International Conference on Advances & Challenges in Interdisciplinary Engineering and Management
78
International Conference on Advances & Challenges in Interdisciplinary Engineering and Management 2017 [ICACIEM 2017]
ISBN Website Received Article ID
978-81-933235-1-9 icaciem.org 10 – January – 2017 ICACIEM155
VOL eMail Accepted eAID
01 icaciem@asdf.res.in 28 - January – 2017 ICACIEM.2017.155
An Ultra-Low Power Microprocessor Based Wireless ECG 1,2,3,4,5,6
Arthi P1, Kalaivani K2, Madhubala V3, Punitha S4, Nivethini G5, Umamaheswari M6 UG Scholars, Department of ECE, Vidyaa Vikas College of Engineering and Technology, Tiruchengode, India
Abstract: This paper presents the design of a fully integrated electrocardiogram (ECG) signal processor (ESP) for the prediction of ventricular arrhythmia using a unique set of ECG features and a naive Bayes classifier. Real-time and adaptive techniques for the detection and the delineation of the P-QRS-T waves were investigated to extract the fiducially points. Those techniques are robust to any variations in the ECG signal with high sensitivity and precision. Two databases of the heart signal recordings from the MIT Physic Net and the American Heart Association were used as a validation set to evaluate the performance of the processor. Based on application-specified integrated circuit (ASIC) simulation results, the overall classification accuracy was found to be 86% on the out-of-sample validation data with 3-s window size. The proposed architecture of this paper analysis the logic size, area and power consumption using Xilinx 14.2.
ISBN Website Received Article ID
978-81-933235-1-9 icaciem.org 10 – January – 2017 ICACIEM156
VOL eMail Accepted eAID
01 icaciem@asdf.res.in 28 - January – 2017 ICACIEM.2017.156
Heat Transfer Enhancement Analysis of Micro Channel Vetrichelvan G1 Associate Professor, Department of Mechanical Engineering, Vidyaa Vikas College of Engineering and Technology, Tiruchengode, India 1
Abstract: In our research work it’s considered Due to the high performance of electronics components, Heat Dissipation becomes a significant issue for stable operation of components. Micro channels provide very high heat transfer coefficients because of their small diameters. In this study, two dimensional fluid flow and heat transfer in a rectangular micro channel heat sink are analysed using FLUENT as solver with water as cooling fluid. With strong literature study it is found that down to 50 μm of hydraulic diameter, macro scale model can be applicable. Three channels of height 50 μm, 100 μm and 150 me are considered. The study is mainly focused on Nussle Number and height effects on micro channel thermal performance. The highest temperature is encountered at the heated surface of the heat sink immediately above the channel outlet.
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