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Content 18

EDITOR MANAS NANDI manas@bisinfotech.com

The Next-generation IIoT Gateway Solutions Transforming Manufacturing

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WHITE PARER 06 Transceiver Phase Noise Teardown Informs Performance Capability with an External LO 22 Mission Critical Space Flight Systems Stay Rad Hard

5G TESTING 10 Three 5G New Radio Challenges You Can Solve Today 50 5G Gets Real in the Field

INDUSTRY REPORT

15 Companies Struggling to Better Optimise Multi-Cloud Compute

TECH FEATURE 16 Importance of Choosing Optimum Power Management ICs for Connected Devices

ELECTRIC VEHICLES 26 Electric Vehicle Battery Test Challenges

INDUSTRY UPDATES 29 Electrolube Introduces its New Website 32 Elgama-Elektronika to Design Electricity Meters with Analog Devices’ mSure Technology 44 NXP Quarterly Dividend and Resumption of Share Repurchases

T&M COLUMN 30 5G Testing Solutions

BIG PICTURE 34 LALIT AGARWAL S ales head, South Asia Secure Issuance, HID Global 36 GURSHARAN BHATIA C ountry Head - India & SAARC Region & South Africa Littelfuse 38 GIRISH RAMASWAMY H ead of Engineering at Continental & Chaiperson Person Organising Committee iTEC India 40 INDRANIL CHATTERJEE S enior Vice President Enea Openwave KISHOR PANPALIYA V P of Americas and APAC, Enea Openwave

T&M 42 Anritsu Introduces its New PCI Express Test Solution

INDUSTRY KART 46 Arrow Showcases Latest IoT and Sensing Technologies

INDUSTRY LAUNCH 52 Allegro First Magnetic Gear Tooth Sensor

THE

ROAD TO

YOUR FUTURE

FACTORY

WITH

WHITE PAPER

Transceiver Phase Noise Teardown Informs Performance Capability with an External LO PETER DELOS

Technical Director|Analog Devices Abstract Software-defined radios are one of the leading topics in the industry today. The software-defined radioâ&#x20AC;&#x2122;s performance capability has been fueled by the release of radio frequency (RF) transceivers offering complete radio solutions in monolithic integrated circuits (ICs). The Analog Devices transceiver product line provides an enabling IC, proliferating into many radio designs that are completely software controlled. One of the areas still to be explored with these devices is the capability for low phase noise applications. This article evaluates the phase noise performance of these highly integrated radio frequency integrated circuits (RFICs) with emphasis on cases wherein external frequencies are provided. Measurements on the Analog Devices ADRV9009 transceiver when using an external local oscillator (LO) indicate significant phase noise improvement is possible when a low noise LO is used. The transceiver architecture is presented from a phase noise contribution point of view. Through a series of measurements, the residual or additive phase noise is extracted as a function of the frequency programmed at the DAC output. Using this noise contribution along with phase noise of the input frequencies, both the LO and the reference, the total phase noise at the transmit output can be estimated. These estimates are compared with measured results.

Introduction/Motivation Phase noise is one of the critical metrics of signal quality characterized in radio designs. Much effort is placed during the architecture definition phase to ensure the phase noise requirements are achieved in the most economical manner possible. Measurements on the ADRV9009 transceiver indicate there are a wide range of possible noise performance outcomes depending on the implementation chosen. When using the internal LO capability, the phase noise is determined by the internal, IC-based phase-locked loop (PLL) and voltage controlled oscillator (VCO). The internal LO has been designed to meet the majority of communications applications. For applications demanding improved phase noise performance, when a low phase noise source is used as an external LO, a significant phase noise improvement can be realized. Figure 1 demonstrates a potential for over 40 dB of phase noise improvement over the 10 kHz to 100 kHz offsets for the ADRV9009 transceiver. The conditions under which these measurements were taken are as follows: For the internal

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LO measurement the LO frequency is set to 2.6 GHz, with a DAC output of 8 MHz. For the external LO measurements, a Rohde & Schwarz SMA100B was used as the LO source. There is an internal frequency divider on the LO path, so for an LO frequency of 2.6 GHz, the generator was set to 5.2 GHz. Measurements were taken with the Holzworth HA7402 phase noise analyzer. ADRV9009 Transceiver The ADRV9009 is the latest release to the Analog Devices transceiver product line. The transceiver architecture is shown in Figure 2. The transceivers are dual channel radios, with both transmit and receive, implemented with direct conversion architectures,1 in monolithic ICs. The digital processing includes quadrature error correction, dc offset, and LO leakage algorithms that enable the performance that has been achieved in a direct conversion architecture. The transceiver provides a complete RF to digital functionality. RF frequencies are supported up to 6 GHz and a JESD204B interface provides a high speed data interface to an ASIC- or FPGA-based processor. The radio is synchronized to a reference frequency input. Several PLLs phase lock to the reference including the converter clocks, the LO, and digital clocks. Provisions for an external LO are offered to allow bypassing the internal LO PLL. The LO path

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has a frequency divider between the PLL or external LO input and the mixer ports. This is used to generate the quadrature LO signals needed for the direct conversion architecture. The converter clocks and LO have a direct impact on the achievable phase noise and are discussed further as phase noise contributors are evaluated. Examining the Phase Noise Contributors The phase noise at the transmit output is comprised of several contributors. Figure 3 illustrates a simplified block diagram of the direct conversion waveform generator architecture used along with the primary phase noise contributors. Before dissecting the transceiver phase noise, a couple fundamental principles are worth reviewing. In a frequency multiplier or divider, phase noise scales 20logN, where N is the input to output frequency ratio.2 This also applies to a direct digital synthesizer (DDS) where the clock noise contribution scales 20logN with the DDS output frequency. The second area to consider is the phase noise transfer functions in a PLL.3

A reference frequency injected into a PLL will scale to the output both as a function of the frequency ratio (similar to a multiplier), but will have a low-pass filter effect applied based on the loop bandwidth (BW) and type of loop filter chosen. Applying these principles to the transceiver, various contributors can be examined. There are two frequencies, the LO frequency and the reference frequency, that are injected into the transceiver. The LO frequency has a direct contribution to the phase noise output but is reduced by 6 dB in the internal frequency divider used to create the quadrature LO signals to the mixer. The reference frequency contribution is determined from several factors. It is used to create the DAC clock in the clock PLL. The noise on the clock output due to the reference frequency will scale by the noise transfer function of the PLL. Then this contribution will be scaled again by the ratio of the DAC clock to the DAC output frequency. This effect can be simplified to a scaling of the reference frequency to the DAC output frequency with a low-pass transfer function applied based on the PLL BW.

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Next, consider the transceiver IC phase noise contribution. There is a residual noise added from all of the circuit components in the transmit path. One of the IC noise contributors is an additive noise at the DAC output that varies as a function of the DAC output frequency. This can be summarized into two residual phase noise terms; a frequency dependent noise contribution and a frequency independent noise contribution. The frequency dependent noise will scale 20logN with the DAC output frequency. The frequency independent noise is fixed and will set the phase noise floor contribution of the transceiver IC.

To extract the IC residual noise contribution as a function of frequency dependent and frequency independent contributors, a series of phase noise measurements were conducted as shown in Figure 4. The test setups used for the phase noise measurements are shown in Figure 5. For the transceiver LO and reference frequency

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inputs, a Rohde & Schwarz SMA100B and 100 A were used, respectively. The Holzworth HA7402C was used as the phase noise test set. For absolute phase noise measurements, the transmit output of the transceiver is injected into the test set. For residual phase noise measurements, three transceivers are required, and when using the additional transceivers as the LO port of the mixer in the test set, the noise contribution of the reference frequency and LO frequency can be removed from the measurement. By evaluating the measured data of Figure 4, frequency dependent and frequency independent phase noise contributors from the transceiver IC were extracted. The estimates are shown in Figure 6. The estimates were derived from both curve fits to the measured data and threshold settings applied to the phase noise floor at offset frequencies greater than 1 MHz.

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The contributors were calculated as follows: 4 LO phase noise contribution: The measured LO phase noise of Figure 4 was used and reduced by 6 dB to account for the frequency divider inside the transceiver IC. 4 Reference phase noise contribution: The measured reference noise of Figure 4 was used as the starting point. The clock PLL in the transceiver has a loop BW of several hundred kHz, so a second-order low-pass filter with a similar BW was applied against the reference noise. The noise was then scaled by 20log of the ratio of the DAC output frequency to the reference frequency. 4 IC contribution: The curves of Figure 6 were used.

Absolute Phase Noise Measurements vs. Predictions By evaluating the different phase noise contributions as described, predictions based on the DAC output frequency and the oscillators used for the LO and reference can be calculated. Measured vs. predicted results are shown in Figure 7.

The measured results very closely match the predictions and the graphs indicate which contributors dominate various offset frequencies. At offset frequencies below ~5 kHz, the first LO dominates. At offsets above ~1 MHz, the IC residual noise dominates. At mid-offset frequencies between ~10 kHz and ~500 kHz, the DAC output frequency becomes a factor. At higher DAC output frequencies, the IC frequency dependent noise dominates. As the DAC output frequency is reduced, the IC contribution reduces to a point where the LO frequency again dominates the performance.

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External LO Considerations Some practical considerations for designs exploring use of an external LO are worth noting. There are two particular items that can be a limitation. XX With the internal frequency divider, there is a phase ambiguity on startup or when switching the external LO. An RF phase sync feature is included with the internal LO that this is not yet available with the external LO. XX When hopping an external LO, there is a settling time of the QEC algorithm that can spuriously affect images during moments directly after a frequency change. Both of these items lead to a complication in multichannel systems, dynamically hopping across operating bands greater than the transceiver’s instantaneous bandwidth. For future transceivers, these limitations may be overcome, but at the time of this writing these complications exist for the ADRV9009 when used with an external LO. In spite of these complications, there are a variety of applications that could exploit the improved phase of an external LO. These include any single channel or low channel count systems with less stringent dynamic hopping requirements or any multichannel system with a fixed LO frequency. A particular application that could benefit from the external LO phase noise performance is a relatively narrow-band phased array. In this application, it is practical to use the transceivers for a generic waveform generator and receiver design that can support a wide selection of operating frequencies, then during operation or final LO implementation a particular band is chosen. For phased array systems with operating bands within the transceiver’s instantaneous bandwidth, the external LO could be a single frequency and using the transceivers in a phased array with an external LO in this case could be a very practical option. When evaluating the system phase noise, the reference frequency source oscillator can be chosen such that the reference frequency noise contribution is much lower than the LO noise contribution. If there is a common LO distributed to an array of transceivers, as the quantity of transceivers coherently combined in a system increases, the noise contribution from the IC will reduce to a level where the system will be dominated by the external LO. This conclusion simplifies the system engineering noise analysis. With noise dominated by a common LO, engineering efforts could focus on the optimum cost/performance trade-off of the central LO design.

Summary A method to predict the ADRV9009 transceiver phase noise when using an external LO has been provided. The method allows tracking contributions from the reference oscillator, the LO source, and the transceiver as a function of the DAC output frequency. Measured vs. predicted results are well matched, indicating that the approach can be extended to analyze the transceiver capability when used with other frequency sources. The approach is also quite general and could be extended to any waveform generator design. The measured phase noise performance with an external LO offers a significant performance advantage once effort

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is placed on creating a low phase noise LO source. Our intention is to provide a range of options for system designers as architecture options are evaluated. For designs using the transceivers in low phase noise applications with an external LO input, the description provides a foundation to assess system level phase noise under varied conditions. For evaluating the system phase noise, the reference frequency source oscillator can be chosen such that the reference frequency noise contribution is much lower than the LO noise contribution. If there is a common LO distributed to an array of transceivers, as the quantity of transceivers coherently combined in a system increases, the noise contribution from the IC will reduce to a level where the system will be dominated by the external LO. This conclusion simplifies the system engineering noise analysis. With noise dominated by a common LO, engineering efforts could focus on the optimum cost/performance trade-off of the central LO design. The measured phase noise performance with an external LO offers a significant performance advantage once effort is placed on creating a low phase noise LO source. Our intention is to provide a range of options for system designers as architecture options are evaluated. For designs using the transceivers in low phase noise applications with an external LO input, the description provides a foundation to assess system-level phase noise under varied conditions. References 1 Peter Delos. “A Review of Wideband RF Receiver Architecture Options.” Analog Devices, Inc., February 2017. 2 “Active Multipliers and Dividers to Simplify Synthesizers.” Microwave Journal, June 2007. 3 Peter Delos. “Phase-Locked Loop Noise Transfer Functions.” High Frequency Electronics, January 2016. Breitbarth, Jason. “Cross-Correlation in Phase Noise Analysis.” Microwave Journal, February 2011. Breitbarth, Jason and Joe Koebal. “Additive (Residual) Phase Noise Measurement of Amplifiers, Frequency Dividers, and Frequency Multipliers.” Microwave Journal, 2008. “HA7402C Phase Noise Analyzer Engine.” Holzworth Instrumentation, Inc., June 2018. Walls, Warren F. “Cross-Correlation Phase Noise Measurements.” Proceedings of the 1992 IEEE Frequency Control Symposium, May 1992. About the Author Peter Delos is a technical lead in the Aerospace and Defense Group at Analog Devices in Greensboro, North Carolina. He received his B.S.E.E. from Virginia Tech in 1990 and M.S.E.E. from NJIT in 2004. Peter has over 25 years of industry experience. Most of his career has been spent designing advanced RF/ analog systems at the architecture level, PWB level, and IC level. He is currently focused on miniaturizing high performance receiver, waveform generator, and synthesizer designs for phased array applications. He can be reached at peter. delos@analog.com.

BIG PICTURE

Three 5G New Radio Challenges

You Can Solve Today

NICK BEN

Technical Marketing Engineer Keysight Technologies

Figure 1: Revolutionary Technology Changes the Way We Interact with The World

Introduction

Technological innovation changes how society interacts with the world around them and the speed at which it’s done: Not so long ago, a hand-written letter took weeks to get to Aunt Abby. Then e-mail came along and fundamentally changed the way we communicated, by enabling messages to be delivered in seconds rather than days or weeks. Innovation in mechanical engines made the automobile mainstream, replacing horse-drawn carriages and helping people and goods get from point A to point B in a fraction of the time it once took. While 5G New Radio (NR) is being partially driven by consumer demand, it’s primarily attributed to the innovators who push the edge of technology and speed. Consumers have a growing insatiable need for bandwidth and speed, but much of this is spurred by technological innovation. As promising as 5G NR technology looks, getting there comes with its own set of challenges.

5G New Radio

Consumer demand for more bandwidth, higher data transfer speeds, and better connectivity is pushing engineers like you to innovate the next frontier of cellular technology, using 5G NR to meet these demands with a reliable communication network. With 5G NR, you will need to utilize new and existing technologies to achieve extreme

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data throughputs while simultaneously introducing new test challenges: testing at millimeter-wave frequencies, wider channel bandwidths, and complex multi-antenna configurations. 5G NR mobile devices and base stations will implement sub-6 GHz and millimeter wave (mmWave) designs that require optimizing and validating 3D beam performance with new, more complex over-the-air (OTA) test configurations with wide channel bandwidths and multi-channel MIMO test requirements. This complexity increases the number of instruments needed and measurement uncertainties in mmWave OTA systems, making it more difficult to achieve accurate and repeatable measurements. But, let’s face it – even with the uncertainty of an evolving 5G New Radio standard, 5G has exciting applications across a variety of industries. For automotive, autonomous vehicles’ response time to emergency situations are orders of magnitude faster than human response time. In entertainment and multimedia streaming across mobile phones and PCs, downloading the average length movie can decrease from 7 minutes to 6 seconds. Finally, in IoT, 5G promises to increase security and health by enabling IoT devices with high data transfer speeds in the smart home. However, to get there, you’ll need to first jump over 3 challenging 5G testing hurdles.

BIG PICTURE

Figure 2: 5G Network Wireless Systems and the Internet of Things (IOT)

3 Key Challenges Test System Setup Complexity 5G testing will generally require more complicated test setups to characterize new cellular designs. Early 5G applications will operate at sub-6 GHz and mmWave frequencies between 28 GHz – 39 GHz. 5G also requires higher modulation bandwidths (up to 2 GHz) to support peak data rates. Since 5G applications operate at mmWave frequencies, previously conducted setups have transitioned to over-the-air test setups with phased array antennas. These antennas bond directly to your RF integrated circuit (RFIC). They provide high gain and beam steering capabilities that enable higher reliability at mmWave frequencies. Increased System Path Loss Since your desired signal now propagates through air instead of a physical cable medium, there is some expected system path loss. High system path loss results in low signal-to-noiseratio (SNR). Low SNR causes transmitter measurements with poor error vector magnitude (EVM) and adjacent channel power ratio (ACPR). This means the measurements don’t show the real performance of a device and simultaneously

reduces receiver sensitivity. In today’s OTA world everyone is familiar with the concept of radiated antenna testing. However, with the shift from 4G to 5G, OTA testing will also entail both RF parametric and functional performance tests at millimeter wave frequencies. These tests range from EVM and adjacent channel leakage ratio (ACLR) tests to modem and data throughput tests. Long Product Development Cycles Finally, another big testing challenge that the 5G NR standard introduces is an increased number of tests that you must conduct which can lead to longer product development cycles. This is partly due to instances where you cannot easily switch from two interference channel tests to dual channel MIMO and beamforming tests. You also need to keep in mind that with the new standard, there are more test items and scenarios that need to be validated. Additionally, it is time consuming to have to wait on a vendor for the latest 5G NR standard-compliant signals for your application for an evolving standard. These challenges are not only a hassle but take away from core product development time that can slow you down in the race to 5G.

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5G TESTING

Figure 3: Having the right single instrument signal generator can help reduce your test system setup complexity, deliver the necessary high output power for radiated mmWave tests, and minimize the product development cycle.

The Solution

You already know that 5G NR requires wider modulation bandwidth (2 GHz) and operates at mmWave frequencies. So, to test a receiver, for example, you need a reliable signal generator (see Figure 3) that meets those minimum qualifications. For the variety of 5G tests that you’ll be running, having multiple instruments is not the best solution. An instrument that performs all your tests in one box will not only minimize your test set up time but also help you meet 5G 3GPP standards more quickly.

While operating at millimeter wave frequencies has its advantages, a significant disadvantage is system path loss. Compensating for excessive system path loss at mmWave frequencies requires a signal generator with high output power. A signal generator must also have a linear output section, less distortion, and low phase noise at high power levels. These are key to making accurate measurements at mmWave frequencies, and to ensure errors are not coming from the signal generator itself. To overcome excess path loss, increase the output power of a signal generator and use a highly sensitive signal analyzer to compensate for the loss. Product development time can be slowed in part by not having a reliable signal generator to enable quick switching between

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independent interference channel tests to dual channel MIMO and beamforming tests and having to independently keep up to date with creating your own 5G NR compliant signals. Signal sources with built-in dual channels can enable you to easily tackle the multitude of 3GPP conformance tests configurations. Software that has current 5G NR compliant signals leaves you with time to focus solely on product development and not meticulously spend it creating your own compliant signals.

Conclusion

5G NR technology is revolutionary. It will have a domino effect for other technology shifts as the cellular network provides more bandwidth, higher data transfer speeds, and better connectivity. The opportunities that 5G will bring are limitless and will require the right tools to overcome these testing challenges: • test system setup complexity, • increased system path loss, and • long product development cycles. The right tools will not only help you stay ahead in the race to 5G, but also give you higher confidence in your device’s performance – faster.

INDUSTRY REPORT

Companies Struggling to Better Optimise Multi-Cloud Compute A vast majority of enterprises worldwide have adopted multi-cloud strategies to keep pace with the need for digital transformation and IT efficiency, but they face significant challenges in managing the complexities and added requirements of these new application and data delivery infrastructures, according to a global survey conducted by the Business Performance Innovation (BPI) Network, in partnership with A10 Networks. The new study, entitled ‘Mapping The Multi-Cloud Enterprise’, finds that improved security, including centralised security and performance management, multicloud visibility of threats and attacks, and security automation, is the number one IT challenge facing companies in these new compute environments. Among key survey findings: Approximately two-thirds of companies have now deployed enterprise applications across two or more public clouds 84% expect to increase their reliance on public or private clouds over the next 24 months 35% have already moved half or more of their enterprise applications into the cloud

Only 11% believe their companies have been ‘highly successful’ in realising the benefits of multi-cloud Improving multi-cloud security is seen as their most critical challenge, followed by a lack of multi-cloud talent and expertise, the need for centralised visibility, and the capacity to more effectively manage application and infrastructure complexity. “Multi-cloud is the de facto new standard for today’s software- and data-driven enterprise,” said Dave Murray, head of thought leadership and research for the BPI Network. “However, our study makes clear that IT and business leaders are struggling with how to reassert the same levels of management, security, visibility and control that existed in past IT models.

Particularly in security, our respondents are currently assessing and mapping the platforms, solutions and policies they will need to realise the benefits and reduce the risks associated of their multi-cloud environments.” “The BPI Network survey underscores a critical desire and requirement for companies to reevaluate their security platforms and architectures in light of multi-cloud proliferation,” said Gunter Reiss, vice president of worldwide marketing at A10 Networks. “The rise of 5G-enabled edge clouds is expected to be another driver for multi-cloud adoption. A10 believes enterprises must begin to deploy robust Polynimbus security and application delivery models that advance centralised visibility and management and deliver greater security automation across clouds, networks, applications and data.” The study finds that some 38% of companies have or will reassess their current relationships with security and load balancer suppliers in light of multicloud, with most others still undecided about whether a change in vendors is needed.

Study of Millennial Parents and Generation Alpha Kids IEEE has recently unveiled "Generation AI 2019: Third Annual Study of Millennial Parents and Generation Alpha Kids." The survey reveals the confidence Millennial parents in the U.S., U.K., India, China and Brazil with Generation Alpha children (nine years-old or younger) may have in using AI and emerging technologies for the health and wellness of their children. Considered to be the most tech-infused demographic, born 2010-2025, Generation Alpha is growing up with AI benefiting their health and wellness, and technology infiltrating nearly every aspect of their lives. Millennial Parents Would Allow a 3D Printed Heart to be Implanted in Their Children Human donor organ availability can mean the difference between life and death. But researchers are using 3D printing technologies to develop organs,

including hearts that use human cells, collagen and biological molecules. For Aches and Pains -- Goodbye Medication, Hello VR Virtual reality-powered headsets can immerse people in 3D virtual environments and because of this distraction, VR is being used for pain management. A significant majority of Millennial parents surveyed globally would prefer their pediatrician to recommend VR pain therapy instead of medication to alleviate their child’s pain (China: 97%; India: 96%; Brazil: 90%; U.K: 82%; U.S: 79%). In addition, some parents “strongly” prefer their paediatrician to recommend VR pain therapy instead of pain medication, including those in India (75%), China (58%) and Brazil (45%), but only one-third of parents in both the U.S and U.K. AI-Powered Virtual Nurse? Not When

our Kids are in the Hospital, U.S. and U.K. Parents Say Though telehealth, AI and remote monitoring tools are helping nursing expand care beyond in-person bedside monitoring creating a practically virtual nurse, a majority of Millennial parents in the U.S. (67%) and U.K. (57%) would not be very comfortable leaving their child in the care of an AI-powered virtual nurse during a hospital stay. Conversely, a majority of Millennial parents in China (88%), India (83%) and Brazil (61%) would be very comfortable leaving their child at the hospital in the care of an AI-powered virtual nurse. U.S. Millennial Parents an Exception to Allowing Robot Surgery on Children Surgical robots powered by artificial intelligence are bringing new innovations and accuracy to the operating room.

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Importance of Choosing Optimum Power Management ICs for Connected Devices SAMBIT SENGUPTA

Associate Director â&#x20AC;&#x201C; Field Applications, Avnet India

In our increasing connected world, technology and smart devices are transforming the way we live. The most visible applications around us are smart and connected consumer products. Powered mostly by small batteries such as button or coin cell types, these products range from smart watches, fitness trackers, heart-rate monitors, sports equipment to a variety of other wearable devices. The key parameters that product designers consider in such applications are long battery life and very low power consumption. Power management ICs (PMICs) provide multiple voltage rails and

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efficient battery management capabilities which help to extend battery life in consumer IoT applications. Applications for wearable or connected devices being very small form factor, need precise but simple low-power monitoring circuits. These PMICs need to assess the health and state of charge of these batteries but they themselves need to be ultra-low power consumption devices. There is wide availability of fuel gauge ICs with built in security which deliver precise current, voltage and temperature measurements. Reputable semiconductor companies such as

TECH FEATURE

As battery-powered IoT products continue to evolve in features, performance and decreasing in size, their power consumption has increased significantly. Therefore, power management has become of paramount importance in order to maximize battery life, prolong product operation and reduce heat dissipation. Performance improvement of low voltage DCDC converters has received a lot of attention and presently efficiencies higher than 94% have been realized. If you are designing wall sockets or smart sockets, smart switch with Wi-Fi, or smart speakers, you can consider products such as InnoSwitch3-Pro or InnoSwitch3-CP. Often designers have to consider the power consumption of the connectivity that they plan to use. To give you an understanding, let us consider the below diagram which summarizes the power consumption for various standards as of today.

As shown in the diagram, a single power management solution may not be suitable for every device. For example, for someone using LoRa cost-optimized module from Murata or making their own LPWAN module, they may consider STBC02, a highly cost-optimized Li-ion battery charger solution. Below is a good example of an evaluation circuit which uses STUSB1600A, STBC02 and a step down converter. Maxim Integrated, Power Integrations, STMicroelectronics, Dialog Semiconductor offer safe and efficient power management in very small form factor to support IoT devices, powered by rechargeable, high energy densified Li-ion batteries. The connected devices of today are targeted at mass market, which must strike a balance between price and utility. The power management needs to be optimum and hence we will like to see the available options as of today. MAX77650/ MAX77651 offer a highly integrated battery charging and power supply solution for low power wearable applications. These feature a buck-boost regulator that provides three independently programmable power rails from a single inductor to minimize total solution size. The 150mA LDO provides ripple rejection for audio and other noise sensitive applications. Hardware designers now have multiple options to get off-the-shelf power management solutions from semiconductor OEMs. Apart from reaching out to semiconductor distributers like Avnet or element14, they may also refer to various useful online resources.

There are various options available for designers. Choosing the optimum power management IC for your connected device ultimately depends on the application, the requirements and the modules used. Alternatively, joining an online IoT community also allows designers to learn from a wider community.

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The Next-Generation IIoT Gateway Solutions Transforming Manufacturing MATTHEW LEE

Moxa|Product Manager

Abstract

Smart manufacturing and digital transformation, coupled with edge intelligence, are enabling manufacturers to increase productivity, reduce downtime, and increase product quality. A key factor in the success of this transformation is the deployment of intelligent edge-computing solutions that can bridge the gap between the operation technology (OT) and the information technology (IT) worlds by providing a number of benefits. In this white paper, we discuss what manufacturers need to benefit from the IIoT trend and how a new generation of IIoT Gateways are helping them reap

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the benefits of the IIoT, thereby transforming their businesses.

Reduced Latency

Manufacturers are expected to be more responsive to customer needs by providing customized products and services on a global scale. In addition, time-sensitive applications need immediate processing of device data to be able to take timely corrective actions and facilitate quick decision-making. Edge intelligence can facilitate quick decision-making at the field sites as opposed to sending all the device data from the edge to the cloud for processing.

COVER STORY

Processing data at the edge helps prevent data breaches and enables faster responses.

Reduced Data-transfer Costs

Transferring large volumes of data from the edge of the network to a cloud server can be prohibitively expensive. Furthermore, the cost of transferring this data on a daily basis could lead to unsustainable communication costs in the long run. Manufacturers are looking for optimized computing solutions for their industrial-automation applications to intelligently process large volumes of data received from the sensors and field monitors, and send only critical data or a summary of the data to the cloud. Compact-sized, ruggedized industrial Armbased computers, designed for low power consumption, are at the heart of these solutions and make edge-side computing more reliable and cost-effective.

Benefits of Using an Arm-based Linux IIoT Gateway Solution

Arm-based Linux IIoT Gateway solutions provide industrialgrade security, manageability, performance, and reliability while still maintaining extensibility. They typically combine the hardware, OS, and software functions listed below to provide an optimized edge-computing solution for IIoT applications. Longevity: Industrial products are usually in place for 10 to 15 years. To meet this requirement, Arm-based CPUs typically come with a minimum lifespan of 15 years. In addition, Arm’s commitment to long-term support and access to their future enhancements, make Arm-based solutions an ideal choice for industrial applications. Low Power Consumption: Low-power processing is a requirement in many industries to ensure that the equipment does not overheat and pose a potential hazard. Fanless equipment are also preferred so as to mitigate the effects of dust in industrial environments. Arm® Cortex®-A processors are highly optimized for performance and power efficiency.

Independent Remote Operations

An edge-computing platform enables remote locations to reduce downtime and operate independently when the central system is inaccessible. For example, if there is a network outage and connectivity to the cloud system is lost, field sites can use local computing power to process and analyze data. Processed data can then be sent to the cloud for long-term storage when the connection is restored.

Data Security

Sending sensitive operational data from the edge to the cloud puts the data and edge devices at risk. Multiple levels of security need to be put in place to ensure that the data is securely transferred from the edge device to the cloud.

Scalability: Linux is eminently scalable and is able to run on a variety of platforms. The basic functionality of a Linux platform— command line tools, configuration, and code—are compatible with any Linux-based device. This flexibility allows for easier upgrades and compatibility between different systems. Enhanced Security: While manufacturers are reaping the benefits of digitization, they are also faced with data security risks and software-integrity issues. A Trusted Platform Module (TPM) can be deployed to guarantee the physical security of edge devices. In addition, Arm’s TrustZone can be used to create an isolated secure world, which can enhance security and maintain the integrity of edge-computing solutions.

Ready-to-run IIoT Gateway Solutions Leading the Way

A new generation of IIoT Gateways that are optimized for industrial applications are revolutionizing the manufacturing landscape. Built around an open Linux-based platform, these IIoT gateways are secure, industrial-grade computing platforms that support multiple communication interfaces and run on low power.

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COVER STORY

Industrial-grade Linux

IIoT gateway solutions that include a high-performance industrial-grade Linux distribution and long-term support are better equipped to meet the growing needs of manufacturers. Currently, long-term support (LTS) offered on a Linux kernel is 5 years. In most industrial establishments, especially in critical systems such as energy, water, transportation, and communication, it is not feasible to update the software systems every 5 years. Software vendors should commit to long-term maintenance of the Linux platform. A long-term commitment (10 years or more) to support a Linux kernel, which includes security patches and bug fixes will address the needs for extended lifecycle of computing systems in industrial automation applications, making industrial projects secure and sustainable. Projects, such as the Civil Infrastructure Platform (CIP), aim to speed implementation of Linux-based civil infrastructure systems, build upon existing open source foundations and expertise, establish de facto standards by providing a base layer reference implementation, and contribute to and influence upstream projects regarding industrial needs. CIP’s kernel will be based on Linux kernel 4.4 and will include security patches and features backported from newer kernels. CIP is driven by some of the world's leading manufacturers of civil infrastructure systems and industry leaders including Codethink, Hitachi, Plat'Home, Renesas, Siemens, Moxa, and Toshiba. This project is hosted by The Linux Foundation to create an open-source platform for managing and monitoring IoTenabled civil infrastructure and make it safe, secure, reliable, scalable, and sustainable.

Low Power Consumption

It is a well-known fact that when it comes to low-power systems, Arm-based systems are a natural choice. x86-based IIoT gateways consume on an average 30 W of power while their Arm-based counterparts, for example, gateways build on the Arm® Cortex®-A processor, can provide industrialgrade performance in power budgets under 10 W. Low power computers and devices help substantially reduce your operational costs. They consume less power and hence generate less heat, which means no cooling systems are required.

Secure Platform

Operational networks were simply not built for connectivity to the Internet/cloud. The key focus of these networks is quick data access for industrial processes. Manufacturers feel that implementing multiple security levels is a huge drain on network resources and may impact productivity. However, in the IIoT age, where the trend is towards more connectivity for edge device, which may otherwise never be connected to the Internet, there is a quantum increase in possible attack points for malicious attackers. Security threats can extend to even low-level devices. Cyber attackers can target anything that is exposed to the Internet, including a thermostat in the field to a wireless device. Manufacturers can longer take this threat lightly. Information security, system hardening, security fixes, and ability to backport fixes to existing cores without

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having to change the software helps organizations better fight cyberattacks.

For example, Arm-based computers that support TPM v2.0. Bringing TPM and Arm-based computers together gives system integrators and industrial engineers a powerful new tool in their security arsenal. By creating a specific cryptographic key for each individual device, which is hardcoded within the platform itself, the data stored on the computing system is secured and protected from being read by an unauthorized party. Moreover, the OS on the system can be locked from being overwritten to secure edge devices and data in distributed areas. Security utilities and tools that can conveniently build up the protection mechanism on the software platform to meet your cybersecurity requirements are other ways to secure industrial systems.

Support for Multiple Interfaces and Protocols

IIoT Edge Gateways should come with multiple interfaces such as serial, CAN, Ethernet, Wi-Fi, and 4G LTE. IIoT gateways with carrier (Verizon/AT&T) certifications and industrial-grade CE/FCC/ UL certifications enable reliable connectivity for edge devices. An edge-side software that accelerates mass configuration of devices, easy device management, and data acquisition can speed up system deployment. Modbus connectivity for data acquisition and processing and MQTT support for lightweight edge-to-core data transmission reduce development efforts. RESTful APIs and Modbus APIs for implementing gateway software functions enable easy integration with existing systems and with new-age IIoT applications.

Easy Connectivity to the Cloud

Edge intelligence and connectivity to the cloud are two faces of the same coin. Depending on the IIoT applications, connectivity to a private cloud, public cloud, or both may be required. To enable cloud connectivity and edge intelligence, generic Modbus and EtherNet/IP protocol support, MQTT /HTTPS and RESTful/ C/Python API support are required. Built-in clients for AWS, Azure, Ignition Edge (Sparkplug), and Wonderware Online services may also be necessary, depending on the cloud services that are required for your IIoT applications.

COVER STORY

Case in Point

In the following two cases, we illustrate how new-age IIoT gateways can help manufacturers speed up IIoT deployments and transform their operations based on intelligence from field data.

Machine Data Acquisition Through PLCs for Machine Tool Builders

Traditional machine tool builders are now willing to invest in new IIoT trends so that they can provide more value with their products and improve the quality of machine status data collected for post-sales management and services. The data acquisition system must be capable of acquiring data from different brands of PLCs with their own proprietary protocols, send the data to backstage control server, and display the data on a dashboard remotely and locally. Furthermore, a compact and reliable device for data acquisition is required without having to changing the structure of machines. Which means, the system should be small enough to fit in existing control cabinets.

aggregate data from variable speed drives (VSDs) and PLCs for their pumping systems and to transfer the data back to the control center through LTE communication in the harshest environments. A built-in Trusted Platform Module (TPM) in the IIoT gateway can ensures that each individual device is hardcoded by a cryptographic key to ensure the data is only accessible by authenticated parties.

System Requirements • Low power consumption because oil wellheads are often located in harsh environments where powering is sometimes difficult • Reliable 4G LTE connectivity in high operating temperatures for constant data aggregation • Computers must feature Trusted Platform Module (TPM) to ensure data integrity • Open Linux platform for flexible application development

Moxa’s Wireless-ready IIoT Gateway Solutions

System Requirements • Computing solution to collect data from PLC to monitor the status of the stamping press remotely and locally through Wi-Fi • The solution should work with Mitsubishi, Delta, and AllenBradley PLCs • Compact-sized and vibration-proofed systems for reliable operation in the cabinet of the stamping press

Enabling Predictive Maintenance in Artificial Lift Monitoring Systems

A leading oil and gas service company is building telematics solutions for its customers to run smooth operations and conduct predictive maintenance for artificial lifts in oilfields. With the trend of oilfield digitization, telematics has been tremendously useful in understanding equipment status so as to avoid problems, also called predictive maintenance. The data generated by the equipment during the operations is the key to achieve this goal. As a result, this oil and gas service company needs a reliable and secure solution to ensure that the data needed is brought back to the control center for further analysis. A wireless-enabled Arm-based open computing platform that acts as a secure IIoT gateway, allows oil companies to

Moxa’s UC series IIoT Edge Gateways are industrial-grade, wireless-ready Arm-based computing platforms that are designed to operate reliably in a wide temperature range of -40 up to 85°C. These gateways are built around the Arm® Cortex®-A processor and come with Moxa Industrial Linux (MIL) to address the need for extended lifecycles in computing systems for sectors such as solar/wind power, water and wastewater, oil and gas, transportation, and factory automation. Key benefits include: • Industrial-grade Linux • Low power consumption • Secure platform • Support for multiple interfaces and protocols • Easy connectivity from the edge to the cloud

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BIG PICTURE

Mission Critical Space Flight Systems Stay Rad Hard

JOSH BROLINE

Renesas Electronics America Space is a challenging environment for satellites and deep space flight systems, particularly due to the intense radiation environment encountered in nearly all mission profiles. Acceptance testing of integrated circuits (ICs) ensures predictable performance and prevents system failure while in flight through low Earth orbit (LEO), geosynchronous Earth orbit (GEO), and deep space missions to other planets. This article explores the effects of various space radiation environments and their impact on spaceflight mission profiles. To understand the effects of radiation on electronic systems and components it is useful to first consider the source of the radiation.

Understanding Space Radiation Space radiation consists almost entirely of particles, including electrons, protons and energetic heavy ions. Most originate from the solar wind or solar flares and they are anisotropic

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NICK VAN VONNO

Renesas Electronics America

(directionally dependent) in nature, yielding different values when measured in different directions. Superimposed on this particle flux are very high-energy protons and heavy ions, which are isotropic (uniform in all orientations), yielding the same value when measured in different directions. The moderate energy particles are trapped by the Earthâ&#x20AC;&#x2122;s magnetic field in the Van Allen belts, and depending on a satelliteâ&#x20AC;&#x2122;s orbit, the belts may cause most of the ionizing radiation damage. So how do these particles interact with the materials used in electronic devices? Solar electrons and protons are very abundant and cause ionization in materials. In a simplified model, low and moderate energy charged particles generate hole-electron pairs in the thermal oxides used in integrated circuits. The electron mobility in these oxides is very high and any applied electric field sweeps the electrons out of the oxide in picoseconds. The hole mobility is much less so

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a much greater proportion of holes get trapped. The net result of these asymmetrical trapping dynamics is positive volume charging of dielectric layers and degradation of both bipolar and MOS circuit devices. Figure 1 shows that when the particle energy is increased, the particle abundance decreases, with the abundance versus energy curve spanning 25 orders of magnitude and culminating in very low fluxes of relativistic TeV heavy ions. The effects of the abundant lower energy particles are uniform through the volume of the IC, but high-energy heavy ions cause single event effects (SEE), defined as the interaction of a single energetic ion with a silicon device.

Figure 2: Schematic cross section of a MOS device and the interaction of an energetic heavy ion with the device structure. Note the incoming particle track, the funneling region and the collection of the generated charge by the reverse-biased drain to body junction. (Source: CERN).

The most commonly used SEE unit is the linear energy transfer (LET) of the incoming ion, which equates to the energy loss (dE/dx) per unit track length for a given material density and is expressed in MeV.cm2/mg. The key takeaway: shielding is ineffective as it only filters out the low energy end of the spectrum. The high-energy ion flux is unaffected, and mitigation must be performed at the IC and system levels. Radiation-Hardened for Mission Assurance As weâ&#x20AC;&#x2122;ve learned, space radiation effects on electronic devices are an important design consideration. Radiation causes problems ranging from operational malfunctions to severe physical damage to the devices and even catastrophic mission failure. In addition to ICs being susceptible to space radiation SEE, total ionizing dose (TID) is another important space radiation effect. TID effects are the result of accumulated exposure to ionizing radiation, whereas SEE is the result of a single highenergy particle that strikes the device. Figure 1: Galactic cosmic ray energy spectrum - particle flux plotted as a function of particle energy. (source: S. P. Swordy, "The energy spectra and anisotropies of cosmic rays", Space Sci. Rev., vol. 99, pp. 85-94, Oct. 2001.)

Energy is lost by these high-energy particles as they pass through the semiconductor lattice, generating a track of hole-electron pairs as shown in Figure 2. The resulting charge is collected and can change the voltage on sensitive nodes, which can affect circuit operation. SEE can be divided into destructive and nondestructive phenomena. Nondestructive effects include bit flips, functional interrupts in digital applications and transients on the outputs of analog functions. Destructive effects include latch up, burnout and MOS gate oxide rupture, leading to permanent damage.

The TID exposure is measured in rads. The term rad (radiationabsorbed dose) quantifies the total radiation exposure of a material. One rad(Si) is defined as one Joule per kilogram, or 100 erg per gram. The energy absorption is specific to the material being irradiated, so the common unit in silicon technology becomes the rad(Si). The total dose radiation threshold of a device is the minimum level of rad(Si) that will cause device failure. Typical commercial devices can survive around 5krads before functional failure occurs. SEE are significantly more hazardous to satellites and spacecraft. The intense proton and heavy ion environment encountered in space applications can cause a variety of SEE in electronic circuitry, including single event upset (SEU), single event transient (SET), single event functional interrupt (SEFI), single event gate rupture (SEGR) and single event burnout (SEB).

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SEE can lead to system-level performance issues including disruption, degradation, and destruction. For predictable and reliable space operation, electronic components should be characterized to determine their SEE response in the space environment of interest. Impact of Commercial New Space Programs Since the end of NASA’s Space Shuttle program, we have seen a strong trend towards increased commercial participation in launches and missions. Private industry is increasingly interested in lower cost alternatives to high reliability ICs. Some of the alternatives include military-grade Class Q parts, commercial off the shelf (COTS) parts and even automotive-grade parts. The leading edge of this trend is in commercial launch vehicles that do not use high-grade ICs due to short mission time and emphasis on cost control. The objectives of private industry are to reduce the cost and increase the reliability of access to space, and make a profit. This model demands simplicity, reliability and sharply reduced cost throughout the entire launch vehicle, payload and launch infrastructure system. New Rad-Tolerant IC Manufacturing Flow Companies addressing the small satellite market are taking a strong interest in Renesas Electronics’ cost-effective radiationtolerant products. They feature small-form-factor surface mount plastic packages using Nickel/Palladium/Gold (Ni/Pd/Au) lead finishes. These ICs undergo one-time characterization during development for TID up to 30krad (Si), SEE with a LET up to 43 MeV.cm2/mg, and military temperature range of -55°C to +125°C. The parts receive AEC-Q100 like qualification with testing up to 2,000 hours of burn-in, 500 temperature cycles, and package moisture sensitivity testing. This is much different versus higher cost traditional radiation-hardened products in large ceramic packages. Commercial parts are routinely ‘upscreened’ through implementation of some or all of the screens for a given grade but the resulting costs are typically equal or even greater than parts screened by the manufacturer. Radiation hardness is a key issue here, and one that some COTS parts may have problems with, including radiation effects that range from total dose degradation of performance parameters, which can cause system degradation, to destructive single event effects, which can be mission ending. Designers build COTS systems with stringent cost limitations and a mixture of COTS and high reliability parts. The hi-rel parts go into mission critical sockets and the COTS parts are used in the rest of the system. The COTS parts are qualified on a sampling basis with some lots passing and the failing lots discarded. Overall this may be a cost-effective method, but its risk and unpredictability are not consistent with high stakes missions such as communications satellites and national security payloads.

Low Dose Rate Testing and Qualification

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The effects of space radiation are caused by particles interacting with the materials used in electronic devices, and truly rigorous radiation tests would replicate these particle environments. Electron and proton testing is inconvenient and expensive, though, so the space community has historically used gamma rays for ground testing. It’s a simulation, but Renesas Electronics (Intersil) has more than 60 years of correlation and high confidence using high-energy photons to predict part response to charged particles. Responding to customer demand, Renesas Electronics introduced an industry-leading low-dose-rate hardness assurance program, which performs wafer-by-wafer acceptance testing at both low and high dose rate using on-site production irradiators. This program has been in operation since 2012 and it has been widely accepted by customers. The Intersil EH parts are low dose rate tested (biased and unbiased) to 50 krad(Si), with a parallel high dose rate test (biased only) to the applicable data sheet level. The 50 krad(Si) low dose rate specification has gained industry traction, with a 75 krad(Si) specification common as well. At 0.01 rad(Si)/s, the 50 krad(Si) irradiation test takes a relatively manageable 10 weeks to perform. Conclusion While commercial space will continue using a mix of COTS/ hi-rel parts and New Space adopts rad-tolerant plastic parts, the high stakes mission profiles will continue to rely on low dose rate testing for meeting the mission assurance needs of military and communications satellites as well as manned spacecraft for deep space exploration. Successful long mission system performance requires radiation hardening at the part level as well as thorough characterization and acceptance testing. References: • Learn more about Low Dose Rate Acceptance Testing. • Learn more about Radiation-Hardened Solutions. About the authors: Josh Broline is the Director of Marketing and Applications for the Space/Hi-Rel Products with Renesas Electronics America. He is responsible for developing and driving strategic plans and product roadmaps for radiation-hardened and radiationtolerant products for spaceflight applications. Mr. Broline has published numerous article in various industry magazines. He holds a BSEE from the University of Central Florida and an MBA from Florida Institute of Technology. Nick van Vonno is a principal engineer for Space/Hi-Rel Products with Renesas Electronics America. He has 48 years of service with Renesas Intersil Space Products and its predecessors in a number of technical and management posts. He is currently responsible for radiation effects research, customer support, and product technology development. Mr. Van Vonno holds a BSEE from the University of Florida and is a Life Senior Member of IEEE. He received the IEEE Radiation Effects Award in 2009.

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Electric Vehicle Battery Test Challenges Electric vehicles (EVs) are the future of the automotive industry, with manufacturers such as Tesla leading the way. But traditional automakers are vying for market share, too: Volkswagen (VW), the world’s largest car and truck maker, is investing $91B to build EVs, including one priced no more than the current base Golf model—truly a ‘car for the people’. Developing new vehicles is time-consuming, but the right investment can offset this challenge. VW has spent over $1B since 2015 to transform its Zwickau factory into the first plant dedicated to manufacturing electric vehicles based on its modular electric drive matrix (MEB) platform. While many of VW’s electric vehicles are based on MEB, it presents potential complications. Its EV powertrain

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and associated technologies are unfamiliar to designers used to generating torque from internal combustion rather than an all-electric drivetrain. And batteries serve a key function, ultimately defining vehicle cost, range, and consequent commercial success. Practically, battery evaluation and test at cell, module, and pack levels is timecritical to n e w E V platforms. Manufac-

ELECTRIC VEHICLES

and cost to meet multiple, varying environmental and driving conditions. The battery management system (BMS) is integral to performance and safety, with complex algorithms required to manage battery charge and discharge, maintaining stateof-health for maximum performance and longevity. There are several battery system evaluation and test methodology options. One involves simulation using cell manufacturers’ data along with BMS and drive-train models. Another applies dynamic loads on real vehicles in test labs to collect data over simulated driving cycles, with on-the-road tests providing final confirmation. Most methods combine options, spreading the work across globally distributed teams and supply partners. Battery subsystem test sequences can be lengthy and, with ever-tightening vehicle program schedules, it’s a challenge to manage the process, collecting and analyzing globally generated data at a central location.

turers require entirely new solutions to get EVs through design validation tests, production (assembly line) tests and into the market ahead of the competition.

Figure 1. The automotive industry is transitioning to electric vehicles, creating significant test infrastructure development challenges.

Battery system designers have the tough job of evaluating different cell chemistries and optimizing pack design for the often-conflicting requirements of energy capacity, size, weight,

To speed up the process, some manufacturers employ duplicate facilities or external agencies, perhaps using automation for ‘lights-out’ testing and delivering remotely accessible results. Oftentimes, though, test systems are vendor-dependent, with disparate data-reporting formats across the lab and agency ecosystem, again making the task of optimizing system performance harder. Another way to speed up the process is to test the BMS independently, earlier in the design cycle, using model-based capabilities to simulate or emulate the battery cells and systems surrounding the device under test. This results in faster iterations and reduces the overall cost of test, but also generates data that requires careful validation for extrapolation into the real world. For efficiency and speed throughout the design cycle, it’s ideal to incorporate a platform-based approach with interoperable hardware and software using a standardized test system architecture. This way, customers can use the same system architecture through the design and test process: From early simulation and cell-level characterization; to BMS hardware-in-the-loop (HIL) testing; to pack-level system integration, characterization, and durability testing. Using a platform-based approach helps customers take reconfiguration and update ownership so that they can reuse test systems on different vehicle programs and for different stages of development and test—from early prototyping through end-of-line production testing.

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ELECTRIC VEHICLES

Figure 3. NI Battery Test System Figure 2. Battery Test System Elements

Such a system is available from National Instruments, the global leader in automated test and measurement systems. Designed to test electric vehicle battery packs and modules in validation workflows, the system consists of measurement and control hardware for automated test execution, a ‘cycler’ to take the battery through a range of charge and discharge conditions, and application software for automated long-running battery tests. These features bundle together with intuitive software for system management, test monitoring, and data reporting and management. The test hardware is based around the NI CompactRIO system, a high-performance embedded controller that features industrial I/O modules, extreme ruggedness, industry-standard certifications, integrated vision, motion, and industrial communication, and human-machine interface (HMI) capabilities. For battery testing, a base system configuration includes four CAN interfaces; 24 cell-voltage measurement channels; 24 cell-temperature measurement channels; eight Digital In and eight Digital Out channels with PWM support; and one RS232 and one RS485 channel. A DC power source is also included, programmable from 0-60 V with a 216 W rating. Because this system is built on standard NI products, customers can customize this system by adding additional I/O modules to this base system, resulting in a configuration that exactly matches their current requirements while accounting for anticipated system changes.

A full test system solution also includes the NI battery cycler, scalable to 1200 V and 1600 A for differing battery packs (for example, for passenger-car 400 V systems or commercial-vehicle powertrains at 800 V and higher). The cycler features fiber-optic interfaces for high speed, low interference control, and high voltage- and currentaccuracy monitoring. All of NI’s battery-cycler hardware supports bidirectional power flow, with regeneration back to the grid for energy savings. NI’s hardware acquisition modules, lab PC, and NI software completes the solution, along with an environmental chamber provided by the customer or system integrator.

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NI battery-test software incorporates a Windows-based configuration and test sequencing user interface, with the option of deploying specific test steps to a ‘headless’ real-time engine for increased reliability during long-duration steps. The system adapts to changing requirements, with a hardware abstraction layer for flexible configuration and a sequence editor for import/export and test-sequence configuration. Various plug-ins offer support: Expand measurement I/O to quickly implement interfaces for new NI devices; incorporate a test sequencer for real-time OS-based test-script execution; and integrate user interfaces to, and publish data from, the data management engine via a configurable data logger. A watchdog function covers process safety, moving the system to a predefined safe state if the system exceeds specified measurement limits. The system works seamlessly with NI SystemLinkTM software for test monitoring and data management.

Figure 4. NI SystemLink Software Combines Distributed Battery Test System Elements with Cloud-Based Data Management

NI SystemLink software manages groups of networked test systems and features user-defined dashboards to set up test sequences and monitoring, with open APIs and graphical interfaces managing cloud-based data transmission, visualization, analysis, and report scheduling. Configurable alarms and notifications monitor system health and performance. The web-accessible application supports NI products such as LabVIEW and TestStand, along with third-party software and hardware, and is expandable though a plug-in architecture. It provides managed software deployments and configurations to improve test repeatability and reduce the risk of mismatched software versions among test system groups. The NI battery system test solution provides a secure route to EV development and validation evaluation, with test time improvement, through a platform that is inherently scalable and reconfigurable. The availability of industry-leading tools to improve data aggregation and analysis means manufacturers can now get the ‘edge’ they need in the competitive world of EV development.

THE ARTICLE IS CONTRIBUTED BY NATIONAL INSTRUMENTS

INDUSTRY UPDATES

Arch Systems, Flex Manufacture Data Transformation

Indium Featured Indium8.9HF Solder Paste Series

Arch Systems has announced an agreement with Flex, the global supply chain and manufacturing company, to supply real-time access to and analysis of manufacturing data at its facilities. “We’re deploying Arch’s technology at key digital factories to capture the relevant analytics and help us drive production efficiencies, process automation and predictive analytics,” explains Gus Shahin, chief information officer at Flex. “Arch can pull raw data from existing and new machines to help us generate actionable metrics, one of the core competencies of our digital factory. As part of our Industry 4.0 journey, we are excited to partner with Arch and leverage its leading-edge technology.” “Flex and Arch form a powerful combination,” says Andrew Scheuermann, CEO and cofounder of Arch Systems. “As a global manufacturing leader, Flex is leveraging the value of accurate, real-time supply chain information to drive efficiency and innovation for its customers, while empowering live machine data and a data exchange to further embrace Industry 4.0 on the factory floor. Flex owns and operates a broad portfolio of new and legacy production machines, which posed a challenge in the Industry 3.0 world. Through our partnership and the Arch Factory Exchange, this is becoming an unmatched asset to achieve flexible, intelligent manufacturing.

Indium Corporation showcased customers how to Avoid the Void with its void-reducing Indium8.9HF Solder Paste series at CEIA Xiamen on November 14 in Xiamen, China. Indium8.9HF is a proven solder paste series that delivers noclean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process conditions, this solder paste series: • Exceeds all requirements for enhanced electrical reliability and SIR performance • Delivers excellent response-to-pause, even after being left on the stencil for 60 hours • Maintains excellent printing and reflow performance after remaining at room temperature for one month • Demonstrates consistent printing performance for up to 12 months when refrigerated • Resists premature flux spread to prevent surfaces from oxidizing • Performs with both Pb and Pb-free alloys • Meets HKMC MS184-01 testing criteria Type B—one of the automotive industry’s most stringent reliability criteria

Electrolube Introduces its New Website Electrolube has recently announced the launch of its brand new website at the URL www.electrolube.com. Months of work have been dedicated to researching how and why people visit the website and the content has been restructured to assist visitors with application-based searches. As reliability and performance are key factors for manufacturers looking to transform their end-products, Electrolube has focused on the numerous and varied application requirements of different industries to improve search results for customers. The content is now highly focused on sourcing an appropriate solution for customer applications. A new product selection tool has also been developed to make narrowing down products even easier and a wider range of samples are now available for encapsulation resins, thermal management products and conformal coating solutions. Electrolube will also highlight their tremendous rise in global growth by appearing in an entirely new way at this

year’s Productronica in hall A4 stand 466, where they will occupy their biggest stand space ever at 114 square metres. The company has completely transformed their exhibition stand to reflect their stance as a complete solutions provider of electro-chemicals worldwide. Ron Jakeman, Electrolube’s Managing Director, comments, “Since the company’s global rebrand 6 years ago, Electrolube has gone from strength to strength. Due to the extensive number and variety of issues that we are presented to solve, the new website and exhibition stand now reflect our strong global capability as a complete solutions provider of electrochemicals. We have made significant

investments in leadership talent, centres of R&D excellence, cutting edge laboratories, expanding our manufacturing facilities, extending our geographical footprint and developing new product innovations that really meet the demands of our customers. Our investments, expansion and international collaboration with leading OEMs have enabled us to firmly position ourselves in the market as a reliable and trusted solutions provider at every stage of design and production. Now in its 78th year, Electrolube has always had a clear vision of the future and has consistently adapted its strengths to stay relevant and ahead of the curve, even with the rapid rate of technological change. The new application-based website and vast, newly designed stand at Productronica signal a new era for Electrolube and with the consistent development of innovative specialist chemical solutions, we are set to broaden our customer base even further and successfully increase the reliability and performance of our customers products globally. ”

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BIG PICTURE

5G Testing Solutions

The world’s demand for data is increasing at an astonishing rate. We need to be connected wherever we are and expect a seamless content rich service. With current devices consuming more and more data and more and more internet enabled devices, the current network infrastructure needs major changes to keep up with demand. 5G will be both an evolution and a revolution. An evolution as mobile evolves to support a wide range of new use cases, and a revolution as the architecture concept is being predicted to completely transform to enable these new use cases. • Provide fast, highly efficient network infrastructure • Support more and more device connections • Low latency, low power consumption • Data rates that exceed 10 Gbps 5G includes the evolution of existing 4G networks that use technologies such as C-RAN and HetNet to increase capacity of existing networks with an affordable cost. But revolution for

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MADHUKAR TRIPATHI

Head- MARCOM & OPTICAL PRODUCTS |Anritsu India Pvt. Ltd

core architecture to fully use SDN/NFV and network ‘slicing’, the use of a new millimeter wave band air interface for higher capacity, and new architecture/signaling for extreme low latency. 5G Testing Challenges As the network concepts and technologies develop for 5G, so the corresponding test methods and processes will evolve to match this. Future 5G test methods will need to provide a high confidence to operators that the technology and services are implemented according to specification, and that the quality of service is matching to the requirements of the application or service being delivered. A fully data-centric 5G network with a very wide and diverse set of applications to test would require a massive effort in standalone testing. Test automation, monitoring and built in test systems will be essential for analyzing properly the

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performance of such a network. In addition, the emergent solution to use Ultra Dense Networks (UDN) for interconnecting the radio access elements with the backhaul architecture using cloud networks will enable the development of cloud based test services for testing everything from everywhere. So, although 5G will introduce many new test requirements and challenges by the use of SDN/NFV and cloud services, this same technology can also be used for creating new test solutions that address these needs. With this in mind, cloud solutions are seen as both the new demand and the new solution for 5G network testing. Anritsu can provide a host of solutions to facilitate and assist this research and development to enable the 5G world. Why Anritsu for 5G Testing need: Anritsu develops timely mobile communications measurement solutions helping customers quickly develop products meeting the latest communications standards. Right from the earliest 3G era using the W-CDMA world standard, Anritsu has been developing and offering base station simulators to worldleading chipset vendors, communications operators, terminal makers, and others as practical solutions for implementing RF and protocol tests. In addition, the company supports its customers with a wide product range covering various types of base station simulator required at each stage of chipset, terminal and application development, manufacturing, quality- assurance inspection, infrastructure installation and maintenance (I&M), etc., as well as testers for application development and production lines, RF/protocol conformance test systems, handheld testers for field I&M, and more. The company has leveraged its long experience in supporting customers worldwide with 3G/4G (LTE) deployments for proactive development of 5G measuring instruments offering timely measurement solutions to makers developing 5G products, starting with main (tier-1) chipset makers. For both 5G and other developments, choosing the right external partner based on one's own company development resources is a key element in getting a product to market as soon as possible. When developing products, such as 5G, using the latest technologies, sometimes the resources to be procured outside the company are also under development. What is the most important element in the race against time when selecting a partner for a new product development? The key elements are selecting a partner with management experience in minimizing problems, keeping to the customer's planned schedule, procuring resources as and when necessary, comparing and investigating procurement sources, long-term experience and track record in 3G/4G (LTE), etc., development.

wave band RF measurements and beamforming tests using call connections specified by 3GPP.

Radio Communication Test Station MT8000A

For next-generation broadband and multicarrier communication system, such as 5G mobile and broadcast satellites • Built-in 5G measurement software supports efficient development and production * All-in-one 5G NR/V5G (sub-6 GHz/mmWave) coverage * High EVM performance due to wide dynamic range (EVM: <1%) * One-button dynamic-range optimization at EVM measurement * Multicarrier batch (all-at-once) analysis * Amplitude/phase/timing difference measurement for each carrier • Maximum analysis bandwidth: 1 GHz • Excellent amplitude and phase flatness performance • Wide dynamic range measurement: >140 dB • Long-term capture using large memory • With PCIe/USB3.0 connector equipped • Transfers captured data to external PC at faster speed than 1000BASE-T

5G Testing Solutions All-in-One Support for RF Measurements and Protocol Tests in FR1 (to 7.125 GHz) and FR2 (Millimeter Wave) Bands With a 5G base station emulation function, a single MT8000A test platform supports both the FR1 (to 7.125 GHz), including band n41, and the FR2 (millimeter wave) bands used by 5G. Combining it with the OTA Chamber enables both millimeter

Spectrum Analyzer/Signal Analyzer MS2850A

ISSUE 12|VOL 1|DECEMBER 2019|BISINFOTECH

INDUSTRY UPDATES

Analog Devices (ADI) has recently announced collaboration with Elgama-Elektronika, a Lithuania-based manufacturer of static electricity meters. Elgama will design electricity meters enabled by ADI’s mSure® diagnostics technology to help utilities remotely monitor accuracy of meters in the field. This allows meters to have greater useful life while reducing overall costs of meter sample testing. In addition, meter tampering accounts for 10 percent of stolen energy worldwide – a nearly $100 billion revenue loss for utilities in Europe alone and ADI’s mSure technology can provide actionable intelligence to identify many different types of meter tampers. Elgama plans to bring these meters to market by the end of 2020. “Intelligence based on the direct measurement of electric meter health will help utilities make quick and confident decisions by identifying out-ofspecification meters, detecting meter malfunction, and confirming and quantifying more tamper events. mSure is a promising solution towards achieving these goals and optimizing meter reverification costs,” said Dr. Nerijus Kruopis, Chief Technology Officer, Elgama-Elektronika. “ADI has rich expertise here and they understand our challenges. In-field accuracy verification is costlier and inconvenient to customers. An mSure-enabled meter checks the accuracy of the entire metrology function, while in the field and in full operation, leading to direct cost savings and customer service improvements. We have eagerly begun having technical conversations with several utilities in our market to help facilitate the implementation of mSure technology as a standard practice for ensuring greater meter accuracy.”

Bosch Opens a First-of-Kind IoT Garage in Bengaluru

Electropreneur Park Invites Startups Acceleration Program

Robert Bosch Engineering and Business Solutions (RBEI) launched India’s first internet of things (IoT) garage in Electronic City, Bengaluru, to offer enterprises a full stack IoT implementation capability. The lab will focus on building technology demonstrators and validating them before they take shape into scalable solutions for smart connected products. The lab will partner with enterprises who want to build connected products. The entire gamut of service from build, develop, prototype and test are offered. Vijay Ratnaparkhe, President and Managing Director, RBEI said, “The future will see the convergence of embedded, IT and IoT world. An IoT lab such as this will help us become ready for the future and also realize our aspiration of becoming the leading IoT company”. RBEI is ideally positioned as a system integrator that has in-depth understanding of key IoT capabilities, the competency and prior experience to implement such solutions, and existing partnerships with various eco-system players. Raghuram Joshi, Sr. General Manager, RBEI said, “IoT is the building block of digital transformation journey taken up by most enterprises. Ability to stitch through solutions across sensor, software and services remains a fundamental capability to be successful in this ecosystem.

Electropreneur Park is inviting proposals from electronic hardware start-ups for its pre-incubation, incubation and visual acceleration programs. The program will run for a period of one and a half year wherein the start-ups will be given INR 50K grant in preincubation phase to INR 1.2 lakh grant for physical incubation program along with investors pitch. The startups incubated at Electropreneur Park, will be offered strategic mentoring by industry stalwarts from pool of 30 leaders from companies like Murata, NXP, Global Foundaries, Cadence, Rambus, NIIT and highly successful entrepreneurs. Access to design support from various supporting organizations like Infineon, STMicroelecronics, Texas Instruments, Microchip, Intel, NXP, Arrow, Avnet etc. Like every other year, Electropreneur Park will provide a robust technology focused sustainable infrastructure, allowing for advanced R&D, innovation and designing. The start-ups will receive funding assistance through government support, industry connect and through member base of IESA, STPI and University of Delhi. Electropreneur Park made an investment over INR 2 crore in setting up the incubation lab for helping the start-ups. While entrepreneurs and start-up enthusiasts in India burst with new ideas, most of them face a major setbacks in setting a proper infrastructure and office space.

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CURRENTLY, THERE IS A LOT OF BUZZ AND DEMAND FOR SMART CARDS

HID Global has always focused on bringing in new technologies that can power trusted identities of people, places and things. In India, our entry-level product range and our enterprise range have been well received states Lalit Agarwal, Sales head, South Asia Secure Issuance, HID Global. During an elaborated e-interaction the veteran unveils the prominence of Smart Cards, its future and their expertise. Edited Nub Below.

LALIT AGARWAL Sales head, South Asia Secure Issuance, HID Global

How Important is India as a market for HID India and what key areas are of HID’s key focus? India continues to remain a key market for HID Global worldwide and we are a growing company with a sizeable presence in the country. With continued focus and market demand for holistic security, we are seeing a strong upward trend for deploying our trusted identities solutions in India. To meet this growing demand, we plan to grow our business both organically as well as inorganically.

During the recent Smart Cards Expo 2019 held in Delhi, HID India centre-staged trusted identity solutions, its competence in latest secured identity solutions? What are the salient features/advantages that provide a competitive edge with these new offerings? At the Smart Card Expo 2019 event held recently in Delhi, we unveiled the following products for the first time in India some of our key products under Secure Issuance. Additionally, to enable our strong partner network to experience our products first-hand we also showcased the following at a recent Kindly share an overview of HID India and its play in SI? Partner Meet held in Goa: HID Global has always focused on bringing in new technologies that can power trusted • S ecured card personalization solutions: HID® FARGO® identities of people, places and things. In India, our entryHDP6600 is a high definition printer/encoder designed to level product range and our enterprise range have been save customers time, money and energy by cutting in half well received. By leveraging decades of experience in the time it takes to print the first ID card while doubling overall document engineering and manufacturing, we are able throughput as compared to many alternatives. to balance high security with ease of implementation and custom design capabilities to meet demands in this market. • Powerful cloud printing solution: HID® FARGO® Connect With respect to Secure Issuance, we recently launched the is a revolutionary cloud-based card issuance solution that HID® FARGO® HDP6600 and HID® FARGO® Connect, both takes seamless on-boarding and credential issuance to a have been well-received globally and in India. new level.

India has major plans under ‘Smart Card Scheme’, what key opportunities does it incur for HID India? Currently, there is a lot of buzz and demand for smart cards. With the introduction of the ‘smart card scheme’, this demand is only expected to spike in the coming years. The BFSI sector, in particular, have been quick to make the transition from chip-based cards to advanced versions that come with fingerprint features; this will be a business opportunity for us. Additionally, with India’s thriving corporate market and increased government focus on end-to-end id card issuance, we anticipate our re-transferable printer solutions to do well. We are also seeing cloud-based card issuance market steadily picking up. Where in individuals, large corporates and governments have started to prefer cloud-based card issuance.

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Tell us about your R&D strength? We have a strong focus on R&D. We closely study the market to anticipate trends as well as demands before we decide on our product roadmap. This technology-led approach has helped us to continuously innovate and stay ahead of the competition.

What keeps HID India different from other manufacturer of secure identity products? Apart from our bullish focus on R&D that help us tap into the right market opportunities, another aspect that sets us apart is our conscious effort towards greener and sustainable solutions. Like our new range of printers come with built-in intelligent temperature control that allows for a significant reduction in energy consumption and therefore are GreenCircle certified.

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How has Cloud, IoT or the lingo used currently (SMAC) has impacted Security and Identity technologies? IOT and SMAC have hugely impacted identity and security sector. Mobile phones are key to user identity today and people may forget their identity cards but would not step out without their mobile phone. Understanding the changing environment and demands, HID has worked towards offering solutions to enhance user experience which is customised.

How challenging it is to cope up with customer-demand in this dynamic changing technology territory? We are geared up and on par with the dynamic market situation. The R&D teams are constantly working towards identifying upcoming trends and developing solutions to the ever changing needs of our customers.

Key business models to cater the domestic market and your partners strength? Our top priorities are channel develop-

The important trends that we are observing are Identity over cloud and subscription based card issuance.

ment and strengthening the channel. We constantly work towards helping the channel partners in providing the right solutions to their customers and remain relevant at all times.

According to you, which are the most important trends in the market? The important trends that we are observing are Identity over cloud and subscription based card issuance.

How was the year 2019 for HID India and ahead plans of HID India in 2020, major announcements, strategies etc.? We are witnessing a healthy growth and are bullish about 2020. Our strategy will be focussed towards providing new solutions which will give us an edge in the market. Our re-transfer printer hdp6600 which has been launched in the india market is a unique solution in its category and offers all together a different experience when it comes to identity badge issuance. We shall further announce new solutions in 2020 as we progress.

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LITTELFUSE IS FOCUSING HEAVILY INTO SILICON CARBIDE TECHNOLOGIES

Littelfuse is working into developing more power-efficient, power pack, compact devices & solutions to create a safer, greener and more connected world. During an exclusive interview Gursharan Bhatia | Country Head - India & SAARC Region & South Africa |Littelfuse tells Niloy from BISinfotech about current and forthcoming Littelfuse dynamic strategies in this fast changing digital environment. The veteran also focused on latest offerings and the company’s focus into SiC and online communities encouraging innovation. Edited Nub below.

GURSHARAN BHATIA Country Head - India & SAARC Region & South Africa |Littelfuse

Advanced technologies like in consumer, automotive, renewable etc. are driving the power semiconductors demand. How is Littelfuse working into developing more power-efficient, power pack, compact devices & solutions? Littelfuse is actively working on providing innovative solutions which are helping to create a safer, greener and more connected world. Some examples of our innovative solutions are like SetPTM Thermal protection for safer higher power delivery with USB-C cables, latest X3 and X4 Ultrajunction MOSFETs which offer the best in the class figure of merit for 150V to 300V ratings and also highly integrated fuses like 881 Series for dense power applications.

Littelfuse, key focus areas and offerings meeting the current demand of the market? Littelfuse focuses on three area’s Protect, Control & Sense and regularly releases products for these area’s. • Protection- Overcurrent protection, Surge-Protection and ESD protection, • Sense: Position, Speed & Temperature etc. and Control: Thyristors, TRIACs •A nd Power Electronics: Diodes, Mosfets, IGBTs & drivers.

BISINFOTECH|DECEMBER 2019|VOL 1|ISSUE 12

Littelfuse has a unique online simulation platform for selecting protection devices – idesign where engineers can run simulations as per their design requirements.

The online community is driving new design ideas and helping innovative ideas to flourish. Do you have any such online community to help young engineer’s community and start-ups? Littelfuse has a unique online simulation platform for selecting protection devices – idesign where engineers can run simulations as per their design requirements. Littelfuse also has an online sample centre where engineers can order limited samples for faster evaluations and also options to check distributor inventories for pilot lot productions. Many tech enthusiasts regularly benefit from the valuable information at https://www.speed2design.com/ In addition to this enough design related information is also available at www.littelfuse.com

Littelfuse focus into the growing emergence of silicon carbide and gallium nitride power semiconductor devices and modules? Littelfuse is focusing heavily into Silicon Carbide technologies has latest generation of 1200V SiC MOSFETs and full range of 650V & 1200V diodes. We also offer unique packaging options for this technology including SOT-227 or our unique SMPD package for highly integrated solutions. Littelfuse has also recently released a unique SiC Diode +

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Si-MOSFET combo device - MXB12R650DCGFC for PFC and boost converter applications.

hicles, more secure automobiles requiring innovative sensing solutions, cleaner solar & wind energies etc. Littelfuse has specialized products for these segments.

What are the key sectors Littelfuse is focusing in India? Everywhere and Everyday Littelfuse broad portfolio of protect, control & sense solutions are being focussed for customers in India and we also try to provide India specific solutions as well.

Advanced technologies are also bringing new challenges for designers to maintain design-cycle time with market demand? What are Littelfuse strategies to be ahead in the market? Littelfuse has a broad sales team integrated with our marketing & product management teams who lay special emphasis on understanding future technology roadmaps and developing innovative solutions for it. For example, Littelfuse SetPTM Thermal protection solutions were developed to protect higher power delivery using USB-C connectors etc. We also provide them access to our labs which helps them to cut their design cycle.

How has been the Q3 of 2019 for Littelfuse? This year due to low demand and economic situation industry overall is affected. This has also impacted our Q3 numbers. However, going forward we expect the demand to pick up. What are the growing challenges and scopes you see in the dynamic changing technology sector? Ever increasing power densities are enabling design or slim/ smart technologies. At the same time, it is posting a challenge to ensure safety of the end users. With focus and experience in its hand, Littelfuse will continue to provide solutions to the customers who are interested in reliable solutions.

What are the impacts of Internet of Things, AI, cloud etc. in the current semiconductor industry and how is Littelfuse adopting the change? IoT opens up new vistas for Littelfuse. While the computing What are the key trends you foresee driving the semi- power from the cloud would help many small/big companies conductor industry going into 2020? to offer myriad products, real sensing does call for reliable Key trends driving the semiconductor industry are safer, sensors and highly integrated power solutions. All these concur greener & connected world. Some examples for India which with Littelfuse focus area’s and we are consistently participatwill drive growth are new cleaner BS-VI emission norms getting ing with many customers globally as well as in India to design implemented in 2020 along with development of electric ve- & develop solutions for these.

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ITEC INDIA 2019 IS FOCUSING ON E-MOBILITY FOR THE COMMUNITY THIS YEAR

Mulling the next big revolution in the Automotive segment, Nitisha Dubey | Sub Editor | BISinfotech in a candid chat with Girish Ramaswamy, Head of Engineering at Continental & Chaiperson Person Organising Committee iTEC India elaborates about iTEC INDIA 2019. The veteran, Ramaswamy undelrlines how iTEC India is aimed at helping the Indian automotive industry transition from conventional vehicles to advanced electrified vehicles. To all the big faces under one roof, we strive to exhibit iTEC India’s 2019 focus, faces and future. Don’t miss out the dates, 17, 18 and 19 December 2019 - Hotel Sheraton Grand, Whitefield, Bangalore. Edited Nub below

GIRISH RAMASWAMY Head of Engineering at Continental & Chaiperson Person Organising Committee iTEC India

What will be this year, iTEC India’s prominent focus and the dates one should remember for this year’s conference? iTEC INDIA 2019, International Transportation Electrification Conference India is aimed at helping the Indian automotive industry transition from conventional vehicles to advanced electrified vehicles. The conference brings together various stakeholders from the industry, policy makers, startups and technology experts across various domains of the automotive industry to identify solutions that can help India make the leap to e-mobility. The theme for the 2019 edition is “e-mobility for the community” since this paves the way for further transformation across the industry. The conference will take place at Hotel Sheraton Grand, Whitefield, Bangalore on 17, 18 and 19 December 2019.

● Electrification of Heavy-Duty and Off- Prof. Ashwin Khambadkone, National Road Vehicles; Sea, Air and Space University of Singapore (NUS), Singapore Vehicles, Mr. Aswin Mahesh, Co-Founder, Lithium ● Smart Materials for EVs, Structural Design Urban Technologies. and Thermal Management; Mr.Georges Zissis, President, IEEE IAS, U.S. ● Components Optimization and Packag- Dr.Tomy Sebastian, IPP, IEEE IAS ing Integration; Structural/Thermal CFD ● Challenges to meet Electrification Vi- Sponsors: sion 2030; India Specific EV Solutions Title - AVL Graz ● Smart and Sustainable e-Transportation Principal Sponsors- Mahindra Electric Ecosystem/Smart cities; Challenges and +Me and Solutions Platinum Sponsors - ANSYS and Dassault ● C onnected and Autonomous EVs; Systemes Remote Monitoring, Diagnostics and Gold Sponsors - Horiba, MathWorks, Data Analytics Siemens and Vitesco ● EV for Fleet - Fleet Management Sys- Silver Sponsor - Altair, Bosch, Valeo and ZF tems, Route Characterization and Trip Bronze Sponsor - Elektrobit, ETAS, TVS Lucas Planning Kindly share the current industry ● EV Deployment Experiences, Battery scenario, and future vision of Power Second Life and Recycling The speaker list has some very notable Electronics and Electronic drive. According to WHO, among the world's names. The current speakers include. 15 most polluted cities, 14 are in India. Mr.Amitabh Kant, CEO, NITI Aayog Key topics to be underlined during Dr.Guenter Fraidl, Senior Vice President, Vehicular Pollution is a major contributthis focus and prominent partners, Powertrain Systems, AVL Graz ing factor to this alarming number. As speakers? Mr.Guillaume Gerondeau- Vice President EVs are the sure fire way to the future, Topic areas include but are not limited to: Global Dassault Systems, Tokyo Power Electronics will play a significant ● Power Electronics, Electric DriveTrain Prof.Ashok Jhunjhunwala, IIT Madras role in fulfilling the gap. and Controls Dr.Zed Tang, Global Solution Architect, Power electronics is the application of ● Battery, Battery Management Systems ANSYS solid-state electronics for the control and and Fuel Cells for EVs conversion of electric power. ApplicaMr.Raghav Gulur VP& Head, ZF India ● EV Architectures for Pure Electric, Hybrid Mr.Sunil Motwani, Industry Director, tions of power electronics range in size Electric and Electric Range Extenders Mathworks from a switched mode power ● EV Charging Infrastructure, Smart Charg- Dr.Fei Gao, Professor, University of Tech- supply in an AC adapter, battery charing Solutions & Apps, Smart Grid, V2G nology of Belfort- Montbeliard, France gers, audio amplifiers, fluorescent lamp and Renewable Integration Mr. Steven Dom, Automotive Solution ballasts, up to gigawatt-scale high volt● Standards, Policies, and Regulations Manager, Siemens PLM, Belgium age direct current power transmission for Transportation Electrification; Emis- Mr.Greg Harris, Global Leader for Electri- systems used to interconnect electrical sion Issues grids. Power electronic systems are found fication, HORIBA MIRA, Germany

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in virtually every electronic device. That reduce the use of fossil fuel in a phased iTEC India 2019 is focusing on e-mobility being said, Power Electronics will have a manner by 2030 is expected to ensure for the community this year. pivotal role to play in the future of EVs. faster adoption of electric vehicles (EVs) What are your long-term plans and However, modern day PEEM technology and environmentally friendly mass transexpectations from this conference? is not sufficient to enable market-viable portation in the country. The emphasis Pure and Hybrids. Programs such as the laid on electric mobility in the ‘2030 Vision’ To bring a conscious change in the Department of Energy’s Vehicle Tech- is aimed at increasing energy security, Automotive Industry through the help nologies Program aims to develop these reducing oil import dependence and of thinkers, innovators and industry specialists. India is the 3rd largest oil technologies by setting strategic goals reducing vehicular pollution. importer currently. It would be great if for Power Electronics, and undertaking What are the most important facts we could transition from this to being research projects that are carried out which are positive elements in using self-sustainable in terms of our transport through collaboration among governenergy requirements. We are bringing ment, national laboratories, academia, e-vehicles? and industry partners. Achieving the Power `1,000 crore has been earmarked for together various thought leaders and Electronics and Electrical Machine goals setting up charging stations for electric hope to create a platform where we will require the development of new vehicles in India. The government has have discussions on multiple fronts - from technologies. These new technologies announced an outlay of `10,000 crore addressing manufacturing challenges must be compatible with high-volume for FAME 2 to boost the number of elec- to identifying solutions for infrastructure manufacturing and must ensure high tric vehicles in India. The government development and also give startups a reliability, efficiency, and ruggedness. will offer incentives for electric buses, platform to put across their innovative These technologies must also reduce three-wheelers and four-wheelers to be solutions for the community. cost, weight, and volume. Of all these used for commercial purposes. What role can media play to prochallenges, cost is the greatest. PEEM Plug-in hybrid vehicles and those with a mote these kind of one-of-a-kind project partners work together to ensure sizeable lithium-ion battery and electric that technical attributes, vehicle-scale motor will also be included in the scheme knowledge base conferences? manufacturing, and cost sensitivities are and fiscal support offered depending on The media has a strong role to play in shaping the choices of the general popuaddressed in a timely fashion and that the the size of the battery. lation, educating people and creating resulting technologies can be adopted What are the key challenges and awareness. The media shares the various by companies willing and able to supply solutions with e-transportation and perspectives and brings the messages products to automakers. smart cities? of the thought leaders to the forefront. What would be the initiatives from Any major transition to a new system would It also helps in bringing innovative solugovernment in order to promote, have some challenges, and the move to tions to the public, which could inspire boost the EVs in India? EVs is one of the biggest transitions the further innovations from the people. The FAME II, announced this year, has brought automotive industry across the globe is world cannot work in a silo any longer. a host of incentives for the industry to facing. There are some challenges that We work collaboratively for a better fumake the transition, including income have to be addressed currently: ture. And the media plays a very critical tax rebates for buyers, lower customs 1. Insufficient charging infrastructure role in creating and connecting these duties on spare parts for such vehicles 2. Reliance on battery imports collaborations. and tax breaks for local spare parts mak- 3. Reliance on imported components Please share the versatile emission ers, as it seeks to transform the world’s and parts issues which can be addressed with third-largest oil importer into a global 4. Range anxiety among consumers manufacturing hub for electric vehicles. 5. A higher cost of vehicle - the Indian the help of such e-mobility drives? This is a welcome step and should help consumer needs to slowly adapt to the India has taken several initiatives to keep gain interest in EVs. It would also help to idea of the initial cost of the vehicle emissions in check. However, India still have a good infrastructure supporting EVs being more than what is currently produces its energy based on coal as raw material. Coal share in India’s priof the future. Several state governments present across the country have already begun Many of these challenges are already mary energy consumption is as much working towards this as well. being addressed by policymakers, gov- as 56% and coal-fired plants generate ernments and the industry. The consumer 72% of India’s electricity. We need to Please share the upcoming initia- is also more favourable to EVs today as move away from coal-based electricity tive which can be taken from the they grow aware of the efficiency of the production towards renewable sources automotive giants in the country in order vehicle, long-term savings and sustain- to ensure that e-mobility becomes clean to support the Pure and Hybrid electric ability aspects of it. mobility in true sense. Platforms such as vehicles? Focusing on developing EVs for the iTEC bring decision-makers and thought The government’s commitment for a community will also help create more leaders under one roof to discuss such ‘Clean & Green’ India through proposals awareness, set up the necessary infra- critical challenges and India specific in the interim budget such as measures to structure. This is one of the reasons why solutions to forge a better tomorrow.

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OUR SIMPLE MESSAGE TO INDIAN TELCOS IS “IT’S TIME TO LIBERATE YOUR DATA”

Given the mass rollout time fixture for 5G, India is among other country which is revvingup policies, technologies and possibilities for 5G rollout. During an exclusive e-interaction with Indranil Chatterjee, Senior Vice President and Kishor Panpaliya, VP of Americas and APAC, Enea Openwave, the enablers of 5G technology comes in light discussing the challenges and scopes of 5G rollout in India. An Edited Nub below.

INDRANIL CHATTERJEE

KISHOR PANPALIYA

Senior Vice President, Enea Openwave

In your opinion, how are Indian operators preparing for 5G? Indian operators spent significant money and effort building 4G networks at a massive scale. Along the same timeframe, Indian consumers got hooked on to mobile data and internet services, thanks to the price pressure introduced by the new mobile operator entrant. India, of all the countries, truly need 5G as current networks are running at capacity and in some cases over capacity leading to acute congestion and user experience issues. True 5G launch appears to be at least a year out and industry projections collaborate that i.e. 90M 5G unique connections by 2025 in a country with 1.3B population! That means 4G and 5G will co-exist for a long time to come. 5G can offer leapfrog opportunities for India where lower levels of investments in physical infrastructure has crippled growth. However, there are multiple headwinds (regulatory and financial included) that operators are facing as they plan for 5G. The Indian government plans to undertake 5G Spectrum auction soon, but, are operators (especially the ones hit hard with recent pricing wars and consolidation) prepared to pay the hefty reserve price tag? Some operators are more interested in defining 5G use cases

BISINFOTECH|DECEMBER 2019|VOL 1|ISSUE 12

VP of Americas and APAC, Enea Openwave

first, prior to committing heavy spectrum and core infrastructure investments. For example, during India Mobile Congress, one of the demonstrations was regarding next generation entertainment experience using FHD and 4K video streaming using multiple 5G handsets. As the streaming wars rage in India with Netflix, Amazon Prime, HotStar etc., 5G presents an enormous opportunity for operators to grab a fair share of the media and entertainment pie. Anticipating that 5G could be game changing, Indian operators are increasingly putting more energy and focus on 5G preparations by conducting trials, changing their network architecture to be 5G-ready and developing some of the 5G core network IP in-house with the goal of reducing the overall operator cost of ownership for 5G.

How is Enea Openwave preparing for 5G in India? Openwave is now owned by ENEA and together our portfolio spans the mobile network from the edge to the core. Enea Openwave has a leading market position in the focus areas of Traffic Management, Cloud Data Management and Policy & Access control and these are fundamental building blocks of 5G

core architecture. Enea Openwave is emerging as the most agile and innovative software provider for 5G Core Network Functions. We have more than 50+ Tier 1 mobile operator deployments worldwide and we are in deployment phase for our 5G products in some of the advanced countries already. We have designed our platforms to ensure smooth migration and interop between 4G and 5G. We have invested heavily in building a self-sufficient centre of excellence in Pune, Maharashtra, where we have cross-functional expertise including sales, product management, engineering and global customer support teams. A Tier-1 operator in India has already experienced the benefits of deploying our Traffic Management solution and we are in the process of expanding our footprint at other Tier-1 operators. There is significant potential in the Indian market for our solutions due to the exponential rise of mobile data traffic causing various customer impacting issues like network congestion and video buffering. Our plan for the Indian market is twofold. Firstly, we intend to leverage our global Tier 1 deployment expertise and significant local presence to create a win-win scenario for Indian network operators through our tested and proven

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core network functions. Secondly, we have mature OEM relationships with major network infrastructure vendors who have significant market share in India and are actively engaged in migrating the packet core domain to virtual machines or containers. Enea Openwave virtual network functions have been pre-integrated and certified within their platforms, offering our Indian operator customers an alternate choice of procuring our solutions.

Enea Openwave has a leading market position in the focus areas of Traffic Management, Cloud Data Management and Policy & Access control and these are fundamental building blocks of 5G core architecture.

What are your thoughts on the mobile data plans in India – how in your opinion have they evolved? Fuelled by large scale deployment of 4G networks and unlimited data plans at low cost, there has been a 56-fold increase in overall mobile data consumption in India in last 4 years. Since the introduction of 4G in 2016, the average cost of wireless data per subscriber has reduced by 95% in India. India has the cheapest mobile broadband prices in the world. Mobile data plans allowed India to skip wired internet altogether and make mobile broadband the backbone of Digital India with 1.2B mobile subscriptions. The new wireless operator entrant drove down the data plan cost sharply to gain subscribers and competitors reacted by matching or beating the price and the resulting hyper competition created a situation where consumers are paying prices much lower than what they are willing to pay. This situation has to correct itself, particularly, when the consumers changing viewing habits & burgeoning OTT streaming services are putting enormous pressure on ROI dynamics for mobile operators. With 5G investments looming, operators will be forced to reevaluate the economics of mobile data than half of all video streaming content and their pricing strategy. in India. As the percentage of HD mobile What are your predictions for the video traffic continues to climb, mobile Indian mobile industry in 2020? operators need to allocate 3-4 times Mobile Video is an area where we actively more bandwidth than what standard track local and global trends and publish video would require. As a result, operators forecasts (Mobile Video Index) based on would struggle to cope as some networks global data across 50+ Mobile Operators. may be stretched to the breaking point. We foresee a huge rise in mobile data Considering that subscribers now say consumption in the near term in India with mobile video quality is more important the rise of streaming services like Netflix, than voice calls, and considering that Facebook, YouTube, Hotstar, TikTok. Enea 5G is at least a year away, operators Openwave predicts, by 2020 HD (High also could face increasing churn if they Definition) video would account for more cannot maintain mobile QoE and take

control of their networks and subscribers. We believe AI and Machine Learning based technologies would gain maturity in helping Mobile operators plan and manage for some of these challenges.

You predicted, in 2018, 90% of internet traffic would go dark for operators. What are the proactive measures, you suggest, telcos should take to cope up with this? Tell our viewers more about your offering. Encryption protocols from Google, Facebook and others continue to darken mobile networks for mobile operators. Yet, at any given point, operators need to ascertain quickly if the content on their networks is from Netflix, Amazon, YouTube or any other source. What definition is the video? Is it being live streamed or downloaded? What codec is being used to deliver the video and to what device? Because operators can’t manage what they can’t see, they need more than conventional traffic management technology to gather data and make informed decisions. To gain insight with analytics, operators need to abandon the old appliance-based Deep Packet Inspection (DPI) approach and adopt pure software solutions, like Enea Openwave’s Video Traffic Management solution. These solutions are designed to be software-based, agile and virtualized so they can be easily deployed in the cloud, with heuristics for encrypted video. Plus this technology allows operators to glean data that enables applicationbased metering plans or promotional add-on services for additional revenue generation opportunities.

Is there anything else you would like to add? Yes, one last point! Coming back to 5G and the investment, we believe that 5G presents a perfect opportunity for mobile operators in India (and worldwide) to re-architect their mobile core network to a much lower TCO and make all 5G network functions a commodity. The key to this architecture is a 5G common data layer that is open, cloud native & simplified and allows operators to solve the problems of vendor lock-in by liberating state from vendor applications. Our simple message here to Indian telcos is “it’s time to liberate your data”.

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Anritsu Introduces its New PCI Express Test Solution Anritsu has recently announced the release of its new PCI Express test solution supporting the Gen5 Base Specification Stressed Receiver Test using the company’s Signal Quality Analyzer-R MP1900A Series with installed Automation Software for Base Specification Calibration and BER Measurement Software supporting the SKP Filter. With this release, customers can easily configure a measurement environment for early-stage development of Gen5 IP and devices, helping faster introduction of PCI Express 5.0. Development Background New technologies, such as IoT and AI, etc., are expected to see rapid growth as commercial rollout of 5G services makes high-speed transmission of large data volumes feasible. Since data centers playing a key role in this new technology paradigm shift require increasingly faster and larger data processing capacity, data-center transmission equipment, servers, storage, etc., are starting to use internal interfaces supporting faster and larger-capacity data transmissions.

Base Specification 5.0 of the next PCIe Gen5 standard has been completed and increases data transfer speeds to 32 GT/s. As a result, development of equipment supporting this standard is urgently required. Outline of Signal Quality Analyzer-R MP1900A Series The Signal Quality Analyzer-R MP1900A Series is a multichannel BER tester meeting the design and verification requirements for high-speed bus interfaces, such as PCI Express 4.0/5.0, USB3.2/4, Thunderbolt, etc., as well as for next-generation network interfaces, such as 200G/400G/800G Ethernet. With a built-in Pulse Pattern Generator for generating high-quality waveforms with industry-bestof-class levels (Intrinsic Jitter of 115 fs rms) plus a high-inputsensitivity Error Detector, as well as a high-accuracy Jitter generation source (SJ, RJ, SSC, BUJ), CM-I/DM-I/White Noise source, Link Training function, and support for LTSSM*3 analysis, the MP1900A series is the ideal solution for various applications, including compliance tests, margin tests, troubleshooting, and more.

Keysight Ranked 18th in First Annual Top 50 ESG Companies

FLIR Launches the Fido X4

FLIR Systems has announced the launch of the FLIR Fido X4, the newest, most advanced version of its premium handheld explosives trace detector. The Fido X4 delivers unmatched sensitivity for a broad range of explosives, so users can easily detect threats at levels other devices cannot. FLIR Systems’ TrueTrace detection technology features a new five-channel sensor array that delivers expanded threat coverage. TrueTrace can accurately detect a wide range of explosives at nanogram to sub-nanogram levels – including military, commercial, improvised, and homemade explosives – allowing users to gain actionable intelligence through identification of threats in as little as ten seconds. A FLIR PackBot Hardware Integration Kit will sync the Fido X4 with the company’s unmanned ground vehicle (UGV) widely used for explosive ordnance and bomb disposal.

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Keysight Technologies announced it has been ranked #18 in the first annual top 50 environmental, social and corporate governance (ESG) companies by Investor’s Business Daily (IBD). According to IBD, companies with strong stocks and growth can also possess solid environmental, social and governance values. Among companies with ESG ratings of AAA or AA from MSCI ESG Research as of September 11, 2019, these 50 companies had the highest IBD Composite Ratings, reflecting broad strength in fundamental and technical areas linked to price performance. Nearly all have a Composite Rating of 80 or higher, putting them in the top 20% of stocks. “Keysight earned a solid placement on IBD's Best ESG companies list, thanks to its high rating for environmental, social and governance practices and strong IBD Composite Rating,” said Susan Warfel, managing editor of IBD. “At the time of our analysis, Keysight held a Composite Rating of 91, putting it in the top 9% of all U.S.-traded stocks. Factors contributing to Keysight's high Composite Rating include its earnings growth, sales growth, margins, return on investment and stock performance.” Methodology for IBD’s first annual Top 50 ESG companies: Held ESG ratings of AAA or AA from MSCI ESG Research as of September 11, 2019. Trade publicly in the U.S. stock market.

T&M UPDATES

Yokogawa Releases ProSafe-RS R4.05.00

Rohde & Schwarz Ties with Qualcomm

Yokogawa Electric Corporation has recently announced the release of ProSafe-RS R4.05.00, an enhanced version of the ProSafe-RS safety instrumented system. ProSafe-RS is a core product of the OpreX™ Control and Safety System family. This latest version of ProSafe-RS has a new processor module with a Yokogawa-developed microprocessor unit (MPU). The use of an MPU of Yokogawa's own design eliminates the risk of disruptions caused by the modification or discontinuation of commercially available electronic components, ensuring the long-term stable provision of the ProSafe-RS system. This version of ProSafe-RS also features an enhanced function that speeds up system software upgrades and a new function that helps to prevent operator errors. With these enhancements, Yokogawa is helping to ensure safety and sustainable operations over the entire lifecycle of plant operations, from commissioning to end of service.

Rohde & Schwarz has entered an agreement with Qualcomm Technologies for the use of their Interface Control Document for 5G as an authorized licensee to develop test equipment based on Qualcomm Snapdragon X55 5G Modem-RF System. Rohde & Schwarz has licensed Qualcomm Technologies’ Interface Control Document for 5G that describes the unique messages that come from the Snapdragon X55 5G Modem-RF System. For Rohde & Schwarz, access to these messages is critical to the development of test solutions such as QualiPoc, for example, that captures and analyses these messages for determining network quality and customer quality of experience. Any type of interaction between a mobile device and the mobile network requires hundreds, if not thousands, of unique messages that are sent back-and-forth that verify all aspects of a mobile phone call or data session. The quantity and complexity of messaging continues to increase as more features and capabilities are added. This trend will no doubt continue as the industry begins to migrate from 4G/LTE to 5G. Hans-Peter Bobst, CEO of Rohde & Schwarz SwissQual AG: “Having early and complete access to the Interface Control Document allows us to develop more comprehensive test solutions faster, providing our customers with what they need when they need it.

ENHANCEMENTS New S2CP471 processor module with Yokogawa-developed MPU: The safety control station (SCS) is a key component of the ProSafe-RS system, and the processor module is a vital component of the SCS. For this latest version of ProSafe-RS, Yokogawa has developed the S2CP471 processor module.

NI Launches 4 GHz Vehicle Radar Test System NI has recently announced the release of its 4 GHz Vehicle Radar Test System (VRTS). In 2010, the U.N. General Assembly declared 2011–2020 as the Decade of Action for Road Safety. This announcement by the Assembly reflected a goal of saving millions of lives; it also triggered a revolution in the automotive industry, spanning from policy to technology. As this decade comes to a close, the gap between assisted driving and autonomy is proving to be one of the most critical challenges and areas of consumer uncertainty. Automotive radar is essential to vehicle safety for current advanced driver assistance systems (ADAS) and future autonomous driving. It’s one of the most widely used sensing technologies because it’s robust and readily available. The massive automotive industry shift towards 79 GHz radar has reduced the cost of radar-based safety features like autonomous emergency braking (AEB) and rear cross-traffic alert (RCTA). The main advantage of 79 GHz radar sensors is the 4 GHz bandwidth, which significantly improves resolution and accuracy for both range and velocity.

A tradeoff, however, is a larger set of test challenges, as the additional bandwidth means more data. This requires additional processing capabilities and an increase in test scenarios as more objects are discernible. With the simulation capabilities of the VRTS, engineers can work to improve their test to more confidently address these challenges. “4 GHz is more than just larger bandwidth and extra scenarios,” said Oliver Poos, Radar Test Engineer at Noffz Technologies. “It provides added room for error on the test, so reliability and repeatability are increasingly important to guarantee safety.” NI’s new VRTS is capable of simulating two objects per angle with a highly repeatable radar cross section (RCS). The RCS makes the simulated obstacle appropriate for both validation and production test. As a product in the NI platform, the VRTS continues the long-standing flexibility, scalability and costeffectiveness of the company’s software-defined systems, helping the user create more precise test scenarios and achieve lower test setup times. Finally, the VRTS is both costand space-optimized for large production deployments.

INDUSTRY UPDATES

NXP Quarterly Dividend and Resumption of Share Repurchases NXP Semiconductors has announced that, as part of the Quarterly Dividend Program, its board of directors has approved the payment of an interim dividend for the fourth quarter of 2019 of $0.375 per ordinary share. The interim dividend will be paid on January 6, 2020 to shareholders of record as of December 16, 2019. Additionally, the NXP board of directors has authorized to resume the share buy-back program in 2020, authorizing up to $2 billion of share repurchase to be executed at times and manners determined by the company management. Taxation – Cash Dividends Cash dividends will be subject to the deduction of Dutch dividend withholding tax at the rate of 15 percent, which may be reduced in certain circumstances. Non-Dutch resident shareholders, depending on their circumstances, may be entitled to a full or partial refund of Dutch dividend withholding tax. If you are uncertain as to the tax treatment of any dividends, consult your tax advisor.

Nordson Elects Ginger Jones to its Board of Directors

Maxim to Present at Upcoming Investor Conferences

Nordson Corporation has recently announced the election of Ginger M. Jones to its board of directors. Jones has more than 30 years of finance and accounting experience in the manufacturing, industrial and consumer industries. Before retiring in December 2018, Jones served as the senior Vice President and Chief Financial Officer of Cooper Tire & Rubber Company, where she was responsible for financial operations, investor relations and business information systems. Jones is currently a member of the board of directors of Tronox Holdings plc. and Libbey Inc. She is chair of the audit committee and a member of the compensation committee for both boards. “We are pleased to welcome Ginger to the Nordson Board of Directors. She is a seasoned financial executive, who partners with her businesses to drive profitable growth. Her global perspective, business leadership experience and financial acumen make her a valuable addition to our board,” said Michael J. Merriman, chairman of the board of directors, Nordson Corporation. “I look forward to working with my fellow board members, as well as president and chief executive officer Sundaram Nagarajan and the Nordson management team, as we continue to build upon this company’s great foundation,” said Jones. Jones was elected unanimously by the current directors of the board after an extensive search conducted by an executive search firm.

Maxim Integrated has announced recently that Tunç Doluca, Chief Executive Officer and Brian White, Chief Financial Officer will be presenting at the Credit Suisse 23rd Annual Technology Conference in Scottsdale, AZ. The presentation is scheduled to begin at 3:30 p.m. Mountain Time/5:30 p.m. Eastern Time on Tuesday, December 3, 2019. A replay of the audio webcast will be available for 180 days at the same location. The company also announced that Brian White, Chief Financial Officer will be presenting at the Barclays 2019 Global Technology, Media and Telecommunications Conference in San Francisco. The presentation is scheduled to begin at 1:30 p.m. Pacific Time/4:30 p.m. Eastern Time on Wednesday, December 11, 2019. A replay of the audio webcast will be available for 180 days at the same location. Lastly, the company announced that Brian White, Chief Financial Officer and Randall Wollschlager, Vice President and General Manager of Maxim's Automotive Business Unit will be presenting at the J.P. Morgan 18th Annual Tech/Auto Forum at CES in Las Vegas. The presentation is scheduled to begin at 9:55 a.m. Pacific Time/12:55 p.m. Eastern Time on Tuesday, January 7, 2020. A replay of the audio webcast will be available for 180 days at the same location.

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INDUSTRY KART

Avnet Introduces New Board of Directors

element14 Enable Customers to Unlock the Power of AI

Avnet has announced that they have elected Carlo Bozotti and Adalio T. Sanchez to the company’s Board of Directors. Bozotti and Sanchez will serve on both the Audit and Corporate Governance Committees of the Board. In addition, JoAnn Jenkins will serve on both the Compensation and Corporate Governance Committees of the Board. Carlo Bozotti brings over 40 years of experience in the electronics and semiconductor industry, and is currently an Industrial Partner of European private equity fund FSI. He was president and CEO of STMicroelectronics from 2005 to 2018, when he retired. During his time as president and CEO, Bozotti successfully led the company’s efforts to expand its leadership into stable, longer-term markets such as automotive and industrial electronics. Bozotti currently serves on the boards of Lumson, the Italian leader in the primary packaging cosmetics sector, and Besi, a leading supplier of assembly equipment for the global semiconductor and electronics industries. “Carlo’s depth of knowledge of the semiconductor and industrial electronics market, along with his expertise in identifying strategies for alliances and partnerships, particularly in the European electronics market, make him a valuable addition to the Avnet board,” said Rodney C. Adkins, chairman of the board of Avnet. “We’re pleased to welcome him and look forward to leveraging his knowledge in support of our supplier partners and engineering customers.”

As Artificial Intelligence (AI) reshapes our world, element14, the Development Distributor, along with element14, an Avnet community, are expanding the AI products and resources available to help engineers develop new solutions leveraging the technology. Opportunities for engineers include availability of the BeagleBone AI single board computer and online resources to help overcome the complexity, cost and power challenges of developing for AI. The BeagleBone AI, one of the newest AI products available from element14, provides a fast track solution for embedded machine learning. The single board computer facilitates everyday automation for industrial, commercial and home applications and allows developers to have their designs up and running within five minutes. “Artificial Intelligence, from autonomous cars to ‘lights out’ autonomous factories used to be reserved for science fiction, but the technology is becoming increasingly popular and more readily available every day,” said Cliff Ortmeyer, Global Head of Technical Marketing for element14. Dianne Kibbey, Global Head of the element14 Community added, “We are committed to giving our customers and community members access to the latest AI products and resources, including free training, projects and tools to support them throughout their AI design journey and grow their careers.”

Arrow Showcases Latest IoT and Sensing Technologies Arrow Electronics has hosted an Internet of Things (IoT) technology seminar that exhibited a wide range of IoT and sensing technology solutions at the Hilton Hanoi Opera, Vietnam. Hanoi is among one of three major Vietnamese cities that are being transformed into digital and interconnected urban areas by 20201. With the launch of Vietnam's first IoT Innovation Hub in Hoa Lac Hi-Tech Park in Hanoi earlier this year, the city has intensified efforts in accelerating research and development as well as establishing a platform to support entrepreneurial innovation in IoT technologies. "As one of the fastest-growing economies in ASEAN, Vietnam is now progressing into a smarter IoT nation. We look forward to working with global companies such as Arrow to further develop the IoT ecosystem and platform for driving best-in-class IoT technologies exchange and adopting

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best practices," said Le Ngoc Tuan, IoT product manager from FPT Corporation, a leading IT and telecommunications company in Vietnam, in the opening remark of the seminar. At the seminar, engineering experts from Arrow and major technology suppliers introduced the latest pioneering IoT and sensing technologies and products, including: Analog Devices' SmartMesh connectivity, intelligent machine condition monitoring,

and 3D time of flight sensor. AVX's connectivity devices with LTE, BT, WLAN, ISM and GPRS capability/I/O filtering and decoupling/pulse power and energy harvesting. Neoway's IoT offerings. ON Semiconductor's Bluetooth low energy connectivity/proprietary RF/image and smart passive sensors. Silicon Lab's wireless Gecko series/Zwave, sub-Ghz/Wifi solution, wireless Xpress/ sensors/Bluetooth mesh smart lighting. TE Connectivity's data storage products including stacking/power connectors, grounding and antenna. Western Digital's storage design consideration in 5G era. "We are excited to team with global and regional technology suppliers to facilitate the development of smart IoT", said Brian Yoon, senior regional director of sales for Thailand, Vietnam, Indonesia and the Philippines at Arrow.

INDUSTRY KART

element14 Adds New Power Products from Traco Power element14 is now shipping new products from leading Swiss power supply specialist Traco Power, with all models available in low order quantities for customers building designs in Industrial, medical and automotive. The Traco Power product range includes industrial and medical DC/DC converters from 1 – 300 Watt, AC/DC PCB mounted converters as well as AC/DC Open Frame and Enclosed DIN-Rail power supplies from 5 up to 1000 Watts. Design engineers and manufacturers of industrial, medical and transportation systems rely on Traco Power products to ensure optimum performance and a long service life of end-products. The market-leading features of Traco Power’s rugged DC/DC converters are widely used to support innovations in transportation technology, from door openers and communications equipment to the control of drives, brakes, switches and signal systems. These products can

also be used for applications exposed to harsh and dangerous environments. The latest Traco Power products now available from element14 include: The TEL 10WI series is a range of isolated 10 Watt converters which come in an ultra-compact DIP-16 metal package. This series of low power DC/DC converters provide maximum miniaturisation without sacrificing high efficiency and sets a new standard for power density with 3.83 W/ cm3. The TPP450A - 450 Watt AC/DC

Medical Power Supplies offer highest power density for convection/conduction cooled medical power supplies in 3”x 5”package. The THN 15 N Series is the latest generation of high performance 15 Watt DC/DC converters, enclosed in a shielded 1” x 1” x 0.4” metal package. The new and improved design provides a fully integrated EN 55032 class A filter and a greatly reduced no-load power consumption of 96-336 mW. The advanced circuit design enables the THN 15N to operate in a temperature range of –40°C to +70°C without derating. TSR2 series 2 Watt DC/DC converter is Traco Power’s smallest 2 Watt DC/DC convertor and are drop-in replacement for inefficient LMxx linear regulators. A high efficiency up to 96 % allows full load operation up to +67°C ambient temperature without the need of any heat-sink or forced cooling. Other significant features over linear regulators include better output accuracy (±2 %).

xGM210P Wireless Gecko Module Starter Kit

New Yorker Electronics Distributes Electrocube RC Filters

Mouser Electronics is now stocking the xGM210P Wireless Gecko Module Starter kit from Silicon Labs. The powerful starter kit contains all the hardware and support tools needed to begin prototyping wireless applications with pre-certified MGM210P and BGM210P (xGM210P) modules. The Silicon Labs xGM210P Wireless Gecko Module Starter kit, available from Mouser Electronics, enables design engineers to develop smart LED, home automation, and industrial Internet of Things (IIoT) solutions. The kit includes two wireless starter kit main boards, two SLWRB4308A +20 dBm radio boards and two SLWRB4308B +10 dBm radio boards, a Silicon Labs Simplicity debug adapter board, and associated cables. The MGM210P modules support Zigbee, Thread, Bluetooth, and multi-protocol functionality, while the BGM210P support Bluetooth functionality only. Together with the Silicon Labs Gecko software development kit (SDK) suite and Simplicity Studio, the xGM210P Wireless Gecko Module Starter Kit delivers a complete development platform with robust software stacks, advanced debugging and optimization tools, sample application code, pre-compiled demos, documentation, and various other resources. As an authorized distributor, Mouser Electronics, Inc. is focused on the rapid introduction of new products and technologies, giving customers an edge and helping speed time to market.

New Yorker Electronics is now distributing the complete series of Electrocube RC Networks ‘Arc-Suppressing’ Resistor-Capacitor (RC) Circuits. Also known as resistors, resistor-capacitors or RC filters, Electrocube’s RC Networks are uniquely designed to prevent or substantially minimize the occurrence of arcing and noise generations in relay and switch contacts. These arc-suppressing networks are made from dielectric material to deliver maximum strength for withstanding voltage (voltage withstand strength). There are four types available: single-phase resistors, single-phase heavy duty RC filters, three-phase resistor-capacitors and three-phase heavy duty RC Networks. Arc suppressing resistor-capacitor (RC) networks consist of specially designed precision capacitors and resistors connected in a series. Spark discharges and induced noise are absorbed over a wide range by the accumulation characteristic and impedance of the capacitor, while the RC time constant delays and averages surge voltage and oscillations. Featuring a wide selection of case configurations with a number of leads, Electrocube RC networks are manufactured both off-the-shelf and custom designed for single- or threephase applications from one to 40 networks in a container. Thousands of unique suppression designs eliminate surges produced by relays and solenoids.

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INDUSTRY KART

RS Components Expands Festo Factory Automation Products RS Components (RS) has expanded its range of products from factory automation manufacturer Festo to include over 17,000* individual items. The new introductions span all of Festo’s most popular pneumatic and electrical device families, including cylinders, actuators, valves and pneumatic air preparation products. Significantly, RS will now be able to offer many of Festo's latest technology releases, such as SOOD and SOOE photoelectric sensors and VUVS pneumatic solenoid valves. The Festo SOOD and SOOE laser and LED opto-electronic sensor product lines include diffuse sensors with background suppression, through-beam sensors, retro-reflective sensors, retro-reflective sensors for transparent objects, and laser contrast and distance sensors. SOOD integrated miniature sensors are suitable for a wide variety of object detection tasks, especially in small

confined spaces; their standardised sensor functions and reusable mounting accessories make them exceptionally fast and cost effective. As well as being compact and versatile, SOOE sensors can offer all optical functions for object detection — from through-beam to distance measurement — in an identical sensor housing for easy assembly. Festo VUVS heavy-duty pneumatic solenoid valves are innovative, versatile, reliable and easy to install, with a

long service life. The 20 or so different products include the VUVS-L series, designed around a piston spool with sealing cartridge and offering a flow rate up to 2300 l/min, and the VUVS-LK series, using a piston spool with sealing ring and giving a flow rate up to 1000 l/min. In-line valves can be used as individual valves or manifold valves, and a wide range of mounting options is available. “The 10,000+* new products we have added to our Festo range represent a major expansion of our factory automation and smart manufacturing capability,” said Kristian Olsson, Vice President of Industrial Automation and Control at RS. “This gives us perhaps the largest Festo offering of any high-service distributor. As a one-stop Festo shop, we can offer machine builders over 17,000* devices from a single supplier, saving them both time and money.”

Posifa Technologies Introduces New Air Velocity Sensors Posifa Technologies has announced the new PAV3000 series of economical, high-performance air velocity sensors with digital I2C output and a surface-mount footprint for thermal management and filter monitoring in even the most spaceconstrained locations. Unlike thermistor-based solutions, the PAV3000 has a MEMS sensor core that is minimally affected by ambient temperature changes and which provides instant real-time feedback on proper air flow at critical locations. Air velocity data perfectly complements temperature information to provide the best insight into thermal efficiency. Because the PAV3000 helps identify areas that require unusually high air flow to maintain stable temperatures, layouts for rack enclosures with air cooling — such as those found in data centers — can be modified to reduce cooling demands for increased energy savings. In applications such as HVAC systems, air velocity measurements can be used to determine when filters need to be replaced. This ensures hardware is adequately protected during heavy use, and it allows customers with light usage requirements to benefit from extended change intervals. PAV3000 series devices feature Posifa's third-generation thermal flow die, which uses a pair of thermopiles to detect changes in temperature gradient caused by mass flow. The result is excellent repeatability of 1 % FS and accuracy of 5 % FS. The solid-state thermal isolation structure on the sensor die

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eliminates the need for a surface cavity or the fragile membrane used in competing technologies, making the sensor resistant to clogging and pressure shock. Measuring air velocity at 7 m/s (PAV3005V) and 15 m/s (PAV3015V), the PAV3000 series devices offer extremely fast response times of 125 ms typical in a compact, robust package. The air velocity sensors feature a 12-bit digital output, 3.3 V supply voltage, and supply current of 13 mA.

INDUSTRY UPDATES

Andreas Thamm New Deputy STMicroelectronics Ships Director of ROHM 1bn ToF Module ROHM Semiconductor has recently appointed Andreas Thamm as new Deputy Director of the European Technical Center (EUTC). Andreas Thamm has more than 20 years of experience in high-tech companies, where he held various positions in engineering and management. The European Technical Center provides customer support excellence through specialized FAEs that assist customers from product selection, to response on technical questions, to system-level design support. “It is a critical interface between customer requirements and product development in Japan," comments Toshimitsu Suzuki, President ROHM Semiconductor Europe. "The appointment of Andreas Thamm underlines the importance of the European market for ROHM. His expertise in industrial automation and his international experience in segment marketing will certainly help to focus on the products of our local customers and to pass on the needs of the industry to our engineering departments in order to emphasize products for the European market.” “ROHM Semiconductor is a technology leader in power management applications for growth markets such as Industry 4.0, Smart Home or ADAS and supports its customers in successfully achieving their development goals,” says Andreas Thamm.

STMicroelectronics has announced the shipment of its 1 billionth Time-of-Flight (ToF) module. ST’s ToF sensors utilize the Company’s Single Photon Avalanche Diode (SPAD) sensor technology and are manufactured in ST’s 300mm front-end wafer fab in Crolles, France. The final module, which integrates the SPAD sensor, a Vertical Cavity Surface Emission Laser (VCSEL), and the necessary optical elements to enable the product’s outstanding performance, is assembled and tested in ST’s state-of-the-art internal backend facilities. “ST has pioneered and transitioned Time-of-Flight technology from its research labs to a fully industrialized family of market-leading products that are now being used in more than 150 different smartphone models and have just passed the 1 billion module milestone,” said Eric Aussedat, General Manager of ST’s Imaging Subgroup. “In continuing to invest, ST has extended the FlightSense roadmap for Time-of-Flight products from high-performance 1-dimensional ranging devices to multi-zone solutions and most recently adding high-resolution 3D depth sensing capabilities to enable innovative applications using advanced proximity sensing, human presence detection, and laser autofocus.”

Renesas and Altair Collaborate for Cellular IoT Solutions Renesas Electronics Corporation and Altair Semiconductor jointly announced a partnership aimed at bringing ultra-small and ultra-low-power cellular IoT solutions to the global IoT market. Cellular IoT device makers will be able to use this combination of best-in-class solutions to create highly differentiated IoT products and services that offer much greater efficiencies and faster time to market. These integrated solutions will be delivered through Renesas’ sales channels, enabling cellular connectivity to all of its markets. “We are delighted to collaborate with Altair to deliver the industry’s best cellular IoT solutions to the booming IoT market,” said Sailesh Chittipeddi, Executive Vice President and General Manager of Renesas’ IoT and Infrastructure Business Unit. “Our combined technical excellence and differentiated IP will allow us to design the smallest and lowest power multi-protocol cellular chip-to-cloud solution for Industrial IoT applications desired by our customers for their next-generation products.” With billions of devices expected to be deployed by 2024, the IoT market demands products that operate seamlessly out of the box. Sensors, cameras, metering, tracking, and smart devices all rely on ultra-low power consumption, offering the potential for a sensor to operate in the field for 10 to 20 years without requiring any hardware maintenance. “This collaboration makes Altair’s technology accessible to the full breadth of Renesas customers and partners ecosystem,” said Oded Melamed, CEO of Altair Semiconductor. “The Integration of Altair’s differentiated cellular IoT technology

with Renesas’ industry-leading MCUs will make this great technology immediately accessible to the mass market of IoT devices and service providers.” As a first step of this collaboration, Renesas and Altair plan to develop cellular IoT solutions with CAT-M and NB-IoT dual mode chipsets and technologies. They will also design a variety of development tools and software to further streamline the adoption of cellular IoT solutions for industrial and consumer applications. This partnership aims to achieve technical leadership in size reduction, power consumption, and IoT security.

Gets Real

in the Field

KASHIF HUSSAIN

Wireless Solutions Director at VIAVI Solutions

Although the evolution to 5G has been years in the making, we are now reaching a point where the steady march of progress has become a mad dash to the finish line as communications service providers (CSPs) race to deliver profitable new services. Yet, even as network rollouts gain momentum, an array of new complications needs to be addressed in order to validate, activate and optimize 5G infrastructure. This evolutionary step is not just an incremental update to existing communication standards â&#x20AC;&#x201D; 5G represents a paradigm shift in network technology. The enhancements that 5G is expected to deliver will depend on multiple elements working seamlessly in tandem, which is only attainable through innovative and robust 5G testing practices.

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Emerging OTA Testing Needs Although the first 5G networks were deployed in non-standalone (NSA) mode using a 4G core, networks eventually will migrate to a 5G core operating in standalone (SA) mode. To achieve gigabit throughput in 5G, operators can deploy wider channel bandwidth by using 5G New Radio (NR), enabling the aggregation of as many as 16 component carriers (CCs) and up to 1 GHz of spectrum. 5G NR introduces flexible spectrum usage with scalable numerology, dynamic TDD, massive MIMO and beamforming. However, although massive MIMO and beamforming increase overall spectral efficiencies, these technologies also impact test and measurement processes. In the past, most radio

5G TESTING

Moreover, these antenna arrays use narrow beams in frequency band 2 (FR2) that create a spatial 3-dimensional requirement that depends upon OTA testing. The antenna arrays necessary for mmWave frequencies are highly integrated with the amplifier integrated circuits (ICs) in the radio system. As such, there are no probing points for conducted measurements, meaning OTA testing is required. Massive Test Challenges In the past, lambda wavelength requirements have made it impossible to deploy large chains of antennas. Massive MIMO and antenna beamforming are key to the 5G centralized radio access network (C-RAN), which will change from static cell-centric coverage to dynamic user-based coverage. Massive MIMO can have more than 256 array elements that require a large number of radio channels. The addition of beamforming enables the array elements that serve the device to dynamically change, which means cable testing isnâ&#x20AC;&#x2122;t always viable or cost effective. Beamforming uses a larger antenna array by manipulating the phase and amplitude of the signals so energy can be directed to specific service areas. This approach makes it easier to avoid obstacles that can interfere with high-frequency transmissions, and can also strategically focus transmissions directly to the end user. However, a number of test challenges accompany beamforming and other mmWave applications. 3D beamforming is proving one of the most difficult technologies to master, as engineers are forced to conduct static tests on devices and antennas in active beamforming environments.

functionality could be evaluated independent of antenna systems. But adaptive antenna system (AAS) technologies used with 5G make it impossible to separate radio performance from antenna performance, necessitating over the air (OTA) testing. OTA testing is required for both 5G NR base stations (gNBs) and user equipment (UEs), requiring conformance testing to ensure quality and sufficient margins. Test systems and the specific test cases used to perform conformance tests must be validated by independent parties to ensure that the conformance test is both consistent with the standards and repeatable. Additionally, radiated tests are required to meet the 3GPP (Third Generation Partnership Project) conformance requirements. Radiated tests are needed because 5G NR designs use multielement active antennas in both frequency ranges. The active nature of these antenna arrays makes it impossible to extract end-to-end performance from individual antenna element measurements.

Taming Test Complexity Due to the complexity added with massive MIMO and beamforming configurations, proper downlink (DL) testing cannot be overlooked, which depends on validation of active antenna beam configurations, as well as channel performance and quality. Performing a comprehensive system verification will enable technicians to identify any DL anomalies, including variability in behavior of gNBs, DL channel power, degraded DL modulation, quality and beamforming performance. For operators to reap the benefits of beamforming, technicians also will need to identify the signal at beam level and test the performance of all algorithms and handoffs, while validating the signal to interference ratio prior to service activation. As commercial deployments move beyond field trials, CSPs must ensure that they can deploy and turn up new 5G infrastructure without negatively impacting current customers. Successful implementation of 5G requires a best practices approach integrating validation and verification with field testing to optimize performance of new network elements, ensuring that your customersâ&#x20AC;&#x2122; first experience with 5G delivers the best possible quality of experience. About the Author Kashif Hussain is the Wireless Solutions Director for VIAVI Solutions. He has more than twenty years of experience in mobile networking and wireless technology. For more information, please visit: www.viavisolutions.com/5g-testing.

ISSUE 12|VOL 1|DECEMBER 2019|BISINFOTECH

INDUSTRY LAUNCH

Allegro First Magnetic Gear Tooth Sensor Allegro MicroSystems has recently announced the launch of the ATS17501, the industry’s first gear tooth sensor IC designed to provide incremental position for electric vehicle traction motors operating up to 30k RPM. Features: • High speed switching up to 40kHz (30k RPM operation) • Advanced algorithms to suppress undesired output pulses at startup and running mode

Applications: Electric vehicle traction motors

Availability: Available Now

Analog Devices Introduces Wideband RF Transceiver Analog Devices has introduced a new wideband transceiver within its RadioVerse design and technology ecosystem. The ADRV9026, ADI’s fourth-generation wideband RF transceiver, offers quad-channel integration with the lowest power, smallest size, common-platform solution. Features: • Qual-channel transmitters and receivers with dual-channel observation receivers •LO frequency: 650 MHz to 6000 MHz • M a x i m u m r e c e i v e r / t r a n s m i t t e r bandwidth: 200 MHz

Applications: Base station applications

Availability: The ADRV9026 is available in a 14 x14 mm BGA package.

Holtek HT7Q1520 –3 to 8 Cell Analog Front End Holtek has released the HT7Q1520 analog front end, specifically designed for Li-battery protection and for use in a wide range of products such as handheld electronic tools, handheld vacuum cleaners etc. Features: • The device is a high voltage analog-front-end for 3 to 8 cell Li-ion rechargeable battery protection. • Accumulative cell voltage monitor and a high accuracy voltage regulator.

Applications: Li-battery protection, Handheld electronic tools, handheld vacuum cleaners.

Availability: Available Now

Infineon Introduces Updatable Security Under the leadership of Infineon Technologies AG, the Fraunhofer Institute for Applied and Integrated Security AISEC, Giesecke+Devrient Mobile Security GmbH, Siemens AG, the Technical University of Munich (TUM), and WIBU-SYSTEMS AG have been developing chip-based solutions and prototypes for connected computer applications and embedded systems since 2016.

Features: • S ecure information and communication structures for connected manufacturing • The partners on the ALESSIO project were able to show that updatable security solutions can be achieved with two different technical approaches.

BISINFOTECH|DECEMBER 2019|VOL 1|ISSUE 12

Availability: ALESSIO is supported by around 3.9 million Euros in funding from Germany’s Federal Ministry of Education and Research (BMBF) and is scheduled to end on 31 December 2019.

INDUSTRY LAUNCH

Maxim Secure Authenticator to Enhance Vehicle Safety Maxim Integrated Products has recently introduced DS28C40 DeepCover automotive secure authenticator. As the industry’s first and only AEC-Q100 Grade 1 solution for automotive systems, this authenticator IC reduces the design complexity and software vulnerability of current approaches to ensure only genuine components are used for many electronic systems, such as advanced driver assistance systems (ADAS) and electric vehicle (EV) batteries. Features: • Robust Security • Simple Integration • R eplaces microcontroller-based approaches

Applications: ADAS, EV Batteries

Availability: Available Now

NVIDIA Releases Jetson Xavier NX NVIDIA has recently introduced Jetson Xavier NX, the world’s smallest, most powerful AI supercomputer for robotic and embedded computing devices at the edge. With a compact form factor smaller than the size of a credit card, the energy-efficient Jetson Xavier NX module delivers server-class performance up to 21 TOPS for running modern AI workloads, and consumes as little as 10 watts of power. Features: • Opens door for embedded edge computing devices. • Jetson Xavier NX delivers up to 14 TOPS (at 10W) or 21 TOPS (at 15W)

Applications: Robotics and Embedded Devices

Availability: Available Now

NXP Adds To its UWB Portfolio NXP Semiconductors has recently announced an addition to its UWB portfolio with a new automotive UWB IC. UWB provides precise, secure, real-time localization capabilities unrivaled by other wireless technologies such as Wi-Fi, Bluetooth, and GPS. Features: • Smartphone-based car access offers the same level of convenience as state-of-the-art key fobs. • Users can open and start cars, while leaving their phones in their pockets or bags

Applications: The technology is designed to give spatial awareness to UWB-equipped cars, mobiles, and other smart devices, to enable cars to know exactly where the users are.

Availability: Available Now

Renesas ASi-5 ASSP for Industrial Automation Renesas Electronics has recently introduced the ASI4U-V5 ASSP – the industry’s first silicon solution to fully implement the ASi-5 (Actuator Sensor Interface specification version 5) standard for industrial network equipment.

Features: • ASi-5 offers superior performance and usability over ASi-3, delivering 1.27 ms cycle time, 200m cable length and 96 slaves per segment. • The new ASI4U-V5 ASSP features a fully verified and field-proven firmware that reduces the complexity associated with ASi-5 implementations, allowing users to minimize design risks.

BISINFOTECH|DECEMBER 2019|VOL 1|ISSUE 12

Applications: Industrial network equipment

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For Website

INDUSTRY LAUNCH

SET New Automatic Flip-Chip Bonder SET, Smart Equipment Technology has recently announced the release of NEO HB, an automatic flip-chip bonder designed for ± 1 µm 3σ post-bonding accuracy, in stand-alone or full automatic mode (EFEM). NEO HB is suitable for direct hybrid bonding processes.

Key Advantages: • The first of a new line of SET flip-chip bonders dedicated entirely to production • The tool combines high precision, flexibility, short cycle time, and creative design. • It was developed in collaboration with CEA-Leti as part of IRT Nanoelec’s 3D integration program.

Applications: Hybrid bonding processes

ST Supports LoRaWAN Firmware Update Over The Air STMicroelectronics has enhanced its STM32* LoRaWAN software expansion package for developers (I-CUBE-LRWAN ) to support the latest Firmware Update Over The Air (FUOTA) specifications. Features: • The LoRa Alliance has published three FUOTA LoRaWAN application specifications (v1) that together support and standardize FUOTA: Application Layer Clock Synchronization, Remote Multicast Setup, and Fragmented Data Block Transport.

Availability: Layer Clock Synchronization, Remote Multicast Setup, and Fragmented Data Block Transport

Availability: Available Now

TDK Robust Power Capacitors TDK Corporation presents the new B2568* series of EPCOS MKP DC link power capacitors, which offer outstanding robustness under harsh environmental conditions. The new capacitors are designed for voltages of between 900 and 3000 V DC and cover a capacitance range from 50 to 4000 µF. Features: • Voltage range from 900 to 3000 V DC • Capacitances from 50 to 4000 µF • Hermetically sealed design • Fire protection according to EN 45545

Applications: • IGBT-based converters in traction applications • Medium-voltage drives

Teledyne Gets EV12DS480 Digital-to-Analog Converter Approval Teledyne e2v has recently confirmed during its participation at Space Tech Expo that its EV12DS480 digital-to-analog converter (DAC) has been approved for use in space applications after it experienced irradiation tests. The EV12DS480 is a 12-bit 8 GSps DAC, now ready for space applications, designed for Newspace systems and offered in various reliability grades (including NASA Grade 1). This new DAC provides an analog bandwidth extending beyond 7GHz facilitating multi-band, direct digital synthesis up to K-band (26.5GHz).

Features: • The series of tests included Total Ionizing Dose (TID) and Heavy Ions (HI) measurements. • The tests were carried out to show that electronic components are capable of performing in a harsh space environment.

BISINFOTECH|DECEMBER 2019|VOL 1|ISSUE 12

Applications: Newspace systems, Reliability grades (including NASA Grade 1)

Availability: Available Now

INDUSTRY LAUNCH

Toradex Releases Over-The-Air Solution The engineers at Toradex have publicly released an experimental version of their OverThe-Air (OTA) solution under Toradex Labs. Modern embedded systems need a reliable and secure way to deliver software updates remotely. Toradex aims to accomplish this by publishing critical operating system updates to customers with devices running TorizonCore, an easy-to-use industrial-grade Linux OS. Features: • The system will provide full control over which updates and when these updates are pushed to their devices by way of a web interface.

Applications: Cellular network

Availability: Available Now

First eFuse that can be Repeatedly Used Toshiba has launched the “TCKE8xx series,” its first-ever eFuse ICs, a lineup of six products that support various functions needed for circuit protection in power supply lines.

Features: • Can be used repeatedly. • Conventional physical fuses—glass tube fuses and chip fuses—protect power line circuits by physically shutting them down.

Applications: Power Supply Lines

Availability: Customers can select the appropriate eFuse IC product for their requirements and the size of their equipment.

Vishay New Series of Capacitors Vishay Intertechnology has introduced a new series of Automotive Grade AC and pulse metallized polypropylene film capacitors for hybrid and electric vehicles. With a maximum operating temperature of +125 °C (observing voltage derating), Vishay BCcomponents MKP385e series devices ensure compliance with IEC 60384-17 and AEC-Q200 Revision D while withstanding temperature humidity bias (THB) testing of 60 °C, 93 % RH for 56 days at rated voltage. Features: • High and stable pulse strength and ripple current capabilities over a long service life under harsh environmental conditions.

Applications: Onboard and inductive charging, battery management, and keyless systems; snubbering; resonant converters; and power supplies.

Availability: Samples and production quantities of the MKP385e series are available now, with a lead time of 10 to 13 weeks.

Xilinx Free of Charge Development Platform Xilinx has recently announced its AI inference development platform; Vitis AI is available for immediate download free of charge. Combined with the Vitis unified software platform, Vitis AI empowers software developers with deep learning acceleration, as part of their software code.

Features: • Integrates a domain-specific architecture (DSA) • Configures Xilinx hardware to be optimized and programmed using industry-leading frameworks like TensorFlow and Caffe.

Applications: Boost the productivity of hardware developers by packaging hardware modules as software-callable functions.

ISSUE 12|VOL 1|DECEMBER 2019|BISINFOTECH

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