LED Productivity Greatly Improved by Laser Cutting Machine LED has been widely used in LCD TV back light, auto headlight, lighting equipment and other fields. It’s expected that the medium and long-term market will expand in the future. The mainstream processing method for sapphire used in high brightness LED is cutter.
According to G3 reports: With the expansion of the market, the requirement for improving productivity and qualified rates of finished products is getting higher. The rapid popularization of laser processing makes its popularity for processing sapphire used in high brightness LED. Burr formation and roughness often occur during cutting. Then how can we avoid these problems? Laser cutting machine can improve productivity General manager Jiangang Tang, from precision laser micro machining center of HAN’S LASER says that during the development process of LED wafer dicing technology, cutting process have developed from diamond cutting to laser cutting. Compared with diamond dicing technology, laser
cutting has its own advantage both in product yield and operating cost. The general demand for chip lining in Taiwan is more than the depth of 30um. Thus the LED wafer fabrication technology has developed rapidly. To improve luminous efficiency and intensity, variation of wafer structure makes dicing equipment face big challenge. The traditional diamond cutting can no longer meet the requirement of the market. It’s known that the operation of diamond scribing machine depends much on skill level of the operator, thus product qualification rate is not stable. Furthermore, the operator should pay attention to the equipment and cost constantly. As consumable, the price of diamond cutter is quite expensive, extremely easy to wear, thus its production cost is extremely high. At the same lighting intensity, the cutting speed can reach up to 100mm/s while using laser cutting machine, several times of that of diamond cutters; which can greatly improve productivity.
As for fully automatic machine, what we need to do is input cutting parameters and install wafer box to the machine, and then the work is done automatically by the machine. At the same time, laser belongs to non contact process; there is no consumption and no need for coolant liquid, thus avoids work piece replacement time and reduces operating time and workload of the operator, further lower cost. The present laser processing is mainly divided into ablation cutting and invisible cutting. The working principle of ablation cutting is focusing laser on the surface of subject and then gasify the surface in an instant. To guarantee the long term stability of products, we design precision 3D working table for UV laser scribing machine, feeding and focusing automatically. It automatically recognizes module, adjusts angle, searches and adjusts contour profile. It’s automatic coating and
self-cleaning. The development of technology never ends. The pursuit for higher lighting efficiency never changes. The evolution of upper stream chip technology will undoubtedly lead the technical change of related equipment. To meet the requirement of the marker for higher luminance chips, invisible cutting which will have no influence on chip brightness is no doubt the best choice. Invisible cutting technology has always been dominated by Japanese enterprises, during which sapphire laser cutting technology for LED wafer---invisible cutting technology “Stealth Dicing� developed by Hamamatsu Photon Techniques INC. is the most advanced technology in the LED cutting industry at present.