HIGH PRESSURE OVEN It has application of touch panel and film, semiconductor industry to remove voids.
Removal of Void (Film, Carbon/Epoxy)
Laminated Films (Anisotropic Conductive Film, Flip Chip)
Pathway of gas or water vapor
Ai
Void
Au
Ni
Heat & Pressure
ACF
Autoclave Vessel Experimental data Fitting curve
Flex
1350
Tensile strength / MPa
Void content / %
Experimental data Fitting curve
1400
2.5
2.0
1.5
Vv = 3.33exp(-2.57P)
1.0
1300 1250
Autoclave Process
1200
S=1443exp(-0.074r)) 1150
0.5
0 0.0
Cu
1450
3.5
3.0
Conducing Particles
Die
Composite Lay-up
1100 1050 0.1
0.2
0.3
0.4
0.5
0.6
0
0.5
Cure Pressure / MPa
1.0
1.5
2.0
2.5
3.0
3.5
Void content / %
Before
After
Ref. J. Mater. Sci. Technol., 27(1), (2011) 69-73
Ref. Mater. Sci. Eng. B., 98, (2003) 255-264
Adhesive layer sintering & Pressing
Temperature
Pressure
PET Film
PET Film
Ferrite
Ferrite
Adhesive layer
Adhesive layer
Separator
200 degree C, 80 degree C
Separator
20 kg/㎠ Before Top and Bottom Die
Clutch Door
Circulation fan & Motor Touch Screen
After Die Attach Film/Paste
Air Bubbles (기포)
Chamber
Dieelectric
Solderball Epoxy Undrfill
Silicon IC
Mold Cap
Air Bubbles
Solder Ball (63Sn/37Pb)
255, Techno 2-ro, Yuseong-gu, Daejeon, Korea (Daedeok techno valley)
Tel: +82-42-931-6100
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FR-5 Substrate
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