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Trivia of Digitally Transforming India
M
ore than two years of India's monetary policy has passed - which removed high value banknotes from the economy - became a reality. That bold step got mixed with support, confusion and criticism. Remuneration was only part of India's larger, strategic digital transformation. Since then, institutional and economic development has accelerated in many ways in India and some of these changes are reactive and corrective.
Despite the monopolization and significant increase in digital payments since issuing one billion debit cards by Indian banks, many Indian consumers still rely on cash transactions. Although no one can make any country cashless of India, but the formal economy has succeeded in reducing all the currency through the channel and reducing the lack of lack of money in the Indian economy and reducing the lack of money. Compared to the current demand of cash with the historical rate of the economy's growth rate, we have calculated that Indian economy is operating at less than $ 33 billion in cash without the estimated value. Obviously, the behavioral changes needed to complete a major digital banking transition were not occurring overnight or even during a one-year period.
In the meantime, the world's second most populous country and the digital backbone of the largest democracy has developed. When compared with the status quo five years ago, then our opinion - one of us is academic and the other is a technical entrepreneur who has worked with and with the Indian government - whether leap into the fourth industrial revolution with the Indian government it is in the center of that change.
While the developed nations invest to compete at the top end of innovation, India is choosing to do things differently and in the process, it is creating playbook for digital and real-time on ground effects.
As the Reserve Bank of India (RBI) has said in its report the Reserve and the settlement system in India: Vision - 2019-2021, the payment and settlement system are the backbone of any economy! And in a master stroke, this is where India decided to start its unprecedented journey of changing the 1.3+ billion life with the technology dissolution. And, the conversion of India's digital payment story is not less than inspirational, especially when you see what impact it is creating at the ground level. Inspired by progressive regulatory policies, due to the increase of mobile internet usage, increasing the growth of a strong ecosystem of non-banking players like Paytm and, most importantly, the difference between players, India becomes a global case study of massive digital transformation changes has gone.
As the nation celebrates Digital India, we are well prepared for the next level. According to a study by Assocham and PWC India, in less than four years from now, digital payments will be more than double to reach $ 135.8 billion (currently) to $ 135.2 billion, which is a 20.2 percent migrating CAGR Is growing on.
If India has to become a processing hub for the world, then we have to focus on the growing capabilities, R & D should never like before and should create a correct transformational policy framework that gives us the entire data value chain - from competitive to competitive advantage Allows effectiveness There is no answer in any part of the ecosystem and as we go to the next phase of Digital India, in order to create a progressive policy framework for governance, industry and academies, it will need to cooperate more effectively than ever before And provide adequate legacy for innovation without compromising security.
But above all, we must ensure that we develop new ways of thinking, which is full of aspiration, hope, confidence, courage and urgency. We have to ensure that we can do all we can to change the new mindset of change and culture. Ironically, this may sound, culture and capabilities in the digital era will be our greatest strength. @JitendraSagar15
We sincerely hope you enjoy reading the July issue of TimesTech.
Jitendra K Sagar Editor jitendra@timestech.in
04 July 2019
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President and CEO of HMSI, stated that it is possible for the brand to collaborate with rival automakers for battery swapping technology and maybe charging infrastructure as well. That being said, Kato revealed that the brand is yet to make a discussion and frame a formal proposal regarding the move. The Indian Government’s thinktank NITI Aayog made a proposal that all petrol-powered two-wheelers below 150cc will have to be replaced by electric ones by 2025. The proposal is yet to be finalised but on the other hand, BS6 emission norms for petrol vehicles are set to be enforced from April 1, 2020 onwards. Many manufacturers including Honda feel that such a major transition to electric vehicles within a gap of just five years is too early, especially considering the bulk of two-wheelers sold in the country displace 150cc and below. Honda does have its own battery swapping tech. However, this technology would prove to be too costly for Honda to implement nationwide as a standalone system. Hence, teaming up with other brands does make good business sense.
Honda Willing to Team Up with Indian Rivals for Electric Infrastructure Honda Motorcycle and Scooter India (HMSI) is reportedly open to the idea of partnering with rival two-wheeler manufacturers to explore solutions that can enhance electric mobility. In an interaction with the Times Of India, Minoru Kato,
NITI AAYOG says only Electric Vehicles to be sold after 2030 in India NITI Aayog has proposed that after 2030, only electric vehicles should be sold in India. The think tank believes that this will expand the scope of the clean fuel technology beyond two-and three-wheelers in the country. According to the Niti Aayog, as transport remains the most demanding sector for oil, about 100 per cent electric vehicle sale by 2030 may reduce India’s import dependence by a big margin. A ToI report revealed that Niti Aayog has moved a Cabinet note, with different responsibility for different ministries. The road transport and highways ministry have been proposed to prepare a framework to phase out the sale of diesel and petrol vehicles by 2030. The ministry has also been asked to pilot an e-highways programme – with an overhead electricity network – to enable trucks and buses to operate as electric vehicles on select national highways. Niti Aayog’s Cabinet proposal also suggests that Gadkari’s ministry should issue some norms for cab aggregators to replace all diesel and petrol vehicles with EVs by 2030. Also, the heavy industries ministry would replace all diesel/ petrol vehicles with EVs of all central ministries, agencies and
08 July 2019
public sector by 2030. As per Niti Aayog, the barriers in wider adoption of electric vehicles lie in areas of consumer perception, the efficiency of batteries, driving range, speed of EVs, charging time, creation of infrastructure for charging, battery recycling and technology development. The most important component, the lithium-ion battery is very expensive in the country due to no domestic manufacturing making the price of electric cars very high. It believes that delinking battery from vehicles through battery swapping could be a way forward, but it demands the creation of a smart infrastructure of swappable batteries with pay-per-use business models, an extensive swappingstation network, and integrated payment and tracking systems. In order to meet the target of setting up of the Giga-scale battery manufacturing, the Aayog has proposed financial incentives for the investors including cash subsidy on the basis of overall domestic value addition per kilowatt hour (KWh) basis.
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NTPC Tenders 160 MW Solar Project in Rajasthan Energy conglomerate NTPC, has invited bids for a 160 MW solar project in Jetsar, Rajasthan. No electricity tariff limit has been set and, unlike in the recent 1 GW tender made by India’s largest power company, this procurement does not bar foreign-made solar cells and modules. The successful developer, however, must be enlisted with NTPC as qualified engineering, procurement and construction services provider. The scope of work includes the design, engineering, operation and maintenance of the solar project for three years from the date of successful completion of a trial run. The developer will also be responsible for establishing a grid substation and the deadline for bid submission is in eight days’ time, on June 26. Earlier this month, NTPC tendered for 1 GW of gridconnected PV capacity to be developed as part of the Central Public Sector Undertaking Scheme, Phase-II (Tranche-I), with a requirement only Indian-made cells and modules could be used. The company has also again extended the bid submission deadline for a separate 1.2 GW tender for solar projects in western India. The initial deadline of December was pushed out to January 3 and it has now been further extended, to July 1.
Last month the Central Electricity Regulatory Commission granted an electricity trading license to NTPC that will help it implement renewable energy projects, especially solar facilities in India. The power giant had petitioned the commission to grant a Category I license for the inter-state trading of electricity across India. In its petition, the utility said it had been asked by the Ministry of New and Renewable Energy to install 15 GW of solar generation capacity under the National Solar Mission.
CALIBER UNVEILS RAPID GROWTH AND EXPANSIONS PLANS K. Sureshbabu, managing director of Caliber Interconnect Solutions, said. “The new development facility gives us the room to expand our operations, develop new products and disruptive technology solutions for our customers.” He also took this opportunity to introduce Jailendra Kumar as the new CEO of the company. Kumar is a technobusiness leader having previously worked with R&D organizations like ISRO, DRDO, and technology majors such as Philips, Samsung and BAE Systems.
Caliber Interconnect Solutions (CIS) has inaugurated a swanky new 50,000 sq. ft. electronics hardware design facility at Coimbatore. The inauguration took place in the presence of Pa. Moorthy, IPS, STF Sathyamangalam, Kimiaki Tanaka, Caliber, Japan, Mr. Gunasekaran, Chief Editor of News 18 -Tamil and Mr. Thangavel, Joint Labour Commissioner. Caliber Interconnect Solutions (CIS) is an integrated product engineering company with proven track record of offering cost effective and intelligent engineering solutions for major global players in industries such as semiconductor, telecommunication, avionics, railways, industrial automation and Internet of Things (IoT).
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“Expansion of facility at Coimbatore underlines our commitment to take the high technology work to tier 2 and 3 cities where the locally available talent needs high quality work opportunity.”, said Kumar, the newly appointed CEO who has been roped in to lead the business expansion. The new building has all the design, assembly, test and measurement facilities to support electronic embedded engineering with 400 exceptional engineering professionals. This electronic hardware design facility is conveniently located along the national highway which is comfortably reachable from the Coimbatore International Airport. Siva Koka, director – marketing has stated that Caliber is actively looking for ODC projects and the new facility will give a boost for their future growth.
July 2019
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Tech News
Foxconn emerges top Smartphone EMS in India: Report Foxconn, a Taiwanese electronics contract manufacturing company, emerged as the number one smartphone Electronics Manufacturing Services (EMS) company in India during 2018, according to a report by Counterpoint. Foxconn led the EMS manufacturing in India with a 63 per cent share. Xiaomi and Nokia were its primary partners in 2018. HiPad, with a 12 per cent stake, ranked second among EMS companies, driven by Realme and Xiaomi, the study said. How did the other players perform? Huawei-Honor dual brand led Flextronics to third place with a seven per cent share. Xiaomi, Realme, Huawei, Honor and Nokia were the biggest Original Equipment Manufacturing (OEMs) partners for EMS players. Certain key brands such as Samsung, Vivo and Oppo were assembling in-house, it said. The top three EMS companies manufactured 82 per cent of the total Indian smartphone shipments in 2018. Original Equipment Manufacturers (OEMs) are now partnering with multiple EMS players to expand their production in India, which was not the case earlier. This will help OEMs to produce mass volumes and reduce costs as most of them play on thin margins, the study added.
Market scenario At present, more than 100 smartphone EMS players manufacture in India, pushed by the ‘Make in India’ initiative, a flagship campaign by Prime Minister Narendra Modi-led government. However, very few have the scale to serve big players. The leading EMS players are transitioning from Semi Knocked Down (SKD) to Completely Knocked Down (CKD) to save on import duties and increase localisation. The escalating China-US trade war is also pushing Chinese manufacturers to relocate some of the production to countries outside China, the study said.
India revises Solar Manufacturing Tender to attract investors More than a year and 10 extensions later, the Union government has revised the tender specifications for the first solar manufacturing-linked power plant project in the country. Hoping to attract more investor interest, the tariff cap has been set at Rs 2.75/unit. Solar Energy Corporation India (SECI) on Tuesday issued a request for a selection (RfS) notice for selecting solar power developers. This will be for setting up 6 GW (per annum) of solar power plants linked to 2 GW of solar manufacturing plant. A bidder can quote any capacity up to 1.5 GW of solar power projects linked to 0.5 GW of solar manufacturing capacity, corresponding to one project. A total of four such projects have been put up for bidding. A company can bid for one or all four. Interesting amendments In an interesting amendment introduced in the new RfS, SECI has allowed using imported solar modules at the power plant and not necessarily the ones manufactured at the linked unit set up by the company. Earlier, this was mandatory. Another addition in the tender is regarding manufacturing, wherein the companies can submit a bid for setting up manufacturing units for ingots and wafers as well as solar
10 July 2019
cells and modules. The tender, however, has not included the long-awaited demand of the industry to include the existing solar manufacturing units. After several extensions, the Central government, in January, decided to cancel the lone bid that came for setting up solar panel manufacturing along with a solar power plant. The single bid came from Azure Power in tie-up with Waaree Energies. The government re-issued the tender in March and it was also extended again. The latest global tender closes in August 2019.
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Aerospace, investment in defense sector will be based on Indo-France strategic partnership: French Ambassador More investments in the field of defence and aerospace will boost the strategic partnership between India and France, Alexandre Ziegler, French Ambassador to India, said. Speaking on the second day of the Paris Air Show, the Ambassador said that he is looking forward to supporting all the efforts by India in the establishment of long-term and winwin cooperation in the aerospace and defence sectors. A strong bond developed over the years Ziegler added that French industrial facilities in India, big and small, which France is strongly supporting, are indeed flourishing. He sees this as a good news, especially because more and more Indian companies are also investing in France. The Ambassador further noted that France is India’s oldest strategic partner and a significant one for defence and aerospace equipment, not just as a supplier but as a true partner.
GST on Electric Vehicles may be reduced to 5 Per Cent India may cut the goods and services tax (GST) on electric vehicles to 5 per cent from 12 per cent to provide a stimulus to the sector that’s a high priority for the Narendra Modi government.
As a matter of fact, Make in India has been a reality for the French industry for many years, particularly for defence equipment such as helicopters, missiles, submarines, aircraft engines, and others, he said. He further said that this strategic partnership was enhanced even further by French President Emmanuel Macron’s state visit to India in March last year.
EV in India to be exempted from Registration Fees The government has moved a proposal to exempt electric vehicles from registration charges in a bid to promote electric mobility in the country.
Punjab took the driver’s seat
The exemption will apply to all the categories of electric vehicles operating in India. The move comes amid swift momentum gathering around electric vehicles in the country as the government works out a roadmap for the transition to cleaner sources of mobility.
This comes as Punjab has written to the Centre seeking a review of tax rates. The state has sought new rates for automobiles, textiles, micro, small and medium enterprises (MSMEs) to provide a boost to the economy, which has slowed to the lowest in five years in FY19.
“In order to give a boost to Battery-operated or electric vehicles in the country, the Ministry of Road Transport and Highways has initiated steps for providing differential registration fees under the Central Motor Vehicles Rules 1989,” the ministry said in a statement on Wednesday.
Punjab finance minister Manpreet Badal has suggested to the union finance minister and GST Council chairman Nirmala Sitharaman that tax rates for these sectors need to be lowered to address the slowdown.
Plan of action
The GST Council is set to take up the proposal at its June 20 meeting, said a senior government official aware of the development to Economic Times.
The automobile sector has sought urgent measures to boost demand, after recording the steepest decline in sales in 18 years. Passenger vehicle sales have been sliding and fell by 21 per cent in May, prompting the closure of dealerships and plant shutdowns. Eye on electric vehicles Policymakers favour incentivising electric vehicles in line with the government’s long-term strategy. The Niti Aayog has prepared a roadmap that envisages all vehicles sold after 2030 being electric. The roadmap lays down that all two-and three-wheelers should go electric from 2023 and all commercial vehicles from 2026.
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The Ministry of Road Transport and Highways has issued a draft notification in this regard for comment from stakeholders. The ministry proposes to amend Rule 81 of the CMVR in this regard, whereby battery operated vehicles will be exempt from the payment of fees for issue or renewal of registration certificate and assignment of the new registration mark. Minister of road transport and highways, Nitin Gadkari, however, has called for wider stakeholders consultation before taking drastic measures. Gadkari has, however, maintained that the transition to electric mobility must happen eventually and automakers must adopt new technologies as they plan their production.
July 2019
11
LED
Thyristors high surge level protection for
LED
Smart Street Lighting
Benoit Renard Thyristors Product Marketing Discrete & Filter Division, Automotive and Discrete Group.
LED Smart street lights are growing each year as replacements of incandescent or gas lights. World's LED street light installations are progressing from 8 % of total lights in 2013 to a forecasted share of 55 % in 20251. In India, the potential energy consumption savings on municipal street lighting – switching to LED - is more than 8 Terawatt Hours2. From this assessment, the Indian government has started in 2015 the Street Lighting National Program (SLNP), to replace old lamp technologies to low consumption LED lights
12 July 2019
Siddharth Ghosh Technical Marketing Automotive and Discrete Group.
ranging from 18 to 190 W. Today a total of 8 Million units has been replaced in the country and more than 35 Million units will be installed in the next few years. Mission profile defined by SLNP demands a high-quality LED design, with a minimum 50,000-hour life span. The manufacturer has to give warranty for 7 years. To achieve this reliability, several conditions for safety and electric compliance have to be passed. One of the biggest challenge is overvoltage surge withstanding. The minimum mandatory level is 4 kV, required by the Bureau of Indian Standard for classic LED driver, as
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LED
defined in IEEE C64.41.2-2002. Keeping in mind that street lights are deployed under very harsh environment which is very prone to lightning strikes on the Line, as well as the life expectancy is quite high, so, the driver should be designed to sustain the stresses it goes through. Typically, 6 or 8 kV surge test is the key recommendation to enhance the reliability of the LED power supply. STMicroelectronics proposes Thyristors SCR-based protection, with improved safety, reliability, efficiency and accuracy versus state-of-theart solution.
term of maximum acceptable power and repetition. Indeed, MOVs surge capability is specified with a de-rating curve of maximum current and number of surges (ageing effect). Above this limit, MOVs show signs of electric failure, with degradation of leakage current and clamping voltage. Once the MOV clamping voltage is below the AC input Line voltage, the MOV is in permanent conduction, leading to device burning. Thereby, the MOV is not recommended in application where high number of high level surges could occur. Furthermore, the high cost of street light module
Figure 1: High level surge protection circuit (left part) and operation principle (right part)
Classic strategy in case of overvoltage surge is the crowbar function. Usually, with Metal Oxide Varistors (MOV), the overvoltage is clamped at a specific voltage level, allowing to protect the DC downstream of the application, for example, the MOSFETs of the converter are mainly able to withstand maximum an 800 V voltage. MOV offers limited reliability in
replacement is of course a good incentive to improve this performance. To face the above challenge, STMicroelectronics proposes a circuit able to avoid any risk of MOV burning for safety purpose – among others advantages. The shows the circuit
Figure 2: IPP specification of the SCR TN5015H-6I
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July 2019
13
LED
diagram of the solution based on High temperature SCR from STMicroelectronics TN5015H-6I SCR, 50 A / 600 V. In this circuit, the SCR triggers the protection, a TransilTM diode controls protection voltage threshold level, and the MOV absorbs the surge energy. All are on-the-shelves devices of power electronics. The operation principle is the following: when a lightning surge is applied to the AC Line, for example a standard 1.2/50 us voltage wave shape, the voltage is rising quickly across the application DC bus. While the DC voltage stays below the break over voltage of the TransilTM, the SCR remains in OFF-state. Once the overvoltage reaches the breakdown voltage of the TransilTM, the current flows through it and the SCR gate. As soon as this current is equal to the SCR minimum required gate current IGT (15 mA for the TN5015H-6I), the SCR is triggered in ON-state. Then, the overvoltage is applied to the MOV which is able to absorb the extra power from the surge. The overcurrent induced by the stress, defined as a standard 8/20 us current wave shape, flows through the MOV and the series SCR. To withstand such a high current from the stress, the SCR offers a very good robustness to overcurrent, with a specific specified parameter called IPP; for example, IPP = 1500 A for an 8/20 us current shape for the TN5015H-6I. Once the overcurrent is reaching zero crossing, the SCR is automatically turned off thanks to its holding built-in function. The highlights the IPP overcurrent surge capability of the SCR TN5015H-6I. The waveform (left part) is the 8/20 us waveform of current through a TN5015H-6I under test. The maximum gate current in this case is 350 mA (zoom at SCR triggering in the right part) and the maximum non-repetitive rate of current (dI/dt)OC is 250 A/us. The device safely withstands the current stress without any risk. Benefits of such a solution are the safety and the reliability of the system, which can then fulfill the life span requirement. In the same time, the solution improves the overall standby efficiency of the system and the accuracy of the protection.
is the MOV power ratings. High MOV power ratings induce high leakage current, which impact the stand-by losses of the LED module. Typical leakage current of a 14 mm / 391 V MOV is 1.6 ÂľA, when applying a 320 V RMS input voltage. This leakage current can increase a lot with ageing and number of surges as explained previously. Thus, adding a series SCR allows to limit the leakage current in the MOV at 0.1 ÂľA in the same conditions. It means 16 times less standby losses. Of course, as the SCR is a solid-state silicon device, leakage current is more stable and predictable with time than amorphous-state MOV. Finally, the accuracy of the protection is well set-up as the maximum voltage across the LED DC downstream is the breakdown voltage of the TransilTM before SCR triggering, for example 603 V with a 0.8 A current for BZW04-376 TransilTM from STMicroelectronics. The maximum voltage across the downstream after SCR Triggering is the MOV clamping voltage at the overcurrent level. In any case, the voltage well manages accurately to prevent any risk of damage, particularly in case the voltage is higher than the rated voltage of the SMPS MOSFETs (Rated VDC in ). In 2015, Indian government launched a massive project of energy savings in the country. Switching from incandescent or gas lamps to efficient and smart LED lights seemingly proves to save quite few Terawatts hours. In the stringent power line conditions and to make drivers reliable with time, STMicroelectronics proposes high level overvoltage surge protection circuit, based on SCR Thyristors. The high surge current capability of SCR technology, such as TN5015H-6I High Temperature SCR, seems the perfect solution for the over voltage surge condition for the Indian street light, compare with traditional stand-alone MOV-based solution. In addition to reliability performance, the solution improves the application safety, protecting from MOV burning. Finally, the circuit also brings benefits of lower stand-by losses and accuracy level for DC/DC devices protection.
Safety improvement has been previously demonstrated. If the MOV fails, i.e. if its clamping voltage is abnormally low, there is no risk to have MOV burning as the SCR in series is in OFF-state, blocking the input voltage, then there is no current through the MOV. In case of next surge occurrence, the SCR will be triggered by overvoltage through the TransilTM, and the protection will be ON for only a line half-cycle until the next current zero crossing. It means a maximum conduction of few milliseconds, not enough to burn the MOV. Moreover, regarding reliability improvement, in case one of the three devices of the circuit is failed separately in shortcircuit or in open circuit, the application is still working, ensuring lighting main function to fit the reliability requirement of 50 000 hours of life span. The solution allows a better standby efficiency of the application. Higher is the surge level requirement, the higher
14 July 2019
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Cover Story
Cover Story
Palak Kalra | TimesTech
ombining all the latest electronics trends and convergence of IT & OT, digital transformation has been lately emerging as a major sector. Digital transformation changes business processes, activities, operations, and infrastructure to use digital technology to more efficiently serve customers, save money, and provide a better customer experience. Digital transformation refers to society's move to digital technology and the impact of those changes. However, the term is largely used to refer to digital business transformation: the process of a business significantly changing its operations to take full advantage of digital technologies. Organizations are driven to make these changes by consumer demands and expectations, technology improvements, competitive and market forces, and changing regulatory requirements.
C
Yet, with another recent BCG report suggesting that digitally-influenced sales in emerging markets like China could reach as much as $4 trillion annually by just 2022, there's certainly a lot at stake for businesses in any sector. “The Rotation Champions are well ahead of the rest,” Accenture Greater China chairman Wei Zhu warns. “To close the gap, companies should invest in and deploy digital technologies at scale and at speed, and they must seek to create an agile organisation with an innovation culture that will allow them to monetise new ideas.” TIMESTech.in
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Cover Story
For the better part of 10 years, digital transformation was, unsurprisingly, about “digital” and how and where CIOs and IT leaders were investing in next-generation technologies. Cloud, mobile, social, apps, IoT, et al., represented significant updates and upgrades to technological infrastructures aimed at scaling and improving operations and performance. But CIOs weren't the only drivers. CMOs recognized the rapid adoption of the same technologies among customers and how they were dramatically reshaping behaviors, preferences and outcomes.
Challenges But integration of digital technologies across fast-growing organizations remains incredibly difficult. Data, apps and even entire teams can remain siloed. The report finds that the average number of apps used in global organizations is around 900, but the percentage of those being integrated has stalled at just 29% (the same proportion as in 2018). IT infrastructure is frequently to blame for these integration issues. IT teams are increasingly the key enabler to implement digital transformation within businesses, but the proportion of budgets they can devote to this has remained stagnant. These teams are often required to do more with less year on year. This lack of integration has a knock-on effect. While 97% of IT leaders say they are currently undertaking or planning to undertake digital transformation initiatives, just 36% believe that they provide a completely connected user experience across all channels. There is a clear disconnect here, and serious doubts as to whether digital transformation among global businesses is progressing as it should be. Nine in every 10 respondents agree that not successfully implementing digital initiatives will negatively impact revenues. The Semiconductor Scenario
Enhancing Customer Experience Over the years, the top drivers for advanced digital transformation efforts have consistently revolved around two things: 1) modernizing technologies across the enterprise and 2) investing in modern customer experiences. Now, competing for new market opportunities also becomes paramount. More than half of the companies (51%) we surveyed reported that they are investing in growth opportunities in new markets, making it the leading driver for digital transformation efforts. Studying evolving customer behaviors and preferences rank second at 46%. The third leading driver is increased competitive pressure (41%). A recent survey of directors, CEOs, and senior executives found that digital transformation (DT) risk is their #1 concern in 2019. Yet 70% of all DT initiatives do not reach their goals. Of the $1.3 trillion that was spent on DT last year, it was estimated that $900 billion went to waste. Organizations are turning to digital tech – such as analytics – to fully understand their customers. The prevalence and accessibility of mobile and cloud technologies are helping businesses deliver a seamless experience across devices and channels. Furthermore, consumers are expecting efficiency across these channels – agile, real-time experiences which are consistent and satisfying.
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More semiconductor companies to increase their software capabilities over the next few years, attracted by the potential for high profits. To their credit, many players have acknowledged that previous transformation attempts were subpar and have made some improvements—for example, by taking a new approach to talent recruitment or streamlining product development. These efforts have helped, but they only address a few parts of the puzzle. No company has yet developed a comprehensive approach for navigating all stages of a software transformation. Digital Transformation Plan Many semiconductor companies assume that their existing corporate strategy will serve them well for software. But software customers are fundamentally different from their hardware counterparts, requiring more frequent product upgrades and greater ongoing support. To reach them, companies will need a specific plan. As with hardware, the software strategy will include a few basic elements—product offerings (including the main business opportunity for each one), sources of differentiation, and specific goals, such as the time frame for becoming a market leader. The best strategies will go beyond this, however, by considering market research about common pain points and inefficiencies that a strong software product could resolve. For instance, Intel developed a highperformance software suite to assist with advanced analytics after research revealed that customers wanted help with such tasks. In some cases, companies may also gain a sense of a customer's software priorities and preferences through interactions on the hardware side.
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Cover Story
The Digital Twin
Strategy for Semiconductor Companies
The benefits of the smart factory include faster, real-time decisions, with more flexible and efficient business processes. The impact will extend globally, in economic value from waste reduction and increase (U.S.) gross domestic product. Customers benefit through reduced time-to-market and lower costs from more-efficient capital investments and optimized inventories. There is less waste, and a significantlysmaller carbon footprint.
Semiconductor companies may be tempted to venture into areas where software start-ups are flourishing. Such moves may be challenging, however, since they typically lack the agility and speed of start-ups, as well as their highly specialized software skills. As an alternative, we suggest that semiconductor companies focus on opportunities where they can leverage their existing assets, such as a strong customer base, brand loyalty, a broad hardware portfolio, and domain knowledge.
The IoT Strategy The IoT presents a particularly daunting challenge for traditional semiconductor companies. In the first place, many continue to focus on their largest business segments — desktops, communications, and the like — a distraction from the opportunities offered by the IoT. Second, new market segments for IoT chips demand a much higher level of design heterogeneity and device integration, affecting not just the chips themselves but also what software is needed to run the chips, how the chips are integrated into their respective devices, and the way components are packaged within the devices, which would impact for example, the casing surrounding the chips.
The Challenge Ahead The current challenge for the largest semiconductor companies is their pursuit of several markets at once. These companies will find it increasingly difficult to compete for customers against businesses that can afford to be more decisive and focused. Many semiconductor companies, for example, currently maintain large units dedicated to crossindustry security, even as they try to pursue customers in specific industry verticals. Such companies' investment and operating decisions could be difficult to reconcile, and their various business units may be unable to support one another in their efforts to build the different capabilities needed to succeed in carrying out these different ways to play.
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Consider, for example, a semiconductor company that wants to develop network-communication software. If a start-up already offers data-visualization software that charts network efficiency, it could be difficult to create a competitive offering. A better strategy might involve developing a software program that delivers additional insights based on the semiconductor company's proprietary data, such as the reasons why a network access point had less data throughput on a certain day. Semiconductor companies should also draw on their longstanding and powerful partnerships with suppliers, IT companies, and connectivity providers as they expand into software, since this will help them achieve scale more rapidly and efficiently. In some cases, they may even benefit from forming alliances with their traditional competitors. For instance, Audi, BMW, and Daimler—normally rivals—jointly acquired HERE, a data-mapping company, from Nokia. In addition to reducing the risks for each company, the acquisition increased their ability to compete with established mapping players. Across industries, many companies have become software leaders by capturing control points—business segments that they can dominate because they offer unique products or services such as software programs based on proprietary data or algorithms. For instance, Siemens captured a control point by creating innovative automation hardware and software for manufacturing industries. The company now dominates this segment and serves 80 percent of original-equipment manufacturer (OEM) manufacturing lines, as well as 14 out of 15 major automotive OEMs. In the chip landscape, new supercompetitors will eventually arise. They will be the companies or consortia that succeed in building out a dominant cross-industry IoT ecosystem, or that develop a winning combination of chips and services for a particular industry, or that offer a flexible line of products and services to rapidly meet customer needs. Getting there will require ambitious companies to be decisive about their value proposition and the way to play needed to create real value in this new world. They must understand in detail the capabilities they need to carry out that strategy, perfecting existing capabilities and building, buying, or collaborating to gain new ones. They must learn to scale up those capabilities to the degree necessary to make a profit in their chosen markets, and they must understand the degree to which the capabilities they do build will be valued by customers in those markets.
July 2019
19
Medical Applications
The Future of
HEALTHCARE May Reside in Your
SMART CLOTHES By Peter Brown Mouser Electronics
W
hen most people think of wearables, they often think of the obligatory smart watches, fitness monitors, and heart rate monitors that are typically worn on the wrist or. However, the wearables market extends well beyond just these standard devices and into multiple emerging markets across some different industries. One such emerging market is smart clothing for healthcare–the idea of weaving electronics into a shirt, a blanket, a bandage, a knitted cap, or pants to perform specific patient care functions. Smart clothing, or e-textiles, as a whole is still in its infancy, and practical applications that are being used in hospitals and other care facilities are few and far between.
20 July 2019
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Medical Applications
Yet, interest in the potential of this technology is vast with many healthcare providers and medical device manufacturers actively monitoring smart clothing pilot projects and research into the latest e-textiles technology. In fact, smart clothing holds such promise in healthcare it is being seen as a major disruptive force in the industry in the next five years. Healthcare in general is experiencing its own crisis especially in the US (also in the UK),” said Aditya Kaul, research director for market research firm Tractica. Therefore, the focus is more on fixing healthcare rather than on technologies like smart clothing. We see a slow growth for the market in the next three to four years, but beyond that, we see a bright, fast growing market. Tractica forecasts smart clothing for healthcare to grow from just $2.4 million today to a whopping $1.2 billion by 2021, with the majority of growth coming in the years 2019-2021.
What is an e-Textile and How Does it Work? Smart clothing is seen as a way to revolutionize the practice of healthcare, and it’s hoped that a widespread use of garments used to monitor health or help with treatment could reduce reliance on costly equipment and a heavily burdened healthcare system. Clothing that can track chronic disease or conditions, help with a growing aging population, or make patients more comfortable during a stay at a hospital or treatment facility is seen as a way to create value, boost health insights, and reduce costs. E-textiles are designed to feel comfortable on the skin but at the same time be functional. These smart fabrics consist of traditional fabric woven with conductive fibers as well as electronic elements such as biomedical sensors, microcontrollers, fiber optics and wearable antennas, such as Mouser’s line of Internet of Things system-on-modules. An example of a biomedical sensor that could be used in etextile applications is the Analog Devices’ AD8232/33 Heart Rate Monitor Front End . It is an integrated signal conditioning block for ECG and other biopotential measurement applications, designed to extract, amplify, and filter small biopotential signals in the presence of noisy conditions. The Intel Edison development platform is designed to lower the barriers to entry for a range of inventors, entrepreneurs, and consumer product designers to rapidly prototype and produce “Internet of Things” (IoT) and wearable computing products. It is both a system-on-module solution and an item that incorporates a wearable antenna. In some cases, e-textiles are created, in part, on a typical tabletop sewing machine that embroiders thread into fabric in a pattern via a computer program. Instead of thread, however, metallic fibers from metals such as silver, nickel, carbon, copper, aluminum, and stainless steel, like Adafruit’s wearable electronic platforms from Mouser, are used that feel
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the same as traditional thread to the touch. These products allow you to realize any wearable project. They are fully featured, round, sew-able, and Arduino-compatible devices. They are small enough to fit into any project and low cost enough to use without hesitation. Depending on how the conductive fibers are woven in and the electronics included in the smart clothing, the fabric is durable and able to be washed similar to regular clothing. While durability is still an on-going issue in many projects, it is a consideration that most researchers and companies are working on as an important step toward mass commercialization of smart clothing for healthcare.
Market Drivers and Challenges for Smart Clothing So far, there have been relatively few e-textile commercial successes. One of the reasons for this is a lack of willingness by companies in the healthcare field to invest in research projects or academics instead taking a wait-and-see approach. In its place, some manufacturers have turned to the wellness/sports market where the consequences for a wrong signal are much lower. However, with a continued rise in many parts of the world of chronic disease–such as diabetes, heart disease, cancer and respiratory disorders–aging populations that are living longer and an increase in the number of surgeries performed in key healthcare markets such as Europe and the US, e-textile developments are on the rise to make use of emerging electronics and medical technology. In some clinical trials, smart clothing has shown to protect against infectious disease, help sense the state of the wearer’s health, and help prevent, treat, and manage health. There are lots of opportunities in healthcare development, especially textiles,” said Luciano Boesel, group leader for adaptive textiles and hydrogels at Swiss research house Empa (Figure 1). “The need for long-term, unobtrusive monitoring of risk patients at home will stimulate quick development. In five years’ time, I believe we’ll get to see many innovative textile solutions in healthcare.”
Figure 1: Fiber optics integrated into a blanket or shirt in order to monitor skin circulation to prevent bed sores or monitor heart rates is what researchers at Empa are working on. (Source: Empa)
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Medical Applications
Boesel admits e-textiles face challenges that must be overcome including further development in reliability, liability, and certification. Regulatory approvals also present a challenge for device manufacturers and researchers as FDA consent can take many years. Then getting approval and certification from insurance companies is another hurdle. So many smart clothing projects that have been introduced will take between three to five years to come to fruition. Many experts see this inflection point happening in the 2020 time frame.
the urine.
Solving Current Problems James Hayward, technology analyst with market research firm IDTechEx, believes that if an immediate financial or economical gain to the technology can be had, the more likely smart clothing will be adopted by providers. E-textiles such as a bed sheet or mattress that are integrated with pressure sensors to manage and prevent bed sores by making sure the patient is moving around on the surface enough is something that that is garnering a lot of interest from companies, Hayward says. Conditions such as bed sores and incontinence in the elderly cost hospitals and care facilities money and time. Moisture sensors integrated into smart clothes for mapping incontinence in patients could prove to be a very worthwhile investment in the long run. If e-textiles continue to prove to be successful, it will start off as a high-end luxury feature before it gets adopted on mass,” Hayward said. “These things take time and while typical medical device lead times are coming down slightly, we can expect to see some in five years, more in 10 years. But there is a lasting value here, so I do think it will come to healthcare gradually. Clothing+ is working with Jabil to mass produce textileintegrated sensors that meet the necessary FDA requirements for medical grade solutions. Some of the ideas for the e-textile include a bioimpedance vest, which measures water accumulation in the lungs to indicate heart conditions, that can be worn at home for trend analysis before hospitalization, saving time and money. Other ideas in development is a chest belt to provide a lung’s performance through a topographic picture of the lungs and a light therapy blanket for babies with jaundice allowing them to be removed from cradle light therapies and held by parents or loved ones instead. Edema ApS is developing a washable stocking to measure and monitor changes in leg volume with patients suffering from edema (fluid accumulation or swelling) in the lower limbs (Figure 2). While not yet available for patients, the stocking is being prepped for clinical trials and validation. Future uses of the stocking could be to monitor congestive heart failure or pre-eclampsia, which happens during pregnancy and involves hypertension, edema, and protein in
22 July 2019
Figure 2: A wearable, washable stocking that can be worn at home for use in monitoring edema in patients legs is moving into the clinical trial and validation phase. (Source: Edema ApS)
The stocking will be washable and durable enough for home use, which is the main concept idea of the project. Being able to monitor people when they are home and avoid long problematic trips just to have an eye assessment of the increase or decrease,” said Klaus Østergaard, CEO of Edema. The stocking would be monitored via a smartphone app where the user could self-regulate during exercise, identify the need to elevate or reposition legs or call the doctor for medical adjustment, Østergaard says. Wearable body metrics vendor Hexoskin has been active in developing smart clothing for sports/fitness markets but is also working on e-textiles for healthcare in the areas such as cardiology, respiratory, neurology, mental disorders, and pediatrics. Currently, Hexoskin is conducting trials for longterm remote monitoring of clinical-grade sensors woven into a smart shirt for precise electrocardiography (ECG) cardiac monitoring with lung function and activity monitoring.
Academia Leading the Way Among those developing e-textiles for the healthcare market, work being done at the university level offers much promise for the future of patient care technology. One interesting project is being developed by VTT Technical Research Center of Finland, where researchers have created smart fabric that can be used as clothing or blankets that calculate whether a patient needs to be cooled or warmed based on the initial date measured from the person and the environment. These garments could also be used by surgeons that get too hot during an operation with the clothing adjusting to the temperature of the body during surgery. “Hospital patients have been asked about their most unpleasant experience, and the most common answer is feeling cold-pain comes only second,” said Pekka Tuomaala principal scientist at VTT.
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Medical Applications
Ohio State University’s ElectroScience Laboratory is working toward functional e-textiles that gather, store or transmit digital information by weaving antennas-such as the Intel® Edison development platform-into something like a brain cap that senses activity in the brain to help treat conditions such as epilepsy or addiction (Figure 3). The researchers are also working on a smart bandage that tells a doctor how well the tissue beneath it is healing without removing the bandage. “Our goal is to understand how we think. Imagine if we can enable our brain into regeneration. To do that we need to understand the brain and how many neurons are working together,” says John Volakis, director of the ElectroScience Laboratory at Ohio State University. “These smart clothes could tell an epileptic person to sit down before they have an attack or how to activate or deactivate cells in patients with Parkinsons.”
Figure 3: Ohio State University is working on integrating antennas and circuits into clothing for the future of healthcare monitoring and treatment. (Source: Ohio State University)
Meanwhile, the University of Bristol is working on soft robotic clothing that could help vulnerable people avoid falls by supporting them while they walk and giving others bionic strength to move between sitting and standing positions or climb stairs (Figure 4). The smart clothing involves nanoscience, 3D fabrication, electrical stimulation, and fullbody monitoring technologies. Researchers believe this technology could ultimately lead to potentially freeing wheelchair-bound people from having to use the devices. “Many existing devices used by people with mobility problems can cause or aggravate conditions such as poor circulation, skin pressure damage or susceptibility to falls, each of which is a drain on health resources,” said Dr. Jonathan Rossiter, professor of robotics in the Department of Engineering at the University of Bristol. “Wearable soft robotics has the potential to improve many of these problems and reduce healthcare costs at the same time too.”
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Figure 4: Researchers at the University of Bristol are working to integrate soft robotics into clothing to support those vulnerable to falls or have trouble walking up stairs. (Source: University of Bristol)
Switzerland’s Empa research center is integrating optic fibers into e-textiles to monitor the skin’s circulation to prevent bed sores and has created a fitted cap that measures heart rates. The garments are being made to withstand a disinfection wash cycle, which would make it ideal for hospitals. Researchers believe this technology could be used eventually to measure oxygen saturation or to measure pressure on the tissue or respiration rate. The e-textiles could also be turned into chemical or biosensors, such as those offered by Maxim Integrated to analyze body fluids or vapors. Maxim’s ultra-low power and secure development boards are based on Maxim’s series of ultra-low power ARM Cortex-M microcontrollers. These ARM Cortex-M4F 32-Bit MCUs are ideal for the emerging category of wearable medical and fitness applications because their architecture combines ultra-low-power, high-efficiency signal processing functionality, and ease of use. The Maxim MAX30102 Pulse Oximeter & Heart-Rate Sensor is an integrated pulse oximetry and heart-rate monitor module, and it includes internal LEDs, photodetectors, optical elements, and low-noise electronics with ambient light rejection. “The ductility of the fibers has to match that of textile yarn to provide the same comfort and integrity,” said Dr. Maike Quandt, a postdoctoral researcher at Empa. “E-textiles benefit from fiber optics since the fibers can be used for a multitude of sensors. At the same time, optical fibers do not pose a risk for electric shock.”
The Future of Smart Clothing While many of these academic endeavors are moving forward and are working toward commercialization, innovations in high-tech fabrics and the advances in microelectronics are opening even further possibilities for healthcare-related e-textiles. Some of these ideas and early pilot projects involve t-shirts that relieve chronic back pain, shirts with stretch sensors for
July 2019
23
Medical Applications
monitoring respiratory rates with patients with chronic lung disease, soft all-day belly bands that monitor uterine contractions and fetal heart rate in pregnant women, pressure monitor stocking for use by diabetic patients or even a shirt that delivers shocks to patients experiencing serious heart problems. Some experts see smart clothing completely replacing bedside monitoring in hospitals with shirts that track heart rate, blood pressure, oxygen intact and more. Recently, the idea of integrating gesture recognition in smart clothing has garnered attention with the Google-Levi Project Jacquard commuter jacket for bicycle riders. While many experts believe gesture recognition could find its way into clothing for healthcare-maybe for use by paraplegics or elderly that have had strokes or heart attacks or elderly in the
home that fall-currently there are far less expensive and established technologies that will be hard to surpass in the next five years. Haptic feedback , or the use of touch in a user interface design, holds much promise in e-textiles because it can be easily miniaturized and does not require moving mechanical parts. Haptic feedback would be used in Electric Muscle Stimulation (EMS) that could range from a small tingle to a strong force feedback to activate a patient’s muscles. Smart clothing with haptic feedback technology could be used at all times during the day and worn on any part of the body to stimulate muscle movements or rehab. Projects involving haptic feedback, such as those from Novasentis, are currently in development for use in garments for healthcare with prototypes expected to arrive later this year.
Peter has nearly 20 years of experience reporting and writing about the electronics industry including semiconductors, semiconductor manufacturing, consumer electronics, power and energy, MEMS and sensors and mobile devices. He previously worked for IHS Technology as Senior Manager for Marketing and Communication, where he wrote, edited and designed the weekly Market Watch newsletter as well as press releases on the latest IHS analytical reports. Peter has held numerous positions at Electronic News including senior editor and managing editor, where he won gold and silver awards from the American Society of Business Publication Editors (ASBPE) for both writing and design.
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Company Watch
Sunil Bhatnagar Country Head- Energy Div. Microlyte Energy Ltd
Microlyte a Pioneer Name in India for Lithium ion battery
India mainly lag in cell manufacturing and some cell manufacturing plant should come up by 2020. First and foremost important thing is to have a cell manufacturing plant in India. MICROMAX pioneers in Indian mobile hand set manufacturers have ventured in Lithium Batteries around a year back. Now Microlyte Lithium ion energy products are available for electric vehicles, solar storage, smart cities, automation, robotics etc. Micromax has plants at strategic locations at Hyderabad, Bhiwadi, Rudrapur etc. have logistics advantage to cover pan India supplies and support. Indian market is predominant with lead acid batteries but Lithium is making inroads where battery is used as a fuel or as a better storage medium. Electric vehicles are coming up fast in India and Govt. programs support make in India products. The FAME 2 scheme specially applies with conditions like domestic contents, phased manufacturing program etc. As a whole Lithium batteries are compact, lightweight with fast charging quality so they surpass lead acid batteries on all fronts except initial cost. Lithium batteries are still a better investment as they work out cheaper if we compare cycle life. The internal resistance of lithium batteries is far superior then that of lead acid so it’s more efficient in charging/discharging etc. Most lithium batteries charge in 2-3 hours as compared to 8-9 hours in lead acid. India mostly have high average temperature in most places so the batteries should be designed to sustain such high temperatures and Microlyte Lithium batteries are specially designed to sustain high temperature conditions. Micromax is deeply involved in lithium battery space and have invested in 1500W laser welding machine set up to have best of quality of the battery pack. Laser welding helps in absorbing vibrations on bumpy roads and also reduces internal resistance of battery pack so over all it makes a more efficient battery pack. India mainly lag in cell manufacturing and some cell manufacturing plant should come up by 2020. First and foremost important thing is to have a cell manufacturing plant in India. Without this we would remain dependent on China, Korea, European companies. Another challenge is resources
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for cell manufacturing as India does not have basic raw material such as Cobalt, Lithium etc. so we would remain dependent on countries like Argentina, Bolivia, Chile etc. for raw material supplies. As of now we lack slightly in lithium technology though some Indian PSUs are providing technology. India still is good in making lithium batteries as we have sufficient expertise in making battery packs. Another integral part of any lithium battery pack is BMS- Battery Management System. This is like heart of any lithium battery. BMS control high and low voltage & current cut off, do cell balancing, protect battery pack from short circuit, protect battery from high temperature as BMS has cell level and pack level sensors to monitor temperatures. CAN communication protocol can be added if required. India is a huge market for lithium battery packs as we are passing through a revolution in EV space with so many E Rickshaws, E Autos, E Bikes, E Scooters, E cars coming in 2019-20. Apart from this, last 4 years were very good in solarizing villages with solar street lights and home lights with back up from LiFePO4 battery packs. Now India boasts of electrifying most villages and that has happened due to Saubhagya scheme of Govt. which mandates use of Lithium batteries only. Micromax mainly focuses in Lithium battery packs of 1Kwhr to 25Kwhr. We have products for electric vehicles mainly in 2&3 wheeler space. In Solar we have battery packs for solar home light, solar street light and rural electrification. We also have containerized BESS- Battery Energy Storage System in MW level. Micromax has battery packs in both lithium technologies of NCM with 3.7v cells and LifePO4 (LFP) with 3.2v cells but focus area is LFP battery packs. Micromax battery packs are tested at ICAT & NABL etc.
July 2019
25
In-Conversation
PASSIVE COMPONENTS Play a Very Important Role in any
ELECTRONICS Related Application
Abhishek Shukla Vendor Development & Marketing Saison Components & Solutions
T
echnical progression at global scale has put more pressure on developing countries to improve their infrastructure and progress in other important areas for prosperity. India being ranked high in the list of developing nation has a lot of pressure to maintain the speed. As per estimates, about 25-30 people will migrate every minute to major Indian cities from rural areas in search of better livelihood and better lifestyles. With the momentum, about 843 million people are expected to live in urban areas by 2050. So to accommodate this massive urbanization country needs to find smarter ways to manage complexities, reduce expenses, increase efficiency and improve the quality of life. The top most priority for competing at the global level is the vision of our Prime Minister Shri Narendra Modi, which is the Smart City.
26 July 2019
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In-Conversation
Now the question comes that “What is a smart city�?
For India, smart meters represent a possible game changer by handing power distribution companies the ability to address billing inefficiencies that have contributed to their losses and debt burden. IoT is the next promising technology which tends to revolutionize and connect the global world via heterogeneous smart devices through seamless connectivity. Like in the rest of the world, India too has adopted the IoT Trend initial deployments are going to be in the urban or the metropolitan parts of the country.
The answer is, there is no universally accepted definition of a smart city. It means different things to different people. The conceptualisation of Smart City, therefore, varies from city to city and country to country, depending on the level of development, willingness to change and reform, resources and aspirations of the city residents. A smart city would have a different connotation in India than, say, Europe. Even in India, there is no one way of defining a smart city. What is the reality about smart city in India? PM Modi had announced his vision to set up 100 smart cities across the country soon after his government was sworn into power, since then a race has been on among cities to land on the list that the ministry of urban development was compiling.
LED Smart Lighting sector is another great field to work on. Government’s energy seemed to cast a brightness over this segment with almost every corner. The LED market in India has been constantly growing over almost 50% for the last five years and is expected to sustain this growth rate in the coming five years as well as LED is a reliable and energyefficient source of lighting which has gained a prominent spot in the Indian lighting market, owing to their numerous benefits over older lighting technology Electric vehicle industry in India. India unveiled 'National Electric Mobility Mission Plan (NEMMP) 2020' in 2013 to address the issues of National energy security, vehicular pollution and growth of domestic manufacturing capabilities. What are Saison solutions for Smart Meter, Smart Lighting, Iot & Electric Vehicle Industry?
To comment on the reality or possibility of smart cities in India, I would just like to give an example from the recent events, just 6 months back, cheap and fast internet seemed like a dream but today India has gone crazy over Reliance Jio. Smart cities are not a new topic in India. They have been in the pipeline for quite some time. The cities we live in today are extremely chaotic, unruly and are spreading at an uncontrolled and unsustainable rate. Smart cities seek to change that. How it will open up multiple opportunities for Indian industries?
One of the major solutions that will contribute to the smart cities is the ultra-capacitor / supercapacitor.
It will definitely open multiple opportunities for Indian industries such as the Automotive Industry, Power Industry, IT industry, Telecom industry, automation industry, lighting, renewable industry and many more. One of the initiative taken by Indian government in their smart city mission they have entered into global smart meter race to fight utility losses.
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As one of the major focus will be to reduce the pollution and eliminate the products which affect the environment adversely such as batteries, there has to be a product which replaces it. So the product is the supercapacitor. With already replaced the batteries in various applications such as Wind turbine pitch control system, energy meters and diesel generator cranking, we are continuously moving forward to replace batteries in other applications as well and thus contributing to the environment.
July 2019
27
In-Conversation
Passive components play a very important role in any Electronics related application. Firstly, charging devices without wires has been a huge benefit. The efficiency of wireless charging depends largely on the quality of the charging coils – these are passive devices which act as the interface between the device and the charger. Secondly, passives have been instrumental with energy storage for energy harvesting. Passive components allow for energy storage in small sensor nodes to comply with the decreasing size of devices. Lastly, passives are able to protect devices from other users. The ESD protection device, which protects electronic products from electrostatic discharge (ESD), is arguably the most important passive component. For IoT devices such as wearables, which are intended to be touched and handled frequently have to be taken care of. Saw device, our one of the solution for communication. These devices are compact, cost efficient, easy to fabricate, and have a high performance. As our major focused being on how we can reduce pollution & products related to it, here is Saw Device which can work even without batteries and operate under harsh environments. SAW devices can work as filters, signal processing units, sensors and actuators. They device have been widely used in different fields and will continue to be of great importance in the foreseeable future. Lithium Ion Batteries, as part of environmental commitment, Fanso Primary batteries use raw material that reduce consumption of fossil energy & pollution. Mainly applied to commercial market, military field, aerospace, GPS and various force stations. The Internet of Things (IoT) relies on the use of autonomous, wirelessly connected sensors to relay data about changing environmental conditions at often remote, difficult-to-reach locations. As a result, IoT sensor nodes need to be able to
28 July 2019
provide their own power over many years. Although IoT sensor nodes may make use of energy harvesting to provide electrical power, the amounts of energy available are small and often unreliable. The sensor node generally needs some way of storing energy temporarily so that it is ready when a reading has to be taken or a message sent wirelessly. One option is to provide a small rechargeable battery or storage capacitor. However, these storage mechanisms have their own drawbacks that can limit their usefulness: rechargeable batteries wear out after a few hundred charge-discharge cycles and need to be replaced, and capacitors will not just change their characteristics over time but will self-discharge rapidly. The self-discharge can be as much as 20 percent per day, causing much of the converted energy to be wasted. To ensure that power can be supplied over the lifetime of the IoT product, a primary battery may be needed although it could be supplemented by the combination of an energy harvesting and storage subsystem. Through the use of harvesting, it is possible to extend the usable lifetime of the sensor node before its primary battery is exhausted and needs to be replaced or the node itself is disposed. EMI Filter, another solution for utility sector. With excellent noise suppression, Yunpen EMI Filter can be used in almost all electrical & electronic equipment. Our high quality products for Lighting solution - Electrolytic Capacitor, Ceramic capacitor, Diodes, resistors, Varistors, MOSFET, COB, SMD LED, SPD, Sidactor, Thyristor etc are quite cost competitive. Other than this, Saison also offers RF Antenna, GPS Antenna Ferrite Bead, Inductor, Wireless charging coil, NFC product & displays and look forward to support with many components & products.
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Digital
The Evolving Communications Landscape Dr. Devasia Kurian CEO, *astTECS
Converging technologies and collaboration solutions are addressing the communication needs of today’s evolving ecosystem. Automation, provisioning and blend of physical and virtual resources are transforming the enterprise communications industry with flexibility to adapt to customer’s communications requirements and market opportunities. Cloud & Mobility is helping simplify organizations’ infrastructure and reduce costs with highperformance secure, scalable and customized solutions. This is also helping accelerate deployment of communications infrastructure with fast access and quick turnaround time. To sum it all, a converged network offers enormous capabilities, since the integration of communications systems increases collaboration, productivity and quality of experience. Insights: Enterprises are seeking optimization and automation techniques and processes to deliver productivity & performance more efficiently. Addressing this enormous phenomenon, technology and application providers are gearing up to serve the communications needs of expanding and evolving ecosystem. With the surge in devices and bandwidth, vendors are offering customers an open enterprise collaboration platform, which seamlessly integrates with wide range of devices and applications, deliver robust applications quickly and free up resources. The digital transformation is driven by rapid innovation in enterprise mobility technologies, at the same time helping enterprises to be more intuitive, agile and transparent. Converging networks and new enterprise applications continues to boost workforce productivity, drive innovation, lower expenses, build scalability and reliability, while maximizing resource and technology to grow revenues, increase profitability and streamline operational costs. Telecommunication continues to be at the focal point for disruption, delivering continued momentum and increased collaboration with newer technologies and applications, such as; Internet of Things (IoT), automation & surveillance solutions, accelerating critical enterprise decisions and analytics. 5G capabilities are taking us to ultra-low-latency and extensive capacity, paving the way for machine to machine communication and new-age technologies like; artificial intelligence and machine learning.
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Evolving communication technologies and open architecture are presenting tremendous growth opportunities and organizations are eventually move away from proprietary hardware-based network equipment to open source based functionalities, which allows them to deploy greater processes and manage their enterprise communications cost effectively and more efficiently. The Trends: Powered by Open Source telephony platform to ensure compliance with SIP-based protocols, there will be seamless integration of IP PBX with surveillance devices. This would make all surveillance solutions extremely easy to install and manage, while creating room for augmentation, scalability and future expansion. As organizations combine their security set-up with the existing communications infrastructure the surveillance application gets integrated with existing IP/Ethernet networks, thereby saving huge costs, as it eliminates the need of added hardware and new infrastructure. The addition of IOT devices for monitoring & control and establishing seamless enterprise connection will be the key transformation for future. An essential and upcoming wave of change for the enterprise communication will be the emergence of IP PBX as the centre piece of work flow automation application - built on open architecture, that connects various enterprise IT devices, captures, analyses and derives actionable knowledge from customer interactions. With real time analytics, businesses will be able to detect critical experiences, e.g.; contact centre employee behaviour during customer interaction, quality of customer engagement and help them analyse quickly. Businesses can track and engage customers across multiple communication channels with accuracy, measuring engagement effectiveness and collecting & acting on real-time feedback. The derived analytics would assist in identifying and resolving bottlenecks in enterprise processes and workflows, eventually improving performance. Accelerating progress and addressing communication challenges the telecommunications industry is transforming fast to deliver successful application performance, integrated connectivity, flexibility & interoperability across platforms, networks and devices.
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Networking
Fulfilling the
5G Promise
5G technology is expected to transform the role that communications will play in society. Delivering ultra-low latency, high speeds and capacity for an almost limitless volume of data traffic, 5G will fuel economic growth and a hyper-connected future where people, devices and things are connected to the network whenever needed.
Sameh Yamany Chief Technology Officer VIAVI Solutions
30 July 2019
Service providers will have a part to play in this digital transformation, of course, but their end game will be to monetize network investments to replace revenue erosion in order to stabilize their CapEx and OpEx, creating new revenue streams. Each of the new use cases enabled by 5G, however, will have its own unique set of requirements in terms of performance, as well as network and service quality. As such, it’s vital that service providers slice the network according to use case and implement service assurance, test and measurement for each use case across every industry.
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Networking
Testing times ahead While some communications service providers (CSPs) deployed limited 5G networks toward the end of 2018, the launch of full end-to-end 5G networks is expected this year. With a full 5G rollout now on the horizon, CSPs have been carrying out critical testing across several aspects of the ecosystem. Yet, from lab testing of new features and interfaces specific to 5G, through to the validation of infrastructure used in pilot network deployments, a great deal of work remains. The unique complexity of 5G creates several challenges when it comes to testing, assurance and optimization. In order to deliver more data bandwidth, for example, 5G new radio (NR) will make use of extremely high-frequency millimeter wave (mmWave) bands, which can only be demonstrated by using over-the-air (OTA) testing and some specialist chambers. The beamforming and massive multiple input/multiple output (MIMO) techniques employed to increase overall spectral efficiency present additional challenges. Massive MIMO in 5G can often have more than 256 array elements, requiring a large number of radio channels, meaning that traditional cable testing won’t always be viable or cost-effective, while the addition of complicated beamforming can seriously impact the testing process. Network slicing, while crucial to meet the service demands of different use cases, is not without its challenges. Currently, there is a lack of slice definition or the associated network and service function distributions that mirror the demands of unique industry verticals. For example, each slice will have its own performance requirements, meaning services that make use of one slice will have entirely different service-level agreements (SLAs) than those using another slice. For network slicing to deliver the multi-faceted benefits being touted, each slice needs vigorous prototyping, testing and continuous assurance and optimization. Robust testing and continuous assurance are essential to guaranteeing that each network slice delivers the particular benefits it promises.
Assurance automated Once a 5G network is deployed, the priority for CSPs becomes the ongoing testing of services and applications to reassure customers that they will perform as expected in their
respective use case. In time, however, as the number of networks grows, and the number of multiple different network slices along with it, CSPs will inevitably turn to automation for service assurance and optimization. With virtual network function (VNF) agents deployed within each service slice, assurance and optimization will be intrinsically linked to the services themselves, thereby enabling automated root-cause analysis with service impact assessed in real-time, and any issues will be automatically addressed and remediated to minimize impact on end users and to optimize the service slice efficiency. Should component failure or insufficient computation or storage be the root cause of a problem. For example, a ticket automatically will be created for either the repair of the defective element, redistribution of the virtual components or to initiate a request for additional computational or storage resources. Real-time analytics will ensure that SLAs are met, even as services evolve and change, by monitoring the network resources or functions infrastructure for overload, congestion, faults and anomalies that might impact service, as well as providing detailed insight into the activities of services, applications and devices across the network. With such measures in place, CSPs can be assured that every application and service on each specific slice of the 5G network delivers the best possible performance.
The end game is in sight 5G represents huge potential for CSPs to provide a range of new and enhanced services and applications, offering speeds, latency and data bandwidth never before possible. However, assuring the performance of these services and applications is crucial if CSPs are to effectively monetize the 5G network. It’s vital, therefore, that they address the testing, assurance and optimization challenges that this new network technology presents, employing virtualized, automated solutions to monitor and measure the performance of every service on every slice for the best possible performance for every use case. Because ubiquitous connectivity without quality of experience would fall far short of the end goal.
EVERYTHING YOU NEED TO REACH YOUR AUDIENCE
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July 2019
31
Test & Measurement
Anritsu Introduces First VNAs to Specify 43.5 GHz Performance in K-Connector Environment to Address Emerging High-frequency Applications ShockLine VNAs Lower Cost-of-Test and Improve Time-to-Market in 5G, Satellite and Signal Integrity Applications
Anritsu Company introduces a 43.5 GHz frequency option for its 2- and 4-port ShockLine™ MS46122B, MS46322B, MS46522B, and MS46524B vector network analyzers (VNAs) with guaranteed specifications using Anritsu's Extended-KTM type connectors and components. The ShockLine family becomes the first VNA to support specified 43.5 GHz functionality in a K-connector environment, creating distinct cost-of-test and time-to-market advantages in high-frequency applications, including 5G, satellite, and signal integrity. With the introduction of the Extended-K calibration kits and accessories, the option eliminates the need to use inconvenient adaptors or completely change the connector type. It provides design and manufacturing engineers with an efficient solution that adds the critical 3.5 GHz to a test environment for verification of products used in emerging applications. Anritsu leveraged its design and characterization capabilities to extend the K-connector frequency performance. The additional 3.5 GHz of guaranteed coverage enables customers to remain in the K-connector environment rather
than transition to more expensive and less robust 2.4 mm connectors, saving cost and increasing compatibility across test environments.
ShockLine VNAs Combine Price and Performance The ShockLine MS46122B, MS46322B, and MS46522B are 2-port VNAs that provide a range of price and performance in three distinct configurations to meet the needs of a wide variety of applications. The MS46122B USB VNAs are packaged in a compact 1U chassis and are externally controlled via USB from a user-supplied PC. The MS46322B is designed in a self-contained, compact, and rugged 2U chassis that includes the power supply and computer. The MS46522B Performance ShockLine VNA delivers unprecedented value and performance in numerous test applications up to 92 GHz. For 4-port test environments, there is the ShockLine MS46524B series. The VNAs deliver economical and performance efficiencies in a multiport VNA to lower the cost-of-test and speed time-to-market. Contact: Madhukar.Tripathi@anritsu.com
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July 2019
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Test & Measurement
Renesas RX23E-A MCU Built-In Analog Front End For High-Precision Sensing and Measurement Equipment Deliver Better-than 0.1% Precision Performance in Temperature, Pressure, and Other Measurements, Ideal for Both Manufacturing and Test and Measurement Equipment
Renesas RX23E-A Group 32-bit RX microcontrollers (MCUs), combining high-precision analog front end (AFE) and an MCU on a single chip. Designed for manufacturing and test and measurement equipment applications that require highprecision measurements of analog signals for temperature, pressure, weight, and flow, the RX23E-A MCUs are the first Renesas solutions to enable such signals to be measured with better than 0.1% precision without calibration. The new MCUs achieve AFE precision at the highest class in the industry (offset drift: 10 nV/°C, gain drift: 1 ppm/°C, and RMS noise: 30 nV rms), a level that could previously only be achieved by combining dedicated A/D converter circuits with high-precision operational amplifier ICs. By integrating this high-precision AFE IP (intellectual property) on a single chip using the same fabrication process technology, Renesas has made it possible to implement high-precision sensor measurement, computation, control, and communications on a single chip. This allows system manufactures to reduce the number of required components, save space, and simplify system design in a wide range of equipment requiring highprecision measurement, such as sensing, temperature controllers, recording, weighing, and force sensing. It also accelerates endpoint intelligence by enabling distributed processing with MCUs. With big data-driven quality and productivity improvements, the pressure is on for factories and manufacturing sites to measure a wide variety of sensor data accurately and reliably. Since users require stability when measuring small signals at high precision over a wide environmental temperature range, it is important to reduce noise characteristics and temperature drift characteristics to low levels. To adress to these needs, Renesas has developed a high-precision AFE and integrated it into an RX MCU with an extensive track record with industrial applications. The RX23E-A MCUs are based on the RXv2 core, which
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features operating speeds of 32 MHz, a digital signal processor (DSP), and superlative floating point unit (FPU) calculations. This allows the implementation of adaptive control using temperature data and inverse matrix calculations using 6-axis distortion data. For example, robot arm force sensors require the measurement and calculation of the 6-axis distortion in a small space. The RX23E-A MCUs make it possible to measure the 6-axis distortion data and perform the inverse matrix calculations with a single chip. Key features of the RX23E-A MCUs AFE block v v24-bit delta-sigma A/D converter: Up to 23 bits of effective resolution. Data output rate flexible at 7.6 PS to 15.6 kPS. v Two 24-bit delta-sigma A/D converters that can start synchronously, allowing sensor temperature correction to be performed without switching channels. v PGA (programmable gain amplifier): Rail-to-rail input PGA allows amplification up to 128×. Offset drift: 10 nV/°C, gain drift: 1 ppm/°C, and RMS noise: 30 nV rms. v Voltage reference: Low temperature drift characteristics of 4 ppm/°C with superlative temperature stabilization. v Excitation current source: Programmable current source with required matching required for 3-wire resistance temperature detector. v Analog inputs: differential inputs: up to 6 channels, pseudo-differential inputs: up to 11 channels, singleended inputs: up to 11 channels. All can be used as inputs to the two A/D converters. MCU block v CPU: 32-bit RXv2 core operating at 32 MHz v Digital signal processing can be implemented with DPS instructions and FPU. v ROM/RAM: ROM: 128 to 256 KB, RAM: 16 to 32 KB. v Communication interfaces: SPI (1 channel), UART (4 channels), I2C (1 channel), CAN (1 channel). v Functional safety: software load reduced by Selfdiagnostic and disconnection-detection assistance functions for the A/D converter, clock frequency accuracy measurement circuit, independent watchdog timer, RAM test assistance functions using the DOC and other circuits. v Supply voltage: 5V. Independent power supplies can be used for the AFE block and microcontroller. Voltages of 1.8 to 5.5 V can be supported. v Operating temperature: -40°C to +85°C, -40°C to +105°C v Package: 48-pin QFP with 7 mm square. 40-pin QFP with 6 mm square. For more information : www.renesas.com
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Test & Measurement
Keysight announced PathWave Design 2020 Software Suite Reduces setup time, automates routine tasks, provides faster simulation and analysis
Keysight Technologies, announced PathWave Design 2020, which includes the latest releases of Keysight’s electronic design automation software to accelerate design workflows for radio frequency (RF) and microwave, 5G, and automotive design engineers. The PathWave Design 2020 software suite includes new releases of flagship products: PathWave Advanced Design System (ADS) 2020, PathWave RFIC Design (GoldenGate) 2020, PathWave System Design (SystemVue) 2020, and PathWave RF Synthesis (Genesys) 2020. Technologies are pushing new limits in electronic design with longer battery life, smaller components, and higher levels of integration. As a result, design requirements are growing in complexity, as the amount of data continues to increase. Analyzing and correlating that data requires multiple, non-integrated design tools that create unnecessary complexities. In fact, in a recent survey conducted by Keysight, data correlation and software integration were identified as the most pressing challenges faced by design and test engineers. According to the survey, over 90% of respondents want to accelerate time-to-market with an integrated product development solution that enables data sharing. The PathWave Design 2020 software suite accelerates product development by reducing the time engineers spend in the design and simulation phase. Its libraries and customized simulators reduce setup time and automation improvements reduce manual work. The software seamlessly integrates circuit design, electromagnetic (EM) simulation, layout capabilities, and system level modeling, reducing time needed for importing and exporting designs and fixing errors
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associated with changing tools. Improvements in data analytics allow for rapid analysis and timely design decisions. “Creating efficiency in the product development workflow is an industry challenge, particularly in design and simulation,” said Todd Cutler, vice president and general manager of design and test software at Keysight. “Keysight’s PathWave Design 2020 provides engineers with new tools and software enhancements that shorten the design cycle and eliminate project delays by adding new efficiencies to their RF and microwave, 5G, and automotive work flows.” Keysight’s PathWave software enables agile and connected design and test. It incorporates advanced analytics that create immediate, actionable insights for development and manufacturing teams. Keysight’s new PathWave Design 2020 enables customers to: v
lower costs and accelerate time to market by reducing design time
v
simplify and automate data analysis on circuit simulations
v
reduce EM simulation setup time with two new integrated EM simulators for RF and power electronics designers
v
design safe vehicles with a new complex modeling environment for automotive radar
v
stay current on the latest 5G new radio (NR) standards with updated 5G virtual test benches
More information: www.keysight.com.
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New Products
Maxim's DSM Smart Amplifier Brings a New-Gen of Micro Speakers
MAX98390 5.1W Dynamic Speaker Management (DSM) Smart Amplifier integrates speaker protection to deliver up to 2.5x loudness and 2 octaves of bass with the lowest quiescent power consumption of ~24mW Maxim Integrated Products unveils MAX98390 smart amplifier integrating Dynamic Speaker Management (DSM) algorithm. The new smart amplifier integrating DSM algorithm delivers louder, clearer, richer sound at the lowest quiescent power in the market. The boosted, digital Class D DSM smart amplifier unleashes a system’s full audio potential by safely driving higher power levels (up to 5.1W) into tiny speakers typically rated for much lower power between 1 to 3W. The miniaturization of consumer devices requires speakers to fit within smaller form factors, which has led to more applications moving towards the use of micro speakers. As speakers shrink, loudness or sound pressure level (SPL) decreases while the resonant frequency increases, leading to less bass. Driving the speakers harder to increase loudness and bass response can easily damage the micro speakers through overheating and over excursion. MAX98390 solves this challenge by utilizing integrated IV (current and voltage) sense and Maxim’s DSM algorithm to drive speakers to their maximum specified limits, while protecting against over excursion and over-temperature events. DSM’s thermal protection empowers designers to safely push their speakers well beyond their specified power rating enabling the speakers to produce their maximum loudness. DSM’s excursion protection enables designers to drive speakers to their specified excursion limits, producing sound up to two octaves below the resonant frequency limit. To properly protect the speaker, amplifier algorithms must
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know the characteristics of the speaker, such as resonant frequency within its enclosure, excursion limit and voice coil thermal limit. Traditionally, designers had to go through the time-consuming and complex characterization process or rely on direct supplier support to characterize their speakers and enclosures. This challenge is further exacerbated as most projects start prototyping with multiple speakers per project, requiring several weeks of supplier support or requiring special equipment and expertise. The MAX98390 significantly reduces the design time through the easy-to-use DSM Sound Studio GUI that allows customers to quickly and easily characterize many speakers. Combined with DSM’s thermal protection, the result is maximum loudness across the significantly extended frequency ranges in minutes, with no complex programming required. To cater to the miniaturization of devices and shrinking batteries, the MAX98390 offers industry-leading peak efficiency at 86 percent, which is even further improved with DSM’s Perceptual Power Reduction (PPR) feature that can yield up to an additional 25 percent efficiency and the lowest quiescent power consumption of ~24mW, making it the ideal choice for low power devices that need longer battery life. Key Advantages • Louder and Deeper Sound Quality: delivers up to 2.5x loudness (Sound Pressure Level) and up to 2 octaves deeper bass versus conventional 5V amplifiers in a small form factor • Ease of Use: includes Maxim’s brand-new DSM Sound Studio software GUI, which enables designers to clearly
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New Products
hear the DSM difference in minutes with the Quick Demo feature, and easily characterize and prototype with their own speakers, significantly reducing design time and work • Industry-leading Power Consumption: features lowest quiescent power in the market with ~24mW; offers peak efficiency of 86 percent with boosted Class D Amplifier; and further improves efficiency by up to 25 percent with no loss in audio fidelity with Maxim’s DSM PPR feature • Designed for Manufacturability: On-chip DC resistance (Rdc) testing can be used on the production line for quality assurance to ensure speaker is within impedance tolerance “Meeting customers’ audio expectations given available size and power constraints gets tougher each day,” said Michael Van Den Broek, senior applications engineer for PUI Audio. “Having a simplified turnkey solution like the MAX98390 in
our toolbox to increase the ability of our micro speakers makes the job easier and our customers much happier—which is the ultimate goal.” “The MAX98390 smart amplifier was designed to boost audio quality in the smallest form-factor to make it nimble enough to go into any device,” said Greg Mow, business manager for Mobile Audio Solutions at Maxim Integrated. “From providing the most balanced and loudest sound to offering the market’s highest efficiency and ease of design, the MAX98390 enables our customers to deliver a best-in-class, immersive sound experience.” Availability and Pricing: The MAX98390 is available at Maxim’s website for $1.95; also available from authorized distributors The MAX98390EVSYS# evaluation kit is available for $200 To Know More: www.maximintegrated.com
Matrix SPARSH Fast Data Rates Meet High Accuracy in VP710 a Smart Video Microchip’s New Analog-to-Digital Converter Families IP Deskphone Matrix SPARSH VP710 is a Smart Video IP Deskphone built for business professionals. The new touch screen Video IP phone is the next step towards unified communication. With enhanced audio and video communication quality, VP710 provides video collaboration which results into communication convenience and productivity. Key Features • 7” (1024 x 600) Capacitive and Adjustable Touch Screen • 720p @30 FPS HD Video • 2 Megapixel HD Camera with Privacy Shutter • Bluetooth 4.0+ EDR for Headsets and Pairing Mobile Devices • Built-in Wi-Fi (802.11b/g/n) • USB 2.0 PORT for USB Headset, Media and Storage Applications • 16 SIP Accounts • Three-way Video Conferencing • Five-way Audio/Video Mixed Conferencing • HD Audio For more information, visit: www.matrixtelesol.com
36 July 2019
The rapidly growing market of high precision applications requires Analog-to-Digital Converters (ADCs) with faster programmable data rates, higher accuracy and more integrated features to maximize system performance. To meet these needs, Microchip Technology Inc. today introduced a family of compact ADCs that offer high programmable data rates of up to 153.6 kilosamples per second (kSPS). The 24-bit MCP356x and 16-bit MCP346x deltasigma ADC families offer faster programmable data rates over similar devices on the market while providing high accuracy and lower noise performance. Available in a tiny 3 mm x 3 mm UQFN-20 package, these highly integrated ADCs meet increasing demand for small packaging in space-constrained applications such as portable instrumentation devices. Most high-resolution delta-sigma ADCs on the market have slower programmable data rates of a few kSPS. The MCP356x and MCP346x families offer a much faster data rate, making the devices ideal for a variety of precision applications that require different data speeds, including industrial process control, factory automation and sensor transducers and transmitters. The ADCs also offer integrated features to eliminate the need for external components and reduce the overall cost of a system, including an internal oscillator, temperature sensor and burnout current source. The new families provide 24-bit or 16-bit resolution, two/four/eight singleended or one/two/four differential channel options, allowing developers to choose the most suitable ADC for their designs. The devices join Microchip’s extensive portfolio of versatile ADCs that meet the needs of a variety of speed, accuracy and power consumption requirements.
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New Products
First Clock Buffers to Meet DB2000Q/QL Standards plus PCIe from Microchip 20-output PCIe clock buffer is ideal for nextgeneration servers, data centers, storage devices and other PCIe applications
Four new 20-output differential clock buffers, which cross PCIe General 5 Jitter standards for next-generation data center applications, are now available from Microchip technology. The ZL40292 (85Ω End) and ZL40293 (100Ω termination) are specially designed to meet the new DB2000Q specification, while ZL40294 (85Ω termination) and ZL40295 (100Ω termination) designed to meet the DB2000QL industry standard is. Ideally suited for all next-generation servers, data centers, storage devices, and other PCIe applications. These new devices also complete the PCIe Gen 1, 2, 3 and 4 specifications. Each buffer is an ideal complement to chipsets where distributed clocks are required across several peripheral components, such as Central Processing Units (CPUs), Field Programmable Gate Arrays (FPGAs) and Physical layers (PHYs) in data center servers and storage devices, along with many other PCIe applications. The devices’ low additive jitter of approximately 20 femtoseconds (~20 fs) far exceeds the DB2000Q/QL specification of 80 femtoseconds (80 fs). This provides designers large margins to meet tight timing budgets while achieving increasing data rates. These devices will minimize jitter when distributing clocks to up to 20 outputs, thereby maintaining the integrity and quality of the clock signal through the buffer. The new buffers achieve low power dissipation and contribute significant savings to power budgets by using LowPower High-Speed Current Steering Logic (LP-HCSL). Compared to standard HCSL, LP-HCSL consumes one third of the power, leading to a significant decrease in power consumption. This feature also gives customers the ability to drive longer traces on their board, improving signal routing while reducing components and board space. The ZL40292, for example, can eliminate up to 80 termination resistors (four per output) compared to traditional HCSL buffers. For more information: www.microchip.com
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Infineon introduces world’s first certified NFC Type 4B Tag For seamless mobile connectivity
NFC tags are undergoing a renaissance: users are increasingly tapping smartphones on tags to access digital information and services. Yet reliable data exchange remains one of the major challenges for a positive user experience. Infineon Technologies AG enables seamless connectivity by providing handset manufacturers with reference tags for interoperability testing with all types of internationally standardized NFC protocols. Infineon’s latest NFC reference tags, which are based on the SECORA Pay security solution, have been successfully approved under the NFC Forum Certification Program. This confirms their compliance with the Type 4A Tag and the Type 4B Tag. Furthermore, the Type 4B Tag is the first product worldwide certified by the NFC Forum that supports the contactless Type B protocol. It will be introduced during the NFC Forum Member Meeting to be held in Stuttgart, Germany, between 25 and 28 June 2019. Infineon has been a principal member of the international industry association since 2005. So far, NFC tags have been generally limited to use cases where security is not deemed to be critical – such as sharing URLs or exchanging business cards. However, they offer a host of benefits beyond general information sharing, and can also be combined with security critical payment applications. Their appeal is further increased by native support among a growing number of smartphone operating systems. Users can activate services via NFC connectivity without having to open an app, and thus instantly connect their mobile handset to e.g. smart devices like wearables or access shared services such as street scooters. This intuitive connectivity makes everyday digital transactions easier for consumers – without compromising on security. More information: www.infineon.com/nfc
Matrix launched PRASAR UCS a unified communication server Matrix PRASAR UCS, an Enterprise Unified Communication Server connects internal and external decision makers at multiple locations for effective communication and real-time collaboration. It enables
enterprises to enhance business processes by unifying communication mediums to simplify the daily workflow and increase their response time. Being a pure IP solution, PRASAR UCS is a single box solution, scalable up to 2,100 users, as per future communication needs of the organization. Bring people together anytime, anywhere, and on any device with our integrated collaboration infrastructure for voice and video calling, messaging, and mobility. Key Features Scalable up to 2,100 UC Users Up to 550 Concurrent Calls Up to 99 SIP Trunks 248 VoIP Channels Corporate Directory Integration Multi Lingual IVR – 128 Auto-attendant Menus 64 Party Simultaneous Conference – 21 Three-party Conference 1U Enclosure 64 Ports Voice Mail System – Record Conversations Presence Sharing – BLF Notification Unified Messaging Redundant Power Supply Port For more information : www.matrixtelesol.com
Mouser Electronics is now stocking the SKY85726-11 front end module (FEM) from Skyworks Solutions
Mouser Electronics Now Shipping Skyworks SKY85726-11 Wi-Fi 6 Front-End Module. The 5 GHz WLAN device is ideal for Wi-Fi 6 (802.11ax)-based Internet of Things (IoT) systems, offering a fully integrated solution in a compact 3 × 3 mm form factor. The Skyworks Solutions SKY85726-11 FEM, available from Mouser Electronics, integrates a 5 GHz power amplifier (PA), single-pole double-throw (SPDT) transmitreceive switch, and low noise amplifier (LNA) with bypass mode into a single 16-pin QFN device. The LNA and PA disable functions
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New Products
ensure low leakage current in off mode, and an integrated power detector provides closed-loop power control within the system. The device offers excellent linearity with high gain and 50 dB antenna for isolation. Mouser is also stocking the Skyworks SKY85726-11EK1 evaluation board, which includes SMA connectors and pinouts to help engineers demonstrate the capabilities of the SKY85726-11 FEM.
AAEON announced BOXER-8150AI Embedded AI at the Speed of Sight
Littelfuse setP temperature indicator provides protection against excessive damage to USB Type-C connectors
For more information: www.mouser.in
ROM-Based GNSS Module from STMicroelectronics Targets MassMarket Tracking and Navigation Applications
STMicroelectronics has enlarged its GNSS product offering with the Teseo-LIV3R ROMbased module. The competitively-priced module provides ST’s full GNSS algorithm capability for cost-conscious tracking and navigation devices. ST’s new GNSS module provides odometer functionality with three trip counters and reacheddistance alert, along with geofencing capabilities with up to eight configurable circles and crossingcircles alarm. Support for real-time assisted GNSS with free server access ensures uninterrupted positioning data for dependable navigation. Simultaneous tracking of GPS, Glonass, Beidou, and QZSS constellations, with Satellite-Based Augmentation System (S-BAS) and RTCM V3.1 differential positioning ensures excellent accuracy to within 1.5 meters (50% CEP). Tracking sensitivity of -163dBm and time-to-first-fix faster than one second ensure high performance for demanding applications. The module is easy to use and responds to proprietary NMEA commands. With scalable power consumption according to accuracy, average current, and frequency of fixes, a sub-15µA standby mode with RTC backup, and support for multiple low-power modes, TeseoLIV3R is an ideal choice for battery-sensitive applications. The low-power modes include continuous-fix with adaptive and power-saving cycled modes, periodic-fix with GPS only, and fixon-demand with the device in permanent standby. To simplify and accelerate new-product development, the module is FCC certified and is supported by the STM32 Open Development Environment. STM32 applications for advanced geolocation, smart tracking, and server-assisted GNSS are available, while the EVB-LIV3x evaluation board and X-NUCLEO-GNSS1A1 expansion board provide a head-start with hardware. The Teseo Suite PC tool helps easily configure settings and fine-tune performance. Developers can also join the ST GNSS community to share information and increase their understanding of the field. For more information: www.st.com/gnss-modules
38 July 2019
AAEON BOXER-8150AI family of Compact Embedded AI Edge solutions powered by NVIDIA Jetson TX2. Featuring eight USB 3.0 ports, BOXER-8150AI is designed to maximize framerates by providing high bandwidth for USB cameras connected. The BOXER-8150AI features the powerful NVIDIA Jetson TX2 CPU paired with 8GB LPDDR4 memory and 32GB eMMC storage onboard. The NVIDIA Jetson TX2 utilizes a unique design to provide 6-cores of processing power by pairing the Dual Denver 2 and Quad ARM 57 processors into a single SOC. The NVIDIA Jetson TX2 is capable of supporting up to 256 CUDA cores and supports AI frameworks such as TensorFlow and Caffe, and can be configured to utilize the customer’s own AI inference software. The BOXER-8150AI stands out from the crowd with its unique configuration of eight USB 3.0 ports. The BOXER-8150AI is designed with four USB chips, each controlling a pair of USB 3.0 ports. By dedicating one chip to one pair of ports, each chip handles less data traffic overall, improving bandwidth from connected devices and allowing the BOXER-8150AI to maximize processing speeds and framerates. Higher framerates allow for AI software to process images faster, more reliably and with greater accuracy. With this configuration, the BOXER-8150AI is able to support up to eight USB connected cameras or devices, each operating independently of one another. This powerful configuration is perfect for a wide range of computer vision applications like visual inspection, quality control, and facial recognition. The I/O features of the BOXER-8150AI doesn’t just stop with its USB ports. The BOXER-8150AI features a COM port for easy integration into industrial systems. It also features a Gigabit Ethernet port and two antenna ports for easy connection to any kind of network, or even as a mobile device. Other I/O features include two HDMI 2.0 ports, an SD Card slot, USB OTG, and remote ON/OFF. For more information: www.aaeon.com
Littelfuse announced an extended polySwitch set series of digital heating indicators, designed to protect USB type use C and USB power delivery charging cables from dangerous overhead. The newest addition to the product family, SETP0805-100-CC is optimized for use in cables equipped with USB Type-C connectors at both ends. When dust, dirt, or other debris becomes trapped in a USB Type-C cable connector or the connector has deformed pins, it creates a resistive fault from the power line to ground, which can cause a dangerous temperature rise without increasing the current. When the temperature reaches the setP’s indicating temperature (100°C), the setP switches from low resistance to very high resistance, shutting down the flow of power. Once the user disconnects the cable and removes the debris, the cable can resume normal operation. The compact 0805 (mils) footprint of setP temperature indicators makes them at least 50 percent smaller than other solutions that require placing a device on the power line. The setP devices can be used to protect cables designed for 100 W of power or more. The setP temperature indicators offer these key benefits: Ÿ Their compact size and sensitivity to temperature helps to simplify, keeping the cable surface temperatures safe for users. Ÿ The rigid structure is compatible with conventional assembly and molding operations used in cable and connector manufacturing. Ÿ Being independent of power simplifies part selection and allows protecting systems that operate at 100 W of power or more. Ÿ No disruption of the communication channel makes the setP an easy drop-in solution for reliable over temperature protection for existing designs.
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