Hi! I’m Emma.
Emma Yen (顏岑芳) +886 963-227641 tsenfangyen@gmail.com 7+ years experience of packaging structure design. Familiar with packaging material and production process. Experienced in cross country and cross function coordination. Excellent in supplier training for new design implementation. Humble and open mind is the way I face new things. Always try to be better than average is the motivation of mine. Calm face but humorous soul.
Experience 2021 – Now
HP Inc. / HyperX Package Design Engineer
2017 – 2021
Kingston Technology / HyperX Package Design Engineer
*System transfer and new rule implementa�on: artwork system and sustainable packaging. Sustanable packaging study: From blister to paper PULP. From PE bag to paper bag. Coordina�on for new rule implementa�on: - Provide design guideline for new shipping carton layout, spare part packaging & label content. - Integrate demands from QA/GP/PKG/MKT/Crea�ve for new artwork and BOM process. - Coordinate a short-term artwork review process for a huge wave of compliance change.
Skill LANGUAGE English / Fluent (TOEIC 850) Mandarin / Na�ve Taiwanese / Fluent DESIGN TOOL Adobe Photoshop Adobe Illustrator Adobe InDesign Pro ENGINEER Auto CAD 3Ds MAX Key Shot OTHER EXPERTIZE Intellectual Property Law Design Patent
Portfolio 顏岑芳
*Gaming headset, keyboard, mouse and charger packaging. Packaging concept and structure designer. Cost and risk evalua�on for PKG design decision. Responsible for package die-line and advise artwork layout arrangement. Color manager of physical packaging samples. Oversea-coworking for pack plan discussion, design change and process establishing. - Supplier training: Pallet packaging rule, test plan and carton layout & label template. - Process op�miza�on: Establish tes�ng-use QSG template & sample L/T agreement. - PKG unifica�on for improving packaging consistency and saving tooling cost: Consolidate headset packaging: unify single package die-line, unify shipping carton. S�nger Core family: generic blister for wireless and wired headset. On-line-print label: Study the limita�on of secondary prin�ng and unify label spec. - Cost down: Change from STE box to C2C design for be�er space efficiency and automa�on. - PKG op�miza�on: Improve box paper locker to improve open-box experience. - Quality alignment: Color: Define press-proof material. Establish corporate color limit sample in suppliers-end. Sample review guideline: to define defect level of sample a�er valida�on. - Establishing test mathod: endurance of hanger, on-line-print label and edge strength of box. - HyperX Design Lab establishing: Set up standard raw material list for sample prototyping.
2014 – 2017
- Amazon fireHD, Kindle & Echo look: Set up BOM structure rule according to the opera�on process on the produc�on. Establish SOP document of projects development flow. - Sony Xperia: Arrange sample and track schedule of box folding altoma�on line buildup. - Micromax India: Organizing tests with different material from different suppliers for label peeling off issue.
Educa�on /
Updated by: 2022/3/13
Compal Electronics Inc. / Package Design Engineer
*Smart phones, tablets and IOT products packaging. Package structure designer and BOM manager. Packaging opera�on SOP document provider. Get PKG concepts from customers and work with suppliers to finalize structure & material spec. Proceed packaging verifica�on and propose improvement solu�ons. Responsible for sample approval schedule. Cross-func�on cowork for change request implementa�on.
Master degree at College of Intellectual Property of NTUST Major Research / Design Patent Infringement Bachelor’s degree Department of Industrial Design of NTUST Major / Industrial Design Sub major / Technology Management