Module I/O-160 Expansion Solution by Advantech

MIO/160 Application Ready Platforms

MIO/160 Application Ready Platforms MIO-6260+PCM-9380 Features

Vertical Markets

Intel®

• M • 6 USB2.0 • 4 COMs • 2 Ethernet Ports

• Voting Machine • Trafﬁc Monitoring • Gaming

Features

Vertical Markets

Pentium®

MIO-6254+PCM-9380

Intel®

Pentium®

• M • Dual Independent Display • DVI/TV-Out/S-Video • 6W Audio Ampliﬁer

• Media Center • Public Information Display • POS/Kiosks

Features

Vertical Markets

• Fanless Intel® Celeron® M • 4 Ethernet (with 2 Ports Bypass)

• Network Gateway • Network Appliance

Features

Vertical Markets

MIO-6250+PCM-9386

MIO-6253+PCM-9386

Intel®

Celeron®

• Fanless M • 6 COMs • 4 COMs with RS-232/422/485

• Factory Automation • Motion Control • Tickenting

* All platforms include value-added services

www.advantech.com

MIO/160 Add-on Boards

Module I/O, a Simpler Way to Fulﬁll Vertical Applications

MIO/160 Add-on Boards

Module I/O, a Simpler Way to Fulﬁll Vertical Applications There are many different ways to extend I/O features to meet vertical application requirements such as stackable I/O modules and carrier-board solutions, but none are as simple as Advantech’s Module I/O-160 (MIO/160) solution.

Stackable Solution

Various expansion features

MIO-6251

3 x 10/100 Mbps with Bypass Ethernet Ports

MIO module with 2-slot Mini PCI, Audio, MDC

Speciﬁcations

Speciﬁcations 3 x RealTek® RTL8139 10/100 Mbps 3 x RJ45 IEEE 802.3 u (100Base-T) Compatible Ethernet Bypass in Port 2 and Port 3 102 x 85 mm, (4.7” x 3.3”) 0 ~ 60° C, operation 0% ~ 90% relative humidity, non-condensing

MIO/160 CPU Board: PCM-9380, PCM-9386, PCM-9382

Stackable solution

• PCI Interface

32-bit data bus (compliant with PCI Bus Speciﬁcation 2.1) • Mini PCI slot 2 Mini PCI type III A slot • Audio Supports AC97 Audio stereo sound (by cable with MIO base board) Audio Output Speaker-Out, Line-In, Mic-In • MDC (Mobile Daughter Card) Interface Optional • Dimension 102 x 85 mm, (4.7” x 3.3”) • Environment 0 ~ 60° C, operation • Operating Humidity 10% ~ 90% relative humidity, non-condensing

Model Name Form Factor Front Side Bus Speed

MIO-6253

Carrier-board Solution

4 COMs MIO/160

In-depth board integration knowledge & efforts CPU module

Carrier-board solution

• CPU module easily upgraded • Greater design effort involvement

MIO/160 CPU Board: PCM-9380, PCM-9386, PCM-9382

400 MHz Pentium M/ Celeron M

Onboard

Socket 478 / onboard

CPU Frequency

up to 1.0 GHz

up to 2.16 GHz

up to 1.8 GHz

System Chipset

Intel 852GM

Intel 945GM

Intel 855GME

CPU Socket

Audio/DVI/TV-Out MIO/160 • Audio • Audio Output

SMSC SCH-3114 LPC I/O with Multiple Serial Ports Controller • Serial Port 3 x D-Sub connector serial RS-232/422/485 Ports and 1 x box header (shared with internal M2M port for wireless) • Dimension 102 x 146 mm, (4.7” x 5.7”) • Environment 0 ~ 60° C, operation • Operating Humidity 0% ~ 90% relative humidity, non-condensing

2nd Cache Memory BIOS Watchdog Timer

AC97 Codec Realtek® ALC202, Chrontel® CH7009A Dual Channel 6W Stereo Audio Speaker-Out, Line-In, Mic-In • Video Output DVI, TV-Out, S-Video • Dimension 102 x 146 mm, (4.7” x 5.7”) • Environment 0 ~ 60° C, operation • Operating Humidity 0% ~ 90% relative humidity, non-condensing

SSD Graphic Controller

MIO-6260

• • • •

MIO/160

MIO/160 Application Ready Platform

Less system space required Lower design barrier Lower cost Easier deployment

0 to 512 KB

1 MB to 2 MB

512 KB to 2 MB

Award 4 Mbit

255 level

CFC I/II

Intel 852GM

Intel 945GM

Intel 855GME

Yes/2 x 18-bit LVDS

Yes/2 x 24-bit LVDS

Yes/2 x 18-bit LVDS

1 x Port 10/100/1000 Mbps

Parallel

Yes

1 x EIDE

2 x SATA

1 x EIDE

2 x Drives

1 x SPP/EPP/ECP

1 x RS-232/422/485, 1 x RS-232

5 x USB 2.0

3 x USB 2.0

1 LAN, 2 COM, 4 USB MIO/160

3 x 10/100/1000 Mbps Ethernet Ports

Serial

1 x RS-232/422/485, 1 x RS-232

USB

3 x USB 2.0

Speciﬁcations

IrDA

115 kbps

Intel® 82551ER (MIO-6260L) NEC® uD720101 PCI USB 2.0 controller SMSC SCH-3114 LPC I/O with Multiple Serial Ports Controller • I/O Interface 1 x RJ-45 (MIO-6260L), 2 x USB connector, 2 x box header, 2 x RS-232/422/485 by D-Sub Serial ports jumperless, with auto ﬂow control • Standard USB 2.0 compliant IEEE 802.3u 100 Base-T Fast Ethernet compatible • Dimension 102 x 146 mm, (4.7” x 5.7”) • Environment 0 ~ 60° C, operation • Operating Humidity 10% ~ 90% relative humidity, non-condensing

• Chipset

3 x Broadcom® BCM5789 3 x Broadcom BCM5751 (optional) 3 x Broadcom BCM5721 (optional) • Speed 10/100 Mbps • Interface 3 x RJ45 • Standard IEEE 802.3 z/ab (1000BASE-T) or IEEE 802.3u (100 BASE-T) protocol compatible • Dimension 102 x 85 mm, (4.7” x 3.3”) • Environment 0 ~ 60° C, operation • Operating Humidity 0% ~ 90% relative humidity, non-condensing

Expansion Bus

MIO/160

MIO/160 Ver. 2.0

MIO/160

• Chipset

MIO/160 CPU board

up to 1 GB DDR266/333

1 x Port 10/100/1000 Mbps

IDE

MIO-6320

up to 1 GB DDR2 533/667

Ethernet

Floppy Disk Drive

Module I/O-160 Solution

up to 1 GB DDR200/266

VGA/LCD Audio

MIO/160 CPU Board: PCM-9380, PCM-9386, PCM-9382

3.5” HDD

Core Duo

Memory Chip Type

• Chipset

PCM-9380

3.5” HDD 533/667 MHz

Max. DRAM

Speciﬁcations

PCM-9382

3.5” HDD 400 MHz

MIO-6254

Speciﬁcations

PCM-9386

ULV Celeron M

CPU Level

MIO/160 CPU Board: PCM-9380, PCM-9386, PCM-9382

• Shock & vibration-resistant • System size grows as functions increase

Carrier board

MIO/160 CPU Boards

MIO-6250

• Chipset • Speed • Interface • Standard • Bypass • Dimension • Environment • Operating Humidity

CPU board

MIO/160 CPU Boards

Power Management Operating Temperature Dimensions EMI Certiﬁcation Other

APM 1.1, ACPI

0 ~ 60° C (32 ~ 140° F), extended temp optional

102 x 146 mm

FCC/CE

LVDS

MIO/160 CPU Board: PCM-9382

MIO/160 CPU Board: PCM-9380, PCM-9386, PCM-9382

www.advantech.com

Technical Notes

MIO/160 Customization Services

Technical Notes

MIO/160 Customization Services

MIO/160 can be completely customized to meet customer requirements. MIO/160 design guide is available upon customer request by contacting any of the local Advantech sales ofﬁces.

Customization Process

Recommended Form Factor

146.05

3.17 8.89

25 142.8

16.16

19.93 18.33

0 3.17

76.22 82

5.97

8.89

80.01

76.05

98.36

98.37

73.11

Unit: mm

View from bottom

Recommended Board Design

• Flexible expansion • Structured IP library to quickly build application ready platform • Streamlined service ﬂow that delivers quality design on time

Advantech IP Library To help customers achieve success in the ﬁeld, many technologies have been standardized and modularized into Advantech’s IP library. Advantech has established a global IP infrastructure intended to share design knowledge amongst Advantech’s design teams. The library assists customers to achieve quick implementation of IP know-how into their product design via Advantech’s ﬂexible, modularized services.

* Graphic signal will depend on CPU’s chipset

* Value-added Services described in following page

www.advantech.com

Value-added Services

Module I/O-160 Expansion Solution

Value-added Services

Module I/O-160 Expansion Solution

Environmental Reliability Services

The Shortest Way from Board to Vertical Applications

Conformal Coating

Glued DRAM Service

• Protects PCB against dust, moisture, fungus, corrosion and vibration • Minimize electromigration between metal conductors • Shield against abrasions or electrical short circuits

• Keep memory secure for resisting shock & vibration • Strengthened connectors • Fully tested before and after for guaranteed quality

Today, embedded computers are ubiquitous, yet many standard embedded single board computers cannot 100% meet system designers’ application specifications because there are no interfaces flexible enough to supply expansion from the hardware perspective. Advantech’s MIO/160 was developed to solve this problem. MIO/160 is an I/O-pin definition created by Advantech and it is open for all development designers. MIO/160 integrates the most popular interface signals together into a high-density 160-pin connector. These popular interfaces include compatibility for PCI, USB, Graphics (DVO, SDVO and others), LPC, SMBus and PCI-Express x4. The MIO/160 interface works seamlessly with Advantech’s PCM-9380 3.5” SBCs, and is a great time saver for board-level engineers. MIO/160 can be completely customized to meet customer requirements. MIO/160 design guide is also available upon customer request by contacting any of the local Advantech sales offices.

SUSI API Functions SUSI (Secure & Uniﬁed Smart Interface) provides a set of user-friendly, intelligent and integrated interfaces, which speeds development, enhances security and offers added value for Advantech platforms. SUSI plays the role of catalyst between developer and solution, and makes Advantech embedded platforms easier and simpler to adopt and operate with customer applications.

MIO/160 Add-on Board

Firmware Optimization Modularization

Optimization • Enhanced performance of BIOS execution • Reduced BIOS ﬁle size

MIO/160 CPU Board

Complete Feature Set • Provides standard BIOS features • Provides advanced BIOS features • Extended Embedded BIOS features

• Flexible feture installation/removal • Efﬁcient development (TTM) • Value-added IP and OEM library

Embedded BIOS Service

MIO/160 Expansion Interface

Documentation • BIOS brochure • BIOS setup manual • BIOS technical white Paper • BIOS release notes

Customization • Provides unique ﬁrmware solution • Fulﬁll requirements through customization

Embedded Software Services: CE/XPe Image Service Our design service helps customers to quickly implement their added value solutions. Dedicated experts are assigned for each project. Our years of experience with the Windows® kernel and device driver development enable Advantech to help customers with anything from low-level device driver development to high-level application services for embedded systems.

www.advantech.com

MIO/160 Features

MIO/160 Beneﬁts

• • • • •

• • • • • • •

Pin definition open for development designer Customization service to fit unique needs Accommodation for baseboard heatsink Rugged, low-profile board-to-board design (17mm) Combination of popular interfaces: SMBus, Low Pin Count, PCI 2.2, USB 2.0, PCI-express x4 and graphic signals

Faster time-to-market for system integrators Preserve customer design know-how Cost-efﬁcient upgrades Easy system integration Minimizes thermal complexity High shock-resistance & compact system size Maximum ﬂexibility for I/O expansion