Advances in Chip Interconnect Technologies (Technical Insights)
This research service assesses the role of new interconnect technologies for electronics applications. On-chip interconnect technologies such as those interconnects based on optical links, wireless communication, nanotechnology or 3D integration, are evaluated in the research service. The emergence of novel interconnect technologies is expected to bring significant advantages to electronic devices allowing for increased speed, lower power consumption and enhanced reliability. The capabilities, technology trends and market readiness of emerging interconnect technologies have been assessed. Opportunity for different interconnect technologies are evaluated using a multiple criteria decision making tool called analytic hierarchy process. Table of Contents Technology Snapshot and Trends Chip Interconnect Technologies: Overview of Optical, Wireless, Nanotechnologybased Interconnect and 3D Integration Technologies Technology Value Chain: Description of Each Stage of the Value Chain with Examples Impact Assessment and Analysis Market Impact of Technology Accelerators: Description of Key Drivers of Novel Interconnect Technologies Market Impact of Technology Challenges: Description of Key Challenges of the Novel Interconnect Technologies Key Industry Participants and Technology Innovations Adoption Cycle and Needs Assessment Technology Adoption Cycle Demand Side Analysis Opportunity Evaluation and Road mapping Scenario Modeling and Emerging Opportunities Technology/Application Roadmap Evaluation of Opportunities For New Interconnect Technologies Technology Management Strategies Key Contacts Key Patents Appendix A - Analytical Hierarchy Process Appendix B - Collaborative Initiatives About Frost & Sullivan About Us: ReportsnReports is an online library of over 100,000+ market research reports and in-depth market research studies & analysis of over 5000 micro markets. We provide 24/7 online and
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