SMTA International 2022 Event Guide

Welcome to

SMTA International is the industry’s premier conference and exposition that collectively delivers focused technical solutions for today’s electronics assembly and manufacturing challenges.

Connect Connect with your manufacturing community and colleagues at SMTA International.

Learn Learn about research and solutions across electronics manufacturing markets including advanced design and manufacturing industries.

Advance Through your participation you will advance your career and your company’s business needs, as well as the great er electronics manufacturing industry.

Nine focused tracks on Advanced Packaging, High Performance and Reliability, Interconnect Research and Reliability, Low Temperature Solder, Manufacturing Excellence, Materials for Electronics, Medical & Defense Symposium, Technical Innovations, Test and Inspection

Discover the latest products and services

The exhibition has everything you need to keep up with rapidly changing technology, identify innovative solutions, and maintain your competitive edge.

See new products and equipment during the expo.

Get immediate answers and experience unique one-on-one networking opportunities on and off the show floor.

TABLE OF CONTENTS

SMTA International Technical Advisory Committee

The distinguised SMTA International Technical Advisory Committee includes electronics manufacturing and packaging experts representing all segments of the industry. The Committee designed the 2022 conference program to ensure that today’s latest trends and developments are fully addressed.

Raiyo Aspandiar, Ph.D. Intel Corporation Conference Co-Director

Dudi Amir Intel Corporation

Martin Anselm, Ph.D. Rochester Institute of Technology

Babak Arfaei, Ph.D. Juniper

Nilesh Badwe, Ph.D. Indian Institute of Technology, Kanpur

Jasbir Bath Bath Consultancy Andy Behr Panasonic

Elizabeth Benedetto HP Inc.

Mike Bixenman, DBA, MBA KYZEN Corporation

Lars Boettcher Fraunhofer IZM Berlin

Robert Boguski Datest Corporation

Keith Bryant KB Consultants

Kevin Byrd Intel Corporation

William Capen Honeywell FM&T

Richard Coyle, Ph.D. Nokia Bell Labs Conference Co-Director

Bill Cardoso, Ph.D. Creative Electron, Inc.

Burton Carpenter NXP Semiconductors

Srinivas Chada, Ph.D. Project Kuiper-Amazon

Lenora Clark ESI Automation

Jean-Paul Clech, Ph.D. EPSI, Inc.

Marie Cole IBM Corporation (Retired)

William Cooper John Deere Electronics Solutions Inc.

Eric Cotts, Ph.D. Binghamton University

Priyanka Dobriyal, Ph.D. Intel Corporation

Michael Ford Aegis Software

Trevor Galbraith Global SMT & Packaging

James Elliott Fowler, Ph.D. Sandia National Laboratories

Jie Geng, Ph.D. Indium Corporation

Faramarz Hadian Auburn University

Sa’d Hamasha, Ph.D. Auburn University

Carol Handwerker, Ph.D. Purdue University

Md Hasnine, Ph.D. Qorvo, Inc.

David Hillman Collins Aerospace (Retired)

Jason Keeping, P. Eng Celestica, Inc.

Jeffrey Kennedy ZESTRON Corporation

Robert Kinyanjui, Ph.D. John Deere Electronics Solutions Inc.

Richard Kraszewski Plexus Corp.

Pradeep Lall, Ph.D. Auburn University

Dale Lee Plexus Corp. Tanya Martin SMTA

Andrew Mawer NXP Semiconductors

James Morgan Celestica, Inc.

Tim Pearson

Collins Aerospace Scott Priore Cisco Systems, Inc.

Anto Raj, Ph.D. Medtronic

Brian Roggeman Qualcomm Technologies Inc.

Chrys Shea Shea Engineering Services

Rajen Sidhu, Ph.D. AMD

Gregory Vance Rockwell Automation

Rebecca Wheeling, Ph.D. Sandia National Laboratories

Charles Woychik, Ph.D. Skywater Technologies

Julie Silk Keysight Technologies VP of Technical Programs

Patty Chonis

VP Expos

A-Tek LLC

Robert Boguski

VP Membership Datest Corporation

Global Board of Directors

Martin Anselm, Ph.D. President

Rochester Institute of Technology

Jason Keeping, P. Eng. Secretary Celestica, Inc.

Mike Konrad VP Communications Aqueous Technologies

Julie Silk VP Technical Programs Keysight Technologies

Gregory Vance Treasurer Rockwell Automation

Strategic Development Committee

Kirk Van Dreel Chairperson Plexus Corp.

William Capen Honeywell FM&T

Adam Klett, Ph.D.

L3Harris Technologies

Ravi Parthasarathy, M.S.Ch.E. ZESTRON Corporation

Fernando Rueda KYZEN Corporation

Registration Hours (Hall B)

Monday, October 31 9:00 am-5:00 pm

Monday, October 31 11:00 am-5:00 pm

Tuesday, November 1 - Thursday, November 3 7:30 am-5:00 pm

Conference Hours

Tuesday, November 1 8:30 am-5:00 pm

Wednesday, November 2 8:00 am-5:15 pm

Exhibit Hours

Wednesday, November 2 10:00 am-5:00 pm

Suitcasing Policy

Thursday, November 3 8:00 am-5:00 pm

Thursday, November 3 10:00 am-4:00 pm

SMTA does not allow solicitation from non-exhibiting companies. This includes attempts to solicit or sell products to event attendees or exhibitors. Any non-exhibiting attendee observed soliciting business in the aisle of the expo will be asked to leave.

In the Event of an Emergency

Please contact the Command Center and tell the operator the nature of the emergency. The Command Center can be contacted via:

• cell phone at 612-335-6040.

• beige house phones, located in public corridors, lobbies, and fire-hose cabinets on various pillars in exhibit halls. The number [EXT. 2013] is posted by each phone.

• uniformed security officers, who are posted at security podiums 24/7 and who will also respond to any safety concerns.

Notice of Photography

Photos and videos may be taken at this event for promotional use. As a registrant or attendee you hereby give SMTA permission to publish photographs or video taken of you during the event.

Press Companies may leave information for media or press in the SMTA Membership Booth.

SMTA Office

Conference speakers and session chairs should check in at Room 205AB. Conference speakers are invited to use Room 200F to prepare for their presentation.

SMTA Booth

Be sure to visit us in Hall B to learn about membership benefits and opportunities.

PREMIERE SPONSOR

Professional Development Courses

Monday, October 31 Tuesday, November 1

1:00 pm - 5:00 pm

PDC1: Cleaning and Cleanliness Testing Best Practices

Instructor: Mike Konrad, Aqueous Technologies

PDC2: Defeating Defects in Electronic Assembly

Instructor: Ron Lasky, P.E., Ph.D., Indium Corporation

PDC5: Reflow Profiling Simplified

Instructor: Robert Rowland, Axiom Electronics LLC

8:30 am - 12:30 pm

PDC4: Reliability Testing and Design for Reliability of Lead-Free Solder Joints

Instructor: John Lau, Ph.D., Unimicron Technology Corporation

PDC6: Tolerance Mistaken: Impacts Of Not Properly Addressing Limitations Of Material, Industry Standards And Assembly Process

Instructor: Dale Lee, Plexus Corp.

PDC7: Low Temperature Solder –History, Progress, and Considerations

Instructor: Kevin Byrd, Intel Corporation

TRACK KEY

Advanced Packaging Technology (APT)

High Performance and Reliability (HPR) Interconnect Research and Reliability (IRR) Test and Inspection (INS)

Low Temperature Solder (LTS)

Medical & Defense (MD) Manufacturing Excellence (MFX) Materials for Electronics (MAT) Technical Innovations (TI) Women’s Leadership Program (WLP)

Sessions - Monday, October 31

am 9:00 am

Registration Opens

am 11:00 am

pm

1:00 pm

2:00 pm

pm

pm

pm

Printed Circuit Engineering Association

Who?

The Printed Circuit Engineering Association is an international network of engineers, designers, fabricators, assemblers, and anyone related to printed circuit development.

YOUR PRINTED CIRCUIT ENGINEERING NETWORK OF BRANDS

Our mission is to promote printed circuit engineering as a profession by encouraging and facilitating the exchange of information and the integration of new design concepts through education, certification, communications, seminars, and workshops, facilitated by a network of chapters and support of our sponsors. pcea.net

®

KEYNOTE PRESENTATION The Electric Vehicle (EV) Conundrum

As a 30-year automotive veteran and EV driver, John leads with a passion for anything on wheels. He has defined his career by engaging in the advancement of technical solutions that elevate the industry and support clean vehicle and EV adoption. With a goal to improve our planet’s sustainability, his efforts have had long lasting effects that enhance the driver experience, support community health initiatives and positively impact carbon emissions. As the COO (Chief Operating Officer) of Autel Energy, John is leading his team to grow Autel with the ambitious target to power the planet by connecting vehicles and energy ecosystems through cloud, AI and big data. This interconnected approach improves total system efficiency while transitioning our world towards renewable energy independence. Under his leadership Autel Energy is defining a new industry benchmark with the best and most comprehensive line of cloud connected, high-quality AC & DC level 2 and level 3 EV chargers supported by world class customer service. For John, the passion for EV charging was ignited in 2017 when he was tasked to helped transform Webasto, a 125-year-old family-owned car parts organization, into a global e-mobility leader by introducing a compact, global 32amp AC Level 2 charging solution that gave the EV driver freedom to charge anywhere they could find a plug. In his role as CEO, John set a long-term strategy and leveraged global OE relationships while introducing technological advancements, creating high value customer centric solutions, and building a fast-growing and profitable comprehensive business. By utilizing innovation, digital connectivity and standardization combined with an entrepreneurial spirit, his team built high volume EV chargers on a global scale that quickly increased company revenue. This unique approach allowed his organization to partner with many of the large vehicle OEMs and capitalize on an expanding EV ecosystem. Over a 24-month period, John led his team to create a global business with explosive growth and a foundation for success and sustainability.

John Thomas COO, Autel Energy

This keynote presentation will address what it will take to provide the infrastructure to support fast charging of electric vehicles (EVs) across the globe. John Thomas will cover the current state of EV infrastructure, challenges, and the future outlook from both a strategic and a manufacturing perspective.

AWARD WINNERS

Technical Distinction

Stromberg

Williams Lorain County

(EXPO) ELECTRONICS EXPOSITION

SMTA International will co-locate with Medical Design & Manufacturing (MD&M) Minneapolis bringing together one of the largest audiences of engineering and manufacturing professionals in the Midwest.

All six trade shows share the expo floor in Minneapolis. It’s a one-stop experience delivering design to manufacturing solutions at every stage of the manufacturing process—design, materials, manufacturing, automation, cleaning and packaging—in top manufacturing sectors. Exhibitor contact information and descriptions found on pages 43-56.

Current Exhibitors

A2Z Electronics LLC ACL Staticide

AI Technology AIM Solder Akrometrix Allfavor Technology Alltemated Inc ANDA Technologies ASM Assembly Systems Bimos Seating BlueRing Stencils Boardera Software Inc. BTU International CalcuQuote Conductive Containers, Inc CTI Systems CyberOptics ESSEMTEC USA Europlacer Americas Finetech Fuji America Corporation Garland Service Company Glenbrook Technologies Global SMT & Packaging Hanwha Techwin Automation Americas. Inc. HZO ICAPE USA IConnect007 Identco Impossible Objects Inovaxe Corporation

Insituware Intraratio Corporation IPC ITW EAE JBC Tools Juki Automation KIC

Koh Young America Kulicke & Soffa Kurtz Ersa, Inc. KYZEN Corporation MacDermid Alpha Electronics Solutions Magnalytix Marc Technologies Metallic Resources Microscreen

Mid America Taping & Reeling Mirtec Corp. Mycronic Nihon Superior Nikon Metrology, Inc. Nordson Test & Inspection NSW Automation Sdn. Bhd. Omron Panasonic PARMI USA

PCB Connect Inc. PCEA PDR Rework and Test Systems Pillarhouse

Retronix SCHUNK Electronic Solutions Scienscope International Seika Machinery Siborg Systems, Inc. Smart Splice LLC SMarTsol Technologies SMT Today SMT Tooling SMTXTRA SPEA America LLC Specialty Coating Systems StaticStop Surfx Technologies Teradyne, Inc. Test Research Texmac/Takaya Tintronics Trans-Tec America Transforming Technologies, LLC U.S. Tech Universal Instruments Viscom Visiconsult Vitrox VJ Electronix, Inc. WNIE World Precision Instruments ZESTRON Corporation Zymet Inc.

Carolyn Duran, Ph.D. Intel Corporation

SPECIAL EVENTS

Tuesday, November 1

Program: 1:00 pm - 5:00 pm Wine Reception: 5:00 pm - 6:00 pm Room 205CD

All are welcome!

Jayshree Seth 3M

Career Development Presentations | 1:00pm - 3:15pm

• Leaning into Lifelong Learning - Carolyn Duran, Ph.D., Intel Corporation

• Changing the Perception of Manufacturing - Loretta Renard, REMAP

• Of Leaders and Ladders - Jayshree Seth, 3M

Speed Mentoring Sessions | 3:30pm - 5:00pm

• Communicate with Confidence

• Polish Your Presence

• Resolve Conflict with Finesse

• Cultivate T-Shaped Skills

• Pay it Forward with Power Skills Recharge

Connection Reception | 5:00pm - 6:00pm

We welcome you to stay and join us for the annual Connection Reception! Wine and appetizers will be served.

Knowing what you bring to the table helps you build the confidence you need to navigate your career. Hence the concept of a toolbox seemed appropriate for the WLP, as the goal of this session is to empower women to explore technology innovations and career progression in the electronics industry. So now are you ready to think about the skills in your toolbox that could help with your career advancement?

Loretta Renard REMAP

SPECIAL EVENTS

Growing the Future II: NextGen Electronic Manufacturing Workforce

Wednesday, November 2 1:30 pm – 3:00 pm Room 203AB

We’re confident you’re well aware of the current difficulty and projected future inability to replace experienced technical staff to sustain a robust and technically competitive electronics manufacturing base in North America.

Please plan to join us at “Growing the Future II”. We hope you are able to take advantage of this opportunity for an open exchange of ideas, concerns, and solutions to the electronic manufacturing industry’s critical shortage of replacement technical workforce.

Hear presentations from individuals around the country as they share their regions experience and what steps they are taking. Following the presentations, a panel of all speakers will be held for further discussion and a Q&A.

Bryant KB Consulting

Featured Presentation: The Route Ahead for

Attendees

A fully qualified engineer, Keith has over thirty years’ experience in Electronics Manufacturing. He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews.

He started his career in this industry with bare printed circuit boards in the early days of high-count multi-layer technology, moving through to running contract manufacturing operation. He had ten years’ experience with advanced materials and soldering systems before working with high technol ogy x-ray and AOI Systems, again for 10 years.

Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names. From 2017 to 2019 he was Global Sales Director of the leading X-ray man ufacturer. Last year reverting to a technology and business consultancy role allowing him to pursue other interesting projects, including i4.0 and working with an advanced x-ray tube manufacturer.

He was Chairman of the SMART Group for 11 years and is now Chairman of SMTA Europe, in 2018 he was presented with the SMTA International Leadership award.

SPECIAL EVENTS Welcome Reception

VSI

floor. Co-hosted with MD&M,

they

Expo Floor (Booth 1424)

Monday, October 31 1:00 pm - 5:00 pm

PDC 1: Cleaning and Cleanliness Testing Best Practices

Mike Konrad, Aqueous Technologies Room 203A

The process of cleaning circuit assemblies after reflow has changed drastically over the past several years. Miniaturization, high density component placement, low component stand-off heights, and the implementation of electronic assemblies into harsh environments has both increased the need for cleaning and cleanliness testing. As a result, an increasing number of assemblers are now cleaning their assemblies.

PDC 2: Defeating Defects in Electronic Assembly

Ronald Lasky, PE., Ph.D., Indium Corporation Room 205CD

This half day workshop will focus on how to eliminate or reduce defects in electronic assembly. It will start with best practices in running an assembly line to minimize all defects. Starting with the PWB, components and solder paste, then stencil design, stencil printing, component placement, and reflow. New Excel® based software developed to optimize these processes will be used and given to the students.

PDC 5: Reflow Profiling Simplified

Robert Rowland, Axiom Electronics LLC Room 204A

Surface mount reflow soldering is a complex and challenging process. Reflow soldering profiles should be based on the chemical and physical constraints that influence the soldering process; namely substrates, components, fluxes, solder alloys and reflow ovens. Reflow profiles should not be developed by trial and error. This workshop identifies and examines the critical material and process constraints associated with SnPb and Pb-free convection reflow soldering. Mixed alloy (SnPb/Pb-free) reflow soldering is also covered.

A standardized methodology for creating reflow soldering profiles should be developed and documented. Soldering profiles are a delicate balance between time and temperature; achieving the right balance can be challenging. All time/temperature profiles are influenced by constraints associated with the substrates, components, fluxes, solder alloys and reflow ovens. These constraints should be well understood and factored into all reflow soldering profiles. This workshop covers how these constraints influence the soldering process and how this knowledge can be used to simplify the creation of convection reflow soldering profiles.

The overall quality and reliability of the finished product is a key concern. One example is substrate (PCB) reliability, which has been impacted by the transition to Pb-free soldering. Other examples will be covered to address and prevent defects and reliability concerns associated with substrates, components and solder joints. Inspection and failure analysis techniques like optical inspection, dye and pry, x-ray and cross sectioning will also be discussed. A process and defect trouble shooting guide is included with the presentation.

Tuesday, November 1 8:30 am - 12:30 pm

PDC 4: Reliability Testing and Design for Reliability of Lead-Free Solder Joints

John Lau, Ph.D., Unimicron Technology Corporation Room 204A

The recent advances and trends of lead-free solder joint reliability are presented in this study. Emphasis is placed on the design for reliability (DFR) and reliability testing and data analysis. For DFR: (a) the Norton power creep constitutive equations and examples for Au20Sn, Sn58Bi, Sn3.8Ag0.7Cu, and Sn3.8Ag0.7Cu0.03Ce, (b) the Wises two power creep constitutive equations and examples for Sn3.5Ag and Sn4Ag0.5Cu, (c) the Garofalo hyperbolic sine creep constitutive equations and examples for Sn3.5Ag, Sn3Ag0.5Cu, Sn3.9Ag0.6Cu, Sn3.8Ag0.7Cu, Sn3.5Ag0.5Cu, and Sn3.5Ag0.75Cu, Sn4Ag0.5Cu, Sn(3.5- 3.9)Ag(0.5-0.8)Cu, 100In, Sn52In, Sn3.8Ag0.7Cu0.03Ce, and Au20Sn, and (d) the Anand viscoplasticity constitutive equations and examples for Sn3.5Ag, Sn3Ag0.5Cu, Sn3.8Ag0.7Cu, Sn3.8Ag0.7CuCe, Sn3.8Ag0.7CuAl, Au20Sn, Sn3.5Ag with temperature and strain rate-dependent parameters, and Sn1Ag0.5Cu, Sn2Ag0.5Cu, Sn3Ag0.5Cu, and Sn4Ag0.5Cu after extreme aging will be discussed. For reliability testing and data analysis: (a) the Weibull and lognormal life distributions for lead-free solder joints under thermal-cycling and drop tests, (b) the true Weibull slope, true characteristic life, and true mean life, and (c) the linear acceleration factors for various lead-free solder alloys based on: (i) frequency and maximum temperature, (ii) dwell time and maximum temperature, and (iii) frequency and mean temperature will be presented. Some recommendations will also be provided.

PDC 6: Tolerance Mistaken: Impacts Of Not Properly Addressing Limitations Of Material, Industry Standards And Assembly Process

Dale Lee, Plexus Corp. Room 203B

The rate of new technology adoption is increasing through development of ever smaller packages, packages with finer lead spacing, increased adoption of leadless/flat lead form package terminations and substrates with finer lines, spaces, varying copper thicknesses and multiple laminate type PCB’s. However, design methods, industry standards, materials and manufacturing processes utilized during the product development and production process have not progressed to meet these new demands and thus many of the tolerance margins that were considered insignificant and acceptable in the past are now critical to high yield, reliable products. This presentation will highlight issues with today’s electronic designs and impacts when material limitations, industry standards and assembly tolerances are not adequately address during design, PCB fabrication, assembly and test.

PDC 7: Low Temperature Solder – History, Progress, and Considerations

Kevin Byrd, Intel Corporation Room 203A

Interest in the opportunities provided by conversion from tin-silver-copper (SAC) high temperature solders to lower melting point tin-bismuth based low temperature solders (LTS) is growing. Absent the regulatory imperative that drove the lead-free conversion, interested parties can benefit from learnings related to manufacturing, reliability, and design enablers.

TECHNICAL SESSIONS

TRACK KEY

Advanced Packaging Technology (APT)

High Performance and Reliability (HPR) Interconnect Research and Reliability (IRR) Test and Inspection (INS)

Low Temperature Solder (LTS)

Monday, October 31

Medical & Defense (MD) Manufacturing Excellence (MFX) Materials for Electronics (MAT) Technical Innovations (TI) Women’s Leadership Program (WLP)

IRR1: Continuing the Pb-Free Transition in High Reliability Electronics

Chair: Tim Pearson, Collins Aerospace

Co-Chair: Colette Anctil, Collins Aerospace

11:00 am - 12:30 pm Room 200DE

IPC PERM DoD Phase 3 Test Program: Copper Dissolution Testing Report for Selected Pb-Free Solder Alloys: SAC305, SAC4.8Bi, SAC6.0Bi and SAC7.5Bi

David Hillman, Retired, Collins Aerospace

Methodology for Implementation of Pb-Free Materials in Aerospace & Defense Electronics Anthony Rafanelli, Ph.D., Raytheon Technologies; Tim Pearson, Collins Aerospace

The USPAE Solder Performance and Reliability Assurance Project: Enabling Pb-Free Solder Alloy Use in High Performance Applications

David Hillman, Retired, Collins Aerospace

IRR2: Modeling

Chair: Jean-Paul Clech, Ph.D., EPSI, Inc.

1:30 pm - 3:00 pm Room 200DE

Thermomechanical Durability Model of 96.5Sn-3.0Ag-0.5Cu (SAC305) Solder Interconnects in Wafer Level Packaging (WLP)

Jean-Baptiste Libot, Ph.D., Safran Electronics & Defense

An Empirical Correlation to Estimate Solder Joint Reliability Acceleration Factors Ross Wilcoxon, Tim Pearson, Collins Aerospace

Predicting the Saturation of Solder Joint Cycles to Failure with Thermal Cycling Dwell Times Jean-Paul Clech, Ph.D., EPSI, Inc.

TECHNICAL SESSIONS

Monday, October 31

MD Forum 1

Chair: Elliott Fowler, Ph.D., Sandia National Labs Co-Chair: Debbie Carboni, KYZEN Corporation

1:30 pm - 3:00 pm Room 201AB

PCB De-Paneling Less is More, a Review of Technologies and Vision Usage in De-Paneling Allen Duck, Detech Automation

3P Process (Production Preparation Process) Jonathan Corona, Plexus Corp.

Continuous Improvement: The Task that Never Ends in the Cleaning World Ram Wissel, KYZEN Corporation

MD Forum 2

Chair: William Capen, Honeywell FM&T Co-Chair: Elliott Fowler, Ph.D., Sandia National Labs

3:30 pm - 5:00 pm Room 201AB

Meeting Today’s Challenge for Low VOC Defluxing Agents For Electronics Manufacturing Terry Price, Ph.D., ZESTRON Corporation

Thinking Inside the ESD Bag on Cleanliness – Numerous and Potentially Dangerous Contamination Contributors to Long Term Failure Eric Camden, Foresite Inc.

Effect of Voltage Bias on SIR Measurements

Elliott Fowler, Ph.D., Sandia National Laboratories

TECHNICAL

TECHNICAL SESSIONS

Tuesday, November 1

MD Forum 3

Chair: Elliott Fowler, Ph.D., Sandia National Labs

Low Stress De-Paneling and Why it is Critical for Long Term Reliability

Michelle Ogihara, Seika Machinery, Inc.

8:30 am - 10:30 am Room 201AB

Component Pressure Exposure Validation in a Inline Wash System and Why Low Pressure is Critical William Capen, Honeywell FM&T

High-Reliability Adhesive Bonding Through Atmospheric Plasma Treatment

Adam Klett , Ph.D., L3Harris Technologies

A Holistic Approach to Surface Insulation Resistance Interdigitated Comb Design

Matthew Kottwitz, Sandia National Laboratories

IRR4: Mechanical Testing

Chair: Babak Arfaei, Ph.D., Juniper Networks Affiliation Co-Chair: Priyanka Dobriyal, Ph.D., Intel Corporation

9:00 am - 10:30 am Room 200DE

Next Generation High Reliability Solder for Enabling Enhanced Thermo-Mechanical Performance in Automotive Applications

Pritha Choudhury, Ph.D., MacDermid Alpha Electronics Solutions

Effect of Strain Rate on the Ductility of Bismuth-Containing Solders

Keith Sweatman, Nihon Superior Co., Ltd.

Identification of the Maximum Allowable Compression Load Per Solder Interconnect

Tae-Kyu Lee, Ph.D., Cisco Systems

TECHNICAL SESSIONS

Tuesday, November 1

TI1: Digital Factory and Artifical Intelligence

Chair: Martin Anslem, Ph.D., Rochester University of Technology Co-Chair: Marie Cole, Retired, IBM Corporation

9:00 am - 10:30 am Room 202AB

Using the Principles of Concurrent Education to Teach a Post-Secondary Engineering Program

Tom Borkes, The Jefferson Project

Digital Factory

Olimpiu-Petru Datcu, ASM Assembly Systems GmbH & Co. KG

Inline Assembly of Flex PET Circuits

Ara Parsekian, PulseForge Corporation

APT1: High-Density Packaging

Chair: Burton Carpenter, NXP Semiconductors Inc.

Assembly Optimization for Thin Flip-Chip Chip-Scale Packages

Trent Uehling, NXP Semiconductors Inc.

A Fracture Mechanics-Based Approach to Simulate Die Pick-up Process

Sandeep Shantaram, Ph.D., NXP Semiconductors Inc.

11:00 am - 12:30 pm Room 201AB

Comparison of Component Assembly Process-Reliability Relationships of Low-Temperature Solders and ECAs on Flexible Direct-Write Additive Circuits

Pradeep Lall, Ph.D., Auburn University

HPR1: Conformal Coating

Chair: Sa’d Hamasha, Ph.D., Auburn University Co-Chair: Robert Kinyanjui, Ph.D., John Deere Electronics Solutions

Conformal Coating Testing in Various Test Environments

Prabjit Singh, Ph.D., IBM Corporation

Conformal Coating Prevention, Temperature Dependence and Physical Analysis of Resistor Silver Sulfide Corrosion Eric Campbell, IBM Corporation

11:00 am - 12:00 pm Room 202AB

TECHNICAL SESSIONS

Tuesday, November 1

IRR5: Microstructure

Chair: Anto Raj, Ph. D., Medtronic Co-Chair: Tim Pearson, Collins Aerospace

An Examination of Tin Pest Phenomenon over a 10 Year Period David Hillman, Retired, Collins Aerospace

11:00 am - 12:30 pm Room 200DE

Experimental Investigation and Phase Field Simulation of Solid-State Diffusion Between Cu and Electroplated-Sn System

Abhilaash Ajith Kumar, Ph.D., Robert Bosch GmbH

Interface Kinetics on Aging in Indium Interconnect Mechanical Performance with Decreasing Bump Rebecca Wheeling, Ph.D., Sandia National Laboratories

APT2: High Performance Packaging 1

Chair: Pradeep Lall, Ph.D., Auburn University

1:00 pm - 3:00 pm Room 201AB

Rework Practicies and Advances for Minileds and other Highly Miniaturized SMT Components Neil O’Brien, Finetech

Assembly and Reliability of a Novel High Density Dual Row MaxQFP Andrew Mawer, NXP Semiconductors Inc.

Development of Si-Interposers for 3D Heterogeneous Integration

John Allgair, BRIDG; Charles Woychik, Ph. D., SkyWater Technology

Board-Level Reliability Test Method and the Automotive Electronics Council Thomas Koschmieder, Veoneer, LLC

TECHNICAL SESSIONS

Tuesday, November 1

HPR2: Thermo-Reliability of Solder Joints

Chair: Mike Bixenman, MBA, DBA, KYZEN Corporation Co-Chair: Robert Kinyanjui, Ph.D., John Deere Electronics Solutions

1:30 pm - 3:00 pm Room 202AB

Reliability of Different Solder Joint Alloys in Thermal Cycling and Drop Shock Tests Sa’d Hamasha, Ph.D., Auburn University

Effect of Matte-Sn Electroplating Parameters on the Thermo-Mechanical Reliability of Lead-Free Solder Joints

Abhilaash Ajith Kumar, Ph.D., Robert Bosch GmbH

Combined Alloy and Flux Approach toward Cost-Effective High Reliable Solder Joints for Automotive Applications

James Wertin, Heraeus Deutschland GmbH

IRR6: High Reliability 1

Chair: Eric Cotts, Ph.D., Binghamton University Co-Chair: Anna Lifton, MacDermid Alpha Electronics Solutions

Impact of High Reliability Pb-Free Solder Alloy Assembly with SAC305 Ball Grid Arrays (BGAs) for Thermal Cycle Reliability Tim Pearson, Collins Aerospace

Thermal Shock Testing of High-Reliability Solder Alloys Jayse McLean, John Deere Intelligent Solutions Group

Novel Lead-Free Solder Alloys Based on Sn-Ag-Cu-Sb with Enhanced Thermal and Electrical Reliability Jie Geng, Ph.D., Indium Corportation

1:30 pm - 3:00 pm Room 200DE

TECHNICAL SESSIONS

Tuesday, November 1

APT3: High Performance Packaging 2

Chair: Chuck Woychik, Ph.D., SkyWater Technology

3:30 pm - 5:00 pm Room 201AB

High Speed Transmission Characteristics on RDL Interposer using Low Loss and Low Stress Dielectric Materials for High Performance Computing Application

Satoru Kuramochi, P.E., Dai Nippon Printing

Heterogenous Integration using Fan-out Wafer-level Packaging (FOWLP) Technology to Produce High Performance and Low-Cost Multi-Chip Modules Tim Olson, Deca Technologies, Inc.

Propensity for FCBGA Chip-UF and Substrate-UF Interface Delamination under Monotonic and Fatigue Loads in Automotive Environments

Pradeep Lall, Ph.D., Auburn University

New Technologies: Speed Presentations and Panel Discussion

Moderator: Andy Behr, Panasonic

3:30 pm - 5:00 pm Room 202AB

Panelists: John D. Williams, Boeing Research and Technology Mark Ronay, Liquid Wire Neil Bolding, MacDermid Alpha Electronics Solutions Mike Newton, nScrypt

Printed electronics represent a rapidly growing segment of the electronics market. This emerging technology is being adopted in many industries. The assembly of printed electronic circuits into functional devices presents unique challenges to the SMT community. How can SMT components be assembled onto additively manufactured circuits in a reliable, cost effective and scalable fashion? A panel of industry experts with a range of backgrounds and expertise in the printed electronics industry discuss the challenges and opportunities of this emerging technology.

IRR7: High Reliability 2

Chair: David Hillman, Retired, Collins Aerospace CoChair: Trevor Galbraith, Global SMT Packaging

3:30 pm - 5:00 pm Room 200DE

Thermal Fatigue Reliability of a 1206 Chip Resistor with High-Performance Pb-Free Solder Alloys Tim Pearson, Collins Aerospace

Thermal Fatigue of QFN and Chip Resistor Solder Joints Assembled with SnPb, SAC305, and SnBi Solders Richard Coyle, Ph.D., Nokia Bell Labs

Case Study: Metallurgical and Mechanical Analysis of Castellated Via Rigid-Flex Connection Rebecca Wheeling, Ph.D., Sandia National Laboratories

TECHNICAL SESSIONS

Wednesday, November 2

INS1: Measurement, Metrology, and Testability

Chair: Keith Bryant, KB Consulting

Non-Contact Measurement of Conformal Coating Thickness using Chromatic Confocal Microscopy (CCM) Wilson Chen, Insituware

11:00 am - 12:30 pm Room 202AB

Paradigm Shift – DFT Analysis Driven by Test Coverage Instead of Accessibility William Webb, ASTER Technologies

Development of Solder Joint Void Metrology to Monitor Solder Joint Quality in Printed Circuit Board Assemblies

Thaer Alghoul, Ph.D., Intel Corporation

LTS1: Electromigration

Chair: Rajen Sidhu, Ph. D., AMD Co-Chair: Prabjit Singh, Ph.D., IBM Corporation

11:00 am - 12:30 pm Room 200DE

Functional System Observations of Tin-Bismuth Low Temperature Solder Electromigration Behavior Kevin Byrd, Intel Corporation

Finite Element Analysis of Electromigration Effect on Solder Ball Performance Mehdi Hamid, IBM Corporation

Kinetics of the Accumulation of a Layer of Bismuth at the Anode of a Sn-Bi Based Solder Joint During Current Stressing Eric Cotts, Ph.D., Binghamton University

TECHNICAL SESSIONS

Wednesday, November 2

MFX1: Printing Optimization Ops Excellence

Chair: Rita Mohanty, Ph.D., Henkel Electronic Materials Co-Chair: Ron Lasky, Ph.D., P.E., Indium Corporation

Impact of Stencil Manufacturing Technology and Supplier’s Capability on Performance of Multi-Level/Step Stencils

Supriya Agrawal, Intel Corporation

Stencil Cleaning Optimization for Fine-Pitch Components

11:00 am - 12:30 pm Room 200C

Sebastian Iturregui-Shelton, Martin Anselm, Ph.D., Rochester Institute of Technology

An Innovative Contactless Technology for High Resolution, High Speed, Solder Paste Deposition Ralph Birnbaum, ioTech

INS2: X-Ray and CT Inspection Techniques for PCBAs

Chair: Robert Boguski, Datest Corporation

Application of X-Ray Inspection Beyond BTCs

Carlos Valenzuela, Creative Electron, Inc.

Breakthrough Technology to Improve X-Ray Results

Keith Bryant, KB Consulting

Automation for Traceability and Reliability

Alejandro Rodriguez, Plexus Corp.

LTS2: Testing & Quality

Chair: Hongwen Zhang, Indium Corporation Co-Chair: Mehdi Hamid, IBM Corporation

2:00 pm - 3:30 pm Room 202AB

2:00 pm - 3:00 pm Room 200DE

Test Data Requirements for the Acceptance of Low Temperature Solder Alloys

Aileen Allen, Insight Global

Low Temperature Solder-Surface Mount Manufacturability & Quality Considerations for Ball Grid Array Components

Rajen Sidhu, Ph. D., AMD

TECHNICAL SESSIONS

Wednesday, November 2

MFX2-1: Cleaning

Chair: Jason Keeping, P. Eng., Celestica Inc. Co-Chair: Sal Sparacino, ZESTRON Corporation

Beyond ECM - Additional Reasons to Clean Circuit Assemblies

Michael Konrad, Aqueous Technologies

2:00 pm - 3:30 pm Room 200C

Ensuring the Reliability of Critical Assemblies when Implementing a New Cleaning Chemistry

Richard Brooks, Spartronics

Cleaning Performance Evaluations and Best Practices for Novel Jettable Pastes for Advanced SMT Assembly Processes

Kalyan Nukala, PMP, ZESTRON Corporation

MFX2-2: Cleaning Process Control

Chair: Scott Priore, Cisco Systems Co-Chair: Jorge Arellano, Cisco Systems

3:45 pm - 5:15 pm Room 200C

Engineered Cleaning Agent Study as a Function of Rinsing under Low Profile Components

Vladimir Sitko, PBT-Works s.r.o.

Pad-to-Pad Electrical Field Effects on Surface Insulation Resistance

David Lober, KYZEN Corporation/Magnalytix, LLC

Cleaning and No-Clean Process Control using the SIR Test Method and Electrical Twin Richard Brooks, Spartronics

TECHNICAL SESSIONS

Thursday, November 3

LTS3: Materials Innovations

Chair: Francis Mutuku, Ph. D., Indium Corporation Co-Chair: Dan Burkholder, Intel Corporation

A Review of the Impact of Dopants in Sn-Bi Solder Alloys

Aileen Allen, Insight Global

8:00 am - 10:00 am Room 200DE

Microalloying Effects of Sb and Ag on the Microstructural Evolution of Eutectic SnBi Alloys Hannah Fowler, Purdue University

Addressing Low Temperature Rework Concerns

Jennifer Fijalkowski, AIM Solder

Progress Towards using SAC305-Based Supercooled Liquid Metal Microcapsules to Make Interconnects at LTS Temperatures

Ian Tevis, Ph.D., SAFI-Tech, Inc.

MAT1: Solder Plating and Finishes

Chair: Richard Kraszewski, Plexus Corp. Co-Chair: Randy Schueller, Dell Technologies

Evaluation of Reliability using Autocatalytic Silver Bath on ENEP Layer Scott Larson, C. Uyemura & Co., Ltd.

The Impact of the Gold Layer Thickness on Layer Properties, Reliability, and Solder Wetting Performance of an Enig Finish Britta Schafsteller, Ph.D., Atotech Deutschland GmbH & Co KG

Direct Metallization for the Printed Circuit Boards Manufacturing Leslie Kim, MacDermid Alpha Electronics Solutions

8:00 am - 10:00 am Room 202AB

The Effect of EPIG Plating Thicknesses on Solder Joint and Wire Bond Reliability

April Labonte, C. Uyemura & Co., Ltd.

TECHNICAL SESSIONS

Thursday, November 3

MFX3: Printing Challenges

Chair: Adam Murling, Indium Corporation Co-Chair: Jorge Arellano, Cisco Systems

8:00 am - 10:00 am Room 200C

Do We Need to Switch to Type 5 Solder Pastes? Conducting a Midsize DoE to Find Answers

Esra Stoll, Basler AG

Kinetics of the Accumulation of a Layer of Bismuth at the Anode of a Sn-Bi Based Solder Joint during Current Stressing Chrys Shea, Shea Engineering Services

Solder Paste Printing from a Reliability Perspective David Spitz, Ansys, Inc.

Implementing the D-Value to Supplement the P-Value in Electronic Assembly

Ronald Lasky, Ph.D., P.E., Indium Corporation

MFX4: Reflow & Soldering Challenges

Chair: Jeff Kennedy, ZESTRON Corporation

Case Study: Analyzing 0402 Capacitor Defects with Stencil Printing Misalignment When using Water Soluble and No-Clean Solder Pastes

Xinzhi Feng, Rochester Institute of Technology

Influence of PCB Design and Manufacturing Process on PCB BGA Land Pattern Warpage and SMT Yield Satyajit Walwadkar, Intel Corporation

11:00 am - 12:00 pm Room 200C

TECHNICAL SESSIONS

Thursday, November 3

MAT2: Conformal Coating

Chair: Jason Keeping, P. Eng., Celestica Inc. Co-Chair: Morgan Miller, Insituware

Engineered Reliability – Safeguarding Electrical Components and Products with Nanocoating Technology

Daniel Pulsipher, Ph.D., HZO

11:00 am - 12:30 pm Room 202AB

Expandable Bio-Based Polymers: A Lightweight Future for Electronics Ruggedization

Bethany Turner, MacDermid Alpha Electronics Solutions

Conformal Coatings - New Solutions to Existing Problems Christopher Brightwell, Humiseal Europe

LTS4: Thermal Cycling 1

Chair: Srinivas Chada, Ph.D., Project Kuiper Co-Chair: Aileen Allen, Insight Global

11:00 am - 12:30 pm Room 200DE

Thermal Cycling Performance of Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Ball Grid Array Interconnects Richard Coyle, Ph.D., Nokia Bell Labs

The Effect of Thermal Cycling Profile on Thermal Fatigue Performance of a 192-Pin Chip Array BGA with Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Interconnects

Dan Burkholder, Intel Corporation

Reliability of Epoxy-Contained Hybrid SnAgCu/SnBiAg Solder Joint under Thermal Cycling Test Watson Tseng, Shenmao America, Inc.

TECHNICAL SESSIONS

Thursday, November 3

LTS5: Thermal Cycling 2

Chair: Kevin Byrd, Intel Corporation

Co-Chair: Srinivas Chada, Ph.D., Project Kuiper

The Thermal Cycling Performance of Hybrid Low Temperature Solder Joints Assembled at Different Peak Reflow Temperatures

Richard Coyle, Ph.D., Nokia Bell Labs

Reliability Performance of Fourth Generation Low Temperature Solder Alloys in Homogeneous and Hybrid Solder Joints

Morgana Ribas, Ph.D., MacDermid Alpha Electronics Solutions

1:30 pm - 3:00 pm Room 200DE

Low Melting Temperature Solder Interconnect Thermal Cycling Performance Enhancement Using Elemental Tuning

Tae-Kyu Lee, Ph.D., Cisco Systems

MAT3: Soldering and Component Attachment

Chair: Tony Lentz, FCT Solder

Die Attach Epoxy Characterization for Electronic Assemblies

Deborah Hagen, Ph.D., Sandia National Laboratories

Increased Reliability of Quad Flat No Lead (QFN) Wettable Flank Connections by Immersion Tin Plating

Britta Schafsteller, Ph.D., Atotech Deutschland GmbH & Co KG

X-Ray Computed Tomography for Printed Circuit Board Inspection

Robert Boguski, Datest Corporation

Chen Dai, Ph.D., VJ Technologies

1:30 pm - 3:00 pm Room 202AB

TECHNICAL SESSIONS

Thursday, November 3

MFX5: Smart Factory & Automation

Chair: Scott Priore, Cisco Systems Co-Chair: Dave Angelini, Cisco Systems

1:30 pm - 3:00 pm Room 200C

The Challenge and Solution for Implementing Automation and AI for Electronic Card Assembly

Wayne Zhang, IBM Corporation; Jason Keeping, Celestica, Inc.

Secure Data Exchange Between Design and Manufacturing using IPC-2581 Ivan Aduna, Koh Young Technology, Inc.

Single Source of Truth

Doug Olson, Crystal Tan, Keysight Technologies

LTS6: Thermal Mechanical Reliability

Chair: Charles E. Bauer, Ph.D., TechLead Corporation Co-Chair: Ian Tevis, Ph.D., Safi-Tech

3:30 pm - 5:00 pm Room 200DE

Low Temperature Solder Hybrid Solder Joint Time Dependent Behavior Learnings

Hemant Shah, Ph.D., Intel Corporation

Thermal Reliability of Mixing Bismuth-Containing Solder Paste with SAC BGAs

At Low Reflow Temperatures - Part III Wenjing He, Rochester Institute of Technology

Reliability Performance of SMT Low Temperature Solder Second Level Interconnects

Jason Stafford, Kevin Byrd, Intel Corporation

Thursday,

TECHNICAL SESSIONS

MAT4:

Chair: Tom Forsythe, KYZEN Corporation

Creation

Tony Lentz

A

Hongwen

Process

Westin

FCT

3:30 pm - 5:00 pm Room 202AB

EXHIBITOR A-Z

A2Z Electronics LLC

Zinal Patel

410B Airport Road, Elgin, IL zpatel@a2zems.com 847-651-2615

A2Z Electronics is a full-service Electronics Contract Manufacturer with ISO 13485, ITAR and IPC Certified employees. With our continuous improvement driven matrix and 20+ years of combined manufacturing and management experience within various industries, A2Z Electronics has the knowledge and expertise to develop comprehensive and flexible processes to quickly become a more cost efficient extension of our customers’ manufacturing operation.

ACL STATICIDE

Booth 1224

Dan Kaiser 840 W. 49th Place, Chicago, IL dkaiser@ACLSTATICIDE.COM 847-981-9212

For over 50 years, ACL, Inc. has been a trusted supplier of static control, contamination and specialized cleaning products. Our name is synonymous with quality, reliability, and cost-effective manufacturing solutions.

AI Technology

Maurice LeBlon

70 Washington Road, Princeton Jct, NJ mleblon@aitechnology.com 609-799-9388

Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology, Inc. (AIT) has been one of the leading forces in development and patented applications of advanced materials and adhesive solutions for electronic interconnection and packaging. AI Technology, Inc. (AIT) offers some of the most reliable adhesives and underfills for die bonding for the largest dies, stack-chip packaging with dicing dieattach film (DDAF), flip-chip bonding and underfilling and high temperature die bonding for single and multiple-chip modules for applications beyond 230°C. The company continues to provide the best adhesive solution for component and substrate bonding for both military and commercial applications. AIT’s thermal interface material solutions, including our patented phase-change thermal pads, thermal greases and gels and thermal adhesives have set many bench marks of performance and reliability for power semiconductors, modules, computers and communication electronics.

Pamela Jaramillo

Booth

25 Kenney Drive, Cranston, RI pjaramillo@aimsolder.com 401-463-5605

AIM is a leading global manufacturer of solder assembly materials for the electronics industry with manufacturing, distribution, and support facilities located throughout North and South America, EMEA, and Asia. We serve the electronics industry, as well as various specialized businesses, including LED lighting, mobile devices, automotive, renewable energy and aerospace. At AIM, we are committed to developing world class products through innovative R&D and offering unparalleled sales and technical support.

Booth 936

Paul Handler

2700 N.E. Expy., Building B, Suite 500, Atlanta, GA phandler@akrometrix.com 678-427-6116

Akrometrix is the leading manufacturer in warpage solutions for the R&D Lab, SMT production lines, as well as a provider of Testing Services for our customers. We utilize Shadow Moiré, Digital Fringe Projection (DFP), and Digital Image Correlation (CTE) vision technologies, capable of measuring warpage of electronic components and PCB assemblies, from sub-freezing to reflow over temperatures up to 3500 C.

Booth 1039

905 Albion Ave., Schaumberg, IL barry@allfavorpcb-usa.com 630-913-4263

Allfavor is a PCB manufacturer, manufacturing PCB’s since 2005. 3 factories located in Shenzhen, Nanjing, & Zhuhai China. Producing, high mix, low to medium / high volume rigid PCB’s 2-14 layers, flex, rigid flex, RF/HF, & metal clad. We are UL for up to 6oz copper, Proto’s 3-5 days, Small production 7-10 days and standard production, 15 days. Our 4th facility focusing on HDI boards will be complete Jan 2022. Our motto is “service beyond expectation.

Booth 1146

Booth 1054

AIM Solder

Akrometrix

Barry Zielke

Allfavor Technology

Alltemated

EXHIBITOR A-Z

Bimos Seating

Booth 1142

Randy Temple

541 Northgate Pkwy., Wheeling, IL randy.temple@actionir.com 847-394-1891

Since 1993, Alltemated has been the electronics industry’s preferred choice for one-stop component-preparation services. Alltemated sets the standard for tape and reel packaging, IC programming, underflim technology and carrier tape manufacturing. Widely known for supplying PLACE-N-BOND underfilms a durable adhesive technology for bonding SMD components to PCB. Seamlessly integrates with SMT assembly and eliminates curing and dispensing.

ANDA Technologies

Brian Stumm

47639 Lakeview Blvd., Fremont, CA 510-270-8648

bstumm@anda.us

Anda (Guangdong Anda Automation Solutions Co., Ltd.) established in 1999, is an industry 4.0 smart equipment and automation solutions manufacturer with over 20 years’ experience manufacturing, developing intelligent automation systems, and providing sales/service to fluid applications. Anda smart equipment and automation systems are used across industries worldwide. Our products include high precision dispensing, conformal coating, plasma treatment, curing ovens, multi-functional assembly, semiconductor manufacturing equipment, medical electronic dispense/assembly machines, and smart manufacturing system solutions.

ASM Assembly Systems

Booth

Mark Ogden

3975 Lakefield Court, Suwanee, GA ogden.mark@asmpt.com 770-797-3189

ASM is the worldwide leading supplier of electronics assembly and microelectronics packaging equipment. For over 40 years our DEK Screen Printing and SIPLACE Pick and Place SMT machines have been enabling our customers to manufacture products for the digital world. In addition, ASM is also provides a suite of factory software, ASM Works. This enables our customers to optimize workflows and increase productivity.

1235 N. Clybourn #349, Chicago, IL m.scelfo@interstuhl.com 630-725-8284

BIMOS LAB SEATING is a Seating for Science + Technology and is the best-in-class brand globally for chairs and stools to support technical, manufacturing, research and science workers. The brand stands for innovation, high-design and high-quality. BIMOS products were all designed specifically with the lab and production environment in mind in conjunction with science professionals and are defined by unique scale, function and materials, all intended for longevity and application.

BlueRing Stencils

Booth 914

Derek Stuart

140 Mount Holly Bypass, Unit 10, Lumberton, NJ dstuart@fctassembly.com 719-510-6000

BlueRing is a “full service” stencil & machined parts manufacturer committed to supplying advanced technologies and solutions to various manufacturing industries. We offer on-time delivery of high quality laser cut stencils, transfer increasing nano-coatings, fixtures & parts, engineering & developments services, all committed to give you the highest quality assembly for your specific process. Our philosophy is to provide products # services that exceed our customers’ expectations which is why we have heavily invested in the best technology & developed the most qualified team members with decades of manufacturing & engineering experience.

Boardera Software Inc. Booth 1147

Curtis Hunter

260 King Street W., Unit 205, Kitchener, Ontario, Canada chunter@boardera.ca 226-789-6237

Boardera Software is focused on helping PCB manufacturers and assemblers to bring their services online with cutting edge e-commerce tooling built specifically for the PCB industry. Using smart design and automation, drastic reductions in overhead and lead times can be achieved.

Booth

Mark Sceifo

EXHIBITOR A-Z

BTU International

Shasheen Conroy

23 Esquire Road, North Billerica, MA sconroy@btu.com

978-667-4111

BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment solutions in the electronics manufacturing market. BTU’s high-performance convection reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes.

CalcuQuote

Christina Molitor

414 Englewood Drive, Muphy, TX

christina@calcuquote.com 909-278-8233

CalcuQuote moves the EMS industry forward with process and technology expertise to solve complex problems. CalcuQuote’s flagship product is a comprehensive quote management software for high-mix, low-volume Electronics Manufacturing Services (EMS) companies. By integrating with major component suppliers, CalcuQuote enables a sophisticated request for quote (RFQ) process that delivers quotes with unrivaled speed and precision.

Conductive Containers

Kallan Blake

4500 Quebec Ave. N., New Hope, MN

We take pride in providing unique static protective packaging solutions that match the way you want your system to work and our vertically integrated processes put us in the position to choose the most cost effective way to meet your needs. When you add our package design and manufacturing expertise with our raw material inventory and stock selection, you have CCI’s formula for success.

CTI Systems

Wes Martin

751 S. Church Street, Goldston, NC wesm@ctisystems.net 972-261-8899

CTI Systems is a world class manufacturer of PCB assembly equipment/Laser marking/PCB depanelers and odd form component insertion. We also provide state of the art PCB transport equipment using AGV’s,

custom

CyberOptics

Sy Creed 5900 Golden Hills Drive, Minneapolis, MN screed@cyberoptics.com 952-820-5837

CyberOptics Corporation is a leading global developer and manufacturer of high-precision 3D sensing technology solutions. CyberOptics’ sensors are used for inspection and metrology in the SMT and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the Company has strategically established itself as a global leader in high precision 3D sensors. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.

ESSEMTEC USA

Bryce Timms

300 5th Ave., Suite 1010, Waltham, MA 02451 bryce.timms@essemtec.com

Essemtec, a Nano Dimension division, develops and manufactures high-tech solutions for the worldwide electronics manufacturing industry. Essemtec leads the industry in adaptive SMT dispensing and pick-andplace equipment, and intelligent production storage system for optimal assembly flow. Essemtec products allow easy programming and operation for a wide range of applications. We invest R&D to develop outstanding solutions for our customers. Eseemtec USA serves the American market with a strong team of experts.

Chris Merow

4640 E. Elwood Street, Suite 14, Phoenix, AZ chris.merow@europlacer.com 508-353-9872

Europlacer designs, manufactures, sells and services advanced SMT Assembly Solutions to the global market, including screen printing and placement equipment, complemented by a suite of software tools designed to provide intuitive set-up, programming and portable production monitoring functions. Over our 50+ years, Europlacer has been the proud recipient of numerous prestigious industry awards for product innovation and service excellence, and is the first placement equipment provider to comply with the IPC CFX initiative.

WWW.SMTA.ORG/SMTAI

Finetech

EXHIBITOR A-Z

Kirsty Stebbins

60 State Route 101A, Bldg. A, Amherst, NH kes@finetechusa.com 603-627-8989

Finetech is a world leader in rework equipment for a wide range of applications. The Fineplacer® Core provides precise temperature and convection flow control, outstanding placement accuracy, and process repeatability for advanced applications including miniLEDs, and 008004 passives. The Expert 10.6 delivers automated component alignment, large board handling, non-contact residual solder removal and solder paste/flux dispensing. For a manual, cost-effective rework solution, the Expert 5.6 handles the complete rework process with a high-resolution camera for fast, accurate and reproducible placement results. Complimentary units for automated or manual dispensing, BGA-CSP reballing and contactless extraction of residual solder are available.

Fuji America Corporation

Booth 1051

Peter Mazza

171 Corporate Woods Pkwy., Vernon Hills, IL mazza@fujiamerica.com 847-913-0162

In 1959, Fuji Corporation beganas Fuji Machine Manufacturing (FMMC) producing electronic assembly equipment. Through the years, the company has remained committed to creating, developing, and manufacturing the surface mount (SMT) industry’s most innovative assembly solutions.

The Fuji Corporation name is synonymous with reliability and trustworthiness. Not only is Fuji Corporationa global leader as a machine tool builder, Fuji Corporation ensures productive manufacturing of countless additioanl companies in almost every industry around the world. Fuji Corporation, is simply, the standard.

Garland Service Comany

Booth

Britt Smith

714 Shepherd Drive, Garland, TX bsmith@gscusa.net 972-494-1911

Garland Service Company (GSC) is a company that specializes in the design and manufacturing of tooling and fixtures associated with the electronics manufacturing industry as well as serving as a machining center for various other industries. We are ISO 9001 certified and ITAR Registered.

Glenbrook Technologies

Steven Zweig

11 Emery Ave., Randoplh, NJ szweig@glenbrooktech.com 973-361-8866

Glenbrook Technologies is a leading worldwide manufacturer of x-ray inspection systems with over 2,800 installations in 62 countries worldwide. We offer a complete line of systems ranging from benchtop to fully automated. Our systems are in use by the leading medical device manufacturers and electronic contract manufacturers. Glenbrook has offices in the US, Germany and Hong Kong.

1st Floor, 239 Kensington High Street, London, UK sdaneau@globalsmt.net 239-234-1600

Global SMT & Packaging is the EMS industry’s leading media brand, reporting on new technologies and processes related to electronics manufacturing. The monthly magazine is supported by websites, newsletters and video channels with regular panel discussions and a Tech Talk Thursday vodcast. The company also hosts the Global Technology Awards, eSmart Factory and LTS Conferences.

Hanwha Techwin

943

Jonny Nichols

6000 Phyllis Drive, Cypress, CA jonny.n@hanwha.com 919-606-3707

Hanwha Techwin delivers a comprehensive line of security cameras and surveillance solutions for analog and network based systems.

HZO

Lisa Rizzo

5151 McCrimmon Pkwy., Morrisville, NC lrizzo@hzo.com 336-263-3296

HZO provides high-reliability coatings for when electronic product failure isn’t an option. We can help you get started quickly with our turnkey application solution for adaptable, scalable production. Our solutions revolve around your convenience - outsource to worldwide locations or use our factory-in-factory business model. Our coatings are REACH, RoHS, and Prop 65 compliant, millions of PCBs coated with no product returns due to coating issues. Speak to an engineer about your project.

Sandy Daneau

Global SMT&

Booth

ICAPE USA

Booth

EXHIBITOR A-Z

Lea Maurel

8102 Zionsville, Indianapolis, IN lea.maurel@icape-group.com 317 405-9427

We are one of the world’s largest providers of PCBs and Custom Technical Parts. Quick Turns through Mass Production, we are your source for all PCB Technologies. Our custom parts include Coils/Transformers, Adaptors/ Power Supplies, and Wire Harnesses. We don’t just sell PCBs and Custom Parts, we offer precision and value: Design for Cost Solutions, DFM, Indiana-based PCB Lab Services, VMI/CMI.

IConnect007

Booth 821

Nolan Johnson 942 Windemere Drive NW, Salem, OR editorial@iconnect007.com 503-437-9446

Watch interviews with industry leaders, read show articles, view our extensive photo gallery and more. Real Time with, SMTAI is produced by I-Connect007, home of SMT007 Magazine, Design007 Magazine, PCB007 Magazine, I-007eBooks, sector-specific websites, newsletters and more. These global digital media products are the electronic manufacturing industry’s most comprehensive source for original, multimedia editorial, news and articles. Our Real Time with SMTAi event coverage can be seen here: www.realtimewith.com.

IDENTCO

Booth 919

Rick Miller 28164 W. Concrete Drive, Ingleside, IL rmiller@identco.com 815-385-0011

IDENTCO is a rapidly growing manufacturer of highperformance labeling solutions for product tracking, tracing, branding, compliance, and identification. We specializein complete print-on-demand labeling solutions and ultra-durable high graphic content custom labels. With locations in the US, Mexico, and Europe, IDENTCO supplies global OEMs and contract manufacturers with durable label solutions for the most extreme environments.

Impossible

Dan Migely 3455 Commercial Ave., Northbrook, IL dmigely@impossible-objects.com 312-593-6447

Impossible Objects 3D Prints cost effective tooling, including Solder Pallets and Fixtures, using carbon fiber reinforced with high temperature PEEK polymer. These materials provide excellent thermal and chemical resistance for the manufacturing environment. Our CBAM process allows for a great deal of design freedom, and the ability to print multiple iterations up front, eliminating time consuming and costly back and forth.

Inovaxe

Margy Khoshnood

260 S.W. 12th Ave., Deerfield Beach, FL margy@inovaxe.com 954-531-1363

Inovaxe provides innovative SMART Material Storage and Handling Systems. Our Ultra Lean Total Material Handling Solutions address the challenges of dealing with SMT components and kits within the manufacturing stockroom and WIP locations and facilitates vendor managed inventory. Find your materials in seconds utilizing InoAuto SMART Mobile Storage Carts and Racks, Stationary Stockroom and line side storage racks and our InoBar; intelligent storage for Reels, Tubes, JEDEC trays, PCBs, Solder Stencils, Bulk Items, Mechanical Bins, and Moisture Sensitive Devices, along with the Stockroom Management and Inventory Locator Software tools.

EXHIBITOR A-Z

Insituware

107 Gilbreth Pkwy., Mullica Hill, NJ morgan@insituware.com 856-324-6776

Insituware allows you to ensure consistency and materials quality control for a world-class manufacturing process. Insituware’s materials quality control device, The Vision MARK-1, is a handheld unit that measures changes in materials before and during the manufacturing process. In addition to the Vision MARK-1, Insituware has just launched two new innovations for materials quality control and automated materials inspection (AMI): The CC-100 Thickness Tester, and the SM-100 Smart Mixer. The CC-100 Conformal Coating Thickness Tester uses a chromatic confocal measuring principle to accurately determine the thickness of transparent layers in wet or dry conformal coatings. The SM-100 Solder Paste Smart Mixer uses a technique called electrochemical impedance spectroscopy (EIS) to monitor the chemical reactions occurring within the solder paste during mixing.

Intraratio Corporation

Philippe Frid

4891 Pacific Highway, Suite 103, San Diego, CA pfrid@intraratio.com 310-382-4239

Intraratio provides enterprise software solutions to automate traceability and quality control of advanced electronics product manufacturing.  Serving the high performance computing, automotive, space military, and medical device markets.  Deployed globally, our platforms bring true visibility and scale to manufacturing operations anywhere.  Delivering on the promise of Industry 4.0.

IPC

Booth 842

Alicia Balonek

3000 Lakeside Drive, 105N, Bannockburn, IL

AliciaBalonek@ipc.org 847-615-7100

IPC is the global association that helps OEMs, EMS, PCB manufacturers, cable and wiring harness manufacturers and electronics industry suppliers build electronics better.

IPC members strengthen their bottom line and build more reliable, high-quality products through proven standards, certification, education and training, thought leadership, advocacy, innovative solutions and industry intelligence.

Erica Candela

Booth 1218

35 Parkwood Drive, Suite 10, Hopkinton, MA

ecandela@itweae.com 508-541-4759

ITW EAE is a developer and provider of capital equipment used in electronics manufacturing, and is found in premier printed circuit board (PCB) assembly facilities the world over. ITW EAE comprised with industry-leading brands: MPM stencil printing equipment for electronic materials; Camalot Systems fluid dispensers; Electrovert reflow soldering, wave soldering, and curing, and cleaning equipment; Vitronics Soltec selective soldering, reflow soldering and wave soldering equipment; and Despatch industrial oven and furnaces.

Jose Larrea

9296 Dielman Industrial Drive, St. Louis, MO jlarrea@jbctools.com 866-429-5753

More than +90 years of experience have placed JBC at the technological forefront of tools for soldering and rework. Leaders of the industry offering top notch tech.

5151 McCrimmon Pkwy., Suite 200, Morrisville, NC carlos.eijansantos@juki.com 919-460-0111 130

Juki Automation Systems (JAS), is an international leader in high-speed SMT Assembly equipment, has shipped more than 45,000 machines worldwide since 1987. Juki has built its global image with a combination of topquality and high-reliability machines with a reputation for world-class service and support that result in the lowest production costs for its customers. Juki machines have about 30 percent U.S. made content by cost. The pioneer of the modular assembly system in 1993, Juki offers flexible solutions designed for both high-volume and high mix environments.

ITW EAE

JBC

Carlos EiJansantos

Juki Automation Booth 731

Booth 1037

Morgan Miller

Booth 1010

KIC

EXHIBITOR A-Z

Kulicke & Soffa

Allene Bailey

16120 W. Bernardo Drive, San Diego, CA

allene@kicmail.com 760-745-0819

KIC provides solutions for challenges such as handling process audits, automating manual profiling and data reporting tasks, MES connectivity, Industry 4.0 implementation, NPI process setup, reducing solder defects (voiding, head in pillow, tombstoning), and more. KIC’s newest product WPI, Wave Process Inspection, provides users with automatic profiling – including an industry first dwell time and parallelism measurement for each production board – real-time preheat and wave analytics, automatic SP charting and more.

Koh Young America

Brent Fischthal

1950 Evergreen Blvd., Suite 200, Duluth, GA brent.fischthal@kohyoung.com 704-651-2860

Established 20 years ago in 2002, Koh Young pioneered the market by launching the first 3D Solder Paste Inspection (SPI) system using a patented dualprojection Moiré technology. Since then, it has become the global leader in 3D measurement-based SPI and Automated Optical Inspection (AOI) equipment for the electronics industry. Based on its True3D™ measurement-based inspection technology, Koh Young has developed innovative inspection solutions for challenges with machined parts, press-fit and throughhole pins, conformal coatings, dispensed materials, and semiconductor packages. Through its constant innovation, Koh Young has secured over 3,500 global customers, and maintains the dominant global market share in the SPI and AOI markets with over 20,000 machine installations. By adopting a user-centric R&D focus, it continues to use its core competencies to develop innovative solutions for new and existing markets.

Tanja Lieshout

1005 Virginia Drive, Fort Washington, PA tlieshout@kns.com 847-524-1600

Kulicke & Soffa is a leading provider of semiconductor, LED, and electronic assembly solutions serving the global automotive, consumer, communications, computing, and industrial markets. Founded in 1951, K&S prides itself on establishing foudnations for technological advancement - creating pioneering interconnect solutions that enable performance improvements, power efficiency, form-factor, reductions, and assembly excellence of current and nextgeneration semiconductor devices.

Kurtz Ersa, Inc. Booth 1119

Daniel Hahn

1779 Pilgrim Road, Plymouth, WI daniel.hahn@kurtzersa.com 920-912-7017

Kurtz Ersa is a leading global supplier of screen printers, reflow ovens, wave solder, selective solder, BGA rework, BGA Inspection and hand soldering irons; with locations in Germany, USA, Mexico, France, Korea and China.

Under the motto “YOUR PRODUCTION – DRIVEN BY KURTZ ERSA”, Ersa will be presenting perfect solutions for all focal topics of future-proof electronics production.

Sherry Stepp

430 Harding Industrial Drive, Nashville, TN sherry_stepp@kyzen.com 615-831-0888

KYZEN has been pioneering award-winning, environmentally responsible, advanced cleaning technologies since 1990. By fusing our commitment to groundbreaking science in cleaning chemistries along with our dedication to research with the care for your manufacturing cleaning process, we continuously improve our cleaning agents and problem solve to create the most effective cleaning products and solutions to suit your specific needs.

Booth 1226

Booth 925

Booth 1136

KYZEN

EXHIBITOR A-Z

MacDermid Alpha Electronics Solutions

Booth 1018

Erika Sebens

800 West Thorndale Ave., Itasca, IL erika.sebens@macdermidalpha.com 630-616-6806

MacDermid Alpha Electronics Solutions (MAES) provides solutions that enable the manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Through the innovation of specialty chemicals and materials under our Alpha, Electrolube, Kester, Compugraphics, and MacDermid Enthone brands, MAES provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain.

Magnalytix

Booth 837

Sherry Stepp

430 Harding Industrial Drive, Nashville, TN sherry_stepp@kyzen.com 615-831-0888

Founded in 2018 by industry experts Dr. Mike Bixenman and Mark McMeen, Magnalytix is at the forefront of an ongoing revolution in cleanliness reliability testing, bringing a new level of consistency and confidence to manufacturers and OEMs. Components are getting smaller, and electronics are playing a greater role in our daily lives. Reliability matters more than ever. In today’s miniaturized manufacturing environment, precision cleaning process reliability is critical. With products from medical devices, to military weapons, to self-driving automobiles, reliable electronics can be the difference between life and death. Magnalytix is ready with gamechanging solutions that run in real-time in your process, on the factory floor.

Marc Technologies

Booth 1113

Mike Gunderson

15345 SE 82nd Drive, Clackamas, OR mike@marctechnologies.com 503-723-0962

2368 E. Enterprise Pkwy., Twinsburg, OH rrocha@metallicresources.com 330-256-7210

Metallic Resources is comprised of “hands-on” industry experts who understand the metallurgy of solder and mechanics of soldering. Technical orientation in the practical aspects of electronic assemblies soldering processes results in superior problem solving capabilities and recommendation of special needs for each individualized soldering process in the electronics market. Continual innovation and refinement of manufacturing methods results in a family of highest quality electrolytic solders guaranteed to improve the quality of finished goods, while at the same time lowering production soldering costs. Local sales representatives and strategically located stocking distributors provide support throughout the United States and the world.

Microscreen Booth 1050

1106 High Street, South Bend, IN hollyw@microscreenLLC.com 574-232-4358

Mid America Taping & Reeling, Inc.

Barbara Pauls

Booth 939

6601 Lyons Road, Coconut Creek, FL bpauls@matr.com 630-629-6646

Mid America Taping and Reeling Inc. offers the following services: axial, radial, and surface-mount lead taping; programming; dry packing; baking; and lead tinning and forming. The company designs and manufactures custom carrier tape and take-up reels, and distributes cover tape. Mid America is an ISO 9001:2015 certified and 100% woman-owned and operated registered company by WBNC.

Ricardo Rocha

Metallic Resources Booth 920

Holly Wallace

EXHIBITOR A-Z

Rob Horowitz

3 Morse Road - 2A, Oxford, CT

r.horowitz@mirtecusa.com 203-881-5559

“MIRTEC is a leading global supplier of 3D & 2D Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) Systems to the electronics manufacturing industry. Among the many strengths are the ease of programming and the flexibility to be used anywhere in the manufacturing process. MIRTEC invests heavily in research & development, focused on using state of the art optics, lighting and Moire technology in the development of our systems.”

MYCRONIC,

Christian

554 Clark Road, Tewksbury, MA christian.vega@mycronic.com 978-994-2503

Nihon

Keith

NS Bldg., 1-16-15

81-6-6380-1121

Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. Since then, we have made our mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry.

Ben Slaughterbeck

12701 Grand River Road, Brighton, MI

Ben.Slaughterbeck@nikon.com

Nikon Metrology offers the broadest range of metrology solutions including X-ray systems and microscopes for applications ranging from miniature electronics and surface-mount technology to the largest aircrafts. Nikon Metrology’s innovative measuring and precision instruments contribute to a high performance design-through-manufacturing process that allows manufacturers to deliver premium quality products in a shorter time. Further information is available on www.nikonmetrology.com.

Nordson Test

1122

Inspection

Janet Lykowski 2747 Loker Ave. W., Carlsbad, CA 92010 janet.lykowski@nordsonsonoscan.com 52-33-32713784

Nordson DAGE, MATRIX, SONOSCAN and YESTECH manufacture AOI, AMI, X-ray Inspection, Bond Testing and Wafer X-ray Metrology systems that bring powerful, cost effective solutions to the PCBA and Semiconductor industries.

NSW Automation Sdn. Bhd. Booth 1125

Nicole Yap

NO.1, Jalan Beringin, Batu Maung, Bayan Lepas, Penang cpyap@nswautomation.com 6012-4380226

We supply advanced precision fluid dispensing solutions to microelectronics and semiconductor producer for device assemblies such as 5G components, 01005 dispensing, 008004 solderings, MEMS, SiP, PoP, CSP and wafer-level packaging applications.”

Omron Inspection Systems Booth 807

Krissy Sorenson 2895 Greenspoint Pkwy., Suite 200, Hoffman Estates, IL krissy.sorensen@omron.com 847-285-7257

Manufacturer of control equipment, factory automation systems, electronic components, automotive electronics, ticket vending machines and medical equipment.

Panasonic

Booth 1143

Tom Kramer Two Riverfront Plaza, 9th Floor, Newark, NJ Tom.Kramer@us.panasonic.com 224-275-6006

Panasonic System Solutions Company of North America, Process Automation (PSSNA-PA) develops and supports innovative manufacturing processes around the core of circuit manufacturing technologies and computerintegrated manufacturing software, thereby, contributing to the growth and prosperity of our customers’ businesses regardless of their mix or volume.

Mirtec

Nikon

EXHIBITOR A-Z

Jessica Jurek

9853 Pacific Heights Blvd., Suite N, San Diego, CA jjurek@parmiusa.com 858-683-0225

PARMI Co., Ltd. is a technology-intensive corporation that develops and supplies in-line 3D inspection machines used in a wide variety of applications ranging from SMT manufacturing to semiconductor processes.

Dustin Rhodes

1 Edgewater Drive, Suite 109, Norwood, MA dustin.rhodes@pcbconnectgroup.com 254-913-5492

PCB connect is one of the leading suppliers of Printed Circuit Boards. PCB Connect is a long established and globally positioned supplier of Printed Circuit Boards whose mission is to utilize its long experience and history to increase our customers competitiveness and improve their time to market.

Brook Anglin

PO Box 807, Amesbury, MA brooke@pcea.net 404-316-9018

PCEA, a nonprofit association, promotes the printed circuit engineering profession through the exchange of information and the integration of new design concepts through training and certification using a worldwide network of chapters. Products include PRINTED CIRCUIT DESIGN & FAB (pcdandf.com)/CIRCUITS ASSEMBLY (circuitsassembly.com) magazine; PCBUPdate (pcbupdate. com) e-newsletter; PCU (printedcircuituniversity.com) online training, PCB East/West (pcbeast.com) (pcbwest. com) exhibitions and conferences; PCB2Day (pcb2day. com) workshops.

PDR Rework and Test Systems Booth 1043

Jack Harris 3869 Dividend Drive, Shingle Springs, CA jharris@pdrxy.com 916-425-1792

PDR is the industry leader in Focused Infrared Technology for PCB Rework. Supported world-wide since 1986, and today with over 4600 systems sold, PDR systems offer Visible IR heating technology, air nozzle free operation, are characteristically easy to learn, set-up and operate, delivering extremely accurate process control to produce both high quality rework and precision thermal testing results.

201 Lively Blvd., Elk Grove, IL adriand@pillarhouseusa.com 847-593-9080 121

Pillarhouse is the world leader in the design and manufacturing of selective soldering systems from handload (batch) processes to fully automated high-speed lines. Pillarhouse manufactures a wide range of modular and hand load equipment to fit the changing marketing market needs of today.

Our product range includes the following: Bench Top, Hand-Load, inline modular and multi station high speed lines plus large board machines up 24 x 36.

Retronix

Booth 808

Phil Myers 1007 S. Heatherwilde Blvd., Suite 300, Plugerville, TX phil.myers@retronix.com 717-847-1540

Retronix is a global business operating in the Americas, Asia, and across Europe. Retronix offers technical solutions for the refurbishment and repair of electronic components to the electronics market. Main services include Reballing, Robotic Hot Solder Dip, Component Testing, and Component Reclaim. Retronix is a key member of the component supply chain, offering alternatives to customers facing component shortages and obsolescence.

Adrian De’Ath

Pillarhouse USA Booth 1007

PCEA Booth 1121

PCB Connect Booth 1020

PARMI USA Booth 910

EXHIBITOR A-Z

831

211 Kitty Hawk Drive, Morrisville, NC

andrew.dustin@us.schunk.com 919-957-6701

SCHUNK Electronic Solutions (SES) is setting standards in the field of depaneling technology by offering solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling parameters to commissioning. Depaneling machines from SES are high-performance machines for the depaneling of single circuit boards with electronic components. The SES product range focuses on modern processes in electronic component production. Our systems and devices meet the most demanding requirements.

Scienscope International

713

Marilu Correa

5751 Schafer Ave., Chino, CA mcorrea@scienscope.com 800-216-1800

Scienscope is an industrial (NDT) solution provider. We are committed to the best price to performance ratio. Scienscope began in 1994, serving all manufacturing areas in North America. Now, we have expanded our services globally through a network of technical sales representatives and distributors. Our mission is to provide the most innovative and cost-effective solutions for your manufacturing process.

Seika Machinery

Booth 913

Michelle Ogihara

21241 S. Western Ave., Suite 140, Torrance, CA michelle@seikausa.com

310-540-7310

Since 1994, Seika Machinery has continuously provided a wide variety of high quality and reliable production equipment with accompanying engineering support services for the electronics and general manufacturing industries. Among its popular lines include the McDry dry cabinets, the Sawa ultrasonic cleaners, the Sayaka PCB depanelers, the Malcom process control systems, the Unitech PCB cleaners, the Hioki flying probe testers, the Kyowa strain gages, the N-1 Checker FAI and much more.

Larry Welk

806

1746 Starbridge Drive, Surfside Beach, SC lwelk@smartsplice.com 717-314-9297

“Smart Splice is the recognized leader in the sales and service of tape splicing materials, tools, and accessories in the PCB industry. Since the introduction of the Professor Splice Channel on YouTube a year and a half ago, we have become the go to instructional company for teaching any company how to get the highest production rates on ANY pick and place machine! With the introduction of the latest tape splicing sensation, double edge splice tape, you owe it to yourself (and your company) to visit our booth and get “schooled by the professor”!”

6600 City West

info@smta.org

The SMTA is an international association for electronics engineering and manufacturing professionals seeking to improve processes through best practices and real world solutions. SMTA offers access to local and global communities of experts as well as accumulated research and training materials from thousands of companies dedicated to advancing the electronics industry. With 50 chapters around the world and thousands of active members, we invite you to join us at one of our local, regional, national or international technical events.

Ana Carrillo

Prol. Pino Suarez 1039 int 36, Col. El Vigia Zapopan, Jalsico ana.carrillo@smartsol.mx 52-33-32713784

SMarTsol Technologies is a company founded in February 2012 in Guadalajara with the objective of offering products of value for our customers.

We are a supplier with the expertise in process analysis and consulting for the High-Tech Industry, includes industrial, electronics, automotive, aerospace, metalworking, medical, telecommunications and commercial sectors.

Andrew Dustin

SCHUNK Electronic Solutions

Smart

Saniya Pilgaonkar

Eden Prairie 952-920-7682

EXHIBITOR A-Z

Wendy Tindle

Etek Technology Gr. Dow Road, Prestwick Aerospace Park, Prestwick, Ayrshire, Scotland wendy@smttoday.com

009

Born in 2013 SMT Today is a team bursting with years of experience in online and offline marketing. Creating the first high quality, industry leading magazine for the world of electronics, we quickly grew to be the clear market leader. By delivering quality content through the widest range of multi-media channels and platforms, our strategy is driven by success. 2017 saw the launch of i4.0 Today, our exclusive platform dedicated to the concept, technology and future of Industry 4.0. The only dedicated Industry 4.0 magazine in the electronics industry, offering digital and print marketing for our clients as well as opportunities to speak at events.”

Specialty Coating Systems

Brittney Dial

7645 Woodland Drive, Indianapolis, IN BDial@scscoatings.com 317-472-1290

Specialty Coating Systems is a leader in Parylene and liquid conformal coating services and technologies with 50 years of experience and 20 worldwide locations. SCS conformal coatings offer excellent moisture, chemical, and dielectric barrier properties to protect components in the aerospace, defense, medical device, transportation and electronics industries. SCS also offers industryleading liquid coating systems, including spray, spin and dip coating systems, thermal and UV cure systems and ionic contamination test systems.

Joe

Unit

StaticStop, a division of SelecTech, Inc, has the most

line of ESD flooring

We offer a

with

SPEA, a world leader of automatic test equipment for

Our flying probe and 3030 series

testers provide the best throughput and multi-

test

including full in-circuit,

impedance test,

and optical

and technical

of glue-down

ESD carpet,

patented FreeStyle and SelecTile

that

without downtime and

flooring and carpet. We also carry a complete

over

of ESD flooring maintenance products to

properly.

last long and

SMT

EXHIBITOR A-Z

Larry Chen

Test Research, Inc. Booth 1030

7th Floor, Number 45, Dexing W. Road., Shihlin Dist., Taipei City, TA larry_chen@tri.com.tw 886-2-2832-8918 2217

Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), In-Circuit Test equipment (ICT), and Functional Testing (FCT), TRI provides the most costeffective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at www.tri.com.tw.

Texmac/Takaya Booth 815

David Levine 807 W. Eastern Ave., McHenry, IL dlevine@texmacusa.com 847-393-6001

TEXMAC is the North American distributor of the worlds most accurate and fastest PCBA Flying Probe Test systems. The Takaya APT-1400F /1600FD family of test systems is setting the flying probe standard one again for both single and double sided mobile flying probe testing. As the inventor of the flying probe test technology, Takaya continues to own the reputation as the leader for accuracy, ease of use and reliability.

Tom Ott PO Box 18335, Huntsville, AL 256-650-0220 tom.ott@tintronics.com

Offering Component level value add services that meet or exceed industry specifications that are required by our ever-changing, fast paced electronics marketplace. Providing XRF analysis, State of the Art Robotic Mitigation/ Hot Solder Dip/Gold Removal/solderability enhancement/BGA repair and reball/ Surface mount tape and reel / thru-hole tape and reel / lead form & excise of SMT devices/ Thru-hole lead form / Dry-packaging / Cleanliness Testing/ Solderabilty Testing. J-STD, Mil-STD, GEIA, EIA, AS9100 REV. D ISO9001:2008, SDVOSB

Cindy Hoke 7301 W Boston Street, Chandler, AZ cindyh@trans-tec.com 480-390-0440

“As the leading distributor of Yamaha SMT equipment solutions in North America, Trans-Tec America is one of the longest-standing global partners for integrated modular assembly lines worldwide. With dedicated industry experience spanning from its inception in 1988, Trans-Tec has developed an excellent reputation for delivering exceptional products and services.”

Tintronics Booth 918

Trans Tec America Booth 1108

EXHIBITOR A-Z

Transforming Technologies

Craig Zander

3719 King Road, Toledo, OH

Transforming Technologies is a provider of quality static control products that meet or exceed industry standards at an excellent value. We provide outstanding customer service and support. Our product categories include: Grounding, Apparel, Ionization, Matting, Test and Measurement and Cleanroom. For our full line, see us at www.transforming-technologies.com.

Universal

Kristi Schilloff

33 Broome Corporate Pkwy., Conklin, NY

We offer a wide range of solutions for Traditional to Complex Printed Circuit Board Assembly for applications requiring high-speed, high-accuracy surface mount placement and through-hole component insertion. Precision Automation for applications requiring versatile, high-accuracy, high-speed handling, inspection, and assembly. Advanced Packaging for applications requiring efficient and versatile multi-die high-accuracy assembly. And, our world-renowned Advanced Process Lab (APL) offers solutions for all aspects of a product lifecyclefrom prototyping, process development, and analytical services to advanced technology assembly.

U.S.

Michael Skinner

michael.skinner@us-tech.com

610-783-6100

10 Gay Street, Phoenixville, PA

U.S. Tech is the leading international, high-tech trade publication that covers the electronics manufacturing industry. Focused on innovations in PCB assembly, test and inspection, and manufacturing services, each edition is delivered to more than 100,000 subscribers in print, two digital versions, and distributed across all major social media platforms. Current and past issues are available online at www.us-tech.com.

Ed Moll

Viscom Booth 1214

1775 Breckinridge Pkwy., Suite 500, Duluth, GA

ed.moll@viscomusa.com 678-966-9835

Full range of industry award winning optical (AOI) and X-ray (AXI) inspection equipment for PCB assembly. In-line and stand-alone inspection of paste, placement, post-reflow, post-wave, selective solder and conformal coating. 100% solder joint inspection to IPC standards, high speed and high performance 3D solutions for every application. Microelectronics inspection equipment for bond, thick film and conductive glue. Heavy duty and large PCB inspection capability. Check out our award winning systems at www.viscom.com.

Inga Braunmiller

I.Braunmiller@visiconsult.de 49-451-290-286-1313

Brandenbrooker Weg 2-4, Stockelsdorf, Lennart

For VCcount, first-class solution is particularly important, launched on 2021 the latest generation of the SMD reel X-ray counting system XRHCount from VCcount. The highlights are the new touchscreen-optimized user interface and the cycle time of under 8.5 seconds per SMD reel including barcode recognition. New user interface that makes easy operational handling. Native software for integration with any external platform ERP/ MES, storage tower or any other feasible integration where usage of data makes higher operational performance.

Vitrox Booth 818

Richard Osborne

3222 Arden Road, Hayward, CA richard.osborne@vitrox.com 510-770-6344

API (SPI), AOI, AXI and Conformal Coat/Final Inspection provider to the worlds largest and most demanding EMS companies. Proven inspection technology that yields the easiest to program solutions with the best and most detailed data outputs available. Utilizing actual AI which is available now, time to inspect is decreased and yields increased. Data from the printer, pick and place and inspection is all corelated to provide real-time views of production yields. All with World Class Service and Support.

Visiconsult

EXHIBITOR A-Z

Katie Marzocchi

19 Alpha Road, Chelmsford, MA kmarzocchi@vjt.com 978-486-4777

VJ Electronix, Inc. is a global leader in advanced rework technologies, and provider of x-ray solutions for inspection and component counting. VJE combines years of industry leadership, technical expertise, and product development knowledge to manufacture state-of-theart x-ray and SMT rework equipment that boosts the productivity of high-value, high-precision applications in electronics manufacturing and industrial markets worldwide.

What’s New In Electronics (WNIE) Booth 1045

Claire Saunders claire@neweventsltd.com

164 Bridge Road, Sarisbury Green, Southampton, UK 44-1428-609-382

WNIE and GIF are both global platforms that support and promote the electronics manufacturing and semiconductor audience. WNIE delivers daily updates via the industry hub www.wnie.online - this is supported by a weekly newsletter being sent to nearly 50,000 global contacts and shared with over 18,000 social media contacts. This platform also delivers WNIE Radio and WNIE TV, interviewing key contacts on the latest updates, products and key issues facing our sector. GIF is a digital publication that goes out 6 times a year, focusing more on the people and the companies behind the products and services. Both of these platforms are in place to connect, update, and support our industry.

WPI Vision Booth 1222

Steve Dunn

175 Sarasota Blvd., Sarasota, FL sdunn@wpiinc.com 941-320-6795

WPI Vision, a division of World Precision Instruments, introduces ERMA™, a 3-D INSPECTION SCOPE FOR YOU. ERMA boasts of many industry firsts: 3-D viewer, variable working distances, computer controlled selffocusing zoom, area of interest, large field of view and depth of field. With ERMA you will increase your throughput and enjoy greater accuracy. This enhanced reality microscope is Ideal for rework, through-hole assembly and inspections. WPI has been designing innovative equipment for over 50 years.

Jessica Molloy

11285 Assett Loop, Manassas, VA jessica.molloy@zestronusa.com 703-393-9880

ZESTRON is the global leading provider of high precision cleaning products, services and training solutions for the electronics and semiconductor manufacturing industries. Whether implementing a new cleaning process, optimizing an existing one or preparing for future design changes, our industry leading products, eight worldwide Technical Centers and global expert engineering teams ensure that our customers can overcome any precision cleaning challenge.

Zymet Inc Booth 930

Karl Loh

7A Great Meadow Lane, East Hanover, NJ kloh@zymet.com 973-428-5245

Zymet manufactures Adhesives & Encapsulants and has been serving the electronics industry for over 30 years. Products include reworkable underfills and edgebond adhesives for high reliability and harsh environment applications. Other products include ultralow stress adhesives. electrically conductive adhesives, thermally conductive adhesives, and nonconductive pastes.

ZESTRON

VJ

ROOM

PRODUCT FINDER

Adhesives and Sealants

ACL Staticide

Chemicals and Treatment

ACL Staticide ANDA Technologies HZO

ITW EAE KYZEN Corporation MacDermid Alpha Electronics Solutions Surfx Technologies ZESTRON Corporation

Analytical and Laboratory

AI Technology Alltemated Inc. MacDermid Alpha Electronics Solutions Mid America Taping & Reeling, Inc. Seika Machinery, Inc. Zymet Inc KYZEN Corporation Magnalytix Metallic Resources Nordson Test and Inspection Retronix Scienscope International Universal Instruments ZESTRON Corporation

Europlacer Americas Fuji America Corporation Identco Inovaxe Corporation KYZEN Corporation Omron Pillarhouse Scienscope International Seika Machinery Universal Instruments ZESTRON Corporation

Blue

Stencils

Conductive Containers

Europlacer Americas Fuji America Corporation Seika Machinery, Inc. Smartsol Technologies Universial Instruments

Cleaning and Solvents

Allfavor Technology ANDA Technologies Coductive Containters, Inc. CTI Systems ESSEMTEC USA Europlacer Americas ICAPE USA

Inovaxe Corporation Insituware ITW EAE Kurtz Ersa KYZEN Corporation MacDermid Alpha Electronics Solutions Panasonic Connect PARMI USA

SCHUNK Electronic Solutions Scienscope International Seika Machinery, Inc. SMarTsol Technologies StaticStop Texmac/Takaya Trans Tec America Universal Instruments Viscom ZESTRON Corporation

Cleaning and Solvents

ACL Staticide

ASM Assembly Systems Insituware ITW EAE KYZEN Corporation MacDermid Alpha Electronics Solutions Marc Technologies Seika Machinery, Inc. SMarTsol Technologies Surfx Technologies ZESTRON Corporation

Coating, Dispensing and Masking

ACL Staticide

ANDA Technologies

ASM Assembly Systems Conductive Containers, Inc. ESSEMTEC USA HZO Insituware ITW EAE KYZEN Corporation MacDermid Alpha Electronics Solutions Marc Technologies NSW Automation PARMI USA Pillarhouse Seika Machinery SMarTsol Technologies Specialty Coating Systems Surfx Techhnologies

ZESTRON Corporation

Component Insertion

ASM ASsembly Systems

ESSEMTEC USA

Europlacer Americas Inc. Fuji America Corporation Hanwha Techwin Automation Juki Automation

Kurtz Ersa, Inc. Mid America Taping & Reeling Panasonic Connect Smartsol Technologies Universal Instruments

CTI Systems Europlacer Americas Fuji America Corporation Inovaxe Corporation Mid America Taping & Reeling Scienscope International Smart Splice LLC SMarTsol Technologies Tintronics Industries VisiConsult VJ Electronix, Inc.

Europlacer Americas ICAPE USA Impossible Objects Inovaxe Corporation Magnalytix Omron Scienscope International SMarTsol Technologies IPC PCEA

Consulting and Market Research

Die and Wire Bonding

ANDA Technologies ASM Assembly Systems Finetech Kulicke & Soffa

ZESTRON Corporation

Marc Technologies Pillarhouse Seika Machinery, Inc. Smart Splice LLC SMarTsol Technologies SMTXTRA

Component Prep and Counting

Components and Hardware

CTI Systems

ICAPE USA SCHUNK Electronic Solutions Seika Machinery, Inc. SMarTsol Technologies

Electronics Manufacturing Services

A2Z Electronics LLC

Drilling, Routing and Dicing ESD and EOS

ACL Staticide Bimos Seating Conductive Containers, Inc. Marc Technologies Mid America Taping & Reeling StaticStop Seika Machinery, Inc. Smart Splice LLC Transforming Techologies, LLC

Feeders

ASM Assembly Systems

CTI Systems

ESSEMTEC USA Europlacer Americas Fuji America Corporation Hanwha Techwin Automation Americas Juki Automation Kulicke & Soffa Smart Splice LLC SPEA America LLC Universal Instruments

ASM Assembly Systems

Europlacer Americas Finetech Fuji America Corporation Kulicke & Soffa Kurtz Ersa, Inc. Universal Instruments

JBC Tools Marc Technologies Mid America Taping & Reeling Smart Splice LLC SMarTsol Technologies Transforming Technologies, LLC

Hand Tools and Shop Supplies Inspection and Measurement

Akrometrix ANDA Technologies ASM Assembly Systems CTI Systems CyberOptics Europlacer Americas Fuji America Corporation Glenbrook Technologies Insituware Juki Automation KIC

Koh Young America Kurtz Ersa, Inc. Magnalytix Marc Technologies Mirtec Corp. Nikon Metrology, Inc. Nordson Test & Inspection Omron PARMI USA Scienscope International Seika Machinery SMarTsol Technologies SPEA America LLC Test Research Texmac/Takaya Trans Tec America Viscom Visiconsult Vitrox World Precision Instruments

PRODUCT FINDER

Labeling, Ink and Marking

Identco SMarTsol Technologies

Laser Systems

PARMI USA Retronix SMarTsol Technologies

Lease, Refurbishment & Resale

Kurtz Ersa, Inc.

Materials Handling Equipment/Automation Systems

Conductive Containers

Europlacer Americas Inovaxe Corporation Insituware Juki Automation Kulicke & Soffa SCHUNK Electronic Solutions Scienscope International Seika Machinery Smart Splice LLC SMarTsol Technologies SPEA America LLC Specialty Coating Systems Texmac/Takaya Universal Instruments Visiconsult

Odd Form Placement

ASM Assembly Systems

Europlacer Americas Finetech

Hanwha Techwin Automation Americas. Inc. Juki Automation Kulicke & Soffa

Mid America Taping & Reeling SMarTsol Technologies Trans Tec America Universal Instruments

Ovens, Curing and Drying

ITW EAE

Juki Automation KIC

Kurtz Ersa, Inc. Pillarhouse Seika Machinery Smart Splice LLC SMarTsol Technologies Specialty Coating Systems

Conductive Containers Finetech MacDermid Alpha Electronics Solutions

Packaging and Encapsulating PCB Fabrication

Mid America Taping & Reeling NSW Automation Sdn. Bhd. Tintronics Zymet Inc. Allfavor Technology ICAPE USA NSW Automation Sdn. Bhd. PCB Connect Inc. SCHUNK Electronic Solutions

Pick and Place

ASM

Europlacer Americas

Hanwha Techwin Automation Americas. Inc. Juki Automation Kulicke & Soffa SMarTsol Technologies Universal Instruments

PRODUCT FINDER

Publications and Marketing

Global SMT & Packaging

CIRCUITS ASSEMBLY

IConnect007

IPC PCEA SMT Today

U.S. Tech WNIE

Repair & Rework

Finetech

JBC Tools

Koh Young America Kurtz Ersa, Inc.

Mid America Taping & Reeling

Nihon Superior PDR Rework and Test Systems Pillarhouse Retronix Seika Machinery

SMarTsol Technologies SPEA America LLC

Tintronics

VJ Electronix, Inc.

World Precision Instruments

ITW EAE

MacDermid Alpha Electronics Solutions

Mid America Taping & Reeling

Nihon Superior NSW Automation Sdn. Bhd. PARMI USA Akrometrix

Software and Programming

ASM Assembly Systems

Europlacer Americas

Fuji America Corporation Hanwha Techwin Automation Americas. Inc. Insituware Intraratio Corporation KIC

Koh Young America Kulicke & Soffa Kurtz Ersa, Inc.

Mid America Taping & Reeling Panasonic Connect Pillarhouse Scienscope International SPEA America LLC Universal Instruments Visiconsult

Semiconductor Materials

Solder and Fluxes

ITW EAE

MacDermid Alpha Electronics Solutions Metallic Resources

Nihon Superior Pillarhouse

Soldering, Automated

JBC Tools

Fuji America Corporation

ITW EAE

Juki Automation Kurtz Ersa, Inc. PARMI USA Pillarhouse Seika Machinery SMarTsol Technologies Tintronics

Soldering, Manual

Fuji America Corporation JBC Tools

Kurtz Ersa, Inc. Pillarhouse SMarTsol Technologies Tintronics World Precision Instruments

Stencil and Screen Printing

ASM Assembly Systems

Europlacer Americas

Fuji America Corporation Hanwha Techwin Automation Americas. Inc. Inovaxe Corporation

ITW EAE

Juki Automation Kurtz Ersa, Inc. Microscreen Smart Splice LLC SMarTsol Technologies Trans Tec America

Tape and Reel Test & Measurement Equipment

Inovaxe Corporation Kulicke & Soffa Mid America Taping & Reeling Scienscope International Smart Splice LLC Tintronics Visiconsult Akrometrix Hanwha Techwin Automation Americas. Inc. Insituware KIC Koh Young America Kurtz Ersa, Inc. Magnalytix Marc Technologies Mirtec Corp. Nikon Metrology, Inc. Nordson Test and Inspection Omron

PARMI USA

PDR Rework and Test Systems Scienscope International Seika Machinery SPEA America LLC Specialty Coating Systems Teradyne, Inc. Test Research Texmac/Takaya Viscom Visiconsult

Test, Automated

CyberOptics

Fuji America Corporation Koh Young America Magnalytix Mirtec Corp. Nordson Test and Inspection Omron

PARMI USA Scienscope International Seika Machinery SMarTsol Technologies SPEA America LLC Teradyne, Inc. Test Research Texmac/Takaya Visiconsult

ANDA Technologies

Koh Young America Mid America Taping & Reeling Nordson Test and Inspection Omron

PARMI USA Retronix Scienscope International SMarTsol Technologies SPEA America LLC Test Research Tintronics BlueRing Stencils Conductive Containers, Inc Europlacer Americas Garland Service Company Impossible Objects Mid America Taping & Reeling SCHUNK Electronic Solutions SMT Tooling

CIRCUITS ASSEMBLY

ICAPE Group IPC KYZEN Corporation PCEA Smart Splice LLC ZESTRON Corporation Akrometrix CTI Systems CyberOptics ESSEMTEC USA Fuji America Corporation Juki Automation Kurtz Ersa, Inc. Mirtec Corp. Nikon Metrology, Inc. Omron

Systems

SCHUNK Electronic Solutions Scienscope International SMarTsol Technologies Test Research Viscom Visiconsult Vitrox

Fuji America Corporation Glenbrook Technologies Nikon Metrology, Inc. Nordson Test and Inspection Omron Scienscope International SMarTsol Technologies Test Research Tintronics Viscom Visiconsult Vitrox VJ Electronix, Inc.

Test,

Training, Education, and Compliance

Datethe