2019 Annual Meeting Plenary & Keynotes Announced! Award of Technical Session and Organizers: Materials and Interfaces for Soft Technology Excellence Honoree 2019 Program Chairs Al Crosby, University of Massachusetts
Plenary Speakers James Hedrick, IBM Almaden Mark Nichols, The Ford Company Metin Sitti, Max Planck Institute for Intelligent Systems
Keynote Speakers Maria French, PPG Industries, Inc. Douglas Holmes, Boston University Jianyu Li, McGill Univeristy Steve Lustig, Northeastern University Carmel Majidi, Carnegie Mellon University Saleema Noormohammad, National Research Council Canada Brent Opell, Virginia Tech Pavana Prabhakar, University of Wisconsin Ted Randolph, University of Colorado, Boulder Michael Sutton, University of South Carolina Hank Sanftleben, Aptiv
Nick Shephard, Dow Chemical Company Chris Wohl, NASA Langley Research Center
Michael Bartlett, Iowa State University Edwin Chan, National Institute of Standards & Technology
Additive Manufacturing
Natural Phenomena: Adhesion Prevention of Ice, Insects, Dust, and Bio-fouling
Erich Bain, US Army Research Laboratory Amy Peterson, Worcester Polytechnic Institute, USA Jon Seppala, National Institute of Standards & Technology Michael Bortner, Virginia Tech
Antifouling
DEADLINE EXTENDED –
Novel Chemistry
Bioadhesive Chemistry
Tim Long, Virginia Tech Nick Shephard, Dow Chemical Company Chris Wohl, NASA Langley Research Center
Biomedical Adhesives
Chelsea Davis, Purdue University Aaron Forster, National Institute of Standards & Technology
Hadi Ghasemi, University of Houston Niels Holten-Andersen, MIT Jonathan Wilker, Purdue University
Novel Tools & Methods for Characterization
Kolbe Ahn, University of Central Florida Yuhan Lee, Harvard University Rupak Rajachar, Michigan Technological University
Organismal Adhesion
Dynamic Response and Fracture of Materials
Physical Properties of Bioadhesives
Erich Bain, US Army Research Laboratory Al Crosby, University of Massachusetts Aaron Forster, National Institute of Standards & Technology Shelby Hutchens, University of Illinois at Urbana-Champaign Joe Lenhart, US Army Research Laboratory
Elasticity and Capillarity in Adhesion Jonathan Pham, University of Kentucky
Fracture Mechanics
Lars Heepe, University of Kiel Alyssa Stark, Villanova University Sandy Chen, University of California, Santa Barbara Lars Heepe, University of Kiel Boxin Zhao, University of Waterloo
Soft Robotic Adhesion
Burak Aksak, Texas Tech University Dan Sameoto, University of Alberta
Structural Adhesives/Composites
Chenglin Wu, Missouri University of Science and Technology
Declan Carolan, FAC Technology Alex Ferguson, FAC Technology
Gels and PSAs
Surface Preparation
Interfaces in Pharmaceutical Sciences
Transportation
Daniel King, Hokkaido University Adrian Defante, National Institute of Standards & Technology Kristoffer Hanser, Coloplast
Lessons Learned from the Field
Nick Shephard, Dow Chemical Company
Call for Short Abstract SubmissionS
Hossein Sojoudi, University of Toledo Chris Wohl, NASA Langley Research Center
Frank Palmieri, NASA-LARC Kar Tean Tan, PPG Coating Innovation
Viscoelasticity and Rheology
Amy Peterson, Worcester Polytechnic Institute Grace Wan, Dow Chemical Company
We strongly encourage you to submit an abstract for the 2019 Annual Meeting being held February 17-20, 2019 at the Sonesta Resort Hotel. You can submit an abstract at www.adhesionsociety.org. EXTENDED ABSTRACT: If your abstract is accepted, you are required to submit an Extended Abstract due by December 14, 2018. The template for the extended abstract is located on the web at www.adhesionsociety.org/abstracts. If you have any questions or concerns, please contact Malinda Armstrong at Adhesionsociety@ascouncil.org.
Abstract Deadline is October 5, 2018 Peebles & Poster Awards – see website for submission and qualifications.
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