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IceMOS Technology
from NMI Directory 20/21
by Grant Rollo
Telephone +44 28 90574700
Email sales@icemostech.com
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Website www.icemostech.com
Established in 2004, IceMOS Technology is focused on establishing itself as a best-inclass provider of cost effective/ high performance Super Junction MOSFETs, MEMS solutions and Advanced Engineering Substrates.
IceMOS has developed an innovative deep trench MEMS Super Junction High Voltage MOSFET that outperforms competing solutions with a much simpler, lower cost process.
IceMOS is a global leader in the development and manufacture of high quality MEMS product substrates as well as advanced engineering substrates based on our wafer bonding technology. Our core expertise is in Wafer Bonding, Deep Reactive Ion Etch (DRIE) and wafer shaping.
We utilise our expertise in DRIE to offer trench etch and refill services to customers on bulk Si substrates or on SOI. Combining both our SOI and trench etch and refill technology, we offer customers a unique dielectrically isolated substrate preparation service.
IceMOS will work directly with the customer to develop a unique specialized product if this is not already on offer. It is with this, that IceMOS’s product portfolio remains unrivaled.
Encompassing over ten years of expertise, unsurpassed manufacturing skill and the latest developments in technology, IceMOS ensures that each customer receives outstanding service from the point of initial enquiry through to product delivery.
