Laser micro-machining solutions
April, 2013
Content
Workshop of Photonics速 is all about laser micromachining.
1. Services in Femtosecond Laser Micromachining. . . 4
We create instruments and solutions for laser micromachining tasks: from feasibility study to customized optical module and from electronics device to a laser laboratory or laser machine. Our services are targeted both to industry and to academic customers.
1.1. Feasibility Study On Laser Micromachining.
Our key competencies lie in: Feasibility study on femtosecond laser micromachining Development of custom femtosecond laser systems and optical modules Small scale production (job shop) in the area of laser micromachining Laser system automation software Custom electronics for laser based systems and devices Our growth is fueled by culture of open innovations and partnership with the local laser sector companies and worldwide partners. Workshop of Photonics is constantly involved in projects connecting scientific inventions with the market needs.
www.wophotonics.com
1.2. 1.3. 1.4. 1.5.
Laser Process Development. . . . . . . . . . . . . . . . . . . . . . . . . Small Scale Production.. . . . . . . . . . . . . . . . . . . . . . . . . . . . Custom Laser Systems for Laboratory.. . . . . . . . . . . . . . . Development of Industrial Laser Machines. . . . . . . . . . .
2. Products.
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2.1. SCA Software for Laser Micromachining. . 2.2. 2.3. 2.4. 2.5. 2.6.
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10 S-waveplate - Linear to Radial Polarization Converter.. 12 MoTex Motorized Beam Expander . . . . . . . . . . . . . . . . . 13 Beam Shaping Unit BSU-6000 . . . . . . . . . . . . . . . . . . . . 14 Watt Pilot Attenuator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Watt Pilot UltraFAST Large Aperture Attenuator. . . . . 18 . . . . . . . . . .
2.7. TINY Laser Diode Driver. . . . . . . . . . . . . . . . . . . . . . . . . . 2.8. TINY Diode Laser. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.9. Porous stone sample holder. . . . . . . . . . . . . . . . . . . . . . . . 2.10. Step Motor Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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3. Technology. .
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3.1. Femtosecond Laser Technology. . 3.2. 3.3. 3.4. 3.5.
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Samples of Femtosecond Micromachining. . . . . . . . . . . Glass and sapphire cutting samples. . . . . . . . . . . . . . . . . Multiphoton Polymerization Technology. . . . . . . . . . . . MPP Samples. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Partners.
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Particitipation in Exhibitions. .
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The first step is usually a feasibility study, which indicates whether lasers are capable to perform the task. If it is a “yes�, then the customer decides how far to go down the steps of cooperation with Workshop of Photonics: 1. Feasibilty study 2. Laser process development (laboratory prototype)
Small scale production
Products
3. Design of a system/module Custom laser systems for science
Laser Machines for Industry*
Warranty & support * In partnership with manufacturing machinery producers
1.1. Feasibility Study On Laser Micromachining Technology
Need to fabricate micron scale structures on the surface or in the bulk? Already tried and disappointed with other technologies? Our laboratories equipped with ultra-short pulse lasers (from below 300 femtoseconds) is a place where machining perfection can be achieved.
Most of laser micromachining applications are not as straightforward as for example marking. Some processes need development which takes weeks and even months. Not only different laser parameters have to be tested but also various beam shaping and focusing solutions. A typical approach for comprehensive process development contains following steps: testing of different wavelengths in order to explore light-material interaction testing of different focusing optics selecting and testing most suitable positioning solution determining, what’s required for repeatability and required speed of process optimising software functionality for convenient process control You are welcome to contact us with specific micromachining tasks. We are committed to develop a micromachining process for you. If a task is more demanding, we are ready to involve our academic partners in search of a solution.
Services in Femtosecond Micromachining
Cooperation with our customers usually starts with a need to perform a specific micromachining task. The complexity of the task may depend on the material, type of fabrication, speed of processing and other requirements.
Products
1.2. Laser Process Development
1.3. Small Scale Production Since micromachining workstations incorporating ultra-short pulse lasers are rather expensive, it is not always worth buying one. Especially if you need to machine a small batch of articles, consider using our job shop services. Technology
Services in Femtosecond Micromachining
1. Services in Femtosecond Micromachining
Our researchers will test your materials to achieve desired fabrication mode and consult on implementation of it in mass production. Our working experience covers great variety of materials and our original micromachining software SCA allows achieving the desired results fast.
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Results of a feasibility study: Principle answer if laser can be used to achieve results desired by the customer Laser parameters, at which the result is achieved (optional)
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We will provide a cost-effective solution for your laboratory. A proven flexibility of FemtoLAB concept will allow you to further expand and upgrade your system when new requirements arise or budget becomes available.
FemtoLAB
Technology
Femtosecond laser micromachining system for scientific laboratories. Equipped with nanometer accuracy and resolution linear positioning stages, high performance galvanometer scanners and versatile micromachining software SCA, FemtoLAB becomes an entire laser laboratory on an optical table. Tunable parameters: pulse duration (<200 fs – 10 ps); repetition rate (1 Hz – 1 MHz); average power (up to 15W); wavelengths (1030, 515, 343, 258 nm).
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Features: Optimized for 2.5 MW/a throughput industrial-research line Femtosecond UV and nanosecond IR laser sources Machine vision system detecting rotation and adjusting laser scanning field Precise laser beam control in space using high-performance galvanometer scanners 5″ and 6″ wafer processing Intuitive touch-screen user interface for simple production mode operation (SCA engineer) Full functionality software access in research mode (SCA engineer) Sollas performs 4 technological processes: Selective SiNx/SiO2 removal Back contact laser firing Edge isolation Laser marking Other processes are integrated after feasibility tests
Services in Femtosecond Micromachining
Based on our partners’ and our own knowhow in laser micromachining and your requirements for the system we will select appropriate configuration: Laser source Sample positioning system Beam delivery and scanning unit Laser power and polarization control Software for system control Machine vision Sample holders and special mechanics Dust suction unit Other devices
An industrial-research laser machine for c-Si solar cells. Equipped with cutting edge duet – femtosecond UV laser and nanosecond IR laser, Sollas is a multi-tasking system, designed for industrialresearch or up to 3 MW/a capacity pilot manufacturing lines.
Products
Every laboratory has specific applications and every scientist has its own approach. Workshop of Photonics develops customized laser systems for your laboratory, so you get what YOU need and ONLY what you need.
SOLLAS
National innovation prize 2010
nSCULPTOR nSCULPTOR is a turnkey 3D laser lithography system for fabrication of nano structures. Operation of the system is based on multi photon polymerization (MPP) technique and works with many conventional photoresists available in the market. nSCULPTOR enables prototyping and production of various three-dimensional structures at nanometer accuracy and resolution. All processes of fabrication are integrated into a single system 3D model creation and preparation Direct laser writing Post-processing
Technology
Services in Femtosecond Micromachining Products
1.4. Custom Laser Systems for Laboratory
Advantages: All-in-one solution 100 nm – 10 μm resolution Complex 3D objects Variety of polymers Small footprint 7
In order to automate the fabrication process, a custom adaptation of our laser micromachining software SCA engineer can be designed (see page 11). This will not only speed up the fabrication process, but will also reduce participation of an operator to the very minimum. On the other hand, high-level users will have a special interface to configure the process or add new tasks. Usually we offer our services to laser system integrators and producers of manufacturing machinery. However through cooperation with our partners, we can also deliver complete laser machines ready to install at your production site.
Features High fabrication speed – up to 300 mm/s Fabrication of difficult objects with submicron resolution Minimal heat affected zone in femtosecond micromachining mode Aerotech based precise object positioning with submicron accuracy Precise laser beam control in space using high-performance galvanometer scanners Pulse number control (single to 1 MHz) Synchronization of laser pulses with moving object in space and time domains Original software interface for control of all integrated hardware devices More information at http://www.wophotonics.com/products/
Laser equipment for glass dicing (cutting) Workshop of Photonics has developed a hardware solution (a laser cutting optical unit) for efficient dicing of tempered or regular glass.
Technology
The equipment is capable to dice glass or sapphire from 30 µm to 1 mm thick with process speeds from 200 to 1000 mm/s depending on specific requirements. It is also possible to integrate surface tracking equipment to ensure higher process quality, automation and repeatability. Sollas - a laser machine for processing of c-Si sollar cells
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Services in Femtosecond Micromachining
Knowing your application of laser micromachining and process needed to implement it, Workshop of Photonics will develop a specific task optimized laser machine. System configuration will be selected to assure quality, speed and reliability of execution of your task. We will select the neededhardware components including: Laser source Sample positioning system Beam delivery and scanning unit Laser power and polarization control Software for process control Machine vision and sample recognition Sample holders and special mechanics Dust suction Other devices
FemtoFAB is a turnkey femtosecond laser machine for industrial use. Configuration is selected and carefully tuned according to a specific laser micromachining application, including laser cutting, laser scribing, laser drilling and 3D laser milling with any desirable material (with >2,4 GW peak power). System is protected by Class 1 equivalent laser safety enclosure and is controlled through a single SCA engineer software window.
Products
Needs of industrial customers are rather different from those of an academic laboratory: speed, repeatability and efficiency are in focus. Therefore our laser solution usually is a part of a bigger manufacturing machine or production line. Usually it is built by specialized integrators or producers of manufacturing machinery.
FemtoFAB
200 μm Side view of glass after dicing and breaking. 700 µm thick glass
Technology
Services in Femtosecond Micromachining Products
1.5. Development of Industrial Laser Machines
Workshop of Photonics can provide the following solutions in glass cutting: develop a specific glass cutting process for certain glass types, build an optical unit which can be integrated as a module in your machinery, provide a complete processing machinery including laser source, sample handling and other functions for your business. 9
Services
Laser micromachining is our core competence, therefore no surprise that our researchers devote most of their time to developing specific laser applications and technologies. However while working in the laboratory, they are often temped to build certain new devices, gadgets, electronics or software, which improve their efficiency or solve specific issues related with micromachining tasks. Some of these internal inventions end up being as successful products on the market. This section presents laser micromachining related products, which were developed as a result of technical curiosity or via cooperation with our academic partners. These products are produced in our company.
Core functionality embedded in both SCA versions: • Direct control of hardware starting with laser, positioning stages, galvanometric scanners and going to power attenuators and power meters, polarization rotators, machine vision, special I/O and other peripheral devices. • DXF, PLT, STL, BMP file import • Import of data from TXT or XML files • Digital and analog I/O control • Fabrication preview window • Camera view calibrated with fabrication preview • Machine vision module for sample detection
Services
2. Products
SCA software was created to provide speed, flexibility and visibility to laser operators. It makes micromachining tasks easy to describe, fine-tune and repeat. Key benefits of the software: The software eliminates the need to work with G-code completely WYSIWYG interface Convenience in entering algorithms and mathematical commands Fast and easy to correct, fine-tune and then repeat machining task Directly a wide range of equipment Customizable to fit special requirement of scientific or industrial applications
Products
Products
2.1. SCA Software for Laser Micromachining
.stl file sliced by SCA professor
The software comes in two versions: for industry -
Sliced object, having 3 shells to thicken the wall
Dedicated primarily to scientists to be used in their research. Complete functionality Machining rich in functions and options Live sample view through camera Complex machining tasks
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Designed for industrial applications. It is meant for machinery integrators and end-users of laser machines. Task optimized functionality Machining as simple as required Custom user interface Edge detection, marking recognition Long term stability
Technology
Technology
for laboratory -
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Products
* According to ISO 11254 – 2 is θ1000-on-1 = 22.80 ± 2.74 J/cm2, at λ = 1064 nm, τ = 3.5 ns, f = 10 Hz.
S-waveplate features: Converts linear polarization to radial or azimuthal Can be used to create an optical vortex High damage threshold 100% polarization conversion 55-90% transmission (wavelength dependent) Large aperture possible (up to 10 mm or bigger; standard is 6 mm) No glued components – more resistant to heat No “ineffective center” problem No segment stitching
S-waveplate converter
How can S-waveplate benefit your applications? Radial polarization enables focusing of laser beam into smaller spot size (with high NA>0.9 optics). For polarization direction sensitive applications azimuth polarization allows same machining properties in all directions. It is also applicable in optical tweezers, STED microscopy or other depletion applications.
Technology
Standard S-waveplate models are available for 1030 nm, 515 nm, 800 nm and 1550 nm wavelengths. Dielectric anti-reflection coatings can be applied on both converter sides to further increase converter transmission. Custom wavelength converters are available at request.
a)
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Microscope photo made with crossed polarizers
b)
Converted beam intensity distributions (TEM01* mode) with electromagnetic field direction shown a) radial, b) azimuth polarization
Features Aberration minimized design (special aberration compensation layout) Plug & play solution (controller included) Suitable for ultrafast picosecond and femtosecond lasers Direct control from microcontrollers and embedded systems Optional adjustable mounting interface Individual calibration capability Individual presets for magnification Reduced setup time by automatic magnification adjustment Manual magnification control Beam expander performance Applications mm 0 Laser beam size control in -1000 industrial and scientific apEffective focal length Angular magnification -2000 plications, laser machining systems -3000 Automatic control of focus-4000 ing parameters (Numerical Aperture) -5000 Hands free operation in remote machinery places and -6000 20 15 11 7.5 4.8 hazardous conditions Magnification
Services
Specifications Continuously variable magnification: 2,5x…12x Wavelength range: • 1020 – 1070 nm • 510 – 540 nm • 340 – 360 nm Material: Optical crown glass or UV grade fused silica Control interfaces: USB 2.0; UART (RS232); Step/Dir Software platform: WindowsTM Entrance beam diameter: up to 10 mm Output beam diameter: up to 48 mm Overall transmission: 98.5 % LIDT: >7 J/cm2 for 10 ns pulses @ 1064 nm Weight: 1 Kg
Products
Services
S-waveplate is a super-structured waveplate which converts linear polarization to radial or azimuthal polarization. The product is unique for its high damage threshold 100 times exceeding alternative devices*. Unique results achieved by forming birefringent nanogratings inside a bulk fused silica glass. Enabling technology was developed by Prof. Peter G. Kazansky group from Optoelectronics Research Centre at Southampton University.
2.3. MoTex Motorized Beam Expander
0.50 0.45 0.40 0.35
Technology
2.2. S-waveplate - Linear to Radial Polarization Converter
0.30 0.25 0.20 0.15 0.10 2.6
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Services
Beam Shaping Unit is intended to be applied in laser systems for micromachining applications to create round or square laser spots with uniform intensity distribution.The BSU-6000 is developed to operate in combination with customer’s scanning optics, but can also be offered as a complete system. It isbased on refractive field mapping beam shaper piShaper.Output of the piShaper is imaged onto a workpiece by imaging optical system composed from an internal collimator and external lens, for example F-theta lens of the customer’s equipment.
Requirements for the laser and optical scheme before installation The optical scheme with all explanations represents requirements that must be met before the unit installation.
Services
2.4. Beam Shaping Unit BSU-6000
Requirements for the Customer‘s Laser Wavelength Average power Pulse duration Mode structure Intensity distribution
257-2050 nm up to 200 W CW ns, ps, fs TEM00 or multimode Gaussian or similar
Figure 1. Example of beam shaping: Left: input laser beam, Right: final square spot. Final laser spot size and shape depend on customer‘s requirements.
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97
36,5 36,5
Side view
Front (input) view
175 175
250 250 585 585
25,5 25,5
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Technology
Mechanics
200 200
206,5 206,5
Figure 2. Front and back side view
Top view
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Back (output) view
Figure 3. Side and top view All dimensions are in millimeters.
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6.3 – 6.4 mm 50 mm 6000 mm πShaper 6_6 (unit type dependent) Depends on aperture shape - depends on magnification of the composed imaging system being defined as ratio of focal lengths of F-theta lens and internal collimator, - variable in case of Iris diaphragm
Products
Input beam diameter Optical axis height (from bottom) Focal length of internal collimator Beam shaper model Spot shape Spot size
Dimensions (LxWxH) Input aperture diameter Output aperture diameter Weight Aperture placement Mounting points
585x251x97 mm 20 mm 20 mm < 6 kg see figures 2, 3 see figures 2, 3
Technology
Products
Optics
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Clear aperture
15mm (up to 50mm available)
Operational wavelength range
Configuration
+/-2nm
λ/2 LowOrder Waveplate + cemented Polarizing cube λ/2 ZeroOrder Waveplate + cemented Polarizing cube
Standard
Products
10mm (up to 50mm available)
15mm Enhanced (up to 50mm are available)
The third edition of motorized variable attenuators developed by WOP. Controlled through USB as stand-alone or fully integrable with SCA laser automation software, Watt Pilot continuously variable motorized attenuator is readily used in automated laser systems. Features User friendly and flexible control software Easy to integrate USB/Step-dir control interfaces 44 steps/degree resolution Rugged and compact aluminum body
+/-10nm
λ/2 ZeroOrder Waveplate + optically contacted Polarizing cube
Technology
Attenuation range@ CWL
Transmission/ Reflection mode
0,5-95% for transmitted p-pol beam
Reflection mode
0,3-99% for reflected s-pol beam
+/-20nm
λ/2 ZeroOrder Waveplate + 2x Broadband Brewster type thin film polarizers
Reflection mode
0,5-98% for reflected s-pol beam
+/-5nm
λ/2 ZeroOrder Waveplate + 1x Brewster type thin film polarizer
Transmission mode
0,3-95% for transmitted p-pol beam
Transmission mode
1-85% for transmitted p-pol beam
Transmission Contrast mode
0,2-70% for transmitted p-pol beam
Reflection mode
4-96% for reflected s-pol beam
Reflection Contrast mode
0,1-70% for reflected s-pol beam
Transmission mode
1-85% for transmitted p-pol beam
Transmission Contrast mode
0,2-70% for transmitted p-pol beam
Reflection mode
4-96% for reflected s-pol beam
Reflection Contrast mode
0,1-70% for reflected s-pol beam
+/-25nm
+/-50nm
λ/2 Achromatic Waveplate + 2x Broadband (ultraFAST) thin film polarizers
>0,3J/cm2
>20J/cm2
λ/2 ZeroOrder Waveplate + 2x Brewster type thin film polarizers
λ/2 ZeroOrder Waveplate + 2x Broadband (ultraFAST) thin film polarizers
Damage threshold, Typical @10ns, application 1064nm, 10Hz >0,3J/cm2
+/-5nm
15mm UltraFAST (up to 50mm available)
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Optimization
>5J/cm2; >100mJ/cm2 @ 100fs, 800nm
CW medium power lasers and LDs High power CW and pulsed lasers, LDs
High power CW and pulsed lasers, LDs
Products
Services
Model
Services
Specification
Ultrafast, broadband laser sources with pulse length 100 50 fs >5J/cm2; >100mJ/cm2 @100fs, 800nm Ultrafast, broadband laser sources with pulse length <50 fs
Technology
2.5. Watt Pilot Attenuator
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Large Aperture Watt Pilot, CA = Ø40 mm
Ideal for ultraSHORT laser pulses (down to 20 fs) Variable attenuator consists of Zero Order (air-spaced) λ/2 quartz Waveplate and two (or one) high-performance broadband 72 degree polarizers. Rotating waveplate changes ratio of s and p polarizations. Polarizers working at 72 deg angle of incidence (AOI) reflect s-polarized light while transmitting p-polarized light. Intensity ratio of those two beams can be continuously varied without alteration of other beam parameters by rotating thewaveplate. Intensity of either exit beams can be controlled over a wide dynamic range. P-polarization could be selected for maximum transmission, or high-purity s-polarization could be reflected when maximum attenuation of the transmitted beam takes place.
Technology
There are 4 types of UltraFAST Large aperture attenuators: they can be reflection or transmission type and contrast or transmission/reflection optimized. Large aperture makes this attenuator perfect for ultra-short femto applications. Features: Ideal for ultraSHORT femtosecond lasers Large aperture CA=Ø 40 mm Divides laser beam into two beams of manually adjustable intensity ratio High optical damage threshold Low dispersion for femtosecond laser pulses
Features Easy controlled Soft start function User selectable: 2 uni-directional TEC controllers or single bi-directional TEC controller 2 single-directional TEC controllers Smooth temperature stabilization. Adjustable parameters to avoid temperature oscillations Overheating protection for laser diode Can be used in multistage laser systems. Master LDD can start/stop slave LDD’s (from 1.4 ver.) Compact size LD current modulation (optional) Microprocessor controlled USB 2.0 compatible
Products
Products
Cost-effective solution designed for safe and reliable operation of single-emitter laser diodes and low power DPSS lasers. It incorporates laser diode driver and 2 TEC controllers as well as on-board user interface with 2-row LCD display and control buttons.
Services
2.7. TINY Laser Diode Driver
Specifications Parameter Value Laser diode current source current range 0.4 to 10 A Laser diode current increment/decrement step 0.004 A Laser diode voltage limit range 1.5 to 3 V Laser diode voltage limit increment/decrement step 0.001 V NTC Capable to connect two NTC NTC (termoresistor) value @25degC 10 kOhm Number of TEC controllers, max. 2 unipolar or one bipolar TEC driver current (each channel) up to 4 A External power supply voltage 100-240 V AC to +5 V DC Dimensions (controller without pads) 134 x 75 x 43 mm Dimensions (power supply) 119 x 60 x 37 mm External TTL trigger signal 0-5 V
Technology
Services
2.6. Watt Pilot UltraFAST Large Aperture Attenuator
TINY LDD is also available in OEM version. 18
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Services
Services
Features: Soft start function TEC controller Overheating protection Stand alone and USB 2.0 compatible Metal shielded fiber Compact size Smooth temperature stabilization Ready-to-use pumping solution 1 year warranty Custom modifications available
2.8. TINY Diode Laser
Standard specifications
Technology
Wavelength Numerical aperture (NA) Spectral width (FWHM) Power conversion efficiency Adjustable current range Voltage limitation range Bipolar TEC controller current External power supply + 5 V 8 A DC Temperature control range Multi-mode fiber Size (without stop button and key) Fiber length Connector Operates in CW 20
808, 915, 940, 975, 1064 nm 0.15 3 nm 50 % 0.4 – 10 A (0.004 A per step) 1.5 – 3 V (0.001 V per step) ±4A 2 x 100 – 240 V AC 10 – 45°C (0.1°C per step) 105 µm 180 x 120 x 45mm 1m FC fiber-optic
Diode power, W
808 915 940 975 1064
4 9 9 9 7
Diode core diameter, µm/NA 105/0.15 105/0.15 105/0.15 105/0.15 105/0.15
Product ID TDL-808 TDL-915 TDL-940 TDL-975 TDL-1064
Products
Tiny diode laser is a precisely controlled light source. It consists of laser diode which is built in custom temperature controlled diode laser driver. This driver has all the specifications of TINY LDD. Diode laser fiber is covered with metal shield. We offer standard wavelength and power diode lasers. However, we can put any diode compatible with TINY LDD in this system.
Wavelength, nm
2.9. Porous stone sample holder After a long testing in Workshop of Photonics laboratories we present a new product: porous stone sample holder. This product was developed by our research engineers to meet specific laser micromachining requirements. It has a two axis tilting screws to compensate the sample position deflection. Rigid and durable design guarantees long period of exploitation. Features Standard size: pore stone diameter 152 mm Available in various shapes and sizes Available with pore size from 6 to 120 µm High porosity 40-50% Has a mechanical tilting platform Good chemical, wearing and erosion resistance Can be used in high temperature environment
Technology
Products
Catalog items:
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2.10. Step Motor Controller
3.1. Femtosecond Laser Technology Services
Services
Features: Microprocessor control USB control interface TTL STEP/DIR control interface User friendly PC control software Compact size Unbeatable price
Controller input (“STEP/DIR INTERFACE” connector): Input pins UartRx UartTx Step/Dir/En
ModeSel UartOn
Description UART baud rate 38400, 8 data bits, 1 stop bit, no parity. RXD and TXD pins are 5V compatible with reference to GND pin. Maximal input voltage +5.5 V These pins are optically isolated, 3.3 V – 5 V compatible. Input current requirement per pin: 4.6 mA @ 2.8V 5.2 mA @ 3.3V 6.8 mA @ 5 V These logic pins are not optically isolated. 5V compatible with reference to GND. Maximal input voltage +5.5 V
Technology
Motor output: Characteristic Max output voltage Max output current Current regulation type Microstepping capability Step frequency
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Rating 12 V 2A Pulse Width Modulation Full, Half, Quarter, Eighth, Sixteenth steps Up to 4 kHz
Femtosecond laser micromachining is currently the most precise technological platform among other laser technologies, which is used for material processing. First of all, femtosecond laser pulses distinguish itself as causing minimal heat effect, therefore almost any solid state material can be fabricated with submicron resolution. Workshop of Photonics is developing microfabrication technological platform, in order to provide scientific and industrial customers with: Feasibility studies Fabrication process development Small scale production Micromachining system development or mass production. Laboratory rent and demo Our competences, accumulated know-how and well equipped laboratories are capable to perform these processes: Precise drilling, cutting, dicing and marking Ablation, etching, 2.5 D milling 3D in bulk engraving Surface micro-nano structuring Laser-Induced Backside Wet Etching (LIBWE) Refractive index modification in transparent materials Optical micro-manipulation Multi-photon polymerization More information at http://www.wophotonics.com/applications/
Products
Virtual serial port (“COM port”) settings then attached to USB: Baud rate 38400 8 data bits 1 stop bit Parity: none Flow control: none
Technology
Products
Specifications:
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Applications: Front contact formation Back contact formation
Application: Detection of materials with increased sensitivity using surface-enhanced Raman scattering (SERS) Bio-sensing, water contamination monitoring, explosive detection etc.
Edge isolation for solar cells
Metal micromachining 3D structures formed on steel surface High precision and surface smoothness achieved
Products
Processing of solar cells
1 μm
Services
Services
Nano ripples Up to 200 nm ripple period fabricated using ultra-short laser pulses Individual nano-feature size on ripples: 10 – 50 nm Controlled period, duty cycle and aspect ratio of the ripples
Developed in cooperation with Swinburne University, Australia
100 μm
Products
3.2. Samples of Femtosecond Micromachining
50 μm
Selective dielectric layers removal for solar cells
Cast iron ablation Surface texturing with micro holes and grooves Minimum heat affected zone 53,591 μm
88,611 μm
Application: Friction reduction between moving metal parts
200 μm
Marking of contact lens Marking made inside a bulk of contact lens, preserving surface of lens and distortions Exact positioning of markings – 3D text format
Laser marking of solar cells
Application: 10 μm
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Technology
Technology
50 μm
100 μm
Product counterfeit protection Development of novel products
More information at http://www.wophotonics.com/applications/
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25 μm
100 μm
Mask for beam splitter pattern deposition Borosillicate glass 150 um thickness ~900 holes per mask Mask diameter 25,4mm
Products Technology 26
10 μm
Appplication: Selective coating Glass tube drilling Controlled damage and depth
Ferroelectric ceramics etching No or low melting Easily removable debris Good structuring quality Applications: Infrared sensors for cameras Memory chips
100 μm
100 μm
Steel foil μ-drilling No melting Micron diameter Applications: Filters Functional surfaces
Application: Product marking
Hologram production Example: hologram view generated using glass sample
Ablation of PCD (polycrystalline diamond) Ablated circle crater on the surface of PCD Smooth and even bottom of the crater Application: Component of PCD cutting tools
30 μm
Datamatrix Data inscribed on a glass surface Extremely small individual elements, up to 5 µm in size
Diamond cutting Low carbonization No HAZ Low material loss Applications: Diamond sheet cutting Diamond texturing/patterning
Applications: Solar cell production Semiconductor industry
Services
3 μm
Products
Services
Applications: Microfluidic sensors Waveguides
Silicon laser assisted etching No HAZ No melting
20 μm
Technology
Micro channel formation Wide range of materials – from glass to polymers
20 μm
Applications: tissue biopsy equipment 15 μm
More information at http://www.wophotonics.com/applications/
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Technology
Application: Vascular surgery
Top view
Metal
Cross-section
Hair
Wood marking No heat effect, no signs of burning
100 μm
Application: Laser marking processes in highly flammable environments Decoration Counterfeit protection
100 μm
Texturized sapphire surface Micron resolution Large area processing Single pulses used to form craters on the surface
Products
Products
Stent cutting Holes in stent wall, cross-section view Polymer stent No heat effect, no debris Minimal taper effect
100 μm
Application: Better light extraction in LED Semiconductor structure growth
30 μm
Technology
Services
Application: Microfluidics
Services
Marking, patterning capabilities: Smallest spots up to 3 µm in width Micron level positioning No heat effect
Glass holes Various hole sizes with routine tapper angle better than 5 deg Minimal debris around the edges of holes
10 μm
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More information at http://www.wophotonics.com/applications/
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Optical fiber drilled to the middle Diameter from <10 μm Various hole profiles possible Depth and angle control 100 μm Optical fiber
Services
Services
Marking inside a bulk of transparent material Colorful structures due to small pixel size Surface not affected Very small or no cracks near markings Low influence on strength of the substrate
Applications: Optical fiber sensors Material science Optical fiber scattering No impact on fiber strength No surface damage Even light dispersion
Products
Selective metal coating ablation (removal) Selective ablation of metal coatings from various surfaces Depth and geometry of ablation may vary Application: Lithography mask production Beam shaping elements Optical apertures Other
Amplitude grating formation
Chrome ablation for beam shaping
Technology
Titan coating selective ablation
50 μm
50 μm Chrome ablation from glass substrate
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Optical fiber lensed using MPP technique Matching refractive index Shape flexibility Resolution from 100 nm to 20 μm Applications: Medical fibers Fiber collimators
100 μm
Apperture array fabrication
Gold layer removal without damage to MgO substrate – Au layer removal without damaging
100 μm
Products
Applications: Medical fibers Oncology
Glass
Serial production of micro-parts Submicron precision micro parts made of polycarbonate/polypropylene/poly(ethylene terephthalate) Minimal or no signs of heat effected deformation Excellent cut surface quality, sub-micron precision of shape High speed laser processing
200 μm
Technology
Sapphire
Application: Consumer electronics MEMS systems More information at http://www.wophotonics.com/applications/
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3.3. Glass and sapphire cutting samples
25.1 μm
100 μm
51.3 μm
Products
100 μm
Tempered and regular glass parts arewidely used in modern electronics from smartphones to television sets and other industries. There are many types of glass with different tempering structure, material composition, thicknessand other qualities. Every particular glass type requires development of a specific cutting process and machinery in order to achieve highest cut quality and throughput. High speed laser cutting of glass and sapphire is a common task in nowadays industry. Mechanical cutting processes are becoming obsolete, therefore innovative methods are emerging. Workshop of Photonicsis developing state of the art laser technologies, which allow cutting of almost any type of glass/sapphire available. Scribing is a method used to laser-cut glass: material is first damaged with a laser and then it has to be broken manually to achieve final cut. In some cases glass will self-break after scribing. Closed cut is a method when only bulk of the glass is damaged with a laser, but surface remains intact. This method produces no debris. Minimal debris can be expected after breaking of glass. Tempered and regular glass cut process general specifications: Straight and round cut processes developed for industrial application Femtosecond and picosecond laser pulses used Single pass process Speed from 125mm/s to 1000 mm/s depending on specific requirements Self-break along the cut line after cutting is possible for certain types
Products
Services
Glass micro-hole drilling (50/25 µm diameter) Glass 320 µm thick Hole entry diameter: 50 µm Hole exit diameter: 25 µm High hole quality
Services
Laser cutting (scribing) of glass and sapphire
Regular glass, 30 µm thick Minimal amounts of debris observed Easy glass breaking after laser scribing Speed: 200 mm/s – 1200 mm/s depending on specific requirements 30 μm
30 μm
5 μm Side view after breaking
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Technology
Technology
We have had experiments with glass as thin as 30 µm and up to 800 µm. Best cutting results were achieved with the following glass types:
5 μm Top view before breaking
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100 μm
500 μm
50 μm
50 μm
Regime A Side view after breaking
Products
100 μm
500 μm
200 μm Regime A Top view after breaking
540 μm
100 μm
50 μm
Regime A Side view after breaking
Regime A Top view before breaking
540 μm
200 μm Regime B Side view after breaking
Regime B Top view after breaking
Technology
Regime B Top view before breaking
50 μm
Technology
Regime B Side view after breaking
Services
100 μm
Tempered glass, 500, 540 µm thick Single pass process In bulk damage (closed cut), surface remains intact, practically no debris Homogeneous cut surface Speed: up to 500 mm/s up to 1000 mm/s depending on specific requirements
Products
Services
Regular glass, 100 µm thick Small amount of debris observed Easy glass breaking after laser scribing Speed from 125mm/s to 800 mm/s depending on specific requirements
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700 μm
700 μm
400µm sapphire
100 μm
Products
Regime B Top view before breaking
700 μm
200 μm
Services
Top view before breaking. Straight cut process. No visible cracks
Top of side after breaking. Straight cut process. Homogeneous side of sapphire
400µm sapphire
400µm sapphire
200 μm Top view after breaking. No cracks. Round cut process
100 μm Side view after breaking. Round cut process
Technology
Regime B. Top view after breaking
10 μm
Technology
Regime B. Side view after breaking
100 μm
400µm sapphire
50 μm
20 μm
Regime A Side view after breaking
700 μm
Results for 400 µm thickness sapphire sample:
Products
Services
Tempered glass, 700 µm thick Single pass process Only bulk is damaged (closed cut), surface remains intact, practically no debris Homogeneous cut surface Speed: from 200 mm/s up to 500 mm/s depending on specific requirements
Sapphire cutting (scribing) process specifications: Single pass process Cutting speed: up to 500 mm/s Easy to break after processing Smooth edges: minimal or no post-processing needed No visible cracks or collateral damage near cut line Round cut available
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How does multiphoton polymerization work? Multiphoton polymerization (MPP) is a unique technology for 3D structuring of micron scale objects with nanometer precision. Femtosecond laser beam is focused inside a drop of sol-gel or other types of photoresist polymer and desired pattern is “written” precisely point–by-point (Fig. 1 a and b). Then, the unsolidified remainder of the photoresist is washed away leaving only the fabricated microstructures on the substrate (Fig.1 c). Products
Features: 100 nm – 10 µm writing resolution Medium cost per sample Variety of polymers Complex 3D objects a)
b)
Photoresist Polymer Materials Variety of photoresist materials with required features can be chosen; No structural distortions; Certain wavelength absorption; Refractive index matching.
< 90 nm
Precision and Controllable Self-Polymerization Standard direct writing is able to make repeatable structures as small as 100 nm, though by employing self-polymerization effect, the smallest lines can be around 20 nm. This effect occurs when certain distance between polymerized structure walls is kept, so self-polymerizing structures can be controlled, at least to some extent. Repeatability
c)
*1
Reliable and multifunctional software SCA Professor ensures fast preparation, stable workflow. 3D lithography is related to huge amounts of data, which has to be transmitted between computer and positioning controllers. Many systems crash because of poor software adaptation to these specific tasks. SCA professor splits the data in portions to deliver them safely and timely to the controllers. Moreover, identical structures can be fabricated by direct laser writing process but in order to save time and work for large area patterning stamping technique can be used.
What is a “technological platform”? Technology
*3
Products
Co-development with Vilnius University Laser Research Center.
*4
MPP technological platform can offer a flexible solution for micro prototyping and production. It is a combination of feasibility studies, small-scale production and development of turn-key work stations. This platform includes certain steps from selecting the most suitable photoresist to building task-dedicated laser system for science or industry.
5 μm
*5
10 μm
Technology
Services
The SCA laser automation software product family procides speed, visibility and efficiency to multiphoton polymerization operations and other laser micromachining tasks. The software is distinguished among other existing laser software solutions by the key working principle – it controls positioning stages by directly addressing the command libraries of the positioning stages software (no machine code conversion). Structures of any geometry can be fabricated directly from CAD file. There are no limitations for object shape or direct writing geometry, except those limited by obvious laws of physics.
Services
Laser system software SCA
3.4. Multiphoton Polymerization Technology
Main Applications: Microoptics Photonic crystals Regenerative medicine 38
More information at http://www.wophotonics.com/applications/
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Scaffolds for tissue engineering.The last picture shows that artificial scaffold ambient is suitable for cell proliferation, because there is a cell growing in mitosis stage. *13
Services
Application in Micro Optics Many polymers are transparent to visible light and can be combined with other materials like Zn or Ge. The ability to control light flow can be used in micro optical devices, such as micro lenses, hybrid micro lenses with a phase gratings, micro lens arrays, vortex beam screw generators, vortex generator arrays or other. The MPP technology allows fixing of such micro optical devices on limited surfaces like the tip of an optical fiber. *6
*14
*15
6.44 μm 10 μm
15 μm
1.32 μm
20 μm
20 μm
*16
*7
Services
3.5. MPP Samples
*17
27 μm
*18
3.5 μm
*9
1 μm
Technology
*12
27 μm
*19
30 μm
50 μm
Highly repeatable and stable technological process aims at fabrication of detractive gratings and photonic crystals.
*20
mitosis
5 μm
Biocompatibility and biodegradability have been tested in vivo and in vitro. Histological tests show that sol-gel material is more biocompatible than a surgical suture or surgical clip. *21 suture
SZ2080 300 μm
10 μm
5 μm
Application in Regenerative Medicine
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100 μm
*10
Application in Photonics
*11
36 μm
Regenerative medicine is the most promising application field for MPP technology, because polymerization can offer variety of custom elements which need controllable precision, biocompatibility or biodegradability. Polymeric scaffolds for stem cells growth can be fabricated in any 3D shape for application in tissue engineering.
Technology
Products
Scan direction
*8
20 μm
Products
3.2 μm 20 μm
If you are interested in Multiphoton Poymerization technological platform do not hesitate to contact us.
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* Illustration Reference
1, 3. Mangirdas Malinauskas, Arune Gaidukeviciute, Vytautas Purlys, Albertas Zukauskas “Direct laser writing of microoptical structures using a Ge-containing hybrid material” Metamaterials 5 (2011) 135–140
Partners
Commercial partners Our solutions often incorporate products and know-how of Lithuanian and foreign laser companies:
2. MangirdasMalinauskas, Holger Gilbergs, Albertas Zukauskas, Vytautas Purlys, Domas Paipulas, Roaldas Gadonas, “A femtosecond laser-induced two-photonphotopolymerization technique for structuring microlenses” J. Opt. 12 (2010) 035204 (8pp)
4, 5. M. Malinauskas, V. Purlys, M. Rutkauskas, A. Gaidukeviciute, R. Gadonas “Femtosecond Visible Light Induced Two-Photon Photopolymerization For 3d Micro/Nanostructuring In Photoresists And Photopolymers” Lithuanian Journal of Physics, Vol. 50, No. 2, pp. 201–207 (2010)
6, 7. Mangirdas Malinauskas, Albertas Zukauskas, Vytautas Purlys, Kastytis Belazaras, Andrej Momot, Domas Paipulas, Roaldas Gadonas, Algis Piskarskas, “Femtosecond laser polymerization of hybrid/integrated micro-optical elements and their characterization” J. 2010 J. Opt. 12 124010
8, 9, 10. Etienne Brasselet, Mangirdas Malinauskas, Albertas Zukauskas,Saulius Juodkazis Photo-polymerized microscopic vortex beam generators : precise delivery of optical orbital angular momentum Appl. Phys. Lett. 97, 211108 (2010); doi:10.1063/1.3517519
11, 12. Mangirdas Malinauskas, Holger Gilbergs, Vytautas Purlys, Albertas Žukauskas, Marius Rutkauskas and Roaldas Gadonas, “Femtosecond laser-induced two-photon photopolymerization for structuring of micro-optical and photonic devices” Proc. of SPIE Vol. 7366 736622-1 (2009)
13, 14, 15, 16. M. Malinauskas, P. Danilevicius, D. Baltriukiene, M. Rutkauskas, A. Žukauskas, Ž. Kairyte, G. Bickauskaite, V. Purlys, D. Paipulas,V. Bukelskiene, R. Gadonas “3d Artificial Polymeric Scaffolds For Stem Cell Growth Fabricated By Femtosecond Laser” Lithuanian Journal of Physics, Vol. 50, No. 1, pp. 75–82 (2010)
Elas
Academic partners The company strives to bring new inventions from academia into market. Therefore, we invest time and effort into building mutually beneficial academic partnerships: Vilnius University, Lithuania: micromachining research and applications . Kaunas University of Technology, Lithuania: coatings, lithography and microfabrication. Swinburne University of Technology, Australia: SERS sensors for Raman spectroscopy development. University of Southampton, United Kingdom: development of special optics. University of Insubria, Italy: femtosecond micromachining using non-Gaussian beams. Tampere University of Technology, Finland: joint development of OPSL yellow laser.
17, 18, 19, 20. M. Malinauskas, P. Danilevicius1, A.Zukauskas1, G. Bickauskaite,V. Purlys, M. Rutkauskas, T. Gertus, D. Paipulas1, J. Matukaite, A. Kraniauskas, R. Sirmenis, D. Baltriukiene, V. Bukelskiene, R. Gadonas, V. Sirvydis, A. Piskarskas “Laser 3D Micro/Nanofabrication of Polymers for Tissue Engineering Applications” Latvian Journal Of Physics And Technical Sciences 2011, Nr. 2
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21. M. Malinauskas,P. Danilevicius, A. Zukauskas, D. Paipulas, V. Purlys, R. Gadonas, A. Piskarskas D. Baltriukiene, R. Jarasiene, V. Bukelskiene, A. Kraniauskas, R.Sirmenis, V. Sirvydis. “Biocompatibility of polymers and laser-fabricated three-dimensional microstructured polymeric scaffolds for biomedical applications” Submitted for “Engineering in Life Sciences” journal October 11, 2010
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Participation in Exhibitions
13-16 May 2013 Munich, Germany Stand B1.553
Altechna R&D
Mokslinink킬 st. 6A 08412 Vilnius, Lithuania
tel. +370 5 272 57 38 fax +370 5 272 37 04
info@wophotonics.com www.wophotonics.com