ELECTRONICS FORBRUGSMATERIALER
2
Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se
Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi
Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl
MATERIAL
Solder Paste The Multicore® line of solder pastes is designed to meet the rigorous demands of a variety of electronic manufacturing soldering processes. Whether your process requires long abandon times, wide process windows, or high-speed printing, Henkel offers a paste that suits your requirements.
Leaded Solder Paste PRODUCT
description/APPLICATION
% METAL LOAD
ALLOY
MP218
- Outstanding humidity resistance - Colourless residues - Soft non-stick pin testable residues - Extended open time and tack-life - Suitable for fine pich, high speed printing
WS200
- High performance water washable solder paste. - Residues are readily removed with DI water, without the need for a saponifier - Good open time with excellent print definition and soldering activity
SN62/SN63 63S4
TACK (g./mm ²)
print speed mm/sec.
ipc/j-std classification
1.1
25-200
ROL0
(Anti-Tombstoning)
89.5 90.5 (Proflow)
SN62/SN63
90.5
0.8
25-100
OHR1
POWDER TYPE
%METAL LOAD
Lead Free Solder Paste Product
description/APPLICATION
ALLOY
LF318
- Outstanding humidity resistance - Colourless residues - Soft non-stick pin testable residues - Extended open time and tack-life
96SC
LF700
- No-clean - Low voiding - Excellent humidity resistance - Long abandon time - High printing speed
96SC 97SC
(38-20 µm)
WS300
- Lead-free water washable solder paste
96SC 97SC
(45-20 µm)
AGS (45-20 µm)
TACK (G./MM²)
PRINT SPEED MM/SEC.
ipc/j-std classification
88.5
2.0
25-150
ROL0
1.8 2.4
1.8 2.4
20-150
ROL0
0.9
0.9
25-100
OHR1
DAP
AGS
Solder Paste
No Clean Lead free
No Clean Tin Lead
Water Wash Lead Free
Water Wash Tin Lead
LF318™
MP218™
WS300™
WS200™
LF700™ Tin Lead
4
Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se
Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi
Lead Free
Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl
Solder Wire The line of cored wires features the renowned multiple flux cores technology to ensure even and consistent distribution of flux throughout the solder wire. This reliability makes Multicore solder wires the first choice for wire soldering processes.
product
halide content
description
ipc class
alloy options (SN/PB)
alloy options (PB-free)
content (BYweight)
CRYSTAL 400
Halide free, no-clean, clear residue, increased flux content for improved wetting
ZERO
ROL0
60/40, SN62
96SC, 99C, 97SC
2.2%
CRYSTAL 502
No-clean, clear residue, minimal activation for increased wetting speed
0.2%
ROM1
60/40, SN62
96SC, 99C, 97SC
3%
CRYSTAL 511
No clean, clear residues, heat stable
1.1%
ROM1
60/40
96SC, 97SC
2.7%
General purpose high activity for fast wetting
0.5%
ROL1
60/40, SN62
96SC, 99C, 97SC
3%
3%
ORH1
60/40, SN62
96SC, 99C, 97SC
2%
362 HYDRO-X
High activity water washable
Bolded text is normal warehouse products. 96SC = Sn 95,5, AG 3,8%, Cu 0,7% melting point 217 °C 99C = Sn 99,3%, Cu 0,7% melting point 227 °C 97SC = Sn 96,5% Ag 3,0%, Cu 0,5% melting point 217-218 °C
Cored Wire
Water Wash
No Clean
Hydro-X™
C400™ C502™ C511™ 362™
Use fume absorbers when soldering. More info on page 33-35
Norway – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se
denmark – OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 | Fax: +45 70 10 64 info@oemklitso.dk | www.oemklitso.dk
The Baltics – OEM Eesti OÜ Kanali tee 1-328, EE-10112 Tallinn Phone: +372 6550 871 | Fax: +372 6550 873 info@oem.ee | www.oem.ee
5
Fluxes The range of VOC-free (Volatile Organic Compound) fluxes offer reliable, high yield, no clean wave soldering whilst providing significant environmental and safety benefits due to the non flammable VOC-free (water based) flux carrier systems.
Alcohol Based Fluxes product
description/application
% solids
% Halids
acid value
ipc class
application
X32-10
- Clear residue - Wide process window - A general purpose halide-free low solids flux - Suitable for foam and spray flux application systems
2.2
ZERO
15.3
REM0
SPRAY/FOAM
MF 388
- Low residue - Halide free - Ideal for Pb-free wave soldering
3.5
ZERO
20
ROL0
SPRAY
5372
- High temperature - Dipping flux - Suitable for all Multicore alloys
75
0.12
38
-
DIPPING
VOC-Free Fluxes product
MF300
description/application
% solids
- General purpose VOC-free (water based) - No-clean, halide-free and resin-free flux - Compatible with Pb-free processes
% Halids
4.6
acid value
ZERO
ipc class
37
ORM0
application
SPRAY/FOAM
Water Washable Fluxes product
HYDROX/20
description/application
% solids
- IPA based - A high activity water washable flux - Unique activator package - Residues are readily and completely removed by water wash after soldering - Suitable for lead-free wave soldering
20
% Halids
acid value
IPC CLASS
24
ORH1
1.0
application
SPRAY/FOAM
Cleaners page 19
Liquid Fluxes
No Clean
Voc Free
Water Wash
5372
MF300™
Hydro-X20™ SC01™
Rework Small Areas
MF388™ ROML
X32-10i™ REMO
Syntehetic Resin
6
Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se
Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi
Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl
Surface Mount Adhesives Henkel is the world leader in developing cutting edge technology for high-speed syringe dispense and stencil print Chipbonders®. Innovative new surface mount adhesives are developed to meet the challenges of high speed assembly processes and high reliability end user requirements.
Syringe Dispense Adhesive product
description/application
color***
cure
storage (protect from heat)
process methid
shelf life**
3609
- For high-speed dispensing - Red for best vision pickup on light surfaces
RED
90 sec. at 150 °C or 3-4 min at 125 °C
High Speed Dispensing 40,000+ DPH capable.
5 °C ± 3 °C
6 months DOM
3621
- Superior humidity resistance and electrical properties - Can be used in lead free solder applications - Room temperature storage capable
RED
90 sec. at 150 °C or 3-4 min at 125 °C
Very High Speed Dispensing 47,000 DPH capable. Jettable.
5 °C ± 3 °C or 8 °C -21 °C for 30 days
10 months DOM
3627
- Specially formulated for excellent high-speed dispensing - Room temperature storage capable
RED
90 sec. at 150 °C 3-4 min at 125 °C
High Speed Dispensing
5 °C ± 3 °C
6 months DOM
3629
- High reliability - Low temperature cure - Lead-Free capable - Flourescence under UV light
RED PINK
60 sec. at 150 °C 110 sec. at 120 °C 3 min. at 110 °C
Dispensing Printing
5 °C ± 3 °C
6 months DOM
Stencil Print/Pin Transfer Adhesives product
description/application
color***
cure
storage (protect from heat)
process methid
shelf life**
3616
- Specifically formulated for metal stencil print applications - Especially well-suited for large components
RED
60 sec. at 150 °C or 2-8 min at 125 °C
Stencil Print (0.5-2"/sec.)
5 °C ± 3 °C
9 months DOM
3627
- Excellent high-speed printing for finepitch components - Room temperature storage capable
RED
90 sec. at 150 °C 3-4 min at 125 °C
Dispense and Stencil Print
5 °C ± 3 °C
6 months DOM
3629
- High reliability - Low temperature cure - Lead-Free capable - Flourescence under UV light
RED PINK
60 sec. at 150 °C 110 sec. at 120 °C 3 min. at 110 °C
Dispensing Printing
5 °C ± 3 °C
6 months DOM
Clean Up Solvent product
7360
description/application
solvent type
- Nozzle and dispense machine component cleaner - Excellent for removal of uncured adhesive from the board without causing the adhesive to gel
Norway – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se
flashpoint
Aliphatic Ester Blend
denmark – OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 | Fax: +45 70 10 64 info@oemklitso.dk | www.oemklitso.dk
100 °C
corrosive properties
None
ozone depletion potential
None
The Baltics – OEM Eesti OÜ Kanali tee 1-328, EE-10112 Tallinn Phone: +372 6550 871 | Fax: +372 6550 873 info@oem.ee | www.oem.ee
7
Conductive Adhesives Loctite® Electrically Conductive Adhesives provide both a mechanical bond and an electrical interconnection between a device and a circuit board. Loctite® electrically conductive adhesives meet the industry’s need for lead-free alternatives to solder.
Electrically Conductive Epoxy Adhesives Product
3880
3888
description/application
shelf life*
lapshear adhesion (AL/AL)
cure schedules
tg °C
cte ppm/ °C
volume resistivity (ohm-cm)
work life at room temp.
Heat Cure 1-component
- Syringe or stencil dispense - Silver conductive adhesive for solder replacement - Long work life
6 months at 0-(-10 °C)
>1,000 psi 6.9 N/mm²
10 min at 125 °C 6 min at 150 °C 3 min at 175 °C
40
45
<.0.0005
7 days
Room temperature 2-component
Room-temperature cure adhesive for applications requiring a combination of good mechanical and electrical properties
6 months at 21-25 °C
>1,000 psi 6.9 N/mm²
24 hrs at 23 °C 1 hr at 120 °C 30 min at 155 °C
50
>50
<.0.0001
90 min.
description/ cure
*Shelf life- 2-component materials have a one year shelf life at room temperature (21 °C-25 °C)
2-Component Packages
1-Component Packages
Typically used for sample evaluation and rework applications. These packages do not require special storage equipment. They can be stored up to 12 months at room temperature.
All 1-component products are packaged in convenient syringes. These packages must be stored FROZEN at -40 °C. (The exception is product 3880 which is stored at 0 °C.)
Electrically Conductive Adhesives
Chipbonder ™
Screen Print/ Pin Transfers
Dispense Adhesives
3616™
3609™
3627™
3621™
3629™
3627™
Cleaner
7360™
Isotropical Conductive 3880™
Adhesive Clean-Up Solvent 7360™
3888™
3629™
8
Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se
Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi
Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl
Thermal Management Materials The PCTIMs are silicone-free and do not migrate or dry out like thermal greases. These innovative products are manufactured as a highly thixo-tropic phase change compound coated in a strictly controlled manner upon the surfaces of special grades of thin AL or CU foils, or to dielectric substrate films.
Phase Change Thermal Interface Material thermal impedance (°C-in. ²/W) at 80 PSI
thermal impedance (°C-in. ²/W) at 550 kpaI
Thermal conductivity (W/mk)
Phase change temperature (ºC)
substrates thickness (mm)
total thickness (mm)
substrates material
Unsupported film with very low thermal impedance even at low pressure. Fills gaps up to 0.2 mm (0.008") or collapses to form a thin interface. Direct attach to heat sink without heating. Suitable for semiconductor and power electronics applications
0.003
0.022
3.3
45
N/A
0.008 0.2
None
Powerstrate® 51r™
Low thermal impedance, reworkable grade. Most suited to applications on lidded processors where the heat sink may have to be removed for rework.
0.008
0.052
3
51
0.051
0.074 to 0.083
AL 1145-0
Powerstrate® 51,60™
Low thermal impedance, robust grade. Suited to a wide range of applications on bare die processors and other electronics devices.
0.008
0.052
3
51 or 61
0.051
0.064 to 0.16
AL 1145-0
PSX-D
Thermal paste for stencil print or manual application
0.008
0.052
3.4
N/A
N/A
0.254
All
Silverstrate®
Excellent thermal performace, particularly at higher pressures. Typically used on RF devices and SCRs where electrical conductivity is required, (Silverfilled).
0.003
0.022
3.14
51
0.051
0.102 to 0.127
AL 1145-0
Thermstrate® TC™
Phase change compound in applicator bar. Ideal for prototyping, rework and small scale production.
0.021
0.137
0.47
60
N/A
N/A
None
Thermstrate® 2000™
Good thermal performance most suited to applications on power IGBTs, semiconductors, DC-DC converters and other isolated packages.
0.022
0.143
3
60
0.051 & 0.128
0.076 to 0.191
AL 1145-0
product
description/application
Powerstrate® Xtreme™
Phase Change Thermal Interface Material - Electrically Isolating Products product
description/application
thermal impedance (°C-in. ²/W) at 80 PSI
thermal impedance (°C-in. ²/W) at 550 kpaI
Thermal conductIVITY (W/mk)
Phase change temp. (ºC)
Thickness substrates (mm)
total thickness (mm)
substrates material
DIELECTRIC RATING VAC/MIL SUBSTRATE
UL YELLOW CARD
UL FLAMMABILTY
Isostrate® 2000™
Electrically isolating phase change material for use with a wide range of non-isolated components.
0.12
0.78
0.45
60
0.025 to 0.076
0.051 to 0.153
Polyimide
>5000
None
None
Isostrate® J-Series™
Electrically isolating phase change material. Ideal for nonisolated devices in high volume applications where high thermal performance is not required.
0.48
3.12
0.155
60
0.0051
0.076
Polyethylene
>5000
See data sheet
See data sheet
MCMstrate®
Adhesive backed version of Isostrate. Allows pad to be postioned to facilitate assembly.
0.25
1.325
0.4
60
0.025 to 0.076
0.064 to 0.114
Polyimide
>5000
E1049 35
94V-0
EMIstrate®
Unique combination of thermal and EMI management. Excellent choise for radiated EMI control.
0.4
2.6
0.69
60
See data sheet
See data sheet
Polyimide
N/A
N/A
N/A
Norway – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se
denmark – OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 | Fax: +45 70 10 64 info@oemklitso.dk | www.oemklitso.dk
The Baltics – OEM Eesti OÜ Kanali tee 1-328, EE-10112 Tallinn Phone: +372 6550 871 | Fax: +372 6550 873 info@oem.ee | www.oem.ee
9
Thermal Management Adhesives Thermally Conductive Adhesives eliminate the need for mechanical fasteners and clips while providing an efficient method of thermal transfer between heat generating electronics devices and their heat sinks.
Thermal Adhesives product
description/application
cure/ chemistry
specific gravity
viscosity
shelf life
cure schedules
modulus
tg °C
Cte ppm/ ºC
thermal conductivity
315
Self-shimming for electrical isolation; room-temperaturecuring adhesive.
1-component Activator* Acrylic
1.7
Paste
9 months at 5 °C
5 min. at 20 °C 4-24 hr. at 20 °C
390,000 psi 2700 N/ mm2
50
69
0.80 W/mK
384
epairable, room-temperatureR curing adhesive utilized for parts subject to disassembly.
1-component Activator* Acrylic
1.6
Paste
9 months at 5 °C
5 min. at 20 °C 4-24 hr. at 20 °C
400,000 psi 2800 N/ mm2
50
110
0.76 W/mK
5404
S elf-shimming, flexible silicone adhesive for demanding parts such as ceramic boards.
1-component Heat Cure Silicone
2.4
280** g/min.
5 months at 4 °C
10 min. at 150 °C
587 psi**** 4 N/mm2
-40
104
1.0 W/mK
7386
7 387 DEPEND is one component of a two part no mix adhesive system. It is solvent based and has a very low viscosity. 1.75 oz bottle
Heptane and Isopropanol
0.8
Very low
on part life 2 months
N/A
N/A
N/A
N/A
N/A
* Use with activator 7386.
** Extrusion measured @ 50 psi/0.125" orifice. *** Made to order. Initial order may require longer lead time.
**** Youngs Modulus
Thermal Management Mtl.
Adhesives
Shimming
NonShimming
315™
384™
Thermal Pads
Activator
NonInsulating
Electrically Insulating
Electrically Conductive
7386™
Powerstrate® Xtreme™
Isostrate®
Silverstrate®
5404™
Thermal Paste
Specialty Mtl.
PSX-D®
EMI-Strate®
Powerstrate® Thermstrate®
10
Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se
Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi
Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl
Silicones Silicones offer highly diverse product properties for virtually unlimited applications. With their great versatility, silicone products are ideal for intelligent, customized solutions. They offer thermal stability, weatherability, hydrophobic and hydrophilic surface properties, and excellent release, lubricating and dielectric characteristics.
Potting and Encapsulation Silicone gel addition-curing dencity g/cm³
colour
1K
Transp.
pot life 23° C
0.96
150
6H
100˚/240 min 130˚/40 min 150˚/10 min
0.98
35 000 2 500
3 month 15˚C/ 6 month
100˚/240 min 130˚/40 min 150˚/10 min
1 000
1 000
features
Semicosil® 926
- Low viscosity - Ready-to-use, one-component - Rapid heat cure - Low content of uncured polymer - Low ion content
Semicosil® 924
- Thixotropic flow - Low ion content - Low content of volatiles - Low content of uncured polymer - Forms a soft gel on vulcanization
Wacker Silgel® 612
- Very low viscosity - Very low hardness (silicone gel) - Crystal clear vulcanizate - Pronounced tackiness - Excellent mechanical damping properites
1:1
Transp.
0.96
- Very low viscosity - Low ion content
1K
Transp.
0.97
Elastosil® RT745S
mix
Viscosity mPa s
product
1K
Transp.
cure time °C/ime for 1 cm
hardness cone mm/10
applications
60
Encapsulation of electronic components.
50
Recommended for local encapsulation of delicate electronic components,e.g.bonded chips on hybrid components which are exposed to extreme external influences.
2H
23˚/8 hrs 70˚/15 min 120˚/5 min
300
Encapsulation of electronic components and solar cells. Embedding of optical fibres. Production of shock absorbers. Sealing of clean-room filters.
>4 H
80˚/30 min 120˚/5 min 150˚/2 min
5 37 Shore 00
Encapsulation of electronic components
Silicone Rubber Addition-Curing RTV-2 product
Elastosil® RT 601
hardness cone mm/10
mix
colour
dencity g/cm³
Viscosity mPa s
pot life 23° C
- Low viscosity - Medium cured hardness - Excellent tensile strength - Crystal clear vulcanizate
9:1
Transp
1,02
3 500
90 min
23˚/24 hrs 70˚/20 min 100˚/10 min 150˚/5 min
45
All-round potting compound. Manufacture of moulded articles by casting.
9:1
Light Grey
1,17
3 500
80 min
23˚/24 hrs 70˚/20 min 100˚/10 min 150˚/5 min
30
All-round potting compound.
9:1
Transp
1,02
800
90 min
23˚/24 hrs 70˚/30 min 100˚/8 min 150˚/5 min
25
Encapsulation of electrical and electronic components.
9:1
Reddish brown
1,43
10 000
80 min
23˚/24 hrs 70˚/20 min 100˚/10 min 150˚/5 min
55
All-round potting compound.
9:1
Reddish brown
1,3
12 000
60 min
23˚/24 hrs 70˚/20 min 100˚/10 min 150˚/5 min
27
All-round potting compound. Technical mouldings. Encapsulation of electrical components.
9:1
Reddish brown
2,3
35 000
150 min
23˚/24 H 70˚/60 min 100˚/30 min 150˚/10 min
80
Encapsulation of electrical components.
9:1
Grey
1,50
1 100
8h
100˚/60 min 150˚/15 min
20
Encapsulation of electrical components.
Elastosil® RT 602
- Low viscosity - Medium hardness - Excellent heat stability
Elastosil® RT 604
- Very low viscosity - Low hardness - Crystal clear vulcanizates
Elastosil® RT607
- High hardness - Excellent heat stability - Flame retardant
Elastosil® RT 622
cure time °C/ime for 1 cm
features
- Good processing due to low viscosity - Very good mechanical properties - Soft vulcanizates
Elastosil® RT 675
- Low viscosity - Low hardness - Fast curing at higher temperatures
Elastosil® RT 743 LV
- Extreme hardness - Excellent heat stability - Extremely high thermal conductivity
Norway – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se
denmark – OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 | Fax: +45 70 10 64 info@oemklitso.dk | www.oemklitso.dk
applications
The Baltics – OEM Eesti OÜ Kanali tee 1-328, EE-10112 Tallinn Phone: +372 6550 871 | Fax: +372 6550 873 info@oem.ee | www.oem.ee
11
Silicones
Encapsulation and Coating Silicone Rubber product
features
mix
colour
dencity g/cm³
Viscosity mPa s
pot life 23° C
cure time °C/ime for 1 cm
hardness cone mm/10
Elastosil® 935
- Low viscosity - Very long pot life - Fast curing at elevated temperatures - Low hardness - High flexibility - Low risk of inhibition by soldering or flux residues
1:1
Transp
0.97
3 500
7 days 10˚C/14 d
80˚/30 min 120˚/10 min 150˚C/5 min
15
applications
Coating of printed circuit boards. Encapsulation of electronic components.
Bonding, Fixing and Sealing/Gasketing Room temperature Curing RTV-1 features
mix
color
dencity g/cm³
Viscosity mPa s
pot life 23° C
cure time °C/ime for 1 cm
hardness cone mm/10
Elastosil® A 07
- Ready to use, one-component system - Low viscosity - High flexibility - Primerless adhesion to many substrates
1K
Transp.
1.08
10 000 -
3-5 min
5
20
Multipurpose sealant and coating material.
Elastosil® A 234
- Amine-curing system - Flowable - Excellent heat stability - Excellent primerless adhesion to many substrates
1K
White
1.21
35 000
10-20 min
2
36
Gluing and sealing of steam chambers and sole plates of steam iron
Elastosil® A 33
- Ready to use, one-component system - Good mechanical properties - Primerless adhesion to many substrates
1K
Ivory
1.16
2
10-20 min
2
25
Adhesive for the coating and sealing at high temperatures.
Elastosil® A 43
- Amine-curing system - Flowable - Excellent heat stability - Excellent primerless adhesion to many substrates
1K
Transp. Black
1.09
350 000
10-25 min
1-2
30
General-purpose adhesive and coating for technical and medical applications
Elastosil® N 2010
- Neutral curing system (alkoxy) - Sprayable - Flowable - Primerless adhesion to many substrates - Good heat stability
1K
Transp.
1.01
20 000 -
10-25 min
2-4
25
General-purpose adhesive and coating for technical applications
- Neutral curing system (alkoxy) - Short skin forming time - Fast curing - Flowable - Primerless adhesion to many substrates - Good heat stability
1K
Black
1.14
45 000 -
20 min
2-4
36
General-purpose adhesive and for technical applications. CIPG- and FIPG-applications e.g. for headlamps.
Elastosil® N 2197
- Neutral curing system - Solvent free - Non-slump - Excellent unprimed adhesions to most plastic, metal, glass and ceramic surfaces
1K
Grey
1.24
N/A
25 min
2-4
35
General-purpose adhesive and for technical applications.
Elastosil® N 2199
- Neutral curing system - Solvent free - Non-slump - Excellent unprimed adhesions to most plastic, metal, glass and ceramic surfaces
1K
Transp.
1.05
N/A
25 min
2-4
40
General-purpose adhesive and for technical applications.
1.30
N/A
5-20 min
2-4
33
The fully cured rubber can withstand expansion-compression cycles for many years. Especially well suited for joining materials with different coefficients of thermal expansion.
1.0
10
10-25 min
1-2
60
product
Elastosil® N 2034
Elastosil® N 9132 N 9132 S Elastosil® N 189
12
- One-part, ready-to-use - Neutral curing system - Non-slump - Excellent unprimed adhesion to most plastic, metal, glass and ceramic substrates - Flame retardant:meets UL 94V-O
1K
- Neutral curing system (oxime) - Non-slump - Good resistance against mineral oil and coolant fluids - Excellent heat stability - Excellent adhesion to many substrates
1K
Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se
Grey
White
Black
Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi
applications
General-purpose adhesive fortechnical applications. FIPG- and CIPG-application
Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl
Silicones
Heat Cure SiliconeAdhesive Silicone Rubber Addition-Curing product
features
mix
colour
dencity g/cm³
Viscosity mPa s
Shear rate. g/10s
cure time 23 °C
26 min
140˚/20 min 200˚/3 min
45
Allround glue for houseware and metal industry. Useable for silk screen printing.
hardness shore a
applications
- Ready-to-use, one-component - Flowable - Thixotropic - High extrusion rate - Fast curing at high temperatures - Good heat stability - Excellent primerless adhesion to many substrates
1K
Black
1.23
100 000 13 000
Semicosil® 986/1K
- Ready-to-use, one-part system - Thixotropic - Translucent, medium hardness - High flexibility
1K
Transp.
1.07
300 000
-
100 °/6 h 130 °/30 min 150 °/10min
51
General purpose adhesive for the electronics industry.
Semicosil® 987/1K
- Ready-to-use, one-component system - Low viscosity during dispensing nonslump after dispensing - Medium hardness - High flexibility - Primerless adhesion to many substrates
1K
Transp. + Grey.
1.1
300 000 30 000
-
100˚/6 h 130˚/1 h 150˚/10 min
50
General purpose adhesive for the electronic industry. FIPG-and CIPGapplications.
Elastosil® RT 705
Silicone Paste features
colour
dencity g/cm³
operating temp.
hardness cone mm/10
- Good electrical properties - Good adhesion to metal and ceramic materials - Excellent water repellency
Transp.
1.0
-40 - +220
350
Lubricants for shut-off valves. Release agents for compression moulding, extruder die rings.
Silicone Paste P 12
- Soft, heat sink paste with marked thermal conductivity - Electrically insulating
White
2.25
-30 - +200
300
Especially used in semiconductor technology as a heat sink paste.
Geniosil N 550
- Silane modified polymere adhesive, free of isocyanates, tin catalysts and silicones - Neutral curing - Temperature range -50° C to 120 °C - Solvent free - Excellent adhesioin
Grey.
1.3
-50 - +120
Shore A 55
product
Silicone Paste P 4
Norway – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se
denmark – OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 | Fax: +45 70 10 64 info@oemklitso.dk | www.oemklitso.dk
applications
Sealant/elastic adhesive for technical applications. Can be varnished with suitable paints in cured and uncured state.
The Baltics – OEM Eesti OÜ Kanali tee 1-328, EE-10112 Tallinn Phone: +372 6550 871 | Fax: +372 6550 873 info@oem.ee | www.oem.ee
13
Die Attach Adhesives Based on ultra-hydrophobic chemistry, Hysol® die attach adhesives offer very high adhesive strength, elongation at break, and cohesive energy at high reflow temperatures. These properties help electronic packages retain adhesive strength and structural integrity during moisture soak and absorb stresses during the deformations associated with lead free reflow processing.
Die Attach Adhesives for Non-Hermetic Packages For organic substrates including laminates, array, BGA and CSP packagers product
QMI 536 QMI 550SI QMI 550 EC
Thermal conductivity
tg (°C)
9000 CPS
0.3 W/mk
-31
15 min at1 50 ˚C oven 10 sec at 150 ˚C SC
17000 CPS
0.6 W/mk
15 min at 150 ˚C oven 10 sec at 150 ˚C SC
17000 CPS
3.8 W/mk
resin
filler
oven cure/ skip cure
Industry Standard Industry standard for die-to-die bonding; dielectric, high adhesive strength material for organic substrates.
BMI
PTFE
15 min at 150 ˚C oven 10 sec at 150 ˚C SC
Low CTE CVersion of QMI 550 Silica-filled for low shrinkage and low warpage on laminate and flex substrates.
BMI
Silica
Electrically Conductive Silver-filled version of QMI 550; very high adhesive and cohesive strength.
BMI
Silver
description/application
viscosity 5rpm at 25 °C
cte 1/2
modulus at 25°C
storage temp.
93 174
0.30 GPa
-40 °C
33
43 91
1.50 GPa
-40 °C
2
46 148
2.8 GPa
-40 °C
For inorganic substrates incl. CU, Pd, Ag & Au plating, ceramic and black oxide product
14
description/application
resin
filler
Recommende cure
BMI
Silver
15 min at 180 ˚C oven 10 sec at 200 ˚C SC
QMI 518
Electrically Conductive, Large die Similar properties to QMI 519, but formulated to have a low modulus to reduce stress on die larger than 500+500 mil./13-13µm.
QMI 519
JEDEC L1 260C for SOIC, QFN Industry standard for QFN packages. Good for all preplated leadframes, and bare copper. Higher adhesion, excellent electrical and thermal performance.
BMI
Silver
15 min at 185 ˚C oven 10 sec at 200 ˚C SC
QMI 519HT02l
High Thermal Conductivity Very high electrical and thermal conductivity while maintaining excellent adhesion. Suitable for high heat dissipating devises.
BMI
Silver
15 min at 180 ˚C oven 10 sec at 200 ˚C SC
Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se
viscosity 5rpm at 25 °C
Thermal conductivity
tg (°C)
8500 CPS
1.4 W/mk
-64
9000 CPS
3.8 W/mk
18800 CPS
7.3 W/mk
Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi
cte 1/2
modulus at 25°C
storage temp.
69 152
0.10 GPa
-40 °C
75
40 140
5.3 GPa
-40 °C
49
42 104
6.70 GPa
-40 °C
Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl
Encapsulants Semiconductor Liquid Encapsulants. Henkel´s co-cure dam and fill encapsulants cure in one easy step, requiring no pre-cure of the dam material. High purity liquid epoxy encapsulants are designed to work together as dam and fill materials for bare chip encapsulation, protecting gold wire bonds and silicon die from mechanical damage and corrosion. Chip on Board Liquid Encapsulants. These products cure to form void-free globs when exposed to heat, with formulations for low CTE, minimizing stress on wire bonds during thermal cycling. These encapsulants are easy-to-dispense, minimize induced stresses, provide improved temperature cycling performance, and offer excellent chemical resistance.
Semiconductor Liquid Encapsulants Flow Control / Dam Materials product
FP4451
description/application
Flow Control Barrier
pot life at 25 ºC
recommended cure
flow properties
24 hrs.
30 min. at 125 °C + 90 min. at 165 °C
None
viscosity at 25ºC
tg. ºC
cte (1) (ppm/ºC)
% filler
860,000 cps
145
24
72
viscosity at 25ºC
tg. ºC
cte (1) (ppm/ºC)
% filler
storage temp.
-40 °C
Fill Encapsulants product
description/application
pot life at 25 ºC
FP4450
ICs, COB, BGA, PGA
3 days
FP4470
Lead-free Packages
5 days
recommended cure
flow properties
storage temp.
30 min. at 125 °C + 90 min. at 165 °C
High
50,000 cps
155
22
73
-40 °C
30 min. at 125 °C + 90 min. at 165 °C
High
48,000 cps
148
18
75
-40 °C
recommended cure
flow properties
viscosity at 25ºC
tg. ºC
cte (1) (ppm/ºC)
% filler
Clip on Board Liquid Encapsulants product
description/application
pot life at 25 ºC
storage temp.
EO1016
COB, Watch ICs
3 months
15 min. at 150 °C
Medium
70,000 cps
115
40
40
4 °C
EO1060
Chip on Board
25 days
4-6 hrs. at 125 °C
High
15,000 cps
125
40
61
4 °C
FP4401
Chip on Board
24 hrs.
3 hrs. at 170 °C or 6 hrs. at 150 °C
Low
375,000 cps
160
22
75
-40 °C
Norway – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se
denmark – OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 | Fax: +45 70 10 64 info@oemklitso.dk | www.oemklitso.dk
The Baltics – OEM Eesti OÜ Kanali tee 1-328, EE-10112 Tallinn Phone: +372 6550 871 | Fax: +372 6550 873 info@oem.ee | www.oem.ee
15
Circuit Board Protection AND Underfills Henkel´s potting and encapsulation compounds protect PCBs and electrical devices by enhancing mechanical strength, providing electrical insulation, and increasing vibration and shock resistance.
Conformal Coatings description
type
pot life
viscosity cps
cure cycle
secondary cure
delectric strenght (v/mil/kV/cm)
PC 18
- A one component solvent based Acrylic conformal coating specifically designed as a toluene free alternative. - Application by non-atomized selective spray coating equipment. - Components and joints may be repaired by heating the coating with a soldering iron for easy removal.
Urethane
60 min. tack free
350
Heat 2 hrs. at 125 °C
5-7 days at RT
1200/472
continuous up to 110 ºC
PC 28
- Solvent-based, oxygen curing, coating exhibiting superior toughness with abrasion and solvent resistance. - Apply by brush, dip or spray procedures
Urethane
60 min. tack free
35
Heat 5-7 days at 25 °C
Air Dry 30-60 min. followed by 2-4 hrs. at 60 °C
1500/591
continuous up to 110 ºC
PC 62
- Solvent-based, coating exhibiting superior toughness with abrasion and solvent resistance. - Apply by brush, dip or spray to meet MIL-I-46058C, Type PUR, requirements
Acrylic conformal
5 min. tack free
40-60
24 hours at 25°C
45 minutes at 75°C
N/A
–40 -125°C
5293
- UV Silicone for severe temperature cycling environments. - High reliability automotive - No solvents - Low VOC
Silicone
N/A
600
UV 20-40 sec. 75mW/cm2
Moisture Tack free:2-6 hrs. Full cure: 72 hrs
406/160
-40 -204 °C
product
temp. range
Hysol® package level underfill encapsulants meet stringent JEDEC level testing requirements and are compatible with the high temperature processing required for lead free assembly. Our green materials are developed to meet demanding end use requirements, including low warpage/low stress, fine pitch, high reliability, and high adhesion. Loctite CSP/BGA underfills offer easy reworkability as well as excellent vibration and impact resistance. These underfills offer many processing advantages such as fast flow, fast cure, and long pot life.
Semiconductor Liquid Encapsulants CSP and DCA Underfill Encapsulants product
16
description/Application
viscosity at 25°C
pot life
cure schedule
tg. °C
cte(1) (ppm/°C)
capillary flow
storage temp.
3513
Reworkable CSP
4,000 cps
2 days
30 min at 100 °C
69
70
N/A
2 °C - 8 °C
3593
Snap Cure Rapid Flow CSP
4,500 cps
7 days
5 min at 150 °C
110
50
100 sek.
2 °C - 8 °C
Sweden – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se
Finland – OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 | Fax: +358 207 499 496 info@oemelectronics.fi | www.oemelectronics.fi
Poland – OEM Electronics PL ul. Postepu 2, PL-02-676 WARSZAWA Phone: +48 22 863 27 22 | Fax: +48 22 863 27 24 info@oemelectronics.pl | www.oemelectronics.pl
Cleaners and other products
product
description/application
SC01 MCF800 SPOT ON SOLDER MASK
TTC-LF
STW 001
product
NO-CLEAN DESOLDERING WICKS
product
MINI FLUXERS & CLEANERS
PACKING SIZE
- SC01 is designed for the stencil cleaning and hand cleaning of solder process residues. - A highly effective cleaner that dries rapidly (fast evaporation).
5L
- MCF800 is designed for post soldering cleaning using cleaning process equipment. - Highly effective cleaner, requires rinse using either water or solvent.
8 ML
- Temporary solder resists used with circuit boards prior to soldering. - Ideal for prevention of PTH hole filling and for the protection of contact surfaces e.g. edge connections. - Suitable for use with hand, robotic, pneumatic or template screening applications and brush. - Peelable for easy removal.
250 ML 5L
- Handy, non-abrasive solder iron tip-tinner. - Easily wets hot solder irons leaving a brightly tinned tip. - Improves hand soldering efficiency and extends tip life. - Adhesive pad allows easy mounting on or near the solder iron holder.
15 G
100 wipes/can
- Stencil Wipes
description/application
type
AVAILABLE WIDTHS
NC-00 NC-AA NC-AB NC-BB
- Fast, easy means of removing solder. - No-clean, High activity flux means minimal cleaning is required. - Comprehensive range available
description/application
0.8 MM 1.5 MM 2.2 MM 2.7 MM
RANGE AVAILABLE
- Controlled release flux and cleaner pen applicators. - Ideal for controlled application of flux when carrying out SMT re-work. - Cleaner pen easily removes residues.
No clean flux x335-07i pen Cleaner MCF-800 pen
SOLDER ACCESSORIES
Solder Masks Multicore
Spot-On™
Mini Cleaners Multicore
MCF800™ Multicore
SC01™
Mini Fluxers (Flux Pen) No Clean Multicore
x33S-07i
Tip Tinners Multicore
TTC-LF™
Wicks Multicore
NC-00™ Multicore
NC-AA™ Multicore
NC-AB™ Multicore
NC-BB™
Norway – OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 | Fax: +46 75 242 45 09 info@oemelectronics.se | www.oemelectronics.se
denmark – OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 | Fax: +45 70 10 64 info@oemklitso.dk | www.oemklitso.dk
The Baltics – OEM Eesti OÜ Kanali tee 1-328, EE-10112 Tallinn Phone: +372 6550 871 | Fax: +372 6550 873 info@oem.ee | www.oem.ee
17
BYRÅN I TRANÅS 2010
Denmark OEM AUTOMATIC KLITSØ A/S Engholm Parkvej 4 DK- 3450 Allerød Phone: +45 70 10 64 00 Fax: +45 70 10 64 10 info@oemklitso.dk www.oemklitso.dk
Norway OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Sverige Phone: +46 75 242 45 00 Fax: +46 75 242 45 09 info@oemelectronics.se www.oemelectronics.se
POLAND OEM Electronics PL ul. Postepu 2 PL-02-676 WARSZAWA Phone: +48 22 863 27 22 Fax: +48 22 863 27 24 info@oemelectronics.pl www.oemelectronics.pl
SWEDEN OEM Electronics AB P O Box 1025 (Norrabyvägen 6B) SE-573 29 Tranås Phone: +46 75 242 45 00 Fax: +46 75 242 45 09 info@oemelectronics.se www.oemelectronics.se
FINLAND OEM Electronics OY Fiskarsinkatu 3 FI-20750 Turku Phone: +358 207 499 300 Fax: +358 207 499 496 info@oemelectronics.fi www.oemelectronics.fi
The Baltics OEM Eesti OÜ Kanali tee 1-328 EE-10112 Tallinn Phone: +372 6550 871 Fax +372 6550 873 info@oem.ee www.oem.ee