Bisinfotech Magazine April Issue 2020

APRIL 2020 80.00

R.N.I. No: DELENG/2019/77352 l VOL 2 l ISSUE 04 l TOTAL PAGES 60 l PUBLISHED ON 1ST OF EVERY MONTH |WWW.BISINFOTECH.COM

Raspberry Pi Tips Bioelectrical Impedance Analysis Tomorrow’s Vehicles

CONFORMAL COATINGS FOR AUTOMOTIVE INDUSTRY

Crowbar Protection Thyristors POWER SEMICONDUCTOR MODULE FOR HEVs Industrial Automation SEI SAUR ENERGY INTERNATIONAL

Publishing Group

Editorial New Methods to Combat New Disruptions Coronavirus (also known as COVID-19) has become a global concern as the disease continues to spread. Without a vaccine to combat it, and research not able to keep up in wake of the continued rates of infection, this pandemic is one that many rightly fear. Doctors are still finding ways to confront these outbreaks, and many have turned towards technology to help.

Several major efforts have started, with teams in Korea, India, China, North America, and elsewhere all utilizing AI testing and other methods to combat the virus as well as better understand how it might spread. While there are skeptic of these methods and technologies, their proponents advocate that the help they provide will be invaluable in preventing further spread of the disease and may help prevent future outbreaks of this and other diseases..

Predicting the Spread

One of the greatest things that can be done when trying to prevent a disease from spreading is understanding just how it will do so. While this may seem like common sense, understanding diseases and their transmission can be unpredictable, especially with new ones like Coronavirus.

Finding the cure

While there has been a lot of investment in the tracking and prevention, companies have been more interested in trying to find potential ways to combat the virus outright.

In controlled trials, the AI used a list of existing anti-viral drugs to see if there are existing means that are effective in combating the disease. The technology used has allowed for teams across the world to share their findings and work together to find these drugs that may lead to further discoveries that could contain and even work to vaccinate against the virus. These discoveries would not have been possible without the advancements in technology that have become available, and are maintained for doctors and other medical professionals to utilized.

Impact on the electronics industry

Electronics equipment manufacturers expect at least a fiveweek product shipment delay from suppliers due to the

CONSULTANT EDITOR NILOY BANERJEE niloy@bisinfotech.com SUB EDITOR NITISHA DUBEY nitisha@bisinfotech.com MARKETING MANAGER ARNAB SABHAPANDIT arnab@bisinfotech.com DESIGN HEAD DEEPAK SHARMA

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WEB DEVELOPMENT MANAGER JITENDER KUMAR WEB PRODUCTION BALVINDER SINGH SUBSCRIPTIONS PRIYANKA BHANDARI priyanka@bisinfotech.com MANAGER FINANCE KULDEEP GUSAIN accounts@bisinfotech.com

coronavirus epidemic. Shipping delays from China and other countries where the virus has spread are already having negative impacts on manufacturers. More than 50 percent of manufacturers report their suppliers expect, on average, a three-week delay. However, electronics manufacturers expect delays to be longer than what their suppliers are currently quoting. On average, executives expect shipment delays to be at least five weeks.

Global economy Impact

COVID-19 has already caused many knock-on effects for the global economy. From lengthy manufacturing time frames to fewer sales, there is global fear of the economy slowing down to a halt. Coronavirus could cost world $1 trillion. The worrying prospect that the Covid-19 outbreak could become the first truly disruptive pandemic of the globalisation era is renewing doubts over the stability of the world economy.

But this will pass but not before teaching us many lessons.

ManasNandi

MANAS NANDI EDITOR manas@bisinfotech.com

Bisinfotech is printed, published, edited and owned by Manas Nandi and published from 303, 2nd floor, Neelkanth Palace, Plot No- 190, Sant Nagar,East of Kailash, New Delhi- 110065 (INDIA), Printed at Swastika Creation 19 DSIDC Shed, Scheme No. 3, Okhla Industrial Area, Phase-II, New Delhi- 110020 Editor, Publisher, Printer and Owner make every effort to ensure high quality and accuracy of the content published. However he cannot accept any responsibility for any effects from errors or omissions.

The views expressed in this publication are not necessarily those of the Editor and publisher. The information in the content and advertisement published in the magazine are just for reference of the readers. However, readers are cautioned to make inquiries and take their decision on purchase or investment after consulting experts on the subject. BisInfotech holds no responsibility for any decision taken by readers on the basis of the information provided herein. Any unauthorised reproduction of Bisinfotech magazine content is strictly forbidden. Subject to Delhi Jurisdiction.

Contents 36 Wireless Power Solutions

12 raspberry-Pi

ADI HAS DECADE+ YEARS OF EXPERIENCE DEVELOPING HV ELECTRONICS AND DELIVER QUALITY AND RELIABLE PRODUCTS

ESSENTIAL Pi. TOP TIPS TO HELP YOU GET THE MOST OUT OF YOUR RASPBERRY Pi

56 5G- 5G WILL BE A GAME CHANGER FOR

16 AUTOMOTIVE - TOMORROW’S VEHICLES

TELECOM OPERATORS: OUR PREDICTIONS FOR 2020

20 EV- POWERING THE FUTURE OF ELECTRIC VEHICLES

WILL HAVE EVEN MORE TECHNOLOGY

24 CONFORMAL COATINGS - CONFORMAL COATINGS THAT MEET THE DEMANDS OF THE AUTOMOTIVE INDUSTRY

28 INDUSTRIAL AUTOMATION-

31 SYSTEM ON MODULES - TORADEX

INDUSTRIAL AUTOMATION – THE EXPERTS EXPLAIN!

32 INDUSTRIAL AUTOMATION- THE CO-

EXISTENCE OF MAN AND THE MACHINE IS NOT A NEW CONCEPT NETWORKS

LAUNCHES VERDIN FEATURING NXP I.MX 8M MINI/NANO INTRODUCING A NEW FAMILY OF SYSTEM ON MODULES THAT SIMPLIFY MODERN PRODUCT DEVELOPMENT

34 ELEKTROBIT- IOT IN AUTOMOTIVE

38 CROWBAR PROTECTION THYRISTORS -

41 EV- BOOST FOR ELECTRIC VEHICLE MARKET

AVOIDING FIELD FAILURES WITH CROWBAR PROTECTION THYRISTORS

42 POWER - HIGH-PERFORMANCE ZVS BUCK REGULATOR REMOVES BARRIERS TO INCREASED POWER THROUGHPUT IN WIDE‑INPUT-RANGE POINT-OF-LOAD APPLICATIONS

AS MITSUBISHI ELECTRIC INTRODUCES NEW POWER SEMI CONDUCTOR MODULE FOR MOTOR DRIVE APPLICATIONS IN HYBRID VEHICLES AND EVS

48 INDUSTRY KART- ARROW PARTNERS WITH XUNZEL

08 IBIOELECTRICAL IMPEDANCE ANALYSIS- BIOELECTRICAL IMPEDANCE

47AUTOMOTIVE MARKET- AUTOMOTIVE ELECTRONICS MARKET $615.3 BN BY 2030

50 WIRELESS POWER SOLUTIONS INFINEON NEW 600 V COOLMOS PFD7 SERIES

52 INDUSTRY UPDATES- TELEDYNE E2V SUPPLIES CCD DETECTORS

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ANALYSIS IN MONITORING OF THE CLINICAL STATUS AND DIAGNOSIS OF DISEASES

55 T&M- R&S NEW TEST SOLUTIONS FOR 5G BASE STATIONS

57 POLICY- CABINET NEW SCHEMES TO ‘MAKE IN INDIA’ ELECTRONICS MANUFACTURING – 3 KEY POINTS

Bioelectrical Impedance Analysis

Bioelectrical Impedance Analysis in Monitoring of the Clinical Status and Diagnosis of Diseases

Cosimo Carriero, Field Applications Engineer Analog Devices

The electrical properties of biological tissues are classified as active or passive depending on the source of electricity.

We talk about active response when biological tissues generate electricity due to the ions inside the cells. These electrical signals are referred to as biopotentials and the best known examples can be found in electrocardiography and electroencephalography. The response is passive when the biological tissue responds to an external electrical stimulus, like a current or a voltage generator. In this case, we are dealing with a bioimpedance.

Bioelectrical Impedance Analysis Bioelectrical impedance analysis is a low cost, noninvasive technique for measuring the composition of the human body and evaluating clinical conditions. Biological impedance is a complex quantity composed of a resistive value R (real part), mainly due to the total value of water in the body, and a reactive value Xc (imaginary part), mainly due to the capacitance created by the cell membrane. The impedance can also be represented as a vector, with module | Z | and phase angle φ. The phase angle plays a fundamental role in determining the composition of the body.

distance, and surface area), which means they are linked to the adopted measurement system, and physical parameters; that is, the resistivity ρ and the dielectric constant ε, which are closely related to the type of material (in this case, the biological tissue) to be measured. Figure 1 shows a simplified electrical model of bioimpedance and of the instrument used to measure it. RE takes into account the resistance of extracellular fluids, RI symbolizes the resistance of intracellular fluids, and Cm is the capacitance of the cell membrane.

The connection between the instrument and the human body occurs through electrodes applied to the skin. The instrument supplies the excitation voltage to the electrodes and measure the current produced. The excitation signal is generated by means of a digital-to-analog converter (DAC) connected to a downstream driver; the DAC is programmed by a microcontroller to enable the setting of the amplitude and the frequency of the signal. For the current measurement, a transimpedance amplifier (TIA) is used, connected to a high resolution analog-to-digital converter (ADC) for precise measurements. The acquired data are processed by the system microcontroller, which extracts the information required for the analysis.

(1)

(2)

(3) The resistance R of a conductor of cross-sectional area S Figure 1. Block diagram of the bioimpedance measurement system. and length l and the capacitance C of a flat parallel plate capacitor with surface area S at distance d are given by the For bioimpedance measurements, the human body is divided into five segments: the two upper limbs, the two lower limbs, following equations: and the torso. This distinction is important for understanding (4) the measurement method used. The most common are handto-foot, foot-to-foot, and hand-to-hand.

(5)

As can be seen from Equation 4 and Equation 5, resistance and capacitance depend on geometrical parameters (length,

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There are multiple factors to be taken into account during a bioelectrical impedance analysis (BIA) test, including anthropometric parameters; that is, height, weight, thickness of the skin, and build. Other factors are sex, age, ethnic group, and—not least—the patient’s state of health; that is, any malnutrition or dehydration. If these factors are not taken into consideration, the test results could be distorted. The

interpretation of the measurements is based on statistical data and equations that take these various factors into account.

Composition of the Human Body When studying body composition, we refer to the threecompartment model, which includes the following: • Fat mass • Cell mass • Extracellular mass Figure 2 illustrates these concepts starting from the well-known terms of lean mass (fat-free mass) and fat mass of the twocompartment model. The fat mass has two components, the essential fat and the storage fat. The lean mass is divided into the body cell mass, composed of protein mass and intracellular water, and the extracellular mass, which in turn includes extracellular water and bone mass. A final parameter, fundamental to establishing the degree of hydration, is the total body water given by the sum of the intracellular and extracellular water.

From an electrical point of view, intracellular and extracellular electrolytic solutions behave like good conductors, whereas fat and bone tissue are poor conductors.

Figure 2. Composition of the human body.

Bioimpedance Measurement Techniques The most widespread techniques for the measurement of bioimpedance differ in the use of the frequency of the excitation signal. The simplest instruments are based on measurements at a fixed frequency (single-frequency bioelectrical impedance analysis, or SF-BIA), some adopt a system with multiple frequencies (multifrequency bioelectrical impedance analysis, or MF-BIA), and the most sophisticated instruments perform real spectroscopy over a range of frequencies (bioimpedance spectroscopy, or BIS). There are also different techniques for the evaluation of the results, of which bioelectrical impedance vector analysis and real-time analysis are the most important.

In SF-BIA instruments, the current injected into the human body has a frequency of 50 kHz; the operation is based on the inversely proportional relationship between the measured impedance and the total body water (TBW)—the conductive part of the impedance–composed in turn of intracellular water (ICW) and extracellular water (ECW). This technique

provides good results in subjects in normal hydration conditions, whereas it loses its validity in subjects with strongly altered hydration, above all due to a limited capacity to evaluate the variations in the ICW. The MF-BIA technique overcomes the limitations of SF-BIA by performing the measurement at low and high frequencies.

The low frequency measurement allows for a more accurate estimate of the ECW, whereas at the high frequency, an estimate of the TBW is obtained. The ICW is given by the difference between the two estimates. However, this technique is also not perfect and shows limitations in the estimation of body fluids in the elderly population affected by disease.

Finally, the BIS is based on the measurement of impedance at zero frequency, which, according to the model of Figure 1, is the resistance RE due to the extracellular fluids, and at infinite frequency, which is the parallel of RE with RI. At these two frequency extremes, the capacitance due to the cell membrane behaves like an open circuit or a short circuit.

Intermediate frequency measurements provide information related to the capacitance value. BIS provides more detailed information than other techniques do, but, in this case, the measurement takes longer time.

Bioimpedance vector analysis (bioelectrical impedance vector analysis, or BIVA) is a human health assessment technique based on the absolute measurement of bioimpedance. It uses a graph that shows a vector representation of the impedance in which the value of the resistance is shown on the abscissa and the value of the capacitive reactance on the ordinate, both values being normalized with respect to the patient’s height. The method is based on the formulation of three tolerance ellipses: 50%, 75%, and 95%. The tolerance ellipse of 50% defines the population with average body composition.

Moving along the horizontal axis of the ellipse, individuals with a low percentage of lean mass are identified on the right and vice versa; that is, those with a high percentage of lean mass are identified on the left. Moving along the vertical axis identifies the level of hydration, with levels below the norm towards the top of the ellipses and levels above the norm in the lower part.

Figure 3.

Bioelectrical impedance vector—analysis tolerance ellipses.

The observation of fluctuations in the components of the human body—for example, the deviation from the normal values of the lean body mass, the fat mass, and the total body water–are key factors for establishing the state of health of the patient. A significant loss of lean mass and an imbalance of body fluids are the BISINFOTECH •Vol - 2/04 •April 2020

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Bioelectrical Impedance Analysis main parameters used for the diagnosis of diseases. Today, bioelectrical impedance analysis is used as an aid in the diagnosis of diseases of the following systems of the human body: 1. Pulmonary system • Lung cancer • Pulmonary edema 2. Cardiovascular system • Accumulation of fluids after surgery 3. Circulatory system • Intravascular volume • Hyponatremia • Hydration 4. Renal system • Hemodialysis • Evaluation of dry weight 5. Nervous system • Alzheimer’s disease • Anorexia nervosa 6. Muscular system • Evolution of body composition during training 7. Immune system • Evaluations in HIV-infected patients • Evaluations in cancer patients • Dengue fever

impedance measurement of the human body with a fourwire configuration. For this type of measurement, the high frequency loop is used; a programmable ac voltage generator provides the excitation signal. A second generator supplies the common-mode voltage—useful for a correct measurement.

The current resulting from the impedance of the human body is measured by the transimpedance amplifier and converted with the 16-bit ADC. The system is able to measure up to a frequency of 200 kHz and provides a signal-to-noise ratio (SNR) of 100 dB at 50 kHz. The digital data are sent to a hardware accelerator for extraction of the quantities of interest; that is, the real part and the imaginary part of the impedance.

As a medical device, the bioimpedance analyzer must comply with the IEC 60601 standard. This standard sets limits for the voltages and currents that can be applied to the human body. For this reason, a resistance, Rlimit, has been provided to limit the maximum current and four coupling capacitors, CisoX, to prevent a dc component from being applied to the human body.

AD5940, a Flexible and High Precision Analog Front End Analog Devices has a broad portfolio of products for impedance analysis, including devices such as the ADuCM35x, a highly integrated system on chip (SoC) designed specifically for impedance spectroscopy. Recently announced to the market, the AD5940 is a high precision, low power consumption analog front end, ideal for portable applications. Designed for the Figure 4. Four-wire connection of the AD5940 for bioelectrical impedmeasurement of bioimpedance and skin conductivity, the ance analysis.

AD5940 is composed of two excitation loops and a common Conclusion measurement channel. The first excitation loop is able to Bioimpedance measurement is a versatile, fast, noninvasive, generate signals with a maximum frequency of 200 Hz and and low cost tool for assessing the composition of the human can be configured as a potentiostat for the measurement of body and diagnosing certain types of diseases. Current electrochemical cells of different types. The basic components technology, thanks to the use of devices such as the AD5940, are a dual-output DAC, a precision amplifier that provides enables the realization of compact, high performance, low the excitation signal, and a transimpedance amplifier for power consumption bioimpedance analyzers that can be current measurement. Working at a low frequency, this loop battery powered. The features of integration, small form consumes low power and is therefore also referred to as the factor, and low power consumption of the AD5940 also make low power loop. The second loop has a similar configuration it particularly suitable for wearable applications. but is able to work with signals up to 200 kHz, for which reason it is called the high speed loop. The device is equipped with an About the Author acquisition channel with a 16-bit, 800 kSPS SAR-type ADC and Cosimo Carriero joined Analog Devices in 2006 as a field an analog signal processing chain upstream of the converter, applications engineer, providing technical support to strategic which includes a buffer, a programmable gain amplifier and key accounts. He holds a Master’s of Science in physics (PGA), and a programmable antialiasing filter. To complete from Università degli Studi of Milan, Italy. Past experiences the architecture, there is a switching matrix mux that allows a include INFN, the Italian Institute for Nuclear Physics, defining multiplicity of signals coming from multiple internal or external and developing instrumentation for nuclear physics experiments, sources to the device to be connected to the ADC. In this collaborating with small companies, developing sensors and way, in addition to the primary impedance measurement systems for factory automation, and as a senior design engineer function, accurate system diagnostics can be performed to for satellite power management systems at Thales Alenia Space. He can be reached at cosimo.carriero@analog.com. verify the full functionality of the instrument.

Figure 4 shows the connection of the AD5940 for the absolute

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Raspberry Pi

Essential Pi. Top tips to help you get the most out of your Raspberry Pi

By Cabe Atwell, element14 community contributor February of 2020 marked the eighth birthday of the initial may keep your Raspberry Pi from resetting when you start release of the Raspberry Pi 1 Model B. While the Pi is far from adding accessories and external circuitry. Even if that giant the first single board computer, none have enjoyed the same breadboarded circuit you cobbled together doesn’t cause a widespread success. Alternatives to the Raspberry Pi may reset or a lock up condition, you may inadvertently hurt your have faster CPU speeds, more IO, or specialized on-board Raspberry Pi’s performance. You might even corrupt the SD peripherals, and they have their place, but none of them card. If the supply voltage dips, the GPU in the Raspberry Pi have that “just right” combination of price, support, power, will throttle the CPU speed down. Incidentally, overheating and features. Over 15 million have been sold by Farnell, alone. may also cause the GPU unit to throttle down the CPU speed.

This writer has been using and following the evolution of the While the Raspberry Pi 4 requires a minimum of 2.5A, the Raspberry Pi since its release. I watched as it transitioned official power supply has a 3A output. The extra 500mA is from a tool for students and hobbyists to a viable option for good insurance against throttling, resets, and lock ups. certain types of engineering projects. If you’re considering Storage the Raspberry Pi because you are curious about electronics You may have noticed that and coding, or even if you are a practicing engineer, just Raspberry Pis have no provisions go for it. The size of the community and the sheer number of for a hard drive; this limitation publically available forums tutorials and projects means than is actually pretty easy to you will be in good company as you explore and experiment. overcome. You can connect As “just right” as the Raspberry Pi may be, unfortunately popularity to an NAS unit via the Ethernet doesn’t always equal perfection. It has its eccentricities and port or WiFi, or you can connect idiosyncrasies like anything else. But that’s okay; the following an external drive via one of the tips are going to help you overcome some of the vulnerabilities USB ports. And, by the way, and limitations of the Raspberry Pi. connecting external storage isn’t just a novelty; it’s insurance.

A word on power supplies As you experiment with the The Raspberry Pi does not come with an on-board power supply; Raspberry Pi, inevitably you will corrupt your SD card. Get you will have to provide one. As a rule of thumb, consider into the practice of storing anything important absolutely a higher mA rating than necessary. The additional capacity anywhere but the SD card.

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A USB to SATA adaptor is a fast and cheap way to give your Raspberry Pi a hard drive.

Raspberry Pis cannot tell time by themselves, and other matters There are no iterations of the Raspberry Pi that come with a real-time clock (RTC) or analog-to-digital converter (ADC).

Also, the GPIO pins on a Raspberry Pi operate at 3.3VDC, whereas most accessories you might want to use operate at 5VDC. Fortunately, RTC, ADC, and 3.3V to 5V converter modules are inexpensive and easily obtained devices. Also, if your time telling requirements are not terribly stringent, then you can simply set up the Pi to check the time via a WiFi, Ethernet, or Bluetooth connection.

personally witnessed many a Raspberry Pi reset or lock up just by being situated too close to a solenoid valve or a beefy relay. To avoid these side effects, and the possibly permanent damage that comes with them, always isolate your Raspberry Pi from inductive loads with a Pi HAT (hardware attached on top, a hardware specification made for Raspberry Pi) designed for this purpose, or an opto-isolator. Also, as a general rule, avoid powering inductive loads from a Raspberry Pis power supply. Roughly speaking, the amount of trouble an inductor will give you will be proportional to its physical size. In some cases, you may find that you will need quite a bit of physical separation between the Raspberry Pi and inductor. In cases where this separation isn’t an option, consider employing a snubbing circuit of some sort, like a diode in parallel with the relay coil or an RC snubber on a DC motor.

Judicious use of a Pi HAT like this “Relay Plate” will prevent damage to your Raspberry Pi.

An RTC module like this 4D Systems RPI-RTC fits directly onto the Raspberry Pi header.

Raspberry Pis do not have a reset button Unlike a machine running Windows, when something goes awry, a Raspberry Pi user will not have the option of Ctrl+Alt+Delete to bring it out of a halted state. Inevitably, during the course of experimentation, you will lock up your Raspberry Pi. Usually this isn’t a big deal, and you have a few ways of dealing with it.

For one, you can power cycle your Raspberry Pi by unplugging the power supply from it. This can get pretty tedious, though!

Switching Inductive Loads Raspberry Pis (and digital electronics in general) are susceptible to the electromagnetic interference (EMI) and back electromotive force (EMF) that come from switching inductive loads. Examples of these interference culprits include solenoid valves, relays, contactors, motors, and more. This author has

A better option is to get a power cable with an integrated On/Off switch, or make or purchase a USB pass-thru board with a switch on it. If you have a Raspberry Pi 4, another option is to reset the Raspberry Pis SoC by connecting the Global_ EN pin to a ground.

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Raspberry Pi A USB extension cord with inline On/Off switch takes a lot of the frustration out of repeatedly power cycling the Raspberry Pi.

One way to accelerate this process is to purchase a copy of Jan Bodnar’s Tkinter programming e-book. In the book Jan, has already done much of the research for you Trouble shooting If you are having boot or software issues, check the green light on the Raspberry Pi. If it’s blinking, then the Raspberry Pi is working. If the LED is OFF or on without blinking, check your SD card, as it may not be seated correctly in its slot. If that isn’t the issue, then the SD card data may be corrupted and you may have to remount the OS. Make sure the mouse and keyboard are plugged into the Raspberry Pi before you turn it on. If you don’t, the Raspberry Pi will not detect them on startup. This is also true for HDMI displays. Try to make sure that the display is powered on before powering up the Raspberry Pi. At one point, I witnessed a monitor that initialized slower than the Raspberry Pi. When I applied power to the Raspberry Pi and this particular monitor at the same time, the Raspberry Pi never detected it; the monitor had to be “ON” before the Raspberry Pi started up.

The Global_EN pin can be found on header J2.

The humble LED At a glance, this tip is going to seem so simple that it isn’t worth mentioning. However, the path to success is traversed with a series of steps, and if you choose to apply this tip you will be taking a deceptively large step toward your goal. This tip may have been ever so slightly overhyped, so let’s just get to it!

When writing code, specifically code that controls the hardware on the Raspberry Pi, start by blinking an LED. It doesn’t matter if you are attempting to control the GPIO pins on the Raspberry Pi itself, or some aspect of a Pi HAT or accessory board. When you can blink an LED at exactly the rate you want, then you have begun to exert a measure of control over that hardware. Blinking an LED is the “Hello World” of hardware programming.

LEDs can also be used as a kind of physical breakpoint in your code, by setting one up to blink or activate when a program hits certain points or thresholds. This isn’t always possible due to the nature of a project, but when circumstances allow it, an LED is a dead simple diagnostic tool.

Creative graphics Python is the preferred programming language for the Raspberry Pi, and shortly after you start writing Python code you’re going to want to make your own custom GUIs. TkInter is the de-facto GUI package for Python, as stated right at the top of its Wiki page. Unfortunately, Tkinter isn’t documented very well in any one place. To really get to know it, you will have to spend a lot of time combing the internet and pooling information from multiple sources. TkInter can be a little overwhelming/frustrating for newer users. If you want to give yourself a break, or you find you don’t need many of the features of TkInter, take a look at Guizero, a library for Python 3. It is perhaps the fastest and easiest way to make a GUI in Python: About – Guizero

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If you just can’t get your peripherals to work, check the verified peripherals list on the elinux.org site.

Speaking of peripherals, if the characters showing up on screen do not match with the key you’ve pressed, then you probably are not using the default UK layout keyboard. You can change this from the Raspbian desktop by opening the main menu, going to Preferences, then clicking Raspberry Pi Configuration. Click the Localization tab, and then click the Set Keyboard option.

Alternatively, you can make the change from the command line. If you are running Raspbian Lite, this is the only way to change the keyboard layout. Run the command sudo raspiconfig, select “Localisation Options,” then “Change Keyboard Layout,” and finally select the model of keyboard you are using. Typically this will be “Generic 105-key PC (intl.).” You will then be prompted to select your keyboard layout.

If you are unable to gain access to the Raspberry Pi via an SSH (Secure Shell) session, then you probably have to activate SSH communication. On the Raspbian desktop, click the Preferences option and then the Configure Raspberry Pi option. You will be presented with a Raspberry Pi Configuration window. Click the Interfaces tab, and then choose the Enabled option to the right of the SSH: line item. If your Raspberry Pi is not connected to a monitor, then you will have to use a separate computer to create a file named SSH (with no file extension) with a text editor to the boot partition on the SD card. The addition of this file will allow you to SSH into the Raspberry Pi. element14 Community members can download the full eBook for free at https://www.element14.com/community/ community/publications/ebooks.

Automotive

Tomorrow’s Vehicles will have Even More Technology

By Rich Miron, Digi-Key Electronics In the past, electronic systems contributed as little as one percent of the total value of vehicles. Today, however, consumer demand for more technology and the increased technological capabilities available have resulted in the number of electronic control units (ECUs) required in a vehicle to skyrocket. For example, as many as 100 ECUs and up to 100 million lines of code may be required in a high-end automobile today - far more than past vehicles and proof to the importance of ECUs to the makeup of an automobile.

sensing including battery management systems, motor currents, and others. Poor accuracy in these critical applications can generally result from non-linearity, temperature drift, and shunt tolerances. These problems are solved by this design by using TI’s current shunt monitors (INA240)and signal conditioners (PGA400-Q1).

Electricity increasingly powers advanced electronics and fuels hybrid (HEV) and electric vehicles (EVs) while reducing CO2 emissions while electronic systems replace manual and motorized components. All of this ensures that the future of driving will look very different from transportation today.

Emission optimized HEVs and self-driven, zero-emission EVs will communicate within the vehicle’s systems and with city and roadway infrastructure in addition to other vehicles.

The Texas Instruments’ (TI) white paper, “Driving the Green Revolution in Transportation”, goes into further detail of the Figure 1. Texas Instruments’ TIDA-03040 Reference Design benefits of HEVs and EVs. Block Diagram for an Automotive Shunt-Based ±500 A Precision Current Sensor. (Image source: Texas Instruments) There are several major factors that are driving a surge in consumer demand for HEVs and EVs: TIDA-03050 - Automotive, mA-to-kA Range, Current Shunt Sensor • Internal combustion engine environmental regulatory pressures Reference Design: In this reference design, a busbar-type • Electric powertrain and battery technological advances shunt resistor is used to detect currents in the mA to KA range.

• Consumer expectations for features of convenience and The EV and HEV ever rising demand from their high-capacity infotainment batteries forces larger operating current spans and highly accurate current sensors to monitor demand. Accurately There is one limiting factor, the capacity limits of the traditional measuring current over three decades (mA to A, 1 A to 100 12 V lead acid battery are being pushed by the increasing A, and 100 A to 1,000 A) is quite a challenge since there is power-load requirements of these innovations. The automobile a large amount of system noise. To solve this problem, this industry has come up with a solution in order to meet this design uses a TI high-resolution analog-to-digital converter increased demand for electrification. They have developed a (ADC) and high-accuracy current shunt monitors. secondary 48 V electrical system which supplies more power TIDA-01604 - 98.6% Efficiency, 6.6-kW Totem-Pole PFC Reference than a traditional 12 V battery can produce alone. These Design for HEV/EV Onboard Charger: Silicon carbide (SiC) high voltage systems, however, require extensive isolations MOSFETs driven by a C2000 MCU with SiC-isolated gate drivers for safety and insulation control to keep drivers and their is the basis of this reference design (Figure 2). Three-phase passengers safe from electric shock along with avoiding the interleaving is implemented in this design which operates in breakdown of system safety. continuous conduction mode (CCM) with a 98.46% efficiency To help overcome these design challenges and enable a when at a 240 V input and 6.6 kW full power. Light load power safer, more efficient transportation systems, TI offers many factor is improved by phase shedding and adaptive dead-time solutions and design aids. The following is a selection of some control enabled by the C2000 MCU. The gate driver board these parts and reference designs. (see TIDA-01605 discussed next) is can deliver a 4 A source current and sink peak current of 6 A while implementing a TIDAs – Texas Instruments Reference Designs reinforced isolation and withstanding more than 100 V/ns common-mode transient immunity (CMTI). The gate driver TIDA-03040 – Automotive Shunt-Based ±500 A Precision Current board also contains a two-level turn-off circuit, protecting Sensing Reference Design: This TI shunt-based current sensor the MOSFET from voltage overshoot if a short-circuit situation reference design (Figure 1) offers a < 0.2% FSR accuracy occurs. over the operating temperature range of -40°C to +125°C. A number of automotive applications require precision current

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Figure 2. Texas Instruments’ TIDA-01604 Reference Design for a HEV/EV Onboard Charger. (Image source: Texas Instruments) TIDA-01605 - Automotive Dual Channel SiC MOSFET Gate Driver Reference Design with Two Level Turn-off Protection: This TI reference design features an automotive qualified isolated gate driver solution for driving SiC MOSFETs in a half-bridge configuration. Two push-pull bias supplies for the dual channel isolated gate driver are included in this design with each supply capable of providing +15 V and -4 V output voltages and an output power of 1 W. As noted earlier, this gate driver can deliver a 4 A source current and a 6 A sink peak current. Its reinforced isolation is capable of withstanding 8 kV Peak and 5.7 kV RMS isolation voltages and has a CMTI of >100 V/ns. Also noted earlier, this board contains a two-level turn-off circuit, protecting the MOSFET from voltage overshoot if a short-circuit situation occurs. This design features a configurable DESAT detection threshold and delay time for second stage turn-off.

For interfacing the signals of fault and reset, an ISO7721-Q1 digital isolator is used. Overall, this reference design fits on a two-layer printed-circuit board (PCB) board with a 40 × 40 mm compact form factor.

TIDA-01168 - Bidirectional DC-DC Converter Reference Design for 12-V/48-V Automotive Systems: This reference design functions as a 4-phase, bidirectional DC-DC converter development platform for 12 V/48 V automotive systems.

The system uses a TMS320F28027F MCU and two LM5170-Q1 current controllers for power stage control. The C2000 MCU provides voltage feedback while the LM5170-Q1 subsystems use average current feedback for current control. Using this control scheme eliminates phase current balancing typical for multiphase converters. LM5170-Q1 based systems allow a high level of integration, reducing PCB area, simplifying design, and accelerating development.

Products ISO7731-Q1: The ISO773x-Q1 device family are high performance, triple-channel digital isolators with 5,000 VRMS (DW package) and 3000 VRMS (DBQ package) isolation ratings per UL 1577.

This family has reinforced insulation ratings according to CQC, CSA, TUV, and VDE. These devices provide high electromagnetic immunity with low emissions at low power, while isolating CMOS or LVCMOS digital I/Os. Logic input and output buffers are separated by a silicon dioxide (SiO2) insulation barrier in each isolation channel. Device enable pins can be used to place the respective outputs in high impedance for multi-master driving applications and for reduced power consumption.

The ISO7730-Q1 device has all three channels in the same direction while the ISO7731-Q1 device has two forward and one reverse-direction channel. Upon losing either the input power or signal, the default output is low for devices with “F” suffix and high for devices without “F” suffix.

UCC21520-Q1: This device is an isolated dual-channel gate driver (Figure 3). It features a 4 A source current and 6 A sink peak current. It is designed to drive power MOSFETs, SiC MOSFETs, and IGBTs at up to 5 MHz with low propagation delay and pulse-width distortion. The input side and the two output drivers are isolated by a 5.7 kVRMS reinforced isolation barrier, with a minimum of 100 V/ns CMTI. A working voltage of up to 1500 VDC is allowed by internal functional isolation between the two secondary-side drivers. The design of this device allows every driver to be configured as either two lowside drivers, two high-side drivers, or a half-bridge driver with programmable dead time (DT). Both outputs are shut down simultaneously by a disable pin, allowing normal operation when left open or grounded. Primary-side logic failures force both outputs low as a fail-safe measure.

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Automotive

Figure 3: Functional Block Diagram of the UCC21520-Q1 isolated dual-channel gate driver from Texas Instruments. (Image source: Texas Instruments) UCC21222-Q1: This isolated dual channel gate driver with programmable dead time and wide temperature range exhibits consistent performance and robustness under extreme temperature conditions. Its 4 A peak-source and 6 A peak-sink current are designed to drive power MOSFET, IGBT, and GaN transistors. The UCC21222-Q1 has multiple configurations: two low-side drivers, two high-side drivers, or a half-bridge driver.

The 5 ns delay matching performance allows the paralleling of two outputs which doubles the drive strength for high load conditions without the risk of internal shoot-through. The two output drivers are isolated from the input side by a 3.0 kVRMS isolation barrier with a minimum of 100 V/ns CMTI. LM5170-Q1: The essential high voltage and precision elements of a dual-channel bidirectional converter for automotive 48 V and 12 V dual battery systems is enabled by the LM5170-Q1 controller. It does this by regulating the average current flowing between the high voltage and low voltage ports in the direction designated by the DIR input signal. The current regulation level is programmed through either the analog or the digital PWM inputs. Typical current accuracy of one percent is achieved by dual-channel differential current sense amplifiers and dedicated channel current monitors. The 5 A half-bridge gate drivers are capable of driving parallel MOSFET switches which can deliver 500 W or more per channel. Additionally,

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not only does the diode emulation mode of the synchronous rectifiers prevent negative currents, but it also enables discontinuous mode operation for improved efficiency with light loads. Many protection features are incorporated into the device including MOSFET failure detection, overvoltage protection at both HV and LV ports, cycle-by-cycle current limiting, and over temperature protection.

INA301-Q1: This device includes both a high common-mode, current-sensing amplifier and a high-speed comparator configured to provide overcurrent protection. It does this by measuring the voltage across a current-sensing or currentshunt resistor and comparing it to a defined threshold limit.

The INA301-Q1 features an adjustable limit-threshold range that can be set by using a single external limit-setting resistor.

This current-shunt monitor measures differential voltage signals on common-mode voltages that can vary from 0 V up to 36 V, independent of the supply voltage. The open-drain alert output has the option to be configured to operate in either a transparent mode, where the output status follows the input state, or in a latched mode, where the alert output is cleared when the latch is reset. Rapid detection of overcurrent events is enabled by a device alert response time of less than 1 Âľs.

INA240-Q1: The automotive-qualified INA240-Q1 is a voltageoutput, current-sense amplifier with enhanced PWM rejection.

It can sense drops across shunt resistors over a wide commonmode voltage range from -4 V to 80 V, independent of the supply voltage. The benefit of the negative common-mode voltage is that it allows the device to operate below ground which accommodates the flyback period of typical solenoid applications. The device’s enhanced PWM rejection provides high levels of suppression for large common-mode transients (ΔV/Δt) in systems that use PWM signals including motor drives and solenoid control systems. This feature ensures accurate current measurements without large transients and associated recovery ripple on the output voltage. The INA240-Q1 operates from a single 2.7 V to 5.5 V power supply and draws a maximum of 2.4 mA. There are currently four fixed gains available: 20 V/V, 50 V/V, 100 V/V, and 200 V/V. The device’s low offset, zero-drift architecture enables current sensing with maximum drops across the shunt as low as 10 mV full-scale. Grade 1 versions are offered in an 8-pin TSSOP and 8-pin SOIC packages and operate over the extended temperature range of –40°C to +125°C. Grade 0 versions are only offered in an 8-pin SOIC package and operate over the extended temperature range of -40°C to +150°C. AMC1305M05-Q1: This is a precision delta-sigma (ΔΣ) modulator with a capacitive double isolation barrier that is highly resistant to magnetic interference separating the output from the input circuitry (Figure 4). The isolation barrier is certified to provide reinforced isolation of up to 7,000 VPEAK according to the DIN V VDE V 0884-10, UL1577, and CSA standards. When paired with isolated power supplies, the AMC1305M05-Q1 prevents noise currents that may be present on a high common-mode voltage line from entering the local system ground and interfering with or damaging low voltage circuitry. This device, optimized for direct connection to shunt resistors or other low voltage level signal sources, supports excellent AC and DC performance.

Typically, shunt resistors sense currents in onboard chargers, traction inverters, or other such automotive applications.

With the use of an appropriate digital filter to decimate the bit stream, such as those integrated on the TMS320F2837x, the device can achieve 16-bits of resolution with a dynamic range of 85 dB (13.8 ENOB) at a data rate of 78 kSPS.

TMS320F28069M: The automotive qualified F2806x Piccolo family of MCUs include the power of the C28x core and CLA coupled with highly integrated control peripherals in low pin-count devices. These devices are code-compatible with previous C28x-based code and provide a high level of analog integration. Other features include an internal voltage regulator that allows for single-rail operation and enhancements to the HRPWM module that allow for dual-edge control (frequency modulation). Additionally, analog comparators with internal 10-bit references that can be routed directly to control the ePWM outputs have been added. The ADC, which has an interface optimized for low overhead and latency, converts from 0 to 3.3 V fixed full-scale range and supports ratio-metric VREFHI/VREFLO references.

ISO1042-Q1: This is a galvanically-isolated controller area network (CAN) transceiver device that meets the specifications of the ISO11898-2 (2016) standard. The ISO1042-Q1 offers ±70 VDC bus fault protection and a common-mode voltage range of ±30 V. It supports a data rate up to 5 Mbps in CAN FD mode which allows a much faster transfer of payload when compared to classic CAN. There is a SiO2 insulation barrier in this device that has a withstand voltage of 5,000 VRMS and a working voltage of 1,060 VRMS. The electromagnetic compatibility of the ISO1042-Q1 has been significantly enhanced to enable system-level ESD, EFT, surge, and emissions compliance. When paired with isolated power supplies, this device can help protect against high voltage and noise currents from the bus entering the local ground. The ISO1042-Q1 is available for both basic and reinforced isolation applications and supports a wide ambient temperature range of -40°C to +125°C. It is available in two package sizes, the SOIC-16 (DW) package and a smaller SOIC-8 (DWV) package.

Conclusion The future of the automotive industry is bright. However, the designs will be more complicated as more features, driven by environmental regulations and consumer demand, are added to vehicles. To help support these features, Texas Instruments has a wide variety reference designs and products available now that can help reduce design time and get these future automotive designs to the consumer sooner.

Figure 4.

Simplified Schematic of Texas Instruments’ AMC1305M05-Q1 precision delta-sigma (ΔΣ) modulator. (Image source: Texas Instruments)

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EV

Powering the Future of Electric Vehicles Carlos Castro, Global Director Automotive Power Control, Semiconductor Business Unit, Littelfuse

Increased power density, efficient power conversion, and reliable circuit protection are critical to enabling the future of electric vehicles adopting wide band gap power semiconductor devices that provide higher power efficiency during power conversion.

In particular, SiC devices are now affordable and have automotive-level reliability (Figure 1).

Another advantage of SiC devices is that they leverage smaller passive components (i.e. inductors) and less need for heat sinks. In hybrid vehicles especially, space is at a premium, and even a small amount of weight has a cost in vehicle performance.

Figure 1. SiC Schottky diodes and MOSFETs, like these pictured from Littelfuse, lower power switching losses compared to Si devices.

Electric vehicles are poised for meteoric growth, rising from an estimated 6 million vehicles in 2019 to 16 million vehicles in 2023. New technologies are enabling this dramatic change, including more efficient power conversion and higher power density. New circuit protection strategies are also required to protect the battery management system (BMS) from higher power.

Efficient Power Conversion Power losses reduce a vehicleâ&#x20AC;&#x2122;s driving range. Also, during vehicle charging, losses cause engineering challenges in the form of heat and charging time. This is why the industry is

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Power Density As the power density of lithium-ion batteries increases, vehicles are achieving longer driving ranges per charge, making EVs more attractive to consumers. In parallel, high-power vehicle charging stations are emerging that dramatically shorten charging times, which will also increase adoption of electric vehicles.

Major automobile companies are offering cars with lithium batteries capable of 250-Watt hours per kilogram (Wh/kg), with targets to reach 350 Wh/kg in a few years. Government and industry researchers are working on battery designs that may far eclipse the power density that is available today.

Lithium-ion batteries offer vehicle designers a long charging cycle life and power density, however they can be finicky.

Overcharging and high discharging reduces the lifespan and efficiency of lithium-ion batteries. Extreme current flows may lead to shorts and dendritic lithium plating that eventually destroys the cell. Undervoltage can break down electrodes.

Extreme battery temperature can cause electrical shorts and the outgassing of flammable gas. For the batteries to operate safely, the BMS must carefully manage charging and discharging and maintain a state of charge of roughly 20-to-90%.

Circuit Protection As battery power density increases, and as charging voltage increases, so does importance of proper circuit protection of batteries and the BMS, which lies at the heart of this green revolution. If it is not adequately protected against a variety of electrical threats, then battery failures will turn off consumers and, in the worst case, lead to dangerous fires and shock hazards.

The challenge for vehicle designers is that standards have

yet to emerge for the BMS. Unlike the mature technology of combustion engines, electrified vehicles are still early in their development. Each vehicle manufacture is attempting to find the best way by doing it a new way: new architectures, new voltage classes, and new ways to adapt performance from mechanical to electric metrics. This has led to confusion about how to best protect the circuits.

Overcurrent protection The BMS and batteries face a variety of electrical threats.

Given that it is a high-energy system operating at hundreds of amps, the most obvious threat is overcurrent. In the case of an accident, a punctured or crumpled battery can cause a fire or shock hazard by making contact with the metal chassis of the car.

For this reason, DC fuses are deployed at multiple strategic locations. They quickly interrupt high-value overcurrent and short circuits. The fuses used in electric vehicle applications must be automotive qualified. It’s not easy. Unlike the fuses used to protect lithium batteries in tablets and mobile phones, automotive fuses must withstand extreme shock and vibration. An automotive fuse is expected to remain reliable over a fifteen-year life cycle including 8,000 hours of operation and 150,000 miles of road vibrations.A small form factor is essential to reduce mass that can be affected by vibration, however the high power involved with electric vehicles requires the fuse to be relatively large. Temperature is a compounding environmental factor; the fuses must have a low-temperature derating so they don’t open prematurely at elevated temperatures.

Surge and ESD protection The BMS communicates continuously with the charging system to prevent cells from being overcharged. It controls the charging rate, slowing it as the battery gets close to reaching capacity in order to avoid overheating. The BMS controls the charging rate according to the capacity of the battery pack, with an increasing number of vehicles having high-capacity batteries capable of fast charging.

As EV charging moves to higher voltages and currents, the communication between the battery, BMS, and charger is increasingly important and must be protected.

TVS diodes and diode arrays are used to defend communication lines, normally CAN bus, against transient voltages induced

by ESD and nearby lightning strikes. The selection of these devices, and their locations in the circuit, depend on the BMS architecture.

BMS architecture In an electric vehicle, battery cells connect in series, making up a module. As modules connect in series, the total voltage of the system increases. Next, the modules are connected in parallel to increase the energy capacity. As designers add modules to a BMS, cost and complexity increases.

Each module of batteries has cell monitoring systems.

These subsystems monitor the voltage for proper balance.

Microcontrollers then oversee each of these modules to provide

the highest energy efficiency and longest-life of a battery.

The particular architecture for the BMS determines the protection specifications, such as the interrupt rating and voltage ranges.

In a decentralized architecture, sense balancing IC connect by long wires between the cells and the slave boards. High voltage fuses are used to reduce the risk of a short circuit under high voltage conditions both in the module and between the cells in an accident. If a component is damaged in this decentralized architecture, it can be replaced separately, making it a less expensive and simpler option.

In centralized architecture, all the components integrate into single modules. However, if one component fails, the entire module must be replaced, at a higher cost.

Under this architecture, the distance is smaller between the cells and slave boards, making an accident less likely to cause short circuit under high voltage conditions. Nevertheless, lower-cost low- and medium-voltage fuses should be used to protect against component failure and contamination on the BMS board. Two types of failure must be taken into account, short circuits and overload conditions.

Because of the sensing lines at each cell, there is the potential for a short circuit in any cell. The cell monitor block or direct line must also be fused to avoid overcurrent damage.

Applying circuit protection Figure 2 shows the system elements at risk of damage and the type of device best suited for their circuit protection.

• ICs used to monitor cells – TVS diodes protect against overvoltage • Communication lines between units – TVS diode arrays guard against EDS • Battery ICs – high voltage TVS diodes in case of voltage transients • Microcontrollers – TVS diode arrays • Main switch – high-voltage-high current fuse in series with the main switch to act as a final protection barrier • Inverters and DC/DC converters – high-voltage TVS diodes

Figure 2. A BMS block diagram. Locations for circuit protection include fuses (1), TVS diodes (3, 5), TVS diode arrays (4, 6), and high voltage fuse (7)

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EV Automotive-grade circuit-protection components are available from a number of suppliers (Figure 3a & 3b). Because of the mission-critical nature of automotive circuit protection, design engineers will benefit from working with suppliers who understand the entire BMS ecosystem and offer a variety of technology solutions.

Figure 3a Figure 3a & Figure 3b: BMS protection requires AEC-Q automotive qualified components. Examples include the 441A Ceramic Fuse and the TPSMB TVS Diode from Littelfuse. TVS diodes guard against secondary induced transient voltages Unlike many applications in which circuit protection is almost an afterthought, vehicle electrification is one area in which design engineers recognize its critical role. Testing is moving

from the final phase to a step early in the process. Many suppliers offer customized simulation testing that can validate designs during development. Standard tests don’t exist in this

Figure 3b quickly evolving market, so designers and component suppliers must work as a team and develop expertise together. What’s more, to reach optimal protection selection within automotive safety standards, automotive engineers should be educated in current safety standards and their requirements. Often their suppliers are in the best position educate them.

As both consumers and governments push automotive manufacturers toward a greener future, they must find solutions to a host of engineering challenges, including circuit protection.

Working with knowledgeable suppliers, they are creating a new generation of safe and reliable electric vehicles.

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Conformal Coatings

Conformal Coatings That Meet The Demands of The Automotive Industry Phil Kinner, Head of Conformal Coatings Division, Electrolube Introduction In a typical car today, electronic systems are critical to the smooth and safe operation of the vehicle. Even before the engine starts, electronics have already unlocked the car.

Once you start the engine and step on the accelerator, sensors assist in getting out of your parking space, engine control units (ECUs) tune the engine performance, monitor the pressure of the tyres and safety systems are powered up in standby mode. As you pull away, adjust the air conditioning, ensure your phone is connected to the entertainment system, set your destination on the satellite navigation system and initiate your favourite music, yet more electronic systems are brought to life.

The electronics continue to manage your interior temperature through the Heating, Ventilation & Air conditioning (HVAC) system. Sensors and control systems detect crash situations, deploy airbags and side impact protection and can automatically notify the emergency authorities of the location of an accident should the driver be incapacitated. Braking is controlled to prevent dangerous situations such as locked brakes, automatic transmission and management systems are used to change gears, maximise fuel efficiency, monitor and minimise emissions. Active collision detection systems use cameras and radar systems to alert drivers of impending situations and prevent lane drift.

The usage of automotive electronics will continue to develop as consumers demand ever more performance, safety, comfort, convenience and entertainment from their vehicles.

Systems are being developed that will do even more to avoid accidents, protect and entertain occupants and reduce the environmental impact of the journey.

The value of the electronic systems in today’s vehicle routinely exceeds 20% of the total vehicle value and many estimates take this value to greater than 35% during the next 5 years.

With the increased adoption of electronic vehicles, and the development of the Internet of Things, which has culminated in the futuristic driverless car being tested by Google in California and BMW on the roads of Bavaria, the future could not look any more different to the industry in the 1970s when electronic fuel injection systems were first introduced to mainstream production.

Much of the increased automotive electronics usage has been enabled by the development of even more powerful controllers, sensors and switches, as well as the development of low-cost, high reliability electronic systems which have

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made body, comfort and safety applications standard in most modern automobiles.

Low-cost, high reliability With increased demands for sophistication, performance and reliability, 5 and even 7 year warranties are being supplied with new vehicles and the need to ensure reliability at acceptable cost of new designs is one of the greatest challenges facing the component suppliers. Electronic systems are increasingly facing wider temperature extremes, greater degrees of humidity, condensation and yet more corrosive gases. With the drive towards electric vehicles, with much higher voltages being normal, increased dielectric protection is required to enable designs to be sufficiently dense to meet size and weight constraints. The increased sophistication of the electronic systems often means they are more sensitive to contamination and the impacts of the external environment.

With the increased level or interconnection between systems, failure in one assembly can have a knock on effect into another. Unlike aerospace applications where there may be 2 or 3 layers of redundancy in design, automotive designs typically must work, first time, every time throughout the life of the product.

Conformal Coating to increase reliability Conformal Coatings are thin, protective polymeric coatings that are often used to provide the required environmental protection, without an excessive cost or weight increase.

Conformal Coating applications are generally thought of being either ‘in-cabin’ electronics (situated within the passenger cabin) or ‘underhood’ (near the engine) electronics. The two distinct categories make it convenient to discuss the main requirements of each, but of course, with increased sophistication and multiple functionality of assemblies, the traditional environments continue to merge, and the drive to higher power electronics in electric cars blurs the lines further.

‘In-cabin’ automotive electronics Electronic sensors and systems situated in the passenger cabin, essentially occupy the same space as the vehicle occupants and are therefore exposed to largely similar environments. In the winter, that can mean extreme cold and the tendency towards a condensing atmosphere. In the summer, the tendency is towards a warm and humid atmosphere. Condensation and high humidity are both a risk to the reliability of electronics, by promoting the formation of

corrosion. In addition to these factors, the electronics may be exposed to atmospheric pollutants, cleaning solutions, liquid splashes etc. Any of these factors may be a potential reliability risk, especially in association with humidity and condensation.

Corrosion is a complicated electro-chemical process, with a variety of potential mechanisms and causes, well beyond the scope of this article, however, in the vast majority of cases, there are 3 requirements that must be fulfilled in order for corrosion to take place.

1. Intrinsically electrochemically dissimilar metals (e.g. Gold/ Silver and Nickel/Tin), or the creation of an anode and cathode by application of applied bias.

2. The presence of an ionic species (usually Salts, Halides, Hydroxides etc).

3. The presence of mono-layers of condensed water, to dissolve the ionic species resulting in an electrolyte solution.

In order to prevent the possibility of corrosion, it is necessary to remove one of the pre-requisite conditions.

Given the relatively benign operating environments experienced by ‘in cabin’ electronics, Acrylic conformal coatings have historically dominated this segment, offering good all round properties, especially against high humidity and spills and splashes.

‘Under-hood’ Electronics The main differences between the requirements for the protection of ‘under-hood’ electronics and ‘in cabin’ electronics are due to the placement of the former. The environment can be much less controlled, with higher maximum operating temperatures and far more opportunity for contamination by fuels, oils, cleaning fluids, corrosive gases, metal particulates and salt-water slush sprayed up after road gritting etc.

In short, ‘under-hood’ and other non-cabin electronic assemblies are required to provide protection under much tougher environmental conditions.

The next generation of protective coatings In order to counter these challenges, a new type of protective coating is required. These coatings are required to be extremely resistant to wet conditions, chemical resistant, highly flexible to survive thermal shock excursions and temperature resistant to survive the higher operating temperatures.

To counter these challenges, Electrolube has developed a new range of highly durable, solvent-free, modified polyurethane conformal coatings, which are designed to be applied at a greater thickness than regular conformal coatings and cure within 10 minutes at 80°C, re-using existing thermal curing ovens often used in solvent-based processes.

Condensation / liquid water resistance

The choice of metals is limited to those used in the solder and solder finish chemistries, which are dissimilar, and there will always be areas of potential difference due to the nature of an electronic assembly. Cleaning can help remove ionic species, but cannot prevent the re-deposition of ionic species from the operating environment.

Conformal Coatings help prevent the formation of electrolytic solutions by acting as moisture barriers. The coating needs to be a good barrier against moisture and must have good adhesion to the substrate to prevent delamination. Once the coating is delaminated, moisture can eventually collect in this ‘pocket’ and form an electrolytic solution with any preexisting ionic contamination. This is the reason that cleaning prior to conformal coating is recommended, to provide a powerful synergistic elimination of two of the three pre-requisite conditions for corrosion.

‘Sharp-edge coverage’, the ability to completely and reliably cover device leads, solder joints and other metal surfaces, to prevent them from being susceptible to corrosion is a longstanding, well known issue, that has recently been highlighted by the IPC5-22ARR J-STD-001/Conformal Coating Material & Application Industry Assessment.

To demonstrate the importance of edge coverage and protection from liquid water, in the form of condensation, the National Physical Laboratory (NPL), UK are currently working on the development of a controlled condensation test. They have shown that at 40°C and 93%RH, a temperature differential of just 1.5°C can lead to the formation of a sufficient moisture to reduce the surface insulation resistance of a copper coupon from TΩ to 1MΩ (limit of detection).

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Conformal Coatings

Fig 2. Comparison of Condensation Resistance of various coatings, Data Courtesy NPL The data clearly shows a significant drop in the SIR value of an uncoated assembly, limited protection by both the Nano coating and the single-coated acrylic, improved protection from the double-coated acrylic, with both the new urethane materials providing improved protection, whilst UR3 in particular shows outstanding protective capabilities against

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condensing water.

This can be explained in part by thickness and coverage, although the particular chemistry of the formulation also plays a significant role, as explained by the significant difference in performance between UR4 and UR3, even though the applied thicknesses (c. 150µm) are similar, as shown in fig 3 below.

The coupons were continuously powered at 50V for the duration of the test and the insulation resistance was measured at periodic intervals throughout the test. As can be seen in figure 5 below, both materials performed well, providing excellent protection against a salt-mist environment, although UR3 showed a higher overall degree of insulation resistance, in line with the results from the NPL’s condensation test

Fig 3. Cross-section of 3 Oz Coated Coupons, showing importance of applied thickness and coverage in condensation resistance.

Thermal Shock Resistance Automobile electronics are usually required to work between -40°C and 125°C, with rapid transitions between the temperature extremes. The Electrolube SIR test coupon shown in fig 4 was designed, containing a number of components, laid out in a difficult configuration, to better simulate a production assembly.

Coupons were selectively coated with polyurethanes UR3 and Fig 5 – Insulation resistance of polyurethane materiUR4 at a target thickness of 250µm and subjected to 1000 als under salt-mist conditions with 50V bias applied air-to-air thermal shock cycles, at the temperature extremes previously indicated, with a rate of temperature change in continuously. excess of 40°C / min.

Conclusion

In order to meet the demands of the automotive industry for greater electronics reliability under ever more adverse conditions, Electrolube has developed a range of solventfree, higher performance protective coatings. These coatings have been developed to be applied at greater thicknesses to overcome common application defects and improve sharp-edge coverage.

Fig 4. Electrolube Test Coupon for assessment of conformacoating performance

These materials have been demonstrated to provide significant performance improvements on model PCB test assemblies, in terms of resistance to thermal shock, condensing and salt-mist environments than traditional conformal coatings, ultra-thin coatings or even UV curable materials.

These coupons were visually inspected at 20X magnification for evidence of cracking, delamination and solder joint or component damage. After 1000 cycles, UR3 showed some signs of surface cracking and discoloration, but did not expose any metal surfaces and did not propagate to the surface of the board, whereas UR4 showed almost no change in appearance.

Salt-Mist Resistance

In order to assess the protection provided under salt-mist conditions, intended to simulate winter driving conditions, the test coupons shown in fig 4, previously exposed to the 1000 thermal shock cycles were subjected to a 196 Hour salt-mist test (5% NaCl Solution).

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Industrial Automation

Industrial Automation – The Experts Explain!

I

ndustrial Automation in 2020 needs no new introduction but yes the technology as it is evolving needs better understanding and expertise. Frost & Sullivan predicts that 30 per cent of all industrial applications will shift to the edge technology and will have better computing horsepower. Humans and Robots working together should not astonish you the next time visiting a plant. Cobots is happening! Negative Latency is emerging, where customers will be able to accurately predict asset failures before they happen and take actions to prevent the failure.

In 2020, automated reporting and analytics functions must become standard. This technology is no longer a luxury, but is

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now essential to allow for effective interpretation, turning data into valuable information. It’s clear that solutions & services will go hand-to-hand playing a pivotal role in the future of production automation and could be a key propeller for Industry 4.0 in the next decade.

Technology seekers and Companies planning to automate your whole manufacturing processes, BIS talks to the experts in this domain, Atul Patil, Asst. General Manager, Marketing Department, Factory Automation & Industrial Division from Mitsubishi Electric India explaining. Here is what one needs to understand before choosing automation, get it noted.

In India, Mitsubishi Electric a Major Player in the Industrial Automation Space

ATUL PATIL

|Asst. GM | Mktg Dept. Factory Automation & Industrial Division | Mitsubishi Electric India

Atul Patil Asst. GM | Mktg Dept. Factory Automation & Industrial Division | Mitsubishi Electric India highlights the trends, technology and market shaping Industrial Automation and robotics. The veteran also highlights on Mitsubishi Electricâ&#x20AC;&#x2122;s dominance in this sector.

access and other forms of cyber-attacks.

Mitsubishi Electric's e-F@ctory solution interconnects the shopfloor data and makes the factory completely visible. The e-F@ctory solution is designed to provide real-time security and high reliability for manufacturing execution and quality management systems.

Industrial Automation Sector Trends In the past few years, Industrial Internet of Things (IIoT) has Market Emerging and Sectors Adopting Robotics developed lot of innovations which are promising for the Industrial robots have become really popular in the past few manufacturing world. When implemented correctly, IIOT has years for their productivity and profitability. With the adoption immense potential to transform the technological landscape. of Industrial Internet of Things (IIoT), robots will be able to collect While these technologies have been around for a while, a major data that was previously inaccessible and this trend will, in development has been witnessed recently: the hardware that turn, boost productivity and efficiency of the organizations is required to deploy IIoT has become much more affordable that employ this technology. and it is shaping the future of the automation sector.

Collaborative robots are really going to gain momentum in IIoT and Connected Enterprises has gained prominence in the coming years. These robots are capable of working in Business Environment. However, with IIoT, comes the need conjunction with humans and are often cheaper than their to handle massive amount of data which must be safe and industrial counterparts. As their technology evolves and they secure. Predictive maintenance and diagnostics, utilizing become more adept to the tough industrial settings, they will massive amount of data are expected to become an important find their place in the organizations that are focused on good part of future manufacturing operations. Increased data from returns on investment. sensors on production lines, etc., will raise the demand for There are many industries that have turned to robotics for expanded data-processing capacity, and we are working to advanced solutions. Manufacturing industry is the first one that offer Controllers to meet the growing demand to secure the comes to mind. Given the efficiency and speed of production systems against wire tapping, data manipulation, unauthorised that robotics has to offer, it should come as no surprise that BISINFOTECH â&#x20AC;˘Vol - 2/04 â&#x20AC;˘April 2020

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Industrial Automation Mitsubishi Electric Market Share and Expectations robotics is finding applications in the manufacturing industry.

Besides manufacturing, healthcare industry is also integrating In India, we are a major player in the Industrial Automation robotics into its infrastructure. From patient monitoring to space. We have a products and solutions basket that covers assisting the staff during surgeries to accurate diagnosis of a wide range of customer needs. We will also continue to the patients, robotics has really carved a niche for itself in expand our operations by reaching out to unrepresented the healthcare industry. areas. As a group, we are committed to our customers in These are just a few among a myriad of industries that are India and will work closely with them to create, enhance and adopting and integrating robotics into their framework. As we meet their automation needs. step into the third decade of the 21st century, by virtue of its beneficial traits, robotics will find a place for itself in almost Mitsubishi Electric Expertise all the sectors.

Mitsubishi Electric’s Factory Automation and Industrial Division (FAID) brings higher productivity to the factory-floor by offering Intelligent edge a vast range of automation technologies, including concept As the technology evolves, it becomes imperative for tech like e-F@ctory, that enables Digitalized manufacturing, Inverters leaderships to adapt accordingly to the changing scenario. (Drive Products), Modular Programmable Controllers (Modular Mitsubishi Electric has achieved this goal using e-F@ctory. With PLCs) and Micro Controllers (Micro PLCs), Motion Controllers & the help of IoT (Internet of Things) based big data utilization, Servo Motion Systems (AC Servos), Human Machine Interfaces e-F@ctory enables smart manufacturing.

HMIs (including locally developed and manufactured Graphic For a smart manufacturing to be achievable, it is essential that Operation Controllers - GOCs), SCADA, Computerized Numerical the production shop-floor data should be utilized in real-time Controllers (CNCs), Robots and Low Voltage Switchgear and an efficient connectivity should be maintained with the (LVS) products. Together, these technologies and products IT systems. By employing the concept of “edge computing” have helped OEMs (Original Equipment Manufacturer), SI’s which facilitates information processing between the shop- (System Integrators), Panel Builders, Consultants and EPC floor and IT systems, it is possible to achieve data connectivity Contractors in providing reliable solutions. In addition, FAID’s with optimal efficiency. extensive service networks provide direct communication and comprehensive support to customers.

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System On Modules

Toradex launches Verdin featuring NXP i.MX 8M Mini/Nano Introducing a new family of System on Modules that simplify modern product development

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oradex, a leader in embedded computing, announces the launch of Verdin, its latest family of System on Modules (SoMs). Verdin provides a modern, future-proof set of interfaces focusing on ease-of-use and robustness. The Verdin line expands on the already successful Colibri and Apalis SoM families and comes with the same extensive Software, documentation, ecosystem and support.

Verdin provides developers with intuitive access to the latest interfaces and the extensive pin-compatibility between Verdin modules offers excellent cost performance and scalability.

The Verdin family adds many unique features to the Toradex product line. Those include a battery-ready design with a wide input voltage range (3.3 to 5V), low power 1.8V IOs, the ability to easily extend power management to carrier board peripherals, off-the-shelf thermal solutions, as well as an extensive range of test reports including data on EMC, shock and vibration tolerance. Additionally, Toradex Direct Breakout™ greatly simplifies signal routing on carrier boards.

Verdin utilizes a rugged, small and cost-optimized 260pin SODIMM DDR4 edge-connector. Toradex has 16 years of experience with implementing edge-connectors in many demanding applications, and that experience translates to a stable, connection over long periods of time, even in extremely harsh environments.

Toradex is launching the Verdin product family of SoMs with capable yet power-efficient NXP® i.MX 8M Mini and i.MX 8M Nano applications processor options. Featuring up to 4x Cortex-A53, up to 2GB of RAM and 16GB of eMMC Flash Memory. An On-board dual-band 802.11ac 2x2 MU-MIMO WiFi and Bluetooth 5 and Industrial Grade (-40 to +85C) options are available as well.

Built-in Hardware security features and interfaces such as USB, Gigabit Ethernet, PCIe, CAN FD, MIPI CSI-2, GPIO, I2C, SPI and others… make it an ideal platform for Industrial, Medical, Transportation and many other applications. And to help future-proof the investment, these Verdin modules will be available for at least 10 years.

Verdin modules come with the well-known production-quality Toradex Software. This includes a Yocto Project-based reference image and TorizonTM, the easy-to-use industrial Linux Platform.

Toradex is committed to Mainline and is currently actively working on mainlining code.

“With Verdin, we are introducing a new family of modern, future-proof SoMs that provide the performance, scalability and cost optimization required to power the next generation of embedded edge computing solutions. Verdin has built-in security features and wireless connectivity ideally suited for industrial IoT applications together with Torizon, our easy-touse industrial Linux platform," stated Samuel Imgrueth, CEO, Toradex. “The design requirements for this new product family were backed by extensive market research, broad customer feedback and our vast industry experience. This goes a long way in reiterating our commitment towards innovation and prioritizing our customers’ needs.”

At launch, Toradex will be offering two off-the-shelf carrier boards. The first being the Verdin Development Board, a larger board that exposes all the features available on Verdin. As such, the Verdin Development Board allows users to build up even very complex systems in no time. The second board – called Dahlia – is a more compact 120mm x 120mm board focusing on the most popular features. Dahlia is designed to provide a simplified development experience with features such as a convenient USB-C power option and full debugging over USB. At launch Toradex partners Linear Computing and Revolution Robotics are providing the first Verdin carrier boards from the Toradex Partner Network, and the Gumstix Geppetto online carrier board design tool will add support for Verdin over the coming weeks.

Verdin takes full advantage of the large Toradex ecosystem, from off-the-shelf and customized carrier boards, a wide range of compatible peripherals such as cameras and screens, and software solutions including UI and Machine Learning frameworks to custom engineering services. Everything you need to create your next successful product!

Verdin modules will be available beginning of March 2020. For more information, visit: https://www.toradex.com/computer-on-modules/ verdin-arm-family BISINFOTECH •Vol - 2/04 •April 2020

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Industrial Automation

The Co-existence of MAN and the MACHINE is not a new concept

We have known it since ages and it is our window to future

Sameer Gandhi Managing Director, OMRON Automation, India

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The harmony between man and his machine has always been associated to pursue a connected world - a world connected through different times and zones. In our growing years, we have heard fairy tales where the unknown that happened was seen to assist humans for better lives. Pumpkins becoming carriages for Cinderella and Ironman using his gadgets to assist and save the world. Human minds have always been stimulated by automation and artificial intelligence. What is needed is not denial of its existence and relevance but the need to acknowledge the harmony.

Industrial revolutions have been depicted with vintage pictures of the production units showing machines surrounded by the work force. The pictures show workers on an assembly line matching the pace of the machines (humorously portrayed in one of the ‘I love Lucy episodes’!). This monotony of work process directed towards a man working like a machine has been evolving from monotony to harmony of the powers of the Man and the Machine over a period of time.

The manufacturing sector in India is slated to contribute 25% of the GDP by 2020 and reach USD 1 trillion by 2025. This huge target if realized is expected to create more demand for productivity, efficiency, reliability, perfection, uniformity, flexibility, customized solutions and above all a match with global standards which is directly associated with choosing the right technology, the right level of industrial automation.

Automation is one of the important keys to the growth of manufacturing sector and the way to scale up the value chain in a progressive manner.

It offers opportunities that can help the industry catalyze the market requirements, reduce manufacturing downtimes and improve the efficiency of the machines and increase productivity. In order to attain error-free results and considering the current ecosystem, it is inevitable for the manufacturers to lean towards one-stop automation solutions with impeccable quality and easy troubleshooting.

Further with the advent and transition towards Industry 4.0, also known as IIoT, there is a tremendous opportunity for Man and the Machine to constantly communicate and complement each other’s performance. A connected shop floor based on a sturdy Industry 4.0 framework is enabled with more transparent and real-time data analysis and so is lot more competitive, efficient and flexible.

One of the most significant examples of the utility of a hi-end and connected automation solution is the India’s automotive industry which is counted as one of the fastest growing sectors in the world. It relies heavily on well-automated ecosystem to assemble multiple complex components seamlessly with constant checking and precision at every step.

One of the big challenges automotive industry currently faces is recall which can happen due to a defect in a single component – causing huge setbacks to the credibility of a brand and even safety of the users of automobiles. To tackle recalls, automation solutions like Traceability help the manufacturers to a great extent.

Another challenge is to optimize the cost which can be done effectively through Flexible manufacturing. This shows that manufacturing sites need to step up with facilities which allow not only to produce in large quantities but to produce varying customer requirements with the right standards and precision. To achieve this, it is important to facilitate both the production units and allocation of people wisely to support those machines.

Companies need to establish the right chord between machines and men. This will give rise to need of new skill development, particularly, for the shop floor workers and would lead to their more effective utilization.

The ongoing industry conversation around automation in general and robots in particular has always depicted robots as the reason for job loss for the workforce. On the contrary, robots are not living beings but are creation of man itself and they are programmed to do as how we want them to perform. In fact, robots and artificial intelligence are proof of concepts of the harmony and interface between humans and machines. Operating these robots requires a skilled workforce which means an opportunity of job creation, however

with better and more advanced skill sets.

The future of automation demands that workers do not lose their creative and out-of-the-box talent by executing timeconsuming, repetitive or potentially unsafe jobs that are best performed by a machine or a robot. Omron takes the view that by getting machines to do repetitive tasks, man is freed to do more fulfilling work. 'To the machine, the work of the machine; to man, the thrill of further creation’- one of the visionary statements of Omron’s founder Kazuma Tateisi, made almost five decades back (1970), make a lot of sense in today’s scenario.

The technologies are being adopted in almost all industries and countries across the globe but the speed and strength will vary as it depends on various technical and economic factors. For example, the machines need to simulate the full range of human performance capabilities and must be economically viable if compared to the wage levels.

This is very much applicable to India because of its large workforce and heavy reliance on predictable physical activities needing considerable up-front capital investment for automation.

So for an emerging economy like India the automation may take time to become viable but whatever is the time frame, it will have a significant impact on the workforce which is unlikely to result in unemployment, rather it will open new avenues of growth in multiple industries and in ways that may be difficult to imagine today. For example, when Computerization/IT was introduced in the Indian banks in the 80s; there was a widespread fear that many employees would lose their jobs.

Not only did this fear prove unfounded (no job losses), but on the contrary, the productivity improvements brought about by computerization had a huge positive spin-off in attracting private players to the banking sector and generating more employment. Gradually new avenues were created and we all evolved to a brighter future.

Co-existence of the man with machine is the solution for tomorrow. Automation is the need of the hour to remain competitive in the industry and produce products which are expected to be consistent and high in quality, increased output, and decreased costs. It is time for Indian industry to be glocal while adopting global processes and technology upgrade for manufacturing world class products.

Given the country’s high growth aspirations, automation plus additional productivity raising measures are necessary to sustain the economic development. The countries which have already touched high levels of manufacturing will need high levels of investment to go to the next level. So for them the cost involved is quite high whereas the Indian industry actually has the opportunity to ‘leap frog’ this Automation Curve to take full advantage of the automation technologies that are available today. Our aspiration should not only be to make in India but to make world class in India and automation will be the key to achieving this.

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Automotive

IoT in Automotive

Satish Sundaresan Managing Director - Elektrobit India Pvt. Ltd

Some of us know of a time when the fastest way to inform was telegram or a ‘trunk call’, where information was only delivered to the receiver to a moderate degree. Today information is almost always waiting on our mobile phones to be read or heard.

Similarly, cars today can seamlessly link to our smartphones, play our music, read out texts, provide us real-time traffic alerts, and even offer emergency roadside assistance. The internet has very quickly become inseparable from everything we do even inside our cars. A case in point is where vehicle maintenance has gone from a place we have to go, to just another thing we click.

From an early implementation of the Internet of Things (IoT) in manufacturing with the objective to execute autonomy and reduce production cost, the use cases today are more commercial and for general usage. Different automotive IoT use cases have popped up that are revolutionizing the way people interact with their vehicles. Some examples are fleet management, connected cars, in-vehicle infotainment and telematics, automotive maintenance systems, automated driving.

With connected technologies (IoT in automotive industry), we can control nearly all aspects of our lives from the palms of our hands. Vehicular infrastructure has evolved to adopt and use connected technology becoming a differentiating

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factor in certain economies. Connectivity features are now in the cars and trucks everyday folks drive.

IoT in the automotive industry enhances our experience multifold. We only need to take a long road trip to understand how the introduction of mobile devices has made journeys so much more exciting. With hotspot technology, passengers can now freely browse the web on the go. Car makers also offer a variety of wireless technology-based use cases through mobile apps like vehicle status and health, maintenance schedules, and certain vehicle features that could only be viewed on the instrument cluster earlier. Advanced systems today offer integration with server based speech systems like Amazon’s Alexa, enabling owners to experience the same comfort in a car, as we do in their homes. A more comprehensive future for connected cars goes beyond the driving experience that can also be continuously enhanced during the lifecycle of the same model, without having to upgrade the vehicle to the next generation. Some use cases already available for the consumers are: • Locking and unlocking • Identifying seat, climate control, steering wheel settings based on the key to pre-adjust to the driver’s preferences • Fleet management for commercial vehicles and tracking mechanisms for vehicle aggregator companies - to provide accurate information on time to destination • Digital wallets integration to your vehicle – paying your bills at the fuel station, and at a service center or even to stream

music from your favorite music app • Tracking stolen cars and in some cases even remotely accessing the vehicles within the legal framework • Integration with emergency services for specific situations like accidents or breakdown We are used to our smartphones upgrading its software ever so often. Similarly, vehicle manufacturers have also begun updating vehicle software over the air, without the need to visit a garage or a service center. Connected vehicles give car makers, in certain cases, quick access to vehicles for a variety of reasons like a study, diagnostics, maintenance or even an upgrade. These over-the-air software updates allow a vehicle owner to subscribe for a new feature for its rollout or even have an error fixed.

The advantages of internet-connected cars may not have yet reached its full potential. Autonomous vehicles will need more of the IoT technology – from positioning accuracy within a few inches to integrating traffic information to route guidance to being able to read road signs & assimilate information received via various sensors and the internet, cars today are super computers.

But the road to connected is also paved with many risks: • Subscription-based pricing – We might come to a point where car owners pay a monthly fee for a new feature or remote assistance. Today the business model across the globe is different to suit local market needs. The connected vehicle changes that ‘local’ paradigm as we become increasingly global.

• Privacy - Data is the basis of all connected technology and this leads to the question of privacy. Imagine a scenario where your vehicle shares data about your favorite coffee shop, restaurant, or even a scenario in which the vehicle registers that you were speeding in certain parts of your journey. Who owns this data? The vehicle owner, the driver, the vehicle manufacturer, or the local authorities of that region?

• And with privacy, car makers need to address security and safety. We already have a few documented instances of vehicles being hacked remotely and then made to function in unsafe ways. This brings cybersecurity into an industry that was always considered secure and safe.

It is imperative to understand that the vehicle does not stand alone. A connected vehicle connects to a back-end cloud network infrastructure that can also be hacked or stolen. In certain organizations, manufacturing itself is based on IoT (Industry 4.0). This implies car makers and vehicle owners are exposed to risks from the production line till the vehicle’s end of life.

Security has never been more important to the automotive industry, and therefore EB is working in tandem with Argus Cyber Security to cover the entire portfolio of end-to-end security solutions and assure that software updates are completed in a safe and secure manner. This allows to fend off external attacks against individual vehicles or the entire vehicle fleet.

More specifically: Security breaches are detected reliably and are quickly fixed via over-the-air updates.

IoT in vehicles provide a list of conveniences that enhance the ownership experience of a passenger or commercial vehicle.

Ultimately it depends on the car maker on the amount of security that the vehicle can offer and the risk appetite of the end buyer. The paradox is the same as the smart phone industry faces– do we use an open-source platform that may be vulnerable to risks but can provide more luxury at a lower price OR do we realize that what is probably fun today (e.g.: hacking a car to prove a point) can also become a serious threat in the future (e.g.: IoT-enabled car that is remotely controlled for a crime)? The technology is available, the larger question is: Do we trust it to be safe, secure, private, and enjoyable?

About the Author

Satish Sundaresan, Managing Director - Elektrobit India Pvt. Ltd heads Elektrobit Indian subsidiary based in Bengaluru and this centre is responsible as a R&D location and a sales site for India. Satish also heads a global product group focusing on future products in validation for automated driving. Satish has been instrumental in setting up the legal entity and establishing a robust management team and driving site vision and thereby deriving the desired results for the company.

As one of the few milestones in this journey Satish is listed as Top 100 Great People Manager by Great Manager Institute in Forbes India Issue - April 2019. He was also awarded as “Great Manager” in “Senior Leaders” category for 2017 People Business in partnership with the Times of India and Economic Times with ET NOW. Prior to Elektrobit, Satish managed large global programs, whilst leading India based R&D centre’s across automotive electronics and IT operations. Satish’s experience spans across Mercedes-Benz R&D India (a Daimler AG company), Infosys Technologies Limited and Robert Bosch, all in Automotive Electronics. Satish has also worked several years in Germany, USA, Australia and has exposure to being part of various multi-location/ cultural/ complex automotive electronics projects execution & product development.

BISINFOTECH •Vol - 2/04 •April 2020

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Big Picture

ADI Has Decade+ Years Of Experience Developing HV Electronics And Deliver Quality And Reliable Products

BIG PICTURE KANTHETI SRINIVAS PRODUCT LINE DIRECTOR

ANALOG DEVICES INDIA

Semiconductor players are constantly innovating in the growing EV & HEV segment. Analog Devices, an innovation powerhouse has been a leading player in this domain. EV & HEV, being a still evolving segment, Analog Devices has been studying closely on the developments of this sector and has been offering leading solutions and products complementing the market need. . For the 4W segment, ADI is already a leader with a number of products meeting different channel count requirements of the OEMs. Kantheti Srinivas | Product Line Director | Analog Devices India in an e-interaction with Niloy from BISinfotech underlines how ADI continues to provide excellent support to the customers to support their engineering teams meet the required product features and performance in the shortest possible time. Edited Nub Below.

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What are the challenges and scopes does HEVs inculcate for Semiconductor players?

EVs are a fast going category of vehicles often called NEVs. BEVs are full battery powered electrical vehicles charged by electricity and run out of battery. A second category of vehicles are called PHEV (Plugin Hybrid Electric Vehicles).

These are often vehicles that have some level of battery to

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enable the car to run on clean energy (battery) – mostly in city but also has ICE to switch to for long distance drives thus reducing the range anxiety. The third category is MHEV/HEV where there is a 48V battery pack that provides boost to the vehicle’s acceleration thus saving the fuel under various conditions like city traffic conditions or giving boost to the vehicle on the freeways through an electric motor thus saving fuel consumption in these conditions.

These are great opportunities to meet the CO2 emission targets for the OEMs at various parts of the world but they also pose challenges. Battery costs are a big challenge for every EV manufacturer. BEVs are the most expensive while HEV and MHEV are the cheaper solutions. They in turn drive different battery architectures and that is an opportunity for the semiconductor players to solve the complex battery measurement and communications problems. The HEVs require a high level of integration at attractive cost points while the BEVs need high level of measurement accuracy and robust communications.

Both the types of vehicles need safety mechanisms to detect a battery fire early on and also ensure very robust working of the battery management IC. HEVs also open up opportunities for the Tier-1s and semiconductor with a lot of software that

is functionally safe in the form of drivers, processing of data, to ADI with the acquisition. With this ADI has a number of algorithms to estimate state of charge etc. products with various channel counts, safety features and In addition to the battery, semiconductor players find systems features to offer to the customers. ADI is also investing opportunities in power train and switches that is applicable only heavily to develop new and advanced technology products in EVs. The Power Train system will have a microcontroller that to radically innovate customer systems in the areas of battery acts as a motor controller and also controls the switches. The cell monitoring, pack monitoring and communications. All these switches and the drivers for the switches with the microcontroller offerings are integrated and ADI provides reference designs presents excellent opportunity for semiconductor players. Last and solutions that are worth of production by customers both but not least is the power supply ICs (DC-DC and switching mode in terms of HW and SW. regulators) that are all over the place powering a number of HEVs are almost soundless when moving, hence how components that top up semiconductor contributions in EVs. does ADI look into this matter to keep pedestrians and Hence all in all, EVs present a large and exciting opportunity to semiconductor players from Battery Management systems roads safe?

ADI not only focused on battery but the latest innovation is to power trains to power supply components etc. understanding user experiences and improve safety of drivers What are the key strategies of ADI to be a strong player and also pedestrians. One such innovation is the Electric in the Indian EV and Hybrid EV sector?

Vehicle Warning Sound System. New regulations now mandate India is a very unique market where the number of 2W and a sound produced by EVs when driven at low speeds so 3W is more than the number of cars. India sells around 20Mn the pedestrians are aware of an approaching vehicle. This 2W per year, the largest market in the world. They are cost requires skills across signal processing, software, digital signal and quality consciousness at the same time. On the other processor programming etc. ADI has developed a solution hand India sells around 4Mn calls per year and is the 5th using its Blackfin processor and developed SW algorithms to largest market in the world. While a number of car makers demonstrate this innovation. This is just one of the many other have launched EVs in the recent past, the uptick of the car innovations ADI developed to keep pedestrians and roads safe.

EVs will take some time due to the cost associated and the How do you foresee the Indian EV/HEV market? socio economic spread of Indian population. On the other The India 2W EV market will certainly grow as it is very hand 2W will see a faster adoption of EVs in India due to more comparable price points compared to their ICE counter parts. attractive for consumer. A recent estimate showed that the This is proven by the fact that all major OEMs have launched cost of owning an EV 2W is approximately half of owning the Electric 2W in India. In addition, there are a number of start corresponding ICE vehicle. This makes it attractive to a number of prospective buyers of 2W. The congested city traffic is also ups focusing on developing 2W in India.

To address this fast going 2W market in India, ADI is developing prompting a number of middle aged citizens to switch to solutions for the customers involving HW and SW so the 2W 2W in the cities. The range anxiety normally associated with OEMs and T1s are immensely benefited from this and reduces EVs is also nullified with 2W EVs. The falling battery prices also their time to design, develop, test and market. ADI will also contribute to larger adoption in this segment. be focusing on developing products that are tailor made for In the case of 4W, the adoption rate might be slower than the this market into the future as the market grows further. For 2W but the adoption of HEVs and MHEVs could see an uptick the 4W segment, ADI is already a leader with a number of to improve the fuel efficiency and mitigate the rising fuel costs. products meeting different channel count requirements of Power semiconductors to play a pivotal role in HEVs, the OEMs. ADI continues to provide excellent support to the ADI’s offerings and focus? customers in a number of ways to support their engineering teams meet the required product features and performance High Voltage is a key technology needed in EVs as the batteries operate at very high voltages (ranging from 200V in the shortest possible time. to 800V). ADI has decade+ years of experience developing BMS is a key component for HEVs, what are your offerings HV electronics and deliver quality and reliable products. This and portfolio for this segment? is a key attribute needed for OEMs and T1s to ensure their end BMS is a very important component of EVs and HEVs are no customer satisfaction. In addition ADI is also building a number exception. LTC has a decade plus years of experience in the of new innovative products with higher levels of integration, HV BMS IC and systems development that carried forward channel counts, communication and safety features.

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BISINFOTECH •Vol - 2/04 •April 2020

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Crowbar Protection Thyristors

Avoiding Field Failures with Crowbar Protection Thyristors

Teddy To, Senior Technical Marketing Manager Walt Tian, Technical Support Manager Andy Xu, Senior Technical Support Engineer, Littelfuse, Inc.

Product failures in the field are both expensive for the manufacturer and create a customer perception of poor quality construction errors or traffic accidents can also cause large transients. Even when there is no problem, the de-energizing or de-powering of a high current load such as a large motor will create a transient on the power line due to the di/dt current reduction from the large load. Transient peaks also can result from current flowing through higher than normal impedances on neutral lines or from single-phase faults on a 3-phase power system.

High voltage transients can damage a product, leading to an in-warranty repair failure and an unhappy customer. Resolving the problem for the customer can be an expensive service; and the manufacturer can experience the potential loss of future business from a disappointed customer.

Figure 1. SIDACtor I-V Curve. It is a bipolar device with an off-state and an on-state. VDRM is the maximum off-state voltage. In that state, the maximum current, IDRM is the offstate leakage current. When the voltage across the device reaches the breakover voltage, VS, the device switches to the on-state and conducts a large current, IH, the holding current. The SIDACtor maintains the holding current at a low voltage, VT, the holding voltage. The SIDACtor can maintain a large current with its power capacity due to the low crowbar voltage, VT. Ensuring a product is robust to power line transient conditions is a critical aspect of design that often does not receive the appropriate level of attention during product design. While a product failure due to a high voltage transient is an external event, the failure is due to a design that inadequately protects the internal circuitry of the product. Thus, power line surge protection is an essential element to ensure a robust AC linepowered device.

Potential sources of high voltage transients are weather conditions. Lightning can induce high voltage and current surges on a power line. Damage to power lines resulting from

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Surge protection is the methodology to protect products against damage from high voltage transients. The transients can cause intermittent errors in data transfer or permanent damage to the product. Fortunately, there are components available which provide protection from high voltage transients.

There are options for power line surge protection design and the design engineer should be aware of the advantages and disadvantages of each option. The options include over-voltage protection components such as metal oxide variators (MOVs), transient voltage suppression (TVS) diodes, gas discharge tubes (GDTs), and protection thyristors or Silicon Diodes for Alternating Current (SIDACs). Littelfuse, a manufacturer of circuit protection devices, manufactures a unique version of these devices under the trade name, SIDACtor®.TVS diodes and MOVs are clamp-type components, while GDTs and protection thyristors are crowbar-type devices.

Clamping, in this application, is defined as holding the voltage across the component at, approximately, a fixed level when the component’s overvoltage threshold is exceeded.

Crowbarring refers to limiting the voltage to a small value when the component’s overvoltage threshold is exceeded.

A crowbar device effectively turns on like a digital switch in response to an overvoltage.

Clamp-type devices have faster response times, but they are limited in their current handling capacity. These devices also have a clamping voltage that is a function of conducted current. Since the clamping voltage is higher than the voltage that a crowbar device would have when both devices are in their overvoltage protection state, the clamping device will allow a lower peak current for a high voltage transient.

The crowbar-type devices can handle much higher surge currents since the clamp voltage is very low when the device

switches to its on-state. The near-short condition shunts the transient energy away from the circuitry of the product. The low voltage that the crowbar component presents to the product circuitry further reduces any stress on the product.

MOV and TVS components, the clamping-type protection devices, can handle high peak currents. MOVs can withstand transient current peaks up to 70kA. They are low cost protection devices, but they do have the disadvantage of higher offstate leakage currents. TVS components do not have the peak current capacity of the MOV, they do have a lower on-state clamp voltage. The TVS devices have a longer lifetime than the MOV devices as MOV devices can be degraded by sustained overvoltage conditions leading to excessive heat dissipation in the device. Both MOV and TVS components have higher parasitic capacitance than crowbar-type devices which allows high overshoot when subjected to high dv/dt or high di/dt transients.

The two clamp-type components, the GDT and the SIDACtor, are significantly different. The SIDACtor is a semiconductor device while the GDT relies on a gas to break down and conduct current when a threshold voltage is reached. Similar to an MOV, the GDT has a limited lifetime based on the number of times the gas is ionized and conducts. The gas is adsorbed on the electrodes after it is ionized. The GDT can withstand large peak currents, but has a much slower response time than the SIDACtor. The GDT cannot prevent very narrow high voltage transients from passing through to the product.

Of the four surge protection components, the SIDACtor has the best combination of properties for AC power line protection.

It offers a long lifetime independent of the number of high voltage transients to which the device is subjected. The SIDACtor has a low on-state crowbar voltage level and a fast turn-on characteristic. It has the least overshoot for high dv/ dt or high di/dt surges and a low, off-state leakage current.

Table 1 compares the four types of protection devices.

Table 1. Characteristics of four high voltage transient circuit devices. The GDT and SIDACtor crowbar the transient to a low voltage. The MOV and TVS clamp the transient to a fixed voltage level.

Figure 1 shows the characteristic curve for the a SIDACtor.

Below VDRM, the maximum off-state voltage, the SIDACtor has a low leakage current, IDRM. The Leakage current is on the order of a few microamps. When the voltage reaches, VS, the device’s peak threshold voltage, the device turns on and switches to a low holding voltage, VT. The SIDACtor can support a large transient current since the voltage across the component is crowbarred at the low voltage, VT. A SIDACtor that can handle a peak surge current of 5000A is housed in a standard TO-218 case for easy printed circuit board layout.

Fortunately, fully protecting devices from high voltage transients takes only a few components.

Figure 2 shows a 3-component solution for protecting a product’s power circuitry. The SIDACtor is paralleled with the power circuit to provide protection from a transient on the AC power line. Since the SIDACtor is in parallel with the power circuit, the SIDACtor has no effect on the performance of the product when no high voltage transients are on the AC line. The SIDACtor, with its low leakage current, consumes only milliwatts of power at nominal AC power line voltages.

The fuse in series with the SIDACtor protects the component from a current surge lasting a single, complete AC line cycle or multiple AC line cycles. The series fuse provides traditional overcurrent protection for the power circuit. The series fuse is placed after the SIDACtor circuit to protect the fuse from high voltage transients. This 3-component network provides both overvoltage and overcurrent protection for the power circuit.

Figure 3 shows the SIDACtor’s fast response to an AC line transient. The green curve is the high current waveform resulting from the voltage transient. The blue line shows how the SIDACtor quickly responds to crowbar the voltage to a safe, low level for the power circuit.

Figure 2. Protection network using a SIDACtor for high voltage transient protection, a fuse to protect the SIDACtor from a BISINFOTECH •Vol - 2/04 •April 2020

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Crowbar Protection Thyristors sustained overvoltage condition, and a fuse for protection of the power circuit from an overcurrent condition.

Figure 3. SIDACtor response (blue trace) to a current surge (green trace) resulting from a high voltage transient A SIDACtor can also be used in combination with a MOV to provide low voltage clamp protection for circuits that can be damaged by high clamping voltages.

See Figure 4. The impedance of the MOV lowers the maximum current following a transient by a factor of at least five which lowers the total instantaneous energy absorbed by the SIDACtor and ensures the SIDACtor is protected. A second important advantage of the combination is that the leakage current is lower than the leakage current drawn by the MOV by itself. For products that must meet low power consumption standards, minimizing the leakage current drawn by the device when it is in its off state or standby state is essential for maximizing power efficiency

Figure 4B. The SIDACtor-MOV series combination limits a transient with a 3kA surge to only 43.2A (orange trace). The blue trace shows the transient voltage clamped by the MOV An inverter, Figure 5, is an application that can use a SIDACtorMOV combination for AC power line surge protection. The SIDACtor-MOV combination protects the inverter drive circuitry from differential high voltage transients. Parallel MOVs protect against surges in the neutral-to-ground connection when the AC mains have a relatively high impedance for neutral lines. For inverters powered by three-phase AC lines, a SIDACtor-MOV combination is recommended for each phase of the threephase AC line. This protection topology is also recommended for use in electric vehicles and hybrid electric vehicles as well as for photovoltaic-powered inverters.

Figure 5. A recommended protection network for a power inverter circuit includes a MOV and a SIDACtor in series for lineto-line protection and an MOV pair for line-ground protection

Figure 4A. A protection network using a SIDACtor in series with a MOV. The fuse provides overcurrent protection

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There are a number of different components that provide levels of protection from high voltage transients. For AC power line protection, the SIDACtor is the most cost-effective component available on the market. It features a low on-state crowbar voltage, fast response to a transient event, long life, and can withstand a high surge current. Combined with fuses for overcurrent protection, the SIDACtor or the series combination of a SIDACtor-MOV provide an excellent and simple protection network for a product’s power circuit.

EV

BOOST FOR ELECTRIC VEHICLE MARKET AS MITSUBISHI ELECTRIC INTRODUCES NEW POWER SEMI CONDUCTOR MODULE FOR MOTOR DRIVE APPLICATIONS IN HYBRID VEHICLES AND EVS The Indian government has ambitious plans to shift on a mass scale to electric vehicles (EVs) by 2030. The plans are opulent and certainly hold several paybacks for environment conservation.

While the transformative thrust for electric vehicles is a very positive move for India and the world, it Hitesh Bhardwaj presents myriad General Manager, Semiconductors & Devices opportunities asMitsubishi Electric India Pvt. Ltd. well as challenges.

Mitsubishi Electric has already taken a step towards making the idea of mass scale shifting to electric vehicles a reality. The company recently launched a new J-Series transfer molded power semiconductor module (T-PM) mainly for motor drive applications in electric and hybrid vehicles. It is known that automotive components must especially meet stringent safety standards, which creates demands for power semiconductor modules that provide greater reliability than modules for industrial equipment. Mitsubishi Electric pioneered the mass production of power semiconductor modules for hybrid

vehicles in 1997.The company’s new module is expected to contribute to further compactness, weight reduction and reduced power consumption in inverters for electric and hybrid vehicles. It has some cutting-edge features like reduced inverter size and weight achieved through the extra compact package with high integration. The compact power semiconductor module features a highly integrated sixth-generation IGBT with a carrier-stored trench-gate bipolar transistor (CSTBTTM) structure and high-thermal conductivity isolation sheet in a transfer molded package. It realises compact EV/HEV inverter designs by achieving 36% smaller footprint and 42% lighter weight compared with the existing J-Series CT300DJH060 automotive power semiconductor module.

Another important feature is inverter power-loss reduction supported by low-loss power semiconductor chips. It realises low power-loss EV/HEV inverter designs through the utilization of sixth-generation IGBT achieving 12% lower collector-emitter saturation voltage compared with the existing J-Series. The new module is automotive-grade high quality and features transfer molded structure and Mitsubishi Electric’s original Direct Lead Bonding (DLB) structure. Its power-cycle and temperature-cycle life spans are 30 times longer than those of typical industrial power semiconductor modules. The powercycle lifespan is based on repetitive operational tests with the chip energised and the temperature rapidly changed within a range of 50°C and 100°C. The temperature cycle lifespan is based on repetitive operational tests with the temperature modulated between -40°C and 125°C without the chip being energised. The new module is completely lead-free, including its terminal plating.

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Power

High-Performance ZVS Buck Regulator Removes Barriers to Increased Power Throughput in Wide‑Input-Range Point-of-Load Applications C. R. Swartz Principal Engineer, Vicor

Introduction

that must be dealt with. These problems are magnified at The need for higher power density in today’s electronic systems higher input voltage and frequency, making faster switching combined with higher overall efficiency has driven many less attractive over a wider operational range requiring higher changes in the non-isolated point-of-load Regulator (niPOL). voltage or frequency.

In an effort to improve overall system efficiency, desigers 2. Body Diode Conduction: The conduction of the synchronous are opting to avoid multiple conversion stages to get to the switch-body diode is detrimental to high efficiency and limits regulated point-of-load voltage they need. This means that how high the switching frequency can be. The synchronous the niPOL is operated at higher input voltages with higher switch-body diode usually has some conduction time before conversion ratios than ever before. Despite this fact, the the high-side switch turns on and also after the synchronous niPOL is expected to maintain the highest efficiency and still MOSFET turns off. continue to shrink the total size of the power solution. There is 3. Gate Drive Loss: Switching the MOSFETs at high frequency also the added expectation that with all other performance causes higher gate-drive losses. increases that power demand from the niPOL also further This paper will illustrate the challenges of hard switching in increases. The power industry has responded to this challenge a moderate and high switching frequency environment by introducing many technological upgrades to the niPOL. by comparing simulation models of two designs using the Over the past few years, the industry has seen significant conventional buck-regulator topology. A new buck-regulator improvements in device packaging, silicon integration and topology called "ZVS Buck" will be introduced and its integration MOSFET technology, yielding highly integrated, compact into the Cool-Power® ZVS Buck product family will be explained. solutions. While these solutions work well over a narrow voltage A simulation model of the new ZVS Buck regulator will show range, the efficiency and throughput power tend to drop how its novel Zero-Voltage-Switching topology achieves very slightly at modest step-down ratios of 10:1 or 12:1 and fall off high power density, efficiency, throughput power capability dramatically when they are subjected to a wide input range and wide dynamic range by reducing the effects of these that can be higher, with a step-ratio approaching 36:1. Of all three operational challenges. The ZVS Buck topology’s many the changes applied to the niPOL in the past few years, the benefits will be described along with the theory of operation. least amount of change has been the powertrain topology itself. Clearly, we have seen countless control topologies like Simulation Model current-mode control, simulated current-mode control, digital control, etc., and powertrain improvements like synchronous rectification and adaptive drivers. These technologies have resulted in either incremental improvements and/or additional design complexities. The hard-switched buck-regulator topology itself greatly limits improvements in the power density and throughput in a wide dynamic operating range. In order to reduce the size of a power system, you must reduce the size of its critical components. The best way to achieve this is to increase the switching frequency. Therein lies the difficulty.

Increasing the switching frequency with a hard-switched topology is like increasing the size of a leaky dam. There are basically three fundamental challenges: Figure 1 Conventional buck topology 1. Hard Switching: The simultaneous conduction of high current while there is high voltage imposed upon the main high-side Figure 1 shows a typical Conventional Buck Topology diagram switch causes frequency- and voltage-dependent switching and the associated parasitic inductances that may be losses and is a direct barrier to operating over a wide dynamic present as either the MOSFET parasitic inductances and/or the range. The next-generation MOSFET technology with better lumped parasitic inductance of the PCB traces themselves. In figures of merit (FOM) for switching speed should allow faster order to graphically show the limiting factors of this topology switching. Fast switching has its own set of problems; hard when used in higher frequency applications, a simulation switching (even fast switching) usually results in switch-mode model was constructed using best-in-class MOSFETs (and the spiking and ringing, as well as EMI and gate-driver corruption manufacturer’s SPICE models).

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The converter design is assumed to be operating from 36V input and stepping down to 12V with a full-load current of 8A. The simulations were run at 650kHz using a 2μH inductor and 1.3MHz using a 1μH inductor. The MOSFET on resistance was 10mΩ. The four parasitic inductances were set to 300pH for LSHS and 100pH for the other inductance values. Parasitic values are based on the available packaging technology and layout techniques associated with a Power-System-inPackage (PSiP) power design concept. The gate driver used 4Ω source resistance to minimize ringing and 1Ω sink resistance for the high-side driver for faster turn-off and 1Ω source and sink resistances for the low‑side driver in both cases.

Hard Switching Figure 2 shows the simulation results of the instantaneous power dissipation in the high-side MOSFET Q1 versus the VS node voltage and current waveforms for Q1 (Green), Q2 (Red) and the output inductor LOUT (Blue).

Figure 2 650kHz simulation 500ns/div The simulation results reveal that there are very high losses at turn-on and somewhat lower losses at turn-off. The area in between are the MOSFET RDS_ON dominated losses, which are quite low. Dramatically improved MOSFET RDS_ON has occurred over the past few years. In most current designs, the conduction loss is low and more easily managed. When the instantaneous power was integrated over the switching cycle, it was found that the average power dissipation of the high-side MOSFET at 650kHz was 1.5W, with 0.24W conduction, 0.213W turn-off and 1.047W occurring at turn-on. The primary contributor to the total loss is Q1 turn-on.

Figure 3 is a snapshot of the area just prior to and including the leading edge of the turn of the high‑side MOSFET Q1.

There is a 30ns dead time between the low-side MOSFET Q2, turning off and the turn-on of Q1. This dead time is meant to ensure that cross conduction of the MOSFETs does not happen at turn-on. As a result, the body diode must commutate the current freewheeling through the output inductor. The body diode of Q2 is forward biased during this time and charge is stored in the PN junction of the diode. This charge must be swept away before the diode can block reverse voltage. This process is known as reverse recovery.

In Figure 3, the drain to source voltage of Q1 is very high; near

VIN, (influenced by the parasitic inductance of the layout) while there is very high current flowing into the body diode of Q2. The peak power is very high as Q1 must burn the reverse recovery charge of the Q2 body diode while at the same time exposed to nearly the full input voltage. The inductance in the source of the high-side MOSFET LSHS does not help this situation very much. At turn-on, this inductance takes away gate drive from the MOSFET due to the reverse recoverycurrent voltage drop across it. This voltage drop is in the wrong direction, pushing the source voltage up with respect to the gate, while the driver is struggling to overcome the Miller effect of turn-on. This results in a longer period of time in the Miller region and higher power dissipation in the high-side MOSFET and driver. As a result, the MOSFET can not enter the low-resistance region until the Q2 body diode has recovered and can block voltage. During the recombination time after the peak recovery current has reached its maximum value, power is burned in the body diode of Q2 since it is exposed to simultaneous reverse current and reverse voltage. The power dissipation ends in the body diode after recombination is completed.

Figure 3 650kHz simulation 20ns/div reverse-recovery effect The power dissipation can be slightly reduced in the high-side MOSFET by speeding up its gate drive. However, speeding up the gate drive so that Q1 will traverse the linear region more quickly will result in faster reverse recovery of the body diode of Q2 by injecting a higher reverse-recovery current. The result will be a faster rising VS node due to the stored energy in the parasitic inductances. Figure 4 shows the gate drive of our 650kHz simulation and the effect of LSHS on the drive of Q1 if it were increased 200 – 500pH. Note that a bump shows up on Q2 during the rising of VS. This bump is coupled to the gate driver of Q2 due to the Miller capacitance of Q2 and the dV/dt of the VS node. It is not difficult to imagine the effect of speeding up the drive to Q1. A faster dV/dt will cause a bigger bump on the gate of Q2 and more ringing. If Q2 is a low-voltage device with low gate threshold, Q2 may be gated on and cause a periodic cross conduction. This cross conduction may or may not be destructive, but lower efficiency definitely will result. Higher energy stored in the parasitic inductance may also cause excessive voltage on the MOSFETs and may even require dissipative snubbing.

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Power

Figure 4 650kHz simulation 20ns/div gate-drive effect of increasing LSHS to 500pH Higher-Frequency Operation The conventional buck simulation model was next operated with a smaller output inductor and at twice the switching frequency to keep the peak currents about the same. No other changes were made to the model. At 1.3MHz, the total simulated losses in the high-side MOSFET increased to 2.73W, As expected, the turn-on and turn-off losses doubled as compared to the 650kHz simulation. The RMS switch current in Q1 remained the same so the conduction losses did not change significantly.

Considering just the losses in Q1 alone, doubling the switching frequency will result in an efficiency drop of 1.2% minimum.

The impact on efficiency would be significantly greater if the conversion ratio was higher. These results indicate that this is not the best method for size reduction and increased power throughput. To reduce the size of a power solution and still produce meaningful output power capability, the switching losses need to be addressed, enabling increased switching frequency.

ZVS Topology Figure 5 shows the schematic diagram for the ZVS Buck topology. Schematically, it is identical to the conventional buck regulators except for an added clamp switch that connects across the output inductor. The clamp switch is added to allow energy stored in the output inductor to be used to implement Zero-Voltage Switching.

Figure 5 ZVS Buck topology

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Figure 6 ZVS buck timing diagram The ZVS Buck topology consists of basically three main states.

They are defined as Q1 on phase, Q2 on phase and clamp phase. In order to understand how the Zero-Voltage-Switching action occurs, you have to assume that Q1 turns on at nearly zero voltage following a resonant transition. Q1 turns on at zero current and when the D-S voltage is nearly zero. Current ramps up in the MOSFET and output inductor to a peak current determined by the on time of Q1, the voltage across the inductor and the inductor value. During the Q1 on phase, energy is stored in the output inductor and charge is supplied to the output capacitor. The area marked in yellow shows the equivalent circuit and current flow corresponding to the Q1 on phase. During the Q1 on phase, the power dissipation in Q1 is dominated by MOSFET on resistance. The switching loss is negligible.

Next, Q1 turns off rapidly followed by a very short body diode conduction time of less than 10ns. This body diode conduction time adds negligible power dissipation. During the current commutation to the body diode, Q1 does experience turn-off losses in proportion to the peak-inductor current. Next Q2 turns on and the energy stored in the output inductor is delivered to the load and output capacitor. When the inductor current reaches zero, the synchronous MOSFET Q2 is held on long enough to store some energy in the output inductor from the output capacitor. This is noted by the inductor current going slightly negative. The Q2 on phase and equivalent circuit can be seen in the blue shaded area.

Once the controller has determined that there is enough energy stored in the inductor, the synchronous MOSFET turns off and the clamp switch turns on, clamping the VS node to VOUT. The clamp switch isolates the output inductor current from the output while circulating the stored energy as current in a nearly lossless manner. During the clamp phase time, (which is very small) the output is supplied by the output capacitor.

When the clamp phase ends, the clamp switch is opened.

The energy stored in the output inductor resonates with the parallel combination of the Q1 and Q2 output capacitances, causing the VS node to ring towards VIN. This ring discharges the

output capacitance of Q1, diminishes the Miller charge of Q1 and charges the output capacitance of Q2. This allows Q1 to turn on when the VS node is nearly equal to VIN and in a lossless manner. The clamp phase of operation, including the resonant transition and equivalent circuit, is shown as the green section. Here it is important to point out that when the clamp switch is on, the current circulates as shown by pink current loop and when the switch is off, the current flows as shown by the red arrows.

This topology addresses the limitations shown previously in several important ways: 1. As long as there is a clamp phase, there is no body-diode conduction that requires high reverse‑recovery current prior to turning on the high-side MOSFET. 2. The turn-on losses are almost totally eliminated.

3. The high-side MOSFET gate drive is unaffected by the parasitic inductance LSHS. The Miller effect is removed from the high-side MOSFET at turn-on due to the ZVS action and lack of turn-on current slug. This allows the high-side gate driver to be smaller and consume less power. The high-side MOSFET does not have to turn on particularly fast, allowing for smooth waveforms and less noise.

much greater; i.e., 1.37W. From the power curve in Figure 8, it can be seen that the turn-on losses are virtually zero and there is no high-current spike in Q1 at turn-on. There is no body-diode conduction prior to the turn-on of Q1 and no reverse-recovery effects, including reverse-recovery loss in the body diode of Q2.

The figure shows the resonant transition ZVS action consisting of the parallel combination of both MOSFET (Q1 and Q2) output capacitances ringing with LOUT. It can also be seen that the turn-on of Q1 does not happen exactly at zero volts. The best overall efficiency is generally obtained by switching Q1 with some residual voltage across it to reduce the amount of stored energy requiring circulation during the clamp phase.

There is a tradeoff made to minimize the losses associated with clamp phase versus the power savings by switching Q1 at exactly zero volts. The gate driver turn‑on losses also benefit from the removal of the Miller charge that occurs as a result of ZVS action. The driver does not have to discharge the G-D capacitance of Q1, so the losses in the high‑side driver go down. In addition, the high-side driver does not have to struggle against the parasitic inductance LSHS at turn-on since the driver supplies less charge at turn-on and there is no highcurrent slug storing energy in LSHS.

Comparison Simulation Figure 7 shows the schematic of the ZVS Buck topology with the previous parasitic inductance values used. A simulation was run of the same 36V to 12V regulator operated at 8A at 1.3MHz to compare the losses in the high-side MOSFET with those of the previous designs. The ZVS Buck used a 230nH inductor and the same MOSFETs and gate driver characteristics used in the previous simulations.

Figure 7 ZVS Buck with parasitic inductances Figure 8 shows the simulation results of the ZVS Buck topology running at 1.3MHz and the corresponding instantaneous power curve for the high-side MOSFET, Q1. The average power dissipation including switching losses and conduction losses measured 1.33W in the high-side MOSFET Q1, even lower than the conventional regulator operated at half the switching frequency and using a larger inductor. The savings in the high-side MOSFET power consumption when comparing the results of both design simulations at 1.3MHz is

Figure 8 ZVS Buck simulation waveforms Figure 9 shows the performance difference between a current, competitive hard switched solution and the performance of the ZVS Buck topology in a 24VIN to 2.5VOUT (9.6:1) 10A design. The full‑load-efficiency difference is nearly 6.5%, (with a notable difference in light‑load efficiency as well) resulting in an improvement of greater-than-52% in power loss at the measurement point of 9A. BISINFOTECH •Vol - 2/04 •April 2020

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Power the output load requirement. This allows implementation of a very simple current-sharing method for connecting Si’s in parallel to increase output power. Only a single connection needs to be made to each PI33xx error amplifier to share the load accurately. Additional connections can be made if the user wishes the units to track one another and be synchronized together. The PI33xx can be synchronized with like models, up to six in parallel, using interleaving. The PI33xx has nearly ideal synchronous-rectifier drive, allowing only single digit nanosecond-body diode-commutation times between turnoff of the high-side MOSFET to turn-on of the synchronous MOSFET. This helps reduce turn-off losses in the high-side MOSFET and body diode conduction losses. In addition to the high efficiency benefits at high loads, the PI33xx uses a very-high efficiency-biasing system and pulse‑skipping mode that achieves outstanding light-load efficiency as well. See Figure 9.

Figure 9 ZVS Buck 9.6:1 step down 24 – 2.5V @ 10A performance vs competitive solution Additional Benefits By integrating the ZVS Buck topology with the Vicor highperformance silicon-controller architecture, the PI33xx family of wide-input-range DC-DC regulators is developed. This DCDC solution consists of a 10 x 14mm SiP containing all of the circuitry required to form a complete power system with the addition of an output inductor and a few ceramic capacitors.

The high switching frequency allows the inductor to be very small and the total solution size to be smaller (25 x 21.5mm) than competitive integrated solutions, while producing up to 120W of output power with a peak efficiency of 98%. With a 20ns minimum on time, the PI33xx can operate from 36V input to 1V output at 10A load with an efficiency exceeding 86% and no reduction of output current over the range of output voltages from 1V to 15V. The combination of advanced silicon and the ZVS Buck topology yields some additional benefits to wide-input range and high efficiency. Since the ZVS topology is inherently stable with a control‑to‑output transfer function having a gain slope of –1 and a phase shift of 90°, a very wide‑bandwidth feedback loop is possible, aided by high switching frequency. The PI33xx requires no external compensation (although it is possible to add some). The closed-loop crossover frequency typically is 100kHz with 55° of phase margin and 20dB of gain margin. The high closedloop gain and small-output inductor allow the closed-loop output impedance to be low over a wide-frequency range.

This results in very fast-transient response, with recovery times in the 20 – 30μs range while using modest ceramic outputcapacitance values and without the aid of additional bulkstorage capacitors. A very accurate-input feed-forward method allows the error amplifier-output voltage to accurately reflect

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Flexibility The high-performance silicon-controller architecture utilizing zero-voltage switching can be applied to other topologies like the Boost topology and the Buck-Boost topology and yield similar benefits just by rearranging the power switches. This will allow virtually any combination of power conversion to take place at high efficiency and even higher input voltages while incurring low switching losses, producing high throughput power and decreasing the solution size.

Conclusion This paper introduced and detailed the challenges that have existed up to now when attempting to operate the conventional Buck topology at high input voltage and switching frequency.

Operation of a buck converter at high frequency and input voltage is desirable to reduce the overall size of a power system solution so that it could be used to replace dual conversion stages and operate over a wider input range at high efficiency.

It has been shown that in order to operate at higher switching frequencies, turn-on losses of the high-side MOSFET need to be reduced or eliminated. ZVS Buck topology was presented as the means to achieve the required size reduction without reducing throughput power. A new product, called the PI33xx was introduced that utilizes a Vicor high‑performance silicon‑controller architecture and contains the necessary features to allow wide input range 8 – 36V input to various outputs such as 1, 2.5, 3.3, 5, 12 and 15V at high throughput power and efficiency. Finally, it was explained that the same high performance silicon controller architecture can be used to address hard-switching applications that are typically done with either Boost or Buck-Boost topologies, yielding significant throughput-power and density improvements. The author is a Principal Engineer at Vicor Corporation. He has more than twenty-five years experience in power systems design and is a member of the IEEE.

Automotive Market

Automotive Electronics Market $615.3 Bn by 2030

As per Organisation Internationale des Constructeurs d'Automobiles (OICA), in 2018, 95.1 million commercial and passenger vehicles were sold, and between 2014 and 2018, the number rose at a CAGR of 1.8%. In the coming years too, the demand for automobiles is predicted to increase, primarily in China, Indonesia, Thailand, Brazil, and India. Additionally, from just 5% in 1970, the share of electronic components in the total cost of automobiles is expected to touch 50% by 2030, which reflects technological advancements in such components as well as their increasing significance in vehicles.

Driven by such factors, the global automotive electronics market, from its value of $235.7 billion in 2019, would progress to $615.3 billion by 2030, at a 9.3% CAGR during the forecast period (2020–2030).

Current Carrying Devices to Register Fastest Market Growth Current carrying devices are expected to record the fastest automotive electronics market growth, on the basis of component, during the forecast period. This is because almost 200 electronic switches and fuses are installed in an automobile to make it functional. With the increasing vehicle production, to cater to the rising demand, the usage of electronics will also surge. The driver assistance system category, based on system, is projected to observe the highest CAGR, of 10.7%, in the automotive electronics market, during the forecast period, in terms of revenue. The major reason behind this would be the quick increase in the adoption of autonomous vehicles, which are currently either in the development phase, especially after 2023. Additionally, with advancements in driver assistance systems, with respect to passenger and pedestrian safety, they would be rapidly integrated in automobiles. In 2019, passenger cars, under the vehicle segment, dominated the automotive electronics market. This is because almost 70% of the automobiles sold in 2019 were passenger cars.

Further, all the new technologies being worked upon, such as autonomous driving and electric propulsion, are first tested on passenger cars, and the integration of these technologies require electronic components in significant amounts.

Massive Growth for Automotive by 2027

The global automotive infotainment SoC market accounted for US$ 8.69 Bn in 2018 and is expected to grow at a CAGR of 7.2% during the forecast period 2019 – 2027, to reach US$ 16.08 Bn by 2027. The automobile industry in developed and developing economies is undergoing a digital makeover.

Many industrial players in the automotive industry are investing considerable resources in the R&D of vehicle automation so as to meet the changing demands and enhance the driving experience of customers. Next-generation automobiles such as audiovisual sensing, speech recognition, image compatibilities, advanced driver assistance, GPS and radar capabilities, next-level security and safety, and IC-integrated

LED front lighting. Major countries considered in the Asia Pacific region include China, India, Japan, South Korea and Rest of APAC. The Asia Pacific is one of the world’s rapidly growing passenger car markets, with China accounting for close to 30% of the global passenger car production. The continuous economic growth in developed and developing countries like India and China, coupled with the presence of huge disposable incomes with individuals in countries like Japan and Australia, has facilitated the rapid growth of the automotive industry in this region. Increasing disposable incomes of the consumers has translated into the purchase of a large number of medium-range cars. In addition to this, China and India are considered among the largest manufacturing hubs globally on account of several factors, such as lower labor wages compared to other countries and supportive favorable Government policies. The Asian countries have attracted several foreign direct investments in many industrial fields, including automotive. The rapidly growing economies have translated into rising per-capita incomes and consumer expenditures. As a result of this, the APAC region witnessed very high growth in the sales of automobiles in recent times.

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Industry Kart

Arrow Partners With Xunzel Arrow Electronics has entered into an agreement with Xunzel to supply a range of products to enable renewable energy installations. Xunzel is a global supplier of state-of-the-art technology for solar and wind off-grid, offshore, mobile and backup power. Applications are expected to be within the industrial and consumer electronics sectors and the Internet of Things (IoT). Xunzel designs its off-the-shelf solutions with user experience at the top of its priority list. The company’s plug-and-play products include system components such as power converters, inverters and chargers, as well as photovoltaic solar panels, solar batteries, and charge controllers. Xunzel also offers solar-powered lighting solutions and a range of lighting and power kits suitable for user installation. The addition of the Xunzel product portfolio further strengthens Arrow’s offering in a broad range of electronics and IoT applications. These include monitoring, control and telemetry for smart cities, access control and automation systems, security and surveillance, and road safety management. Arrow is representing Xunzel throughout Europe, Middle East and Africa (EMEA).

Digi-Key, Quest Technology International Collaborates Digi-Key Electronics has recently announced that it has expanded its product portfolio by signing a North American distribution partnership with Quest Technology International and Quest Manufacturing. The new partnership will provide Digi-Key customers with an “all-inone” shopping experience that includes both industrial enclosures, wall cabinets, server racks, and accessories, as well as ethernet, HDMI and audio products, fiber optics, and installation tools. This expansion is part of the DK+ initiative, Digi-Key’s continued growth as a world-class distributor to provide products, services, and solutions for all phases of the technology innovation ecosystem.

As Digi-Key continues to expand its offerings to support all the needs of its customers, Quest’s telecom floor racks, accessories, wire management products, installation tools, and more are a key element to round out the end-to-end solutions Digi-Key offers for anyone driving technology innovation today.

R&S Power Supplies At Farnell element14 New Research On IoT Farnell has added Rohde & Schwarz’s NGP800 Series of power supplies to its portfolio. The new generation NGP800 Series is made up of five 2- and 4-channel models operating at either 400W or 800W, suited for both bench-top and automated test systems. Design and Test Engineers will benefit from a market leading performance in connectivity, safety, functionality and flexibility. Rohde & Schwarz is known for flexible products offering long-term durability, uncompromising quality, environmental compatibility and an eco-footprint.

The new NGP800 series of power supplies have a 5” highresolution touch display that makes synchronising outputs, performing waveform tests and logging data for in-depth analysis easy. All models come with a 3-year warranty as standard and users benefit from features such as: • Full flexibility • Full safety • Full functionality • Full connectivity Farnell offers an extensive range of products to support electronic design, manufacture and test engineers. Customers also have free access to online resources, data sheets, application notes, videos and webinars on Farnell’s website and 24/5 technical support.

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element14 has published new research on the Internet of Things (IoT) which confirms strong adoption of Artificial Intelligence (AI) within IoT devices, alongside new insights on key markets, enablers and concerns for design engineers working in IoT. AIoT is the major emerging trend from the survey, demonstrating the beginning of the process to build a true IoT ecosystem. Research showed that almost half (49%) of respondents already use AI in their IoT applications, with Machine Learning (ML) the most used technology (28%) followed by cloud-based AI (19%). This adoption of AI within IoT design is coupled with a growing confidence to take the lead on IoT development and an increasing number of respondents seeing themselves as innovators. However, it is still evident that some engineers (51%) are hesitant to adopt AI due to being new to the technology or because they require specialized expertise in how to implement AI in IoT applications. Other results from element14’s second Global IoT Survey show that security continues to be the biggest concern designers consider in IoT implementation.

Heilind Stocks JAE's FR02 Series

Mouser Electronics New Product Insider: March 2020

Heilind Electronics has now stocked JAE's FR02 Series connectors.

The FR02 Series is a top- and bottom-surface connection type of FPC connector that is ideal for use in mobile devices, such as smartphones and tablet PCs. This connector has a 0.2 mm pitch and meets the industry's demand for space-saving, smaller connectors.

Features: •0.2 mm pitch, 0.82 mm height, and 3.0 mm depth (the industry's smallest-in-class), rear-flip-type FPC connector.

• LIF (low insertion force) horizontal insertion structure with secure retention force.

• Tapered guides in the insertion area improves ease of assembly.

• Compliant with top- and bottom-surface FPC connection and raises the customer's layout flexibility.

• Rigid and robust actuator design prevents half mating when only one side of the actuator is pushed by the operator.

• Has a structure that prevents the actuator from coming off and gives good operational feeling during the opening and closing of the actuator.

• PCB traces can be routed in the area under the connector body (excluding the terminal area).

Mouser Electronics giving customers an edge and helping speed time to market.

Over 800 semiconductor and electronic component manufacturers count on Mouser to help them introduce their products into the global marketplace.

Mouser's customers can expect 100% certified, genuine products that are fully traceable from each manufacturer.

Last month, Mouser launched more than 329 new products ready for same-day shipment.

Some of the products introduced by Mouser last month include: • Intel NUC Mini PCs Intel Next Unit of Computing (NUC) mini PCs offer high-performance capabilities in a space-saving design ideal for applications such as home theater, home office, entry-level gaming, industrial/commercial kiosks, and digital signage.

• Osram Opto Semiconductors PLPT9 450LA_E Blue Laser Diode Osram Opto Semiconductors PLPT9 450LA_E blue laser diode achieves an optical power of 3 W and emits a highly concentrated visible light with a wavelength of 447 nm.

New Yorker Electronics Releases Vishay Dale E-Shield Inductors

RS Components Introduces T&M Kits from Keysight

New Yorker Electronics is now distributing the newly extended Vishay Dale IHLE series of low profile, high current inductors featuring integrated e-shields. These e-shields reduce EMI in new commercial and Automotive Grade devices. The Vishay Dale IHLE-5050FH-51 and IHLE-5050FH-5A inductors reduce costs and save board space by eliminating the need for separate board-level Faraday shielding. These new inductors contain the electric and B field associated with EMI in a tin-plated copper integrated shield. These wirewound inductors provide up to -20 dB of electric field reduction at 1 cm (above the center of the inductor) when the integrated shield is connected to ground. They are packaged in a 100% lead (Pb)-free shielded, composite construction that reduces buzz to ultra low levels. It also demonstrates high resistance to thermal shock, moisture and mechanical shock. They are used for energy storage in DC/DC converters and high current filtering in such products as desktop PCs and servers, high current POL converters, low profile, high current power supplies and battery-powered devices. They also have many automotive applications such as engine and transmission control units, diesel injection drivers.

RS Components (RS) has stocked a wide selection of products from Keysight Technologies. The InfiniiVision 4000X and 6000X series of oscilloscopes offer large displays and large touchscreen displays with a unique ‘zone trigger’ feature, which helps engineers, scientists and technicians to isolate hard-to-capture signals. The multi-function scopes also feature the industry’s fastest waveform update rate of one million waveforms per second. Both families are expected to find use in a series of applications including embedded system design and debug, power design and analysis, in the automotive field, and in many other systems that require analogue, digital, serial and RF signal analysis.

The higher-end 6000X series also offers performance up to 6GHz and 20G-sample/s and combines digital channels, serial protocol analysis, built-in dual-channel waveform generator, frequency response analysis, built-in digital multimeter and 10-digit counter with totalizer. In addition, it weighs 6.8kg and is 15.4cm deep, and consumes only 200W, making it the world’s most environmentally friendly multi-GHz portable oscilloscope.

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NEW LAUNCH Infineon New 600 V CoolMOS PFD7 Series Infineon Technologies broadens its CoolMOS portfolio with the PFD7 product family combining best-in-class performance with state-of-the-art ease of use. The devices are suitable for ultrahigh power-density designs such as chargers and adapters as well as for low-power drives and specific lighting applications.

Features: • Minimized switching losses • Improved thermal behavior make this product family the ultimate choice for contemporary engineering designs.

Applications: Low-power drives and specific lighting applications.

Availability: Available Now

Electrolube New Thermal Gap Fillers Electrolube has launched a new range of thermal gap fillers that provide a highly effective heat transfer solution for many different applications. The new gap filler range includes the GF300 and GF400 products.

Features: • Both of these thermal interface materials are two part, liquid silicone-based fillers, which provide excellent thermal performance of 3.0 W/m.K (GF300) and 4.0 W/m.K (GF400).

• Both products reduce the risk of air pockets forming by effectively filling the entire heatsink

Applications: Ideal for applications where the gap is nonuniform such as between multiple components and a collective heatsink/case.

Availability: Available Now

Holtek Multi-Standard NFC Reader The BC45B4523 is a single-chip reader ASIC for 13.56MHz NFC/contactless standard protocols, which provides the best solution for near field wireless communication applications such as access control locks, label readers, payment machines.

Features: • The device supports and compatibles with all major global secured baseband ISO standards including ISO14443 Type A, Type B, Crypto_M cards and Smart label ISO15693.

Applications: Near field wireless communication.

Availability: Available Now

Microchip Technology Launches CEC1712 MCU Microchip Technology has announced a new cryptography-enabled microcontroller (MCU), the CEC1712 MCU with Soteria-G2 custom firmware – designed to stop malicious malware such as rootkit and bootkit for systems that boot from external Serial Peripheral Interface (SPI) flash memory.

Features: • Secure boot with hardware root of trust protection in a pre-boot mode for those operating systems booting from external SPI flash memory.

• Revocation and code rollback protection during operating life enabling in-field security updates.

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Applications: To stop malicious malware.

Availability: Pre-provisioning of customer-specific data is an option provided

by Microchip or Arrow Electronics.

NEW LAUNCH Mornsun Unveils SCM1502A Mornsun has recently launched 7V ~ 40V SCM1502A to meet DC contactor, relays, solenoid valves and other applications. The SCM1502A is energy-saving control IC for relay, which can reduce the pick-up and holding power consumption.

Features: • Operating temperature range 7~40V to meet the various application requirements of relays • Real-time detection of input voltage, precise setting of relay operating voltage

Applications: It can be widely used in DC contactor, relays, solenoid valves and other occasions

Availability: Available Now.

Renesas Unveils RX23E-A MCU Starter Kit Renesas Electronics has introduced a new Renesas Solution Starter Kit (RSSK) for developers working with the 32-bit RX23E-A microcontroller (MCU), which features one of the most highly accurate analog front ends (AFE) in the industry.

Features: • The new RSSK evaluation board allows users to check characteristics of the 24-bit ΔΣ A/D converter with high accuracy, regardless of analog development expertise levels.

Applications: Widely used in industrial devices, are also mounted on the evaluation board, allowing the development of applications with industrial networking standards support.

Availability: Available Now.

TI 40-A SWIFT DC/DC Buck Converter Texas Instruments (TI) has recently introduced a new 40-A SWIFT DC/DC buck converter, offering firstof-its-kind stackability of up to four integrated circuits (ICs). The TPS546D24A PMBus buck converter can deliver up to 160 A of output current at an 85°C ambient temperature – four times more current than competing power ICs. Features: • Shrink the power supply while optimizing thermal performance • Improve efficiency at high switching frequencies

Applications: Data center and enterprise computing, medical, wireless infrastructure, and wired networking applications.

Availability: The TPS546D24A is now available from TI and authorized distributors in a 5-mm-by-7-mm, 40-pin quad flat no-lead (QFN) package.

Xilinx Third Series in the Versal ACAP Portfolio Xilinx has announced Versal Premium, the third series in the Versal ACAP portfolio. The Versal Premium series features highly integrated, networked and power-optimized cores and the industry’s highest bandwidth and compute density on an adaptable platform.

Features: • Versal is the industry’s first adaptive compute acceleration platform (ACAP).

• Developed on TSMC’s 7-nanometer process technology

Applications: Versal Premium is designed for the highest bandwidth networks operating in thermally and spatially constrained environments, as well as for cloud providers who need scalable, adaptable application acceleration.

Availability: Available Now

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Industry Updates ALLPCB Resumes Full Production Hangzhou headquarters and SMT factory of ALLPCB have officially resumed full operation.

Top 10 PCB manufacturersIn addition, ALLPCB PCB factory in Anhui province, Jieyuan electronic technology has been approved by local government on February 10 to resume production, becoming one of the first batch enterprises in Guangde city, which has been in operation for an entire week now. Since the outbreak of the nCoV-19, it is very important for the battle of anti-epidemic to ensure the production of key epidemic materials. In particular, medical supplies, such as hospital ventilator, handheld thermometer and patient bracelet label printer, which are all inseparable from PCB. In total, ALLPCB has assisted in production of nearly 1500 pieces of PCB and 3700 sets of PCBA for the above medical materials.

InterMotion Completes Verification of its IP Portfolio

Aldec announces that InterMotion Technology has successfully completed the verification of its soft IP portfolio for the latest Lattice Semiconductor CrossLink FPGA family, using ActiveHDL for mixed-HDL simulation and debugging. Together with Lattice, InterMotion is in the process of completing the latest line of IP designs for the CrossLink FPGA family. The verification work on this development was greatly advanced by using Active-HDL Expert Edition with its powerful features and capabilities that gave InterMotion the ability to create, simulate and debug soft IP designs in a shorter time with improved quality of verification and reliability of codes.

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Faurecia Becomes a Member of eSync Alliance The eSync Alliance has announced that Faurecia, one of the world’s leading automotive technology companies, has become its latest member. The eSync Alliance is a multicompany initiative for end-to-end over-the-air (OTA) updating and data services for the connected car. The Alliance is based around eSync, a multi-vendor OTA platform of server and embedded software, which provides a secure bi-directional data pipeline between the cloud and electronic end devices in vehicles. eSync can deliver and update software and firmware over-the-air, while collecting real-time operational data from in-car devices. Leveraging a global network of co-operating suppliers, the eSync system can help prevent increasingly costly and inconvenient vehicle recalls.

Littelfuse Expands High Voltage Products for EV Littelfuse has recently announced the expansion of its DCN Series of high voltage direct current (DC) contactors. The new relay products enable design engineers to incorporate high voltage relay switching into a range of high current and high voltage applications.

The DCN Series of contactors deliver safe, reliable and efficient high voltage switching.

• Electric Vehicles (EV) • Automotive Electric Vehicle / Hybrid Electric Vehicle Charging Stations • Electric Forklifts • Battery Disconnect Units and Management Systems • Uninterruptable Power Supplies • Renewable Energy Storage Availability Requests for the DCN Series of DC contactors can be placed through authorized Littelfuse distributors worldwide.

Luminous Starts Work for Home Automation

Power Integrations New AEC-Q100 Automotive Qualification

Luminous Power Technologies has made entry into the home automation segment. Initially, it will be offering products in select markets.

Home automation refers to usage of wires and switches solutions to ensure a series of connected devices/ appliances at home. The home automation market is estimated to be at $1.5 billion in India, with an annual growth of 30 percent. The products in the segment include motion sensors, smart plugs and smart switches. Few appliance makers have til now ventured into the segment.

Right now, brands like like Anchor (Panasonic Life Solutions), Syska, Schneider Electric, Legrand and Crabtree offer home automation solutions. Luminous is a part of Schneider Electric India.

Power Integrations has announced that its SIC118xKQ SCALE-iDriver, a high-efficiency, single-channel gate driver for silicon carbide (SiC) MOSFETs, is now certified to AEC-Q100 for automotive use. Devices can be configured to support gate-drive voltage requirements of commonly used SiC MOSFETs and feature sophisticated safety and protection features. The SIC1182KQ (1200 V) and SIC1181KQ (750 V) SCALE-iDriver devices are optimized for driving SiC MOSFETs in automotive applications, exhibiting rail-to-rail output, fast gate switching speed, unipolar supply voltage supporting positive and negative output voltages, integrated power and voltage management and reinforced isolation. Critical safety features include Drain to Source Voltage (VDS) monitoring, SENSE readout.

New 600 V CoolMOS PFD7 Series For Ultrahigh Power-Density Designs

Tektronix, Coherent Partners

Building on superjunction technology innovations and more than 20 years of experience, Infineon Technologies broadens its CoolMOS portfolio with the PFD7 product family combining best-in-class performance with state-of-the-art ease of use. The devices are suitable for ultrahigh power-density designs such as chargers and adapters as well as for low-power drives and specific lighting applications.

Robustness and reliability gains together with increased efficiency, minimized switching losses and improved thermal behavior make this product family the ultimate choice for contemporary engineering designs. The CoolMOS PFD7 series supports the key trends of small and light mobile products and energy saving in major home appliances pushing the limits of affordable ultrahigh power-density. The devices are optimized for high efficiency, especially at light-load conditions and still being able to fulfill EMI requirements.

These switches offer best-in-class figures-of-merit RDS(on) x QRR. The excellent commutation ruggedness is enabled by the integrated fast body diode. The implemented Zener diode supports electrostatic discharge (ESD) protection up to 2 kV. Infineon offers a great variety of RDS(on) values ranging from 125 mΩ to 2000 mΩ. The broad package portfolio makes it easy to select the right parts for design fine-tuning to improve customers’ convenience.

Availability The CoolMOS PFD7 series is now available. More information can be found at www.infineon.com/600V-PFD7.

Tektronix and Coherent Solutions have signed an agreement to provide fully-integrated optical communications platforms to new and existing customers in support of the growing global demand for communications across the telecom, datacom, defense/aerospace and semiconductor markets. Tektronix unveils new logo, marking the most significant change in its visual identity in 24 years. The legacy Tektronix logo has been refashioned, with the angle incorporated within the logotype as an upwards gesture of progress. The sans-serif type is given character by subtly clipping the ‘T’ letterforms, echoing the blue angle. Together, these two companies will provide fully-integrated Optical Modulation Analyzer (OMA) systems, using Tektronix’s DPO70000SX/DX oscilloscopes and Coherent Solutions IQReceivers. Capabilities of this platform include the generation of coherently modulated signals such as 64QAM to address the high-speed communications market.

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Industry Updates Teledyne e2v Supplies CCD Detectors Teledyne e2v has announced that it will continue its role as a long-term partner in the development, fabrication, and supply of CCD detectors to the high science market — including space exploration, Earth observation, and ground-based scientific endeavours in the fields of microscopy, spectroscopy and astronomy. As a longstanding supplier to the European Space Agency (ESA), NASA, ESO, and JAXA, e2v understands well the required diligence of delivering science-level visible detection to an environment where detectors and systems simply must work. While other technology companies have migrated to CMOS technology over continuing development of CCD technology, Teledyne Imaging, through its European business, Teledyne e2v, and with Teledyne DALSA’s foundry in Bromont, Canada.

u-blox Module Certified for Japan Market u-blox has announced certification of its SARAR410M-63B module for Japan market on the LTE-M cellular network of the domestic network operators. The module series will support a broad spectrum of IoT applications such as smart metering, telematics, asset and vehicle tracking, security systems, building automation, as well as smart lighting solutions and connected health. The SARA-R410M-63B modules are ideal for mission-critical IoT solutions, as they include a unique and immutable root of trust (RoT). This provides the foundation for a trusted set of advanced security functionalities.

Vicor Hosted 2nd Annual Seminar and TASKING, Infineon Expands Workshop Partnership

Vicor shared its expertise in the 2020 High-Performance Power Conversion Seminar and Workshop series beginning the worldwide tour starting on March 31, 2020 in Bangalore.

Designing high-performance power systems continues to increase in complexity year after year. Deploying a robust design methodology for high-performance power conversion is essential to achieving first-time success and managing the rapidly changing power demands of emerging technologies.

The one-day complimentary seminar will include a keynote presentation and will devote the majority of the day to expertled interactive workshops, to identify common pitfalls and provide guidance on the path to successful high-performance power system design.

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TASKING has recently announced its new multi-core development environment for thirdgeneration AURIX microcontrollers from Infineon. This capability will allow TASKING and Infineon automotive customers to optimize performance for multicore architecture for safety-critical applications. This upcoming AURIX family of microcontrollers will be prepared for data-hungry automotive applications such as future gateways, domain and zone controllers, engine management, electro-mobility, and advanced driver assistance systems. At the same time these microcontrollers will deliver the safety features, throughput, and power-efficient performance necessary to meet increasing AI computational requirements. The new TASKING development environment is being developed according to Automotive SPICE® Level 2 standards, with plans for TÜV certification according to ISO 26262 up to ASIL D. This development environment provides compiler support for the new Parallel Processing Unit (PPU) from Synopsys, one of the main enhancements in the next generation AURIX family of microcontrollers, in addition to all instruction set architectures used in the next generation AURIX TC v1.8.

SwitchingRegulator

Monolithic Switching Regulator - When Everything Is on a Chip

FREDERIK DOSTAL

FIELD APPLICATIONS ENGINEER, ANALOG DEVICES

A switching regulator can be constructed either monolithically or via a controller. In a monolithic switching regulator, the respective power switches, usually MOSFETs, are integrated within a single silicon chip. With controllers, in addition to the controller IC, the power semiconductors must be selected and positioned separately. The selection of MOSFETs is timeconsuming and requires a certain understanding of the parameters of a switch. Designers do not need to deal with this when using a monolithic design. Also, controller solutions usually take up more space on the board than solutions that are highly integrated. Thus, it is no wonder that over the years ever more switching regulators have been executed monolithically so that today there is a large selection of suitable solutions available, even for higher power. Figure 1 shows a monolithic buck converter on the left and a controller solution on the right.

ADP2441 Monolithic Switching Regulator

the high-side switch, the connection between the high-side switch and the low-side switch, and the connection between the low-side switch and the input capacitor are part of the hot loop. They are the current paths in which a current flow changes at the speed of the switching transitions. Through the rapid current changes, a voltage offset forms via a parasitic inductance and can couple into different circuit segments as interference.

ADP2441 Monolithic Switcing Regulator

C

High-Side Switch Low-Side Switch

ADP1874 Controller

VIN MOSFET IC1

L Controller

C

C

Controller

MOSFET IC2

L C

GND

ADP1874 Controller

Figure 2. A monolithic switching regulator (left) and a solution with a controller IC (right), Controller

Controller

Figure 1. Monolithic buck converter (left); controller solution with external switches (right).

While monolithic solutions require less space and the design process is simplified, one advantage of a controller solution, on the other hand, is more flexibility. A designer can select optimized, application-specific switches for a controller solution, and there is access to the gate for the switches, enabling the switching edges to be influenced with clever employment of passive components. Furthermore, controller solutions are fit for high power since large discrete switches can be selected and switching losses dissipate with thermal separation from the controller IC. However, in addition to these well-known arguments for and against a monolithic solution, there is another aspect that is not often considered. In switching regulators, the so-called hot loops are decisive for low radiated emissions. In all switching regulators, the EMC should be optimized as much as possible.

One of the basic rules for accomplishing this is to minimize the parasitic inductances in the respective hot loop. In a buck converter, the path between the input capacitor and

each with the geometrical arrangement of the hot loop.

Thus, these parasitic inductances in the hot loops must be kept as low as possible. Figure 2 shows the paths of the respective hot loop in red for a monolithic switching regulator on the left and for a controller solution on the right. We can see there are two advantages with the monolithic solution. First, the hot loop is smaller than in the case with the controller. Second, the connection path between the high-side switch and the low-side switch is very short and only routed on the silicon. In comparison, for a solution with a controller IC, this connected current path must be routed through the parasitic inductance of the packaging, usually with parasitic inductance from bonding wires and lead frames. This causes a higher voltage offset and, accordingly, poorer EMC behavior.

Conclusion Monolithic switching regulators thus offer an additional, lesser-known advantage with respect to EMI. How high this interference is and how it affects a circuit depends on many other parameters. The basic idea that there is a difference between monolithic switching regulators and solutions with controller ICs in terms of EMC behavior is, however, worth considering.

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5G

5G will be a Game Changer for Telecom Operators: Our predictions for 2020 John Giere, President |Enea Openwave As we kick off 2020, we open a new dimension in wireless communications technology. 5G is here and expected to supercharge devices and communication networks in a big way. Based on our industry expertise and analysis, following are the predictions and trends of what our team of experts expect to unfold this year.

Prediction 1: 5G will amplify live streaming and viewing experience

As 5G rolls out to deliver faster mobile networks, higher capacity and lower latency, mobile operators are working on new services and product offerings on their advancing 5G networks. 5G is drastically transforming mobile video, delivering high-end gaming experience to consumers.

Majority of mobile operators are creating new partnerships with OTT service providers to enhance the delivery of sports and gaming coverage to consumers.

There has been a surge of traffic generated by myriad of streaming services such as Netflix, Amazon Prime, Hulu, Sling TV, CBS All Access, Philo, YouTube TV and HBO Now. Infact 2019 witnessed the addition of even more new streaming channels, including Apple TV+ and AT&T TV and then came the giant of entertainment Mickey Mouse to the wireless stage in the form of Disney +.

Our live data shows that the Disney + service quickly reached #1 in Canada within days and is already rising rapidly in the US. According to media industry sources, Disney could reach its 60 – 90 million subscribers much earlier than its 2024 goal. This result will have profound competitive implications for mobile operators and a host of new streaming protocols planning their future. In 2020, new streaming services are expected from NBC Universal Peacock (launching in April); HBO Max (expected in the spring); Discover/BBC (some time in 2020)

Prediction 2: With 5G, Cloud Gaming advances in 2020

5G networks will support cloud game streaming, enabling consumers to play digital games on their handsets without the need to own or install a copy of the game. 5G networks will eventually empower cloud gaming services and gamers will demand low latency, high-definition immersive experiences.

These subscription-based services will give consumers access to a high-end gaming experience without requiring additional hardware. Operators believe that cloud gaming could represent 25% to 50% of 5G data traffic by 2022, based on the rapid progression of cloud gaming services in recent months.

Cloud gaming services have already kicked off, with Google

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Stadia, GeForce NOW, PlayStation Now, Shadow, Vortex and Parsec already leading the pack.

To attract a premium consumer segment and deliver an authentic gaming experience, operators will have to get rid of buffering, stalling and latency levels, as these will not work and poor results will be career ending. Operators will need to deploy a mix of software technologies to build networks that support up to four times more bandwidth than what currently exists on today’s networks – or it could be game over for their subscribers!

Prediction 3: Unified 5G data management layer: The way data is managed and processed demands new thinking

Mobile carriers have access to lots of data and there is tremendous potential to convert that data into new insights, which can be a new revenue streams in the future. The advent of 5G has seen an evolution from managing just subscriber data to managing a whole variety of data, including information on policy, session, application and configuration. And, while some of this data may be stateful, increased virtualisation means much of it will be stateless. All of it, however, must be made available in real time to authorised applications, which may or may not reside in the cloud.

For mobile carriers this means embedding not only mobility but also AI/ML. This AI/ML requirement should connect to every partner they choose to work with and every piece of software they purchase to put in their network.

To achieve success in this transforming telecom landscape, it is important that mobile operators build a common data layer across their 5G applications and replicate data quickly and cost effectively as needed. As 5G networks become mature over 2020, operators will turn to these data layers to deliver new revenue by extending their capability to support 5G slices and stateless core services, while also delivering data at the edge for performance-sensitive, ultra-reliable low-latency applications like streaming and cloud gaming.

The way forward in 2020

In 2020, we will witness a range of streaming services, more immersive games and disruptive applications. In order to enrich the quality of experience, 5G will present operators with both challenges and opportunities as they migrate to next generation networks. 2020 holds the promise of significant new revenue opportunities for mobile operators, capitalising on 5G’s promise of high speed and ultra-low latency to expand their service offerings.

Policy

Cabinet New Schemes to ‘Make in India’ Electronics Manufacturing – 3 Key Points

G

iving a massive push to foster indigenous electronics manufacturing, lately, the Union Cabinet has approved three new schemes. The three schemes are said to considerably boost large-scale electronics manufacturing in India. The new announcement from the Union Cabinet also includes a production-linked incentive scheme, with a total outlay of almost Rs. 48,000 crore. Led by PM Modi, the cabinet has approved the Production Incentive Scheme (PLI) for Large Scale Electronics Manufacturing. It has nudged financial assistance to the Modified Electronics Manufacturing Clusters (EMC2.0), and financial incentive of 25 per cent of capital expenditure for the manufacturing of goods. The electronic components manufacturing will cement a new ecosystem for the complete electronics industry as it plays like the heart of electronics manufacturing. Till today, India heavily relies on China for semiconductors and other electronic components.

According to the Electronic Industries Association of India (ELCINA), the electronic components market in India has increased from Rs 68,342 crore in 2015-16 to Rs 1,31,832 crore in 2018-19. Domestic production of electronic components is valued at approximately Rs 63, 380 crore, of which around Rs 48,803 crore is domestically consumed. “The three schemes together will enable large-scale electronics manufacturing, a domestic supply chain ecosystem of components and a

state-of-the-art infrastructure and common facilities for large anchor units and their supply chain partners,” Minister of Electronics and IT Ravi Shankar Prasad said.

The schemes are expected to attract new investments worth at least Rs 50,000 crore in the sector, while generating more than five lakh direct and 15 lakh indirect jobs. The production-linked incentive scheme aims to attract large investments in mobile phone manufacturing and specified electronic components, including assembly, testing, marking and packaging (ATMP) units, at a budgetary outlay of Rs 40,995 crore for five years.

The scheme will offer an incentive of 4-6% on incremental sales of goods manufactured in India and is expected to create a total of 8 lakh jobs. “Domestic value addition for mobile phones is expected to rise to 35-40% by 2025 from the current 20—25% due to the impetus provided by the scheme,” an official statement said. For the ‘Scheme for Promotion of Manufacturing of Electronics Components and Semiconductors’ the outlay has been kept at Rs. 3,285 crore over eight years and is expected to create about 6 lakh jobs.

“The scheme will provide a financial incentive of 25% on capital expenditure for the identified list of electronic goods… and will be applicable to investments in new units and expansion of capacity/ modernisation and diversification of existing units.”

The third scheme, Electronics Manufacturing Clusters (EMC) .

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ELECTRICAL AND ELECTRONICS EXPO APRIL 24-26, 2020 BENGALURU

ELECTRICAL AND ELECTRONICS

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LED EXPO MUMBAI 2020 MAY 07-09, 2020 MUMBAI

ELECTRONICS FAIR

Website : https://led-expo-mumbai. in.messefrankfurt.com/mumbai/en/ planningpreparation/exhibitors.html

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ELECTRONICS AND SECURITY

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ELECTRONICS PRODUCTION EQUIPMENT AND MICROELECTRONICS

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ELECXPO JUNE 26-28, 2020 CHENNAI

ELECTRONICS FAIR

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POWERGEN INDIA JUNE 23-25, 2020 NEW DELHI

POWER

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SMART CITIES INDIA EXPO JULY 7-9, 2020 NEW DELHI

SMART CITIES

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ELECTRONICS FAIR

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ELECTRONICA AND PRODUCTRONICA INDIA SEPTEMBER 23-25, 2020 BENGALURU

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SMART CARDS EXPO SEPTEMBER 23-25, 2020 BENGALURU

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POWER 2 DRIVE INDIA DEC 15-17, 2020 MUMBAI INDIA POWER EXPO JANUARY 20-21, 2021 MUMBAI

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LIGHT + LED EXPO INDIA SEPTEMBER 18-20, 2020 DELHI

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April 2020 •Vol - 2/04 •BISINFOTECH

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