Bruker Introduces Most Advanced Benchtop Stylus Profilometer New Dektak Pro Expands Measurement Area and Accuracy for Critical Analyses

Source: Coherent Scientific

Bruker Corporation has announced the release of the Dektak ProTM stylus profilometer, the next-generation profiler in the industry-leading Dektak® product line. Incorporating over 55 years of innovation, the new benchtop system provides an expanded measurement area up to 200 mm of full-sample access for semiconductor applications, as well as a shortened time to results with improved user experience and measurement accuracy. Dektak Pro incorporates advancements that solidify the brand as the world’s most advanced stylus profiler, positioning it to address R&D, process development, and QA/QC present and future needs across a host of industrial and research markets.

“The name Dektak has become synonymous with stylus profiling, and for good reason. Hundreds of Dektak systems are installed around the world every year, proving an enduring need for this technology,” added Samuel Lesko, Senior Director and General Manager of Bruker’s Tribology, Stylus and Optical Metrology Business. “With Dektak Pro, we have taken the next step in measurement capability and ease of operation while maintaining the value and reliability that Dektak is so well known for, and I really look forward to seeing the many ways our customers will use the system in the years to come.”

About Dektak Pro

Widely utilised in microelectronics, semiconductor, display, solar, medical, and materials science markets, Dektak stylus profilers are an essential precision metrology instrument found in literally hundreds of production, research, and failure analysis facilities around the world. Dektak systems are employed in both 2D profilometry and 3D surface profiling applications to measure stress, nanometre film thicknesses, and step heights with better than 4 angstrom repeatability. The new Dektak Pro introduces step height and stress measurement updates that expand its usage. A streamlined automatic step detection routine requires less user-defined parameters for a simplified analysis that reduces user-based variability. 2D stress measurement analysis is now more customizable than ever, allowing for user-defined areas and refining precision through artifact thresholds. Fast characterisation of wafer warpage and 3D stress analysis are also made possible by new automatic centring and wafer mapping features.

For further information please contact Coherent Scientific Pty Ltd sales@coherent.com.au www.coherent.com.au