Flip Chip Bonder Market Growth 2019-2024 Published on: 25 June 2019
Report Description Top Manufacturers
• Besi • ASM Pacific Technology • Shibaura • Muehlbauer • Kulicke & Soffa
E-mail: help@grandresearchstore.com
Flip Chip Bonder Market Growth 2019-2024 MARKET OVERVIEW Although sales of Flip Chip Bonder brought a lot of opportunities, for the new entrants with only advantage in capital without sufficient support in technology and downstream channels, the research group did not recommend taking risk enter this market. According to this study, over the next five years the Flip Chip Bonder market will register a 13.1% CAGR in terms of revenue, the global market size will reach US$ 510 million by 2024, from US$ 250 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Flip Chip Bonder business, shared in Chapter 3. This report presents a comprehensive overview, market shares, and growth opportunities of Flip Chip Bonder market by product type, application, key manufacturers and key regions and countries.
+91-8087042414 (Asia)
|
(+1) 646 781 7170 (Int'l)
|
help@grandresearchstore.com
www.grandresearchstore.com
Flip Chip Bonder Market Growth 2019-2024 MARKET BY APPLICATION
IDMs
OSAT
CAGR 13.1% (2019 – 2025) +91-8087042414 (Asia)
|
(+1) 646 781 7170 (Int'l)
|
help@grandresearchstore.com
www.grandresearchstore.com
THANK YOU Full report URL: https://www.grandresearchstore.com/manufacturing-and-construction/global-flip-chi p-bonder-2019-2024-649
Download Free Sample