PUBLICATIONS LIST
July 2021-June 2022
Center for Advanced Microelectronics Manufacturing (CAMM)
Center for Autonomous Solar Power (CASP)
Center for Energy-Smart Electronic Systems (ES2)
Center for Heterogeneous Integration Research in Packaging (CHIRP)
Integrated Electronics Engineering Center (IEEC)
NorthEast Center for Chemical Energy Storage (NECCES)
Analytical and Diagnostics Laboratory (ADL)
Health Sciences Core Facility (HSCF)
S3IP Publication List • July 1, 2021 - June 30, 2022
Publications:
Mohamed Y. Abdelatty, Ashraf Umar, Gurvinder S. Khinda, Mohammed Alhendi, Mark D. Poliks, “Modeling the Effect of Surface Roughness for Screen-Printed Silver Ink on Flexible Substrates,” Proceedings of the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), pp. 1946-1951, San Diego, Calif., May 31-June 3, 2022. (CAMM)
Shrouq Alelaumi, Jingxi He, Yuanyuan Li, Nourma Khader, Sang Won Yoon, “Cleaning Profile Classification Using Convolutional Neural Network in Stencil Printing,” IEEE Transactions on Components, Packaging and Manufacturing Technology, volume 11, number 11, pp. 2003-2011, November 2021. (IEEC)
Shrouq Alelaumi, Nourma Khader, Jingxi He, Sarah Lam, Sang Won Yoon, “Residue Buildup Predictive Modeling for Stencil Cleaning Profile Decision-Making Using Recurrent Neural Network,” Robotics and Computer-Integrated Manufacturing, volume 68, April 2021. (IEEC)
Mohammed Alhendi, Firas Alshatnawi, El Mehdi Abbara, Rajesh Sivasubramony, Gurvinder
Khinda, Ashraf I. Umar, Peter Borgesen, Mark D. Poliks, David Shaddock, Cathleen Hoel, Nancy Stoffel, Tommyhing-K.H. Lam, “Printed Electronics for Extreme High Temperature Environments,” Additive Manufacturing, Volume 54, p. 102709, June 2022. (CAMM)
Omar Asif and A.C. Rastogi, “High Transmittance n-type Tin-oxysulfide Sn(OxS2-x) Heterojunction Layer Grown From Surfactant Mediated Chemical Bath Deposition for Thin Film Solar Cells,” Thin Solid Films, volume 733, article 138807, September 2021. (CASP)
Arad Azizi, Xiaobo Chen, Feilin Gou, Fatemeh Hejripour, Jacob A. Goodman, In-Tae Bae, Srikanth Rangarajan, Charles L. Arvin, Bahgat G. Sammakia, Changhong Ke, Guangwen Zhou, Scott N. Schiffres, “Selective Laser Melting of Metal Structures onto Graphite Substrates Via a Low Melting Point Interlayer Alloy,” Applied Materials Today, volume 26, March 2022
(ES2, IEEC, NECCES)
Morteza H. Bagheri, Rebecca T. Loibl, Scott N. Schiffres, “Control of Water Adsorption via Electrically Doped Graphene,” Advanced Materials Interfaces, volume 8, issue 8, article 2100445, Sept. 23, 2021. (ADL)
Lauren Boston, Peter Huang, Paul R. Chiarot, “Effect of Nozzle Orientation on Electrospray Cooling,” Applied Thermal Engineering, volume 210, June 25, 2022. (IEEC)
Matthew S. Brown, Louis Somma, Melissa Mendoza, Yeonsik Noh, Gretchen J. Mahler, Ahyeon Koh, “Upcycling Compact Discs for Flexible and Stretchable Bioelectronic Applications,” Nature Communications, volume 13, article number 3727, June 28, 2022. (ADL)
Busra Buyuk, Sha Jin, Kaiming Ye, “Epithelialto-Mesenchymal Transition Signaling Pathways Responsible for Breast Cancer Metastasis,” Cellular and Molecular Bioengineering, volume 15, pp. 1-13, Sept. 2, 2021. (HSCF)
Chongyang Cai, Ke Pan, Karthik Deo, Yangyang Lai, Junbo Yang, Jing Wang, Seungbae Park, “Characterization of Constitutive Equation of Sn-Bi by Studying Creep Behavior of Flip Chip Solder Joints,” proceedings of 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), pp. 1-6, San Diego, Calif., May 31, 2022-June 3, 2022. (IEEC)
Ezer Castillo and Nikolay Dimitrov, “Electrodeposition of Cu-Mn Films as Precursor Alloys for the Synthesis of Nanoporous Cu,” in Electrochem, volume 2, issue 3, pp. 520-533, Sept. 13, 2021. (CHIRP, IEEC)
Yuqiao Cen, Jingxi He, and Daehan Won, “Defect Patterns Study of Pick-And-Place Machine Using Automated Optical Inspection Data,” Soldering & Surface Mount Technology, Aug. 4, 2021. (IEEC)
Benson Chan, Mark Hoffmeyer, Eugene M. Chow, Ivy Qin, Daehan Won, and Seungbae Park, “Emerging Technology; Smart Manufacturing of Computer Systems and Assemblies,” IEEE Electronic Packaging Society, pages 1–8, March, 2022. (IEEC)
Poorya Chavoshnejad, Ali H. Foroughi, Niranjana Dhandapani, Guy K. German, Mir Jalil Razavi, “Effect of Collagen Degradation on the Mechanical Behavior and Wrinkling of Skin,” Physical Review E. volume 104, p. 034406, Sept. 10, 2021. (ADL)
Xiaobo Chen, Zhenyu Liu, Dongxiang Wu, Na Cai, Xianhu Sun, Dimitri N. Zakharov, Sooyeon Hwang, Dong Su, Guofeng Wang, Guangwen Zhou, “Passive Oxide Film Growth Observed on the Atomic Scale,” Advanced Materials Interfaces, volume 9, issue 11, April 14, 2022. (NECCES, IEEC)
Xiaobo Chen, Siming Zhang, Can Li, Zhijuan Liu, Xianhu Suna, Shaobo Cheng, Dmitri N. Zakharov, Sooyeon Hwang, Yimei Zhu, Jiye Fang, Guofeng Wang, and Guangwen Zhou, “Composition-dependent Ordering Transformation in Pt-Fe Nanoalloys,” Proceedings of the National Academy of Sciences, volume 119, issue 14, March 28, 2022. (NECCES, IEEC)
Yan Chen, George Z. Tan, Yingge Zhou, “Effects of Viscosities and Solution Composition on Core-Sheath Electrospun Polycaprolactone (PCL) Nanoporous Microtubes,” Polymers, volume 13, issue 21, Oct. 23, 2021. (ADL)
Matthias Daeumer, Ernesto D. Sandoval, Arad Azizi, Morteza H. Bagheri, In-Tae Bae, Sitaram Panta, Ekatrina A. Koulakova, Eric Cotts, Charles L. Arvin, Aleksey N. Kolmogorov, Scott Schiffres, “Orientation-Dependent Transport Properties of Cu3Sn,” Acta Materialia, Volume 227, p. 117671, April 2022. (IEEC)
Ronit Das, Sanoop Thekkut, Rajesh Sharma Sivasubramony, Thaer Alghoul, Atif Mahmood, Shantanu Joshi, Carlos Arroyo, Gaurav Sharma, and Peter Borgesen, “Early Transient Creep of Single Crystal SnAgCu Solder Joints,” Journal of Materials Science: Materials in Electronics, volume 33, pp. 13657-13667, May 10, 2022, (CHIRP)
Sunil Kumar Dube, Ramu Nare, Kalyan Yenduri, Pritam Das, “A Novel Integrated Bidirectional AC to DC Resonant Converter,” Proceedings of the 2022 IEEE Applied Power Electronics Conference and Exposition (APEC), Houston, Texas, March 20-24, 2022. (IEEC)
Sunil Kumar Dube, Ramu Nair, Pritam Das, “Analysis and Design of an Integrated Bidirectional Three-Phase AC-DC Resonant Converter,” IEEE Transactions on Industrial Electronics,” p. 1-10, June 22, 2022. (IEEC)
Alejandro Fajardo-Peralta, Minh An T Nguyen, J Valenzuela-Benavides, Alexander Brodie, Rafael Nunes Gontijo, Ana Laura Elías, Néstor Perea-Lopez, Thomas E. Mallouk, Mauricio Terrones, “Evolution of Spectroscopy Features in Layered MoSxSe (2-x) Solid Solutions,” Materials Research Express, volume 9, issue 4, April 6, 2022. (ADL)
Sebastian Freeman, Karen Kibler, Zachary Lipsky, Sha Jin, Guy K. German, Kaiming Ye, “Systematic Evaluating and Modeling of SARS-CoV-2 UVC Disinfection,” Scientific Reports, volume 12, article number 5689, April 7, 2022. (ADL)
Shantanu G. Gaurkhede, Ositomiwa O. Osipitan, Gary Dromgoole, Sara A. Spencer, Anthony J. di Pasqua, Jia Deng, “3D Printing and Dissolution Testing of Novel Capsule Shells for Use in Delivering Acetaminophen,” Journal of Pharmaceutical Sciences, volume 110, issue 12, pp. 3829-3837, December 2021. (ADL)
Yaser Hadad, Vahideh Radmard, Srikanth Rangarajan, Mahdi Farahikia, Gamal RefaiAhmed, Paul R. Chiarot, Bahgat Sammakia, “Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks,” Journal of Electronic Packaging, volume 143, issue 2, p. 021007, June 2021. (ES2)
Jingxi He, Yuqiao Cen, Yuanyuan Li, Shrouq Alelaumi, and Daehan Won (2021), “A Novel Placement Method for Mini-Scale Passive Components in Surface Mount Technology,” The International Journal of Advanced Manufacturing Technology, volume 115, p. 1475-1485, July 2021. (IEEC)
Jingxi He, Yuqiao Cen, Yuanyuan Li, Seungbae Park, and Daehan Won (2021), “The Dissimilar Self-Alignment Characteristics of Smaller Passive Components in the Length and Width Directions,” Journal of Surface Mount Technology, volume 34, issue 2, pp. 7-15, July 28, 2021. (IEEC)
Cong Hiep Hoang, Srikanth Rangarajan, Yaman Manaserh, Mohammad Tradat, Ghazal Mohsenian, Leila Choobeneh, Olfonso Ortega, Scott Schiffres, Bahgat Sammakia, “A Review of Recent Developments in Pumped Two-Phase Cooling Technologies for Electronic Devices,” IEEE Transactions on Components, Packaging and Manufacturing Technology, volume 11, number 10, pp. 1565-1582, October 2021. (ES2)
Cong Hiep Hoang, Najme Fallahtafti, Srikanth Rangarajan, Ahman Gharaibeh, Yaser Hadad, Charles Arvin, Kamal Sikka, Scott N. Schiffres, Bahgat Sammakia, “Impact of Fin Geometry and Surface Roughness on Performance of an Impingement Two-Phase Cooling Heat Sink,” Applied Thermal Engineering, volume 198, Nov. 5, 2021. (ES2)
Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia, “Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model,” Journal of Electronic Packaging, volume 144, issue 2, p. 021104, June 2022. (ES2)
Cong Hiep Hoang, Arad Azizi, Najmeh Fallahtafti, Srikanth Rangarajan, Vahideh Radmard, Charles Arvin, Kamal Sikka, Scott Schiffres, Bahgat Sammakia, “Design and Thermal Analysis of a 3-D Printed Impingement Pin Fin Cold Plate for Heterogeneous Integration Application,” IEEE Transactions on Components, Packaging and Manufacturing Technology, volume 12, number 7, pp. 1091-1099, June 23, 2022. (ES2)
Cong Hiep Hoang, Srikanth Rangarajan, Yaman Manaserh, Mohammad Tradat, Ghazal Mohsenian, Leila Choobeneh, Olfonso Ortega, Scott Schiffres, Bahgat Sammakia, “A Review of Recent Developments in Pumped Two-Phase Cooling Technologies for Electronic Devices, IEEE Transactions on Components, Packaging and Manufacturing Technology, volume 11, number 10, pp. 1565-1582, October 2021. (ES2)
Nabid Aunjum Hossain, Geofrey George Yamomo, Ryan Willing, Shahrzad Towfighian, “Characterization of a Packaged Triboelectric Harvester Under Simulated Gait Loading for Total Knee Replacement,” IEEE/ASME Transactions on Mechatronics, volume 26, number 6, pp. 2967-2976, December 2021. (ADL)
Nabid Aunjum Hossain, Geofrey George Yamomo, Ryan Willing, Shahrzad Towfighian, “Effect of Dielectric Material and Package Stiffness on the Power Generation in a Packaged Triboelectric Energy Harvesting System for Total Knee Replacement,” Journal of Biomechanical Engineering, volume 143, issue 10, p. 101009, October 2021. (ADL)
Ming Hu, Huanjing Bi, Deana Moffat, Margaret Blystone, Paul DeCostanza, Tchilabalo Alayi, Kaiming Ye, Yetrib Hathout, Sha Jin, “Proteomic and Bioinformatic Analysis of Decellularized Pancreatic Extracellular Matrices,” Molecules, volume 26, issue 21, p. 6740, Nov. 8, 2021. (HSCF)
Chien-Yi Huang, Li-Cheng Shen, Christopher Greene, Chun-Chieh Yang, “Parameter Optimization of Pretin Printing Process of Wireless Communication Module,” Transactions on Components, Packaging and Manufacturing Technology, volume 11, number 7, pp. 1137-1147, July 2021. (CAMM)
Dayue Jiang, Fuda Ning, “Additive Manufacturing of 316L Stainless Steel by a Printing-Debinding-Sintering Method: Effects of Microstructure on Fatigue Property,” Manufacturing Science and Engineering, volume 143, issue 9, p. 091007, September 2021. (ADL)
Dayue Jiang, Hamzeh A. Al Shraida, Fuda Ning, “Non-Planar Polymer-Based Flexible Electronics Fabricated by a Four-Axis Additive Manufacturing Process,” Materials Letters, volume 294, July 1, 2021. (ADL, IEEC)
Dayue Jiang and Fuda Ning, “Anisotropic Deformation of 316L Stainless Steel Overhang Structures Built by Material Extrusion Based Additive Manufacturing,” Additive Manufacturing, volume 50, February 2022. (ADL)
Jiexian Ma, Pu Zhang, “Supercooling Suppression of Phase Change Liquid Metal–Polydimethylsiloxane Soft Composites,” Materials Advances, volume 2, pp. 7437-7444, Sept. 15, 2021. (ADL)
Nourma Khader and Sang Won Yoon, “Adaptive Optimal Control of Stencil Printing Process Using Reinforcement Learning,” Robotics and Computer-Integrated Manufacturing, volume 71, October 2021. (IEEC)
Bahman Khaki and Pritam Das, “Multi-Objective Optimal Charging Current and Flow Management of Vanadium Redox Flow Batteries for Fast Charging and Energy-Efficient Operation,” Journal of Power Sources, volume 506, p. 230199, September 2021. (IEEC)
Bahman Khaki and Pritam Das, “An Equivalent Circuit Model for Vanadium Redox Batteries Via Hybrid Extended Kalman Filter and Particle Filter Methods,” Journal of Energy Storage, volume 39, p. 102587, July 2021. (IEEC)
Gurvender Singh Khinda, Maan Z. Kokash, Mohammed Alhendi, Behnam Garakani, Nancy C. Stoffel, Peter Borgesen, Mark D. Poliks, “Fatigue Behaviour of Inkjet-Printed Silver Interconnects on Silica-Coated Mesoporous Flexible PET Substrate,” Flexible and Printed Electronics, vol 7, number 1, April 4, 2022. (CHIRP)
Bryce J. Kingsley, Emma E. Pawliczak, Thomas R. Hurley, Paul R. Chiarot, “Electrospray
Printing of Polyimide Films Using Passive Material Focusing,” ACS Applied Polymer Materials, volume 3, issue 12, pp. 6274-6284, Nov. 16, 2021. (ADL)
Bryce J. Kingsley, Emma E. Pawliczak, Thomas R. Hurley, Paul R. Chiarot, “Electrospray
Printing of Polyimide Films for Electronics
Packaging Applications,” Proceedings of the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), pp. 1906-1913, San Diego, Calif., May 31-June 3, 2022. (ADL)
Yangyang Lai, Ke Pan, Chongyang Cai, Pengchenc Yin, Junbo Yang, Seungbae Park, “Smarter Temperature Setup for Reflow Oven to Minimize Temperature Variation Among Components,” in IEEE Transactions on Components, Packaging and Manufacturing Technology, volume 12, number 3, pp. 562-569, March 2022. (IEEC)
Yangyang Lai, Ke Pan, Jonghwan Ha, Chongyang Cai, Junbo Yang, Pengcheng, Yin, Jiefeng Xu, Seungbae Park, “The Optimal Solution of Reflow Oven Recipe Based on Physics-guided Machine Learning Model,” proceedings of 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), pp. 1-6, San Diego, Calif., May 31-June 3, 2022. (IEEC)
Adriane R. Lam, Kenneth G. MacLeod, Solveig H. Schilling, R. Mark Leckie, Andrew J. Fraass, Molly O. Patterson, Nicholas L. Venti, “Pliocene to Earliest Pleistocene (5–2.5 Ma) Reconstruction of the Kuroshio Current Extension Reveals a Dynamic Current,” Paleoceanography and Paleoclimatology, volume 36, issue 9, September 2021. (ADL)
M. Landers, A. Elhadad, and S. Choi, “Papertronics: Fully Paper-Integrated Resistor, Capacitor, and Transistor Circuits,” proceedings of the Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop, pp. 419-422, Hilton Head Island, S.C., June 5-9, 2022. (IEEC)
Can Li, Shaohui Yan, and Jiye Fang, “Construction of Lattice Strain in Bimetallic Nanostructures and its Effectiveness in Electrochemical Applications, Small, volume 17, issue 46, Nov. 18, 2021. (ADL)
Chaoran Li, Yaguang Zhu, Dongxiang Wu, Jorge Anibal Boscoboinik, Guangwen Zhou, “Effect of Surface Segregation on the Oxidation Resistance of Cu3Pt(100),” Physical Review Materials, volume 6, Feb. 3, 2022. (NECCES, IEEC)
Jonathan Li, Siming Zhang, Chaoran Li, Yaguang Zhu, Jorge Anibal Boscoboinik, Xiao Tong, Jerzy T. Sadowski, Guofeng Wang, Guangwen Zhou, “Coupling Between Bulk Thermal Defects and Surface Segregation Dynamics,” Physical Review B, volume 104, Aug. 9, 2021. (NECCES, IEEC)
N. Li, C.M. Dmuchowski, Y.-C. Jiang, C.-L. Yi, F.-L. Gou, J. Deng, C.-H. Ke, H.B. Chew, “Sliding Energy Landscape Governs Interfacial Failure of Nanotube-Reinforced Ceramic Nanocomposites,” Scripta Materialia, Vol. 210, pp. 114413, 2022. (ADL)
Yanshuai Li, Xiaomei Li, Jianmin Chen, Canying Cai, Wei Tu, Jun Zhao, Yongfu Tang, Liqiang Zhang, Guangwen Zhou, Jianyu Huang, “In Situ TEM Studies of the Oxidation of Li Dendrites at High Temperatures,” Advanced Functional Materials, volume 32, June 1, 2022. (NECCES, IEEC)
Yuanyuan Li, Jingxi He, Daehan Won, Sang Won Yoon, “Noncontact Reflow Oven Thermal Profile Prediction Based on Artificial Neural Network,” IEEE Transactions on Components, Packaging and Manufacturing Technology, volume 11, number 12, pp. 2229-2237, December 2021. (IEEC)
Yuanyuan Li, Daehan Won, Sang Won Yoon, “Reflow Oven Recipe Optimization Based on Simulations,” Proceedings of the International Conference on Production Research, Taiwan, July 18-21, 2021. (IEEC)
Zachary W. Lipsky, Marisa Patsy, Cláudia N. H. Marques, Guy K. German, “Mechanisms and Implications of Bacterial Invasion Across the Human Skin Barrier,” Microbiology Spectrum, volume 10, no. 3, May 9, 2022. (ADL)
Zachary W. Lipsky and Guy K. German, “The Precision of Macroscale Mechanical Measurements is Limited by the Inherent Structural Heterogeneity of Human Stratum Corneum,” Acta Biomaterialia, volume 130, pp. 308-316, August 2021. (ADL, HSCF)
Lin Liu and Seokheun Choi, “Enhanced Biophotoelectricity Generation in Cyanobacterial Biophotovoltaics with Intracellularly Biosynthesized Gold Nanoparticles,” Journal of Power Sources, volume 506, p. 23051, Sept. 15, 2021. (ADL)
Sandeep Mallampati, Harry Schoeller, Liang Yin, David Shaddock, Junghyun Cho, “Influence of Second Phase Particles on Thermal Conductivity of Bi Alloys,” IEEE Transactions on Components, Packaging and Manufacturing Technology, volume 12, number 3, pp. 502-511, March 2022. (IEEC)
Yaman M. Manaserh, Mohammad I. Tradat, Dana Bani-Hani, Aseel Alfallah, Bahgat G. Sammakia, Kourosh Nemati, Mark. J. Seymour, “Machine Learning Assisted Development of IT Equipment Compact Models for Data Centers Energy Planning,” Applied Energy, col. 305, p. 117846, Jan. 1, 2022. (ES2)
Yaman M. Manaserh, Mohammad I. Tradat, Cong Hiep-Hoang, Bahgat G. Sammakia, Alfonso Ortega, Kourosh Nemati, Mark J. Seymour, “Degradation of Fan Performance in Cooling Electronics: Experimental Investigation and Evaluating Numerical Techniques,” International Journal of Heat and Mass Transfer, volume 174, p. 121291, August 2021. (ES2)
Yaman M. Manaserh, Mohammad I. Tradat, Ahmad R. Gharaibeh, Bahgat G. Sammakia, Russ Tipton, “Shifting to Energy Efficient Hybrid Cooled Data Centers Using Novel Embedded Floor Tile Heat Exchangers,” Energy Conversion and Management, Volume 247, issue 1, p. 114762, November 2021. (ES2)
Yaman “Mohammad Ali” Manaserh, Ahman R. Gharaibeh, Mohammad I. Tradat, Srikanth Rangarajan, Bahgat G. Sammakia, Husam A. Alissa, “Multi-objective Optimization of 3D Printed Liquid Cooled Heat Sink with Guide Vanes for Targeting Hotspots in High Heat Flux Electronics,” International Journal of Heat and Mass Transfer, volume 184, p. 122287, March 2022. (ES2)
Melissa Mendoza, Mei-Hsiu Chen, Peter Huang, Gretchen J. Mahler, “Shear and Endothelial Induced Late-Stage Calcific Aortic Valve Disease-on-a-Chip Develops Calcium Phosphate Mineralizations,” Lab on a Chip, volume 22, pp. 1374-1385, Feb. 21, 2022. (ADL)
Deana Moffat, Kaiming Ye, Sha Jin, “Decellularization for the Retention of Tissue Niches,” Journal of Tissue Engineering, volume 13, May 21, 2022. (HSCF)
Ghazal Mohsenian, Sadegh Khalili, Mohammad Tradat, Yaman Manaserh, Srikanth Rangarajan, Anuroop Desu, Dushyant Thakur, Kourosh Nemati, Kanad Ghose, Bahgat Sammakia, “A Novel Integrated Fuzzy Control System Toward Automated Local Airflow Management in Data Centers,” Control Engineering Practice, volume 112, July 2021. (ES2)
Mohammad Mousavi, Mohammad Alzgool, Shahrzad Towfighian, “Enhancing Open-Loop Control of MEMS Using Linear Electrostatic Levitation Actuators,” proceedings of IEEE Sensors, virtual, Oct. 21-Nov. 4, 2021, pp. 1-4. (ADL)
Mohammad Mousavi, Mohammad Alzgool, Daniel Lopez, Shahrzad Towfighian, “Open-Loop Control of Electrostatic Levitation Actuators to Enhance the Travel-Range of Optical Switches,” Sensors and Actuators A: Physical, vol 338, p. 112353, May 2022. (ADL)
Mohammad Mousavi, Mohammad Alzgool, Shahrzad Towfighian, “A MEMS Pressure Sensor Using Electrostatic Levitation,” IEEE Sensors Journal, volume 21, number 17, pp. 1860118608, Sept. 1, 2021. (ADL)
M. Njuki, S. Thekkut, R. Das, N. Shahane, P. Thompson, K. Mirpuri, Peter Borgesen, N. Dimitrov, “Understanding and Preventing Cu–Sn Micro Joint Defects Through Design and Process Control,” Journal of Applied Electrochemistry, volume 52, pp. 259-271, February 2022. (CHIRP, IEEC)
M Njuki, S. Thekkut, R. Sivasubramony, C. M. Greene, N. Shahane, P. Thompson, K. Mirpuri, Peter Borgesen, Nik Dimitrov, “Enhanced Voiding in Cu-Sn Micro Joints,” Materials Research Bulletin, volume 150, p. 111759, June 2022. (CHIRP, IEEC)
Ke Pan, Jiefeng Xu, Yangyang Lai, Seungbae Park, Chukwudi Okoro, Dhananjay Joshi, Scott Pollard, “In-situ Temperature-Dependent Characterization of Copper Through Glass Via (TGV),” Microelectronics Reliability, volume 129, p. 114487, February 2022. (IEEC)
Ke Pan, Jiefeng Xu, Yangyang Lai, Seungbae Park, Chukwudi Okoro, Dhananjay Joshi, Scott Pollard, “Investigation of Copper and Glass Interaction in Through Glass Via (TGV) During Thermal Cycling,” proceedings of IEEE 71st Electronic Components and Technology Conference (ECTC), pp. 1660-1666, San Diego, Calif., June 1-July 4, 2021. (IEEC)
Ke Pan, Yangyang Lai, Jiefeng Xu, Pengcheng Yin, Jonghwan Ha, Chongyang Cai, Junbo Yang, Seungbae Park, “Parametric Study of the Geometry Design of Through-silicon Via in Silicon Interposer,” proceedings of 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), pp. 1-8, San Diego, Calif., May 31, 2022-June 3, 2022. (IEEC)
Vahideh Radmard, Yaser Hadad, Srikanth Rangarajan, Cong H. Hoang, Najmeh Fallahtafti, Charles L. Arvin, Kamal Sikka, Scott N. Schiffres, Bahgat G. Sammakia, “Multi-Objective optimization Chip-Attached Micro Pin Fin Liquid Cooling System,” Applied Thermal Engineering, volume 195, pp.1-14, August 2021. (ES2)
Vadhideh Radmard, Arad Azizi, Srikanth Rangarajan, Najmeh Fallahtafti, Cong H. Hoang, Ghazal Mohsenian, Kourosh Nemati, Scott N. Schiffres, Bahgat Sammakia, “Performance Analysis of Impinging Chip-Attached Micro Pin Fin Direct Liquid Cooling Package for Hotspot Targeted Applications,” Proceedings of the 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), pp. 220-228, San Diego, CA, July 1-4, 2021. (ES2)
Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia, “Supervised Machine-Learning Approach for the Optimal Arrangement of Active Hotspots in 3-D Integrated Circuits,” in IEEE Transactions on Components, Packaging and Manufacturing Technology, volume 11, number 10, pp. 1724-1733, October 2021. (ES2)
M. Rezaie, Z. Rafiee, and S. Choi “Biopowerin-Gut: An Ingestible Bacteria-Powered Battery Capsule,” Hilton Head Workshop 2022: A Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head Island, S.C., pp. 85-88, June 5-9, 2022. (This paper has been selected as the Best Paper Award Winner) (ADL)
Raghabendra Rout, Swagatika Patra, Samaher Mashaareh, Daryl Santos, Christopher Greene, Krishnaswami Srihari, Ganesh Pandiarajan, “Development of a Mixed Model Conveyor System Using a Simulation Based Lean SixSigma Approach for Assembly of Servers,” Proceedings of the 10th Annual World Conference of the Society for Industrial and Systems Engineering, virtual, Sept. 23-24, 2021. (IEEC)
Jihyun Ryu and Seokheun Choi, “Bioelectricity Production from Sweat-Activated Germination of Bacterial Endospores,” Biosensors and Bioelectronics, volume 186, p. 113293, Aug. 15, 2021. (ADL)
Xin Shu, Yiqi Mao, Ming Lei, Daicong Da, Shujuan Hou, Pu Zhang, “Toughness Enhancement of Honeycomb Lattice Structures Through Heterogeneous Design,” Materials & Design, volume 217, p. 110604, May 2022. (ADL)
Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia, “Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model,” Journal of Electronic Packaging, volume 144, issue 2, p. 021104, June 2022. (ES2)
Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia, “Thermal Management of Electronics During Continuous and Intermittent Operation Mode Employing Phase Change Material-Based Heat Sinks— Numerical Study,” IEEE Transactions on Components, Packaging and Manufacturing Technology, volume 11, number 11, pp. 178301791, November 2021. (ES2)
Andrew Stennermann, Dan Balder, Madhu Stennermann, Christopher Tabor, Nancy Stoffel, Riadh Al-Haidari, Behnam Garakandi, Udara Somarathna El Medhi Abbara, Mohammed Alhendi, Mark Poliks, “Robustness and Reliability of Novel Anisotropic Conductive Epoxy for Stretchable Wearable Electronics,” Proceedings of the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), pp. 762-768, San Diego, Calif., May 31, 2022-June 3, 2022. (CAMM)
Jiaxu Song and Kaiyan Yu, “3D Pose Identification of Micro- and Nanowires in Fluid Suspensions,” proceedings of 2021 IEEE 17th International Conference on Automation Science and Engineering (CASE), pp. 2092-2097, Aug. 23-27, 2021. (IEEC)
Tuhin Subhra Sasmal, Kalyan Yenduri, Pritam Das, “Single-Stage Saturable InductiveLink Half-Bridge Point of Load Converter,” proceedings of the 2021 IEEE Energy Conversion Congress and Exposition,” Oct. 10-14, 2021, Vancouver, BC, Canada. (IEEC)
Preeth Sivakumar, Surbhi Mahajan Du, Matt Selter, John Daye, Junghyun Cho, “Improved Adhesion of Polyurethane-Based Nanocomposite Coatings to Tin Surface Through Silane Coupling Agents,” International Journal of Adhesion and Adhesives, volume 110, p. 102948, October 2021. (IEEC)
Preeth Sivakumar, Surbhi Mahajan Du, Matt Selter, Imani Ballard, John Daye, Junghyun Cho, “Long-Term Thermal Aging of Parylene Conformal Coating Under High Humidity and its Effects on Tin Whisker Mitigation,” Polymer Degradation and Stability, volume 191, September 2021. (IEEC)
Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen, “Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds,” Journal of Electronic Packaging, volume 144, issue 1, p. 011007, March 2022. (IEEC)
Biao Sun and Wenfeng Zhao, “Compressed Sensing of Extracellular Neurophysiology Signals: A Review,” Frontiers in Neuroscience, Aug. 26, 2021. (IEEC)
Xianhu Sun, Dongxiang Wu, Wenhui Zhu, Xiaobo Chen, Renu Sharma, Judith C. Yang, Guangwen Zhou, “Atomic Origin of the Autocatalytic Reduction of Monoclinic CuO in a Hydrogen Atmosphere,” in Journal of Physical Chemistry Letters, volume 12, issue 39, pp. 9547-9556, Sept. 27, 2021. (NECCES, IEEC)
Lynn R. Terry, Sage Sanders, Rebecca H. Potoff, Jacogb W. Kruel, Manan Jain, Huiyuan Guo, “Applications of Surface-Enhanced Raman Spectroscopy in Environmental Detection,” Analytical Science Advances, volume 3, issue 3-4, pp. 113-145, April 2022. (ADL)
Haifeng Wang, Hongya Lu, Shrouq M. Alelaumi, Sang Won Yoon, “A Wavelet-Based MultiDimensional Temporal Recurrent Neural Network for Stencil Printing Performance Prediction,” Robotics and Computer-Integrated Manufacturing, volume 71, October 2021.
(IEEC)
Haifeng Wang, Daehan Won, and Sang Won Yoon, “An Adaptive Neural Architecture Optimization Model for Retinal Disorder Diagnosis on 3D Medical Images,” Applied Soft Computing, volume 111, November 2021. (IEEC)
Jianyu Wang, Chaoran Li, Yaguang Zhu, Jorge Anibal Boscoboinik, Guangwen Zhou, “In-situ Monitoring of H2-induced Nonstoichiometry in Cu2O,” Journal of Physical Chemistry Letters, volume 13, pp. 5597-5604, June 14, 2022.
(NECCES,
IEEC)
Daehan Won, J. He, S. Alelaumi, Y. Li, Y. Cen, and S.W. Yoon, “Smart Factory in Electronics Manufacturing: Artificial Intelligence-Based Closed-Loop Self-Optimization Platform,” i4.0 Today, pages 14–17, 2021. (IEEC)
Michael Woodcox and Manuel Smeu, “Atomistic Modeling to Predict and Improve the Strength of Doped Sn-Cu Solder Interfaces,” Proceedings of the International Symposium on Microelectronics, volume 2021, issue 1, pp. 000321-000327, October 2021. (IEEC)
Dongxiang. Wu, Yaguang. Zhu, Weitao. Shan, Jianyu Wang, Qianqian Liu, Guangwen Zhou, “Revealing an Intermediate Cu-O/OH Superstructure on Cu(110),” Journal of Physical Chemistry Letters, volume 13, issue 10, pp. 2396-2403, March 8, 2022. (NECCES, IEEC)
Juan Wu and Kaiyan Yu, “Adaptive Tube Model Predictive Control of Micro- and Nanoparticles in Fluid Suspensions using Global External Fields,” proceedings of the 2021 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM), pp. 526-531, July 12-16, 2021. (IEEC)
Xinli Wang, Canying Cai, Guanwen Zhou, “Firstprinciples study on the NiAl/Al2O3 Interfacial Segregation of Hafnium During the Oxidation of Hf-modified NiAl,” Applied Surface Science, volume 578, March 15, 2022. (NECCES, IEEC)
Shan Yan, Dong K. Dinh, Guojung Shang, Shan Wang, Wei Zhao, Xin Liu, Richard Robinson, Jack P. Lombardi III, Ning He, Susan Lu, Mark Poliks, Benjamin S. Hsiao, Ivan Gitsov, ChuanJiang Zhong, “Nano-Filamented Textile Sensor Platform with High Structure Sensitivity,” ACS Applied Material Interfaces, volume 14, issue 13, pp. 15391-15400, March 25, 2022. (CAMM)
Junbo Yang, Chongyang Cai, Pengcheng Yin, Ke Pan, Yangyang Lai, Jing Wang, Seungbae Park, “Optimal Thermo-Mechanical Reliability Design of 2.5D Lidless Package,” proceedings of 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), pp. 1-6, San Diego, CA, May 31, 2022-June 3, 2022. (IEEC)
David A. Yefroyev and Sha Jin, “Induced Pluripotent Stem Cells for Treatment of Alzheimer’s and Parkinson’s Diseases,” Biomedicines, volume 10, issue 2, p. 208, Jan. 19, 2022. (HSCF)
Kalyan Yenduri, Sunil Kumar Dube, Ramu Nare, Pritam Das, “An Integrated Multilevel Bridge Tapped Resonant Bidirectional AC to DC Converter,” proceedings of IECON 2021 –47th Annual Conference of the IEEE Industrial Electronics Society, Oct. 13-16, 2021, Toronto, ON, Canada. (IEEC)
Pengcheng Yin, Seungbae Park, Ganesh Pandiarajan, “Shipping Container Design Improvement Analysis for Drop/Shock Loading,” proceedings of the 71st Electronic Components and Technology Conference, (ECTC), pp. 21452150, San Diego, Calif., June 1, 2021-July 4, 2021. (IEEC)
Joshua Young and Manuel Smeu, “Preventing Electrolyte Decomposition on a Ca Metal Electrode Interface Using an Artificial SolidElectrolyte Interphase,” Advanced Theory and Simulations, volume 4, Issue 8, August 2021. (IEEC)
Hailing Zhang, Xinli Wang, Dingding Zhu, Jun Zhao, Tingting Yang, Yichun Zhou, Jian Lu, Canying Cai, Jianyu Huang, Guangwen Zhou, “Interfacial Oxidation of Hafnium Modified NiAl Alloys,” Corrosion Science, volume 189, Aug. 15, 2021. (NECCES, IEEC)
Hanlei Zhang, Hao Liu, Louis F.J. Piper, M. Stanley Whittingham, Guangwen Zhou, “Oxygen Loss in Layered Oxide Cathodes for Li-Ion Batteries: Mechanisms, Effects, and Mitigation,” Chemical Review, volume 122, issue 6, pp. 56415681, March 23, 2022. (NECCES, IEEC)
Stephanie Y. Zhang and Gretchen J. Mahler, “Modeling Renal Filtration and Reabsorption Processes in a Human Glomerulus and Proximal Tubule Microphysiological System,” Micromachines, volume 12, number 8, p. 983, Aug. 19, 2021. (IEEC)
Ming Zhou, Jiangna Guo and Jiye Fang, “Nanoscale Design of Pd-based Electrocatalysts for ORR Enhancement in Alkaline Media,” Small Structures, volume 3, issue 2, February 2022. (IEEC)
Ming Zhou, Jiangna Guo, Bo Zhao, Can Li, Lihua Zhang and Jiye Fang, “Improvement of Oxygen Reduction Performance in Alkaline Media by Tuning Phase Structure of Pd-Bi Nanocrystals,” Journal of the American Chemical Society,” volume 143, issue 38, pp. 15891-15897, Sept. 14, 2021. (ADL)
Huimin Zhou, Yingchun Jiang, Christopher M. Dmuchowski, Changhong Ke, Jia Deng, “Electric-Field-Assisted Contact Mode Atomic Force Microscope-Based Nanolithography with Low Stiffness Conductive Probes,” Journal of Micro and Nano-Manufacturing, volume 10, Issue 1, p. 011001, March 2022. (ADL)
Yue Zhou, El Mehdi Abbara, Dayue Jiang, Arad Azizi, Mark D. Rishnan, Fuda Ning, “High-cycle Fatigue Properties of Curved-Surface AlSi10Mg Parts Fabricated by Powder Bed Fusion Additive Manufacturing,” Rapid Prototyping Journal, volume 28, issue 7, June 29, 2022. (ADL, CAMM)
Yaguang Zhu, Dongxiang Wu, Chaoran Li, Xiao Tong, J. Anibal Boscoboinik, Jerzy T. Sadowski, Guangwen Zhou, “Atomistic Mechanisms of the Initial Oxidation of Stepped Cu3Au(100),” Physical Review B, volume 105, Feb. 22, 2022. (NECCES, IEEC)
Presentations
Jingxi He, Yuqiao Cen, Daehan Won, “An Adaptive Method for Components’ Post-Reflows Misalignment Prediction in a Dynamic Surface Mount Assembly Line,” 26th International Conference on Production Research, Taichung, Taiwan (virtual), July 18-21, 2021. (IEEC)
El Mehdi Abbara, Gurvinder Singh Khinda, Mohammed Alhendi,, Riadh Al Haidari, Firas Alshatnawi, Behnam Garakani, Udara S. Somarathna, Mark Poliks, “Current Carrying Capacity of Inkjet-Printed Nano-Silver Interconnects on Mesoporous PET Substrate,” presented at 72nd Electronic Components and Technology Conference (ECTC), San Diego, Calif., May 30-June 3, 2022. (CAMM)
Mohamed Y. Abdelatty, Ashraf Umar, Gurvinder S. Khinda, Mark D. Poliks, “Investigating the Significance of Surface Roughness for Screenprinted Silver Ink on Kapton Substrate,” presented at the IISE Annual Conference and Expo, May 24, 2022. (CAMM)
Mohamed Y. Abdelatty, Ashraf Umar, Gurvinder S. Khinda, and Mark D. Poliks, “Modeling the Effect of Surface Roughness for Screen-printed Silver Ink on Flexible Substrates,” presented at 72nd Electronic Components and Technology Conference (ECTC), San Diego, Calif., May 30 – June 3, 2022. (CAMM)
Mohamed Y. Abdelatty, Ashraf Umar, Gurvinder S. Khinda, Mohammed Alhendi, Mark D. Poliks, “A Study of Trace Profile and Surface Roughness for Screen-printed Silver Ink on Kapton Substrate,” presented at iMAPS New England 48th Symposium & Expo, May 3, 2022. (CAMM)
Riadh Al-Haidari, Behnam Garakani, Mohammed Alhendi, Mark Poliks, “Reliability Study of a Magnetically Aligned Anisotropic Conductive Epoxy for Interconnecting Stretchable Conductors to Various Surfaces,” presented at the Nanotechnology Network Symposium, Cornell University, on May 19, 2022. (CAMM)
Riadh Al-Haidari, Behnam Garakani, Mohammed Alhendi, Udara Somarathna, Mark D Poliks, Christopher Tabor, Madhu Stemmermann, Nancy Stoffel, “Evaluation of an Anisotropic Conductive Epoxy for Interconnecting Highly Stretchable Conductors to Various Surfaces,” presented at 72nd Electronic Components and Technology Conference (ECTC), San Diego, Calif., May 30-June 3, 2022. (CAMM)
Firas Alshatnawi, Mohammed Alhendi, Riadh A. Al-Haidari, Rajesh S. Sivasubramony, El Mehdi Abbara, K Udara Somarathna, Mark D. Poliks, Peter Borgesen, David M. Shaddock, Nancy Stoffel, Cathleen Hoel, “High Temperature Die Interconnection Approaches,” presented at 72nd Electronic Components and Technology Conference (ECTC), San Diego, Calif., May 30-June 3, 2022. (CAMM)
E. Castillo, Y. Xie and N. Dimitrov, “Electrochemical Approach for the Synthesis of Alloy Materials Beyond Thermodynamic Limits: A Proof-of-Concept Study,” presented at the 72nd International Society of Electrochemistry (ISE) Meeting, Jeju Island, South Korea, August 2021. (CHIRP, IEEC)
E. Castillo, Y. Xie and N. Dimitrov, “Electrochemical Filling of Nanoporous Gold with Silver via Surface-Limited Redox Replacement,” presented at the 240th Electrochemical Society Meeting, Orlando, Fla., October 2021. (CHIRP, IEEC)
Ezer Castillo, Michael Njuki and Nikolay Dimitrov, “Electrochemical Preparation of Nanoporous Cu-Sn as New Materials for Interconnects,” presented at the 2030 Decadal Plan for Semiconductors, 2022 MRS Spring Meeting, Honolulu, May 2022. (CHIRP, IEEC)
X. Chen, J. Wang, X. Sun, D. Zakharov, S. Hwang, G. Zhou, “In-situ Atomic-scale Visualization of Atomic-Step Induced NiO Growth During the Oxidation of Ni,” presented at the Microscopy & Microanalysis, virtual, Aug. 1-5, 2021. (NECCES, IEEC)
Emuobosan Enakerakpo, Dylan J. Richmond, Ashraf Umar, Mohammed Alhendi, and Mark Poliks “Fabrication of Flexible Antenna Using a Semi-Additive Process,” presented by at the Nanotechnology Network Symposium, Cornell University, May 19, 2022. (CAMM)
N. Dimitrov and E. Castillo, “All Electrochemical Synthesis of Nanoporous Cu Films for the Purposes of Fine Pitch and Low Temperature Interconnection in 3D Packaging,” invited talk presented at the 240th Electrochemical Society Meeting, Orlando, Fla., October 2021. (CHIRP, IEEC)
Behnam Garakani, K. Udara Somarathna, Riadh Al Haidari, Firas Alshatnawi, Detlef Smilgies and Mark Poliks, “Fabrication, Characterization, and Electromechanical Reliability of Stretchable Circuitry for Health Monitoring Systems,” presented at 72nd Electronic Components and Technology Conference (ECTC), San Diego, Calif., May 30 – June 3, 2022. (CAMM)
A. García-Rodríguez, Cláudia N. H. Marques and Gretchen J. Mahler, “Effects of Metal Oxide NPs on the Small Intestine,” presented at the Binghamton University Biological Sciences Seminar Series, Dec. 17, 2021. (ADL)
Cong Hiep Hoang, Srikanth Rangarajan, Vahideh Radmard, Najmeh Fallahtafti, Mohammad Tradat, Charles Arvin, Scott Schiffres, Bahgat Sammakia, “Two-phase Impingement Cooling using a Trapezoidal Groove Microchannel Heat Sink and Dielectric Coolant HFE 7000,” presented at the 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), virtual, July 1-4, 2021. (ES2)
H. Huang, S. S. Karanth, Y. Guan, S. R. Freeman, D. S. Godovich, J. Guan, K. Ye, K., S. Jin, “In situ Oxygenated 3D Scaffolds for iPSC Differentiation into Islet Organoids,” presented at the Biomedical Engineering Society (BMES) annual conference, Oct. 6-9, 2021. (HSCF)
Thomas R. Hurley and Paul Chiarot, “Electrospray Printing of Polymeric Films onto Substrates with Non-Homogenous Electrical Properties,” presented at the APS March Meeting, Chicago, March 2022. (ADL)
Bryce J. Kingsley, Emma E. Pawliczak, Thomas R. Hurley, Paul R. Chiarot, “Passively Focused Electrospray Printing of Polymeric Films,” presented at the APS March Meeting, Chicago, March 2022. (ADL)
Bryce J. Kingsley, Emma E. Pawliczak, Thomas R. Hurley, Paul R. Chiarot, “Electrospray Printing of Polymeric Films,” presented at the American Chemical Society Spring Meeting, San Diego, Calif., April 2022. (ADL)
Z. Liang, D. Wu, X. Sun, X. Chen, D. Zakharov, G. Zhou, “Hydrogen-Adsorption Induced Surface Segregation and Chemical Ordering in Cu-Pt alloys,” presented at Microscopy & Microanalysis, virtual, Aug. 1-5, 2021. (NECCES, IEEC)
Gretchen J. Mahler, “Engineering Gut Models for Assessing the Impact of Food Additives,” presented at Cornell University, Department of Food Science, March 31, 2022. (ADL)
M. Mendoza, M. Chen, P. Huang, B. Murray, Gretchen J. Mahler, “Shear- and Chondroitin Sulfate-Induced Microcalcifications within an Aortic Valve-on-a-Chip Model,” presented at the Biomedical Engineering Society Annual Meeting, Oct. 7, 2021. (ADL)
M. Mendoza, M. Chen, B. Murray, P. Huang, Gretchen J. Mahler, “Early and Late Calcific Aortic Valve Disease-on-a-Chip,” presented at the Microphysiological Systems (MPS) World Summit, virtual conference, Dec. 9, 2021. (ADL)
M. Njuki, S. Thekkut, P. Borgesen and N. Dimitrov, “Factors Controlling the Defect Formation in Cu-Sn Micro Joints in 2.5D and 3D Interconnects,” presented at the 240th Electrochemical Society Meeting, Orlando, Fla., October 2021. (CHIRP, IEEC)
M. Njuki, S. Thekkut, P. Borgesen, and N. Dimitrov, “Sporadic Voiding Effects in Micro Joints: Understanding and Control,” presented at the 2030 Decadal Plan for Semiconductors, 2022 MRS Spring Meeting, Honolulu, May 2022. (CHIRP, IEEC)
Emma E. Pawliczak, Bryce J. Kingsley, Paul R. Chiarot, “Electrospray Printing of Conformal Polyimide Films onto Complex Geometries,” presented at the APS March Meeting, Chicago, March 2022. (ADL)
H. Qamar, Tracy Hookway, Gretchen J. Mahler, “Effects of Shear Stress On iPSCDerived Myocardial Aggregates Cultured in 3D Heterotypic ECM Microenvironment within a Microfluidic Device,” presented at the Binghamton University BME Exhibition, April 21, 2022. (ADL)
Dylan Richmond, Emuobosan Enakerakpo, Mohammed Alhendi, Peter McClure, and Mark D. Poliks, “Methods of Printing Copper for PCB Repair,” presented at 72nd Electronic Components and Technology Conference (ECTC), San Diego, Calif., May 30-June 3, 2022. (CAMM)
Dylan Richmond, Ashraf I. Umar, Mohamed Youssef M Abdellaty, Mark Schadt, and Mark D. Poliks, “Additive Fabrication of Aluminum Antennas on Flexible Glass,” presented at the Nanotechnology Network Symposium, Cornell University, May 19, 2022. (CAMM)
L. Roman, A. Garcia-Rodriguez, Cláudia N. H. Marques, and Gretchen J. Mahler, “Development of an In Vitro Model for the Assessment of Gut Inflammatory Responses,” presented at the Binghamton University BME Exhibition, April 2022. (ADL)
F. Salemizadehparizi and Gretchen J. Mahler, “Hydrogen Peroxide Induces Aortic Valve Calcification in an In Vitro Model,” presented at Binghamton University BME Exhibition, April 26, 2022. (ADL)
Preeth Sivakumar, Junghyun Cho, Matt Selter, Surbhi Mahajan Du, John Daye, “Role of Conformal Coating and its Strategies for Tin Whisker Mitigation,” presented at SMTA International, Minneapolis, MN, Nov. 1-4, 2021. (IEEC)
Preeth Sivakumar, Matt Selter, Surbhi Mahajan Du, John Daye, and Junghyun Cho, “Strategies for Mitigating Tin Whisker Growth Using Conformal Coating,” presented at iMAPS New England, virtual, Oct. 26, 2021. (IEEC)
E. Solano and Gretchen J. Mahler, “Mathematical Modeling of the Intestinal Mucosa for Dynamic Intestine-on-a-Chip Devices,” presented at Biomedical Engineering Society Annual Meeting, Oct. 7, 2021. (ADL)
Udara S. Somarathna, Mohammed Alhendi, Darshana L. Weerawarne, Behnam Garakani, Joseph Iannotti, Christopher J. Kapusta, Nancy Stoffel, Stephen Gonya, and Mark Poliks, “The Effect of Thermal Stress on the Reliability of all-Printed Vias on Flexible Substrates,” presented at 72nd Electronic Components and Technology Conference (ECTC), San Diego, Calif., May 30-June 3, 2022. (CAMM)
X. Sun, R. Garza, X. Chen, M. Li, S. House, W. Saidi, J. Yang, G. Zhou, “In-situ ETEM Observation of Intergranular Oxidation of Copper,” presented at Microscopy & Microanalysis, virtual, Aug. 1-5, 2021. (NECCES, IEEC)
J. Tanzman, Gretchen J. Mahler, Cláudia N. H. Marques, “Effect of Engineered Nanoparticles on a ‘Mock’ Gut,” presented at the Binghamton University Biology Symposium, Nov. 22, 2021. (ADL)
R. Walker, H. Huang, S. Jin, “Biochemical and Mechanical Impact on iPSC Pancreatic Lineage Differentiation in 3D Cultures,” presented at the Biomedical Engineering Society (BMES) Annual conference, Oct. 6-9, 2021. (HSCF)
G.W. Zhou, “Surface Reaction Induced Structural Oscillations in the Subsurface,” invited talk presented at the 2022 International Conference on Frontier Materials, Zhuhai, China, May 27-31, 2022. (NECCES, IEEC)
Poster Presentations
J. A. Boulali, Gretchen J. Mahler, B. Murray, P. Huang, “In Silico Simulation of Endothelial to Mesenchymal Transformation in Heart Valve Tissue Using a Multiscale Model,” Binghamton University ME Exhibition, April 4, 2022. (ADL)
J. A. Boulali, Gretchen J. Mahler, B. Murray, P. Huang, “In Silico Simulation of Endothelial to Mesenchymal Transformation in Heart Valve Tissue Using a Multiscale Model,” Binghamton University ME Exhibition, April 26, 2022. (ADL)
E. Castillo and N. Dimitrov, “All-Electrochemical Preparation of Fine-Structured Nanoporous Cu as New Materials for Interconnects,” best technical poster award, 32nd Electronics Packaging Symposium, virtual, September 2021. (CHIRP, IEEC)
E. Castillo, Y. Xie, and N. Dimitrov, “Electrochemical Approach for the Synthesis of Alloy Materials Beyond Thermodynamic Limits: A Proof-of-Concept Study,” 72nd International Society of Electrochemistry (ISE) Meeting, Jeju Island, South Korea, August 2021. (CHIRP, IEEC)
A. García-Rodríguez, A. Stillwell, B. Tochilovsky, J. V. Tanzman, R. Limage, N. Kolba, E. Tako, Cláudia N. H. Marques, Gretchen J. Mahler, “Exposure to MgO Food Additives Affects Human Commensal Bacteria,” Society of Toxicology Annual Meeting, March 21, 2022. (ADL)
A. García-Rodríguez, J. V. Tanzman, A. J. Gonzalez, Cláudia N. H. Marques, Gretchen J. Mahler, “An In Vitro System of the Mucosal Gut,” ASM Microbe, June 20, 2021. (ADL)
R. Limage, A. Garcίa-Rodrίguez, E. Tako, Cláudia N. H. Marques, Gretchen J. Mahler, “Commensal Gut Bacteria Alter Intestinal Mucus Composition in an In Vitro Model,” Society of Toxicology Annual Meeting, March 21, 2022. (ADL)
Jiexian Ma, Piyush Kulkarni, Pu Zhang, Scott Schiffres, “Liquid Metal Fiber Composites for High Performance and Compliant Thermal Interface Material,” 33rd Annual Electronics Packaging Symposium, Binghamton, Sept. 7, 2022. (IEEC)
M. Mendoza, M. Chen, B. T, Murray, P. Huang, Gretchen J. Mahler, “Microfluidic Model of Late-Stage Calcific Aortic Valve Disease Develops Calcium Phosphate Mineralizations,” American Heart Association’s Basic Cardiovascular Sciences (BCVS) 2021 Scientific Sessions, video e-poster, Aug. 23-25, 2021. (ADL)
M. Mendoza, M. Chen, B. Murray, P. Huang, Gretchen J. Mahler, “Oxidative Low-Density Lipoprotein and Shear Induce Early Calcific Aortic Valve Disease on a Chip,” Keystone Symposia: Engineering Multi-Cellular Living Systems, April 3-6, 2022. (ADL)
F. Salemizadehparizi and Gretchen J. Mahler, “Hydrogen Peroxide Induces Aortic Valve Calcification in an In Vitro Model,” Northeast Regional Bioengineering Conference (NEBEC), March 25, 2022. (ADL)
J. V. Tanzman, Gretchen J. Mahler, Cláudia N. H. Marques, “Effects of Engineered Nanoparticles on Human Gut Microbiota,” ASM Microbe, June 15, 2021. (ADL)
S. Zhang and Gretchen J. Mahler, “Modeling Drug-Induced Toxicity in Human Glomerulus and Proximal Tubule Microphysiological System,” Keystone Symposia: Engineering Multi-Cellular Living Systems, April 3-6, 2022. (ADL)
S. Zhang and Gretchen J. Mahler, “Recreating Renal Function in a Human Glomerulus and Proximal Tubule Microphysiological System,” American Society of Nephrology Annual Meeting, Oct. 27, 2021. (ADL)
S. Zheng and Gretchen J. Mahler, “A Long-Term Tri-Culture Human Glomerulus and Proximal Tubule Microphysiological System,” Biomedical Engineering Society Annual Meeting, Oct. 7, 2021. (ADL)
Patents
Pritam Das, Electrolytic Capacitorless, Selectively Dimmable LED Driver, patent Number 11,013,083. (IEEC)
Disclosures
Yaser Hadad, Mahdi Farahakia, Bahgat Sammakia, Paul Chiarot, RB674: Elevated Heat Flux Targeted Thermal Management Systems, July 6, 2021. (ES2)
Sha Jin, RB675: Angiopoietins Promote the Generation of Functional Human Pancreatic Islets from iPSCs, July 9, 2021. (HSCF)
Jiye (James) Fang and Ming Zhou, RD676: Synthesis Approach for Shape-Controlled CoMn2O4 and CuMn2O4 Spinel FacetTailored Nano-Octahedra Electrocatalysts and Compositions for Use in Alkaline Fuel Cells, Oct. 13, 2021. (ADL)
Scott Schiffres, Arad Azizi, Chang Hong Ke, Bahgat Sammakia, Feilin Guo, RB677: Thermalsafe Additive Manufacturing for Electronics, Oct. 20, 2021. (HSCF)
Yaser Hadad, Bahgat Sammakia, Naimeh Fallahafti, Srikanth Rangarajan, RF 678: AI Assisted Single-Two Phase Liquid Cooled Thermal Management System with Flow Bypass, Nov. 2, 2021. (ES2)
Junghyun Cho and Preeth Sivakumar, Laser Markable Translucent Polyurethane-Based Coatings Filled with Silicon Rubber Particles, RB679, Dec. 1, 2021. (ADL)
Chuan-Jian Zhong and Shan Wang, RB682: A Low-cost, Nano-engineered and Highly-Efficient Catalyst for Hydrogen Fuel Production, Dec. 10, 2021. (IEEC)
Pu Zhang, RB647: Liquid Metal Composite Without Supercooling, September 2021. (ADL)
Pritam Das, RB684: Magnetic Device to Integrate Multiple Series Primary Parallel Secondary Connected Transformers with Precise Leakage Inductance on One Core, Feb. 8, 2022. (IEEC)
Pritam Das, RB685: Control of POL (Point of Load) Converter, Feb. 8, 2022. (IEEC)
Pritam Das and Tuhin Sasmal, RB689: SingleStage Half-Bridge Point of Load Converter with Quasi-Peak Cycle by Cycle Current Controller, June 28, 2022. (IEEC)
Scott Schiffres, Aras Azizi, Mat Heitner, RB688: 3D Printed Magnetics, May 17, 2022. (IEEC)
Awards
Nikolay Dimitrov received the 2022 Electrodeposition Division Research Award of The Electrochemical Society (IEEC)
Seungbae Park, ASME Fellow (IEEC)
