Global Thermal Interface Materials (TIM)
Size, Share, Global Trends, Analysis, Research, Report, Opportunities, Segmentation and Forecast, 2014-2018 www.bigmarketresearch.com
About Thermal Interface Materials TIM is used to support heat sinks in removing heat from heat sources in various equipment. It is generally used in the form of a secondary thermally conducting material to replace the thermally insulating air between the two surfaces. Along with helping in the efficient transfer of heat, TIM also acts as an adhesive and strengthens the mechanical link between the surfaces. Polymer-based TIM, metal-based TIM, and phase change TIM (PCTIM) are the basic types of TIM commercially available. Owing to its conductive and adhesive properties, TIM is used for thermal management applications in various industries, including Computers, Electrical and Electronics, Telecom, and Automotive. TechNavio's analysts forecast the Global TIM market to grow at a CAGR of 10.30 percent over the period 2013-2018.
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Report Description The report covers the present scenario and the growth prospects of the Global TIM market for the period 2014-2018. Some of the major end-users of the Global TIM market are the Computers, Electrical and Electronics, Telecom, and Automotive industries. TechNavio's report, the Global TIM Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the America, the APAC and EMEA regions; it also covers the Global TIM market landscape and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market.
Key Regions • Americas • APAC • EMEA Key Vendors • Cookson Electronics Assembly Materials • Dow Corning • Henkel • Honeywell International • Laird • Zalman Tech Other Prominent Vendors • 3M • Aavid Thermalloy • Aegis Technology • AI Technology • Akasa Group
Key Regions • AMETEK Specialty Metal Products • AOS Thermal Compounds • Arctic Silver • Bergquist • Cast-Coat • Chomerics • Cool Polymers • Coolaboratory • Enerdyne Thermal Solutions • Epoxies • Indium • Innovation Cooling • LORD • Master Bond • Materion • MC-21
Key Regions • MG Chemicals • Momentive • NuSil Technology • ROGERS • Rubbercraft • Seal King Industrial • Shenzhen Western Hemisphere Technology • Shin-Etsu Chemical • Stockwell Elastomerics • T-Global Technology • Thermal Transfer Composites • Timtronics • Universal Science • Vanguard products • Wakefield-Vette Enquiry about Report @ http://www.bigmarketresearch.com/report-enquiry/150095
Key Market • Increased Functionality of Telecommunication and Electronic Devices • For a full, detailed list, view our report Key Market Challenge • Concentration of Demand • For a full, detailed list, view our report Key Market Trend • Increased Usage of PCTIM • For a full, detailed list, view our report
Key Questions Answered • What will the market size be in 2018 and what will the growth rate be? • What are the key market trends? • What is driving this market? • What are the challenges to market growth? • Who are the key vendors in this market space? • What are the market opportunities and threats faced by the key vendors? • What are the strengths and weaknesses of the key vendors?
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