JANUARY 2014
p.24
Also In This ISSUE:
Touch panel design trade-offs ............................................. p18 Controlling power factor correction ................................. p20 Product Tends: Applications in mil-aero ......................... p34
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4 Contents Vol. 56, No.8
Features
18 20 11
18
Displays: Touch panel design trade-offs Energy Saving Initiative: Better get that power factor corrected!
38th Annual Product of the Year Awards • Advanced Linear Devices • Analog Devices, Inc. • AVX • Broadcom • Coilcraft, Inc • Coto Technology Inc. • Cree, Inc. • EMCO High Voltage Corp.
• Linear Technology • Microchip Technology Inc. • PNI Sensor Corporation • STMicroelectronics • Tektronix • Texas Instruments • Transphorm page 24 Introducing Electronic Products’
Touch Points
Inaugural
6
Viewpoint: A bold step for engineering
8
The Story Behind the Story: Judging the 38th Annual Product of the Year entries
11
January 2014
Outlook (Technology News):
■ Researchers move closer to energizing nanonetworks ■ The Advanced Automotive Battery Conference charges into Atlanta
■ DesignCon starts January 28 in Santa Clara 32 34
What’s Inside: Apple iPhone 5S A1533
39
Product Update: Connectors & Sockets
Product Trends: Military-aerospace products
New Products 41
Power Sources
44
Optoelectronics
43
Components & Subassemblies
45
Packaging & Interconnections
Inspiration Awards For the first time ever, Electronic Products will present 10 recipients with a new category of accolade — the Inspiration Award. Recognition is based on the technologies these individuals produced during the previous year, which were covered by the editors of ElectronicProducts.com and proved popular with our online audience based on a variety of measurement tools. We are excited to honor this group of engineers, researchers, and developers with this eye-catching new trophy. To see who won, and to learn about the technologies, go to ElectronicProducts.com
Only Online ElectronicProducts.com Education Center: • LOGi family of FPGA boards made to interface with Raspberry Pi, Beaglebone Black, and Arduino Due. • Why circuit protection actually matters to space exploration
Electronic Products Magazine (USPS 539490) (ISSN 0013-4953)—Published monthly by Hearst Business Communications Inc./UTP Division, 50 Charles Lindbergh Blvd., Suite 100, Uniondale, NY 11553. Periodicals postage paid Garden City, NY and additional mailing offices. Electronic Products is distributed at no charge to qualified persons actively engaged in the authorization, recommendation or specification of electronic components, instruments, materials, systems and subsystems. The publisher reserves the right to reject any subscription on the basis of information submitted in order to comply with audit regulations. Paid subscriptions available: U.S. subscriber rate $65 per year, 2 years $110. Single issue, $6.00. Information contained herein is subject to change without notice. No responsibility is assumed by the publisher for its accuracy or completeness. Postmaster: Send address changes to Electronic Products, PO Box 3012, Northbrook, Il 60065-3012. Phone 847-559-7317 ©2014 by Hearst Business Communications Inc./UTP Division. ALL RIGHTS RESERVED Publications Mail Agreement Number 40012807. Return Undeliverable Canadian Addresses to: Station A PO Box 12, Windsor, ON N9A 6J5
JANUARY 2014 • electronicproducts.com • ELECTRONIC PRODUCTS
Be ready with the storage that’s ready for the future. The universe of apps is exploding. Mobile downloads are skyrocketing. And the need for storage has never been greater. That’s why for 25 years, SanDisk has been expanding the possibilities of storage and enabling companies to create game-changing products. sandisk.com
Source: Juniper Research. ©SanDisk Corporation 2013
6 Viewpoint
A bold step for engineering How mil/aero technology is leading the engineering charge
“T
o boldly go where no man has gone before” is no longer just a pop culture reference, especially when considering the actual advancements being made in military and aerospace engineering. Google recently completed the acquisition of Waltham, MA-based Boston Dynamics, an engineering company that has designed mobile research robots for the Pentagon. With designed robots that can act autonomously and walk over tough terrain — such as BigDog, Cheetah, and WildCat Boston Dynamics has expanded its collection to now include Atlas, humanoid robots that are intended to serve in harsh conditions, such as up hills and snow, and which are capable of performing in natural disasters. Boston Dynamics is also supplying DARPA (Defense Advancement Research Projects Agency) with the set of robots to participate in the DARPA Robotics Challenge, a two-year contest with a $2 million prize. Not to be outdone, NASA recently unveiled Valkyrie, a six-foot twoinch next-generation humanoid robot capable of performing tasks such as walking over uneven terrain, climbing a ladder, using tools, and driving. Part of NASA’s stated mission to reach Mars, and designed to operate in the same spaces that a person would, the robot has a head that can tilt and swivel, and a waist that can rotate, as well as detachable legs and arms and hands that each feature three fingers and a thumb. Likewise, NASA also made news last month by releasing a low-resolution video featuring a view from its Juno spacecraft as it flew past Earth, gathering speed for a rendezvous with Jupiter in 2016. The result — courtesy of a special camera sensor on Juno optimized to track faint stars — gave a compelling view of the Earth and moon system. “If Captain Kirk of the USS Enterprise said, ‘Take us home, Scotty,’ this is what the crew would see,” said Scott Bolton, Juno principal investigator at the Southwest Research Institute, San Antonio. “In the movie, you ride aboard Juno as it approaches Earth and then soars off into the blackness of space. No previous view of our world has ever captured the heavenly waltz of Earth and moon.” Barriers are being broken in aeronautics here on Earth as well. Two U.S. aeronautics companies are starting to develop a high-speed vertical takeoff-and-landing (VTOL) aircraft with
JANUARY 2014 • electronicproducts.com • Electronic Products
the hover capability of a helicopter that can also fly nearly 50% faster than the Boeing V-22 Osprey tiltrotor aircraft. Sikorsky Aircraft Corp., based in Stratford, CT, and Aurora Flight Sciences in Manassas, VA, have won contracts for the initial phase of the Vertical Take-Off and Landing Experimental Plane (VTOL X-Plane) project of DARPA.
So what does this all mean?
What this means is that with great power comes great responsibility. For instance, online retail giant Amazon CEO Jeff Bezos unveiled an unmanned “octocopter” that, theoretically, could deliver small packages to customers’ doorstep — a service he dubbed PrimeAir. As of now, however, such unmanned aerial-filming contraptions are effectively banned in the United States along with virtually all other commercial uses of unmanned aircraft, or drones. The main reason is that the U.S. government has stalled in its efforts to regulate and manage the use of drones. That hasn’t stopped some drones from taking flight, such as a small helicopter drone that flew high above buildings on the East Side of Manhattan and crash landed just feet away from a businessman during the Monday evening rush hour. The drone was small but the FAA says it should not have been flying hundreds of feet above a crowded Manhattan sidewalk. What it also means is that other nations are possibly passing us in the space race, as China just last month announced that it had successfully carried out the world’s first soft landing of a space probe on the moon in nearly four decades, state media said, the next stage in an ambitious space program that aims to eventually put a Chinese astronaut on the moon. In the end, these ambitions — and realities – I believe, should inspire but also provide sobering thoughts. There is a saying that if you do not know which way you are going, any direction will do. Let’s hope that in this age of advancement, we not only know which direction we are going, but that we continue to go there boldly. Be sure to check out our Product Trends section on mil/aero product trends on pages 34 and 36. John Filippelli Managing Editor
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Electronic PRODUCTS EDITORIAL STAFF 516-227-1300 FAX: 516-227-1901 Content Operations Director Bryan DeLuca 516-227-1379 • bdeluca@hearst.com Managing Editor John Filippelli 516-227-1381 • jfilippelli@hearst.com Senior Editor Paul O’Shea 941-359-8684 • poshea@hearst.com Technical Editor Jim Harrison 415-456-1404 • jpharrison@hearst.com Editor Richard Comerford 516-227-1433 • rcomerford@hearst.com Editor Lauren Leetun 516-455-8602 • lleetun@hearst.com Contributing Editors Chief Copy Editor Data Analyst and Writer
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8 Story Behind the Story A look at the making of POY award winners
Judging the 38th Annual Product of the Year entries
O
nce again, we here at Electronic Products set out to find new products that are worthy of the title Product of the Year, and once again, we were not disappointed! Now in its 38th year, Electronic Products’ 2013 Product of the Year competition challenges our suppliers for outstanding advancements in product development. The Electronic Products editorial team – Paul O’Shea, Senior Editor; Richard Comerford, Editor; and Jim Harrison, Technical Editor – spent the last few months of 2013 reviewing, researching, and debating the merits of over 250 product entries, using a very specific and strict set of judging criteria. That criteria included whether a product presented a significant advancement in a technology or its application, featured ground-breaking innovation, and whether it offered a substantial achievement in price/performance. The 2013 winners — 15 in all — reflect a diverse grouping of products that now share a common bond: Each has now earned the title of a Product of the Year.
Powered up
The editors found that in terms of product power consumption, less is definitely more. “We saw a great amount of semiconductor technology that Paul O’Shea Jim Harrison Richard Comerford will enable more efficient, faster, lower-power devices we desperately need,” said Paul O’Shea. According to O’Shea, winners that most reflect this trend is the Cree CCS050M12CM2 silicon carbide (SiC) six-pack module, which is the industry’s first all sic three-phase power module in an industry-standard 45-mm package. “When replacing a silicon module with equivalent ratings, this six-pack module can reduce power losses by 75%, which leads to an immediate 70% reduction in the size of the heat sink or a 50% increase in power density. This now makes silicon carbide accessible — in terms of price — to more designs,” he said. Likewise, Transphorm earned its recognition by establishing the first qualified 600-V device platform with its TPH3006PS GaN HEMT. The GaN transistor combines low switching and conduction losses, offering reduced energy loss of 50% compared to conventional silicon-based power conversion designs. “The common thread that ran throughout the products was power efficiency, from small devices like Microchip's gesture-sensing IC to Tektronix’s power analyzer,” said Richard Comerford.
Sensor-y overload
Sensors, in portable devices from smartphones to medical equipment, were widely evident among this year’s Product of the Year candidates. But making them work together is espeicially important; hence the SENtral sensor-fusion coprocessor from PNI Sensor Corp. received recognition. It’s “a highly effective way to pull in data from complex motion sensors — gyroscopes, accelerometers, and magnetic sensors like those found in mobile and wearable devices,” noted Jim Harrison. The device offloads complex signal processing from a main CPU and does so while consuming about 1% of the power a standard CPU would need to perform the task. And that’s just a sampling; there’s Coilcraft’s LPD5030V miniature high-isolation transformer, Linear Technology’s LTC2378-20 20-bit low-power A/D converter, Broadcom’s BCM43341 single-chip quad-radio device, and seven others just as important that we can’t cram into this space. So turn to our special Product of the Year section on pages 24 to 31. John Filippelli Managing Editor JANUARY 2014 • electronicproducts.com • ELECTRONIC PRODUCTS
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Outlook 11 Innovations impacting products, technology, and applications
Researchers move closer to energizing nanonetworks
At the Georgia Institute of Technology, investigation of energy harvesting is paving the path to self-powered nets
R
esearchers at Georgia Institute of Technology are rapidly developing essential elements for a network of independent machines with nanometric dimensions. These machines could be the basis for new medical treatments, advanced system maintenance, and remote manufacturing. A recent project involving power generation seems to offer solutions to a fundamental challenge. Zhong Lin Wang, a Regents professor in Georgia Tech’s School of Materials Science and Engineering, leads a group of researchers developing a family of power generators that take advantage of the triboelectric effect to produce electricity in surprising amounts. “The fact that an electric charge can be produced through triboelectrification is well known,” Wang notes. Anyone who has walked across a wool rug on a dry winter’s day and then touched another person, door knob, or other conductor to produce a static-electricity shock will agree. “What we have introduced is a gap separation technique that produces a voltage drop, which leads to a current flow in the external load, allowing the charge to be used. This generator can convert random mechanical energy from our environment into electric energy.” In its simplest form, the researchers’ triboelectric generator uses two sheets of dissimilar materials, one an electron donor, the other an electron acceptor (Fig. 1). When the materials are in contact, electrons flow from one material to the other. If the sheets are then separated, one sheet holds an electrical charge isolated by the gap between them. If an electrical load is then connected to two electrodes placed at the outer edges of the two surfaces, a small current will flow to equalize the charges. By continuously repeating the process, an alternating current can be produced. In a variation of the technique, the materials produce current if they are rubbed together before being separated. Generators producing direct current have also been built. Most commonly, inexpensive flexible polymers are used. However, it is possible to use a wide range of materials, including fabrics and even papers. The materials are inexpensive, and can include such sources as recycled drink bottles. Further, the generators can be made from nearly-transparent polymers, .allowing their use in touch pads and screens.
Fig. 1: At top, when an electric donor (PET/PMMA) and receptor (Kapton) are separated, an induced charge is created. At bottom, a similar effect is seen when the materials are rubbed together; a working example of this latter type of generator is seen in the photo on the left. (Credit: Inertia Films.)
Over time, Wang and his research team have increased the power output density of their triboelectric generator by a factor of 100,000 — reporting that a square meter of single-layer material can now produce as much as 300 W. Applying micron-scale patterns to the polymer sheets increases the power output; the patterning effectively increases the contact area and thereby increases the effectiveness of the charge transfer. By using this patterning, the volume power density is able to reach more than 400 kW/m3 at an efficiency of more than 50%, providing significant power from a relatively small mass. “This opens up a source of energy by harvesting power from activities of all kinds,” said Wang. The researchers have created a range of energy-gathering techniques from “power shirts” containing pockets of the generating material, to shoe inserts, whistles, foot pedals, floor mats, backpacks, and floats bobbing on ocean waves. Wang believes the discovery can provide a new way to not only power mobile devices such as sensors and smartphones, but also lead to a new type of self-powered sensor, allowing detection of vibrations, motion, water leaks, explosions — or even rain falling. The research has been supported by the National Science Foundation; U.S. Department of Energy; MANA, part of the National Institute for Materials in Japan; Samsung in South Korea; and the Chinese Academy of Sciences. For further information, contact John Toon, jtoon@gatech.edu, 404-894-6986. Richard Comerford ELECTRONIC PRODUCTS • electronicproducts.com • JANUARY 2014
12 Outlook Innovations impacting products, technology, and applications
The Advanced Automotive Battery Conference charges into Atlanta The Advanced Automotive Batteries (AAB) Conference helps engineers keep pace with the technology and market development of advanced vehicles and the batteries that will power them. This year, it takes place at the Hyatt Regency in Atlanta, GA from Feb. 3 to 7. It offers a technical and business exchange between large energy-storage users and developers and includes four symposia, tutorials, exhibits, posters, and short presentations. Many of the carmakers' chief energy-storage technologists will chair a session, present, or attend AABC. The conference technical sessions include: LLIBTA symposium on large lithium-ion battery technology and application: • Track A: Cell Materials and Chemistry — An in-depth examination of the recent developments and future prospects of cell materials and chemistry in large li-ion batteries. • Track B: Battery Engineering — An exploration of cell and pack engineering for various large-battery applications, li-
ion battery life requirements and challenges, and validation of battery safety and abuse tolerance. ECCAP symposium on large electrochemical (EC) capacitor technology and applications — A review of large EC capacitor technology, including advances in materials and cell design, pack engineering and performance in key applications. ABBTAM symposium on advanced automotive battery technology, application and market — Dissects the vehicle and battery markets by segment and reviews the recent advances in automotive battery systems technology. Tutorials on EC capacitors and liion cell and pack technology — Offers world-class tutorials on the fundamentals of EC capacitors and large li-ion battery technology. Posters — Authors are encouraged to submit an abstract in order to apply for a poster that presents your latest R&D findings
Exhibits — Companies can show their wares in a booth. Exhibit hall hours are Tuesday (Feb. 4), 5:30 to 7 p.m.; Wednesday (Feb. 5), noon to 8 p.m.; Thursday (Feb. 6), noon to 7 p.m. For more information, e-mail info@ advancedautobat.com, call 530-692-0140, or go to www.advancedautobat.com. Paul O’Shea
DesignCon starts January 28 in Santa Clara The DesignCon conference in Santa Clara is for chip, board, and systems design engineers and focuses on signal integrity at all levels of electronic design: chip, package, board, and system. The conference part of the event will be operating Tuesday, January 28, through Friday, January 31. There will be 100+ technical tutorials, panels, and case studies presented across 14 tracks. On Tuesday, Prof. Dr. Hermann Eul, Vice President and General Manager of the Mobile & Communications Group at Intel, will give the keynote speech from 12:00 to 12:45 p.m. The expo area will be open on Wednesday and Thursday, the 29th and
30th, from 12:30 to 6:00 pm. It will have over 150 exhibitors with the latest in high-speed serial design, signal integrity, and test & measurement. There will be free education and speed-training, panels, and product teardowns in the
JANUARY 2014 • electronicproducts.com • Electronic Products
Chiphead Theater, plus many in-booth trainings and vendor sessions. Free expo passes are available from the show web site (www.designcon.com). Jim Harrison
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14 Engineering Distribution
v
The Forgotten NAND: Low-Density SLC
Q+A
What is “the forgotten NAND”? In the overall scheme of NAND memory, low-density SLC NAND may have a small market share, but it plays an important role. While everyone is talking about high density flash and 3D NAND, low-density SLC is busy playing an important role in things we touch every day. Electronic Products’ Jim Harrison explores some frequently asked questions regarding low-density SLC NAND — and the role it plays in our everyday lives.
SLC NAND – for Industrial and Consumer Applications Q What is LoW-DeNsity sLC NaND? A Invented by Toshiba, SLC (Single Level Cell) NAND is the
original NAND architecture. Its much higher endurance (vs. MLC) makes it ideally suited for a variety of consumer and industrial applications where longevity of supply is important. Low-density SLC refers to (<16-Gbit) SLC NAND flash memory. While many applications are moving to MLC, SLC is still around in a big way — even if it does fly under the radar when compared to the attention its MLC NAND counterparts receive. SLC is the only memory currently available which can provide high levels of endurance, long life cycles, high reliability and wide temperature ranges. Low-density SLC NAND is available in an asynchronous (or legacy) interface only, with an interface speed of up to 50 Mbytes/s. By way of comparison, highdensity SLC and MLC NAND devices typically have the togglemode DDR interface, which supports an interface speed of up to 400 Mbytes. Available packages for low-density SLC NAND include TSOP and BGA. The BGA is available in a new, smaller 67-ball version — as well as the older 63-ball version. The most popular configurations are 3.3-V, x8 TSOPs and 1.8-V, x8 BGAs.
Q Where CaN LoW-DeNsity sLC NaND be fouND? A SLC has a relatively small market share in terms of total
NAND bits, but it runs a lot of things that people take for granted — it has a substantial impact. It is found in a lot of places that people don’t necessarily know about, including TVs, ink-jet printers, digital cameras, set-top boxes, toys, exercise equipment, automation control, printers, teleconferencing equipment, POS terminals, and more. Parts with –40° to 85°C temperature range are especially popular for industrial and outdoor applications.
JANUARY 2014 • electronicproducts.com • ELECTRONIC PRODUCTS
Q What fuNCtioN Does LoW-DeNsity sLC NaND perforM iN these proDuCts?
A It’s the ROM (read-only memory) for a lot of these products
— used for boot up and small amounts of datalogging. People tend to take it for granted when they press a button on their printer and it boots up right away. SLC NAND makes it happen.
TOSHIBA SLC NAND Density
Available Configurations
Gbit
Byte Page
Voltage
Bus
Temperature
Package
1
2176
3.3V
x8
Commercial
48 pin TSOP
2
2176
3.3V
x8
Industrial
48 pin TSOP
3
2176
3.3V
x8
Industrial
63 ball BGA
4
2176
3.3V
x8
Industrial
67 ball BGA
4
4352
3.3V
x16
Industrial
67 ball BGA
8
4352
1.8V
x8
Industrial
63 ball BGA
1.8V
x8
Industrial
67 ball BGA
1.8V
x16
Industrial
67 ball BGA
Q What Does the future hoLD for LoW-DeNsity sLC NaND?
A It will be around for quite some time, as there aren’t any good
alternatives available at the moment. NOR flash is more suited to code-storage applications, and, for any given lithography process, the density of the NAND flash will always be higher than NOR flash which makes NAND a lower price per gigabyte option. For example, the highest-density NOR commercially available is 1 Gbit, while SLC NAND starts at 1 Gbit and goes up from there. In regard to MLC, although it offers high density and low cost per bit, it can’t compete when it comes to endurance, temperature range, and speed. Additionally, MLC NAND is not available in these low densities anymore.
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Engineering Distribution 15 Q What other types of sLC NaND are avaiLabLe?
Product Closeup
A SLC NAND is available for industrial
temperature operation, and in both x8 and x16 bus widths.
Q What Does the future hoLD for sLC NaND?
A ECC requirements for SLC NAND have
increased from 1 bit/512 bytes to 8 bits/512 bytes. Therefore, it is expected that SLC NAND flash with built-in error correction (ECC) hardware will become more popular. Toshiba offers the BENAND™ (1-bit ECC NAND) family to meet this need. BENAND™ is SLC NAND with embedded ECC, which removes the burden of ECC from the host processor. Currently, the lowestdensity SLC NAND available is 512 Mbits. In the near future, the lowest density available will be 1 Gbit. With enough ECC, SLC NAND can still reach 100,000 write/erase cycles, but, with the minimum recommended ECC, reaching 60,000 write/erase cycles is more common.
NAND FLASH MEMORY
Embedded | Storage
DESIGN ADVANTAGES o f LOW-DENSITY SLC NAND
Q What Does toshiba offer iN the Way of sLC?
A I recently talked with Brian Kumagai,
director of NAND Flash Memory Products for Toshiba America Electronic Components, to find out more about what they are doing in this area. Toshiba has the full range of SLC NAND available - including the aforementioned BENAND family. According to Kumagai, “Toshiba developed NAND-type flash technology in 1984 and was the world leader in promoting its practical use. We continue to maintain our leadership position in high density, advanced processes, and mass-production technology. SLC chips can read and write large amounts of data at high speed, support high-write/erasecycle endurance, and offer excellent reliability. Toshiba has developed SLC devices to meet the diverse needs of different embedded applications. Our lineup for SLC NAND ranges from midcapacity models (those with a capacity of between 1 and 4 Gbits) to largecapacity models (those with a capacity of 8 Gbits or more). For these SLC NAND products, we provide support related to driver software, and technical assistance for developing NAND flash products.”
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Electronic Products • electronicproducts.com • JANUARY 2014
91313_Toshiba_EP_Jan 2014_4.125x8.625.indd 1
12/13/13 2:02 PM
16 Engineering Distribution
IN PARTNERSHIP WITH
Handicapping 2014 Tech Trends One candidate for the title of “top tech trend of 2014” involves wearable connected sensors, which allow people to track a variety of personal data — including heart rate, blood ike horse racing enthusiasts engaged in serious study of pressure and sleep quality — then analyze and share that the Daily Racing Form, in January engineers, compoinformation wirelessly. Wearables even provide the potential nent buyers, and sales execs pore over industry projecof using technology to “enhance” reality (e.g., Google Glass), tions and market research studies in an attempt to identify ushering in a new era that some call the “quantified self,” this year’s technology winners and also-rans. In terms of tech trends, the general consensus among those whereby every aspect of a person’s life is captured and available for dissemination. By 2017, 169.5 million wearable health paid to gaze into a crystal ball puts the Internet of Things, and fitness devices will be on the market worldwide according wearable connected devices and solid state lighting (SSL) in to ABI Research, with about half of these devices designed for the winner’s circle. Here’s why: Driven by the convergence remote and home monitoring. of increasingly connected devices, cloud computing and the According to industry analysts, the introduction of big data analytics, the “InLED lighting sector continues to works ternet of Things” is composed of identifithrough recent over-capacity issues and able objects seamlessly integrated into the will renew capital spending this year. information network, including addressMarket research firm Strategies Unlimited able sensors embedded in machines to notes that the average cost per kilolumen allow them to connect and share informahas declined from $13 in 2011 to less tion with people and other machines. A consumer version of Google Glass is than $3.65, but that packaged LED price One characteristic shared by Internet declines have been partially offset by sapof Things applications is the ability to take expected to be launched during the first calendar quarter. phire wafer cost reduction, yield improvereal-time information, apply end-to-end ments and wafer size increases. analytics, and obtain a course of action. An example of how Declining sapphire prices and the continued competitivethis works is data collected centrally from global production ness of silicon carbide (SiC) have taken some wind out of the locations that can immediately be studied and responded to sails of GaN-on-silicon LED proponents. Lux Research sees by product managers as these events are taking place. SiC and sapphire continuing to dominate the LED market As the Internet becomes an integrated part of our daily through the decade, benefitting from continued technology lives, the risks associated with being connected have become improvements to boost throughput and cut costs. more apparent. Last year we discovered that information was For 2014, lighting manufacturers are looking to reduce not as secure from third-party entities — private and governpart counts and are also turning to mid-power packaged mental — as we had assumed. According to Ericsson ConLEDs for applications once thought reserved for advanced sumerLab research, 56% of daily Internet users are concerned high-power products, opening up new market opportunities. about privacy issues. However, only 4% said that they would In summary, research firms such as IC Insights have actually use the Internet less. predicted that Internet-capable converging technologies and To protect data, Internet sites are demanding more commobile electronic systems will keep demand for ICs strong plex passwords. This is leading to growing interest in biometthrough 2017. Total worldwide production value of electronic ric alternatives. For example, Ericsson ConsumerLab found systems was projected to increase 4% last year to $1.41 trillion that 52% of smartphone users want to use their fingerprints and climb to about $1.74 trillion in 2017, which represents instead of passwords and 48% are interested in using eye-reca compound annual growth rate (CAGR) of 5% from $1.36 ognition to unlock their screen. A total of 74% believe that billion in 2012, according to IC Insights. biometric smartphones will become mainstream during 2014. BY MURRAY SLOVICK
A DVE RT I SEM EN T
L
Technologies to Watch in 2014 on Mouser’s site. Computing
Touch
Lighting
JANUARY 2014 • electronicproducts.com • ELECTRONIC PRODUCTS
RFID & NFC
IN PARTNERSHIP WITH
Engineering Distribution 17
Technologies to Watch in 2014 ical devices include accelerometers to warn of falls, and insulin pumps and glucose monitors for diabetics. Each of these devices can connect to a smartphone via Bluetooth, hile 2013 saw some remarkable advances in and can issue an alert to their doctor by triggering a call MCU and wireless technologies that further over the cellular network. enable the Internet of Things, 2014 will move Few industries have undergone such a rapid change in forward with the emergence of a more practical Internet core technology and product offerings as lighting. Fueled by of Useful Things. For some, this Internet of Useful Things rapid market acceptance, solid-state lighting manufacturers promises a world where nearly every device continuously are translating innovative technologies such as more-efficient analyzes and transmits data about operational minutiae silicon-carbide substrates into new classes of mainstream while winnowing non-useful details. products that dramatically reduce the size and power conThe trend toward a more useful world of connected sumption of more powerful LED driver ICs. For example, devices hinges on a new class of smart sensors. Sensor inLED headlamps are tegration and sensor evolving beyond just a fusion will continue standard replacement to be the watch words for headlights in new for these new sensor vehicles. Increasingly, networks. In turn, premium features more sophisticated such as side illumisensor systems will nation and cornering rely on a new class of headlights are appearprocessors — blending, thanks to greater ing low power and reliability, smaller high performance at size, and lower cost of a lower price point brighter LEDs. needed to enable While enhanced widespread use. hardware solutions Expect more everyday continue to emerge devices to become Wearable computing brings more immediacy to data and enables new applications for smart sensors, intelligent and netsuch as evidence-based healthcare that draws on continuous collection of vital health systems designers are worked. statistics. (Source: Intel.) looking to surround In 2014, portable and wearable computing promises to introduce major shifts users with a more natural environment that provides an immersive experience via interacting with IoT devices and in how humans interact with computing devices and inforthe cloud. Ultimately, all these key technologies — the Inmation, dramatically reducing the gap between immediate ternet of Useful Things, wearable computing, and LEDs — information and the person for whom that information is serve the purpose of bending technology to meet real needs the most useful. as efficiently as possible. With the continued evolution Health and fitness buffs already wear monitors that of these key areas in 2014, the industry is moving rapidly record their heart rate and the distance they run, coupling toward that objective. that to a PC to analyze the results. Wearable wireless med-
By Mouser Electronics, www.mouser.com
W
A DVE RT I SEM EN T
/applications
ELECTRONIC PRODUCTS • electronicproducts.com • JANUARY 2014
18 Displays
Touch panel design trade-offs
terials including soda-lime glass, chemically strengthened soda-lime glass, super glass, or plastics like PMMA. When specifying a cover lens, potential characteristics that drive the material choice include hardness, impact strength and safety. For example, soda-lime glass is fairly scratch resistant while PMMA is not. However, soda-lime glass can also be easily broken by a surface impact and may produce dangerous glass shards when it fails. PMMA, on the other hand, is extremely difficult to break with surface impact. Super glass is somewhere in the middle: It doesn’t scratch or break as easily as standard soda-lime glass, but when it does fail, it shatters. Another consideration when choosing a cover lens material is the dielectric, which is very important to the touch panel designer. The touch panel’s electric field has to propagate through the cover lens: the higher the dielectric, the better the propagation and the thinner the material can be. A good rule of thumb is that a plastic cover lens has to be about half the thickness of a glass cover lens to
For optimum performance, consider several factors early in the design phase BY TONY GRAY Director of Product Technology, Ocular, www.ocularlcd.com
A
s projected capacitive touch panels continue to expand product offerings in consumer and industrial markets, designers need to become familiar with the trade-offs involved when designing-in a projected capacitive touch panel. A touch panel is not a simple commodity like a resistor or linear dropout regulator, but a complicated subassembly of an electric field generator with a highly sensitive antenna and high optical performance. To achieve optimum performance, designers must consider a number of factors early in the design phase. “Designing Touch Sensors in 3D,” a previous article featured in Electronic Products, described the general operation of a touch panel and discussed some of the considerations that designers must take into account. However, there are even more details to be considered, such as alternative materials that can be used for constructing a projected capacitive touch panel, the characteristics of those materials, and the functional trade-offs involved. Most touch panel designs include a cover lens, typically with silkscreen that is used for logos, button labels, and voids for LEDs or photodetectors. Cover lenses can be made from a variety of ma-
ngle color OLED displays
way from VFD displays, OLED has faster ngle, uses less power, is thin, light weight &
ed
Okaya introduces single color OLED displays Consider a step up to color or away from VFD displays, OLED has faster response time, wider viewing angle, uses less power, is thin, light weight & can be made sunlight readable.
www.okaya.com/products/display/oled JAnuArY 2014 • electronicproducts.com • ElEctronic Products
Fig. 1: Thickness comparison: Glass cover lens vs. plastic cover lens
achieve the same performance (see Fig. 1). The touch panel design can typically be adjusted to accommodate a specific thickness of material; however, the materials are not automatically interchangeable. A touch panel that has been designed for a 1.1-mm soda-lime cover lens cannot be replaced with a 1.1-mm plastic cover lens and provide the same performance. The touch panel design will need to be adjusted in some way to accommodate the material of choice. This could be as simple as turning up the gain of the touch panel controller, or it could be as complicated as changing the thicknesses of other layers in the touch panel itself, which would result in a redesign of the overall stack-up. Cover lenses can also be enhanced with films and/or coatings, including anti-glare (AG), anti-reflective (AR), anti-smudge, etc. Some of these are thin film layers that are applied to the top of the cover lens material while others are chemical etching processes. Each type of film or coating has its benefits and drawbacks. A benefit is the additional durability that coatings can provide for the touch panel. However, coatings may also reduce scratch resistance and some can be applied to glass while others can only be applied to plastic. The good news is that these films and coatings are so thin that they do not alter the performance of the touch panel, so they can usually be added without any impact to the overall design.
Fig. 2: Bonding layers
Displays 19 The next material to consider is the adhesive used within the layers of the touch panel. Depending on the touch panel design and whether or not the touch panel is being bonded to a TFT, the entire stack-up may include three separate adhesive layers (see Fig. 2). Each layer can be a wet or dry bond, and different bonding agents are typically used for each layer. A wet adhesive is a viscous liquid that has to be cured, usually with UV light. A dry bond is typically a sheet adhesive similar to double sided tape. The sheet adhesive may have a plastic base, typically PET, or it may just be a layer of adhesive which is commonly referred to as “no-base” adhesive. One of the biggest concerns when choosing an adhesive is birefringence. When light passes through materials like PET, different wavelengths in the light are refracted at different angles. This refraction happens in all directions equally, so it’s not noticeable to the human eye. The issue arises when looking at the material through polarized sunglasses, the light rays are aligned in one direction and a prism/rainbow effect occurs across the material. For outdoor applications where the use of polarized sunglasses is possible, PET-based adhesives should not be used in any of the internal bonding layers to eliminate birefringence. Another factor to consider when discussing layer adhesives with the touch panel manufacturer is the temperature range of the adhesives being used. Some adhesives can stretch, which allows air bubbles to form if the temperature gets too high. This might not be an issue for the end application, but it could be a concern during manufacturing, especially if the different bonding layers are being built by different suppliers. One supplier may need a certain cure temperature for their adhesive that is too high for another adhesive layer. In addition to material selection, there are also mechanical constraints that must be considered. The touch panel controller chip is sometimes on a flexible printed circuit, or FPC, that is attached directly to the touch panel. This is called a chip on flex (CoF) design (see Fig. 3). In other cases, typically on larger touch panels, the controller is on a separate PCB. The PCB has connectors that mate with FPCs connected to the touch panel. In either case, the placement, size Fig. 3: Chip on and shape of the FPCs can be a critical factor in the me- Flex (CoF) design chanical design of the TFT mounting and the enclosure. This is where a 3D model of the touch panel and controller can be invaluable. With a 3D model you can ensure that there is no interference with the FPCs, or you can use the model to design custom FPCs if needed. One caveat: FPCs are made from a base sheet material. The cost of the FPC is directly related to the number of FPCs that can be created on a single sheet; an FPC that includes bends or right angles is going to lower the number of FPCs per sheet and increase the cost. Another factor to consider with FPCs is shielding. Most applications don’t need shielded FPCs, but some require shielded FPCs to keep EMI in the environment from affecting the touch panel, or to keep the EMI generated by the touch panel control signals from polluting the system. A shielded FPC is typically a two- or three-layer FPC with a ground plane on one side or on both sides of the signal layer. Shielded FPCs are much more expensive than single layer FPCs and should only be used when absolutely necessary. Touch panel makers can help navigate designers through these various options, but only if they are provided with details about the application. The details required include: • Maximum thickness for the touch panel assembly. • Are there any impact or safety requirements? • Is there a requirement for a cover glass coating (for example, anti-reflective, anti-glare)? • Is this an indoor or outdoor application? Can outdoors uses wear polarized sunglasses? • Are there additional bonding steps needed after the touch panel assembly is received? • Are there any mounting concerns or restricted areas for the FPCs? • Are there any special EMI concerns? The answers to these questions will help touch panel vendors choose the right materials for the touch panel design and avoid costly design impacts that may occur down the road. ■ ElEctronic Products • electronicproducts.com • JAnuArY 2014
20 Energy-Saving Initiative an electronic products special series
Better get that power factor corrected! Smart meters can measure both kWh and more accurate kVAh BY RAMANAN NATARAJAN Product Marketing Manager Texas Instruments, www.ti.com
D
eployment of smart energy meters is in full swing worldwide. Traditionally, consumers like me and you pay only for the kWh we consumed for all the electrical equipment in our homes. However, for all equipment without power factor correction (PFC), the energy draw
position to expose our bad consuming habits. We’d better get that power factor corrected quickly, lest the utility companies decide to come at us with vengeance for their pound of flesh. One way to protect ourselves from this vengeance is using a power factor controller (PFC). One example of a number of ICs available for this task would be TI’s UCC28180 PFC controller.
and office such as TVs, air conditioners, wide-area lighting, projectors, workstations, and in industrial/IT infrastructure environments to such things as power supplies for process automation, programmable logic controllers, datacenter servers, and cellular base stations. Active and passive PFC Active PFC control uses switch mode power conversion, while passive PFC involves simply inserting good old inductors and capacitors, at the front end of electrical equipment. Although component count may be higher, there is huge savings in overall equipment cost, size, weight, and even manufacturing costs by moving from passive to active PFC. A classic example is in a commercial multi-kW air-conditioner. In this instance, the size and weight of the passive PFC inductor is so huge, you have to bolt it to the chassis and add a wire harness to connect it to rest of the electronics driving the main compressors and motors. Adopting an active approach, using high-frequency switching, the size
Fig. 1: Smart meters measure both the kWh and kVAh.
from the electrical outlet is, in fact, much higher. It is more correctly represented by kVAh (kilovolt-amp-hour), which is not affected by the voltage-current phase differences. The cost of this incorrect measurement is graciously borne by our friendly neighborhood utility company. Smart meters can measure both the kWh we consume and kVAh that the utility company actually delivers. Beware - these smart devices are in a
These controllers use a boost topology operating in continuous conduction mode (CCM), which lends itself to a wide range of power levels, from Fig. 2: Power factor and THD correction achieved using the a few hundred watts UCC28180 PFC IC. to several kilowatts. and weight of the inductor shrinks and This type of controller can be applied to results in significantly reduced magnetics a broad variety of equipment in home
JANUARY 2014 • electronicproducts.com • ELECTRONIC PRODUCTS
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22 Energy-Saving Initiative an electronic products special series cost. From a mechanical design perspective, the inductor can easily mount directly onto the main electronics board, reducing special assembly costs. Having the capability to program the exact switching frequency provides the flexibility to optimize the design for size, cost, efficiency, and specific choice of power switch (MOSFET, IGBT,
etc.). Many controllers can operate at a low switching frequency of 18 kHz, which facilitates using high-current IGBT power switches which deliver superior performance compared to power MOSFETs in the multi-kilowatt range. For new power devices such as SiC MOSFETs and GaN HEMTs that are on the horizon, the newest con-
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trollers (see www.ti.com/ucc28180-ep) support switching frequencies as high as 250 kHz. This allows you to harness the promise of these wide band-gap power semiconductors which are able to achieve the 50+ W/in.3 and 98% efficiency for the holy grail of power conversion. Total harmonic distortion Total harmonic distortion (THD) is a much desired performance metric these days. This parameter represents what fraction of the fundamental AC input line current harmonic is represented by all the rest of the harmonics combined. Measured as a percent of the fundamental harmonic, the goal is to keep this metric as low as 5% to 10%, especially when the equipment is consuming significant power — 50% to 100% of nameplate power rating. In equipment powered by a UPS, the PFC must extend down to as low as 10% to 20% of nameplate power rating. If the equipment tends to dwell at these load conditions for a prolonged period, the need for low THD at low power may be especially important. UPS face a difficult task in delivering a well regulated ac output under a light, high THD load. A classic example of this situation is a datacenter server power supply that may be idling at light-load conditions for several hours during the night. With many analog PFC controllers available in the industry today, low THD is achievable only when a strong current-sensing signal is supplied to this type of design. This implies using a high-value current measurement shunt resistor, especially at light loads. That higher-value resistor means more losses and lower efficiency. Using available continuous conduction mode PFC controllers, like the UCC28180, allows for a lower-value resistor. With these sorts of controllers, THD as low as 5% is achieved with shunt resistance that is 50% lower in value (see Fig. 2). Now — go forth and get that “power factor” corrected! This information originally appeared on the TI Power House blog (www.ti.com/powerhouse-ep). ■
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24 POY Special
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WINNERS
MOSFET array enables design of ultra-low supply voltages The ALD210800 Precision N-channel MOSFET arrays from Advanced Linear Devices features zero-threshold voltage
that establishes a new industry benchmark for forward transconductance and output conductance. Designed with the company’s EPAD CMOS technology, the arrays allow circuit designers to build ultra-low supply voltages that were never before possible. The precision parameters of the device enable <100-mV min. operating voltage, <1-nA min. operating current, and <1-nW min. operating power. The device enables independent control of each device within a quad package. This innovative capability provides circuit designers with the capability to design next-generation energy harvesting systems and low-power mobile devices. Advanced Linear Devices: www.aldinc.com
• Advanced Linear Devices • Analog Devices, Inc. • AVX • Broadcom • Coilcraft, Inc • Coto Technology Inc. • Cree, Inc. • EMCO High Voltage Corporation
• Linear Technology • Microchip Technology Inc.
• PNI Sensor
Corporation
• STMicroelectronics • Tektronix • Texas Instruments • Transphorm
Analog front end is the tipping point for SDR For over a decade, software-defined radio (SDR) has been viewed as a potentially revolutionary means of communications. In principle, SDR would allow a single hardware design to support communications across a variety of formats, protocols, and frequencies, including GSM, LTE, MIMO, and more. Indeed, many digital chips have been put forward to handle the logic functions of the SDR scheme. What’s been missing is an easy way to implement the necessary analog functionality… until last year. Formally introduced by Analog Devices last October, the $175 70-MHzto-6-GHz AD9361 RF Agile Transceiv-
er integrates an RF front end, flexible mixed-signal baseband section, frequency synthesizers, two analog-to-digital
JANUARY 2014 • electronicproducts.com • ElEctRoNic PRodUcts
converters, and two direct conversion receivers. With its high level of integration, this highly programmable device simplifies design and reduces bill-of-material cost, while at the same offering the widest dynamic range available, with state-of-the-art noise figure and linearity. The extremely flexible transceiver can be configured for experiments and evaluation of signals in FM and TV broadcast reception, prototyping a GSM base station with OpenBTS, developing GNU Radio GPS/WiFi/ISM, and more. Analog Devices: www.analog.com
Simple contact provides an elegant solution Soldering wires to connect something to a pc board may seem simple, until you think about manufacturing in quantity. Then the cost of soldering and, if some rework is required, unsoldering quickly mounts up. Enter the single-position 9296 Series contact — an elegant alternative to solder. The stamped, dual-beam, boxed connector integrates key features that facilitate SMT pickup/placement, wire guidance and retention, and easy wire removal. In essence, it provides all the benefits of a full-function connector, without an unnecessary insulator, for a host of rugged wire-to-board appli-
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26 POY Special ical unit with 5 GHz Wi-Fi sending data back to the main desk and to the cloud, near-field communications to scan an ID tag, and Bluetooth to wirelessly connect a measurement probe of some kind. What other applications? You tell me. Broadcom: www.broadcom.com
cations. Capable of accepting 12 to 20 AWG wires and rated (depending on AWG) for up to 20 A, the 9296 holds solid wires fast and stranded wire even faster. For rework, wires can be removed quickly by either simply twisting them out or, particularly in the case of stranded wire, using a removal tool to release some of the contact force. AVX: www.avx.com
Miniature transformers offer 1,500-Vdc isolation The Coilcraft LPD5030V SMT transformer has two really outstanding features — 1,500-Vdc winding-to-winding isolation and, at just 5 x 5 x 3 mm, a much smaller size than any similar devices. The part is great for coupled-inductor applications
Wirelsss combo chip includes 802.11, NFC, BLE Broadcom’s wireless combo chip, the BCM43341 four-function wireless IC provides the highest level of integration available for a mobile or handheld system. It includes a dual-band (2.4-GHz/5-GHz) IEEE 802.11 a/b/g and single-stream IEEE 802.11n, near-field communications (NFC), Bluetooth LE 4.0 (BLE), and an FM radio receiver.
It’s a chip that offers OEMs the ability to integrate Wi-Fi, Bluetooth LE, and near-field communications easily into a product — with FM radio also available. We think the possibilities are very, interesting, and not just for cell phones. You can now more easily have a portable med-
like SEPIC power converters and also for flyback-type power conversion. The transformer is functional safety listed by UL, and it provides tight coupling, high inductance values from 4.7 to 220 µH, and DCR as low as 0.32 Ώ. Plus, you can get this part starting from only $0.75 ea/10,000. Coilcraft: www.coilcraft.com
A MEMS device breaks the reedswitch size barrier The traditional, glass-encapsulated reed switch is widely used in the electronics industry, but unlike other electronic devices, it’s size isn’t continuing to
JANUARY 2014 • electronicproducts.com • Electronic Products
shrink dramatically: at a length of about 5 mm, it’s reached the practical limit at which it can continue to function. Enter the RedRock RS1-A-2515 MEM-based reed switch from Coto Technology. Its maximum dimensions of 2.18 x 1.10 x 1.10 mm give it a volume that is approximately 8X less than the smallest available conventional reed switch. The single-pole, single-throw switch is the first commercially available example of a magnetically-operated electromechanical switch built using high-aspect-ratio MEMS (HARM) technology. Its combination of zero electrical power operation, very small size and high power switching capability is unique, and offers clear competitive advantages over technologies such as conventional reed switches, planar MEMS switches and active semiconductor switches using Hall or GMR technology. As such, it promises to make possible new types of medical, industrial, commercial, and consumer devices, to name just a few areas of potential application. Coto Technology: www.cotoelay.com
SiC 50-A module provides performance of 150-A silicon device The Cree CCS050M12CM2 silicon carbide (SiC) six-pack module is the industry’s first all-SiC three-phase power module in an industry-standard 45-mm package. When replacing a silicon mod-
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NEAR HERMETIC LONG-LIFE WELDED SEAL MLP: 50 YEAR LIFE, MLS: 100 YEAR LIFE MLP and MLS > 25 YEAR SHELF LIFE WITHSTANDS > 80,000 FEET ALTITUDE COLD TO –55 °C ≤ 250 V; –40 °C, 300–450 V
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ule with equivalent ratings, this six-pack module can reduce power losses by 75%, which leads to an immediate 70% reduction in the size of the heat sink or a 50% increase in power density. When compared to state-of-the-art silicon modules, the SiC 1.2-kV, 50-A modules deliver performance equivalent to silicon modules rated at 150 A. The switching of the SiC module allows significantly less derating than silicon IGBTs, which enables higher-frequency operation, both increasing fundamental output frequency and reducing passive component size in the motor drive. The SiC power module family can provide benefits to solar inverters, uninterruptible power supplies, and industrial power supplies. Cree: www.cree.com
on top, provides a versatile space-saving solution to OEM systems designers in applications where every millimeter counts. This package can be mounted using the surface mount tabs or with swaged PC pins for through-hole applications. The converter mitigates EMI/ RFI by using a quasi-sine-wave oscillator, a fully shielded transformer, proven layout techniques, and filtering. The use of a proprietary high-performance encapsulation formula and process result in very low input-to-output leakage current of <100 nA and a very low coupling capacitance of <250 pF.
EMCO High Voltage: www.emcohighvoltage.com
A/D converter tops all for accuracy, speed
IC creates an e-field to let electronic systems interpret gestures We’ve all gotten use to operating electronics by touching screens, but touch is limited. Humans have a much greater
The LTC2378-20 from Linear Technology is a real 20-bit A/D converter, with industry-leading 0.5-ppm integral nonlinearity. Yes, that’s in ppm — otherwise called 0.00005%. And, in an industry first, this exceptional linearity comes in a
Novel ultrasmall HV dc/dc converter shrinks device height The AG Series ultraminiature dc/dc converter from EMCO High Voltage is a novel surface-mount design that recesses the power supply into a trench
in the host PCB, resulting in a component height profile of one eighth of an inch (0.128 in.). The low profile of the device, coupled with its unique ability to sit inside a circuit board rather than
applications currently use multiple A/ Ds to get the combination of speed and accuracy they need. This IC is so fast they can go to a single A/D — and it is so very accurate that they probably don’t have to do any time-consuming calibration on the assembly line anymore. Think about that. At $29.50 each, the A/D is not a low-cost item, but it certainly may be well worth it. Linear Technology: www.linear.com
SAR-type A/D with 1 Msample/s speeds. And yes, the INL spec is at full speed. This is a breakthrough device for many applications. Worst-case INL is 2 ppm over the -40° to 85°C temperature range. The 16-lead DFN- or MSOP-packaged IC yields a 104-dB SNR and requires just 21 mW at 1 Msample/s and only 21 μW at 1 ksamples/s. A number of medical and industrial
JANUARY 2014 • electronicproducts.com • ElEctRoNic PRodUcts
silent vocabulary, ranging from the simple “OK” gesture to the intricacies of sign language (of which there are at least 137 versions). Wouldn’t it be nice if our smartphones and tablets could recognize these gestures, and do our bidding at the snap of our fingers? Last year, Microchip Technology introduced its patented GestIC technology to make this possible. The configurable MGC3130 is the world’s first electrical-field (e-field)-based 3D gesture controller and, unlike systems that use visual images to derive gesture information, requires little power to provide precise, fast, and robust hand-position tracking and free-space gesture recognition. Microchip Technology: www.microchip.com
POY Special 29 Low-power sensorfusion coprocessor makes design easier The SENtral sensor-fusion coprocessor from PNI Sensor presents a highly effective way to pull in data from complex motion sensor systems with gyroscope, accelerometer, and magnetometer sensors that are often found in mobile and
wearable devices. The device offloads complex sensor algorithm processing from a main CPU and takes only a few hundred microamps while doing so. It will consume only about 1% of the power a standard CPUs needs to perform the task. The IC can handle the job of managing and “fusing” data from these multiple sensors with a nine-axis sensor fusion algorithm, further unburdening the CPU. And, the chip improves accuracy and eases the design task with “constant calibration.” The chip is only 1.6 x 1.6 x 0.5 mm, and it works over –40° to 85°C. What’s not to like about this chip? PNI Sensor Corporation: www.pnicorp.com/
Bluetooth Low Energy chip is in top form The BlueNRG low-power Bluetooth Low Energy network processor IC from StMicroelectronics is compliant with the v4.0 specification. Bluetooth seems to be coming into great favor now, partly due to the Low Energy specification along with the fact that several suppliers are now making single-chip devices that can replace modules and be much more ElEctRoNic PRodUcts • electronicproducts.com • JANUARY 2014
30 POY Special cost effective. This STMicroelectronics implementation looks to be the best around, with the lowest power draw (just 7.3 mA active receive peak current) and
excellent transmit/receive specs. It can act as master or slave and the Bluetooth LE stack runs on its Cortex M0 core while flash memory allows in-field upgrading. STMicroelectronics: www.st.com
Power analyzer eases precision test of real-world signals For today’s designs, power is a major issue. Energy efficiency and new power sources are taking center stage in designs, so engineers are looking for advanced power analysis tools that can keep up with consumer demand, changing technologies, government regulations…and the added workload they present. To meet the demands, the tools must provide a stable, linear response over a wide range of input current levels, ambient temperatures, crest factors, and other variables. Last year Tektronix enter this realm for the first time, and did so with an instrument that sets new measurement standards. The PA4000 multi-phase power analyzer lets designers perform precise current measurements from input to output, even on the highly distorted power waveforms common in many of today’s applications. It is able to check conformance not only to current regulatory standards but is geared for future ones as well, even those with highly modulated waveforms and crest factors as high as 10. The instruments unique, built-in Spiral Shunt design
provides two shunts on each module: one for precise low-current measurements up to 1 A, and another for higher-current measurements up to 30A. Combined with unique, high-speed DSP algorithms, this allows the PA4000 to track power cycles accurately, even in the presence of transients and noise, with measurements up to the 100th harmonic. Tektronix: www.tek.com JANUARY 2014 • electronicproducts.com • Electronic Products
POY Special 31 First qualified GaN HEMT features very low energy losses Transphorm offers the industry’s first qualified 600-V gallium nitride (GaN) device platform with its TPH3006PS GaN high-electron mobility transistor
power conversion designs. The TO-220packaged device features an RDS(on) of 150 mΩ, a Qrr of 56 nC, and high-frequency switching capability that enables compact, lower-cost systems. The devices simplify the design and manufacturing of a wide variety of electrical systems and devices, including power supplies and adapters, PV inverters for solar panels, motor drives and power conversion for electric vehicles. Transphorm: www.transphorm.com
A novel converter uses inductance for sensing (HEMT). The GaN transistor combines low switching and conduction losses, offering reduced energy loss of 50% compared to conventional silicon-based
For years, engineers have measured the voltage across an inductor to sense changes in a circuit or the surrounding field. Until last year, however, no one had apparently thought of using the phenomenon as the basis for creating a dedicated, mass-produced sensing
circuit. But a bolt of lightning struck the minds of Texas Instruments’ designers and product managers recently, causing them to invent the LDC1000 -- the industry’s first inductance-to-digital converter (LDC). The converter can use the inductive properties of coils, springs, and other devices to form sensors that deliver higher resolution, better reliability, and greater flexibility than other sensing solutions that might fit the application, at do so at a lower system cost and with less power consumption. The number of potential applications for this device seems to be growing by leaps and bounds. Texas Instruments: www.ti.com
Fast and Efficient Processing, Flash Memory, a Wide Range of Integrated Peripherals, and Efficient Register-Oriented Architectures S3 8-BIT MICROCONTROLLER FAMILY S3F80P5
S3F8S19
S3F80P9
S3F8S24
S3F80PB
S3F8S28
S3F82NB
S3F8S35
S3F84B8
S3F8S39
S3F8S15
S3F94C4
S3F94C8
Design With Freedom
APPLICATIONS: • Induction Heating Cookers • Small Kitchen/Home Appliances • Boilers • Rice Cookers • Pressure Cookers • Induction Heaters • Air Conditioners • Washing Machines • Dryer Controller • Oven Controller • Vending Machines • IR Remote Controls with LCD • Fan Control • Smoke Detectors • Cordless Tools & Battery Chargers • PIR Motion Detectors • Ambient Light Sensors • Humidity Detectors • LED Lighting Control • System Board Management
FEATURES: • SAM8 & SAM88 Z8-Compatible CPU Cores • Flash Memory: 4, 8, 16, and 32 KB • RAM: 208, 272, 1040, 2086 bytes
For more information about our S3 Product Family, please visit www.zilog.com/S3
• CISC Instructions: 41, 78 • Interrupts: 4, 17, 26 • And many more!
S3F84B8 Block Diagram
ElEctRoNic PRodUcts • electronicproducts.com • JANUARY 2014
32 What’s Inside Product teardown
Apple
iPhone 5S A1533
The iPhone 5S A1533 is the latest handset available from Apple in North America. This high-end smartphone comes with a large diagonal 4-in. display with 1,136 x 640 resolution and in-cell touch technology. Apple also included an A7 processor with a 64-bit dual-core CPU with quad-core GPU in 28 nm. Also featured is the 8-Mpixel rear-camera module with auto-focus lens and LED flash that can record HD video in 1080p, and a 1.2-Mpixel front-facing camera capable of recording full HD video in 720p. What really makes the iPhone 5S stand out is its 500-ppi fingerprint sensor module. The sensor is only 170 µm thin and can easily read the fine details of a fingerprint by using advanced capacitive touch to take a high-resolution image from small sections of a fingerprint from the subepidermal layers of the skin. Other major components of this design include the multimode, multiband Qualcomm baseband processor, the main chassis enclosure with injected molded plastic, and the Toshiba Semiconductor 16-Gbyte NAND flash. The iPhone 5S A1533 is priced at $649.
% of Total Cost by Function Apps Memory Processing 9.78% 9%
User Interface 10.94%
% of Total Cost by Assembly
Camera
7.91%
Baseband
7.37%
RF/PA
7.12%
Power Managment 3.13%
Mech/ Electro 15.77%
BT/WLAN
2.35%
Accessories 2.25% Display 21.92%
Battery Literature Packaging
Display/ Touchscreen 21.92%
Other Enclosures 11.97%
1.87%
Main PCB 45.11%
0.57%
Home Button/ Fingerprint Sensor PCB 7.01% Primary Camera Mod
6.84%
Box Contents
2.86%
Connector PCB
1.39%
Secondary Camera Mod
1.07%
Control Button PCB
0.93%
Light Sensor PBC
0.89%
% of Total Cost by Component Type
To get the complete teardown analysis and parts list of the Apple iPhone 5S A1533, including datasheets, go to... www2.electronicproducts.com/whatsinside.aspx The information in this feature represents a small sample of the data available from the IHS iSuppli Teardown Analysis Service. This service provides complete, detailed analyses of electronic equipment by disassembling products and studying their contents. The service has performed teardown analyses on products including wireless handsets, digital still cameras, PDAs, and laptop computers. IHS delivers complete assessments of all electronic, electromechanical, and mechanical components in such products, from semiconductors to passives to displays. Component data includes parts and estimated pricing and is broken down by assembly, function, component family, and type.
For more information on the IHS iSuppli Teardown Analysis Service, e-mail IHS at info@isuppli.com JANUARY 2014 • electronicproducts.com • ElEctRoNic PRodUcts
Generate the exact waveforms you want. Introducing Agiileent Trueform m technology.
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34 Product Trends Insight into current product developments
Applications in
Military-aerospace products
M
The COTS TPS75 DC Tactical Power Supply from API Technologies is for RF and mobile networks, C4ISR applications, and unmanned systems. It accepts power from single or three phase generators or shore/community power. It converts ac to 28-Vdc power at 75 A. API Technologies: www.apitech.com
JANUARY 2014 • electronicproducts.com • Electronic Products
ilitary-aerospace companies look to be competitive in similar ways to commercial companies, by making products smaller, cheaper, and faster. However, the military companies then must make them more rugged and secure than their nonmilitary counterparts. Read what our experts from API Technologies and VPT have to say about trends for military/aerospace products. Tara Flynn Condon, Vice President, Corporate Development & Marketing for API Technologies, says that in 2014 we will see advancements in miniaturization continue. Just as in the commercial sector, the military and aerospace sectors strive to do more in a smaller footprint for greatly improved flexibility and portability. Reducing size, weight, and power consumption are even more important today, since the military continues to look to extend operational life. Spectrum management is also becoming increasingly important, as we are seeing exponential growth in the amount of data travelling across the same finite spectrum. With this, signal interference has become a major challenge, and will only continue to worsen. More sophisticated electronic systems will need to minimize cross-channel interference.
Military & Space
Design & Manufacturing for Custom Modules & Subsystems Analog, Digital & Mixed-Signal ICs, Modules, Subsystems & Instrumentation
Core Competencies n Frequency Synthesizers n Dielectric Resonator Oscillators n Narrow & Broadband Frequency Converters n Power Amplifiers n Multi-Channel Receivers n Multi-Function Assemblies
Facilities, Manufacturing & Test n ISO 9001:2008 & AS9100:2009 n Class 100 Environment for S-Level Products n Automatic Hybrid Assembly Equipment:
Die Inspect / Pick, Die / Substrate Attach & Wire Bond n IR Reflow Equipment for PCB Based
Assemblies n Automated Digital Product Test to 40 Gbps n Automated RF, Microwave & Millimeterwave
Product Test to 110 GHz
High Reliability Screening & Qualification n VI to Methods 2010A & 2017K n Temp Cycle Stress Test n High Temp Burn-In & Life Test n Wafer Lot Acceptance Test
Bond Pull & Die Shear Test SEM Inspection Metal & Glass Thicknesses n Serialized Test Data n Qualification Report
Delivering Complete, Qualified Solutions to Meet Your Specific Requirements 2 Elizabeth Drive • Chelmsford, MA 01824 978-250-3343 tel • 978-250-3373 fax www.hittite.com • sales@hittite.com Receive the latest product releases - click on “My Subscription”
Download Hittite at the App Store
36 Product Trends Insight into current product developments
VPT provides a full range of proven dc/ dc converters, EMI Filters, and accessory products to Mil/ Aero, High-Rel COTS, and space customers. VPT: www. vptpower.com
The demand for unmanned aerial vehicles (UAVs) is increasing because of the rise in the adoption by government defense programs and civil use applications. Analog Devices provides best-inclass technology solutions in the areas of gimbal control, imaging, radar, avionics, data link communications, and MEMS based sensor technology for UAV navigation. Analog Devices: www.analog.com Custom fabricated sapphire domes feature a combination of optical and mechanical properties for protecting guidance systems, sensors, and other devices in harsh airborne and subsea environments. The domes are unaffected by fast moving dirt, sand, saltwater, and chemicals. They feature Moh 9 hardness and provide up to 85% transmission uncoated in the UV and IR range, and up to 99% when anti-reflective coated on two sides. Meller Optics: www.melleroptics.com JANUARY 2014 • electronicproducts.com • Electronic Products
With SIGINT becoming an even bigger deal in electronic warfare, we expect to see continued growth in this arena. Military relies on GPS; and our enemies know that. Jamming/ antijamming technology is the key to protection, as well as the way to defeat emerging adversaries. There also seems to be a shifting mindset of mil and aero electronics buyers as they take on commercial buying habits. Buyers are holding suppliers to tighter turnaround times and more competitive pricing. Defense electronics firms with a strong commercial backbone that combines strong engineering with the ability to turn products quickly can do well here. Monty Pyle, Vice President of Sales and Marketing for VPT, peered into the future and saw that even though development, qualification, and program cycles are lengthy in the mil-aero industry compared to most other industries, short- and longterm trends tend to be one and the same. With that clarified, we see the trend of cost sensitivity steering requirements to those product offerings that meet the application requirement, but do not exceed them. For example, in past years, a MIL-PRF-38534 Class H qualified dc/dc converter may have been selected for a given application because it was better than the requirement, and the customer then moved on to their next material decision. Today that same customer will scrutinize their application requirements, compare that to the offerings available, and then select either the same product as before, the same but lesser-screened device or even an entirely different device from a commercial offering. Paul O’Shea The LGDS-100-P-K module transient/spike suppressor is rated to sustain transients up to 100 and 202 V to comply with MILSTD-1275 and DEF-STAN 61-5 part 6 standards. The transient suppressor handles up to 100 W with no heatsink. The device provides input undervoltage lockout, output overcurrent protection, and overtemperature protection. GAIA: www.gaia-converter.com
Buckeye Shapeform provides products and enclosures that use the company’s deep-draw technology and refined enclosure creation process. The technology ensures product precision, performance, and efficiency even when employed in harsh and often hostile environments. Buckeye Shapeform: www.buckeyeshapeform.com
Welcome to our Satellite Office With hundreds of space missions under our belt, Coilcraft CPS is well positioned for all your aerospace applications Space is no place for commercial-grade components. That’s why leading aerospace companies rely on Coilcraft CPS for proven RF and power magnetics that feature:
We also offer comprehensive product testing and validation services in accordance with established industry standards, as well as custom screening to your electrical and physical specifications.
• Custom termination plating including Sn/Pb and Gold • Extended temperature ranges (-55°C to +300°C) • Vibration testing to 80 G / shock testing to 1000 G • Low outgassing to NASA specifications
Learn more about how our deep space experience can help your design take flight. Call or visit coilcraft-cps.com today!
* Coilcraft CPS parts are available with or without ITAR compliance.
800.981.0363
847.639.6400 www.coilcraft-cps.com
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Product Update 39 Connectors & Sockets
Coin-cell-battery holder isn’t much bigger than a coin cell
Adding just 1.5 mm to the total height/profile of a CR2016 coin-battery system, the ultra-low-profile (3.1-mm) BLP2016SM-GTR holder from Memory Protection Devices also minimizes the total footprint to 23.09 x 15.09 mm in surface-mount applications. The top-loading coin cell holder uses corrosion-resistant, gold-flashed, nickel-plated phosphor bronze for its pressure contacts to provide a highly reliable electrical connection with low electrical resistance. For increased reliability, the holder also features specially curved positive contacts that provide added pressure for greater battery-cell retention, resisting shock, vibration, and drops (1-meter-drop certified). The holder's body is made of putty-colored LCP plastic designed to withstand SMT reflow temperatures up to 260ºC, as well as high-temperature sterilization cycles (gamma, electron beam, ethylene oxide, steam/autoclave, and hot air) commonly associated with medical-device manufacturing. The holder has a dielectric strength of 1,100 V/mil; is halogen-, PFOS-, and PFOA-free; and complies with such international regulations as RoHS 2, WEEE, REACH, and SVHC. Available on tape and reel for automated assembly, holders are priced at $0.50 each in 5,000-piece lots and are available from stock to 4 weeks ARO. Memory Protection Devices: www.memoryprotectiondevices.com
Low-profile connectors take high current loads
For board-to-board and board-to-wire interfaces, the DF64 Series horizontally mated two-piece connector system uses 18-24 AWG wire and can carry a 5-A current. The two-position connector measures 20.4 x 14.4 mm and has a mated height of just 4.7 mm. Unlike conventional horizontally mated connectors that require a different series of connectors between board-to-board and board-to-wire interfaces, the DF64 Series features a common receptacle that mates with the header and the cable plug. As a result, manufacturers can simplify their assembly and eliminate the time and cost needed to maintain inventory of any additional components. Hirose Electric: www.hirose.com
Solving Your Board to Board Connector Design Challenges
1.0mm Pitch SMT Connector
• Screw-machined Terminals • Thru-hole or SMT • Low Profile • High Density • Customized Designs • Proven Performance
Connector now available in small size
The UltiMate Series size 07 connector is smaller, more compact, and lighter than previous versions, but has the same performance, suiting it for use in harsh and extreme environments. Available in 2 to 9 contact configurations, the connector is sealed to IP68/69 mated and unmated, and has a high corrosion resistance of 1,000 hours. The 14-mm-diameter connector has 360° EMC shielding, guarantees 10,000 mating cycles, and operates from -55°C to 135°C. Cable assembly solutions are available in both straight and right-angle overmolding. Fischer Connectors: www.fischerconnectors.com/htm/Contact-us-Maps.asp
800.424.9850 401.823.5200 www.advanced.com info@advanced.com Made in USA
Electronic Products • electronicproducts.com • JANUARY 2014
New design technology with increased efficiency and optimized thermal management and the use of best grade components afford the design of highest power density DC/DC-converters.
TRACOPOWER introduces six new series of ultra compact isolated DC/DC-converters for high performance applications • Highest efficiency across full load range • Fully regulated output voltages
• 1500 VDC I/O-isolation • Remote On/Off control
6 Watt in SIP-8 package
TMR-6 WI Series 4:1 input voltage range TMR-6 Series 2:1 input voltage range
30 Watt in 6-side shielded 1" x 1" metal package
THN-30 Series 2:1 input voltage range
THN-30WI Series 4:1 input voltage range
60 Watt in 6-side shielded 1" x 2" metal package
TEN-60N Series 2:1 input voltage range
POWERGATE LLC Power Sources Unlimited
866-588-1750 800-966-7784
www.powergatellc.com www.psui.com/traco
TEN-60WIN Series 4:1 input voltage range
www.tracopower.com
GlobTek Ad B rev 8.15.13_Electronic Products 8/28
New Products 41 Power Sources
Need Power?
Think GlobTek
6-W dc/dc converter targets space-critical applications
The ML600xRU series surface-mount dc/dc converters provide 6 W of output power in a 0.87 x 0.80 x 0.40-in. SMT package. They provide the performance, size, and economy required by a wide range of space-critical board-level applications. Available on tape-andreel, they can be used with most automated assembly systems. Sixteen models operate from 9 to 36-Vdc or 18 to 75-Vdc inputs, providing single and dual outputs of 3.3, 5, 12, 15, 24, ±5, ±12, or ±15 Vdc. Standard features include continuous short-circuit protection, high efficiency, an input/output isolation of 1,500 Vdc, and low-noise operation. All models include a remote on/off input. The MTBF (per MIL HDBK 217F) is greater than 350 kh. The operating temperature range extends from –40° to +80°C with no derating required. MicroPower Direct: www.micropowerdirect.com
Green Power Supplies Meet Efficiency Level V Requirements 0-150W
Desktop style Power Supplies with IEC 60320/ C6, C8 or C14 inlets have DoubleEnforced Insulation Mechanical Configurations, Regulated Outputs voltage from: 12 to 48Vdc in 0.1V increments, up to 0-150W of continuous output power. GlobTek’s GT41133 series of enclosed power supplies are housed in Impact Resistant nonvented Polycarbonate Case, Thermal conduction Cooling, Case Dimensions: 62 x 150 x 34 (mm). This Family features: Regulated output with very low ripple, ...for more click www.globtek.com
Dc/dc converters target wireless and telecom networks
The JRCK017A0S32R0 isolated dc/dc power module offers 544-W output power with 95% efficiency. This addition to the ORCA series provides up to 17 A of dc-output current at a nominal output voltage of 32 Vdc. The dc/dc converter module in a DOSA-compliant half-brick form factor, optimized for high-voltage, high-power applications such as wireless and switch networks. The new module also offers Tunable Loop, an optional feature that enables a user to optimize the dynamic response of the converter to match the load with reduced output capacitance and reduce board space. XP Power: www.xppower.com
30-kW dc/dc and ac/dc module targets telecom, military needs
The C/B 6600 series is a 30-kW dc/dc and ac/dc converter module and battery charger. It provides a high density solution for high-power applications in industries such as utility, oil/gas, automation, heavy industrial, military, telecom/ datacom, alternative energy, transit/railway, process control, and power stations. The converter module and battery charger offers two standard dc-input voltage ranges of 320 to 640 Vdc or 450 to 800 Vdc, as well as three-phase ac-input voltages of either 3 x 400 Vac or 3 x 480 Vac. These modules are single output and are available in ten standard ranges from 23 to 800 Vdc. All outputs
Lithium Ion (Li-Ion) Battery Charger
In response to increased concern and requirements of portable equipment and device manufacturers for safety related to Lithium Ion (Li-Ion) batteries, GlobTek’s latest generation battery charger designs include numerous redundant safety features which when communicating with electronics in Lithium (Li-Ion) batteries prevents failure or damage of the battery pack during charging. Aside from safety, the charger includes many features to maintain and lengthen battery life. The GlobTek GT93023-12012(R) is a customized bespoke multiple-bay battery charger designed to charge 5 battery packs in unison. The ...for more click www.globtek.com
International Power Cordsets
This wide range of international power cordsets are approved to international safety agency requirements. Designs are available in various lengths, cable types, conductor gauge, termination, and jacket color. Cordsets are ideal for portable equipment, communication, video, power tools, consumer electronics or industrial and medical equipment. Many designs are available ...for more click www.globtek.com
ISO 9001:2008/ 13485/14001 Certified
www.globtek.com Electronic Products • electronicproducts.com • JANUARY 2014
A44_ElecProd_1-3V_2-0625x9-5_A44.qxd 12/10/13 11:34 AM Page 1
42 New Products Power Sources
DC-DC CONVERTERS 2V to 10,000 VDC Outputs 1-300 Watt Modules
are adjustable and regulated to 0.2% (load) and 0.1% (line). They feature front to back fan cooling with a standard operating temperature of –20° to +75°C (with derating above +55°C), with an option for -40° to +75°C. Schaefer: www.schaeferpower.com
Regulated/Proportional/Programmable Isolated/Single/Dual Outputs
High Reliability Greater than 1,000,000 hrs. Mil Hbk 217F •
Military Upgrades
Expanded operating temperature -55º to +85º C, no derating required •
Environmental Screening
Selected Screening, Mil Std 883 •
ULTRA Miniature
From 0.5" x 0.5" x 0.2" •
Surface Mount/Thru-Hole • Custom Models • US Manufactured • AS 9100 Approved High Reliability AC/DC Power Supplies, Transformers and Inductors
200-1,200-Vdc photovoltaic power supplies are economical
The PV05/10(R) series economical photovoltaic power products are an upgrade of the company’s PV05/10 series. Compared to the PV05/10 series, it has 200 to 1,200-Vdc ultrawide input range (6:1) and its efficiency in high-voltage input improves by 5% to 12%, making it widely applicable for fields like photovoltaic power generation and high voltage inverters. It has high efficiency and reliability, and various protection functions lsuch as input undervoltage protection, output overvoltage protection, short-circuit protection, and reverse input protection. The built-in isolation voltage ensures the safety performance of the module power supply and relevant loading under abnormal situations. Mornsun America: www.mornsunamerica.com
Thermoelectric air conditioners provide cooling to 170°F
The expanded line of ThermoTEC thermoelectric coolers are capable of sustained performance in environments with temperatures as high as 170°F. Select models can be configured to operate in ambient temperatures up to 190°F. The coolers target hot settings including deserts, or industrial applications such as those near blast furnaces. Thermoelectric coolers offer significant advantages over traditional cooling methods such as compressor-based air conditioners. The units are NEMA 4X rated for indoor or outdoor use to provide protection against rain, sleet, snow, windblown dust, and corrosion. In addition, solid-state electronics and a lack of moving parts (except for fans) means thermoelectric cooling systems are low maintenance. The units are offered in sizes from 200 to 2,500 BTUs. EIC Solutions, Inc.: www.eicsolutions.com
See PICO’s full line catalog at
www.picoelectronics.com
YOUR PROVEN SOURCE.
Over 40 years providing reliable products. Over 2,500 Standard Modules.
800-431-1064 PICO ELECTRONICS, Inc. 143 Sparks Ave., Pelham, New York 10803 Call Toll Free 800-431-1064 • FAX 914-738-8225
E Mail: info@picoelectronics.com
3,000-W 1U hot-swap power supply delivers platinum efficiency
The TFE300-54 3,000-W 1U hot-swap power supply delivering 80-plus platinum efficiencies with leading power density of 33.48 W/in3. The TFE3000-54 offers a floating dc output of 54 V which is adjustable from 42 to 55 Vdc, making it ideal for Power-Over-Ethernet, Telecom and Networking applications. Measuring only 1.6 x 4 x 14-in, the supply features: a standby output of either 3.3- or 5-V rated for 2 A; digital I2C/PMBus status & control; and a single rear blind-mate connector for ac input, dc output and status / control connections. An optional 1U 19-in. Power Shelf is available to mount up to 4 power supplies for N+1 or 2N dual feed redundancy operations. Units are safety approved to cTUVus 60950-1 and bear the CE Mark for world wide applications. Tectrol: www.tectrol.com/feature
JANUARY 2014 • electronicproducts.com • Electronic Products
New Products 43
Components & Subassemblies Precision foil resistors target high-end audio
The conformally coated low-profile AUR precision resistors (Y4700xxKxxxxD) feature TCR down to 0.05 ppm/°C from 0°C to +60°C, tolerances down to ±0.01%, and load-life stability to ±0.01%. The resistors target high-end audio applications that require low distortion and noise.
The cold-rolled metal alloy foil devices eliminate any current noise in the element itself and provide the linearity that preserves signal integrity. They offer a resistance range from 5 Ω to 120 kΩ and are rated for 300 mW at +70°C with a maximum working voltage of 300 V and with a rise time of 1 ns with effectively no ringing. Vishay Precision Group: www.vishaypg. com/foil-resistors/
Ceramic capacitors are automotive grade
The CGA3EA series automotive-grade multilayer SMT ceramic capacitors meet ESD immunity requirements according to the IEC 61000-4-2 standard. They come in 1.6 × 0.8-mm packages and offer capacitances from 1 to 10 nF at a rated voltage of 100 V.
0603 RF inductors specified at -55° to 125°C
The ST312RAG0603 chip inductors offer extended temperature ratings of -55° to 125°C along with a higher Q and lower DCR than similar devices. For a 10-nH unit, Q is 38 minimum at 250 MHz and 142 at 1.7 GHz. DCR is 0.054 Ω maximum and Imax is
800 mA. The series has inductance values of 1.8 to 150 nH with 2% or 5% tolerance. Pricing starts at $0.99. Coilcraft: www.coilcraftcps.com
Optically Isolated Power Relays! ▪ MOSFET-Based AC/DC Power Relays ▪ MOSFET-Based DC-Only Power Relays ▪ SCR-Based AC Power Switches
IXYS IC Division Part Number
Blocking Voltage
Load Current 5ºC/W Heat Sink
On Resistance Free Air
Switching Times ton / toff
Examples of MOSFET-Based AC/DC Power Relays CPC1988J
1000 VP
2.25 A
0.9 A
2.5
20ms / 5ms
CPC1909J
60 VP
15 A
6.5 A
0.1
25ms / 10ms
Examples of MOSFET-Based DC-Only Power Relays CPC1788J
1000 VP
2.45 A
1A
1.25
20ms / 5ms
CPC1709J
60 VP
22.8 A
9A
0.05
20ms / 5ms
Examples of SCR-Based AC Power Switches (Zero-Cross Turn-On) CPC1945G
400 VP
-
1A
-
0.5 cycle / 0.5 cycle
CPC40055ST
800 VP
20 A
5A
-
0.5 cycle / 0.5 cycle
Examples of SCR-Based AC Power Switches (Rapid Turn-On) CPC1964BX6
600 VP
-
1.5 A
-
500s / 0.5 cycle
CPC1976YX6
600 VP
-
2A
-
500s / 0.5 cycle
Note: All devices in this table have input-to-output put to output iisolation betw between 2500Vrms and 5000Vrms
The MLCCs come with C0G rating with a temperature range of -55° to +125°C and a temperature coefficient of 0 ±30 ppm/°C max, or NP0 rating over -55° to +150°C and the same temperature coefficient. Contact sales office. TDK-EPC: www.epcos.com
IXYS Integrat Integrated ted Ci Circuits iircuits rcu Division ion (Formerly Clare, are, Inc.) 78 Cherry Hillll Drive Beverly, MA 01915 978-524-6768
http://www.ixysic.com
Electronic Products • electronicproducts.com • JANUARY 2014
44 New Products
Optoelectronics LED module delivers industry’s first sunset dimming experience
The LMH2 LED module features sunset dimming, a game-changing dimming technology that provides a dimming experience similar to incandescent lighting. The module enables a natural dimming from 2700K to 1800K, that was previously unachievable with any other energy-saving technology. It suits applications requiring a traditional style of dimming such as hospitality and residential settings, while still achieving over 80 percent energy reduction compared to incandescent bulbs. The LED module family lets lighting manufacturers address a wide range of lighting technologies with a one module form factor. The module is available from 850 to 3,000 lm at 2,700K and multiple driver options, They can be retrofitted in any room with traditional dimming technologies or used in new installations with 0 to 10 V or digital addressable lighting interface (DALI) dimming technologies. Cree: www.cree.com/modules
New-gen IR emitters are based on metal alloys and MEMS The DLS200X2224 IR/thermal emitters are diamond-like sources (DLS) that are MEMS (microelectromechanical systems) structures that are micromechanically-structured hot plates. The device is a carbon-based nanocomposite (amorphous diamond) that is deposited as a resistance material on a silicon membrane. The material has a temperature coefficient of resistance of 40 A/W typical and a material emissivity of 0.80.
The thermal time constant rise time of 28 ms and fall time of 6.8 ms enable modulation depths of approximately 25% and 10% at modulation frequencies of 100 Hz and 1,000 Hz, respectively. The life expectancy at 750°C (10 Hz, duty cycle, 50%) is 30,000 h and at 600°C it is 250,000 h. The active material of the thermal emitter is a nano-amorphous carbon (NAC) has two structural networks; a hydrogen-containing carbon and a network that consists of silicon oxides. Laser Components: www.lasercomponents.com
LED offers 50-kh life even at 135°C
The newest version of the Oslon Square LED withstands high ambient temperatures. The heat dissipation of the LED allows an increase in the junction temperature enabling them to reach a lifetime of 50,000 hours at 135°C. They are measured and binned at 85°C to ensure that the color point of each LED in a luminaire remains uniform even at high temperatures. The LED suits use in various building applications. It features a color temperature ranging between 2400 and 5000 Kelvin, and has a color rendering index over 80 and a luminous flux of 202 lm. The LED is undergoing extensive quality testing and the certification process under the LM-80 long lifetime standard is in progress. The results of the 3,000 hour test are expected at the end of 2013, and the results of the 6,000 hour test are expected in spring 2014. Osram Opto Semiconductors: www.osram-os.com JANUARY 2014 • electronicproducts.com • Electronic Products
New Products 45
Packaging & Interconnections HigHligHt of tHe MontH
Battery connector can cut onboard footprint over 100%
Offering connection pitches as low as 2 mm, the XD2B miniature battery connector is only 2.6-mm deep, which is >50% to >100% less than competing products. Further, the connector is designed to be recessed into the edge of a board to reduce above-board height. The connector is targeted at mobile devices that use Li-Ion flat-pack batteries, such as smartphones, tablets, dataloggers, and hand-held POS terminals. Electroforming technology produces contacts that are substantially stronger than contacts produced by conventional pressed materials, and an improved spring-contact configuration provides higher contact forces, making the gold-plated contacts more impervious to impact and shock. The connectors are available now in three versions: with 6, 7, or 8 PCB connection terminals (parts XD2B-0406-26A, XD2B-0507-20A, and XD2B-0408-23A, respectively) for mating with 4, 5, or 4 battery connection pads, respectively. Omron Electronic Components: www.components.omron.com
Plastic enclosures house popular SBCs
Based on the company's 1593 series plastic enclosures, the 1593HAM series enclosures are designed to house such creditcard-sized, single-board computers (SBCs) as the Arduino Uno, Due, and Mega 2560; the Beaglebone and Beaglebone Black; and the Freescale Freedom KL-02Z, KL-05Z, and KL-25Z. Machined for the particular SBC type's connectors, controls, and/or LEDs, the cases are molded in black, gray, or translucent blue ABS plastic and come in three different sizes: 4.3 x 2.9 x 1.0 in. (Arduino), 3.75 x 3.04 x1.18 in. (Beaglebone), and 3.6 x 2.6 x 1.1 in. (Freescale Freedom). The enclosure's top, bottom, and front/rear panels are assembled with self-tapping screws. Hammond Manufacturing: www.hammondmfg.com
I/O connectors operate at 5 to 10 Gbits/s
For high-performance in cloud computing, data centers, enterprise servers, and consumer electronics, these SATA III, PCI Express (PCIe) 3.0, USB 3.0, and Thunderbolt connectors operate at frequencies ranging from 5 to 10 Gbits/s. The SATA III connector, in SMT (E9122-001-01) or DIP (E9113-001-01) versions, is popular as a storage interface while the PCIe3.0 connector (E9001-001-01) can support up to 8 Gbits/s and is used in expansion cards. The USB 3.0 connectors type A (E8199-00101) and micro type AB (E8110001-01) are used to provide desktop/mobile connectivity, while Thunderbolt (E9320-00101) supports high-resolution displays and high-performance data devices through a single, compact port. Samples are available upon request and lead time is 4 to 6 weeks. Pulse Electronics: www.pulseelectronics.com Electronic Products • electronicproducts.com • JANUARY 2014
46 New Products
Packaging & Interconnections Fine-pitch board-to-board connector is hermaphroditic
For parallel stacking of printed circuit boards, the 0.5-mm fine-pitch hermaphroditic (FPH) board-to-board connector is robust, yet economical compared to conventional stacking connectors that require separate plugs and receptacles. It helps consolidate connector selection, reduce component engineering and part maintenance costs, and eliminate material scrap on the factory floor. The connector is designed to withstand 50 mating cycles in its working environment, with a maximum mating force of 42 g per contact pair. It handles a maximum of 0.5 A per contact, has a maximum contact resistance of 30 mΩ, is rated for 50 V, and has a dielectric withstanding voltage 500 V. The connector is available with or without locating posts and the ability to withstand reflow soldering of 245°C or 260°C. TE Connectivity: www.tycoelectronics.com
stay
connected
Silver Coated Nickel Filled Epoxy EP79FL Adhesive • Superior toughness • Low volume resistivity • Non-drip compound
Hackensack, NJ 07601 USA +1.201.343.8983 • main@masterbond.com
www.masterbond.com JANUARY 2014 • electronicproducts.com • Electronic Products
Compact vent suits automotive electronics & housings
To provide high-performance venting of automotive electronics' housings in a smaller footprint, the AMF200200 PolyVent Compact Series measures just 14.33 mm in diameter by 8.9 mm in total height — 30% smaller than previous PolyVent Snap-Fit products. It aims to provide a higher level of protection for sensitive components like sensors, motors, and control units, while providing reliable and rapid pressure equalization through the use of an enhanced microporous oleophobic membrane that allows airflow but blocks water and contaminants. The smaller total height provides more flexibility in component layout, and facilitates heat transfer from printed circuit boards to the housing exterior. A low installed height (only 3.45 mm) results in less protrusion above the housing and thus less
New Products 47
Packaging & Interconnections vulnerability to mechanical impacts or steam-jets; often, a protective wall does not need to be added. W.L. Gore & Associates: www.gore.com
Shock-safe fuseholder has UL/CSA ratings of 16 A/400 Vac
Designed for 5 x 20-mm fuses, the FPG fuseholder series is now available in models that are UL4248-1/UL 512 and CSA C22.2 rated for up to 16A at 400 Vac. VDE approval is in accordance with IEC 60127-6 for 10 A at 250 Vac, and the series meets shock-safe requirements according to IEC 529. The fuseholders have a rated power acceptance of 2.5 W at 10 A and operate over a -40° to 85°C range. Priced at $2.11 ea / 100, the series includes thermoplastic versions that meet IEC 603351 edition 4.0 requirements for appliances in unattended use. The units come in seven different mounting options: front or rear panel, threaded neck panel, snap-in or pressin panel, through-hole, or SMD PCB mount. Fuseholders come with fuse carriers and slotted or finger grip caps, and are available with IP40 or IP67 seal protection for front or rear panel mounting and vertical or horizontal PCB mounting. Schurter: www.schurter.com
A lot more of what you need... MORE PERFORMANCE High frequency (>40 GHz) sockets come in various materials to meet your diverse testing requirements. From Bench Characterization to fully Automatic Handlers (>500k cycles).
A lot less of what you don’t!
MORE CHOICES The industry’s widest available DUT interfaces – Spring Probes, Microstrip™ Contacts, and two types of Conductive Elastomers. LESS COST All of these DUT interface materials are available in off-the-shelf molded plastic for a fraction of the cost of others’ machined housings. LESS WAIT We can deliver the sockets you need in four weeks or less! Why settle for less?
Bristol, PA 19007-6810 Tel 215-781-9956 Fax 215-781-9845 Email: info@arieselec.com www.AriesElec.com The Evolution of Interconnect Innovation
Electronic Products • electronicproducts.com • JANUARY 2014
48 Product Mart Electronic Products Presented by the Manufacturer Voice-Capable Alarms Replace Ambiguous “Beep” Sometimes a “beep” or “whoop” doesn’t convey enough information. • Announcer™ Series alarms from Floyd Bell play a pre-recorded audio message or voice instructions up to ten seconds (up to 90dB). • Choose from standard messages (“Warning!”), or custom message production. Announcer™ Series alarms come standard with quick connect terminals and voltage range to fit your application.
Floyd Bell Inc.
Burn-In & Test Sockets 0.4mm to 1.27mm Industry’s Smallest Footprint • Up to 500,000 insertions • Bandwidth 23 GHz • 2.5mm per side larger than IC • Ball Count over 3500, Body Size 2 - 100mm • Less than 25 milliohm Contact Resistance • -55C to +180C • 4A to 8A @80C rise • BGA, LGA, QFN, QFP, & SOIC • Optional heatsinking to 100W • Six different Lid options • Quick Turn Customs
Ironwood Electronics
888-FLOYD-BELL sales@floydbell.com www.floydbell.com
Tel: (800) 404-0204 Fax: (952) 229-8201 www.ironwoodelectronics.com
advertiser index this index is provided as an additional service. the publisher does not assume any liability for errors or omissions.
Absopulse Electronics Ltd. ……………………………………… 41
IXYS Integrated Circuits Division ……………………………… 43
Advanced Interconnections Corp. ……………………………… 39
KOA Speer Electronics, Inc. …………………………………… 29
Agilent Technologies, Inc. ……………………………
Linear Technology Corporation
Cover 2, 33
……………………………… 13
APEC - Applied Power Electronic Conference ………………… 38
Master Bond Inc.
Aries Electronics, Inc …………………………………………… 47
Maxim Integrated ………………………………………… Cover 4
Coilcraft CPS …………………………………………………… 37
Mill-Max Manufacturing Corp. …………………………………
Coilcraft, Inc. …………………………………………………… 10
Mouser Electronics …………………………………………… 16, 17
Cornell Dubilier Electronics …………………………………… 27
National Instruments ……………………………………… Cover 3
CUI Inc. ………………………………………………………… 22
Newark/element 14
DataImage, Inc. ………………………………………………… 44
Okaya Electric America, Inc. …………………………………… 18
Digi-Key Corporation
OKW Enclosures, Inc.
………………………………… Cover 1, 1
……………………………………………… 46
……………………………………………
7
9
………………………………………… 45
Floyd Bell Inc. …………………………………………………… 48
Pico Electronics, Inc. …………………………………………… 42
Global Lighting Technologies, Inc.
Precision Paper Tube Company ………………………………… 46
…………………………… 19
GlobTek, Inc. …………………………………………
Cover 1, 41
Renco Electronics, Inc. ………………………………………… 25
Hammond Manufacturing Company Inc. ……………………… 47
SanDisk Corporation ……………………………………………
Hittite Microwave Corporation ………………………………… 35
TDK-Lambda Americas, Inc. …………………………………… 30
Integrated Power Designs, Inc. ………………………………… 23
TE Connectivity ………………………………………………… 2, 3
International Rectifier …………………………………………… 21
Toshiba America Electronic Components, Inc. ……………… 14, 15
Ironwood Electronics, Inc. ……………………………………… 48
TRACOPOWER
IXYS Corporation ……………………………………………… 34
Zilog Inc. ………………………………………………………… 31
ELECTRONIC PRODUCTS ADVERTISING OFFICES
5
……………………………………………… 40
50 Charles Lindbergh Blvd., Ste. 100, Uniondale, NY 11553 • www.hearstadvantage.com • (516) 227-1300 Publisher: Steve Cholas Sales Administrator: Michelle Smith
AL/DE/NC/SC/CT/FL/MA/MD/ME/NH/NJ/NY/EASTERN PA/RI/VA/VT/EASTERN CA Joe Williams 508-541-4449, FAX: 508-541-0042 Hearst Electronics Group, Franklin, MA jwilliams@hearst.com TN/KY/WV/OH/MI/IN/IL/CO/IA/MN/ND/WESTERN PA/SD/WI/TORONTO Dirk E. Barenbrugge 847-803-4662, FAX: 847-803-8795 Hearst Electronics Group, Naperville, IL dbarenbrugge@hearst.com CA/NV John Spreer 408-293-2650, FAX: 408-521-9955 Hearst Electronics Group, San Jose, CA jspreer@hearst.com AR/AZ/GA/ID/KS/LA/MO/MS/MT/NE/OK/OR/TX/WA/NM/UT/WY/WESTERN CANADA Jim DeAndrea 281-557-9133, FAX: 832-201-0787 Hearst Electronics Group jdeandrea@hearst.com DISTRIBUTOR INVENTORY Pat Cragin 303-815-6853, FAX: 972-767-4659 Operations Manager/Distributor Services pcragin@hearst.com JANUARY 2014 • electronicproducts.com • Electronic Products
CHINA Daphne Liu 86-10-51727138, FAX: 86-10-51727142 Electronic Products China, 21IC.com, Beijing, China daphne@epc.com.cn EUROPE Steve Regnier Tel: +44 1732 366 555, Fax: +44 1732 366 052 Star Media Services sales@electronicspecifier.com KOREA Keon Chang, Sls. Mgr., Young J. Baek, Mng. Director Tel: 82-2-2273-4818 Young Media, Seoul, Korea ymedia@chol.com JAPAN Akiyoshi Ojima Tel: 81-(0)45-624-3502, Mediaship Japan Ltd., Yokohama Fax: 81-(0)45-624-3503 TAIWAN Helen Lai Tel: 886-2-2727-7799 Two-Way Communications Co., Ltd. helen@twoway-com.com REPRINTS Wright’s Media 877-652-5295
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