1 minute read
Inseto
from NMI Directory 20/21
by Grant Rollo
Inseto is a leading technical distributor of equipment and related materials to the semiconductor, microelectronic & advanced technology sectors, as well as adhesives for electronics, automotive & industrial manufacturing.
Telephone +44 (0)1264 334505
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Email enquiries@inseto.co.uk
Website inseto.co.uk
Our advanced equipment and materials are available from specialist technology divisions, which offer carefully selected, technically innovative, high performance products, comprising: EQUIPMENT DIVISION: Provides fabrication, assembly, test & inspection equipment, including: manual and automated lithography equipment for exposure, resist coating and development, plus semiconductor furnaces, wafer bonders, probing systems, dicing saws and diamond scribing machines, die bonders and sorters, inspection and metrology equipment, ultrasonic wire bonding machines, plasma cleaners and etching systems, vacuum solder reflow ovens, material testers for wire pull and shear testing etc. With several hundred equipment installations throughout Europe, our dedicated team of specialist engineers provides each of our customers with a full technical and after sales support programme. CONSUMABLE DIVISION: Provides fabrication and packaging materials and services, plus machine assembly consumables. Our products include: semiconductor & silica wafers, sub-contract wafer bumping grinding & dicing, wires & ribbons for bonding and soldering, precision stampings & preforms, hermetic metal & ceramic packages, thick film materials, thin film substrates, thermal dissipation materials, welding electrodes, plus bonding wedges, capillaries, die collets & dicing blades etc. ADHESIVE DIVISION: Provides technically advanced adhesives for bonding, sealing & encapsulation throughout the UK & Ireland. Exclusively representing DELO Industrial Adhesives, our adhesive division has the technical expertise to advise on all your project requirements. Products include an extensive range of UV cured or light activated Epoxies, light cured Acrylates, light / heat cured Epoxies, dual curing materials, light / Anaerobic curing Adhesives, 2 part Polyurethanes, 1 & 2 part Epoxies, Cyanoacrylates and single part Silicones.
