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Flip Chip Market by Packaging Technology (3D IC, 2.5D IC, 2D IC), Bumping Technology (Copper Pillar, Solder Bumping, Tin-lead eutectic solder, Lead-free solder, Gold Bumping), Industry (Electronics, Industrial, Automotive & Transport) - Global Opportunity Analysis and Industry Forecast, 2014 - 2022
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No of Pages : 250
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Report Overview Flip chip, also known as controlled collapse chip connection (C4), consist of conductive bumps deposited on the chip pads on the top side of the wafer and then semiconductor devices are mounted by flipping the chip. It is an advanced semiconductor interconnecting device extensively used in different electronic products such as smartphones, PCs, and medical devices among others due to its advantages such as lower cost, increased packaging density, improved performance and reduced size & thickness of the chip. Further, flip chip has enabled the dramatic improvement of portable electronics and electric vehicles by providing better means for electrical interconnections. Flip chip market is mainly driven by the emerging internet of things: a network of physical devices, vehicles, buildings, and other items that include embedded electronics, software, sensors, actuators, and network connectivity. In addition, its technological superiority over the traditional wire bond electrical connection makes it the exceptional alternative. However, the technology is still in mutation. The rate of flip chip is propelled by bumping cost and assembly process cost. Get More Here>>> http://www.researchbeam.com/flip-chip-market
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Report Overview The market is segmented on the basis of flip chip packaging technology, bumping technology, industry vertical, and geography. Based on bumping technology, the market comprises copper pillar, solder bumping, gold bumping and others including aluminum & conductive polymer bumping. The copper pillar segment dominates the market as it is a next generation flip chip interconnect which offers advantages in many designs while meeting current and future electronic device requirements. It is an excellent interconnect choice for applications such as transceivers, embedded processors, and application processors. POTENTIAL BENEFITS FOR STAKEHOLDERS: This report provides an in-depth analysis of the world flip chip market along with current trends and future estimations to identify lucrative investment opportunities. This report identifies the key drivers, opportunities, and restraints that shape the market along with their impact analysis. Porter’s Five Forces analysis highlights the potency of buyers and suppliers participating in this market to facilitate better business decisions for stakeholders and strengthen their supplier and buyer networks. Market estimation of geographical regions is based on the current market scenario and future trends.
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Table of Content CHAPTER 1 Introduction 1.1 Report Description CHAPTER 2 EXECUTIVE SUMMARY 2.1 CXO Perspective CHAPTER 3 MARKET OVERVIEW 3.1 Market Definition and Scope CHAPTER 4 WORLD FLIP CHIP MARKET, BY PACKAGING TECHNOLOGY 4.1 Overview CHAPTER 5 WORLD FLIP CHIP MARKET, BY INDUSTRY 5.1 Overview 5.2 Electronics CHAPTER 6 WORLD FLIP CHIP MARKET, BY BUMPING TECHNOLOGY 6.1 Overview 6.2 Copper pillar CHAPTER 7 WORLD FLIP CHIP MARKET BY GEOGRAPHY CHAPTER 8 COMPANY PROFILES 8.1 International Business Machines Corporation (IBM) Enquire Here>>> http://www.researchbeam.com/flip-chipmarket/enquire-about-report
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