end of the market needs broad platforms and choices for OEMs to achieve its outstanding growth potential. One thing is for certain: Reducing board sizes without addressing thermal solutions, enclosures, cabling, RAM, and solid-state storage is inadequate. Equipped with component, board, and system integration expertise, SFF-SIG’s 15 members representing Asia, Europe, and North America are working to define and promote specifications in the lowpower space. Some new specifications will appear to overlap and compete, as the group’s philosophy is to let the market decide what should prevail and what can coexist. We welcome your perspectives and contributions as well. Check in with us regularly here and online at our website to keep up with the latest developments. Small Form Factor SIG 408-480-7900 info@sff-sig.org www.sff-sig.org
70
Primary target applications: Mobile and ultramobile embedded computing applications
64 5
Heat transmission zone
Sponsors: congatec AG and SECO, with support from recently announced participating members Hectronic, MSC Vertriebs GmbH, IEI Technology, and Portwell Specification release: June 2008
Features: • 4x PCI Express x1 lanes • 2x SATA • 8x USB 2.0 • 2x ExpressCard • 1x SDIO • I2C bus • HD audio • 1x Gigabit Ethernet • 2x 24-bit LVDS (with VESA DisplayID flat-panel detection) • SDVO • DisplayPort • HDMI • Fan control • Battery management • Software API for embedded features
54
54.53
7.58
62.11
3 95
Power input: • +5 VDC • Optional +5 VDC standby for power management features
51
Mounting: • Computer-On-Module (COM); requires carrier board • All data and power signals available at Mobile PCI Express Module (MXM)-type edge connector
64 9
Dimensions: 70 mm x 70 mm
70
Specification information: Download specification for free at www.qseven-standard.org
Low-power module standard poised to open new markets By Christian Eder, congatec AG The latest processor products from chipset manufacturers, such as Intel’s Atom Z5xx series CPUs, show a strong trend toward low power consumption figures at high-performance computing levels. Existing Computer-On-Module (COM) standards like COM Express or ETX were defined four to eight years ago without consideration of this low-power trend. Where COM Express defines a maximum power consumption of 188 W, the Qseven specifications describe a 14 W maximum. Qseven cuts all legacy interfaces and focuses purely on a feature set that will be available for several years, calling for only differential serial interfaces with high bandwidth and good EMC behavior. Cooling concepts and features such as an I2C bus, watchdog timer, user storage area, flat-panel interface, and temperature control are present in the clearly defined Qseven specification. “We see Qseven as a great initiative to approach new applications in fanless, mobile, and battery-powered systems, which current solutions do not support very well,” says Wolfgang Eisenbarth, director of marketing at MSC. “This will open new markets with a strong industry commitment from the Qseven community.” “The Qseven platform will allow embedded designers to take advantage of the benefits of new UMPC platforms such as Intel’s Atom processor,” says Hectronic sales and marketing manager Patrik Björklund. “We see this new module standard as a perfect fit for applications where very small form factors, competitive cost, x86 performance, and ultra-low power consumption are important requirements.” Standard applications will include automation/DIN rail, automotive, and other ultra-mobile embedded computing systems.
12 / Summer 2008 PC/104 and Small Form Factors
Maneuvering in outer space and underwater Motion on Mars Maxon Motor, Switzerland, has delivered motors to nearly every space vehicle that has moved around on Mars and the moon. These motors are extremely small, lightweight, and power efficient because of their patented design, which is created through a patented production process. Maxon’s micromotors use an ironless rotor with rhombic winding. Located on space vehicles’ wheels and other mechanical parts, these motors do nothing unless told to move in a coordinated manner. The world’s leading high-precision drive systems supplier introduced the second generation of motor management and position control at the Hannover Industrial Fair earlier this April. The company makes motors from 1 W (0.25" diameter) to about 5 kW. Maxon’s EPOS controller family is optimized for smaller motors up to 700 W, which covers most applications. Small and mechanically robust, the DSPsupported EPOS2 controller (Figure 1) can be installed near the drive or motor in decentralized applications. A typical EPOS is 105 mm x 83 mm x 24 mm (4" x 3.5" x 1"). Communication with up to 127 nodes or axes can be achieved via the CAN fieldbus, which is efficient in real time and often used under different names (J1939, NMEA 2000, ISO 11783, 11898, and 11992, Smart Distributed System, and DeviceNet) in many passenger cars, trucks, and farm tractors worldwide.
Computing Design). EPOS controller SBCs control chain drive motors, robot arms, turrets, and other moving elements in real time. The Telerob is radio-controlled from a safe distance.
Figure 1
speed, and position control at installation time. The con roller also has gateways to USB and RS 232. Control cycle times are not a problem even for very small and highly dynamic motors. EPOS-controlled motors power the Telerob vehicle (Figure 2), a remotecontrolled robot from Telerob, Germany, that searches for explosives in buses, aircraft, or railway cars (see the Embedded Technology in Europe column in the November 2007 issue of Embedded
The EPOS controller is an SBC with local I/O (analog and digital) using a 32-bit DSP to process complex mathematical algorithms in real time. I/O ports are available potential-separated (optocoupled) for electrical isolation and protection against electromagnetic interference. In Interpolated Position Mode, EPOS2 can move synchronously and control coordinated multi-axis movements. The Regulated Tuning function helps optimize current, 14 / Summer 2008 PC/104 and Small Form Factors
Maxon has partnered with NASA since the first Mars landing in 1997. The Mars Pathfinder was fitted with 11 small Maxon motors. Spirit and Opportunity, NASA’s twin rovers that landed on Mars in January 2004, each have 39 Maxon motors. Maxon also supports Phoenix, the most recent Mars project that successfully landed on the Red Planet on May 25. The probe Phoenix Lander (Figure 3, courtesy of Corby Waste, Jet Propulsion Laboratory) will search for visible water and dig for traces of water with a robot shovel. A more than 2 meter long robot arm will penetrate the thin layer of dust and rubble to lay bare the Martian ice-rich soil. The researchers at the University of Neuchatel, Switzerland, will use a special microscope to analyze the soil samples and assess if primitive life forms can be found beneath Mars’ surface.
Figure 2
To compete in SAUC-E, AUVs (mini submarines) must operate autonomously without any control or communication to or from the outside world. Batteries must last for an extended period of time, and processors must handle complex algorithms and three video streams in real time, thus presenting heat dissipation difficulties. Pressure sensors and compass and inertial navigation systems control the underwater course. Teams that participate in this four-day event gain real-life engineering experience as they design and build vehicles capable of completing a series of underwater tasks without any human intervention. Points are awarded based on the final run, technical documentation, presentations, and innovation. The 2008 competition will be held this July in Brest, France, along the Atlantic Coast. For more information, contact Hermann at hstrass@opensystems-publishing.com. Figure 3
Mini submarine contest The Student Autonomous Underwater Challenge – Europe (SAUC-E) is a competition in which students from across Europe design and build Autonomous Underwater Vehicles (AUVs) to attempt navigation through an underwater assault course. The course varies from year to year but typically consists of gates, drop targets, surface zones, and many other obstacles. The competition aims to advance AUV technology and provides students the opportunity to gain industrial links. A student-led team from the University of Southampton, United Kingdom, triumphed at last year’s SAUC-E, winning both the overall competition and receiving an award for Innovation in Autonomy Two U.K. government organizations – the Defence Science Technology Laboratory and the Research Acquisition Organisation – hosted and sponsored the competition, respectively. Commercial sponsors included QinetiQ, Kontron Europe, and other companies. The victorious Southampton team used three watertight USB cameras, which deliver better accuracy than echolocation or other search systems, and the dual-core 986LCD-M/M-ITX, a 17 cm x 17 cm (approximately 7" x 7") Mini-ITX board from Kontron. Figure 4 shows a view inside the team’s AUV, courtesy of the University of Southampton.
Figure 4 PC/104 and Small Form Factors
Summer 2008 / 15
SPECIAL
Low-power portable devices
It doesn’t look anything like the picture By Don Dingee
I
ntel launched the Atom processor as a headliner at Intel Developer Forum Shanghai this April, including a brand spanking new branding campaign that in and of itself is significant – after all, it’s not every day that Intel launches a major processor brand.
others remarked, asserting that it would take years to crack into that market, if it is even possible. Speculation that Intel was after Apple’s future iPhone business was rampant. (Those odds got a lot slimmer with Apple’s recent purchase of P.A. Semi and the ARM intellectual capital).
The Intel brass has been discussing names like Menlow, Silverthorne, and Poulsbo for quite some time. With the announcement of the Atom brand for those projects, Intel officials went on stage and discussed their vision for Mobile Internet Devices (MIDs).
Hello? Over here ... it’s the embedded community. We build lots of things that could use a low-power Intel Architecture processor like Atom. We’ll have something to say before this is over.
And the trade press largely panned them. MIDs are “dreams,” one journalist commented. That’s a space owned by ARM,
Some folks at Intel absolutely understand the embedded play. They’ve developed a whole ecosystem of embedded vendors, who in turn have built a wide range of small form factor boards, many of which were showcased at the Embedded Systems
16 / Summer 2008 PC/104 and Small Form Factors
Conference Silicon Valley; even more will be ready by the next stop later this year in Boston. They also launched an initiative for automotive infotainment at Telematics Detroit this May. Intel made sure that Atom processors would be available with the extended seven-year life cycle from the first day of introduction, supporting two specific Stock Keeping Units (SKUs) for embedded designs. And the company is starting to support distributors – as I’m writing this, Avnet’s site says they have Z510s at $23 and Z530s at $80.50 with “call for lead time”; Arrow’s site lists both SKUs with a “call for quote.” (I’ve read the reports about the expected short supply of Atom processors in Q3. It’s
a short-term mix issue, if anything. Atom is fabbed on the same 45 nm process used for Penryn platforms, which helps with capacity and yield issues. And two more 45 nm fabs are coming online soon.) That said, why isn’t the embedded play for Atom processors making headlines? This reminds me of the scene in Iron Man where Tony Stark, tasked by his captors to build a Jericho missile, instead builds the prototype armor. During construction, the captors peek in via a surveillance camera, and after studying the work in progress and comparing it to a Jericho missile photo, one finally says, “It doesn’t look anything like the picture.” So, the brass said “MID,” and that’s what the media expected to see. But visualizing the exact outcome for Atom processors (or any architecture, for that matter) in the embedded space is difficult. There will be many relatively low-volume uses and probably not a single high-profile, huge volume platform. And there will be a lot of creative applications. It’s hard to say where Atoms will show up, but the answer is likely everywhere. Maybe inside a credit card swipe terminal. Or in a new hydrogen automotive fuel dispenser. Or an office photocopier Or a car dashboard. Or in portable medical gear. Most folks won’t even know there’s an Atom inside their device. They’ll know they get good performance, good battery life, good connectivity – whatever their measure of “good” is – and they won’t need to know much else. The current Menlow platform based on the Silverthorne processor might not make the most headlines. Perhaps the next-generation platform, Moorestown, with lower standby power and support for both video encoding and decoding, will get more ink. I don’t expect that Atom processors will suddenly dethrone ARM and other wellestablished embedded processor architectures. I also am not holding my breath on the MID vision. It may take years to develop, if at all. But I do believe the Atom launch is significant for the embedded space – and so do a lot of the folks I talk to. Yeah. It can fly. ➤ PC/104 and Small Form Factors
Summer 2008 / 17
SPECIAL
Small, efficient COMs remedy mobile medical electronics demands By Christine Van De Graaf
Low-power portable devices
While mobile medical devices are shrinking in size, the need to improve diagnostic capabilities is increasing the demand for performance. Small form factor specifications are rising to the challenge, as evidenced by the evolution of Computer-On-Module (COM) systems. Christine outlines a design approach that uses COM modules to help cut time to market.
M
edical OEMs face many challenges throughout product life cycles as they strive to meet performance and reliability requirements, pass certifications tests, and keep up with future needs. With processors evolving continually and new high-speed serial differential interfaces emerging in the market, embedded developers are now confronted with the problem of implementing these new capabilities while maintaining focus on their core businesses. Engineering a new SBC for each generation of processors and implementing faster buses are both expensive and time-consuming propositions. Embedded computing options include off-the-shelf motherboards, long-life industrial motherboards, and high-volume, application-specific custom boards. The COM approach offers some distinct advantages, such as high levels of processing performance and I/O bandwidth in a compact form factor. More significantly, COM modules can help medical systems designers achieve faster time to market, reduced development cost, minimized design risk, simplified future upgrade paths, scalability, and greater application longevity – all leading to the potential for increased market share. Design challenges for medical electronic equipment The majority of medical electronic equipment on the market today is designed to enhance patient care while lowering health-care costs. In medical imaging applications, such as X-ray, ultrasound, and MRI devices, the more images that doctors can see when examining a patient, the better equipped they are to properly diagnose and treat that patient.
18 / Summer 2008 PC/104 and Small Form Factors
The need for extremely high-resolution images that can be manipulated in real time has driven medical equipment developers to require better graphics, faster processing, and enhanced communications capabilities. In emergency medical and rescue services where every second counts, getting the right information at the right time is vital, so real-time data conversions are essential. In many embedded medical applications such as point-of-care terminals, size also matters. As the medical industry advances, the requirements will likely change repeatedly. However, these applications must be updated without having to start completely from scratch, so scalability and upgradeability must be built in.
development time needed to modify existing designs and expand product portfolios. This holds true particularly for embedded products that require longevity (5- to 10-year life cycles) as well as up-to-date processing performance and I/O capabilities. A big, bulky piece of equipment that takes a long time to develop, such as a full custom motherboard and enclosure, is not a viable option. Engineering, debugging, and supporting a new SBC for each generation of processors and faster buses can be extremely costly and time-consuming. In fact, a full custom design can average
“The COM approach can help medical equipment manufacturers meet new requirements by reducing the costs and development time needed to modify existing designs and expand product portfolios.�
Beyond performance and scalability needs, equipment designed for medical use must meet extended longevity requirements, with some applications expected to last as long as 10-15 years. As in all embedded applications, time to market is also a concern; thus, reducing implementation time plus the time allotted for FDA and other regulatory testing and approvals is also key a factor for consideration. Additionally, because budgets for these products are not unlimited, costs must be optimized whenever possible. COMs shorten design time and improve scalability Many of today’s most demanding embedded application segments benefit from high levels of processing performance and I/O bandwidth in extremely compact form factors. The COM approach puts an entire computer host on a small form factor module that can be mounted on carrier boards containing application-specific I/O and power circuitry. All generic PC functions, such as graphics, Ethernet, sound, integrated development environment, floppy disk drive, keyboard/ mouse, parallel, serial, USB ports, and PCI and ISA system buses are added via an off-the-shelf module. A customdesigned carrier board can then be added to address specific functionality. The carrier boards provide all the interface connectors to attach the system to peripherals such as hard disks, displays, and so on. The COM approach can help medical equipment manufacturers meet new requirements by reducing the costs and PC/104 and Small Form Factors
Summer 2008 / 19
SPECIAL
Low-power portable devices
as long as 24 weeks to complete. Figure 1 provides a comparison between full and semicustom design timelines.
The system was also fanless to increase reliability and lessen noise. This modular approach enabled the relatively small design team consisting of one electrical engineer, one systems engineer, and one mechanical engineer to finish the concept design and prototyping within 12 weeks, a significant improvement over the typical 6-9 month schedule. Completing new computing product designs in this context traditionally calls for two additional hardware engineers and one firmware programmer, which would have more than doubled the development time.
The following example of a clinical workstation illustrates the time-to-market and scalability benefits derived from using a COM implementation focused on the application-specific core. Typically, a clinical workstation comprises an IP65resistant 19" panel PC with a pen and touch interface for data entry and control in patient-monitoring or ICU stations. An ETX module was chosen for this application because of its ability to deliver the computer engine while the baseboard hosted power conditioning, battery backup (uninterruptible power supply function), and media storage. This design provided the flexibility to use a flash drive or hard disk. An RFID reader, touch controller, PCI expansion card socket, and ETX module pin connectors were designed to the baseboard. In this case, the workstation had a special feature – interconnects that allowed the system to communicate with a range of patient-monitoring systems.
After undergoing four performance upgrades, this particular workstation has not required a single modification to the baseboard. Instead of redesigning the entire motherboard, designers simply had to install the new ETX module to prepare the workstation for the approval process. This approach turned a multi-engineer project that would have taken several months to complete into a single-engineer, one-week project. I/O interfaces were not touched, thus reducing the risk of failing
EN 60601-1 Parts 1, 2, and 4 tests. It is estimated that using the ETX module cut the cost of retesting by 40 percent. Evolving standards Medical electronic equipment follows a path of continuous improvement not unlike that of consumer electronics, with increasing emphasis on size reduction and mobility. Driven by extended battery life requirements and users’ need to quickly find out the status of their health, key design considerations focus on low power consumption, high efficiency, and high precision for fast response time. The PICMG-defined COM Express standard is evolving to address this trend. Initially, COM Express was designed to accommodate the next generations of PCI Express (5 GHz) and Serial ATA (300 Mbps) interfaces, effectively doubling existing data rates to 160 Gbps and 1.2 GBps. Kontron’s ETXexpress family was created to integrate high-speed COMs with the PCI Express bus and PCI Express chipsets.
Full Custom Design = 24 Weeks
Schematics
Placement & Routing
Build Prototypes
6 weeks
6 weeks
2 weeks
Test & Validation 6 weeks
Embedded Module Semicustom Design = 12 Weeks Placement Build Schematics & Routing Prototypes 3 weeks
3 weeks
2 weeks
Test & Release 4 weeks
Figure 1
20 / Summer 2008 PC/104 and Small Form Factors
Design Touch-Up, Build Revised Units, Test & Release 4 weeks
In 2006, a compact footprint (95 mm x 95 mm) version of COM Express modules – the microETXexpress family – was developed. Recently, the nanoETXexpress family of COM Express compatible modules debuted with a footprint merely 39 percent of the original COM Express standard form factor module, as shown in Figure 2. Table 1 provides a comparison of these related COM Express modules. All three COMs share the same baseboard interface connector design and pinout and have overlapping mechanical assemblies. Standardized height and heat spreaders further facilitate interchangeability among modules from different manufacturers. Looking ahead: Ultra-small and ultra-portable Ultrasound exams are increasingly being conducted in nontraditional environments, such as doctors’ offices, ambulatory units,
and rural medical facilities. Medical equipment manufacturers are now pioneering the concept of “take-everywhere” diagnostic tools that enable medical practitioners to make faster and more accurate clinical decisions at the point of care. Pocket ultrasound systems and other ultra-portable point-of-care units demand low power and high performance in a very small form factor. Until recently, the convenience of portability required manufacturers to sacrifice image quality, limiting the scope and accuracy of medical diagnoses made with portable ultrasound equipment. In addition, few options among standardsbased embedded computing platforms adequately met the requirements for this field. Platforms were not small enough, lacked the right mix of integrated features, and/or did not provide a seamless migration for next-generation product revisions.
Figure 2 COM Express module
Footprint
Basic form factor (ETXexpress)
125 mm x 95 mm (4.9" x 3.7")
Extended form factor
155 mm x 110 mm (6.1" x 4.3")
microETXexpress
95 mm x 95 mm (3.7" x 3.7")
nanoETXexpress
55 mm x 84 mm (2.2" x 3.3") Table 1 PC/104 and Small Form Factors
Summer 2008 / 21
SPECIAL
Credit card-sized COM with Intel Atom inside The Kontron nanoETXexpress-SP offers processor performance from 1.1 GHz to 1.6 GHz, a highly integrated chipset, up to 533 MHz front side bus, and up to 1 GB DDR2 RAM on a credit card-sized footprint of 55 mm x 84 mm. An integrated graphics processor handles accelerated MPEG2 decoding and produces extremely clear images for applications that require extra graphics performance. Dual-channel 18/24-bit LVDS provides enhanced resolution. To meet current and future interface requirements, nanoETXexpress-SP supports one Gigabit Ethernet interface, a PCI Express x1 lane, and two Serial ATA (SATA) II ports. The two SATA interfaces are designed in accordance with the PICMG COM.0 specification to ensure that the COM connectors remain COM Express compatible. The module follows the PICMG COM Express standard and is 100 percent compatible with the COM.0 Type 1 connector with respect to pin-out definition and the physical connector positioning. However, advances in processing technology have dramatically improved the amount of performance that can be squeezed into a small form factor. For instance, the new Intel Atom processor Z5xx series was specifically developed to address very compact, performancehungry, thermally constrained embedded applications. The new 45 nm Intel Atom processor architecture achieves fast performance (with clock speeds between 1.1 GHz and 1.6 GHz) in a sub 5 W thermal power envelope. Power optimization on the front side bus (up to 533 MHz) provides fast data transfer. To address the need for a standardized, ultra-portable embedded computing platform, Kontron has introduced the nanoETXexpress-SP based on the Intel Atom processor (see sidebar). With these new technologies, applications that previously faced barriers because of size, performance issues, or power consumption limitations can now be developed using a standard COM. One possible future implementation is a mini ultrasound machine – as simple as a “brick” that fits into the pocket of a lab
coat – that wirelessly transmits images to a standard PC for remote diagnosis. An EMT could use this new device at the scene of an emergency, allowing the attending doctor to start the diagnosis and treatment process before the patient arrives at the ER. This application would provide a quick and convenient way to deliver care, with the ultimate goal of saving lives. ➤ Christine Van De Graaf is the product marketing manager for Kontron America’s Embedded Modules Division located in Northern California’s Silicon Valley. Christine has more than seven years of experience working in the embedded computing technology industry and holds an MBA in Marketing Management from California State University, East Bay, Hayward, California. Kontron America 858-677-0877 christine.vandegraaf@us.kontron.com www.kontron.com PC/104 and Small Form Factors
Summer 2008 / 23
HARDWARE
PC/104: New frontiers
PC/104-Plus : The brains behind the DARwIn humanoid robot By Karl Muecke and Dennis Hong, PhD
Powered by a PC/104-Plus board and National Instruments’ LabVIEW, Virginia Tech’s DARwIn is making huge strides in robotics – literally, with a bipedal soccer-playing machine. Karl and Dennis explore the dynamics of bipedal motion and describe the electromechanical platform used to control these robots’ movements.
T
he Dynamic Anthropomorphic Robot with Intelligence (DARwIn) series is a family of humanoid robots capable of bipedal walking and performing human-like motions. Developed at the Robotics & Mechanisms Laboratory (RoMeLa) at Virginia Tech, DARwIn is a research platform for studying robot locomotion that served as the base platform for Virginia Tech’s first entry to the humanoid division of RoboCup 2007, an international autonomous robot soccer competition[1].
The 600 mm tall, 4 kg robot (the latest version of DARwIn) has 21 degrees of freedom with each joint actuated by a coreless DC motor via distributed control with controllable compliance. Using a computer vision system on the head, Inertial Measurement Unit (IMU) in the torso, and multiple force sensors on the foot, DARwIn can implement humanlike gaits while navigating obstacles and will eventually be able to traverse uneven terrain while implementing complex behaviors such as playing soccer.
26 / Summer 2008 PC/104 and Small Form Factors
Static versus dynamic gaits With a few exceptions, such as Honda ASIMO, Sony QRIO, and KAIST HUBO, most legged robots today walk using what is called the static stability criterion. The static stability criterion is an approach to prevent the robot from falling down by keeping its center of mass over the support polygon by adjusting the position of its links and pose of its body very slowly to minimize dynamic effects[2]. Thus, at any given instant in the walk, the robot could “pause” and not fall over.
Static stability walking is generally energy inefficient because the robot must constantly adjust its pose in such a way as to keep its center of mass over its support polygon, which generally requires large torques at the joint actuators, similar to a human standing still with one foot off the ground and the knee of the other leg bent. Humans naturally walk dynamically with their center of mass almost always outside the support polygon. Thus, human walking can be considered as a cycle of continuously falling and catching the fall: an exchange of potential energy and kinetic energy of the system, like the motion of a pendulum. We fall forward and catch ourselves with our swinging foot while continuing to walk forward. This falling motion allows our center of mass to continually move forward, not expending energy to stop the momentum. The lowered potential energy from this forward motion is then increased again by the lifting motion of the supporting leg.
at a single point, making it equivalent to a ball and socket joint (Figure 1). Not only does this make the kinematic configuration closer to a human’s, but it also simplifies the mathematics involved in controlling and creating the robot’s motion. DARwIn has 21 degrees of freedom (6 in each leg, 4 in each arm, 1 in the waist), 4 force sensors on each foot, a 3-axis rate gyro, a 3-axis accelerometer, and space to house a computer and batteries for powering the Robotis’ Dynamixel DX-117 motors, Flexiforce sensors, and computing equipment. The motors operate on a serial RS-485 network, allowing the
Figure 1
Dynamic stability is commonly measured using the Zero Moment Point (ZMP), which is defined as “the point where the influence of all forces acting on the mechanism can be replaced by one single force” without a moment term[3]. If this point remains in the support polygon then the robot can apply some force or torque to the ground, which in turn means the robot can have some control over its motion (the system). Once the ZMP moves to the edge of the foot, the robot is unstable and cannot recover without extending the support polygon (planting another foot or arm). Kinematically correct Parameterized gaits can be optimized using the ZMP as a stability criterion. Stable hyperbolic gaits can be generated by solving the ZMP equation for a path of the center of mass. Additionally, the ZMP can be measured directly or estimated during walking to give the robot feedback to correct and control walking. DARwIn is developed and being used for research on such dynamic gaits and control strategies for stability[2,4]. DARwIn’s primary joints are kinematically equivalent to human joints. Humans have ball and socket joints at the shoulders and hips, allowing three axes of rotation about a single point. Though DARwIn does not have a ball and socket joint, it achieves the same kinematics with three motors’ axes of rotation intersecting PC/104 and Small Form Factors
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HARDWARE motors to be daisy-chained together. Each motor has its own built-in potentiometer and position feedback controller, creating distributed control. DARwIn II kicks In addition to the mechanical design improvements over DARwIn I, DARwIn II has added intelligence that allows it to perform higher-level tasks, like playing soccer autonomously. DARwIn II’s electronics provide power management, a computing architecture, and a sensing scheme to gather information on salient environmental features. Two 8.2 V (nominal) lithium polymer batteries power DARwIn. The batteries are usually attached to the lower body (legs or feet) to keep the robot’s center of gravity below its waist. These batteries provide 2.1 Ah, which gives DARwIn a little more than 15 minutes of runtime. The power circuit provides 3.3 V, 5 V, and 12 V for the various digital electronics within DARwIn. However, the joint actuators are run directly off battery power,
PC/104: New frontiers which drops from 16.4 V to 14.8 V during runtime. In addition to providing power to DARwIn’s main systems, the power electronics allow for an external power connection and a seamless switch between power sources. Additionally, this circuit prevents reverse polarity, overvoltage, overcurrent, and undervoltage conditions from damaging the computing, sensing, and actuation components. DARwIn’s computing architecture is set up to use a centralized control scheme, which is run on an Arbor Em104P-i7013 PC/104-Plus computer (Figure 2) with a 1.4 GHz Pentium M processor, 1 GB of RAM, CompactFlash drive for storage, IEEE 1394 card, serial communication, USB, Ethernet, and IEEE 802.11 for wireless communication. DARwIn also has two IEEE 1394 (FireWire) cameras and a 6-axis rate gyro/ accelerometer (IMU) for vision and local localization. The cameras capture 15 frames per second (fps) at 640 x 480 resolution and 30 fps at 320 x 240 resolution RGB.
28 / Summer 2008 PC/104 and Small Form Factors
Figure 2
The cameras are attached to a pan and tilt unit, which allows the robot to look at its surroundings. Two lithium polymer batteries in the feet allow the robot to be powered autonomously. Software for reactive-based control For higher-level behaviors such as playing autonomous soccer, DARwIn uses a reactive behavior-based control architecture programmed using LabVIEW Real-Time. Reactive-based control has the advantage of being simple and robust. Figure 3 shows the flow diagram of the entire control algorithm used for RoboCup 2007. The sensor
data is processed to meaningful information, which gives the robot ball position, goal position, opponent positions, and orientation. The behavior modules use this information to dictate their respective actions. The motion control module uses orientation information to correct and stabilize the bipedal walking gait. Each behavior module’s result is sent to the integrator, which decides the most appropriate behavior to implement in a given situation. For example, three behaviors may be “kick the ball,” “reposition,” and “avoid obstacles.” If there are no obstacles (or opponent robots) nearby, the integrator will more likely choose to reposition the robot for a better kick. However, if an opponent is nearby, the integrator will “skip” repositioning and move straight to kicking the ball. Once the integrator decides what the robot should do, the result is sent to the motion generator as a team message for other teammates to read in order to coordinate team play. The motion generator creates the necessary motion for the motion control based on the integrator’s result.
Sensors
Perception
Command/Behavior
Integrator
Motion generator
Motion control
Team message
Web host
Probed data
Operational Control Unit (OCU) Figure 3
PC/104 and Small Form Factors
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HARDWARE
PC/104: New frontiers
Next up: DARwIn III DARwIn III looks to further improve the successful designs of the previous versions. Because the robot needs finer control of its walking gaits and increased processing power for a robust vision system, an ARM9 microcontroller will be introduced in DARwIn III’s design to handle all aspects of gait generation, leaving the PC/104-Plus computer to run the behavior and vision routines.
“To meet the
model allows for planning, which reactive behavior does not, and leads to more efficient behaviors. To meet the modeling demand, the PC/104-Plus board will be upgraded to a Core 2 Duo-based board running at approximately 2 GHz, allowing RoMeLa team members to finish developing their vision – behavior and walking gate algorithms on a computing platform running LabVIEW Real-Time. Going farther with FPGAs The final implementation of DARwIn’s electronics package calls for a large reduction in weight, power consumption, and size while increasing performance. Several improvements are planned.
modeling demand, the PC/104-Plus board
First, the PC/104-Plus Core 2 Duo will be replaced by the old PC/104-Plus 1.4 GHz Pentium M to save battery power To boost performance, a new set of FPGAs will be added for each system, such as behavior and vision This will allow mul multiple systems, such as walking, vision, and behaviors o be more complex and run simultaneously on their own proces processors without impinging on each other’s operation. More importantly, DARwIn’s reaction time to an ever-changing envi environment will decrease as a result of the parallel architecture.
will be upgraded to a Core 2 Duo-based board running at approximately 2 GHz, allowing RoMeLa team members to finish developing their vision ...” Gait commands to the microcontroller will tell the robot to move in a specific way (direction, speed, gait type, pose, and so on). The PC/104-Plus board and the microcontroller communicate with one another over an RS-232 network, with the microcontroller communicating over an RS-485 network with the Robotis Dynamixel motors. DARwIn III also will use a world model to dictate its behavior. A world model is a completely known virtual model of the environment with the states of the model updated from sensor inputs. A world
In addition, the specific I/O required by each system will be on the FPGAs, eliminating the need to add I/O boards present in DARwIn III’s larger computing package. The walking algorithms running on a microcontroller could then be instantiated on an FPGA and control custom joint actuators instead of the Robotis Dynamixel motors. Alternate joint actuators will be used because the controller within the motors is Robotis’ intellectual property, and the ability to design the motors’ controller is becoming a necessity. Finally, all systems will be connected to deterministic buses so the delay caused by information transfer is known. The current setup in DARwIn III does not use feedback from the Dynamixel motors because the proprietary code shares information
in a delayed fashion on a nondeterministic, polling architecture bus. Using the team’s own joint actuators can subvert many of these problems and allow a deterministic bus such as EtherCAT to be implemented. Without such a bus, large latencies and indeterminism will make it very difficult to implement active realtime controllers. ➤ Karl Muecke is a PhD candidate at Virginia Tech in Blacksburg, Virginia, and the lead engineer on the DARwIn project. Dennis Hong is Assistant Professor of Mechanical Engineering and director of RoMeLa at Virginia Tech. He holds a PhD and MS from Purdue University and a BS from the University of Wisconsin-Madison. Virginia Tech RoMeLa 540-231-7195 kmuecke@vt.edu dhong@vt.edu www.me.vt.edu/romela/ References: [1] Hong, D. W., “Biologically Inspired Locomotion Strategies: Novel Ground Mobile Robots at RoMeLa,” The 3rd International Conference on Ubiquitous Robots and Ambient Intelligence (URAI 2006), Seoul, S. Korea, October 15-17, 2006. [2] J. Kim, “On the Stable Dynamic Walking of Biped Humanoid Robots,” Korea Advanced Institute of Science and Technology, Daejeon, South Korea, 2006. [3] Vukobratovic, Miomir, “Zero-moment Point – Thirty Five Years of its Life,” Int. Journal of Humanoid Robotics, Vol. 1, No. 1, 2004. [4] Q. Huang, K. Yokoi, S. Kajita, et al, “Planning Walking Patterns for a Biped Robot,” IEEE Transactions on Robotics and Automation, Vol. 17, No. 3, June 2001, pp. 280-289.
It sHoots, It scoREs Check out a DARwIn robot in action at: www.me.vt.edu/Robocup/Site/Media.html 30 / Summer 2008 PC/104 and Small Form Factors
HARDWARE
PC/104: New frontiers
An inside look at PCI/104-Express By Jim Blazer
The PC/104 Embedded Consortium recently announced its latest specification, PCI/104-Express. In this expanded view, which amounts to a primer on the specification, one of the creators explains the thinking behind it and illustrates some of the finer details, such as stacking and PCI Express (PCIe) routing.
T
he PCI/104-Express specification establishes a standard method for using the high-speed PCI Express bus in embedded applications. It was developed by the PC/104 Embedded Consortium and adopted by member vote this March. The PC/104 Embedded Consortium chose PCI Express because of its desktop/laptop PC market adoption, performance, scalability, and growing silicon availability worldwide. It provides a new high-performance physical interface while retaining software compatibility with existing PCI infrastructure. Incorporating the PCI Express bus within the industry-proven PC/104 architecture provides embedded applications many advantages, including fast data transfer, low cost because of PC/104’s unique selfstacking bus, high reliability because of PC/104’s inherent ruggedness, and longterm sustainability. Figure 1 shows the layout, and Figure 2 shows a board using PCI/104-Express. PCI and PCI Express The PCI bus has been the standard bus in desktop PCs for nearly 20 years. In PC/104-Plus and PCI-104, it is a 32-bit,
PCI Connector
PCI/104-Express Stackable PCIe Connector
Figure 1
it is point-to-point, PCI Express can transmit and receive data simultaneously from any or all devices. Understanding lanes and links: x1, x4, x8, and x16 A PCI Express lane is a transmit differential pair and a receive differential pair connection between two devices. A PCI Express link is one or more lanes and a clock differential pair. Therefore, a x1 (read as “by 1”) link has one transmit/ receive lane and one clock differential pair. Likewise, a x4 link has four transmit/ receive lanes and one clock differential pair. This continues logically for x8 and
33 MHz synchronous parallel bus. The new connectors in desktop PCs are PCI Express. PCI Express is similar to PCI from the software view but much different in hardware. It is a point-to-point, high-speed, differential serial bus composed of lanes and links. PCI Express uses a packet-based model similar to Ethernet, but Gen 1 PCI Express runs at 2.5 Gbps per lane per direction. Because
32 / Summer 2008 PC/104 and Small Form Factors
Figure 2
x16 links, each having 8 or 16 transmit/ receive lanes and one clock differential pair. Table 1 shows the bandwidth for various link configurations. Implementing PCI Express PCI/104-Express add-in cards are identified by link size. The specification supports four x1 links and one x16 link. Users can place any four x1 cards on the CPU in any order and all of them will work. Each uses its own PCI Express link. Several choices exist if PCI cards are available to use in the system. One option is to stack CPU, PCI/104-Express, and then PCI cards being careful not to exceed the PCI specification limits. Users also can stack the PCI and PCI Express card on opposite sides of the CPU; for example, they can stack PCI Express cards below the CPU and PCI cards above the CPU. Additionally, if a x1 link card uses a PCI Express switch, which is similar in concept to an Ethernet switch, it can replace the link on the bus and share the bandwidth with another x1 card. This capability means that the number of addin cards will not be the limiting factor for PCI/104-Express systems.
Technology
Bandwidth (MBps)
Bandwidth relative to 32-bit, 33 MHz PCI
32-bit, 33 MHz PCI-104
132
1
PCIe x1 link
500
3.8
PCIe x4 link
2,000
15
PCIe x8 link
4,000
30
PCIe x16 link PCI/104-Express Four x1 and one x16 links
8,000
61
10,000
76 Table 1
switch on the x16 link can replace all four x1 links, break the x16 into two x4 or two x8, use x16 onboard and replace
the x16 link on the bus, and/or create a PCI-104 PCI bus. The switch can do any of these things individually or all of them.
Taking advantage of the x16 link The x16 link has options that depend on the CPU and chipset. Users can employ the x16 link as a x16 PCI Express. The most popular use for a x16 link is in graphics cards, but watch for 10 GbE, high-end DSP, frame grabber, and FPGA cards. Xilinx supports a x1 PCI Express core in the Spartan III FPGA and has a x8 hardware PCI Express endpoint in the Virtex-5 FPGA. Altera offers x1, x4, and x8 MegaCores for the Stratix and Arria FPGAs. Several other FPGA vendors and IP vendors offer PCI Express cores, which are probably just the tip of the iceberg. The PCI/104-Express specification also supports two x4 or x8 links with automatic link shifting on the x16 part of the connector. These add-in cards are identified as x4, x8, or x16 and do not affect the four x1 links. Also, chipsets allow the x16 link to be used for other functions such as Serial Digital Video Output (SDVO), which is automatically selected by the CPU and add-in card. Support for these functions is optional, so consult the CPU manual for more information. PCI Express switches allow vendors to create bridge cards that provide additional uses for the x16 link. A PCI Express PC/104 and Small Form Factors
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HARDWARE Granted, they all share the bandwidth of the x16 link. However, vendors can have four x1s and two x4s and still use a x4 on the board without losing any bandwidth. Pseudo-multitasking with the x16 link For an example of the x16 link’s power and flexibility, consider a simple board that uses a three-port, 48-lane switch with an onboard DSP that requires a x16 link. The board replaces the x16 link on the bus. In a stack-down configuration, the x16 link comes in the top connector and sends all 16 lanes to one of the switch’s ports. The switch’s second port sends 16 lanes to the onboard x16 link DSP. Lastly, the third port sends 16 lanes to the bottom connec connector replacing the x16 link (see Figure 3). Top PCIe Connector x16 Link
Port 1
Port 2
Switch
x16 Link DSP
Port 3 x16 Link
Bottom PCIe Connector
Figure 3
If the system is configured with a CPU and three of the DSP boards depicted in Figure 3 – called DSP 1, DSP 2, and DSP 3 – the boards will be able to perform the following transactions, each assuming nothing else is happening on the x16 link: CPU can talk to DSP 1 at 10,000 MBps CPU can talk to DSP 2 at 10,000 MBps CPU can talk to DSP 3 at 10,000 MBps CPU can talk to any of the DSPs at 5,000 MBps at the same time it talks to any other DSP at 5,000 MBps CPU can talk to all three DSPs at the same time at 2,500 MBps each and still have 2,500 MBps for additional x16 cards CPU can talk to DSP 1 at 10,000 MBps while DSP 2 talks to DSP 3 at 10,000 MBps 34 / Summer 2008 PC/104 and Small Form Factors
This example makes it appear as though the CPU is performing more than one transaction at a time when in reality it is not. Express switches operate like Ethernet switches. A host sends packets of data to the switch at the fastest rate possible. The switch buffers the packets and
sends them to a device at the fastest rate the device can handle. These packets can vary in size but are typically no more than 512 bytes. So, how does a PCI Express switch let a CPU talk to five devices seemingly at
the same time? Imagine a host that uses a x16 link. Devices #1 and #2 are x1 link devices, devices #3 and #4 are x4 link devices, and device #5 is a x8 link device. The drawing in Figure 4 shows the timing required for this “simultaneous” operation.
NotES oN FIGURE 4 Each time slot – T0, T1, …, Tn – is the time required to send one packet on a x16 link. The numbers inside the waveforms represent the destination device for the packet, and the letters identify different packets headed to the same device. For example, <1a> on the host is the same data packet as <1a> going to device #1. The host transfer takes less time because it is a x16 link. The device is a x1 link, so the transfer takes 16 times longer. A packet cannot be sent out of the switch before it is received. Packets <1b>, <3b>, and <4b> show that when a device is busy, the switch has to buffer the packet until the device is free. T0 x16 Packets In From Host
1a
T1
T2 2a
T3 3a
T4 4a
T5 5a
T6 3b
x1 Packets Out Device #1
T8
T9
5b
T10 1b
T11
T12
T13
T14
T15
T16
T17
T18
5c 1b
1a
x1 Packets Out Device #2 x4 Packets Out Device #3
T7 4b
2a 3a
3b
x4 Packets Out Device #4
4a
x8 Packets Out Device #5
5a
4b 5b
5c
Figure 4
PC/104 and Small Form Factors
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HARDWARE Using PCI/104-Express Mechanics of stacking PCI/104-Express is designed to simplify system configuration. For example, if a designer uses a typical 3.6" x 3.8" (92 mm x 96 mm) 104 form factor CPU, the CPU is placed on top of the stack, as shown in Figure 5. PCI/104-Express add-in boards are then stacked below the CPU. Because all add-in boards are universal cards and employ automatic lane shifting, the designer never has to set switches or jumpers.
PC/104: New frontiers PCI
Memory Chipset PCI/104-Express CPU Module
Processor Chip
PCI
PCIe
0.600 inches (15.24 mm)
PCIe Device PCI/104-Express Peripheral Module PCI
PCIe
0.600 inches (15.24 mm)
PCIe
0.600 inches (15.24 mm)
PCIe Device PCI/104-Express Peripheral Module PCI
“PCI/104-Express
PCI Device PCI-104 Peripheral Module
is designed to simplify system configuration … Because all add-in
PCI
0.600 inches (15.24 mm) PCI Device
PCI-104 Peripheral Module PCI
boards are universal
Figure 5
cards and employ automatic lane shifting, the designer never
PCIe Device PCIe/104 Peripheral Module PCIe
PCIe Device PCIe/104 Peripheral Module PCIe
has to set switches or jumpers.”
PCIe Device PCIe
PCI Device
36 / Summer 2008 PC/104 and Small Form Factors
0.600 inches (15.24 mm)
PCIe/104 Peripheral Module
PCI
If a designer chooses one of the PC/104 Embedded Consortium’s larger form factors such as EPIC or EBX or uses a PCI/104-Express module as a macrocomponent on a baseboard, the CPU is typically placed on the bottom of the stack, and add-in cards are stacked on top, as shown in Figure 6. The exact same cards used in the stack-down configuration can be used without any changes in this configuration as well because PCI/104-Express features a universal add-in card design that automatically detects if it is installed above or below the CPU and selects the correct PCI Express link. Because of the frequencies involved with PCI Express, it is not recommended to stack modules both above and below the CPU at the same time.
0.600 inches (15.24 mm)
0.600 inches (15.24 mm)
PCI/104-Express Peripheral Module PCI
PCIe
Memory Chipset Larger Form Factor PCI/104-Express CPU Module PCI
0.600 inches (15.24 mm) Processor
PCIe
Figure 6
For more information on the PCI/104-Express specification, check out the PC/104 Embedded Consortium website at: www.pc104.org/pci104_Express_specs.php
Form factors The PC/104 Embedded Consortium maintains specifications for three form factors. The original 104 form factor is the readily recognized 3.6" x 3.8" (92 mm x 96 mm) board. EPIC provides a midsized board at 4.5" x 6.5" (115 mm x 165 mm). EBX is the largest at 5.8" x 8" (146 mm x 203 mm). PCI/104-Express is defined on all three form factors, as shown in Figure 7. â&#x17E;¤
Jim Blazer is the vice chairman and Chief Technical Officer of RTD Embedded Technologies, Inc., in State College, Pennsylvania, where he is responsible for managing intelligent data acquisition system and
embedded PC designs. He currently serves as chairman of the PC/104 Embedded Consortiumâ&#x20AC;&#x2122;s Technical Committee. Jim has a BSEE from Penn State University. RTD Embedded Technologies 814-234-8087 jblazer@rtd.com www.rtd.com EBX Express Form Factor
EPIC Express Form Factor 104 Form Factor
PCI Connector PCI Connector
PCI Connector
PCI/104-Express PCI/104-Express
PCI/104-Express Stackable PCIe Connector
Stackable PCIe Connector
Stackable PCIe Connector
Figure 7
PC/104 and Small Form Factors
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tors
fa c
pc/104
¸
a
nd
sm a l l f o r m
EDITOR’S CHOICE PRODUCT
A different take on XMCs Folks usually think of XMCs as expansion modules for VME or CompactPCI boards, but there’s nothing stopping more creative uses. And that’s exactly what the SBC-ComEx illustrates in its small form factor PC design with two XMC sites for configurable expansion. SBC-ComEx runs either Windows or Linux on a COM Express x86 CPU module, with its suite of I/O. The XMC sites support PCI Express as the connection for additional high-speed I/O. The entire unit comes in a 250 mm x 170 mm footprint and operates on either AC or 12 VDC input. Innovative Integration www.innovative-dsp.com RSC# 36881
Denser, faster ASIC verification I’m always on the lookout for systems that have undergone a significant reduction in size. Those who used an ASIC verification system in the last couple of decades know that the boxes were huge – we’re talking washing machinesized huge. GiDEL has shrunk that huge box into something more toaster-sized in the PROC_SoC, powered by Altera Stratix III L340 FPGAs. The system holds three small form factor boards, each capable of 6M gates, for a total capacity of 18M gates running at 300 MHz system clock speed. A larger version with 10 boards handles up to 60M gates. GiDEL www.gidel.com RSC# 37073
Green watch: Smarter watering I’ve seen several programmable sprinkler control systems, but this one has a couple of interesting ideas, including an 802.15.4 wireless connection from a PC to the controller and the ability to download an online weather forecast to help project water needs – less on cool or rainy days, more on hot days. The Cyber-Rain XCI system presents an easy-to-use PC interface to set zones, keep track of water usage, and produce reports on water savings, which the company claims can be 30-70 percent. Modes such as “fertilizing” also can help manage a temporary increase in water supply for a short period, then return to normal. Cyber-Rain www.cyber-rain.com RSC# 37072
Better runtime tracing, more complete support Code Red’s Eclipse-based C development tools now offer more advanced runtime tracing using serial wire-viewing capability in the Luminary Micro Stellaris microcontroller family, a nonstopping technology that gathers information nonintrusively as the target code executes. Red Suite 1.5 adds support for project wizards, USB registers, and DMA controllers in the Stellaris family, giving better views into microcontroller and peripheral activities as well as enabling faster code writing and debugging. The tool includes a FreeRTOS.org project wizard, which the company claims can generate a project skeleton in just four mouse clicks. Code Red Technologies Ltd. www.code-red-tech.com RSC# 37074
code_red 38 / Summer 2008 PC/104 and Small Form Factors
™
GPUs get GRIP on images
Tiny 16-bit ADC for portable sensors
GRIP in this case means Generalpurpose Rugged Image Processing, the basis for a new line of platforms launched recently by Vision4ce. Combining an Intel Core 2 Duo processor with a suite of GPUs in a rugged package, these units can process images in harsh environments.
Linear Technology’s latest 16-bit delta-sigma ADC family features a pair of converters with a 0.5 microamp shutdown current in a tiny 3 mm x 2 mm, 8-pin package. The LTC2451 has an I2C interface and measures voltages from 0 to Vcc, while the LTC2452 has an SPI interface and measures a differential input up to ±Vcc.
Besides the GRIP-Alpha rugged platform pictured here, larger versions are available with increasing numbers of GPUs. This Alpha unit includes 1 GPU, 4 GB of memory, two GbE ports, four USB ports, one PCI Express slot, and room for an SSD or SATA drive.
These units support up to 60 conversions per second but can be throttled back to save power at lower sample rates – typically 40 microwatt at one sample per second. Linear Technology www.linear.com RSC# 37075
Vision4ce www.vision4ce.com RSC# 36410
PC/104 and Small Form Factors
Summer 2008 / 39
LabVIEW ARMs up
Six inches, seven pounds, 100 GFLOPs Sounds like a birth announcement … and it is, in a sense. Mercury Computer Systems has taken a leap in reducing system size with the new PowerBlock 50, packing 100 GFLOPs into a tiny, rugged, liquid-cooled package. We saw a preview at the recent VITA MediaFest, and we’re pretty sure the package is rugged enough to stand on without collapsing. With a Linux board support package development environment and desktop-ready heat-rejection unit, developers can get started right away. Mercury expects to customize the payload and cooling to specific program requirements for volume shipments. Mercury Computer Systems www.mc.com RSC# 36933
If you caught the DARwIn article on page 26, you noticed that the research team is making one improvement by adding an ARM microcontroller to the robot platform. National Instruments recently announced the LabVIEW Embedded Module for ARM microcontrollers. Targets include ARM 7, ARM 9, and Cortex-M3 microcontroller families. Drivers are available for peripherals, along with a desktop simulator and links into NI Multisim. In addition to a project wizard for fast configuration, the module includes an interrupt manager that sets up LabVIEW code to run when a specific hardware interrupt occurs. National Instruments www.ni.com RSC# 33913
Editor’s Ch ce P od cts are drawn from OSP’s product database and press releases. Vendors may add their new products to our website at www.opensystems-publishing.com/np and submit press releases at www.opensystems-publishing.com/news/submit. OSP reserves the right to publish products based on editors’ discretion alone, and does not guarantee publication of any product entries.
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40 / Summer 2008 PC/104 and Small Form Factors
InDustrIAl AutOmAtIOn: sensOrs OsrAm Opto semiconductors www.OsrAm-os.com sFh7740 and sFh7741 rsc no. 36502
Six-channel 24/16-bit precision temperature measurement single-width IP module, with fixed and optional programmable current source • Eight 16-bit A/D channels • Input voltage up to ±20 V • Each analog input is programmable separately ±10 V, ±5 V, 0-5 V, and 0-10 V • Programmable gain from 1 to 128 • IndustryPack module, 8/32 MHz
enter the product’s rsc no. at www.smallformfactors.com/rsc Industrial automation: Sensors. . . . . . . . . . . . . . .42 Mezzanines: IndustryPack. . . . . . . . . . . . . . . . . . .42 Mezzanines: PMC . . . . . . . . . . . . . . . . . . . . . . . . . .42 Mezzanines: XMC/PMC . . . . . . . . . . . . . . . . . . . . .42
mezzAnInes: Pmc 4DsP www.4dsp.com AD484
FOr mOre InFOrmAtIOn
Networking: CAN . . . . . . . . . . . . . . . . . . . . . . . . . . .42 Networking: Industrial computer . . . . . . . . . . . . .43
rsc no. 36144
Networking: Power over Ethernet . . . . . . . . . . . .43 Processor boards/SBCs: COM Express . . . . . . .43 Processor boards/SBCs: ECX . . . . . . . . . . . . . . . .43
Proximity sensor SFH7740 with optical touch switch measures 3.7 mm x 3.7 mm x 1.0 mm and reacts to distances between 0.5 mm and 4.0 mm • Compact dimensions allow it to be unobtrusively integrated into unusual designs such as extremely low-profile devices • Depending on if the slider is closed or open, SFH7740 switches display lighting off or on • Provides an alternative to Hall sensors because it is insensitive to electro electromagnetic interference and does not produce any electromagnetic interference • Proximity sensor SFH7741 reacts at a typical working distance of 20 mm and is suitable for a wide range of applications • In hands-free mode with the phone away from the user’s ear, backlighting can be switched on and volume adjusted accordingly • Helps save energy in digital cameras, switching off display lighting whenever users hold the camera up to their eyes and use the viewfinder instead of the screen • The two SMT sensors draw a current of 50 microamperes (approximately) • With integrated ambient light suppression, the sensors operate reliably in all lighting conditions
Processor boards/SBCs: PC/104 . . . . . . . . . . . . .44 Processor boards/SBCs: PC/104-Plus . . . . . . . . .44 Processor boards/SBCs: StackableUSB . . . . . .44 Ruggedized/Mil-spec: LCD monitor . . . . . . . . . . .44 Ruggedized/Mil-spec: Solid-state drive . . . . . . .45 Test and analysis: Boundary scan . . . . . . . . . . . .45
Quad 14-bit, 125 MSps A/D digitizer PMC (V rtex-4 FX and SX/LX) with optical trans transceivers (optional: Serial FPDP) • Four 14-bit, 125 MSps A/D channels • Custom external clock and trigger inputs • Dual Virtex-4 FX and LX/SX FPGA architecture • QDR2 SRAM and DDR2 SDRAM • PCI-X 64-bit 133/66 MHz
Test and analysis: Evaluation board. . . . . . . . . . .45 Test and analysis: Synchro converter module . .45
netwOrkInG: cAn Dynamic engineering www.dyneng.com IP-cAn
rsc no. 36785
mezzAnInes: Xmc/Pmc AdvancedIO systems www.advancedio.com v1021
rsc no. 36417
mezzAnInes: IndustryPack Alphi technology corporation www.alphitech.com IP-thermIstOr rsc no. 36416 An intelligent VITA 42.3 XMC/PMC module that provides 10 GbE connectivity for demanding real-time applications • Enables use of 10 GbE as the high-performance fabric • Xilinx Virtex-II Pro FPGA • Standard 10 GbE SFP+ optical interface • PCI Express x4 and PCI-X 133 MHz interfaces • udpXG protocol offload or streamXG direct data streaming (optional)
42 / Summer 2008 PC/104 and Small Form Factors
IndustryPack Control Area Network (CAN) provides dual connections with direct or ISO options • Add CAN to VME, PCI, CompactPCI, or PC/104-Plus hardware • Windows driver available • Dual channels: Have redundancy built in, snoop or connect to more than one bus, or simulate more than one instrument • Direct or isolated connections • -ISO model suited for systems with voltage isolation requirements • Programmable terminations: Bus node must be terminated based on the network topology • Terminations are selectable in software to optimize performance and reduce stocking requirements • Driver support: Plug-and-play support is provided with options to operate in Pelican or standard mode • Reference application software
is provided with the driver • Small package with several system options for use in any format system • IP carriers available for CompactPCI, PCI, VME, PCI-104, PC/104-Plus, and more
netwOrkInG: InDustrIAl cOmPuter korenix technology www.korenix.com JetBox 9300
rsc no. 36403
Three-in-one industrial networking computer • Consolidates industrial computer, router, and managed switch to make networking simple • RISC, 64 MB SDRAM • Linux, VCOM, Modbus gateway • Four COM, two USB, four DI/DO, SD card • Router (five Ethernet ports) • Free combination between WAN and LAN • IP routed, static routing, NAT, firewall, DMZ • Managed switch • SNMP v1/v2c/v3 • Quality of Service, VLAN (802.1Q, port-based)
More formally known as IEEE 802.3af internationally, PoE specifies a supply of 48 VDC at up to 15.4 W per port • With the combined capabilities of an unmanaged Ethernet switch and PoE power injector, the EKI-2525P has four PoE ports capable of supplying up to 15.4 W each • Each port automatically detects when PoE-compliant devices are attached before supplying power, allowing the use of traditional (non-PoE) Ethernet devices if needed • Compact, thin DIN-rail mount chassis suitable for applications where panel space is limited • Ruggedized for demanding industrial applications, with dual 12-48 VDC power inputs, 4,000 VDC Ethernet ESD protection, and power line surge (EFT) protection of 3,000 VDC • Features an operating temperature range of -10 °C to +60 °C to ensure system uptime • CUL (UL/CSA), CE, FCC, and RoHS/WEEE certified • Each Ethernet port is equipped with frontfacing LED indicators that provide link, transmission speed, activity, and PoE output status to aid in diagnosing issues with cables and attached devices • Auto-MDI/MDI-X eliminates the need to use crossover cables for interswitch connections • Autonegotiation provides optimum link configurations and compatibility with legacy devices
PrOcessOr BOArDs/sBcs: rDs/sBc xpress cOm express ADlInk nk ttechnology, echnology, Inc. www adlinktech.com express-mlc eexpressxpress-
rsc no. 36492
radisys www.radisys.com Procelerant ce945Gm2A
rsc no. 36025
Replaces older ETX technology at a comparable price point, enabling high-speed serial interface options such as PCI Express, SATA, and GbE • Based on the value-priced Intel Celeron M processor 440 • Higher processor performance at a value entry point using the COM Express modular form factor • Can be combined with a RadiSys designed low-profile active heat sink with an embedded fan, allowing the module to be used in 1U platforms • Module and heat sink combination enables rapid design-in by eliminating the need to create a heat sink that can effectively cool a 1U system
PrOcessOr BOArDs/sBcs: ecX American Portwell technology www.portwell.com PeB-2736 rsc no. 36455
netwOrkInG: Power over ethernet Advantech eAutomation Group www.eAutomationPro.com ekI-2525P rsc no. 36397
Industrial 5-port Power over Ethernet (PoE) switch • Combines a compact and rugged 5-port unmanaged Ethernet switch with PoE technology to connect and power Ethernet devices over a single cable • PoE transmits power plus data to remote Ethernet devices over standard twisted-pair Cat5e cables •
with an extended feature set that offers PCI bus, PCI Express-based GbE LAN, and PCI Express-based SATA
Member of ADLINK’s Computer-On-Module (COM) Express family • 95 mm x 95 mm • COM Express Type 2 compatible design based on the Intel Atom processor Z500 series with the new Intel System Controller Hub US15W • Highly integrated off-the-shelf building block based on the PCI Express bus architecture • Plugs into custom-made, application-specific carrier boards • Allows for innovative designs that meet mobile and light computing needs, including: portable and mobile equipment for the automotive and test and measurement industries, visual communication in the medical field such as home care and video conferencing, entry-level public gaming devices, and public points of communication • Basic version supports two PCI Express x1, LVDS, SDVO, 8x USB 2.0, SDIO, audio, and LPC bus • Also available
3.5" Intel ECX form factor embedded board with Intel Atom 45 nm ultra-low-power small form factor processor and chipset (TDP < 5 W) • One 200-pin SODIMM supports DDR2 SDRAM up to 1 GB • One Type II CompactFlash and one IDE connector • Dual independent display: SDVO and 24-bit LVDS • SDVO connector support VGA/DVI/LVDS daughtercard • Multistream audio and CH5.1 supported Trusted Platform Module and USB-Disk Module can be added onboard • Designed for very low power consumption at less than 10 W at full load • Supports dual display by LVDS and SDVO connector • Modular SDVO and SDIO board architecture can be customized easily
PC/104 and Small Form Factors
Summer 2008 / 43
PrOcessOr BOArDs/sBcs: Pc/104 sealevel systems www.sealevel.com c4-104.485+I
rsc no. 36496
PC/104 serial I/O adapter with four RS-422/485 ports • 1,500 VDC port-to-port isolation protects against transients and ground loops • Each port is software configurable for 4-wire RS-422/485 or 2-wire RS-485 • Includes 16954 UART with 128-byte FIFOs and 9-bit support • Error-free data rates to 921.6 Kbps • Includes an Oxford 16954 UART with 128-byte transmit and receive FIFOs for communication up to 921.6 Kbps • UART includes support for 9-bit protocol • Clock prescaler coupled with a 14.7456 oscillator provide high resolution for achieving all standard and many nonstandard baud rates • Includes Sealevel Systems’ SeaCOM suite of drivers for Windows 98/ME/NT/2000/XP/Vista operating systems • Includes WinSSD, a full-featured diagnostic application providing powerful testing and troubleshooting capabilities to assist in application development and testing • Use WinSSD for bit error rate testing, throughput monitoring, loopback tests, and transmitting test pattern messages • Also includes drivers, utilities, application notes, and technical details to simplify installations in Linux, QNX, and DOS • Standard operating temperature range is 0 °C to +70 °C • Extended temperature range version offering -40 °C to +85 °C is available • Covered by a lifetime warranty
performance • Fanless operation (no moving parts), soldered-on system memory, and extended temperature operation (-40 °C to +85 °C) for military, aerospace, medical, and industrial applications • Highly integrated AMD LX 800 processor delivers Celeron 800 MHzequivalent performance while drawing less than 5 W of power • Standard onboard features include 256 MB soldered-on SDRAM, dual 10/100 Ethernet, four USB 2.0 ports, IDE interface, and three COM ports • CompactFlash socket provides reliable, highcapacity onboard storage • Flexible options for keyboard, mouse, external storage, and other devices are provided via USB ports • Includes integrated SVGA and LVDS flatpanel support with MMX and 3DNow! for video-intensive applications • PC/104-Plus interface supports both ISA and PCI add-on modules • Standard pass-through connectors allow the board to be used either above or below other PC/104 modules • Can be used as a CPU module for a larger system by plugging it into a proprietary baseboard that in in-cludes specific user I/O circuitry • Features a General Software Embedded BIOS with OEM enhancements • Field reprogrammable BIOS supports custom defaults and the addi addition of firmbase securi y applications, remote booting, and o her pre-operating system software functions • Compatible with a variety of popular operating systems, including Windows CE/XP/XPe, QNX, VxWorks, Linux, and other real-time operating systems • Fully RoHS-compliant • Options include conformal coating, BIOS customizations, revision locks, custom labeling, high g shock and vibration treatment, custom testing, and screening
Five host ports through the StackableUSB connector and two separate client USB ports • Dual network processing engines drive the 10/100BASE-T Ethernet, allowing embedded system users to offload networking tasks from a server such as Ethernet filtering, which enables higher throughputs • Consumes 385 mA typical in its basic configuration • 24 digital I/O lines • Eight readable DIP switches • Eight LEDs for application use • Four RS-232 serial ports, one RS-485 configurable • 128 MB of SDRAM and 64 MB resident flash array • CompactFlash socket supports storage devices and I/O devices such as Wi-Fi cards • Board support packages available for Linux, Windows CE, and VxWorks
PrOcessOr BOArDs/sBcs: stackableusB
Industrial-grade, rugged, versatile touchscreen LCD monitor designed to handle the rigors of industrial and commercial environments • 17" steel-enclosed touch-screen LCD • Built to withstand harsh environments typically encountered in industrial plant floor applications • NEMA 4/IP 66 LCD front panel withstands water, dust, and dirt intrusion • High precision, metal-encapsulated 17" viewable display is capable of running resolutions up to its native mode of 1280 x 1024 pixels with both analog and digital input sources • Low power consumption • Wide viewing angles • Enhanced image quality with 250 nits of brightness, 8 ms response time, and a contrast ratio of 500:1 • Available with resistive and capacitive touch-screen options • Includes a wide range of versatile mounting options such as wall, benchtop, pendant arm, and ceiling mounts • All Stealth LCD monitors are plug-and-play capable, requiring no video drivers or special interface cards • Suitable for applications such as HumanMachine Interface, factory automation, process control, interactive kiosks, or demanding applications where vital information must be displayed
micro/sys, Inc. www.embeddedsys.com rcB1626
rsc no. 36863
PrOcessOr BOArDs/sBcs: Pc/104-Plus versalogic www.versalogic.com cougar
rsc no. 36489
LX 800 PC/104-Plus embedded computer • Uses an AMD LX 800 processor that provides low power consumption without sacrificing
Incorporates StackableUSB technology in an ARM processor • Network-ready controller on the 104 form factor • Seven USB ports:
44 / Summer 2008 PC/104 and Small Form Factors
ruGGeDIzeD/mIl-sPec: lcD mOnItOr stealth computer corporation www.stealthcomputer.com tufftouch lcD monitor rsc no. 35614
ruGGeDIzeD/mIl-sPec: sOlID-stAte DrIve trident space and Defense www.tridentsd.com trident BGADrive
rsc no. 36775
Solid-state drive in a standard BGA form factor that can be reflowed directly onto a PCB • Available in standard IDE and SATA interfaces • BGA form factor: 29 mm x 29 mm • Less than 7 mm high • Capacities up to 32 GB using SLC NAND flash • Custom sizes and form factors available • Highly rugged for extreme environmental conditions • Suitable for military and industrial embedded systems
test AnD AnAlysIs: BOunDAry scAn Asset Intertech www.asset-intertech.com scanworks
rsc no. 36723
CPU emulation test and diagnostic system • Supports Intel’s Atom processor with CPU emulation test and diagnostics • Takes control of the CPU and then asserts structural and functional test and diagnostic routines through the processor to other devices and other nodes on the circuit board
test AnD AnAlysIs: evAluAtIOn BOArD GAO tek Inc. www.gaotek.com Arm stDv912F rsc no. 36388 Part of the STMicroelectronics STR91xF series of ARM-powered microcontrollers, which combines a 16/32-bit ARM966E-S RISC processor core with up to 96 KB SRAM, 256 KB main flash, and 32 KB second flash • ARM966E-S core can perform single-cycle DSP instructions for speech processing, audio algorithms, and low-end imaging • Equipped with USB, CAN, Ethernet, AC motor
control, four timers, ADC, RTC, DMA, and up to 80 GPIO • Dimensions: 149 mm x 142 mm • Processor: STR912FW42 (966E-S) with (256+32) KB internal flash and 96 KB internal SRAM • Working temperature: -40 °C ~ +85 °C • Power input: +5.0 V/1 A • 10/100M Ethernet interface (CS8900A) • USB 2.0 interface (device) • CAN 2.0 communication interface with CAN driver chip • LCD interface (16 x 2 character LCD) • Seven LED indicator lights: one for power, two for indicating network communication, others for general usage
test AnD AnAlysIs: nverter m OD ODule synchrO cOnverter mODule north orth Atlantic Indu tries www.naii.com 73Ds2 73Ds 73D s2
rsc no. 36804
A 3-channel programmable digital-tosynchro/resolver converter available on a PC/104 card • Three independent, transformer isolated, programmable synchro/ resolver simulation channels • Each channel has 16-bit resolution, ±1 arc-minute accuracy, and a short circuit protected output with 1.2 VA drive capability • Each unit includes eight programmable digital I/O channels, wrap-around self-test, programmable output angle rotation, and an optional programmable excitation reference supply • Provides continuous background Built-In-Test on all functions and channels, including reference and signal loss detection
FOr mOre InFOrmAtIOn enter the product’s rsc no. at www.smallformfactors.com/rsc
Everything’s coming up ‘small form factors’ SFF-SIG: New logo, new start, and a SUMIT to ascend. Meanwhile, the PC/104 Consortium rolls out PCIe, and ESC needs a new name. Before last month’s Embedded Systems Conference (ESC) even got rolling in San Jose, the SFF-SIG held a private dinner to brief the media on what I believe is a new idea that stands a snowball’s chance at success. In a packed room at the San Jose Marriott, international journalists and companies began charting a course for the creation of several new Small Form Factors (SFFs) while capitalizing on the trends of Size, Weight, and Power (SWaP), PCI Express (PCIe), low cost, and processor independence. The SFF-SIG was an idea I personally championed behind the scenes and in print. With more than 80 SFFs in the market, it’s high time to rein it all in and foster the type of “co-opetition” (cooperation/competition) that births open standards and creates sustainable markets with multiple vendors. PC/104 is one such successful SFF, and at ESC the PC/104 Embedded Consortium also announced its own new flavor, called PCI/104-Express. I described the SFF-SIG’s mission in the PC/104 and Small Form Factors 2008 Resource Guide (www.smallformfac ors.com/ departments/insight/2008/03/01/a_new_sig_in_town/). Now the group has taken the wraps off its SUMIT interface. Based on a low-bux Samtec connector set that they say sells for a mere $16 in quantity 1, the Stackable Unified Module Interconnect Technology (SUMIT) is intended to decouple the board size and interconnect from the processor bus du jour. Moreover, the size and interconnect are designed to balance the best of legacy interfaces and current- and future-generation connectivity options. And because PC/104 has enjoyed such a long run of success partially because of a well-managed life cycle (read: anti-obsolescence), SUMIT is building “long term” in at the start. Here are the technical whizzies: SUMIT includes two PCIe x1 and one PCIe x4 lanes. On an SFF, the routing (and cost!) required to accommodate anything fatter than x4 approaches diminishing returns. There are three USB 2.0 ports, an LPC “bus” to bridge back to legacy modules (such as PC/104 running ISA), SPI, MicroWire, SMBus, and I2C. These pins and traces can be configured to support an Express card, the add-in I/O choice of today’s high-volume laptops and notebook computers. SUMIT’s Samtec Q2 52-pin connector has a relatively clean eye diagram for 5 GHz signals with boards stacked three high and is supposedly rugged enough to deal with standoffs. At these speeds, even PCIe 2.0 and USB 3.0 are doable. Samtec claims insertion cycles of 1,000 times, well beyond what any board stack would ever see in the real world. The SFF-SIG also announced its Express104 standard, which is PC/104-like at 90 mm x 96 mm, with 14 square inches (8,600 square mm) per side. Clearly, the SFF-SIG wanted to get the basics 1 Two
right first and let the SIG’s members propose the definition for the physical card size. Member company VIA Technologies did just that, showing a proof-of-concept Pico-ITX processor board modified with SUMIT-based Pico-I/O add-in cards. (Note: VIA even had Robert Kuo, inventor of the Mini-, Nano-, and Pico-ITX modules present at this kickoff. That says they’re serious about this, folks.) Later that evening, various SFF-SIG member companies and (presumably) a few “lurkers” milled about after the crème brûlée had congealed. European companies congatec AG and SECO – founders of the Qseven SFF consortium – announced that MSC Vertriebs GmbH and Hectronic of Sweden will support the Qseven platform I a so noticed some ex-Kontron people in atten attendance. The on-the-record attendees or supporters include VIA, Ampro Computers, congatec, General Standards Corporation, Octagon Systems, American Portwell Technology, Samtec, SiliconSystems, Tri-M Systems, VersaLogic, and WinSystems. Not to be outdone, the next day the PC/104 Consortium unveiled two years’ worth of work and a few lost member companies. Their briefing made it crystal clear that the PC/104 ecosystem intends to stay wedded to the successful ISA/PCI legacy desktop world. Several audience members provided impromptu assertion testimonials to this fact: I’d just witnessed the genesis of the market split between the visions of the PC/104 Consortium and the SFF-SIG. Ironically, many companies belong to both camps, leading to possible future multiple personalities not seen since Sybil. PCI/104-Express also uses a Samtec connector, but this one has a better eye diagram and can support faster and wider signals. In other SFF news, congatec’s Qseven and XTX form factors might soon become SFF-SIG standards, LiPPERT Embedded Computers announced CoreExpress, which is arguably the smallest Intel-based SFF SBC on the market, and XtremeData showcased the XD2000 Altera Stratix II-based FPGA coprocessor SFF compatible with AMD’s and Intel’s coprocessor initiatives. Also at ESC, the general manager of ADLINK briefed me on the company’s post-acquisition plans for PC/104 inventor Ampro (hint: U.S. manufacturing and design, leading to military sales), and EMAC beefed up its almost Gumstix-sized SODIMM SoM SFF modules with a ColdFire MCF5282 32-bit CPU. ESC showcased so many SFFs that it should be renamed SFF ESC. Really. Embedded hardware seems to only come in SFF sizes, and we are ramping up our coverage of SFF trends in this very magazine1. Stay tuned. Chris A. Ciufo, cciufo@opensystems-publishing.com
other SFFs recently appeared in an unlikely place: under the umbrella of VITA, owner of the sacred VME flame. VITA 57 pertains to a smaller-than-PMC FPGA mezzanine card designed to make FPGA I/O swaps easier than a full basecard re-layout. As well, the new VITA 59 Rugged System-On-Module is COM-sized but includes a full billet alloy frame for extremely rugged shock and vibration, plus it offers nifty conduction cooling for up to about 40 W over a wide temperature range.
46 / Summer 2008 PC/104 and Small Form Factors