Bisinfotech October Issue 2021

OCTOBER 2021 80.00

R.N.I. No: DELENG/2019/77352 l VOL 3 l ISSUE 10 l TOTAL PAGES 64 l PUBLISHED ON 1ST OF EVERY MONTH l WWW.BISINFOTECH.COM

MEET THE

SMART CITY ENABLERS!

IoT Device Testing

Automotive Electronics and Evolution of Two Wheelers Power over Ethernet (PoE) Transforming 5G Generation Power Modules Empowering a New Era in Healthcare Data Acquisition Defining the Future of ATMS

Editorial The ongoing semiconductor shortage coupled with the continued spread of the delta variant, rising freight costs, and growing worker shortages will create ongoing problems for all the manufacturing sectors.

The semiconductor shortage can be attributed to several factors, but the biggest impact comes from the automotive industry. As automotive manufacturers scaled back production in preparation for an expected collapse in demand for vehicles, they reduced their orders for microchips. But the automotive slow-down was not as severe as had been feared, leaving vehicle factories unable to meet demand because their stocks of semiconductors were depleted. Demand for semiconductors then boomed as car factories suddenly ramped up orders and now analysts predict that the semiconductor market will suffer a steep dip in 2023 as the supply situation normalizes.

The global machinery market took a damaging hit during the pandemic as factories cut back on investment, with the hardest hit sector being machine tools, which slumped by 18% in 2020 in the face of the knockon effects of a decline in investment from automotive and aerospace customers. However, many machinery sectors fared better, with the market for semiconductor and electronics machinery growing by 8% in 2020. By 2025, all manufacturing sectors will have recovered to 2019 levels, and some segments, such as the metallurgy machinery market, will reach the 2019 mark this year.

Production of laptops, tablets, smartphones and other electronic devices has been impacted by the shortage of semiconductors. Many tech companies have begun developing their own chips, a move that will not only alleviate the current supply concerns but will likely help the industry in the long-run. Apple is using its own M1 chip in its new iPads and Macs. A report by Nikkei Asia suggests that Google is developing its own central processors that will be used in CPUs of its Chromebook laptop from 2023.

More in-depth stories inside. Happy Reading!!

ManasNandi

MANAS NANDI EDITOR manas@bisinfotech.com CONSULTANT EDITOR & EXTERNAL COMMUNICATION NILOY BANERJEE niloy@bisinfotech.com SENIOR SUB-EDITOR NITISHA DUBEY nitisha@bisinfotech.com CORRESPONDENT AISHWARYA SAXENA editorial@bisinfotech.com WEB DEVELOPMENT MANAGER JITENDER KUMAR

DESIGN HEAD DEEPAK SHARMA MANAGER FINANCE KULDEEP GUSAIN accounts@bisinfotech.com WEB PRODUCTION PRIYANKA BHANDARI SUBSCRIPTIONS RAVI RANA subscription@bisinfotech.com

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Bisinfotech is printed, published, edited and owned by Manas Nandi and published from 303, 2nd floor, Neelkanth Palace, Plot No- 190, Sant Nagar,East of Kailash, New Delhi- 110065 (INDIA), Printed at Swastika Creation 19 DSIDC Shed, Scheme No. 3, Okhla Industrial Area, Phase-II, New Delhi- 110020 Editor, Publisher, Printer and Owner make every effort to ensure high quality and accuracy of the content published. However he cannot accept any responsibility for any effects from errors or omissions.

The views expressed in this publication are not necessarily those of the Editor and publisher. The information in the content and advertisement published in the magazine are just for reference of the readers. However, readers are cautioned to make inquiries and take their decision on purchase or investment after consulting experts on the subject. BisInfotech holds no responsibility for any decision taken by readers on the basis of the information provided herein. Any unauthorised reproduction of Bisinfotech magazine content is strictly forbidden. Subject to Delhi Jurisdiction.

Contents 08

COVER STORY MEET THE SMART CITY ENABLERS

12 WHITE PAPER

MODERN LIDAR SYSTEMS: SENSING FOR EVERY INDUSTRY

16 WHITE PAPER

HOW TO DESIGN MODULAR DC-DC SYSTEMS, PART 5: LOAD CONSIDERATIONS

20 AUTOMOTIVE-FEATURE CHOOSING RELIABLE CAPACITORS FOR AUTOMOTIVE APPLICATIONS 24

5G-COLUMN TIMING & SYNCHRONIZATION ARE KEY TO 5G

Andrew Wilson

Senior Manager of Product Marketing in Vishay’s Tantalum Capacitor Division

20

Kashif Hussain

Wireless Solutions Director VIAVI Solutions

24

26 AUTOMOTIVE-FEATURE

AUTOMOTIVE ELECTRONICS HERALDING A NEW ERA OF EVOLUTION IN TWO WHEELERS

32 SMART CITIES-EXCLUSIVE

FUTURE VISION & TECHNOLOGY OF SMART CITIES

34

AUTOMOTIVE-FEATURE RENESAS’ NEW R-CAR GEN3E SERIES UPGRADES THE POPULAR R-CAR GEN3 FOR AUTOMOTIVE INFOTAINMENT, COCKPIT, AND DIGITAL CLUSTER

36

TECHNICAL-GUIDE USB-C CHARGING THE UNIVERSAL DEMAND AND ITS TECHNICAL GUIDE

Benoit Foret

Senior Product Marketing Engineer, STMicroelectronics

36

Madhukar Tripathi

Associate Director – Optical Business and Marketing, Anritsu India

38

38

T&M-EXCLUSIVE IOT DEVICE TESTING

40

BIG PICTURE STATE OF THE COATING INDUSTRY WITH PHIL KINNER, GLOBAL BUSINESS/TECHNICAL DIRECTOR - COATINGS DIVISION AT ELECTROLUBE

42

5G-EXCLUSIVE POWER OVER ETHERNT (POE) TECHNOLOGY FOR THE 5G GENERATION & BEYOND

44

BIG PICTURE DEVELOPING A CHIP TECHNOLOGY IS COMPLEX PROCESS NEEDS YEARS OF R&D FOLLOWED BY THE DESIGN, TESTING AND TRIALS

Phil Kinner

Global Business and Technical Director of Electrolube’s Coatings Division

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40

Kuldeep Malik

Director – Corporate Sales |MediaTek India

44

COVER STORY

Rajeev Sharma

Chief Strategy Officer, Mitsubishi Electric India Pvt. Ltd

Sanjay Sudhakaran Vice President- Power Systems, Schneider Electric India

Vasantha Subbiah Vice President- Communications, FluxGen Engineering Technologies

Meet the Smart City Enablers

A report from ResearchAndMarkets.com predicted the global smart cities market to reach USD 670,424.1 Million by the year 2030. The market is expected to register a CAGR of 20.5% during the forecast period. The report is talking about the global situation, but if we talk about the Indian market, so situation is not showcasing any positive impact of smart India mission. Since the launch of five years, hundreds of projects under the Smart City Mission have not been completed. Only 1,119 of the 1,794 projects (63%) in the first phase of the mission are completed.

Moreover, only Rs 18,408 crore have been spent of the total estimated budget of Rs 57,124 crore. The agenda of this project is to accomplish it within a span of five years. While emphasizing on the same, Nitisha from BISinfotech ineracts with Vasantha Subbiah, Vice President- Communications, FluxGen Engineering Technologies; Rajeev Sharma, Chief Strategy Officer, Mitsubishi Electric India Pvt. Ltd and Sanjay Sudhakaran, Vice PresidentPower Systems, Schneider Electric India.

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Challenges

There are some major challenges that India is facing while moving ahead in making smart cities which include informal growth in semi-urban areas, air-pollution, escalating water crisis, extension of slums, and mismanagement of solid waste, says Rajeev. As more and more people are migrating towards urban areas, these cities are getting overcrowded. The growth of social infrastructure and civic amenities are not being able to catch-up with the pace of people migrating to these limited cities.

There is a need for better sanitation, transport, electricity supply, affordable housing, digitization & IT connectivity, sustainable environment for the cities to become sustainable.

The challenge will be to supply these populations with basic resources like waste management, water management, sustainable public commute, and housing with affordable connectivity to city centers etc, he added.

According to him the major challenge is migration of people to cities which has a long-term solution of providing jobs across the country and not in some clusters only and development of those cities as smart-cities which the government is already working on. Indore and Jamshedpur are very good examples of this good mix.

Sanjay finds, the major challenges in making smart cities include Institutional and structural issues with the special purpose vehicles (SPVs), roadblocks in funding, lack of skilled manpower, resistance from the citizens, shortage of town planners etc. Hence, there is a need for a transparent platform where demand and supply aspects can be looked at by the government and the citizens.

On the other hand, Vasantha believes India is a melting pot of cultures and ways of living. Every city has its style of city dynamics, resident behavioral practices, geographical structures & infrastructure constructions. Adding to all this is the Impact of COVID 19 Pandemic, Aging Infrastructure, Widening gap between freshwater availability & increasing demand from industries & residential facilities, Operational cost & Asset Maintenance, Captial Funding issues, etc. Smart Cities' phase-wise planning framework is a gradual process of technological interventions encompassing sustainability, social inclusiveness, and limited resource management.

Government Initiation

SPVs have to be created on a smaller scale and more bitesized projects should be launched to offer targeted solutions in a small time frame. Further, government needs to launch special skilling initiatives to develop a pool of skilled manpower who know how urban governance is used from the economic,

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COVER STORY financial, administrative and technological perspective, highlights Sanjay.

SmartCities start with local area development with a prime focus on Retrofitting, Redevelopment, and Greenfield projects.

According to Census 2011, Indian Cities accommodate nearly 31% of India’s Current Population, contributing to 63% of GDP. The expected projection by 2030 is that Indian Urban Areas would house 40% of India’s population and contribute 75% to India’s GDP. Thus, revamping the aging infrastructures to match the population requirements is an urgent need. Along with this, the proven model of Public-Private Partnership (PPP) will bring in investments for Greenfield projects.

At the start of this year, Central Ground Water Authorities (CGWA), released a compliant notification that - 'Any groundwater withdrawal without the installation of tamper-proof digital water flowmeters & telemetry (wherever applicable) shall be construed as illegal'. AquaGen is FluxGen's Intelligent Water Consumption monitoring and Borewell Level Monitoring suite. After the release of this notification, AquaGen has seen wide-scale installation PAN India. Real-time data is provided by data analytics and benchmarking on an interactive web & mobile application. AquaGen can definitely be a crucial component in managing the water resource in Smart Cities, Vasantha explains.

The Indian government is working quiet progressively but there are certain challenges that they have to deal with and as soon as the Smart Cities Mission (SCM) was launched in 2015, many areas saw drastic upliftment while some of the cities still have a lot to achieve to reach the desired levels of transformation, says Rajeev.

If we talk about the statistics of the smart city project, the first round of the competition in January 2016, 20 cities were chosen, which was followed by another 13 in a fast-track round in May 2016. In September 2016, during the second round, 27 more cities were selected; in the third, in June 2017, another 30; in the fourth in January 2018, another nine. The government has itself planned that Smart Cities Mission will improve the infrastructure and services (i.e. housing, water supply, sanitation, electricity supply, health, education, mobility, safety and security, IT connectivity and digitalization), while maintaining a clean and sustainable environment, and strengthening urban governance. The development and application of ‘smart’ solutions to overcome various urban problems is the key point that distinguishes the mission from previous urban-reform initiatives, he added.

With an agenda to transform India, Indian government has initiated the Smart City Mission. The aim of the mission was to drive economic growth and improve the quality of life of people by enabling local development and harnessing technology, especially technology that leads to smart outcomes. Due to Covid-19 pandemic country has faced major loss and smart city mission also faced the same loss.

The government had selected 20 cities to be developed into smart cities in January 2016 — Bhubaneswar, Pune, Jaipur, Surat, Kochi, Ahmedabad, Jabalpur (MP), Visakhapatnam, Sholapur, Davangere (Karnataka), Indore, New Delhi Municipal Corporation, Coimbatore, Kakinada (Andhra), Belagavi (Karnataka), Udaipur, Guwahati, Chennai, Ludhiana and Bhopal.

Adoption of Smart Cities

The adoption of Smart Cities is growing in India where different fields of the urban segment are getting digitized, starting from tracking public transport mobility through apps to digitizing the judicial records. With technological advancements, the citizens will be able to live a hassle-free life, without much cost escalation. The lifestyle change is expected to be subtle, not radical. This gradual transition will take everyone along the course and build an empowered society. With the ongoing COVID 19 pandemic, the prime focus shifting on health care needs, the smart cities initiative has seen slow growth.

However, such initiatives will act as primary growth drivers of the economy in the upcoming years, shares Vasantha.

Rajeev elaborates the whole plan of smart cities adoption.

He says, Smart city technology can make customer’s lifestyle more effective and efficient, which is necessary given the projected rapid growth in urban populations over the next few decades. Here are some important benefits that can impact customer’s lifestyle: • More effective, data-driven decision-making - Effective big data applications and strategies provide a city with information to identify and staff police in high-risk areas, for example, forecast and plan for expansion in citywide population growth and identify trends in citizen interests, concerns, and needs.

• Enhanced citizen and government engagement Expanding digital services in communities make smart cities a more attractive place for residents to live and promote a connected citizen experience.

• Safer communities - Many cities have already started investing in smart technologies to help promote a safer community. A smart city is a safer city. Leveraging technology advances and pursuing private/public partnerships help reduce criminal activity.

• Reduced environmental footprint - With the rise of greenhouse gases, debris in our oceans, and trash in our streets, smart cities are fighting back to reduce negative effects on the environment.

• Improved transportation - Smart city transportation investments are expected to rise over 25 percent annually over the next five years. Connected transportation systems have some of the greatest potential to drastically enhance efficiencies throughout a city.

The adoption of smart cities is growing as per the SCM launched

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in 2015 and its progress so yes it is growing but also we cannot deny the fact that there are still a lot of major challenges that we need to work on and we need continuous support from the local authorities and we hope everything will come out positive.

Although the primary goal of the smart city is to empower and sustain services like transportation, energy, water and waste, it also has a huge impact on a customer’s lifestyle.

Smart cities are a catalyst for better citizen health as they can provide insights on the demographic groups with elevated health profiles and target them precisely. They also provide data on the spread of infectious-disease helping citizens to stay a step ahead on fast moving epidemics. Smart cities have air-quality sensors address pollution and also identify the sources and provide the solution for further action. Sharing real-time air quality data with the citizens will enable them to take protective measures, thereby making them more conscious towards the environment. Furthermore, smart cities will lead to job creation thanks to the accelerated wave of automation. This will improve the standard of living and make local labour markets more efficient, elaborates Sanjay.

Expected Trends in 2022

Technological Interventions in the water, energy, health, mobility & public transport, sanitation, safety domains will see an increase in demand in the coming years. For instance, in the case of Digitization of water and energy networks, installing smart meters will help to track their consumption parameters in real-time. Also, water balance charts will help to assess the water requirement per facility and ensure it maintains its benchmark requirements. This will enable the Sustainability index measurement of smart cities, says Vasantha.

She also said, smart cities market will also see great potential in urban transportation development of metro, rapid rails, buses, electric vehicles, etc. Production of various metro components like telecommunication, signaling, electrical and mechanical systems will also drive investment. Digital health infrastructure along with good governance will enable the Livability index of Smart cities.

Promotion of Data Centers, Building Smart Traffic Management systems, Sustaining the various components of Smart cities from a central control room will provide opportunities for employment in urban areas. This enables the Economic-ability of cities. All of the mentioned markets – Urban Transportation, Health Infrastructure require more water as it’s an essential prerequisite. People are becoming more and more accountable to judicious water usage. We at FluxGen, De-risk Industries and Commercial facilities from water resource management related risks. We believe that 'What gets Measured, Gets Managed'. Smart digital water metering infrastructures will also have a big market in 2022, shares Vasantha.

Rajeev shares the major trends which are expected to shape the smart cities market by 2022: • Transportation Congestion Sensors: Smart Transportation

systems utilize IoT sensors in the detection of congestion and bottlenecks on traffic patterns. These sensors are dependent on cameras to implement speed and traffic infractions. They are useful in gathering the constant data which can be utilized to make portable networks secure and efficient. Transportation systems have thus become a fundamental base.

• Parking Sensor Apps: Parking sensor apps are mainly utilized for the effective coordination with smart parking meters to inform drivers about parking availability. Smart parking development— an IoT-based system sends data regarding free and occupied parking places via online or mobile applications. Similarly, the app also provides information on previous parking receipts and sessions.

• Lighting Sensors: Light Emitting Diode (LED) technology has helped in the development of Modern smart lighting systems. These lightening systems have evolved thereby to be compatible with the IoT environment. When there is a need to change the bulbs, the LED lights automatically send a notification to the Department of Public Works. These LED lights are made so that they are adaptive to weather and communications.

• Waste Management Sensors: IoT based sensors help in the detection of the amount of garbage around the city prominently. On informing about the undisposed garbage, the sanitation workers can thus locate it and clean it. For cities looking to take care of sustainable, connected growth, the IoT sensors provide a far better option.

• Water and Wastewater Monitoring: IoT in water treatment has been installed at various places in the water system.

These systems have sensors that help in gathering the data from several places which can keep a track of the quality and temperature of the water. If there is a presence of leak detection, then the engineer on-site is notified immediately.

Moreover, IoT in waste management can also help in the detection of residual chemicals after treatment. The detection of chemicals will help in tracking the release of chemicals to stay within permissible limits.

In the coming years, data science and analytics will form the backbone for the growth of smart cities in India. Also, artificial intelligence and machine learning will propel transformation in the sector as it will enable smoother operations and provide accurate and error free results. Similarly, interoperability of systems will play an important role in enabling data unification and homogeneity.

Furthermore, the arrival of 5g technology will be a game changer for the sector. Due to its numerous characteristics like improved security, faster connectivity and processing speed, it will tend to have a major impact on Smart Cities. It is with the deployment of 5g that one will be able to see the true vision of connected smart cities in the country, concludes Sanjay.

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WHITE PAPER

Modern LIDAR Systems:

Sensing for Every Industry

Tony Pirc

Applications Engineer

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Recent advances in technology have unlocked unprecedented modalities of capturing the physical world in digital form.

One of those modalities is light detection and ranging, or LIDAR. Many applications and industries have adopted LIDAR technology; the applications range from geographical survey to 3D structural mapping and object recognition. Industries include manufacturing automation, safety, agriculture, and many others. All these applications and industries have leveraged LIDAR to drive down costs, create safer environments, improve efficiencies, or even do things not previously possible.

To better understand the impact of LIDAR, it is important to understand what this technology is, what was used before it, and what LIDAR allows us to actually measure and, more importantly, do.

At the most fundamental level, LIDAR is a system that bounces light off objects to detect them. This boils down to a transmitting portion of the system that emits light, and a receiving portion that measures the reflected light’s time of return. This happens to be exactly how traditional radar systems work, with one very important difference—the wavelength of LIDAR systems is on the order of ten thousand times shorter than the shortest radar wavelengths.

Figure 1. What we see vs. what a radar sees.

What Is Different with LIDAR?

What does a much shorter wavelength enable us to do that we could not do with radar? A shorter wavelength allows us to see a much higher resolution image, due to a physical limitation that a measurement cannot be more precise than what is used to measure it. Even with tricks in software and signal processing, you can only characterize something so well if you are using long wavelengths to do it. With LIDAR’s shorter wavelength, we can scan the environment for objects and their features, instead of being limited to only knowing location, rough size, and velocity.

Imagine trying to navigate an unfamiliar dark room. You generally move more slowly than when it is illuminated, and you would use your hands to feel around for objects to get a sense of what is where. Take that same scenario and put on a

pair of latex gloves, gardening gloves, or boxing gloves. Each of those pairs of gloves have value in their own applications, but not so much when trying to navigate in the dark.

Hasn’t LIDAR Been Around for Decades? What Is New?

Radar has been used very successfully for many decades and will continue to be invaluable, but now we have an additional tool coming up on the horizon that will allow us to further extend our ability to sense things in this world. Until now, LIDAR has been restricted to applications that are large and expensive (like specialized surveying equipment) or smaller and simpler (like speed detection devices used by law enforcement).

A high performance LIDAR system must meet certain criteria.

The transmitting portion, for example, needs to pulse the laser for 3 ns to 5 ns at a peak of 40 A to 80 A to make it attractive for automotive—laser drivers are finally approaching these metrics of interest, making this portion of LIDAR a reality. Other factors include small and efficient power management, integration of subsystems, inexpensive high speed data processing, and sophisticated software to make sense of all this data. Our ability to push LIDAR systems’ performance up and power budget down is nearing the point where they make sense to use in many applications where they simply could not meet demands previously.

Due to this approaching critical mass, the collective effort in driving down the cost, size, and power needs while increasing performance is accelerating the attraction to this solution.

Like the microelectromechanical systems (MEMS) revolution of the 1990s, LIDAR today is becoming smaller, cheaper, and more versatile.

Both LIDAR and MEMS took a long time to fully realize their potentials to other systems and subsystems. MEMS, while developed in the 1950s, was never a practical option to integrate into many systems due to its cost, size, power needs, and performance. It was not until process technology in the 1990s was mature enough to match demand to allow proliferation of MEMS into applications never dreamed of before. Similarly, LIDAR (developed in the early 1960s) is only now ready to meet similar demands.

What is currently changing is the confluence of factors that goes into the design and manufacture of a high performance LIDAR system. These additional factors have helped LIDAR meet the constraints inherent in it, such as driving down cost, solving size and power issues, and increasing overall performance. Because these factors have helped LIDAR technology with enhanced performance while decreasing development costs, it makes sense to begin pursuit of other areas for LIDAR application.

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WHITE PAPER

Figure 4. Feature capture using LIDAR provides a much more feature-rich image.

Geographical Survey

LIDAR has been used in geographical surveying for some time, but the increase in range and resolution of these systems has allowed researchers to uncover ancient ruins that would not be feasible to investigate by foot. The constantly decreasing size and cost is also making it much more attractive for civil land surveying and engineering, with advantages over traditional land surveying methods in speed, accuracy, flexibility, and safety.

Figure 2. Leaps in development of LIDAR and MEMS technology over 13 years, respectively.

What Is LIDAR Allowing Us to Do that We Have Not Done Before?

Imagine what sorts of novel technologies can be developed with a system that can scan surfaces when it is within a much more attainable price point. Here are a few recent innovations to the application of LIDAR systems:

Entertainment

A boon in the entertainment industry has been the ability to map out complex sets or objects digitally, allowing for a more seamless interaction between reality as we know it and realities generated by software. In movies or video games, for example, this allows for fluid 3D motion capture by human actors transcribed into a fictional universe that until now relied on expensive suits with sensors (which conveyed limited movement information) or homebrew animation (which, depending on detail desired, can be slow and expensive).

Figure 5. Mapped elevation of a quarry site.

Structural and Civil Engineering

As a building is being constructed, LIDAR can be used to monitor construction progress in real time, compare those measurements to current schematics, and allow for updating of those schematics. Existing structures can also be scanned to better understand the evolution of integrity over time, which would allow us to more appropriately assess needs for renovation or rebuilding.

Figure 3. 3D motion capture of yesteryear using special suits, tracking movement of white spheres.

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Figure 6. Real-time updating of a construction site, informing changes needed in design.

Transportation

The panacea of autonomous driving is the addition of a low cost LIDAR system to complement the suite of instruments that currently measures the surroundings of a vehicle. LIDAR signals allow the autonomous system to gauge the detailed surface features (thereby object identifying) that radar cannot and cut through weather obstructions much better than a traditional vision system.

Figure 7. A car detecting features of proximal objects at night, allowing for the safe operation of the vehicle.

Safety

Outfitting what were traditionally simple “Is there something in front of me?” sensors with LIDAR systems can have the benefit of knowing how and when to respond in safety situations. A robotic arm that handles heavy objects will be able to respond more keenly when a person-like object enters its path as opposed to an object that it was designed to handle.

Agriculture

Simple sensors have been used for years to detect things like the level of grain in a silo, the state of crops, fuel level, and so on. What these methods often do not capture is the deeper context, like how the shape of the mound that the grain makes when poured into the silo and where it is measured (highest, lowest, mean, or arbitrary point) can affect how efficiently the storage is being utilized. Currently, the only way to capture this information using traditional methods is by using multiple sensors, which itself has resolution limits while adding significant cost to manufacturing. Being able to capture a whole crop’s growth in granular detail over time provides important data and can inform on cultivation practices, both in real time and for future crops. LIDAR can also help optimize the movement of automated machinery in harvesting crops.

Figure 8. The plowing of a field with subsequent real-time terrain mapping—insensitive to lighting conditions due to the nature of LIDAR.

Automation

Knowing the physical structure in precise detail adds tremendous value to robotics, which can more accurately and appropriately handle objects of various sizes and geometries.

This can be extrapolated to any manufacturing or warehouse context that involves repetitive handling or sorting. Having this additional information can also allow for the relaxation of otherwise unnecessarily tight tolerances in manufacturing, saving costs in production and quality control.

Figure 9. Damage and defects can be detected before bottling where it often is not practical to set up a large vision system (which is more often used after the bottles are filled and packaged). This is especially helpful when the bottles are visually difficult to distinguish from one another.

The previously discussed applications are ones that are currently being or have already been developed. As is always the case in human endeavors, it is impossible to know what other creative and useful ways people will come up with to use technology such as LIDAR. If you have a product or system that may be able to leverage the benefits of LIDAR, Analog Devices has the expertise to help you along the journey from conception through creation to make that idea reality.

Seeing If LIDAR Can Provide Value for Your Company

Analog.com/lidar contains a launch pad for companies looking to get into the LIDAR space or to enhance their current offerings. For a high level, applicationsbased approach, contact our systems experts for guidance on how to approach these problems. For a technical approach, we have evaluation platforms such asthe AD-FMCLIDAR1-EBZ development platform that can help get your product to market faster by avoiding unnecessary design.

About the Author

Tony Pirc has a B.S. in electrical engineering, as well as minors in computer engineering, physics, and mathematics from California State University, Chico. He has a background in industrial automation in a manufacturing environment. He supports precision amplifiers at Analog Devices and is an allaround fun-loving guy. He can be reached at tony.pirc@analog.com. Engage with the ADI technology experts in our online support community. Ask your tough design questions, browse FAQs, or join a conversation.

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WHITE PAPER

How to design modular DC-DC systems,

part 5: load considerations Jonathan Siegers

Principal Applications Engineer, Vicor Corporation

&

Vamshi Domudala Application Engineer, Vicor Corporation

The previous tutorials in this series addressed the appropriate filtering, stability, and protection concerns for power modules when used as elements of a complete DC-DC power system.

This tutorial is focused on the load-specific aspects of a system designed with power modules.

It was once possible to conceptualize the load supplied by a DC-DC module as merely having voltage and current requirements, effectively reducing it to a simple black box.

But loads have grown in complexity over the years, and today they have many characteristics relevant to the power delivery network (PDN). Therefore, power system designers must understand the behavior of the load in considerable detail to determine whether it can impact the performance of the DC-DC module. For example, the load might affect the module’s control-loop response and, therefore, its ability to regulate and perform in a stable manner. The load’s behavior might also adversely affect the module’s transient response capabilities.

Every system involves some design considerations that are particular to the load (orange elements of system diagram).

Basic load types and their impacts on control loops, transient response

There are three main load types: resistive, complex, and downstream converters. Resistive loads are the simplest, having no impact on the DC-DC module’s control-loop or transient response at all. A more complex load comprised of resistive, inductive, and capacitive characteristics will certainly impact the module’s control-loop stability and transient response. But the situation becomes less obvious when a DC-DC module is the input to an additional converter module. In this case, the upstream module’s control-loop stability and transient response depend on the control-loop characteristics of the downstream module. In addition to these main load types, some special cases require more careful analysis.

Three basic load types—resistive, complex, downstream power module.

Inductive loads present EMI and performance challenges

Inductive loads present particular challenges for DC-DC power modules at the instance of turn-off. In the following figure, the characteristics of an inductive load are shown for a simple inductor and series switch. Opening the switch breaks the current path from the module to the inductor very quickly, producing a large negative voltage spike as the inductor impedes the change in current passing through it. This action results in a high-frequency noise pulse and, potentially, arcing across the open switch contacts. The voltage spike applied to the DC-DC module’s output (and anything else connected to the bus) can affect the module’s behavior, and the noise pulse will impact the module’s EMI and overall performance.

The solution is to add a freewheeling diode connected across the inductive load to provide the required discharge path for the inductor’s stored energy.

Inductive loads have unique features affecting power system design, notably large negative voltage spikes in the instance of switch-off.

Power averaging allows efficient power design for pulse loads Pulse loads, characterized by brief but very high peak load

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currents, present a different kind of DC-DC system design challenge. The simplest way to design a system for this kind of load is to choose power modules that support the full load current at the peak of the pulse. While this works, it has significant negative trade offs in terms of weight and cost of both the power modules and the associated filtering and thermal management components they require.

It is possible to design a more compact and less costly system using the power-averaging technique. Average power is a function of the peak load requirement and the ratio of on-time to off-time. A power-averaging system design utilizes a smaller DC-DC module and appropriate PDN components for bulk energy storage to keep the voltage drop within the load’s specified tolerance during the off-time of the duty cycle. This optimizes the power system for actual power needs, rather than overdesigning the system for the worst-case condition.

Scaling for high-power loads with modular arrays

One of the major advantages of the modular approach to DC-DC system design is scalability: power modules enable current sharing and offer fault-tolerance when used in parallel, which offers the benefit of increased reliability while providing a considerable amount of power without having to qualify a new discrete design. It is sometimes possible to connect power modules in parallel without much concern about adverse interactions with their respective control systems, but designers should be aware of two main areas of interest.

First, it is important to be aware of any applicable power derating that might alter the standalone module’s capabilities when used in an array. For instance, modules in an array might not start up into the same full-load capacitance as a standalone module. Second, additional external control circuitry may be required to ensure that the shut-down and restart behaviors of modules that encounter faults do not disrupt the entire system.

Current sharing in arrays of modules

To make full use of the capabilities offered by modules connected in parallel, the system design should ensure that the array evenly shares the load current. This will maximize the overall reliability of the array by reducing the thermal stress on each module. The simplest approach is to adopt a droop-sharing mechanism so that as the load draws more current, the output voltage sags slightly and enforces current sharing among the modules. A more complicated method is to add an active current-sharing controller that monitors each module’s individual output current.

The power averaging technique allows designers to optimize DC-DC systems for loads that require high-current power in short-duration pulses.

There are several factors affecting the selection of an appropriate power module for power averaging. First, the module must operate with a current and power limit to ensure that the load’s peak pulse will draw power from the bulk energy storage capacitor bank placed at the output of the power module. Second, the DC-DC module must support start-up and operation with large output capacitance, as significant energy storage may be needed depending on the pulsed load characteristics. Large output capacitance can also impact the module’s stability and must be accounted for in the system design.

Three main considerations influence the selection of appropriate capacitors for the bulk storage designed into the PDN. First, the voltage rating should be about 140% (or more) of the system’s operating voltage. Second, select capacitors with appropriate temperature profiles so that environmental conditions involving a significant amount of heat will not adversely affect system reliability. Lastly, weigh these performance factors against the physical volume of the capacitance acceptable in the application.

Decoupling noise to ensure power quality in module arrays

Parallel arrays of modules also need a filter design for the input and output to ensure that the noise currents generated by a module circulate locally and do not create interference with adjacent modules. If allowed to circulate freely in the array, the noise currents can produce serious stability problems and adversely affect overall system operation.

Filtering on each module’s input and output in a parallel array prevents beat frequencies (represented as green and blue arrows) from circulating throughout the array and causing system instability.

One of the ways switching noise can affect system stability is the addition of a low-frequency noise component to the system’s overall switching frequency noise profile. A beat

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WHITE PAPER frequency like this is caused by the inherent variability that exists even among modules of the same type and model number, complicating in the real world what would ideally be a single higher-amplitude ripple made by summing the switching noise of all the modules in the array.

Another reason to design and include input and output filtering for each individual module is that the normal noise created by one module can be perceived by another module in the array as a perturbation and therefore cause a drastic change in that module’s behavior, even though the load’s behavior remained constant. Return to the second tutorial in this series for more on output filter design (Part 2).

Designing arrays for fault tolerance and redundancy

Parallel arrays of modules also make fault-tolerance possible by means of redundancy, significantly improving the reliability and stability of a DC-DC power system with only a modest increase in cost. A system load might have power requirements that a single module could supply, but by adding another module in parallel, the system achieves N+1 redundancy.

Multiple modules in parallel achieves N+M redundancy.

Specific implementation will vary by application, but the fundamentals are essentially the same: OR the outputs of the modules together to prevent a fault or short circuit from shutting down the entire array. There are two ways to accomplish this: a series diode or actively-controlled MOSFET placed at each module’s output. A series diode will block a short circuit condition at the output of one module from affecting the rest of the array. Still, it will incur some power losses due to the forward voltage drop when conducting current during normal operation. To mitigate the losses, take advantage of the diodes’ negative temperature coefficient by running them hot. To further reduce losses, substitute an actively-controlled MOSFET for the diode: it will perform the same function as the diode but with a lower efficiency penalty.

There are two options for OR-ing a redundant array of modules to ensure a fault in one module does not bring down the whole system: series diodes and actively controlled MOSFETS.

Modular power is only getting better!

Loads consistently demand more from power supplies, making discrete solutions more cumbersome to design with each passing year. Pressures include more power, better quality power, higher efficiency, scalability, tight design schedules, and a host of other challenges. The modular approach to power design offers clear advantages that allow power designers to keep pace, but designing with power modules means thinking differently and employing some new tools and techniques. Taking the time to understand the modular approach is clearly worthwhile because power modules are steadily getting smaller, more efficient, and more capable.

This tutorial series provides a beginning-to-end overview of the process for designing DC-DC power systems with modules: from basic power system architecture (Part 1) to noise filtering and stability considerations (Part 2), (Part 3), then to safety requirements (Part 4) and finally the special factors related to specialized loads and parallel arrays in this tutorial. Designers who follow this approach will be able to provide stable, highquality power for rapidly changing technologies.

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For more details contact: Arun Kumar Singh | T: +91 22 4255 4702 | M: +91 78278 55273 I E: arun.singh@mm-india.in

AUTOMOTIVE-FEATURE

Choosing Reliable Capacitors for Automotive Applications Choosing a capacitor for reliable performance in today's automotive electronics requires an examination of several parameters. The performance characteristics of the various capacitor technologies must be first be understood. Following this, the automotive environment and specific application must be considered in order to determine the most cost-effective and reliable solution. This article will look at the characteristics of the four major capacitor dielectric types: tantalum electrolytics, aluminum electrolytics, poly-films, and ceramics. In addition, the automotive environment will be described, and the general categories for automotive applications will be listed.

Author Andrew Wilson currently serves as Senior Manager of Product Marketing in Vishay’s Tantalum Capacitor Division. Previously, he has held the roles of Regional Business Development Manager for TTI, Market Segment Manager for Sensata Technologies, and Lead Marketing Manager for Osram’s North American OEM Component Division. An accomplished mechanical engineer with two patents and experience in electronics packaging integration, Andrew holds a BS from Wentworth Institute of Technology and a MBA from Northeastern University.

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Figure 1 shows the typical capacitance and voltage ranges for some of the more popular types of capacitor dielectrics. It is interesting to note that for applications requiring capacitance values from about 0.1 μF to 100 μF, and voltages of less than 50 V, there are several overlapping choices. To further understand the performance characteristics of these various capacitor types, we will need to cover a few of the capacitor basics.

Figure 1 Figure 2 shows the typical dielectric constant (K) and dielectric strength values for the four basic capacitor types. A combination of low K and low dielectric breakdown strength (such as is the case with poly-film capacitors) results in low volumetric efficiency. However, physical size is only one characteristic of a given capacitor type. For example, although film capacitors are rather large in size, they offer extremely high efficiency and stable electrical characteristics.

Figure 3 The formulas provided in Figure 4 are important capacitor relationships: capacitive reactance, dissipation factor, inductive reactance, and impedance. Note: the resistor used to model insulation resistance (IR) is a very high value resistor, so it is neglected for simplicity in the derivation of overall impedance (Z).

Figure 2 The equivalent circuit for any capacitor is shown in Figure 3.

The equivalent series resistance (ESR) is the real part of the impedance and represents losses in the capacitor. The ESR value varies with temperature, frequency, and dielectric type.

The insulation resistance (IR) determines the amount of DC leakage current that the capacitor passes for a given applied voltage. The leakage current is typically much lower for film and ceramic (electrostatic) capacitors than for tantalum and aluminum (electrolytic) types. DC leakage varies with temperature and the magnitude of applied voltage.

Figure 4 Z is important in determining how the capacitor affects incoming signals. During charge / discharge cycles, low ESR is critical for achieving high efficiency, low heating loss, and reliability. Capacitive reactance (XC ) and inductive reactance (XL) tell us something about the energy storage capacity and inductive field generation of the device. Note that when XC and XL are equal, the resonant frequency of the device is achieved. This is important when choosing a decoupling capacitor to remove AC components / noise from a DC signal. To efficiently remove AC signal components from a DC power rail, select a capacitor with a resonant frequency near the frequency of the unwanted AC noise for minimum impedance and maximum decoupling to ground.

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AUTOMOTIVE-FEATURE Automotive applications for electronic components can be categorized into six general areas: 1. Powertrain control (electronic engine, transmission, and emission control). Today’s push toward electric vehicles adds many new opportunities for power conversion and control electronics 2. Vehicle control (antilock brakes, active suspension, traction control, power and 4WD steering) 3. Safety, comfort, and convenience (air bag actuators, collision avoidance, climate control, cruise control, and anti-theft) 4. In-car entertainment 5. Driver information displays and audio warning systems 6. Diagnostics and repair Some automotive environmental conditions are more demanding than others. Figure 5 characterizes under the hood and passenger compartment conditions.

• Available in 85 °C, 105 °C, or 120 °C temperature ratings • SMD capacitance up to 10 mF • No need to surge current screen • Aluminum electrolytics have a natural wear-out mechanism that could limit their useful life to 5000 hours under full rated voltage and maximum temperature conditions. For 2x longer life, derate to 80 % of rated voltage

Ceramic Electrostatics:

• Rated voltage from 6.3 VDC to 5000 VDC (most usage is 100 V or less); no voltage derating is necessary, but the voltage coefficient of capacitance must be considered. MLCCs may lose up to 40 % of their effective capacitance value when operated at or near rated voltage • Operating temperatures may exceed 150°C • Non-polar (may be bulk fed for high speed insertion) • Very low ESR and DC leakage • Typical failure rates under 1 FIT; typical failure mode is short or parametric shift

Poly-Film Electrostatics: Figure 5

Having described the primary automotive environments and applications, we will now look at the four major capacitor technologies and describe the characteristics that will affect circuit performance and long term reliability.

In the most general of classifications, most capacitors fall into one of two basic categories of construction: electrostatics (poly-films and ceramics) and electrolytics (tantalums and aluminums). Electrostatic capacitors are non-polarized devices that typically exhibit very low ESR and impedance. Electrolytics generally offer higher capacitance values, but are polarized.

Tantalum Electrolytics:

• Rated voltage from 2.5 VDC to 63 VDC SMD and 125 V axial leaded. Note: for best reliability, derate the application voltage to 50 % of the rated voltage for solid tantalum, and 80 % for tantalum polymer and wet slug axial tantalum • Very stable electrical characteristics over time and temperature • Capacitance values up to 2200 μF for SMD and 10 000 μF for axial wet tantalum • Surge test / screen larger SMD case sizes (low ESR and high capacitance) • Typical failure rates from 5 FIT - 15 FIT (failures per billion hours) with normal voltage derating

Aluminum Electrolytics:

• Rated voltage from 6.3 VDC to 450 VDC (SMD devices).

Higher voltages for large can styles

• Rated voltage from 16 VDC to 2000 VDC; no voltage derating necessary • Operating temperatures to 105 °C for most types (125 °C for PPS) • Ultra low ESR and DC leakage • Typical failure rates under 5 FIT; typically fail open or parametric shift • Surface-mount offerings limited The characteristics listed above will help the design engineer make general decisions regarding the choice of a capacitor.

Cost, size, and manufacturability are also factors.

It is not always easy to determine which capacitor type will best suit a given application. A few general guidelines are offered below for the primary types of circuit applications found in automotive and other electronic circuits.

1. Power filtering - High capacitance, low ESR, high temperature capability — tantalum, aluminum (some ceramics and poly-films) 2. Bulk energy storage - High capacitance, low ESR (for quick discharge and pulse applications) —tantalum, aluminum, (some poly-films) 3. Tuning & timing - Stable capacitance values across temperature and frequency, repeatable under thermal cycle — ceramics (NP0 type), poly-films 4. Decoupling / bypass - Very low ESR, good Z characteristics — ceramics, poly-films Choosing a capacitor is a multidimensional problem; each capacitor type has its own set of characteristics that may make it the most logical choice for a given application. A capacitor’s cost, size, packaging type, and end of life reliability issues are important considerations. With the many choices available, it is essential to reference each manufacturer’s specifications for the right capacitor. As a leader in capacitor technology and manufacturing, Vishay is here to support electrical designers with a variety of options for automotive applications. Serving customers worldwide, Vishay is The DNA of tech.™

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5G-COLUMN

Timing & Synchronization are key to

Synchronization is one of the most critical functions of a communication system.

Timing and synchronization standards for mobile networks prevent messages from interfering with one another and enable smooth cell-to-cell transfers.

The increased stringency of timing and synchronization requirements for 5G is being driven by exponentially faster speeds, lower latency, and increased densification.

Kashif Hussain

Wireless Solutions Director VIAVI Solutions

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To use available spectrum as efficiently as possible, 5G technology introduces a time division duplex (TDD) environment.

In the context of 5G, especially for TDD - where both uplink and downlink transmission is on the same frequency, the possibility of interference is much more significant. As a result, we see more exacting requirements for timing and synchronization for both TDD LTE and 5G-NR. Operators need large amounts

of spectrum to deliver on the enhanced mobile broadband (eMBB) use case of 5G, amounts much greater than the 5 to 20MHz that is generally available for LTE networks. Further, most of the available wideband 5G spectrum is either in the C-Band or mmWave, which only supports TDD. This means that TDD is a key factor in enabling eMBB services.

complexities for synchronization. Service providers need different approaches depending on the topology and configuration of their networks. In most cases, we expect to see precision timing protocol (PTP) for distributing time of day (ToD), and Synchronized Ethernet (SyncE) for distributing frequency. This means that radio units (RU) will be synchronized over Ethernet.

Significance of synchronization

Synchronization requirements

It is important to discuss the relevance of synchronization in a communication network—especially a radio communication network. If the radio clock loses synchronization accuracy or the radios are not synchronized in a TDD channel, TDD framing will drift outside the guard period and interfere with adjacent cell-sites. The less accurate the clock source, the higher the probability for time shifts which ultimately bring performance and interference challenges.

Intricacies in synchronization

Because a lack of synchronization in uplink (UL) / downlink (DL) frames further intensifies interference problems, industry standards introduce stringent restrictions on LTE and 5G new radio (NR) TDD transmission. While the absolute time synchronization margin in a frequency division duplex (FDD) LTE environment is in the magnitude of 10µs, in a TDD radio environment it is restricted to just 1.5µs.

Telecom service providers can implement various methods to meet these stringent phase and time synchronization requirements. The intent is to ensure synchronization of all nodes to the primary reference time clock (PRTC) source.

However, the location of the source may vary depending on the network topology, cost and application. By using a grand master clock synced to a satellite source and a combination of boundary clock and slave clocks, network nodes can be aligned to a common time and phase. For networks that cannot adhere to full timing support, such as networks that are not PTP aware, there are other options. For example, network operators can implement assisted partial timing support with appropriate consideration for the network topology and cost.

It is important to consider the use cases for frame and slot synchronization. 5G 3GPP standards defined 56 slot formats, each of which is a predefined pattern of downlink/flexible/ uplink symbols during one slot. These formats allow flexibility in terms of the application supported on a 5G node B (gNB). Yet, this also creates a challenge if two networks offering different types of service are located next to each other. Interference can result even if they are synchronized in time, but their slot formats are not synchronized. Essentially, when operating a 5G or 4G LTE network in a TDD environment, we not only need frequency and phase synchronization, but also frame and slot synchronization. This avoids inter-network interference.

Timing and Synchronization - Essential for 5G-NR TDD network success

Time / Phase requirements for TDD transmission In addition to the absolute time error margin, another consideration is management of over-the-air synchronization requirements for advanced radio features. These include MIMO, eCIC, COMP and location-based services. In 5G, we are moving away from a synchronized fronthaul CPRI to a packet-based fronthaul. While this approach offers a number of advantages, packet-based fronthaul introduces

Synchronization Technology is a fundamental building block for all wireless communication networks. Both 3G and 4G cellular technology required frequency synchronization, primarily to prevent interference when cells overlap. But, with the introduction of 5G technology, we’ve reached a new level in terms of TDD phase and frame synchronization.

Validation testing is essential to meet stricter synchronization requirements, ensure conformance to industry standards and affirm quality of service.

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AUTOMOTIVE-FEATURE

Automotive Electronics Heralding a New Era of Evolution in Two Wheelers

the year 2019. A quick look at India’s automotive industry reveals that almost 80% of the vehicles running on Indian roads are two wheelers. Infineon has been spearheading the adoption of these megatrends in India through partnership with various players in the entire two-wheeler ecosystem.

The need for green energy and clean mobility is driving a shift in focus towards electric two wheelers. This has accentuated the need to adopt sophisticated electronic system solutions that are vital for motor controller and battery management in an electric vehicle. As consumer requirements evolve, more and more consumers have been demanding for greater intelligence in automobiles. In addition, the emission and safety regulations, as well user experience and comfort features are driving the electronic content.

Two wheelers are right in the middle of this transformation. The developments in microelectronics, has led to increase in connectivity, sensors, displays and Director and Head of OEM Business lighting applications in a two-wheeler.

Sr. Manager - Automotive Development & Application Engineering (Vehicle User Experience), Further the need for safe and secure - Automotive, Infineon Technologies Infineon Technologies mobility has meant system designers to increasingly depend upon Automotive World is making the new and smart forms of mobility. Electronics that are designed to match the performance, Semiconductors are essential to realize the automotive cost, and advanced architecture of an automotive system. megatrends. These megatrends include Electro-mobility, Connectivity, Security, and Automated driving. Around 90% Motor Controller of all automotive innovations depends on Microelectronics or An electric motor, replacing the conventional combustion Semiconductors. Being the Largest Automotive Semiconductor engine in ICE vehicles, is the driving force behind the wheels supplier in the world, Infineon Technologies has always been for electric vehicles. Most of today’s electric 2/3 wheelers use at the fore front in innovating these solutions for the world. BLDC (Brushless DC) or PMSM (Permanent Magnet Synchronous Our core beliefs - Zero CO2 becomes real, A driver becomes Motor) motors. The electric motor and it’s controller are tightly passenger, A car becomes a smarter car – reflects these coupled and at the centre-stage of electric 2/3 wheelers or for that matter any electric vehicle. The overall performance and automotive megatrends.

India moves on two-wheeler, a well-known fact and also efficiency of motor and it’s controller are critical parameters reflected from production of nearly 25 million vehicles in for any electric vehicle.

Avinash Kale

Anoop Aggarwal

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The FOC/SVPWM (Field Oriented Control/Space Vector Pulse Width Modulation) is the most efficient and popular driving technic for BLDC/PMSM motors, hence most of the motor controllers implements the same. Infineon’s AURIX and Traveo-II MCUs with their high performance, multicore architecture, high resolution TCPWM (Timer Counter Pulse Width Modulation) modules, performant/multiple ADCs, and peripheral interconnectivity, are ideally suited for motor control applications. With Traveo-II MCUs, users can easily achieve ASIL-B compliance at system level, while AURIX family is qualified for the highest safety (ASIL-D).

Infineon offers complete product-to-system approach, reference solutions and the entire ecosystem for motor controllers. Besides MCU, ASIL-C/D compliant gate driver, wide range of MOSFETs, accurate magnetic rotor position sensor, current sensors, DC-DCs, PMIC (Power Management ICs), communication (CAN/LIN/Flexray) transceivers, forms the part of entire motor controller system.

durability of battery pack as well the efficient utilization of this battery energy decides the performance, and range of the vehicle. Hence, it’s essential to monitor the vital parameters of battery pack all the time. These parameters typically include Voltage, Temperature, State of Health (SOH), State of Charge (SOC), State of Power (SOP), etc. A reliable BMS is responsible for the efficiency, longevity, and safety of Lithium-ion batteries.

As battery packs are susceptible to certain risks such as under/ over-voltage, deep discharge, mechanical stress, over-heating, unstable chemical stage, thermal runaway, a BMS is critical in detecting these events quickly and mitigating the potential hazardous situation, if not, alerting the driver or passengers in time. So, BMS is a safety critical application. The educated customers demand for automotive quality and safety (ASILC/D) compliance.

Infineon’s BMS family is designed for automotive quality, highest safety (ASIL-C/D), and engineered for systems that consists of 4 to 200 cells in series comprehending voltages

Figure 1- Motor Controller (48-72V, up to 10kW) Reference Solution

Customers can jump start their development using readily available reference hardware, software (low level drivers, E-Motor Library, example codes, etc.), documentation (HW/ SW User Manuals, Application Notes, etc.) and the entire ecosystem (tool-chain, IDE, compilers, debuggers, various evaluation boards, etc.).

Battery Management System (BMS)

Battery Pack is the ultimate source of energy for any electric vehicle. An electric 2/3 wheelers are powered by 48V to 72V lithium-ion battery packs today. The energy density, and

between 12V and 800V. A single BMS SoC/AFE (TLE9012) can monitor up to 12 batteries/cells with 12 dedicated 16-bit SDADCs thereby supporting very fast and fully synchronous measurements. An additional 13th 16-bit SDADC is targeted for Pack Voltage and temperature measurements. The in-built Stress Sensor compensates for all stresses and guarantees the End of Life (EOL) accuracy for voltage measurements. Safety mechanisms consists of Analog Comparators for redundant OV/UV check, Open wire detection, Leakage detection and comprehensive diagnostic features. The BMS SoCs/AFEs (TLE9012s) communicates over iso-UART, a robust and patented

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AUTOMOTIVE-FEATURE communication interface. The iso-UART transceiver (TLE9015) interfaces the AFEs in daisy chain to the Host Microcontroller in a typical high voltage BMS. TLE9015 supports the ring topology with it’s dual iso-UART channels and complete isolation between the high voltage and low voltage system, ensuring a cost optimized robust system solution. In low voltage BMS, TLE9012 can directly communicate with the Host Microcontroller over UART without the need of TLE9015.

to store both the updated image and rollback image with read while write operation. This enables true Firmware-OverThe-Air (FOTA) update, with no interruption of service and roll back in case of failure. While all derivatives come with the latest CAN-FD, LIN, UART, SPI connectivity options, the higher derivatives also support 1 Gbit Ethernet, Flexray, I2S/ TDM interface and serial memory interface with integrated on-the-fly AES encryption.

Figure 2- Battery Management System Reference Solution Infineon provides complete system solution for battery management system. Customers can minimize their time-tomarket by leveraging on the scalable and ASIL-C/D ready reference design. This design is for monitoring and balancing of 4-24 cells, that is suitable for 48-72V BMS application. A solid-state switch is used for battery disconnect which gives faster turn off & robustness compared to contactors and relays. In addition, CAN/BLE/NFC connectivity, Memories for data logging, Pressure sensor for thermal runaway, and PMIC as safety supply adds the value, differentiation and flexibility in two-wheeler BMS system.

Connectivity with Enhanced Security

Modern electronics have become more connected. Our phones, computers and electronic devices are constantly communicating and upgrading through the cloud. Obviously, consumers are now expecting their vehicles to have latest connectivity and upgradability features. Infineon’s Traveo-II family of MCUs helps connect the vehicle seamlessly and offers the feature to upgrade the firmware at any time.

Being connected also means being exposed to security risks.

Each of Traveo-II MCUs offers Hardware Security Module (HSM) that integrates an additional dedicated ARM Cortex M0+ core and the latest hardware encryption accelerators like AES 128/192/256-bit, SHA 1/2/3, RSA and ECC, PRNG, TRNG. The M0+ core boots from ROM while M4/M7 are kept in reset, enabling secure boot and ROM code provides root-of-trust.

Traveo-II Body MCUs are designed for typical body control applications that demand low power consumption and at the same time offer superior safety up to level ASIL B. Customers can start their development using the free Software Development Library (SDL) with various offerings of evaluation boards, a wide range of compiler and debugger tools, MCAL & other quality-controlled software. With 7 packages available from as small as 64-LQFP, Traveo-II is not only best suited for twowheeler body control applications but also can be used to scale up to a Telematics Control Unit (TCU) or a Vehicle Control Unit (VCU) with higher pin count and flash memory.

Infineon’s Traveo-II offers wide performance scalability offering single ARM Cortex M4 at 80Mhz to as high as dual ARM Cortex M7 at 350Mhz each. The dual bank flash provides the facility

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rich graphics engine renders 2.5D high resolution graphics at 720p with the help of internal VRAM and without the need of external memory. It can perform perspective correction of simple 3D effects. In the highest feature derivative, the sophisticated display controller supports arbitrary warping for HUDs, multiple displays, video capture and motion picture using a JPEG decoder. Flexible memory interface supports high speed serial memories like NOR Flash and RAM. Ethernet connectivity and sound generation along with audio interface can further enhance the user’s vehicle experience to next level with dynamic content.

Figure 3 - Traveo-II Body MCU Family Scalability

Vehicle User Experience with Advanced Graphics

The consumer desire to view vehicle information on big screens has meant increased adoption of the Thin Film Transistor (TFT) LCDs including also the broad range of touch screen displays from sizes of anywhere between 4 to 7 inches. Using touch screen display, OEMs are able to provide two-wheeler consumers with "smartphone-like" graphical interfaces, seamless navigation, infotainment and at the same time also promising third-party app stores for a broad range of services.

The Traveo-II Cluster MCUs helps create a low-cost state of the art vehicle user experience. It offers scalability for graphics with multiple variants i.e. from a small 3-inch graphics screen with QVGA resolution to as high as an 8-inch TFT with full HD resolution. It reduces memory footprint with innovative on-the-fly and line-based graphics, thereby reducing costs. The feature-

Customers can begin development using the same software, tools and ecosystem that are available for Traveo-II Body MCUs. Further they can accelerate their graphics development by leveraging the expertise of Infineon certified vendors who utilize hardware capabilities of our MCU in their HMI tool in the best possible way.

Conclusion

Advanced automotive electronics offers tangible benefits that helps manufacturers to rapidly develop these solutions that hide design complexity, offering a better riding experience.

Infineon Technologies AG is a leading player and pioneer in automotive electronics. Our 40 years of dedicated experience, clear strategic focus on automotive applications, safety, zerodefect quality standards, system solution approach, premium support, and our ability to continually innovate this market has meant enduring success for our customers. Indian twowheeler industry landscape is witnessing a huge technological transformation today and Infineon is partnering with the industry in this journey heralding a new era of technology evolution.

Figure 4 - Infineon’s system solution approach for a two-wheeler cluster

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SMART CITIES-EXCLUSIVE

Future Vision & Technology of Smart Cities 2020 shows that there is a rise in awareness towards smart cities. Many major automobile manufacturers and telecommunications companies formed business and capital alliances for smart city projects in 2020.

Let’s have a look at the emerging visions for our smart cities and the required technologies which will greatly affect the future of the smart cities we will live in.

1. Future city vision through smart cities

Behind the emergence of smart cities is a social issue that various cities around the world face. An increase of people moving from rural areas to cities. As seen in the explosive rise in population of cities of all continents, it is estimated that approximately 6.7 billion people, which is 68% of the world’s population, will move to urban areas by 2050.

What kind of issues arise if the population grows in urban areas?

What immediately comes to mind are traffic congestion, increases in exhaust gas, and shortages of energy such as electricity and gas.

Also, situations which may lead to risks that weaken the city's ability to function, including lack of proper medical care and overflow of trash are expected to occur.

With these kinds of social issues in the background, an idea to create a smart city that enables smooth, efficient, and comfortable functioning by managing the entire city using elements such as IoT (Internet of Things) has emerged.

For example, this enables mitigation of traffic congestion to provide comfortable transportation and thus eliminating the need to create new

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roads. The water pipe network identifies abnormalities such as water leakage, enabling optimal repairs and exchanges. This means that in addition to comfortable living conditions and eco-friendliness, this brings economic benefits by reducing investments in infrastructures. These examples are indicative of the required vision approach that developers must take.

2. Technology required for smart cities

What becomes crucial here is calculation abilities that can record, transfer, and process large amounts of data. Edge computing and data centers are the keys to its creation. Many of you may know of data centers that are equipped with and operate IT devices such as server and network devices. On the other hand, edge computing is attracting attention as a trend word of the next generation.

Cloud computing is a generally applied “centralized processing system” that transfers data to clouds and accumulates them while edge computing is a “distributed data processing system.” As its name implies, by processing data in a communication area much like edge (network terminal devices), it reduces load to the server compared to clouds, and enables calculation processes to be performed without delay in the “real time.” Also, compared to clouds that accumulate confidential data, data is processed on edge, making it highly reliant in terms of security.

A major premise to achieve a smart city is an “environment that enables internet connection at any location.” For example, to identify water pipe abnormalities, it is assumed the water pipes are connected to the network and require sensors that detect abnormalities, platforms and data centers that receive notifications of abnormalities, and AI that analyzes abnormalities. Elements linked to connected devices that provide and analyze data in real time, and perform demands in a timely manner are called “connectivity network.”

The connectivity network is steadily expanding. In 2018, there were 798.6 million mobile telephone line connections. This is expected to increase to 3,145.5 million by 2024. Communication speeds are progressing at an unbelievable speed due to the emergence of 5G and 6G, and network solutions such as LPWA (Low-Power Wide Area) have also emerged. LPWA is a technology that enables communication at a wider range compared to conventional mobile telephone lines, and are highly effective in areas with network limitations such as when underground. This will be an important keyword that predicts future technology trends.

AI and data analysis are also technologies that are crucial in smart cities as they enable the analysis of conditions in real time and swiftly provide information and solution ideas to decision makers. For example, it can reduce labour costs by optimizing bus and train services as well as propose routes that mitigate traffic congestions by analyzing traffic volumes of the entire city.

This means that the biggest issue in connectivity network is security.

Connecting devices and sensors to power networks and public utilities as well as building management systems means that the range of cyber-attack targets become wider. The fact that traffic signals, air conditioning systems, and medical equipment are also connected to networks, this risk may also affect human lives. Safe and reliable security is an important factor for smart cities.

Finally, let us have a look at the scale of the smart city market.

The total value of the market is expected to exceed 3 trillion dollars by 2025, and its business potential in fields such as infrastructure development, technology integration as well as energy and security services are immeasurable in scale.

To learn more on the drivers and common challenges of India's home appliance industry; how engineers are managing the evolving, fast-changing consumers taste, incorporating the latest technologies and trends into their product design, while increasing product quality and accelerating time-to-market, check out our on-demand webinar. https://www.murata.com/en-sg/webinars/murataspeaks/jul21-ha/download

About This Article: This article is provided by Murata Manufacturing Co., Ltd. https://article.murata.com/en-sg/article/vision-andtechnology-for-the-future-of-smart-cities

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AUTOMOTIVE-FEATURE

Renesas’ New R-Car Gen3e Series Upgrades the Popular R-Car Gen3 for Automotive Infotainment, Cockpit, and Digital Cluster

Peter Bechberger

Automotive Solution Business Unit | Renesas Electronics Corporation The ongoing transformation of the automotive industry and the E/E architecture towards CASE (connected, autonomous, shared, electrified) requires enormous efforts and investments.

Whereas such transformation is considered indispensable, it creates high cost pressure on “legacy systems”, especially for entry to mid-range car lines.

Cockpit-related modules such as in-vehicle infotainment (IVI) and digital cluster systems are facing such cost pressure.

Nevertheless, the pace of innovation remains high, e.g., towards larger displays, richer contents, and overall improved user experience (UX). At the same time, no compromises are allowed regarding automotive quality and functional safety.

As a market leader in these segments, Renesas has decided to re-launch its successful R-Car Gen3 with the “R-Car Gen3e” series to address especially cost-sensitive entry to mid IVI, digital cluster, and integrated cockpit systems. In combination with Renesas PMICs, the new series is also well suited for applications such as driver monitoring systems, LED matrix light, connected gateway, and other systems requiring low to mid CPU or graphics performance.

What’s new on R-Car Gen3e?

The “R-Car Gen3e” is directed at our existing R-Car Gen3 users and new customers alike.

If you are already familiar with R-Car Gen3, you might be interested in the improvements on R-Car Gen3e and how you can benefit from an upgrade: • New 2GHz speed variants for M3Ne, M3e, H3e, offering CPU speed up to 50k DMIPS o Fully pin and software compatible upgrade to higher CPU performance, e.g. for car facelifts with new apps, larger displays, etc.

• New reference SW solutions using the CR7 real-time core as “robust domain” for HMI, fast boot and FuSa o Reduced BOM and shortened development time using

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pre-integrated software • Improved options scheme and optimized specification, especially for digital cluster o Easier access to all required R-Car functions and simplified pricing scheme

“Winning combo” to reduce system cost R-Car Gen3e aims to reduce the system cost, and one way to achieve it is to enable higher integration and to simplify the software architecture.

On the hardware side, R-Car Gen3e in combination with a Renesas PMIC as “Winning Combo” allows you to eliminate an external vehicle controller by activating the on-chip real-time CPU (Arm Cortex R7).

On the software side, such configuration provides the system robustness to easier select open-source OS such as Linux, and to simplify or even remove a hypervisor for multi-domain systems.

Especially in case the following use cases sound familiar to you, you should consider R-Car Gen3e: • Fast boot for CAN network, welcome animation, 2.5D cluster HMI, and rearview camera • Functional safety (FuSa) up to ASIL-B for telltale monitoring, alarm sound, and display/camera freeze detection • Non-hypervisor multi domain cockpits including digital cluster and IVI or others • Integration of camera-based applications such as driver monitoring and surround view

How to get started on R-Car Gen3e?

R-Car Gen3e is fully pin- and software compatible to R-Car Gen3. If you have a running R-Car Gen3 environment, you can use it for development start and change to R-Car Gen3e series during development. Boards, BSPs and libraries from R-Car Gen3 can be re-used on R-Car Gen3e.

Evaluation boards: Boards and starter kits based on R-Car Gen3 are available and can be used for R-Car Gen3e evaluation and development. Upgraded boards with R-Car Gen3e devices are planned from Q4/2021.

• R-Car H3 and M3 Starter Kits • R-Car H3, M3, and M3N Reference Boards (Salvator-XS) • R-Car E3 Reference Board (Ebisu) Embedded Software (CA53/57 core): On the CA5x application cores, BSPs and middleware are available for Linux, Android, QNX, and Integrity OS. For information on versions and supported SOCs, please contact us.

• R-Car H3 and M3 Linux and Android BSPs Embedded software (CR7 core): On the CR7 real-time core, Autosar MCAL and reference software on FreeRTOS for HMI, fast-boot, and FuSa are available. For more detailed information, please contact us.

Samples: R-Car Gen3e device samples are available; mass production is planned from 2022.

R-Car Consortium: Find a variety of solutions on R-Car by our partners, such as system integrators, middleware/application developers, and OS/tool vendors. The Solution Matching System helps you to find the partner fitting to your use case.

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TECHNICAL-GUIDE

USB-C Charging

The Universal Demand and its Technical Guide The Need of USB-C Charging Globally

Benoit Foret

Senior Product Marketing Engineer, STMicroelectronics

With the growing adoption of USB-C, temptation to upgrade micro-B port with USB-C by simple connector replacement and schematics inherited from legacy devices is high. Some companies are sadly experiencing quick implementation hurdles which is finally making companies to re-design their device.

Addressing the Problem and Identifying its Solution

Legacy USB used to be hot sockets (5V always available on VBUS power pin), while clean USB-C implementation require cold socket implementation (VBUS line not powered until a sink is detected by the source). This means that direct access to the battery charger is impossible until the interface IC makes the decision to do so. Somehow, this is the right way to proceed, as USB-C connector is the same for SINK and SOURCE. Taking into account that charging power is scalable (from 2.5W to 100W) and can be also bidirectional, we’d better rely on dedicated controllers to ensure that connected devices are compatible together (ie. an AC adapter and a smartphone for instance), and working as expected (AC adapter delivering 5V by default, and not 20V). To do so, controllers must implement protocol features but also application features. Protocol could be even implemented by software, reporting the power management issues and interoperability ownership at system level, which is the most appropriate.

Indeed, what really makes the value of a controller are the application features, which guarantee effective and certified implementation in the system and appropriate behavior when devices are operating in normal conditions of course, but especially when unwanted situation occurs.

Smartphone manufacturers are officially under pressure from the European Parliament to adopt USB-C universal charging as reported by the BBC. As Brussels is adopting USB-C in EU regulation, users will benefit a lot from this technological and political push: the possibility to charge everywhere, and at anytime, any kind of portable devices, making everyone’s life easier. Whereas the need for reducing electronic waste gained painfully people’s mind in the last 10 years, it has recently transformed into an everyone’s duty to limit overall men’s environmental impact. This is one of the Covid-19 lesson’s learns.

Creating Newer Innovation of Opportunities for Companies Some companies have understood it, and can see also in this realization an opportunity to stick with society’s mood, without engaging extra cost induced by a new regulation.

Cost penalty for transforming once a charger into a universal one is balanced by the cost savings of making regularly proprietary chargers: no need to design, manufacture, package, transport and sell a charger for every device.

Chargers are compulsory accessories to make devices work, but add extra cost, extra time, extra weight that never make anyone preferring a device to a competition one: no value in the act of purchasing, just extra wastes for the seller. Some famous companies started to sell their device on the market without including any AC adapter, but just a cable. A good example is Fatboy with its successful Edison the Petit portable lamp, having embraced the “no charger included” policy as a contribution to its sustainability program.

More and more articles regularly report that both Apple and Samsung might be adopting such a philosophy starting from 2021.

People Ready To Buy Their Universal Charger

Not only smartphones makers are concerned by universal charging. This is how USB-C becomes a game changer: any kind of small portable device is eligible to 15W USB-C charging: computer and smartphones accessories of course, but also Bluetooth speakers and audio headsets, hearing aids and other medical devices, payment terminals or Wi-Fi access points, wearable devices such as smartwatches, healthcare devices

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such as shavers, or battery powered outdoor LED lights etc…

All these devices can be simply and universally charged by an affordable home charger, or even a USB outlet durably integrated into the wall.

reported by the STUSB4500L controller and can be used to set the maximum charging current input from the battery charger.

Overall, it makes the overall process (from the connection to the charging): y SAFE (safety first, always), Technical Challenge y FAST (customer experience matters), As a matter of fact, USB-C is the solution to address universal y SIMPLE (designer’s time matters as well,) charging for small portable devices. But universality has 2 y and OPTIMIZED (when effectiveness is achieved with simplicity, corollaries in engineers’ mind: what about INTEROPERABILITY this is called ROBUSTNESS). (guaranteeing customer experience) and what about SAFETY (on which no compromise can be done)?

• ZERO POWER Another key issue to address, especially for portable device, STUSB4500L USB-C controller from STMicroelectronics has been is the preservation of the battery autonomy. Designers are designed with these 2 objectives in mind. naturally tracking any leakage current in the system, and a USB interface, especially when it is not in use (maybe 90% of • SAFETY the time) should not be a detractor of the autonomy.

Benefit of a clean, cold socket implementation, is that the Being powered directly from VBUS, STUSB4500L removes the switch is open by default, meaning that at connection time, need from any discrete or external LDO support. Power is taken charging path is fully isolated from the connector. Switch is directly from the SOURCE, when it is correctly identified and closed only by STUSB4500L decision, guarantying a safe VBUS at the connection established. In all other cases (no connection, 5V (so called Vsafe 5V). Compared to discrete implementation or connection to another sink), STUSB4500L is not powered as with protection switch, MOS opening time does not have to it simply does not need to. be considered, limiting the risk of destructive power at the connection. Being a standalone interface IC, it does not CONCLUSION need any connection to local MCU or application processor. For fast migration to 5V USB-C charging using STUSB4500L, Therefore, it does not only preserve MCU hardware resources just try our mini-Dongle following this link or download the (such as GPIO or ADC etc…), but it also guarantees a full full Altium library for quick implementation into your design. electrical isolation between the port and the heart of the REFERENCE ARTICLE FROM CYPRESS system, which is always safer.

• INTEROPERABILTY Handling faults is a must, but managing clean re-start after a fault occurred is a major concern for interoperability. This is what STUSB4500L does by having a tight interaction between native protection features and embedded USB-C state machine. For instance, an overshoot on VBUS will be detected by the STUSB4500L. As an immediate action, the VBUS switch will be opened and VBUS discharge be managed. CC pin terminations are removed until VBUS voltage turns back to safe conditions. Electrical disconnection / connection can be then emulated without having to detach / attach the cable mechanically. In best case conditions, fault protection and re-start processes can be so fast that not even visible to endusers, allowing the charging process to continue automatically without manual action from the user.

https://www.electronicdesign.com/power-management/ whitepaper/21131272/usbc-makes-compelling-case-as-eu-movestoward-single-charging-standard?utm_source=EG+ED+Analog+%26+P ower+Source&utm_medium=email&utm_campaign=CPS200508052&o_ eid=7607J7278956D3B&rdx.ident%5Bpull%5D=omeda%7C7607J7278 956D3B&oly_enc_id=7607J7278956D3B

In order to guarantee interoperability, the IC has been certified (TID #1455) as “Power sinking device” according as USB-C rev 1.4 standard.

• APPLICATION BENEFITS Once a SOURCE is identified and verified to deliver the expected 5V, protection switch is closed to initiate charging.

Benefits of having a standalone controller is that this process is immediate, and does not need the application processor to wake-up or boot, which might be pretty long especially when waking-up from dead battery. Maximum charging current is also guaranteed from the beginning as the information is

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T&M-EXCLUSIVE

DEVICE TESTING Internet of Things (IoT) is being well accepted now and number of connected devices are increasing day by day. One report indicates that there will be 35.82 billion IoT devices installed worldwide by 2021 and 75.44 billion by 2025. Another report from Fortune Business Insights says IoT technology holds important potential in the ICT segment with the worldwide market valued at $190 b in 2018 and hitting $1.1 trillion by 2026.

The report projects that the international market will grow at a surprising CAGR of 24.7% all through the estimated years.

IoT has moved from industrial- commercial applications to home appliances, personal devices and much more. Smart sensors, wearables, and connected devices will continue to alter the way healthcare is delivered, from automated homes to telemedicine help for the disabled and elderly. Besides, in situations where the risk of virus infection is strong, it will also be used to minimize unnecessary contact.

n the future, manufacturers who develop and manufacture IoT devices (products) expect more customers complaints about problems, such as difficult and dropped connections and short communications range, which will increase support costs. In order to prevent this situation, manufacturers who develop and manufacture IoT devices (products) must evaluate and test the wireless communications quality at the development and manufacturing stages.

By testing the quality of IoT devices (products) thoroughly at the development stage and guaranteeing quality, after-sales support problems can be reduced in advance.

Madhukar Tripathi

Associate Director – Optical Business and Marketing, Anritsu India are assumed to be the most common method used in the IoT market for connecting to the Internet. There is also news about using 5G, LTE, NB-IoT, Cat-M, wireless LAN (WLAN) and Bluetooth for these wireless communications and IoT devices (products) featuring these technologies are appearing.

Today there is increasing need to deliver better and faster services. There is a huge demand to access, create, use and share data from any device Anritsu IoT device test solutions and equipment can check and test the wireless communications quality at the above-described development and manufacturing stages of IoT devices (products). They support all wireless communications methods, including 5G, LTE, NB-IoT, Cat-M, wireless LAN (WLAN) and Bluetooth.

There will various testing levels in IoT eco system such as unit testing, integration testing, system testing, acceptance testing or functional testing or regulatory compliance testing.

ITU -T document Q Series specifies test methods SWITCHING AND SIGNALLING, AND ASSOCIATED MEASUREMENTS AND TESTS Testing specifications – Testing specifications for IMT2020 and IoT.

Also, at manufacturing of IoT devices (products), defects may occur due to component or assembly failure. After-sales support problems can be reduced in advance by testing and checking the wireless communications quality of finished IoT devices (products) at the final stage. Wireless communications

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Key Test Solutions & key features of them are:

* Wireless Connectivity Test Set (WLAN Tester) MT8862A The Wireless Connectivity Test Set MT8862A is for measuring the RF TRx characteristics of WLAN IEEE802.11a/b/g/n/ac (2.4 GHz and 5 GHz bands) devices. The MT8862A has standard WLAN protocol messages (WLAN Signalling) to connect with the device under test (DUT) for measuring each TRx performance item as Network Mode * Universal Wireless Test SetMT8870A Universal Wireless Test Set MT8870A is test equipment from Anritsu that has been specifically designed for high volume manufacturing test of cellular and connectivity wireless systems supporting LTE, NB-IoT, Cat-M, V2X, WLAN and Bluetooth etc. * Bluetooth Test Set MT8852B The Bluetooth Test Set MT8852B is the market leading RF measuring equipment for design proving and production test of a wide range of products that integrate Bluetooth technology.

It supports Basic Rate (BR), Enhanced Data Rate (EDR) and Bluetooth low energy (BLE) measurement of transmit power, frequency, modulation, and receiver sensitivity required by Bluetooth RF test specification.

* Radio Communication Analyzer MT8821C The Radio Communication Analyzer MT8821C is designed for R&D into mobile devices (UE: User Equipment), such as smartphones, tablets and IoT modules. It supports all technologies, ranging from LTE-U/LAA/Higer order MIMO/ LTE-Advanced to 3G/2G, with its easy-to-use measurement functions for efficient RF adjustment and testing in one unit.

* Signalling Tester MD8475A/B The Signalling Tester MD8475B is an all-in-one, high-performance base station simulator supporting various mobile communications technologies ranging from 2G to LTE-Advanced. With up to eight TX and four RX RF ports, easy operation, and a full range of versatile tests using SmartStudio (state-machine GUI) parameter settings, it is ideal for assuring the quality of mobile terminals supporting LTE-Advanced Carrier Aggregation technology. * Spectrum Analyser MS2830A /Signal Analyser MS2830A The Signal Analyzer MS2830A includes a low-cost spectrum analyzer function supporting high dynamic range. With builtin vector and analog signal generator, modulation analysis function, BER measurement function, Noise Figure measurement function and audio analyzer, it supports measurement for spurious, EVM, LTE FDD, LTE TDD, Analog modulation, etc. The digitize function can capture RF input signals. * Vector Signal Generator MG3710A The MG3710A Vector Signal Generator is a best-of-class, highfunction, signal generator with excellent RF and baseband performance. Up to two RF output connectors can be installed each with two built-in waveform memories to output two combined modulation signals from each RF connector for a maximum of four modulation signal outputs.

Conclusion:

Various test instruments will play important role in R&D, production, integration of IoT devices in ecosystem. IoT devices acceptance and success in market will need latest test instruments. R&D instrument should be more precise in measurement while production test instrument should have faster test speed and more automated to save time and lead delivery in market.

* Simple Conformance Test System ME7800L: Simple Conformance Test System ME7800L is the ideal system for introducing RF and Protocol Conformance tests of 3GPPcompliant LTE mobile terminals. It covers all the basic LTE test items include Cat-M1/NB-IoT and also supports evolving communications standards.

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BIG PICTURE

State of The Coating Industry with Phil Kinner, Global Business/Technical Director - Coatings Division at Electrolube Niloy from BIsinfotech in talks with Phil Kinner, Global Business and Technical Director of Electrolube’s Coatings Division, discuss the impact of 2020, the innovation of new materials, issues of growing importance to the electronics industry and how the future is looking right now. Phil also describes the increasing prominence of condensation resistance and environmental issues that specifically preclude the use of solvent-containing or solvent-emitting conformal coating materials.

Q

It goes without saying that 2020 presented all kinds of challenges for people all over the world, how did the year impact on you?

2020 was certainly an interesting year; one that most of us will choose to forget. Plant shutdowns, project cancellations, component shortages, furlough, working from home, Microsoft teams, Brexit, the list of challenges seemingly endless. Fortunately, life continued largely unchanged for those of us in the R&D team at Electrolube and we were able to complete many of our longer-term projects without the usual day to day interruptions; after all, a win is a win!

Q

As a result of the tremendous progress heralded by the vaccination programme, hope of a return to ‘normality’ is high. However, what does normality look like now, and looking ahead to the future?

Several trends have really stood out as the first half of 2021 comes to a close. Firstly, 150°C appears to have become the new ‘normal’ for the maximum required operating temperature of conformal coatings for automotive use. This is an increase from 85°C or 120°C on the last generation of products.

This new high is really pushing the limits of availability from traditional coating chemistries, but happily for us, this is not a surprise. Here at Electrolube, we have been preparing for this very moment over the last few years; applying ourselves to the generation of solutions and products that support the new requirements.

Q

We have been reading about your extensive work in condensation testing. What is the reason for this?

Condensation resistance continues to grow in importance, increasing in prominence within many new customer specifications. Historically, conformal coatings have predominantly applied to provide a barrier against the effects of humidity affecting the underlying circuit. This is not nearly as challenging a scenario as a condensing environment, where the presence of liquid water provides new tests, both to the thickness and coverage achievable. Liquid water will seek out any weak spots in the protection afforded and corrosion takes place much more quickly if this is present. Liquid water

Phil Kinner

Global Business and Technical Director of Electrolube’s Coatings Division

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can also change the electrical properties of many coatings, causing them to become less insulating than expected, and leading to leakage currents and other unexpected electrical behaviours that result in faulty performance of the assembly.

We have witnessed many cases of late whereupon companies performing condensation testing of powered assemblies, coated with historical materials and processes fail very rapidly, as predicted by the NPL’s recent industry project. Thankfully, there are materials and processes available that can maintain operation and prevent corrosion and failure events under condensing conditions.

Q

What key issues face the industry moving forwards?

Environmental issues have really been in the spotlight over the past twelve months as pollution levels have dropped in many areas due to various lockdowns despite huge ice sheet breakages and raging wildfires. Throughout the world, governments have pledged commitments to a variety of agreements aiming to reduce greenhouse gases and minimize climate change. For example, this year China has effectively banned the use of certain solvents used in many legacy coating formulations, and heavily restricted the use of solvents-in general coatings applications. Whilst conformal coatings are currently exempt from this legislation, it is not hard to imagine that they will be targeted in further legislation or perhaps even the next revision. This has had a knock-on effect with the environmental aspect of Corporate Social Responsibility starting to become more apparent at the material specification level too. For the first time throughout my 22 years in the conformal coating industry, I have seen several specifications that specifically preclude the use of solvent-containing or solvent-emitting conformal coating materials. This is not only a great step forward for the environment, but a great step forward for the material users as well. Solvent-free alternative materials are generally higher

performing in condensing environments and can have the ability to meet the requirements of the increased maximum thermal operating temperatures.

Also, the IPC-CC-830 conformal coating standard committee are currently looking to introduce several new classes of coating materials. This reflects the newer types of products, introduced to help meet some of these new industry requirements. However, since the pass/fail criteria remains the same for materials from different classes, users will still be required to ensure that the materials are fit for purpose and meet their requirements.

Electrolube remain committed to providing conformal coating solutions to meet current challenges but also pay attention to future requirements. The novel, high-performance, solvent-free 2K range of conformal coatings, initially introduced some 5 years ago, is finding commercial success in many applications.

Improved environmental credentials, because of the solventfree nature and lack of by-products from curing, sit happily alongside improved condensation resistance and are the hallmarks of the 2K range.

Q

What does the near future hold in store?

I am really looking forward to the resumption of live and in-person events where I can talk about conformal coating solutions and solving customer’s challenges and issues with them. I’m also really excited about the product launches we will be making later in the year, as well as unleashing future innovations from our R&D pipeline. Finally, I am really looking forward to our integration journey into MacDermid Alpha Electronics Solutions and the benefits that will see continued investment and the opportunity to work with a much larger global team. 2021 is shaping up to be a very exciting year personally, professionally and for the industry in general.

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5G-Exclusive

Technology for the 5G Generation & Beyond

Galit Mendelson

Senior Manager of PoE Marketing & Business Development | Microchip Technology, (www.microchip.com)

How to deliver up to 90 watts of Power over Ethernet wiring in an existing switch infrastructure The Advancement of 5G and PoE

As next generation 5G technology comes to the mainstream, it opens new business opportunities that rely on a variety of IoT and Big Data applications driven by higher data rates and power. There is a greater need to connect powered devices (PDs) such as 802.11ac and 802.11ax access points, 5G small cells, IP surveillance cameras, LED luminaires, and other IoT appliances to Ethernet networks. Power-over-Ethernet (PoE) technology works well to power these devices in 5G deployments, facilitated by the latest IEEE® 802.3bt standard that pushes the power limits of Power Sourcing Equipment (PSE) and Powered Devices (PDs) to 90W and 71.3W respectively.

Ensuring that the PDs that support this latest generation of PoE technology can still work with existing pre-IEEE® 802.3bt 2-pair and 4-pair PDs that support legacy PoE standards is a challenge. This issue has now been resolved since pre-standard and new IEEE® 802.3bt-2018-compliant PDs can share the same Ethernet infrastructure and don’t require changes to existing switches or cabling.

The Road to IEEE 802.3bt

The first PoE standard was ratified in 2003. Since then, PoE adoption has picked up as it is finding its way into powering new applications. PoE offers several advantages such as ease of installation and lower CAPEX and OPEX costs. It has also emerged as a unified and safe power standard that can be used worldwide.

In the early years, the primary drawback with PoE was that the amount of power available wasn’t sufficient for devices such as IP video phones, 802.11n, and pan-tilt-zoom (PTZ) IP cameras, although it worked well for most IP phones and 802.11a/b/g access points. To address this, the Institute of Electrical and Electronic Engineers (IEEE) specified 30W at the PoE source when it released IEEE 802.3at-in 2009.

With devices such as PTZ security cameras, kiosks, POS terminals, thin clients, 802.11ac and 802.11ax access points, small cells, and connected LED lighting connected to the Ethernet network, there is demand for even higher power.

Addressing this requirement, the new IEEE 802.3bt standard utilizes all four pairs of the structured wiring, thereby increasing the maximum PoE power. IEEE 802.3bt extends the power classification information exchanged during initial negotiation to allow meaningful power management capability, enabling support of multiple PoE classes, while also being backwardcompatible. In turn, this helps achieve higher power and more efficient PoE delivery systems.

The IEEE 802.3bt standard was ratified in September 2018, five years after the Call for Interest (CFI) activity started. The new standard facilitates the expansion of PoE use cases since it pushes the power limit of PSEs and PDs to 90W and 71.3W respectively. This makes it a major catalyst to PoE market growth.

In the past too, efforts were taken to increase power delivery to PDs. First, the IEEE 802.3af-2003 PoE standard was launched and could provide up to 15.4W of output power to each device over two pairs of Category 5e (Cat5e) cables. Then, the IEEE 802.3at-2009 standard, also known as PoE+, which is an extension of the first standard, could support 30W output power and 25.5W load power through the “Type 2” PSE/PD. We then saw the emergence of the HDBaseT Alliance, which helped standardize the HDBaseT protocol. This standard allowed the HDMI links to be extended up to 100m over Cat5e or better cables. In 2011, the Power over HDBaseT (PoH) standard, which was created by the HDBaseT Alliance, could extend the maximum power deliverable to 95W over four pairs.

The following table summarizes the pre-IEEE 802.3bt standards:

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Note 1: Extended power capability allows PD input power to reach up to 95W if channel length is known.

from legacy standards to IEEE 802.3bt via a software update with no hardware changes is an important factor.

IEEE 802.3bt not only introduces Type 3 and Type 4 PSEs/PDs and working over four pairs, but also supports both the singleand dual-signature PD constructions. It also adds class 5 to 8 as part of an improved mutual identification process. By bringing in the automatic class functionality, it extends the power capability as long as the channel length is known. It also supports 10G-BASE-T with PoE and provides low standby power support. Here are the PoE capabilities that were available once the IEEE 802.3bt standard was ratified:

The full-bridge rectifier devices that are used on the powered side of the PoE connection help address concerns around reverse-polarity connections for PDs. This can also help cut power space and the costs of delivering IEEE 802.3bt Type 4 Class 8 power.

Note 1: With extended power capability, PD input power can reach up to 60W for Type 3 and up to 90W for Type 4 if channel length is known.

for the existing cabling and connectors deployed in today’s infrastructures. This standard will replace all existing pre-standard PoE solutions that deliver 60W/75W/95W today, such as Universal PoE (UPOE) or 4PPoE. With the right implementation, organizations can continue to use both pre-standard and new IEEE® 802.3bt-2018-compliant PDs on the same Ethernet infrastructure without changing existing switches or cabling.

The IEEE 802.3bt standard is also compliant with the limited power source and Safety Extra Low Voltage (SELV) requirements as defined in ISO/IEC 60950. Despite this, power cannot exceed 100W per port. However, the 100W per port supports applications that were not feasible under the prior IEEE standards, expanding the potential number of PoE ports deployments.

Ensuring interoperability

With the IEEE 802.3bt specifications, the IEEE 802.3bt system will work automatically with legacy Type 1 and Type 2 devices.

However, to ensure this, the PSE needs to be capable (in terms of power) of supporting the PD and both must be standardcompliant. If the PSE cannot support it (IEEE 802.3af/at PSE), the PD will remain off or turn on and consume only the power available from the PSE. The PSE chipset from Microchip is a great example of a solution that enables pre-standard switches to interoperate with new IEEE 802.3bt-2018-compliant products. It is based on an earlier PSE chipset from Microchip, which was widely adopted to implement the POH four-pair power standard for 95W PDs. It also forms the basis for IEEE 802.3bt-2018-compliant PoE injectors and midspans that bridge the interoperability gap for users.

For system developers, IEEE 802.3af/at/bt PoE chipsets provide the scalability to incorporate, into a single board design, the two- and four-pair systems that are required for supporting pre-standard and IEEE 802.3bt-2018-compliant PoE. They also need to include all required manager and controller functionality for building PSE equipment while being able to balance thermal dissipation evenly across the system. The fact that systems based on these chipsets can be upgraded

With the new IEEE 802.3bt standard, 90W can be delivered over four pairs of Cat5e cables and above. Higher PoE levels than this are not recommended since they may not be safe

The Ultimate Solution To Powering 5G Technology With PoE

Microchip multi-Power over Ethernet (mPoE) technology powers any wired network device seamlessly and efficiently, making it the ideal solution for Ethernet-based applications.

Addressing the 5G market demand for more power, more data and more speed, Microchip’s family of multigigabit multiport PoE midspans offer the easiest and most cost-effective way to install Wi-Fi 6 APs and 5G small cells. The ready-to-install PoE injectors not only solve the challenges of adequately powering these devices up to 90W, but also support their 10Gbps data rates across both, indoor and outdoor environments. These solutions make it easy for users and system engineers to transition to the latest IEEE® 802.3bt standard by supporting both pre-standard and IEEE-compliant PoE devices without having to change network switches or cabling infrastructure.

With this, powering challenges will soon be a thing of the past.

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BIG PICTURE

Kuldeep Malik

Director – Corporate Sales MediaTek India

Developing a Chip Technology is Complex Process Needs Years of R&D Followed by the Design, Testing And Trials Kuldeep Malik | Director – Corporate Sales | MediaTek India in an exclusive interview with Niloy from BISinfotech underlines MediaTek with its tagline of “Incredible In, Incredible Out,” aims at creating a connected ecosystem that can flourish on the capabilities of the ultra-fast 5G network. The tagline is applicable especially to MediaTek Dimensity 5G series of chipsets which are bolstered with smart and intelligent technologies to deliver super-performing capabilities to devices, not just smartphones but also modems, laptops and hotspots. The hotshot also elaborates on the company’s 5G portfolio and their expertise in the SoC domain. Edited Excerpts Below.

can contribute towards building a robust 5G smartphone ecosystem. MediaTek Dimensity series is the newest 5G chipset technology that combines a fully integrated 5G modem and a revolutionary power saving enhancement, MediaTek 5G UltraSave. Built on the latest global standards, these chipsets support all popular network technologies, ensuring enhanced coverage, reliability and competitive performance. They also pack built-in technologies for imaging, video, and gaming, yielding an unrivalled 5G experience to the user.

MediaTek has introduced its popular chipsets from the Dimensity series in India, including the Dimensity 800U, Dimensity 700, Kindly elaborate about your 5G portfolio specifically the and Dimensity 1200, and now the latest 1200AI. Leading OEMs Dimensity SoC series? are opting for MediaTek SoCs for their unique, customization MediaTek has launched a series of SoCs featuring some of capabilities. The latest Dimensity 1200AI is a major breakthrough the top innovations and cutting-edge technologies that in this regard, as it allows OEMs to enhance AI capabilities of

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the device across several elements including camera, display, security and more. Dimensity 1200, the flagship in the Dimensity 5G series, is marked by several enhancements including the 3GHz Ultra-Core in a powerful octa-core CPU, MediaTek HyperEngine 3.0 gaming technology, enhanced MediaTek APU 3.0, MediaTek MiraVision 4K HDR video playback with AIvideo and AV1 video decoding, MediaTek Imagiq staggered 4K HDR video capture, up to 200MP photos and AI-camera.

MediaTek 5G Dimensity chipsets build on the capabilities of its predecessors, but feature several major advancements, bringing incredible 5G experience to devices everywhere, not just smartphones but laptops, routers, mobile hotspots and more.

them with the digital tools required to manage their day-to-day affairs. The ongoing pandemic has taught that technology is the cornerstone to development, so we believe technology exclusion of any kind will lead to discrimination and unfair distribution of the benefits of the societal development. Also, anticipating the wider adoption of 5G by late next year.

We will also invest more in the marketing/communication efforts to educate end users about the latest advancements at MediaTek. We plan to engage with industry associates to launch brand connect initiatives wherein the brand can come in direct contact with the end users who really benefit from these technologies. This will be a great learning platform for us to feel the market pulse and perform better in the coming days. Besides, we will be investing more in R&D, with a focus How it is like developing a chip in a 5G world. Challenges on emerging technology trends like AIoT, AR/VR and WiFi6. you identify in terms of reliability, performance while Experts’ purview it’s not anymore about just leadership beholding the power of more connectivity? in semiconductor but combining the power of network Developing a chip technology is complex process involving years of R&D followed by the design, testing and trials. Designing technology with advance 5G R&D. Hence MediaTek’s strength an SoC in a 5G world not only necessitates building capabilities in leading innovations in the indigenous market? around reliable connectivity and network access, but also As a leading chipset player, MediaTek believes technology demands enhanced performance for features like camera, innovation is the most critical aspect to gain an edge in this video playback, gaming capabilities, etc. Perceiving these highly competitive market. Forward-thinking in R&D will help demands, we have invested hugely in our R&D to bring the us explore newer possibilities and build momentum around most innovative products suitable for the markets worldwide. them. When it comes to combining the power of network As the 5G device ecosystem expands, we foresee even technology with 5G R&D and modern-day devices, we can greater challenges with regard to meeting the demands say they all are interdependent. Without the presence of a of the customers. We anticipate a surge in the demand for network, devices are not of much use and vice versa. Thus, devices as 5G gains popularity, especially in countries like to succeed in 5G chipset market, we need to fine-tune the India where data consumption is growing at an unpredictable technologies to deliver the best customer experience across level. The growing volume of data-hungry applications like AR/ each element.

VR, gaming and streaming will demand even more powerful chips in the near future. Thus, we need to be able to meet From the perspective of 5G, the future holds numerous the demand from our customers, not only in terms of supply possibilities for device ecosystem players. From owning smartphones to making our homes smart with 10s and 20s of volume but also on innovations on all fronts. connected devices, we have come a long way. MediaTek Kindly elaborate about “Incredible In, Incredible out” – aims at bringing unending possibilities for its users to fulfill their MediaTek’s vision of a connected and smart ecosystem. requirements in this fast evolving century.

MediaTek with its tagline of “Incredible In, Incredible Out,” System flexibility becomes a critical design challenges. aims at creating a connected ecosystem that can flourish The 5G standard is still evolving with new releases issued on the capabilities of the ultra-fast 5G network. The tagline is applicable especially to MediaTek Dimensity 5G series of chipsets periodically and no end in sight. Any comments. which are bolstered with smart and intelligent technologies System flexibility is one of the major demands of the industry. to deliver super-performing capabilities to devices, not just To meet the demands, we have launched 5G Open Resource Architecture to open the in-chip resources for device makers, smartphones but also modems, laptops and hotspots.

The “Incredible In” symbolizes the power of the fully integrated especially for features like camera, display, graphics, AI in-chip 5G modem, combined with the MediaTek 5G UltraSave, processing units, sensors, and connectivity sub-systems in capable of delivering sub-6GHz performance. The “Incredible select Dimensity 5G chips. Dimensity 1200AI is our latest open Out” signifies the infinite possibilities enabled by our advanced resource architecture, which can be seen in the leading chip technologies that support the latest standards and global brand OnePlus. cellular network technologies, offering incredible coverage, MediaTek chip technologies are designed on par with reliability and performance. MediaTek builds technologies international standards. Our 5G solutions are 3GPP Release 16 compliant, offering comprehensive connectivity across 2G keeping humans and their evolving demands in mind. through 5G. They deliver incredible 5G performance at both MediaTek’s upcoming plans for the Indian Market? mmWave and Sub-6 GHz frequencies. Further, we have made As we await the launch of 5G network in India, MediaTek several advancements in connectivity realm, especially with is investing in 5G technologies with intent on making them features like 5G NR Carrier Aggregation with Mixed Duplex accessible to the entire community in India, thus empowering (TDD+FDD) and Dynamic Spectrum Sharing (DSS).

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EXPERT COLUMN

Power Modules Empowering a New Era of Healthcare With an Evolution of IGBT Modules

Hitesh Bhardwaj

General Manager | Mitsubishi Electric India Pvt. Ltd.

Over the years, innovations in technology and business models have changed the world and the way we live. With industry 4.0, a blend of artificial intelligence (AI), robotics & automation, big data, internet of things (IoT), simulation, additive manufacturing, cyber-physical systems and sensorbased technologies in line, each and every sector has been making full use of these advancements that can help save time and ensure productivity.

There is no denying that the healthcare sector is also in the same league, seeking support from tech giants. Being a major focus in most of the countries, especially during the pandemic, the healthcare sector is looking for innovations that can plan, scan and diagnose issues faster; thereby ensuring precision healthcare to support the growing needs in less time.

Even today, the access and availability of quality radiology and laboratory services have been a key challenge for the healthcare system.

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Gradually, the companies also customize devices according to needs and preferences. The IGBT (Insulated Gate Bipolar Transistor) module is one such innovation. The IGBT module is used in power electronic applications such as inverters and the power supply in many types of industrial equipment.

With a long history of providing high currents and high voltage IGBT modules, Mitsubishi Electric India has innovated their chip structure from a flat planar structure to a trench gate structure. Also, from the 5th generation onwards, low loss CSTBT (Mitsubishi Electric India's unique IGBT that makes use of the carrier cumulative effect) modules are being offered. The Medical power supply is one of the key applications where the 5th generation high-frequency modules are being used.

From the 5th generation IGBT, the line-up has further extended with a thin profile (NX type) package, in addition to the former (standard type) package in the S series (6th generation IGBT).

Mitsubishi Electric India is now offering the T/T1 series (7th generation IGBT) as the latest version. The company has developed the IGBT module technology, both chip structure and packaging, over the years. The introduction of a new generation every time helped achieve better results, including low power loss and compactor features, which enables better efficiency and size reduction in the customers’ equipment.

The IGBT modules are also used for amplifying magnetic resonance Imaging (MRI) systems. The need for advanced MRI systems is rapidly increasing as there is an urgent need to diagnose more cases in less time.

However, the technology sector has been doing its bit and providing additional support to the industry. The technology companies offering semiconductors and devices are changing the healthcare industry in India. Many of the devices used in healthcare are in-built with semiconductors that include Magnetic Resonance Imaging (MRI) systems, radiography, blood pressure monitors, pacemakers, etc.

Many global leaders in the industry have also come forward with a range of semiconductors and devices designed with cutting-edge technology that provides energy-saving solutions for various devices. One of the leading manufacturers of electrical and electronic products in the world, Mitsubishi Electric India has extended their support to the healthcare industry as well.

Whether in appliances, railcars, EVs, or industrial systems, Mitsubishi Electric offers power modules that are the key elements in changing the way we utilize energy.

These power modules provide an easy way to cool the device as well as connect them to the outer circuit and are mechanically and thermally optimized for ease of assembly, long life and reliable operation. The power modules are often classified by the type of diode that they feature (fast recovery, standard SCR, Schottky, etc).

For seamless operations, the application of IGBT modules in MRI systems requires power modules assembly. It acts as a switching device that quickly initiates fast switching with high efficiency. The efficient power supply provides amplifiers for switching or processing complex wave patterns with pulse width modulation. As a result, these systems can capture anything to everything, including those minute details of a torn ligament to diagnosing tumours.

The other application of IGBT modules can be seen in radiography systems as well. Radiology is the key diagnostic tool for many health problems and has an important role in monitoring treatment and predicting results. The advanced radiography systems provide excellence in imaging and the optimization of workflow. IGBT modules help turn on the device and maintain a regular power supply to the system.

The regular supply of the power and amount of the voltage delivered ensures low power loss and the maintenance of effective resistance of the circuit currents, delivering better quality images.

These IGBT modules by Mitsubishi Electric India are constantly supporting the healthcare structure of our country. Mitsubishi Electric India aims to provide equipment with the best semiconductor technology. The company is striving hard to offer services that act like a heart for the machines and effectively powers the systems.

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TECH-FUTURE

Steer the Future of an ATMS With Secure Data Acquisition & Transmission As traffic congestion continues to increase and take a heavy toll on existing infrastructure, the environment, and commuting time, city administrators and traffic engineers are turning to intelligent transportation systems (ITS) for practical and cost-effective solutions to improve road safety and traffic management. These systems leverage cutting-edge analytics, made possible by vast amounts of high-quality data that was collected by various sensors.

At the core of an ITS, the Advanced Traffic Management System (ATMS) incorporates sensors with communication and control technology to monitor traffic conditions and transmit relevant data to the traffic control center via a citywide

network. The control center then consolidates information from other sources to formulate, evaluate, and execute traffic control strategies, as well as deliver relevant information to all road users for route planning and safety purposes.

Increasing Components of an ATMS

ATMS integrates traffic monitoring, analysis, and control into a single application via a network. The more real-time traffic data is fed to the central control system, the more robust it becomes. A reliable network is therefore key to enabling operators to make the right traffic management decisions.

An ATMS contains the following necessary components:

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Control Mechanism: At each road intersection, the control mechanism analyzes the traffic information coming from various sensors to decide the optimal timing for each traffic signal.

This is made possible by multiple subsystems and devices, such as traffic lights, variable message systems (VMS), traffic information from road weather information systems (RWIS), or CCTV systems.

Sensors: Sensor data is important as data forms the basis for recognizing traffic patterns and formulating a traffic control plan. Common sensors in an ATMS include loop detectors and laser or radar sensors for motion detection. Cameras are also widely used in these applications.

Communications: Control mechanisms at each intersection also need to be interconnected for communication with the central control system via wired or wireless networks.

That way, signal switching at multiple intersections can be coordinated effectively.

Central Control Systems: At the heart of the ATMS is the Central Control System (CCS), which oversees the entire traffic management operation of the ATMS.

First, does my connectivity solution make network integration of various sensors easy?

An ATMS relies on multiple sensor data to provide insights for both traffic management input systems and information output devices used to convey messages to road users. The interfaces required may include serial-based or digital/analog data points, so your connectivity solution should offer multiple yet flexible communication interfaces in one compact hardware design to make installation and maintenance efficient. Thus, choose a compact and reliable solution to connect various sensors for clean and robust integration.

Second, does my connectivity solution provide sufficient cybersecurity safeguards for critical infrastructure?

Transportation systems are critical infrastructure important to national security and safety. Networked and cloud-based services can become an easy target of malicious hackers.

Proper device configuration and up-to-date installation of firmware and security patches help secure both data and communication within the network. Thus, choose a solution that is secure by design and provides essential security functions to ramp up your device security.

Third, how do I manage multiple field devices spread across different networks and sites?

The increasing number of smart sensors that are deployed at different field sites requires more networking devices for data acquisition and communication.

Consequently, traffic system networks can become a tremendous undertaking and easily overwhelmed. Configuring, maintaining, and troubleshooting these devices and networks can also be labor-intensive and time-consuming.

For this reason, you need an efficient solution from the very beginning. For example, a network management tool that visualizes your networking device statuses and provides a user-friendly interface for mass configurations can be a great help.

Thanks to the increasing adoption of cloud-based traffic management systems and the wider deployment of smart sensors, today’s ATMSs are more efficient and robust. However, these advanced sensors and systems also raise several connectivity concerns. Before revamping your existing traffic management systems, you should ask yourself the following three questions.

As an industrial connectivity and networking solution provider, Moxa has helped numerous clients connect and build reliable networks for ATMS in intelligent transportation systems.

Download our case studies and see how we have helped other companies enable future-proof communication for their ATMS. Looking for the right connectivity or networking products for your application? Download our E-book to find out what key criteria you should consider to choose the best solution for your needs.

(The article is an original piece written by MOXA.)

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BIG PICTURE

Hyperscale Data Centers

Are Mushrooming Globally and Have Pervaded the Indian Enterprise Segment As Well

Just after Sachin Bhalla VP and Country GM – Secure Power, Schneider Electric India and SAARC joins in to the leadership team of Schneider Electric India, Niloy from BISinfotech gets along the veteran exploring his new journey, vision and his key strategies upfront. Sachin during this exclusive interview shares his expertise across the importance of IoT and edge computing in data center, how Modular UPS can help data centers, trend of micro data centers and cues the scenario of hyperscale data centers in India. Edited Excerpts Below.

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Firstly congratulations, Sachin on your new leadership position.

In this new role what will be your key responsibilities and your strategies to take the company ahead to new dimensions?

Thank you. It is indeed a matter of immense pride for me to take on the mantle of Schneider Electric’s Secure Power division which is distinguished as one of the most dynamic and revolutionary divisions of the organization. My new role comes at a time where we are exploring and defining new paradigms for edge computing and data center operations, integrating new-age technologies in empowering sustainability and stepping forward towards our goal of a zero-net future.

Sachin Bhalla

VP & Country GM – Secure Power, Schneider Electric India and SAARC

their businesses, and achieve their Sustainability goals. I would also want to ensure resilient and sustainable business growth for our channel partners.

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The importance of IoT and edge computing in data center and how critical the security factor becomes and the benefits clients can tap with these evolving co-technologies?

Technical buzzwords like the Internet of Things (IoT) and edge computing that we increasingly use exist in conjunction, especially when we speak about data centers. IoT empowers devices with unparalleled data processing power and robust connectivity through superior cloud networks. While we have been gearing up The key responsibilities and strategies that I have delineated to to embrace edge computing as ‘next big thing’, this technology expand the frontiers of our Secure Power division include growing has pervaded our industries and operations, accelerating workflows the business further, post pandemic, through our Data Center and breaking down silos and deploy next-gen solutions. Edge and infrastructure offerings. I will help our enterprise client grow computing integrates its distributed networks that brings data

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closer to data storage units, making operations faster and secure.

These evolving technologies render immense benefits to clients, some of which include increased cost efficiency and savings, scalability and improved reliability. Security is an imperative factor and is inalienable across data center operations. The growth of data centers and their use of new and emerging technologies help in identifying and mitigating potential breaches to security.

With decentralised data, the extended footprint using edge computing increases the surface area for attacks exponentially.

Multiple unsecured endpoints are used as entry points to the core network or in distributed denial-of-service attacks.

Today, edge computing is present everywhere in different forms. It can be mobile as in the case of a smartphone or vehicle. Or it can be static as in the case of manufacturing plants or offshore oil rigs, building management solutions. It can also be an amalgamation of both as seen in hospitals and other medical environments. With edge computing, the possibilities are limitless. The importance of edge computing can be realised by the fact that by 2025, 75% of enterprise data will be generated and processed on the edge.

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How a Modular UPS can Help Data Centers Protect and Scale their Operations?

With the ever increasing demand for data, data center densities will continue to rise. The global data center market will grow at a CAGR of 4.5% over the next five years. With physical space being a limiting factor, data center managers are challenged to add power and expand operational capacity without adding physical space or scheduling downtime. This is where Modular uninterruptible power supply (UPS) present themselves as the ideal solution. The Modular UPS offers flexible, cost efficient solutions that extend multiple advantages for data centers. They follow the pay-as-you-grow model that not only is extremely cost-efficient but also emphasizes on employee safety.

With the explosion in the number of IoT devices sending raw data to a single, central data center, the issue of latency comes into play. This is where micro data centers step in as the solution. They collect the data from devices around them and process it locally, thus combating the latency issue.

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The scenario of Hyperscale data centers in India and your strategies to explore this segment?

Hyperscale data centers are mushrooming globally and have pervaded the Indian enterprise segment as well, especially as a consequent factor following the current pandemic. There is a significant shift towards operations becoming hyperscale with the increasing patterns of data consumption and utilization. The hyperscale data center market is projected to grow to USD 80.65 billion by 2022, with a CAGR of 26.32%.

With the rapid adoption of cloud and edge computing along with the shift in demand from on-premises to colocation providers, hyperscale data centers will be propelling digital transformation while supporting robust, scalable operations end-to-end. Hyperscale data centers empower energy efficiency. With the integration of cooling mechanisms including hot aisle isolation, economizers and liquid cooling, they help in scaling back power consumption.

The demand for hyperscale data centers in India is developing phenomenally. A key driving factor for the same is the consumer demand for app based and OTT services that run on the cloud.

With data utilisation from half a billion digital users in India, the scale of cloud adoption is unprecedented. Increased digitisation efforts by the Indian government and plans for smart cities is another driver. Data localisation mandates driven by the government is also a contributor as organizations are shifting to hyperscale data centers in order to service their clients in India.

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How important is the India market for Schneider Electric when it comes to data center market?

The Indian data center market is expected to grow at a CAGR of over 12% during the period 2020-2026 when looking from the lens of investments. With the outbreak of the coronavirus pandemic, The trend of Micro Data Centers as a service and why it is the Indian market is witnessing huge investments as a result of becoming pivotal? high demand from BFSI, e-commerce, transportation, logistics, Micro Data Centers (MDC) stores all the computing, storage, and and government agencies. Within the span of two years, the networking power combined with cooling, power, and other demand for hyperscale data centers has skyrocketed as more factors that are intrinsic to a data center’s operations. Owing to businesses are moving towards the cloud. their small size, they are used at places where a traditional data center is significantly larger and cannot be deployed.

The Indian market has immense potential for growth and expansion MDCs are witnessing a growing trend as they offer easy installation. for Schneider Electric. What we look forward to the most is to This is because majority of the micro data centers are shipped cater to the needs of our booming population and empower preassembled and only require installation by the user. Moreover, them with our ethos of being sustainable, scalable and secure. they offer several business benefits such as low latency, increased Support clients (pre-after sales) can bag while aligning with resilience, faster deployment times, standardisation, scalability, Schneider Electric’s solution and also if you can highlight and reduced costs. Some increasingly popular and preferred micro data center use cases today include IoT, content delivery, about your esteem partners ecosystem?

Schneider Electric is a leader in providing physical infrastructure 5G, and hybrid cloud architectures. solutions for data centres. The main challenges that we address MDCs are booming within the data centers vertical and becoming include speed, cost, availability risk, modernising, and integration, a pivotal part as they have a smaller footprint, reduced costs and and we empower end-to-end data center operations that are deployment times while also increasing resilience and scalability. future-proof and reliable.

Some advantages of the modular UPS approach include smaller footprint, scalability, availability, safety, keep data center employees safer, and scale fast with no scheduled downtime.

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BIG PICTURE

Sanjay Dhar Director India Elektrobit (EB)

Advanced Technologies Such as IOT and AI Are Bringing in Transformational Changes in the Automotive Industry Advanced technologies such as IOT and AI are bringing in transformational changes in the automotive industry. It is not only revolutionizing the way people travel from one point to another but is also unfolding a whole new world of opportunities and possibilities for the OEMs and all the other players in the ecosystem states Sanjay Dhar - Director India, Elektrobit (EB) during an interview with Niloy from BISinfotech. The veteran also pans across many facets of modern automotive industry.

Edited Excerpts Below.

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Is Elektrobit’s key focus on the need for a shift from hardwareto software-defined vehicles?

As the vehicle continues to transition itself from a hardware-based machine to a software-based electronic device, the amount of software (or lines of code) and the complexity of software in

the vehicle is continuously increasing. In the past, the vehicles were assembled from many different hardware components with no software or connectivity at all. Then embedded software enabled new functions and first connectivity was introduced to connect the different ECUs in an in-vehicle network. Today vehicles getting connected to the cloud have become common and standard. In the future, autonomous driving along with new mobility solutions will have a fundamental impact on the vehicle software and the ecosystems in which the connected vehicle is embedded.

In addition, hardware is becoming commoditized and the percentage of software costs compared to the overall vehicle costs is continuously increasing, hence shifting the focus from hardware- to software-defined vehicles.

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As automakers take a vigorous shift towards EVs, the space of vehicle-to-grid (V2G) charging is changing. What are the differences between V1G and V2G? As the percentage of electric vehicles on the road increases, optimal charging of these vehicles becomes a key focus area. The primary difference between V1G and V2G is that V1G is unidirectional while V2G is bidirectional. To elaborate a bit more, V1G involves varying the time or rate at which an electric vehicle is charged in order to provide ancillary services to the grid, while V2G additionally includes reverse power flow which means that the electric vehicles are equipped to provide electricity back to the grid. There are other concepts such as “vehicle-to-home (V2H)” and “vehicle-to-building (V2B)” which means the vehicle can act as a source of power and can power homes and buildings. We have our own solution for V2G charging (https://www.elektrobit.com/products/ecu/ebtresos/v2g-chargein/) through which we help carmakers and Tier 1 suppliers to implement charging solutions inside charge control ECUs within short development cycles with our off-theshelf Classic AUTOSAR basic software products, tailor-made for OEM requirements.

Automated driving software components; 2. Automated driving test and validation; 3. ADAS and automated driving engineering services; 4. Environmental model. https://www.elektrobit.com/products/automated-driving/ For markets such as India, until the fully autonomous car becomes a reality, we will focus on providing advanced driver assistance functionalities such as driver fatigue detection, lane departure warning, adaptive cruise control, automatic emergency braking, adaptive lighting to name a few, to improve drivability and make the drive safer.

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Impact of advanced technologies such as IoT and AI in the automotive space?

Advanced technologies such as IOT and AI are bringing in transformational changes in the automotive industry. It is not only revolutionizing the way people travel from one point to another but is also unfolding a whole new world of opportunities and possibilities for the OEMs and all the other players in the ecosystem. Broadly speaking, IOT technologies are transforming the vehicles in the following two ways: 1. The customer’s vehicle will become a part of their personal IoT environment consisting of smart home functions, wearable devices, etc.; 2. The vehicle At what level does Elektrobit assist automotive players and will become an IoT device in the smart city environment where their respective clients? Are there any key flagship offerings it will have to interact with other vehicles, intelligent street lights, that you want to highlight stating this dynamic market? intelligent traffic signals, and other infrastructure components.

Elektrobit (EB) is an award-winning and visionary global supplier Application of AI technology in the automotive space is enabling of embedded and connected software products and services functionalities across the following areas: 1. Personalized and for the automotive industry. A leader in automotive software customized experience to the drivers and passengers; 2. Increasing with over 30 years serving the industry, EB’s software powers safety for the drive, the road, and the driver through driver over one billion devices in more than 100 million vehicles and assistance functionalities; 3. Enhancing the vehicle-customer offers flexible, innovative solutions for car infrastructure software, relationship (VRM) through remote diagnostics and predictive connectivity & security, automated driving and related tools, maintenance functionalities. and user experience.

How do you see India as a market for Elektrobit and trends Being an international supplier of embedded software solutions specific to India to sculpture the indigenous market? and services for the automotive industry, what changes India is an important market for us, and we are focusing to grow and trends do you reckon have been shaping up this space? our business in the India market. Some of the key trends we are ‘CASE’ is a megatrend that is transforming the automotive observing in the India market are: industry globally. Some of the key global trends across each • Connected vehicle services and apps area of CASE is as follows: • Remote diagnostics and OTA features • Connected – With connected vehicles becoming ubiquitous, • Four-wheelers and two-wheelers with ADAS and ARAS data has become the new oil. Every player in the ecosystem functionalities respectively wants to own and monetize the data. And with concerns • Security and functional safety around data privacy and security, topics such as cybersecurity Lately, Elektrobit (EB) successfully completed five years in is coming to prominence.

India. Is there an anecdote on the journey so far and outlook • Autonomous – We are observing trends such as autonomous delivery, autonomous public transport, and modular autonomous specific to the business model and market strategies to keep the momentum strong?

PODs in this space.

• Shared – AI-enabled personalized experience is one of the In the last five years we have grown tremendously in size, content, and our areas of operations. Our constant endeavor has been key trends emerging in this space.

• Electric – V2G and automatic billing in charging stations are to create and deliver more value to our headquarters, other EB locations, and to the local market. We view our R&D engineering some of the key trends in this space. center in Bangalore as an automotive software hub from where How distant is the future of an autonomous car and at what we can also enhance our local customer business offerings. level of autonomy is Elektrobit supporting its clients?

India is also looked at as an innovation partner for our product Fully autonomous vehicles are already being driven in some development activities for our global customers. Hence, we will parts of the world. We have our products and offer services for continue investing in similar proportions and add head count automated driving functions across the following categories: 1. in India in the future too.

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5G-COLUMN

The Virtual Key to Unlock 5G & 4G Data

Fergus Wills

Director of Products, Enea

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Data is at the heart of nearly everything in today’s hyperconnected world. This is particularly true for mobile telecom networks. Yet mobile operators have found that their legacy data management systems are unable to keep up, failing to provide the capabilities they need to monetize and access services as they transition from 4G to 5G. With 5G networks, it’s all about agility. When it comes to launching new services and network slices across public and private networks, fast access to data is critical. Application, profile, and subscriber data have to be available accurately, seamlessly, with low latency, across many different sites in a decentralized model. Otherwise, operators cannot bring innovative new services to life quickly and effectively monetize their 5G investment.

The beating heart of 5G

Not all 5G ecosystems are created equally, and many operators lack a comprehensive view across vertical data silos. This not only hinders their ability to launch new services and on-board new clients, but duplicate and fragmented data drives up the costs of storage, access and operational management.

In order to realize their return on 5G, mobile operators should consider deployment of a common network data layer architecture across legacy and 5G systems. A cloud native fabric of data access which allows control and user plane functions to write and update data to a common layer but make it accessible anywhere in the system.

The challenge faced is that operators are still at the mercy of vendor lock-in and lack sufficient control of their (own) data.

That’s why Enea introduced the industry’s first telco grade virtualized 5G data schema, based on 3GPP guidelines to unlock the 4G/5G data path from the network core to the edge. Developed for the Stratum Network Data Layer, its open standard virtual schema allows operators to take full control and ownership of their data by mapping 4G and 5G data models into single customizable read/write views.

The telco-grade solution breaks through vertical data silos, enabling operators to implement new use cases such as edge computing, network slicing and IoT, while interworking seamlessly with 4G systems and the 5G core. This powerful 5G data management system can seamlessly access multiple data sources — an important factor for synchronization to resolve latency and performance issues. By breaking down vertical data silos and creating a harmonized data model, the virtual schema provides the solid foundation that operators need to build agile 5G ecosystems.

Life on the edge

A common problem with yesterday’s proprietary, centralized databases is a lack of scalability, due to an architecture that requires all data to be stored and distributed in a small number of large databases. This means that a service at the edge has to make multiple transactions back to the core site just to get the data they need to function, which results in accumulated delay and latency. This lost time is the enemy of 5G. In other words, a fast access system is slowed down by the slowest link to an old data management system. This legacy pain point significantly hinders mobile operators trying to introduce a new service where changes need to be made and selectively replicated in different parts of the network.

The 5G virtual schema provides dynamic read-write capabilities, allowing operators to make changes quickly. Data that is created or updated in one location can be accessed and read anywhere— from the core to the edge — securely and instantly while avoiding synchronization issues. This robust data management solution allows data to live at the edge to deliver low latency, but selectively and automatically synchronizes data across the region or whole network, delivering safe data management at the edge. With virtual schema and Stratum’s cloud-native capabilities, mobile operators can have full control and visibility of when, where and how their data feeds their architecture dynamically.

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EVENT-EXCLUSIVE

EV

Development Series by ICAT ASPIRE & MathWorks Turned Heads of the Electrification Community

The virtual 5-part Electric Vehicle Development series focused on the end-to-end workflow for electric vehicle modelling and simulation concluded on 15th Sept, 2021. There were more than 3000 attendees from the automotive industry at the virtual event, from the commercial, academia and startup community. The sessions imparted guidance on how to simulate a whole electric vehicle and analyze design including vehicle architecture in a single environment.

The event was organized by ICAT ASPIRE and MathWorks under the noble initiative of Azadi Ka Amrit Mahotsav – the 75th Anniversary of India’s Independence. Ministry of Heavy Industries’ (MHI), Govt. of India, has taken an initiative to promote innovation and to develop an eco-system for the same by creating 6 technology platforms through the organizations under its aegis. In line with this initiative and recommendation

by MHI, International Centre for Automotive Technology (ICAT), Manesar, has launched a new technology platform, in the form of an e-Portal, named “ASPIRE” (Automotive Solutions Portal for Industry, Research & Education). The key objective of this initiative is to enhance the technological capability of Indian automotive sector through exchange of knowledge & expertise, in order to facilitate the growth of automobile sector and overall socio-economic progress of the country.

This technology platform will facilitate auto industries (including OEMs, Tier 1, Tier 2 & Tier 3 companies), R&D institutions and students & academia (colleges & universities) to provide technology solutions, suggestions, expert opinions etc. on issues involving technology advancement. Further, it will facilitate exchange of knowledge with respect to research & development and other technological aspects of the automotive sector. The e-portal will act as one stop solution.

One can register on this portal for the own organization (industry / R&D Institute / Institution/ Start-ups) or as an individual as expert (or academia) or user or

student. There is no registration fee at present.

Here is the link for the same: https:// aspire.icat.in/ oauth/register. We believe that this initiative will bridge the gap between Industry and Academia and help the overall technological innovation in the country.

MathWorks, a mathematical computing company, creators of MATLAB and Simulink has been heavily invested in helping companies accelerate their electrification journeys through their tools, training and experts.

Speakers included Mr. Saugata Pal (Advisor, ICAT), Mr. Devesh Pareek (Manager, Electrical Electronics Lab, ICAT) together with client facing engineers from MathWorks, Speedgoat and partners. Mr. Saugata shared details on the ICAT ASPIRE platform and how this could be leveraged by the automotive community as a medium for technology innovation and collaboration to help the Indian automotive industry to become self-reliant. Mr. Devesh spoke about how ICAT provided the validation requirements for electric vehicles and their critical components using dedicated facilities with specific capabilities.

Trending topics that were discussed

• Model-Based system Engineering for translating requirements to vehicle architecture to system design.

• Building detailed battery cell and pack models for developing and implementation of battery management system (BMS) • Building accurate motor models for designing and implementing motor control algorithms.

• Leveraging Model-Based Design for the software development and verification process to meet industry standards like ISO26262 • Re-use system models for real-time testing of BMS, MCU and VCU. If these topics interest you, you may view the recording of the event series that is available freely here.

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INDUSTRY UPDATES

Infineon Upgrades EconoDUAL 3 Portfolio Infineon Technologies has released new current ratings for its EconoDUAL 3 portfolio with TRENCHSTOP IGBT7 chips.

With the broad range of current classes from 300 A up to 900 A, the portfolio offers inverter designers a high degree of flexibility while also providing increased power density and performance.

In addition to solar and drive applications, the portfolio is also tailored for commercial, construction and agricultural vehicles (CAV) as well as for uninterruptible power supply (UPS) inverters.

Based on the new micro-pattern trench technology, the EconoDUAL 3 with the TRENCHSTOP IGBT7 chip performs with much lower static losses compared to the modules with an IGBT4 chipset.

Additionally, its on-state voltage is reduced by up to 30 percent for the same chip area. This brings significant loss reduction

ST with Feig Develop Contactless Logistics System

STMicroelectronics and Feig Electronic have collaborated to join their RFID know-how in a time-saving logistics solution that can help cut numerous costs and enhance flexibility for vendors of high-tech products such as smart industrial, consumer, and medical devices.

Together the Companies have created a production-ready contactless system capable of personalizing palletized items containing ST’s ST25DV NFC dynamic tags in just a few seconds, eliminating the need to power up or even remove the products from their packaging.

With this system, end users can eliminate the costs associated with inline programming and leverage contactless NFC technology to enjoy efficient, economical, and flexible stock management and logistics.

A typical application configures setup parameters such as manufacturer ID, serial number, and default language in new products before they are shipped.

Historically a laborious and time-consuming process that requires connecting each unit to a programmer, basic setup can now take place at any convenient point in the supply chain using this new contactless solution.

The innovative solution extends the readable range for contactless NFC interactions beyond the typical distance of only a few centimeters, to create a 1m x 1m x 1m readable space. By connecting the Feig ID LR2500 long-range reader/ writer to two pairs of long-range antennas positioned on either side of the reading area, the Feig system can simultaneously program batches of products containing the ST25DV dynamic NFC tags placed in the reading area.

in applications, especially for industrial drives, which usually operate at moderate switching frequencies. The oscillation behavior and the controllability of the IGBT have been improved. Additionally, the new power modules feature a maximum overload junction temperature of 175°C. The new chip dimensions enable optimization of the module layout to reduce switching losses. As a result, the switching losses for the 600 A module are reduced by up to 24 percent compared to the former generation.

This leads to a simplified design-in for applications with higher switching frequency. Furthermore, all features can be implemented in the same footprint facilitating the upgrade of existing inverter system designs.

With the extended 750 A and 900 A versions, the EconoDUAL 3 package addresses an improved inverter power range. In addition, the PressFIT housing enables a fast and cost-efficient assembly.

Cadence Pegasus Verification System Verified

Cadence Design Systems has reported that the Cadence Pegasus Verification System is now qualified for the GlobalFoundries (GF) 12LP/12LP+ and 22FDX technologies. The collaboration with GF confirmed that the Pegasus Verification System meets the rigorous accuracy and runtime targets customers have come to expect with physical verification for these advanced GF nodes. GF-qualified rule decks are now available to help customers who are designing and taping out hyperscale, aerospace 5G communications, consumer and automotive applications ramp up quickly.

The Pegasus Verification System offers several benefits to customers designing on GF 12LP/12LP+ and 22FDX technologies.

Architected from the ground up to provide massively scalable runs, the Pegasus Verification System provides fast turnaround times and more predictable design cycle times with design rule checks (DRC), layout versus schematic (LVS), metal fill and design-for-manufacturing (DFM).

It features tight in-design integration with Cadence’s Innovus Implementation System and Virtuoso platform, providing improved productivity and checks throughout the implementation flow. Also, designers can easily fulfill mandatory DFM requirements by leveraging integrated hotspot detection with seamless automated fixing. The Pegasus Verification System is part of the broader Cadence digital full flow, which provides optimal power, performance and area (PPA) with a faster path to design closure and supports Cadence’s Intelligent System Design™ strategy, enabling SoC design excellence.

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LAUNCH

ST Presents eSIMs for M2M Applications STMicroelectronics has reported mass-market availability of its ST4SIM, eSIM (embedded SIM) ICs for Machine-to-Machine (M2M) applications through e-distribution.

Features: Applications: • Provide all the services needed to connect IoT devices to Machinery condition Availability: cellular networks. monitoring and predictive Available through e-distribution.

• Allowing remote management of the SIM profile under the maintenance, as well as The ST4SI2M0020TPIFW is now GSMA specification. asset tracking, energy available at the eStore. Other • Let customers change the connectivity provider without management and package options are available having access to the device. connected healthcare to order, including the highly • ST also takes care of activation and deployment by arranging devices. miniaturized wafer-level chipfor customers to use device-onboarding and service-provisioning scale package (WLCSP) platforms provided by ST Authorized Partner Truphone.

Infineon Presents 22 kW Reference Design Infineon Technologies has launched a pretested industrial reference design for motor drive which reduces the time to market significantly.

Features: • A general-purpose motor featuring a nominal power of 22 kW and can be operated directly on a 380 to 480 V three-phase grid.

• The design can be fully reused for customization.

• Allows customers to evaluate Infineon’s products under real operating conditions.

• The design combines Infineon’s latest technologies in one system.

• The system is optionally available with a 3D-printed housing, which encloses all electronic components and the cooling system.

Applications: Pumps, fans, compressors, and conveyor belts.

Availability: Available Now

Microchip’s Compact 1.6T Ethernet PHY

Microchip Technology unveils PM6200 META-DX2L reducing power per port by 35 percent compared to its 56G PAM4 predecessor, META-DX1, the industry’s first terabit-scale PHY solution.

Features: • Industry’s most compact, 1.6T (terabits per second), low-power PHY (physical layer) solution.

• High-density 1.6T bandwidth.

• Space-saving footprint • 112G PAM4 SerDes technology • Supports for Ethernet rates from 1 to 800 GbE • Connectivity versatility to maximize design reuse.

Applications: Handling escalating data center traffic driven by 5G, cloud services and Artificial Intelligence (AI) and Machine Learning (ML) applications.

Availability: Available Now

MORNSUN Launches Buck-Boost DC DC Converter MORNSUN has introduced KUB4836EB(F)-10A(-RS), a 1/8 brick non-isolated step-up & step-down DC/DC converter, meeting the customer's demand for voltage and current.

Features: • Input voltage range: 9 - 60V • Output voltage range: 0 - 60V • Output current range: 0 - 10A • Output voltage and current are both adjustable • High efficiency up to 95% • Input under-voltage protection, output short-circuit protection, over-temperature protection

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Applications: Various applications

Availability: Available Now

Littelfuse’s Optically Isolated MOSFET Gate Driver Littelfuse launched the first high-voltage optically-isolated MOSFET gate driver on the market that requires no external power supply, yet can provide fast load turn-on speeds in the order of tens of microseconds.

Features: Applications: • Provides fast turn-on switch speed (typically 40µs) Demanding • Enabling designers to create a custom, higher power, optically isolated, fast turn-on DC-only or AC/DC solid-state relay (SSR) with external MOSFET(s). application • To increase the switching speed, simply utilize the product’s unique requirements. load-biasing, on-board circuit.

• The use of load-biasing eliminates the need for an opto-gate driver auxiliary power supply.

Availability: Available Now

TDK’s MEMS Barometric Pressure Sensor Platform TDK Corporation launched the InvenSense ICP-20100 platform, a new generation, featurerich barometric pressure sensor.

Features: • Improves on the industry-leading accuracy, long-term drift, and temperature stability of the SmartPressure™ product family.

• Combines a barometric pressure and a temperature sensor in a small 2.0 mm x 2.0 mm x 0.8 mm package.

• The device enables flexible user designs with multiple input voltage levels including 1.2V, 1.8V and 3.3V, and a choice of I²C, I3CSM and SPI interfaces.

Applications: Smartphones, tablets, drones, and smart home appliances.

Availability: Available Now

Analog Devices Launches LTC3337 Analog Devices has launched the LTC3337, a nanopower primary (non-rechargeable) cell State-of-Health (SoH) monitor with precision coulomb counter, designed to be placed in series with a primary battery with minimal associated series voltage drop.

Applications: Features: • The patented infinite dynamic range coulomb counter tallies all accumulated The LTC3337 is ideal for battery discharge and stores it in an internal register accessible via an I2C primary cell applications that interface. Quiescent current consumption is the only 100nA, increasing require only occasional power such as applications in remote battery run time.

• The LTC3337 integrates additional SoH variable monitoring which measures locations, electronic door locks, and reports via I2C: battery voltage, battery impedance, and temperature. or glass break detectors.

• To accommodate a wide range of primary battery inputs, the peak input current limit is pin selectable from 5mA to 100mA.

Availability: Available Now

iW-RainboW-G34S Single Board Computer iWave has recently introduced the iW-RainboW-G34S, a single board computer based on NXP i.MX 8M Mini applications processor in a PICO-ITX form factor. iWave supports Linux 5.4.70, Ubuntu 20.04, Buildroot 2021.02 and Android 11 on the platform, supported with an extensive BSP support team and continuous updates.

Features: • i.MX 8M Mini Q/QL/D/DL/S/SL CPU • Up to 4GB LPDDR4 & 128GB eMMC • Multi-OS Platform Support • Wi-Fi 802.11a/b/g/n/ac & BT 5.0 • Wide range of high-speed interfaces • 1000/100/10 Mbps Dual Ethernet • HDMI Output or LVDS Display • MIPI CSI Camera Connector

Applications: The SBC is designed for connectivity applications with an onboard Wi-Fi & Bluetooth module. Built with an M.2 connector with optional PCIe support, you can plug in an external cellular connectivity modem.

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Availability: The iW-Rainbow-G34S is designed for mass production with iWave assuring product longevity of 10+ years.

TECHNOVATORS

DoxelA Computer-VisionTECHNOVATORS

Powered Predictive Analytics Enabler for Construction Industry

Founded in 2016, Doxel leverages the first computer-vision-powered predictive analytics solution for the construction industry. By integrating into existing digital assets such as Building Information Modeling (BIM), Schedule, and Budget, Doxel empowers decision-makers with timely warnings on potential schedule delays, cost overruns, and quality issues which enables owners and General Contractors to increase control over outcomes and deliver projects with higher predictability. While talking with Nitisha from BISinfotech; Saurabh Ladha, CEO and Co-founder, Doxel.AI explains how the company plans to scale its artificial intelligence platform and expand its already-active Go-To-Market function.

Q

Kindly explain Doxel and its special offerings.

Doxel is the only solution in the market that can take video footage of a job site, 3D designs, project budget, and project schedule and tell clients exactly how much progress has occurred on their job site today and how much will occur in a week, a month, or a year. Additionally, based on this data, tell clients how delayed their project will be and how much money this delay will cost. This look into the future is unique to Doxel and enables our clients to proactively mitigate schedule delays and cost overruns - critical when a single week delay can result in millions of dollars of losses.

Some Doxel specific capabilities which we don’t see in the market today: y Doxel can track all trades and systems y Doxel can track any project type y Doxel can track 100% of the site y Doxel can granularly track progress to the 100th decimal y Doxel can turn around critical insights every 72 hours y Doxel predictions are >96% accurate after the second scan

Saurabh Ladha CEO and Co-founder, Doxel.AI

Couple of Industry-specific Notes y On average (without Doxel) customers receive progress data for their job site every 3-6 weeks y On average (without Doxel) 20% of the progress data is incorrectly reported y Typically building owners and contractors (without Doxel) can only track a fraction of the total project (ex. large customer ~15%)

Q

Kindly share Doxel's technology and benefits of the USPs solution.

This is the part which excites most of us! Given we work at the intersection of Building Information Models, MLbased Computer Vision, big data pipelines & business analytics, we use a large spectrum of tools to build the end-to-end stack. For BIM and CAD, we have built custom plugins on top of standard construction software (like Autodesk NavisWorks). We use managed services from standard cloud providers to power our backend flow (k8s, database, data pipelines, security, etc). Our persistent data is stored at secured cloud storage across multiple services. Spark and Airflow are used for our batch processing data pipelines. For ML,

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we use Tensorflow and PyTorch frameworks for writing deep learning models. We also use advanced VSLAM techniques to localize panoramas to enable accurate object detection in 2D. Our frontend is powered by React and uses REST APIs to communicate with backend infrastructure.

Q

Tell us about your recent funding, revenues and user base. Also, tell us about the challenges that you have faced in your journey.

We’ve raised $56.5 to date from well-respected VCs to continue developing our platform, hiring talented staff, and better serve our customers. New customers continue to reach out to us with interest and existing customers' average spend is continually increasing as we’re brought onto more of their projects. We are deeply committed to serving our customers.

The journey actually started with a tremendous focus on customer discovery. We spent time with customers in the industry trying to understand the most important challenges needing to be solved. We first focused on capturing quality data on a job site so owners and general contractors could have visibility into the current job site status. A key learning came from one of our customers which left an imprint on us.

This customer said, “telling me what is happening today is good, but come back when you can tell me what is going to happen next.” This was a game-changer for us and started the next three years of product development, customer feedback, iteration, and ultimately large scale customer acquisition - the sole driver of which is our AI-Powered Project Controls platform which can tell owners and general contractors where they are today, objectively, and exactly where they will be in the

future in terms of cost and schedule on their project. This look into the future is what allows project teams to improve project performance and mitigate schedule delays and cost overruns, saving millions of dollars per project in the process.

Q

How predictability can keep projects on time and on budget?

By knowing what is around the corner on your project, whether that be days, weeks, or months, you can react to it today. This ability to mitigate problems before they occur is what allows our clients to take proactive measures and avoid delays and cost overruns.

Q

Kindly highlight opportunities in India post Series B funding.

We are continuing to build out the India team which is pivotal to Doxel’s success and also exploring client opportunities as they arise.

Q

Kindly share future plans for the Indian market.

Our India head is one of our engineering leaders and foundational to our technological success. The team in India brings deep technological expertise and construction expertise, especially in the discipline of Building Information Modeling (BIM). Doxel will continue to invest in this team which is pivotal to Doxel’s success. Additionally, our fully integrated India/US workforce has a blended culture which ultimately underpins our success.

Q

Kindly highlight an upcoming project.

We have a host of new clients with exciting new projects - stay tuned as we disclose these publicly if and when possible.

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INDUSTRY KART Digi-Key Allies with Power Integrations

Rochester Collaborates with ST

Digi-Key Electronics has partnered with Power Integrations to offer its InnoSwitch3 IC family with PowiGaN technology as a part of its power focus campaign.

This technology delivers high-impact performance for demanding consumer and industrial applications while simultaneously reducing energy consumption.

Digi-Key Electronics has joined with Power Integrations to offer the InnoSwitch™3 IC family, as part of its Power Focus campaign.

As more applications increase their reliance on smart devices and power automation, demand for higher-efficiency solutions with stronger thermal performance is rising and GaN is quickly replacing silicon.

PowiGaN is Power Integrations' internally-developed technology that allows InnoSwitch3 ICs to achieve 95% efficiency across the full load range and up to 100 W in enclosed adapter implementations without heat sinks.

Rochester Electronics has partnered with STMicroelectronics to provide a growing range of both active and end-of-life stocked products helping customers with extended product lifecycle management and safety inventory during times of constrained supply, through a broad portfolio of Discrete, Analog and Mixed-Signal ICs, Microcontrollers and Microprocessors.

Rochester Electronics is the world’s largest continuous source of semiconductors–100% Authorized by over 70 leading semiconductor manufacturers.

As an original manufacturer stocking distributor, Rochester has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

Mouser & DERBI Foundation Partners Innovation Lab users need to help them minimize the high costs, component shortages and procedural delays that can hinder a proof of concept.

The component bank will be stocked with the evaluation modules, test and measurement equipment, capital equipment, and discrete components that the survey respondents requested.

Mouser Electronics has collaborated with the DERBI Foundation to build a component bank at the Mouser Innovation Lab in India.

The partnership will help innovators and early-stage start-ups to build their proofs-of-concept and allow them to overcome the challenges of procuring the components for their designs.

DERBI Foundation, a world-class incubation center fuelling entrepreneurship dreams of ambitious start-ups, launched a survey to find out which components and equipment Mouser

The Mouser component bank will enable innovators to check out equipment as necessary and then return it after use, facilitating a rapid turnaround time from idea to proof of concept.

In addition, Mouser is planning a series of Tech Talk sessions for late 2021 to highlight the latest product offerings available from Mouser’s manufacturer partners. The first Tech Talk will occur on September 30, 2021, co-hosted by DERBI Foundation and Analog Devices.

Technical experts from Analog Devices will explore the basics and challenges of precision technology, as well as Analog Devices’ extensive health care product portfolio.

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What if the future isn’t something we dream, but something we create?

At Analog Devices, we believe staying ahead of what’s possible means embracing new opportunities to make our company stronger. And now that Maxim Integrated is joining Analog Devices, our collective expertise in power management, advanced sensing, and connectivity will help make what if become what is. See What If: analog.com/Maxim

Where what if becomes what is.

Ensure your products are 100% authentic Mouser was the first SAE AS6496 accredited distributor

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